TW208092B - - Google Patents
Info
- Publication number
- TW208092B TW208092B TW080104915A TW80104915A TW208092B TW 208092 B TW208092 B TW 208092B TW 080104915 A TW080104915 A TW 080104915A TW 80104915 A TW80104915 A TW 80104915A TW 208092 B TW208092 B TW 208092B
- Authority
- TW
- Taiwan
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/586,841 US5028106A (en) | 1990-09-24 | 1990-09-24 | Environmentally stable integrated optic chip mount |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW208092B true TW208092B (OSRAM) | 1993-06-21 |
Family
ID=24347306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW080104915A TW208092B (OSRAM) | 1990-09-24 | 1991-06-25 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5028106A (OSRAM) |
| AU (1) | AU8855391A (OSRAM) |
| TW (1) | TW208092B (OSRAM) |
| WO (1) | WO1992005457A1 (OSRAM) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5214726A (en) * | 1991-10-07 | 1993-05-25 | United Technologies Corporation | Strain isolated integrated optic chip package |
| US9768584B2 (en) | 2015-03-24 | 2017-09-19 | Lawrence Livermore National Security, Llc | High flux diode packaging using passive microscale liquid-vapor phase change |
| US9478494B1 (en) | 2015-05-12 | 2016-10-25 | Harris Corporation | Digital data device interconnects |
| US9437911B1 (en) | 2015-05-21 | 2016-09-06 | Harris Corporation | Compliant high speed interconnects |
| CN108028240B (zh) * | 2015-08-17 | 2020-06-09 | 恩耐公司 | 具有优化的热膨胀和/或热传递系数的热扩散器 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59159110A (ja) * | 1983-02-28 | 1984-09-08 | Sumitomo Electric Ind Ltd | 光学部品の接着構造 |
| US4750800A (en) * | 1986-11-04 | 1988-06-14 | United Technologies Corporation | Low stress mounting of integrated optic chips |
-
1990
- 1990-09-24 US US07/586,841 patent/US5028106A/en not_active Expired - Fee Related
-
1991
- 1991-06-25 TW TW080104915A patent/TW208092B/zh active
- 1991-07-01 AU AU88553/91A patent/AU8855391A/en not_active Abandoned
- 1991-07-01 WO PCT/US1991/004678 patent/WO1992005457A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO1992005457A1 (en) | 1992-04-02 |
| US5028106A (en) | 1991-07-02 |
| AU8855391A (en) | 1992-04-15 |