TW202436377A - 硬化性組成物、硬化物之製造方法、膜、光學元件、影像感測器、固體攝像元件、圖像顯示裝置及自由基聚合起始劑 - Google Patents

硬化性組成物、硬化物之製造方法、膜、光學元件、影像感測器、固體攝像元件、圖像顯示裝置及自由基聚合起始劑 Download PDF

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Publication number
TW202436377A
TW202436377A TW113107277A TW113107277A TW202436377A TW 202436377 A TW202436377 A TW 202436377A TW 113107277 A TW113107277 A TW 113107277A TW 113107277 A TW113107277 A TW 113107277A TW 202436377 A TW202436377 A TW 202436377A
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TW
Taiwan
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group
formula
curable composition
resin
compound
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TW113107277A
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English (en)
Chinese (zh)
Inventor
牧野雅臣
本橋拓貴
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日商富士軟片股份有限公司
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Publication of TW202436377A publication Critical patent/TW202436377A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Polymerisation Methods In General (AREA)
  • Materials For Photolithography (AREA)
TW113107277A 2023-03-01 2024-02-29 硬化性組成物、硬化物之製造方法、膜、光學元件、影像感測器、固體攝像元件、圖像顯示裝置及自由基聚合起始劑 TW202436377A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023031436 2023-03-01
JP2023-031436 2023-03-01

Publications (1)

Publication Number Publication Date
TW202436377A true TW202436377A (zh) 2024-09-16

Family

ID=92589944

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Application Number Title Priority Date Filing Date
TW113107277A TW202436377A (zh) 2023-03-01 2024-02-29 硬化性組成物、硬化物之製造方法、膜、光學元件、影像感測器、固體攝像元件、圖像顯示裝置及自由基聚合起始劑

Country Status (3)

Country Link
JP (1) JPWO2024181520A1 (https=)
TW (1) TW202436377A (https=)
WO (1) WO2024181520A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104076606B (zh) * 2014-07-15 2019-12-03 常州强力电子新材料股份有限公司 一种含肟酯类光引发剂的感光性组合物及其应用
KR102386489B1 (ko) * 2017-07-13 2022-04-14 후지필름 가부시키가이샤 조성물, 막, 적외선 투과 필터, 고체 촬상 소자, 화상 표시 장치 및 적외선 센서
JPWO2022202204A1 (https=) * 2021-03-22 2022-09-29
JP7219378B1 (ja) * 2021-12-09 2023-02-08 東洋インキＳｃホールディングス株式会社 感光性着色組成物、光学フィルタ、画像表示装置、及び固体撮像素子

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JPWO2024181520A1 (https=) 2024-09-06
WO2024181520A1 (ja) 2024-09-06

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