TW202521511A - 含有胺基之化合物、硬化性樹脂組成物、硬化物及積層體 - Google Patents

含有胺基之化合物、硬化性樹脂組成物、硬化物及積層體 Download PDF

Info

Publication number
TW202521511A
TW202521511A TW113127818A TW113127818A TW202521511A TW 202521511 A TW202521511 A TW 202521511A TW 113127818 A TW113127818 A TW 113127818A TW 113127818 A TW113127818 A TW 113127818A TW 202521511 A TW202521511 A TW 202521511A
Authority
TW
Taiwan
Prior art keywords
group
compound
resin composition
resin
curable resin
Prior art date
Application number
TW113127818A
Other languages
English (en)
Chinese (zh)
Inventor
大山俊幸
木村莉沙
鈴木悅子
有田和郎
Original Assignee
日商Dic股份有限公司
國立大學法人橫濱國立大學
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Dic股份有限公司, 國立大學法人橫濱國立大學 filed Critical 日商Dic股份有限公司
Publication of TW202521511A publication Critical patent/TW202521511A/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D209/00Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D209/56Ring systems containing three or more rings
    • C07D209/58[b]- or [c]-condensed
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00Technologies relating to chemical industry
    • Y02P20/50Improvements relating to the production of bulk chemicals
    • Y02P20/582Recycling of unreacted starting or intermediate materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW113127818A 2023-08-10 2024-07-26 含有胺基之化合物、硬化性樹脂組成物、硬化物及積層體 TW202521511A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023131568 2023-08-10
JP2023-131568 2023-08-10

Publications (1)

Publication Number Publication Date
TW202521511A true TW202521511A (zh) 2025-06-01

Family

ID=94534076

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113127818A TW202521511A (zh) 2023-08-10 2024-07-26 含有胺基之化合物、硬化性樹脂組成物、硬化物及積層體

Country Status (5)

Country Link
JP (1) JP7689705B1 (https=)
KR (1) KR20260049183A (https=)
CN (1) CN121816340A (https=)
TW (1) TW202521511A (https=)
WO (1) WO2025033159A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013170313A1 (en) * 2012-05-18 2013-11-21 Monash University Epoxy resins
JP2013256557A (ja) 2012-06-11 2013-12-26 Hitachi Ltd 接着剤組成物及び接着構造体の解体方法
JP6575220B2 (ja) 2015-08-18 2019-09-18 富士電機株式会社 半導体装置
JP7681273B2 (ja) * 2021-11-05 2025-05-22 国立大学法人横浜国立大学 エポキシ樹脂の硬化剤、化合物、エポキシ樹脂組成物及びエポキシ樹脂硬化物
JP7770959B2 (ja) 2022-03-09 2025-11-17 リンナイ株式会社 屋外フード

Also Published As

Publication number Publication date
KR20260049183A (ko) 2026-04-13
JPWO2025033159A1 (https=) 2025-02-13
WO2025033159A1 (ja) 2025-02-13
JP7689705B1 (ja) 2025-06-09
CN121816340A (zh) 2026-04-07

Similar Documents

Publication Publication Date Title
JP7597989B2 (ja) フェノール性水酸基含有化合物、硬化性樹脂組成物、硬化物及び積層体
KR20180093916A (ko) 옥사진 화합물, 조성물 및 경화물
KR20180093915A (ko) 옥사진 화합물, 조성물 및 경화물
JP2024100826A (ja) グリシジルエーテル基含有化合物、硬化性樹脂組成物、硬化物及び積層体
JP7635904B1 (ja) アミノ基含有化合物、硬化性樹脂組成物、硬化物及び積層体
JP7568172B2 (ja) グリシジル基含有化合物、硬化性樹脂組成物、硬化物及び積層体
TW202521511A (zh) 含有胺基之化合物、硬化性樹脂組成物、硬化物及積層體
JP7687540B1 (ja) アミノ基含有化合物、硬化性樹脂組成物、硬化物及び積層体
TW202513543A (zh) 含有胺基之化合物、硬化性樹脂組成物、硬化物及積層體
JP7533820B2 (ja) グリシジルエーテル基含有化合物、硬化性樹脂組成物、硬化物及び積層体
JP7648022B2 (ja) 硬化性化合物、硬化性樹脂組成物、硬化物及び積層体
JP7729484B2 (ja) 水酸基含有化合物、硬化性樹脂組成物、硬化物及び積層体
TW202406963A (zh) 含有環氧丙基醚基之化合物、硬化性樹脂組成物、硬化物及積層體
KR20180086201A (ko) 옥사진 화합물, 조성물 및 경화물
KR20260052036A (ko) 아미노기 함유 화합물, 경화성 수지 조성물, 경화물 및 적층체
KR20260051356A (ko) 아미노기 함유 화합물, 경화성 수지 조성물, 경화물 및 적층체
TW202528406A (zh) 環氧樹脂組成物、其硬化物及拆解方法
JP2025026162A (ja) アミノ基含有化合物、硬化性樹脂組成物、硬化物及び積層体
KR20180092953A (ko) 옥사진 화합물, 조성물 및 경화물