TW202403311A - Chip testing socket having impedance matching configuration - Google Patents
Chip testing socket having impedance matching configuration Download PDFInfo
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- 238000012360 testing method Methods 0.000 title claims abstract description 60
- 239000002184 metal Substances 0.000 claims abstract description 109
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- 230000000694 effects Effects 0.000 claims description 11
- 230000004308 accommodation Effects 0.000 claims description 6
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- 230000003071 parasitic effect Effects 0.000 claims description 2
- 238000004891 communication Methods 0.000 abstract description 2
- 239000012212 insulator Substances 0.000 abstract 4
- 238000009434 installation Methods 0.000 description 6
- 230000008054 signal transmission Effects 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
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- 238000009413 insulation Methods 0.000 description 3
- 238000005728 strengthening Methods 0.000 description 3
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Abstract
Description
本發明涉及一種測試插座，尤其涉及一種匹配型晶片測試插座。The invention relates to a test socket, in particular to a matching chip test socket.
現有晶片測試插座包含有一外框、安裝於所述外框的一絕緣板、及設置於所述絕緣板的多個導電端子。其中，所述絕緣板雖是以工程塑膠所製成，但其依然存在著難以克服且影響測試品質的許多缺陷（如：翹曲變形、吸濕膨脹、或熱傳導效能不佳）。再者，隨著通訊頻率提高，晶片的載波頻率也變得越來越高，因而導致現有晶片測試插座的架構已逐漸無法滿足晶片性能的測試要求。The existing chip test socket includes an outer frame, an insulating plate installed on the outer frame, and a plurality of conductive terminals provided on the insulating plate. Although the insulation board is made of engineering plastic, it still has many defects that are difficult to overcome and affect test quality (such as warping deformation, hygroscopic expansion, or poor thermal conductivity). Furthermore, as the communication frequency increases, the carrier frequency of the chip becomes higher and higher. As a result, the structure of the existing chip test socket is gradually unable to meet the test requirements of chip performance.
於是，本發明人認為上述缺陷可改善，乃特潛心研究並配合科學原理的運用，終於提出一種設計合理且有效改善上述缺陷的本發明。Therefore, the inventor believed that the above-mentioned defects could be improved, so he devoted himself to research and applied scientific principles, and finally proposed an invention that is reasonably designed and effectively improves the above-mentioned defects.
本發明實施例在於提供一種匹配型晶片測試插座，其能有效地改善現有晶片測試插座所可能產生的缺陷。An embodiment of the present invention provides a matching chip test socket, which can effectively improve the defects that may occur in the existing chip test socket.
本發明實施例公開一種匹配型晶片測試插座，其包括：一金屬外框；一金屬固持座，安裝於所述金屬外框，以使所述金屬外框與所述金屬固持座共同包圍形成有一容置槽；其中，所述金屬固持座沿一預設方向凹設形成有呈貫穿狀且連通於所述容置槽的多個信號孔；多個信號彈簧探針，分別安裝於所述金屬固持座的多個所述信號孔；其中，每個所述信號彈簧探針的兩個端部分別穿出所述金屬固持座，並且每個所述信號彈簧探針的其中一個所述端部沿所述預設方向可移動地位於所述容置槽內；以及多個絕緣匹配體，分別設置於多個所述信號孔內，並且多個所述絕緣匹配體分別包覆於多個所述信號彈簧探針，以使每個所述信號彈簧探針通過相對應的所述絕緣匹配體而與所述金屬固持座隔開；其中，每個所述絕緣匹配體於所述預設方向具有一匹配長度，其為相對應所述信號孔於所述預設方向的一孔長度的30%～100%。An embodiment of the present invention discloses a matching chip test socket, which includes: a metal outer frame; a metal holder installed on the metal outer frame, so that the metal outer frame and the metal holder together form a Accommodation groove; wherein, the metal holder is recessed along a preset direction to form a plurality of signal holes that are penetrating and connected to the accommodation groove; a plurality of signal spring probes are respectively installed on the metal A plurality of the signal holes of the holder; wherein, two ends of each signal spring probe respectively pass through the metal holder, and one of the end portions of each signal spring probe movably located in the accommodating groove along the preset direction; and a plurality of insulating matching bodies, respectively disposed in a plurality of the signal holes, and the plurality of insulating matching bodies are respectively covered in a plurality of the plurality of signal holes. the signal spring probes, so that each of the signal spring probes is separated from the metal holding base by the corresponding insulating matching body; wherein each of the insulating matching bodies is in the preset direction There is a matching length, which is 30% to 100% of a hole length corresponding to the signal hole in the preset direction.
綜上所述，本發明實施例所公開的匹配型晶片測試插座，其通過採用所述金屬外框與所述金屬固持座來作為整體的主要架構，以使得所述匹配型晶片測試插座能夠實現強化其結構剛性、提升熱傳導效能、並避免吸收濕氣而膨脹的技術效果，進而有效地維持所述匹配型晶片測試插座的測試品質穩定性。In summary, the matching chip test socket disclosed in the embodiment of the present invention adopts the metal outer frame and the metal holder as the main structure of the whole, so that the matching chip test socket can realize The technical effects of strengthening its structural rigidity, improving heat conduction efficiency, and preventing expansion due to moisture absorption, thereby effectively maintaining the test quality stability of the matching chip test socket.
再者，本發明實施例所公開的匹配型晶片測試插座，其通過設有多個所述絕緣匹配體，以使每個所述信號彈簧探針能夠更為順暢地插設於所述金屬固持座內。進一步地說，所述金屬固持座能夠依據信號傳輸的頻段或阻抗需求而調整所述信號孔的孔徑或是所述絕緣匹配體的所述匹配長度，據以實現阻抗匹配的效果，因而利於符合更高性能測試要求。Furthermore, the matching chip test socket disclosed in the embodiment of the present invention is provided with a plurality of the insulating matching bodies, so that each of the signal spring probes can be inserted into the metal holder more smoothly. Inside the seat. Furthermore, the metal holder can adjust the aperture of the signal hole or the matching length of the insulating matching body according to the frequency band or impedance requirements of signal transmission, thereby achieving an impedance matching effect, thus facilitating compliance with Higher performance testing requirements.
為能更進一步瞭解本發明的特徵及技術內容，請參閱以下有關本發明的詳細說明與附圖，但是此等說明與附圖僅用來說明本發明，而非對本發明的保護範圍作任何的限制。In order to further understand the characteristics and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, these descriptions and drawings are only used to illustrate the present invention and do not make any reference to the protection scope of the present invention. limit.
以下是通過特定的具體實施例來說明本發明所公開有關“匹配型晶片測試插座”的實施方式，本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用，本說明書中的各項細節也可基於不同觀點與應用，在不悖離本發明的構思下進行各種修改與變更。另外，本發明的附圖僅為簡單示意說明，並非依實際尺寸的描繪，事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容，但所公開的內容並非用以限制本發明的保護範圍。The following is a specific embodiment to illustrate the implementation of the "matching chip test socket" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depictions based on actual dimensions, as is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of the present invention.
應當可以理解的是，雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號，但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件，或者一信號與另一信號。另外，本文中所使用的術語“或”，應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that although terms such as “first”, “second” and “third” may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another component or one signal from another signal. In addition, the term "or" used in this article shall include any one or combination of more of the associated listed items depending on the actual situation.
請參閱圖1至圖10所示，其為本發明的實施例。如圖1至圖3所示，本實施例公開一種匹配型晶片測試插座100，其於本實施例中包含有一金屬外框1、安裝於所述金屬外框1的一金屬固持座2、安裝於所述金屬固持座2的多個接地彈簧探針3（pogo pin）與多個信號彈簧探針4、及分別包覆於多個所述信號彈簧探針4的多個絕緣匹配體5，但本發明不受限於此。舉例來說，在本發明未繪示的其他實施例中，所述金屬固持座2與多個所述接地彈簧探針3之間的配合也可以通過其他方式取代。Please refer to FIGS. 1 to 10 , which are embodiments of the present invention. As shown in Figures 1 to 3, this embodiment discloses a matching
如圖3至圖5所示，所述金屬外框1與所述金屬固持座2共同包圍形成有一容置槽S，用以供一待測試晶片200置於其內。於本實施例中，所述容置槽S的槽口形成於所述金屬外框1；也就是說，所述金屬外框1的底緣形成有一環形凹槽11，並且所述金屬固持座2固定於（如：鎖固於）所述環形凹槽11內，以使所述金屬外框1與所述金屬固持座2能被共同用來安裝於一電路板300上。As shown in FIGS. 3 to 5 , the metal frame 1 and the
據此，所述匹配型晶片測試插座100於本實施例中通過採用所述金屬外框1與所述金屬固持座2來作為整體的主要架構，以使得所述匹配型晶片測試插座100能夠實現強化其結構剛性、提升熱傳導效能、並避免吸收濕氣而膨脹的技術效果，進而有效地維持所述匹配型晶片測試插座100的測試品質穩定性。Accordingly, in this embodiment, the matching
進一步地說，如圖3、圖6、圖7、及圖8所示，所述金屬固持座2大致呈板狀且沿一預設方向D凹設形成有呈貫穿狀且連通於所述容置槽S的多個接地孔23與多個信號孔24；也就是說，多個所述接地孔23與多個所述信號孔24於所述預設方向D皆具有相同的一孔長度L24。其中，所述預設方向D相當於垂直所述金屬固持座2的方向，多個所述接地孔23與多個所述信號孔24彼此間隔地設置，並且相鄰的任兩個所述接地孔23之間設置有至少一個所述信號孔24。Furthermore, as shown in Figures 3, 6, 7, and 8, the
於本實施例中，所述金屬固持座2包含有一第一金屬板21、與相連接於所述第一金屬板21的一第二金屬板22。其中，所述第一金屬板21構成所述容置槽S的槽底，並且所述第二金屬板22的厚度T22為所述第一金屬板21的厚度T21的50%～100%，但本發明不受限於此。舉例來說，在本發明未繪示的其他實施例中，所述金屬固持座2也可以是單層板體、或是以三層以上的板體堆疊而構成。In this embodiment, the
再者，所述第一金屬板21的輪廓與所述第二金屬板22的輪廓彼此切齊，並且每個所述接地孔23與每個所述信號孔24皆是沿所述預設方向D凹設形成於所述第一金屬板21與所述第二金屬板22；也就是說，所述第一金屬板21形成有每個所述接地孔23的一部分與每個所述信號孔24的一部分，而所述第二金屬板22形成有每個所述接地孔23的其餘部分與每個所述信號孔24的其餘部分。Furthermore, the contours of the first metal plate 21 and the second metal plate 22 are aligned with each other, and each of the ground holes 23 and each of the signal holes 24 are along the preset direction. D recesses are formed on the first metal plate 21 and the second metal plate 22; that is to say, the first metal plate 21 is formed with a part of each ground hole 23 and each signal hole. 24 , and the second metal plate 22 is formed with the remaining portion of each ground hole 23 and the remaining portion of each signal hole 24 .
多個所述接地彈簧探針3分別安裝於所述金屬固持座2的多個所述接地孔23，每個所述接地彈簧探針3的兩個端部31a、31b分別穿出所述金屬固持座2，並且每個所述接地彈簧探針3的其中一個所述端部31a沿所述預設方向D可移動地位於所述容置槽S內、並定義為一測試端部31a，而每個所述接地彈簧探針3的其中另一個所述端部31b突伸出所述金屬外框1的所述底緣、並定義為一安裝端部31b，用以安裝於所述電路板300上。A plurality of
其中，多個所述接地彈簧探針3通過分別緊配合地固持於所述金屬固持座2的多個所述接地孔23，以使多個所述接地彈簧探針3、所述金屬固持座2、及所述金屬外框1彼此電性耦接而構成一共地連接架構，據以有效地達成信號傳輸時的屏蔽及抑制彼此的串擾（如：所述共地連接架構完整地包覆於多個所述信號彈簧探針4的外圍），以利於符合所述待測試晶片200的更高性能測試要求。Wherein, the plurality of
需說明的是，多個所述接地彈簧探針3的構造與類型於本實施例中大致相同，所以為便於說明，以下僅介紹單個所述接地彈簧探針3的構造，但本發明不受限於此。舉例來說，在本發明未繪示的其他實施例中，多個所述接地彈簧探針3的構造或類型也可以略有差異。It should be noted that the structures and types of the plurality of
更詳細地說，所述接地彈簧探針3具有位於兩個所述端部31a、31b之間的一針身部32、及位於所述針身部32內一導電彈簧33。其中，所述導電彈簧33的兩端分別彈性地抵接於兩個所述端部31a、31b，以使兩個所述端部31a、31b能夠彼此電性連接。所述測試端部31a與所述安裝端部31b於本實施例中可以是能夠相對於所述針身部32沿所述預設方向D移動，但本發明不受限於此。舉例來說，於本發明未繪示的其他實施例中，所述安裝端部31b也可以是與所述針身部32為一體成型的單件式構造。In more detail, the
所述接地彈簧探針3以所述針身部32緊配合地固持於相對應的所述接地孔23；也就是說，所述接地彈簧探針3（的所述針身部32）緊配合地固持於所述第一金屬板21與所述第二金屬板22的至少其中之一。再者，鄰近於所述針身部32的每個所述端部31a、31b的區塊是與相對應的所述接地孔23之間形成有一間隙G3，據以利於所述接地彈簧探針3與相對應所述接地孔23之間的安裝作業。The
多個所述信號彈簧探針4分別安裝於所述金屬固持座2的多個所述信號孔24，每個所述信號彈簧探針4的兩個端部41a、41b分別穿出所述金屬固持座2，並且每個所述信號彈簧探針4的其中一個所述端部41a沿所述預設方向D可移動地位於所述容置槽S內、並定義為一測試端部41a，而每個所述信號彈簧探針4的其中另一個所述端部41b突伸出所述金屬外框1的所述底緣、並定義為一安裝端部41b，用以安裝於所述電路板300上。The plurality of signal spring probes 4 are respectively installed in the plurality of signal holes 24 of the
其中，每個所述信號彈簧探針4的所述測試端部41a與所述安裝端部41b較佳是分別共平面於每個所述接地彈簧探針3的所述測試端部31a與所述安裝端部31b，據以利於共同對所述待測試晶片200進行頂抵測試、也利於安裝於所述電路板300上，但本發明不以此為限。Wherein, the test end 41a and the installation end 41b of each signal spring probe 4 are preferably co-planar with the test end 31a and the
再者，多個所述絕緣匹配體5分別設置於多個所述信號孔24內，並且多個所述絕緣匹配體5分別包覆於多個所述信號彈簧探針4，以使每個所述信號彈簧探針4於本實施例中可以通過相對應的所述絕緣匹配體5而與所述金屬固持座2隔開。Furthermore, the plurality of insulating matching bodies 5 are respectively disposed in the plurality of signal holes 24 , and the plurality of insulating matching bodies 5 are respectively covered with the plurality of signal spring probes 4 , so that each In this embodiment, the signal spring probe 4 can be separated from the
據此，每個所述信號彈簧探針4能夠通過相對應的所述絕緣匹配體5，進而能夠更為順暢地插設於所述金屬固持座2內，並且所述金屬固持座2通過其內設有便於調整外型尺寸的所述絕緣匹配體5，因而使得所述信號孔24的孔徑能夠依據信號傳輸的頻段或阻抗需求而調整，據以實現阻抗匹配的效果。Accordingly, each of the signal spring probes 4 can pass through the corresponding insulating matching body 5 and can be inserted into the
更詳細地說，每個所述絕緣匹配體5於所述預設方向D具有一匹配長度，其為相對應所述信號孔24的所述孔長度L24的30%～100%。也就是說，所述金屬固持座2的所述絕緣匹配體5能夠依據信號傳輸的頻段或阻抗需求而調整其所述匹配長度，據以實現阻抗匹配的效果。In more detail, each of the insulating matching bodies 5 has a matching length in the predetermined direction D, which is 30% to 100% of the hole length L24 corresponding to the signal hole 24 . That is to say, the matching length of the insulating matching body 5 of the
於本實施例中，每個所述絕緣匹配體5包含有兩個套環51，其分別位於相對應所述信號孔24的兩端（如：兩個所述套環51分別位於所述第一金屬板21與所述第二金屬板22內），以使每個所述絕緣匹配體5的兩個所述套環51分別套設於相對應所述信號彈簧探針4的兩個所述端部41a、41b；其中，兩個所述套環51於本實施例中僅能由所述第一金屬板21與所述第二金屬板22的相接處面沿所述預設方向D分別插設於其內，但本發明不受限於此。舉例來說，在本發明未繪示的其他實施例中，所述絕緣匹配體5也可以是單件式構造、或是以三個以上的套環51而構成；或者，任一個所述套環51可以由所述金屬固持座2的外表面插設於其內。In this embodiment, each insulating matching body 5 includes two collars 51 , which are respectively located at both ends corresponding to the signal hole 24 (for example: the two collars 51 are respectively located at the third (a metal plate 21 and the second metal plate 22 ), so that the two collars 51 of each insulating matching body 5 are respectively sleeved on the two corresponding signal spring probes 4 The end portions 41a and 41b; in this embodiment, the two collars 51 can only be moved along the preset direction from the joint surface of the first metal plate 21 and the second metal plate 22. D are respectively inserted therein, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the insulating matching body 5 can also be a single-piece structure or composed of three or more collars 51; or, any one of the collars 51 can The ring 51 can be inserted into the outer surface of the
此外，多個所述絕緣匹配體5的所述匹配長度（如：兩個所述套環51的長度L51總合）可以依據設計需求而皆相同（如：圖9和圖10），或者是具有不同的至少兩種數值（如：圖6至圖8）。In addition, the matching lengths of multiple insulating matching bodies 5 (such as the sum of the lengths L51 of the two collars 51 ) may be the same according to design requirements (such as FIG. 9 and FIG. 10 ), or Have at least two different values (eg: Figure 6 to Figure 8).
舉例來說，如圖7所示，所述匹配長度大致為相對應所述信號孔24的所述孔長度L24的30%～85%；其中，任一個個所述絕緣匹配體5的兩個所述套環51彼此間隔地設置且被一介質（如：空氣）所隔開；或者，如圖8所示，任一個所述絕緣匹配體5的所述匹配長度（如：兩個所述套環51的長度L51總合）等於相對應所述信號孔24的所述孔長度L24，用以能夠通過相對應所述信號彈簧探針4產生一寄生電容效應。For example, as shown in FIG. 7 , the matching length is approximately 30% to 85% of the hole length L24 corresponding to the signal hole 24 ; wherein, two of any one of the insulating matching bodies 5 The collars 51 are spaced apart from each other and separated by a medium (such as air); or, as shown in FIG. 8 , the matching length of any one of the insulating matching bodies 5 (such as two of the The length L51 of the collar 51 (total) is equal to the hole length L24 corresponding to the signal hole 24, so as to generate a parasitic capacitance effect through the corresponding signal spring probe 4.
需說明的是，如圖3、圖6、圖7、及圖8所示，多個所述信號彈簧探針4的構造與類型於本實施例中大致相同，所以為便於說明，以下僅介紹單個所述信號彈簧探針4的構造，但本發明不受限於此。舉例來說，在本發明未繪示的其他實施例中，多個所述信號彈簧探針4的構造或類型也可以略有差異。It should be noted that, as shown in Figures 3, 6, 7, and 8, the structures and types of the plurality of signal spring probes 4 are roughly the same in this embodiment, so for the convenience of explanation, only the following are introduced. A single signal spring probe 4 is configured, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the structures or types of the plurality of signal spring probes 4 may also be slightly different.
更詳細地說，所述信號彈簧探針4具有位於兩個所述端部41a、41b之間的一針身部42、及位於所述針身部42內一導電彈簧43。其中，所述導電彈簧43的兩端分別彈性地抵接於兩個所述端部41a、41b，以使兩個所述端部41a、41b能夠彼此電性連接。所述測試端部41a與所述安裝端部41b於本實施例中可以是能夠相對於所述針身部42沿所述預設方向D移動，但本發明不受限於此。舉例來說，於本發明未繪示的其他實施例中，所述安裝端部41b也可以是與所述針身部42為一體成型的單件式構造。In more detail, the signal spring probe 4 has a needle body part 42 located between the two end parts 41a and 41b, and a conductive spring 43 located in the needle body part 42. Wherein, the two ends of the conductive spring 43 elastically abut the two end portions 41a and 41b respectively, so that the two end portions 41a and 41b can be electrically connected to each other. In this embodiment, the test end 41a and the installation end 41b may be movable in the preset direction D relative to the needle body 42, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the mounting end portion 41 b may also be a single-piece structure formed integrally with the needle body portion 42 .
所述信號彈簧探針4以所述針身部42抵接於相對應所述絕緣匹配體5；也就是說，所述信號彈簧探針4的所述針身部42兩端分別插設於兩個所述套環51內。再者，鄰近於所述針身部42的每個所述端部41a、41b的區塊是與相對應的所述絕緣匹配體5（如：所述套環51）之間形成有一間隙G4，據以利於所述信號彈簧探針4與相對應所述絕緣匹配體5（如：所述套環51）之間的安裝作業。The signal spring probe 4 contacts the corresponding insulating matching body 5 with the needle body 42; that is to say, both ends of the needle body 42 of the signal spring probe 4 are respectively inserted into inside the two collars 51. Furthermore, a gap G4 is formed between the block adjacent to each end portion 41a, 41b of the needle body portion 42 and the corresponding insulating matching body 5 (such as the collar 51). , thereby facilitating the installation work between the signal spring probe 4 and the corresponding insulating matching body 5 (such as the collar 51 ).
需額外說明的是，所述信號彈簧探針4於本實施例中較佳是採用相同於所述接地彈簧探針3的構造，但本發明不受限於此。舉例來說，在本發明未繪示的其他實施例中，所述信號彈簧探針4與所述接地彈簧探針3於結構上也可以略有差異。It should be noted that the signal spring probe 4 in this embodiment preferably adopts the same structure as the
[本發明實施例的技術效果][Technical effects of the embodiments of the present invention]
綜上所述，本發明實施例所公開的匹配型晶片測試插座，其通過採用所述金屬外框與所述金屬固持座來作為整體的主要架構，以使得所述匹配型晶片測試插座能夠實現強化其結構剛性、提升熱傳導效能、並避免吸收濕氣而膨脹的技術效果，進而有效地維持所述匹配型晶片測試插座的測試品質穩定性。In summary, the matching chip test socket disclosed in the embodiment of the present invention adopts the metal outer frame and the metal holder as the main structure of the whole, so that the matching chip test socket can realize The technical effects of strengthening its structural rigidity, improving heat conduction efficiency, and preventing expansion due to moisture absorption, thereby effectively maintaining the test quality stability of the matching chip test socket.
再者，本發明實施例所公開的匹配型晶片測試插座，其通過多個所述接地彈簧探針、所述金屬固持座、及所述金屬外框構成所述共地連接架構，據以有效地達成信號傳輸時的屏蔽及抑制彼此的串擾，以利於符合所述待測試晶片的更高性能測試要求。Furthermore, the matching chip test socket disclosed in the embodiment of the present invention uses a plurality of the ground spring probes, the metal holder, and the metal outer frame to form the common ground connection structure, thereby effectively To achieve shielding during signal transmission and suppress crosstalk between each other, so as to meet the higher performance testing requirements of the chip under test.
此外，本發明實施例所公開的匹配型晶片測試插座，其通過設有多個所述絕緣匹配體，以使每個所述信號彈簧探針能夠更為順暢地插設於所述金屬固持座內。進一步地說，所述金屬固持座能夠依據信號傳輸的頻段或阻抗需求而調整所述信號孔的孔徑或是所述絕緣匹配體的所述匹配長度，據以實現阻抗匹配的效果，因而利於符合所述待測試晶片的更高性能測試要求。In addition, the matching chip test socket disclosed in the embodiment of the present invention is provided with a plurality of the insulating matching bodies, so that each of the signal spring probes can be inserted into the metal holder more smoothly. within. Furthermore, the metal holder can adjust the aperture of the signal hole or the matching length of the insulating matching body according to the frequency band or impedance requirements of signal transmission, thereby achieving an impedance matching effect, thus facilitating compliance with Higher performance testing requirements for the wafer to be tested.
以上所公開的內容僅為本發明的優選可行實施例，並非因此侷限本發明的專利範圍，所以凡是運用本發明說明書及圖式內容所做的等效技術變化，均包含於本發明的專利範圍內。The contents disclosed above are only preferred and feasible embodiments of the present invention, and do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the patent scope of the present invention. within.
100:匹配型晶片測試插座 1:金屬外框 11:環形凹槽 2:金屬固持座 21:第一金屬板 22:第二金屬板 23:接地孔 24:信號孔 3:接地彈簧探針 31a:測試端部 31b:安裝端部 32:針身部 33:導電彈簧 4:信號彈簧探針 41a:測試端部 41b:安裝端部 42:針身部 43:導電彈簧 5:絕緣匹配體 51:套環 S:容置槽 D:預設方向 L24:孔長度 T21、T22:厚度 L51:長度 G3、G4:間隙 200:待測試晶片 300:電路板 100: Matching chip test socket 1: Metal frame 11: Annular groove 2: Metal holder 21:First Metal Plate 22:Second metal plate 23:Ground hole 24:Signal hole 3: Ground spring probe 31a: Test end 31b: Install the end 32: Needle body part 33:Conductive spring 4: Signal spring probe 41a: Test end 41b: Install the end 42: Needle body part 43:Conductive spring 5: Insulation matching body 51: Collar S: storage tank D: Default direction L24: hole length T21, T22: Thickness L51:Length G3, G4: gap 200: Chip to be tested 300:Circuit board
圖1為本發明實施例的匹配型晶片測試插座的立體示意圖。FIG. 1 is a three-dimensional schematic diagram of a matching chip test socket according to an embodiment of the present invention.
圖2為圖1沿剖線II-II的剖視示意圖。FIG. 2 is a schematic cross-sectional view along section line II-II of FIG. 1 .
圖3為圖2的匹配型晶片測試插座安裝於電路板且用來測試一待測試晶片的剖視示意圖。FIG. 3 is a schematic cross-sectional view of the matching chip test socket of FIG. 2 installed on a circuit board and used to test a chip to be tested.
圖4為圖1的分解示意圖。Figure 4 is an exploded schematic diagram of Figure 1.
圖5為圖1另一視角的分解示意圖。Figure 5 is an exploded schematic diagram of Figure 1 from another perspective.
圖6為圖4的局部分解示意圖。Figure 6 is a partially exploded schematic diagram of Figure 4.
圖7為圖4沿剖線VII-VII的剖視示意圖。FIG. 7 is a schematic cross-sectional view along the section line VII-VII in FIG. 4 .
圖8為圖4沿剖線VIII-VIII的剖視示意圖。Figure 8 is a schematic cross-sectional view along section line VIII-VIII of Figure 4 .
圖9為圖6另一實施態樣的立體示意圖。FIG. 9 is a schematic perspective view of another embodiment of FIG. 6 .
圖10為圖6又一實施態樣的立體示意圖。FIG. 10 is a schematic three-dimensional view of yet another embodiment of FIG. 6 .
100:匹配型晶片測試插座 100: Matching chip test socket
1:金屬外框 1: Metal frame
11:環形凹槽 11: Annular groove
2:金屬固持座 2: Metal holder
21:第一金屬板 21:First Metal Plate
22:第二金屬板 22:Second metal plate
23:接地孔 23:Ground hole
24:信號孔 24:Signal hole
3:接地彈簧探針 3: Ground spring probe
31a:測試端部 31a: Test end
31b:安裝端部 31b: Install the end
32:針身部 32: Needle body part
33:導電彈簧 33:Conductive spring
4:信號彈簧探針 4: Signal spring probe
41a:測試端部 41a: Test end
41b:安裝端部 41b: Install the end
42:針身部 42: Needle body part
43:導電彈簧 43:Conductive spring
5:絕緣匹配體 5: Insulation matching body
51:套環 51: Collar
S:容置槽 S: storage tank
D:預設方向 D: Default direction
L24:孔長度 L24: hole length
T21、T22:厚度 T21, T22: Thickness
G3、G4:間隙 G3, G4: gap
200:待測試晶片 200: Chip to be tested
300:電路板 300:Circuit board
Claims (10)
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| Application Number | Priority Date | Filing Date | Title |
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| TW111126385A TWI807917B (en) | 2022-07-14 | 2022-07-14 | Chip testing socket having impedance matching configuration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111126385A TWI807917B (en) | 2022-07-14 | 2022-07-14 | Chip testing socket having impedance matching configuration |
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| Publication Number | Publication Date |
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| TWI807917B TWI807917B (en) | 2023-07-01 |
| TW202403311A true TW202403311A (en) | 2024-01-16 |
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Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100543474C (en) * | 2002-04-16 | 2009-09-23 | 日本发条株式会社 | Holder for conductive contact |
| US7071715B2 (en) * | 2004-01-16 | 2006-07-04 | Formfactor, Inc. | Probe card configuration for low mechanical flexural strength electrical routing substrates |
| JP2007017234A (en) * | 2005-07-06 | 2007-01-25 | Molex Japan Co Ltd | Socket for inspection device |
| US8203354B2 (en) * | 2009-09-25 | 2012-06-19 | Intersil Americas, Inc. | System for testing electronic components |
| US20150168450A1 (en) * | 2013-12-17 | 2015-06-18 | Tim WOODEN | Coaxial Impedance-Matched Test Socket |
| CN108738355B (en) * | 2015-11-25 | 2020-11-06 | 佛姆法克特股份有限公司 | Floating nest for test socket |
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