TW202407064A - Polysiloxane filler treating agent and compositions prepared therewith - Google Patents
Polysiloxane filler treating agent and compositions prepared therewith Download PDFInfo
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- 239000000203 mixture Substances 0.000 title claims abstract description 44
- 239000000945 filler Substances 0.000 title claims abstract description 33
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 13
- -1 Polysiloxane Polymers 0.000 title description 8
- 229920001296 polysiloxane Polymers 0.000 title description 5
- 239000002245 particle Substances 0.000 claims abstract description 25
- 150000001875 compounds Chemical class 0.000 claims description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 8
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 7
- 229920002554 vinyl polymer Polymers 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- RREGISFBPQOLTM-UHFFFAOYSA-N alumane;trihydrate Chemical compound O.O.O.[AlH3] RREGISFBPQOLTM-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 230000002902 bimodal effect Effects 0.000 claims description 2
- 238000009826 distribution Methods 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- 238000009472 formulation Methods 0.000 abstract description 20
- 238000001125 extrusion Methods 0.000 description 15
- 239000000463 material Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000013523 DOWSIL™ Substances 0.000 description 3
- 229920013731 Dowsil Polymers 0.000 description 3
- 238000005481 NMR spectroscopy Methods 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000011068 loading method Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-MICDWDOJSA-N Trichloro(2H)methane Chemical compound [2H]C(Cl)(Cl)Cl HEDRZPFGACZZDS-MICDWDOJSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000010954 inorganic particle Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 150000004684 trihydrates Chemical class 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- QCAWEPFNJXQPAN-UHFFFAOYSA-N methoxyfenozide Chemical compound COC1=CC=CC(C(=O)NN(C(=O)C=2C=C(C)C=C(C)C=2)C(C)(C)C)=C1C QCAWEPFNJXQPAN-UHFFFAOYSA-N 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000003534 oscillatory effect Effects 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000001542 size-exclusion chromatography Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 238000010626 work up procedure Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/44—Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/04—Compounds of zinc
- C09C1/043—Zinc oxide
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/40—Compounds of aluminium
- C09C1/407—Aluminium oxides or hydroxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/12—Treatment with organosilicon compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
本發明係關於一種基於聚矽氧烷之填料處理劑及其在導熱配方中之應用。The present invention relates to a filler treatment agent based on polysiloxane and its application in thermal conductive formulations.
對導熱複合材料之需求的增加推動導熱配方的發現,導熱配方為積體電路、電池組、微電子電路系統、及電動馬達提供更均勻且更高效的散熱。習知導熱配方之主要組分係基質聚合物、無機填料粒子、及填料處理劑(filler treating agent, FTA)。無機粒子係導熱配方中便宜的組分,且提供散熱。因此,所欲的是將高水平的填料粒子裝載並均勻地分散至基質聚合物中;然而,均勻分散具有挑戰性,因為填料粒子通常與基質聚合物不相容,導致相分離。具有與基質聚合物及填料粒子兩者相容的化學功能之FTA藉由與無機粒子之表面締合,促進相容性並改善填料粒子與基質之分散性。市售FTA之實例係單三甲氧基矽基氧基封端之聚二甲基矽氧烷,其係由下式表示: (參見US 7,592,383 B2,第6欄)。不幸地,雖然此類別以及其他結構類似的FTA係高性能的,但因為其等係藉由需要使用有毒試劑及溶劑之多步驟合成程序及許多純化步驟製備,其等係非常昂貴的。因此,在用於導熱配方之相容劑之技術領域中,發現具有可接受性能特性(包括擠壓流量、擠出速率、及黏度)之相對低成本的FTA將係有利的。 Increased demand for thermally conductive composite materials has driven the discovery of thermally conductive formulations that provide more even and efficient heat dissipation for integrated circuits, battery packs, microelectronic circuit systems, and electric motors. The main components of conventional thermal conductive formulations are matrix polymer, inorganic filler particles, and filler treating agent (FTA). Inorganic particles are inexpensive components of thermally conductive formulations and provide heat dissipation. Therefore, what is desired is a high level of loading and uniform dispersion of filler particles into the matrix polymer; however, uniform dispersion is challenging because filler particles are often incompatible with the matrix polymer, leading to phase separation. FTA, which has a chemical function that is compatible with both the matrix polymer and the filler particles, promotes compatibility and improves the dispersion of the filler particles and the matrix by associating with the surface of the inorganic particles. An example of a commercially available FTA is monotrimethoxysiloxy-terminated polydimethylsiloxane, which is represented by the following formula: (See US 7,592,383 B2, column 6). Unfortunately, although this and other structurally similar FTA's are high performing, they are very expensive because they are prepared through multi-step synthetic procedures and numerous purification steps that require the use of toxic reagents and solvents. Therefore, in the art of compatibilizers for thermally conductive formulations, it would be advantageous to find relatively low-cost FTAs with acceptable performance characteristics, including extrusion flow, extrusion rate, and viscosity.
本發明藉由提供由包含下列之組成物來解決本領域之需求: a) 聚有機矽氧烷; b) 填料粒子;及 c) 式I之填料處理劑: I 其中m係5至150;n係1至3;p係0至3;q係0至8;各R 1獨立地係C 1-C 6-烷基、乙烯基、苯基、或苄基;各R 1 '獨立地係C 1-C 6-烷基; R 2係: 其中r係0至5;s係0或1;t係0至15;各R 3獨立地係C 1-C 6-烷基;a係1至3之整數;其中該聚有機矽氧烷具有在40至800之範圍內的聚合度。 The present invention solves the needs in the art by providing a composition comprising: a) polyorganosiloxane; b) filler particles; and c) filler treatment agent of formula I: I wherein m is 5 to 150; n is 1 to 3; p is 0 to 3; q is 0 to 8; each R 1 is independently C 1 -C 6 -alkyl, vinyl, phenyl, or benzyl ; Each R 1 ' is independently C 1 -C 6 -alkyl; R 2 is: wherein r is 0 to 5; s is 0 or 1; t is 0 to 15; each R 3 is independently C 1 -C 6 -alkyl; a is an integer from 1 to 3; wherein the polyorganosiloxane has Degree of polymerization in the range of 40 to 800.
本發明之組成物可用作導熱配方。The compositions of the present invention can be used as thermally conductive formulations.
本發明係一種組成物,其包含: a) 聚有機矽氧烷; b) 填料粒子;及 c) 式I之填料處理劑: I 其中m係5至150;n係1至3;p係0至3;q係0至8;各R 1獨立地係C 1-C 6-烷基、乙烯基、苯基、或苄基;各R 1 '獨立地係C 1-C 6-烷基; R 2係: 其中r係0至5;s係0或1;t係0至15;各R 3獨立地係C 1-C 6-烷基;a係1至3之整數;且虛線表示與伸烷基之附接點;其中該聚有機矽氧烷具有在40至800之範圍內的聚合度。 The present invention is a composition, which includes: a) polyorganosiloxane; b) filler particles; and c) filler treatment agent of formula I: I wherein m is 5 to 150; n is 1 to 3; p is 0 to 3; q is 0 to 8; each R 1 is independently C 1 -C 6 -alkyl, vinyl, phenyl, or benzyl ; Each R 1 ' is independently C 1 -C 6 -alkyl; R 2 is: Where r is 0 to 5; s is 0 or 1; t is 0 to 15; each R 3 is independently C 1 -C 6 -alkyl; a is an integer from 1 to 3; and the dotted line represents the relationship with the alkylene group Point of attachment; wherein the polyorganosiloxane has a degree of polymerization in the range of 40 to 800.
式I之FTA係隨機共聚物;也就是說,具有下標m、n、及p之結構單元不需要依式I中所描繪之順序。較佳地,m係20或50至較佳地125;較佳地,n係1或1.5或1.8至3或至2.5或至2.2;p係0至3或至2或至1或至0.5;q係1或2至6或至4;各R 1較佳地獨立地係C 1-C 6-烷基,更佳地甲基或乙基,且最佳地甲基;R 3較佳地係甲基或乙基,更佳地甲基;a較佳地係2或3,更佳地3。 FTA of Formula I is a random copolymer; that is, the structural units with subscripts m, n, and p need not be in the order depicted in Formula I. Preferably, m ranges from 20 or 50 to preferably 125; preferably, n ranges from 1 or 1.5 or 1.8 to 3 or to 2.5 or to 2.2; p ranges from 0 to 3 or to 2 or to 1 or to 0.5; q is 1 or 2 to 6 or to 4; each R 1 is preferably independently C 1 -C 6 -alkyl, more preferably methyl or ethyl, and most preferably methyl; R 3 is preferably It is methyl or ethyl, more preferably methyl; a is preferably 2 or 3, more preferably 3.
在一個態樣中,R 2係由以下基團表示: 其中t係0或1或2或3。 In one aspect, R 2 is represented by: where t is 0 or 1 or 2 or 3.
在另一態樣中,R 2係由以下基團表示: 其中q + t在0或1或3或5至20或至14或至9之範圍內。 In another aspect, R 2 is represented by: where q + t is in the range of 0 or 1 or 3 or 5 to 20 or to 14 or to 9.
本發明之填料處理劑可藉由以下製備:使式Ia之化合物: 其中x係n + p;與下式Ib之化合物接觸: 其係在鉑催化劑之存在下及在高溫下,以形成式I之化合物,其中R 2係: The filler treatment agent of the present invention can be prepared by making a compound of formula Ia: where x is n + p; in contact with a compound of formula Ib: It is in the presence of a platinum catalyst and at high temperature to form a compound of formula I, wherein R 2 is:
填料處理劑亦可藉由以下製備:使式Ic之化合物: 其中x係n + p;與式Id之化合物接觸: 其係在鉑催化劑之存在下及在高溫下,以形成式I之化合物,其中s係0,且y係0至25。 Filler treatment agents can also be prepared by making compounds of formula Ic: where x is n + p; in contact with a compound of formula Id: This is done in the presence of a platinum catalyst and at high temperature to form a compound of formula I, where s is 0 and y is 0 to 25.
聚有機矽氧烷可用例如一或多個可交聯基團官能化,諸如末端乙烯基。此類官能化聚有機矽氧烷之實例包括單乙烯基-二-C 1-C 6-烷基封端之聚矽氧烷及雙(乙烯基-二-C 1-C 6-烷基)封端之聚矽氧烷,更具體而言,雙(乙烯基-二甲基)封端之聚矽氧烷,其可如US 4,329,273中所述製備。 Polyorganosiloxanes may be functionalized, for example, with one or more crosslinkable groups, such as terminal vinyl groups. Examples of such functionalized polyorganosiloxanes include monovinyl-di-C 1 -C 6 -alkyl terminated polysiloxanes and bis(vinyl-di-C 1 -C 6 -alkyl) End-capped polysiloxane, more specifically bis(vinyl-dimethyl) end-capped polysiloxane, which can be prepared as described in US 4,329,273.
填料粒子係金屬、金屬氧化物、金屬水合物、或陶瓷氮化物粒子,諸如鋁、氧化鋁(aluminum oxide/alumina)、三水合鋁、氮化硼、或氧化鋅粒子。填料粒子之D 50粒徑(如使用HELOS雷射繞射裝置所判定)一般在0.5 µm至100 µm之範圍內。第一及第二填料粒子之多峰(例如雙峰)分布可用於配方中以提高填料粒子濃度。 Filler particles are metal, metal oxide, metal hydrate, or ceramic nitride particles, such as aluminum, aluminum oxide/alumina, aluminum trihydrate, boron nitride, or zinc oxide particles. The D50 particle size of filler particles (as determined using a HELOS laser diffraction device) is generally in the range of 0.5 µm to 100 µm. Multimodal (eg, bimodal) distributions of first and second filler particles can be used in formulations to increase filler particle concentration.
以組成物之重量計,聚有機矽氧烷濃度較佳地在1.9或5 wt.%至15或至10 wt.%之範圍內;以組成物之重量計,FTA濃度較佳地在0.1或0.2或0.3 wt.%至3或至1或至0.7或至0.5 wt.%之範圍內;且以組成物之重量計,填料裝載量較佳地在70或80或85或90 wt.%至98或至94 wt.%之範圍內。已發現本發明之經調配之組成物具有有利的擠壓流速、黏度、擠出速率、及導熱率。 實例 粒徑排阻層析方法 Based on the weight of the composition, the polyorganosiloxane concentration is preferably in the range of 1.9 or 5 wt.% to 15 or 10 wt.%; based on the weight of the composition, the FTA concentration is preferably in the range of 0.1 or In the range of 0.2 or 0.3 wt.% to 3 or to 1 or to 0.7 or to 0.5 wt.%; and based on the weight of the composition, the filler loading is preferably 70 or 80 or 85 or 90 wt.% to Within the range of 98 or to 94 wt.%. The formulated compositions of the present invention have been found to have advantageous extrusion flow rates, viscosity, extrusion rates, and thermal conductivities. Example size exclusion chromatography method
SEC分離係在具有Agilent 1260 Infinity II等度泵、多管柱恆溫器、集成除氣器、自動取樣器、及折射率偵測器之液相層析儀上執行。系統配備有兩個PLgel Mixed A管柱(300 × 7.5 mm i.d.,粒徑= 20 µm)及保護管柱(50 × 7.5 mm i.d.)。管柱烘箱及折射率偵測器在40℃下操作。樣本注射體積係100 µL,且分離係使用THF作為洗提液以1.0 mL/min之流速執行。將儀器用580至371,000 Da之十個窄分散度聚苯乙烯標準品校準。使用Agilent GPC/SEC軟體套件A.02.01版(Build 9.34851)進行數據分析。 NMR光譜方法 SEC separations were performed on a liquid chromatograph with an Agilent 1260 Infinity II isocratic pump, multi-column thermostat, integrated degasser, autosampler, and refractive index detector. The system is equipped with two PLgel Mixed A columns (300 × 7.5 mm i.d., particle size = 20 µm) and a guard column (50 × 7.5 mm i.d.). The column oven and refractive index detector were operated at 40°C. The sample injection volume was 100 µL, and the separation was performed using THF as eluent at a flow rate of 1.0 mL/min. The instrument was calibrated using ten narrow dispersion polystyrene standards ranging from 580 to 371,000 Da. Data analysis was performed using Agilent GPC/SEC software suite version A.02.01 (Build 9.34851). NMR spectroscopy methods
NMR光譜法係使用配備有5-mm Prodigy BBO CryoProbe之Bruker Avance III HD 500光譜儀(Billerica, MA)執行。質子光譜係用10 s之脈衝重複延遲取得。化學位移係相對於CDCl3之殘餘溶劑質子(δ 1H, 7.26 ppm)記述。 實例A –填料處理劑之製備 NMR spectroscopy was performed using a Bruker Avance III HD 500 spectrometer (Billerica, MA) equipped with a 5-mm Prodigy BBO CryoProbe. Proton spectra were obtained with a pulse repetition delay of 10 s. Chemical shifts are expressed relative to the residual solvent protons of CDCl3 (δ 1 H, 7.26 ppm). Example A – Preparation of Filler Treatment Agent
將式Ia'之共聚物及式Ib'之化合物在室溫下以乙烯基與Si-H基團之1:1莫耳比混合。將卡斯特催化劑(Karstedt's catalyst)(基於乙烯基為0.1 mol%)添加至混合物中,且將溫度升至120℃。在2 h之後,使混合物冷卻至室溫,之後將反應混合物用CHCl 3稀釋並通過活性碳/矽藻土過濾。移除於聚合物溶液中之揮發性物質,且將產物藉由SEC及NMR表徵。 實例B –填料處理劑之製備 The copolymer of formula Ia' and the compound of formula Ib' are mixed at room temperature in a 1:1 molar ratio of vinyl groups to Si-H groups. Karstedt's catalyst (0.1 mol% based on vinyl) was added to the mixture and the temperature was raised to 120°C. After 2 h, the mixture was allowed to cool to room temperature, after which the reaction mixture was diluted with CHCl and filtered through activated carbon/celite. Volatile materials in the polymer solution were removed, and the products were characterized by SEC and NMR. Example B – Preparation of Filler Treatment Agent
將式Ic'之共聚物及式Id'之化合物在室溫下以乙烯基與Si-H基團之1:1莫耳比混合,且反應、後處理、及表徵係如實例A中所述進行。 實例C、D、E –填料處理劑之製備 The copolymer of formula Ic' and the compound of formula Id' were mixed at room temperature in a 1:1 molar ratio of vinyl to Si-H groups, and the reaction, work-up, and characterization were as described in Example A conduct. Examples C, D, E – Preparation of Filler Treatment Agent
將式Ie'及式Ib'之化合物在室溫下以乙烯基與Si-H基團之3:1、3:2、及1:1莫耳與莫耳比混合,以製備實例C、D、及E。 實例1至5及比較例1 –含有FTA之配方之製備 Compounds of Formula Ie' and Formula Ib' were mixed at room temperature in 3:1, 3:2, and 1:1 molar to molar ratios of vinyl to Si-H groups to prepare Examples C, D , and E. Examples 1 to 5 and Comparative Example 1 - Preparation of Formulations Containing FTA
配方係藉由以下製備:將FTA (0.23 g)與DOWSIL ™2-7287乙烯基二甲基封端之聚二甲基矽氧烷(5.31 g,黏度= 80 cP,The Dow Chemical Company或其子公司之商標)及DOWSIL ™CV-119乙烯基二甲基封端之聚二甲基矽氧烷(1.79 g,黏度= 450 cP)在Max-10混合杯中組合,並以2000 rpm之速度混合30 s。接著,將此摻合物與SB 36三水合氧化鋁(7.07 g, D 50= 25 µm)在Max-40混合杯中組合,並以1300 rpm之速度混合30 s。將Maxfil MX200三水合氧化鋁(35.57 g, D 50= 45 µm)添加至配方中並以1300 rpm之速度混合30 s。接著,將經調配之材料手動混合,接著再次以1300 rpm混合30 s,接著轉移至玻璃罐中,並在150℃下在真空下加熱1 h。材料之總填料裝載量係85.3 wt.%及69.7 vol%。 擠壓流量之測量 The formulation was prepared by combining FTA (0.23 g) with DOWSIL ™ 2-7287 vinyldimethyl-terminated polydimethylsiloxane (5.31 g, viscosity = 80 cP, The Dow Chemical Company or its subsidiary Company trademark) and DOWSIL ™ CV-119 vinyldimethyl-terminated polydimethylsiloxane (1.79 g, viscosity = 450 cP) were combined in a Max-10 mixing cup and mixed at 2000 rpm 30 seconds. Next, this blend was combined with SB 36 alumina trihydrate (7.07 g, D 50 = 25 µm) in a Max-40 mixing cup and mixed at 1300 rpm for 30 s. Maxfil MX200 alumina trihydrate (35.57 g, D 50 = 45 µm) was added to the formula and mixed at 1300 rpm for 30 s. Next, the prepared materials were mixed manually, then mixed again at 1300 rpm for 30 s, then transferred to a glass jar and heated under vacuum at 150 °C for 1 h. The total filler loading of the material was 85.3 wt.% and 69.7 vol%. Measurement of extrusion flow
擠壓流量測試係用以將含有FTA樣本之測試配方之流動性如下表徵:將導熱測試配方(0.6 g)夾在兩個載玻片(25 × 7 5 × 1.0 mm,獲自Thermofisher)之間,並由兩個1-mm墊片隔開以控制厚度。將頂部載玻片手動壓下以確保材料均勻散布,且將材料之初始直徑記錄為D 1。接著,自測試樣本移除1-mm間隔物,且將350-g質量置於頂部玻璃上並使其靜置1 min。將擠壓後直徑記錄為D 2,且擠壓流量係計算為ΔR = (D 2– D 1)/2 (mm)。 在0.1%應變下之黏度之測量 The squeeze flow test was used to characterize the flowability of test formulations containing FTA samples as follows: The thermal conductivity test formulation (0.6 g) was sandwiched between two glass slides (25 × 75 × 1.0 mm, obtained from Thermofisher) , and separated by two 1-mm spacers to control thickness. The top slide was manually pressed down to ensure even spread of material, and the initial diameter of the material was recorded as D1 . Next, the 1-mm spacer was removed from the test sample, and a 350-g mass was placed on the top glass and allowed to sit for 1 min. The diameter after extrusion is recorded as D 2 , and the extrusion flow rate is calculated as ΔR = (D 2 – D 1 )/2 (mm). Measurement of viscosity at 0.1% strain
對測試配方樣本執行振盪剪切應變振幅掃描,以表徵配方黏度及剪切稀化(shear thinning)行為。使用25-mm平行板幾何形狀將測試配方樣本裝載至Anton Paar高通量流變儀(AP HT流變儀)上。藉由自動修整機器人以1.0-mm間隙執行修整。在300-s測試前浸泡時間之後,測量係使用10 rad/s振盪頻率之標準程序進行,自0.01至300%應變振幅進行掃描,每十倍頻程(decade)有20個取樣點。記述在0.1%應變下之黏度(低剪切速率黏度)。 擠出速率之測量 Oscillatory shear strain amplitude scans were performed on test formulation samples to characterize formulation viscosity and shear thinning behavior. Test formulation samples were loaded onto an Anton Paar High Throughput Rheometer (AP HT Rheometer) using a 25-mm parallel plate geometry. Trimming is performed with a 1.0-mm gap by an automatic trimming robot. After a 300-s pre-test soak time, measurements were performed using a standard procedure with an oscillation frequency of 10 rad/s, scanning from 0.01 to 300% strain amplitude, with 20 sampling points per decade. Describe the viscosity at 0.1% strain (low shear rate viscosity). Measurement of extrusion rate
藉由將凝膠配方裝入30-mL EFD注射器中測量擠出速率。接著,將注射器附接至EFD施配設備,且將材料在氮氣下以55 Psi施配5 s。擠出速率係記錄為在5-s施配期期間施配之質量,如使用分析天平所判定。 導熱率測量 Extrusion rates were measured by filling gel formulations into 30-mL EFD syringes. Next, the syringe was attached to the EFD dispensing equipment and the material was dispensed under nitrogen at 55 Psi for 5 s. Extrusion rate was recorded as the mass dispensed during the 5-s dosing period, as determined using an analytical balance. Thermal conductivity measurement
導熱率係使用Hot Disk瞬態平面熱源工具(TPS 2500S)及Kapton封裝之熱探針測量。等向主體測量係在6 mm直徑容器上執行。Thermal conductivity was measured using a Hot Disk transient planar heat source tool (TPS 2500S) and a thermal probe in a Kapton package. Isotropic body measurements were performed on 6 mm diameter vessels.
表1說明熱凝膠樣本之擠壓流量(S.F,以mm計)、在0.1%應變下之黏度(Visc.,以Pa·s計)、及55 psi下之擠出速率(E.R.,以g/5 s計)。RMS-759係指DOWSIL
™RMS-759單三甲氧基矽氧基-二甲基矽氧烷聚合物(The Dow Chemical Company或其子公司之商標),其係比較例1中所使用之FTA。所有配方之導熱率係在2.3 W/m·K下測量。
表1 –熱凝膠樣本之特性
實例1至5配方皆展現出可接受的擠壓流量、在0.1%應變下之黏度、擠出速率、及導熱率。相較於商業配方(C1),擠出速率顯著改善。本發明之配方亦受益於製備FTA之容易度。The formulations of Examples 1 to 5 all exhibited acceptable extrusion flow, viscosity at 0.1% strain, extrusion rate, and thermal conductivity. The extrusion rate is significantly improved compared to the commercial formulation (C1). The formulations of the present invention also benefit from the ease of preparing FTA.
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