TW202417226A - A molding method and structure that integrates various heterogeneous materials by hot pressing - Google Patents
A molding method and structure that integrates various heterogeneous materials by hot pressing Download PDFInfo
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- 239000000463 material Substances 0.000 title claims abstract description 91
- 238000007731 hot pressing Methods 0.000 title claims abstract description 90
- 238000000465 moulding Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000003825 pressing Methods 0.000 claims description 26
- 238000002844 melting Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 13
- 238000010586 diagram Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 238000009434 installation Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000000428 dust Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000003384 small molecules Chemical class 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- -1 water vapor Chemical class 0.000 description 1
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Abstract
一種將多種異質材料利用熱壓方式形成一體化的成型方法及結構,其主要是先提供一熱壓模具,再將一殼體、一蓋板以及一熱壓材料依序置入該熱壓模具後,再通過對該熱壓模具進行加熱加壓,使該熱壓材料在該熱壓模具內熔融後,而將該殼體、該蓋板及該熱壓材料能夠形成一體化設計,並達到簡化工序,進而使其應用在控制面板或操控面板上時,能夠更為有效的達到防水及防塵的效果。 A molding method and structure for integrating multiple heterogeneous materials by hot pressing, which mainly provides a hot pressing mold, and then sequentially places a shell, a cover plate and a hot pressing material into the hot pressing mold, and then heats and presses the hot pressing mold to melt the hot pressing material in the hot pressing mold, and then the shell, the cover plate and the hot pressing material can form an integrated design, and the process is simplified, so that when it is applied to a control panel or an operating panel, it can more effectively achieve the waterproof and dustproof effects.
Description
本發明係關於一種將多種異質材料利用熱壓方式形成一體化的成型方法及結構,以通過熱壓方式將多種異質材料形成一體化,可應用在控制面板或是觸控面板上,使其面板同時兼具防水與防塵的效果。 The present invention relates to a molding method and structure for integrating various heterogeneous materials by hot pressing. Various heterogeneous materials are integrated by hot pressing and can be applied to control panels or touch panels, so that the panels have both waterproof and dustproof effects.
習知的控制面板或是觸控面板,其結構主要是由一上殼體、一下殼體、一面板以及一電路板所組成,並在該上殼體的位置處預留一可供該面板安裝的通孔,再將該面板利用黏著的方式黏著在該通孔的位置處,而該電路板則是安裝在該上殼體與該下殼體之間的安裝空間中,並該面板電性連結,藉以可以通過該面板進行操控。 The known control panel or touch panel is mainly composed of an upper shell, a lower shell, a panel and a circuit board. A through hole is reserved at the position of the upper shell for the panel to be installed. The panel is then glued to the position of the through hole by gluing. The circuit board is installed in the installation space between the upper shell and the lower shell, and the panel is electrically connected so that it can be controlled through the panel.
但當該面板安裝在該上殼體的該通孔位置處時,以往都是利用黏著劑塗佈在該通孔的周圍,與該面板的周緣相互黏著固定,如此一來,當該黏著劑塗佈不均時,除了會影響該面板的平整度外,也容易在該面板與該上殼體之間形成有間隙,造成水氣、水分或灰塵的等細小的分子通過該些間隙進入該上殼體與該下殼體之間的安裝空間中,進而造成電路板的損壞;或造成水氣凝結於面板背部,形成水霧進而影響面板的透視度且殘留於面板內並無法清除。 However, when the panel is installed at the through hole position of the upper shell, adhesive is usually applied around the through hole to adhere and fix the panel to the periphery. In this way, when the adhesive is applied unevenly, in addition to affecting the flatness of the panel, it is also easy to form a gap between the panel and the upper shell, causing small molecules such as water vapor, moisture or dust to pass through these gaps into the installation space between the upper shell and the lower shell, thereby causing damage to the circuit board; or causing water vapor to condense on the back of the panel, forming water mist, thereby affecting the transparency of the panel and remaining in the panel and unable to be removed.
此外,當該上殼體與該下殼體彼此間相互安裝時,一般會在上殼體與下殼體的內部之間安裝有一防水墊圈,其目的主要在防止水氣、 水分或灰塵的等細小的分子經由該上殼體與該下殼體之間的結合處進入安裝空間中,進而達到防水及防塵的效果。 In addition, when the upper shell and the lower shell are mounted on each other, a waterproof gasket is generally installed between the inner parts of the upper shell and the lower shell, the purpose of which is mainly to prevent water vapor, moisture or dust and other small molecules from entering the installation space through the joint between the upper shell and the lower shell, thereby achieving waterproof and dustproof effects.
但,當防水墊圈的尺寸有誤,或是安裝不確實時,同樣的也會在該上殼體與該下殼體之間產生細縫,如此一來同樣的也會失去防水及防塵的效果。 However, when the waterproof gasket is of the wrong size or is not installed correctly, a crack will also be created between the upper shell and the lower shell, which will also lose the waterproof and dustproof effects.
爰此,如何提供一種將多種異質材料利用熱壓方式形成一體化的成型方法及結構,以通過熱壓方式將多種異質材料形成一體化,可應用在控制面板或是觸控面板上,並簡化製造流程以節省工時,同時使其面板同時兼具防水與防塵的效果,即為本案所欲解決的問題。 Therefore, how to provide a molding method and structure that integrates various heterogeneous materials by hot pressing, so that various heterogeneous materials can be integrated by hot pressing, which can be applied to control panels or touch panels, and simplify the manufacturing process to save labor hours, while making the panel waterproof and dustproof at the same time, is the problem that this case aims to solve.
本發明之主要目的在於提供一種將多種異質材料利用熱壓方式形成一體化的成型方法及結構,以通過熱壓方式將多種異質材料形成一體化,可應用在控制面板或是觸控面板上,使其面板同時兼具防水與防塵的效果。 The main purpose of the present invention is to provide a molding method and structure for integrating various heterogeneous materials by hot pressing, so that various heterogeneous materials can be integrated by hot pressing, which can be applied to control panels or touch panels, so that the panels have both waterproof and dustproof effects.
為達成上述之目的,本發明首先提供一種將多種異質材料利用熱壓方式形成一體化的成型方法,該方法包含下列步驟:提供一熱壓模具,該熱壓模具內具有一成型空間,由一上模及一下模所組成,該成型空間由該上模及下模結合後所形成;依序將一殼體、一蓋板及一熱壓材料置入該成型空間中,且該殼體與該蓋板之間形成有一間隙,之後對該熱壓模具進行加熱,並通過該熱壓模具對該熱壓材料進行加壓加熱,當該熱壓材料受到該熱壓模具的加熱與加壓後,使該熱壓材料被熔融後而填充在該成型空間中,同時流動至該殼體的外部,及該殼體與該蓋板之間的該間隙中, 再對該熱壓模具進行冷卻,使該熱壓材料在該成型空間中逐漸冷卻且定型,最後使該熱壓材料被披覆在該殼體的外部並填充在該間隙中,進而通過該熱壓材料將該殼體與該蓋板結合成一體。 To achieve the above-mentioned purpose, the present invention first provides a molding method for integrating a plurality of heterogeneous materials by hot pressing, the method comprising the following steps: providing a hot pressing mold, the hot pressing mold having a molding space therein, the hot pressing mold being composed of an upper mold and a lower mold, the molding space being formed by combining the upper mold and the lower mold; sequentially placing a shell, a cover plate and a hot pressing material into the molding space, and forming a gap between the shell and the cover plate, then heating the hot pressing mold, and passing the hot pressing mold through the hot pressing mold. The hot-pressed material is pressurized and heated. When the hot-pressed material is heated and pressurized by the hot-pressed mold, the hot-pressed material is melted and filled in the molding space, and flows to the outside of the shell and the gap between the shell and the cover plate at the same time. The hot-pressed mold is then cooled, so that the hot-pressed material is gradually cooled and shaped in the molding space. Finally, the hot-pressed material is covered on the outside of the shell and filled in the gap, and the shell and the cover plate are combined into one body through the hot-pressed material.
在一實施例中,其中該殼體是選自塑膠材料或金屬材料其中之一所製成。 In one embodiment, the housing is made of one of a plastic material or a metal material.
在一實施例中,其中該蓋板是選自玻璃、壓克力或PC其中之一所製成。 In one embodiment, the cover is made of one of glass, acrylic or PC.
在一實施例中,其中該熱壓材料是由未經硫化的橡膠(REBBER)所製成。 In one embodiment, the hot-pressed material is made of unvulcanized rubber (REBBER).
在一實施例中,其中該殼體與該蓋板的熔點高於該熱壓材料的熔點,避免該熱壓模具在加熱時,造成該殼體與該蓋板的熔融,以保持該殼體與該蓋板的完整性。 In one embodiment, the melting point of the shell and the cover is higher than the melting point of the hot pressing material, so as to avoid the melting of the shell and the cover when the hot pressing mold is heated, so as to maintain the integrity of the shell and the cover.
在一實施例中,其中該殼體被該熱壓材料所披覆的表面上進一步已預先進行表面處理,已增加該殼體與該熱壓材料之間的接著力。 In one embodiment, the surface of the shell covered by the hot-pressed material has been pre-treated to increase the bonding force between the shell and the hot-pressed material.
為達成上述之目的,本發明另外提供一種將多種異質材料利用熱壓方式形成一體化的結構,該結構包含有:一殼體、一蓋板及一熱壓材料。該殼體具有一外部表面,且該殼體的中央位置處具有一貫穿孔。該蓋板覆蓋在該殼體的該貫穿孔上並與該殼體之間形成有一間隙。該熱壓材料通過加熱與加壓後而披覆在該殼體的外部表面,並填充在該間隙中,已通通過該熱壓材料將該殼體與該蓋板結合為一體。 To achieve the above-mentioned purpose, the present invention further provides a structure that integrates a plurality of heterogeneous materials by hot pressing, and the structure includes: a shell, a cover plate, and a hot pressing material. The shell has an outer surface, and a through hole is provided at the center of the shell. The cover plate covers the through hole of the shell and forms a gap with the shell. The hot pressing material is coated on the outer surface of the shell after heating and pressurizing, and fills in the gap, and the shell and the cover plate are combined into one body by the hot pressing material.
在一實施例中,其中該殼體更具有一內部表面,該殼體在該內部表面上形成有至少一安裝槽,而該安裝槽的底部具有貫穿該殼體的連 通孔,使該熱壓材料能夠通過該外部表面穿過該連通孔後,而延伸至在該安裝槽內。 In one embodiment, the shell further has an inner surface, the shell is formed with at least one mounting groove on the inner surface, and the bottom of the mounting groove has a connecting hole penetrating the shell, so that the hot-pressed material can pass through the outer surface through the connecting hole and extend into the mounting groove.
在一實施例中,其中該殼體上進一步更設置有至少一按壓通孔,該按壓通孔同樣的貫穿該殼體,且該熱壓材料在該按壓通孔的中心位置處形成有一按壓連桿,該按壓連桿延伸穿過該按壓通孔後,凸露於該內表面上。 In one embodiment, the shell is further provided with at least one pressing through hole, the pressing through hole also penetrates the shell, and the hot pressing material forms a pressing connecting rod at the center of the pressing through hole, and the pressing connecting rod extends through the pressing through hole and protrudes on the inner surface.
在一實施例中,其中該殼體上進一步更凹設有一安裝平台,且該貫穿孔位於該安裝平台的中心位置處,並通過該安裝平台將該外部表面區隔成一第一外部表面以及一位置較第一外部表面略低的第二外部表面,該蓋板則覆蓋在該第二外部表面上,且該間隙形成於該第二外部表面與該蓋板之間。 In one embodiment, a mounting platform is further recessed on the housing, and the through hole is located at the center of the mounting platform, and the mounting platform is used to divide the outer surface into a first outer surface and a second outer surface slightly lower than the first outer surface, the cover plate covers the second outer surface, and the gap is formed between the second outer surface and the cover plate.
本發明相較於習知技術具有下列的優點: Compared with the prior art, the present invention has the following advantages:
1.本發明通過該熱壓材料經過加熱加壓後,以模壓的方式將該殼體與該蓋板相互接著成一體,如此一來能夠令該殼體與該蓋板之間不會產生縫隙,且該熱壓材料也能更有效的完整的包覆自該殼體的外部表面上,進而能夠具有更為良好的防水及防塵效果。 1. The present invention heats and presses the hot-pressed material, and then molds the shell and the cover plate to form a whole. This prevents a gap from forming between the shell and the cover plate, and the hot-pressed material can more effectively and completely cover the outer surface of the shell, thereby achieving better waterproof and dustproof effects.
2.該熱壓材料通過該連通孔進入該安裝槽內,而該安裝槽可以採用環狀設計,環繞在整個該殼體的該內部表面上,進而可以取代傳統防水墊圈,以增加該殼體安裝時的防水及防塵效果。 2. The hot-pressed material enters the mounting groove through the connecting hole, and the mounting groove can adopt a ring-shaped design, surrounding the entire inner surface of the shell, thereby replacing the traditional waterproof gasket to increase the waterproof and dustproof effect of the shell during installation.
10:熱壓模具 10: Hot pressing mold
11:上模 11: Upper mold
12:下模 12: Lower mold
13:成型空間 13: Molding space
14:加壓面 14: Pressurized surface
15:模穴 15: Mold cavity
16:支撐平台 16: Support platform
20:殼體 20: Shell
21:貫穿孔 21: Perforation
22:外部表面 22: External surface
23:內部表面 23: Inner surface
24:安裝平台 24: Installation platform
25:第一外部表面 25: First external surface
26:第二外部表面 26: Second external surface
27:安裝槽 27: Mounting slot
28:連通孔 28: Connecting hole
29:按壓通孔 29: Press through the hole
30:蓋板 30: Cover plate
40:熱壓材料 40: Hot pressing material
41:止擋部 41: Stopper
42:按壓連桿 42: Press the connecting rod
50:控制面板 50: Control Panel
51:按壓區域 51: Press area
60:下殼 60: Lower shell
61:側壁 61: Side wall
70:控制盒 70: Control box
80:顯示屏 80: Display screen
圖1為本發明一體化後的剖面示意圖。 Figure 1 is a cross-sectional schematic diagram of the integrated invention.
圖2為本發明該熱壓模具合模前的剖面示意圖。 Figure 2 is a schematic cross-sectional view of the hot pressing mold of the present invention before closing the mold.
圖3為本發明該熱壓模具合模後的剖面示意圖。 Figure 3 is a schematic cross-sectional view of the hot pressing mold after the mold is closed.
圖4為本發明該熱壓模具冷卻後開模的剖面示意圖。 Figure 4 is a cross-sectional schematic diagram of the hot pressing mold of the present invention after cooling and opening the mold.
圖5為應用本發明的第一實施態樣圖。 Figure 5 is a sample diagram of the first implementation of the present invention.
圖6為圖5的剖面示意圖。 Figure 6 is a schematic cross-sectional view of Figure 5.
圖7為圖5的部分放大示意圖。 Figure 7 is a partially enlarged schematic diagram of Figure 5.
圖8為應用本發明的第二實施態樣圖。 Figure 8 is a sample diagram of the second embodiment of the present invention.
圖9為圖8結合後的剖面示意圖。 Figure 9 is a schematic cross-sectional view of Figure 8 after combination.
圖10為圖9的部分放大示意圖。 Figure 10 is a partially enlarged schematic diagram of Figure 9.
圖11為應用本發明的第三實施態樣圖。 Figure 11 is a diagram showing the third embodiment of the present invention.
為使 貴審查委員能更進一步瞭解本發明為達成預定目的所採取之技術、手段及功效,茲例舉較佳可行的實施例,並配合圖式詳細說明如後,相信本發明之目的、特徵與優點,當可由此得一深入且具體之瞭解。 In order to enable the review committee to further understand the technology, means and effects adopted by the present invention to achieve the intended purpose, the best feasible implementation examples are given and detailed descriptions are provided with drawings. It is believed that the purpose, features and advantages of the present invention can be understood in depth and concretely.
如圖1至圖4所示,為本發明一種將多種異質材料利用熱壓方式一體化的成型方法。該成型方法主要是先提供一熱壓模具10,且該熱壓模具10是應用於一熱壓成型機(為習知技術,圖式中未表示)上。該熱壓模具10是由一上模11以及一下模12所組成,當該上模11與該下模12進行合模後,該熱壓模具10內部會形成有一成型空間13。其中該上模11朝向該下模12的方向會形成有一加壓面14,該下模12內則形成有一可依序供一殼體20、一蓋板30以及一熱壓材料40擺放的模穴15,該成型空間13即是通過該加壓面14及該模穴15所組成。而該模穴15則可以依據該殼體20的形狀所設
置而成,藉以能夠令該殼體20更有效的安裝在該模穴15內。
As shown in Figures 1 to 4, a molding method of the present invention is used to integrate a variety of heterogeneous materials by hot pressing. The molding method mainly provides a hot
在本實施例中,該殼體20的中央位置處具有一貫穿孔21,且該殼體20上具有一形成在該貫穿孔21周圍的外部表面22以及一外部表面22相對的內部表面23,該外部表面22與該內部表面23之間形成該殼體20的厚度。值得一提的是,該殼體20上進一步更凹設有一自該外部表面22朝向該內部表面23方向凹設的安裝平台24,該貫穿孔21則是設置在該安裝平台24上,且該外部表面22通過該安裝平台24而被區隔成一第一外部表面25以及一位置較該第一外部表面25略低的第二外部表面26,該第二外部表面26鄰近在該貫穿孔21的周緣,而該第一外部表面25圍繞在該第二外部表面26的周圍。在本實施例中,該殼體20是預先成型的,而該殼體20可以是由金屬材料或是塑膠材料其中之一所預先成型。
In this embodiment, the
該蓋板30則是用以覆蓋在該貫穿孔21上,並與該殼體20的該外部表面22之間形成有一間隙,在本實施例中,該蓋板30主要是設置在該安裝平台24的上方,且該蓋板30的外徑略小於該安裝平台24的內徑,進而能夠使該蓋板30分別與該第一外部表面25與該第二外部表面26之間形成有該間隙,且該蓋板30的表面略高於該第一外部表面25。而該蓋板30也是預先成型,可以由玻璃、PC或是壓克力等其中之一的材料所預先成型。
The
該熱壓材料40則是由未硫化的橡膠(REBBER)所製成,當該熱壓材料40在未置入該成型空間13前,該熱壓材料40在未經過加熱加壓過程前係呈現半固體狀態。
The hot-pressed
當該殼體20、該蓋板30以及該熱壓材料40依序置入該成型空間13時,首先該殼體20會先安裝在該下模12的該模穴15中,再將該蓋板30
置入該模穴15內。為了令該殼體20與該蓋板30之間形成有該間隙,因此,該下模12的該模穴15內進一步更設置有一可穿過該殼體20的該貫穿孔21並用以承載該蓋板30的支撐平台16,該支撐平台16的高度略高於該第二外部表面26但略低於該第一外部表面25,如此一來,當該蓋板30置於該支撐平台16後,會使得該蓋板30與該第一外部表面25及該第二外部表面26之間形成該間隙。接著,在將該熱壓材料40置入該模穴15內,最後在通過該熱壓成型機帶動該上模11,使該上模11朝向該下模12的方向移動,並覆蓋在該下模12上,使該上模11及該下模12形成合模狀態。
When the
值得一提的是,為了能夠保持該殼體20與該蓋板30在成型時的穩定性,該上模11的該加壓面14相對設置在該支撐平台16的位置處,該加壓面14略凸出於該上模11的下表面,使得該加壓面14與該下表面之間形成有一段差,且當該上模11及下模12完成合模作業時,該蓋板30會被夾持在該加壓面14與該支撐平台16之間,並使該蓋板30的外部周緣凸伸於該成型空間13內。因此,當該上模11與該下模12在進行合模作業時,會對該熱壓模具10進行加熱及加壓,而在合模過程中,該上模11會先對該熱壓材料40進行加熱與加壓,使得呈半固體狀態的該熱壓材料40會逐漸在該成型空間13內逐漸熔融,且當完整合模作業時,該熱壓材料40會在該成型空間13內完全得被熔融,並且填充整個該成型空間13,如此一來,暴露在該成型空間13內部的該殼體20的該外部表面22及該蓋板30的外部周緣會完全的被該熱壓材料40給包覆。
It is worth mentioning that in order to maintain the stability of the
最後,當該熱壓模具10冷卻後,該熱壓材料40也會在該成型空間中固化成型,因此當該熱壓模具10進行開模作業時,即可通過該熱壓
材料40將該殼體20與該蓋板30結合成一體。而該熱壓材料40在成型後的厚度,可以依據不同的產品特性,通過改善該熱壓模具10的該成型空間13所獲得。進而,能夠確保該殼體20與該蓋板30之間不會產生縫隙,而使得水氣、水分或灰塵等分子經由該蓋板30及該貫穿孔21之間進入該殼體20內部,從而更為有效的達到防水及防塵的效果。
Finally, when the hot
此外,為了能夠使該熱壓材料40與該殼體20及該蓋板30之間接著時穩定性,本發明會在該殼體20與該蓋板30上被該熱壓材料40包覆的位置處,預先利用介面處理劑(PRIMER)預先進行表面處理,藉以增加該殼體20、該蓋板30及該熱壓材料40之間的接著效果。而在本發明中,該殼體20與該蓋板30的熔點會高於該熱壓材料40的熔點,藉以可以避免該殼體20與該蓋板30在置入該熱壓模具10內進行加溫加壓過程中,不慎造成熔融的現象,以保持該殼體20與該蓋板30的完整性。
In addition, in order to ensure the stability of the connection between the hot
又如圖5至圖7所示,係為一種利用本發明所成型的控制面板50,該控制面板50同樣的是由該殼體20、該蓋板30及該熱壓材料40所一體成形,但該控制面板50主要會在該殼體20的該內部表面23上的周緣,形成有一環繞在該內部表面23的安裝槽27,而該安裝槽27的底部具有至少一貫穿該殼體20的連通孔28,使得該連通孔28能夠貫穿至該第一外部表面25,如此一來,當該熱壓材料40在受到前述的加熱加壓後,除了會包覆在該殼體20的該外部表面22外,也會使得該熱壓材料40通過該連通孔28而填充至在該安裝槽27內,進而在該安裝槽27內形成一止擋部41。由於該安裝槽27是環繞在該內部表面23的周緣,因此當該止擋部41成型後,同樣的該止擋部41會環繞在該殼體20的內部表面23上。
As shown in FIGS. 5 to 7, a
此外,該控制面板50亦可形成有至少一按壓區域51,使得可以在該控制面板50的外部,通過該按壓區域51進行按壓的動作。為了形成該按壓區域51,因此需在該殼體20上預先預留有一按壓通孔29,使得該熱壓材料40在通過加熱加壓的過程中,會在該按壓通孔29中形成有一按壓連桿42,該按壓連桿42穿過該按壓通孔29而延伸至該殼體20的內部。
In addition, the
前述,不論是該止擋部41或是該按壓區域51的成型,都可以藉由在前述該下模12的該模穴15內預留空間而使得該熱壓材料40在受到加熱加壓的狀態下而成型,使得該控制面板50能夠通過該殼體20、該蓋板30及該熱壓材料40在加溫加壓後所一體成型。
As mentioned above, whether the
又如圖8至圖10所示,前述該控制面板50成型後,可用以安裝在一下殼60上,以組構成一控制盒70,其該下殼60的周緣形成有一環繞的側壁61,該側壁61係與該安裝槽27相互對應設置,當該控制面板50與該下殼61相互組裝後,能夠使該側壁61延伸至該安裝槽27內,並使該側壁61的頂端與該安裝槽27內的該止擋部41相互抵靠。
As shown in Figures 8 to 10, after the
值得一提的是,該止擋部41是通過該熱壓材料40所形成,且由橡膠材料所形成,因此當該側壁61的頂端抵靠到該止擋部41後彼此之間能夠緊密的相互抵靠,如此一來,可以有效的防止水分、水氣及灰塵等分子經由該殼體20與該下殼61之間進入該控制盒70內部,進而令該控制盒70具有更為良好的防水及防塵效果。而前述該按壓連桿42則可以延伸至在該控制盒70內部,當該控制盒70內部設至有電路板(為習知技術,圖示中未表示)時,能夠通過該按壓連桿42與該電路板上的按壓開關進行連動。
It is worth mentioning that the
最後如圖11所述,本發明的該蓋板進一步是由玻璃所製成,
並可再該蓋板的下方設置有一顯示屏80,進而使在該蓋板30上通過該顯示屏80而能呈現出畫面。
Finally, as shown in FIG. 11 , the cover plate of the present invention is further made of glass, and a
綜合上述,本發明將多種異質材料利用熱壓方式形成一體化的成型方法及其結構,能夠應用在控制面板50亦或是遙控面板等等區域,藉由一體化的設計,能夠有使得控制面板50或是遙控面板等具有更加良好的防水及防塵效果,其防水效果可達到IP68的等級,同時能夠有效的改善傳統需要黏著等加工步驟,進而簡化製造流程以節省工時,從而大幅的降低生產成本,且該殼體20、該蓋板30及該熱壓材料40之間的一體化設計能夠避免縫隙的產生,進而降低藏汙納垢的問題,因此本發明為一完全與習知不同的結構展現與成型方法。
In summary, the present invention uses a hot pressing method to form a plurality of heterogeneous materials into an integrated molding method and structure, which can be applied to the
以上所述為本發明之較佳實施例之詳細說明與圖式,並非用來限制本發明,本發明之所有範圍應以下述之專利範圍為準,凡專利範圍之精神與其類似變化之實施例與近似結構,皆應包含於本發明之中。 The above is a detailed description and diagram of the preferred embodiment of the present invention, and is not intended to limit the present invention. The entire scope of the present invention shall be subject to the following patent scope. All the spirit of the patent scope and its similar variations and similar structures shall be included in the present invention.
10:熱壓模具 10: Hot pressing mold
11:上模 11: Upper mold
12:下模 12: Lower mold
14:加壓面 14: Pressurized surface
15:模穴 15: Mold cavity
16:支撐平台 16: Support platform
20:殼體 20: Shell
21:貫穿孔 21: Perforation
22:外部表面 22: External surface
23:內部表面 23: Inner surface
24:安裝平台 24: Installation platform
25:第一外部表面 25: First external surface
26:第二外部表面 26: Second external surface
30:蓋板 30: Cover plate
40:熱壓材料 40: Hot pressing material
Claims (10)
Publications (1)
Publication Number | Publication Date |
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TW202417226A true TW202417226A (en) | 2024-05-01 |
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