TW223176B - - Google Patents
Info
- Publication number
- TW223176B TW223176B TW082105546A TW82105546A TW223176B TW 223176 B TW223176 B TW 223176B TW 082105546 A TW082105546 A TW 082105546A TW 82105546 A TW82105546 A TW 82105546A TW 223176 B TW223176 B TW 223176B
- Authority
- TW
- Taiwan
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US89613792A | 1992-06-09 | 1992-06-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW223176B true TW223176B (ru) | 1994-05-01 |
Family
ID=25405691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW082105546A TW223176B (ru) | 1992-06-09 | 1993-07-13 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0645008A1 (ru) |
| JP (1) | JP3375338B2 (ru) |
| KR (1) | KR950702029A (ru) |
| TW (1) | TW223176B (ru) |
| WO (1) | WO1993025893A1 (ru) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5738756A (en) * | 1995-06-30 | 1998-04-14 | Lam Research Corporation | Method and apparatus for detecting optimal endpoints in plasma etch processes |
| US6010538A (en) * | 1996-01-11 | 2000-01-04 | Luxtron Corporation | In situ technique for monitoring and controlling a process of chemical-mechanical-polishing via a radiative communication link |
| US6028669A (en) * | 1997-07-23 | 2000-02-22 | Luxtron Corporation | Signal processing for in situ monitoring of the formation or removal of a transparent layer |
| WO2000071971A1 (en) | 1999-05-24 | 2000-11-30 | Luxtron Corporation | Optical techniques for measuring layer thicknesses |
| US6570662B1 (en) | 1999-05-24 | 2003-05-27 | Luxtron Corporation | Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers |
| CN114112944A (zh) * | 2022-01-25 | 2022-03-01 | 武汉精立电子技术有限公司 | 一种显示面板测量方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4679938A (en) * | 1985-06-03 | 1987-07-14 | International Business Machines Corporation | Defect detection in films on ceramic substrates |
| US5196285A (en) * | 1990-05-18 | 1993-03-23 | Xinix, Inc. | Method for control of photoresist develop processes |
| US5160576A (en) * | 1991-03-05 | 1992-11-03 | Lam Research Corporation | Method of end point detection in a plasma etching process |
-
1993
- 1993-05-24 WO PCT/US1993/004936 patent/WO1993025893A1/en not_active Application Discontinuation
- 1993-05-24 KR KR1019940704490A patent/KR950702029A/ko not_active Application Discontinuation
- 1993-05-24 EP EP93914123A patent/EP0645008A1/en not_active Withdrawn
- 1993-05-24 JP JP50149994A patent/JP3375338B2/ja not_active Expired - Lifetime
- 1993-07-13 TW TW082105546A patent/TW223176B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| KR950702029A (ko) | 1995-05-17 |
| JP3375338B2 (ja) | 2003-02-10 |
| EP0645008A1 (en) | 1995-03-29 |
| JPH07507904A (ja) | 1995-08-31 |
| WO1993025893A1 (en) | 1993-12-23 |