TW202406442A - Cooling system for providing low-pressure boiling and vaporization of coolant by controlling pipe switching - Google Patents

Abstract

A cooling system for providing low-pressure boiling and vaporization of coolant by controlling pipe switching is provided. Close instruction is generated according to operating temperature signal by control device and valve of first inflow air export is controlled to close by close instruction and valve of first outflow air entrance is controlled to close by close instruction. Open instruction is generated by control device and valve of second inflow air export is controlled to open by open instruction and valve of second outflow air export is controlled to open by open instruction. Vacuum device is activated to reduce air pressure in airflow pipe to form low pressure state with time. Boiling point of the cooling liquid in air flow pipe is lowered to make cooling liquid boil and vaporize rapidly to provide heat dissipation to the heat source device. The improve efficiency of heat dissipation for low pressure boiling and vaporization of coolant through control pipe switching may be achieved.

Description

A cooling system that provides low-pressure boiling and vaporization of coolant by controlling pipe switching

A heat dissipation system, in particular, refers to a heat dissipation system that provides low-pressure boiling and vaporization of coolant to improve heat dissipation efficiency by controlling pipe switching.

In terms of heat dissipation technology for high-calorific electronic products, liquid cooling is currently the mainstream. Because the boundary layer of liquid flows is thinner than that of gas and the heat conduction coefficient is higher than that of gas, liquid cooling system seems to have the advantage of heat dissipation technology. However, from the perspective of environmental protection and biological toxicity, liquid cooling systems have inherent shortcomings. In order to prevent freezing and corrosion, the liquid ethylene glycol, propylene glycol or fluorinated liquid used in the liquid cooling system is toxic to the human body or can cause the greenhouse effect.

In summary, it can be seen that there has long been a problem in the prior art that the coolant used in the liquid cooling system is toxic and requires further treatment of the waste liquid. Therefore, it is necessary to propose improved technical means to solve this problem. .

In view of the problem in the prior art that the coolant used in the liquid-cooled heat dissipation system is toxic and requires further treatment of the waste liquid, the present invention discloses a heat dissipation system that provides low-pressure boiling vaporization of the coolant by controlling pipeline switching, wherein:

The heat dissipation system disclosed by the present invention provides low-pressure boiling and vaporization of coolant by controlling pipeline switching, which includes: a vortex tube device, an inflow solenoid valve, a heat source device, a vacuum device, a first outflow solenoid valve, a second outflow solenoid valve, a mist chemical devices and control devices.

The vortex tube device has a gas inlet and a cryogenic gas outlet.

The inflow solenoid valve has an inflow gas inlet, a first inflow gas outlet and a second inflow gas outlet. The inflow gas inlet is connected to the low-temperature gas outlet. The valve opening range of the first inflow gas outlet is controlled according to the valve command, and the first inflow gas outlet is controlled according to the closing command. The valve of the gas outlet is closed, and the valve of the second inflow gas outlet is controlled to open according to the opening command.

The heat source device has a heat source gas inlet and a heat source gas outlet. The heat source gas inlet is connected to the first inflow gas outlet. The heat source device provides an operating temperature signal.

The vacuum device has a first vacuum gas inlet, a second vacuum gas inlet and a vacuum gas outlet. The first vacuum gas inlet is connected to the second inflow gas outlet, and the second vacuum gas inlet is connected to the heat source gas outlet.

The first outflow solenoid valve has a first outflow gas inlet and a first outflow gas outlet. The first outflow gas inlet is connected to the heat source gas outlet and the second vacuum gas inlet, and controls the valve of the first outflow gas inlet to close according to the closing command.

The second outflow solenoid valve has a second outflow gas inlet and a second outflow gas outlet. The second outflow gas inlet is connected to the vacuum gas outlet, and controls the opening of the valve of the second outflow gas inlet according to the opening command.

The atomizing device is connected to the first inflow gas outlet and the heat source gas inlet. The atomizing device adds atomized cooling liquid to the air flow pipe according to the start command. The atomizing device stops adding the atomized cooling liquid to the air flow according to the stop command. pipeline.

The control device is electrically connected to the inflow solenoid valve, the first outflow solenoid valve, the second outflow solenoid valve, the heat source device and the atomization device respectively. The control device obtains the working temperature signal from the heat source device, and the control device generates a valve command based on the working temperature signal. , close the command or open the command.

When the valve of the first inflow gas outlet is closed and the valve of the first outflow gas inlet is closed, and the valve of the second inflow gas outlet is opened and the valve of the second outflow gas inlet is opened, the vacuum device is activated so that the air pressure in the gas flow pipe increases with time. The reduction creates a low-pressure state, thereby lowering the boiling point of the coolant in the air flow pipe so that the coolant rapidly boils and vaporizes to provide heat dissipation for the heat source device.

The difference between the system disclosed by the present invention and the prior art is that the control device generates a closing command to control the closing of the valve of the first inflow gas outlet and the closing of the valve of the first outflow gas inlet based on the operating temperature signal, and the control device generates a control With the command to open the valve of the second inflow gas outlet and the valve of the second outflow gas inlet, the vacuum device is started to reduce the air pressure in the air flow pipe over time to form a low pressure state, thereby reducing the boiling point of the coolant in the air flow pipe. The coolant quickly boils and vaporizes to dissipate heat from the heat source device.

Through the above technical means, the present invention can achieve the technical effect of providing low-pressure boiling vaporization of coolant to improve heat dissipation efficiency by controlling pipeline switching.

The embodiments of the present invention will be described in detail below with reference to the drawings and examples, so that the implementation process of how to apply technical means to solve technical problems and achieve technical effects of the present invention can be fully understood and implemented accordingly.

The following will first describe the heat dissipation system disclosed in the present invention that provides low-pressure boiling and vaporization of coolant through control pipe switching, and please refer to "Figure 1". "Figure 1" illustrates the present invention's control pipe switching to provide Provides a system architecture diagram of a cooling system for low-pressure boiling and vaporization of coolant.

The heat dissipation system disclosed by the present invention provides low-pressure boiling and vaporization of coolant by controlling pipeline switching, which includes: a vortex tube device 10, an inflow solenoid valve 20, a heat source device 30, a vacuum device 40, a first outflow solenoid valve 50, a second Outflow the solenoid valve 60, the atomization device 70 and the control device 80.

The vortex tube device 10 has a gas inlet 11, a low temperature gas outlet 12 and a high temperature gas outlet 13. After the compressed normal temperature gas is injected from the gas inlet 11 of the vortex tube device 10, the vortex tube device 10 can divide the compressed normal temperature gas into The high-speed low-temperature gas flowing out from the low-temperature gas outlet 12 and the high-speed high-temperature gas flowing out from the high-temperature gas outlet 13 achieve the purpose of rapidly heating and cooling the normal temperature gas.

In "Figure 1", the inflow solenoid valve 20 can use an electromagnetic proportional valve, an electromagnetic regulating valve, etc. This is only for illustration and does not limit the scope of application of the present invention. The inflow solenoid valve 20 has an inflow The gas inlet 21, the first inflow gas outlet 22 and the second inflow gas outlet 23. The inflow gas inlet 21 is connected to the low temperature gas outlet 12 through the first circulation pipe 91. The inflow solenoid valve 20 can control the first inflow gas outlet 22 according to the valve command. The opening range of the valve can be adjusted, whereby the gas flow rate of the first inflow gas outlet 22 can be adjusted. The inflow solenoid valve 20 can also control the valve closing of the first inflow gas outlet 22 according to the closing command, and the inflow solenoid valve 20 can control the second inflow gas outlet 22 according to the opening command. The valve of the inflow gas outlet 23 is opened.

The heat source device 30 has a heat source gas inlet 31 and a heat source gas outlet 32. The heat source gas inlet 31 is connected to the first inflow gas outlet 22 through the second circulation pipe 92. The heat source device 30 can be composed of a heat sink, a temperature equalizing device, a chip, and a circuit board. The heat source device 30 can also be an integration of a heat dissipation device and a temperature equalizing device, or a combination of a chip and a circuit board. This is only an example and does not limit the application scope of the present invention. The heat source device 30 can be The operating temperature signal is provided through the circuit board.

The vacuum device 40 has a first vacuum gas inlet 41 , a second vacuum gas inlet 42 and a vacuum gas outlet 43 . The first vacuum gas inlet 41 is connected to the second inflow gas outlet 23 through a third circulation pipe 93 . The second vacuum gas inlet 42 It is connected to the heat source gas outlet 32 through the fourth circulation pipe 94 .

The first outflow solenoid valve 50 has a first outflow gas inlet 51 and a first outflow gas outlet 52. The first outflow gas inlet 51 is connected to the heat source gas outlet 32 and the second vacuum gas inlet 42 through the fourth circulation pipe 94. The solenoid valve 50 can control the valve closing of the first outflow gas inlet 51 according to the closing command.

The second outflow solenoid valve 60 has a second outflow gas inlet 61 and a second outflow gas outlet 62. The second outflow gas inlet 61 is connected to the vacuum gas outlet 43 through the fifth circulation pipe 95. The second outflow solenoid valve 60 can be opened according to the opening command. The valve controlling the second outflow gas inlet 62 is opened.

The atomizing device 70 atomizes the coolant. The atomizing device 70 is connected to the first inflow gas outlet 22 and the heat source gas inlet 31 through the second circulation pipe 92. The atomizing device 70 atomizes the coolant according to the starting command. Added to the air flow pipe (ie, the second circulation pipe 92), the atomizing device 70 stops adding the atomized cooling liquid to the air flow pipe according to the stop command. By adding the atomized cooling liquid to the second circulation pipe 92, the cooling liquid can be further improved. Regarding the heat dissipation performance of the heat source device 30 , the cooling liquid is, for example, water. This is only an example and does not limit the application scope of the present invention.

The control device 80 is electrically connected to the inflow solenoid valve 20 , the first outflow solenoid valve 50 , the second outflow solenoid valve 60 , the heat source device 30 and the atomization device 70 respectively. After the control device 80 obtains the operating temperature signal from the heat source device 30 , The control device 80 can generate a valve command to control the first inflow gas outlet 22 according to the working temperature signal of the heat source device 30 to provide the valve command to the inflow solenoid valve 20. At the same time, the control device 80 can also generate a valve command according to the working temperature of the heat source device 30. The signal is generated to control the opening command or the closing command of the atomizing device 70 to provide the opening command or the closing command to the atomizing device 70 .

When the control device 80 generates a closing instruction to control the atomization device 70 to close, the control device 80 will simultaneously generate a closing instruction to control the closing of the first inflow gas outlet 22 of the inflow solenoid valve 20 and control the first outflow of the first outflow solenoid valve 50 The control device 80 simultaneously or after a preset time delay generates a closing command for closing the gas inlet 51 and generates an opening command for controlling the opening of the second inflow gas outlet 23 of the inflow solenoid valve 20 and a second outflow gas control for the second outflow solenoid valve 60 The opening command to open the entrance 61.

When the inflow solenoid valve 20 and the first outflow solenoid valve 50 receive closing instructions from the control device 80 respectively, the inflow solenoid valve 20 can control the valve of the first inflow gas outlet 22 to close according to the closing instruction, and the first outflow solenoid valve 50 can The valve of the first outflow gas inlet 51 is controlled to close according to the closing command. At the same time or after a delay of a preset time, the inflow solenoid valve 20 and the second outflow solenoid valve 60 respectively receive the opening command from the control device 80, and the inflow solenoid valve 20 can control the valve of the second inflow gas outlet 23 to open according to the opening command, and the second outflow solenoid valve 60 can control the valve of the second outflow gas inlet 62 to open according to the opening command.

Through the above mentioned first inflow gas outlet 22 of the inflow solenoid valve 20 , the second inflow gas outlet 23 of the inflow solenoid valve 20 , the first outflow gas inlet 51 of the first outflow solenoid valve 50 and the second outflow gas inlet 60 of the second outflow solenoid valve 60 . The opening and closing of the valve of the outflow gas inlet 62 can be controlled to achieve pipeline switching control. At this time, the vacuum device 40 is activated to cause the gas flow pipeline (ie, the second circulation pipeline 92, the gas flow pipeline of the heat source device 30 and the fourth circulation pipeline 94) The air pressure inside decreases over time to form a low-pressure state, thereby lowering the boiling point of the cooling liquid in the air flow pipes (i.e., the second flow pipe 92, the air flow pipe of the heat source device 30, and the fourth flow pipe 94) so that the coolant rapidly boils and vaporizes It provides heat dissipation for the heat source device 30 and avoids the accumulation of atomized cooling liquid in the air flow pipes (ie, the second flow pipe 92 , the air flow pipe of the heat source device 30 and the fourth flow pipe 94 ), resulting in a decrease in heat dissipation efficiency.

In addition to the above control method of the vacuum device 40 by the control device 80, the control device 80 can further control the vacuum device 40 through the following evaluation methods.

The heat transfer rate of the atomized coolant boiling and vaporizing has a certain relationship with the working temperature of the heat source device 30. When the working temperature of the heat source device 30 is higher, the heat transfer rate of the coolant boiling and vaporizing is also higher. The cooling rate after atomization The liquid adheres to the heat dissipation device of the heat source device 30 (usually a heat dissipation fin, which is only used as an example and does not limit the application scope of the present invention) to form a thin film and begin to absorb heat. In order to maintain the heat dissipation of the heat source device 30 For the rated heat dissipation capacity of the device, the vacuum device 40 must be turned on when the film temperature reaches the design value, so that the heat absorption mode of the film changes to boiling and evaporation. Therefore, the opening time of the vacuum device 40 must be matched with the atomization device 70 to cool the atomized The end time of adding liquid to the gas flow pipe (ie, the second flow pipe 92, the gas flow pipe of the heat source device 30 and the fourth flow pipe 94) can be evaluated through the following formula:

in, is a variable in the process, so the parameter β must be introduced to correct the average heat transfer rate, L is the film thickness, k is the heat transfer coefficient of the coolant, ρ is the density of the coolant, and C _p is the specific heat of the coolant.

When the vacuum device 40 is turned on, the pressure of the air flow pipe in the heat source device 30 decreases, and the film formed by the heat sink attached to the heat source device 30 will boil and evaporate, thereby causing the operating temperature of the heat source device 30 to drop. Reducing the operating temperature brings about the effect of material shrinkage. In order to limit the amount of strain, the temperature operating temperature change of the heat source device 30 must be reduced.

In order to achieve this goal, the degree of shrinkage and expansion of the heat sink material of the heat source device 30 can be controlled by controlling the opening time of the vacuum device 40 . From the perspective of energy balance, the total amount of heat dissipated by the heat source device 30 will cause a change in the operating temperature of the heat source device 30, which can be evaluated according to the following formula:

in, is the calorific value of the heat source device 30; ( ) is the heat taken away by the boiling and vaporization of the coolant; m _E is the mass of the heat sink of the heat source device 30; C _{p, E} is the material specific heat of the heat sink of the heat source device 30; Δ T is the operating temperature change of the heat source device 30; And A is the effective area of the heat sink of the heat source device 30 .

After organizing the above formulas, the following formula is shown:

Among them, α is the correction coefficient, ρ _l is the liquid density, ρ _v is the saturated vapor density, and σ is the tension.

When the time when the vacuum device 40 is activated reaches Δt ₂ , the control device 80 can generate a closing command to control the closing of the vacuum device 40, and the atomized cooling liquid in the circulation pipe of the heat source device 30 may not have completely evaporated. Therefore, after _Δt3 passes again, the control device 80 can generate an opening command to control the startup of the vacuum device 40 again. The evaluation method of _Δt3 is as shown in the following formula:

Among them, L ^' is the film thickness. Since L>L ^', _Δt3 < _Δt1 .

During the process of repeatedly opening the vacuum device 40, the atomized coolant in the circulation pipe of the heat source device 30 will boil and vaporize at a certain moment. The pressure in the circulation pipe of the heat source device 30 will be lower, and the working temperature of the heat source device 30 will be lower. will rise again, the control device 80 generates and provides an opening command to the inflow solenoid valve 20 and the first outflow solenoid valve 50. The inflow solenoid valve 20 can control the valve of the first inflow gas outlet 22 to open according to the opening command, and the first The outflow solenoid valve 50 can control the opening of the valve of the first outflow gas inlet 51 according to the opening command. At the same time, the control device 80 generates and provides a closing command to the inflow solenoid valve 20 and the second outflow solenoid valve 60, and the inflow solenoid valve 20 is sufficient. The valve of the second inflow gas outlet 23 is controlled to close according to the closing instruction, and the second outflow solenoid valve 60 can control the valve of the second outflow gas inlet 62 to close according to the closing instruction. , control the opening and closing of the valves of the second inflow gas outlet 23 of the inflow solenoid valve 20, the first outflow gas inlet 51 of the first outflow solenoid valve 50, and the second outflow gas inlet 62 of the second outflow solenoid valve 60, thereby Pipe switching control can be realized.

Next, the control device 80 generates and provides a start command to the atomization device 70. The atomization device 70 adds the atomized cooling liquid to the air flow pipe (ie, the second circulation pipe 92) according to the start command, thereby reciprocating the cycle to achieve the present invention. The invention provides a heat dissipation system that provides low-pressure boiling and vaporization of coolant by controlling pipe switching.

In summary, it can be seen that the difference between the present invention and the prior art is that the control device generates a closing command to control the closing of the valve of the first inflow gas outlet and the closing of the valve of the first outflow gas inlet based on the operating temperature signal, and the control device generates a control With the command to open the valve of the second inflow gas outlet and the valve of the second outflow gas inlet, the vacuum device is started to reduce the air pressure in the air flow pipe over time to form a low pressure state, thereby reducing the boiling point of the coolant in the air flow pipe. The coolant quickly boils and vaporizes to dissipate heat from the heat source device.

This technical means can solve the problem in the previous technology that the coolant used in the liquid-cooled heat dissipation system is toxic and requires further treatment of the waste liquid, thereby achieving an improvement in the low-pressure boiling vaporization of the coolant by controlling the switching of pipelines. Technical efficacy of heat dissipation efficiency.

Although the embodiments disclosed in the present invention are as above, the described contents are not used to directly limit the patent protection scope of the present invention. Anyone with ordinary knowledge in the technical field to which the present invention belongs may make slight changes in the form and details of the implementation without departing from the spirit and scope of the disclosure of the present invention. The patent protection scope of the present invention must still be defined by the attached patent application scope.

10: Vortex tube device 11:Gas inlet 12: Low temperature gas outlet 13:High temperature gas outlet 20:Inflow solenoid valve 21: Inflow gas inlet 22: First inflow gas outlet 23: Second inflow gas outlet 30:Heat source device 31: Heat source gas inlet 32: Heat source gas outlet 40: Vacuum device 41: First vacuum gas inlet 42: Second vacuum gas inlet 43: Vacuum gas outlet 50: First outflow solenoid valve 51: First outflow gas inlet 52: First outflow gas outlet 60: Second outflow solenoid valve 61: Second outflow gas inlet 62: Second outflow gas outlet 70:Atomization device 80:Control device 91:First circulation channel 92:Second circulation channel 93:Third circulation channel 94:Fourth circulation channel 95:Fifth circulation channel

Figure 1 is a system block diagram of a heat dissipation system that provides low-pressure boiling and vaporization of coolant by controlling pipe switching according to the present invention.

10: Vortex tube device

11:Gas inlet

12: Low temperature gas outlet

13:High temperature gas outlet

20:Inflow solenoid valve

21: Inflow gas inlet

22: First inflow gas outlet

23: Second inflow gas outlet

30:Heat source device

31: Heat source gas inlet

32: Heat source gas outlet

40: Vacuum device

41: First vacuum gas inlet

42: Second vacuum gas inlet

43: Vacuum gas outlet

50: First outflow solenoid valve

51: First outflow gas inlet

52: First outflow gas outlet

60: Second outflow solenoid valve

61: Second outflow gas inlet

62: Second outflow gas outlet

70:Atomization device

80:Control device

91:First circulation channel

92:Second circulation channel

93:Third circulation channel

94:Fourth circulation channel

95:Fifth circulation channel

Claims (7)

A cooling system that provides low-pressure boiling and vaporization of coolant by controlling pipe switching, which includes: A vortex tube device having a gas inlet and a low-temperature gas outlet; An inflow solenoid valve has an inflow gas inlet, a first inflow gas outlet and a second inflow gas outlet, the inflow gas inlet is connected to the low temperature gas outlet, and the first inflow gas outlet is controlled according to a valve command. The valve opening range is controlled to close the valve of the first inflow gas outlet according to a closing instruction, and to control the opening of the valve of the second inflowing gas outlet according to an opening instruction; A heat source device having a heat source gas inlet and a heat source gas outlet, the heat source gas inlet is connected to the first inflow gas outlet, and the heat source device provides an operating temperature signal; A vacuum device has a first vacuum gas inlet, a second vacuum gas inlet and a vacuum gas outlet, the first vacuum gas inlet is connected to the second inflow gas outlet, the second vacuum gas inlet is connected to the The heat source gas outlet is connected to control the opening or closing of the vacuum device according to the opening command or the closing command; A first outflow solenoid valve has a first outflow gas inlet and a first outflow gas outlet. The first outflow gas inlet is connected to the heat source gas outlet and the second vacuum gas inlet. According to the closing command controlling the closing of the valve of the first outflow gas inlet; A second outflow solenoid valve has a second outflow gas inlet and a second outflow gas outlet. The second outflow gas inlet is connected to the vacuum gas outlet, and the second outflow gas inlet is controlled according to the opening command. The valve opens; An atomizing device is connected to the first inflow gas outlet and the heat source gas inlet. The atomizing device adds atomized cooling liquid to the air flow pipe according to a start command. The atomizing device adds atomized cooling liquid to the air flow pipe according to a stop command. Instructs to stop adding atomized coolant to the airflow duct; and A control device is electrically connected to the inflow solenoid valve, the first outflow solenoid valve, the second outflow solenoid valve, the heat source device and the atomization device, and the control device is connected from the The heat source device obtains the working temperature signal, and the control device generates the valve command, the closing command or the opening command based on the working temperature signal; Wherein, when the valve of the first inflow gas outlet is closed and the valve of the first outflow gas inlet is closed, and the valve of the second inflow gas outlet is opened and the valve of the second outflow gas inlet is opened, the When the vacuum device is activated, the air pressure in the air flow pipe decreases over time to form a low pressure state, thereby lowering the boiling point of the cooling liquid in the air flow pipe so that the cooling liquid boils and vaporizes rapidly to provide heat dissipation for the heat source device. The heat dissipation system for providing low-pressure boiling and vaporization of coolant through control pipe switching as described in claim 1, wherein the control device generates the closing command of the first inflow gas outlet and the third inlet gas outlet according to the operating temperature signal. Simultaneously with the closing instruction of the outflow gas inlet, the opening instruction of the second inflow gas outlet and the opening instruction of the second outflow gas inlet are generated. The heat dissipation system that provides low-pressure boiling and vaporization of coolant through control pipe switching as described in claim 1, wherein the inflow solenoid valve controls the closing of the valve of the first inflow gas outlet and the first outflow according to the closing command. While the solenoid valve controls the valve of the first outflow gas inlet to close according to the closing command, the inflow solenoid valve controls the opening of the valve of the second inflow gas outlet and the second outflow solenoid valve according to the opening command. The valve of the second outflow gas inlet is controlled to open according to the opening command. The heat dissipation system for providing low-pressure boiling and vaporization of coolant through control pipe switching as described in claim 1, wherein the control device generates the closing command of the first inflow gas outlet and the third inlet gas outlet according to the operating temperature signal. After the closing command of the outflow gas inlet is delayed for a preset time, the opening command of the second inflow gas outlet and the opening command of the second outflow gas inlet are generated. The heat dissipation system that provides low-pressure boiling and vaporization of coolant through control pipe switching as described in claim 1, wherein the inflow solenoid valve controls the closing of the valve of the first inflow gas outlet and the first outflow according to the closing command. After the solenoid valve controls the valve of the first outflow gas inlet to close according to the closing command and delays for a preset time, the inflow solenoid valve controls the opening of the valve of the second inflow gas outlet and the opening of the second inflow gas outlet according to the opening command. The second outflow solenoid valve controls the opening of the valve of the second outflow gas inlet according to the opening command. The heat dissipation system that provides low-pressure boiling and vaporization of coolant through control pipe switching as described in claim 1, wherein the control device calculates the time required to generate the opening command to control the vacuum device according to the following formula : Among them, β is the modified average heat transfer rate, L is the film thickness, k is the thermal conductivity coefficient of the coolant, ρ is the density of the coolant, and C _p is the specific heat of the coolant. The heat dissipation system that provides low-pressure boiling and vaporization of coolant through control pipe switching as described in claim 1, wherein the control device calculates the time required to generate the shutdown command to control the vacuum device based on the following formula : in, is the calorific value of the heat source device 30; ( ) is the heat taken away by the boiling and vaporization of the coolant; m _E is the mass of the heat sink of the heat source device 30; C _{p, E} is the material specific heat of the heat sink of the heat source device 30; Δ T is the operating temperature change of the heat source device 30; And A is the effective area of the heat sink of the heat source device 30 .

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