TW202417896A - Composition, light-shielding film, solid-state imaging element, image display device, infrared sensor, method for manufacturing cured film - Google Patents

Abstract

The main subject of the present invention is to provide a composition that can form a cured film with excellent adhesion and low reflectivity to infrared light, and also produces little development residue. In addition, another subject of the present invention is to provide a light-shielding film, a solid-state imaging element, an image display device, an infrared sensor, and a method for manufacturing a cured film. The composition of the present invention includes: a resin including a repeating unit A having a group represented by formula (A1), a repeating unit B having an acid group, and a repeating unit C having a polymerizable group; a polymerizable compound; and a pigment.

Description

Composition, light shielding film, solid-state imaging element, image display device, infrared sensor, and method for manufacturing cured film

The present invention relates to a composition, a light shielding film, a solid-state imaging element, an image display device, an infrared sensor and a method for manufacturing a hardened film.

In image display devices such as liquid crystal display devices, and solid-state imaging devices such as CCD (Charge Coupled Device) image sensors and CMOS (Complementary Metal-Oxide Semiconductor) image sensors, color filters or light shielding films are often arranged at predetermined positions. For example, in liquid crystal display devices, a light shielding film called a black matrix is sometimes arranged between colored pixels on the color filter in order to shield the light between the colored pixels to improve the contrast. In addition, in solid-state imaging devices, a light shielding film is sometimes used to prevent the generation of noise and improve image quality.

For example, Patent Document 1 discloses a copolymer composition having a structural unit represented by the following formula (1) as a photosensitive resin composition that can be used for the above-mentioned purpose. In the following formula (1), ^R2 to ^R4 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkoxy group having 1 to 6 carbon atoms, and at least one of ^R2 to ^R4 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

[Chemical formula 1]

[Patent Document 1] International Publication No. 2022/085389

However, in addition to the light-shielding property, the light-shielding film is also expected to have low reflectivity to infrared light. The inventors of the present invention prepared the composition described in Patent Document 1 and studied its cured film, and found that there is room for further reducing the reflectivity to infrared light. In addition, it was found that there is room for forming a cured film with excellent adhesion with a smaller exposure amount. In addition, the composition is usually provided when a pattern (pattern-shaped cured film) is formed, and as a basic performance, it is required that the amount of development residue generated is small.

Therefore, the subject of the present invention is to provide a composition that can form a cured film with excellent adhesion and low reflectivity to infrared light, and produces less development residue. In addition, the subject of the present invention is also to provide a light-shielding film, a solid-state imaging element, an image display device, an infrared sensor, and a method for manufacturing a cured film.

As a result of in-depth research to solve the above-mentioned problem, the inventors found that the above-mentioned problem can be solved by the following structure.

[1] A composition comprising: a resin comprising a repeating unit A having a group represented by formula (A1), a repeating unit B having an acid group, and a repeating unit C having a polymerizable group; a polymerizable compound; and a pigment. Formula (A1) *-Si( ^RA1 ) ₃ In the formula, ^RA1 represents an alkyl group which may have a substituent, an aryl group which may have a substituent, or a group represented by formula (A2). * represents a bonding position. At least two of the three ^RA1s represent a group represented by formula (A2). Formula (A2) *-OSi( ^RA2 ) ₃ In the formula, ^RA2 represents a non-hydrolyzable group. * represents a bonding position. In addition, plural ^RA1s in formula (A1) and plural ^RA2s in formula (A2) may be the same or different from each other. [2] The composition as described in [1], wherein the repeating unit C comprises a repeating unit represented by the formula (CX2) described below. [3] The composition as described in [1] or [2], wherein the repeating unit A comprises a repeating unit represented by the formula (AX1) described below. [4] The composition as described in any one of [1] to [3], wherein the acid value of the resin is 60 to 170 mgKOH/g. [5] The composition as described in any one of [1] to [4], wherein the acid value of the resin is 70 to 170 mgKOH/g. [6] The composition as described in any one of [1] to [5], wherein the content of silicon atoms in the resin is 17.0 mass % or more relative to the total mass of the resin. [7] A composition as described in any one of [1] to [6], wherein the double bond valence of the resin is 0.35 mmol/g or more. [8] A composition as described in any one of [1] to [7], wherein the pigment comprises a black pigment. [9] A composition as described in [8], wherein the black pigment comprises titanium oxynitride. [10] A composition as described in any one of [1] to [9], which is a composition for forming a light-shielding film. [11] A light-shielding film comprising a cured film formed from the composition as described in any one of [1] to [10]. [12] A solid-state imaging element comprising a cured film formed from the composition as described in any one of [1] to [10]. [13] An image display device comprising a cured film formed from the composition as described in any one of [1] to [10]. [14] An infrared sensor comprising a cured film formed from a composition described in any one of [1] to [10]. [15] A method for manufacturing a cured film, comprising: a composition layer forming step, forming a composition layer on a support using a composition described in any one of [1] to [10]; an exposure step, irradiating the composition layer with activating light or radiation to expose the composition layer into a pattern; and a development step, performing a development process on the exposed composition layer. [Effect of the Invention]

According to the present invention, a composition can be provided, which can form a cured film having excellent adhesion and low reflectivity to infrared light, and also produces little development residue. In addition, according to the present invention, a light shielding film, a solid-state imaging element, an image display device, an infrared sensor, and a method for manufacturing a cured film can be provided.

The present invention is described in detail below. The description of the constituent elements described below is sometimes completed based on representative implementations of the present invention, but the present invention is not limited to such implementations. In addition, in this specification, the numerical range expressed by "～" means a range that includes the numerical values described before and after "～" as the lower limit and upper limit.

In addition, in the term "radical" in this specification, the term "unsubstituted" or "unsubstituted" includes not only radicals without substituents but also radicals with substituents. For example, "alkyl" includes not only radicals without substituents (unsubstituted alkyl) but also radicals with substituents (substituted alkyl).

In addition, "activating light" or "radiation" in this specification refers to, for example, far ultraviolet light, extreme ultraviolet light (EUV: Extreme ultraviolet lithography), X-rays, and electron beams. In addition, in this specification, light refers to activating light and radiation. Unless otherwise specified, "exposure" in this specification includes not only exposure using far ultraviolet light, X-rays, and EUV light, but also drawing using particle beams such as electron beams and ion beams.

In addition, in this specification, "(meth)acrylate" means acrylate and methacrylate, "(meth)acrylic acid" means acrylic acid and methacrylic acid, "(meth)acryl" means acryl and methacryl, and "(meth)acrylamide" means acrylamide and methacrylamide. In addition, in this specification, "monomer" and "monomer: monomer" have the same meaning.

In this specification, the weight average molecular weight (Mw) is a polystyrene conversion value based on the GPC (Gel Permeation Chromatography) method. The weight average molecular weight based on the GPC method is based on the following method, that is, using HLC-8020GPC (manufactured by Tosoh Corporation), using TSKgel Super HZM-H, TSKgel Super HZ4000, TSKgel SuperHZ2000 (manufactured by Tosoh Corporation, 4.6 mmID×15 cm) as a column, and using THF (tetrahydrofuran) as an eluent.

In this specification, "solid components in a composition" refers to a composition layer formed using the composition, and when the composition contains a solvent, it refers to all components other than the solvent. In addition, liquid components are also regarded as solid components as long as they are components that form a composition layer.

[Composition] The composition of the present invention comprises: a resin (hereinafter, also referred to as a "specific resin"), a repeating unit A having a group represented by the formula (A1) described below (hereinafter, also referred to as "repeating unit A"), a repeating unit B having an acid group (hereinafter, also referred to as "repeating unit B"), and a repeating unit C having a polymerizable group (hereinafter, also referred to as "repeating unit C"); a polymerizable compound; and a pigment.

The composition of the present invention can form a cured film with excellent adhesion and low reflectivity to infrared light by the above structure, and less development residue is generated. The following is an explanation of the presumed mechanism of action of the composition. It is presumed that the specific resin has a small surface free energy due to the presence of the group represented by formula (A1) contained in the repeating unit A, and when the above composition is used to form a composition layer, the specific resin tends to be concentrated on the surface of the layer. In addition, it is presumed that the surface of the layer where the specific resin of the composition layer is concentrated shows a low refractive index to infrared light due to the presence of the group represented by formula (A1) contained in the repeating unit A. That is, it is believed that the cured film formed by curing the composition layer formed by the composition of the present invention forms a low refractive index layer derived from the specific resin on the surface of the cured film, and exhibits low reflectivity to infrared light due to the Ar (Anti-reflection) effect caused by the low refractive index layer. In addition, the cured film formed by the composition of the present invention has excellent adhesion even when the exposure treatment is performed with a small exposure amount because the specific resin contains the repeating unit C. In addition, the composition of the present invention can suppress the generation of development residues when providing a pattern (pattern-shaped cured film) formation because the specific resin contains the repeating unit B.

Furthermore, through recent studies by the inventors, it has been confirmed that the composition of the present invention also has excellent storage stability.

Hereinafter, the fact that a cured film formed by the composition has lower reflectivity to infrared light, the cured film formed by the composition has better adhesion, the generation of development residues is suppressed when the composition is provided for pattern formation (pattern-shaped cured film), and/or the storage stability of the composition is better is also referred to as “the effect of the present invention is better”.

Hereinafter, various components of the composition of the present invention will be described.

[Specific resin] The composition contains a specific resin. The specific resin is a resin containing a repeating unit A (repeating unit A) having a group represented by formula (A1), a repeating unit B (repeating unit B) having an acid group, and a repeating unit C (repeating unit C) having a polymerizable group. The following describes various repeating units contained in the specific resin.

<Repeating unit A> The specific resin contains a repeating unit A (repeating unit A) having a group represented by formula (A1).

(Group represented by formula (A1)) First, the group represented by formula (A1) will be described below.

Formula (A1) *-Si( ^RA1 ) ₃ In the formula, ^RA1 represents an alkyl group which may have a substituent, an aryl group which may have a substituent, or a group represented by formula (A2). * represents a bonding position. In addition, plural ^RA1 groups in the formula may be the same or different from each other.

Formula (A2) *-OSi( ^RA2 ) ₃ In the formula, ^RA2 represents a non-hydrolyzable group. * represents a bonding position. In addition, plural ^RA2s in the formula may be the same or different.

The alkyl group represented by ^RA1 may be any of a linear, branched, and cyclic group, and a linear or branched group is preferred. The number of carbon atoms in the alkyl group is not particularly limited, and is preferably 1 to 30, more preferably 1 to 20, further preferably 1 to 12, particularly preferably 1 to 6, and most preferably 1 to 3. The substituent that the alkyl group represented by ^RA1 may have is not particularly limited, and examples thereof include aryl, alkenyl, alkynyl, alkoxy, aryloxy (e.g., phenoxy), acyloxy, alkenyloxy, and halogen atoms.

The aryl group represented by R ^A1 may be either monocyclic or polycyclic. The number of carbon atoms in the aryl group is not particularly limited, but is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 10, with phenyl being particularly preferred. The substituent that the aryl group represented by R ^A1 may have is not particularly limited, and examples thereof include alkyl, aryl, alkenyl, alkynyl, alkoxy, aryloxy (e.g., phenoxy), acyloxy, alkenyloxy, and halogen atoms.

In addition, as a substituent which the alkyl group represented by ^RA1 or the aryl group represented by ^RA1 may have, the carbon number of the aryl part in the aryl group and the aryloxy group exemplified in the above paragraph is preferably 6 to 18, and more preferably 6 to 12. Moreover, the carbon number of the alkyl part in the alkyl group and the alkoxy group is preferably 1 to 20, more preferably 1 to 12, and more preferably 1 to 6. Moreover, the carbon number of the alkenyl part in the alkenyl group and the alkenyloxy group is preferably 2 to 20, more preferably 2 to 12, and more preferably 2 to 6. Moreover, the carbon number of the alkynyl group is preferably 2 to 20, more preferably 2 to 12, and more preferably 2 to 6. Moreover, the carbon number of the acyloxy group is preferably 2 to 20, more preferably 2 to 12, and more preferably 2 to 6.

Next, the group represented by formula (A2) is described. The non-hydrolyzable group represented by ^RA2 refers to a substituent that directly bonds to a silicon atom and does not form a siloxane bond by a hydrolysis reaction and/or a condensation reaction. In addition, as a hydrolyzable group that can be hydrolyzed by bonding to a silicon atom, generally speaking, a hydrogen atom, a halogen atom, an alkoxy group, an aryloxy group (for example, a phenoxy group, etc.), an acyloxy group, and an alkenyloxy group, etc. can be cited. As the non-hydrolyzable group represented by ^RA2 , specifically, an alkyl group that may have a substituent and an aryl group that may have a substituent can be cited. As the ^alkyl group that may have a substituent represented by RA2, it is the same as the alkyl group that may have a substituent represented by ^RA1 , and the preferred embodiment is also the same. The aryl group which may have a substituent represented by ^RA2 is the same as the aryl group which may have a substituent represented by ^RA1 , and the preferred embodiment is also the same. As the non-hydrolyzable group represented by ^RA2 , from the viewpoint of better effect of the present invention, an alkyl group having 1 to 6 carbon atoms which may have a substituent is preferred, and an alkyl group having 1 to 3 carbon atoms which may have a substituent is more preferred.

In formula (A1), at least two of the three ^RA1s represent groups represented by formula (A2). From the viewpoint of achieving a more excellent effect of the present invention, it is preferred that all of the three ^RA1s represent groups represented by formula (A2).

In the repeating unit A, the number of the group represented by the above formula (A1) may be 1 or more, preferably 1 to 3, more preferably 1 or 2, and even more preferably 1.

The specific structure of the repeating unit A is not particularly limited, but from the perspective of more easily achieving excellent effects of the present invention, a repeating unit represented by the following formula (AX1) is preferred.

[Chemical formula 2]

In the formula, ^RA3 represents a hydrogen atom or an alkyl group. The carbon number of the alkyl group represented by ^RA3 is preferably 1 to 5, more preferably 1 to 3, and even more preferably 1.

L ^A1 represents a single bond, -COO- or -CONR ^A4 -. ^RA4 represents a hydrogen atom or an alkyl group. ^RA4 has the same meaning as ^RA3 above, and the preferred embodiment is also the same.

L ^A2 represents a single bond or a divalent linking group. The type of the divalent linking group is not particularly limited, and examples thereof include a divalent aliphatic alkyl group, a divalent aromatic alkyl group, -O-, -S-, -SO ₂ -, -NR ^A5 -, -CO-, and a group combining two or more of these. The divalent aliphatic alkyl group may be any of a linear chain, a branched chain, and a ring. In addition, as the number of carbon atoms, 1 to 20 are preferred, 1 to 10 are more preferred, and 1 to 6 are further preferred. As the divalent aliphatic alkyl group, an alkylene group, an alkenylene group, and an alkynylene group may be cited, among which an alkylene group is preferred. As the divalent aromatic alkyl group, a carbon number of 6 to 10 is preferred, and an example thereof may be a phenylene group. The divalent aliphatic alkyl group and the divalent aromatic alkyl group may further have a substituent. In addition, there is no particular limitation on the substituent, and examples thereof include a hydroxyl group and the like. The above-mentioned ^RA5 represents a hydrogen atom or an alkyl group. ^RA5 has the same meaning as the above-mentioned ^RA3 , and the preferred embodiment is also the same.

Examples of the divalent linking group include a group consisting of an alkylene group which may have a substituent or a combination of two or more selected from the group consisting of an alkylene group which may have a substituent, -O-, and -CO- (e.g., a group in which _-CH2- of an alkylene group which may have a substituent is substituted by a combination of one or two of -O- and -CO-). In the above alkylene group, the total number of carbon atoms excluding the substituent is preferably 1 to 10, more preferably 1 to 6.

W ^A1 represents a group represented by the above formula (A1).

The specific resin may contain one type of repeating unit A alone or two or more types. In the specific resin, as the lower limit of the content of the repeating unit A, 40% by mass or more is preferred, 50% by mass or more is more preferred, and 60% by mass or more is further preferred relative to all repeating units of the specific resin. In addition, as the upper limit of the content of the repeating unit A, 90% by mass or less is preferred, 80% by mass or less is more preferred, and 75% by mass or less is further preferred relative to all repeating units of the specific resin. When two or more types of repeating units A are used in combination, the total content is preferably within the above range.

<Repeating unit B> The specific resin contains a repeating unit B having an acid group (repeating unit B). In the specific resin, the repeating unit B not only contributes to reducing the development residue by improving the development adaptability of the specific resin to the alkaline developer, but also functions as a pigment adsorption group to contribute to the dispersibility of the pigment. In addition, the repeating unit B is a repeating unit different from the repeating unit A and the repeating unit C. As the acid group, for example, a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, and a phenolic hydroxyl group can be cited, among which a carboxylic acid group is preferred. In the repeating unit B, the number of acid groups can be 1 or more, and for example, 1 to 6 can be cited.

The specific structure of the repeating unit B is not particularly limited, but from the viewpoint of achieving more excellent effects of the present invention, a repeating unit represented by the following formula (BX) is preferred.

[Chemical formula 3]

In the formula, ^RB1 represents a hydrogen atom or an alkyl group. The carbon number of the alkyl group represented by ^RB1 is preferably 1 to 5, more preferably 1 to 3, and even more preferably 1.

L ^B1 represents a single bond, -COO- or -CONR ^B2 -. R ^B2 represents a hydrogen atom or an alkyl group. R ^B2 has the same meaning as R ^B1 above, and the preferred embodiment is also the same.

L ^B2 represents a single bond or a divalent linking group. The type of the divalent linking group is not particularly limited, and examples thereof include a divalent aliphatic alkyl group, a divalent aromatic alkyl group, -O-, -S-, -SO ₂ -, -NR ^B3 -, -CO-, and a group combining two or more of these. The divalent aliphatic alkyl group may be any of a linear chain, a branched chain, and a ring. In addition, as for the number of carbon atoms, 1 to 20 are preferred, and 1 to 10 are more preferred. As for the divalent aliphatic alkyl group, an alkylene group, an alkenylene group, and an alkynylene group may be cited, among which an alkylene group is preferred. As for the divalent aromatic alkyl group, a carbon number of 6 to 10 is preferred, and for example, a phenylene group may be cited. The divalent aliphatic hydrocarbon group and the divalent aromatic hydrocarbon group may further have a substituent. The substituent is not particularly limited, and may be, for example, a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, a phenolic hydroxyl group or the like. The above-mentioned ^RB3 represents a hydrogen atom or an alkyl group. ^RB3 has the same meaning as the above-mentioned ^RB1 , and the preferred embodiment is also the same.

As the divalent linking group, a group obtained by combining two or more groups selected from the group consisting of an alkylene group which may have a substituent, a phenylene group which may have a substituent, -O- and -CO- is preferred.

In the above formula (BX), the number of the hydrogen atoms in the moiety represented by ^-LB1 - ^LB2- is preferably less than 40, for example.

W ^B1 represents an acid group. The acid group is as described above.

From the viewpoint of achieving a better effect of the present invention, the repeating unit B preferably includes one or more repeating units represented by any one of the following formulas (B1) to (B4). In addition, in formula (B3), n represents the average addition number, which is 1 to 3.

[Chemical formula 4]

The specific resin may contain one type of repeating unit B alone or two or more types. In the specific resin, the content of the repeating unit B is preferably 5 to 50 mass %, more preferably 5 to 40 mass %, and even more preferably 10 to 40 mass % relative to all repeating units of the specific resin. When two or more types of repeating units B are used in combination, the total content is preferably within the above range.

<Repeating unit C> The specific resin contains a repeating unit C (repeating unit C) having a polymerizable group. Examples of the polymerizable group include an ethylenic unsaturated group (e.g., a group represented by *-CO-C( ^RC2 )= _CH2 (* represents a bonding position, and ^RC2 represents a hydrogen atom or an alkyl group. For example, it is equivalent to a (meth)acryl group), a vinyl group, a styryl group, etc.), and a cyclic ether group (e.g., an epoxy group, an oxobutylene group, etc.). Among them, as a polymerizable group, an ethylenic unsaturated group is preferred from the viewpoint of being able to control polymerization in a free radical reaction. As an ethylenic unsaturated group, a group represented by *-CO-C( ^RC2 )= _CH2 is preferred. In addition, the carbon number of the alkyl group represented by ^RC2 is preferably 1 to 5, more preferably 1 to 3, and further preferably 1. Furthermore, in the repeating unit C, the polymerizable group is preferably connected to the main chain via a covalent bonding group. That is, in the repeating unit C, it is preferred that the bonding position between the polymerizable group and the main chain does not include other bonds such as ionic bonds. In addition, the repeating unit C is a repeating unit different from the repeating unit A and the repeating unit B. In the repeating unit C, the number of polymerizable groups can be 1 or more, preferably 1 to 3, more preferably 1 or 2, and further preferably 1.

The specific structure of the repeating unit C is not particularly limited, but a repeating unit represented by the following formula (CX1) is preferred.

[Chemical formula 5]

In the formula, R ^C1 represents a hydrogen atom or an alkyl group. The carbon number of the alkyl group represented by R ^C1 is preferably 1 to 5, more preferably 1 to 3, and even more preferably 1.

L ^C1 represents a single bond, -COO- or -CONR ^C2 -. R ^C2 represents a hydrogen atom or an alkyl group. R ^C2 has the same meaning as R ^C1 above, and the preferred embodiment is also the same.

L ^C2 represents a single bond or a divalent linking group. The type of the divalent linking group is not particularly limited, and examples thereof include divalent aliphatic alkyl groups, divalent aromatic alkyl groups, -O-, -S-, -SO ₂ -, -NR ^C3 -, -CO-, and groups combining two or more of these. The divalent aliphatic alkyl group may be any of a linear chain, a branched chain, and a ring. In addition, as for the number of carbon atoms, 1 to 20 are preferred, and 1 to 10 are more preferred. As for the divalent aliphatic alkyl group, alkylene groups, alkenylene groups, and alkynylene groups may be cited, among which alkylene groups are preferred. As for the divalent aromatic alkyl group, those having 6 to 10 carbon atoms are preferred, and for example, phenylene groups may be cited. The divalent aliphatic hydrocarbon group and the divalent aromatic hydrocarbon group may further have a substituent. The substituent is not particularly limited, and examples thereof include acid groups such as carboxylic acid groups, sulfonic acid groups, phosphoric acid groups, and phenolic hydroxyl groups, as well as hydroxyl groups. The above-mentioned R ^C3 represents a hydrogen atom or an alkyl group. R ^C3 has the same meaning as the above-mentioned R ^C1 , and the preferred embodiment is also the same.

As the divalent linking group, a group obtained by combining two or more groups selected from the group consisting of an alkylene group which may have a substituent, a phenylene group which may have a substituent, -O- and -CO- is preferred.

In the above formula (CX1), the number of the hydrogen atoms in the site represented by ^-LC1 - ^LC2- is preferably less than 40, for example.

W ^C1 represents a polymerizable group. Examples of the polymerizable group represented by W ^C1 include the polymerizable groups already described.

As the repeating unit C, the repeating unit represented by formula (CX2) is more preferred. [Chemical Formula 6]

In the formula, R ^C1 and R ^C2 represent a hydrogen atom or an alkyl group. The alkyl groups represented by R ^C1 and R ^C2 have the same meanings as the alkyl group represented by R ^C1 in formula (CX1), and the preferred embodiments are also the same. L ^C3 represents a divalent linking group. The divalent linking group represented by L ^C3 is the same as the divalent linking group represented by L ^C2 in formula (CX1). As the divalent linking group represented by L ^C3 , a group obtained by combining two or more groups selected from the group consisting of an alkylene group which may have a substituent, a phenylene group which may have a substituent, -O- and -CO- is preferred.

The specific resin may contain one type of repeating unit C alone or two or more types. In the specific resin, the content of the repeating unit C is preferably 5 to 30 mass %, more preferably 5 to 20 mass %, and even more preferably 5 to 15 mass % relative to all repeating units of the specific resin. When two or more types of repeating units C are used in combination, the total content is preferably within the above range.

<Repeating unit D> The specific resin may contain other repeating units D (hereinafter, also referred to as "repeating unit D") other than the above-mentioned repeating units A to C.

As repeating unit D, other repeating units having various functions other than the above-mentioned repeating units can be cited. As repeating unit D, hydrophobic repeating units (hereinafter, also referred to as "repeating unit D1"), repeating units having functional groups capable of interacting with dispersed materials such as pigments (hereinafter, also referred to as "repeating unit D2"), repeating units having salt structures (hereinafter, also referred to as "repeating units D3"), and repeating units having groups selected from the group including polyoxyalkylene groups having an average addition number of 3 or more and polyoxyalkylene carbonyl groups having an average addition number of 3 or more (hereinafter, also referred to as "repeating unit D4"), etc. can be cited.

(Repeating unit D1) The specific resin may contain a hydrophobic repeating unit (repeating unit D1). As one aspect of the repeating unit D1, a repeating unit derived from a compound (monomer) having a ClogP value of 1.2 or more can be cited, among which a repeating unit derived from a compound having a ClogP value of 1.2 to 8 is preferred.

In this specification, the ClogP value is a value calculated by the program "CLOGP" available from Daylight Chemical Information System, Inc. The program provides the value of "calculated logP" calculated by the fragment approach of Hansch, Leo (see the following reference). The fragment approach divides the chemical structure into partial structures (fragments) based on the chemical structure of the compound, and calculates the logP value of the compound by summing up the logP contribution allocated to the fragment. The details are described in the following reference. In this specification, the ClogP value calculated by the program CLOGP v4.82 is used. A. J. Leo, Comprehensive Medicinal Chemistry, Vol.4, C.Hansch, P. G. Sammnens, J. B. Taylor and C. A. Ramsden, Eds., p.295, Pergamon Press, 1990 C. Hansch & A. J. Leo. Substituent Constants For Correlation Analysis in Chemistry and Biology. John Wiley & Sons. A. J. Leo. Calculating logPoct from structure. Chem. Rev., 93, 1281-1306, 1993.

logP refers to the common logarithm of the partition coefficient P (Partition Coefficient), which is a physical property value that quantitatively represents how a certain organic compound is distributed in the two-phase system equilibrium of oil (generally 1-octanol) and water, and is expressed by the following formula. logP=log(Coil/Cwater) In the formula, Coil represents the molar concentration of the compound in the oil phase, and Cwater represents the molar concentration of the compound in the water phase. If the logP value includes 0 and increases with positive values, the oil solubility increases, and if it increases with negative absolute values, the water solubility increases. It is negatively correlated with the water solubility of organic compounds and is widely used as a parameter for estimating the hydrophilicity and hydrophobicity of organic compounds.

Furthermore, as another aspect of the repeating unit D1, a repeating unit represented by the following formula (DX1) can be cited.

[Chemical formula 7]

In the formula, R ^D1 represents a hydrogen atom or an alkyl group. The carbon number of the alkyl group represented by R ^D1 is preferably 1 to 5, more preferably 1 to 3, and more preferably 1. R ^D2 represents a linear or branched alkyl group having 1 to 12 carbon atoms or an aralkyl group having 7 to 18 carbon atoms. From the viewpoint of more excellent effects of the present invention, an aralkyl group having 7 to 18 carbon atoms is preferred. The carbon number of the alkyl group represented by R ^D2 is preferably 1 to 8, more preferably 1 to 6, and more preferably 1 to 4. Furthermore, a linear alkyl group is preferred. The carbon number of the aralkyl group represented by R ^D2 is preferably 7 to 18, more preferably 7 to 12, and more preferably 7 to 10. Furthermore, the alkyl group and aralkyl group represented by R ^D2 may have a substituent. The substituent is not particularly limited, and examples thereof include a hydroxyl group.

From the viewpoint of achieving a more excellent effect of the present invention, the repeating unit D1 is preferably a repeating unit having a benzyl group, and more preferably a repeating unit derived from benzyl (meth)acrylate.

The specific resin may contain one type of repeating unit D1 alone or two or more types. In the specific resin, the content of the repeating unit D1 is preferably 5 to 20 mass %, more preferably 5 to 15 mass %, and even more preferably 5 to 10 mass % relative to all repeating units of the specific resin. When two or more types of repeating units D1 are used in combination, the total content is preferably within the above range.

(Repeating unit D2) The specific resin may contain a repeating unit (repeating unit D2) including a functional group capable of interacting with a dispersed substance such as a pigment. As the functional group capable of interacting with the dispersed substance such as a pigment, for example, a base group and a coordination group can be cited.

As the base group, for example, a primary amine group, a diamine group, a tertiary amine group, a heterocycle containing a N atom, an amide group, and a urea group can be cited. The specific resin can contain one type of repeating unit containing a base group alone, or two or more types. As the ligand and the reactive functional group, for example, an acetylacetoxy group, a trialkoxysilyl group, an isocyanate group, an acid anhydride, and an acyl chloride can be cited. The specific resin can contain one type of repeating unit containing a ligand alone, or two or more types. In the specific resin, the content of the repeating unit D2 is preferably 5 to 20 mass %, more preferably 5 to 15 mass %, and even more preferably 5 to 10 mass % relative to all the repeating units of the specific resin. When two or more repeating units D2 are used in combination, the total content is preferably within the above range.

(Repeating unit D3) The specific resin may contain a repeating unit having a salt structure (hereinafter, also referred to as "repeating unit D3"). As the repeating unit D3, for example, a repeating unit derived from (meth) acrylic acid, and a repeating unit in which the carboxylic acid part in the above repeating unit is anionized to form a salt structure with quaternary ammonium is preferred. As quaternary ammonium, the structure represented by the formula (TY) described below is preferred. The specific resin may contain one type of repeating unit D3 alone, or may contain two or more types. In the specific resin, the content of the repeating unit D3 is preferably 5 to 20 mass %, more preferably 5 to 15 mass %, and even more preferably 5 to 10 mass % relative to all repeating units of the specific resin. When two or more repeating units D3 are used together, the total content is preferably within the above range.

(Repeating unit D4) The specific resin may contain a repeating unit having a group selected from the group including a polyoxyalkylene group having an average addition number of 3 or more and a polyoxyalkylene carbonyl group having an average addition number of 3 or more (hereinafter, also referred to as "repeating unit D4").

In addition, a polyoxyalkylene group represents a group represented by -(O-AL) _n1 -, and a polyoxyalkylene carbonyl group represents a group represented by -(O-AL-CO) _n2 -. In the polyoxyalkylene group and the polyoxyalkylene carbonyl group, a plurality of oxyalkylene groups (-O-AL-) may be the same or different.

The carbon number of the alkylene group in the oxyalkylene group and the oxyalkylene carbonyl group (the carbon number of AL) is not particularly limited, but is preferably 2 to 10, more preferably 2 to 9, and even more preferably 2 to 7. The average addition number (n1, n2) in the polyoxyalkylene group and the oxyalkylene carbonyl group is 3 or more, preferably 4 or more, more preferably 5 or more, even more preferably 6 or more, and particularly preferably 8 or more. In addition, as the upper limit, 100 or less is preferably, 70 or less is more preferably, and 30 or less is even more preferably.

The repeating unit D4 may be, for example, a repeating unit represented by any one of the formulas (1) to (3) described in the dispersant (dispersing resin) described below, and may be a unit in which the average number of additions of polyoxyalkylene groups and oxyalkylene carbonyl groups is 3 or more. The repeating units represented by the formulas (1) and (2) described in the dispersant (dispersing resin) described below are equivalent to repeating units having a polyoxyethylene carbonyl group, and the repeating unit represented by the formula (3) described in the dispersant (dispersing resin) described below is equivalent to a repeating unit having a polyoxyalkylene group.

The specific resin may contain one type of repeating unit D4 alone or two or more types. In the specific resin, the content of the repeating unit D4 is preferably 5 to 20 mass %, more preferably 5 to 15 mass %, and even more preferably 5 to 10 mass % relative to all repeating units of the specific resin. When two or more types of repeating units D4 are used in combination, the total content is preferably within the above range.

The content of the specific resin in the composition is not particularly limited. It is preferably 2 to 40 mass %, more preferably 5 to 30 mass %, and even more preferably 5 to 25 mass % relative to the total solid content of the composition. The specific resin may be used alone or in combination of two or more. When two or more specific resins are used in combination, the total content is preferably within the above range.

As the lower limit of the content of silicon atoms in the specific resin, from the viewpoint of a better effect of the present invention, relative to the total mass of the specific resin, for example, 10.0 mass% or more is preferred, 11.5 mass% or more is more preferred, and 17.0 mass% or more is further preferred. As the upper limit, for example, 50.0 mass% or less is preferred, 40.0 mass% or less is more preferred, and 35.0 mass% or less is further preferred. In addition, for example, by changing the content of the repeating unit A, which is a constituent component of the specific resin, a resin having a desired silicon atom content can be obtained.

As for the acid value of the specific resin, from the viewpoint of ensuring the developability with alkaline developer and the viewpoint of achieving the effect of the present invention, 50 mgKOH/g or more is preferred, 55 mgKOH/g or more is more preferred, 60 mgKOH/g or more is further preferred, and 70 mgKOH/g or more is particularly preferred. As the upper limit, 170 mgKOH/g or less is preferred, 150 mgKOH/g or less is more preferred, and 100 mgKOH/g or less is further preferred. In addition, for example, by changing the content of the repeating unit B, which is a constituent component of the specific resin, a resin having a desired acid value can be obtained.

As for the bivalent bond (C=C valent bond) of the specific resin, from the viewpoint of more excellent effects of the present invention, it is preferably 0.10 mmol/g or more, more preferably 0.15 mmol/g or more, and even more preferably 0.35 mmol/g or more. As the upper limit, it is preferably 3.0 mmol/g or less, more preferably 2.0 mmol/g or less, and even more preferably 1.5 mmol/g or less. In addition, for example, in the repeating unit C, which is a constituent of the specific resin, as long as the polymerizable group is set to an ethylenically unsaturated group, etc., and its content is changed, a resin having a desired bivalent bond can be obtained.

The weight average molecular weight of the specific resin is preferably 5,000 to 100,000, more preferably 6,000 to 80,000, further preferably 15,000 to 60,000, and most preferably 15,000 to 50,000.

In addition, from the viewpoint of achieving a more excellent effect of the present invention, it is also preferred that the resin does not contain a polysiloxane structure such as a polydialkylsiloxane structure having silicon atoms bonding two organic groups as constituent atoms (i.e., a D unit structure).

[Polymerizable compound] The composition contains a polymerizable compound. The polymerizable compound is preferably an organic compound that can be polymerized by the action of a photopolymerization initiator described later (for example, an organic compound containing an ethylenically unsaturated group). In addition, when the composition contains a solvent, the polymerizable compound is preferably present in the solvent while being dissolved.

The molecular weight (weight average molecular weight when there is a molecular weight distribution) of the polymerizable compound is not particularly limited, but is preferably 2500 or less. The lower limit is preferably 100 or more.

The polymerizable compound is preferably a compound containing an ethylenically unsaturated group (a group containing an ethylenically unsaturated bond). That is, the composition preferably contains a low molecular compound containing an ethylenically unsaturated group as a polymerizable compound. As a polymerizable compound, a compound containing one or more ethylenically unsaturated bonds is preferred, a compound containing two or more is more preferred, a compound containing three or more is further preferred, and a compound containing four or more is particularly preferred. The upper limit is, for example, 15 or less. As ethylenically unsaturated groups, for example, vinyl, (meth)allyl, and (meth)acryloyl can be cited.

As the polymerizable compound, for example, the compounds described in paragraph [0050] of JP-A-2008-260927 and paragraph [0040] of JP-A-2015-068893 can be cited, and the contents thereof are incorporated into the present specification.

The polymerizable compound may be any chemical form such as a monomer, a prepolymer, an oligomer, a mixture thereof, or a polymer thereof. The polymerizable compound is preferably a 3-15-functional (meth)acrylate compound, and more preferably a 3-6-functional (meth)acrylate compound.

The polymerizable compound is preferably a compound containing one or more ethylenically unsaturated groups and having a boiling point of 100° C. or higher at normal pressure. For example, the compounds described in paragraph [0227] of JP-A-2013-029760 and paragraphs [0254] to [0257] of JP-A-2008-292970 can be cited, and the contents are incorporated into this specification.

Preferred polymerizable compounds are dipentatriol triacrylate (commercially available products such as KAYARAD D-330; manufactured by Nippon Kayaku Co., Ltd.), dipentatriol tetraacrylate (commercially available products such as KAYARAD D-320; manufactured by Nippon Kayaku Co., Ltd.), dipentatriol penta(meth)acrylate (commercially available products such as KAYARAD D-310; manufactured by Nippon Kayaku Co., Ltd.), dipentatriol hexa(meth)acrylate (commercially available products such as KAYARAD DPHA; manufactured by Nippon Kayaku Co., Ltd., A-DPH-12E; manufactured by SHIN-NAKAMURA CHEMICAL Co., Ltd.), and structures in which (meth)acryloyl groups thereof mediate ethylene glycol residues or propylene glycol residues (for example, commercially available products SR454 and SR499 from Sartomer company Inc.). Such oligomer types can also be used. In addition, NK Ester A-TMMT (neopentaerythritol tetraacrylate, manufactured by SHIN-NAKAMURA CHEMICAL Co., Ltd.), KAYARAD RP-1040, KAYARAD DPEA-12LT, KAYARAD DPHA LT, KAYARAD RP-3060 and KAYARAD DPEA-12 (all product names, manufactured by Nippon Kayaku Co., Ltd.) can be used. In addition, the polymerizable compound can use a (meth)acrylic urethane compound having both a (meth)acrylic group and a urethane bond in the compound, for example, KAYARAD DPHA-40H (product name, manufactured by Nippon Kayaku Co., Ltd.) can be used. The following shows the state of the preferred polymerizable compound.

The polymerizable compound may have an acid group such as a carboxylic acid group, a sulfonic acid group, and a phosphoric acid group. The polymerizable compound containing an acid group is preferably an ester of an aliphatic polyhydroxy compound and an unsaturated carboxylic acid, and is more preferably a polymerizable compound having an acid group by reacting a non-aromatic carboxylic acid anhydride with an unreacted hydroxyl group of an aliphatic polyhydroxy compound. Among the esters, the aliphatic polyhydroxy compound is more preferably a compound that is neopentyl triol and/or dipentyl triol. Examples of commercially available products include ARONIX TO-2349, M-305, M-510, and M-520 manufactured by TOAGOSEI CO., LTD.

The acid value of the polymerizable compound containing an acid group is preferably 0.1 to 40 mgKOH/g, and more preferably 5 to 30 mgKOH/g. If the acid value of the polymerizable compound is 0.1 mgKOH/g or more, the developing and dissolving properties are good, and if it is 40 mgKOH/g or less, it is advantageous in manufacturing and/or handling. In addition, the photopolymerization performance is good and the curing property is excellent.

Regarding polymerizable compounds, compounds containing a caprolactone structure are also preferred. As compounds containing a caprolactone structure, for example, there are no particular restrictions as long as the caprolactone structure is contained in the molecule. For example, ε-caprolactone modified multifunctional (meth)acrylates obtained by esterifying polyols such as trihydroxymethylethane, ditrihydroxymethylethane, trihydroxymethylpropane, ditrihydroxymethylpropane, pentaerythritol, dipentaerythritol, tripentaerythritol, glycerol, diglycerol and trihydroxymethylmelamine with (meth)acrylic acid and ε-caprolactone can be cited. Among them, compounds containing a caprolactone structure represented by the following formula (Z-1) are preferred.

[Chemical formula 8]

In formula (Z-1), all six Rs are groups represented by the following formula (Z-2), or 1 to 5 of the six Rs are groups represented by the following formula (Z-2), and the rest are groups represented by the following formula (Z-3).

[Chemical formula 9]

In formula (Z-2), ^R1 represents a hydrogen atom or a methyl group, m represents a number of 1 or 2, and * represents a bonding position.

[Chemical formula 10]

In formula (Z-3), ^R1 represents a hydrogen atom or a methyl group, and "*" represents a bonding position.

Regarding the polymerizable compound containing a caprolactone structure, for example, it is commercially available as the KAYARAD DPCA series from Nippon Kayaku Co., Ltd., and includes DPCA-20 (in the above formulas (Z-1) to (Z-3), m=1, the number of groups represented by formula (Z-2)=2, and all ^R1s are hydrogen atoms), DPCA-30 (in the same formula, m=1, the number of groups represented by formula (Z-2)=3, and all ^R1s are hydrogen atoms), DPCA-60 (in the same formula, m=1, the number of groups represented by formula (Z-2)=6, and all ^R1s are hydrogen atoms), and DPCA-120 (in the same formula, m=2, the number of groups represented by formula (Z-2)=6, and all ^R1s are hydrogen atoms). In addition, as a commercially available product of a polymerizable compound including a caprolactone structure, M-350 (product name) (trihydroxymethylpropane triacrylate) manufactured by TOAGOSEI CO., LTD. can also be cited.

As the polymerizable compound, a compound represented by the following formula (Z-4) or formula (Z-5) can be used.

[Chemical formula 11]

In formula (Z-4) and formula (Z-5), E represents -((CH ₂ ) _y CH ₂ O)- or -((CH ₂ ) _y CH(CH ₃ ) O)-, y represents an integer of 0 to 10, and X represents a (meth)acryloyl group, a hydrogen atom or a carboxylic acid group. In formula (Z-4), the total number of (meth)acryloyl groups is 3 or 4, m represents an integer of 0 to 10, and the total number of each m is an integer of 0 to 40. In formula (Z-5), the total number of (meth)acryloyl groups is 5 or 6, n represents an integer of 0 to 10, and the total number of each n is an integer of 0 to 60.

In formula (Z-4), m is preferably an integer of 0 to 6, more preferably an integer of 0 to 4. The total of each m is preferably an integer of 2 to 40, more preferably an integer of 2 to 16, and more preferably an integer of 4 to 8. In formula (Z-5), n is preferably an integer of 0 to 6, more preferably an integer of 0 to 4. The total of each n is preferably an integer of 3 to 60, more preferably an integer of 3 to 24, and more preferably an integer of 6 to 12. In formula (Z-4) or formula (Z-5), -((CH ₂ ) _y CH ₂ O)- or -((CH ₂ ) _y CH(CH ₃ ) O)- is preferably in a form in which the terminal on the oxygen atom side is bonded to X.

The compound represented by formula (Z-4) or formula (Z-5) may be used alone or in combination of two or more. In particular, a compound in which all six Xs in formula (Z-5) are acryl groups, or a compound in which all six Xs in formula (Z-5) are acryl groups and a compound in which at least one of the six Xs is a hydrogen atom are preferably used as a mixture. By adopting such a configuration, the developing property can be further improved.

Furthermore, the total content of the compounds represented by formula (Z-4) or (Z-5) in the polymerizable compound is preferably 20% by mass or more, and more preferably 50% by mass or more. Among the compounds represented by formula (Z-4) or (Z-5), neopentyletrol derivatives and/or dipentyletrol derivatives are more preferred.

In addition, the polymerizable compound may contain a cardo skeleton. The polymerizable compound containing a cardo skeleton is preferably a polymerizable compound containing a 9,9-diarylfluorene skeleton. As polymerizable compounds containing a cardo skeleton, for example, Oncoat EX series (manufactured by NAGASE & CO., LTD) and Ogsol (manufactured by Osaka Gas Chemicals Co., Ltd.) can be cited. It is also preferred that the polymerizable compound is a compound containing an isocyanuric acid skeleton as a central core. As an example of such a polymerizable compound, for example, NK Ester A-9300 (manufactured by SHIN-NAKAMURA CHEMICAL Co., Ltd.) can be cited. The content of ethylenically unsaturated groups in the polymerizable compound (a value obtained by dividing the number of ethylenically unsaturated groups in the polymerizable compound by the molecular weight (g/mol) of the polymerizable compound) is preferably 5.0 mmol/g or more. The upper limit is preferably below 20.0mmol/g.

The content of the polymerizable compound in the composition is preferably 5% by mass or more relative to the total solid content of the composition, more preferably 10% by mass or more, further preferably 14% by mass or more, and particularly preferably 20% by mass or more. In addition, as the upper limit, 60% by mass or less is preferably, 40% by mass or less is more preferably, and 35% by mass or less is further preferably. The polymerizable compound can be used alone or in combination of two or more. When two or more polymerizable compounds are used in combination, the total amount thereof is preferably within the above range.

[Pigment] The composition includes a pigment. There is no particular limitation on the pigment, and examples thereof include black pigment, white pigment, and color pigment. Also, examples of color pigment include red pigment, green pigment, blue pigment, yellow pigment, purple pigment, and orange pigment. As pigments, black pigment and white pigment are preferred, and black pigment is more preferred. Also, the pigment may be any of an inorganic pigment and an organic pigment. Also, as a pigment, a material obtained by replacing a part of an inorganic pigment or an organic-inorganic pigment with an organic chromophore may be used. By replacing an inorganic pigment or an organic-inorganic pigment with an organic chromophore, it has the advantage of being easy to design the hue.

The composition may use a single pigment or two or more pigments in combination. For example, when the cured film of the composition is used as a light-shielding film, the light-shielding properties of the light-shielding film can be adjusted by using a black pigment and other pigments in addition to the black pigment. Furthermore, when the light-shielding film is used as a light-attenuating film, it becomes easy to evenly attenuate each wavelength of light containing a wide-wavelength component.

(Black pigment) The composition preferably includes a black pigment. In this specification, a black pigment refers to a pigment having absorption over the entire wavelength range of 400 to 700 nm. For example, a black pigment that meets the evaluation standard Z described below is preferred. First, a composition is prepared, which includes a black pigment, a transparent resin matrix (acrylic resin, etc.) and a solvent, and the content of the black pigment relative to the total solid content is 60% by mass. The obtained composition is applied to a glass substrate until the film thickness of the cured film after drying becomes 1 μm to form a cured film. The light-shielding property of the cured film after drying is evaluated using a spectrophotometer (UV-3600, etc. manufactured by Hitachi, Ltd.). As long as the maximum transmittance of the cured film after drying at a wavelength of 400 to 700 nm is less than 10%, the above black pigment can be judged as a black pigment suitable for evaluation standard Z. In evaluation standard Z, it is better if the maximum transmittance of the cured film of the black pigment after drying at a wavelength of 400 to 700 nm is less than 8%, and it is even better if it is less than 5%.

As a black pigment, you can combine multiple pigments that cannot be used as a black pigment individually and adjust them so that the whole becomes black to use as a black pigment. For example, you can combine multiple pigments with colors other than black individually to use as a black pigment.

The average particle size of the black pigment is preferably 250 nm or less, more preferably 200 nm or less, and even more preferably 150 nm or less. From the perspective of better operability, the average particle size is preferably 1 nm or more, more preferably 5 nm or more, and even more preferably 20 nm or more.

The above average particle size is calculated by the following method. The composition is diluted with propylene glycol monomethyl ether acetate (PGMEA) to prepare a measurement solution with a solid content concentration of 0.2 mass %. Then, using a dynamic light scattering particle size distribution measuring device (LB-500 (product name) manufactured by HORIBA, Ltd.) in accordance with JIS8826:2005, 50 data acquisitions of the above measurement solution are performed at a temperature of 25°C using a 2 ml measurement quartz cell, and the obtained number-based particle sizes are arithmetic averaged as the average particle size. In addition, in the above-mentioned measurement solution prepared using the composition, the above-mentioned measurement can be performed using a color material dispersion in which a black pigment is dispersed. For example, when the composition contains particles other than black pigment, the average particle size of the black pigment can be measured using a color material dispersion in which the black pigment used to prepare the composition is dispersed. Also, when the composition contains particles other than black pigment, the average particle size of the black pigment can be measured after separating the black pigment from the other particles by any method.

As a black pigment, a pigment that appears black alone is preferred. In addition, a black pigment that appears black alone and absorbs infrared rays can also be used. Here, the black pigment that absorbs infrared rays has absorption in the wavelength range of the infrared region (preferably a wavelength of 650 to 1300 nm). A black pigment having a wavelength with a maximum absorption wavelength in the wavelength range of 675 to 900 nm is also preferred.

As the black pigment, various known black pigments can be used. The black pigment can be an inorganic pigment or an organic pigment. From the perspective of achieving a better effect of the present invention, the black pigment is preferably an inorganic pigment, and carbon black, metal nitride particles, or metal oxynitride particles are more preferably.

-Inorganic pigments- As inorganic pigments that can be used as black pigments, there are no particular restrictions as long as they have light-shielding properties and contain particles of inorganic compounds, and known inorganic pigments can be used.

As inorganic pigments, metal oxides, metal nitrides, and metal oxynitrides containing Group 4 metal elements such as titanium (Ti) and zirconium (Zr), Group 5 metal elements such as vanadium (V) and niobium (Nb), and one or more metal elements selected from the group including yttrium (Y), aluminum (Al), cobalt (Co), chromium (Cr), copper (Cu), manganese (Mn), ruthenium (Ru), iron (Fe), nickel (Ni), tin (Sn), and silver (Ag) can be cited. Among them, metal oxides, metal nitrides, or metal oxynitrides containing one or more metal elements selected from the group including titanium (Ti), zirconium (Zr), vanadium (V), yttrium (Y), aluminum (Al), and iron (Fe) are preferred. That is, the inorganic pigment may contain two or more metal atoms. As the above-mentioned metal oxide, metal nitride and metal oxynitride, particles mixed with other metal atoms may be further used, for example, particles containing metal nitrides containing atoms selected from elements of groups 13 to 17 of the periodic table (preferably oxygen atoms and/or sulfur atoms) may be further used. In addition, the above-mentioned metal oxide, metal nitride and metal oxynitride may be coated with inorganic and/or organic substances. As the above-mentioned inorganic substance, the metal atom contained in the above-mentioned inorganic pigment may be cited. As the above-mentioned organic substance, an organic substance having a hydrophobic group may be cited, and silane compounds are preferred.

As a method for producing the above-mentioned metal nitrides, metal oxides and metal oxynitrides, there is no particular limitation as long as a black pigment having the desired physical properties can be obtained, and a known production method such as a gas phase reaction method can be used. As a gas phase reaction method, an electric furnace method and a hot plasma method can be cited, but from the perspective of less impurities mixed, easy uniform particle size and high productivity, the hot plasma method is preferred. The above-mentioned metal nitrides, metal oxides and metal oxynitrides can be subjected to surface modification treatment. Surface modification treatment can be performed using a surface treatment agent having both a polysiloxy group and an alkyl group. As such inorganic particles, the "KTP-09" series (manufactured by Shin-Etsu Chemical Co., Ltd.) can be cited.

Among them, from the viewpoint of being able to suppress the occurrence of undercutting when forming a cured film, nitrides or oxynitrides of one or more metals selected from the group consisting of titanium, vanadium, zirconium, niobium and iron are more preferred, and nitrides or oxynitrides of zirconium or nitrides or oxynitrides of titanium (titanium black) are even more preferred.

Titanium black is black particles containing titanium oxynitride. Titanium black can be surface-modified as needed for the purpose of improving dispersibility, inhibiting agglomeration, etc. Titanium black can be coated with silicon oxide, titanium oxide, germanium oxide, aluminum oxide, magnesium oxide, or zirconium oxide, and can also be treated with a water-repellent substance as described in Japanese Patent Publication No. 2007-302836.

As a method for producing titanium black, there can be cited a method of heating and reducing a mixture of titanium dioxide and metallic titanium in a reducing atmosphere (Japanese Patent Publication No. 49-05432), a method of reducing ultrafine titanium dioxide obtained by high-temperature hydrolysis of titanium tetrachloride in a hydrogen-containing reducing atmosphere (Japanese Patent Publication No. 57-205322), a method of high-temperature reducing titanium dioxide or titanium hydroxide in the presence of ammonium (Japanese Patent Publication No. 60-065069, Japanese Patent Publication No. 61-201610), and a method of attaching a vanadium compound to titanium dioxide or titanium hydroxide and high-temperature reducing it in the presence of ammonium (Japanese Patent Publication No. 61-201610).

There is no particular restriction on the particle size of titanium black, but 10 to 45 nm is preferred, and 12 to 20 nm is more preferred. There is no particular restriction on the specific surface area of titanium black, but in order to achieve the specified performance of water repellency after surface treatment with a water repellent, the value measured by the BET (Brunauer, Emmett, Teller) method is preferably 5 to 150 m ² /g, and more preferably 20 to 100 m ² /g.

As titanium black, for example, titanium black 10S, 12S, 13R, 13M, 13M-C, 13R, 13R-N, 13M-T (product names, manufactured by Mitsubishi Materials Corporation), Tilack D (product name, manufactured by Ako Kasei Co., Ltd.), and MT-150A (product name, manufactured by TAYCA CORPORATION) can be cited.

It is also preferred that the composition contains titanium black as a dispersed body containing titanium black and Si atoms. In this form, titanium black is contained in the composition as a dispersed body. The content ratio of Si atoms to Ti atoms in the dispersed body (Si/Ti) is preferably 0.05 to 0.5 in terms of mass conversion, and more preferably 0.07 to 0.4. Here, the above-mentioned dispersed body includes both titanium black in the state of primary particles and titanium black in the state of aggregates (secondary particles). In addition, as long as the Si/Ti of the dispersed body is above the specified value, it is difficult to leave residues in the removed part when the composition layer using the dispersed body is patterned by photolithography, etc., and as long as the Si/Ti of the dispersed body is below the specified value, the light shielding ability is easy to become good.

In order to change the Si/Ti of the dispersed body (for example, to 0.05 or more), the following mechanism can be used. First, titanium oxide and silicon dioxide particles are dispersed by a disperser to obtain a dispersion, and the mixture is reduced at a high temperature (for example, 850 to 1000°C) to obtain a dispersed body containing Si and Ti with titanium black particles as the main component. Titanium black with adjusted Si/Ti can be produced, for example, by the method described in paragraphs [0005] and [0016] to [0021] of Japanese Patent Publication No. 2008-266045. In addition, the content ratio of Si atoms to Ti atoms in the dispersed body (Si/Ti) can be measured using, for example, method (2-1) or method (2-3) described in paragraphs [0054] to [0056] of International Publication No. 2011/049090.

In the dispersed body containing titanium black and Si atoms, the titanium black can be used as the above-mentioned one. In addition, in the dispersed body, for the purpose of adjusting dispersibility, coloring, etc., titanium black can be used as the dispersed body in combination with one or more black pigments including composite oxides of multiple metals selected from Cu, Fe, Mn, V and Ni, cobalt oxide, iron oxide, carbon black and aniline black. In this case, it is preferred that the dispersed body composed of titanium black accounts for more than 50% by mass of all the dispersed bodies.

Carbon black can also be cited as a black inorganic pigment. As carbon black, for example, furnace black, channel black, thermal black, acetylene black, and lamp black can be cited. As carbon black, carbon black produced by a known method such as an oil furnace method can be used, and commercial products can also be used. As commercial products of carbon black, for example, inorganic pigments such as C.I. Pigment Black 7 can be cited.

As carbon black, surface-treated carbon black is preferred. Surface treatment can modify the surface state of carbon black particles and improve the dispersion stability in the composition. Examples of surface treatment include coating treatment with resin, surface treatment by introducing acidic groups, and surface treatment by silane coupling agent.

As carbon black, carbon black coated with resin is preferred. By coating the surface of carbon black particles with insulating resin, the light shielding and insulation properties of the cured film can be improved. In addition, the reliability of the image display device can be improved by reducing leakage current, etc. Therefore, it is preferred to use the cured film for applications requiring light shielding and insulation properties. As the coating resin, epoxy resin, polyamide, polyamide imide, novolac resin, phenolic resin, urea resin, melamine resin, polyurethane, dibutyl phthalate resin, alkylbenzene resin, polystyrene, polycarbonate, polybutylene terephthalate and modified polyphenylene ether can be cited. From the viewpoint of better light shielding and insulation of the cured film, the content of the coating resin is preferably 0.1 to 40% by mass, and more preferably 0.5 to 30% by mass relative to the total of carbon black and the coating resin.

As an inorganic pigment used as a black pigment, for example, zirconium disclosed in Japanese Patent Application Publication No. 2017-222559, International Publication No. 2019/130772, International Publication No. 2019/059359, and Japanese Patent Application Publication No. 2009-091205 can be cited, and the contents thereof are incorporated into this specification.

-Organic pigment- As an organic pigment that can be used as a black pigment, there is no particular limitation as long as it is a particle having light-shielding properties and containing an organic compound, and a known organic pigment can be used. In the present invention, as an organic pigment, for example, bisbenzofuranone compounds, azomethine compounds, perylene compounds and azo compounds can be cited, and bisbenzofuranone compounds or perylene compounds are preferred.

As the bisbenzofuranone compound, compounds described in Japanese Patent Publication No. 2010-534726, Japanese Patent Publication No. 2012-515233, and Japanese Patent Publication No. 2012-515234 can be cited. The bisbenzofuranone compound can be obtained as "Irgaphor Black" (product name) manufactured by BASF. As the perylene compound, compounds described in Japanese Patent Publication No. 62-001753 and Japanese Patent Publication No. 63-026784 can be cited. The perylene compound can be obtained as C.I. Pigment Black 21, 30, 31, 32, 33, and 34.

The content of the pigment relative to the total solid content of the composition is preferably 10-60 mass %, more preferably 20-60 mass %, further preferably 20-50 mass %, and particularly preferably 20-40 mass %. The composition may contain only one pigment or two or more. When containing two or more pigments, the total amount is preferably within the above range.

[Dye] The composition may contain a dye. As the dye, a known dye can be used, for example, a black dye and a color dye can be cited. As the color dye, for example, a red dye, a green dye, a blue dye, a yellow dye, a violet dye and an orange dye can be cited. As the dye, a black dye is preferred. As the black dye, for example, a dye that exhibits black can be used alone, for example, a pyrazole azo compound, a pyrromethene compound, an aniline azo compound, a triphenylmethane compound, an anthraquinone compound, a benzylidene compound, an oxonol compound, a pyrazolotriazole azo compound, a pyridone azo compound, a cyanine compound, a phenanthridine compound and a pyrrolopyrazole azo methine compound can be used. In addition, as black dyes, for example, compounds described in Japanese Patent Publication No. 64-090403, Japanese Patent Publication No. 64-091102, Japanese Patent Publication No. 01-094301, Japanese Patent Publication No. 06-011614, Japanese Patent Publication No. 2592207, U.S. Patent No. 4808501, U.S. Patent No. 5667920, U.S. Patent No. 505950, Japanese Patent Publication No. 05-333207, Japanese Patent Publication No. 06-035183, Japanese Patent Publication No. 06-051115, and Japanese Patent Publication No. 06-194828 can be referred to, and the contents are incorporated into this specification.

As such black dyes, for example, dyes specified in the Pigment Index (C.I.) of Solvent Black 27 to 47 can be cited, and dyes specified in the C.I. of Solvent Black 27, 29 or 34 are preferred. In addition, as commercially available products of such black dyes, for example, dyes such as Spilon Black MH, Black BH (manufactured by Hodogaya Chemical Co., Ltd.), VALIFAST Black 3804, 3810, 3820, 3830 (manufactured by ORIENT CHEMICAL INDUSTRIES CO., LTD.), Savinyl Black RLSN (manufactured by Clariant Chemicals), KAYASET Black K-R, K-BL (manufactured by Nippon Kayaku Co., Ltd.) can be cited. In addition, polymerizable dyes having polymerizability in the molecule can be used. As commercially available products, for example, the RDW series manufactured by Wako Pure Chemical Industries, Ltd. can be cited.

In addition, a pigment polymer can be used as a black dye. As a pigment polymer, for example, compounds described in Japanese Patent Publication No. 2011-213925 and Japanese Patent Publication No. 2013-041097 can be cited. In addition, as described above, a plurality of dyes having colors other than black can also be combined alone to be used as a black dye. As such a coloring dye, for example, in addition to color dyes (color dyes) such as R (red), G (green) and B (blue), dyes described in paragraphs 0027 to 0200 of Japanese Patent Publication No. 2014-042375 can also be used.

[Dispersant] The composition preferably contains a dispersant (dispersing resin). The dispersant (dispersing resin) refers to a resin added for the purpose of dispersing a dispersed substance such as a pigment and is a resin different from the specific resin described above. The content of the dispersant in the composition is not particularly limited, but is preferably 2 to 40% by mass, more preferably 5 to 30% by mass, and even more preferably 5 to 20% by mass relative to the total solid content of the composition. The dispersant may be used alone or in combination of two or more. When two or more dispersants are used in combination, the total content is preferably within the above range.

As a dispersant, for example, a known dispersant can be appropriately selected for use. Among them, a polymer compound is preferred. As a dispersant, there can be cited polymer dispersants [for example, polyamidoamine and its salts, polycarboxylic acid and its salts, high molecular weight unsaturated acid esters, modified polyurethane, modified polyester, modified poly(meth)acrylate, (meth)acrylic acid copolymer, naphthalenesulfonic acid formalin condensate], polyoxyethylene alkyl phosphate, polyoxyethylene alkylamine and pigment derivatives. Polymer compounds can be further classified into linear polymers, terminal modified polymers, grafted polymers, and block polymers according to their structures.

·Polymer compounds Polymer compounds play a role in adsorbing on the surface of dispersed bodies such as pigments and preventing the dispersed bodies from re-aggregating. Therefore, terminal modified polymers, grafted polymers (including polymer chains) or block polymers containing anchor sites on the pigment surface are preferred.

The polymer compound may contain a curable group. As the curable group, for example, ethylenic unsaturated groups (such as (meth)acrylic groups, vinyl groups, and styrene groups, etc.) and cyclic ether groups (such as epoxy groups and cyclobutylene groups, etc.) can be cited, but are not limited to them. Among them, as the curable group, ethylenic unsaturated groups are preferred from the viewpoint of being able to control polymerization in a free radical reaction. It is more preferred that the ethylenic unsaturated group is a (meth)acrylic group.

The resin preferably contains at least one selected from the group including polyester structure and polyether structure. In this case, the main chain may contain a polyester structure and/or a polyether structure. When the resin contains a structural unit including a graft chain as described later, the polymer chain may contain a polyester structure and/or a polyether structure. As the resin, it is more preferable that the polymer chain contains a polyester structure.

It is preferred that the polymer compound contains a structural unit including a grafted chain. In addition, in this specification, "structural unit" and "repeating unit" have the same meaning. The polymer compound containing a structural unit including such a grafted chain has an affinity with the solvent due to the grafted chain, so the dispersibility of the dispersed matter such as the pigment and the dispersion stability after time are excellent. In addition, due to the presence of the grafted chain, the polymer compound containing a structural unit including the grafted chain has an affinity with the resin A, the polymerizable compound or other resins that can be used in combination. As a result, it is less likely to generate residues during alkaline development. If the grafted chain becomes longer, the stereo repulsion effect is enhanced and the dispersibility of the dispersed matter such as the pigment is improved. On the other hand, if the graft chain is too long, the adsorption force to the dispersed matter such as the pigment decreases, and the dispersibility of the dispersed matter such as the pigment tends to decrease. Therefore, the number of atoms other than hydrogen atoms in the graft chain is preferably 40 to 10,000, the number of atoms other than hydrogen atoms is more preferably 50 to 2,000, and the number of atoms other than hydrogen atoms is further preferably 60 to 500. Here, the graft chain refers to the root of the main chain of the copolymer (the atom bonded to the main chain in the group branched from the main chain) to the end of the group branched from the main chain.

The graft chain preferably comprises a polymer structure, and examples of such polymer structures include poly(meth)acrylate structures (e.g., poly(meth)acrylic acid structures), polyester structures, polyurethane structures, polyurea structures, polyamide structures, and polyether structures. In order to improve the interaction between the graft chain and the solvent and thereby improve the dispersibility of dispersed materials such as pigments, the graft chain preferably comprises one or more graft chains selected from the group including polyester structures, polyether structures, and poly(meth)acrylate structures, and more preferably comprises at least one of polyester structures and polyether structures.

The macromonomer containing such a graft chain (a monomer having a polymer structure and bonding to the main chain of the copolymer to constitute the graft chain) is not particularly limited, and a macromonomer containing a reactive bibond group can be preferably used.

As commercially available macromonomers that correspond to the structural units including the graft chain contained in the polymer compound and are preferably used for synthesizing the polymer compound, AA-6 (product name, manufactured by TOAGOSEI CO., LTD.), AA-10 (product name, manufactured by TOAGOSEI CO., LTD.), AB-6 (product name, manufactured by TOAGOSEI CO., LTD.), AS-6 (product name, manufactured by TOAGOSEI CO., LTD.), AN-6 (product name, manufactured by TOAGOSEI CO., LTD.), AW-6 (product name, manufactured by TOAGOSEI CO., LTD.), AA-714 (product name, manufactured by TOAGOSEI CO., LTD.), AY-707 (product name, manufactured by TOAGOSEI CO., LTD.), AY-714 (product name, manufactured by TOAGOSEI CO., LTD.), and AY-707 (product name, manufactured by TOAGOSEI CO., LTD.) can be used. CO., LTD.), AK-5 (Product name, manufactured by TOAGOSEI CO., LTD.), AK-30 (Product name, manufactured by TOAGOSEI CO., LTD.), AK-32 (Product name, manufactured by TOAGOSEI CO., LTD.), BLEMMER PP-100 (Product name, manufactured by NOF CORPORATION.), BLEMMER PP-500 (Product name, manufactured by NOF CORPORATION.), BLEMMER PP-800 (Product name, manufactured by NOF CORPORATION.), BLEMMER PP-1000 (Product name, manufactured by NOF CORPORATION.), BLEMMER 55-PET-800 (Product name, manufactured by NOF CORPORATION.), BLEMMER PME-4000 (Product name, manufactured by NOF CORPORATION.), BLEMMER PSE-400 (product name, manufactured by NOF CORPORATION), BLEMMER PSE-1300 (product name, manufactured by NOF CORPORATION) or BLEMMER 43PAPE-600B (product name, manufactured by NOF CORPORATION), etc. Among them, AA-6 (product name, manufactured by TOAGOSEI CO., LTD.), AA-10 (product name, manufactured by TOAGOSEI CO., LTD.), AB-6 (product name, manufactured by TOAGOSEI CO., LTD.), AS-6 (product name, manufactured by TOAGOSEI CO., LTD.), AN-6 (product name, manufactured by TOAGOSEI CO., LTD.) or BLEMMER PME-4000 (product name, manufactured by NOF CORPORATION) are preferred.

The above-mentioned dispersant preferably contains one or more structures selected from the group including polymethyl acrylate, polymethyl methacrylate and cyclic or chain polyesters, more preferably contains one or more structures selected from the group including polymethyl acrylate, polymethyl methacrylate and chain polyesters, and further preferably contains one or more structures selected from the group including polymethyl acrylate structure, polymethyl methacrylate structure, polycaprolactone structure and polyvalerolactone structure. The dispersant may be a dispersant containing the above-mentioned structure alone in one dispersant, or may be a dispersant containing a plurality of such structures in one dispersant. Among them, the polycaprolactone structure refers to a structure containing a structure in which ε-caprolactone is ring-opened as a repeating unit. The polyvalerolactone structure refers to a structure containing a structure in which δ-valerolactone is ring-opened as a repeating unit. As a specific example of a dispersant containing a polycaprolactone structure, there are dispersants in which j and k are 5 in the following formula (1) and the following formula (2). As a specific example of a dispersant containing a polyvalerolactone structure, there are dispersants in which j and k are 4 in the following formula (1) and the following formula (2). As a specific example of a dispersant containing a polymethyl acrylate structure, there is a dispersant in which X ⁵ is a hydrogen atom and R ⁴ is a methyl group in the following formula (4). As a specific example of a dispersant containing a polymethyl methacrylate structure, there is a dispersant in which X ⁵ is a methyl group and R ⁴ is a methyl group in the following formula (4).

· Structural unit containing a graft chain The polymer compound preferably contains a structural unit represented by any one of the following formulas (1) to (4) as a structural unit containing a graft chain.

[Chemical formula 12]

In formulae (1) to (4), W ¹ , W ² , W ³ and W ⁴ each independently represent an oxygen atom or NH. W ¹ , W ² , W ³ and W ⁴ are preferably oxygen atoms. In formulae (1) to (4), X ¹ , X ² , X ³ , X ⁴ and X ⁵ each independently represent a hydrogen atom or a monovalent organic group. From the viewpoint of synthetic constraints, X ¹ , X ² , X ³ , X ⁴ and X ⁵ each independently represent a hydrogen atom or an alkyl group having 1 to 12 carbon atoms, more preferably a hydrogen atom or a methyl group, and even more preferably a methyl group.

In formulae (1) to (4), Y ¹ , Y ² , Y ³ and Y ⁴ each independently represent a divalent linking group, and the linking group is not limited in structure. Specific examples of the divalent linking group represented by Y ¹ , Y ² , Y ³ and Y ⁴ include the following linking groups (Y-1) to (Y-21). In the structures shown below, A and B represent the bonding sites to the left terminal group and the right terminal group in formulae (1) to (4), respectively. Among the structures shown below, (Y-2) or (Y-13) is more preferred from the perspective of simplicity of synthesis.

[Chemical formula 13]

In formulae (1) to (4), Z ¹ , Z ² , Z ³ and Z ⁴ independently represent a hydroxyl group, an amino group or a monovalent organic group. The structure of the organic group is not particularly limited, and specific examples thereof include alkyl, alkoxy, aryloxy, heteroaryloxy, alkyl thioether, aryl thioether and heteroaryl thioether groups. As the organic group represented by Z ¹ , Z ² , Z ³ and Z ⁴ , a group having a stereo-repelling effect is preferred from the viewpoint of improving dispersibility, an alkyl group or an alkoxy group having 5 to 24 carbon atoms is more preferred, and a branched alkyl group having 5 to 24 carbon atoms, a cyclic alkyl group having 5 to 24 carbon atoms or an alkoxy group having 5 to 24 carbon atoms is further preferred. In addition, the alkyl group contained in the alkoxy group may be any of a linear, branched, or cyclic group. In addition, the methylene group in the alkoxy group may be substituted with -O-. In addition, each of the above groups may have a substituent (for example, a hydroxyl group and an ethylenically unsaturated group such as a (meth)acryloyloxy group).

In formula (1), when Z ¹ is a hydroxyl group, the site represented by -COZ ¹ in the formula may be anionized (-COO ^- ). In this case, as the relative cation, quaternary ammonium can be cited, among which the structure represented by formula (TY) is preferred.

[Chemical formula 14]

In the formula (TY), R ^1f and R ^1g each independently represent a hydrogen atom or an alkyl group. As the alkyl group represented by R ^1f and R ^1g , a linear or branched chain is preferred. Moreover, as the carbon number, 1 to 10 is preferred, 1 to 4 is more preferred, and 1 or 2 is further preferred. In the formula (TY), R ^1e represents an alkyl group. As the alkyl group represented by R ^1e , a linear chain is preferred. Moreover, as the carbon number, 10 to 24 is preferred, and 10 to 20 is more preferred. In the formula (TY), L ² represents an alkylene group. As the alkylene group represented by L ² , a linear or branched chain is preferred, and a linear chain is more preferred. As the carbon number, 1 to 20 is preferred, and 1 to 12 is more preferred. The alkylene group may have a substituent (for example, a hydroxyl group). The methylene group in the alkylene group may be substituted with -O-. In formula (TY), R ^1h represents a hydrogen atom or an ethylenically unsaturated group such as a (meth)acryloyloxy group.

In formulas (1) to (4), n, m, p and q are independently a number of 1 to 500. In formulas (1) and (2), j and k are independently an integer of 2 to 8. From the viewpoint of the viscosity stability over time and the developing property of the composition, j and k in formulas (1) and (2) are preferably integers of 4 to 6, and 5 is more preferably. In formulas (1) and (2), n and m are preferably 10 or more, and 20 or more is more preferably. In addition, when the dispersant contains a polycaprolactone structure and a polyvalerolactone structure, the sum of the number of repetitions of the polycaprolactone structure and the number of repetitions of the polyvalerolactone structure is preferably 10 or more, and 20 or more is more preferably.

In formula (3), R ³ represents a branched or linear alkylene group, preferably an alkylene group having 1 to 10 carbon atoms, and more preferably an alkylene group having 2 or 3 carbon atoms. When p is 2 to 500, a plurality of R ³ may be the same or different. In formula (4), R ⁴ represents a hydrogen atom or a monovalent organic group, and the monovalent organic group is not particularly limited in structure. As R ⁴ , a hydrogen atom, an alkyl group, an aryl group or a heteroaryl group is preferred, and a hydrogen atom or an alkyl group is more preferred. When ^R4 is an alkyl group, the alkyl group is preferably a linear alkyl group having 1 to 20 carbon atoms, a branched alkyl group having 3 to 20 carbon atoms, or a cyclic alkyl group having 5 to 20 carbon atoms, more preferably a linear alkyl group having 1 to 20 carbon atoms, and still more preferably a linear alkyl group having 1 to 6 carbon atoms. In formula (4), when q is 2 to 500, a plurality of ^X5 and ^R4 present in the graft copolymer may be the same or different from each other.

Furthermore, the polymer compound may contain two or more structural units containing graft chains having different structures. That is, the polymer compound molecule may contain structural units represented by formulas (1) to (4) having different structures. Furthermore, in formulas (1) to (4), when n, m, p and q each represent 2 or more, in formulas (1) and (2), j and k may have different structures in the side chain. In formulas (3) and (4), a plurality of R ³ , R ⁴ and X ⁵ present in the molecule may be the same or different.

In the polymer compound, the structural unit containing the graft chain (for example, the structural unit represented by the above formula (1) to (4)) is preferably contained in the range of 2 to 90 mass % and more preferably in the range of 5 to 30 mass % relative to the total mass of the polymer compound in terms of mass conversion. If the structural unit containing the graft chain is within this range, the dispersibility of the pigment is high and the developability in the cured film after exposure is good.

·Hydrophobic structural unit In addition, it is preferred that the polymer compound contains a hydrophobic structural unit that is different from the structural unit containing the grafted chain (that is, not equivalent to the structural unit containing the grafted chain). Among them, in the present invention, the hydrophobic structural unit is a structural unit that does not contain an acid group (for example, a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, a phenolic hydroxyl group, etc.).

The hydrophobic structural unit is preferably a structural unit derived from (corresponding to) a compound (monomer) having a ClogP value of 1.2 or more, and more preferably a structural unit derived from a compound having a ClogP value of 1.2 to 8. Thereby, the effect of the present invention can be more reliably manifested.

The polymer compound preferably contains, as the hydrophobic structural unit, one or more structural units selected from structural units derived from monomers represented by the following formulae (i) to (iii).

[Chemical formula 15]

In the above formulae (i) to (iii), R ¹ , R ² and R ³ each independently represent a hydrogen atom, a halogen atom (e.g., a fluorine atom, a chlorine atom, a bromine atom, etc.) or an alkyl group having 1 to 6 carbon atoms (e.g., a methyl group, an ethyl group, a propyl group, etc.). R ¹ , R ² and R ³ are preferably hydrogen atoms or alkyl groups having 1 to 3 carbon atoms, and more preferably hydrogen atoms or methyl groups. R ² and R ³ are further preferably hydrogen atoms. X represents an oxygen atom (—O—) or an imino group (—NH—), and preferably an oxygen atom.

L is a single bond or a divalent linking group. Examples of the divalent linking group include a divalent aliphatic group (e.g., an alkylene group, a substituted alkylene group, an alkenylene group, a substituted alkenylene group, an alkynylene group, a substituted alkynylene group), a divalent aromatic group (e.g., an arylene group, a substituted arylene group), a divalent heterocyclic group, an oxygen atom (-O-), a sulfur atom (-S-), an imino group (-NH-), a substituted imino group (-NR ³¹ -, wherein R ³¹ is an aliphatic group, an aromatic group or a heterocyclic group), a carbonyl group (-CO-), and combinations thereof.

The divalent aliphatic group may have a cyclic structure or a branched structure. The carbon number of the aliphatic group is preferably 1 to 20, more preferably 1 to 15, and even more preferably 1 to 10. The aliphatic group may be an unsaturated aliphatic group or a saturated aliphatic group, but a saturated aliphatic group is preferred. In addition, the aliphatic group may have a substituent. Examples of the substituent include a halogen atom, an aromatic group, and a heterocyclic group.

The carbon number of the divalent aromatic group is preferably 6 to 20, more preferably 6 to 15, and even more preferably 6 to 10. The aromatic group may have a substituent. Examples of the substituent include a halogen atom, an aliphatic group, an aromatic group, and a heterocyclic group.

The divalent heterocyclic group preferably contains a 5-membered ring or a 6-membered ring as a heterocyclic ring. Other heterocyclic rings, aliphatic rings or aromatic rings may be condensed on the heterocyclic ring. In addition, the heterocyclic group may have a substituent. Examples of the substituent include a halogen atom, a hydroxyl group, an oxo group (=O), a thio group (=S), an imino group (=NH), a substituted imino group (=NR ³² , wherein R ³² is an aliphatic group, an aromatic group or a heterocyclic group), an aliphatic group, an aromatic group and a heterocyclic group.

L is preferably a single bond, an alkylene group, or a divalent linking group containing an oxyalkylene structure. The oxyalkylene structure is more preferably an oxyethylene structure or an oxypropylene structure. In addition, L may contain a polyoxyalkylene structure formed by repeating two or more oxyalkylene structures. As the polyoxyalkylene structure, a polyoxyethylene structure or a polyoxypropylene structure is preferred. The polyoxyethylene structure is represented by -(OCH ₂ CH ₂ ) n-, wherein n is preferably an integer greater than 2, and more preferably an integer from 2 to 10.

As Z, there can be mentioned an aliphatic group (e.g., an alkyl group, a substituted alkyl group, an unsaturated alkyl group, and a substituted unsaturated alkyl group), an aromatic group (e.g., an aryl group, a substituted aryl group, an arylene group, a substituted arylene group), a heterocyclic group, or a combination thereof. These groups may also contain an oxygen atom (—O—), a sulfur atom (—S—), an imino group (—NH—), a substituted imino group (—NR ³¹ -, wherein R ³¹ is an aliphatic group, an aromatic group, or a heterocyclic group) or a carbonyl group (—CO—).

The aliphatic group may have a cyclic structure or a branched structure. The carbon number of the aliphatic group is preferably 1 to 20, more preferably 1 to 15, and even more preferably 1 to 10. The aliphatic group also includes a ring-aggregated alkyl group and a cross-linked cyclic alkyl group. Examples of the ring-aggregated alkyl group include a bicyclohexyl group, a perhydronaphthyl group, a biphenyl group, and a 4-cyclohexylphenyl group. Examples of the cross-linked cyclic hydrocarbon ring include bicyclic hydrocarbon rings such as pinane, camphane, norpinane, norbornane, bicyclic octane ring (bicyclic [2.2.2] octane ring and bicyclic [3.2.1] octane ring), tricyclic hydrocarbon rings such as isobranes, adamantane, tricyclic [5.2.1.0 ^2,6 ] decane ring and tricyclic [4.3.1.1 ^2,5 ] undecane ring, and tetracyclic hydrocarbon rings such as tetracyclic [4.4.0.1 ^2,5 .1 ^7,10 ] dodecane and perhydro-1,4-methylene-5,8-methylenenaphthalene ring. In addition, cross-linked cyclic hydrocarbons also include fused cyclic hydrocarbons, such as perhydronaphthalene (decahydronaphthalene), perhydroanthracene, perhydrophenanthrene, perhydroacenaphthene, perhydrofluorene, perhydroindene and perhydronaphthalene ring, which are fused rings of multiple 5-8 membered cycloalkane rings. Compared with unsaturated aliphatic groups, aliphatic groups are preferably saturated aliphatic groups. In addition, aliphatic groups may have substituents. Examples of substituents include halogen atoms, aromatic groups and heterocyclic groups. Among them, as a substituent, aliphatic groups do not have acid groups.

The number of carbon atoms in the aromatic group is preferably 6 to 20, more preferably 6 to 15, and even more preferably 6 to 10. The aromatic group may have a substituent. Examples of the substituent include a halogen atom, an aliphatic group, an aromatic group, and a heterocyclic group. However, the aromatic group does not have an acid group as a substituent.

The heterocyclic group preferably contains a 5-membered ring or a 6-membered ring as the heterocyclic group. Another heterocyclic group, an aliphatic ring or an aromatic ring may be condensed on the heterocyclic group. In addition, the heterocyclic group may have a substituent. Examples of the substituent include a halogen atom, a hydroxyl group, an oxo group (=O), a thio group (=S), an imino group (=NH), a substituted imino group (=NR ³² , wherein R ³² is an aliphatic group, an aromatic group or a heterocyclic group), an aliphatic group, an aromatic group and a heterocyclic group. The heterocyclic group does not have an acid group as a substituent.

In the above formula (iii), R ⁴ , R ⁵ and R ⁶ each independently represent a hydrogen atom, a halogen atom (e.g., a fluorine atom, a chlorine atom, a bromine atom, etc.), an alkyl group having 1 to 6 carbon atoms (e.g., a methyl group, an ethyl group, a propyl group, etc.), Z or LZ. L and Z have the same meanings as in the above-mentioned groups. As R ⁴ , R ⁵ and R ⁶ , a hydrogen atom or an alkyl group having 1 to 3 carbon atoms is preferred, and a hydrogen atom is more preferred.

As the monomer represented by the above formula (i), the following compounds are preferred: R ¹ , R ² and R ³ are hydrogen atoms or methyl groups, L is a single bond or an alkylene group or a divalent linking group containing an oxyalkylene structure, X is an oxygen atom or an imino group, and Z is an aliphatic group, a heterocyclic group or an aromatic group. Moreover, as the monomer represented by the above formula (ii), the compound wherein R ¹ is a hydrogen atom or a methyl group, L is an alkylene group, and Z is an aliphatic group, a heterocyclic group or an aromatic group is preferred. Moreover, as the monomer represented by the above formula (iii), the compound wherein R ⁴ , R ⁵ and R ⁶ are hydrogen atoms or methyl groups, and Z is an aliphatic group, a heterocyclic group or an aromatic group is preferred.

As examples of representative compounds represented by formulas (i) to (iii), free radical polymerizable compounds selected from acrylates, methacrylates, and styrenes can be cited. In addition, as examples of representative compounds represented by formulas (i) to (iii), the compounds described in paragraphs 0089 to 0093 of Japanese Patent Application Publication No. 2013-249417 can be referred to, and the contents are incorporated into this specification.

In the polymer compound, the hydrophobic structural unit is preferably contained in the range of 10 to 90% by mass, and more preferably in the range of 20 to 80% by mass relative to the total mass of the polymer compound. When the content is within the above range, a pattern can be sufficiently formed.

· Functional groups capable of interacting with dispersed materials such as pigments The polymer compound can introduce functional groups capable of interacting with dispersed materials such as pigments (e.g., light-shielding pigments). It is preferred that the polymer compound further contains a structural unit containing a functional group capable of interacting with dispersed materials such as pigments. As functional groups capable of interacting with dispersed materials such as pigments, for example, acid groups, base groups, coordination groups, and reactive functional groups can be cited. When the polymer compound contains an acid group, a base group, a coordination group, or a reactive functional group, it is preferred that the polymer compound contains a structural unit containing an acid group, a structural unit containing a base group, a structural unit containing a coordination group, or a structural unit containing a reactive functional group, respectively. In particular, if the polymer compound further contains an alkali-soluble group such as a carboxylic acid group as an acid group, the polymer compound can be given developability for pattern formation based on alkali development. That is, if an alkali-soluble group is introduced into the polymer compound, the polymer compound as a dispersant that helps disperse the dispersed material such as the pigment in the above composition has alkali solubility. Regarding the composition containing such a polymer compound, the light-shielding property of the cured film formed by exposure is excellent and the alkali developability of the unexposed part is improved. In addition, if the polymer compound contains a structural unit containing an acid group, the polymer compound tends to be easily compatible with the solvent and the coating property is also improved. This is presumably because the acid groups in the structural units containing acid groups easily interact with dispersed substances such as pigments, so that the polymer compound stably disperses dispersed substances such as pigments, and the viscosity of the polymer compound that disperses dispersed substances such as pigments becomes lower, so the polymer compound itself also easily disperses stably.

Among them, the structural unit containing an alkali-soluble group as an acid group can be the same structural unit as the structural unit containing the above-mentioned grafted chain, or it can be a different structural unit, but the structural unit containing an alkali-soluble group as an acid group is a structural unit different from the above-mentioned hydrophobic structural unit (that is, it does not belong to the above-mentioned hydrophobic structural unit).

As a functional group that can interact with a dispersed substance such as a pigment, i.e., an acid group, there are carboxylic acid groups, sulfonic acid groups, phosphoric acid groups, or phenolic hydroxyl groups, etc., preferably at least one selected from the group including carboxylic acid groups, sulfonic acid groups, and phosphoric acid groups, and carboxylic acid groups are further preferred. Carboxylic acid groups have good adsorption power to dispersed substances such as pigments and high dispersibility. That is, it is preferred that the polymer compound further contains a structural unit including one or more selected from the group including carboxylic acid groups, sulfonic acid groups, and phosphoric acid groups.

The polymer compound may have one or more acid group-containing structural units. The polymer compound may or may not contain acid group-containing structural units, but when it contains acid group-containing structural units, the content of acid group-containing structural units is preferably 5 to 80 mass % relative to the total mass of the polymer compound in terms of mass conversion, and 10 to 60 mass % is more preferably considered from the viewpoint of suppressing the damage of image intensity based on alkali development.

As a functional group that can interact with a dispersed substance such as a pigment, i.e., an alkaline group, there are primary amine groups, secondary amine groups, tertiary amine groups, heterocyclic groups containing N atoms, and amide groups, etc. From the perspective of good adsorption and high dispersibility to dispersed substances such as pigments, the preferred alkaline group is a tertiary amine group. The polymer compound can contain one or more of these alkaline groups. The polymer compound may or may not contain a structural unit containing an alkaline group, but when it contains an alkaline group, the content of the structural unit containing an alkaline group is preferably 0.01 to 50% by mass relative to the total mass of the polymer compound in terms of mass conversion, and 0.01 to 30% by mass is more preferred from the perspective of suppressing the development resistance.

As functional groups that can interact with dispersed materials such as pigments, i.e., coordinating groups and reactive functional groups, for example, acetoacetyloxy, trialkoxysilyl, isocyanate, acid anhydride and acyl chloride can be cited. From the perspective of good adsorption to dispersed materials such as pigments and high dispersibility of dispersed materials such as pigments, the preferred functional group is acetoacetyloxy. The polymer compound may have one or more of these groups. The polymer compound may or may not contain a structural unit containing a coordination group or a structural unit containing a reactive functional group, but when it contains such structural units, the content of such structural units is preferably 10 to 80% by mass relative to the total mass of the polymer compound, and 20 to 60% by mass is more preferably considered from the perspective of suppressing the development resistance.

When the polymer compound contains functional groups capable of interacting with dispersed substances such as pigments in addition to the grafted chains, it is sufficient to contain the above-mentioned various functional groups capable of interacting with dispersed substances such as pigments, and there is no particular limitation on how the functional groups are introduced. However, it is preferred that the polymer compound contains one or more structural units selected from the structural units derived from monomers represented by the following formulae (iv) to (vi).

[Chemical formula 16]

In formulae (iv) to (vi), R ¹¹ , R ¹² and R ¹³ each independently represent a hydrogen atom, a halogen atom (e.g., a fluorine atom, a chlorine atom, a bromine atom, etc.) or an alkyl group having 1 to 6 carbon atoms (e.g., a methyl group, an ethyl group, a propyl group, etc.). In formulae (iv) to (vi), R ¹¹ , R ¹² and R ¹³ each independently represent a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and each independently represent a hydrogen atom or a methyl group, more preferably. In general formula (iv), R ¹² and R ¹³ each independently represent a hydrogen atom, further preferably.

_X1 in formula (iv) represents an oxygen atom (-O-) or an imino group (-NH-), preferably an oxygen atom. Also, Y in formula (v) represents a methine group or a nitrogen atom.

In formulae (iv) to (v), _L1 represents a single bond or a divalent linking group. The definition of the divalent linking group is the same as the definition of the divalent linking group represented by L in formula (i) above.

_L1 is preferably a single bond, an alkylene group, or a divalent linking group containing an oxyalkylene structure. The oxyalkylene structure is more preferably an oxyethylene structure or an oxypropylene structure. In addition, _L1 may contain a polyoxyalkylene structure contained by repeating 2 or more oxyalkylene structures. As the polyoxyalkylene structure, a polyoxyethylene structure or a _{polyoxypropylene} structure is preferred. The polyoxyethylene structure is represented by -( _OCH2CH2 ) _n- , wherein n is preferably an integer greater than 2, and more preferably an integer of 2 to 10.

In formulae (iv) to (vi), _Z1 represents not only a graft chain but also a functional group capable of interacting with a dispersed substance such as a pigment, with carboxylic acid group and tertiary amine group being preferred, and carboxylic acid group being more preferred.

In formula (vi), R ¹⁴ , R ¹⁵ and R ¹⁶ each independently represent a hydrogen atom, a halogen atom (e.g., a fluorine atom, a chlorine atom, a bromine atom, etc.), an alkyl group having 1 to 6 carbon atoms (e.g., a methyl group, an ethyl group, a propyl group, etc.), -Z ₁ or L ₁ -Z ₁ . L ₁ and Z ₁ have the same meanings as L ₁ and Z ₁ in the above description, and preferred examples are also the same. R ¹⁴ , R ¹⁵ and R ¹⁶ each independently represent a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and a hydrogen atom is more preferred.

As the monomer represented by formula (iv), the compound wherein R ¹¹ , R ¹² and R ¹³ are independently a hydrogen atom or a methyl group, L ₁ is a divalent linking group containing an alkylene or oxyalkylene structure, X ₁ is an oxygen atom or an imino group, and Z ₁ is a carboxylic acid group is preferred. Moreover, as the monomer represented by formula (v), the compound wherein R ¹¹ is a hydrogen atom or a methyl group, L ₁ is an alkylene group, Z ₁ is a carboxylic acid group, and Y is a methine group is preferred. Furthermore, as the monomer represented by formula (vi), the compound wherein R ¹⁴ , R ¹⁵ and R ¹⁶ are independently a hydrogen atom or a methyl group, and Z ₁ is a carboxylic acid group is preferred.

Representative examples of monomers (compounds) represented by formulas (iv) to (vi) are shown below. Examples of monomers include methacrylic acid, crotonic acid, isocrotonic acid, a compound containing an addition polymerizable double bond and a hydroxyl group in the molecule (e.g., 2-hydroxyethyl methacrylate) and a reaction product of succinic anhydride, a compound containing an addition polymerizable double bond and a hydroxyl group in the molecule and phthalic anhydride, a compound containing an addition polymerizable double bond and a hydroxyl group in the molecule and tetrahydroxyphthalic acid. The reaction products of the compound containing an addition polymerizable double bond and a hydroxyl group in the molecule and trimellitic anhydride, the reaction products of the compound containing an addition polymerizable double bond and a hydroxyl group in the molecule and pyromellitic acid, acrylic acid, acrylic acid dimer, acrylic acid oligomer, maleic acid, itaconic acid, fumaric acid, 4-vinylbenzoic acid, vinylphenol and 4-hydroxyphenyl methacrylic acid amide, etc.

From the viewpoint of interaction with dispersed matter such as pigments, viscosity stability over time, and permeability to developer, the content of the structural unit containing a functional group capable of forming an interaction with dispersed matter such as pigments is preferably 0.05 to 90 mass %, more preferably 1.0 to 80 mass %, and even more preferably 10 to 70 mass % relative to the total mass of the polymer compound.

·Other structural units In addition, for the purpose of improving various properties such as image strength, the polymer compound may further have the following other structural units (for example, structural units containing functional groups having affinity for the solvent described below) within the scope that does not impair the effect of the present invention: having various functions different from the structural units containing graft chains, hydrophobic structural units, and structural units containing functional groups capable of forming interactions with dispersed substances such as pigments. As such other structural units, for example, structural units derived from free radical polymerizable compounds selected from acrylonitriles and methacrylonitris can be cited. The polymer compound can use one or more of these other structural units, and the content thereof is preferably 0 to 80 mass % relative to the total mass of the polymer compound in terms of mass conversion, and more preferably 10 to 60 mass % or less. The content within the above range can maintain sufficient pattern formation.

· Physical properties of polymer compounds The acid value of the polymer compound is preferably 0 to 250 mgKOH/g, more preferably 10 to 200 mgKOH/g, and even more preferably 30 to 180 mgKOH/g. If the acid value of the polymer compound is 160 mgKOH/g or less, the pattern peeling when the cured film after exposure is developed can be more effectively suppressed. Moreover, if the acid value of the polymer compound is 10 mgKOH/g or more, the alkali developability is better. Moreover, if the acid value of the polymer compound is 20 mgKOH/g or more, the sedimentation of the dispersed matter such as the pigment can be further suppressed, the number of coarse particles can be further reduced, and the viscosity stability of the composition over time can be further improved.

The acid value can be calculated, for example, based on the average content of the acid groups in the compound. In addition, by changing the content of the constituent components of the resin, that is, the structural unit containing the acid groups, a resin having a desired acid value can be obtained.

The weight average molecular weight of the polymer compound is preferably 4,000 to 300,000, more preferably 5,000 to 200,000, further preferably 6,000 to 100,000, and particularly preferably 10,000 to 50,000. The polymer compound can be synthesized according to a known method.

Specific examples of polymer compounds include "DA-7301" manufactured by Kusumoto Chemicals, Ltd., BYK Chemie GmbH manufactures "Disperbyk-101 (polyamide amine phosphate), 107 (carboxylate), 110 (copolymer containing acid groups), 111 (phosphoric acid dispersant), 130 (polyamide), 161, 162, 163, 164, 165, 166, 167, 170, 190 (polymer copolymer)", "BYK-P104, P105 (high molecular weight unsaturated polycarboxylic acid)", EFKA manufactures "EFKA4047, 4050~4010~4165 (polyurethane series), EFKA4330~4340 (block copolymer), 4400~4402 (modified polyacrylate), 5010 (polyester amide), 5765 (high molecular weight polycarboxylate), 6220 (fatty acid polyester), 6750 (azo pigment derivative)", Ajinomoto Fine-Techno Co., Ltd., Inc., "AJISPER PB821, PB822, PB880, PB881", Kyoeisha Chemical Co., Ltd., "FLOREN TG-710 (urethane oligomer)", "Polyflow No.50E, No.300 (acrylic copolymer)", Kusumoto Chemicals, Ltd., "DISPARLON KS-860, 873SN, 874, #2150 (aliphatic polycarboxylic acid), #7004 (polyether ester), DA-703-50, DA-705, DA-725", Kao Corporation, "DEMOL RN, N (naphthalenesulfonic acid formalin condensation), MS, C, SN-B (aromatic sulfonic acid formalin condensation)", "HOMOGENOL L-18 (polymer polycarboxylic acid)", "EMULGEN 920, 930, 935, 985 (polyoxyethylene nonylphenyl ether)", "ACETAMIN 86 (stearylamide acetate)", 22000 (azo pigment derivative), 13240 (polyester amine), 3000, 12000, 17000, 20000, 27000 (polymer containing a functional part at the end), 24000, 28000, 32000, 38500 (graft copolymer)" manufactured by The Lubrinzol Corporation, "NIKKOL T106 (polyoxyethylene sorbitan monooleate), MYS-IEX (polyoxyethylene monostearate)" manufactured by Nikko Chemicals Co., Ltd., HINOAKUTO T-8000E manufactured by Kawaken Fine Chemicals Co., Ltd., organic silicone polymer KP341 manufactured by Shin-Etsu Chemical Co., Ltd., Yusho Co. Ltd., non-ionic surfactants such as "W001: Cationic Surfactant", polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid ester, anionic surfactants such as "W004, W005, W017", "EFKA-46, EFKA-47, EFKA-47EA, EFKA Polymer 100, EFKA Polymer 400, EFKA Polymer 401, EFKA Polymer 450" manufactured by MORISHITA & CO., LTD., polymer dispersants such as "Disperse Aid 6, Disperse Aid 8, Disperse Aid 15, Disperse Aid 9100" manufactured by SAN NOPCO LIMITED, and ADEKA Adeka Pluronic (registered trademark) L31, F38, L42, L44, L61, L64, F68, L72, P95, F77, P84, F87, P94, L101, P103, F108, L121, P-123 manufactured by Adeka Pluronic Corporation and Ionet (product name) S-20 manufactured by Sanyo Chemical Industries, Ltd. can also be used. Acrybase FFS-6752 and Acrybase FFS-187 can also be used.

In addition, it is also preferred to use an amphoteric resin containing an acid group and an alkaline group. The amphoteric resin is preferably a resin having an acid value of 5 mgKOH/g or more and an amine value of 5 mgKOH/g or more. Examples of commercially available amphoteric resins include DISPERBYK-130, DISPERBYK-140, DISPERBYK-142, DISPERBYK-145, DISPERBYK-180, DISPERBYK-187, DISPERBYK-191, DISPERBYK-2001, DISPERBYK-2010, DISPERBYK-2012, DISPERBYK-2025, BYK-9076 manufactured by BYK-Chemie GmbH, and AJISPER PB821, AJISPER PB822, and AJISPER PB881 manufactured by Ajinomoto Fine-Techno Co., Inc. These polymer compounds may be used alone or in combination of two or more.

In addition, as specific examples of the polymer compound, reference can be made to the polymer compounds described in paragraphs 0127 to 0129 of Japanese Patent Application Laid-Open No. 2013-249417, the contents of which are incorporated herein by reference.

Furthermore, as a dispersant, in addition to the above-mentioned polymer compounds, the graft copolymers of paragraphs 0037 to 0115 of Japanese Patent Publication No. 2010-106268 (corresponding to paragraphs 0075 to 0133 of US2011/0124824) can also be used, and such contents can be cited and introduced into this specification. In addition, in addition to the above, the polymer compound containing the constituent components of the side chain structure formed by the acid group bonded via the linking group of paragraphs 0028 to 0084 of Japanese Patent Publication No. 2011-153283 (corresponding to paragraphs 0075 to 0133 of US2011/0279759) can also be used, and such contents can be cited and incorporated into this specification.

Furthermore, as the dispersant, the resins described in 0033 to 0049 of JP-A-2016-109763 can also be used, and the contents are incorporated into the present specification.

[Alkali-soluble resin] The composition preferably contains an alkali-soluble resin. In this specification, the alkali-soluble resin refers to a resin containing a group that promotes alkali solubility (alkali-soluble group. For example, acid groups such as carboxylic acid groups), and refers to a resin different from the specific resin and dispersant described above. In addition, the alkali-soluble resin preferably does not contain the repeating unit A contained in the above-mentioned specific resin. The content of the alkali-soluble resin in the composition is not particularly limited, and is preferably 1 to 40 mass %, more preferably 5 to 35 mass %, and even more preferably 10 to 35 mass % relative to the total solid content of the composition. Alkali-soluble resins may be used alone or in combination of two or more. When two or more alkali-soluble resins are used in combination, the total content is preferably within the above range.

Examples of the alkali-soluble resin include resins containing at least one alkali-soluble group in the molecule, such as polyhydroxystyrene resins, polysiloxane resins, (meth)acrylic resins, (meth)acrylamide resins, (meth)acrylic acid/(meth)acrylamide copolymer resins, epoxy resins, and polyimide resins.

As specific examples of alkali-soluble resins, copolymers of unsaturated carboxylic acids and ethylenically unsaturated compounds can be cited. As unsaturated carboxylic acids, there are no particular limitations, and examples include monocarboxylic acids such as (meth)acrylic acid, crotonic acid, and vinylacetic acid; dicarboxylic acids such as itaconic acid, succinic acid, and fumaric acid, or their anhydrides; and polycarboxylic acid monoesters such as mono(2-(meth)acryloyloxyethyl)phthalate; etc.

Examples of copolymerizable ethylenically unsaturated compounds include methyl (meth)acrylate, etc. In addition, compounds described in paragraph 0027 of JP-A-2010-097210 and paragraphs 0036 to 0037 of JP-A-2015-068893 can also be used, and the above contents are incorporated into this specification.

As the alkali-soluble resin, an alkali-soluble resin containing a curable group is also preferred from the viewpoint that the effect of the present invention is more excellent. As the above-mentioned curable group, the curable group that can be contained in the above-mentioned dispersant (polymer compound) can be cited in the same manner, and the preferred range is also the same. As one aspect of the alkali-soluble resin containing a curable group, an acrylic resin containing an ethylenically unsaturated group in the side chain can be cited. The acrylic resin containing an ethylenically unsaturated group in the side chain can be obtained, for example, by allowing an ethylenically unsaturated compound containing a glyoxypropyl group or an alicyclic epoxy group to react with the carboxylic acid group of an acrylic resin containing a carboxylic acid group. As the alkali-soluble resin containing a curable group, an alkali-soluble resin having a curable group in a side chain is preferred. Examples of alkali-soluble resins containing a curable group include DIANAL NR series (manufactured by Mitsubishi Rayon Co., Ltd.), Photomer 6173 (COOH-containing polyurethane acrylic oligomer, manufactured by Diamond Shamrock Co., Ltd.), VISCOAT R-264, KS RESIST 106 (both manufactured by OSAKA ORGANIC CHEMICAL INDUSTRY LTD.), CYCLOMER P series (such as ACA230AA), PLACCEL CF200 series (both manufactured by Daicel Corporation), Ebecryl 3800 (manufactured by DAICEL-ALLNEX LTD.), and ACRYCURE RD-F8 (manufactured by NIPPON SHOKUBAI CO., LTD.).

As the alkali-soluble resin, for example, free radical polymers containing carboxylic acid groups in the side chains described in Japanese Patent Application Laid-Open No. 59-044615, Japanese Patent Publication No. 54-34327, Japanese Patent Publication No. 58-012577, Japanese Patent Publication No. 54-025957, Japanese Patent Application Laid-Open No. 54-092723, Japanese Patent Application Laid-Open No. 59-053836, and Japanese Patent Application Laid-Open No. 59-071048 can be used; European Patent Application No. Acetal-modified polyvinyl alcohol-based adhesive resin containing an alkali-soluble group as described in the publications of European Patent No. 993966, European Patent No. 1204000 and Japanese Patent Publication No. 2001-318463; polypyrrolidone; polyethylene oxide; alcohol-soluble nylon and a polyether which is a reaction product of 2,2-bis-(4-hydroxyphenyl)-propane and epichlorohydrin; and a polyimide resin as described in International Publication No. 2008/123097; etc.

As the alkali-soluble resin, for example, the compounds described in paragraphs 0225 to 0245 of JP-A-2016-075845 can also be used, and the above contents are incorporated into the present specification.

As the alkali-soluble resin, a polyimide precursor can also be used. The polyimide precursor refers to a resin obtained by allowing a compound containing an acid anhydride group to undergo addition polymerization reaction with a diamine compound at 40 to 100°C. As the polyimide precursor, for example, a resin containing a repeating unit represented by formula (1) can be cited. As the structure of the polyimide precursor, for example, a polyimide precursor containing an amide structure represented by the following formula (2), an amide structure formed by the closure of a part of the amide structure with the following formula (3), and an amide structure formed by the closure of all the amides with the following formula (4) can be cited. In addition, in this specification, polyimide precursors having an amide structure are sometimes referred to as polyamide.

[Chemical formula 17]

[Chemical formula 18]

[Chemical formula 19]

[Chemical formula 20]

In the above formulae (1) to (4), _R1 represents a tetravalent organic group having 2 to 22 carbon atoms, _R2 represents a divalent organic group having 1 to 22 carbon atoms, and n represents 1 or 2.

As specific examples of the polyimide precursor, for example, the compounds described in paragraphs 0011 to 0031 of Japanese Patent Application Publication No. 2008-106250, the compounds described in paragraphs 0022 to 0039 of Japanese Patent Application Publication No. 2016-122101, and the compounds described in paragraphs 0061 to 0092 of Japanese Patent Application Publication No. 2016-068401 can be cited, and the above contents are incorporated into this specification.

From the perspective of achieving a better pattern shape of the cured film formed by exposure, it is also preferred that the alkali-soluble resin contains at least one selected from the group consisting of polyimide resins and polyimide precursors. The polyimide resin containing an alkali-soluble group is not particularly limited, and a polyimide resin containing a known alkali-soluble group can be used. As the above-mentioned polyimide resin, for example, the resin described in paragraph 0050 of Japanese Patent Publication No. 2014-137523, the resin described in paragraph 0058 of Japanese Patent Publication No. 2015-187676, and the resin described in paragraphs 0012 to 0013 of Japanese Patent Publication No. 2014-106326 can be cited, and the above contents are incorporated into this specification.

[Photopolymerization initiator] The composition preferably contains a photopolymerization initiator. As the photopolymerization initiator, there is no particular limitation as long as it can initiate polymerization of the polymerizable compound, and a known photopolymerization initiator can be used. As the photopolymerization initiator, for example, a photopolymerization initiator having photosensitivity from the ultraviolet region to the visible light region is preferred. In addition, it can be an activator that generates active free radicals by reacting with a photoexcited sensitizer, or it can be an initiator that initiates cationic polymerization depending on the type of polymerizable compound. As the photopolymerization initiator, a so-called free radical polymerization initiator is preferred.

As photopolymerization initiators, for example, halogenated alkyl derivatives (for example, compounds containing a trioxane skeleton, compounds containing a diazole skeleton, etc.), acylphosphine compounds such as acylphosphine oxides, hexaarylbiimidazoles, oxime compounds such as oxime derivatives, organic peroxides, sulfur compounds, ketone compounds, aromatic onium salts, aminoacetophenone compounds, and hydroxyacetophenones can be cited. As specific examples of photopolymerization initiators, for example, paragraphs 0265 to 0268 of Japanese Patent Publication No. 2013-029760 can be referred to, and the contents are incorporated into this specification.

As the photopolymerization initiator, for example, the aminoacetophenone-based initiator described in Japanese Patent Publication No. 10-291969 and the acylphosphine-based initiator described in Japanese Patent Publication No. 4225898 can be cited. As the hydroxyacetophenone compound, for example, Omnirad-184, Omnirad-1173, Omnirad-500, Omnirad-2959 and Omnirad-127 (product names: all manufactured by IGM RESINS B.V.) can be cited. As the aminoacetophenone compound, for example, the commercially available products Omnirad-907, Omnirad-369 or Omnirad-379EG (product names: all manufactured by IGM RESINS B.V.) can be cited. As aminoacetophenone compounds, compounds described in Japanese Patent Publication No. 2009-191179 whose absorption wavelength matches a long-wavelength light source such as a wavelength of 365 nm or a wavelength of 405 nm can also be cited. As acylphosphine compounds, commercially available products Omnirad-819 or Omnirad-TPO (product names: both manufactured by IGM RESINS B.V.) can be cited.

(Oxime compound) As a photopolymerization initiator, an oxime ester polymerization initiator (oxime compound) is preferred. In particular, oxime compounds are preferred because they have high sensitivity and high polymerization efficiency, and it is easy to increase the content of the pigment in the composition. As oxime compounds, for example, compounds described in Japanese Patent Publication No. 2001-233842, compounds described in Japanese Patent Publication No. 2000-080068, or compounds described in Japanese Patent Publication No. 2006-342166 can be cited. As oxime compounds, for example, 3-benzoyloxyiminobutane-2-one, 3-acetyloxyiminobutane-2-one, 3-propionyloxyiminobutane-2-one, 2-acetyloxyiminopentane-3-one, 2-acetyloxyimino-1-phenylpropane-1-one, 2-benzoyloxyimino-1-phenylpropane-1-one, 3-(4-toluenesulfonyloxy)iminobutane-2-one and 2-ethoxycarbonyloxyimino-1-phenylpropane-1-one can be cited. In addition, compounds described in J.C.S.Perkin II (1979) pp. 1653-1660, J.C.S.Perkin II (1979) pp. 156-162, Journal of Photopolymer Science and Technology (1995) pp. 202-232, Japanese Patent Publication No. 2000-066385, Japanese Patent Publication No. 2000-080068, Japanese Patent Publication No. 2004-534797, and Japanese Patent Publication No. 2006-342166 can also be cited. Commercial products include IRGACURE-OXE01 (manufactured by BASF), IRGACURE-OXE02 (manufactured by BASF), IRGACURE-OXE03 (manufactured by BASF), and IRGACURE-OXE04 (manufactured by BASF). In addition, TR-PBG-304 (manufactured by Changzhou Tronly New Electronic Materials CO., LTD.), Adeka Arkls NCI-730, Adeka Arkls NCI-831, Adeka Arkls NCI-930 (manufactured by ADEKA CORPORATION), and N-1919 (photopolymerization initiator containing carbazole/oxime ester skeleton (manufactured by ADEKA CORPORATION)). In addition, Omnirad1316 (IGM RESINS B.V.) can also be cited.

In addition, as oxime compounds other than the above, there can be cited compounds described in Japanese Patent Publication No. 2009-519904 in which an oxime is linked to the N-position of carbazole; compounds described in U.S. Patent Publication No. 7626957 in which a hetero substituent is introduced into the benzophenone site; compounds described in Japanese Patent Publication No. 2010-015025 and U.S. Patent Publication No. 2009- 292039; ketoxime compounds described in International Publication No. 2009-131189; and compounds described in U.S. Patent No. 7556910 containing a trioxime skeleton and an oxime skeleton in the same molecule; compounds described in Japanese Patent Publication No. 2009-221114 having an absorption maximum at 405 nm and good sensitivity to a g-ray light source; etc. For example, paragraphs 0274 to 0275 of Japanese Patent Publication No. 2013-029760 can be referred to, and the contents are incorporated into this specification. Specifically, as an oxime compound, a compound represented by the following formula (OX-1) is preferred. In addition, the N-O bond of the oxime compound may be an (E) type oxime compound, an (Z) type oxime compound, or a mixture of the (E) type and the (Z) type.

[Chemical formula 21]

In formula (OX-1), R and B each independently represent a monovalent substituent, A represents a divalent organic group, and Ar represents an aryl group. In formula (OX-1), as the monovalent substituent represented by R, a monovalent non-metallic atomic group is preferred. As the monovalent non-metallic atomic group, alkyl, aryl, acyl, alkoxycarbonyl, aryloxycarbonyl, heterocyclic, alkylthiocarbonyl and arylthiocarbonyl groups can be cited. In addition, these groups can have more than one substituent. In addition, the above-mentioned substituents can be further substituted by other substituents. As substituents, halogen atoms, aryloxy, alkoxycarbonyl, aryloxycarbonyl, acyloxy, acyl, alkyl and aryl groups can be cited. In formula (OX-1), as the monovalent substituent represented by B, an aryl group, a heterocyclic group, an arylcarbonyl group or a heterocyclic carbonyl group is preferred, and an aryl group or a heterocyclic group is more preferred. Such groups may have one or more substituents. As substituents, the above-mentioned substituents can be exemplified. In formula (OX-1), as the divalent organic group represented by A, an alkylene group, a cycloalkylene group or an alkynylene group having 1 to 12 carbon atoms is preferred. Such groups may have one or more substituents. As substituents, the above-mentioned substituents can be exemplified.

As the photopolymerization initiator, an oxime compound containing a fluorine atom can also be cited. As the oxime compound containing a fluorine atom, for example, the compound described in Japanese Unexamined Patent Publication No. 2010-262028; Compounds 24, 36 to 40 described in Japanese Unexamined Patent Publication No. 2014-500852; and Compound (C-3) described in Japanese Unexamined Patent Publication No. 2013-164471; etc. This content is incorporated into this specification.

Examples of the polymerization initiator include compounds represented by the following formulae (1) to (4).

[Chemical formula 22]

[Chemical formula 23]

In formula (1), ^R1 and ^R2 each independently represent an alkyl group having 1 to 20 carbon atoms, an alicyclic alkyl group having 4 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an aralkyl group having 7 to 30 carbon atoms; when ^R1 and ^R2 are phenyl groups, the phenyl groups may be bonded to each other to form a fluorenyl group; ^R3 and ^R4 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 4 to 20 carbon atoms; and X represents a direct bond or a carbonyl group.

In the formula (2), R ¹ , R ² , R ³ and R ⁴ have the same meanings as R ¹ , R ² , R ³ and R ⁴ in the formula (1); R ⁵ represents -R ⁶ , -OR ⁶ , -SR ^{6 , -COR 6 ,} -CONR ⁶ R ⁶ , -NR ⁶ COR ⁶ , -OCOR ⁶ , -COOR ⁶ , -SCOR ⁶ , -OCSR ^{6 , -COSR 6 , -CSOR 6 , -CN} , a halogen atom or a hydroxyl group; R ⁶ represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms or a heterocyclic group having 4 to 20 carbon atoms; X represents a direct bond or a carbonyl group; and a represents an integer of 0 to 4.

In formula (3), ^R1 represents an alkyl group having 1 to 20 carbon atoms, an alicyclic alkyl group having 4 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an aralkyl group having 7 to 30 carbon atoms; ^R3 and ^R4 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 4 to 20 carbon atoms; and X represents a direct bond or a carbonyl group.

In formula (4), R ¹ , R ³ and R ⁴ have the same meanings as R ¹ , R ³ and R ⁴ in formula (3); R ⁵ represents -R ⁶ , -OR ⁶ , -SR ⁶ , -COR ⁶ , -CONR ⁶ R ⁶ , -NR ⁶ COR ⁶ , -OCOR ⁶ , -COOR ⁶ , -SCOR ⁶ , -OCSR ⁶ , -COSR ⁶ , -CSOR ⁶ , -CN, a halogen atom or a hydroxyl group; R ⁶ represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms or a heterocyclic group having 4 to 20 carbon atoms; X represents a direct bond or a carbonyl group; and a represents an integer of 0 to 4.

Examples of the compounds represented by formula (1) and formula (2) include compounds described in paragraphs 0076 to 0079 of JP-A-2014-137466, the contents of which are incorporated herein.

Furthermore, as the photopolymerization initiator, a compound represented by the following formula (1) is also preferred.

[Chemical formula 24]

In formula (1), R represents a group represented by the following formula (1a).

[Chemical formula 25]

In formula (1a), n represents an integer from 1 to 5. m represents an integer from 1 to 6. * represents a bonding position.

As m, 3 or 4 is preferred. The compound represented by formula (1) can be synthesized, for example, according to the synthesis method described in Japanese Patent Publication No. 2012-519191.

Specific examples of oxime compounds that can be preferably used in the composition are shown below. In addition, as oxime compounds, compounds listed in Table 1 of International Publication No. 2015-036910 can also be cited, and the above contents are incorporated into this specification.

[Chemical formula 26] [Chemical formula 27]

[Chemical formula 28]

The oxime compound preferably has a maximum absorption wavelength in the wavelength region of 350 to 500 nm, more preferably has a maximum absorption wavelength in the wavelength region of 360 to 480 nm, and more preferably has a high absorbance at wavelengths of 365 nm and 405 nm. From the perspective of sensitivity, the molar absorption coefficient of the oxime compound at 365 nm or 405 nm is preferably 1,000 to 300,000, more preferably 2,000 to 300,000, and even more preferably 5,000 to 200,000. The molar absorbance of the compound can be measured by a known method, for example, by a UV-visible spectrophotometer (Cary-5 spectrophotometer manufactured by Varian), preferably using ethyl acetate at a concentration of 0.01 g/L. Two or more photopolymerization initiators can be used in combination as needed.

Furthermore, as the photopolymerization initiator, the compounds described in paragraph 0052 of JP-A-2008-260927, paragraphs 0033 to 0037 of JP-A-2010-097210, and paragraph 0044 of JP-A-2015-068893 can also be used, and the above contents are incorporated into the present specification.

As the photopolymerization initiator, an oxime ester-based polymerization initiator is preferred from the viewpoint of achieving a more excellent effect of the present invention.

The content of the photopolymerization initiator in the composition is preferably 0.5 to 20 mass % relative to the total solid content of the composition, more preferably 1.0 to 10 mass %, and even more preferably 1.5 to 10 mass %. One photopolymerization initiator may be used alone, or two or more may be used in combination. When two or more photopolymerization initiators are used in combination, the total amount thereof is preferably within the above range.

[Surfactant] The composition may contain a surfactant. The surfactant helps to improve the coating properties of the composition. As the surfactant, for example, silicone-based surfactants, fluorine-based surfactants, non-ionic surfactants, cationic surfactants, and anionic surfactants can be cited. Among them, silicone-based surfactants are preferred from the viewpoint of the better effect of the present invention.

Examples of polysilicone-based surfactants include linear polymers composed of siloxane bonds and modified siloxane polymers having organic groups introduced into the side chains and/or the terminals.

As polysilicone-based surfactants, for example, DC3PA, SH7PA, DC11PA, SH21PA, SH28PA, SH29PA, SH30PA, and SH8400 of the DOWSIL (registered trademark) series (all manufactured by Dow Corning Toray Co., Ltd.); X-22-4952, X-22-4272, X-22-6266, KF-351A, K354L, KF-355A, KF-945, KF-640, KF-642, KF-643, X-22-6191, X-22-4515, KF-6000, KF-6004, KP-323, KP-341, KF-6001, and KF-6002 (all manufactured by Shin-Etsu Silicone Company); F-4440, TSF-4300, TSF-4445, TSF-4460 and TSF-4452 (all manufactured by Momentive Performance Materials Inc.); BYK307, BYK323 and BYK330 (all manufactured by BYK-Chemie GmbH). As a preferred embodiment of silicone-based surfactants, aromatic-modified silicone-based surfactants (silicone-based surfactants with aromatic groups) can also be cited. As aromatic-modified silicone-based surfactants, phenyl-modified silicone-based surfactants (silicone-based surfactants with phenyl groups) are preferred.

As a preferred embodiment of the silicone-based surfactant, a siloxane compound having the following structure can also be cited: In addition, n is 1 or more, preferably 10 to 40.

[Chemical formula 29]

As fluorine-based surfactants, for example, MEGAFACE F171, MEGAFACE F172, MEGAFACE F173, MEGAFACE F176, MEGAFACE F177, MEGAFACE F141, MEGAFACE F142, MEGAFACE F143, MEGAFACE F144, MEGAFACE R30, MEGAFACE F437, MEGAFACE F475, MEGAFACE F479, MEGAFACE F482, MEGAFACE F554, and MEGAFACE F780 (all manufactured by DIC CORPORATION); Fluorad FC430, Fluorad FC431, and Fluorad FC171 (all manufactured by Sumitomo 3M Limited); Surflon S-382, Surflon SC-101, Surflon SC-103, Surflon SC-104, Surflon SC-105, Surflon SC1068, Surflon SC-381, Surflon SC-383, Surflon S393 and Surflon KH-40 (all manufactured by Asahi Glass Co., Ltd.); and PF636, PF656, PF6320, PF6520 and PF7002 (manufactured by OMNOVA Solutions Inc.), etc. As a fluorine-based surfactant, a block polymer can also be used, for example, the compound described in Japanese Patent Publication No. 2011-089090 can be cited.

When the composition contains a surfactant, the content of the surfactant in the composition is not particularly limited. From the perspective of achieving a better effect of the present invention, 0.001 to 2.0 mass % is preferred, 0.005 to 1.0 mass % is more preferred, and 0.01 to 1.0 mass % is further preferred relative to the total solid content of the composition. One surfactant may be used alone or two or more surfactants may be used in combination. When two or more surfactants are used in combination, the total amount is preferably within the above range.

[Solvent] The composition may contain a solvent. The solvent is not particularly limited, and known solvents can be used, for example, organic solvents and water. In the composition, the content of the solid component is preferably 10 to 90 mass % relative to the total mass of the composition, 20 to 70 mass % is more preferably, 30 to 70 mass % is further preferably, and 40 to 60 mass % is particularly preferably. That is, the content of the solvent in the composition is not particularly limited, and it is preferably adjusted so that the solid component of the composition becomes the above content. The solvent may be used alone or in combination of two or more. When two or more solvents are used in combination, it is preferably adjusted so that the total solid content of the composition is within the above range.

Examples of the organic solvent include acetone, methyl ethyl ketone, cyclohexane, ethyl acetate, ethylene dichloride, tetrahydrofuran, toluene, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol dimethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, acetylacetone, cyclohexanone, cyclopentanone, diacetone alcohol, ethylene glycol monomethyl ether acetate, ethylene glycol ethyl ether acetate, ethylene glycol monoisopropyl ether, ethylene glycol monobutyl ether acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monoisopropyl ether, ethylene glycol monobutyl ether acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monoisopropyl ether, ethylene glycol monoethyl ether acetate, ethylene glycol monomethyl ether acetate ... Acid esters, 3-methoxypropanol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, 3-methoxypropyl acetate, N,N-dimethylformamide, dimethyl sulfoxide, γ-butyrolactone, butyl acetate, methyl lactate, N-methyl-2-pyrrolidone and ethyl lactate, but are not limited to them.

[Compounds containing epoxy groups (adhesives)] The composition may contain compounds containing epoxy groups. Examples of compounds containing epoxy groups include compounds having one or more epoxy groups, and compounds having two or more epoxy groups are preferred. It is preferred that the number of epoxy groups is 1 to 100. The upper limit may be, for example, 10 or less, or 5 or less. The lower limit is preferably 2 or more. In addition, the compound containing epoxy groups refers to a component different from the above-mentioned dispersant, alkali-soluble resin, and polymerizable compound.

The epoxy equivalent (=molecular weight of the epoxy group-containing compound/number of epoxy groups) of the epoxy group-containing compound is preferably 500 g/equivalent or less, more preferably 100 to 400 g/equivalent, and even more preferably 100 to 300 g/equivalent.

The compound containing an epoxy group may be a low molecular weight compound (e.g., a molecular weight of less than 2000) or a high molecular weight compound (e.g., a molecular weight of 2000 or more, and in the case of a polymer, a weight average molecular weight of 2000 or more). The weight average molecular weight of the compound containing an epoxy group is preferably 200 to 100000, more preferably 500 to 50000. The upper limit of the weight average molecular weight is more preferably 10000 or less, more preferably 5000 or less, and particularly preferably 3000 or less.

Commercially available compounds containing epoxy groups can be used. For example, EHPE3150 (manufactured by Daicel Corporation), EOCN-1020 (manufactured by Nippon Kayaku Co., Ltd.), EPICLON N-695 (manufactured by DIC), and CELLOXIDE 2021P (manufactured by Daicel Corporation) can be cited. In addition, compounds containing epoxy groups include compounds described in paragraphs 0034 to 0036 of Japanese Patent Publication No. 2013-011869, paragraphs 0147 to 0156 of Japanese Patent Publication No. 2014-043556, and paragraphs 0085 to 0092 of Japanese Patent Publication No. 2014-089408. These contents are incorporated into this specification.

When the composition contains a compound containing an epoxy group, the content of the compound containing an epoxy group in the composition is preferably 0.001 to 10 mass %, more preferably 0.01 to 8 mass %, and even more preferably 0.01 to 6 mass % relative to the total solid content in the composition. The compound containing an epoxy group may be used alone or in combination of two or more. When the composition contains two or more compounds containing an epoxy group, the total content thereof is preferably within the above range.

[Silane coupling agent (adhesive agent)] The composition may contain a silane coupling agent. When a cured film is formed on a substrate, the silane coupling agent functions as an adhesive agent that improves the adhesion between the substrate and the cured film. Silane coupling agent refers to a compound containing a hydrolyzable group and other functional groups in the molecule. In addition, a hydrolyzable group such as an alkoxy group is bonded to a silicon atom. A hydrolyzable group refers to a substituent that directly bonds to a silicon atom and can form a siloxane bond by a hydrolysis reaction and/or a condensation reaction. Examples of the hydrolyzable group include a halogen atom, an alkoxy group, an acyloxy group, and an alkenyloxy group. When the hydrolyzable group contains a carbon atom, the carbon number is preferably 6 or less, and more preferably 4 or less. In particular, an alkoxy group with a carbon number of 4 or less or an alkenyloxy group with a carbon number of 4 or less is preferred. In addition, when a cured film is formed on a substrate, in order to improve the adhesion between the substrate and the cured film, the silane coupling agent preferably does not contain fluorine atoms and silicon atoms (except for silicon atoms bonded to hydrolyzable groups), and preferably does not contain fluorine atoms, silicon atoms (except for silicon atoms bonded to hydrolyzable groups), alkylene groups substituted by silicon atoms, linear alkyl groups with a carbon number of 8 or more, and branched alkyl groups with a carbon number of 3 or more. The silane coupling agent may contain an ethylenically unsaturated group such as a (meth)acryloyl group. When an ethylenically unsaturated group is contained, the number thereof is preferably 1 to 10, and more preferably 4 to 8. In addition, silane coupling agents containing ethylenically unsaturated groups (e.g. compounds containing hydrolyzable groups and ethylenically unsaturated groups with a molecular weight of less than 2000) do not belong to the above-mentioned polymerizable compounds.

Examples of the silane coupling agent include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, vinyltrimethoxysilane, and vinyltriethoxysilane.

When the composition contains a silane coupling agent, the content of the silane coupling agent in the composition is preferably 0.1 to 10 mass %, more preferably 0.5 to 8 mass %, and even more preferably 1.0 to 6 mass % relative to the total solid content in the composition. The silane coupling agent may contain one type alone or two or more types. When the composition contains two or more silane coupling agents, the total amount thereof may be within the above range.

[Ultraviolet absorber] The composition may contain an ultraviolet absorber. This can make the pattern shape of the cured film formed by exposure to become a more excellent (fine) shape. As ultraviolet absorbers, salicylic acid ester-based, benzophenone-based, benzotriazole-based, substituted acrylonitrile-based and tris-based ultraviolet absorbers can be cited. In addition, the compounds in paragraphs 0137 to 0142 of Japanese Patent Publication No. 2012-068418 (corresponding to paragraphs 0251 to 0254 of US2012/0068292) can also be cited, and the contents can be cited and incorporated into this specification. In addition, diethylamino-phenylsulfonyl ultraviolet absorber (manufactured by DAITO CHEMICAL CO., LTD., product name: UV-503) and the like can also be cited. As ultraviolet absorbers, compounds exemplified in paragraphs 0134 to 0148 of Japanese Patent Publication No. 2012-032556 can also be cited. When the composition contains the ultraviolet absorber, the content of the ultraviolet absorber is preferably 0.001 to 15 mass %, more preferably 0.01 to 10 mass %, and even more preferably 0.1 to 5 mass % relative to the total solid content of the composition.

[Infrared absorber] The composition may further contain an infrared absorber. The infrared absorber refers to a compound having absorption in the wavelength region of the infrared region (preferably a wavelength of 650 to 1300 nm). The infrared absorber is preferably a compound having a maximum absorption wavelength in the wavelength region of 675 to 900 nm. As coloring agents having such spectral characteristics, for example, pyrrolopyrrole compounds, copper compounds, cyanine compounds, phthalocyanine compounds, iminium compounds, thiol complex compounds, transition metal oxide compounds, squarylium compounds, naphthalocyanine compounds, quaterrylene compounds, dithiol metal complex compounds, and croconium compounds can be cited. Phthalocyanine compounds, naphthalocyanine compounds, ammonium compounds, cyanine compounds, squarylium compounds and crotonium compounds can use compounds disclosed in paragraphs 0010 to 0081 of Japanese Patent Publication No. 2010-111750, and the contents are incorporated into this specification. For example, cyanine compounds can refer to "Functional Pigments, Okawara Nobuyuki/Matsuoka Ken/Kitao Teijiro/Hirajima Tsuneaki·Written, Kodansha Scientific Ltd.", and the contents are incorporated into this specification.

As a coloring agent having the above-mentioned spectral characteristics, the compounds disclosed in paragraphs 0004 to 0016 of Japanese Patent Publication No. 07-164729 and/or the compounds disclosed in paragraphs 0027 to 0062 of Japanese Patent Publication No. 2002-146254, and the near-infrared absorbing particles disclosed in paragraphs 0034 to 0067 of Japanese Patent Publication No. 2011-164583, which are composed of microcrystals containing Cu and/or P oxides and have a number average agglomerated particle size of 5 to 200 nm, can also be used.

The compound having a maximum absorption wavelength in the wavelength region of 675 to 900 nm is preferably at least one selected from the group consisting of cyanine compounds, pyrrolopyrrole compounds, squarylium compounds, phthalocyanine compounds, and naphthalocyanine compounds. In addition, the infrared absorber is preferably a compound that dissolves at least 1% by mass in water at 25°C, and more preferably a compound that dissolves at least 10% by mass in water at 25°C. By using such a compound, solvent resistance becomes good. The pyrrolopyrrole compound can be found in paragraphs 0049 to 0062 of Japanese Patent Publication No. 2010-222557, and the content is incorporated into this specification. For the cyanine compounds and the squarylium compounds, see paragraphs 0022 to 0063 of International Publication No. 2014/088063, paragraphs 0053 to 0118 of International Publication No. 2014/030628, paragraphs 0028 to 0074 of Japanese Patent Application No. 2014-059550, paragraphs 0013 to 0091 of International Publication No. 2012/169447, and paragraphs 0017 to 0018 of Japanese Patent Application No. 2014-059550. 0019 to 0033 of Japanese Patent Application No. 15-176046, 0053 to 0099 of Japanese Patent Application No. 2014-063144, 0085 to 0150 of Japanese Patent Application No. 2014-052431, 0076 to 0124 of Japanese Patent Application No. 2014-044301, 0045 to 0078 of Japanese Patent Application No. 2012-008532 , paragraphs 0027 to 0067 of Japanese Patent Application Publication No. 2015-172102, paragraphs 0029 to 0067 of Japanese Patent Application Publication No. 2015-172004, paragraphs 0029 to 0085 of Japanese Patent Application Publication No. 2015-040895, paragraphs 0022 to 0036 of Japanese Patent Application Publication No. 2014-126642, paragraphs 001 1 to 0017, paragraphs 0010 to 0025 of Japanese Patent Publication No. 2015-157893, paragraphs 0013 to 0026 of Japanese Patent Publication No. 2014-095007, paragraphs 0013 to 0047 of Japanese Patent Publication No. 2014-080487, and paragraphs 0007 to 0028 of Japanese Patent Publication No. 2013-227403, etc., the contents are incorporated into this manual.

[Other optional components] The composition may further contain other optional components other than the above components. For example, polymerization inhibitors, sensitizers, co-sensitizers, crosslinking agents, hardening accelerators, fillers, thermosetting accelerators, plasticizers, diluents and grease-sensitizing agents can be cited. In addition, adhesion promoters and other auxiliary agents (for example, conductive particles, fillers, defoaming agents, flame retardants, leveling agents, stripping accelerators, antioxidants, fragrances, surface tension regulators and chain transfer agents) and other well-known additives may be added as needed. For example, the components can be found in paragraphs 0183 to 0228 of Japanese Patent Application No. 2012-003225 (paragraphs 0237 to 0309 of the corresponding U.S. Patent Application Publication No. 2013/034812), paragraphs 0101 to 0102, 0103 to 0104, 0107 to 0109 of Japanese Patent Application No. 2008-250074, and paragraphs 0159 to 0184 of Japanese Patent Application No. 2013-195480, and the contents are incorporated into this specification.

[Method for preparing the composition] Regarding the composition, first, a dispersion composition in which a pigment is dispersed is prepared, and the obtained dispersion composition is preferably further mixed with other components to prepare a composition. The dispersion composition is preferably prepared by mixing a pigment, a dispersion resin and a solvent. In addition, it is also preferable to introduce a polymerization inhibitor into the dispersion composition. The above-mentioned dispersion composition can be prepared by mixing the above-mentioned components by a known mixing method (for example, a mixing method using a stirrer, a homogenizer, a high-pressure emulsifier, a wet pulverizer or a wet disperser). After the dispersion composition is prepared, the above-mentioned dispersion composition, a specific resin, a polymerizable compound, a photopolymerization initiator and a solvent can be mixed to prepare it. When preparing the composition, each component can be mixed at once, or each component can be dissolved or dispersed in a solvent and mixed one by one. In addition, there are no special restrictions on the order of addition and operating conditions during mixing.

The composition is preferably filtered by a filter for the purpose of removing foreign matter and reducing defects. As a filter, for example, as long as it is a filter that has been used for filtering purposes, it can be used without special restrictions. For example, filters based on fluororesins such as PTFE (polytetrafluoroethylene), polyamide resins such as nylon, and polyolefin resins such as polyethylene and polypropylene (PP) (including high-density and ultra-high molecular weight) can be cited. Among them, polypropylene (including high-density polypropylene) or nylon is preferred. The pore size of the filter is preferably 0.1 to 7.0 μm, more preferably 0.2 to 2.5 μm, further preferably 0.2 to 1.5 μm, and particularly preferably 0.3 to 0.7 μm. If set to this range, the filter clogging of the pigment (including black pigment) can be suppressed, and fine foreign matter such as impurities and agglomerates contained in the pigment can be reliably removed. It is preferred that the composition does not contain impurities such as metals, halogenated metal salts, acids, and bases. The type of metal is not particularly limited, and alkali metals, alkaline earth metals, transition metals, Al, Sn, Pb, Bi, etc. can be cited. The content of impurities contained in these materials is preferably 1 mass ppm or less, 1 mass ppb or less is more preferred, 100 mass ppt or less is further preferred, 10 mass ppt or less is particularly preferred, and substantially no impurities (below the detection limit of the measuring device) are the best. In addition, the above impurities can be measured by an inductively coupled plasma mass spectrometer (manufactured by Yokogawa Analytical Systems, Inc., Agilent 7500cs model).

[Method for producing a cured film] In this specification, "cured film" refers to a film formed by subjecting a composition layer formed using a composition to a curing treatment such as exposure treatment. The method for producing a cured film is described below. The method for producing a cured film preferably includes the following steps. Through the above steps, for example, a patterned cured film can be formed. In addition, when the cured film is not set to a patterned shape, the development step may not be performed. Each step is described below.

[Composition layer formation step] In the composition layer formation process, a composition layer (composition layer) is formed by applying a composition on a support or the like before exposure. As a support, for example, a solid-state imaging element substrate can be used in which an imaging element (light-receiving element) such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal-Oxide Semiconductor) is provided on a substrate (for example, a silicon substrate). In addition, as needed, an undercoat layer for improving the close contact with the upper layer, preventing the diffusion of substances, and flattening the substrate surface can be provided on the support.

As a method for applying the composition on the support, various coating methods such as slit coating, inkjet coating, rotary coating, cast coating, roll coating, and screen printing can be cited. The film thickness of the composition layer is preferably 0.1 to 10 μm, more preferably 0.2 to 5 μm, and even more preferably 0.2 to 3 μm. The drying (pre-baking) of the composition layer coated on the support can be performed at a temperature of 50 to 140° C. for 10 to 300 seconds using a heating plate or an oven.

[Exposure step] The exposure step is a step of exposing the component layer formed in the component layer forming step by irradiating activating light or radiation. Specifically, the exposure step is a step of exposing the component layer formed in the component layer forming step by irradiating activating light or radiation, and hardening the light-irradiated area of the component layer. There is no particular limitation on the method of light irradiation, and it is preferable to perform light irradiation through a photomask having a patterned opening. It is preferable to perform exposure by irradiation with radiation, and as radiation that can be used for exposure, ultraviolet rays such as g-rays, h-rays and i-rays are particularly preferable, and as a light source, a high-pressure mercury lamp is preferable. The irradiation intensity is preferably 5 to 1500 mJ/cm ² , and more preferably 10 to 1000 mJ/cm ^2. In addition, in the exposure step, when the component layer is heated, the post-heating step described below can be used in combination. In other words, in the exposure step, when the component layer is heated, the method for producing a cured film does not need to include a post-heating step.

[Developing step] The developing step is a step of developing the exposed component layer. In this step, the component layer in the light-exposed area in the exposure step is dissolved, and only the light-hardened part remains. For example, in the exposure step, when light irradiation is performed through a photomask having a patterned opening, a patterned hardened film can be obtained. The type of developer used in the developing step is not particularly limited, and an alkaline developer that does not cause damage to the imaging element and circuit of the base is preferred. The developing temperature is, for example, 20 to 30°C. The developing time is, for example, 20 to 90 seconds. In recent years, 120 to 180 seconds is sometimes used to further remove residues. In addition, in order to further improve the removability of residues, the following steps are sometimes repeated several times: the developer is shaken off every 60 seconds and the developer is re-supplied.

The alkaline developer is preferably an alkaline aqueous solution prepared by dissolving an alkaline compound in water to a concentration of 0.001 to 10 mass % (preferably 0.01 to 5 mass %). Examples of the alkaline compound include sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, ammonia water, ethylamine, diethylamine, dimethylethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, benzyltrimethylammonium hydroxide, choline, pyrrole, piperidine, and 1,8-diazabicyclo[5.4.0]-7-undecene (among which organic bases are preferred). In addition, when used as an alkaline developer, it is generally washed with water after development.

[Post-baking] It is preferable to perform heat treatment (post-baking) after the exposure step. Post-baking is a heat treatment after development for complete hardening. The heating temperature is preferably below 240°C, and more preferably below 220°C. There is no particular lower limit, but if efficient and effective processing is considered, 50°C or above is preferred, and 100°C or above is more preferred. Post-baking can be performed continuously or intermittently using heating mechanisms such as heating plates, convection ovens (hot air circulation dryers) and high-frequency heaters.

The above post-baking is preferably carried out in a low oxygen concentration atmosphere. The oxygen concentration is preferably 19 volume % or less, more preferably 15 volume % or less, further preferably 10 volume % or less, particularly preferably 7 volume % or less, and most preferably 3 volume % or less. There is no particular lower limit, but it is actually 10 volume ppm or more.

Furthermore, it can be changed to baking after the above heating, and completely hardening it by UV (ultraviolet) irradiation. In this case, it is preferable that the above composition further includes a UV hardener. The UV hardener is preferably a UV hardener that can harden at a wavelength shorter than the exposure wavelength of 365nm, which is the wavelength of the polymerization initiator added for the lithography step based on the usual i-ray exposure. As a UV hardener, for example, CIBS IRGACURE 2959 (product name) can be cited. When UV irradiation is performed, it is preferable that the composition layer is hardened at a wavelength below 340nm. There is no special restriction on the lower limit of the wavelength, and it is generally above 220nm. In addition, the exposure amount of UV irradiation is preferably 100-5000mJ, more preferably 300-4000mJ, and even more preferably 800-3500mJ. In order to perform low-temperature curing more effectively, the UV curing step is preferably performed after the lithography step. It is preferred to use an ozone-free mercury lamp as the exposure light source.

[Physical properties of cured film and uses of cured film] The cured film obtained by curing the composition of the present invention is preferably used as a light-shielding film. The following describes the preferred physical properties and uses of the cured film obtained by curing the composition of the present invention when used as a light-shielding film.

[Physical properties of light-shielding film and uses of light-shielding film] From the perspective of having excellent light-shielding properties, the light-shielding film preferably has an optical density (OD: Optical Density) of 3.0 or more per 5.0 μm film thickness in the wavelength range of 400 to 1100 nm, and more preferably 3.5 or more. In addition, the upper limit is not particularly limited, and generally 10 or less is preferred. In addition, in this specification, the optical density of 3.0 or more per 5.0 μm film thickness in the wavelength range of 400 to 1100 nm means that the optical density of 3.0 or more per 5.0 μm film thickness in the entire wavelength range of 400 to 1100 nm. As a method for measuring the optical density of the light-shielding film, first, a light-shielding film is formed on a glass substrate and measured using a spectrophotometer (e.g., U-4100 manufactured by Hitachi High-Tech Corporation). The thickness of the light-shielding film is preferably 0.1 to 6.0 μm, more preferably 1.0 to 5.0 μm, and further preferably 1.0 to 2.5 μm. In addition, the light-shielding film can be set to a thin film smaller than this range or a thick film larger than this range according to the application. In addition, from the perspective of having excellent low reflectivity, the maximum reflectivity (incident angle 5°) of the light-shielding film per 5.0 μm film thickness in the wavelength range of 350 to 1200 nm is preferably less than 5%, more preferably less than 4%, and further preferably less than 1%. In addition, there is no special restriction on the lower limit value, which is generally above 0%. As a method for measuring the maximum reflectivity of a light-shielding film, first, a light-shielding film is formed on a glass substrate, and a reflectivity spectrum with respect to an incident angle of 5° is obtained using a spectrometer (e.g., the VAR unit of the spectrometer V7200 manufactured by JASCO Corporation), and the reflectivity of light with a wavelength showing the maximum reflectivity in the wavelength range of 350 to 1200 nm is obtained.

In addition, the light-shielding film is suitable for portable devices such as personal computers, tablet computers, mobile phones, smart phones and digital cameras; OA (Office Automation) equipment such as printers and scanners; industrial equipment such as surveillance cameras, barcode readers, ATMs (Automated Teller Machines), high-speed cameras and equipment with personal authentication functions using facial image authentication; in-vehicle camera equipment; endoscopes, capsule endoscopes (capsule endoscopes); endoscope and catheter; as well as body sensors, biosensors, military reconnaissance cameras, 3D map cameras, weather and ocean observation cameras, land resource exploration cameras, and space equipment such as exploration cameras for astronomy and deep space targets; light-shielding components and films of filters and modules, as well as anti-reflection components and films used in them.

The above-mentioned light-shielding film can also be used for micro LED (Light Emitting Diode) and micro OLED (Organic Light Emitting Diode). In addition to being suitable for filters and optical films used in micro LED and micro OLED, the above-mentioned light-shielding film is also suitable for components that have a light-shielding function or an anti-reflection function. As examples of micro LED and micro OLED, examples described in Japanese Patent Publication No. 2015-500562 and Japanese Patent Publication No. 2014-533890 can be cited.

The light shielding film is also preferably used as a filter and an optical film used in quantum dot sensors and quantum dot solid-state imaging devices. In addition, it is suitable as a component that imparts light shielding function and anti-reflection function. As examples of quantum dot sensors and quantum dot solid-state imaging devices, examples described in U.S. Patent Application Publication No. 2012/37789 and International Publication No. 2008/131313 can be cited.

<Solid-state imaging element and solid-state imaging device> The light-shielding film is preferably used for the solid-state imaging element. In other words, the solid-state imaging element of the present invention is a solid-state imaging element having the light-shielding film of the present invention. The form of the solid-state imaging element including the light-shielding film is not particularly limited, and for example, the following form can be cited: a light-receiving element composed of a plurality of photodiodes and polysilicon constituting the light-receiving area of the solid-state imaging element (CCD image sensor, CMOS image sensor, etc.) is provided on a substrate, and a light-shielding film is provided on the light-receiving element forming surface side of the support (for example, the portion other than the light-receiving portion and/or the color adjustment pixel, etc.) or on the side opposite to the forming surface. Furthermore, when the light shielding film is used as a light attenuation film, for example, if the light attenuation film is arranged so that a part of the light enters the light receiving element after passing through the light attenuation film, the dynamic range of the solid-state imaging element can be improved. The solid-state imaging device includes the above-mentioned solid-state imaging element.

<Image display device> It is also preferable that the light-shielding film is applied to the image display device. In other words, the image display device of the present invention is an image display device having the light-shielding film of the present invention. As a form in which the image display device has a light-shielding film, for example, a form in which a color filter having a black matrix including a light-shielding film is applied to the image display device can be cited. Next, the black matrix and the color filter including the black matrix are explained, and further, as a specific example of the image display device, a liquid crystal display device including such a color filter is explained.

(Black Matrix) It is also preferable that the light shielding film is included in the black matrix. The black matrix is sometimes included in image display devices such as color filters, solid-state imaging devices, and liquid crystal display devices. As black matrices, those described above can be cited; black edges provided at the periphery of image display devices such as liquid crystal display devices; grid-shaped and/or straight-line black portions between red, blue, and green pixels; dot-shaped and/or linear black patterns used for TFT (Thin Film Transistor) light shielding; etc. The definition of the black matrix is described, for example, in "Glossary of Liquid Crystal Display Manufacturing Devices" by Taihei Kanno, 2nd edition, NIKKAN KOGYO SHIMBUN, LTD., 1996, p. 64. In order to improve the display contrast and prevent the degradation of image quality caused by light leakage current when using a thin film transistor (TFT) active matrix driven liquid crystal display device, it is preferred that the black matrix has high light shielding properties (measured in optical density OD of 3 or more).

The method for manufacturing the black matrix is not particularly limited, and can be manufactured by the same method as the method for manufacturing the above-mentioned light-shielding film. Specifically, a composition layer can be formed by coating a composition on a substrate, and then exposure and development are performed to manufacture a patterned light-shielding film (black matrix). In addition, the film thickness of the light-shielding film (black matrix) is preferably 0.1 to 4.0 μm.

The substrate is not particularly limited, but preferably has a transmittance of 80% or more for visible light (wavelength 400 to 800 nm). Examples of the material of this substrate include glasses such as sodium calcium glass, alkali-free glass, quartz glass, and borosilicate glass; and plastics such as polyester resins and polyolefin resins. From the perspective of chemical resistance and heat resistance, alkali-free glass or quartz glass is preferred.

(Color filter) It is also preferable that the light-shielding film is included in the color filter. The form of the color filter including the light-shielding film is not particularly limited, and a color filter having a substrate and the above-mentioned black matrix can be cited. That is, a color filter having red, green, and blue colored pixels formed in the opening of the above-mentioned black matrix formed on the substrate can be exemplified.

A color filter including a black matrix can be manufactured, for example, by the following method. First, a coating (composition layer) containing a composition of pigments corresponding to each colored pixel of the color filter is formed at the opening of a patterned black matrix formed on a substrate. In addition, there is no particular limitation on the composition for each color, and a known composition can be used. Among the compositions described in this specification, a composition in which black pigment is replaced with a colorant corresponding to each pixel is preferably used. Then, the composition layer is exposed through a mask having a pattern corresponding to the opening of the black matrix. Then, after removing the unexposed portion by development processing, baking is performed to form colored pixels at the opening of the black matrix. For example, if a series of operations are performed using color compositions containing red, green, and blue pigments, a color filter having red, green, and blue pixels can be produced.

(Liquid crystal display device) It is also preferable that a light shielding film is included in a liquid crystal display device. There is no particular limitation on the form of a liquid crystal display device including a light shielding film, and a form including a color filter including the black matrix (light shielding film) described above can be cited.

As a liquid crystal display device, for example, there can be cited a form having a pair of substrates arranged opposite to each other and a liquid crystal compound sealed between the substrates. As the above-mentioned substrate, it has been described as a black matrix substrate.

As a specific form of the above-mentioned liquid crystal display device, for example, there can be cited a laminate including, in order from the user side, polarizer/substrate/color filter/transparent electrode layer/orientation film/liquid crystal layer/orientation film/transparent electrode layer/TFT (Thin Film Transistor) element/substrate/polarizer/backlight unit.

In addition, as liquid crystal display devices, they are not limited to the above, and for example, liquid crystal display devices described in "Electronic Display Devices (written by Akio Sasaki, published by Kogyo Chosakai Publishing Co., Ltd. in 1990)" and "Display Devices (written by Junaki Ibuki, published by Sangyo Tosho Publishing Co., Ltd. in 1989)" can be cited. Another example is the liquid crystal display device described in "Next Generation Liquid Crystal Display Technology (edited by Ryuo Uchida, published by Kogyo Chosakai Publishing Co., Ltd. in 1994)".

<Infrared sensor> It is also preferable that the light shielding film is included in the infrared sensor. Next, a solid-state imaging device to which the above-mentioned infrared sensor is applied is described. The above-mentioned solid-state imaging device includes a lens optical system, a solid-state imaging element, and an infrared light-emitting diode. In addition, for each structure of the solid-state imaging device, it is possible to refer to paragraphs 0032 to 0036 of Japanese Patent Publication No. 2011-233983, and the content is incorporated into this specification. [Example]

The present invention is further described below in detail based on the embodiments. The materials, usage amounts, ratios, processing contents and processing steps shown in the following embodiments can be appropriately changed as long as they do not deviate from the purpose of the present invention. Therefore, the scope of the present invention should not be limited to the embodiments shown below.

[Various ingredients used in the preparation of the composition] Below, the various ingredients used in the preparation of the composition are described in detail.

[Resin A] Table 1 shows the structure of Resin A (Resin A-1 to A-15 and Resin RA-1 to RA-4) shown in Table 4, and Table 2 shows various physical properties of Resin A shown in Table 1 (Silicon atom content in resin (mass %), acid value (mgKOH/g) and double bond value (mmol/g)).

As resins A-1 to A-15 and resins RA-1 to RA-4, synthesized products were used. Hereinafter, a synthesis example of resin A-1 is shown as an example.

<Synthesis of Resin A-1> 30.0 g of 3-[tri(trimethylsiloxy)silyl]propyl methacrylate (manufactured by Tokyo Chemical Industry Co., Ltd.) and 6.5 g of methacrylic acid (manufactured by Wako Pure Chemical Industries, Ltd.) were mixed to prepare a raw material monomer solution. In addition, a mixed solution A was prepared by mixing 2 mol% of a thermal polymerization initiator (V-601 manufactured by FUJIFILM Wako Pure Chemical Corporation) with 111% by mass of 1-methoxy-2-propanol with respect to the total mass of the raw material monomers. Next, a mixed solution B of the raw material monomer mixed solution and 74 mass % of 1-methoxy-2-propanol relative to the total mass of the raw material monomers was prepared and heated to 80°C, and then the mixed solution A was added dropwise to the mixed solution B over 2 hours (dropwise polymerization), and then heated at 80°C for 2 hours, and further heated at 90°C for 3 hours. The polymerization reaction was terminated by the above operation. After the reaction was completed, 0.24 g of tetrabutylammonium acetate (manufactured by Tokyo Chemical Industry Co., Ltd.) and 0.23 g of 2,2,6,6-tetramethylpiperidinyl 1-oxyl (TEMPO) (manufactured by Tokyo Chemical Industry Co., Ltd.) were added to the above polymerization solution under air, and 3.5 g of 4-hydroxybutyl acrylate glycidyl ether (manufactured by Mitsubishi Chemical Corporation) was added dropwise. After the addition was completed, the reaction was continued at 90°C in air for 48 hours, and the acid value was measured to confirm the completion of the reaction, thereby synthesizing Resin A-1. The weight average molecular weight (Mw) of the obtained Resin A-1 was 37,000.

<Resins A-2 to A-15 and Resins RA-1 to RA-4> Resins A-2 to A-15 and Resins RA-1 to RA-4 were synthesized in the same procedure as the synthesis example of Resin A-1 except that the types and proportions of the raw material monomers were changed. The weight average molecular weight (Mw) of Resins A-2 to A-15 and Resins RA-1 to RA-4 was in the range of 18,000 to 45,000.

Tables 1 and 2 are shown below. The "Silicon atom content (mass %) in resin" in Table 2 indicates the content (mass %) of silicon atoms relative to the total mass of resin A.

[Table 1]

[Table 2]

[table 3] Table 2 Silicon atom content in resin (mass %) Acid value (mgKOH/g) C=C value (mmol/g) A-1 19.9 81.4 0.44 A-2 13.3 74.7 0.23 A-3 13.8 63.7 0.32 A-4 17.1 67.0 0.35 A-5 17.1 60.9 0.24 A-6 11.5 60.7 0.23 A-7 18.6 97.7 0.47 A-8 19.9 81.4 0.44 A-9 19.9 81.4 0.44 A-10 19.9 81.4 0.44 A-11 18.6 97.7 0.47 A-12 18.6 97.7 0.47 A-13 18.6 102.9 0.35 A-14 18.6 97.7 0.35 A-15 18.6 97.7 0.35 RA-1 8.5 130.3 0.17 RA-2 20.2 26.7 0.33 RA-3 0.0 16.3 0.0 RA-4 0.0 228.0 0.0

[Resin B] The following are resins B (resins B-1 to B-2) shown in Table 3. · Resin B-1: The following structure. Acid value is 57.2 mgKOH/g, glass transition temperature is 33°C, and weight average molecular weight is 30,000. In the following structural formula, the unit of the numerical value in the brackets attached to the main chain is mass %, and the value in the brackets attached to the side chain is equivalent to the average addition number.

[Chemical formula 30]

· Resin B-2: The following structure. Acid value is 55.7 mgKOH/g, glass transition temperature is 55°C, and weight average molecular weight is 18,000. In addition, in the following structural formula, the unit of the value in the brackets of the main chain is mass %, and the value in the brackets of the side chain is equivalent to the average addition number.

[Chemical formula 31]

[Monomer] The following are monomers shown in Table 4 (monomers C-1 to C-3). ·C-1: NK Ester A-TMMT (manufactured by SHIN-NAKAMURA CHEMICAL Co., Ltd., neopentatriol tetraacrylate) ·C-2: KAYARAD DPHA (manufactured by Nippon Kayaku Co., Ltd., a mixture of dipentatriol pentaacrylate and dipentatriol hexaacrylate) ·C-3: NK Ester A-DPH-12E (ethoxylated dipentatriol polyacrylate manufactured by SHIN-NAKAMURA CHEMICAL Co., Ltd.)

[Pigments] The following are pigments (pigments D-1 to D-4) shown in Table 3. D-1: TiON (titanium oxynitride: black pigment) D-1 is a synthetic product synthesized by the following method. <Synthesis of D-1> Titanium oxide MT-150A (product name: manufactured by TAYCA CORPORATION) with an average particle size of 15 nm (100 g), silica particles AEROGIL (registered trademark) 300/30 (manufactured by EVONIK) with a BET surface area of 300 m ² /g (25 g), and dispersant Disperbyk 190 (product name: manufactured by BYK Chemie) (100 g) were weighed, ion-exchanged water (71 g) was added, and the mixture was treated for 20 minutes using MAZERSTAR KK-400W manufactured by Kurabo Industries Ltd. at an orbital speed of 1360 rpm and an autorotational speed of 1047 rpm to obtain a uniform aqueous mixture solution. The aqueous solution was filled into a quartz container and heated to 920°C in an oxygen atmosphere using a small rotary kiln (produced by Motoyama Co., Ltd.). The atmosphere was replaced with nitrogen and ammonia gas was passed through at 100 mL/min for 5 hours at the same temperature to perform a nitriding reduction treatment. After completion, the recovered powder was crushed with a mortar to obtain a powdered TiON (a dispersed body containing titanium black particles and Si atoms) containing Si atoms and having a specific surface area of 73 ^m2 /g.

·D-2: TiN (titanium nitride: black pigment) D-2 is a synthetic product synthesized in the same way as D-1 (TiON) above, except that the amount of ammonia is increased to replace all oxygen elements with nitrogen elements.

·D-3: TiO ₂ (titanium oxide: white pigment) manufactured by ISHIHARA SANGYO KAISHA, LTD., TTO-51 ·D-4: CB (carbon black: black pigment) manufactured by Mitsubishi Chemical Corporation, #2300

[Photopolymerization initiator] Below, the photopolymerization initiators shown in Table 4 (photopolymerization initiators E-1 to E-3) are shown. ·E-1: IRGACURE OXE02 (manufactured by BASF, oxime ester polymerization initiator) ·E-2: ADEKA ARKLS NCI-831E (manufactured by ADEKA CORPORATION, oxime ester polymerization initiator) ·E-3: Compounds of the following structures (oxime ester polymerization initiators)

[Chemical formula 32]

[Binder] The following are the combinations shown in Table 4 (binders F-1 to F-3). ·F-1: Resin with the following structure. The values attached to the main chain are molar ratios, and the weight average molecular weight is 11,000. ·F-2: Resin with the following structure. The values attached to the main chain are molar ratios, and the weight average molecular weight is 30,000.

[Chemical formula 33]

·F-3: Cardoline V-259ME (manufactured by NIPPON STEEL CORPORATION)

[Surfactant] The following is a surfactant shown in Table 4 (surfactant W-1). ·W-1: KF6001 (manufactured by Shin-Etsu Chemical Co., Ltd.) ·W-2: FZ-2122 (manufactured by DOW TORAY CO., LTD.) ·W-3: The following surfactant (weight average molecular weight 3000, where n represents an integer greater than 1.)

[Chemical formula 34]

[Solvent] The following are the solvents shown in Tables 3 and 4. ·PGMEA: Propylene glycol monomethyl ether acetate ·Butyl acetate ·PGME: Propylene glycol 1-monomethyl ether ·Cyclopentanone

[Preparation of pigment dispersion] After mixing the components shown in Table 3 at the mass ratio shown in Table 3, 230 parts by mass of 0.3 mm diameter zirconium dioxide beads were added, and dispersion treatment was performed for 5 hours using a paint agitator. The beads were separated by filtration to prepare each pigment dispersion (pigment dispersion 1 to 8). Table 3 is shown below.

[Table 4] table 3 Pigments Resin B Solvent Type Quality Type Quality Type Quality Pigment dispersion 1 D-1 25.0 B-1 7.5 PGMEA/Butyl Acetate 40.5/27.0 Pigment dispersion 2 D-1 25.0 B-2 7.5 PGMEA/Butyl Acetate 40.5/27.0 Pigment dispersion 3 D-2 25.0 B-1 7.5 PGMEA/Butyl Acetate 40.5/27.0 Pigment dispersion 4 D-2 25.0 B-2 7.5 PGMEA/Butyl Acetate 40.5/27.0 Pigment dispersion 5 D-1/D-3 23.0/2.0 B-1 7.5 PGMEA/Butyl Acetate 40.5/27.0 Pigment dispersion 6 D-1/D-4 23.0/2.0 B-1 7.5 PGMEA/Butyl Acetate 40.5/27.0 Pigment dispersion 7 D-2/D-3 23.0/2.0 B-2 7.5 PGMEA/Butyl Acetate 40.5/27.0 Pigment dispersion 8 D-2/D-4 23.0/2.0 B-2 7.5 PGMEA/Butyl Acetate 40.5/27.0

[Preparation of compositions] The components shown in Table 4 below were mixed in the amounts (parts by mass) shown in Table 4 to prepare the compositions of the Examples and Comparative Examples.

Table 4 is shown below.

[table 5] Table 4 (Part 1) Pigment dispersion Resin A Single Photopolymerization initiator Adhesive Surfactant Solvent Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Embodiment 1 Pigment dispersion 1 53.48 A-1 6.05 C-1 16.00 E-1 2.55 F-1 12.36 W-1 0.2 PGMEA 9.36 Embodiment 2 Pigment dispersion 2 53.48 A-2 6.05 C-2 16.00 E-1 E-2 1.55 1.00 F-3 12.36 W-1 0.2 PGMEA 9.36 Embodiment 3 Pigment dispersion 2 53.48 A-3 6.05 C-1 C-3 8.00 8.00 E-3 2.55 F-1 F-2 10.00 2.36 W-1 0.2 PGMEA 9.36 Embodiment 4 Pigment dispersion 3 48.48 A-4 11.05 C-1 17.05 E-1 1.50 F-1 12.36 W-1 0.2 PGMEA 9.36 Embodiment 5 Pigment dispersion 4 60.48 A-1 6.05 C-1 14.00 E-1 5.00 F-3 4.91 W-1 0.2 PGMEA 9.36 Embodiment 6 Pigment dispersion 7 53.48 A-5 6.05 C-1 C-2 12.00 4.00 E-1 2.55 F-2 F-3 4.00 8.36 W-1 0.2 PGMEA 9.36 Embodiment 7 Pigment dispersion 6 53.48 A-6 6.05 C-3 17.05 E-2 1.50 F-1 F-2 4.00 8.36 W-1 0.2 PGMEA 9.36 Embodiment 8 Pigment dispersion 2 53.48 A-7 6.05 C-1 16.00 E-3 2.55 F-1 12.36 W-1 0.2 PGMEA 9.36 Embodiment 9 Pigment dispersion 5 53.48 A-8 6.05 C-1 C-3 8.00 8.00 E-1 E-2 1.55 1.00 F-1 12.36 W-1 0.2 PGMEA 9.36 Embodiment 10 Pigment dispersion 6 53.48 A-9 6.05 C-2 16.00 E-2 2.55 F-1 12.36 W-1 0.2 PGMEA 9.36 Embodiment 11 Pigment dispersion 1 53.48 A-10 6.05 C-2 16.00 E-2 2.55 F-1 12.36 W-1 0.2 PGMEA 9.36 Embodiment 12 Pigment dispersion 2 53.48 A-11 6.05 C-3 16.00 E-2 2.55 F-3 12.36 W-1 0.2 PGMEA 9.36 Embodiment 13 Pigment dispersion 6 53.48 A-12 6.05 C-1 16.00 E-3 2.55 F-1 12.36 W-1 0.2 PGMEA 9.36 Embodiment 14 Pigment dispersion 4 53.48 A-13 6.05 C-2 16.00 E-1 2.55 F-3 12.36 W-1 0.2 PGMEA 9.36 Embodiment 15 Pigment dispersion 5 53.48 A-14 6.05 C-3 16.00 E-2 2.55 F-1 12.36 W-1 0.2 PGMEA 9.36 Embodiment 16 Pigment dispersion 8 53.48 A-15 6.05 C-2 16.00 E-2 2.55 F-1 12.36 W-1 0.2 PGMEA 9.36

[Table 6] Table 4 (Part 2) Pigment dispersion Resin A Single Photopolymerization initiator Adhesive Surfactant Solvent Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Type Quality Embodiment 17 Pigment dispersion 2 53.48 A-3 4.00 C-1 C-3 8.00 8.00 E-3 2.55 F-3 14.41 W-1 0.2 PGMEA 9.36 Embodiment 18 Pigment dispersion 5 53.48 A-5 8.05 C-1 C-2 4.00 4.00 E-1 2.55 F-1 18.36 W-1 0.2 PGMEA 9.36 Embodiment 19 Pigment dispersion 1 53.48 A-1 6.05 C-1 16.00 E-1 2.55 F-1 12.36 W-2 0.2 PGMEA 9.36 Embodiment 20 Pigment dispersion 2 53.48 A-1 6.25 C-1 16.00 E-1 2.55 F-1 12.36 - - PGMEA 9.36 Embodiment 21 Pigment dispersion 1 53.48 A-10 6.05 C-2 16.00 E-2 2.55 F-1 12.36 W-2 0.2 PGMEA PGME 7.36 2.0 Embodiment 22 Pigment dispersion 7 53.48 A-5 6.05 C-1 C-2 12.00 4.00 E-1 2.55 F-2 F-3 4.00 8.36 W-1 0.2 PGMEA Cyclopentanone 3.36 6.0 Embodiment 23 Pigment dispersion 6 53.48 A-12 6.25 C-1 16.00 E-3 2.55 F-1 12.36 - - PGMEA Butyl Acetate 4.68 4.68 Embodiment 24 Pigment dispersion 6 53.48 A-12 6.05 C-1 16.00 E-3 2.55 F-1 12.36 W-1 0.2 Cyclopentanone 9.36 Embodiment 25 Pigment dispersion 5 53.48 A-14 6.05 C-3 16.00 E-2 2.55 F-1 12.36 W-3 0.2 PGME Butyl Acetate 7.36 2.0 Comparison Example 1 Pigment dispersion 3 53.48 RA-1 6.05 C-1 16.00 E-1 2.55 F-1 12.36 W-1 0.2 PGMEA 9.36 Comparison Example 2 Pigment dispersion 3 53.48 RA-2 6.05 C-1 16.00 E-1 2.55 F-1 12.36 W-1 0.2 PGMEA 9.36 Comparison Example 3 Pigment dispersion 3 53.48 RA-3 6.05 C-1 16.00 E-1 2.55 F-1 12.36 W-1 0.2 PGMEA 9.36 Comparison Example 4 Pigment dispersion 3 53.48 RA-4 6.05 C-1 16.00 E-1 2.55 F-1 12.36 W-1 0.2 PGMEA 9.36

[Evaluation results] The evaluation of each composition of the embodiment and the comparative example was performed by the following method. The results are shown in Table 4 below. [Evaluation of reflectivity] Each composition of the embodiment and the comparative example was applied to a glass substrate by spin coating, and a coating having a film thickness of 5.0 μm after exposure was prepared. After pre-baking at 90°C for 120 seconds, the entire surface of the substrate was exposed using a UX-1000SM-EH04 (manufactured by Ushio Inc.) with a high-pressure mercury lamp (lamp power of 50 mW/ ^cm2 ) at an exposure amount of 1000 mJ/ ^cm2 . The exposed substrate was post-baked at 220°C for 300 seconds to obtain a substrate with a cured film. The prepared substrate with a cured film was evaluated based on the reflectance spectrum at a reflection angle of 5° obtained by injecting light with a wavelength of 350 to 1200 nm at an incident angle of 5° using the VAR unit of the spectrometer V7200 (trade name) manufactured by JASCO Corporation. Specifically, the reflectance of light with a wavelength of 940 nm was used as the evaluation standard, and the evaluation was performed according to the following classification. In addition, in practical terms, an evaluation of "3" or above is preferred. The results are shown in the "Low Reflection" column in Table 5.

<Evaluation criteria> "4": Reflectivity less than 4% "3": Reflectivity 4% or more and less than 5% "2": Reflectivity 5% or more and less than 6% "1": Reflectivity 6% or more

[Evaluation of pattern adhesion] Using a spin coater, each composition of the embodiment and the comparative example was applied to an 8-inch silicon wafer pre-sprayed with hexamethyldisilazane, and a coating film of 5.0 μm was prepared after exposure. Then, the obtained coating film was pre-baked at 100°C for 120 seconds to prepare a substrate with a film. Furthermore, using an i-ray stepper exposure device FPA-i5+ (manufactured by Canon Inc.), the film in the prepared substrate with a film was irradiated at a wavelength of 365 nm through a mask with a 50 μm square island pattern (a mask with 25 50 μm square openings) at an exposure dose of 50 to 1,700 mJ/ ^cm2 . After exposure, the substrate was developed at 25°C for 40 seconds using an alkaline developer CD-2000 (manufactured by FUJIFILM Electronic Materials Co., Ltd.). After rinsing under running water for 30 seconds, the substrate was spray dried to obtain a substrate with a cured film. The obtained 50μm square island pattern was observed from above using a scanning electron microscope (S-9220 manufactured by Hitachi, Ltd.) to measure the number of patterns obtained. The minimum exposure required for all 50μm square island patterns to be closely attached was determined, and the adhesion was evaluated according to the following classification. In addition, in practice, an evaluation of "3" or above is better. The results are shown in the "Adhesion" column in Table 5.

<Evaluation criteria>"4": Minimum exposure is 900mJ/ ^cm2 or less. "3": Minimum exposure is more than 900mJ/ ^cm2 and less than 1700mJ/ ^cm2 . "2": At least one 50μm square island pattern can be formed with an exposure of 50 to 1700mJ/ ^cm2 , but all patterns cannot be formed. "1": At an exposure of 50 to 1700mJ/ ^cm2 , an island pattern of 50μm square cannot be formed.

[Evaluation of development residue (residue in unexposed area)] Using a spin coater, each composition of the embodiment and the comparative example was applied to an 8-inch silicon wafer pre-sprayed with hexamethyldisilazane, and a coating film after exposure was prepared to be 5.0μm. Then, the obtained coating film was pre-baked at 100°C for 120 seconds to prepare a substrate with a film. Furthermore, using an i-ray stepper exposure device FPA-3000i5+ (manufactured by Canon Inc.), the film in the prepared substrate with a film was irradiated with light of a wavelength of 365nm at an exposure amount of 50 to 1,700mJ/ ^cm2 through a pattern mask with 50μm lines and spaces. Next, the exposed film (cured film) was developed using 60% CD-2000 (manufactured by FUJIFILM Electronic Materials Co., Ltd.) developer at 25°C for 60 seconds to obtain a patterned cured film. The patterned cured film was then rinsed with running water for 20 seconds and air-dried. In the above exposure step, the minimum exposure amount at which the line width of the pattern after development in the area irradiated with light becomes 50μm or more was set as the exposure sensitivity, and the exposure sensitivity was set as the initial exposure sensitivity. The cured film obtained with the minimum exposure amount at which the line width of the pattern after development becomes 50μm or more was heated in an oven at 220°C for 1 hour per substrate. After the film was cured by heat, the amount of residue in the area not irradiated with light (unexposed area) was observed in the exposure step on the substrate using SEM (Scanning Electron Microscope, magnification: 20,000 times), and the development residue (unexposed area residue) was evaluated according to the following classification. In addition, for practical purposes, an evaluation of "3" or above is preferred. The results are shown in the "Residue Performance" column in Table 5.

<Evaluation criteria> "4": No pattern was formed, and no residue was observed in the unexposed part. "3": No pattern was formed, and 1 to 10 residues were observed in the unexposed part with a size of 1.0 μm square. "2": No pattern was formed, and more than 11 residues were observed in the unexposed part with a size of 1.0 μm square. "1": Poor development and no pattern was formed.

[Evaluation of storage stability] For each composition of the embodiment and comparative example, the viscosity of the composition immediately after preparation and the viscosity of the composition after standing for 3 days in an environment of 45°C were measured using "RE-85L" manufactured by TOKI SANGYO CO., LTD. In addition, the viscosity measurement was carried out at a temperature adjusted to 25°C. The value of the viscosity difference (ΔVis) before and after standing was calculated, and the storage stability was evaluated according to the following classification. It can be considered that the smaller the value of the viscosity difference (ΔVis), the better the storage stability. The results are shown in the "Storage Stability" column in Table 5.

<Evaluation criteria> "A": Δvis is less than 0.5 mPa·s. "B": Δvis is greater than 0.5 mPa·s and less than 2.0 mPa·s. "C": Δvis is greater than 2.0 mPa·s.

[Table 7] table 5 Low reflectivity Adhesion Residue performance Preserve stability Embodiment 1 4 4 4 A Embodiment 2 3 3 4 A Embodiment 3 3 3 3 A Embodiment 4 4 4 3 A Embodiment 5 4 4 4 A Embodiment 6 4 3 3 A Embodiment 7 3 3 3 A Embodiment 8 4 4 4 A Embodiment 9 4 4 4 A Embodiment 10 4 4 4 A Embodiment 11 4 4 4 A Embodiment 12 4 4 4 A Embodiment 13 4 4 4 A Embodiment 14 4 4 4 A Embodiment 15 4 4 4 A Embodiment 16 4 4 4 A Embodiment 17 3 3 3 A Embodiment 18 4 3 3 A Embodiment 19 4 4 4 A Embodiment 20 4 4 4 A Embodiment 21 4 4 4 A Embodiment 22 4 3 3 A Embodiment 23 4 4 4 A Embodiment 24 4 4 4 A Embodiment 25 4 4 4 A Comparison Example 1 2 2 4 C Comparison Example 2 3 3 2 A Comparison Example 3 1 2 1 A Comparison Example 4 1 1 4 B

From the results shown in Table 5, it was found that the pattern obtained by curing the composition of the example was excellent in adhesion and excellent in low reflectivity to infrared light. In addition, it was confirmed that the composition of the example also produced little development residue.

In addition, from the comparison of the examples, it was confirmed that when the acid value of resin A was 70.0 mgKOH/g or more, the amount of development residue generated by the composition was further reduced (see the results of Examples 3, 4, 6, 7, 17, 18, and 22).

Furthermore, from the comparison of the embodiments, it was confirmed that when the silicon atom content relative to the total mass of the resin A was 17.0 mass % or more, the pattern obtained by curing the composition had a more excellent low reflectivity to infrared light (see the results of Examples 2, 3, 7, and 17).

Furthermore, from the comparison of the examples, it was confirmed that when the double bond valence (C=C valence) of the resin A was 0.35 mmol/g or more, the adhesion of the pattern obtained by curing the composition was more excellent (see the results of Examples 2, 3, 6, 7, 17, 18, and 22).

On the other hand, in the composition of the comparative example, it was confirmed that the expected effect of the present invention was not exhibited.

[Example 26] Resin A-16 was synthesized by using the same raw materials and the same synthesis method as the resin A-1 shown in the upper section, except that the methyl group (equivalent to the non-hydrolyzable group represented by ^RA2 in formula (A2)) bonded to the silicon atom in the repeating unit A of the resin A-1 shown in the upper section was changed to an ethyl group. Next, the composition of Example 26 was prepared by using the same raw materials and the same preparation method as the composition of Example 1, except that the resin A-1 was changed to the above-mentioned resin A-16, and the same evaluation results as those of Example 1 were performed, and the same evaluation results as those of Example 1 were obtained.

without.

Claims (15)

A composition comprising: a resin comprising a repeating unit A having a group represented by formula (A1), a repeating unit B having an acid group, and a repeating unit C having a polymerizable group; a polymerizable compound; and a pigment, Formula (A1) *-Si( ^RA1 ) ₃ wherein ^RA1 represents an alkyl group which may have a substituent, an aryl group which may have a substituent, or a group represented by formula (A2), * represents a bonding position, wherein at least two of the three ^RA1s represent a group represented by formula (A2), Formula (A2) *-OSi( ^RA2 ) ₃ wherein ^RA2 represents a non-hydrolyzable group, * represents a bonding position, and in addition, a plurality of ^RA1s in formula (A1) and a plurality of ^RA2s in formula (A2) may be the same as or different from each other. The composition as claimed in claim 1, wherein the repeating unit C comprises a repeating unit represented by formula (CX2), [Chemical Formula 1] In the formula, R ^C1 represents a hydrogen atom or an alkyl group, L ^C3 represents a divalent linking group, and R ^C2 represents a hydrogen atom or an alkyl group. The composition as claimed in claim 1 or claim 2, wherein the repeating unit A comprises a repeating unit represented by formula (AX1), [Chemical Formula 2] In the formula, ^RA3 represents a hydrogen atom or an alkyl group, ^LA1 represents a single bond, ^-COO- or -CONRA4-, ^RA4 represents a hydrogen atom or an alkyl group, ^LA2 represents a single bond or a divalent linking group, and ^WA1 represents a group represented by the aforementioned formula (A1). The composition as described in claim 1 or claim 2, wherein the acid value of the aforementioned resin is 60 to 170 mgKOH/g. The composition as described in claim 1 or claim 2, wherein the acid value of the aforementioned resin is 70 to 170 mgKOH/g. A composition as described in claim 1 or claim 2, wherein the content of silicon atoms in the resin is 17.0 mass % or more relative to the total mass of the resin. The composition as described in claim 1 or claim 2, wherein the double bond value of the resin is 0.35 mmol/g or more. A composition as described in claim 1 or claim 2, wherein the aforementioned pigment includes a black pigment. The composition as described in claim 8, wherein the black pigment contains titanium oxynitride. The composition as described in claim 1 or claim 2, which is a composition for forming a light-shielding film. A light-shielding film comprising a cured film formed from the composition described in any one of claims 1 to 10. A solid-state imaging device comprising a cured film formed from the composition described in any one of claims 1 to 10. An image display device comprises a cured film formed from the composition described in any one of claims 1 to 10. An infrared sensor comprising a cured film formed from the composition described in any one of claims 1 to 10. A method for manufacturing a hardened film, comprising: a component layer forming step, using the component described in any one of claim 1 to claim 10 to form a component layer on a support; an exposure step, exposing the component layer into a pattern by irradiating activating light or radiation; and a developing step, performing a developing process on the exposed component layer.