TW202341756A - A vibrating device - Google Patents

Abstract

One or more embodiments of the present specification relate to a vibration device comprising: a mass element; one or more piezoelectric elements, the one or more piezoelectric elements being configured to generate vibration based on an electrical signal; one or more resilient elements, at least one of the one or more resilient elements connecting the mass element and the one or more piezoelectric elements; wherein the one or more piezoelectric elements comprise a ring structure, the one or more piezoelectric elements being configured to vibrate based on an electrical signal in a direction parallel to an axial direction of the ring structure.

Description

a vibrating device

This application relates to the field of acoustic technology, and in particular to a vibration device.

This application claims priority to the Chinese patent application with application number 202210360055.8 submitted on April 7, 2022, the entire content of which is incorporated herein by reference.

Piezoelectric speakers usually use the inverse piezoelectric effect of piezoelectric ceramic materials to generate vibrations to radiate sound waves outward. Compared with transmission electromagnetic speakers, piezoelectric speakers can have high electromechanical energy conversion efficiency, low energy consumption, small size, With the advantages of high integration, under the current trend of device miniaturization and integration, piezoelectric speakers have extremely broad prospects and future. However, compared with traditional electromagnetic speakers, piezoelectric speakers have poor low-frequency response due to the poor low-frequency response of piezoelectric acoustic devices, which results in poor low-frequency sound quality of piezoelectric speakers. At the same time, piezoelectric speakers have many vibration modes in the audible range (for example, 20Hz to 20kHz), which also prevents them from forming a relatively flat frequency response curve.

Therefore, it is necessary to propose a vibration device that reduces vibration modes in the audible range while also improving the low-frequency response of the vibration device.

An embodiment of the present invention provides a vibration device, including: a mass element; one or more piezoelectric elements configured to generate vibration based on electrical signals; one or more elastic elements, the one or more piezoelectric elements configured to generate vibration based on electrical signals; or at least one of a plurality of elastic elements connects the mass element and the one or more piezoelectric elements; wherein the one or more piezoelectric elements comprise a ring structure, and the one or more piezoelectric elements are The vibration direction based on the electrical signal is configured to be parallel to the axis direction of the annular structure.

In order to explain the technical solutions of the embodiments of the present invention more clearly, the accompanying drawings needed to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some examples or embodiments of the present invention. For those with ordinary knowledge in the technical field, the present invention can also be modified according to these drawings without making any progressive efforts. The invention applies to other similar situations. Unless obvious from the locale or otherwise stated, component symbol labels in the drawings represent the same structure or operation.

It will be understood that the terms "system", "apparatus", "unit" and/or "module" as used herein are a means of distinguishing between different elements, components, parts, portions or assemblies at different levels. However, said words may be replaced by other expressions if they serve the same purpose.

As shown in the scope of this invention and patent claims, words such as "a", "an", "an" and/or "the" do not specifically refer to the singular and may include the plural unless the context clearly indicates an exception. Generally speaking, the terms "comprising" and "comprising" only imply the inclusion of clearly identified steps and elements, and these steps and elements do not constitute an exclusive list. The method or apparatus may also include other steps or elements.

Flowcharts are used in the present invention to illustrate operations performed by the system according to embodiments of the present invention. It should be understood that preceding or following operations are not necessarily performed in exact order. Instead, the steps can be processed in reverse order or simultaneously. At the same time, you can add other operations to these processes, or remove a step or steps from these processes.

The vibration device provided by the embodiments of this specification can be applied to an acoustic output device. Acoustic output devices may include, but are not limited to, bone conduction speakers, air conduction speakers, bone conduction hearing aids, air conduction hearing aids, and the like. The vibration device provided by the embodiments of this specification may include a piezoelectric element. The piezoelectric element can convert the input voltage into a displacement output under the action of the inverse piezoelectric effect. Therefore, a vibration device that uses a piezoelectric element to output displacement is also called a piezoelectric vibration device. The working modes of piezoelectric elements in piezoelectric vibration devices usually adopt d33 working mode and d31 working mode. In the d33 working mode of the piezoelectric element, the polarization direction of the piezoelectric element is the same as the displacement output direction. In the d31 working mode of the piezoelectric element, the polarization direction of the piezoelectric element is perpendicular to the displacement output direction. Since piezoelectric elements usually have a higher resonant frequency, piezoelectric vibration devices can usually enhance high-frequency output, but piezoelectric elements have poor low-frequency response and usually have more noise in the audible range (such as 20Hz to 20KHz). Vibration modes are difficult to form a relatively flat frequency response curve, thus affecting the sound quality output when the vibration device is used in an acoustic output device.

In order to solve the problem of poor low-frequency response of the piezoelectric vibration device and many modes in the audible frequency range, the vibration device provided in the embodiment of this specification also includes a mass element and an elastic element, and the combination of the elastic element and the mass element is used The structure builds a first resonance peak in a low frequency range (e.g., 20 Hz to 2000 Hz), while utilizing piezoelectric elements to build a second resonance peak in a higher frequency range (e.g., 1000 Hz to 20,000 Hz). The first resonance peak can be A straight curve is formed between the second resonance peak and the second resonance peak. In some embodiments, the piezoelectric element can adopt the d33 working mode. The piezoelectric element in the d33 working mode has a higher resonant frequency, which can reduce the working mode of the piezoelectric element in the audible frequency range. Utilize Piezoelectric elements in the d33 operating mode under different boundary conditions (for example, with fixed connection boundaries or without fixed connection boundaries) can also compensate for the loss of high-frequency response of the vibrating device.

Figure 1 is an exemplary module diagram of a vibration device according to some embodiments of the present specification. In some embodiments, the vibration device 100 may include a piezoelectric element 110 , a mass element 120 and an elastic element 130 . In some embodiments, the mass element 120 may be connected to the piezoelectric element 110 through an elastic element. In some embodiments, there may be one elastic element 130 , and the mass element 120 may be connected to the piezoelectric element 110 through one elastic element 130 . In some embodiments, there may be multiple elastic elements 130 , and the mass element 120 may be connected to the piezoelectric element 110 through one or more elastic elements 130 . In some embodiments, there may be one piezoelectric element 110 or multiple piezoelectric elements 110 . In some embodiments, mass element 120 may be coupled to a piezoelectric element 110 . In some embodiments, the mass element 120 can also be connected to multiple piezoelectric elements 110 respectively. In some embodiments, multiple piezoelectric elements 110 may be connected to each other. In some embodiments, multiple piezoelectric elements 110 may be directly connected to each other. In some embodiments, multiple piezoelectric elements 110 may also be connected through one or more elastic elements 130 .

The piezoelectric element 110 may be a component with a piezoelectric effect. In some embodiments, the piezoelectric element 110 may be composed of materials with piezoelectric effect such as piezoelectric ceramics and piezoelectric polymers. In some embodiments, piezoelectric element 110 may be configured to generate vibration based on electrical signals. For example, when an alternating electrical signal is applied to the piezoelectric element 110, the piezoelectric element 110 may undergo reciprocating deformation to generate vibration. In some embodiments, the vibration direction of the piezoelectric element 110 and the polarization direction of the piezoelectric element 110 may be the same. In some embodiments, the vibration direction of the piezoelectric element 110 and the polarization direction of the piezoelectric element 110 may also be perpendicular to each other.

In some embodiments, the number of piezoelectric elements 110 may be one or multiple. In some embodiments, when the number of piezoelectric elements 110 is multiple, the multiple piezoelectric elements 110 may be connected through the elastic element 130 . In some embodiments, any of the piezoelectric elements 110 that are connected to each other through elastic elements 130 can be connected to the mass element 120 again through another elastic element 130 . In some embodiments, multiple piezoelectric elements 110 can also be connected in series along the vibration direction of the multiple piezoelectric elements 110 to form a whole, and the series-connected piezoelectric elements 110 can be connected to the mass element 120 through the elastic element 130 .

In some embodiments, the piezoelectric element 110 may be a single ring structure. The single ring structure refers to a structure in which the projection of the piezoelectric element 110 along the axis direction is a ring shape. For example, when the number of piezoelectric elements 110 is one, the piezoelectric element 110 has a single ring structure. In some embodiments, the piezoelectric element 110 may be a multi-ring structure (such as a double-ring structure, a three-ring structure, etc.). The multi-ring structure refers to a structure when the piezoelectric element 110 is projected into multiple ring shapes along the axis direction. For example, the number of piezoelectric elements 110 is 2, and the annular structures of the two piezoelectric elements 110 have different annular outer diameters. The two piezoelectric elements 110 can be connected through one or more elastic elements 130. In this case, 2 Two piezoelectric elements 110 and the elastic element 130 connecting the two piezoelectric elements 110 form a double ring structure. Piezoelectric elements with a ring structure (for example, a single ring structure or a double ring structure) have a higher resonant frequency, which can reduce the number of modes of the piezoelectric element in the audible range through structural design (for example, connecting elastic elements) After constructing the low-frequency peak and the mass element), a straight curve can be formed between the low-frequency peak and the resonance peak of the piezoelectric element. When the vibration device 100 is applied to an acoustic output device, the sound quality of the sound output by the vibration device 100 or the acoustic output device can be improved. .

In some embodiments, piezoelectric element 110 may be a single layer annular structure. In some embodiments, the piezoelectric element 110 may also be a double-layer annular structure. For example, the one or more piezoelectric elements 110 may include at least two piezoelectric elements connected to each other along the axial direction to form a double-layer annular structure. The mass element 120 is respectively connected to at least two piezoelectric elements through one or more elastic elements 130 . In some embodiments, the piezoelectric element 110 may also be a multi-layer annular structure composed of more piezoelectric elements interconnected along the axial direction.

In some embodiments, the polarization direction of the piezoelectric element 110 and the displacement output direction of the piezoelectric element 110 may be the same. In some embodiments, the displacement output end of the piezoelectric element 110 can be used as a vibration end, so that the polarization direction of the piezoelectric element 110 is the same as the vibration direction of the piezoelectric element 110. It can also be understood that the piezoelectric element 110 can Vibration is generated along the polarization direction of the piezoelectric element 110 under the action of the electrical signal. In some embodiments, one or more piezoelectric elements 110 may include annular structures, which may be columnar structures with annular end surfaces. In some embodiments, the polarization direction of the piezoelectric element 110 may be parallel to the axial direction of the annular structure. Under the action of the electrical signal, the piezoelectric element 110 may vibrate along the axial direction of the annular structure of the piezoelectric element 110 . The axis of the annular structure may be an imaginary line connecting the centroids of two annular end faces of the columnar structure and connecting the centroids of any cross-section parallel to the annular end faces. For example, the annular structure is a circular cylindrical structure, and the axis is a straight line connecting the center centers of the end faces of the two rings. For another example, the annular structure is a trapezoidal ring-cylindrical structure, and the axis is a straight line connecting the centroids of the end faces of two trapezoidal rings. In some embodiments, the axial direction of the annular structure is perpendicular to the annular surface of the annular structure. In some embodiments, the shape of the annular end surface of the annular structure may include but is not limited to a circular annular shape, an elliptical annular shape, a curved annular shape or a polygonal annular shape, etc. In some embodiments, the polarization direction of the piezoelectric element 110 is parallel to the axis direction of the annular structure. Under the action of the electrical signal, the piezoelectric element 110 can vibrate along the axis direction of the annular structure of the piezoelectric element 110 .

The mass element 120 may be an element with a certain mass. In some embodiments, the mass element 120 can serve as a vibration plate or diaphragm of the vibration device 100 , so that the vibration device 100 outputs vibration through the mass element 120 . In some embodiments, the material of mass element 120 may be a metallic material or a non-metallic material. Metal materials may include, but are not limited to, steel (eg, stainless steel, carbon steel, etc.), lightweight alloys (eg, aluminum alloy, beryllium copper, magnesium alloy, titanium alloy, etc.), etc., or any combination thereof. Non-metallic materials may include but are not limited to polymer materials, glass fiber, carbon fiber, graphite fiber, silicon carbide fiber, etc. In some embodiments, the projection of the mass element 120 along the vibration direction of the mass element 120 may be a regular and/or irregular polygon such as a circle, an annular shape, a rectangle, a pentagon, a hexagon, etc.

In some embodiments, the mass element 120 can be connected to the piezoelectric element 110 through the elastic element 130, and the vibration output by the piezoelectric element 110 can be transmitted to the mass element 120 through the elastic element 130. In some embodiments, the resonance of the mass element 120 and the elastic element 130 connected thereto can cause the vibration device 100 to generate a first resonance peak. The magnitude of the first resonant frequency corresponding to the first resonant peak is affected by the mass of the mass element 120 and the elastic coefficient of the elastic element 130 . In some embodiments, the frequency of the first resonant peak (also called the first resonant frequency) can be expressed by formula (1): , (1) Where, f represents the first resonant frequency, m represents the mass of the mass element 120 , and k represents the elastic coefficient of the elastic element 120 . According to formula (1), it can be seen that the size of the first resonant frequency corresponding to the first resonant peak can be adjusted by adjusting the mass of the mass element 120 and/or the elastic coefficient of the elastic element 120, so that the first resonant peak is located at the required frequency. within the range.

In some embodiments, the mass element 120 may be connected to the inner side of the piezoelectric element 110 through the elastic element 130 . In some embodiments, when the piezoelectric element 110 vibrates based on the electrical signal, the vibration is transmitted to the mass element 120 through the elastic element 130 , causing the mass element 120 to vibrate parallel to the vibration direction of the piezoelectric element 110 . In some embodiments, the projection of the mass element 120 along the vibration direction of the mass element 120 may be within the projection of the piezoelectric element 110 along the vibration direction of the piezoelectric element 110 . In some embodiments, when the mass element 120 is located inside the piezoelectric element 110, the mass element 120 may be a solid cylindrical structure, for example, a solid cylindrical structure. In other embodiments, when the mass element 120 is located inside the piezoelectric element 110, the mass element 120 can also be in other shapes and structures, for example, an annular structure with an outer diameter smaller than the inner diameter of the piezoelectric element 110.

In some embodiments, mass element 120 may be located outside piezoelectric element 110 . When the mass element 120 is located outside the piezoelectric element 110, the shape of the mass element 120 can be an annular shape, and the inner diameter of the annular shape can be larger than the outer diameter of the annular structure of the piezoelectric element 110, so that the mass element 120 is along the axis of the piezoelectric element 110. The projection of the direction may be outside the projection of the piezoelectric element 110 along the axis direction of the piezoelectric element 110 .

In some embodiments, mass element 120 may be located between multiple piezoelectric elements 110 . In some embodiments, the piezoelectric element 110 may include a first piezoelectric element and a second piezoelectric element with different diameters, the second piezoelectric element is disposed inside the first piezoelectric element, and the mass element 120 is located inside the first piezoelectric element. element and the second piezoelectric element. In some embodiments, the shape of the mass element 120 may be annular, and the projection of the mass element 120 along the axis direction of the piezoelectric element 110 may be located between the first piezoelectric element and the second piezoelectric element along the axis direction of the piezoelectric element 110 between projections.

In some embodiments, when the shape of the mass element 120 is annular, a cover plate may be provided on a side of the mass element 120 away from the piezoelectric element 110 along the axis direction of the piezoelectric element 110 . The cover plate can seal the side of the mass element 120 away from the piezoelectric element 110 along the axial direction of the piezoelectric element 110 . For example, the shape of the mass element 120 is annular, and the cover plate can be a circular structure. The peripheral side of the cover plate is connected to the side of the mass element 120 away from the piezoelectric element 110 along the axis direction of the piezoelectric element 110 . By disposing a cover plate on the side of the mass element 120 away from the piezoelectric element 110 along the axis direction of the piezoelectric element 110, the cover plate can be used as a vibration plate for transmitting vibration signals. In some embodiments, when the vibration device 100 is applied to an acoustic device, the cover plate can also be used to connect the mass element 120 with other structures of the acoustic device, such as a diaphragm, so that the vibration device 100 drives the diaphragm through the mass element 120 vibration.

The elastic element 130 may be an element capable of elastic deformation under the action of an external load. In some embodiments, the elastic element 130 can be a material with good elasticity (that is, easy to undergo elastic deformation), so that the mass element 120 connected thereto has good vibration response capability. In some embodiments, the material of the elastic element 130 may include but is not limited to one or more of metal materials, polymer materials, glue materials, and the like. In some embodiments, the number of elastic elements 130 may be one or multiple. In some embodiments, the mass element 120 may be connected to the piezoelectric element 110 through an elastic element 130 . For example, the shape of the elastic element 130 may be annular, and the mass element 120 and the piezoelectric element 110 may be connected through the annular elastic element 130 . In some embodiments, the mass element 120 may be connected to the piezoelectric element 110 through a plurality of elastic elements 130 . For example, the elastic element 130 may include a rod-shaped structure, and a plurality of elastic elements 130 are distributed along the circumference of the piezoelectric element 110 and connected with the mass element 120 .

In some embodiments, the elastic element 130 may be a vibration transmission piece. When the elastic element 130 connects the mass element 120 and the piezoelectric element 110, the elastic element 130 can transmit the vibration generated by the piezoelectric element 110 to the mass element 120, so that the mass element 120 generates vibration. In some embodiments, the elastic element 130 can also be a connecting rod provided on the vibration transmission plate, thereby making the processing of the vibration device 100 simpler and faster.

In some embodiments, the elastic element 130 may be a single-layer structure. The single-layer structure means that one or more elastic elements 130 are located in the same plane perpendicular to the axis direction of the piezoelectric element 110 . In some embodiments, the elastic element 130 may be a multi-layer structure. The multi-layer structure means that multiple elastic elements are located in different planes perpendicular to the axis direction of the piezoelectric element 110 .

In some embodiments, the shape of the elastic element 130 may include, but is not limited to, at least one of a polygonal shape, an S-shape, a spline shape, an arc shape, and a straight line shape. The shape of the elastic element 130 can be set according to the requirements of the vibration device 100 (for example, the position of the first resonance peak, the difficulty of processing the vibration device 100, etc.).

In some embodiments, elastic element 130 may have multiple curved segments. In some embodiments, the bending directions of the plurality of bending segments may be the same. In some embodiments, the bending directions of the plurality of bending segments may also be different. In some embodiments, the bending directions of the plurality of bending segments may also be opposite. For example, when the shape of the elastic element 130 is a polyline shape, the polyline shape may include a first bending segment and a second bending segment. The bending direction of the first bending segment may be to bend in the first direction first, and the bending direction of the second bending segment may be It can be bent in the second direction first, and the second direction is opposite to the first direction. For more description about the bending direction of the elastic element and its arrangement, please refer to the relevant description in Figure 12 of this specification.

In some embodiments, during the vibration process of the vibration device 100, since the elastic element 130 has a curved shape, the elastic element 130 may provide shear stress to the mass element 120. When the shear stress provided by the multiple elastic elements 130 to the mass element 120 When the directions are the same, the mass element 120 may have a tendency to rotate around its central axis. The shear stress may be a stress provided by the elastic element 130 to the mass element 120 (and/or the piezoelectric element 110 ) that is tangent to any section on the mass element 120 that is perpendicular to the vibration direction of the mass element 120 . The shear stress may cause the mass to Element 120 tends to rotate about its central axis. In some embodiments, bending sections with different bending directions on the elastic element 130 can provide shear stresses with different curls for the mass element 120 connected to the elastic element 130 . Curl can be a vector operand used to measure the rotational nature of the shear stress vector field. The size of the vector operand can measure the degree of rotation of the shear stress vector field. The direction of the vector operand can measure the rotation of the shear stress vector field. direction of rotation. The direction of the curl can be determined based on the direction of rotation using the right-hand rule. For example, when the mass element 120 rotates (or tends to rotate) due to the shear stress provided by the elastic element 130, according to the right-hand rule, the bending direction of the four fingers is consistent with the ring shape. The direction of rotation (or rotation tendency) of the structure is the same, and the direction of the thumb is the direction of the curl. In some embodiments, the bending sections on the elastic element 130 with opposite bending directions can provide shear stress with opposite curls for the mass element 120 connected to the elastic element 130 . By arranging bending sections with opposite shear stresses in rotation, the shear stresses provided by different parts of the elastic element 130 to the mass element 120 can be offset, so that the elastic element 130 as a whole does not provide shear stress to the mass element 120. This avoids the tendency of the mass element 120 to rotate.

In some embodiments, when the number of elastic elements 130 is multiple, the bending directions of adjacent elastic elements 130 are different. In some embodiments, when the number of elastic elements 130 is multiple, the bending directions of adjacent elastic elements 130 are opposite. In some embodiments, when the elastic element 130 is a single-layer structure, the projections of the plurality of elastic elements 130 along the axis direction of the piezoelectric element 110 may have two mutually perpendicular axes of symmetry, so that the bending of adjacent elastic elements 130 In the opposite direction. For example, the elastic element 130 may be in an X shape, and the X-shaped elastic element has two mutually perpendicular axes of symmetry. By arranging the elastic elements 130 with opposite bending directions, the shear stress provided by the multiple elastic elements 130 with opposite bending directions to the mass element 120 can be reversed in the curl direction, so that the multiple elastic elements 130 with opposite bending directions can exert opposite directions on the mass element 120 . The shear stresses provided by the elements 120 can cancel each other out, thus avoiding the tendency of the mass element 120 to rotate.

In some embodiments, when the elastic element 130 is a multi-layer structure, the elastic elements 130 of adjacent layers may have different bending directions. In some embodiments, the elastic element 130 may be a double-layer structure. The elastic element 130 may include a first helical structure and a second helical structure. The first helical structure and the second helical structure are respectively in a direction perpendicular to the axis of the piezoelectric element 110 . Mass element 120 and one or more piezoelectric elements 110 are connected in different planes. In some embodiments, the axes of the first helical structure and the second helical structure may be the same and the helical directions are opposite. By arranging the first helical structure and the second helical structure with opposite helical directions, the shear stress provided by the elastic elements 130 of different layers to the mass element 120 can be opposite in the curl direction, so that the elastic elements 130 of different layers have opposite directions to the mass element 120 The provided shear stresses can cancel each other out, thereby preventing the mass element 120 from having a tendency to rotate.

In some embodiments, the vibration device 100 may form at least two resonance peaks in the audible frequency range. In some embodiments, the resonance of at least one of the one or more elastic elements 130 and the mass element 120 may generate a first resonance peak; the resonance of the one or more piezoelectric elements 110 may generate a second resonance peak. In some embodiments, the frequency corresponding to the first resonance peak (also referred to as the first resonance frequency) may be located in a low frequency range (for example, less than 2000 Hz), and the frequency corresponding to the second resonance peak (also referred to as the second resonance frequency) can be in the mid to high frequency range (e.g., greater than 1000 Hz). In some embodiments, the second resonant frequency corresponding to the second resonant peak may be higher than the first resonant frequency corresponding to the first resonant peak. In some embodiments, there is no resonance valley between the second resonance peak and the first resonance peak, and a relatively straight curve can be formed between the first resonance peak and the second resonance peak, thereby improving the sound quality of the output sound of the vibration device 100 .

In some embodiments, according to formula (1), the frequency range of the first resonant frequency corresponding to the first resonant peak can be adjusted by adjusting the mass of the mass element 120 and/or the elastic coefficient of the elastic element 130 . In some embodiments, the frequency range of the first resonant frequency corresponding to the first resonant peak may be 50 Hz to 2000 Hz. In some embodiments, the frequency range of the first resonant frequency corresponding to the first resonant peak may be 50 Hz to 1000 Hz. In some embodiments, in order to improve the low-frequency sensitivity of the vibration device 100, by adjusting the mass of the mass element 120 and/or the elastic coefficient of the elastic element 130, the frequency range of the first resonant frequency corresponding to the first resonant peak can be 50 Hz to 500 Hz. . In some embodiments, in order to further improve the low-frequency sensitivity of the vibration device 100, by adjusting the mass of the mass element 120 and/or the elastic coefficient of the elastic element 130, the frequency range of the first resonance frequency corresponding to the first resonance peak can be from 50 Hz to 50 Hz. 200Hz.

In some embodiments, the frequency range of the second resonant frequency corresponding to the second resonant peak can be adjusted by adjusting the structural parameters (for example, size, shape, quality, material, etc.) of the piezoelectric element 110 . In some embodiments, the second resonant frequency may be the natural frequency of piezoelectric element 110 . In some embodiments, the frequency range of the second resonant frequency corresponding to the second resonant peak may be 1,000 Hz to 50,000 Hz. In some embodiments, in order to improve the sensitivity of the vibration device 100 in the audible range of the human ear, the second resonance peak of the vibration device 100 can be adjusted to the audible range of the human ear by adjusting the structural parameters of the piezoelectric element 110. The frequency range of the second resonant frequency corresponding to the two resonant peaks may be 1,000 Hz to 20,000 Hz. In some embodiments, in order to further improve the sensitivity of the vibration device 100 in the audible range of the human ear, the frequency range of the second resonant frequency corresponding to the second resonant peak may be 1000 Hz to 10000 Hz. In some embodiments, in order to make the frequency response curve of the vibration device 100 have a larger flat area between the first resonance peak and the second resonance peak, thereby ensuring the sound quality of the sound output by the vibration device 100, the second resonance peak corresponds to The frequency range of the second resonant frequency may be 2000Hz to 10000Hz. In some embodiments, in order to further increase the flat area of the frequency response curve of the vibration device 100 between the first resonance peak and the second resonance peak, the frequency range of the second resonance frequency corresponding to the second resonance peak may be 3000 Hz to 10000 Hz.

In some embodiments, in order to make the frequency response curve of the vibration device 100 have a larger flat area between the first resonance peak and the second resonance peak, thereby ensuring the low frequency response of the vibration device 100 and the sound quality of the output sound, the second The frequency ratio range of the second resonant frequency corresponding to the resonant peak and the first resonant frequency corresponding to the first resonant peak may be 20 to 200. In some embodiments, a frequency ratio between the second resonant frequency corresponding to the second resonant peak and the first resonant frequency corresponding to the first resonant peak may range from 30 to 180. In some embodiments, a frequency ratio between the second resonant frequency corresponding to the second resonant peak and the first resonant frequency corresponding to the first resonant peak may range from 40 to 160. In some embodiments, the frequency ratio of the second resonant frequency corresponding to the second resonant peak and the first resonant frequency corresponding to the first resonant peak may range from 50 to 150.

In some embodiments, the vibration device 100 may also have a third resonance peak when vibrating, and the frequency corresponding to the third resonance peak (also referred to as the third resonance frequency) may be located between the first resonance frequency corresponding to the first resonance peak and between the second resonant frequencies corresponding to the second resonant peak. In some embodiments, the vibration device 100 may have a double ring structure, and the third resonance peak may be generated by resonance of the double ring structure. In some embodiments, when the piezoelectric element 110 is a double ring structure and the mass element 120 is located at the innermost side, the inner piezoelectric element (eg, the second piezoelectric element) and the mass element 120 (and the connection between the inner piezoelectric element and the mass element The elastic element 130 of 120) can constitute the overall mass. Since the overall mass is greater than the mass of the mass element 120 (that is, the vibration mass increases), the resonant frequency of the low-frequency peak of the vibration device 100 decreases, which is reflected in the frequency response curve of the vibration device 100 The first resonance peak moves toward low frequency, and the vibration device 100 with the double ring structure can also generate a third resonance peak located between the first resonance peak and the second resonance peak when vibrating. In some embodiments, the formation of the third resonance peak will not affect the position of the high-frequency resonance peak (eg, the second resonance peak), but will also enhance the high-frequency resonance valley, thereby improving the high-frequency response of the vibration device 100 .

In some embodiments, in order to meet the miniaturization requirement of the device, the maximum dimension of the projection of the vibration device 100 along the vibration direction is no higher than 60 mm. The maximum size of the projection of the vibration device 100 along the vibration direction refers to the maximum value of the distance between any two points on the outer contour of the projection. For example, if the maximum contour of the projection of the vibration device 100 along the vibration direction is a circle, then the maximum size of the projection of the vibration device 100 along the vibration direction is the diameter of the circle. For another example, if the maximum contour of the projection of the vibration device 100 along the vibration direction is an ellipse, then the maximum size of the projection of the vibration device 100 along the vibration direction is the long axis of the ellipse. For another example, if the maximum outline of the projection of the vibration device 100 along the vibration direction is a square, then the maximum size of the projection of the vibration device 100 along the vibration direction is the diagonal of the square. In some embodiments, when the mass element 120 is disposed at the outermost side of the vibration device 100, the maximum dimension of the projection of the vibration device 100 along the vibration direction may be the maximum dimension of the projection of the mass element 120 along the vibration direction. In some embodiments, when the piezoelectric element 110 is disposed on the outermost side of the vibration device 100, the maximum size of the projection of the vibration device 100 along the vibration direction may be the maximum size of the projection of the piezoelectric element 110 along the vibration direction.

In some embodiments, the vibration device 100 may also include a piezoelectric beam, and the piezoelectric beam is directly or indirectly connected to the mass element 120 . For example, the piezoelectric beam may be located on a side of the mass element 120 away from the piezoelectric element 110 and directly connected to the mass element 120 . As another example, the piezoelectric beam may be indirectly connected to the mass element 120 through the elastic element 130 . In some embodiments, the piezoelectric beam may be configured to generate vibration along the axis of the annular structure of the piezoelectric element 110 based on the electrical signal. In some embodiments, the piezoelectric beam may include at least one first piezoelectric sheet and at least one second piezoelectric sheet, and the at least one first piezoelectric sheet and at least one second piezoelectric sheet are respectively disposed along the piezoelectric beam. Both sides of the annular structure of the electrical component 110 in the axial direction. In some embodiments, the polarization directions of at least one first piezoelectric piece and at least one second piezoelectric piece may be reversely arranged along the axis direction of the annular structure. That is, in the axial direction of the annular structure of the piezoelectric element 110, the polarization direction of the first piezoelectric sheet is opposite to the polarization direction of the second piezoelectric sheet. In some embodiments, the displacement output direction of the first piezoelectric sheet and the second piezoelectric sheet may be perpendicular to the polarization direction. In some embodiments, since the polarization direction of the first piezoelectric sheet is opposite to the polarization direction of the second piezoelectric sheet, when the first piezoelectric sheet and the second piezoelectric sheet are connected to voltage signals in the same direction at the same time, The first piezoelectric piece and the second piezoelectric piece can generate displacements in opposite directions, thereby causing the piezoelectric beam to vibrate. For example, the first piezoelectric sheet may contract in a direction perpendicular to the axis of the annular structure, and the second piezoelectric sheet may extend in a direction perpendicular to the axis of the annular structure, thereby causing the piezoelectric beam to vibrate in the direction of the axis of the annular structure.

In some embodiments, the mass element 120 may include a first mass element and a second mass element, and the first mass element may be connected to the middle part of the piezoelectric beam through at least one of one or more elastic elements 130 . In some embodiments, the first mass element may also be connected to one or more piezoelectric elements 110 through an elastic element 130 . In some embodiments, second mass elements may be connected to both ends of the piezoelectric beam respectively. In some embodiments, the first mass element may also be connected to other locations of the piezoelectric beam (eg, near the end of the piezoelectric beam) through at least one of one or more elastic elements 130 . In some embodiments, the vibration of the vibration device 100 may be output through a second mass element at the end of the piezoelectric beam. In some embodiments, the vibration of the vibration device 100 can also be output through the first mass element.

Figure 2 is an exemplary structural diagram of a vibration device according to some embodiments of the present specification. As shown in FIG. 2 , the vibration device 200 may include one or more piezoelectric elements 210 , a mass element 220 and one or more elastic elements 230 . Wherein, at least one of the one or more elastic elements 230 can be used to connect the mass element 220 and the piezoelectric element 210 .

In some embodiments, one or more piezoelectric elements 210 may include a first piezoelectric element 211 , the first piezoelectric element 211 may be an annular structure, and one end of the first piezoelectric element 211 along the axis direction is fixed (also known as Fixed end), the mass element 220 is connected to other positions on the first piezoelectric element 211 except this end through the elastic element 230. In the embodiment of this specification, one end of a piezoelectric element (such as a first piezoelectric element, a second piezoelectric element, etc.) refers to the direction from one of the annular end surfaces of the annular structure of the piezoelectric element along the axis of the annular structure. All areas with a certain thickness (for example, 0.1%, 5%, or any thickness within the range of 0.1% to 30% of the total thickness of the annular structure). For example, one end of the first piezoelectric element 211 along the axial direction may be fixed or one of the annular end surfaces of the first piezoelectric element 211 may be fixed. For another example, one end of the first piezoelectric element 211 along the axial direction may be fixed, or the inner and/or outer surface of the annular structure of a certain thickness area near one of the annular end surfaces of the first piezoelectric element 211 may be fixed. In some embodiments, the elastic element 230 may be connected to another annular end surface opposite to the annular end surface of the fixed end. In some embodiments, the elastic element 230 can also be connected to the inner side of the annular structure, and the connection position on the inner side does not belong to the area of the fixed end.

In some embodiments, the mass element 220 may be located inside the first piezoelectric element 211 , and the projection of the mass element 220 along the axial direction of the first piezoelectric element 211 is within the projection of the first piezoelectric element 211 along the axial direction. The piezoelectric element 210 , the elastic element 230 and the mass element 220 are arranged in sequence from outside to inside along the projection of the axis direction of the piezoelectric element 210 . In some embodiments, when the mass element 220 may be located inside the first piezoelectric element 211 , the shape of the mass element 220 may be columnar (as shown in FIG. 2 ), annular, etc.

In some embodiments, there may be a plurality of elastic elements 230 connecting the mass element 220 and the first piezoelectric element 211, and the plurality of elastic elements 230 may be distributed along the circumference of the annular structure. In some embodiments, one end of the elastic element 230 can be connected to any surface of the mass element 220 along the axial direction (for example, a surface close to the piezoelectric element 210 ). In other embodiments, one end of the elastic element 230 can also be connected to the peripheral surface of the mass element 220 . In some embodiments, the other end of the elastic element 230 can be connected to any surface of the non-fixed end on the piezoelectric element 210 . For example, in some embodiments, the other end of the elastic element 230 may be connected to the annular end surface of the piezoelectric element 210 close to the mass element 220 . For another example, in some embodiments, the other end of the elastic element 230 can also be connected to the peripheral inner surface of the piezoelectric element 210 . The connection position between the elastic element 230 and the mass element 220 and/or the piezoelectric element 210 can be set according to the structural feasibility of the vibration device 200 .

In some embodiments, the resonance of the mass element 220 and the elastic element 230 may generate a first resonance peak, and the resonance of the first piezoelectric element 211 may generate a second resonance peak. The position of the first resonance peak, that is, the size of the first resonance frequency corresponding to the first resonance peak, may be determined by the mass of the mass element 220 and the elastic coefficient of the elastic element 230 . The position of the second resonance peak, that is, the size of the second resonance frequency corresponding to the second resonance peak, may be determined by the structural parameters (eg, size) of the piezoelectric element 210 .

FIG. 3 is a frequency response graph of the vibration device 200 according to some embodiments of the present specification. As shown in FIG. 3 , the abscissa represents the resonant frequency of the vibration device 200 in Hz, and the ordinate represents the acceleration output intensity of the vibration device 200 in dB. In some embodiments, referring to FIG. 3 , the vibration device 200 can form at least two resonance peaks in the audible domain (such as 20Hz to 20KHz) frequency range, where the first resonance peak 310 can be the mass element 220 and the elastic element 230 The second resonance peak 320 may be generated by resonance of the piezoelectric element 210 . In some embodiments, the frequency f1 of the first resonance peak 310 of the vibration device 200 may range from 50 Hz to 2000 Hz. In some embodiments, the frequency f1 of the first resonance peak 310 of the vibration device 200 may range from 50 Hz to 500 Hz. In some embodiments, the frequency f1 of the first resonance peak 310 of the vibration device 200 may range from 50 Hz to 300 Hz. In some embodiments, the frequency f1 of the first resonance peak 310 of the vibration device 200 may range from 50 Hz to 200 Hz. In some embodiments, the frequency f1 of the first resonance peak 310 of the vibration device 200 may range from 100 Hz to 200 Hz. In some embodiments, the frequency f2 of the second resonance peak 320 of the vibration device 200 may range from 1000 Hz to 20000 Hz. In some embodiments, the frequency f2 of the second resonance peak 320 of the vibration device 200 may range from 2000 Hz to 10000 Hz. In some embodiments, the frequency f2 of the second resonance peak 320 of the vibration device 200 may range from 2000 Hz to 8000 Hz. In some embodiments, the frequency f2 of the second resonance peak 320 of the vibration device 200 may range from 2000 Hz to 7000 Hz. In some embodiments, the frequency f2 of the second resonance peak 320 of the vibration device 200 may range from 3000 Hz to 7000 Hz. In some embodiments, the frequency f2 of the second resonance peak 320 of the vibration device 200 may range from 4000 Hz to 7000 Hz. In some embodiments, the frequency f2 of the second resonance peak 320 of the vibration device 200 may range from 5000 Hz to 7000 Hz. The frequency response curve between the first resonant peak 310 and the second resonant peak 320 can be relatively flat. In the frequency range between the first resonant frequency f1 and the second resonant frequency f2, the vibration device 200 has a higher output response. Ability, when the vibration device 200 is applied to an acoustic output device, it can output sounds with higher sound quality.

Figure 4A is an exemplary structural diagram of a vibration device according to some embodiments of the present specification. In some embodiments, referring to FIG. 4A , the mass element 420 may also be located outside the first piezoelectric element 411 , and the projection of the mass element 420 along the axis direction of the first piezoelectric element 411 is located along the axis direction of the first piezoelectric element 411 . In addition to the projection, the mass element 420 and the first piezoelectric element 411 are connected through an elastic element 430. The first piezoelectric element 411 , the elastic element 430 and the mass element 420 are arranged in sequence from the inside to the outside along the projection of the axis direction of the first piezoelectric element 411 . In some embodiments, when the mass element 420 is located outside the first piezoelectric element 411, the shape of the mass element 420 may be annular.

In some embodiments, when the mass element 420 is located outside the first piezoelectric element 411 , a cover plate may be provided on the side of the mass element 420 away from the first piezoelectric element 411 along the axis direction of the first piezoelectric element 411 . The cover plate can seal the side of the mass element 420 away from the first piezoelectric element 411 along the axial direction of the first piezoelectric element 411 . For example, the cover plate may have a circular structure, and the peripheral side of the cover plate is aligned with and closely connected to the side of the mass element 420 away from the first piezoelectric element 411 along the axis direction of the first piezoelectric element 411 . By disposing a cover plate on the side of the mass element 420 away from the first piezoelectric element 411 along the axial direction of the first piezoelectric element 411, the cover plate can be used as a vibration plate for transmitting vibration signals. The cover plate can also be used to connect the mass element 420 to other structures of the vibration device 400, such as a diaphragm.

Figure 4B is a frequency response graph of a vibration device according to some embodiments of the present specification. When the mass element 420 is located outside the first piezoelectric element 411, the frequency response curve of the vibration device 400 can be as shown in FIG. 4B. In some embodiments, the frequency f1 of the first resonance peak 401 of the vibration device 400 (also referred to as the first resonance frequency) may range from 50 Hz to 4000 Hz. In some embodiments, the frequency f1 of the first resonance peak 401 of the vibration device 400 may range from 50 Hz to 500 Hz. In some embodiments, the frequency f1 of the first resonance peak 401 of the vibration device 400 may range from 50 Hz to 300 Hz. In some embodiments, the frequency f1 of the first resonance peak 401 of the vibration device 400 may range from 50 Hz to 200 Hz. In some embodiments, the frequency f1 of the first resonance peak 401 of the vibration device 400 may range from 100 Hz to 200 Hz. In some embodiments, the frequency f2 (also referred to as the second resonant frequency) of the second resonance peak 402 of the vibration device 400 may range from 1,000 Hz to 40,000 Hz. In some embodiments, the frequency f2 of the second resonance peak 402 of the vibration device 400 may range from 4000 Hz to 10000 Hz. In some embodiments, the frequency f2 of the second resonance peak 402 of the vibration device 400 may range from 4000 Hz to 8000 Hz. In some embodiments, the frequency f2 of the second resonance peak 402 of the vibration device 400 may range from 4000 Hz to 7000 Hz. In some embodiments, the frequency f2 of the second resonance peak 402 of the vibration device 400 may range from 4000 Hz to 6000 Hz.

In some embodiments, one or more piezoelectric elements may include not only a first piezoelectric element, but also a second piezoelectric element, and the second piezoelectric element may be disposed inside the first piezoelectric element. In some embodiments, the first piezoelectric element may include a first annular structure, and the second piezoelectric element may include a second annular structure; the second piezoelectric element may be disposed inside the first annular structure.

Figure 5 is an exemplary structural diagram of a vibration device according to some embodiments of the present specification. Referring to FIG. 5 , the vibration device 500 may include one or more piezoelectric elements 510 , a mass element 520 , and one or more elastic elements 530 . Wherein, at least one of the one or more elastic elements 530 can be used to connect the mass element 520 and the piezoelectric element 510 .

In some embodiments, the one or more piezoelectric elements 510 may include a first piezoelectric element 511 including a first annular structure and a second piezoelectric element 512 including The second annular structure; the second piezoelectric element 512 is disposed inside the first annular structure. In some embodiments, one end of the first piezoelectric element 511 along the axial direction (for example, the end away from the mass element 520 ) may be fixed, and the second piezoelectric element 512 is connected to the second piezoelectric element 512 through at least one of one or more elastic elements 530 . The first piezoelectric element 511 is connected at other positions than the fixed end; the projection of the mass element 520 along the axis direction is within the projection of the second piezoelectric element 512 along the axis direction, and the mass element 520 passes through one or more elastic elements 530 At least another one is connected to the second piezoelectric element 512 . In some embodiments, the elastic element 530 may include a first elastic element 531 and a second elastic element 532 . The first elastic element 531 is located between the first piezoelectric element 511 and the second piezoelectric element 512 , and the first piezoelectric element 511 and the second piezoelectric element 512 are connected through the first elastic element 531 . The second elastic element 532 is located between the second piezoelectric element 512 and the mass element 520 , and the second piezoelectric element 512 and the mass element 520 are connected through the second elastic element 532 .

In some embodiments, by disposing the second piezoelectric element 512 in the vibration device 500, the second piezoelectric element 512 and the mass element 520 (and the elastic element connecting the second piezoelectric element 512 and the mass element 520) can form an integral body. Mass, when the overall mass resonates with the elastic element connecting the entire mass and the first piezoelectric element 511, since the overall mass is greater than the mass of the mass element, the first resonance peak of the vibration device 500 moves to a low frequency, and the vibration device 500 vibrates. When the device 500 is vibrating, the resonance of the double ring structure can also generate a third resonance peak located between the first resonance peak and the second resonance peak. In the frequency response curve of the vibration device 500, it can be shown that the resonance peak is between the first resonance peak and the second resonance peak. The position between the resonant peaks forms an additional resonant peak, the third resonant peak. In some embodiments, the third resonant frequency corresponding to the third resonant peak may be located between the first resonant frequency corresponding to the first resonant peak and the second resonant frequency corresponding to the second resonant peak.

In some embodiments, the frequency range of the first resonance peak of the vibration device 500 having a double ring structure may be 50 Hz to 2000 Hz. In some embodiments, the frequency range of the first resonance peak of the vibration device 500 having a double ring structure may be 50 Hz to 1000 Hz. In some embodiments, the frequency range of the first resonance peak of the vibration device 500 having a double ring structure may be 50 Hz to 500 Hz. In some embodiments, the frequency range of the first resonance peak of the vibration device 700 having a double ring structure may be 50 Hz to 300 Hz. In some embodiments, the frequency range of the first resonance peak of the vibration device 500 having a double ring structure may be 50 Hz to 200 Hz. In some embodiments, the frequency range of the first resonance peak of the vibration device 500 having a double ring structure may be 50 Hz to 100 Hz.

Figure 6 is a frequency response graph of a vibration device 500 according to some embodiments of the present specification. Among them, curve 610 can represent the frequency response curve of a vibration device with only a first piezoelectric element, and curve 620 represents a first piezoelectric element and a second piezoelectric element, and the first piezoelectric element and the second piezoelectric element are The frequency response curve of a vibrating device with a phase difference of 0 degrees in received electrical signals. Comparing curve 610 and curve 620, it can be seen that when the vibration device is additionally provided with a second piezoelectric element, not only the first resonance peak 601 and the second resonance peak 602 can be formed in the frequency response curve 620 of the vibration device, but also an additional resonance peak can be formed. , that is, the third resonance peak 603. In some embodiments, when the vibration device is additionally provided with a second piezoelectric element, while the third resonance peak 603 is formed in the frequency response curve 620 of the vibration device, there is also a third resonance peak 603 between the first resonance peak 601 and the third resonance peak 603. A resonance valley 604 is formed between them. The resonance valley 604 is formed because the vibration output directions of the first piezoelectric element and the second piezoelectric element at the frequency position of the resonance valley 604 are opposite, causing the vibration outputs to cancel each other. In some embodiments, the location of the resonant valley 604 is related to the shape dimensions of the first and second piezoelectric elements and the shape of the elastic element. In some embodiments, the resonant valley 604 can be filled by adjusting the phase of the electrical signal between the first piezoelectric element and the second piezoelectric element. In some embodiments, the low-frequency sensitivity of the vibration device may increase as the phase difference of the electrical signals of the first piezoelectric element and the second piezoelectric element increases. The phase difference of the electrical signal between the first piezoelectric element and the second piezoelectric element basically does not affect the high-frequency characteristics of the vibration device.

Continuing to refer to FIG. 6 , curve 630 represents the frequency response curve of the vibration device when the phase difference between the electrical signals received by the first piezoelectric element and the second piezoelectric element is 45°. Curve 640 represents the frequency response curve of the first piezoelectric element and the second piezoelectric element. The frequency response curve of the vibration device when the phase difference of the electrical signals received by the piezoelectric element is 90°. Curve 650 represents the frequency response curve of the vibration device when the phase difference of the electrical signals received by the first piezoelectric element and the second piezoelectric element is 135°. Frequency response curve of vibrating device. Comparing curve 630, curve 640 and curve 650, it can be seen that when other parameters are the same, the greater the phase difference between the electrical signals received by the first piezoelectric element and the second piezoelectric element, the greater the difference between the first resonant peak and the third resonant peak. The shallower the resonance valley formed between them, the better the low-frequency response of the vibration device.

In some embodiments, in order to ensure the low-frequency response of the vibration device, the phase difference between the electrical signals received by the first piezoelectric element and the second piezoelectric element may be 45° to 180°. In some embodiments, in order to ensure the low-frequency response of the vibration device, the phase difference between the electrical signals received by the first piezoelectric element and the second piezoelectric element may be 60° to 180°. In some embodiments, in order to ensure the low-frequency response of the vibration device, the phase difference between the electrical signals received by the first piezoelectric element and the second piezoelectric element may be 80° to 180°. In some embodiments, in order to ensure the low-frequency response of the vibration device, the phase difference between the electrical signals received by the first piezoelectric element and the second piezoelectric element may be 100° to 180°. In some embodiments, in order to ensure the low-frequency response of the vibration device, the phase difference between the electrical signals received by the first piezoelectric element and the second piezoelectric element may be 45° to 120°. In some embodiments, in order to ensure the low-frequency response of the vibration device, the phase difference between the electrical signals received by the first piezoelectric element and the second piezoelectric element may be 45° to 90°.

In some embodiments, when the vibration device includes a first piezoelectric element and a second piezoelectric element, the mass element may be located outside the first piezoelectric element. Figure 7 is an exemplary structural diagram of a vibration device according to some embodiments of the present specification. As shown in FIG. 7 , one or more piezoelectric elements 710 may include a first piezoelectric element 711 and a second piezoelectric element 712 , the first piezoelectric element 711 includes a first annular structure, and the second piezoelectric element 712 includes The second annular structure; the second piezoelectric element 712 is disposed inside the first annular structure. In some embodiments, one end of the second piezoelectric element 712 along the axial direction of the annular structure can be fixed, and the first piezoelectric element 711 passes through at least one of the one or more elastic elements 730 (for example, the second elastic element 732) Connected to other positions other than the fixed end of the second piezoelectric element 712; the shape of the mass element 720 can be annular, and the projection of the mass element 720 along the axial direction is located outside the projection of the first piezoelectric element 711 along the axial direction. The mass element 720 The first piezoelectric element 711 is connected through at least another one of the one or more elastic elements 730 (eg, the first elastic element 731 ).

In some embodiments, the vibration device 700 includes a first piezoelectric element 711 and a second piezoelectric element 712 , and when the mass element 720 is located outside the first piezoelectric element 711 , the mass element 720 extends along the edge of the first piezoelectric element 711 . A cover plate may be provided on the side away from the first piezoelectric element 711 in the axial direction.

In some embodiments, the first piezoelectric element 711 and the mass element 720 (and the elastic element connecting the first piezoelectric element 711 and the mass element 720) can form an overall mass. When the entire mass is connected to the second When the elastic element of the piezoelectric element 712 resonates, the first resonance peak of the vibration device 700 can be moved to a low frequency, and the resonance of the double ring structure of the vibration device 700 can also generate a third resonance peak located between the first resonance peak and the second resonance peak. resonance peak. In some embodiments, the frequency range of the first resonance peak of the vibration device 700 having a double ring structure may be similar to the frequency range of the first resonance peak of the vibration device 500 , which will not be described again here.

Figure 8 is a frequency response graph of a vibration device 700 according to some embodiments of the present specification. Among them, curve 810 can represent the frequency response curve of a vibration device with only a first piezoelectric element, and curve 820 represents a first piezoelectric element and a second piezoelectric element, and the first piezoelectric element and the second piezoelectric element are The frequency response curve of a vibrating device with a phase difference of 0 degrees in received electrical signals. Comparing curve 810 and curve 820, it can be seen that when the vibration device is additionally provided with a second piezoelectric element, not only the first resonance peak 801 and the second resonance peak 802 can be formed in the frequency response curve 820 of the vibration device, but also a third resonance peak can be formed. 803. In some embodiments, when the vibration device is additionally provided with a second piezoelectric element, while the third resonance peak 803 is formed in the frequency response curve 820 of the vibration device, there is also a third resonance peak 803 between the first resonance peak 801 and the third resonance peak 803. A resonance valley 804 is formed between them. The resonance valley 804 is formed because the vibration output directions of the first piezoelectric element and the second piezoelectric element at the frequency position corresponding to the resonance valley 804 are opposite, causing the vibration outputs to cancel each other. In some embodiments, the location of the resonant valley 804 is related to the shape dimensions of the first and second piezoelectric elements and the shape of the elastic element. In some embodiments, the resonant valley 804 may be filled by adjusting the phase of the electrical signal between the first piezoelectric element and the second piezoelectric element. In some embodiments, the low-frequency sensitivity of the vibration device may increase as the phase difference of the electrical signals of the first piezoelectric element and the second piezoelectric element increases. The phase difference of the electrical signal between the first piezoelectric element and the second piezoelectric element basically does not affect the high-frequency characteristics of the vibration device.

In some embodiments, there may be a phase difference between the electrical signals received by the first piezoelectric element and the second piezoelectric element, and the existence of the phase difference will affect the amplitude of the resonance valley 804 . Continuing to refer to FIG. 8 , curve 830 represents the frequency response curve of the vibration device when the phase difference between the electrical signals received by the first piezoelectric element and the second piezoelectric element is 45°, and curve 840 represents the frequency response curve of the first piezoelectric element and the second piezoelectric element. The frequency response curve of the vibration device when the phase difference of the electrical signals received by the piezoelectric element is 90°. Curve 850 represents the frequency response curve of the vibration device when the phase difference of the electrical signals received by the first piezoelectric element and the second piezoelectric element is 135°. Frequency response curve of vibrating device. Comparing curve 830, curve 840 and curve 850, it can be seen that when other parameters are the same, the greater the phase difference between the electrical signals received by the first piezoelectric element and the second piezoelectric element, the greater the phase difference between the first resonant peak and the third resonant peak. The shallower the resonance valley formed between them, the better the low-frequency response of the vibration device. In some embodiments, the specific setting range of the phase difference between the electrical signals received by the first piezoelectric element and the second piezoelectric element can be referred to the description elsewhere in this specification.

In some embodiments, when the vibration device includes a first piezoelectric element and a second piezoelectric element, the mass element may be located between the first piezoelectric element and the second piezoelectric element. Figure 9 is an exemplary structural diagram of a vibration device according to some embodiments of the present specification. As shown in Figure 9, in some embodiments, the shape of the mass element 920 may be annular, and the mass element 920 is located between the first annular structure of the first piezoelectric element 911 and the second annular structure of the second piezoelectric element 912. between. The projection of the mass element 920 in the axial direction is located between the projections of the first piezoelectric element 911 and the second piezoelectric element 912 in the axial direction. The mass element 920 is connected to the first piezoelectric element 911 through at least one of the one or more elastic elements 930 (eg, the first elastic element 931 ), and the mass element 920 is connected to the first piezoelectric element 911 through at least another of the one or more elastic elements (eg, the first elastic element 931 ). , the second elastic element 932) is connected to the second piezoelectric element 912. In some embodiments, the shape of the elastic element 930 (eg, the first elastic element 931 and/or the second elastic element 932 ) may be S-shaped, and the bending directions of adjacent S-shaped elastic elements 930 may be opposite, such that adjacent S-shaped elastic elements 930 may have an opposite bending direction. The S-shaped elastic element 930 can provide shear stress with opposite curl to the mass element 920, thereby preventing the mass element 920 from producing a rotational tendency to rotate around the axis direction, thereby preventing the vibration device 900 from producing a rotational mode. In some embodiments, referring to FIG. 9 , the connection positions of adjacent S-shaped elastic elements 930 on the mass element 920 or the piezoelectric element 910 (eg, the first piezoelectric element 911 and/or the second piezoelectric element 912 ) Can be the same. In other embodiments, the connection positions of adjacent S-shaped elastic elements 930 on the mass element 920 or the piezoelectric element 910 (for example, the first piezoelectric element 911 and/or the second piezoelectric element 912 ) may also be different. same.

In some embodiments, the first piezoelectric element 911 or the second piezoelectric element 912 may have a fixed end along the axis direction. In some embodiments, when one end of the first piezoelectric element 911 is fixed along the axial direction, the two end surfaces of the second piezoelectric element 912 along the axial direction are freely disposed. The second piezoelectric element 912 can serve as a piezoelectric free ring. The first piezoelectric element 912 can be used as a piezoelectric free ring. Piezoelectric element 911 may serve as a piezoelectric retaining ring. Or when one end of the second piezoelectric element 912 is fixed along the axial direction, the two end surfaces of the first piezoelectric element 911 along the axial direction are freely disposed. The first piezoelectric element 911 can be used as a piezoelectric free ring, and the second piezoelectric element 912 can be As a piezoelectric retaining ring. In some embodiments, when different piezoelectric elements of at least one piezoelectric element 910 have fixed ends along the axial direction, the vibration device 900 may have different frequency response curves. The overall mass formed by the piezoelectric free ring and the mass element 920 (and the elastic element connecting the piezoelectric free ring and the mass element 920) can resonate with the elastic element connecting this overall mass and the piezoelectric fixed ring, which can make the first resonance peak moves to low frequency, and the piezoelectric free ring and the piezoelectric fixed ring are indirectly connected (that is, connected through the first elastic element 931, the mass element 920 and the second elastic element 932), so that when the vibration device 900 vibrates, the piezoelectric free ring and The resonance of the piezoelectric fixed ring can form a third resonance peak in the frequency response curve. The third resonant frequency corresponding to the third resonant peak may be located between the first resonant frequency corresponding to the first resonant peak and the second resonant frequency corresponding to the second resonant peak. In some embodiments, the frequency range of the first resonance peak of the vibration device 900 may be similar to the frequency range of the first resonance peak of the vibration device 500 , which will not be described again here.

Figure 10 is a frequency response curve diagram of a vibration device according to some embodiments of this specification. The frequency response curves other than the curve 1010 in FIG. 10 may be the frequency response curve of a vibration device (eg, the vibration device 900 ) in which the first piezoelectric element (eg, the first piezoelectric element 911 ) has a fixed end along the axial direction. Referring to FIG. 10 , curve 1010 may represent the frequency response curve of a vibration device (eg, vibration device 200 ) with only a first piezoelectric element, and curve 1020 represents a first piezoelectric element and a second piezoelectric element, and the first piezoelectric element is provided. The frequency response curve of the vibration device in which the phase difference between the electrical signals received by the electrical element and the second piezoelectric element is 0°. Comparing curve 1010 and curve 1020, it can be seen that when the vibration device is provided with a first piezoelectric element and a second piezoelectric element, the frequency response curve 1020 of the vibration device may also form a first resonance peak 1001 and a second resonance peak 1002. The third resonance peak 1003. In some embodiments, the third resonance peak 1003 is generated by the resonance of the first piezoelectric element and the second piezoelectric element. In some embodiments, the mass element is located between the first piezoelectric element and the second piezoelectric element as compared to the mass element being located outside the first piezoelectric element (or alternatively, the mass element is located inside the second piezoelectric element). When , the resonance valley 1004 formed in the frequency response curve 1020 of the vibration device may be located before the first resonance peak 1001 . In some embodiments, the resonance valley 1004 can also be filled by adjusting the phase of the electrical signal between the first piezoelectric element and the second piezoelectric element.

Continuing to refer to FIG. 10 , curves 1030 and 1040 may respectively represent the frequency response curves of the vibration device when the phase differences of the electrical signals received by the first piezoelectric element and the second piezoelectric element are 90° and 180°. Comparing curve 1030 and curve 1040, it can be seen that when other parameters are the same, the greater the phase difference between the electrical signals received by the first piezoelectric element and the second piezoelectric element, the shallower the resonance valley formed before the first resonance peak. The better the low frequency response of the vibrating device. In some embodiments, the specific setting range of the phase difference between the electrical signals received by the first piezoelectric element and the second piezoelectric element can be referred to the description elsewhere in this specification.

Figure 11 is a frequency response curve diagram of a vibration device according to some embodiments of this specification. In addition to the curve 1110 in FIG. 11 , the frequency response curve may be a frequency response curve of a vibration device in which the second piezoelectric element (for example, the second piezoelectric element 912 ) has a fixed end along the axis direction. Among them, the curve 1110 can represent the frequency response curve of a vibration device (for example, the vibration device 200 ) with only a first piezoelectric element, and the curve 1120 represents a first piezoelectric element and a second piezoelectric element, and the first piezoelectric element The frequency response curve of a vibration device (for example, the vibration device 900 ) with a phase difference of 0° from the electrical signal received by the second piezoelectric element. Comparing curve 1110 and curve 1120, it can be seen that when the vibration device is provided with a first piezoelectric element and a second piezoelectric element, the frequency response curve 1120 of the vibration device may also form a first resonance peak 1101 and a second resonance peak 1102. The third resonance peak 1103. In some embodiments, the third resonance peak 1103 may be generated by the resonance of the first piezoelectric element and the second piezoelectric element. In some embodiments, the mass element is located between the first piezoelectric element and the second piezoelectric element as compared to the mass element being located outside the first piezoelectric element (or alternatively, the mass element is located inside the second piezoelectric element). When , the resonance valley 1104 formed in the frequency response curve 1120 of the vibration device may be located before the first resonance peak 1101 . The resonance valley 1104 can also be filled by adjusting the phase of the electrical signal between the first piezoelectric element and the second piezoelectric element.

Continuing to refer to FIG. 11 , curves 1130 and 1140 may respectively represent the frequency response curves of the vibration device when the phase differences of the electrical signals received by the first piezoelectric element and the second piezoelectric element are 90° and 180°. Comparing curve 1130 and curve 1140, it can be seen that when other parameters are the same, the greater the phase difference between the electrical signals received by the first piezoelectric element and the second piezoelectric element, the shallower the resonance valley formed before the first resonance peak. The better the low frequency response of the vibrating device. In some embodiments, the specific setting range of the phase difference between the electrical signals received by the first piezoelectric element and the second piezoelectric element can be referred to the description elsewhere in this specification.

In some embodiments, in piezoelectric vibration devices (eg, vibration device 200 , vibration device 400 , vibration device 500 , vibration device 700 , and vibration device 900 ), elastic elements may be used to provide elasticity such that the mass element may Make vibration. Therefore, the structural design of the elastic element can affect the vibration characteristics of the vibration device. In some embodiments, in order to meet the elastic coefficient requirement of the elastic element, the elastic element can be designed in a curved shape to increase the length of the elastic element, thereby reducing the elastic coefficient of the elastic element. In this arrangement, if the shape of the elastic element has a rotational or asymmetric configuration, it may cause the mass element of the vibration device to produce a rotational mode when vibrating, thereby affecting the output of the vibration device (which may appear in the frequency response curve (resonance valley), thus affecting the vibration performance of the vibration device. Therefore, the structure of the elastic element can be reasonably designed to ensure the vibration performance of the vibration device.

In some embodiments, the number of elastic elements connecting the mass element and the piezoelectric element may be multiple, and the multiple elastic elements may be distributed along the circumference of the annular structure of the piezoelectric element. In some embodiments, multiple elastic elements can be symmetrically distributed in the circumferential direction of the piezoelectric element, so that the vibration device can take advantage of the symmetry of the elastic elements (for example, the rotation of the elastic elements) when a rotational mode may occur. To the opposite direction) to make the rotational mode anti-phase and cancel, thereby reducing or eliminating the resonance valley generated by the rotational mode.

In some embodiments, the shape of the elastic element may include at least one of a polygonal shape, an S shape, a spline shape, an arc shape, and a straight line shape. In some embodiments, when the elastic elements have different shapes, the elastic elements may have different bending sections and bending directions. In some embodiments, the connection between the two ends of the elastic element is used as an auxiliary line. The elastic element can be alternately connected on both sides of the auxiliary line to form sub-segments. The segment composed of multiple sub-segments with the same alternating rule is the bending of the elastic element. part. In some embodiments, the bending direction may be a direction expressing an alternating pattern of multiple sub-segments on both sides of the auxiliary line. Taking the shape of the elastic element as a polyline as an example, the polygonal shape can be bent toward the first side of the auxiliary line, then toward the second side of the auxiliary line, and then toward the first side, and so on, then The direction of the initial bending side of the polyline can be recorded as the bending direction of the polyline shape. When the cycle law is broken, the bending segment of the polyline segment ends.

Figure 12 is an exemplary structural diagram of an elastic element according to some embodiments of the present specification. In some embodiments, each of the one or more elastic elements 1200 may have multiple bending segments, and the bending directions of adjacent bending segments in the multiple bending segments may be opposite. For example, each elastic element among the plurality of elastic elements 1200 in FIG. 12 may include two bending sections, namely a first bending section 1210 and a second bending section 1220. The first bending section 1210 and the second bending section 1220 are connected end to end. The elastic element 1200 is formed. The bending direction of the first bending section 1210 is the first direction, the bending direction of the second bending section 1220 is the second direction, and the first direction and the second direction are relative to the auxiliary line of the elastic element 1200 (shown as a dotted line in Figure 12) The direction is opposite. In some embodiments, the first direction may be a counterclockwise direction relative to the center of the projected shape of the elastic element in a projection plane along the axial direction of the piezoelectric element, and the second direction may be a projection plane along the axial direction of the piezoelectric element. in a clockwise direction relative to the center of the projected shape of the elastic element.

By arranging the bending directions of adjacent bending segments among the plurality of bending segments of the elastic element 1200 to be opposite, the rotational modes of the adjacent bending segments when vibrating can be anti-phase and cancel each other, thereby reducing or eliminating the resonance generated by the rotational mode. valley.

Figure 13A is an exemplary structural diagram of a vibration device according to some embodiments of the present specification. The structure of the vibration device 1300-1 shown in FIG. 13A is substantially the same as the structure of the vibration device 200 shown in FIG. 2, except that the structure of the elastic element is different.

Referring to FIG. 13A , in some embodiments, multiple elastic elements 1330 may be located in the same plane perpendicular to the axis direction of the first piezoelectric element 1311 . For example, the elastic element 1330 can be a vibration-transmitting piece or a vibration-transmitting rod structure. Multiple vibration-transmitting pieces are located in the same plane, and the plane is perpendicular to the axis direction of the annular structure. In some embodiments, the plurality of elastic elements 1330 can be arranged in a certain manner, so that the projection of the arranged plurality of elastic elements 1330 along the axial direction of the first piezoelectric element 1311 can have at least two mutually perpendicular axes of symmetry.

In some embodiments, the number of elastic elements 1330 connecting the mass element 1320 and the first piezoelectric element 1311 may be an even number (eg, 4, 8, etc.). As shown in FIG. 13A , in some embodiments, the number of elastic elements 1330 connecting the mass element 1320 and the first piezoelectric element 1311 can be four, and the arrangement of the four elastic elements can form an X shape. The bending directions of adjacent elastic elements among the four elastic elements can be opposite, and the bending directions of opposite elastic elements can be the same. When the four elastic elements 1330 are arranged in an X shape, the projection of the four elastic elements 1330 along the axial direction of the first piezoelectric element 1311 may have two mutually perpendicular first symmetry axes 1301 and second symmetry axes 1302 .

In some embodiments, in the X-shaped elastic element 1330, an included angle may be formed between a single elastic element and the axis of symmetry (eg, the first axis of symmetry 1301 or the second axis of symmetry 1302). An angle θ can be formed between 1301. By adjusting the angle θ, the rolling modes of the vibration device along different symmetry axes during vibration can be controlled. In some embodiments, in order to minimize the rolling mode when the vibration device vibrates, the included angle θ may range from 10° to 30°. In some embodiments, in order to minimize the rolling mode when the vibration device vibrates, the included angle θ may range from 30° to 60°. In some embodiments, in order to minimize the rolling mode when the vibration device vibrates, the included angle θ may range from 60° to 80°.

The structure and connection method of the elastic element 1330 shown in FIG. 13A are not only applicable to the aforementioned annular structure piezoelectric element, but can also be applied to other configurations of piezoelectric elements. For example, FIG. 13B is an exemplary structural diagram of a vibration device according to some embodiments of the present specification. The vibration device 1300-2 shown in FIG. 13B may include a piezoelectric element 1340, a first mass element 1351, a second mass element 1352, a connection 1341, and one or more elastic elements 1360. In some embodiments, the piezoelectric element 1340 can be constructed as a piezoelectric beam structure, and the second mass element 1352 can be connected to the middle portion of the piezoelectric beam. In some embodiments, a piezoelectric sheet can be attached to one surface or a group of opposite surfaces of the piezoelectric beam (the one or group of surfaces is also referred to as a piezoelectric surface), and the piezoelectric sheet can expand and contract based on an electrical signal. Deformation allows the piezoelectric beam to vibrate perpendicular to the piezoelectric surface based on electrical signals. In some embodiments, connectors 1341 are provided at both ends of the piezoelectric beam, and the piezoelectric beam is connected to one end of the plurality of elastic elements 1360 through the connectors 1341 at both ends. In some embodiments, the other ends of the plurality of elastic elements 1360 may be connected to the first mass element 1351. In some embodiments, multiple elastic elements 1360 may be distributed along the circumference of the first mass element 1351 . In some embodiments, multiple elastic elements 1360 may be located in the same plane, and the plane where the elastic elements 1360 are located is parallel to the piezoelectric plane of the piezoelectric beam. The shape and structure of the plurality of elastic elements 1360 may be the same as the shape and structure of the elastic element 1330 shown in FIG. 13A. For example, the number of the plurality of elastic elements 1360 can be four, and the four elastic elements can be arranged to form an X shape. Arranged in an X shape, the four elastic elements 1330 may have a symmetry axis 1301 and a symmetry axis 1302, so that the bending directions of adjacent elastic elements among the four elastic elements 1330 may be opposite.

Figure 14A is an exemplary structural diagram of a vibration device according to some embodiments of the present specification. The structure of the vibration device 1400-1 shown in Figure 14A is substantially the same as the structure of the vibration device 1300-1 shown in Figure 13A, except that the number and structure of the elastic elements are different.

Referring to Figure 14A, in some embodiments, the number of elastic elements 1430 connecting the mass element 1420 and the first piezoelectric element 1411 may be eight, and the eight elastic elements may form a double X shape. Among them, 4 elastic elements among the 8 elastic elements can form the first X shape 1401, and the remaining 4 elastic elements form the second X shape 1402. The first X shape 1401 and the second X shape 1402 form multiple elastic elements 1430. The double X-shaped structure. In some embodiments, the double X-shaped structure composed of multiple elastic elements 1430 may be a parallel double X-shape, a vertical double X-shape (as shown in FIG. 14A ), or other forms of inversely symmetrically distributed shapes. The parallel/perpendicular double X-shape may mean that the two symmetry axes of the first X-shape 1401 and the two symmetry axes of the second X-shape 1402 are respectively parallel/perpendicular.

Figure 14B is an exemplary structural diagram of a vibration device according to some embodiments of the present specification. The structure of the vibration device 1400-2 shown in FIG. 14B is substantially the same as the structure of the vibration device 1300-2 shown in FIG. 13B. The difference lies in the number of piezoelectric beams, the number and structure of the elastic elements.

Referring to FIG. 14B , in some embodiments, the number of elastic elements 1460 connecting the mass element 1450 and the piezoelectric element 1440 may be eight, and the eight elastic elements 1460 are distributed along the circumference of the first mass element 1451 . In some embodiments, eight elastic elements may form a double X shape. Among them, 4 elastic elements among the 8 elastic elements can form a first X shape, and the remaining 4 elastic elements form a second X shape. The first X shape and the second X shape form a double X shape of multiple elastic elements 1460 structure. In some embodiments, the double X-shaped structure composed of multiple elastic elements 1460 can be a parallel double X-shape (as shown in Figure 14C), a vertical double Symmetrically distributed shape.

As shown in FIG. 14B , when the double X-shaped structure composed of multiple elastic elements 1460 is a vertical double X-shaped structure, the four elastic elements forming the first X shape can be connected to the two piezoelectric elements 1440 ( For example, the same piezoelectric element in the piezoelectric beam structure is connected, and the four elastic elements forming a second X shape are connected to another piezoelectric element, and the two piezoelectric elements are arranged perpendicularly to each other in the same plane. Two piezoelectric elements 1440 can be connected to the second mass element 1452 simultaneously.

Figure 14C is an exemplary structural diagram of a vibration device according to some embodiments of the present specification. As shown in FIG. 14C , the double X-shaped structure composed of multiple elastic elements 1460 is a parallel double X-shaped structure. The connection method between the elastic element and the piezoelectric element of the vibration device 1400-3 shown in Figure 14C is substantially the same as that in Figure 14B. The difference is that the four elastic elements 1460 forming a first The member 1441 is connected to another piezoelectric element 1440 (eg, a piezoelectric beam structure), and the two piezoelectric elements 1440 are arranged parallel to each other in the same plane. The four elastic elements 1460 forming the first X-shape and the four elastic elements 1460 forming the second X-shape are also connected to the first mass element 1451 respectively. In some embodiments, there may be one first mass element 1451 , or there may be multiple first mass elements 1451 , and the multiple first mass elements 1451 may be connected to each other through rigid connectors (not shown in the figure). The two piezoelectric elements 1440 are respectively connected to the second mass element 1452. In some embodiments, there may be one second mass element 1452 , or there may be multiple second mass elements 1452 , and the multiple second mass elements 1452 may be connected to each other through rigid connectors 1453 .

In some embodiments, when the shape and structure of the elastic element are different, the vibration performance of the vibration device may be different. The higher the degree of inverse symmetry of the elastic element, the fewer rotational modes generated by the vibration of the elastic element, and the higher the vibration performance of the vibration device. Figure 14D is a frequency response graph of a vibration device according to some embodiments of the present specification. Among them, the curve 1401 can represent the frequency response curve of the vibration device (for example, the vibration device 1300-2) when the elastic element is a single X-shape, and the curve 1402 can represent the frequency response curve of the vibration device (for example, the vibration device 1400-2) when the elastic element is a parallel double 3) Frequency response curve, curve 1403 may represent the frequency response curve of the vibration device (for example, the vibration device 1400-1 or the vibration device 1400-2) when the elastic element is a non-parallel double X-shape. Combining curve 1401, curve 1402, and curve 1403, it can be seen that when the configuration of the elastic element is a single X-shape, a parallel double X-shape, or other types of double X-shapes, the frequency response of the vibration device is better. It should be noted that when the elastic element is in a single The vibration system formed by the electrical components absorbs the vibration caused by the output end. For example, with reference to FIG. 13B , the resonance valley may be caused by the vibration system formed by the second mass element 1352 and the piezoelectric beam 1340 absorbing the vibration of the first mass element 1351 .

In some embodiments, the elastic element can also be configured as a double-layer structure, and the double-layer elastic element is distributed up and down along the axis of the annular structure. In some embodiments, the elastic element may include a first elastic element and a second elastic element disposed along an axial direction of the annular structure. The bending directions of the first elastic element and the second elastic element may be correspondingly opposite. For example, the bending directions of the plurality of bending sections of the first elastic element are respectively opposite to the bending directions of the plurality of bending sections of the second elastic element.

In some embodiments, the shape of the double-layer elastic element may be any one of a double-layer polygonal shape, a double-layer S-shape, a double-layer spline shape, or a double-layer arc shape. In some embodiments, the first layer of the double-layered elastic elements is a plurality of folded line-shaped elastic elements arranged along the first direction, and the second layer is a plurality of folded line-shaped elastic elements arranged along the second direction. The first direction and the second direction are opposite to the auxiliary line direction of the elastic element.

In some embodiments, when the structure of the elastic element is a double-layer structure, among the multiple bending sections included in each elastic element in the same layer of elastic elements, the bending directions of adjacent bending sections can be opposite; at the same time, along the In the direction of the axis of the annular structure, the bending directions of the two opposite elastic elements located at different levels can also be correspondingly opposite.

Figure 15A is an exemplary structural diagram of a vibration device according to some embodiments of the present specification. The structure of the vibration device 1500-1 shown in FIG. 15A is substantially the same as the structure of the vibration device 200 shown in FIG. 2, except that the structure of the elastic element is different.

Referring to Figure 15A, one or more elastic elements 1530 may include a first helical structure 1531 and a second helical structure 1532, which respectively connect the mass element 1520 and the one or more piezoelectric elements 1510. . In some embodiments, the first helical structure 1531 and the second helical structure 1532 may be arranged up and down along the axis direction of the piezoelectric element 1510 . The connection position between the first spiral structure 1531 and the piezoelectric element 1510 may be a side of the piezoelectric element 1510 closer to the mass element 1520 . The connection position between the second spiral structure 1532 and the piezoelectric element 1510 may be a side of the piezoelectric element 1510 that is farther away from the mass element 1520 .

In some embodiments, the axes of the first helical structure 1531 and the second helical structure 1532 may be the same and the helical directions are opposite. The helical direction may be the direction in which the helical structure rotates about its axis. In some embodiments, at least two elastic elements 130 can rotate in opposite directions along the same axis to form a first helical structure 1531 and a second helical structure 1532 with opposite helical directions.

In some embodiments, by configuring the elastic element 1530 into a double-layer spiral structure, the rotation amplitude of the elastic element 1530 during the vibration process of the vibration device 1500 can be reduced. At the same time, the double-layer spiral structure can also increase the elastic coefficient of the elastic element 1530, so that the first resonance peak generated by the resonance of the elastic element 1530 and the mass element 1520 shifts to the right (that is, moves to high frequency) to meet the requirements of the vibration device 1500-1. Vibration performance requirements.

Figure 15B is an exemplary structural diagram of a vibration device according to some embodiments of the present specification. The double helix structure of the elastic element 1530 shown in Figure 15A can also be applied to the vibration device 1500-2 shown in Figure 15B. The structure of the vibration device 1500-2 in Figure 15B is substantially the same as the structure of the vibration device 1400-2 in Figure 14B, except that the structure of the elastic element is different.

Referring to FIG. 15B , in some embodiments, the elastic element 1560 may include a first helical structure 1561 and a second helical structure 1562 arranged up and down along the thickness direction of the first mass element 1551 . The first spiral structure 1561 and the second spiral structure 1562 connect the first mass element 1551 and the plurality of piezoelectric elements 1540 respectively. The first helical structure 1561 and the second helical structure 1562 have opposite helical directions.

In some embodiments, when the elastic element is a helical structure, the number of layers of the helical structure is different, and the vibration performance of the corresponding vibration device can also be different. In some embodiments, the inverse symmetry of the double-layer helical structure is higher than the inverse symmetry of the single-layer helical structure. Therefore, the vibration performance of the vibration device in which the elastic element is a double-helix structure can be better than that in which the elastic element is a single-layer helix. Vibration performance of structural vibrating devices. Figure 16 is an exemplary frequency response graph of a vibration device according to some embodiments of the present specification. The curve 1610 can represent the frequency response curve of a vibration device with a single-layer spiral structure as an elastic element, and the curve 1620 can represent a frequency response curve of a vibration device with a double-layer spiral structure as an elastic element. Comparing curve 1610 and curve 1620, it can be seen that the peak value of the resonance valley formed by the frequency response curve 1620 of the vibration device when the elastic element is a double-layer spiral structure is significantly improved compared to when the elastic element is a single-layer spiral structure.

Figure 17 is an exemplary structural diagram of a vibration device according to some embodiments of the present specification. Referring to FIG. 17 , the vibration device 1700 may include one or more piezoelectric elements 1710 , a mass element 1720 , and one or more elastic elements 1730 . Wherein, one or more piezoelectric elements 1710 may include a first piezoelectric element 1711 and a second piezoelectric element 1712. The second piezoelectric element 1712 is located inside the first annular structure of the first piezoelectric element 1711. The mass element 1720 is located inside the second annular structure of the second piezoelectric element 1712 .

In some embodiments, one or more elastic elements 1730 may include one or more inner ring elastic elements 1732 and one or more outer ring elastic elements 1731 . In some embodiments, the bending directions of the one or more inner ring elastic elements 1732 and the one or more outer ring elastic elements 1731 may be opposite. For example, the shapes of the inner ring elastic element 1732 and the outer ring elastic element 1731 may be S-shaped, and the S-shaped bending direction of the inner ring elastic element 1732 is opposite to the S-shaped bending direction of the outer ring elastic element 1731 .

In some embodiments, when the bending direction of the inner ring elastic element 1732 is opposite to the bending direction of the outer ring elastic element 1731, during the vibration process of the vibration device 1700, the rotational mode generated by the inner ring elastic element 1732 is consistent with the outer ring elastic element 1731. The generated rotational modes can be opposite, so that the rotational mode generated by the inner ring elastic element 1732 and the rotational mode generated by the outer ring elastic element 1731 cancel (or weaken) each other, thereby reducing the overall vibration of the vibration device 1700 during the vibration process. rotation mode.

Figure 18 is an exemplary structural diagram of a vibration device according to some embodiments of the present specification. The structure of the vibration device 1800 shown in FIG. 18 is substantially the same as that of the vibration device 1700 shown in FIG. 17 , and the difference lies in the shape of the elastic element. The shape of the elastic element 1830 of the vibration device 1800 is arc-shaped. The arc-shaped bending direction of the inner ring elastic element 1832 is opposite to the arc-shaped bending direction of the outer ring elastic element 1831 .

In some embodiments, when the one or more elastic elements include one or more inner ring elastic elements and one or more outer ring elastic elements, the shape of the inner/outer ring elastic elements may not be limited to S-shape and arc shape, but also It can be other shapes, such as polyline or spline.

Figure 19 is an exemplary structural diagram of a vibration device according to some embodiments of the present specification. Referring to FIG. 19 , the vibration device 1900 may include one or more piezoelectric elements 1910 , a mass element 1920 , and one or more elastic elements 1930 . In some embodiments, one or more piezoelectric elements 1910 may include two first piezoelectric elements 1911, and the two first piezoelectric elements 1911 may be distributed up and down along the axis direction and connected to each other. The two first piezoelectric elements 1911 are distributed up and down along the axial direction to form a double-layer single ring structure of the piezoelectric element 1910 .

In some embodiments, the mass element 1920 can be connected to the two first piezoelectric elements 1911 respectively through one or more elastic elements 1930. In some embodiments, one or more elastic elements 1930 can be arranged in double layers. The double-layer elastic elements 1930 include two layers of first elastic elements 1931 , and the two layers of first elastic elements 1931 are arranged up and down along the axis direction of the piezoelectric element 1910 . In some embodiments, the two layers of first elastic elements 1931 may be connected to the circumferences of the two first piezoelectric elements 1911 respectively. The mass element 1920 is respectively connected to the two piezoelectric elements 1911 through two layers of first elastic elements 1931. In some embodiments, the bending directions of the two layers of first elastic elements 1931 may be opposite.

In some embodiments, when the number of first piezoelectric elements 1911 is two, the displacement changes of the two first piezoelectric elements 1911 along the axis direction during vibration may be opposite. That is, one of the two first piezoelectric elements 1911 becomes larger (ie, elongates) in the axial direction during the vibration process, and the other of the two first piezoelectric elements 1911 displaces in the axial direction during the vibration process. become smaller (i.e. shrink). In some embodiments, the displacement change of the first piezoelectric element 1911 along the axis direction during vibration can be controlled by the polarization direction of the first piezoelectric element 1911 and the electrode polarity of the electrical signal. For details, see Figure 20A of this specification. and the related description of Figure 20B.

In some embodiments, the number of first piezoelectric elements 1911 included in the piezoelectric element 1910 may be multiple, for example, 4, 6, 8, etc. The plurality of first piezoelectric elements 1911 may be connected sequentially along the axial direction, and the mass element 1920 is connected to each of the plurality of first piezoelectric elements 1911 through a plurality of elastic elements 1930 (for example, divided into multiple layers). In some embodiments, the number of mass elements 1920 may also be multiple, and each of the multiple mass elements 1920 may be connected to a first piezoelectric element 1911 through multiple elastic elements 1930 .

Figure 20A is an exemplary circuit diagram of a first piezoelectric element shown in accordance with some embodiments of the present specification. Referring to FIG. 20A , the polarities of the connection surfaces of the two first piezoelectric elements 1911 may be the same, and the electrode polarities of the electrical signals on the connection surfaces may be the same. For convenience of description, the two first piezoelectric elements 1911 can be respectively referred to as the upper piezoelectric element 19111 and the lower piezoelectric element 19112. In some embodiments, when the upper piezoelectric element 19111 is connected to the lower piezoelectric element 19112, the upper piezoelectric element 19111 may have an upper connection surface 2010, and the lower piezoelectric element 19112 may have a lower connection surface 2020. In some embodiments, when the polarization direction of the upper piezoelectric element 19111 is the same as the polarization direction of the lower piezoelectric element 19112 (as shown by the arrow in Figure 20A), the upper connection surface 2010 is connected to the electrode polarity of the electrical signal (for example, , positive electrode or negative electrode) and the electrode polarity of the lower connection surface 2020 for receiving electrical signals can be the same. In this arrangement, the potential direction inside the upper piezoelectric element 19111 and the potential direction inside the lower piezoelectric element 19112 can be opposite.

By setting the polarization directions of the upper piezoelectric element 19111 and the lower piezoelectric element 19112 to be the same, when the upper piezoelectric element 19111 and the lower piezoelectric element 19112 are connected to potentials (or electrical signals) in opposite directions, the upper piezoelectric element 19111 and the lower piezoelectric element 19112 The underlying piezoelectric element 19112 can produce displacement in the opposite direction.

Figure 20B is another exemplary circuit diagram of a first piezoelectric element shown in accordance with some embodiments of the present specification. Referring to FIG. 20B , the polarities of the connection surfaces of the two first piezoelectric elements can be opposite, and the electrode polarities of the electrical signals on the connection surfaces can be opposite. In some embodiments, when the upper piezoelectric element 19113 is connected to the lower piezoelectric element 19114, the upper piezoelectric element 19113 may have an upper connection surface 2030, and the lower piezoelectric element 19114 may have a lower connection surface 2040. When the polarization direction of the upper piezoelectric element 19112 is opposite to the polarization direction of the lower piezoelectric element 19114 (as shown by the arrow in FIG. 20B ), the electrode polarity (for example, positive or negative electrode) of the upper connection surface 2030 connected to the electrical signal and The polarity of the electrodes connected to the electrical signal on the lower connection surface 2040 can be reversed. In this arrangement, the potential direction inside the upper piezoelectric element 19111 and the potential direction inside the lower piezoelectric element 19112 can be the same.

By setting the polarization directions of the upper piezoelectric element 19113 and the lower piezoelectric element 19114 to be opposite, when the upper piezoelectric element 19113 and the lower piezoelectric element 19114 are connected to the potential (or electrical signal) in the same direction, the upper piezoelectric element 19113 and the lower piezoelectric element 19114 The underlying piezoelectric element 19114 can produce displacement in the opposite direction.

Figure 21 is an exemplary structural diagram of a vibration device according to some embodiments of the present specification. The structure of the vibration device 2100 shown in FIG. 21 is similar to the structure of the vibration device 500 shown in FIG. 5 , except that the structure of the piezoelectric element is different. The piezoelectric element 510 of the vibration device 500 has a single-layer double ring structure, and the piezoelectric element 2110 of the vibration device 2100 has a double-layer double ring structure.

Referring to Figure 21, in some embodiments, one or more piezoelectric elements 2110 may include two first piezoelectric elements 2111 and two second piezoelectric elements 2112. The two first piezoelectric elements 2111 are up and down along the axis direction. Distributed and connected to each other, the two second piezoelectric elements 2112 are located inside the first annular structure and distributed up and down along the axial direction and connected to each other. The axes of the two second piezoelectric elements 2112 may coincide with the axes of the two first piezoelectric elements 2111, and the projections of the two second piezoelectric elements 2112 along the axial direction are located in the first ring of the two first piezoelectric elements 2111. The inner side of the projection of the shape structure along the axis direction.

In some embodiments, the two second piezoelectric elements 2112 may be connected to the two first piezoelectric elements 2111 through at least one of one or more elastic elements. In some embodiments, the elastic element may include an outer ring elastic element 2132 located between the first annular structure and the second annular structure. The outer ring elastic element 2132 may include two elastic elements, and the two first piezoelectric elements 2111 and the two second piezoelectric elements 2112 are respectively connected through two elastic elements in the outer ring elastic element 2132. In some embodiments, the outer ring elastic element 2132 can also have a certain thickness along the axis direction of the second ring structure, and the two first piezoelectric elements 2111 and the two second piezoelectric elements 2112 can pass through an outer ring elastic element. 2132 to connect.

In some embodiments, referring to Figure 21, the mass element 2120 can be located inside the second annular structure of the second piezoelectric element 2112 (as shown in Figure 21). The projection of the mass element 2120 along the axial direction is located within the projection of the second piezoelectric element 2122 along the axial direction. The mass element 2120 may be respectively connected to the two second piezoelectric elements 2112 through at least one of one or more elastic elements 2130 . For example, the elastic element 2130 may include an inner annular elastic element 2131 located between the second annular structure and the mass element 2120. The inner ring elastic element 2131 may include two elastic elements arranged along the axial direction. The mass element 2120 is connected to the two second piezoelectric elements 2112 through two elastic elements in the inner ring elastic element 2131. In some embodiments, the inner ring elastic element 2131 can also have a certain thickness along the axis direction of the first ring structure, and the mass element 2120 and the two second piezoelectric elements 2112 can be connected through an inner ring elastic element 2131.

In some embodiments, when the mass element 2120 is located inside the second piezoelectric element 2112, one end of the first piezoelectric element 2111 along the axial direction can be fixed, and the other end is connected to the second piezoelectric element 2112 through the outer ring elastic element 2132. . For example, the outer ring elastic element 2132 can also include two elastic elements arranged along the axial direction. The two first piezoelectric elements 2111 are connected to the two second piezoelectric elements 2112 through the two elastic elements in the outer ring elastic element 2132. connection. In this case, the second piezoelectric element 2112 can serve as a piezoelectric free ring, and the first piezoelectric element 2111 can serve as a piezoelectric fixed ring.

In some embodiments, the mass element 2120 may also be located outside the first annular structure of the first piezoelectric element 2111. The projection of the mass element 2120 along the axial direction is located outside the projection of the first piezoelectric element 2121 along the axial direction. The mass element 2120 may be respectively connected to the two first piezoelectric elements 2111 through at least one of one or more elastic elements 2130. For example, the mass element 2120 can be respectively connected to the two first piezoelectric elements 2111 through two elastic elements in the outer ring elastic element 2132.

In some embodiments, when the mass element 2120 is located outside the first piezoelectric element 2111, one end of the second piezoelectric element 2112 along the axial direction can be fixed, and the other end is connected to the first piezoelectric element 2111 through the inner ring elastic element 2131. . In this case, the second piezoelectric element 2112 can serve as a piezoelectric fixed ring, and the first piezoelectric element 2111 can serve as a piezoelectric free ring.

In some embodiments, the mass element 2120 may also be located between the first annular structure of the first piezoelectric element 2111 and the second annular structure of the second piezoelectric element 2112. The projection of the mass element 2120 in the axial direction is between the projections of the first piezoelectric element 2111 and the second piezoelectric element 2112 in the axial direction. The mass element 2120 can be respectively connected to the two first piezoelectric elements 2111 and the two second piezoelectric elements 2112 through one or more elastic elements 2130. For example, the mass element 2120 can be connected to the two first piezoelectric elements 2111 respectively through the outer ring elastic element 2132, and the mass element 2120 can be connected to the two second piezoelectric elements 2112 respectively through the inner ring elastic element 2131.

In some embodiments, when the mass element 2120 is located between the second piezoelectric element 2112 and the first piezoelectric element 2111, the first piezoelectric element 2111 or the second piezoelectric element 2112 has a fixed end along the axis direction. In this case, one of the first piezoelectric element 2111 and the second piezoelectric element 2112 may serve as a piezoelectric free ring, and the other may serve as a piezoelectric fixed ring.

It should be noted that when the piezoelectric element 2110 has a double-layer structure, the piezoelectric element 2110 does not need to have a fixed end along the axis direction, so that the vibration device 2100 can have better performance in bone conduction earphones where it is difficult to find a strict fixed boundary. ease of use.

In some embodiments, by arranging the first piezoelectric element 2111 and the second piezoelectric element 2112 in the vibration device 2100, the mass element 2120 and the second piezoelectric element 2112 can form an overall mass, because the overall mass is larger than the mass element. 2120 mass, thereby moving the first resonance peak of the vibration device 2100 to a low frequency. When the vibration device 2100 vibrates, the first piezoelectric element 2111 and the second piezoelectric element 2112 are connected to each other through the outer ring elastic element 2132 to form a double ring structure that resonates and can also generate a third resonance peak between the first resonance peak and the second resonance peak. The three resonance peaks can be represented in the frequency response curve of the vibration device 2100 by forming an additional resonance peak, that is, the third resonance peak, between the first resonance peak and the second resonance peak. In some embodiments, the third resonant frequency corresponding to the third resonant peak may be located between the first resonant frequency corresponding to the first resonant peak and the second resonant frequency corresponding to the second resonant peak.

It should be noted that when the piezoelectric element 2110 has a double-layer structure, the elastic element can also have a double-layer structure, and the bending directions of the two layers of elastic elements in the double-layer structure of the elastic element can be opposite. In some embodiments, the piezoelectric element can also be a multi-layered multi-ring structure, for example, a 4-layer 4-ring structure, etc. The piezoelectric element with a multi-layer multi-ring structure is similar to the piezoelectric element with a double-layer double ring structure, and will not be described in detail here.

Figure 22 is a frequency response graph of a vibration device according to some embodiments of the present specification. The curve 2210 may represent the frequency response curve of the vibration device (for example, the vibration device 1900 ) when the piezoelectric element is a double-layered single-ring structure, and the curve 2220 represents the piezoelectric element being a single-layer double-ring structure, and the first piezoelectric element Frequency response curve of a vibration device (eg, vibration device 2100 ) with a fixed end along the axis direction. In some embodiments, by arranging a piezoelectric free ring in the vibration device, a third resonance peak in addition to the first resonance peak and the second resonance peak can be formed in the frequency response curve of the vibration device. For example, comparing curve 2210 and curve 2220, curve 2220 may form a third resonance peak in addition to the first resonance peak and the second resonance peak, and the frequency of the third resonance peak is located between the frequency of the first resonance peak and the frequency of the second resonance peak. between frequencies.

Continuing to refer to Figure 22, curve 2230 represents the frequency response curve of the vibration device in which the piezoelectric element has a double-layered double-ring structure, and the first piezoelectric element has a fixed end along the axis direction. Curve 2240 represents that the piezoelectric element has a double-layered double-ring structure. , and the piezoelectric element does not have a frequency response curve of a vibration device with a fixed end along the axis direction. In some embodiments, by providing a piezoelectric element with a double-layer anti-phase vibration structure, the sensitivity of the vibration device in the audible frequency range can be improved. For example, comparing curve 2220 and curve 2230, curve 2230 is shifted upward as a whole compared to curve 2220, and the sensitivity of curve 2230 is higher than the sensitivity of curve 2220. In some embodiments, by arranging both the first piezoelectric element and the second piezoelectric element to be in a free ring state, the first piezoelectric element and the second piezoelectric element (as well as the elastic element for connection) are formed together with the mass element The overall mass thus shifts the low-frequency resonance peak of the vibrating device to the right. For example, comparing curve 2230 and curve 2240, the first resonance peak of curve 2240 is shifted to the right relative to the first resonance peak of curve 2230, thereby improving high frequency performance.

In some embodiments, when the piezoelectric elements are arranged in a double-layer structure, the structures of the two layers of piezoelectric elements may be the same. For example, the piezoelectric element may include two first piezoelectric elements arranged sequentially along the axis direction, and the structure of the two piezoelectric elements is an annular structure. In some embodiments, when the piezoelectric elements are arranged in a double-layer structure, the structures of the two layers of piezoelectric elements can also be different. For example, the piezoelectric elements of any one layer of the two layers of piezoelectric elements may have a ring structure, and the piezoelectric elements of the other layer may have a piezoelectric beam structure.

Figure 23 is an exemplary structural diagram of a vibration device according to some embodiments of the present specification. As shown in FIG. 23 , the vibration device 2300 may not only include one or more piezoelectric elements 2310 , a mass element 2320 , and one or more elastic elements 2330 , but may also include a piezoelectric beam 2340 . The piezoelectric beam 2340 may be configured to generate vibration along the axis of the annular structure of the piezoelectric element 2310 based on the electrical signal. In some embodiments, piezoelectric beam 2340 may be connected to mass element 2320. In some embodiments, the piezoelectric beam 2340 may be located on a side of the mass element 2320 away from the piezoelectric element 2310 along the axis direction of the annular structure of the piezoelectric element 2310 and connected with the mass element 2320 . In some embodiments, the piezoelectric beam 2340 may be a plate-shaped structure, and the plate surface of the plate-shaped structure (ie, the surface with the largest area) is arranged parallel to the annular end surface of the annular structure of the piezoelectric element 2310.

In some embodiments, the piezoelectric beam 2340 may include at least one first piezoelectric sheet 2341 and at least one second piezoelectric sheet 2342. The first piezoelectric sheet 2341 and the second piezoelectric sheet 2342 are respectively disposed on both sides of the piezoelectric beam 2340 along the axial direction of the annular structure of the piezoelectric element 2310 . For example, the first piezoelectric sheet 2341 can be disposed on the side of the piezoelectric beam 2340 away from the piezoelectric element 2310 along the axial direction, and the second piezoelectric sheet 2342 can be disposed on the side of the piezoelectric beam 2340 close to the piezoelectric element 2310 along the axial direction. .

In some embodiments, the polarization directions of the first piezoelectric sheet 2341 and the second piezoelectric sheet 2342 may be reversely arranged along the axis direction of the annular structure. That is, in the axial direction of the annular structure of the piezoelectric element 2310, the polarization direction of the first piezoelectric piece 2341 is opposite to the polarization direction of the second piezoelectric piece 2342. The displacement output direction of the first piezoelectric sheet 2341 and the second piezoelectric sheet 2342 may be perpendicular to their respective polarization directions. In some embodiments, the polarization direction of the first piezoelectric sheet 2341 is opposite to the polarization direction of the second piezoelectric sheet 2342, and the first piezoelectric sheet 2341 and the second piezoelectric sheet 2342 are connected to the same direction at the same time. When receiving a voltage signal, the first piezoelectric piece 2341 and the second piezoelectric piece 2342 can generate displacements in opposite directions, thereby causing the piezoelectric beam 2340 to vibrate. For example, the first piezoelectric sheet 2341 can contract in a direction perpendicular to the axis of the annular structure, and the second piezoelectric sheet 2342 can extend in a direction perpendicular to the axis of the annular structure, so that the piezoelectric beam 2340 generates an axial direction along the axis of the annular structure. vibration. In some embodiments, piezoelectric beam 2340 may be connected to mass element 2320 and output vibrations through mass element 2320. In some embodiments, the piezoelectric beam 2340 can be directly connected to the mass element 2320, such that the resonance peak of the vibration device 2300 includes a high-frequency resonance peak generated by the resonance of the piezoelectric beam 2340 (for example, the frequency range is 2kHz-20kHz), That is, the piezoelectric beam 2340 constitutes the high-frequency unit of the vibration device 2300.

In some embodiments, the structure of the elastic element 2330 in the vibration device 2300 can be a double X-shaped structure as shown in Figure 23, or other structural types with reverse symmetry, such as single X rows, parallel double Xs shape, spiral structure, etc.

Figure 24 is an exemplary structural diagram of a vibration device according to some embodiments of the present specification. The structure of the vibration device 2400 in FIG. 24 is roughly the same as the structure of the vibration device 2300 in FIG. 23 . The difference lies in the structure and number of the mass elements, and the connection method between the mass elements and the piezoelectric beam.

Referring to Figure 24, in some embodiments, the mass element may include a first mass element 2421 and a second mass element 2422. Wherein, the first mass element 2421 can be connected to the middle part of the piezoelectric beam 2340 through one or more elastic elements 2330. In some embodiments, the first mass element 2421 can also be connected to one or more piezoelectric elements 2310 through an elastic element 2330. The piezoelectric element 2310 includes an annular structure, and the vibration direction of the piezoelectric element 2310 is parallel to the axis of the annular structure. direction. In some embodiments, second mass elements 2422 may be connected to two ends of the piezoelectric beam 2340 respectively. The vibration of the vibration device 2400 can be output through the second mass element 2422 at the end of the piezoelectric beam 2340. In some embodiments, the vibration of the vibration device 2400 can also be output through the first mass element 2421. In some embodiments, the first mass element 2421 in the vibration device 2400 is connected to the piezoelectric beam 2340 through one or more elastic elements 2330 to form a low-frequency unit of the vibration device 2400, and the piezoelectric element 2310 with an annular structure can form a vibration High frequency unit of device 2400.

In some embodiments, the first mass element 2421 can also be connected to other positions of the piezoelectric beam 2340 (for example, near the end of the piezoelectric beam 2340) through one or more elastic elements 2330. In some embodiments, the two ends of the piezoelectric beam 2340 may also pass through one or more elastic elements 2330 and the second mass element 2422.

The basic concepts have been described above. It is obvious to those with ordinary knowledge in the technical field that the above detailed disclosures are only examples and do not constitute limitations to the present invention. Although not explicitly stated herein, various modifications, improvements and corrections to the present invention may be made by those skilled in the art. Such modifications, improvements, and corrections are contemplated in this invention, and so such modifications, improvements, and corrections remain within the spirit and scope of the exemplary embodiments of this invention.

At the same time, the present invention uses specific words to describe the embodiments of the present invention. For example, "one embodiment", "an embodiment", and/or "some embodiments" means a certain feature, structure or characteristic related to at least one embodiment of the present invention. Therefore, it should be emphasized and noted that “one embodiment” or “an embodiment” or “an alternative embodiment” mentioned twice or more at different places in this specification does not necessarily refer to the same embodiment. . In addition, certain features, structures or characteristics of one or more embodiments of the invention may be combined appropriately.

Furthermore, one of ordinary skill in the art will understand that aspects of the invention may be illustrated and described in several patentable categories or circumstances, including any new and useful process, machine, product, or combination of matter , or any new and useful improvements thereto. Accordingly, various aspects of the present invention may be executed entirely by hardware, may be entirely executed by software (including firmware, resident software, microcode, etc.), or may be executed by a combination of hardware and software. The above hardware or software may be called "data block", "module", "engine", "unit", "component" or "system". Additionally, aspects of the invention may be embodied as a computer product including computer-readable program code located on one or more computer-readable media.

100:Vibration device 110: Piezoelectric element 120:Quality component 130: Elastic element 200:Vibration device 210: One or more piezoelectric elements 211: First piezoelectric element 220:Quality component 230: One or more elastic elements 310: First resonance peak 320: Second resonance peak 400:Vibration device 411: First piezoelectric element 420:Quality component 430: Elastic element 401: First resonance peak 402: Second resonance peak 500:Vibration device 510: One or more piezoelectric elements 511: First piezoelectric element 512: Second piezoelectric element 520:Quality component 530: One or more elastic elements 531: First elastic element 532: Second elastic element 601: First resonance peak 602: Second resonance peak 603: The third resonance peak 604: Resonance Valley 610:Curve 620:Curve 630:Curve 640:Curve 650:Curve 700:Vibration device 710: One or more piezoelectric elements 711: First piezoelectric element 712: Second piezoelectric element 720:Quality component 730: One or more elastic elements 731: First elastic element 732: Second elastic element 801: First resonance peak 802: Second resonance peak 803: The third resonance peak 804: Resonance Valley 810:Curve 820:Curve 830:Curve 840:Curve 850:Curve 900: Vibration device 910: One or more piezoelectric elements 911: The first piezoelectric element 912: Second piezoelectric element 920:Quality component 930: One or more elastic elements 931: First elastic element 932: Second elastic element 1001: First resonance peak 1002: Second resonance peak 1003: The third resonance peak 1004: Resonance Valley 1010:Curve 1020:Curve 1030:Curve 1040:Curve 1101: First resonance peak 1102: Second resonance peak 1103: The third resonance peak 1104:Resonance Valley 1110:Curve 1120:Curve 1130:Curve 1140:Curve 1200: One or more elastic elements 1210: First bending section 1220: Second bending section 1300-1: Vibration device 1301: First axis of symmetry 1302:Second axis of symmetry 1311: First piezoelectric element 1320:Quality component 1330: Elastic element 1300-2: Vibration device 1340: Piezoelectric element 1341: Connector 1351:First quality component 1352: Second mass element 1360: Multiple elastic elements 1400-1: Vibration device 1401: First axis of symmetry 1402: Second axis of symmetry 1411: First piezoelectric element 1420:Quality component 1430: Elastic element 1400-2: Vibration device 1440: Piezoelectric element 1441: Connector 1451:First quality element 1452: Second mass element 1460: Multiple elastic elements 1400-3: Vibration device 1401:Curve 1402:Curve 1403:Curve 1500-1: Vibration device 1510: One or more piezoelectric elements 1520:Quality component 1530: Elastic element 1531:First helix structure 1532:Second helix structure 1500-2: Vibration device 1540: Multiple piezoelectric elements 1551:First quality element 1560: Elastic element 1561:First helix structure 1562:Second helix structure 1610:Curve 1620:Curve 1700:Vibration device 1710: One or more piezoelectric elements 1711:First piezoelectric element 1712: Second piezoelectric element 1720:Quality component 1730: One or more elastic elements 1731: One or more outer ring elastic elements 1732: Inner ring elastic element 1800: Vibration device 1830: Elastic element 1831: Outer ring elastic element 1832: Inner ring elastic element 1900:Vibration device 1911: The first piezoelectric element 1920: Quality components 1930: One or more elastic elements 1931: Two-layer first elastic element 2010: Upper connection surface 2020: Lower connection surface 19111: Upper layer piezoelectric element 19112:Lower piezoelectric element 2030: Upper connection surface 2040: Lower connection surface 19113: Upper layer piezoelectric element 19114:Lower piezoelectric element 2100:Vibration device 2110: One or more piezoelectric elements 2111:First piezoelectric element 2112: Second piezoelectric element 2120:Quality component 2130: Elastic element 2131: Inner ring elastic element 2132: Outer ring elastic element 2210:Curve 2220:Curve 2230:Curve 2240:Curve 2300:Vibration device 2310: One or more piezoelectric elements 2320:Quality component 2330: Elastic element 2340: Piezoelectric beam 2341:The first piezoelectric film 2342:Second piezoelectric piece 2400: Vibration device 2421:First quality component 2422: Second mass element

The invention will be further explained by way of exemplary embodiments, which are described in detail by means of the accompanying drawings. These embodiments are not limiting. In these embodiments, the same numbers represent the same structures, where:

[Fig. 1] is an exemplary module diagram of a vibration device according to some embodiments of this specification;

[Fig. 2] is an exemplary structural diagram of a vibration device according to some embodiments of this specification;

[Fig. 3] is a frequency response curve diagram of a vibration device according to some embodiments of this specification;

[Fig. 4A] is an exemplary structural diagram of a vibration device according to some embodiments of this specification;

[Fig. 4B] is a frequency response curve diagram of a vibration device according to some embodiments of this specification;

[Fig. 5] is an exemplary structural diagram of a vibration device shown according to some embodiments of this specification;

[Fig. 6] is a frequency response curve diagram of a vibration device according to some embodiments of this specification;

[Fig. 7] is an exemplary structural diagram of a vibration device according to some embodiments of this specification;

[Fig. 8] is a frequency response curve diagram of a vibration device according to some embodiments of this specification;

[Fig. 9] is an exemplary structural diagram of a vibration device according to some embodiments of this specification;

[Fig. 10] is a frequency response curve diagram of a vibration device according to some embodiments of this specification;

[Fig. 11] is a frequency response curve diagram of a vibration device according to some embodiments of this specification;

[Fig. 12] is an exemplary structural diagram of an elastic element shown according to some embodiments of this specification;

[Fig. 13A] is an exemplary structural diagram of a vibration device shown according to some embodiments of this specification;

[Fig. 13B] is an exemplary structural diagram of a vibration device shown according to some embodiments of this specification;

[Fig. 14A] is an exemplary structural diagram of a vibration device shown according to some embodiments of this specification;

[Fig. 14B] is an exemplary structural diagram of a vibration device shown according to some embodiments of this specification;

[Fig. 14C] is an exemplary structural diagram of a vibration device shown according to some embodiments of this specification;

[Fig. 14D] is a frequency response curve diagram of a vibration device according to some embodiments of this specification;

[Fig. 15A] is an exemplary structural diagram of a vibration device shown according to some embodiments of this specification;

[Fig. 15B] is an exemplary structural diagram of a vibration device shown according to some embodiments of this specification;

[Fig. 16] is an exemplary frequency response curve diagram of a vibration device according to some embodiments of this specification;

[Fig. 17] is an exemplary structural diagram of a vibration device shown according to some embodiments of this specification;

[Fig. 18] is an exemplary structural diagram of a vibration device shown according to some embodiments of this specification;

[Fig. 19] is an exemplary structural diagram of a vibration device shown according to some embodiments of this specification;

[Fig. 20A] is an exemplary circuit diagram of the first piezoelectric element shown according to some embodiments of the present specification;

[Fig. 20B] is another exemplary circuit diagram of the first piezoelectric element shown according to some embodiments of the present specification;

[Fig. 21] is an exemplary structural diagram of a vibration device shown according to some embodiments of this specification;

[Fig. 22] is a frequency response curve diagram of a vibration device according to some embodiments of this specification;

[Fig. 23] is an exemplary structural diagram of a vibration device according to some embodiments of this specification;

[Fig. 24] is an exemplary structural diagram of a vibration device shown according to some embodiments of this specification.

100:Vibration device

110: Piezoelectric element

120:Quality component

130: Elastic element

Claims (11)

A vibrating device comprising: quality components; a first piezoelectric element configured to generate vibration based on an electrical signal; One or more elastic elements connecting the mass element and the first piezoelectric element; Wherein, the one or more piezoelectric elements include a ring-shaped structure, and the direction of vibration of the first piezoelectric element based on the electrical signal is parallel to the axis direction of the ring-shaped structure. The vibration device of claim 1, wherein one end of the first piezoelectric element is fixed along the axial direction, and the mass element is connected to the first piezoelectric element through the one or more elastic elements except the one end. Connect from other locations. The vibration device of claim 2, wherein the projection of the mass element along the axial direction of the first piezoelectric element is located within the projection of the first piezoelectric element along the axial direction. The vibration device of claim 2, wherein the shape of the mass element is annular, and the projection of the mass element along the axial direction of the first piezoelectric element is located outside the projection of the first piezoelectric element along the axial direction. . The vibration device of claim 2, wherein there are multiple elastic elements connecting the mass element and the first piezoelectric element, and the plurality of elastic elements are distributed along the circumferential direction of the annular structure, and the plurality of elastic elements are The elastic elements are located in the same plane perpendicular to the axial direction of the first piezoelectric element, and the projections of the plurality of elastic elements along the axial direction of the first piezoelectric element have at least two mutually perpendicular axes of symmetry. The vibration device of claim 1, wherein the shape of the one or more elastic elements includes at least one of a polygonal shape, an S shape, a spline shape, an arc shape, and a straight line shape, and the shape of the one or more elastic elements Each of them has a plurality of bending segments, and the bending directions of the plurality of bending segments are opposite. The vibration device of claim 1, wherein the one or more elastic elements include a first helical structure and a second helical structure, the first helical structure and the second helical structure respectively connect the mass element and the The one or more piezoelectric elements; the axes of the first spiral structure and the second spiral structure are the same, and the spiral directions are opposite. The vibration device of claim 1, wherein the vibration device further includes a piezoelectric beam, the piezoelectric beam is configured to generate vibration along the axis direction of the annular structure based on an electrical signal; the piezoelectric beam is connected to the The mass element connection described above. The vibration device of claim 8, wherein the piezoelectric beam includes at least one first piezoelectric sheet and at least one second piezoelectric sheet, and the at least one first piezoelectric sheet and the at least one second piezoelectric sheet The pieces are respectively arranged on both sides of the piezoelectric beam along the axial direction of the annular structure, and the polarization directions of the at least one first piezoelectric piece and the at least one second piezoelectric piece are along the direction of the annular structure. The axis direction is reversed. The vibration device of claim 9, wherein the mass element includes a first mass element and a second mass element, and the first mass element communicates with the piezoelectric beam through at least one of the one or more elastic elements. is connected in the middle; the two ends of the piezoelectric beam are respectively connected with second mass elements. The vibration device of claim 1, wherein the one or more elastic elements and the mass element resonate to generate a first resonance peak; the first piezoelectric element resonates to generate a second resonance peak, and the second resonance peak The frequency ratio to the first resonance peak ranges from 20 to 200.

Images