TW202401147A - Photosensitive resin composition for forming partition wall, partition wall structure manufactured using same, and display device comprising partition wall structure - Google Patents

Abstract

The present disclosure relates to a photosensitive resin composition for forming a partition wall, the photosensitive resin composition comprising: (A) a colorant; (B) an alkali-soluble resin; (C) a photopolymerizable compound; (D) a photopolymerization initiator; and (E) a solvent, wherein when a cured film prepared from the photosensitive resin composition has a thickness of 3 to 15

Description

Photosensitive resin composition for forming partition walls, use of the same to produce a partition structure, and a display device including a partition structure

The present disclosure relates to a photosensitive resin composition for forming partition walls, using the photosensitive resin composition to produce a partition wall structure, and a display device including a partition wall structure.

Because a conventional flat panel display or a liquid crystal display has a conventional display structure that loses a large amount of light, a display using a color conversion panel has recently been studied. As a simple example, a structure composed of a color conversion panel and a backlight that generates blue light uses the blue light of the backlight, so that the light of the backlight can be fully used. Additionally, because pixels that display red or green convert blue to red or green and display blue or green, the pixels can produce more light than traditional methods that use absorption and transmission to express the desired color.

Compared with displays manufactured using traditional high-temperature processes, displays manufactured using low-temperature processes have great advantages. Generally speaking, in order to increase the reliability of materials, high-temperature processes are usually used to increase the reliability of patterns. However, recently developed organic light-emitting diodes (OLEDs) are easily affected by heat, making it difficult to perform high-temperature processes on organic light-emitting diodes. Therefore, if organic light-emitting diodes are manufactured individually and then laminated to manufacture a display, it will be difficult to manufacture a flexible or rollable display. Therefore, color conversion pixels must be formed on the upper part of the organic light emitting diode panel through a photolithography process, and there is an increasing demand for low-temperature processes for forming color conversion pixels.

Furthermore, in a display device including a color conversion panel, partition walls are formed between color conversion pixels to prevent color mixing of each color conversion pixel. Due to the conversion efficiency of the color conversion pixels, the partition wall between the color conversion pixels has a thickness of approximately 3 microns ( ) to 15 film thickness.

The traditional photosensitive resin composition used for black matrix has 1 to 1.5 of thickness, there is no problem in forming patterns, but it is not preferred because the film prepared for partition walls between color conversion pixels should have 3 to 15 thickness of.

In addition, when the conventional black matrix is used to form partition walls from a thick film, a problem occurs that the transmittance of ultraviolet light is reduced during the exposure process, resulting in the light not reaching the lower end of the pattern. Since the lower part of the film is not photocured, the undercut phenomenon will be seriously induced after the development process, and there is a disadvantage of weak process margin.

In addition, if the photosensitive resin composition for the black matrix is used when manufacturing the partition walls between the color conversion pixels, it will be difficult to recognize the alignment key located on the lower side when aligning the mask pattern in the exposure process after the coating process. key), so it becomes difficult to form the pattern at the correct position. Therefore, the conventionally used photosensitive resin composition for a black matrix has limitations as a material for forming partition walls between color conversion pixels.

In addition, the fabrication of partition walls between color conversion pixels includes heat treatment in subsequent processes. If the reliability of the partition wall (such as solvent resistance) is low, residues will be generated inside the partition wall during the heat treatment process, which will lead to problems such as reduced efficiency and lifespan of the color conversion pixel.

Korean Patent Publication No. 10-2007-0094460 provides a photosensitive resin composition for forming partition walls, which has excellent heat-resistant shape stability, but cannot overcome the above problems.

[Prior technical literature]

[Patent Document]

(Patent document 1) Korean Patent Publication No. 10-2007-0094460 (published on September 20, 2007)

[Technical issue]

The present disclosure can solve the above-mentioned conventional technical problems, and one object of the present disclosure is to provide a photosensitive resin composition for forming partition walls, which has excellent reliability (such as solvent resistance) and leaves no residue except for pattern formation parts. material and has excellent tapered process characteristics.

Another object of the present disclosure is to provide a photosensitive resin composition for forming partition walls, which can avoid color mixing of the color conversion panel, improve resolution and light efficiency, and meet the transmittance and reflection in a specific wavelength range. rate to make the alignment keys easy to identify.

Another object of the present disclosure is to provide a partition structure and a display device manufactured using a photosensitive resin composition for forming partition walls.

[Technical solution]

The present disclosure provides a photosensitive resin composition for forming partition walls, including: (A) colorant; (B) alkali-soluble resin; (C) photopolymerizable compound ; (D) photopolymerization initiator; and (E) solvent, wherein when the cured film prepared from the photosensitive resin composition has 3 to 15 At a thickness of % or more transmittance.

In addition, the present disclosure provides a partition wall structure manufactured using a photosensitive resin composition for forming partition walls, and a display device including the same.

[Beneficial effects]

The photosensitive resin composition and partition structure used to form partition walls according to the present disclosure can provide excellent reliability (such as solvent resistance), no residue except for pattern formation parts, and an excellent tapering process. The effect of tapered process characteristics.

In addition, the photosensitive resin composition and partition structure used to form partition walls according to the present disclosure can avoid color mixing of the color conversion panel, improve resolution and light efficiency, and satisfy transmittance and reflection in a specific wavelength range. Rate conditions to make the alignment keys easy to identify.

[Best mode]

The present disclosure relates to a photosensitive resin composition for forming partition walls, a partition structure manufactured using the photosensitive resin composition for forming partition walls, and a display device including a partition structure. The photosensitive resin composition includes (A) colorant; (B) alkali-soluble resin; (C) photopolymerizable compound; (D) photopolymerization initiator; and (E) solvent, wherein when the cured film prepared from the photosensitive resin composition has 3 to 15 At a thickness of More transmittance.

In addition, when the cured film prepared from the photosensitive resin composition has 3 to 15 At a thickness of , the cured film may have a maximum transmittance of 20% or less at a wavelength of 450 nm, preferably 15% or less, and more preferably 10% or less.

In addition, when the cured film prepared from the photosensitive resin composition has 3 to 15 At a thickness of 550 nm to 650 nm, the cured film may have a minimum reflectivity of 10% or more, preferably 15% or more, and more preferably 20% or more.

In addition, when the cured film prepared from the photosensitive resin composition has 3 to 15 At a thickness of 900 nm, the cured film can have a maximum transmittance of 70% or more at a wavelength of 900 nm, preferably 80% or more.

When the cured film meets the specific transmittance and specific reflectivity conditions at the above-mentioned specific wavelengths, it can provide the effects of avoiding color mixing of the color conversion panel, improving resolution and light efficiency, and making the alignment keys easy to identify.

The present disclosure will be described in detail below.

<Photosensitive resin composition for forming partition walls>

The photosensitive resin composition used to form partition walls according to the present disclosure includes: (A) colorant; (B) alkali-soluble resin; (C) photopolymerizable compound; (D) photopolymerization initiator; and (E) ) solvent.

(A) Colorants

The colorant in the photosensitive resin composition used to form partition walls according to the present disclosure may include one or more of (a1) white pigment, (a2) black pigment, and (a3) yellow pigment, and preferably (a1) white pigment, (a2) black pigment, and (a3) yellow pigment may be included.

As for the traditional photosensitive resin composition used to form partition walls, it contains scattering particles, such as metal oxides, to increase the light efficiency of the pixels, and the transmittance is adjusted by adjusting only the content of the black pigment. However, when only black pigments are used to reduce the transmittance, the content of white pigments required to increase reflectivity increases significantly. As a result, the total pigment content in the photosensitive resin composition increases, and components that affect process stability, such as alkali, are added. The content of soluble resin and photopolymerizable compound decreases, leading to the problem of deterioration in the process characteristics of the photosensitive resin composition.

The photosensitive resin composition according to the present disclosure includes (a1) white pigment, (a2) black pigment, and (a3) yellow pigment, thereby not only effectively controlling light leakage, but also effectively increasing the light efficiency of the pixel. In addition, since the total amount of pigments in the composition decreases as the amount of white pigment required to ensure reflectivity decreases, the photosensitive resin composition according to the present disclosure can better provide the effect of improving process characteristics.

(a1) white pigment

The white pigment is for the reflectivity of the partition wall structure. Specifically, the white pigment improves the brightness by improving the reflectivity of the partition wall structure to the red and/or green light series wavelengths to reflect the light in a specific wavelength range in the direction of the partition wall among the light generated by the color conversion element.

The white pigment preferably has an average particle size of 150 nm to 400 nm, and when its average particle size is less than 150 nm, it will exhibit UV blocking properties, so that the UV light cannot be fully transmitted to the lower side during the exposure process, resulting in difficulty. Forming a pattern, and the particle size is too small will cause the transmittance in the visible light region to increase, which may lead to the problem of deterioration in shielding properties. When the average particle size exceeds 400 nm, problems of deterioration in dispersibility and storage stability may occur, the surface smoothness of the exposed part is reduced, and the interface between the exposed part and the unexposed part is not smooth.

The white pigment can be selected from titanium oxide (TiO ₂ ), silicon dioxide (SiO ₂ ), aluminum oxide (Al ₂ O ₃ ), tin oxide (SnO ₂ ), iron oxide (iron oxide; Fe ₂ O ₃ ), zinc oxide (zinc oxide; ZnO), magnesium oxide (MgO), zirconium oxide (zirconium oxide; ZrO ₂ ), cerium oxide (cerium oxide; CeO ₂ ), lithium oxide In the group consisting of (lithium oxide; Li ₂ O), silver oxide (AgO), antimony oxide (Sb ₂ O ₃ , Sb ₂ O ₅ ), and calcium oxide (calcium oxide; CaO) One or more of them, and preferably titanium oxide (TiO ₂ ) can be used.

When the above conditions are met, a white pigment (C.I. Pigment White) known in the art can be used as the white pigment, and examples of the white pigment can include C.I. Pigment White 4, 5, 6, 6:1, 7, 18, 18 :1, 19, 20, 22, 25, 26, 27, 28 and 32. In terms of reflection efficiency and whiteness, examples of white pigments preferably include C.I. Pigment White or 22, and more preferably include C.I. Pigment White 6. These white pigments may be used alone or two or more of these white pigments may be mixed and used.

The titanium oxide (TiO ₂ ) contained in CI Pigment White 6 is cheap and has excellent reflectivity due to its high refractive index, making it an effective white pigment and excellent in coloring power and whiteness. It is better to have a rutile structure.

Titanium oxide (TiO ₂ ) can be subjected to resin treatment (resin treatment), surface treatment using pigment derivatives (pigment derivatives) that introduce acidic groups or basic groups, etc., or polymers, etc., can be used on the surface of the pigment as needed. Graft treatment, atomization treatment using sulfuric acid atomization method, cleaning treatment using organic solvent or water to remove impurities, or ionic impurity removal treatment using ion exchange method, etc.

Titanium oxide (TiO ₂ ) may include a group selected from the group consisting of silicon oxide (SiO ₂ ), aluminum oxide (Al ₂ O ₃ ), zirconium oxide (ZrO ₂ ) and various organic materials. Titanium oxide (TiO ₂ ) that is surface-treated by one or more of the groups preferably includes sequentially using silicon oxide (SiO ₂ ), aluminum oxide (Al ₂ O ₃ ), and zirconium oxide (ZrO ₂ ) for surface treatment. The treated titanium oxide may more preferably include titanium oxide obtained by treating the outermost surface of surface-treated titanium oxide (TiO ₂ ) with an organic material. The organic material is not particularly limited, as long as the organic material can reduce the energy required to disperse titanium oxide (TiO ₂ ) through surface treatment of low-polarity monolayer-coated titanium dioxide, and can avoid the titanium oxide (TiO ₂ ) being compressed or Agglomerated. In one or more embodiments, stearic acid, trimethylpropane (trimethylpropane; TMP), pentaerythritol, etc. can be used as organic materials.

The reflection brightness characteristics can be improved, and at the same time, the photocatalytic activity of titanium oxide (TiO ₂ ) can be reduced by surface-treating titanium oxide (TiO ₂ ) as mentioned above. In particular, preferred embodiments of surface treatments may have the benefit of improving reliability, such as thermal resistance, chemical resistance, etc. Surface treatment can be through encapsulation.

The amount of titanium oxide core contained in the surface-treated titanium oxide (TiO ₂ ) is preferably 85% to 95% by weight based on the total weight of the surface-treated titanium oxide. When the surface of the titanium oxide core is treated within the above range, the surface-treated titanium oxide core exhibits excellent whiteness and excellent reflective brightness.

Examples of commercial products of titanium oxide (TiO ₂ ) include “R-101”, “R-102”, “R-103”, “R-104”, “R-105”, "R-350", "R-706", "R-794", "R-796", "TS-6200", "R-900", "R-902", "R-902+", "R-931","R-960", etc., Huntsman's "R-FC5", "TR81" and "TR88", and Ishihara Sangyo (ISK)'s "CR-57", etc.

Based on the total weight of the photosensitive resin composition used to form partition walls according to the present disclosure, the content of the white pigment may be 1% to 30% by weight, preferably 1% to 28% by weight. When the content of the white pigment is less than 1% by weight, the reflectivity for red or green series light may decrease; when the content exceeds the above content, the transmittance at the wavelength of 900 nm is excessively reduced, which may make it difficult to identify the alignment keys. During the exposure stage, the white pigment partially scatters light from the surface of the coating film, so that the unexposed areas may solidify, and a shoulder-like taper appears on the upper part of the reverse taper and on the pattern, so the shape of the pattern may deteriorate.

(a2) black pigment

The (a2) black pigment contained in the (A) colorant of the present disclosure can absorb light in the ultraviolet and visible light wavelength ranges.

The black pigment may be appropriately selected from black organic pigments or black inorganic pigments.

One or more selected from the group consisting of lactam black, perylene black, cyanine black and aniline black may be used as the black organic pigment. From the perspective of improving blue light blocking properties and transmittance in the infrared region, it is better to use lactamine black.

One or more selected from the group consisting of carbon black, chromium oxide, iron oxide and titanium black can be used as the black inorganic pigment, preferably Carbon black can be used.

Furthermore, depending on the purpose, the black organic pigment and the black inorganic pigment may be used alone, or two or more of the black organic pigment and the black inorganic pigment may be mixed and used.

Based on the total weight of the photosensitive resin composition used to form partition walls according to the present disclosure, the content of the black pigment may be 0.03% to 5% by weight, preferably 0.05% to 5% by weight. When the content of the black pigment is lower than the above content, as the transmittance of light in the blue backlight wavelength region increases, the light shielding property becomes weaker, and color mixing between pixels may occur. When the black pigment content exceeds 5% by weight, the transmittance of light in the wavelength range of 900 nm or higher decreases, so it may be difficult to identify the lower alignment keys during the exposure process, making it difficult to form patterns at accurate positions. In addition, problems such as undercutting may occur due to lack of deep hardening, and problems such as reduced luminous efficiency of the display may occur due to reduced reflectivity of partition walls.

(a3) yellow pigment

The (a3) yellow pigment contained in the (A) colorant of the present disclosure can be used to absorb light in the low-wavelength region of the visible light region (blocking blue light) so that the transmission and reflection of light in other regions will not be inhibited.

When the above conditions are satisfied, pigments known in the art can be used as the yellow pigment. Preferably, the yellow pigment may comprise one or more selected from the group consisting of anthraquinone-based compounds, isoindolinone-based compounds and azo-based compounds. Many, and may specifically include C.I. Pigment yellow, which is classified as a pigment in the color index (published by the Institute of Dyes and Colorists).

For example, examples of yellow pigments may include C.I. Pigment Yellow 13, 20, 24, 31, 53, 83, 86, 93, 94, 109, 110, 117, 125, 129, 137, 138, 139, 147, 148 , 150, 153, 154, 166, 173, 180 and 185, preferably one or more selected from the group consisting of C.I. Pigment Yellow 129, C.I. Pigment Yellow 138, C.I. Pigment Yellow 139, C.I. Pigment One or more yellow pigments from the group consisting of Yellow 150 and C.I. Pigment Yellow 185.

Based on the total weight of the photosensitive resin composition used to form partition walls according to the present disclosure, the content of the yellow pigment may be 0.03% to 5% by weight, preferably 0.05% to 5% by weight. When the content of the yellow pigment is lower than the above-mentioned content, the transmittance of light for a wavelength range of about 450 nm increases, so that color mixing between pixels may occur. When the content of the yellow pigment exceeds 5% by weight, the reflectivity of light in the wavelength range (550 nm to 650 nm) generated by red pixels and green pixels decreases, which may cause the display's luminous efficiency to deteriorate.

(a4) additional pigments or dyes

Within the scope that does not impair the purpose of the present disclosure, the (A) colorant according to the present disclosure may further include organic pigments, inorganic pigments, dyes, etc. commonly used in the technical field.

As the organic pigment, various pigments used in printing inks, inkjet inks, etc. can be used. Specific examples of organic pigments may include water-soluble azo pigments, insoluble azo pigments, phthalocyanine pigments, quinacridone pigments, isoindolinone pigments, isoindoles Isoindoline pigments, perylene pigments, perinone pigments, dioxazine pigments, anthraquinone pigments, dianthraquinonyl pigments, anthrapyrimidine pigments , anthanthrone pigment, indanthrone pigment, flavanthrone pigment, pyranthrone pigment or diketopyrrolopyrrole pigment.

Examples of the inorganic pigment may include metal compounds such as metal oxides or metal double salts, and specific examples may include metal oxides or complexes of iron, cobalt, aluminum, cadmium, lead, copper, titanium, magnesium, chromium, zinc or antimony. metal oxides.

Specific examples of organic pigments and inorganic pigments may include compounds classified as pigments in the Color Index (published by the Institute of Dyes and Colorists), and more specific examples thereof may include pigments having the following Color Index (C.I.) numbers, but Not necessarily limited to this:

Red pigments such as C.I. Pigment Red 9, 81, 97, 105, 122, 123, 144, 149, 150, 155, 166, 168, 171, 175, 176, 177, 179, 180, 185, 192, 202, 208 , 209, 214, 215, 216, 220, 222, 224, 242, 254, 255, 264, 269, 270 and 272;

Yellow pigments such as C.I. Pigment Yellow 13, 20, 24, 31, 53, 83, 86, 93, 94, 109, 110, 117, 125, 129, 137, 138, 139, 147, 148, 150, 153, 154 , 166, 173, 180 and 185;

Orange pigments, such as C.I. Pigment Orange 13, 15, 31, 36, 38, 40, 42, 43, 51, 55, 59, 61, 64, 65 and 71;

Green pigments, such as C.I. Pigment Green 7, 10, 15, 25, 36, 47, 58 and 59;

Blue pigments, such as C.I. Pigment Blue 15 (15:3, 15:4, 15:6, etc.), 21, 28, 60, 64 and 76;

Indigo pigments, such as C.I. Pigment Violet 1, 14, 19, 23, 29, 32, 33, 36, 37, and 38; and

Brown pigments such as C.I Pigment Brown 28.

The dye can be used without restriction as long as it is soluble in the organic solvent or dispersible in the organic solvent. It is preferable to use dyes that can ensure reliability, such as solubility to alkaline developers, heat resistance, and solvent resistance, and have solubility in organic solvents.

The dye may include acid dyes having an acidic group such as sulfonic acid or carboxylic acid, salts of acid dyes and nitrogen-containing compounds, sulfonamide derivatives of acid dyes, and one of its derivatives. In addition, one selected from azo acid dyes, xanthene-based acid dyes, phthalocyanine-based acid dyes, and derivatives thereof may also be included .

Preferred examples of dyes may include compounds classified as dyes in the Color Index (published by the Institute of Dyes and Colorists), or known dyes described in dyeing notes (dyed yarns).

Specific examples of dyes may include:

C.I. Solvent Green 1, 3, 4, 5, 7, 28, 29, 32, 33, 34 and 35;

C.I. Solvent Yellow 4, 14, 15, 16, 21, 23, 24, 38, 56, 62, 63, 68, 79, 82, 93, 94, 98, 99, 151, 162 and 163;

C.I. Solvent Blue 18, 35, 36, 45, 58, 59, 59:1, 63, 68, 69, 78, 79, 83, 94, 97, 98, 100, 101, 102, 104, 105, 111, 112 , 122, 128, 132, 136 and 139;

Red dyes, such as C.I. Solvent Red 8, 45, 49, 89, 111, 122, 125, 130, 132, 146, and 179; and

Red dyes such as C.I. Acid Red 1, 4, 8, 14, 17, 18, 26, 27, 29, 31, 34, 35, 37, 42, 44, 50, 51, 52, 57, 66, 73, 80 ,87,88,91,92,94,97,103,111,114,129,133,134,138,143,145,150,151,158,176,182,183,198,206,211,215 ,216,217,227,228,249,252,257,258,260,261,266,268,270,274,277,280,281,195,308,312,315,316,339,341,345 , 346, 349, 382, 383, 394, 401, 412, 417, 418, 422 and 426.

The pigments and dyes may each be used alone or two or more of the pigments and dyes may be used in combination.

(a5) Pigment dispersant

A pigment dispersant is added to deagglomerate the pigment and maintain pigment stability. Pigment dispersants commonly used in this technical field can be used without limitation. Specific examples of the pigment dispersant can include surfactants, such as cationic surfactants. surfactants, anionic surfactants, nonionic surfactants, amphoteric surfactants, polyester surfactants, polyamine surfactants, etc., and these surfactants can be used alone or in combination. two or more of them.

In addition, the pigment dispersant preferably includes an acrylic dispersion containing butyl methacrylate (BMA) or N,N-dimethylaminoethyl methacrylate (DMAEMA). agent (hereinafter referred to as acrylic dispersant). Acrylate dispersants preferably include those prepared by a living control method. Examples of commercially available acrylate dispersants include DISPER BYK-2000, DISPER BYK-2001, DISPER BYK-2070 or DISPER BYK-2150, and these acrylic dispersants may be used individually or two or more of these acrylic dispersants may be used in combination.

In addition to acrylic dispersants, other resin-based pigment dispersants can also be used as pigment dispersants. Examples of other resinous pigment dispersants may include known resinous pigment dispersants, particularly oily dispersants such as polyurethane, polycarboxylic acid ester represented by polyacrylate, Unsaturated polyamides, polycarboxylic acids, (partial) amine salts of polycarboxylic acids, ammonium salts of polycarboxylic acids, alkylamine salts of polycarboxylic acids salts), polysiloxanes, long-chain polyaminoamide phosphate salts, esters of hydroxyl-containing polycarboxylic acids and their modified products, or esters with free carboxyl groups Amides or salts thereof formed by the reaction of polyester and poly(lower alkylene imine); water-soluble resins or water-soluble polymers, such as (meth)acrylic acid-styrene copolymer (meth)acrylic acid-styrene copolymer ), (meth)acrylic acid-(meth)acrylate ester copolymer, styrene-maleic acid copolymer, polyvinyl alcohol (polyvinyl alcohol) or polyvinyl pyrrolidone; polyester; modified polyacrylate; ethylene oxide/propylene oxide adduct; and phosphate ester.

Examples of commercially available other resinous pigment dispersants mentioned above may include cationic resin dispersants, such as BYK-Chemie GmbH product names DISPER BYK-160, DISPER BYK-161, DISPER BYK-162, DISPER BYK-163, DISPER BYK-164, DISPER BYK-166, DISPER BYK-171, DISPER BYK-182 and DISPER BYK-184; BASF’s product names are EFKA-44, EFKA-46, EFKA-47, EFKA-48, EFKA-4010, EFKA-4050, EFKA-4055, EFKA-4020, EFKA-4015, EFKA-4060, EFKA-4300, EFKA-4330, EFKA-4400, EFKA-4406, EFKA-4510 and EFKA- 4800; product names SOLSPERS-24000, SOLSPERS-32550 and NBZ-4204/10 from Lubrizol; product names HINOACT T-6000, HINOACT T-7000 and HINOACT from Kawaken Fine Chemicals T-8000; Ajinomoto Fine-Techno's product names AJISPUR PB-821, AJISPUR PB-822 and AJISPUR PB-823; Kyoeisha Chemical's product names FLORENE DOPA-17HF, FLORENE DOPA-15BHF, FLORENE DOPA-33 and FLORENE DOPA-44; etc.

In addition to the acrylic dispersant, these other resin-type pigment dispersants may be used individually or two or more of these other resin-type pigment dispersants may be mixed, or the acrylic dispersant may be used in combination with Other resin pigment dispersants.

Based on 100 parts by weight of the solid content of the colorant, the content of the pigment dispersant may be 1 to 50 parts by weight, preferably 5 to 30 parts by weight. When the content of the pigment dispersant falls within the above range, dispersed pigments with uniform particle diameters can preferably be obtained. If the content of the pigment dispersant exceeds 50 parts by weight, the viscosity may increase. If the content of the pigment dispersant is less than 1 part by weight, it may be difficult to atomize the pigment, or may cause problems such as gelation after dispersion.

(B) Alkali solubility Resin

The alkali-soluble resin of the present disclosure is a component that imparts solubility to the alkaline developer used in the development process and serves as a dispersion medium for pigments.

The alkali-soluble resin can be used without limitation as long as it is soluble in the alkaline developer, and preferred examples thereof may include cardo-based alkali-soluble resin, acrylic alkali-soluble resin, or mixtures thereof.

Cardos alkali-soluble resins are reactive and alkali-soluble under irradiation or heating, and the cardos-based alkali-soluble resins included in the photosensitive resin composition for forming partition walls according to the present disclosure serve as a coloring agent containing white pigments. The binder resin of the agent is not limited as long as it is a resin soluble in an alkaline developer.

The cardos alkali-soluble resin of the present disclosure may include one or more compounds represented by Chemical Formula 1-1 and Chemical Formula 1-2.

[Chemical formula 1-1]

[Chemical formula 1-2]

In Chemical Formula 1-1 or Chemical Formula 1-2, R1, R2, R3 and R4 are each independently an alkyl group having 1 to 5 carbon atoms, a cycloalkyl group having 4 to 8 carbon atoms, or ,

X is a hydrogen atom; an alkyl group with 1 to 5 carbon atoms; or a hydroxyl group; and

R ₅ is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms.

In the present disclosure, the above-mentioned compound represented by Chemical Formula 1-1 can be synthesized into the following compound represented by Chemical Formula 2-1, and the compound represented by Chemical Formula 2-2 can be used to synthesize the compound represented by Chemical Formula 1-2 compound of.

[Chemical formula 2-1]

[Chemical formula 2-2]

Preferably, an acrylic alkali-soluble resin can be produced by copolymerizing an ethylenically unsaturated monomer having a carboxyl group.

Specific examples of the ethylenically unsaturated monomer having a carboxyl group may include: monocarboxylic acid, such as acrylic acid, methacrylic acid, and crotonic acid; dicarboxylic acid acids, such as fumaric acid, mesaconic acid and itaconic acid; dicarboxylic acid anhydrides; and mono(meth)acrylates with carboxyl and hydroxyl groups at both ends polymers, e.g. -Carboxy-polycaprolactone mono(meth)acrylate ( -carboxy-polycaprolactone mono(meth)acrylate), and acrylic acid and methacrylic acid are preferred.

In addition, the alkali-soluble resin can be produced by polymerizing an ethylenically unsaturated monomer having a carboxyl group and a copolymerizable unsaturated monomer.

Specific examples of the copolymerizable unsaturated monomer may include: glycidyl methacrylate, which is an unsaturated monomer having an oxypropylene group (glycidyl group); an ethylenically unsaturated monomer having a hydroxyl group, For example, hydroxyethyl(meth)acrylate, such as 2-hydroxyethyl(meth)acrylate, 2-hydroxypropyl(meth)acrylic acid Ester (2-hydroxypropyl(meth)acrylate), 4-hydroxybutyl(meth)acrylate(4-hydroxybutyl(meth)acrylate), 2-hydroxy-3-phenoxypropyl(meth)acrylate( 2-hydroxy-3-phenoxypropyl(meth)acrylate), N-hydroxyethyl acrylamide, etc.; aromatic vinyl compounds, such as styrene, vinyltoluene (vinyltoluene), -Methylstyrene (α-methylstyrene), p-chlorostyrene (p-chlorostyrene), o-methoxystyrene (o-methoxystyrene), m-methoxystyrene (m-methoxystyrene), p-methoxybenzene Ethylene (p-methoxystyrene), o-vinylbenzylmethyl ether (o-vinylbenzylmethyl ether), m-vinylbenzylmethyl ether (m-vinylbenzylmethyl ether), p-vinylbenzylmethyl ether (p-vinylbenzylmethyl ether) ), o-vinylbenzyl glycidyl ether (o-vinylbenzyl glycidyl ether), m-vinylbenzyl glycidyl ether (m-vinylbenzyl glycidyl ether), and p-vinylbenzyl glycidyl ether (p-vinylbenzyl glycidyl ether) ;N-substituted maleimide compounds, such as N-cyclohexylmaleimide (N-cyclohexylmaleimide), N-benzylmaleimide (N-benzylmaleimide), N-phenylmaleimide (N-phenylmaleimide), N-hydroxyphenylmaleimide (No-hydroxyphenylmaleimide), N-m-hydroxyphenylmaleimide Nm-hydroxyphenylmaleimide, N-p-hydroxyphenylmaleimide, N-o-methylphenylmaleimide, N-m-methylphenylmaleimide, N-p-methylphenylmaleimide, N-o-methoxyphenylmaleimide Endedimide (No-methoxyphenylmaleimide), N-m-methoxyphenylmaleimide (Nm-methoxyphenylmaleimide), and N-p-methoxyphenylmaleimide (Np -methoxyphenylmaleimide); alkyl(meth)acrylates, such as methyl(meth)acrylate, ethyl(meth)acrylate )acrylate), n-propyl (meth) acrylate (n-propyl (meth) acrylate), i-propyl (meth) acrylate (i-propyl (meth) acrylate), n-butyl (meth) acrylate n-butyl(meth)acrylate), i-butyl(meth)acrylate, secondary butyl(meth)acrylate(sec-butyl(meth) )acrylate), and t-butyl(meth)acrylate (t-butyl(meth)acrylate);

Alicyclic (meth)acrylates, such as cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate , 2-methylcyclohexyl(meth)acrylate, tricyclo[5.2.1.0(2,6)]decan-8-yl(meth)acrylate 5.2.1.0(2,6)]decan-8-yl (meth)acrylate), 2-dicyclopentanyloxyethyl(meth)acrylate (2-dicyclopentanyloxyethyl(meth)acrylate), and isoborneol (meth)acrylate isobornyl(meth)acrylate); aryl(meth)acrylates, such as phenyl(meth)acrylate and benzyl(meth)acrylate benzyl(meth)acrylate; unsaturated oxetane compounds, such as 3-(methacryloyloxymethyl)oxetane oxetane), 3-(methacryloyloxymethyl)-3-ethyloxetane (3-(methacryloyloxymethyl)-3-ethyloxetane), 3-(methacryloyloxymethyl)-2- Trifluoromethyloxetane (3-(methacryloyloxymethyl)-2-trifluoromethyloxetane), 3-(methacryloyloxymethyl)-2-phenyloxetane (3-(methacryloyloxymethyl)-2 -phenyloxetane), 2-(methacryloyloxymethyl)oxetane), and 2-(methacryloyloxymethyl)-4-trifluoromethyloxa cyclobutane (2-(methacryloyloxymethyl)-4-trifluoromethyloxetane), etc., but are not limited thereto.

The above-mentioned copolymerizable unsaturated monomers may be used individually or two or more of the above-mentioned copolymerizable unsaturated monomers may be used in combination.

The alkali-soluble resin preferably has an acid value of 30 mg KOH/g to 200 mg KOH/g. When the acid value of the alkali-soluble resin is less than 30 mg KOH/g, it is difficult for the photosensitive resin composition used to form partition walls to ensure a sufficient development speed. When the acid value of the alkali-soluble resin exceeds 200 mg KOH/g, the adhesion to the substrate decreases, pattern short circuit is likely to occur, and compatibility issues with colored materials may occur, resulting in the precipitation of colored materials in the photosensitive resin composition. Or the storage stability of the photosensitive resin composition decreases and the viscosity tends to increase.

The "acid value" is a value obtained by measuring the amount of potassium hydroxide (mg) required to neutralize 1 gram of acrylic polymer, and this value can usually be obtained by titration using an aqueous potassium hydroxide solution.

In addition, the weight average molecular weight of polystyrene-based cardos resin or acrylic alkali-soluble resin was measured using gel permeation chromatography (GPC) (using tetrahydrofuran as the eluant) to be 2,000 to 20,000, preferably 3,000 to 10,000. Within the above molecular weight range, film loss during the development process can be suppressed and pattern stability can be improved.

Based on the total weight of the photosensitive resin composition used to form partition walls according to the present disclosure, the content of the alkali-soluble resin may be 5% to 85% by weight, preferably 5% to 60% by weight. When the content of the alkali-soluble resin falls within the above range, the solubility in the developer is sufficient to promote the formation of the cured film, and the film reduction of the pixel portion of the exposed portion can be avoided during development, thereby improving the omission of unexposed portions.

(C) photopolymerizable compound

The photopolymerizable compound is a compound that can be polymerized through the action of the following (D) photopolymerization initiator, and may include a monofunctional monomer, a bifunctional monomer, or a polyfunctional monomer ( polyfunctional monomer), preferably a multifunctional monomer with difunctional or more functional groups.

Specific examples of the monofunctional monomer may include nonylphenylcarbitol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, acrylic acid 2 - 2-ethylhexylcarbitol acrylate, 2-hydroxyethyl acrylate or N-vinylpyrrolidone, but not limited thereto.

Specific examples of the bifunctional monomer may include 1,6-hexanediol di(meth)acrylate, ethylene glycol di(meth)acrylate (meth)acrylate), neopentyl glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, bisphenol bisphenol A bis(2-(acryloyloxy)ethyl)ether), or di(meth)acrylate (3-methylpentanediol) ester (3 -methylpentanediol di(meth)acrylate).

Examples of multifunctional monomers may include trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri( meth)acrylate), propoxylated trimethylolpropane tri(meth)acrylate), propoxylated trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate )acrylate), pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, ethoxylated dipentaerythritol Ethoxylated dipentaerythritol hexa(meth)acrylate, propoxylated dipentaerythritol hexa(meth)acrylate, or dixin Pentaerythritol hexa(meth)acrylate, but is not limited thereto.

In addition, based on the total weight of the photosensitive resin composition used to form partition walls according to the present disclosure, the content of the photopolymerizable compound may be 5% to 50% by weight. In terms of strength and smoothness, the content of the photopolymerizable compound is preferably within the above range.

(D) Photopolymerization initiator

The photopolymerization initiator according to the present disclosure is a radical-generating compound that can initiate the polymerization of a photopolymerizable compound by being exposed to radiation, such as visible light, ultraviolet light, far ultraviolet light, and electron beam. Or X-ray.

For example, acetophenone-based compounds, benzophenone-based compounds, biimidazole-based compounds, triazine-based compounds, Oxime ester-based compounds and thioxanthone-based compounds serve as photopolymerization initiators.

Specific examples of acetophenones may include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one (2-hydroxy-2-methyl-1- phenylpropan-1-one), benzyldimethylketal, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methylpropan-1-one (2 -hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methylpropan-1-one), 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-(4 -Methylthiophenyl)-2-morpholinopropan-1-one (2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one), 2-benzyl-2-dimethyl Amino-1-(4-morpholinophenyl)butan-1-one (2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butan-1-one), 2-hydroxy-2-methyl 2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propane-1-one , 2-(4-methylbenzyl)-2-(dimethylamino)-1-(4-morpholinylphenyl)butan-1-one (2-(4-methylbenzyl)-2-( dimethylamino)-1-(4-morpholinophenol)butan-1-one) etc.

Specific examples of benzophenone compounds may include benzophenone, o-benzoylbenzoate methyl ester (o-benzoylbenzoate), 4-phenylbenzophenone (4-phenylbenzophenone), 4-benzene 4-benzoyl-4'-methyldiphenyl sulfide, 3,3',4,4'-tetrakis(tert-butylperoxycarbonyl)benzophenone(3 ,3',4,4'-tetra(tert-butylperoxycarbonyl)benzophenone), 2,4,6-trimethylbenzophenone (2,4,6-trimethylbenzophenone), etc.

Specific examples of bis(2-chlorophenyl)-4,4'-bis(2-chlorophenyl)-4,4'-tetraphenylbis(2,2'-bis(2-chlorophenyl)) -4,4',5,5'-tetraphenylbiimidazole), 2,2'-bis(2,3-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole (2,2 '-bis(2,3-dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole), 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra( Alkoxyphenyl)biimidazole (2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(alkoxyphenyl)biimidazole), 2,2'-bis(2-chlorophenyl) )-4,4',5,5'-tetrakis(trialkoxyphenyl)biimidazole(2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(trialkoxyphenyl) biimidazole), 2,2-bis(2,6-dichlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole (2,2-bis(2,6 -dichlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole), imidazole in which the phenyl group at the 4,4',5,5' position is replaced by an alkoxycarbonyl group (carboalkoxy group) ) compounds, etc. Among these compounds, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(2,3- Dichlorophenyl)-4,4',5,5'-tetraphenylbiimidazole and 2,2-bis(2,6-dichlorophenyl)-4,4',5,5'-tetraphenyl Base-1,2'-biimidazole.

Specific examples of the tris[well] compound may include 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-tris(well)(2, 4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine), 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1, 3,5-Tris(2,4-bis(trichloromethyl)-6-(4-methoxynaphthyl)-1,3,5-triazine), 2,4-bis(trichloromethyl)-6- Piperonyl-1,3,5-triazine (2,4-bis(trichloromethyl)-6-piperonyl-1,3,5-triazine), 2,4-bis(trichloromethyl)-6 -(4-methoxystyryl)-1,3,5-triazine(2,4-bis(trichloromethyl)-6-(4-methoxystyryl)-1,3,5-triazine), 2,4-bis(trichloromethyl)-6-[2-(5-methylfuran-2-yl)vinyl]-1,3,5-tri[well](2,4-bis( trichloromethyl)-6-[2-(5-methylfuran-2-yl)ethenyl]-1,3,5-triazine), 2,4-bis(trichloromethyl)-6-[2-(furan-2 -ethyl]-1,3,5-triazine(2,4-bis(trichloromethyl)-6-[2-(furan-2-yl)ethenyl]-1,3,5-triazine ), 2,4-bis(trichloromethyl)-6-[2-(4-diethylamino-2-methylphenyl)vinyl]-1,3,5-tri[well]( 2,4-bis(trichloromethyl)-6-[2-(4-diethylamino-2-methylphenyl)ethenyl]-1,3,5-triazine), 2,4-bis(trichloromethyl)-6-[ 2-(3,4-dimethoxyphenyl)vinyl]-1,3,5-tri[well](2,4-bis(trichloromethyl)-6-[2-(3,4-dimethoxyphenyl )ethenyl]-1,3,5-triazine) etc.

Specific examples of the oxime ester compound may include o-ethoxycarbonyl- -Oxime-1-phenylpropan-1-one (o-ethoxycarbonyl- -oxyimino-1-phenylpropan-1-one), 1,2-octanedione (1,2-octanedione), 1-(4-(phenylthio)phenyl)-(1-(4-(phenylthio) )phenyl)-), 2-(o-benzoyloxime), ethanone, 1-(9-ethyl)-6-(2-methylbenzoyloxime) methylbenzoyl-3-yl)-(1-(9-ethyl)-6-(2-methylbenzoyl-3-yl)-), 1-(o-acetyloxime)(1-(o-acetyloxime)), etc., and Examples of commercially available products include Ciba Geigy's CGI-124 and CGI-224, BASF's Irgacure OXE-01、Irgacure OXE-02 and Irgacure OXE-03, N-1919 and NCI-831 of Adeka Corporation, etc.

Specific examples of thioxanthone compounds may include 2-isopropylthioxanthone, 2,4-diethylthioxanthone, and 2,4-dichlorothioxanthone. Ketone (2,4-dichlorothioxanthone), 1-chloro-4-propoxythioxanthone (1-chloro-4-propoxythioxanthone), etc.

The photopolymerization initiator may be used alone, or two or more of the photopolymerization initiators may be used in mixture.

Based on the total weight of the photosensitive resin composition used to form the partition wall, the content of the photopolymerization initiator may be 0.01% to 10% by weight, preferably 0.01% to 5% by weight. When the content of the photopolymerization initiator falls within the above range, the photopolymerization reaction rate is appropriate to better avoid an increase in the overall processing time and deterioration of the physical properties of the final cured film caused by excessive reaction.

The photosensitive resin composition used to form partition walls according to the present disclosure may further include a photopolymerization initiation aid in addition to the photopolymerization initiator. When a photopolymerization initiating assistant and a photopolymerization initiator are used together, the photosensitive resin composition becomes more sensitive to better improve the productivity.

The photopolymerization initiating assistant is a compound used to promote the polymerization of the photopolymerizable compound. The polymerization of the photopolymerizable compound is initiated by a photopolymerization initiator, and preferably a compound selected from the group consisting of amines and carboxylic acids can be used. One or more compounds in the group consisting of acid) compounds serve as photopolymerization initiating assistants.

When a photopolymerization initiating assistant is included, based on 1 mole of the photopolymerization initiator, the content of the photopolymerization initiating assistant may generally be 0 moles to 10 moles, preferably 0.01 moles to 5 moles. More. When the content of the photopolymerization initiating assistant falls within the above range, it can be expected that the yield will be improved by increasing the photopolymerization efficiency.

(E) Solvent

As the solvent, organic solvents known in the art can be used without particular limitation.

Specific examples of solvents may include: ethers, such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether ), ethylene glycol monobutyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether ( diethylene glycol dipropyl ether), diethylene glycol dibutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether ), propylene glycol monobutyl ether, dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, dipropylene glycol dipropyl ether, and dipropylene glycol dimethyl ether dipropylene glycol dibutyl ether; aromatic hydrocarbons, such as benzene, toluene, xylene, and mesitylene; ketones, For example, methyl ethyl ketone, acetone, methyl amyl ketone, methyl isobutyl ketone, and cyclohexanone; alcohols, For example, ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, and glycerin; esters , such as ethyl 3-ethoxypropionate, methyl 3-methoxypropionate, methyl cellosolve acetate, ethyl cellulosine acetate (ethyl cellosolve acetate), ethyl acetate (ethyl acetate), butyl acetate (butyl acetate), amyl acetate (amyl acetate), methyl lactate (methyl lactate), ethyl lactate (ethyl lactate), butyl lactate ( butyl lactate), 3-methoxybutyl acetate (3-methoxybutyl acetate), 3-methyl-3-methoxy-1-butyl acetate (3-methyl-3-methoxy-1-butyl acetate), Methoxypentyl acetate, ethylene glycol monoacetate, ethylene glycol diacetate, ethylene glycol monomethyl ether acetate glycol monomethyl ether acetate), ethylene glycol monoethyl ether acetate, diethylene glycol monoacetate, diethylene glycol diacetate), diethylene glycol monobutyl ether acetate, propylene glycol monoacetate, propylene glycol diacetate, propylene glycol monoethyl ether acetate (propylene glycol monoethyl ether acetate), ethylene carbonate, propylene carbonate, and -Butyrolactone( -butyrolactone) etc. One selected from the group consisting of the exemplified solvents or a mixture of two or more may be used as the solvent.

In terms of applicability and drying properties, the solvent preferably contains a to 200 Organic solvents with a boiling point, preferably including alkylene glycol alkyl ether acetates, ketones, and esters (such as ethyl 3-ethoxypropionate, 3-methoxy methyl propionate), etc., and more preferably include propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, cyclohexanone, ethyl 3-ethoxypropionate Ester, methyl 3-methoxypropionate, etc. These solvents may be used individually or two or more of these solvents may be used in mixture.

The content of the solvent may be the balance of 100% by weight of the photosensitive resin composition forming the partition wall. Specifically, the “remainder” in the present disclosure represents the remaining amount that makes the total weight of the composition containing the essential ingredients of the disclosure and further including other additional ingredients become 100% by weight. The meaning of the above “remainder” is not limiting. The photosensitive resin composition used to form partition walls of the present disclosure does not contain additional components.

For example, based on the total weight of the photosensitive resin composition used to form partition walls, the content of the solvent may be 60% to 90% by weight, preferably 70% to 85% by weight, but is not limited thereto. However, when the content of the solvent falls within the above content range, when the solvent is used in, for example, a roll coater, a spin coater, a slit and spin coater, a slot coater When used with coating devices such as slit coaters (sometimes called die coaters) and inkjet machines, it can better provide the effect of improving applicability.

additives

The photosensitive resin composition used to form partition walls according to the present disclosure may further include additives, such as fillers, other polymers, curing agents, surfactants, adhesion promoters ( adhesion promoter), antioxidant, ultraviolet absorber and anti-aggregation agent. The above-mentioned additives may be used alone or two or more of them may be used in combination.

Specific examples of fillers may include glass, silica, alumina, etc., but are not limited thereto.

Specific examples of other polymers may include curable resins such as epoxy resins and maleimide resins, thermoplastic resins such as polyvinyl alcohol, polyacrylic acid, etc. acid, polyethylene glycol monoalkyl ether, polyfluoroalkyl acrylate, polyester and polyurethane, but are not limited thereto.

Examples of surfactants may include silicone-based surfactants, fluorine-based surfactants, ester surfactants, cationic surfactants, anionic surfactants, non-ionic surfactants, etc. ionic surfactants and amphoteric surfactants, and these surfactants may be used alone or in combination of two or more of these surfactants.

The antioxidant may include, for example, one or more selected from the group consisting of phosphorus antioxidants, sulfur antioxidants, and phenolic antioxidants, in which case discoloration occurring at high temperatures during treatment can be suppressed Phenomenon or yellowing caused by light sources after the display is manufactured. Examples of antioxidants may include one or more selected from the group consisting of phenolic compounds, phosphorus compounds and sulfur compounds, which may be combined with phenol-phosphorus compounds, phenol-sulfur compounds, phosphorus-sulfur compounds Compounds or phenolic phosphorus-sulfur compounds are used in combination.

Specific examples of the adhesion promoter may include vinyltrimethoxysilane (vinyltrimethoxysilane), vinyltriethoxysilane (vinyltriethoxysilane), vinyltris(2-methoxyethoxy)silane (vinyltris(2- methoxyethoxy)silane), N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane (N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane), N-(2-aminoethyl)- 3-Aminopropyltrimethoxysilane (N-(2-aminoethyl)-3-aminopropyltrimethoxysilane), 3-aminopropyltriethoxysilane (3-aminopropyltriethoxysilane), 3-glycidoxypropyltrimethoxysilane ( 3-glycidoxypropyltrimethoxysilane), 3-glycidoxypropylmethyldimethoxysilane (3-glycidoxypropylmethyldimethoxysilane), 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane (2-(3, 4-epoxycyclohexyl)ethyltrimethoxysilane), 3-chloropropylmethyldimethoxysilane (3-chloropropylmethyldimethoxysilane), 3-chloropropyltrimethoxysilane (3-chloropropyltrimethoxysilane), 3-methacryltrimethoxypropyl Trimethoxysilane (3-methacryloxypropyltrimethoxysilane), 3-mercaptopropyltrimethoxysilane (3-mercaptopropyltrimethoxysilane), 3-isocyanatepropyltrimethoxysilane, and 3-isocyanatopropyltriethoxysilane Oxysilane (3-isocyanatepropyltriethoxysilane) or one of the group consisting of mixtures thereof.

Specific examples of the anti-aggregation agent may include sodium polyacrylate and the like, but are not limited thereto.

Those with ordinary skill in the art can appropriately add and use additives within the scope that does not impair the efficacy of the present disclosure. For example, based on the total weight of the photosensitive resin composition used to form the partition wall, the content of the additive may be 0.05% to 10% by weight, preferably 0.1% to 10% by weight, and more preferably 0.1% to 10% by weight. 0.1% to 5%, but not limited to this.

＜Partition wall structure and display device＞

The present disclosure provides a partition structure manufactured using a photosensitive resin composition for forming partition walls, and a display device including the same.

In a display device including a color conversion panel, since each pixel is driven to form a color, it is necessary to form a partition wall structure capable of distinguishing individual pixels. A display device including a partition wall structure formed using the photosensitive resin composition for forming partition walls according to the present disclosure can form partition walls to avoid color mixing between pixels, which is beneficial to forming fine patterns, and along with the development process The change in line width caused by the change in development time is very small. When the line width of the partition wall changes very little, the benefit is that the color conversion pixels can ensure sufficient spacing (space) and achieve high-quality images.

In addition, the partition wall structure is preferably formed to have 3 to 20 The height or thickness is preferably 3 to 15 height or thickness.

Examples of display devices may include liquid crystal display devices, organic light emitting diodes, flexible displays, etc., but are not limited thereto, and all known display devices in this application field may be used as examples.

In order to manufacture the color conversion partition wall, the composition used to form the partition wall according to the present disclosure may be used without particular limitation by applying methods commonly used in the art.

For example, the above composition can be applied to a surface of the substrate and a cured film can be formed through a photocuring and development process to form partition walls. A photolithography process may be used to form the color conversion panel partition structure for distinguishing the color conversion pixels.

Specifically, in order to form partition walls, each photosensitive resin composition can be applied on a surface of a substrate, and then volatile components, such as solvents, are removed by heating and drying to obtain a smooth cured film.

The coating method of the composition is not particularly limited, and examples thereof may include spin coating, flexible coating method, roll coating method, slot-spin coating method, slit coating method, and the like.

After applying the composition, heat drying (pre-baking, pre-baking) or drying under reduced pressure is performed followed by heating to volatilize volatile components (eg, solvents). The heating temperature can generally be 70 to 150 , preferably 80 to 130 , but not limited to this.

In order to form a target pattern on the coating film thus formed, ultraviolet light is irradiated through a mask to cure the portion irradiated with ultraviolet light. At this time, it is best to use a device such as a mask aligner or a stepper to evenly illuminate the entire exposed area with parallel light, and adjust the mask and cured film substrate to achieve precise positioning. G-rays (wavelength 436 nm), h-rays (h-rays), i-rays (wavelength 365 nm), etc. can be used as ultraviolet light. The UV irradiance can be appropriately selected according to needs. (irradiance).

The cured coating film is contacted with a developing machine to dissolve the unexposed areas and develop, thereby forming a cured film of a target pattern.

Through additional heating and curing processes (pre-baking, pre-baking), the resulting cured film can be cured harder than the cured product. In this case, the heating temperature can be 90 to 230 , and the heating time can be from 5 minutes to 180 minutes, preferably from 15 minutes to 90 minutes, but is not limited thereto.

The present disclosure will be described in more detail below through examples.

The following examples are provided to describe the present disclosure in more detail, however the scope of the present disclosure is not limited to the following examples. Within the scope of the present disclosure, the following embodiments may be modified and changed within the common knowledge of those skilled in the art.

In addition, unless otherwise stated, "%" and "parts" indicating content are based on weight.

<Examples and Comparative Examples: Preparation of Photosensitive Resin Composition>

Photosensitive resin compositions according to the examples and comparative examples were prepared with reference to the compositions and weight parts described in Table 1 and Table 2 below.

[Table 1] (A) Colorant composition (% by weight) white pigment(a1) black pigment(a2) Yellow pigment (a3) dispersant sum a2-1 a2-2 a3-1 a3-2 a3-3 Example 1 6 0.5 - 1 - - 0.2 7.7 Example 2 4 0.3 - 2 - - 0.2 6.5 Example 3 2 0.2 - 3 - - 0.2 5.4 Example 4 20 0.7 - 1 - - 0.2 21.9 Example 5 30 1.5 - 1 - - 0.2 32.7 Example 6 2 0.03 - 0.03 - - 0.2 2.26 Example 7 6 - 0.5 1 - - 0.2 7.7 Example 8 2 0.2 - - 3 - 0.2 5.4 Example 9 2 0.2 - - - 3 0.2 5.4 Comparative example 1 15 1 - - - - 0.2 16.2 Comparative example 2 6 1 - - - - 0.2 7.2 Comparative example 3 - 2 - 2 - - 0.2 4.2 Comparative example 4 6 - - 5 - - 0.2 11.2

[Table 2] Unit (% by weight) Example Comparative example 1 2 3 4 5 6 7 8 9 1 2 3 4 (A) Colorant 7.7 6.5 5.4 21.9 32.7 2.26 7.7 5.4 5.4 16.2 7.2 4.2 11.2 alkali soluble resin 43.4 44.0 44.5 36.4 31.5 46.02 43.4 44.5 44.5 39.4 43.7 45.1 41.8 photopolymerizable compound 43.4 44.0 44.5 36.4 31.5 46.02 43.4 44.5 44.5 39.4 43.7 45.1 41.8 Photopolymerization initiator 4.5 4.5 4.6 4.3 3.3 4.7 4.5 4.6 4.6 4.0 4.4 4.6 4.2 additives 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 total amount 100 100 100 100 100 100 100 100 100 100 100 100 100

- White pigment (a1-1): TiO ₂ (Ti-Pure R-101, DuPont)

- black pigment (a2)

- a2-1: lactam black (100cf, BASF)

- a2-2: Perylene Black (C.I Pigment Black 32, BASF Corporation)

- yellow pigment (a3)

- a3-1: C.I Pigment Y138 (BASF Corporation)

- a3-2: C.I Pigment Y139 (BASF Corporation)

- a3-3: C.I Pigment Y185 (BASF Corporation)

- Dispersant: DISPERBYK-2000

- Alkali-soluble resin: Acrylic alkali-soluble resin (CX-65-C, SHOWA DENKO K.K.)

- Photopolymerizable compound: ethoxylated dipentaerythritol pentaacrylate (A-DPH-12E, Shin Nakamura Chemical Co., Ltd.)

- Photopolymerization initiator: PBG-327 (Tronly)

- Additive: F554 (DIC Corporation)

＜Experimental example＞

(1) Preparation of partition wall pattern cured film

Use neutral detergent and water to clean 5 cm 5 cm glass substrate (Corning Incorporated) and allowed to dry. On the glass substrate, the solid photosensitive resin compositions according to the examples and comparative examples were diluted to a concentration of 30% using propylene glycol methyl ether acetate (PGMEA) solvent. Spin coating was performed to remove the solvent and the final film thickness was 10 , to 80 Bake before proceeding and allow to dry for 2 minutes. Next, use an exposure dose of 100 mJ/ ^cm2 to make a to 100 line/space pattern or 40 mm A 40 mm mask of the pattern was exposed, and an alkaline aqueous solution was used to remove the unexposed areas. Then use 180 Post-bake the prepared cured film for 30 min to prepare a film with 10 The thickness of the cured film of the partition wall pattern.

(2) Measure tapered shoulders (tapered shoulders) Angle

The cured film of the partition wall pattern prepared according to the photosensitive resin composition of the Example and Comparative Example was inspected using an electron microscope (product name: SU-8010 of Hitachi Ltd.), and as shown in Figure 3 Methods Measure the angle of the tapered shoulder. The results are shown in Table 3 below.

＜Evaluation criteria for tapered shoulder angle＞

: greater than 140

: Greater than 110 and less than 140

: less than or equal to 110

(3) Evaluation of Solvent Resistance

The cured film of the partition wall pattern prepared according to the photosensitive resin composition of the Example and Comparative Example was immersed for 90 The film was immersed in propylene glycol methyl ether acetate solvent for 10 minutes, and the change in film thickness before and after immersion was measured and evaluated for comparison. The results are shown in Table 3 below.

＜Evaluation criteria for solvent resistance＞

: Less than or equal to 0.1

: greater than 0.1 and less than or equal to 0.3

: Greater than 0.3 and less than or equal to 0.7

: greater than 0.7

(4) Assessment of residues

The surface of the cured film of the partition wall pattern prepared according to the photosensitive resin composition of the Example and Comparative Example was observed using an optical microscope, and evaluated according to the residue measurement standard shown in Figure 4.

＜Residue Evaluation Criteria＞

: No residue

: Less residue

: Many residues

[table 3] Process characteristics Taper angle Solvent resistance residue Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 Comparative example 1 Comparative example 2 Comparative example 3 Comparative example 4

(5) Measuring transmittance and reflectance

Measured using a spectrophotometer (CM-3700d) with 10 The transmittance and reflectance of the partition wall pattern cured film with thickness at each wavelength.

The transmittance or reflectance evaluation criteria at each wavelength are shown below, and the results are shown in Table 4 below.

<Transmittance at wavelength 450 nm>

: Less than or equal to 5%

: Greater than 5% and less than or equal to 20%

: Greater than 20%

<Reflectance at wavelength 550 nm>

: Greater than or equal to 20%

: Greater than or equal to 15% and less than 20%

: Greater than or equal to 10% and less than 15%

: Less than 10%

<Reflectance at wavelength 650 nm>

: Greater than or equal to 20%

: Greater than or equal to 15% and less than 20%

: Greater than or equal to 10% and less than 15%

: Less than 10%

<Transmittance at wavelength 900 nm>

: Greater than or equal to 70%

: Greater than or equal to 55% and less than 70%

: Less than 55%

[Table 4] Optical properties Transmission at 450 nm Reflectivity at 550 nm Reflectivity at 650 nm Transmission at 900 nm Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 Comparative example 1 × Comparative example 2 Comparative example 3 Comparative example 4

Referring to Table 3 and Table 4, it can be confirmed that the cured film of the partition pattern prepared using the photosensitive resin composition according to the embodiment has a transmittance of 20% or less at a wavelength of 450 nm, and a transmittance of 20% or less at a wavelength of 550 and 650 nm. Having a reflectivity of 10% or more and a transmittance of 70% or more at a wavelength of 900 nm. Therefore, when the photosensitive resin composition according to the present disclosure is used to form the cured film of the partition pattern between the display devices, it can effectively avoid color mixing of the color conversion panel, improve the resolution light efficiency, and make the alignment keys easy to identify.

In addition, it can be confirmed that when the cured film of the partition wall pattern is prepared using the photosensitive resin composition according to the embodiment, especially when the cured film of the partition wall pattern is prepared using the photosensitive resin composition according to Examples 1 to 4 and 7 In the case of preparing the photosensitive resin composition of Example 9, reliability such as solvent resistance was excellent, there was no residue except for pattern formation parts, and the taper process characteristics were excellent.

At the same time, it has been confirmed that the cured film of the partition wall pattern prepared using the photosensitive resin composition according to Comparative Example 1 to Comparative Example 4 (excluding one or more of white pigment, black pigment and yellow pigment) does not satisfy the requirement according to the present invention. The transmittance and reflectance ranges at the disclosed wavelengths are disclosed, and it can be confirmed that the process characteristics of the cured film, such as tapered shoulder angle, solvent resistance and residue, are also worse than those of the embodiments.

Figure 1 is a spectrum diagram illustrating the transmittance and reflectance of a partition pattern cured film prepared from a photosensitive resin composition for forming partitions according to Examples 1 and 3 of the present disclosure; Figure 2 is a spectrum diagram illustrating the transmittance and reflectance of a partition pattern cured film prepared from a photosensitive resin composition for forming partitions according to Comparative Example 2 of the present disclosure; Figure 3 illustrates a method of measuring the tapered shoulder angle of a partition wall pattern cured film prepared from a photosensitive resin composition for forming partition walls according to embodiments and comparative examples of the present disclosure; and Figure 4 illustrates the evaluation criteria for the residual characteristics of the partition pattern cured film prepared from the photosensitive resin composition for forming partitions according to the embodiments and comparative examples of the present disclosure.

Claims (14)

A photosensitive resin composition for forming partition walls, including: (A) a colorant; (B) an alkali-soluble resin; (C) a photopolymerization (photopolymerizable compound); (D) a photopolymerization initiator; and (E) a solvent, wherein when a cured film prepared from the photosensitive resin composition has a thickness of 3 microns ( ) to a thickness of 15 microns, the cured film has a transmittance of 20% or less at a wavelength of 450 nanometers (nm) and 10% or more at a wavelength of 550 nanometers to 650 nanometers. High reflectance and a transmittance of 70% or more at a wavelength of 900 nanometers. The photosensitive resin composition of claim 1, wherein the colorant includes a white pigment, a black pigment and a yellow pigment. The photosensitive resin composition of claim 2, wherein the white pigment has an average particle size of 150 nanometers to 400 nanometers. The photosensitive resin composition according to claim 2, wherein the white pigment contains titanium oxide (TiO ₂ ). The photosensitive resin composition according to claim 4, wherein titanium oxide (TiO ₂ ) is selected from the group consisting of silicon oxide (SiO ₂ ), aluminum oxide (Al ₂ O ₃ ), Zirconium oxide (ZrO ₂ ) is surface-treated with one or more of a group consisting of various organic materials. The photosensitive resin composition as claimed in claim 2, wherein the black pigment includes one selected from the group consisting of lactam black, perylene black, cyanine black and aniline black. One or more members of a group. The photosensitive resin composition of claim 2, wherein the yellow pigment includes one or more selected from the group consisting of C.I. Pigment Yellow 138, 139, 150 and 185. The photosensitive resin composition of claim 2, wherein the content of the white pigment is 1% to 28% by weight based on the total weight of the photosensitive resin composition. The photosensitive resin composition of claim 2, wherein the content of the black pigment is 0.05% to 5% by weight based on the total weight of the photosensitive resin composition. For the photosensitive resin composition as described in claim 2, based on the total weight of the photosensitive resin composition, the content of the yellow pigment is 0.05% to 5% by weight. The photosensitive resin composition according to claim 1, wherein the alkali-soluble resin includes cardo-based alkali-soluble resin and acrylic alkali-soluble resin. The photosensitive resin composition as described in claim 1 further includes a filler, a polymer, a curing agent, a surfactant, an adhesion promoter, and an antioxidant. One or more of the group consisting of antioxidant and anti-aggregation agent. A partition wall structure manufactured using the photosensitive resin composition according to any one of claims 1 to 12. A display device comprising a partition wall structure as described in claim 13.