TW202401894A - Chip packaging structure - Google Patents

Abstract

A chip packaging structure includes a chip module and a main body, wherein the main body has a first portion, a second portion, and a holding portion. The second portion protrudes from the first portion, and a size of the second portion is less than a size of the first portion. The holding portion is located at the second portion, and the chip module is placed at the holding portion to be engaged with the main body.

Description

Chip packaging structure

The present invention relates to chip packaging; in particular, it refers to a chip packaging structure.

Radio frequency technology (Radio Frequency Identification) is widely used in the automotive industry. The industry practice is to implant radio frequency tags into tires, which can also be used to track other automotive components. As long as wireless radio frequency readers are installed at specific locations such as toll stations and regular inspection stations, the use or operation status of relevant components can be tracked. However, since the operating environment of automobiles is often high temperature and high pressure, radio frequency tags implanted in tires or various automobile components need to have good environmental tolerance. This is also an improvement goal that the industry has been pursuing.

In view of the above reasons, the present invention provides a chip packaging structure, which helps to improve the tolerance of the packaged chip and is more suitable for use in the automobile industry.

The present invention proposes a chip packaging structure, including a chip module and a main body, wherein the main body includes a first part, a second part, and a carrying part, wherein the second part protrudes from the first part, and the The size of the second part is smaller than the size of the first part; the carrying part is located in the second part; wherein the chip module is placed on the carrying part and combined with the main body.

In one embodiment, the carrying part of the main body is located on a side of the second part away from the first part, and the chip module is placed on the carrying part.

In one embodiment, the chip package structure further includes a linear antenna, wherein the linear antenna includes a first extension part, a second extension part, and a winding part; the first extension part is connected to the winding part, and the The second extension part is connected to the wrapping part, and the wrapping part is wrapped around the chip module.

In one embodiment, the chip packaging structure further includes an adhesive for bonding the winding portion of the linear antenna and the chip module, wherein the adhesive system covers at least a portion of at least one side of the chip module.

In one embodiment, the main body further includes a third part, wherein the third part is connected to the second part and is located on the opposite side of the first part; the size of the third part is larger than the size of the second part ; The carrying part of the main body is located inside the second part, and the first part and the third part respectively have a through hole connected with the carrying part; the chip module is placed in the carrying part.

In one embodiment, the main body includes a first coupling shell and a second coupling shell; the first coupling shell and the second coupling shell are coupled to form the first part and the second coupling shell. part, the third part, and the carrying part located inside the second part.

In one embodiment, the chip package structure further includes a linear antenna, wherein the linear antenna includes a first extension part, a second extension part, and a winding part; the first extension part is connected to the winding part, and the The second extension part is connected to the wrapping part, and the wrapping part is wrapped around the second part of the main body.

In one embodiment, the chip packaging structure further includes an adhesive for bonding the winding portion of the linear antenna and the main body, wherein the adhesive system covers at least a portion of at least one side of the main body.

In one embodiment, ends of the first extension part and the second extension part of the linear antenna away from the winding part are close to each other.

In one embodiment, the winding portion of the linear antenna is substantially rectangular or circular.

In one embodiment, the first part and the third part of the main body are rectangular or circular in outer shape.

In one embodiment, the through hole of the first part, the bearing part located inside the second part, and the through hole of the third part all have rectangular or circular cross-sectional shapes.

In one embodiment, the first part, the second part and the third part jointly form a groove to accommodate the winding part of the linear antenna; the groove has a semicircular arc shape, a rectangular shape, or a polygonal shape. the cross-sectional shape.

In one embodiment, the main system is made of a thermoplastic elastomer.

In one embodiment, the thermoplastic elastic system is selected from elastic plastics with Shore hardness A and D.

Through the above design, the chip packaging structure provided by the present invention has better tolerance, can be used in high temperature and high pressure environments, and is not prone to damage.

In order to illustrate the present invention more clearly, the preferred embodiments are described in detail below along with the drawings. 1 and 2 show a chip packaging structure 10 according to a first embodiment of the present invention, which includes a chip module 12, a main body 14, a linear antenna 16, and an adhesive 18. It should be noted that the chip module 12 usually includes a micro antenna and a radio frequency identification chip connected to each other. However, since the internal structure of the chip module 12 is not the focus of the present invention, the micro antenna and radio frequency identification chip are not the focus of the present invention. The chip is not shown in the drawings of the present invention, nor does it constitute a limitation of the present invention; basically, as long as it conforms to the industry's general understanding of chip modules, it can be regarded as equivalent to the chip module of the present invention. 12. The same applies to other embodiments, which will be described first.

Referring to FIGS. 1 and 2 , the main body 14 of the chip packaging structure 10 includes a first part 142 , a second part 144 , a third part 148 , and a carrying part 146 . The second part 144 protrudes from the first part 142, and the size of the second part 144 is smaller than the size of the first part 142; the third part 148 is connected to the second part 144 and is located on the opposite side of the first part 142, and the third part 148 is connected to the second part 144. The size of the third part 148 is also larger than the size of the second part 144. In this embodiment, the bearing part 146 of the main body 14 is located inside the second part 144, and the first part 142 has a through hole 1422, and the third part also has a through hole 1482. These through holes 1422, 1482 are respectively connected with the bearing part. 146 connected. The chip module 12 is combined with the main body 14 by being placed in the carrying part 146. More specifically, the chip module 12 is placed in the carrying part 146 through the through hole 1422 or the through hole 1482, thereby being combined with the main body. 14.

The linear antenna 16 includes a first extension part 162, a second extension part 164, and a winding part 166. The first extension part 162 is connected to the winding part 166, the second extension part 164 is connected to the winding part 166, and the winding part 166 Then it is wrapped around the main body 14. Since the size of the second part 144 of the main body 14 is smaller than the first part 142 and the third part 148, a groove 150 is formed on the outer surface of the main body 14 to accommodate the winding part 166 of the linear antenna 16, so that the winding part 166 can be along the Wrap around groove 150. It should be noted that the winding manner of the winding portion 166 and the shapes of the extension portions 162 and 164 shown in the figure are only examples and are not limitations of the present invention; in other words, in other embodiments, the shapes of the extension portions 162 and 164 It can be irregular, and the number of winding turns of the winding portion 166 is not particularly limited; in addition, the groove 150 can also be designed to have a semicircular arc, rectangle, or polygonal cross-sectional shape depending on the use requirements.

The adhesive 18 is used to bond the winding portion 166 of the linear antenna 16 to the main body 14 to ensure a tight combination between the linear antenna 16 and the main body 14. In order to provide a basic bonding effect, the adhesive 18 should cover at least one side of the main body 14. at least part of. However, in other embodiments, if the wrapping portion 166 of the linear antenna 16 itself can be firmly wrapped around the main body 14 without risk of falling off, the adhesive 18 can of course be omitted.

Please refer to FIG. 3 again, which shows a chip packaging structure 20 according to a second embodiment of the present invention. Like the same embodiment, the chip packaging structure 20 also includes a chip module 22 and a main body 24 (the linear antenna and adhesive are omitted in this figure). The main body 24 also includes a first part 242 and a second part 244 , a carrying part 246, and a third part 248, and the sizes of the first part 242 and the third part 248 are both larger than the size of the second part 244, so that a groove 250 is formed on the outer surface of the main body 24 for the linear antenna ( (not shown) is used for the winding operation; in addition, the carrying portion 246 is also located inside the second portion 244 for accommodating the chip module 22 . Different from the previous embodiment, the main body 24 further includes a first coupling shell 24A and a second coupling shell 24B. The first coupling shell 24A and the second coupling shell 24B are combined to form the aforementioned structure. The first part 242, the second part 244, the third part 248, and the bearing part 246 located inside the second part 244. By using the synthetic shape design, the chip module 22 no longer needs to pass through the through holes in the first part 242 or the third part 248 to be placed on the carrying part 246; in other words, in this embodiment, the first part No matter whether 242 and the third part 248 are provided with through holes, they do not affect the combination of the chip module 22 and the main body 24 .

Next, please refer to FIG. 4 and FIG. 5 , which shows a chip packaging structure 30 according to a third embodiment of the present invention. Same as the previous two embodiments, the chip packaging structure 30 includes a chip module 32, a main body 34, a linear antenna 36, and an adhesive 38. The main body 34 also includes a first part 342 and a second part 344. , and a carrying part 346. The second part 344 of the main body 34 protrudes from the first part 342 , and the size of the first part 342 is larger than the size of the second part 344 . Different from the previous embodiments, the main body 34 does not have a third part, so the dimensions of the first part 342 and the second part 344 are designed so that the outer surface of the main body 34 forms a groove 350 with only a single groove wall.

In this embodiment, the carrying part 346 is not inside the second part 344, but is located on a side of the second part 344 away from the first part 342, and the chip module 32 is placed on the carrying part 346 to communicate with it. The main body 34 is combined. The linear antenna 36 includes a first extension part 362, a second extension part 364, and a winding part 366. The first extension part 362 is connected to the winding part 366, the second extension part 364 is connected to the winding part 366, and the winding part 366 is connected to the winding part 366. 366 is wound around the chip module 32 placed on the carrying portion 346 . The adhesive 38 covers at least a part of at least one side of the chip module 32, thereby bonding the winding portion 366 of the linear antenna 36 and the chip module 32 together. It should be noted that the shapes of the extension portions 362 and 364 are not limited to those shown in the figures, and the number of winding turns of the winding portion 366 is not a limitation of the present invention; in addition, in other embodiments, the linear antenna 36 The wrapping portion 366 can also be wrapped around the main body 34 along the groove 350 formed on the outer surface of the main body 34 as in the previous embodiment, and is not limited to what is described here.

Figures 6 and 7 show a chip packaging structure 40 of the fourth embodiment of the present invention. Its structure is basically the same as the first embodiment, and also includes a chip module 42, a main body 44, a linear antenna 46, and an adhesive Only the body 44 of the colloid 48 is circular in shape, which is different from the rectangular design seen in the first embodiment. To be more specific, the circular main body 44 also includes a first part 442, a second part 446, a third part 448, and a bearing part, where the second part 446 protrudes from the first part 442, and the third part 448 is located on the other side relative to the first part 442 and is connected to the second part 446, and the size of the second part 446 is smaller than the size of the first part 442 and the third part 448, so that the outer surface of the main body 42 forms an annular shape. trench. The linear antenna 46 includes a first extension part 462, a second extension part 464, and a winding part 466. The first extension part 462 and the second extension part 464 are respectively connected to opposite sides of the winding part 466, and the winding part 466 An annular groove along the outer surface of body 42 wraps around body 44 . The adhesive 48 is also used to bond the winding portion 466 of the linear antenna 46 and the main body 42 to cover at least a portion of the outer surface of the main body 42 .

It should be noted that, in accordance with the shape of the main body 42 , the winding portion 466 of the linear antenna 46 is essentially circular. However, in other embodiments (such as the aforementioned embodiments), the winding portion 466 of the linear antenna 46 has a circular shape. The wrap shape can also be rectangular in nature. In this embodiment, a through hole 4422 of the first part 442 of the main body 44, a bearing part inside the second part 446, and a through hole 4482 of the third part 448 all have circular cross-sectional shapes, but This is not a necessary limitation of the present invention. Please refer to another implementation aspect of this embodiment shown in Figure 8. The first part 442 of the main body 44 has a through hole 4422', a bearing part inside the second part 446, and a third The cross-sectional shapes of the other through holes 4482' and so on of the three parts 448 are all rectangular. Comparing the foregoing embodiments (such as the first embodiment), it can be understood that the shapes of the first portion 142, 442 and the third portion 148, 448 of the main body 14, 44 of the chip packaging structure of the present invention can have different shapes, which are rectangular. Or round shape is acceptable, and other shapes not shown in the drawings of this case are not excluded.

Finally, please refer to FIG. 9 , which shows a chip packaging structure 50 according to a fifth embodiment of the present invention, including a chip module 52 , a main body 54 , a linear antenna 56 , and an adhesive 58 . The structural relationship of these components is as described in the previous embodiments. The main difference is that the linear antenna 56 has a first extending portion 562 and a second extending portion 564 that are close to each other at ends 562A and 564A away from its winding portion. In other words, in this embodiment, the linear antenna 56 generally takes the form of a loop antenna, but does not completely form a loop. However, what is shown here is only an example. In other embodiments, the end 562A and the end 564A can also be substantially connected, so that the linear antenna 56 becomes a complete loop.

It is worth mentioning that in each of the above-mentioned embodiments, the main body 14, 24, 34, 44, 55 is made of a thermoplastic elastomer. More specifically, the thermoplastic elastomer system is selected from Shore Hardness (Shore Hardness). ) Elastic plastics of A and D, and the melting point is lower than the temperature required for the tire vulcanization process. By selecting such a material, the main body 14, 24, 34, 44, 55 of the chip packaging structure 10, 20, 30, 40, 50 of the present invention will melt when encountering the tire vulcanization manufacturing process. Therefore, if the chip package structure of the present invention is The chip packaging structure 10, 20, 30, 40, 50 is applied inside the tire, and the melted main body 14, 24, 34, 44, 55 can bring at least the following two advantages: 1). Main body 14, 24, 34, 44 , 55 will be integrated with the tire body at least at its edges. Therefore, after the tire is formed, the structure formed by the tire and the main body 14, 24, 34, 44, 55 can have a more uniform material, and reduce the number of the main body 14, 24, 55. The sharpness of the corners of 34, 44, 55; 2). Some wires of the tire will wrap around the main body 14, 24, 34, 44, 55 that have been integrated with the tire body. 55 is integrated with the tire body at least at its edges, so these wires can have better coupling with the chip modules 12, 22, 32, 42, 52 inside the chip packaging structure 10, 20, 30, 40, 50 of the present invention. Effect.

According to the above description, the chip packaging structures 10, 20, 30, 40, 50 of the present invention can provide better durability and are especially suitable for use inside tires and other applications in the automotive industry.

The above are only the best possible embodiments of the present invention. All equivalent structural changes made by applying the description and patent scope of the present invention should be included in the patent scope of the present invention.

[First Embodiment] 10: Chip packaging structure 12:Chip module 14:Subject 142: Part One 1422:Through hole 144:Part 2 146: Bearing part 148:Part 3 1482:Through hole 150:Trench 16:Linear antenna 162:First extension 164:Second extension 166: Winding Department 18:Viscose [Second Embodiment] 20: Chip packaging structure 22:Chip module 24:Subject 242: Part One 244:Part 2 246: Bearing part 248:Part 3 24A:The first pair of shells 24B: The second pair of shells 250:Trench [Third Embodiment] 30: Chip packaging structure 32:Chip module 34:Subject 342: Part One 344:Part 2 346: Bearing part 350:Trench 36:Linear antenna 362:First extension 364:Second extension 366: Winding Department 38:Viscose [Fourth Embodiment] 40: Chip packaging structure 42:Chip module 44:Subject 442: Part One 4422, 4422’:Through hole 446:Part 2 448:Part 3 4482, 4482’:Through hole 46:Linear antenna 462:First extension 464:Second extension 466: Winding Department 48:Viscose [Fifth Embodiment] 50: Chip packaging structure 52:Chip module 54:Subject 56:Linear antenna 562:First extension 564:Second extension 562A:end 564A:end 58:Viscose

FIG. 1 is a perspective view of the chip packaging structure of the first embodiment of the present invention. FIG. 2 is an exploded view of the chip package structure of the first embodiment of the present invention, illustrating the combination of the chip module and the main body. The linear antenna is omitted in this figure. FIG. 3 is an exploded view of the chip packaging structure of the second embodiment of the present invention, illustrating another way of combining the chip module and the main body. The linear antenna is also omitted in this figure. FIG. 4 is a perspective view of a chip packaging structure according to a third embodiment of the present invention. FIG. 5 is an exploded view of the chip package structure of the third embodiment of the present invention, illustrating the combination of the chip module and the main body. The linear antenna is also omitted in this figure. FIG. 6 is an exploded view of the chip packaging structure of the fourth embodiment of the present invention. FIG. 7 is a top view of the chip packaging structure of the fourth embodiment of the present invention, in which the chip module and the linear antenna are omitted in this figure. 8 is a top view of another implementation aspect of the chip packaging structure of the fourth embodiment of the present invention, in which the chip module and the linear antenna are also omitted in this figure. FIG. 9 is a top view of the chip packaging structure of the fifth embodiment of the present invention.

10: Chip packaging structure

12:Chip module

14:Subject

142: Part One

148:Part 3

16:Linear antenna

162:First extension

164:Second extension

166: Winding Department

18:Viscose

Claims (15)

A chip packaging structure includes: a chip module; and A main body includes a first part, a second part, and a bearing part, wherein the second part protrudes from the first part, and the size of the second part is smaller than the size of the first part; the bearing part is located The second part; The chip module is placed on the carrying part and combined with the main body. The chip packaging structure of claim 1, wherein the carrying part of the main body is located on a side of the second part away from the first part, and the chip module is placed on the carrying part. The chip packaging structure of claim 2 further includes a linear antenna, wherein the linear antenna includes a first extension part, a second extension part, and a winding part; the first extension part is connected to the winding part, The second extension part is connected to the wrapping part, and the wrapping part is wrapped around the chip module. The chip packaging structure of claim 3 further includes an adhesive for bonding the winding portion of the linear antenna and the chip module, wherein the adhesive system covers at least part of at least one side of the chip module. The chip packaging structure of claim 1, wherein the main body further includes a third part, wherein the third part is connected to the second part and is located on the opposite side of the first part; the size of the third part is larger than The size of the second part; the carrying part of the main body is located inside the second part, and the first part and the third part respectively have a through hole connected to the carrying part; the chip module is placed on the Inside the load-bearing part. The chip packaging structure of claim 5, wherein the main body includes a first pairing shell and a second pairing shell; the first pairing shell and the second pairing shell are combined to form the third pairing shell. One part, the second part, the third part, and the carrying part located inside the second part. The chip packaging structure of claim 5 further includes a linear antenna, wherein the linear antenna includes a first extension part, a second extension part, and a winding part; the first extension part is connected to the winding part, The second extension part is connected to the wrapping part, and the wrapping part is wrapped around the second part of the main body. The chip packaging structure of claim 7 further includes an adhesive for bonding the winding portion of the linear antenna and the main body, wherein the adhesive system covers at least part of at least one side of the main body. The chip packaging structure of claim 8, wherein ends of the first extension part and the second extension part of the linear antenna away from the winding part are close to each other. The chip packaging structure of claim 7, wherein the winding portion of the linear antenna is essentially rectangular or circular. The chip packaging structure of claim 5, wherein the outer shapes of the first part and the third part of the body are rectangular or circular. The chip packaging structure of claim 5, wherein the through hole of the first part, the carrying part located inside the second part, and the through hole of the third part all have a rectangular or circular cross-sectional shape . The chip packaging structure of claim 5, wherein the first part, the second part and the third part jointly form a groove to accommodate the winding part of the linear antenna; the groove has a semi-circular arc Shape, rectangle, or polygonal cross-section. The chip packaging structure of claim 1, wherein the main system is made of a thermoplastic elastomer. The chip packaging structure of claim 1, wherein the thermoplastic elastic system is selected from elastic plastics with Shore hardness A and D.

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