TW202401848A - Light emitting device - Google Patents

Abstract

A light emitting device is disclosed. The light emitting device includes: a substrate; a semiconductor stack formed on the substrate and including a first type semiconductor layer, a second type semiconductor layer, an active region located between the first type semiconductor layer and the second type semiconductor layer to emit light; a reflective structure formed on the semiconductor stack and including one or multiple openings; and a conductive structure formed on the reflective structure and filling in the one or multiple openings to electrically connected to the second type semiconductor layer; wherein the reflective structure includes a plurality of groups of stack structures, the plurality of groups of stack structures includes a first stack structure, and the first stack structure includes a first sub-layer, a second sub-layer and a third sub-layer sequentially stacking on the semiconductor stack, wherein the first sub-layer has a first optical thickness and a first refractive index, the second sub-layer has a second optical thickness and a second refractive index, the third sub-layer has a third optical thickness and a third refractive index, wherein the first optical thickness > the third optical thickness > the second optical thickness, and the first refractive index < the second refractive index < the third refractive index.

Description

Light emitting element

This application relates to a light-emitting element, and more specifically, to a light-emitting element that improves brightness.

Light-emitting diodes (LEDs) in solid-state light-emitting components have low power consumption, low heat production, long life, small size, fast response speed, and good optoelectronic properties, such as stable luminescence wavelength, so they have been widely used. Used in household devices, indicator lights and optoelectronic products, etc.

A conventional light emitting diode includes a substrate, an n-type semiconductor layer, an active layer and a p-type semiconductor layer formed on the substrate, and p and n-electrodes formed on the p-type/n-type semiconductor layer respectively. When the light-emitting diode is energized through the electrode and is forward biased at a specific value, the holes from the p-type semiconductor layer and the electrons from the n-type semiconductor layer are combined in the active region to emit light. However, as light-emitting diodes are used in different optoelectronic products, the brightness specifications of light-emitting diodes are also improved. How to improve their brightness is one of the research and development goals of those in the technical field.

This application discloses a light-emitting element, including a substrate; a semiconductor stack is disposed on the substrate, including a first-type semiconductor layer, a second-type semiconductor layer, and an active region located between the first-type semiconductor layer and the second-type semiconductor layer. Emit a light; a reflective structure is formed on the semiconductor stack and has one or more reflective structure openings; and a conductive structure is formed on the reflective structure, filling the one or more reflective structure openings and electrically connected to the second type semiconductor layer; wherein the reflective structure includes a plurality of stacked structures, and the plurality of stacked structures includes a first group of stacked structures, the first group of stacked structures includes a first sub-layer, a second sub-layer and a third sub-layer sequentially stacked on the semiconductor On the stack, the first sub-layer has a first optical thickness and a first refractive index, the second sub-layer has a second optical thickness and a second refractive index, the third sub-layer has a third optical thickness and a third refractive index, and the third sub-layer has a third optical thickness and a third refractive index. An optical thickness>third optical thickness>second optical thickness, and first refractive index<second refractive index<third refractive index.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings to enable those skilled in the art to fully understand the spirit of the present invention. The present invention is not limited to the following embodiments, but can be implemented in other forms. In this specification, there are some identical symbols, which represent components with the same or similar structures, functions, and principles, and those with general knowledge in the industry can deduce them based on the teachings of this specification. For the sake of simplicity in the description, components with the same symbols will not be repeated.

Figure 1 shows a top view of a light-emitting element 1 according to an embodiment of the present application. Figure 2A shows a cross-sectional view along line A-A' in Figure 1. The light-emitting element 1 includes a substrate 10, a semiconductor stack 12, one or a plurality of exposed areas 28, a first protective layer 21, a reflective structure 50, a second protective layer 23, a first contact layer 20, a first Two contact layers 30, a third protective layer 25, a first bonding pad 80a, and a second bonding pad 80b. In one embodiment, the light-emitting element 1 may include a transparent conductive layer 18 located on the second-type semiconductor layer 122 and between the second-type semiconductor layer 122 and the reflective structure 50 .

Specifically, the semiconductor stack 12 is located on the substrate 10 and includes a first-type semiconductor layer 121, a second-type semiconductor layer 122, and an active area between the first-type semiconductor layer 121 and the second-type semiconductor layer 122. 123. The exposed area 28 includes a peripheral area and an internal area respectively located on the semiconductor stack 12, and exposes a first-type semiconductor layer upper surface 121a. The exposed area 28 includes sidewalls and a bottom, and the bottom is composed of the exposed upper surface 121a of the first-type semiconductor layer. The first protective layer 21 covers part of the upper surface 121 a of the first-type semiconductor layer in the exposed region 28 , and extends to cover part of the upper surface of the second-type semiconductor layer 122 . In other words, the first protective layer 21 contacts part of the bottom and sidewalls of the exposed region 28 and part of the upper surface of the second-type semiconductor layer 122 . In another embodiment, around the semiconductor stack 12 , the first protective layer 21 further extends to cover the sidewalls of the first-type semiconductor layer 121 (not shown) that are in contact with the upper surface 10 a of the substrate. The first protective layer 21 includes one or a plurality of first first protective layer openings 210 and one or a plurality of second first protective layer openings 212. The first first protective layer opening 210 is located on the second type semiconductor layer 122 and exposes The second-type semiconductor layer 122 and/or the transparent conductive layer 18 are exposed, and the second first protective layer openings 212 are respectively located on the exposed areas 28 in the internal region of the semiconductor stack 12, and expose the first-type semiconductor layer upper surface 121a. In one embodiment, the transparent conductive layer 18 is located in the first protective layer opening 210 and extends onto the first protective layer 21 . The reflective structure 50 is located on the transparent conductive layer 18 or the second type semiconductor layer 122, and includes one or a plurality of first reflective structure openings 501 formed corresponding to the exposed area 28 and the transparent conductive layer opening 180, and one or a plurality of second reflective structures. The opening 502 exposes the transparent conductive layer 18 and/or the second type semiconductor layer 122 . The conductive structure 36 is located on the reflective structure 50 and is electrically connected to the transparent conductive layer 18 and/or the second-type semiconductor layer 122 through the reflective structure opening 502 . In one embodiment (not shown), the reflective structure 50 includes a plurality of island-shaped structures distributed on the second-type semiconductor layer 122, and the conductive structure 36 communicates with the transparent conductive layer 18 and the second-type semiconductor layer 122 through the gaps between the island-shaped structures. The semiconductor layer 122 is electrically connected. The second protective layer 23 is formed on the first protective layer 21 and extends from the exposed area 28 to cover the conductive structure 36 . The second protective layer 23 includes one or a plurality of first and second protective layer openings 230 located on the conductive structure 36 , and a portion of the conductive structure 36 is exposed through the first and second protective layer openings 230 . In addition, the second protective layer 23 includes one or a plurality of second protective layer openings 232 respectively located on the exposed areas 28 in the internal region of the semiconductor stack 12 , and the first-type semiconductor is exposed through the second second protective layer openings 232 Layer upper surface 121a. In one embodiment, the first protective layer 21 and the second protective layer 23 respectively include one or a plurality of third first protective layer openings 214 and one or a plurality of third second protective layer openings 234 located around the semiconductor stack 12 The exposed area 28 of the region exposes the first-type semiconductor layer upper surface 121a through the third first protective layer opening 214 and the third second protective layer opening 234. In one embodiment, a plurality of third first protective layer openings 214 and a plurality of third second protective layer openings 234 may be spaced apart on the exposed area 28 located around the semiconductor stack 12 . In one embodiment, since the second protective layer 23 covers the sidewalls of the exposed region 28 , that is, the sidewalls of the semiconductor stack 12 , the semiconductor stack 12 can be protected from possible damage to the semiconductor stack 12 or abnormal electrical properties in subsequent processes. Contact creates a short circuit. In another embodiment, around the semiconductor stack 12 , the second protective layer 23 further covers the sidewalls of the first-type semiconductor layer 121 under the exposed region 28 .

In one embodiment, the exposed region 28 can be formed by removing part of the second-type semiconductor layer 122, the active layer 123 and the first-type semiconductor layer 121 to expose the upper surface 121a of the first-type semiconductor layer 121. As shown in FIG. 1 , relative to the exposed area 28 , other areas of the semiconductor stack 12 form a mesa MS. In this embodiment, the exposed area 28 includes a peripheral area surrounding the high platform MS and an internal area distributed within the high platform MS around the semiconductor stack 12 . In an embodiment of the first type semiconductor, as shown in FIG. 1 , the outline of the platform MS includes a plurality of convex portions and a plurality of concave portions arranged at intervals. It is wavy. In other embodiments, when viewed from a top view, the outline of the platform MS includes a zigzag, a square wave, or other non-linear patterns. In one embodiment, a plurality of recessed portions are provided corresponding to the third first protective layer opening 214 and the third second protective layer opening 234 . The recessed portion of the profile of the mesa MS can increase the area around the exposed region 28, thereby increasing the contact area between the contact layer 20 and the exposed region 28 to improve current injection. In addition, the high platform MS profile can increase the lateral light extraction area. However, the increase in recesses will also cause a loss of light-emitting area. Therefore, the pattern design of the high-station MS profile can be optimized by taking into account the contact area between the contact layer 20 and the area around the exposed area 28 and the loss of light-emitting area. The pattern design of the high platform MS profile can improve current injection while maintaining the optimal light-emitting area, and can improve the light extraction efficiency of the light-emitting element 1 .

The first contact layer 20 and the second contact layer 30 are formed on the semiconductor stack 12 . The first contact layer 20 covers the first protective layer 21 and the second protective layer 23 through the second first protective layer opening 212, the third first protective layer opening 214, the second second protective layer opening 232 and the third second protective layer opening 212. The protective layer opening 234 is electrically connected to the first type semiconductor layer 121 . The second contact layer 30 is separated from the first contact layer 20 , contacts the conductive structure 36 through the first and second protective layer openings 230 , and is electrically connected to the second type semiconductor layer 122 . In one embodiment, the second contact layer 30 is located in the first and second protective layer openings 230 . In another embodiment, the second contact layer 30 is located in the first and second protective layer openings 230 and extends onto the second protective layer 23 . The third protective layer 25 is located on the first contact layer 20 and the second contact layer 30 , and includes one or a plurality of first and third protective layer openings 251 to expose the first contact layer 20 , and one or a plurality of second and third protective layers. Opening 252 exposes second contact layer 30 . The third protective layer 25 further covers the sidewalls around the semiconductor stack 12 and the upper surface 10a of the substrate. The first bonding pad 80a is located in the first and third protective layer opening 251 and contacts the first contact layer 20 . The second bonding pad 80b is located in the second and third protective layer openings 252 and contacts the second contact layer 30 . In another embodiment, the first bonding pad 80a and the second bonding pad 80b are respectively located in the first and third protective layer openings 251 and the second and third protective layer openings 252, and extend to the third protective layer 25. The second bonding pad 80b, the second contact layer 30 and the conductive structure 36 may form a first conductive structure electrically connected to the second type semiconductor layer 122. The first bonding pad 80a and the first contact layer 20 may form a second conductive structure electrically connected to the first type semiconductor layer 121.

In one embodiment, the substrate 10 may be a growth substrate, including a gallium arsenide (GaAs) substrate for growing gallium indium phosphide (AlGaInP), a gallium phosphide (GaP) substrate, or a growth substrate for indium nitride. Gallium (InGaN) or aluminum gallium nitride (AlGaN) sapphire (Al ₂ O ₃ ) substrate, gallium nitride (GaN) substrate, silicon carbide (SiC) substrate, and aluminum nitride (AlN) substrate. The substrate 10 includes a substrate upper surface 10a. The substrate 10 may be a patterned substrate, that is, the upper surface 10a of the substrate has a patterned structure (not shown). In one embodiment, the light emitted from the semiconductor stack 12 can be refracted by the patterned structure of the substrate 10, thereby increasing the brightness of the light-emitting element. In addition, the patterned structure slows down or suppresses the dislocation caused by lattice mismatch between the substrate 10 and the semiconductor stack 12 , thereby improving the epitaxial quality of the semiconductor stack 12 .

In one embodiment, the semiconductor stack 12 may further include a buffer structure (not shown). The buffer structure, the first-type semiconductor layer 121, the active region 123 and the second-type semiconductor layer 122 are sequentially formed on the substrate 10. The buffer structure can reduce the above-mentioned lattice mismatch and suppress dislocation, thereby improving the epitaxial quality. The material of the buffer layer includes GaN, AlGaN or AlN. In one embodiment, the buffer structure includes multiple sub-layers (not shown). The sub-layers include the same material or different materials. In one embodiment, the buffer structure includes two sub-layers, wherein the growth method of the first sub-layer is sputtering, and the growth method of the second sub-layer is MOCVD. In one embodiment, the buffer layer further includes a third sub-layer. The growth method of the third sub-layer is MOCVD, and the growth temperature of the second sub-layer is higher or lower than the growth temperature of the third sub-layer. In one embodiment, the first, second and third sub-layers include the same material, such as AlN, or different materials, such as AN, GaN, or AlGaN. In an embodiment of the present application, the first type semiconductor layer 121 and the second type semiconductor layer 122, such as a cladding layer or a confinement layer, have different conductive types and electrical properties. , polarity, or doping elements used to provide electrons or holes. For example, the first type semiconductor layer 121 is an n-type semiconductor, and the second type semiconductor layer 122 is a p-type semiconductor. The active region 123 is formed between the first type semiconductor layer 121 and the second type semiconductor layer 122 . Electrons and holes are combined in the active region 123 driven by current, converting electrical energy into light energy to emit light. The wavelength of the light emitted by the light-emitting element 1 or the semiconductor stack 12 can be adjusted by changing the physical properties and chemical composition of one or more layers in the semiconductor stack 12 .

The material of the semiconductor stack 12 includes a III-V group semiconductor material of Al _x In _y Ga _(1-xy) N or Al _x In _y Ga _(1-xy) P, where 0≤x, y≤1; x+y ≤1. According to the material of the active region 123, when the material of the active region 123 is AlInGaP series, red light with a wavelength between 610 nm and 650 nm or yellow light with a wavelength between 550 nm and 570 nm can be emitted. When the material of the active region 123 is the InGaN series, it can emit blue light or deep blue light with a wavelength between 400nm and 490nm or green light with a wavelength between 490nm and 550nm. When the material of the active region 123 is AlGaN series, UV light with a wavelength between 400 nm and 250 nm can be emitted. The active region 123 may be a single heterostructure (single heterostructure; SH), a double heterostructure (double heterostructure; DH), a double-side double heterostructure (DDH), or a multi-quantum well (MQW). ). The material of active region 123 may be i-type, p-type or n-type semiconductor. In one embodiment, the method of forming the semiconductor stack 12 on the substrate 10 includes metal-organic chemical vapor deposition (MOCVD), molecular beam epitaxy (MBE), hydride vapor phase epitaxy (HVPE) or ion plating, For example, sputtering or evaporation, etc.

The first protective layer 21 , the second protective layer 23 and the third protective layer 25 are transparent to the light emitted by the semiconductor stack 12 , and their materials are non-conductive materials, including organic materials or inorganic materials. The organic materials include Su8, benzocyclobutene (BCB), perfluorocyclobutane (PFCB), epoxy resin (Epoxy), acrylic resin (Acrylic Resin), cycloolefin polymer (COC), polymethacrylic acid Methyl ester (PMMA), polyethylene terephthalate (PET), polycarbonate (PC), polyetherimide (Polyetherimide), polyimide (Polyimide) or fluorocarbon polymer (Fluorocarbon Polymer) . Inorganic materials include, for example, silicone, glass, or dielectric materials. Dielectric materials include, for example, silicon oxide (SiO _x ), silicon nitride (SiN _x ), silicon oxynitride (SiO _x N _y ), Niobium oxide (Nb ₂ O ₅ ), hafnium oxide (HfO ₂ ), titanium oxide (TiO _x ), magnesium fluoride (MgF ₂ ), aluminum oxide (Al ₂ O ₃ ), etc., first protective layer 21, second protective layer The layer 23 and the third protective layer 25 may be of the same material or different materials. The first protective layer 21 , the second protective layer 23 and the third protective layer 25 are formed by atomic deposition (ALD), sputtering, evaporation and spin-coating. ), etc., the first protective layer 21 , the second protective layer 23 and the third protective layer 25 may be formed in the same or different ways. The opening methods of the first protective layer 21 , the second protective layer 23 and the third protective layer 25 include dry etching, wet etching or lift-off. The first protective layer 21 , the second protective layer 23 and The openings of the third protective layer 25 may be formed in the same manner or in different ways.

As shown in FIG. 2A , the transparent conductive layer 18 covers the upper surface of the second-type semiconductor layer 122 and is in electrical contact with the second-type semiconductor layer 122 , and includes one or a plurality of transparent conductive layer openings 180 formed corresponding to the exposed regions 28 . The transparent conductive layer 18 can be a metal or a transparent conductive material. The metal can be selected from a thin metal layer with light transmittance. The transparent conductive material is transparent to the light emitted by the active layer 123 and includes graphene, indium tin oxide ( Materials such as ITO), aluminum zinc oxide (AZO), gallium zinc oxide (GZO), zinc oxide (ZnO) or indium zinc oxide (IZO). In one embodiment, the transparent conductive layer 18 covers part of the first protective layer 21 . In another embodiment. The transparent conductive layer 18 does not cover the first protective layer 21 . In another embodiment, the transparent conductive layer 18 can be formed first, and then the first protective layer 21 is formed. The first protective layer 21 covers part of the transparent conductive layer 18 or does not cover the transparent conductive layer 18 . In one embodiment, the first protective layer 21 is formed between the transparent conductive layer 18 and the reflective structure 50 and exposes the transparent conductive layer 18 .

As shown in FIG. 1 and FIG. 2A , the first contact layer 20 covers the second protective layer 23 and is electrically connected to the second protective layer opening 232 and the third second protective layer opening 234 of the second protective layer 23 respectively. A first-type semiconductor layer 121 and a second-type semiconductor layer 122. The first contact layer 20 and the second contact layer 30 include metal materials, such as aluminum (Al), chromium (Cr), platinum (Pt), titanium (Ti), tungsten (W), zinc (Zn) or alloys of the above materials. Or laminated. The first bonding pad 80a and the second bonding pad 80b are respectively formed in the first and third protective layer openings 251 and the first and third protective layer openings 252, and are respectively contacted with the first contact layer 20 and the second contact layer 30. The first type semiconductor layer 121 and the second type semiconductor layer 122 are electrically connected. The first bonding pad 80a and the second bonding pad 80b include metal materials, such as chromium (Cr), titanium (Ti), tungsten (W), gold (Au), aluminum (Al), indium (In), tin (Sn) , nickel (Ni), platinum (Pt) and other metals or laminates or alloys of the above materials. The first bonding pad 80a and the second bonding pad 80b may be composed of a single layer or multiple layers. For example, the first bonding pad 80a and the second bonding pad 80b may include Ti/Au, Ti/Pt/Au, Cr/Au, Cr/Pt/Au, Ni/Au, Ni/Pt/Au or Cr/Al/Cr. /Ni/Au. In one embodiment, the first bonding pad 80a and the second bonding pad 80b are connected to a circuit on a carrier board (not shown) in a flip-chip manner to achieve connection with external electronic components or an external power supply. In another embodiment, the first bonding pad 80a and/or the second bonding pad 80b can further extend to cover the third protective layer 25. In another embodiment, the area where the first bonding pad 80a and/or the second bonding pad 80b is located can avoid the exposed area 28 and be distributed in the internal area of the semiconductor stack 12 to avoid the height difference between the bonding pads and the semiconductor stack. Possible peeling at the interface between layers 12. In one embodiment, the surfaces of the first bonding pad 80a and the second bonding pad 80b have a plurality of recessed portions (not shown) formed corresponding to the second reflective structure opening 502. Through these recessed portions, in the subsequent packaging process, The bonding force between the soldering pad and the carrier board can be improved to improve the process yield.

FIG. 2B shows a partial enlarged view of a cross-section marked C1 in FIG. 2A . The reflective structure 50 includes a complex array stack structure 51 . In one embodiment, as shown in FIG. 2B , the reflective structure 50 includes one or a plurality of stacked structures 51 , and the stacked structures 51 sequentially include a first sub-layer 51 a , a second sub-layer 51 b and a third sub-layer 51 c . . In one embodiment, the reflective structure 50 includes one or a plurality of stacked structures 51 and one or a plurality of stacked structures 51', wherein the stacked structure 51' only consists of a first sub-layer 51a, a second sub-layer 51b and a third sub-layer. 51c is composed of any two stacked layers. Please refer to FIG. 2C. The reflective structure 50 includes at least two stack structures 51 sequentially stacked by a first sub-layer 51a, a second sub-layer 51b and a third sub-layer 51c, and a first sub-layer 51a and a second sub-layer 51. 51b is a stacked structure 51' stacked sequentially. In an embodiment, there may be a plurality of stacked structures 51'. In one embodiment, the stacked structure 51' may be formed by stacking the first sub-layer 51a and the third sub-layer 51c in sequence, or the second sub-layer 51b and the third sub-layer 51c being stacked in sequence. In one embodiment, the first sub-layer 51a, the second sub-layer 51b and the third sub-layer 51c are formed of dielectric materials. The dielectric materials include silicon-containing materials, such as silicon oxide (SiO _x ), silicon nitride ( SiN _x ), or silicon oxynitride (SiOₓN _y ), metal oxides, such as niobium oxide (Nb ₂ O ₅ ), hafnium oxide (HfO ₂ ), titanium oxide (TiO _x ), or aluminum oxide (Al ₂ O ₃ ), metal fluorides, such as magnesium fluoride (MgF ₂ ). By selecting materials with different refractive indexes and designing their thickness, they are stacked into material stacks to form the reflective structure 50, which provides a reflection function for the light in a specific wavelength range emitted by the active area 123, such as a distributed Bragg reflector (DBR, distributed Bragg). reflector). In this embodiment, the first sub-layer 51a has a first refractive index, the second sub-layer 51b has a second refractive index, and the third sub-layer 51c has a third refractive index, where the first refractive index < the second refractive index < Third refractive index. The thickness of each sub-layer can be adjusted according to its stacking order and refractive index. In one embodiment, the first sub-layer 51a has a first optical thickness, the second sub-layer 51b has a second optical thickness, and the third sub-layer 51c has a third optical thickness, where first optical thickness>third optical thickness> Second optical thickness. In one embodiment, the material of the first sub-layer 51a includes silicon oxide, whose refractive index is approximately between 1.4 and 1.6, such as silicon dioxide (SiO ₂ ), and the material of the second sub-layer 51 b includes aluminum oxide, Its refractive index is approximately between 1.6 and 1.8, such as aluminum oxide (Al ₂ O ₃ ). The material of the third sub-layer 51 c includes titanium oxide, and its refractive index is approximately between 2.4 and 2.6, such as Titanium dioxide (TiO ₂ ). In an embodiment, when the reflective structure 50 includes at least a first group of stacked structures 51 sequentially stacked by a first sub-layer 51a, a second sub-layer 51b and a third sub-layer 51c, the reflective structure 50 may It further includes optimizing the optical effect of the reflective structure 50 by selecting a stack structure 51' in which any two sub-layers are stacked sequentially. In one embodiment, the stack structure closest to the conductive structure 36 in the reflective structure 50 is the stack structure 51', in which the adhesion of the sub-layer in contact with the conductive structure 36 is greater than that of other sub-layers. By selecting the material of the sub-layer in contact with the conductive structure 36, the adhesion between the conductive structure 36 and the reflective structure 50 can be increased to improve the reliability of the light-emitting element. In one embodiment, the second sub-layer 51b has better adhesion to the conductive structure 36, and its material is, for example, aluminum oxide. In one embodiment, any two stacked structures 51 ′ of sequentially stacked sub-layers may be located between any two groups of stacked structures 51 of three sequentially stacked sub-layers, or the stacked structure 51 and the transparent conductive layer 18 or the second between the semiconductor layers 122 to optimize the optical effect of the reflective structure 50 . The reflective structure 50 is formed by methods such as atomic deposition (ALD), sputtering, evaporation, and spin-coating. The openings of the reflective structure 50 may be formed by dry etching, wet etching or lift-off.

2C shows a partial enlarged view of a cross-section marked C2 in FIG. 2A . The reflective structure 50 has a first side wall W1 at a position corresponding to the opening 502 of the second reflective structure. The transparent conductive layer 18 located below the reflective structure 50 has a transparent conductive layer upper surface. 18a, and there is an acute angle θ1 between the first side wall W1 and the upper surface 18a of the transparent conductive layer. In one embodiment, the acute angle θ1 is between 10 degrees and 45 degrees. Since the reflective structure 50 is composed of a stacked structure 51, compared to a general distributed Bragg reflector, there are more choices of materials with different refractive indexes that can be used to adjust the optical thickness of the sub-layers, thereby obtaining a distributed Bragg reflector with a thickness comparable to that of a general distributed Bragg reflector. The thin reflective structure 50 makes the reflective structure 50 less susceptible to cracks due to stress. In addition, in the subsequent patterning process, a thicker lift-off process that cannot be used for general distributed Bragg reflectors can be selected, so that the transparent conductive layer 18 below it is less likely to be damaged by etching. In one embodiment, the thickness of the second sub-layer 51b is 0 to 0.5 times that of the first sub-layer 51a and/or the third sub-layer 51c. In one embodiment, when the thickness of the second sub-layer 51b is 0 times that of the first sub-layer 51a and/or the third sub-layer 51c, a layer composed of the first sub-layer 51a and the third sub-layer 51c stacked sequentially is formed. Stacked structure 51'. After the reflective structure opening 502 is formed in the reflective structure 50 by a patterning process such as etching or lift-off, an acute angle θ1 is sandwiched between the first sidewall W1 and the upper surface 18a of the transparent conductive layer, so that the conductive structure 36 can be compliantly covered on the reflective structure. 50, and then form a good electrical connection with the transparent conductive layer 18 and/or the second-type semiconductor layer 122. In one embodiment, the reflective structure 50 can be directly formed on the second-type semiconductor layer 122, so there is an acute angle between the first sidewall W1 of the reflective structure 50 and the upper surface of the second-type semiconductor layer 122.

As shown in FIG. 2C , the reflective structure 50 has a wedge-shaped portion R1 , a platform portion R2 and a connecting portion R3 connecting the wedge-shaped portion R1 and the platform portion R2 . The wedge-shaped portion R1 is adjacent to the second reflective structure opening 502 and is connected to the upper surface 18 a of the transparent conductive layer. With an acute angle θ1 between them, the platform portion R2 is far away from the second reflective structure opening 502 and has substantially the same thickness as a whole, and has an upper surface that is substantially parallel to the upper surface 18a of the transparent conductive layer. The connecting portion R3 is located between the wedge portion R1 and the platform portion R2 and has a gradually increasing thickness from the wedge portion R1 to the platform portion R2, wherein the first sub-layer 51a has a first thickness t1 at the wedge portion R1 and a third thickness t1 at the platform portion R2. The second thickness t2 has a third thickness t3 at the connection part R3, the first thickness t1<the third thickness t3<the second thickness t2, due to the thickness of the first sub-layer 51a moving away from the position adjacent to the second reflective structure opening 502 The openings 502 of the second reflective structure gradually increase, so that the conductive structure 36 can conformally cover the reflective structure 50 to contact the transparent conductive layer 18 or the second-type semiconductor layer 122 to form a good electrical connection with the second-type semiconductor layer 122 .

Referring again to FIG. 2A , the conductive structure 36 is formed on the transparent conductive layer 18 and the reflective structure 50 , and is electrically connected to the transparent conductive layer 18 and the second-type semiconductor layer 122 through the second reflective structure opening 502 of the reflective structure 50 . The conductive structure 36 includes a plurality of conductive structure openings 360 formed corresponding to the positions of the first reflective structure opening 501 and the exposed area 28 of the reflective structure 50 . In one embodiment, the conductive structure 36 includes a metal structure, which may include a single layer of metal or a stack of multiple layers of metal. The conductive structure 36 and the reflective structure 50 form an omnidirectional reflector (ODR). , improve the reflection of light and the brightness of the light-emitting element 1. In one embodiment, for the light emitted by the active area 123 with a peak wavelength between 400 nanometers and 700 nanometers, the omnidirectional mirror formed by the conductive structure 36 and the reflective structure 50 has a reflectivity of more than 90%. In one embodiment, the conductive structure 36 includes a barrier layer (not shown) and a reflective layer (not shown). The barrier layer is formed and covers the reflective layer. The barrier layer can prevent the migration of metal elements in the reflective layer. , diffusion or oxidation. The material of the reflective layer includes metal materials with high reflectivity for the light emitted by the semiconductor stack 12, such as silver (Ag), gold (Au), aluminum (Al), titanium (Ti), chromium (Cr), copper ( Cu), nickel (Ni), platinum (Pt), ruthenium (Ru) or alloys or laminates of the above materials. Materials of the barrier layer include chromium (Cr), platinum (Pt), titanium (Ti), tungsten (W), zinc (Zn) or alloys or laminates of the above materials. In one embodiment, when the barrier layer is a metal stack, the barrier layer is formed by alternately stacking two or more layers of metal, such as Cr/Pt, Cr/Ti, Cr/TiW, Cr/W. , Cr/Zn, Ti/Pt, Ti/W, Ti/TiW, Ti/Zn, Pt/TiW, Pt/W, Pt/Zn, TiW/W, TiW/Zn, or W/Zn, etc.

In one embodiment, by inserting a second sub-layer 51 b having a refractive index between the first sub-layer 51 a and the third sub-layer 51 c between the first sub-layer 51 a and the third sub-layer 51 c, the general distribution can be reduced. The interference phenomenon caused by the excessive difference in refractive index of the stack of Bragg reflectors allows the omnidirectional reflector formed by the conductive structure 36 and the reflective structure 50 to have a reflectivity of more than 90% for the light in a specific wavelength range emitted by the active area 123 , which also makes the omnidirectional reflector formed by the conductive structure 36 and the reflective structure 50 have good reflectivity at all angles. For example, Figure 4 shows the wavelength-corresponding reflectance curve of the light-emitting element 1 of the first embodiment of the present application, the first comparative example and the second comparative example of the light-emitting element. The light-emitting element 1, the first comparative example and the second comparative example are The structures of the light-emitting elements of the two comparative examples are similar. The difference is that the light-emitting element of the first comparative example only has a conductive structure 36 (that is, there is no reflective structure 50 below the conductive structure 36), while the light-emitting element of the second comparative example consists of a conductive structure 36 and two sub-layers. An omnidirectional reflector formed by a general distributed Bragg reflector composed of a stacked structure. The curve O1 is the reflectivity of the light-emitting element of the first comparative example for light with a peak wavelength between 380 nanometers and 780 nanometers. The curve P1 is the reflectivity of the light-emitting element of the first comparative example. The reflectivity of the light-emitting element of the two comparative examples for light with a peak wavelength between 380 nanometers and 780 nanometers. The curve E1 is the peak wavelength of the omnidirectional reflector formed by the light-emitting element 1 of the embodiment of this case with the conductive structure 36 and the reflective structure 50. The reflectivity of light between 380 nanometers and 780 nanometers. Due to the interference phenomenon caused by the excessive difference in refractive index of the stack of general distributed Bragg reflectors, the reflectivity of the curve P1 of the light-emitting element of the second comparative example drops sharply at a wavelength close to 400 nanometers; from the light-emitting element of the first comparative example Judging from the reflectance curve O1, although there is no sharp drop in reflectivity at a wavelength close to 400 nanometers due to interference in curve P1, its reflectivity below a wavelength of 580 nanometers is better than that of the second comparative example of the light-emitting element and the light-emitting element. 1 is much lower; and from the curve E1 of the light-emitting element 1, there is no sudden drop in reflectivity due to the interference phenomenon mentioned above, and the reflectivity can reach more than 90% at wavelengths between 400 nanometers and 780 nanometers.

Figure 3A shows a cross-sectional view of the light-emitting element 1' according to an embodiment of the present application, and Figure 3B shows a partial enlarged view of the cross-section marked C3 in Figure 3A. However, the relevant descriptions of components with the same symbols have been previously described in FIG. 1 and FIG. 2A-2C , and therefore will not be described again here. The difference is that the light-emitting element 1' further includes an intermediate layer 40 formed between the second-type semiconductor layer 122 and/or the transparent conductive layer 18 and the reflective structure 50, wherein the intermediate layer 40 includes one or a plurality of first intermediate layer openings 401. and one or more second intermediate layer openings 402. The position of the first intermediate layer opening 401 corresponds to the exposed area 28 and the transparent conductive layer opening 180. The second intermediate layer opening 402 is distributed on the second type semiconductor layer 122 and/or the transparent conductive layer 18, and respectively corresponds to a plurality of third Two reflective structure openings 502 are formed and expose the second type semiconductor layer 122 and/or the transparent conductive layer 18 below them. In one embodiment, around the semiconductor stack 12 , the intermediate layer 40 further covers the sidewalls of the first-type semiconductor layer 121 .

The intermediate layer 40 is transparent to the light emitted by the semiconductor stack 12 , and its material is a non-conductive material, including organic materials or inorganic materials. The organic materials include Su8, benzocyclobutene, perfluorocyclobutane, epoxy resin, acrylic resin, cycloolefin polymer, polymethyl methacrylate, polyethylene terephthalate, polycarbonate, Polyetherimide, polyimide or fluorocarbon polymer. Inorganic materials include, for example, silicone, glass, or dielectric materials. The dielectric materials include, for example, silicon oxide, silicon nitride, silicon oxynitride, niobium oxide, hafnium oxide, titanium oxide, magnesium fluoride, aluminum oxide, etc. The intermediate layer 40 may be formed by atomic deposition, sputtering, evaporation, spin coating, or other methods. The openings of the intermediate layer 40 may be formed by dry etching, wet etching or lift-off. In one embodiment, when the reflective structure 50 is etched, such as dry etching, to form the second reflective structure opening 502, the intermediate layer 40 can be used as an etching barrier layer to prevent etching from damaging the second-type structure underneath it. Semiconductor layer 122, and/or transparent conductive layer 18. In one embodiment, after the second reflective structure opening 502 is formed, the second interlayer opening 402 can be formed in the interlayer 40 to expose the second type semiconductor layer 122 by the same or different etching methods, such as wet etching, and /or transparent conductive layer 18 . The second intermediate layer opening 402 is formed below the second intermediate layer opening 402 corresponding to the second reflective structure opening 502 . In one embodiment, the intermediate layer 40 and the first protective layer 21 may be formed of the same material, such as silicon oxide. In one example, the intermediate layer 40 and the first protective layer 21 can be formed on the transparent conductive layer 18 in the same process. In one embodiment, the intermediate layer 40 and the second sub-layer 51b can be formed of the same material, such as aluminum oxide, and the intermediate layer 40 can increase the overall adhesion between the conductive structure 36 and the reflective structure 50 .

Referring to FIG. 3B , the intermediate layer 40 is formed on the transparent conductive layer 18 and has a second intermediate layer opening 402 exposing the transparent conductive layer 18 . In one embodiment, the intermediate layer 40 can be directly formed on the second-type semiconductor layer 122 . The reflective structure 50 is formed on the intermediate layer 40 and has a second reflective structure opening 502 corresponding to the second intermediate layer opening 402 of the intermediate layer 40 . The reflective structure 50 has a first side wall W1 at a position corresponding to the opening 502 of the second reflective structure. The intermediate layer 40 has an upper surface 40a of the middle layer at a position corresponding to the opening 502 of the second reflective structure. The intermediate layer 40 has an upper surface 40a at a position corresponding to the opening 402 of the second intermediate layer. The second side wall W2, the first side wall W1 of the reflective structure 50 is located on the upper surface 40a of the intermediate layer and is located on the same side as the second side wall W2 of the intermediate layer 40, and has a first distance D1 from the second side wall W2. The reflective structure 50 has a third sidewall W3 located on the upper surface 40a of the middle layer on the other side of the first sidewall W1 at a position corresponding to the second reflective structure opening 502. The middle layer 40 has a fourth sidewall W3 at a position corresponding to the second middle layer opening 402. The side wall W4 is located on the same side as the third side wall W3 of the reflective structure 50 and has a second distance D2 between it and the third side wall W3, where the first distance D1 and the second distance D2 may be the same or different. In one embodiment, the minimum distance between the first side wall W1 and the third side wall W3 of the reflective structure 50 is defined as the first width of the second reflective structure opening 502, and the second side wall W2 and the fourth side wall W4 of the intermediate layer 40 are The minimum distance between them is defined as the second width of the second intermediate layer opening 402, and the first width is greater than the second width. In one embodiment, the first sidewall W1 and the third sidewall W3 of the reflective structure 50 and the upper surface 40a of the intermediate layer respectively have the same included angle or different included angles. In one embodiment, the second sidewall W2 and the fourth sidewall W4 of the intermediate layer 40 and the upper surface 18a of the transparent conductive layer respectively have the same included angle or different included angles. In one embodiment, the first sidewall W1 of the reflective structure 50 and the upper surface 40a of the intermediate layer, and the second sidewall W2 of the intermediate layer 40 and the upper surface 18a of the transparent conductive layer respectively have the same included angle or different included angles. In one embodiment, the third sidewall W3 of the reflective structure 50 and the upper surface 40a of the intermediate layer, and the fourth sidewall W4 of the intermediate layer 40 and the upper surface 18a of the transparent conductive layer respectively have the same included angle or different included angles.

However, the above embodiments are only illustrative to illustrate the principle and effect of the present application, and are not used to limit the present application. Anyone with ordinary knowledge in the technical field to which this application belongs can make modifications and changes to the above embodiments without violating the technical principles and spirit of this application. All changes and modifications made equally to the shape, structure, characteristics and spirit described in the patentable scope of this application shall be included in the patentable scope of this application.

1. 1’: Light-emitting element 10:Substrate 10a: Upper surface of substrate 12: Semiconductor stack 121: First type semiconductor layer 121a: Upper surface of the first type semiconductor layer 122: Second type semiconductor layer 123:Active layer 18:Transparent conductive layer 18a: Upper surface of transparent conductive layer 180: Transparent conductive layer opening 28: Exposed area 20: First contact layer 21: First protective layer 210: First first protective layer opening 212: Second first protective layer opening 214: Third first protective layer opening 23:Second protective layer 230: First and second protective layer openings 232: Second second protective layer opening 234: Third and second protective layer opening 25:Third protective layer 251: First and third protective layer openings 252: Second and third protective layer openings 30: Second contact layer 36:Conductive structure 360: Conductive structure openings 40:Middle layer 40a: Upper surface of the middle layer 401: First middle layer opening 402: Second middle layer opening 50: Reflective structure 51, 51: stacked structure 51a, 51b, 51c: first sub-layer, second sub-layer, third sub-layer 501: First reflective structure opening 502: Second reflective structure opening 80a: First pad 80b: Second pad D1, D2: first distance, second distance MS:Gaotai P1, E1, O1: Curve R1: wedge-shaped part R2:Platform Department R3:Connection part t1, t2, t3: first thickness, second thickness, third thickness W1, W2, W3, W4: first side wall, second side wall, third side wall, fourth side wall θ1: acute angle

﹝Figure 1﹞ shows a top view of the light-emitting element 1 according to an embodiment of the present application. ﹝Figure 2A﹞ shows a cross-sectional view of the light-emitting element 1 according to an embodiment of the present application. ﹝ FIG. 2B ﹞ shows a partially enlarged cross-sectional view of the light-emitting element 1 according to an embodiment of the present application. ﹝Figure 2C﹞shows a partially enlarged cross-sectional view of the light-emitting element 1 according to an embodiment of the present application. ﹝Figure 3A﹞ shows a cross-sectional view of a light-emitting element 1' according to an embodiment of the present application. ﹝Figure 3B﹞ shows a partial enlarged view of a cross-section of the light-emitting element 1' according to an embodiment of the present application. ﹝Figure 4﹞ shows the reflectance curves of the light-emitting element 1 of the first embodiment of the present application and the light-emitting element of the comparative example.

18:Transparent conductive layer

18a: Upper surface of transparent conductive layer

36:Conductive structure

50: Reflective structure

51, 51’: stacked structure

51a: First sub-layer

51b: Second sub-layer

51c: The third sub-layer

502: Second reflective structure opening

R1: wedge-shaped part

R2:Platform Department

R3:Connection part

t1, t2, t3: first thickness, second thickness, third thickness

W1: first side wall

θ1: acute angle

Claims (10)

A light-emitting element contains: a substrate; A semiconductor stack is formed on the substrate, including a first-type semiconductor layer, a second-type semiconductor layer, and an active layer located between the first-type semiconductor layer and the second-type semiconductor layer for emitting a light; An insulating reflective structure is formed on the semiconductor stack, the insulating reflective structure includes a stacked structure and has an opening, the stacked structure includes a plurality of sub-layers; and A first conductive structure is formed on the insulating reflective structure and is electrically connected to the second-type semiconductor layer through the opening; The material of the outermost sub-layer of the stacked structure in contact with the first conductive structure includes aluminum oxide, and the adhesion between the sub-layer and the first conductive structure is greater than that between other layers of the plurality of sub-layers and the first conductive structure. Adhesion between first conductive structures. The light-emitting element of claim 1, further comprising an intermediate layer formed between the semiconductor stack and the insulating reflective structure, wherein the intermediate layer has an interlayer opening corresponding to the opening of the insulating reflective structure. The light-emitting element of claim 2, wherein the opening has a first width, the middle layer opening has a second width, and the first width is greater than the second width. The light-emitting element of claim 2, wherein the insulating reflective structure has a first side wall, the intermediate layer has a second side wall and an upper surface of the intermediate layer, and the first side wall is located on the upper surface of the intermediate layer and is connected to the upper surface of the intermediate layer. There is a distance between the second side walls. The light-emitting element of claim 2, wherein the material of the intermediate layer includes aluminum oxide or silicon oxide. The light-emitting element of claim 2 further includes a transparent conductive layer located between the insulating reflective structure and the second-type semiconductor layer of the semiconductor stack. The light-emitting element of claim 6, wherein the intermediate layer opening exposes the transparent conductive layer, and the first conductive structure is covered on the insulating reflective structure and is electrically connected to the transparent conductive layer through the opening and the intermediate layer opening. layer. The light-emitting element of claim 7, further comprising a second conductive structure, wherein the insulating reflective structure includes another opening, and the second conductive structure is electrically connected to the first-type semiconductor layer through the other opening. The light-emitting element of claim 1, wherein the first conductive structure includes a reflective layer, and the material of the reflective layer includes a metal material with high reflectivity for the light emitted by the semiconductor stack. The light-emitting element according to claim 1, wherein the materials of other layers of the plurality of sub-layers include silicon oxide, silicon nitride, silicon oxynitride, niobium oxide, hafnium oxide, titanium oxide or aluminum oxide.