TW202411707A - Device and method for non-invasive light delivery to a subject - Google Patents

Device and method for non-invasive light delivery to a subject Download PDF

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TW202411707A
TW202411707A TW112132686A TW112132686A TW202411707A TW 202411707 A TW202411707 A TW 202411707A TW 112132686 A TW112132686 A TW 112132686A TW 112132686 A TW112132686 A TW 112132686A TW 202411707 A TW202411707 A TW 202411707A
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laser diode
mhz
optical fiber
infrared laser
light
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TW112132686A
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布蘭克 路易斯 艾伯托 桑塔納
德 桑塔納 伊莉莎白 羅卓奎茲
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加拿大商波利通雷射股份有限公司
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Abstract

A device for non-invasive light delivery to a subject. The device includes a controller disposed in the housing, the controller being electrically connected to the power source; at least one waveform electronics assembly; a plurality of laser diodes disposed in the housing, the plurality of laser diodes being configured to operate in a super-pulsed regime, the controller being configured to operate the plurality of laser diodes with a Megahertz (MHz) modulation and peak power in milliwatts (mW), the plurality of laser diodes including at least one near-infrared laser diode, at least one mid-infrared laser diode, at least one far-infrared laser diode, and at least one visible-range laser diode; a plurality of optical fibers bundled into at least one fiber bundle, a distal end of the at least one fiber bundle being arranged and configured for delivering light from the plurality of optical fibers to the subject.

Description

用於向對象進行非侵入性光傳輸之裝置及方法Device and method for non-invasive light transmission to a subject

本技術係關於用於向一對象進行非侵入性光傳輸之裝置及方法。The present technology relates to devices and methods for non-invasively transmitting light to a subject.

為治療各種病症,已提出用於向一對象傳輸非電離電磁(EM)信號之不同裝置,在一些情況下,程序被稱為光生物調節(PBM)療法。術語低能量雷射療法(LLLT)及雷射生物刺激有時亦用於描述與此等裝置協作而提供之程序。Different devices for delivering non-ionizing electromagnetic (EM) signals to a subject have been proposed for treating a variety of conditions, in some cases the procedure being referred to as photobiomodulation (PBM) therapy. The terms low-level laser therapy (LLLT) and laser biostimulation are also sometimes used to describe procedures provided in conjunction with these devices.

為避免非特異性毒性,複雜疾病(CD)之非手術治療通常依靠靶向單分子靶點之藥劑。然而,患病組織通常可適應一個分子途徑之變動,導致部分或短暫回應,接著為進展或復發。To avoid non-specific toxicity, non-surgical treatments for complex disease (CD) often rely on agents directed against a single molecular target. However, diseased tissues can often adapt to changes in one molecular pathway, resulting in a partial or transient response followed by progression or relapse.

在PBM療法中,裝置通常在一特定靶點相關波長範圍內操作。然而,判定生物結果之信號及受體特性之耦合可能僅針對一組條件為最佳的。In PBM therapy, devices typically operate within a wavelength range relevant to a specific target. However, the coupling of signal and receptor properties that determines the biological outcome may only be optimal for one set of conditions.

因此,所建構之裝置接著可限於一特定條件子集,且各不同治療方案可能需要其自身的裝置。在疾病組織適應時,一特定裝置可能不再足以治療一給定對象。此對於向具有待解決之廣泛範圍之病症之對象提供PBM療法之操作者而言可為昂貴且麻煩的。Therefore, the devices constructed may then be limited to a specific subset of conditions, and each different treatment regimen may require its own device. As disease tissue adapts, a specific device may no longer be adequate to treat a given subject. This can be expensive and cumbersome for operators to provide PBM therapy to subjects with a wide range of conditions to be addressed.

因此,希望提供一種解決此等缺點之至少一些之裝置。Therefore, it would be desirable to provide a device that addresses at least some of these disadvantages.

已基於開發者對與先前技術相關聯之缺點之瞭解來開發本技術之實施例。Embodiments of the present technology have been developed based on the developers' understanding of the shortcomings associated with previous technologies.

在一個態樣中,本技術之各項實施例提供一種能夠以各種波長向一對象提供非侵入性光傳輸之裝置。如本文中所描述之裝置包含在不同波長範圍中、以不同高頻範圍(以百萬赫為數量級)及用不同峰值功率範圍(以毫瓦為數量級)調變之複數個雷射,以及能夠選擇性地啟動及撤銷啟動各雷射以便向該對象提供各種光傳輸型樣之一內部控制器。在至少一些實施例中,可包含複數個雷射之多個組,使得自各組延伸之纖維束可配置於對象之身體之一不同部分上以同時向對象上之多個位置提供光療法。一或多個光療法程式(在本文中被稱為一光產生程式)可經保存至控制器,以便提供經預程式化以用於裝置之臨床或家庭使用之一裝置。在至少一些情況下,與控制器之通信可受限制,使得僅一經核可操作者或程式設計者可修改光療法程式。裝置經組態以向對象提供超脈衝、低功率(mW)光傳輸,其中各雷射以百萬赫(MHz)脈衝率進行調變,特定脈衝率由控制器控制。In one aspect, embodiments of the present technology provide a device capable of providing non-invasive light delivery to a subject at various wavelengths. The device as described herein includes a plurality of lasers modulated in different wavelength ranges, in different high frequency ranges (on the order of millions of hertz), and with different peak power ranges (on the order of milliwatts), and an internal controller capable of selectively activating and deactivating the lasers to provide various light delivery patterns to the subject. In at least some embodiments, multiple groups of the plurality of lasers may be included such that fiber bundles extending from each group may be configured on different parts of the subject's body to provide light therapy to multiple locations on the subject simultaneously. One or more phototherapy programs (referred to herein as a light generation program) can be saved to the controller to provide a device that is pre-programmed for clinical or home use of the device. In at least some cases, communication with the controller can be restricted so that only an approved operator or programmer can modify the phototherapy program. The device is configured to provide ultra-pulsed, low-power (mW) light transmission to a subject, with each laser modulated at a million-hertz (MHz) pulse rate, the specific pulse rate being controlled by the controller.

根據本技術之一個態樣,提供一種用於向一對象進行非侵入性光傳輸之裝置。該裝置包含:一殼體;一電源,其安置於該殼體中;一控制器,其安置於該殼體中,該控制器電連接至該電源;至少一個波形電子器件總成,其安置於該殼體中,該至少一個波形電子器件總成可操作地連接至該電源及該控制器;複數個雷射二極體,其等安置於該殼體中,該複數個雷射二極體之各者可操作地連接至該至少一個波形電子器件總成,該複數個雷射二極體經組態以在一超脈衝體制中操作,該控制器經組態以用一百萬赫(MHz)調變操作該複數個雷射二極體,該複數個雷射二極體包括至少一個近紅外光雷射二極體、至少一個中紅外光雷射二極體、至少一個遠紅外光雷射二極體及至少一個可見光範圍雷射二極體;複數個光纖,其等包含在其之一近端處光學連接至該至少一個近紅外光雷射二極體之至少一個第一光纖、在其之一近端處光學連接至該至少一個中紅外光雷射二極體之至少一個第二光纖、在其之一近端處光學連接至該至少一個遠紅外光雷射二極體之至少一個第三光纖及在其之一近端處光學連接至該至少一個可見光範圍雷射二極體之至少一個第四光纖,該複數個光纖經捆束成至少一個光纖束,該至少一個光纖束自該殼體之一內部延伸至該殼體之一外部,該至少一個光纖束之一遠端經配置及組態以用於將光自該複數個光纖傳輸至該對象,該至少一個光纖束之該遠端至少部分由該複數個光纖之各者之一遠端形成。According to one aspect of the present technology, a device for non-invasive light transmission to a subject is provided. The device includes: a housing; a power source disposed in the housing; a controller disposed in the housing, the controller being electrically connected to the power source; at least one waveform electronic device assembly disposed in the housing, the at least one waveform electronic device assembly being operably connected to the power source and the controller; a plurality of laser diodes disposed in the housing, each of the plurality of laser diodes being operably connected to the power source; and a plurality of laser diodes disposed in the housing. The at least one waveform electronics assembly is connected to the plurality of laser diodes configured to operate in an ultra-pulse regime, the controller being configured to operate the plurality of laser diodes using 1 MHz modulation, the plurality of laser diodes including at least one near infrared laser diode, at least one mid infrared laser diode, at least one far infrared laser diode and at least one visible range laser diode. a plurality of optical fibers, including at least one first optical fiber optically connected at one proximal end thereof to the at least one near-infrared laser diode, at least one second optical fiber optically connected at one proximal end thereof to the at least one mid-infrared laser diode, at least one third optical fiber optically connected at one proximal end thereof to the at least one far-infrared laser diode, and at least one third optical fiber optically connected at one proximal end thereof to the at least one far-infrared laser diode. At least one fourth optical fiber of a visible light range laser diode, the plurality of optical fibers are bundled into at least one optical fiber bundle, the at least one optical fiber bundle extends from an interior of the housing to an exterior of the housing, a far end of the at least one optical fiber bundle is configured and arranged to transmit light from the plurality of optical fibers to the object, the far end of the at least one optical fiber bundle is at least partially formed by a far end of each of the plurality of optical fibers.

在一些實施例中,該控制器包括至少一個儲存媒體及至少一個處理器;且該處理器經組態以執行保存至該儲存媒體之一光產生程式。In some embodiments, the controller includes at least one storage medium and at least one processor; and the processor is configured to execute a light generation program saved to the storage medium.

在一些實施例中,該控制器經組態以根據該光產生程式之指令選擇性地啟動該複數個雷射二極體之各者。In some embodiments, the controller is configured to selectively activate each of the plurality of laser diodes according to instructions of the light generation program.

在一些實施例中,該裝置進一步包含可操作地連接至該控制器之一通信總成,該通信總成經組態以提供來自該控制器之資訊之向外通信。In some embodiments, the device further includes a communication assembly operably connected to the controller, the communication assembly configured to provide outbound communication of information from the controller.

在一些實施例中,該通信總成進一步經組態以接收向內通信,該控制器在經由該通信總成選擇性地連接至一安全通信連接時可選擇性地重新程式化。In some embodiments, the communications assembly is further configured to receive inbound communications, and the controller is selectively reprogrammable when selectively connected to a secure communications connection via the communications assembly.

在一些實施例中,該至少一個波形電子器件總成包含:至少一個波形產生器;至少一個頻率選擇器電路,其可操作地連接至該至少一個波形產生器;及至少一個緩衝電路,其可操作地連接至該至少一個頻率選擇器電路。In some embodiments, the at least one waveform electronic device assembly includes: at least one waveform generator; at least one frequency selector circuit operably connected to the at least one waveform generator; and at least one buffer circuit operably connected to the at least one frequency selector circuit.

在一些實施例中,該至少一個波形電子器件總成包含複數個雷射波形總成;該複數個雷射波形總成之各總成可操作地連接至該複數個雷射二極體之一對應者;且該複數個雷射波形總成之各總成包含:一波形產生器;一頻率選擇器電路,其可操作地連接至該波形產生器;及一緩衝電路,其可操作地連接至該頻率選擇器電路及該複數個雷射二極體之該對應者。In some embodiments, the at least one waveform electronic device assembly includes a plurality of laser waveform assemblies; each of the plurality of laser waveform assemblies is operably connected to a corresponding one of the plurality of laser diodes; and each of the plurality of laser waveform assemblies includes: a waveform generator; a frequency selector circuit, which is operably connected to the waveform generator; and a buffer circuit, which is operably connected to the frequency selector circuit and the corresponding one of the plurality of laser diodes.

在一些實施例中,該至少一個近紅外光雷射二極體包含:一第一近紅外光雷射二極體,其經組態以在自約9.5 MHz至約10 MHz之一脈衝頻率下操作;及一第二近紅外光雷射二極體,其經組態以在自約3 MHz至約3.5 MHz之一脈衝頻率下操作。In some embodiments, the at least one near-infrared laser diode includes: a first near-infrared laser diode configured to operate at a pulse frequency from about 9.5 MHz to about 10 MHz; and a second near-infrared laser diode configured to operate at a pulse frequency from about 3 MHz to about 3.5 MHz.

在一些實施例中,該第一近紅外光雷射二極體具有自約780 nm至約810 nm之一波長範圍選擇之一操作波長。In some embodiments, the first near-infrared laser diode has an operating wavelength selected from a wavelength range of about 780 nm to about 810 nm.

在一些實施例中,該第二近紅外光雷射二極體具有自約904 nm至約945 nm之一波長範圍選擇之一操作波長。In some embodiments, the second near-infrared laser diode has an operating wavelength selected from a wavelength range of about 904 nm to about 945 nm.

在一些實施例中,該至少一個中紅外光雷射二極體經組態以在自約6 MHz至約6.5 MHz之一脈衝頻率下操作。In some embodiments, the at least one mid-infrared laser diode is configured to operate at a pulse frequency from about 6 MHz to about 6.5 MHz.

在一些實施例中,該至少一個中紅外光雷射二極體具有自約1200 nm至約1550 nm之一波長範圍選擇之一操作波長。In some embodiments, the at least one mid-infrared laser diode has an operating wavelength selected from a wavelength range of about 1200 nm to about 1550 nm.

在一些實施例中,該至少一個遠紅外光雷射二極體經組態以在自約7 MHz至約7.5 MHz之一脈衝頻率下操作。In some embodiments, the at least one far infrared laser diode is configured to operate at a pulse frequency from about 7 MHz to about 7.5 MHz.

在一些實施例中,該至少一個遠紅外光雷射二極體具有自約2900 nm至約3200 nm之一波長範圍選擇之一操作波長。In some embodiments, the at least one far infrared laser diode has an operating wavelength selected from a wavelength range of about 2900 nm to about 3200 nm.

在一些實施例中,該至少一個可見光範圍雷射二極體包含:一第一可見光雷射二極體,其經組態以在自約4 MHz至約4.5 MHz之一脈衝頻率下操作;及一第二可見光雷射二極體,其經組態以在自約5 MHz至約5.5 MHz之一脈衝頻率下操作。In some embodiments, the at least one visible range laser diode includes: a first visible light laser diode configured to operate at a pulse frequency from about 4 MHz to about 4.5 MHz; and a second visible light laser diode configured to operate at a pulse frequency from about 5 MHz to about 5.5 MHz.

在一些實施例中,該第一可見光雷射二極體具有自約630 nm至700 nm之一波長範圍選擇之一操作波長;且該第二可見光雷射二極體具有自約570 nm至約600 nm之一波長範圍選擇之一操作波長。In some embodiments, the first visible light laser diode has an operating wavelength selected from a wavelength range of about 630 nm to 700 nm; and the second visible light laser diode has an operating wavelength selected from a wavelength range of about 570 nm to about 600 nm.

在一些實施例中,該裝置進一步包含連接至該至少一個光纖束之該遠端之至少一個黏著墊;且當將該至少一個黏著墊貼附至該對象時,該至少一個黏著墊經組態以定位該至少一個光纖束之該遠端,使得當該裝置在使用中時,來自該複數個雷射二極體之光經傳輸至該對象。In some embodiments, the device further includes at least one adhesive pad connected to the distal end of the at least one optical fiber bundle; and when the at least one adhesive pad is attached to the object, the at least one adhesive pad is configured to position the distal end of the at least one optical fiber bundle so that when the device is in use, light from the plurality of laser diodes is transmitted to the object.

在一些實施例中,該至少一個波形電子器件總成包含複數個波形電子器件總成;該複數個雷射二極體包含複數個二極體群組,該複數個二極體群組之各二極體群組至少包含:一第一近紅外光雷射二極體、一第二近紅外光雷射二極體、一中紅外光雷射二極體、一遠紅外光雷射二極體、一第一可見光範圍雷射二極體及一第二可見光範圍雷射二極體,各二極體群組可操作地連接至該複數個波形電子器件總成之一對應者;該至少一個光纖束包含複數個光纖束;且該複數個光纖束之各光纖束光學連接至該複數個二極體群組之一對應者。In some embodiments, the at least one waveform electronic device assembly includes a plurality of waveform electronic device assemblies; the plurality of laser diodes include a plurality of diode groups, each diode group of the plurality of diode groups includes at least: a first near-infrared laser diode, a second near-infrared laser diode, a mid-infrared laser diode, a far-infrared laser diode, a first visible light range laser diode and a second visible light range laser diode, each diode group is operably connected to a corresponding one of the plurality of waveform electronic device assemblies; the at least one optical fiber bundle includes a plurality of optical fiber bundles; and each optical fiber bundle of the plurality of optical fiber bundles is optically connected to a corresponding one of the plurality of diode groups.

根據本技術之另一態樣,提供一種使用用於非侵入性光傳輸之一裝置向一對象傳輸光之方法,該方法藉由該裝置之一控制器執行,該方法包含:引起至少一個波形電子器件總成產生一方波信號,該裝置之複數個雷射二極體可操作地連接至該至少一個波形電子器件總成以用於接收來自其之該方波信號;自複數個雷射二極體選擇一第一雷射二極體,該複數個雷射二極體包含至少一個近紅外光雷射二極體、至少一個中紅外光雷射二極體、至少一個遠紅外光雷射二極體及至少一個可見光範圍雷射二極體;引起該第一雷射二極體產生光,來自該第一雷射二極體之光藉由該裝置之複數個光纖之一第一光纖傳導至該對象,控制該第一雷射二極體以用一第一百萬赫(MHz)調變進行發射(fire);引起該第一雷射二極體停止產生光;自複數個雷射二極體選擇一第二雷射二極體;引起該第二雷射二極體產生光,該第二雷射二極體為該複數個雷射二極體之與該第一雷射二極體不同之一者,來自該第二雷射二極體之光藉由複數個光纖之一第二光纖傳導至該對象;控制該第二雷射二極體以用一第二MHz調變進行發射;及引起該第二雷射停止產生光。According to another aspect of the present technology, a method for transmitting light to an object using a device for non-invasive light transmission is provided, the method being performed by a controller of the device, the method comprising: causing at least one waveform electronic device assembly to generate a square wave signal, a plurality of laser diodes of the device being operably connected to the at least one waveform electronic device assembly for receiving the square wave signal therefrom; selecting a first laser diode from a plurality of laser diodes, the plurality of laser diodes comprising at least one near infrared laser diode, at least one mid infrared laser diode, at least one far infrared laser diode, and at least one visible light range laser diode; causing the first laser diode to generate a square wave signal; The device is provided with a device for generating light, wherein light from the first laser diode is transmitted to the object through a first optical fiber of a plurality of optical fibers of the device, the first laser diode is controlled to fire with a first million hertz (MHz) modulation; the first laser diode is caused to stop generating light; a second laser diode is selected from the plurality of laser diodes; the second laser diode is caused to generate light, the second laser diode is one of the plurality of laser diodes different from the first laser diode, light from the second laser diode is transmitted to the object through a second optical fiber of the plurality of optical fibers; the second laser diode is controlled to fire with a second MHz modulation; and the second laser is caused to stop generating light.

在一些實施例中,引起該第一雷射二極體產生光包含,回應於選擇該至少一個近紅外光雷射二極體,引起該至少一個近紅外光雷射二極體在以下之一者下操作:自約3 MHz至約3.5 MHz之一脈衝頻率及約9.5 MHz至約10 MHz之一脈衝頻率;回應於選擇該至少一個中紅外光雷射二極體,引起該至少一個中紅外光雷射二極體在自約6 MHz至約6.5 MHz之一脈衝頻率下操作;回應於選擇該至少一個遠紅外光雷射二極體,引起該至少一個遠紅外光雷射二極體在自約7 MHz至約7.5 MHz之一脈衝頻率下操作;及回應於選擇該至少一個可見光範圍雷射二極體,引起該至少一個可見光範圍雷射二極體在以下之一者下操作:自約4 MHz至約4.5 MHz之一脈衝頻率及自約5 MHz至約5.5 MHz之一脈衝頻率。In some embodiments, causing the first laser diode to generate light includes, in response to selecting the at least one near-infrared laser diode, causing the at least one near-infrared laser diode to operate at one of: a pulse frequency from about 3 MHz to about 3.5 MHz and a pulse frequency from about 9.5 MHz to about 10 MHz; in response to selecting the at least one mid-infrared laser diode, causing the at least one mid-infrared laser diode to operate at a pulse frequency from about 6 MHz to about 6.5 MHz; in response to selecting the at least one far-infrared laser diode, causing the at least one far-infrared laser diode to operate at a pulse frequency from about 7 MHz to about 7.5 MHz; and in response to selecting the at least one visible light range laser diode, causing the at least one visible light range laser diode to operate at one of: a pulse frequency from about 4 MHz to about 4.5 MHz and a pulse frequency from about 5 MHz to about 5.5 MHz.

本文中敘述之數量或值意欲指代實際給定值。術語「約」在本文中用於指代將基於一般技術者合理推斷之對此給定值之近似計算,包含此給定值之歸因於實驗及/或量測條件而引起之等效物及近似值。The quantities or values described herein are intended to refer to the actual given values. The term "about" is used herein to refer to the approximation of the given value based on reasonable inferences by one of ordinary skill in the art, including equivalents and approximate values of the given value due to experimental and/or measurement conditions.

本申請案中提供之術語之解釋及/或定義優先於可在以引用的方式併入本文中之任何文件中找到之此等或類似術語之解釋及/或定義。Explanations and/or definitions of terms provided in this application take precedence over explanations and/or definitions of such or similar terms that may be found in any document incorporated herein by reference.

圖中展示之各種元件之功能(包含經標記為一「控制器」之任何功能區塊)可透過使用專用硬體以及能夠執行與適當軟體相關聯之軟體之硬體來提供。當控制器之操作係藉由一處理器提供時,功能可藉由一單個專用處理器,藉由一單個共用處理器,或藉由複數個個別處理器(其等之一些者可經共用)提供。在本技術之一些實施例中,處理器可為一通用處理器,諸如一中央處理單元(CPU),或專用於一特定目的之一處理器,諸如一數位信號處理器(DSP)。此外,術語「處理器」之明確使用不應被解釋為僅指代能夠執行軟體之硬體,且可隱式地包含(但不限於)特定應用積體電路(ASIC)、場可程式化閘陣列(FPGA)、用於儲存軟體之唯讀記憶體(ROM)、隨機存取記憶體(RAM)及非揮發性儲存器。亦可包含其他硬體(習知的及/或客製的)。The functions of the various elements shown in the figures, including any functional blocks labeled as a "controller," may be provided through the use of dedicated hardware as well as hardware capable of executing software in association with appropriate software. When the operation of the controller is provided by a processor, the functions may be provided by a single dedicated processor, by a single shared processor, or by a plurality of individual processors (some of which may be shared). In some embodiments of the present technology, the processor may be a general-purpose processor, such as a central processing unit (CPU), or a processor dedicated to a specific purpose, such as a digital signal processor (DSP). In addition, the explicit use of the term "processor" should not be interpreted as referring only to hardware capable of executing software, and may implicitly include (but not limited to) application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), read-only memories (ROMs) for storing software, random access memories (RAMs), and non-volatile memory. Other hardware (known and/or customized) may also be included.

本文中敘述之實例及條件語言主要旨在幫助讀者理解本技術之原理,而非將其範疇限於此等具體敘述之實例及條件。將瞭解,熟習此項技術者可設計各種系統,該等系統儘管本文中未明確描述或展示,但仍體現本技術之原理。The examples and conditional language described in this article are mainly intended to help readers understand the principles of the present technology, rather than limiting its scope to these specific examples and conditions. It will be understood that those skilled in the art can design various systems that, although not explicitly described or shown in this article, still embody the principles of the present technology.

此外,為幫助理解,以下描述可描述本技術之相對簡化之實施方案。如熟習此項技術者將理解,本技術之各項實施方案可具有一更大複雜性。In addition, to help understanding, the following description may describe relatively simplified implementations of the present technology. As will be appreciated by those skilled in the art, various implementations of the present technology may have greater complexity.

在一些情況下,亦可闡述被視為對本技術之修改之有用實例之內容。此僅為了幫助理解,而不是為了界定本技術之範疇或闡述本技術之界限。此等修改並非一詳盡清單,且熟習此項技術者可進行其他修改,同時仍保持於本技術之範疇內。此外,在未闡述修改之實例的情況下,不應被解釋為不可進行修改及/或所描述之內容係實施本技術之該元件之唯一方式。In some cases, content that is considered to be a useful example of modification of the present technology may also be described. This is only to aid understanding and is not intended to define the scope of the present technology or to describe the boundaries of the present technology. These modifications are not an exhaustive list, and those skilled in the art may make other modifications while still remaining within the scope of the present technology. In addition, where examples of modifications are not described, it should not be interpreted that modifications cannot be made and/or that the content described is the only way to implement the element of the present technology.

此外,本文中敘述本技術之原理、態樣及實施方案以及其特定實例之所有陳述旨在涵蓋其結構等效物及功能等效物兩者,無論其等是否當前已知或在未來開發。Furthermore, all statements herein describing principles, aspects, and embodiments of the technology, as well as specific examples thereof, are intended to encompass both structural and functional equivalents thereof, whether currently known or developed in the future.

在本說明書之上下文中,除非另有明確提供,否則字詞「第一」、「第二」、「第三」等已被用作僅用於容許其等修飾之名詞彼此之間的區分之目的,而非用於描述彼等名詞之間的任何特定關係之目的之形容詞。In the context of the present specification, unless expressly provided otherwise, the words "first", "second", "third" etc. have been used as adjectives for the sole purpose of allowing the nouns they modify to be distinguished from each other, rather than for the purpose of describing any specific relationship between those nouns.

本技術之實施例各具有上述目的及/或態樣之至少一者,但不一定具有其等全部。應理解,由試圖達到上述目的而引起之本技術之一些態樣可能不滿足此目的及/或可能滿足本文中未具體敘述之其他目的。Each embodiment of the present technology has at least one of the above-mentioned purposes and/or aspects, but not necessarily all of them. It should be understood that some aspects of the present technology caused by attempting to achieve the above-mentioned purpose may not meet this purpose and/or may meet other purposes not specifically described herein.

本技術之實施例之額外及/或替代特徵、態樣及優點將自以下描述、隨附圖式及隨附發明申請專利範圍變得顯而易見。Additional and/or alternative features, aspects and advantages of embodiments of the present technology will become apparent from the following description, the accompanying drawings and the accompanying patent claims.

本申請案主張2022年9月6日申請之標題為「Device and Method for Non-Invasive Light Delivery to a Subject」之美國臨時專利申請案第63/403,925號之優先權,該案之全文以引用的方式併入本文中。This application claims priority to U.S. Provisional Patent Application No. 63/403,925, filed on September 6, 2022, entitled “Device and Method for Non-Invasive Light Delivery to a Subject,” the entire text of which is incorporated herein by reference.

參考圖1及圖2,繪示用於向一對象提供非侵入性光傳輸之一裝置100之一項非限制性實施例。雖然如本文中大體上所描述之對象係接收一非侵入性(即,應用於皮膚)、非熱(即,溫度增加<0.01ºC)及非電離光治療之一人類對象,但經考慮,在非限制性情況下,包含其他哺乳動物之動物可為一光接收對象。1 and 2, a non-limiting embodiment of a device 100 for providing non-invasive light delivery to a subject is shown. Although the subject generally described herein is a human subject receiving a non-invasive (i.e., applied to the skin), non-thermal (i.e., temperature increase <0.01°C), and non-ionizing light therapy, it is contemplated that animals, including other mammals, may be a light receiving subject, without limitation.

裝置100包含用於在其中圍封及保護裝置100之組件之一殼體102。如所繪示之殼體102之形狀及審美形式並不意欲為限制性,且考慮各種形式。在至少一些實施例中,殼體102經配置以可選擇性地敞開以便為裝置100之一操作者或程式設計者提供入口(例如)以用於裝置100之維護、修理或調整(諸如重新程式化)。在至少一些實施例中,亦經考慮,殼體102可固定於閉合位置中,以阻礙一最終使用者或對象對內部組件之接取,以便有助於防止干擾內部組件。在一些此等情況下,殼體102可具備固定構件(例如,包含一鎖定機構),以便容許操作者或程式設計者之選擇性接取,同時亦阻礙由最終使用者或對象接取。在至少一些實施例中,殼體102可進一步包含用於冷卻安置於其中之組件之配置,包含(但不限於):通風孔或狹槽、風扇及冷卻系統。The device 100 includes a housing 102 for enclosing and protecting the components of the device 100 therein. The shape and aesthetic form of the housing 102 as depicted are not intended to be limiting, and various forms are contemplated. In at least some embodiments, the housing 102 is configured to be selectively openable to provide access to an operator or programmer of the device 100, for example, for maintenance, repair, or adjustment (such as reprogramming) of the device 100. In at least some embodiments, it is also contemplated that the housing 102 can be secured in a closed position to block access to the internal components by an end user or subject to help prevent interference with the internal components. In some such cases, the housing 102 may have fixed features (e.g., including a locking mechanism) to allow selective access by an operator or programmer while preventing access by an end user or subject. In at least some embodiments, the housing 102 may further include provisions for cooling components disposed therein, including (but not limited to): vents or slots, fans, and cooling systems.

裝置100包含安置於殼體102中之一電源110。電源110根據各種組件之所需電輸入對裝置100之複數個組件提供電力。電源100之特定技術並不意欲為特別受限。取決於實施例,電源110可包含各種電子組件,例如,包含用於輸出在適於由此供電之組件之不同電壓或電流組態中之電力之變壓器。電源110包含用於將裝置100可操作地連接至用於對電源110提供一電力源之一標準電插座之一電插塞112。在至少一些實施例中,此外或替代性地,裝置100可包含一可再充電電池。The device 100 includes a power supply 110 disposed in the housing 102. The power supply 110 provides power to a plurality of components of the device 100 according to the required electrical input of the various components. The specific technology of the power supply 100 is not intended to be particularly limited. Depending on the embodiment, the power supply 110 may include various electronic components, for example, including a transformer for outputting power in different voltage or current configurations suitable for the components powered thereby. The power supply 110 includes an electrical plug 112 for operably connecting the device 100 to a standard electrical outlet for providing a source of power to the power supply 110. In at least some embodiments, the device 100 may additionally or alternatively include a rechargeable battery.

裝置100包含安置於殼體102中且由電源110供電之一控制器120。廣義而言,控制器120管理裝置100之組件之操作,如下文將進一步描述。控制器120可以各種形式實施;用以形成控制器120以管理本文中描述之組件之操作之一電腦實施總成之配置通常假定為在熟習此項技術者之能力內且因此在本文中將不更詳細描述。通常,控制器120包含一或多個儲存媒體122及一或多個處理器124。處理器124經組態以執行一光產生程式(下文進一步描述),該程式經保存至儲存媒體122。The device 100 includes a controller 120 disposed in the housing 102 and powered by the power supply 110. Broadly speaking, the controller 120 manages the operation of the components of the device 100, as will be further described below. The controller 120 can be implemented in a variety of forms; the configuration of a computer-implemented assembly to form the controller 120 to manage the operation of the components described herein is generally assumed to be within the capabilities of those skilled in the art and therefore will not be described in greater detail herein. Typically, the controller 120 includes one or more storage media 122 and one or more processors 124. The processor 124 is configured to execute a light generation program (described further below) that is saved to the storage medium 122.

裝置100進一步包含可操作地連接至控制器120及電源110之一通信總成130。通信總成130經組態以至少提供來自控制器120之資訊之向外通信。例如,通信總成130可經組態以將對象對裝置100之使用之確認(諸如日期及持續時間)發送至一遠端定位之操作者。The device 100 further includes a communication assembly 130 operably connected to the controller 120 and the power source 110. The communication assembly 130 is configured to provide at least outward communication of information from the controller 120. For example, the communication assembly 130 can be configured to send confirmation of the subject's use of the device 100 (such as date and duration) to a remotely located operator.

雖然本文背景中未特別限制,但通信總成130包含可通信地連接至控制器120以用於自控制器120傳輸資訊及將經接收資訊傳送至控制器120之一WiFi路由器/數據機(未展示)。取決於實施例,經考慮,通信模組130可包含各種額外或替代通信組件,包含(但不限於):一通信匯流排、Bluetooth TM模組及硬接線之乙太網路連接模組。無論通信體制之特定選擇如何,但通信總成130通常在一安全通信方法下操作,使得對裝置100之控制限於經核可方(諸如操作者或程式設計者)。在一些實施例中,可限制或阻止傳入通信以防止儲存至控制器120之光產生程式之變更。 Although not particularly limited in the context of this document, the communication assembly 130 includes a WiFi router/modem (not shown) that is communicatively connected to the controller 120 for transmitting information from the controller 120 and transmitting received information to the controller 120. Depending on the embodiment, it is contemplated that the communication module 130 may include a variety of additional or alternative communication components, including (but not limited to): a communication bus, Bluetooth TM module, and hard-wired Ethernet connection module. Regardless of the specific choice of communication system, the communication assembly 130 generally operates under a secure communication method so that control of the device 100 is limited to approved parties (such as operators or programmers). In some embodiments, incoming communications can be restricted or blocked to prevent changes to the light generation program stored to the controller 120.

在至少一些實施例中,通信總成130可進一步經組態以接收向內通信,控制器在經由通信總成130選擇性地連接至一安全通信連接時可選擇性地重新程式化。在一些配置中,裝置100可由一遠端位置操作者撤銷啟動以便阻止最終使用者之誤用。In at least some embodiments, the communication assembly 130 can be further configured to receive inbound communications, and the controller can be selectively reprogrammed when selectively connected to a secure communication connection via the communication assembly 130. In some configurations, the device 100 can be deactivated by a remote location operator to prevent misuse by the end user.

為針對光產生程式產生光,裝置100包含複數個雷射總成140。雖然本實例中繪示四個雷射總成140,但經考慮,裝置100可具有更多或更少總成140,包含少至一個總成140。在下文更詳細描述雷射總成140。To generate light for the light generation process, the device 100 includes a plurality of laser assemblies 140. Although four laser assemblies 140 are shown in this example, it is contemplated that the device 100 may have more or fewer assemblies 140, including as few as one assembly 140. The laser assemblies 140 are described in more detail below.

裝置100包含複數個光纖束165以將藉由雷射總成140產生之光傳播至對象。各光纖束165自雷射總成140之一對應者延伸且可操作地連接至該對應者。明確言之,各光纖束165之一近端連接至雷射總成140之一對應者。各光纖束165自殼體102之一內部延伸至殼體102之一外部。如下文將更詳細描述,各光纖束165係由可操作地連接至對應雷射總成140之複數個光纖160形成。The device 100 includes a plurality of optical fiber bundles 165 to transmit light generated by the laser assembly 140 to an object. Each optical fiber bundle 165 extends from a corresponding one of the laser assemblies 140 and is operably connected to the corresponding one. Specifically, a proximal end of each optical fiber bundle 165 is connected to a corresponding one of the laser assemblies 140. Each optical fiber bundle 165 extends from an interior of the housing 102 to an exterior of the housing 102. As will be described in more detail below, each optical fiber bundle 165 is formed by a plurality of optical fibers 160 operably connected to a corresponding laser assembly 140.

各光纖束165之一遠端經配置及組態以用於將光自光纖160傳輸至對象,光纖束165之遠端至少部分由光纖160之各者之一遠端形成。在所繪示實施例中,各光纖束165之遠端包含連接至其之一黏著墊170。當裝置100在使用中時,黏著墊170在一位置處貼附至對象以根據光產生程式傳輸光。對於具有多個光纖束165及黏著墊170之裝置100 (諸如所繪示實例),黏著墊170可在身體之不同位置處連接至同一對象,以便同時將光傳輸至身體之不同部分。A distal end of each optical fiber bundle 165 is configured and arranged for transmitting light from the optical fiber 160 to the object, and the distal end of the optical fiber bundle 165 is at least partially formed by a distal end of each of the optical fibers 160. In the illustrated embodiment, the distal end of each optical fiber bundle 165 includes an adhesive pad 170 connected thereto. When the device 100 is in use, the adhesive pad 170 is attached to the object at a location to transmit light according to the light generation program. For a device 100 having multiple optical fiber bundles 165 and adhesive pads 170 (such as the illustrated example), the adhesive pad 170 can be connected to the same object at different locations on the body to simultaneously transmit light to different parts of the body.

明確言之,黏著墊170經組態以定位光纖束165之遠端,使得來自雷射總成140之雷射二極體(下文描述)之光經傳輸至對象。藉由將光纖束165之遠端黏著至對象,黏著墊170進一步幫助維持光纖束遠端之定位,以便即使在對象移動(例如)的情況下(在至少一些情況下,在使用裝置100時改良對象之舒適度)仍適當地將光傳輸至對象。Specifically, adhesive pad 170 is configured to position the distal end of optical fiber bundle 165 so that light from a laser diode (described below) of laser assembly 140 is transmitted to the subject. By adhering the distal end of optical fiber bundle 165 to the subject, adhesive pad 170 further helps maintain the positioning of the distal end of the optical fiber bundle so that light is properly transmitted to the subject even if the subject moves, for example (in at least some cases, improving the subject's comfort when using device 100).

取決於實施例,不同構件可與裝置100一起使用或由裝置100所包含以用於保持各光纖束165至對象之定位及/或連接。除了黏著墊170之外或作為其替代,連接或貼附構件可包含(但不限於):袖帶、膠帶、條帶、皮帶、手環及項鏈。雖然本文中未繪示,但經考慮,光纖束165及/或黏著墊170 (或其他連接構件)可包含用以塑形或調節自光纖束165傳輸之光之一或多個光學元件。Depending on the embodiment, different components may be used with or included by the device 100 for maintaining the position and/or connection of each fiber optic bundle 165 to an object. In addition to or as an alternative to the adhesive pad 170, the connection or attachment components may include (but are not limited to): a cuff, a tape, a strap, a belt, a bracelet, and a necklace. Although not shown herein, it is contemplated that the fiber optic bundle 165 and/or the adhesive pad 170 (or other connection components) may include one or more optical elements for shaping or conditioning the light transmitted from the fiber optic bundle 165.

裝置100之一個雷射總成140係在圖3中單獨地且更詳細地繪示。各雷射總成140通常在一給定裝置100內係相同的,且因此,本文中將僅描述總成140之一者。經考慮,在裝置100之至少一些實施例中,在其不同雷射總成140之間可能存在差異。雖然各雷射總成140經繪示為一個經封裝模組,但此僅為了便於圖解;在所考慮之殼體102內之不同雷射總成140之間不存在特定封裝或分離。取決於實施例,可在殼體102中包含(例如)諸如擋板或光束阻擋器之結構,以便限制殼體102內之串擾或雜訊。One laser assembly 140 of the device 100 is shown separately and in more detail in FIG. 3 . Each laser assembly 140 is typically identical within a given device 100, and therefore, only one of the assemblies 140 will be described herein. It is contemplated that in at least some embodiments of the device 100, there may be differences between different laser assemblies 140 thereof. Although each laser assembly 140 is shown as a packaged module, this is for ease of illustration only; there is no particular packaging or separation between different laser assemblies 140 within the housing 102 under consideration. Depending on the embodiment, structures such as baffles or beam stops, for example, may be included in the housing 102 to limit crosstalk or noise within the housing 102.

雷射總成140包含安置於殼體102中之一波形電子器件總成144。波形電子器件總成144可操作地連接至電源110及控制器120。在下文進一步描述波形電子器件總成144之組件及使用。The laser assembly 140 includes a waveform electronics assembly 144 disposed in the housing 102. The waveform electronics assembly 144 is operably connected to the power supply 110 and the controller 120. The components and use of the waveform electronics assembly 144 are further described below.

雷射總成140亦包含安置於殼體102中之複數個雷射二極體152、153、154、155、156、157 (在本文中被稱為二極體152至157)。各雷射二極體152至157個別地且可操作地連接至波形電子器件總成144及控制器120。The laser assembly 140 also includes a plurality of laser diodes 152, 153, 154, 155, 156, 157 (referred to herein as diodes 152-157) disposed in the housing 102. Each laser diode 152-157 is individually and operably connected to the waveform electronics assembly 144 and the controller 120.

藉由本技術,雷射二極體152至157經組態以在一超脈衝體制中操作,其中二極體152至157經操作以依一相對較高脈衝率及一相對較低功率輸出而輸出(「發射」)。明確言之,控制器120經組態以用一百萬赫(MHz)脈衝調變操作雷射二極體152至157。各雷射二極體152至157之MHz調變特定於一給定二極體152至157且係在下文陳述。平均而言,在超脈衝體制中,各雷射二極體152至157產生具有在毫瓦(mW)之範圍內之一功率與通常大於50%之一作用時間循環之輸出脈衝。With the present technique, the laser diodes 152-157 are configured to operate in an ultra-pulse regime, wherein the diodes 152-157 are operated to output ("emit") at a relatively high pulse rate and a relatively low power output. Specifically, the controller 120 is configured to operate the laser diodes 152-157 with one million Hertz (MHz) pulse modulation. The MHz modulation of each laser diode 152-157 is specific to a given diode 152-157 and is described below. On average, in the ultra-pulse regime, each laser diode 152 to 157 produces an output pulse having a power in the milliwatt (mW) range and an on-time cycle that is typically greater than 50%.

術語「超脈衝體制」係指在光生物調節領域中常用之一雷射操作模式。超脈衝操作體制通常經設計為操作一雷射以輸出具有以瓦(W)為單位之一峰值功率、在千赫(kHz)範圍內之一脈衝頻率及以奈秒為單位之一脈衝持續時間(例如,200 ns)之一脈衝信號。例如,在超脈衝體制操作下之此等雷射用於治療傷口愈合、肌肉骨骼疼痛及炎症。應注意,此等超脈衝體制可經設計為在由操作下之一給定雷射(例如,具有以瓦為單位之一峰值功率(例如,10 W至200 W)及<10千赫 (KHz)之一脈衝頻率之雷射二極體)之製造商建立之電子參數之外部操作。藉由將信號分別變更至mW及MHz,可使雷射在電子方面低效。對於本裝置100之至少一些實施例所尋求之生物應用,從生物角度來看,此等信號係高效的。由於以MHz為單位之脈衝降低組織中之阻抗,因此此等經修改信號在達成更大穿透時保持一非熱效應。參見1993年8月3日發佈之Lasb Laser Corp.之美國專利第5,231,984號,該案之全文以引用的方式併入本文中。The term "ultrapulsed regime" refers to a laser operating mode commonly used in the field of photobiomodulation. Ultrapulsed regimes are typically designed to operate a laser to output a pulse signal having a peak power in Watts (W), a pulse frequency in the kilohertz (kHz) range, and a pulse duration in nanoseconds (e.g., 200 ns). For example, such lasers operated under the ultrapulsed regime are used to treat wound healing, musculoskeletal pain, and inflammation. It should be noted that these ultra-pulse regimes can be designed to operate outside of the electronic parameters established by the manufacturer of a given laser under operation (e.g., a laser diode having a peak power in Watts (e.g., 10 W to 200 W) and a pulse frequency of <10 kilohertz (KHz)). The laser can be made electronically inefficient by changing the signal to mW and MHz, respectively. For biological applications sought by at least some embodiments of the present device 100, these signals are efficient from a biological perspective. Because pulses in MHz lower the impedance in tissue, these modified signals remain a non-thermal effect while achieving greater penetration. See U.S. Patent No. 5,231,984, issued August 3, 1993 to Lasb Laser Corp., which is incorporated herein by reference in its entirety.

現將更詳細描述波形電子器件總成144之組件。總成144包含可操作地連接至控制器120之一波形產生器145。在本實施例中,明確言之,波形產生器145 (亦被稱為一信號產生器)係一振盪器145。在其他實施例中,可實施其他類型之信號產生器來代替振盪器145。當裝置100在操作中時,振盪器145提供各雷射二極體152至157之脈衝形狀及作用時間循環。藉由本技術,一方波形式通常係用於提供一開關狀態光照明,其中光以一給定功率傳輸或關閉,但不在彼等狀態之間漸變(ramp)。在至少一些實施例中,振盪器145可經組態以輸出一正弦或鋸齒波形。The components of the waveform electronics assembly 144 will now be described in more detail. The assembly 144 includes a waveform generator 145 operably connected to the controller 120. In the present embodiment, the waveform generator 145 (also referred to as a signal generator) is specifically an oscillator 145. In other embodiments, other types of signal generators may be implemented in place of the oscillator 145. When the device 100 is in operation, the oscillator 145 provides the pulse shape and action time cycle of each laser diode 152 to 157. With the present technology, a square wave form is typically used to provide a switched state light illumination, where the light is either transmitted at a given power or turned off, but does not ramp between those states. In at least some embodiments, oscillator 145 can be configured to output a sinusoidal or sawtooth waveform.

波形電子器件總成144亦包含可操作地連接至振盪器145之一頻率選擇器電路(FSC) 147。FSC 147用以調變自振盪器145接收之信號之信號電壓。明確言之,FSC 147調變信號以將信號之振幅自瓦之數量級減小至毫瓦之數量級,同時將信號頻率自千赫之數量級增加至百萬赫之數量級。頻率選擇器電路147之特定組件可改變,且設想電路147之各種組態。The waveform electronics assembly 144 also includes a frequency selector circuit (FSC) 147 operably connected to the oscillator 145. The FSC 147 is used to modulate the signal voltage of the signal received from the oscillator 145. Specifically, the FSC 147 modulates the signal to reduce the amplitude of the signal from the order of watts to the order of milliwatts while increasing the frequency of the signal from the order of kilohertz to the order of megahertz. The specific components of the frequency selector circuit 147 can be varied, and various configurations of the circuit 147 are contemplated.

FSC 147進一步可操作地連接至控制器120以用於接收來自控制器120之指令。明確言之,FSC 147控制信號自振盪器145至雷射二極體152至157之傳輸,以便根據光產生程式管理雷射二極體152至157之光產生(「發射」)之頻率及功率。在一些實施例中,經考慮,裝置100可包含複數個FSC 147,各雷射二極體152至157一個FSC 147,以便為各雷射二極體152至157提供一單獨控制電路。The FSC 147 is further operably connected to the controller 120 for receiving commands from the controller 120. Specifically, the FSC 147 controls the transmission of signals from the oscillator 145 to the laser diodes 152-157 so as to manage the frequency and power of light generation ("emission") of the laser diodes 152-157 according to the light generation program. In some embodiments, it is contemplated that the device 100 may include a plurality of FSCs 147, one for each laser diode 152-157, so as to provide a separate control circuit for each laser diode 152-157.

波形電子器件總成144亦包含可操作地連接至FSC 147之一緩衝電路149。緩衝電路149在波形信號傳輸至雷射二極體152至157之前提供波形信號之一信號緩衝,以便防止電流尖峰,從而有助於限制對二極體152至157之可能損壞。The waveform electronics assembly 144 also includes a buffer circuit 149 operably connected to the FSC 147. The buffer circuit 149 provides a signal buffering of the waveform signal before the waveform signal is transmitted to the laser diodes 152-157 to prevent current spikes, thereby helping to limit possible damage to the diodes 152-157.

取決於實施例,經考慮,波形電子器件總成144可包含替代或額外組件。例如,在一些實施例中,波形電子器件總成144可包含額外電晶體、電容器等,以便管理信號產生及雷射二極體操作。亦經考慮,額外電子組件可包含於波形電子器件總成144與雷射二極體152至157之間。Depending on the embodiment, it is contemplated that the waveform electronics assembly 144 may include alternative or additional components. For example, in some embodiments, the waveform electronics assembly 144 may include additional transistors, capacitors, etc., in order to manage signal generation and laser diode operation. It is also contemplated that additional electronic components may be included between the waveform electronics assembly 144 and the laser diodes 152-157.

如上文簡要提及,各雷射總成140之光纖束165係由複數個光纖160形成。各光纖160可操作地連接至雷射二極體152至157之一對應者,其中各光纖160之一近端接收來自其對應二極體152至157之光。取決於裝置100之特定實施例及/或取決於雷射二極體152至157之一特定模型,經考慮,可包含任何數目個光纖、孔隙及光學元件。例如,對於IR雷射二極體152至155 (下文描述),可包含一紫外光(UV)阻擋濾光器以防止來自一些類型之IR雷射二極體之UV光透射至對應光纖160中。As briefly mentioned above, the fiber optic bundle 165 of each laser assembly 140 is formed of a plurality of optical fibers 160. Each optical fiber 160 is operably connected to a corresponding one of the laser diodes 152-157, wherein a proximal end of each optical fiber 160 receives light from its corresponding diode 152-157. Depending on the specific embodiment of the device 100 and/or depending on a specific model of the laser diodes 152-157, it is contemplated that any number of optical fibers, apertures, and optical elements may be included. For example, for the IR laser diodes 152-155 (described below), an ultraviolet (UV) blocking filter may be included to prevent UV light from some types of IR laser diodes from being transmitted into the corresponding optical fiber 160.

光纖160之遠端接著形成光纖束165之遠端。在至少一些實施例中,一套筒或可撓性管可安置於光纖160周圍以便形成光纖束165且保護其中之光纖160。亦經考慮,一光阻擋套筒可圍繞光纖束165以防止雜散光自光纖束165散射及/或環境光滲透至光纖束165中。The distal ends of the optical fibers 160 are connected to the distal ends of the optical fiber bundle 165. In at least some embodiments, a sleeve or flexible tube can be placed around the optical fibers 160 to form the optical fiber bundle 165 and protect the optical fibers 160 therein. It is also contemplated that a light blocking sleeve can surround the optical fiber bundle 165 to prevent stray light from scattering from the optical fiber bundle 165 and/or ambient light from penetrating into the optical fiber bundle 165.

如圖4中所繪示,裝置100之另一非限制性實施例之一雷射總成240包含複數個波形電子器件總成144。明確言之,雷射總成240包含用於各雷射二極體152至157之一個波形電子器件總成144。4, a laser assembly 240 of another non-limiting embodiment of the device 100 includes a plurality of waveform electronics assemblies 144. Specifically, the laser assembly 240 includes one waveform electronics assembly 144 for each laser diode 152-157.

參考圖3,將更詳細描述雷射二極體152至157之各雷射之細節。在至少一些實施例中,除了下文描述之二極體之外,雷射總成140亦可包含額外雷射二極體。3, the details of each laser of laser diodes 152-157 will be described in more detail. In at least some embodiments, laser assembly 140 may include additional laser diodes in addition to the diodes described below.

各雷射總成140包含一或多個近紅外光(NIR)雷射二極體。在本實施例中,各雷射總成140包含兩個近紅外光雷射二極體152、153。一第一近紅外光雷射二極體152經組態以在自約9.5 MHz至約10 MHz之一脈衝頻率下操作(如由控制器120控制)。第一近紅外光雷射二極體152具有自約780 nm至約810 nm之一波長範圍選擇之一操作波長。Each laser assembly 140 includes one or more near infrared (NIR) laser diodes. In the present embodiment, each laser assembly 140 includes two NIR laser diodes 152, 153. A first NIR laser diode 152 is configured to operate at a pulse frequency from about 9.5 MHz to about 10 MHz (as controlled by the controller 120). The first NIR laser diode 152 has an operating wavelength selected from a wavelength range of about 780 nm to about 810 nm.

亦包含一第二近紅外光雷射二極體153。第二近紅外光雷射二極體153具有自約904 nm至約945 nm之一範圍選擇之一操作波長。如由控制器120控制,第二近紅外光雷射二極體153經組態以在自約3 MHz至約3.5 MHz之一脈衝頻率下操作。A second near infrared laser diode 153 is also included. The second near infrared laser diode 153 has an operating wavelength selected from a range of about 904 nm to about 945 nm. As controlled by the controller 120, the second near infrared laser diode 153 is configured to operate at a pulse frequency from about 3 MHz to about 3.5 MHz.

各雷射總成140亦包含至少一個中紅外光(MIR)雷射二極體154。如由控制器120控制,中紅外光雷射二極體154經組態以在自約6 MHz至約6.5 MHz之一脈衝頻率下操作。中紅外光雷射二極體154具有自約1200 nm至約1550 nm之波長範圍選擇之一操作波長。Each laser assembly 140 also includes at least one mid-infrared (MIR) laser diode 154. The MIR laser diode 154 is configured to operate at a pulse frequency from about 6 MHz to about 6.5 MHz as controlled by the controller 120. The MIR laser diode 154 has an operating wavelength selected from a wavelength range of about 1200 nm to about 1550 nm.

各雷射總成140進一步包含至少一個遠紅外光(FIR)雷射二極體155。在所繪示實施例中,遠紅外光雷射二極體155具有自約2900 nm至約3200 nm之波長範圍選擇之一操作波長。如由控制器120控制,遠紅外光雷射二極體155經組態以在自約7 MHz至約7.5 MHz之一脈衝頻率下操作。Each laser assembly 140 further includes at least one far infrared (FIR) laser diode 155. In the illustrated embodiment, the far infrared laser diode 155 has an operating wavelength selected from a wavelength range of about 2900 nm to about 3200 nm. As controlled by the controller 120, the far infrared laser diode 155 is configured to operate at a pulse frequency from about 7 MHz to about 7.5 MHz.

各雷射總成140進一步包含一或多個可見光範圍(VIS)雷射二極體。藉由本實施例,雷射總成140包含兩個VIS雷射二極體156、157。一第一可見光雷射二極體156具有自約630 nm至700 nm之波長範圍選擇之一操作波長。如由控制器120控制,第一可見光雷射二極體156經組態以在自約4 MHz至約4.5 MHz之一脈衝頻率下操作。一第二可見光雷射二極體157具有自約570 nm至約600 nm之波長範圍選擇之一操作波長。如由控制器120控制,第二可見光雷射二極體157經組態以在自約5 MHz至約5.5 MHz之一脈衝頻率下操作。Each laser assembly 140 further includes one or more visible range (VIS) laser diodes. By this embodiment, the laser assembly 140 includes two VIS laser diodes 156, 157. A first visible light laser diode 156 has an operating wavelength selected from a wavelength range of about 630 nm to 700 nm. As controlled by the controller 120, the first visible light laser diode 156 is configured to operate at a pulse frequency from about 4 MHz to about 4.5 MHz. A second visible light laser diode 157 has an operating wavelength selected from a wavelength range of about 570 nm to about 600 nm. As controlled by controller 120, second visible light laser diode 157 is configured to operate at a pulse frequency from about 5 MHz to about 5.5 MHz.

如上文所提及,控制器120經組態以根據保存至控制器120之特定光產生程式之指令選擇性地啟動雷射二極體152至157之各者。通常,在光產生程式中之任何給定時刻啟動一個雷射二極體152至157,但雷射二極體152至157之任一給定者之使用之順序、持續時間及重複在不同光產生程式中改變。與波形電子器件總成144及雷射二極體152至157操作連接之控制器120容許對所產生之光進行嚴格控制,包含對各雷射二極體152至157之順序、持續時間及重複之控制。As mentioned above, the controller 120 is configured to selectively activate each of the laser diodes 152-157 according to the instructions of a particular light generation program stored in the controller 120. Typically, one laser diode 152-157 is activated at any given moment in the light generation program, but the sequence, duration, and repetition of use of any given one of the laser diodes 152-157 varies in different light generation programs. The controller 120 in operative connection with the waveform electronics assembly 144 and the laser diodes 152-157 allows for tight control of the light generated, including control of the sequence, duration, and repetition of each laser diode 152-157.

應注意,雖然本文中描述之雷射二極體152至157以一特定順序列出,但雷射二極體152至157之順序不對應於任何特定照明或控制序列或與任何特定照明或控制序列相關。亦應注意,此外,任何特定二極體152至157之實體放置並不意欲推斷對光產生程式之任何特定含義或效應。It should be noted that although the laser diodes 152 to 157 described herein are listed in a particular order, the order of the laser diodes 152 to 157 does not correspond to or relate to any particular illumination or control sequence. It should also be noted that, further, the physical placement of any particular diode 152 to 157 is not intended to infer any particular meaning or effect on the light generation process.

參考圖5,繪示使用裝置100 (即,操作裝置100)向對象傳輸光以進行非侵入性光傳輸之一方法300。方法300係由控制器120執行,但經考慮,方法300之不同部分可在裝置100之不同組件內實施。5, a method 300 for using the device 100 (ie, operating the device 100) to transmit light to an object for non-invasive light transmission is shown. The method 300 is executed by the controller 120, but it is contemplated that different portions of the method 300 may be implemented in different components of the device 100.

方法300以步驟310開始,其中引起波形電子器件總成144產生一方波信號。該方波信號係由波形產生器145產生,其中藉由控制器120至少部分基於光產生程式選擇作用時間循環。The method 300 begins at step 310, where the waveform electronics assembly 144 is caused to generate a square wave signal. The square wave signal is generated by the waveform generator 145, where the action time cycle is selected by the controller 120 based at least in part on the light generation program.

在至少一些實施例中,方法300接著可包含通信至FSC 147以調變信號頻率及振幅以用於藉由雷射二極體152至157之一者之光產生。In at least some embodiments, method 300 may then include communicating to FSC 147 to modulate the signal frequency and amplitude for light generation by one of laser diodes 152-157.

方法300接著以步驟320繼續,其中自雷射二極體152至157選擇一第一雷射二極體。第一雷射僅係指待在方法300之任何給定實施方案中發射之雷射二極體152至157之一第一者,而並非係指對應雷射二極體之任何順序或位置。The method 300 then continues with step 320, where a first laser diode is selected from the laser diodes 152 to 157. First laser refers only to the first of the laser diodes 152 to 157 to fire in any given implementation of the method 300, and does not refer to any order or position of the corresponding laser diodes.

方法300以步驟330繼續,其中引起第一雷射二極體產生光(亦被稱為發射)。方法300接著以步驟340繼續,其中控制第一雷射二極體以用一第一MHz調變進行發射。調變係至少部分基於在程式中選擇之雷射二極體152至157。在一些情況下,特定脈衝率亦可取決於光產生程式之給定實施方案之參數。The method 300 continues with step 330, wherein the first laser diode is caused to generate light (also referred to as emitting). The method 300 then continues with step 340, wherein the first laser diode is controlled to emit with a first MHz modulation. The modulation is based at least in part on the laser diodes 152-157 selected in the program. In some cases, the specific pulse rate may also depend on the parameters of a given implementation of the light generation program.

方法300隨後以步驟350繼續,其中引起第一雷射二極體停止產生光。藉由本技術,雷射二極體152至157之僅一者在一給定時刻發射且因此,在開始雷射二極體152至157之另一者之操作之前,雷射二極體152至157之一者之操作結束。Method 300 then continues with step 350, wherein the first laser diode is caused to cease generating light. With the present technique, only one of the laser diodes 152 to 157 emits at a given time and thus, operation of one of the laser diodes 152 to 157 ends before operation of another of the laser diodes 152 to 157 begins.

方法300以步驟360繼續,其中自雷射二極體152至157選擇一第二雷射二極體,該第二雷射二極體為不同於第一選定二極體之一二極體。第二雷射二極體之選擇係至少部分基於特定光產生程式。The method 300 continues with step 360, where a second laser diode is selected from the laser diodes 152 to 157, the second laser diode being a diode different from the first selected diode. The selection of the second laser diode is based at least in part on a particular light generation process.

方法300以步驟370繼續,其中引起第二雷射二極體產生光。方法300以步驟380繼續,其中控制第二雷射二極體以用一第二MHz調變進行發射。控制第二雷射二極體以用第二MHz調變進行發射包含藉由FSC 147調變至二極體之一輸入信號。調變係至少部分基於在光產生程式中選取為第二雷射二極體之雷射二極體152至157。在一些情況下,特定脈衝率亦可取決於光產生程式之給定實施方案之參數。The method 300 continues with step 370, wherein the second laser diode is caused to generate light. The method 300 continues with step 380, wherein the second laser diode is controlled to emit with a second MHz modulation. Controlling the second laser diode to emit with the second MHz modulation includes modulating an input signal to the diode by FSC 147. The modulation is based at least in part on the laser diode 152-157 selected as the second laser diode in the light generation process. In some cases, the specific pulse rate may also depend on parameters of a given implementation of the light generation process.

方法300以步驟390繼續,其中引起第二雷射停止產生光。當裝置100完成光產生程式時,控制器120停止雷射二極體152至157之操作。The method 300 continues with step 390, wherein the second laser is caused to cease generating light. When the device 100 completes the light generation process, the controller 120 stops the operation of the laser diodes 152-157.

取決於特定光產生程式(控制器120根據其控制雷射二極體152至157),方法300可包含雷射二極體152至157之任何者及/或所有者之發射及結束發射之複數個步驟。Depending on the particular light generation process according to which the controller 120 controls the laser diodes 152 to 157 , the method 300 may include a plurality of steps of emitting and terminating the emission of any and/or all of the laser diodes 152 to 157 .

取決於特定光產生程式,方法300可包含選擇性地啟動雷射二極體152至157之各者。在至少一些程式中,回應於選擇近紅外光雷射二極體152、153之一者,方法300可包含引起對應雷射二極體152、153在以下之一者下操作:自約3 MHz至約3.5 MHz之一脈衝頻率及約9.5 MHz至約10 MHz之一脈衝頻率。Depending on the particular light generation process, method 300 may include selectively activating each of laser diodes 152 to 157. In at least some processes, in response to selecting one of the near infrared laser diodes 152, 153, method 300 may include causing the corresponding laser diode 152, 153 to operate at one of: a pulse frequency from about 3 MHz to about 3.5 MHz and a pulse frequency from about 9.5 MHz to about 10 MHz.

在至少一些程式中,回應於選擇中紅外光雷射二極體154,方法300可包含引起中紅外光雷射二極體154在自約6 MHz至約6.5 MHz之一脈衝頻率下操作。In at least some implementations, in response to selecting the mid-infrared laser diode 154, the method 300 may include causing the mid-infrared laser diode 154 to operate at a pulse frequency from about 6 MHz to about 6.5 MHz.

在至少一些程式中,回應於選擇遠紅外光雷射二極體155,方法300可包含引起遠紅外光雷射二極體155在自約7 MHz至約7.5 MHz之一脈衝頻率下操作。In at least some embodiments, in response to selecting the FIR LD 155, the method 300 may include causing the FIR LD 155 to operate at a pulse frequency from about 7 MHz to about 7.5 MHz.

在至少一些程式中,回應於選擇可見光範圍雷射二極體156、157之一者,方法300可包含引起可見光範圍雷射二極體156、157在以下之一者下操作:自約4 MHz至約4.5 MHz之一脈衝頻率及自約5 MHz至約5.5 MHz之一脈衝頻率。In at least some implementations, in response to selecting one of the visible range laser diodes 156, 157, method 300 may include causing the visible range laser diodes 156, 157 to operate at one of: a pulse frequency from about 4 MHz to about 4.5 MHz and a pulse frequency from about 5 MHz to about 5.5 MHz.

雖然雷射二極體152至157之發射在本文中以一特定順序列出,但雷射二極體152至157之任一者或所有者之使用之實際操作順序並不意欲為如此受限。取決於保存至控制器120之特定光產生程式,各雷射二極體152至157之使用之順序、持續時間、重複及通量(亦被稱為劑量)可改變。Although the firing of the laser diodes 152-157 is listed herein in a particular order, the actual operational order of use of any or all of the laser diodes 152-157 is not intended to be so limited. Depending on the particular light generation program stored in the controller 120, the order, duration, repetition, and flux (also referred to as dose) of use of each laser diode 152-157 may vary.

雖然已參考以一特定順序執行之特定步驟來描述及展示上文描述之實施例,但將理解,在不脫離本技術之教示的情況下,此等步驟可經組合、細分或重新排序。至少一些步驟可並列或串列執行。因此,步驟之順序及分組並非本技術之一限制。Although the embodiments described above have been described and shown with reference to specific steps performed in a specific order, it will be understood that these steps may be combined, subdivided, or reordered without departing from the teachings of the present technology. At least some steps may be performed in parallel or in series. Therefore, the order and grouping of steps is not a limitation of the present technology.

應明確理解,並非本文中提及之所有技術效應需要在本技術之每一項實施例中享有。對本技術之上文描述之實施例之修改及改良可對熟習此項技術者變得顯而易見。前文描述旨在為例示性而非限制性。因此,本技術之範疇旨在僅受隨附發明申請專利範圍之範疇限制。It should be clearly understood that not all technical effects mentioned herein need to be enjoyed in every embodiment of the present technology. Modifications and improvements to the above-described embodiments of the present technology may become apparent to those familiar with the technology. The foregoing description is intended to be illustrative rather than restrictive. Therefore, the scope of the present technology is intended to be limited only by the scope of the accompanying invention application.

100:裝置 102:殼體 110:電源 112:電插塞 120:控制器 122:儲存媒體 124:處理器 130:通信總成 140:雷射總成 144:波形電子器件總成 145:波形產生器/振盪器 147:頻率選擇器電路(FSC) 149:緩衝電路 152:雷射二極體/第一近紅外光(NIR)雷射二極體 153:雷射二極體/第二近紅外光(NIR)雷射二極體 154:雷射二極體/中紅外光(MIR)雷射二極體 155:雷射二極體/遠紅外光(FIR)雷射二極體 156:雷射二極體/可見光範圍(VIS)雷射二極體/第一可見光雷射二極體 157:雷射二極體/可見光範圍(VIS)雷射二極體/第二可見光雷射二極體 160:光纖 165:光纖束 170:黏著墊 240:雷射總成 300:方法 310:步驟 320:步驟 330:步驟 340:步驟 350:步驟 360:步驟 370:步驟 380:步驟 390:步驟 100: device 102: housing 110: power supply 112: electrical plug 120: controller 122: storage medium 124: processor 130: communication assembly 140: laser assembly 144: waveform electronics assembly 145: waveform generator/oscillator 147: frequency selector circuit (FSC) 149: buffer circuit 152: laser diode/first near infrared (NIR) laser diode 153: laser diode/second near infrared (NIR) laser diode 154: laser diode/mid infrared (MIR) laser diode 155: Laser diode/Far infrared (FIR) laser diode 156: Laser diode/Visible light range (VIS) laser diode/First visible light laser diode 157: Laser diode/Visible light range (VIS) laser diode/Second visible light laser diode 160: Optical fiber 165: Optical fiber bundle 170: Adhesive pad 240: Laser assembly 300: Method 310: Step 320: Step 330: Step 340: Step 350: Step 360: Step 370: Step 380: Step 390: Steps

為了更佳理解本技術以及本技術之其他態樣及進一步特徵,參考將結合隨附圖式使用之以下描述,其中:For a better understanding of the present technology and other aspects and further features of the present technology, reference is made to the following description used in conjunction with the accompanying drawings, wherein:

圖1係根據本技術之非限制性實施例之一光傳輸裝置之一透視圖;FIG. 1 is a perspective view of a light transmission device according to a non-limiting embodiment of the present technology;

圖2係圖1之裝置之一示意圖;FIG2 is a schematic diagram of the device of FIG1;

圖3係圖1之裝置之一雷射總成之一示意圖;FIG3 is a schematic diagram of a laser assembly of the device of FIG1 ;

圖4係圖1之裝置之一雷射總成之另一非限制性實施例之一示意圖;及FIG. 4 is a schematic diagram of another non-limiting embodiment of a laser assembly of the device of FIG. 1 ; and

圖5係描繪圖1之裝置之操作之一方法之一流程圖。FIG. 5 is a flow chart depicting a method of operation of the apparatus of FIG. 1 .

亦應注意,除非本文中另有明確指定,否則圖式不按比例繪製。It should also be noted that unless explicitly specified otherwise herein, the drawings are not drawn to scale.

110:電源 110: Power supply

112:電插塞 112: Electrical plug

120:控制器 120: Controller

122:儲存媒體 122: Storage media

124:處理器 124: Processor

130:通信總成 130: Communication assembly

140:雷射總成 140:Laser assembly

165:光纖束 165: Fiber optic bundle

170:黏著墊 170: Adhesive pad

Claims (20)

一種用於向一對象進行非侵入性光傳輸之裝置,該裝置包括: 一殼體; 一電源,其安置於該殼體中; 一控制器,其安置於該殼體中,該控制器電連接至該電源; 至少一個波形電子器件總成,其安置於該殼體中,該至少一個波形電子器件總成可操作地連接至該電源及該控制器; 複數個雷射二極體,其等安置於該殼體中,該複數個雷射二極體之各者可操作地連接至該至少一個波形電子器件總成, 該複數個雷射二極體經組態以在一超脈衝體制中操作,該控制器經組態以用一百萬赫(MHz)調變操作該複數個雷射二極體, 該複數個雷射二極體包括: 至少一個近紅外光雷射二極體, 至少一個中紅外光雷射二極體, 至少一個遠紅外光雷射二極體,及 至少一個可見光範圍雷射二極體; 複數個光纖,其等包括: 至少一個第一光纖,該至少一個第一光纖在其之一近端處光學連接至該至少一個近紅外光雷射二極體, 至少一個第二光纖,該至少一個第二光纖在其之一近端處光學連接至該至少一個中紅外光雷射二極體, 至少一個第三光纖,該至少一個第三光纖在其之一近端處光學連接至該至少一個遠紅外光雷射二極體,及 至少一個第四光纖,該至少一個第四光纖在其之一近端處光學連接至該至少一個可見光範圍雷射二極體, 該複數個光纖經捆束成至少一個光纖束,該至少一個光纖束自該殼體之一內部延伸至該殼體之一外部, 該至少一個光纖束之一遠端經配置及組態以用於將光自該複數個光纖傳輸至該對象,該至少一個光纖束之該遠端至少部分由該複數個光纖之各者之一遠端形成。 A device for non-invasively transmitting light to a subject, the device comprising: a housing; a power source disposed in the housing; a controller disposed in the housing, the controller electrically connected to the power source; at least one waveform electronics assembly disposed in the housing, the at least one waveform electronics assembly operably connected to the power source and the controller; a plurality of laser diodes disposed in the housing, each of the plurality of laser diodes operably connected to the at least one waveform electronics assembly, the plurality of laser diodes being configured to operate in an ultra-pulse regime, the controller being configured to operate the plurality of laser diodes with MHz modulation, the plurality of laser diodes comprising: at least one near-infrared laser diode, at least one mid-infrared laser diode, at least one far-infrared laser diode, and at least one visible range laser diode; a plurality of optical fibers, comprising: at least one first optical fiber, the at least one first optical fiber optically connected to the at least one near-infrared laser diode at one of its proximal ends, at least one second optical fiber, the at least one second optical fiber optically connected to the at least one mid-infrared laser diode at one of its proximal ends, at least one third optical fiber, the at least one third optical fiber optically connected to the at least one far-infrared laser diode at one of its proximal ends, and At least one fourth optical fiber, the at least one fourth optical fiber optically connected to the at least one visible light range laser diode at a proximal end thereof, the plurality of optical fibers are bundled into at least one optical fiber bundle, the at least one optical fiber bundle extends from an interior of the housing to an exterior of the housing, a distal end of the at least one optical fiber bundle is configured and arranged for transmitting light from the plurality of optical fibers to the object, the distal end of the at least one optical fiber bundle being at least partially formed by a distal end of each of the plurality of optical fibers. 如請求項1之裝置,其中: 該控制器包括至少一個儲存媒體及至少一個處理器;且 該處理器經組態以執行保存至該儲存媒體之一光產生程式。 The device of claim 1, wherein: the controller includes at least one storage medium and at least one processor; and the processor is configured to execute a light generating program stored in the storage medium. 如請求項2之裝置,其中該控制器經組態以根據該光產生程式之指令選擇性地啟動該複數個雷射二極體之各者。A device as claimed in claim 2, wherein the controller is configured to selectively activate each of the plurality of laser diodes based on instructions of the light generating program. 如請求項1之裝置,其進一步包括可操作地連接至該控制器之一通信總成,該通信總成經組態以提供來自該控制器之資訊之向外通信。The device of claim 1, further comprising a communication assembly operably connected to the controller, the communication assembly being configured to provide outward communication of information from the controller. 如請求項4之裝置,其中該通信總成進一步經組態以接收向內通信,該控制器在經由該通信總成選擇性地連接至一安全通信連接時可選擇性地重新程式化。A device as claimed in claim 4, wherein the communication assembly is further configured to receive inbound communications, and the controller is selectively reprogrammable when selectively connected to a secure communication connection via the communication assembly. 如請求項1之裝置,其中該至少一個波形電子器件總成包括: 至少一個波形產生器; 至少一個頻率選擇器電路,其可操作地連接至該至少一個波形產生器;及 至少一個緩衝電路,其可操作地連接至該至少一個頻率選擇器電路。 The device of claim 1, wherein the at least one waveform electronic device assembly comprises: at least one waveform generator; at least one frequency selector circuit operably connected to the at least one waveform generator; and at least one buffer circuit operably connected to the at least one frequency selector circuit. 如請求項1之裝置,其中: 該至少一個波形電子器件總成包括複數個雷射波形總成; 該複數個雷射波形總成之各總成可操作地連接至該複數個雷射二極體之一對應者;且 該複數個雷射波形總成之各總成包括: 一波形產生器, 一頻率選擇器電路,其可操作地連接至該波形產生器,及 一緩衝電路,其可操作地連接至該頻率選擇器電路及該複數個雷射二極體之該對應者。 The device of claim 1, wherein: the at least one waveform electronics assembly comprises a plurality of laser waveform assemblies; each of the plurality of laser waveform assemblies is operably connected to a corresponding one of the plurality of laser diodes; and each of the plurality of laser waveform assemblies comprises: a waveform generator, a frequency selector circuit operably connected to the waveform generator, and a buffer circuit operably connected to the frequency selector circuit and the corresponding one of the plurality of laser diodes. 如請求項1之裝置,其中該至少一個近紅外光雷射二極體包括: 一第一近紅外光雷射二極體,其經組態以在自約9.5 MHz至約10 MHz之一脈衝頻率下操作;及 一第二近紅外光雷射二極體,其經組態以在自約3 MHz至約3.5 MHz之一脈衝頻率下操作。 The device of claim 1, wherein the at least one near-infrared laser diode comprises: a first near-infrared laser diode configured to operate at a pulse frequency from about 9.5 MHz to about 10 MHz; and a second near-infrared laser diode configured to operate at a pulse frequency from about 3 MHz to about 3.5 MHz. 如請求項8之裝置,其中該第一近紅外光雷射二極體具有自約780 nm至約810 nm之一波長範圍選擇之一操作波長。The device of claim 8, wherein the first near-infrared laser diode has an operating wavelength selected from a wavelength range of about 780 nm to about 810 nm. 如請求項8之裝置,其中該第二近紅外光雷射二極體具有自約904 nm至約945 nm之一波長範圍選擇之一操作波長。The device of claim 8, wherein the second near-infrared laser diode has an operating wavelength selected from a wavelength range of about 904 nm to about 945 nm. 如請求項1之裝置,其中該至少一個中紅外光雷射二極體經組態以在自約6 MHz至約6.5 MHz之一脈衝頻率下操作。The device of claim 1, wherein the at least one mid-infrared laser diode is configured to operate at a pulse frequency from about 6 MHz to about 6.5 MHz. 如請求項11之裝置,其中該至少一個中紅外光雷射二極體具有自約1200 nm至約1550 nm之一波長範圍選擇之一操作波長。The device of claim 11, wherein the at least one mid-infrared laser diode has an operating wavelength selected from a wavelength range of about 1200 nm to about 1550 nm. 如請求項1之裝置,其中該至少一個遠紅外光雷射二極體經組態以在自約7 MHz至約7.5 MHz之一脈衝頻率下操作。The device of claim 1, wherein the at least one far infrared laser diode is configured to operate at a pulse frequency from about 7 MHz to about 7.5 MHz. 如請求項13之裝置,其中該至少一個遠紅外光雷射二極體具有自約2900 nm至約3200 nm之一波長範圍選擇之一操作波長。A device as in claim 13, wherein the at least one far infrared laser diode has an operating wavelength selected from a wavelength range of about 2900 nm to about 3200 nm. 如請求項1之裝置,其中該至少一個可見光範圍雷射二極體包括: 一第一可見光雷射二極體,其經組態以在自約4 MHz至約4.5 MHz之一脈衝頻率下操作;及 一第二可見光雷射二極體,其經組態以在自約5 MHz至約5.5 MHz之一脈衝頻率下操作。 The device of claim 1, wherein the at least one visible light range laser diode comprises: a first visible light laser diode configured to operate at a pulse frequency from about 4 MHz to about 4.5 MHz; and a second visible light laser diode configured to operate at a pulse frequency from about 5 MHz to about 5.5 MHz. 如請求項15之裝置,其中: 該第一可見光雷射二極體具有自約630 nm至700 nm之一波長範圍選擇之一操作波長;且 該第二可見光雷射二極體具有自約570 nm至約600 nm之一波長範圍選擇之一操作波長。 The device of claim 15, wherein: the first visible light laser diode has an operating wavelength selected from a wavelength range of about 630 nm to 700 nm; and the second visible light laser diode has an operating wavelength selected from a wavelength range of about 570 nm to about 600 nm. 如請求項1之裝置,其進一步包括: 至少一個黏著墊,其連接至該至少一個光纖束之該遠端;且 其中: 當將該至少一個黏著墊貼附至該對象時,該至少一個黏著墊經組態以定位該至少一個光纖束之該遠端,使得當該裝置在使用中時,來自該複數個雷射二極體之光經傳輸至該對象。 The device of claim 1, further comprising: at least one adhesive pad connected to the distal end of the at least one optical fiber bundle; and wherein: when the at least one adhesive pad is attached to the object, the at least one adhesive pad is configured to position the distal end of the at least one optical fiber bundle so that when the device is in use, light from the plurality of laser diodes is transmitted to the object. 如請求項1之裝置,其中: 該至少一個波形電子器件總成包含複數個波形電子器件總成; 該複數個雷射二極體包含複數個二極體群組,該複數個二極體群組之各二極體群組至少包括: 一第一近紅外光雷射二極體, 一第二近紅外光雷射二極體, 一中紅外光雷射二極體, 一遠紅外光雷射二極體, 一第一可見光範圍雷射二極體,及 一第二可見光範圍雷射二極體, 各二極體群組可操作地連接至該複數個波形電子器件總成之一對應者; 該至少一個光纖束包含複數個光纖束;且 該複數個光纖束之各光纖束光學連接至該複數個二極體群組之一對應者。 The device of claim 1, wherein: the at least one waveform electronic device assembly comprises a plurality of waveform electronic device assemblies; the plurality of laser diodes comprises a plurality of diode groups, each diode group of the plurality of diode groups comprises at least: a first near-infrared laser diode, a second near-infrared laser diode, a mid-infrared laser diode, a far-infrared laser diode, a first visible light range laser diode, and a second visible light range laser diode, each diode group is operably connected to a corresponding one of the plurality of waveform electronic device assemblies; the at least one optical fiber bundle comprises a plurality of optical fiber bundles; and Each of the plurality of optical fiber bundles is optically connected to a corresponding one of the plurality of diode groups. 一種使用用於非侵入性光傳輸之一裝置向一對象傳輸光之方法,該方法藉由該裝置之一控制器執行,該方法包括: 引起至少一個波形電子器件總成產生一方波信號,該裝置之複數個雷射二極體可操作地連接至該至少一個波形電子器件總成以用於接收來自其之該方波信號; 自複數個雷射二極體選擇一第一雷射二極體,該複數個雷射二極體包括: 至少一個近紅外光雷射二極體, 至少一個中紅外光雷射二極體, 至少一個遠紅外光雷射二極體,及 至少一個可見光範圍雷射二極體; 引起該第一雷射二極體產生光,來自該第一雷射二極體之光藉由該裝置之複數個光纖之一第一光纖傳導至該對象, 控制該第一雷射二極體以用一第一百萬赫(MHz)調變進行發射; 引起該第一雷射二極體停止產生光; 自複數個雷射二極體選擇一第二雷射二極體; 引起該第二雷射二極體產生光,該第二雷射二極體為該複數個雷射二極體之與該第一雷射二極體不同之一者,來自該第二雷射二極體之光藉由複數個光纖之一第二光纖傳導至該對象; 控制該第二雷射二極體以用一第二MHz調變進行發射;及 引起該第二雷射停止產生光。 A method for transmitting light to an object using a device for non-invasive light transmission, the method being performed by a controller of the device, the method comprising: causing at least one waveform electronics assembly to generate a square wave signal, a plurality of laser diodes of the device being operably connected to the at least one waveform electronics assembly for receiving the square wave signal therefrom; selecting a first laser diode from a plurality of laser diodes, the plurality of laser diodes comprising: at least one near infrared laser diode, at least one mid infrared laser diode, at least one far infrared laser diode, and at least one visible range laser diode; Causing the first laser diode to generate light, the light from the first laser diode being transmitted to the object through a first optical fiber of a plurality of optical fibers of the device, Controlling the first laser diode to emit with a first million hertz (MHz) modulation; Causing the first laser diode to stop generating light; Selecting a second laser diode from the plurality of laser diodes; Causing the second laser diode to generate light, the second laser diode being one of the plurality of laser diodes different from the first laser diode, the light from the second laser diode being transmitted to the object through a second optical fiber of the plurality of optical fibers; Controlling the second laser diode to emit with a second MHz modulation; and Causing the second laser to stop generating light. 如請求項19之方法,其中引起該第一雷射二極體產生光包括: 回應於選擇該至少一個近紅外光雷射二極體,引起該至少一個近紅外光雷射二極體在以下之一者下操作:自約3 MHz至約3.5 MHz之一脈衝頻率及約9.5 MHz至約10 MHz之一脈衝頻率; 回應於選擇該至少一個中紅外光雷射二極體,引起該至少一個中紅外光雷射二極體在自約6 MHz至約6.5 MHz之一脈衝頻率下操作; 回應於選擇該至少一個遠紅外光雷射二極體,引起該至少一個遠紅外光雷射二極體在自約7 MHz至約7.5 MHz之一脈衝頻率下操作;及 回應於選擇該至少一個可見光範圍雷射二極體,引起該至少一個可見光範圍雷射二極體在以下之一者下操作:自約4 MHz至約4.5 MHz之一脈衝頻率及自約5 MHz至約5.5 MHz之一脈衝頻率。 The method of claim 19, wherein causing the first laser diode to generate light comprises: In response to selecting the at least one near-infrared laser diode, causing the at least one near-infrared laser diode to operate at one of: a pulse frequency from about 3 MHz to about 3.5 MHz and a pulse frequency from about 9.5 MHz to about 10 MHz; In response to selecting the at least one mid-infrared laser diode, causing the at least one mid-infrared laser diode to operate at a pulse frequency from about 6 MHz to about 6.5 MHz; In response to selecting the at least one far-infrared laser diode, causing the at least one far-infrared laser diode to operate at a pulse frequency from about 7 MHz to about 7.5 MHz; and In response to selecting the at least one visible range laser diode, causing the at least one visible range laser diode to operate at one of: a pulse frequency from about 4 MHz to about 4.5 MHz and a pulse frequency from about 5 MHz to about 5.5 MHz.
TW112132686A 2022-09-06 2023-08-30 Device and method for non-invasive light delivery to a subject TW202411707A (en)

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