TW236717B - - Google Patents

Info

Publication number
TW236717B
TW236717B TW81108275A TW81108275A TW236717B TW 236717 B TW236717 B TW 236717B TW 81108275 A TW81108275 A TW 81108275A TW 81108275 A TW81108275 A TW 81108275A TW 236717 B TW236717 B TW 236717B
Authority
TW
Taiwan
Application number
TW81108275A
Other languages
Chinese (zh)
Inventor
Zhao-Hui Lin
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW81108275A priority Critical patent/TW236717B/zh
Application granted granted Critical
Publication of TW236717B publication Critical patent/TW236717B/zh

Links

TW81108275A 1992-10-15 1992-10-15 TW236717B (el)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW81108275A TW236717B (el) 1992-10-15 1992-10-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW81108275A TW236717B (el) 1992-10-15 1992-10-15

Publications (1)

Publication Number Publication Date
TW236717B true TW236717B (el) 1994-12-21

Family

ID=51349052

Family Applications (1)

Application Number Title Priority Date Filing Date
TW81108275A TW236717B (el) 1992-10-15 1992-10-15

Country Status (1)

Country Link
TW (1) TW236717B (el)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7598125B2 (en) 2006-01-12 2009-10-06 Touch Micro-System Technology Inc. Method for wafer level packaging and fabricating cap structures

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7598125B2 (en) 2006-01-12 2009-10-06 Touch Micro-System Technology Inc. Method for wafer level packaging and fabricating cap structures

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