TW215454B - Binary system adhesive suitable to be used at super low temperature and its production method - Google Patents

Binary system adhesive suitable to be used at super low temperature and its production method

Info

Publication number
TW215454B
TW215454B TW81109485A TW81109485A TW215454B TW 215454 B TW215454 B TW 215454B TW 81109485 A TW81109485 A TW 81109485A TW 81109485 A TW81109485 A TW 81109485A TW 215454 B TW215454 B TW 215454B
Authority
TW
Taiwan
Prior art keywords
urethane
binary system
group
system adhesive
low temperature
Prior art date
Application number
TW81109485A
Other languages
Chinese (zh)
Inventor
Dar-Shyang Chen
Horng-Jong Shiah
Jeng-Ji Maa
Wang-Nan Wnag
Original Assignee
China Technical Consultant Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by China Technical Consultant Inc filed Critical China Technical Consultant Inc
Priority to TW81109485A priority Critical patent/TW215454B/en
Application granted granted Critical
Publication of TW215454B publication Critical patent/TW215454B/en

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  • Adhesives Or Adhesive Processes (AREA)

Abstract

A binary system adhesive composition, which comprises of a urethane and a hardener; in which the urethane contains 65-100 weight percent urethane prepolymer with two or above two epoxy group, substantially free of NCO group, average molecular weight of 800-5000 and 0-35 weight percent of urethane with two or above two epoxy group, substantially free of NCO group, average molecular weight of lower than 800; the hardener is selected from the group containing two or above two primary amine or secondary amine compounds, oligomer, and their mixtures; in which the chemical equivalent ratio of the amino group in the hardener to the epoxy group in the urethane is 0.5-3.0.
TW81109485A 1992-11-26 1992-11-26 Binary system adhesive suitable to be used at super low temperature and its production method TW215454B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW81109485A TW215454B (en) 1992-11-26 1992-11-26 Binary system adhesive suitable to be used at super low temperature and its production method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW81109485A TW215454B (en) 1992-11-26 1992-11-26 Binary system adhesive suitable to be used at super low temperature and its production method

Publications (1)

Publication Number Publication Date
TW215454B true TW215454B (en) 1993-11-01

Family

ID=51357219

Family Applications (1)

Application Number Title Priority Date Filing Date
TW81109485A TW215454B (en) 1992-11-26 1992-11-26 Binary system adhesive suitable to be used at super low temperature and its production method

Country Status (1)

Country Link
TW (1) TW215454B (en)

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