TW202402409A - Wafer washing system and operation method thereof - Google Patents

Abstract

The present invention discloses a wafer washing system and an operation method thereof. The wafer washing system includes: a washing chamber; a wafer stage device arranged in the washing chamber; a liquid-film generation spray device; a functional-water feeding device, an output end of which is connected with an input end of the liquid-film generation spray device, and a washing spray device. The functional-water feeding device is used to feed a liquid mixed with functional gas. The washing spray device is used to spray a cleaning solution. In the present application, by the liquid-film generation spray device, the wafer is sprayed with the liquid mixed with functional gas in the functional-water feeding device before the main washing operation, so that the wafer surface is formed with a wet interface that is easy to be covered by the chemical cleaning solution while a part of pollutants are removed, thus improving the cleaning effect of the chemical cleaning solution at the spraying site of the subsequent cleaning spray device on the wafer surface, and improving the wafer cleaning quality.

Description

Wafer cleaning system and working method thereof

The present invention relates to the technical field of wafer cleaning, and in particular to a wafer cleaning system and a working method thereof.

At present, in the integrated circuit production industry, it is common to use a wet process to clean the surface of the wafer. Specifically, the wafer is driven to rotate at high speed through a corresponding carrying platform, and chemicals are sprayed on the wafer at the same time. on the surface to achieve cleaning of the wafer. However, in the actual cleaning process, workers often spray chemicals directly on relatively dry wafers. In this case, it is difficult for the chemicals to evenly cover the surface of the wafer, which also leads to poor cleaning effects. .

In view of this, in order to solve the above problems, the object of the present invention is to provide a wafer cleaning system, including:

cleaning chamber;

A wafer carrying platform, the wafer carrying platform is arranged in the cleaning chamber, and a wafer is placed on the wafer carrying platform;

a liquid film generating spray device, which is arranged outside the cleaning chamber, and the output end of the liquid film generating spray device is arranged toward the wafer;

Functional water supply device, the functional water supply device is arranged outside the cleaning chamber, the output end of the functional water supply device is connected to the input end of the liquid film generating spray device, the functional water supply device is used for Supply a liquid mixed with functional gas;

A cleaning spray device is provided above the wafer carrying platform, and the cleaning spray device is used to spray a cleaning liquid.

In another preferred embodiment, the functional gas includes: a mixture of one or more of nitrogen, carbon dioxide and hydrogen.

In another preferred embodiment, the liquid includes: one or a mixture of both chemical cleaning liquid and ultrapure water.

In another preferred embodiment, the functional water supply device includes: a gas-liquid mixing device, a gas input device, a liquid input device and an output pipeline, and the gas input device and the liquid input device are both connected with the gas A liquid mixing device is connected, the gas-liquid mixing device is connected to one end of the output pipeline, and the other end of the output pipeline is connected to the liquid film generating spray device.

In another preferred embodiment, the functional water supply device includes: a temperature control component, the temperature control component is installed on the output pipeline, and the temperature control component is used to control the mixture of water in the output pipeline. The temperature of the functional gas liquid.

In another preferred embodiment, the liquid film generating spray device includes: a base, a bracket, a small spray head, an upper arm and a lower arm, the base is arranged outside the cleaning chamber, and the The lower end of the bracket is connected to the base, the upper arm is arranged in the horizontal direction, one end of the upper arm is connected to the upper end of the bracket, and the other end of the upper arm is connected to the head of the small nozzle One end of the lower arm is connected to the upper end of the bracket, and the other end of the lower arm is connected to the tail of the small nozzle.

In another preferred embodiment, the cleaning spray device includes: a swing mechanism, a spray head assembly and a cleaning liquid supply device, the swing mechanism is arranged outside the cleaning chamber, the swing mechanism has a moving end, The moving end is connected to the nozzle assembly, and the nozzle assembly is connected to the cleaning fluid supply device through a pipeline.

In another preferred embodiment, it also includes: a mechanical transfer mechanism, the mechanical transfer mechanism is arranged outside the cleaning chamber, the mechanical transfer mechanism is arranged outside the cleaning chamber, the mechanical transfer mechanism is for transporting the wafers.

In another preferred embodiment, the wafer carrying platform is provided with a blowing group pieces.

Another object of the present invention is to provide a working method of a wafer cleaning system, including the wafer cleaning system described in any one of the above, including the following steps:

Step S1, place the wafer on the wafer carrying platform;

Step S2, spray the liquid mixed with the functional gas on the upper surface of the wafer through the liquid film generating spray device;

Step S3, spray chemical cleaning liquid on the upper surface of the wafer through the cleaning spray device;

Step S4: Spray ultrapure water on the upper surface of the wafer through the cleaning spray device.

Due to the adoption of the above technical solution, the present invention has a positive effect compared with the prior art: through the application of the present invention, the liquid film generating spray device wafer is sprayed with functional water before performing the main cleaning operation. The liquid mixed with functional gas in the supply system can take away some contaminants and form a wet interface on the wafer surface that is easy to be coated with chemical cleaning liquid, thereby improving the chemical spraying area of the subsequent cleaning spray device. The cleaning effect of the cleaning liquid on the wafer surface further improves the cleaning quality of the wafer.

1: Cleaning chamber

10: base

11: Bracket

12:Small nozzle

13: Upper arm

14:Lower arm

15: Mechanical transfer mechanism

16: Air blowing component

2: Wafer carrying platform

25:Support

3: Liquid film generation spray device

4: Functional water supply device

5: Clean the spray device

6: Gas-liquid mixing device

7:Gas input device

8: Liquid input device

9: Output pipeline

S1, S2, S3, S4: steps

Figure 1 is an overall schematic diagram of a wafer cleaning system of the present invention;

Figure 2 is a partial schematic diagram of a wafer cleaning system of the present invention.

The present invention will be further described below in conjunction with the drawings and specific embodiments, but shall not be used as a limitation of the present invention.

As shown in Figures 1 and 2, a wafer cleaning system of a preferred embodiment is shown, including: a cleaning chamber 1; a wafer carrying platform 2, the wafer carrying platform 2 is arranged in the cleaning chamber 1, and the wafer carrying platform A wafer is placed on 2; a liquid film generating spray device 3 is arranged outside the cleaning chamber 1, and the output end of the liquid film generating spray device 3 is arranged toward the wafer; a functional water supply device 4. The functional water supply device 4 is installed outside the cleaning chamber 1. The output end of the functional water supply device 4 is connected to the input end of the liquid film generating spray device 3. The functional water supply device 4 is used to supply a mixture of functional gas. liquid; cleaning spray device 5, the cleaning spray device 5 is arranged above the wafer carrying platform 2, The cleaning spray device 5 is used to spray a cleaning liquid. Further, through the use of this wafer cleaning system, the cooperation of the liquid film generating spray device 3 and the functional water supply device 4 is first used to pre-spray the wafers placed on the wafer carrying platform 2, so as to A wet interface is formed on the surface of the wafer that is easy to be coated with chemical cleaning liquid, and after the wet interface is coated, the conventional cleaning liquid is sprayed on the surface of the wafer through the cleaning spray device 5. At this time, the cleaning liquid is easier to coat the wafer. The surface of the wafer is cleaned to further improve the cleaning quality of the wafer surface.

Further, as a preferred embodiment, the functional gas includes: one or a mixture of one or more of nitrogen, carbon dioxide and hydrogen.

Further, as a preferred embodiment, the liquid includes: one or a mixture of two of chemical cleaning liquid and ultrapure water.

Further, as a preferred embodiment, further, the chemical cleaning liquid is one or a mixture of one or more of CA cleaning liquid, SPM cleaning liquid, SC1 cleaning liquid, SCI cleaning liquid and EKC cleaning liquid.

Further, as a preferred embodiment, the functional water supply device 4 includes: a gas-liquid mixing device 6, a gas input device 7, a liquid input device 8 and an output pipeline 9. The gas input device 7 and the liquid input device 8 are both connected with the gas. The liquid mixing device 6 is connected, the gas-liquid mixing device 6 is connected to one end of the output pipeline 9 , and the other end of the output pipeline 9 is connected to the liquid film generating spray device 3 . Further, the nitrogen, carbon dioxide or hydrogen provided by the gas input device 7 and the chemical cleaning liquid and ultrapure water provided by the liquid input device 8 are pre-mixed through the gas-liquid mixing device 6, so that this kind of liquid is mixed through the output pipeline 9. The gas-liquid mixture is sprayed onto the wafer surface from the liquid film generating spray device 3, thereby generating the above-mentioned wet interface.

Furthermore, as a preferred embodiment, the functional water supply device 4 includes: a temperature control component, which is installed on the output pipeline 9. The temperature control component is used to control the liquid mixed with functional gas in the output pipeline 9. temperature. Further, the temperature of the above-mentioned gas-liquid mixture is controlled through a temperature control component, so that a wet interface with sufficiently good performance can be generated on the surface of the wafer.

Furthermore, as a preferred embodiment, the temperature control component includes a temperature sensor, a heater and a refrigerator, and the temperature sensor, heater and/or refrigerator are all arranged on the output pipeline 9. The temperature sensor is used to detect the temperature of the fluid in the output pipeline 9 , the heater is used to heat the fluid in the output pipeline 9 , and the refrigerator is used to cool down the fluid in the output pipeline 9 .

Furthermore, as a preferred embodiment, the output end of the heater and the output end of the refrigerator are both arranged in a pipe-sheath structure and are sleeved at corresponding positions of the output pipe 9 .

Further, as a preferred embodiment, the cleaning chamber 1 includes: an outer cavity and an inner cavity. The inner cavity is nested in the outer cavity. The wafer carrying platform 2 is arranged inside the inner cavity, and the outer cavity Both the upper part of the outer cavity and the upper part of the inner cavity have an open structure. There is an accommodation space formed between the outer cavity and the inner cavity. An annular receiving opening is formed between the upper part of the outer cavity and the upper part of the inner cavity. The annular receiving opening The port is arranged around the wafer carrying platform 2, and the annular receiving port is used to receive the liquid splashed on the surface of the wafer during the cleaning process and store it in the accommodation space.

Furthermore, as a preferred embodiment, the bottom of the accommodation space has a lowest point, and a discharge channel is provided at the lowest point, and the discharge channel is used for discharging liquid.

Furthermore, as a preferred embodiment, an annular cavity is formed at the bottom of the accommodation space, the bottom end of the annular cavity is formed with the above-mentioned lowest point, and a heat conduction channel is formed inside the annular cavity, and the heat conduction channel The output pipeline 9 is arranged through the accommodating space and is isolated from the accommodating space. The output pipeline 9 is arranged through the heat conduction channel. Furthermore, the heat conduction channel is made of materials that are easy to transfer heat, and heat can be transferred through the contact between the output pipe 9 and the inner wall of the heat conduction channel, thereby utilizing the liquid recovered in the accommodation space and the liquid in the output pipe 9 The fluid undergoes heat exchange to adjust the temperature of the fluid in the output pipeline 9 .

Furthermore, as a preferred embodiment, the upper end of the wafer carrying platform 2 is provided with a rotating support part, and the rotating supporting part is used to support the wafer and drive the wafer to rotate. Furthermore, the rotation of the wafer driven by the rotating support part makes it easier for the liquid to spread on the surface of the wafer.

Furthermore, as a preferred embodiment, the liquid film generating spray device 3 includes: a base 10, a bracket 11, a small spray head 12, an upper arm 13 and a lower arm 14. The base 10 is arranged outside the cleaning chamber 1. , the lower end of the bracket 11 is connected to the base 10, the upper arm 13 is arranged in the horizontal direction, one end of the upper arm 13 is connected to the upper end of the bracket 11, and the other end of the upper arm 13 is connected to the head of the small nozzle 12 Connect, one end of the lower arm 14 is connected to the upper end of the bracket 11, and the other end of the lower arm 14 is connected to the tail of the small nozzle 12.

Furthermore, as a preferred embodiment, the horizontal height of the upper arm 13 is greater than the horizontal height of the lower arm 14 .

Furthermore, as a preferred embodiment, the other end of the upper arm 13 is provided with a first connecting piece for rotatingly connecting the small nozzle 12 , and the other end of the lower arm 14 is provided with a second connecting piece for connecting the small nozzle 12 Connectors.

Furthermore, as a preferred embodiment, the second connecting member is an adjustable telescopic structure, and the angle of the output end of the small nozzle 12 can be adjusted by adjusting the length of the second connecting member.

Furthermore, as a preferred embodiment, the telescopic structure includes: an adjusting plate and a fixing buckle. A waist-shaped hole is provided on the adjusting plate. One end of the adjusting plate is rotatably connected to the small nozzle 12. The fixing buckle can operatively secure the small nozzle 12. The tail is fixed at any position in the waist-shaped hole, and the fixed buckle is fixedly connected to the lower arm 14.

The above are only preferred embodiments of the present invention, and are not intended to limit the implementation and protection scope of the present invention.

On the basis of the above, the present invention also has the following implementation modes:

In a further embodiment of the present invention, it also includes: a working platform, on which the cleaning spray device 5, the liquid film generating spray device 3 and the cleaning chamber 1 are all arranged.

In a further embodiment of the present invention, the cleaning spray device 5 includes: a swing mechanism, a spray head assembly and a cleaning liquid supply device. The swing mechanism is arranged outside the cleaning chamber 1. The swing mechanism has a moving end, and the moving end is connected to the spray head assembly. The nozzle assembly is connected to the cleaning fluid supply device through pipelines. Further, the swing mechanism is used to drive the mobile end to swing in an arc in the horizontal direction.

Furthermore, as a preferred embodiment, it also includes: a mechanical transfer mechanism 15. The mechanical transfer mechanism 15 is arranged outside the cleaning chamber 1. The mechanical transfer mechanism 15 is arranged outside the cleaning chamber 1. The mechanical transfer mechanism 15 is used to transport crystals. disc.

In a further embodiment of the present invention, the mechanical transfer mechanism 15 includes: a lifting component, a translation component, a transfer rack and a vacuum adsorption component. The lifting component is connected to the translation component, and the lifting component is used for The translation component is driven to lift, and the translation component is connected to the transfer rack. The translation component is used to drive the transfer rack to move horizontally. The vacuum adsorption component is arranged on the upper surface of the transfer rack, and the vacuum adsorption component is operatively in contact with the lower surface of the wafer. and adsorb.

In a further embodiment of the present invention, a blowing assembly 16 is provided on the wafer carrying platform 2 . Further, the blowing assembly 16 at least includes a plurality of blowing nozzles disposed on the wafer carrying platform 2. The blowing nozzles are used to blow out clean air. When the wafer is in a cleaning state, the blowing nozzles are used to clean the wafer. The lower surface of the wafer blows out a weak and stable air flow to prevent liquid from splashing into the lower surface of the wafer. When the wafer is cleaned, the air blowing nozzle is used to blow out a strong and stable air flow so that the wafer is blown It floats in the air, and is convenient for the transfer rack to extend between the wafer and the carrying platform to support the lower surface of the wafer. When the transfer rack extends into the lower surface of the wafer, its body structure It should be staggered with the position of the blowing nozzle to avoid interfering with the blowing of the blowing nozzle.

In a further embodiment of the present invention, the transfer rack includes: a mounting portion and two transfer arms. The two transfer arms are arranged in parallel. One end of the two transfer arms is connected to the mounting portion and is spaced a certain distance apart.

In a further embodiment of the present invention, a liquid draining device is connected to the gas-liquid mixing device 6, and the liquid draining device is used to drain the residual liquid in the gas-liquid mixing device 6 after the work is completed.

In a further embodiment of the present invention, the invention also includes: a waste liquid recovery device, the output end and the discharge channel of the liquid discharge device are both connected to the waste liquid recovery device.

The present invention also shows a working method of a wafer cleaning system in a preferred embodiment, including any one of the above wafer cleaning systems, including the following steps:

Step S1, place the wafer on the wafer carrying platform 2;

Step S2, spray the liquid mixed with the functional gas on the upper surface of the wafer through the liquid film generating spray device 3;

Step S3, spray chemical cleaning liquid on the upper surface of the wafer through the cleaning spray device 5;

Step S4, spray ultrapure water on the upper surface of the wafer through the cleaning spray device 5.

The above are only preferred embodiments of the present invention, and do not limit the implementation and protection scope of the present invention. Those skilled in the art should be able to realize that any application of the present invention Solutions resulting from equivalent substitutions and obvious changes made to the contents of the description and drawings shall be included in the protection scope of the present invention.

1: Cleaning chamber

2: Wafer carrying platform

3: Liquid film generation spray device

4: Functional water supply device

5: Clean the spray device

6: Gas-liquid mixing device

7:Gas input device

8: Liquid input device

9: Output pipeline

15: Mechanical transfer mechanism

16: Air blowing component

Claims (10)

A wafer cleaning system, characterized by including: cleaning chamber; A wafer carrying platform, the wafer carrying platform is arranged in the cleaning chamber, and a wafer is placed on the wafer carrying platform; a liquid film generating spray device, which is arranged outside the cleaning chamber, and the output end of the liquid film generating spray device is arranged toward the wafer; Functional water supply device, the functional water supply device is arranged outside the cleaning chamber, the output end of the functional water supply device is connected to the input end of the liquid film generating spray device, the functional water supply device is used for Supply a liquid mixed with functional gas; A cleaning spray device is provided above the wafer carrying platform, and the cleaning spray device is used to spray a cleaning liquid. The wafer cleaning system according to claim 1, wherein the functional gas includes: one or a mixture of one or more of nitrogen, carbon dioxide and hydrogen. The wafer cleaning system according to claim 1, wherein the liquid includes: one or a mixture of two of chemical cleaning liquid and ultrapure water. The wafer cleaning system according to claim 1, wherein the functional water supply device includes: a gas-liquid mixing device, a gas input device, a liquid input device and an output pipeline, the gas input device and the liquid input device Both are connected to the gas-liquid mixing device, the gas-liquid mixing device is connected to one end of the output pipeline, and the other end of the output pipeline is connected to the liquid film generating spray device. The wafer cleaning system according to claim 4, wherein the functional water supply device includes: a temperature control component, the temperature control component is installed on the output pipeline, and the temperature control component is used to control the output The temperature of the liquid mixed with functional gas in the pipeline. The wafer cleaning system according to claim 1, wherein the liquid film generating spray device includes: a base, a bracket, a small spray head, an upper arm and a lower arm, and the base is disposed on the cleaning On the outside of the washing chamber, the lower end of the bracket is connected to the base, the upper arm is arranged in the horizontal direction, one end of the upper arm is connected to the upper end of the bracket, and the other end of the upper arm is Connected to the head of the small nozzle, one end of the lower arm is connected to the upper end of the bracket, and the other end of the lower arm is connected to the tail of the small nozzle. The wafer cleaning system according to claim 1, wherein the cleaning spray device includes: a swing mechanism, a spray head assembly and a cleaning liquid supply device, the swing mechanism is arranged outside the cleaning chamber, the swing mechanism It has a moving end, the moving end is connected to the nozzle assembly, and the nozzle assembly is connected to the cleaning fluid supply device through a pipeline. The wafer cleaning system according to claim 1, further comprising: a mechanical transfer mechanism, the mechanical transfer mechanism is arranged outside the cleaning chamber, the mechanical transfer mechanism is arranged outside the cleaning chamber, so The mechanical transfer mechanism is used to transport the wafer. The wafer cleaning system according to claim 1, wherein an air blowing component is provided on the wafer carrying platform. A working method of a wafer cleaning system, including the wafer cleaning system described in any one of the above claims 1 to 9, including the following steps: Step S1, place the wafer on the wafer carrying platform; Step S2, spray the liquid mixed with the functional gas on the upper surface of the wafer through the liquid film generating spray device; Step S3, spray chemical cleaning liquid on the upper surface of the wafer through the cleaning spray device; Step S4: Spray ultrapure water on the upper surface of the wafer through the cleaning spray device.