TW202343411A - Micro-light-emitting diode display panel - Google Patents
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- 238000003698 laser cutting Methods 0.000 claims description 4
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- 229910002601 GaN Inorganic materials 0.000 description 1
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
本發明係有關一種微發光二極體(microLED)顯示面板,特別是關於一種可輕易修復的微發光二極體顯示面板。The present invention relates to a micro-light-emitting diode (microLED) display panel, and in particular to a micro-light-emitting diode display panel that can be easily repaired.
微發光二極體(microLED、mLED或μLED)顯示面板為平板顯示器(flat panel display)的一種,其係由尺寸等級為1~100微米之個別精微(microscopic)發光二極體所組成。相較於傳統液晶顯示面板,微發光二極體顯示面板具較大對比度及較快反應時間,且消耗較少功率。微發光二極體與有機發光二極體(OLED)雖然同樣具有低功耗的特性,但是,微發光二極體因為使用三-五族二極體技術(例如氮化鎵),因此相較於有機發光二極體具有較高的亮度(brightness)、較高的發光效能及較長的壽命。MicroLED (microLED, mLED or μLED) display panel is a type of flat panel display, which is composed of individual microscopic light-emitting diodes with a size range of 1 to 100 microns. Compared with traditional liquid crystal display panels, micro-light-emitting diode display panels have larger contrast ratios, faster response times, and consume less power. Although micro-light-emitting diodes and organic light-emitting diodes (OLED) also have low power consumption characteristics, micro-light-emitting diodes use Group III-V diode technology (such as gallium nitride), so compared with Organic light-emitting diodes have higher brightness, higher luminous efficiency and longer life.
於製造微發光二極體顯示面板時,當安裝驅動器積體電路(integrated circuit)於玻璃基板上,有時會發生異常(例如斷路或短路)。為了修復此異常,需進行重工(re-work),將原驅動器積體電路自玻璃基板去除,再重安裝替代驅動器積體電路於玻璃基板上,因此需耗費相當時間與成本。此外,當進行重工時,很可能會破壞鄰近的微發光二極體。When manufacturing micro-light-emitting diode display panels, abnormalities (such as open circuits or short circuits) sometimes occur when the driver integrated circuit is mounted on the glass substrate. In order to repair this abnormality, re-work is required to remove the original driver integrated circuit from the glass substrate and then reinstall the replacement driver integrated circuit on the glass substrate, which requires considerable time and cost. Additionally, when heavy work is performed, adjacent micro-LEDs are likely to be damaged.
因此亟需提出一種新穎機制,用以克服製造微發光二極體顯示面板時所遇到的缺失。Therefore, there is an urgent need to propose a novel mechanism to overcome the shortcomings encountered in manufacturing micro-light-emitting diode display panels.
鑑於上述,本發明實施例的目的之一在於提出一種微發光二極體顯示面板,可使用較少時間與成本以進行修復。In view of the above, one purpose of embodiments of the present invention is to provide a micro-light emitting diode display panel that can be repaired with less time and cost.
根據本發明實施例,微發光二極體顯示面板包含基板及設於基板的驅動器。驅動器包含電源信號端子及相應的修復端子。電源信號端子藉由設於基板的電源信號線連接至電源。修復端子藉由設於基板的修復線連接至電源。電源信號端子與相應修復端子於驅動器內互相電性連接。According to an embodiment of the present invention, a micro-light emitting diode display panel includes a substrate and a driver provided on the substrate. The driver contains power signal terminals and corresponding repair terminals. The power signal terminal is connected to the power supply through a power signal line provided on the substrate. The repair terminal is connected to the power supply through a repair wire provided on the substrate. The power signal terminals and the corresponding repair terminals are electrically connected to each other in the driver.
根據本發明另一實施例,微發光二極體顯示面板包含基板及設於基板的驅動器。驅動器包含信號端子及相應的修復端子。信號端子耦接設於基板的相應信號線。修復端子耦接設於基板的相應修復線。修復線與相應信號線部分重疊,但未初始電性連接。According to another embodiment of the present invention, a micro-light emitting diode display panel includes a substrate and a driver provided on the substrate. The driver contains signal terminals and corresponding repair terminals. The signal terminals are coupled to corresponding signal lines provided on the substrate. The repair terminal is coupled to the corresponding repair line provided on the substrate. The repair line partially overlaps the corresponding signal line, but is not initially electrically connected.
第一圖顯示本發明實施例的微發光二極體(microLED)顯示面板100的方塊圖。在本實施例中,微發光二極體顯示面板100可包含複數微發光二極體11,排列為矩陣形式。微發光二極體顯示面板100可包含驅動器12(例如積體電路),使用被動矩陣定址(passive matrix addressing)機制以驅動微發光二極體11。其中,同一行的微發光二極體11的陽極電性連接至驅動器12,同一列的微發光二極體11的陰極電性連接至驅動器12。微發光二極體顯示面板100可包含時序控制器13,用以控制驅動器12。The first figure shows a block diagram of a
第二圖顯示本發明第一實施例的微發光二極體顯示面板100的俯視圖。其中,驅動器12結合於基板10(例如玻璃基板)上。驅動器12可包含至少一電源信號端子(terminal、pin或pad)121,如第二圖所例示的Vp1與Vp2。電源信號端子及本說明書後續提及的其他端子可包含導電材質(例如氧化銦錫(ITO))。電源信號端子121可藉由(設於基板10上的)電源信號線101連接至電源,例如數位(digital)電源電壓(DVDD)、類比(analog)電源電壓(AVDD)或地(GND)。The second figure shows a top view of the micro-light emitting
根據本實施例的特徵之一,本實施例的驅動器12可包含至少一修復端子122,例如第二圖所例示的r_Vp1與r_Vp2,相應於電源信號端子121。修復端子122可藉由(設於基板10上的)修復線102連接至電源。值得注意的是,電源信號端子121與修復端子122於驅動器12內互相電性連接。According to one of the features of this embodiment, the
根據上述實施例,當電源信號端子121(例如Vp1)偵測到異常(例如斷路或短路)時,切斷電源信號線101與電源信號端子121之間的連接(例如標示X處)。所述切斷可使用雷射切割來進行。因此,修復端子122可藉由修復線102以連接至電源(如虛線所示),而非藉由電源信號線101以連接異常的電源信號端子121。藉此,不須進行重工(亦即,將原驅動器12自基板10去除,再重安裝替代驅動器於基板10上)即可修復異常。因此,製造微發光二極體顯示面板100時,可大量降低時間與成本。According to the above embodiment, when the power signal terminal 121 (eg Vp1) detects an abnormality (eg open circuit or short circuit), the connection between the
第三圖顯示本發明第二實施例的微發光二極體顯示面板100的俯視圖。其中,驅動器12結合於基板10上。驅動器12可包含至少一信號端子123,如第三圖所例示的資料與控制輸入信號端子T1~T3、資料輸出信號端子D1~D3/Dx~Dz及共同輸出信號端子C1~C3/Cx~Cz。信號端子123可耦接至相應信號線103,其設於基板10上。The third figure shows a top view of the micro-light emitting
根據本實施例的特徵之一,本實施例的驅動器12可包含至少一修復端子124,相應於信號端子123。如第三圖所例示,修復端子r_Ta與r_Tb相應於資料與控制輸入信號端子T1~T3,修復端子r_Da與r_Db相應於資料輸出信號端子D1~D3/Dx~Dz,修復端子r_Ca與r_Cb相應於共同輸出信號端子C1~C3/Cx~Cz。在本實施例中,修復端子124可耦接相應修復線104,其設於基板10上。如第三圖所例示,修復端子r_Ta與r_Tb分別耦接相應的修復線r_Tbusa與r_Tbusb,修復端子r_Da與r_Db分別耦接相應的修復線r_Dbusa與r_Dbusb,修復端子r_Ca與r_Cb分別耦接相應的修復線r_Cbusa與r_Cbusb。According to one of the features of this embodiment, the
修復線104與相應信號線103可部分重疊,但未初始電性連接。如第三圖所例示,修復線r_Tbusa與r_Tbusb與相應信號線103(其相應於信號端子T1~T3)可部分重疊,但未初始電性連接;修復線r_Dbusa與r_Dbusb與相應信號線103(其相應於信號端子D1~D3/Dx~Dz)可部分重疊,但未初始電性連接;修復線r_Cbusa與r_Cbusb與相應信號線103(其相應於信號端子C1~C3/Cx~Cz)可部分重疊,但未初始電性連接。The repair line 104 and the corresponding signal line 103 may partially overlap, but are not initially electrically connected. As illustrated in the third figure, the repair lines r_Tbusa and r_Tbusb and the corresponding signal lines 103 (which correspond to the signal terminals T1 to T3) may partially overlap, but are not initially electrically connected; the repair lines r_Dbusa and r_Dbusb and the corresponding signal lines 103 (which correspond to the signal terminals T1~T3) Corresponding to signal terminals D1~D3/Dx~Dz) may partially overlap, but are not initially electrically connected; repair lines r_Cbusa and r_Cbusb and corresponding signal lines 103 (corresponding to signal terminals C1~C3/Cx~Cz) may partially overlap , but not initially electrically connected.
根據上述實施例,當信號端子123(例如T2)偵測到異常(例如斷路或短路)時,切斷信號端子123與相應信號線103之間的連接(例如標示X處)。所述切斷可使用雷射切割來進行。接著,電性耦接修復線104(例如r_Tbusb)與(相應於異常的)信號線103之間的重疊位置。所述電性耦接可使用雷射焊接。然後,選擇修復端子124(例如r_Tb)並放棄相應於異常的信號端子123(例如T2)。所述驅動器12的選擇與放棄可由時序控制器13設定,例如使用多工器(multiplexer)從信號端子123與修復端子124當中來選擇。因此,(相應於異常的)信號線103可連接至修復端子(例如t_Tb),而非連接至異常的信號端子(例如T2)。藉此,不須進行重工(亦即,將原驅動器12自基板10去除,再重安裝替代驅動器於基板10上)即可修復異常。因此,製造微發光二極體顯示面板100時,可大量降低時間與成本。類似的情形,當其他信號端子123(例如第三圖所例示的D1、C3、Cy或Dx)偵測到異常(例如斷路或短路)時,可使用上述程序以修復異常。According to the above embodiment, when the signal terminal 123 (eg T2) detects an abnormality (eg open circuit or short circuit), the connection between the signal terminal 123 and the corresponding signal line 103 is cut off (eg marked X). The cutting can be performed using laser cutting. Next, the overlapping position between the repair line 104 (for example, r_Tbusb) and the signal line 103 (corresponding to the abnormality) is electrically coupled. The electrical coupling may use laser welding. Then, the repair terminal 124 (for example, r_Tb) is selected and the signal terminal 123 (for example, T2) corresponding to the abnormality is discarded. The selection and abandonment of the
以上所述僅為本發明之較佳實施例而已,並非用以限定本發明之申請專利範圍;凡其它未脫離發明所揭示之精神下所完成之等效改變或修飾,均應包含在下述之申請專利範圍內。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the patentable scope of the present invention; all other equivalent changes or modifications made without departing from the spirit of the invention shall be included in the following. Within the scope of patent application.
100:微發光二極體顯示面板 10:基板 101:電源信號線 102:修復線 103:信號線 104:修復線 11:微發光二極體 12:驅動器 121:電源信號端子 122:修復端子 123:信號端子 124:修復端子 13:時序控制器 Vp1,Vp2:電源信號端子 r_Vp1,r_Vp2:修復端子 DVDD:數位電源電壓 AVDD:類比電源電壓 GND:地 T1~T3:資料與控制輸入信號端子 D1~D3,Dx~Dz:資料輸出信號端子 C1~C3,Cx~Cz:共同輸出信號端子 r_Ta,r_Tb:修復端子 r_Da,r_Db:修復端子 r_Ca,r_Cb:修復端子 r_Tbusa,r_Tbusb:修復線 r_Dbusa,r_Dbusb:修復線 r_Cbusa,r_Cbusb:修復線 100:Micro light emitting diode display panel 10:Substrate 101:Power signal line 102: Repair line 103:Signal line 104: Repair line 11:Micro light emitting diodes 12:Drive 121:Power signal terminal 122:Repair terminal 123:Signal terminal 124: Repair terminal 13: Timing controller Vp1, Vp2: power signal terminals r_Vp1, r_Vp2: repair terminal DVDD: digital supply voltage AVDD: analog supply voltage GND: ground T1~T3: Data and control input signal terminals D1~D3,Dx~Dz: data output signal terminals C1~C3,Cx~Cz: common output signal terminals r_Ta,r_Tb: repair terminal r_Da,r_Db: repair terminal r_Ca,r_Cb: Repair terminal r_Tbusa,r_Tbusb: repair line r_Dbusa,r_Dbusb: repair line r_Cbusa,r_Cbusb: repair line
第一圖顯示本發明實施例的微發光二極體顯示面板的方塊圖。 第二圖顯示本發明第一實施例的微發光二極體顯示面板的俯視圖。 第三圖顯示本發明第二實施例的微發光二極體顯示面板的俯視圖。 The first figure shows a block diagram of a micro-light emitting diode display panel according to an embodiment of the present invention. The second figure shows a top view of the micro-light emitting diode display panel according to the first embodiment of the present invention. The third figure shows a top view of the micro-light emitting diode display panel according to the second embodiment of the present invention.
100:微發光二極體顯示面板 100:Micro light emitting diode display panel
10:基板 10:Substrate
101:電源信號線 101:Power signal line
102:修復線 102: Repair line
121:電源信號端子 121:Power signal terminal
122:修復端子 122:Repair terminal
Vp1,Vp2:電源信號端子 Vp1, Vp2: power signal terminals
r_Vp1,r_Vp2:修復端子 r_Vp1, r_Vp2: Repair terminal
DVDD:數位電源電壓 DVDD: digital supply voltage
AVDD:類比電源電壓 AVDD: analog supply voltage
GND:地 GND: ground
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