TW202425267A - Capacitor coupling package structure - Google Patents

Abstract

A capacitor coupling package structure is provided. The capacitor coupling package structure includes a first leadframe, a second leadframe, a plurality of transmitter modules, and a plurality of receiver modules. The second leadframe corresponds to and is aligned with the first leadframe, and a gap is formed therebetween. The plurality of transmitter modules are correspondingly disposed on a first surface of the first leadframe or a second surface of the second leadframe. The plurality of receiver modules are correspondingly disposed on a first surface of the first leadframe or a second surface of the second leadframe. A first signal output pole and a second signal output pole of the transmitter module, and a first signal input pole and a second signal input pole of the receiver module are spaced apart at a predetermined distance respectively through floating leads.

Description

Capacitively coupled package structure

The present invention relates to a capacitive coupling packaging structure, and in particular to a multi-signal channel capacitive coupling packaging structure which is separately arranged by a suspension bracket.

The existing capacitive coupling technology mainly places capacitors on-chip. However, the distance between the metal conductors of the capacitor cannot be too large (generally must be less than 16 μm), and when the capacitor is placed on the chip, the overall area of the chip will also increase, resulting in a larger volume for the related products. In addition, the isolation voltage of the capacitor on the chip is also limited by the thickness of the chip's main material (such as silicon dioxide), so it is not easy to meet the isolation requirements of specific application areas.

Therefore, how to improve the structural design so that the overall capacitor coupling package structure can be miniaturized to overcome the above-mentioned defects has become one of the important issues that the industry wants to solve.

The technical problem to be solved by the present invention is to provide a multi-signal channel capacitive coupling packaging structure in view of the shortcomings of the prior art.

In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a capacitive coupling package structure, which includes a first lead frame, a second lead frame, a plurality of transmitter modules, and a plurality of receiver modules. The second lead frame corresponds to and is aligned with the first lead frame, and there is a gap between the first lead frame and the second lead frame. The plurality of transmitter modules are respectively arranged on a first surface of the first lead frame or a second surface of the second lead frame. Each transmitter module includes a transmitter, a signal input pin, a first signal output pole plate and a second signal output pole plate. An input end of the transmitter is electrically connected to the signal input pin, and an output end of the transmitter is electrically connected to the first signal output pole plate and the second signal output pole plate, respectively. A plurality of receiver modules are respectively arranged on the first surface of the first lead frame or the second surface of the second lead frame. Each receiver module includes a receiver, a signal output pin, a first signal input pole plate and a second signal input pole plate. An input end of the receiver is electrically connected to the first signal input pole plate and the second signal input pole plate, and an output end of the receiver is electrically connected to the signal output pin. A plurality of receiver modules correspond to a plurality of transmitter modules respectively. The first signal input pole plate, the second signal input pole plate, the first signal output pole plate and the second signal output pole plate are respectively separately arranged through a plurality of suspension brackets. When any transmitter module is disposed on the first surface of the first lead frame or the second surface of the second lead frame, the corresponding receiver module of any transmitter module is disposed on the second surface of the second lead frame or the first surface of the first lead frame.

One of the beneficial effects of the present invention is that the capacitive coupling package structure provided by the present invention can be realized by "a gap between the first lead frame and the second lead frame", "the first signal input plate, the second signal input plate, the first signal output plate and the second signal output plate are separately arranged through the suspension bracket", "when any transmitter module is arranged on the first surface of the first lead frame or the second surface of the second lead frame, the corresponding receiver module of any transmitter module is arranged on the second surface of the second lead frame or the first surface of the first lead frame" As well as the technical solution of "multiple transmitter modules may not all be arranged on the first surface of the first lead frame or the second surface of the second lead frame", it not only provides multi-signal channel capacitive coupling but also improves the flexibility of capacitive coupling packaging structure preparation and effectively reduces the volume, and the overall capacitance value can be adjusted by adjusting the distance of the gap.

Furthermore, in the capacitive coupling package structure provided by the present invention, the transmitter module further includes at least one functional semiconductor element, at least one functional semiconductor element is electrically connected between the signal input pin and the input end of the transmitter, and/or the receiver module further includes at least one functional semiconductor element, at least one functional semiconductor element is electrically connected between the output end of the receiver and the signal output pin, so that the control of the output signal can be achieved in a limited structural space.

To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only used for reference and description and are not used to limit the present invention.

The following is an explanation of the implementation of the "capacitive coupling packaging structure" disclosed in the present invention through specific concrete embodiments. Technical personnel in this field can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual sizes. Please note in advance. The following implementation will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention. In addition, the term "or" used herein may include any one or more combinations of the associated listed items as appropriate.

[First embodiment]

1 to 7 , the first embodiment of the present invention provides a capacitive coupling package structure, which includes: a first lead frame 1, a second lead frame 2, a plurality of transmitter modules 3, a plurality of receiver modules 4 and a spacer (package body 5).

Specifically, the first lead frame 1 and the second lead frame 2 may have the same size and may be made of the same material, but the present invention is not limited thereto. In addition, in the capacitive coupling package structure, the first lead frame 1 and the second lead frame 2 correspond to and align with each other, and there is a gap d between the first lead frame 1 and the second lead frame 2, that is, the first lead frame 1 may be arranged in parallel directly above the second lead frame 2. In a preferred embodiment, the distance of the gap d may be 50 μm to 600 μm. It is worth noting that the distance of the gap d may be adjusted according to the actual application, thereby adjusting the overall capacitance value.

The plurality of transmitter modules 3 may be disposed on the first surface 11 of the first lead frame 1 or the second surface 21 of the second lead frame 2, respectively. The plurality of receiver modules 4 may be disposed on the second surface 21 of the second lead frame 2 or the first surface 11 of the first lead frame 1, respectively, and the plurality of transmitter modules 3 and the plurality of receiver modules 4 may be fixed to the first lead frame 1 or the second lead frame 2 by die-attach. For example, as shown in FIGS. 1 to 3 , the number of transmitter modules 3 and the number of receiver modules 4 may be three, but the present invention is not limited thereto. The three transmitter modules 3 may all be arranged on the first lead frame 1 and the three receiver modules 4 may all be arranged on the second lead frame 2 (as shown in FIG. 1 ); two of the three transmitter modules 3 may be arranged on the first lead frame 1 and the other one of the transmitter modules 3 may be arranged on the second lead frame 2, and two of the three receiver modules 4 may be arranged on the second lead frame 2 and the other one of the receiver modules 4 may be arranged on the first lead frame 1 (as shown in FIG. 2 ); or one of the three transmitter modules 3 may be arranged on the first lead frame 1 and the other two of the transmitter modules 3 may be arranged on the second lead frame 2, and one of the three receiver modules 4 may be arranged on the second lead frame 2 and the other two of the receiver modules 4 may be arranged on the first lead frame 1 (as shown in FIG. 3 ).

The transmitter module 3 may include chips with transmission signals. Each transmitter module 3 may include a transmitter 31, a signal input pin 32, a first signal output plate 33, and a second signal output plate 34. The input end of the transmitter 31 is electrically connected to the signal input pin 32, and the output end of the transmitter 31 is electrically connected to the first signal output plate 33 and the second signal output plate 34. It is worth noting that each component of the transmitter module 3 may be made of the same conductive material, but the present invention is not limited thereto.

The receiver module 4 may include a chip having a receiving signal. Each receiver module 4 may include a receiver 41, a signal output pin 42, a first signal input plate 43, and a second signal input plate 44. The input end of the receiver 41 is electrically connected to the first signal input plate 43 and the second signal input plate 44, respectively, and the output end of the receiver 41 is electrically connected to the signal output pin 42. It is worth noting that each component of the receiver module 4 may be made of the same conductive material, but the present invention is not limited thereto.

In the present invention, the transmitter 31 may include a high-frequency transmitter chip, and is a transmitter chip that performs signal processing in a differential form. In the present invention, using a differential form to perform signal processing can make the capacitive coupling package structure meet the requirements of common mode rejection (CMR). Therefore, the signal transmitted from the signal input pin 32 to the transmitter 31 will be transmitted to the first signal output plate 33 and the second signal output plate 34 in a differential form, respectively, to generate two physical links with the first signal input plate 43 and the second signal input plate 44 of the receiver module 4, and the two physical links form a signal channel. The transmitter 31 and the receiver 41 in each signal channel are galvanically isolated/DC isolated from each other through the capacitor formed by the first signal output plate 33, the second signal output plate 34, the first signal input plate 43 and the second signal input plate 44, and the high-frequency signal can pass through the barrier formed by the capacitor through capacitive coupling.

The spacer is disposed in the gap d between the first lead frame 1 and the second lead frame 2. In other words, the spacer of the present embodiment can be a package 5, which covers the first lead frame 1 and the second lead frame 2, and the package 5 fills the gap d. The package 5 can be formed by molding glue, or by molding glue mixed with insulating materials, so that the first lead frame 1 and the second lead frame 2 are electrically isolated from each other, but the insulating material of the package 5 of the present invention can be adjusted according to actual needs. In a preferred embodiment, the package 5 can be formed by epoxy resin or silicone resin.

Furthermore, the first surface 11 of the first lead frame 1 and the second surface 21 of the second lead frame 2 may face the same direction or different directions. For example, in one embodiment, as shown in FIG. 4 , the first surface 11 and the second surface 21 face the same direction, that is, the transmitter module 3 and the receiver module 4 are respectively disposed on the upper surface (first surface 11) of the first lead frame 1 and the upper surface (second surface 21) of the second lead frame 2. In another embodiment, as shown in FIG. 5 , the first surface 11 and the second surface 21 face different directions, that is, the transmitter module 3 and the receiver module 4 are respectively disposed on the lower surface (first surface 11) of the first lead frame 1 and the upper surface (second surface 21) of the second lead frame 2, or the transmitter module 3 and the receiver module 4 are respectively disposed on the upper surface (first surface 11) of the first lead frame 1 and the lower surface (second surface 21) of the second lead frame 2. It is worth noting that the arrangement of the first surface 11 of the first lead frame 1 and the second surface 21 of the second lead frame 2 can be adjusted according to actual applications, and the present invention is not limited thereto.

It is worth mentioning that the capacitive coupling package structure of the present invention may further include at least one functional semiconductor element E. In one embodiment, the functional semiconductor element E may be electrically connected between the signal input pin 32 and the input end of the transmitter 31. In another embodiment, as shown in FIG6 and FIG7 , the functional semiconductor element E may be electrically connected between the output end of the receiver 41 and the signal output pin 42. In yet another embodiment, there may be two functional semiconductor elements E, one of which is electrically connected between the signal input pin 32 and the input end of the transmitter 31, and the other functional semiconductor element E is electrically connected between the output end of the receiver 41 and the signal output pin 42. In addition, the functional semiconductor element E can be selected according to the actual application. For example, the functional semiconductor element E can be an insulated gate bipolar transistor (IGBT), a digital to analog converter circuit (DAC), or an analog to digital converter circuit (ADC).

Furthermore, as shown in FIG6 , the functional semiconductor element E can be integrated in the receiver module 4. After the receiver module 4 detects the modulated high-frequency signal from the transmitter 31, it can demodulate it and restore it to a transmission control signal to output to the functional semiconductor element E. On the other hand, as shown in FIG7 , the functional semiconductor element E can also be not integrated with the receiver module 4, that is, the receiver module 4 and the functional semiconductor element E are separate independent structures. After the receiver module 4 detects the modulated high-frequency signal from the transmitter 31, it can demodulate it and restore it to a transmission control signal and then output the control signal to the functional semiconductor element E.

Furthermore, in this embodiment, as shown in FIG8 , three transmitter modules 3 are disposed on the first surface 11 of the first lead frame 1, and three receiver modules 4 are correspondingly disposed on the second surface 21 of the second lead frame 2, so as to form a multi-signal channel capacitive coupling package structure having three channels (i.e., a first channel, a second channel, and a third channel). In this embodiment, the three transmitter modules 3 can be integrated into one IC chip, and similarly, the three receiver modules 4 can be integrated into one IC chip, thereby reducing the cost and the size of the package. During packaging, the first surface 11 of the first lead frame 1 and the second surface 21 of the second lead frame 2 face the same direction. By translating the first lead frame 1 or the second lead frame 2, the first signal output plates 33 (i.e., C1+, C2+, and C3+ shown in the upper half of FIG. 8; C1+, C2+, and C3+ are physically not connected to each other and are independent plates) and the second signal output plates 34 (i.e., C1-, C2-, and C3- shown in the upper half of FIG. 8; C1-, C2- and C3- are physically not connected to each other and are independent poles), the first signal input pole plate 43 (i.e., C1+, C2+ and C3+ shown in the lower half of FIG. 8; C1+, C2+ and C3+ are physically not connected to each other and are independent poles) and the second signal input pole plate 44 (i.e., C1-, C2- and C3- shown in the lower half of FIG. 8; C1-, C2- and C3- are physically not connected to each other and are independent poles) can be suspended on the package body 5 through corresponding suspension brackets FL (floating lead), and the first signal output pole plate 33 is aligned with the first signal input pole plate 43, and the second signal output pole plate 34 is aligned with the second signal input pole plate 44. In addition, the first lead frame 1 can be disposed on the package body 5 through a plurality of first leads 12 separated from each other, and the second lead frame 2 can be disposed on the package body 5 through a plurality of second leads 22 separated from each other, and the first lead frame 1 and the second lead frame 2 correspond to and align with each other in the package body 5. In one embodiment, as shown in FIG8 , when the first signal output electrode 33, the second signal output electrode 34, the first signal input electrode 43, and the second signal input electrode 44 are suspended on the package body 5 through corresponding suspension brackets FL, respectively, the projection of the suspension bracket FL on the projection plane can be parallel to the plurality of first leads 12 and the plurality of second leads 22. That is, as shown in FIG8 , the first signal output electrode 33 and the second signal output electrode 34 are arranged along a length direction of the first lead frame 1, and the first signal input electrode 43 and the second signal input electrode 44 are arranged along a length direction of the second lead frame 2. In a preferred embodiment, the projection of any suspension bracket FL on the projection plane corresponds to a center line between two adjacent first pins 12 corresponding thereto or a center line between two adjacent second pins 22 corresponding thereto, that is, when the capacitive coupling package structure of the present invention is observed from above, the suspension bracket FL is disposed at the midpoint of the spacing distance between two adjacent first pins 12 or the midpoint of the spacing distance between two adjacent second pins 22.

However, the above example is only a feasible embodiment and is not intended to limit the present invention.

[Second embodiment]

Referring to FIG. 9, FIG. 9 is a schematic diagram of a capacitive coupling package structure of the second embodiment of the present invention. The second embodiment differs from the first embodiment mainly in the arrangement of the suspension bracket FL. In addition, it should be noted that the other structures of the capacitive coupling package structure of the second embodiment are similar to those of the first embodiment, and will not be described in detail here.

In this embodiment, as shown in FIG. 9 , three transmitter modules 3 are disposed on the first surface 11 of the first lead frame 1, and three receiver modules 4 are correspondingly disposed on the second surface 21 of the second lead frame 2 to form a multi-signal channel capacitive coupling package structure having three channels (i.e., a first channel, a second channel, and a third channel). During packaging, the first lead frame 1 can be flipped relative to the axis X so that the first lead frame 1 is arranged directly above the second lead frame 2, that is, the first surface 11 of the first lead frame 1 and the second surface 21 of the second lead frame 2 face each other, and the first signal output plate 33 (i.e., C1+ shown in the upper half of FIG. 9) and the second signal output plate 34 (i.e., C1- shown in the upper half of FIG. 9) arranged on the first channel of the first lead frame 1 can correspond to the first signal input plate 43 (i.e., C1+ shown in the lower half of FIG. 9) and the second signal input plate 44 (i.e., C1- shown in the lower half of FIG. 9) arranged on the first channel of the corresponding second lead frame 2, respectively, and the first signal output plate 33 (i.e., C1+ shown in the lower half of FIG. 9) on the second channel of the first lead frame 1 can correspond to each other. 9) and the second signal output electrode 34 (i.e., C2- shown in the upper half of FIG. 9) can respectively correspond to the first signal input electrode 43 (i.e., C2+ shown in the lower half of FIG. 9) and the second signal input electrode 44 (i.e., C2- shown in the lower half of FIG. 9) arranged on the second channel corresponding to the second lead frame 2, and the first signal output electrode 33 (i.e., C3+ shown in the upper half of FIG. 9) and the second signal output electrode 34 (i.e., C3- shown in the upper half of FIG. 9) on the third channel of the first lead frame 1 can respectively correspond to the first signal input electrode 43 (i.e., C3+ shown in the lower half of FIG. 9) and the second signal input electrode 44 (i.e., C3- shown in the lower half of FIG. 9) arranged on the third channel corresponding to the second lead frame 2.

However, the above example is only a feasible embodiment and is not intended to limit the present invention.

[Third Embodiment]

Referring to FIG. 10 , FIG. 10 is a schematic diagram of a capacitive coupling package structure of the third embodiment of the present invention. The third embodiment differs from the first embodiment mainly in the arrangement of the suspension bracket FL. In addition, it should be noted that the other structures of the capacitive coupling package structure of the third embodiment are similar to those of the first and second embodiments, and will not be described in detail here.

In this embodiment, as shown in FIG. 10 , four transmitter modules 3 are disposed on the first surface 11 of the first lead frame 1, and four receiver modules 4 are correspondingly disposed on the second surface 21 of the second lead frame 2 to form a multi-signal channel capacitive coupling package structure having four channels (i.e., a first channel, a second channel, a third channel, and a fourth channel). During packaging, the first surface 11 of the first lead frame 1 and the second surface 21 of the second lead frame 2 face the same direction, and the first lead frame 1 or the second lead frame 2 is translated so that the first signal output pad 33 (i.e., C1+, C2+, C3+, and C4+ shown in the upper half of FIG. 10) and the first signal input pad 43 (i.e., C1+, C2+, C3+, and C4+ shown in the lower half of FIG. 10) are aligned with each other, and the second signal output pad 34 (i.e., C1-, C2-, C3-, and C4- shown in the upper half of FIG. 10) and the second signal input pad 44 (i.e., C1+, C2+, C3+, and C4+ shown in the lower half of FIG. 10) are aligned with each other. -, C2-, C3- and C4-) are aligned with each other, and the first signal output pole plate 33, the second signal output pole plate 34, the first signal input pole plate 43 and the second signal input pole plate 44 of each of the four channels are suspended on the package body 5 through a plurality of suspension brackets FL, wherein the projection of a part of the suspension bracket FL on the projection plane can be parallel to the plurality of first pins 12 and the plurality of second pins 22, and the projection of the remaining part of the suspension bracket FL on the projection plane can be perpendicular to the plurality of first pins 12 and the plurality of second pins 22, that is, the suspension bracket FL is arranged in a horizontal direction or a vertical direction. In addition, the first lead frame 1 can be disposed on the package body 5 via a plurality of first leads 12 separated from each other, and the second lead frame 2 can be disposed on the package body 5 via a plurality of second leads 22 separated from each other.

For the suspended bracket FL (vertical suspended bracket) whose projection on the projection plane is perpendicular to the first plurality of pins 12 and the second plurality of pins 22, in order to meet the isolation requirements, the creepage distance between the vertical suspended bracket of the first lead frame 1 and the vertical suspended bracket of the second lead frame 2 must be greater than the distance required for isolation and safety. However, for small packages, the creepage distance of the vertical suspended bracket is usually not easy to meet the distance required for isolation and safety. In order to overcome this problem, the double molding technology can be used to seal the suspended bracket in the second layer of packaging gel. In this way, the distance between the vertical suspended bracket of the first lead frame 1 and the vertical suspended bracket of the second lead frame 2 only needs to be greater than 400um to meet the isolation and safety requirements.

However, the above example is only a feasible embodiment and is not intended to limit the present invention.

[Fourth embodiment]

Referring to FIG. 11 , FIG. 11 is a schematic diagram of a capacitive coupling package structure of a fourth embodiment of the present invention. The fourth embodiment differs from the third embodiment mainly in the arrangement of the transmitter module 3 on the first surface 11 of the first lead frame 1 and the receiver module 4 on the second surface 21 of the second lead frame 2. In addition, it should be noted that the other structures of the capacitive coupling package structure of the fourth embodiment are similar to those of the first embodiment, the second embodiment and the third embodiment, and will not be described in detail here.

In this embodiment, as shown in FIG. 11 , four transmitter modules 3 are disposed on the first surface 11 of the first lead frame 1, and four receiver modules 4 are correspondingly disposed on the second surface 21 of the second lead frame 2, so as to form a multi-signal channel capacitive coupling package structure having four channels (i.e., the first channel, the second channel, the third channel, and the fourth channel). During packaging, the first lead frame 1 can be flipped relative to the axis X so that the first lead frame 1 is disposed directly above the second lead frame 2, that is, the first surface 11 of the first lead frame 1 and the second surface 21 of the second lead frame 2 face each other, then the first signal output plate 33 (i.e., C1+ shown in the upper half of FIG. 11 ) and the second signal output plate 34 (i.e., C1- shown in the upper half of FIG. 11 ) disposed on the first channel of the first lead frame 1 can be respectively disposed on the corresponding second lead frame 21. The first signal input plate 43 (i.e., C1+ shown in the lower half of FIG. 11) and the second signal input plate 44 (i.e., C1- shown in the lower half of FIG. 11) of the first channel of the lead frame 2 correspond to each other, and the first signal output plate 33 (i.e., C2+ shown in the upper half of FIG. 11) and the second signal output plate 34 (i.e., C2- shown in the upper half of FIG. 11) of the second channel of the first lead frame 1 can respectively communicate with the first signal input plate 43 (i.e., C2+ shown in the upper half of FIG. 11) of the second channel of the corresponding second lead frame 2. 11) and the second signal input plate 44 (i.e., C2- shown in the lower half of FIG. 11) correspond to each other, and the first signal output plate 33 (i.e., C3+ shown in the upper half of FIG. 11) and the second signal output plate 34 (i.e., C3- shown in the upper half of FIG. 11) of the third channel of the first lead frame 1 can respectively communicate with the first signal input plate 43 (i.e., C3+ shown in the lower half of FIG. 11) and the second signal input plate 44 (i.e., C2- shown in the lower half of FIG. 11) arranged in the third channel corresponding to the second lead frame 2. 11) correspond to each other, and the first signal output pad 33 (i.e., C4+ shown in the upper half of FIG. 11) and the second signal output pad 34 (i.e., C4- shown in the upper half of FIG. 11) of the fourth channel of the first lead frame 1 can respectively correspond to the first signal input pad 43 (i.e., C4+ shown in the lower half of FIG. 11) and the second signal input pad 44 (i.e., C4- shown in the lower half of FIG. 11) arranged at the fourth channel of the corresponding second lead frame 2.

In addition, in this embodiment, as shown in FIG. 11, when the first signal output plate 33 (i.e., C1+, C2+, C3+, and C4+ shown in the upper half of FIG. 11), the second signal output plate 34 (i.e., C1-, C2-, C3-, and C4- shown in the upper half of FIG. 11), the first signal input plate 43 (i.e., C1+, C2+, C3+, and C4+ shown in the lower half of FIG. 11) and the second signal input plate 44 (i.e., C1-, C2-, C3-, and C4- shown in the lower half of FIG. 11) are connected to each other, the first signal output plate 33 is connected to the second signal output plate 34 (i.e., C1-, C2-, C3-, and C4- shown in the upper half of FIG. 11), the first signal input plate 43 (i.e., C1+, C2+, C3+, and C4+ shown in the lower half of FIG. 11) and the second signal input plate 44 (i.e., C1-, C2-, C3-, and C4- shown in the lower half of FIG. 11) are connected to each other. When the C1-, C2-, C3- and C4-) shown in the figure are suspended on the package body 5 through the suspension bracket FL respectively, the projection of a part of the suspension bracket FL on the projection plane can be parallel to the multiple first pins 12 and the multiple second pins 22, and the projection of the remaining part of the suspension bracket FL on the projection plane can be perpendicular to the multiple first pins 12 and the multiple second pins 22, that is, the suspension bracket FL is set in the horizontal direction or the vertical direction.

However, the above example is only a feasible embodiment and is not intended to limit the present invention.

[Fifth Embodiment]

Referring to FIG. 12, FIG. 12 is a schematic diagram of a capacitive coupling package structure of the fifth embodiment of the present invention. The fifth embodiment differs from the first embodiment mainly in the arrangement of the suspension bracket FL. In addition, it should be noted that the other structures of the capacitive coupling package structure of the fifth embodiment are similar to those of the first embodiment, the second embodiment, the third embodiment and the fourth embodiment, and will not be described in detail here.

In this embodiment, as shown in FIG12, four transmitter modules 3 are disposed on the first surface 11 of the first lead frame 1, and four receiver modules 4 are correspondingly disposed on the second surface 21 of the second lead frame 2, so as to form a multi-signal channel capacitive coupling package structure having four channels (i.e., the first channel, the second channel, the third channel, and the fourth channel). As shown in FIG12, during packaging, the first surface 11 of the first lead frame 1 and the second surface 21 of the second lead frame 2 face the same direction, and the first lead frame 1 or the second lead frame 2 is translated. When the first signal output plate 33 (i.e., C1+, C2+, C3+, and C4+ shown in the upper half of FIG12) and the second signal output plate 34 (i.e., C1-, C2-, C3-, and C4+ shown in the upper half of FIG12) are connected to the first signal output plate 33, the second signal output plate 34 (i.e., C1-, C2-, C3-, and C4+ shown in the upper half of FIG12) are connected to the second ... 4-), the first signal input plate 43 (i.e., C1+, C2+, C3+, and C4+ as shown in the lower half of FIG. 12) and the second signal input plate 44 (i.e., C1-, C2-, C3-, and C4- as shown in the lower half of FIG. 12) are suspended on the package body 5 through the suspension bracket FL respectively, and the projection of the suspension bracket FL on the projection plane can be perpendicular to the plurality of first pins 12 and the plurality of second pins 22. That is, as shown in Figure 12, the first signal output pole plate 33 (i.e., C1+, C2+, C3+ and C4+ shown in the upper half of Figure 12) and the second signal output pole plate 34 (i.e., C1-, C2-, C3- and C4- shown in the upper half of Figure 12) are arranged along a width direction of the first lead frame 1, and the first signal input pole plate 43 (i.e., C1+, C2+, C3+ and C4+ shown in the lower half of Figure 12) and the second signal input pole plate 44 (i.e., C1-, C2-, C3- and C4- shown in the lower half of Figure 12) are arranged along a width direction of the second lead frame 2.

In summary, a multi-signal channel capacitive coupling package structure with N channels needs to be equipped with 2*M*N floating leads FL (floating leads), where N, M≥2.

For example, when there are three channels (N=3) and the number of signal output/input poles M is 2, the number of suspension brackets on the signal output side and the corresponding signal input side are both 6 (i.e., the independent suspension brackets FL corresponding to C1+, C1-, C2+, C2-, C3+ and C3- shown in the upper and lower halves of Figure 8-9), totaling 12. When there are four channels (N=4) and the number of signal output/input poles M is 2, the number of suspension brackets on the signal output side and the corresponding signal input side are both 8 (i.e., the independent suspension brackets FL corresponding to C1+, C1-, C2+, C2-, C3+, C3-, C4+ and C4- shown in the upper and lower halves of Figure 10-12), totaling 16.

However, the above example is only a feasible embodiment and is not intended to limit the present invention.

[Sixth Embodiment]

The capacitive coupling package structure of the present invention can be manufactured using different processes according to actual applications. For example, the capacitive coupling package structure of the present invention can first form a circuit substrate, then perform circuit integration, and finally perform a packaging process to complete the capacitive coupling package structure.

In one embodiment, the transmitter module 3 and the receiver module 4 can be arranged on opposite surfaces of the same substrate, the substrate is a dielectric material, a portion of each first pin 12 and a portion of each second pin 22 are surrounded by the dielectric material or arranged on the surface of the dielectric material, and the upper surface and the lower surface of the dielectric material can form a patterned conductive material layer, that is, the transmitter module 3 and the receiver module 4 are respectively arranged on the patterned conductive material layer, and then the packaging process is performed to complete the capacitive coupling packaging structure.

Alternatively, the transmitter module 3 and the receiver module 4 may be disposed on any surface of different substrates, a portion of each first pin 12 and a portion of each second pin 22 may be disposed on different substrates, a portion of each first pin 12 is disposed on the first substrate, a portion of each second pin 22 is disposed on the second substrate, the first substrate and the second substrate are dielectric materials, another portion of each first pin 12 and another portion of each second pin 22 are respectively surrounded by the dielectric material or disposed on the surface of the dielectric material (that is, the dielectric material layer can be regarded as the aforementioned embodiment of the present invention). The first lead frame 1 and the second lead frame 2 are provided, and the upper surface and the lower surface of the dielectric material can form a patterned conductive material, that is, the transmitter module 3 and the receiver module 4 are respectively arranged on the patterned conductive material. Further, as shown in FIG. 4 or FIG. 5, the transmitter module 3 and the receiver module 4 are arranged on two different substrate surfaces facing the same or different directions, with the first substrate or the second substrate or a combination of the two as a spacer, that is, the dielectric material is arranged between the transmitter module 3 and the receiver module 4, and after providing a gap d, a packaging process is then performed to complete the capacitive coupling packaging structure.

In one embodiment, the dielectric material can be made of a ceramic material, preferably, the ceramic material can be aluminum nitride, aluminum oxide or any combination thereof, but the present invention is not limited thereto. In one embodiment, the conductive material layer can be made of copper, but the present invention is not limited thereto.

However, the above example is only a feasible embodiment and is not intended to limit the present invention.

[Beneficial Effects of Embodiments]

One of the beneficial effects of the present invention is that the capacitive coupling package structure provided by the present invention can be realized by "a gap between the first lead frame and the second lead frame", "the first signal input plate, the second signal input plate, the first signal output plate and the second signal output plate are respectively arranged on the spacer through the suspension bracket", "when any transmitter module is arranged on the first surface of the first lead frame or the second surface of the second lead frame, the corresponding receiver module of any transmitter module is arranged on the second surface of the second lead frame or the first surface of the first lead frame" As well as the technical solution of "multiple transmitter modules may not all be arranged on the first surface of the first lead frame or the second surface of the second lead frame", it not only provides multi-signal channel capacitive coupling but also enhances the flexibility of capacitive coupling packaging structure preparation and effectively reduces the volume, and the overall capacitance value can be adjusted by adjusting the distance of the gap.

Furthermore, in the capacitive coupling package structure provided by the present invention, the transmitter module further includes at least one functional semiconductor element, at least one functional semiconductor element is electrically connected between the signal input pin and the input end of the transmitter, and/or the receiver module further includes at least one functional semiconductor element, at least one functional semiconductor element is electrically connected between the output end of the receiver and the signal output pin, so that the control of the output signal can be achieved in a limited structural space.

The contents disclosed above are only preferred feasible embodiments of the present invention and are not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the specification and drawings of the present invention are included in the scope of the patent application of the present invention.

1: First lead frame 11: First surface 12: First lead 2: Second lead frame 21: Second surface 22: Second lead 3: Transmitter module 31: Transmitter 32: Signal input pin 33: First signal input plate 34: Second signal input plate 4: Receiver module 41: Receiver 42: Signal output pin 43: First signal output plate 44: Second signal output plate 5: Package C1+, C2+, C3+, C4+: First signal input plate/First signal output plate C1-, C2-, C3-, C4-: Second signal input plate/Second signal output plate d: gap E: functional semiconductor element FL: suspension bracket X: axis

1 to 3 are schematic diagrams of the configuration of a transmitter module and a receiver module of a capacitive coupling package structure according to a first embodiment of the present invention.

FIG. 4 is a schematic diagram of a capacitive coupling packaging structure according to an embodiment of the present invention.

FIG. 5 is a schematic diagram of a capacitive coupling packaging structure according to another embodiment of the present invention.

FIG6 is a schematic diagram of a functional semiconductor element provided in the capacitive coupling package structure of the first embodiment of the present invention.

FIG. 7 is another schematic diagram of a functional semiconductor element provided in the capacitive coupling package structure of the first embodiment of the present invention.

FIG8 is a schematic diagram of a capacitive coupling packaging structure according to the first embodiment of the present invention.

FIG9 is a schematic diagram of a capacitive coupling packaging structure according to a second embodiment of the present invention.

FIG. 10 is a schematic diagram of a capacitive coupling packaging structure according to a third embodiment of the present invention.

FIG. 11 is a schematic diagram of a capacitive coupling packaging structure according to a fourth embodiment of the present invention.

FIG. 12 is a schematic diagram of a capacitive coupling packaging structure according to a fifth embodiment of the present invention.

1: First lead frame

11: First surface

12: First pin

2: Second lead frame

21: Second surface

22: Second pin

5: Package body

C1+, C2+, C3+: First signal input plate/first signal output plate

C1-, C2-, C3-: Second signal input plate/second signal output plate

FL: Floating bracket

Claims (16)

A capacitive coupling package structure, comprising: a first lead frame; a second lead frame, the second lead frame corresponds to and aligns with the first lead frame, and there is a gap between the first lead frame and the second lead frame; a plurality of transmitter modules, the plurality of transmitter modules are respectively arranged on a first surface of the first lead frame or a second surface of the second lead frame, each of the transmitter modules comprises a transmitter, a signal input pin, a first signal output plate and a second signal output plate, an input end of the transmitter is electrically connected to the signal input pin, and an output end of the transmitter is respectively electrically connected to the first signal output plate and the second signal output plate; A plurality of receiver modules, wherein the plurality of receiver modules are respectively arranged on the first surface of the first lead frame or the second surface of the second lead frame, each of the receiver modules comprises a receiver, a signal output pin, a first signal input plate and a second signal input plate, an input end of the receiver is respectively electrically connected to the first signal input plate and the second signal input plate, and an output end of the receiver is electrically connected to the signal output pin; and a spacer, wherein the spacer is arranged in the gap; wherein the plurality of receiver modules respectively correspond to the plurality of transmitter modules; wherein the first signal input plate, the second signal input plate, the first signal output plate and the second signal output plate are respectively arranged on the spacer through a plurality of suspension brackets; Wherein, when any of the transmitter modules is disposed on the first surface of the first lead frame or the second surface of the second lead frame, the corresponding receiver module of any of the transmitter modules is disposed on the second surface of the second lead frame or the first surface of the first lead frame. A capacitive coupling package structure as described in claim 1, wherein a distance of the gap is 50 μm to 600 μm. The capacitive coupling package structure as described in claim 1, wherein at least one of the transmitter modules is disposed on one of the first surface of the first lead frame and the second surface of the second lead frame. The capacitive coupling package structure as described in claim 1, wherein the first surface of the first lead frame and the second surface of the second lead frame face the same direction. The capacitive coupling package structure as described in claim 1, wherein the first surface of the first lead frame and the second surface of the second lead frame face different directions. A capacitive coupling package structure as described in claim 1, wherein the first lead frame includes a plurality of first leads separated from each other, the second lead frame includes a plurality of second leads separated from each other, and the projections of the plurality of suspended supports on the projection plane are parallel or perpendicular to the plurality of first leads and the plurality of second leads. A capacitive coupling package structure as described in claim 6, wherein the projections of the multiple suspended supports parallel to the first pins and the multiple second pins on the projection plane correspond to a center line between two adjacent first pins corresponding thereto or a center line between two adjacent second pins corresponding thereto. A capacitive coupling package structure as described in claim 6, wherein the first lead frame includes a plurality of first pins separated from each other, the second lead frame includes a plurality of second pins separated from each other, and a portion of the plurality of suspended supports has a projection on a projection plane parallel to the plurality of first pins and the plurality of second pins, and a remaining portion of the plurality of suspended supports has a projection on a projection plane perpendicular to the plurality of first pins and the plurality of second pins. A capacitive coupling package structure as described in claim 8, wherein the distance between each of the suspended supports in the remaining portions of the plurality of suspended supports whose projections on the projection plane are perpendicular to the first pin and the distance between the corresponding suspended supports in the remaining portions of the plurality of suspended supports whose projections on the projection plane are perpendicular to the second pin is at least 400 μm. A capacitive coupling packaging structure as described in claim 1, wherein a plurality of the first signal input poles and a plurality of the second signal input poles are arranged along a length direction of the first lead frame, a plurality of the first signal output poles and a plurality of the second signal output poles are arranged along a length direction of the second lead frame, and a plurality of the first signal input poles respectively correspond to a plurality of the first signal output poles, and a plurality of the second signal input poles respectively correspond to a plurality of the second signal output poles. A capacitive coupling packaging structure as described in claim 1, wherein a plurality of the first signal input poles and a plurality of the second signal input poles are arranged along a width direction of the first lead frame, a plurality of the first signal output poles and a plurality of the second signal output poles are arranged along a width direction of the second lead frame, and a plurality of the first signal input poles respectively correspond to a plurality of the first signal output poles, and a plurality of the second signal input poles respectively correspond to a plurality of the second signal output poles. The capacitive coupling package structure as described in claims 1 to 11 further includes at least one functional semiconductor element, which is arranged in the receiver module or the transmitter module, and the at least one functional semiconductor element is electrically connected between the output end of the receiver and the signal output pin or electrically connected between the signal input pin and the input end of the transmitter. A capacitively coupled package structure as described in claim 12, wherein the at least one functional semiconductor element is an insulated gate bipolar transistor (IGBT), a digital to analog converter circuit (DAC) or an analog to digital converter circuit (ADC). In the capacitive coupling package structure as described in claims 1 to 11, the spacer may be a package body, which covers the first lead frame and the second lead frame and fills the space between the first lead frame and the second lead frame. A capacitive coupling package structure as described in claims 1 to 11, wherein the spacer can be a dielectric material plate or a multi-layer ceramic plate, the first signal input pole plate and the first signal output pole plate are formed on one surface of the spacer, and the second signal input pole plate and the second signal output pole plate are formed on another surface of the spacer. A capacitive coupling package structure as described in claim items 1 to 11, wherein when the multi-signal channel is defined as N channels, the plurality of the suspension brackets are 2*M*N suspension brackets, N, M≥2.

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