TW202341103A - Detachable flexible splicing device - Google Patents

Abstract

The present invention discloses a detachable flexible splicing device, comprising a plurality of flexible boards and a plurality of adhesive members. Each flexible board includes a substrate, an electrical area, and a splicing area; the substrate defines an opposite first surface and a second surface, and the substrate and the electrical area respectively define an opposite first side and a second side; the electrical area is located on the first surface of the substrate, the second side of the electrical area is close to the second side of the substrate, and the splicing area is defined between the first side of the electrical area and the first side of the substrate. The adhesive members connect two adjacent flexible boards; wherein, at least part of the adhesive members are spaced apart from each other in the splicing area of one of the flexible boards and connected to the second surface of the other flexible board; one end of the adhesive members is protrudes from the first side of one of the substrates; wherein, two adjacent flexible boards are partially overlapped, and the other flexible board covers at least the splicing area of one of the flexible boards.

Description

Removable flexible splicing device

The present invention relates to a splicing device, and in particular to a detachable flexible splicing device.

At the end of the first quarter of 2020, after Samsung announced that it would stop producing LCD panels in October 2020, the market began to see a wave of flexible displays coming. An important feature of flexible displays is that they are easy to bend and can be used in mobile information terminals, wearable devices, and large electronic signs.

However, the manufacturing process is limited by machine equipment. When the product size of the flexible display becomes larger, the machine equipment and production difficulty required are relatively higher, and it cannot meet the diversified needs of the market. Therefore, it is necessary to use flexible displays. The panels are spliced to meet the size required by customers, while increasing the variety and diversity of flexible displays.

The purpose of the present invention is to provide a detachable flexible splicing device that can achieve seamless splicing of flexible boards through overlapping and can be infinitely extended to solve the problem of large product sizes.

In order to achieve the above object, a detachable flexible splicing device according to the present invention includes a plurality of flexible boards and a plurality of adhesive parts. Each flexible board includes a substrate, an electrical area, and a splicing area; the substrate defines an opposite first side and a second side, and the substrate and the electrical area respectively define an opposite first side and a second side. side; the electrical area is located on the first side of the substrate, the second side of the electrical area is close to the second side of the substrate, and the splicing area is defined between the first side of the electrical area and the first side of the substrate. The adhesive members connect two adjacent flexible boards; at least some of the adhesive members are spaced apart from each other in the splicing area of one of the flexible boards and connected to the second surface of the other flexible board; one end of the adhesive members It is protruding from the first side of one of the substrates; wherein two adjacent flexible boards partially overlap, and the other flexible board at least covers the splicing area of one of the flexible boards.

In one embodiment, each flexible board further includes: a plurality of ears electrically connected to the electrical area and spaced apart from each other; the ears protrude from the first side of one of the substrates, and the ears are connected to the Some adhesive parts are arranged in a staggered manner.

In one embodiment, each flexible board further includes: a plurality of ears electrically connected to the electrical area and spaced apart from each other; the ears protrude from the first side of one of the substrates, and one of the adhesive members is disposed on Between two adjacent ears.

In one embodiment, each flexible board defines a stretching direction perpendicular to the first side or the second side of the substrate; the elongation at break of each adhesive member along the stretching direction is greater than 850%.

In one embodiment, each flexible board further includes: a plurality of electronic components located in the electrical area and arranged in an array.

In one embodiment, in two adjacent flexible boards, the first row of the electronic components of one flexible board is located between the second side of the substrate of the other flexible board and the electronic components of one of the flexible boards. between the second column.

In one embodiment, among two adjacent flexible boards, the first row of the electronic components of one flexible board is covered by at least the second side of the substrate of the other flexible board.

In one embodiment, each electronic component is an optoelectronic component.

In one embodiment, each electronic component is a chip or package.

In order to achieve the above object, a detachable flexible splicing device according to the present invention includes a plurality of flexible boards and a plurality of adhesive parts. Each flexible board includes a substrate, an electrical area, and a splicing area; the substrate defines an opposite first side and a second side, and the substrate and the electrical area respectively define an opposite first side and a second side. side; the electrical area is located on the first side of the substrate, the second side of the electrical area is close to the second side of the substrate, and the splicing area is defined between the first side of the electrical area and the first side of the substrate. The adhesive members connect two adjacent flexible boards; at least some of the adhesive members are spaced apart from each other in the splicing area of one of the flexible boards and connected to the second surface of the other flexible board; one end of the adhesive members Protruding from the first side of one of the substrates; the adhesive force of the adhesive members is greater than the adhesiveness; wherein, when splicing, two adjacent flexible boards partially overlap, and the other flexible board covers at least one of the flexible boards The splicing area; during disassembly, each adhesive piece is completely separated from the two adjacent flexible boards.

Based on the above, in the detachable flexible splicing device of the present invention, two adjacent flexible boards are connected through a plurality of adhesive members; at least some of the adhesive members are spaced apart from each other in the splicing area of one of the flexible boards. And connected to the second side of another flexible board, and one end of the adhesive parts is exposed from the first side of one of the substrates, and two adjacent flexible boards partially overlap, and the other flexible board covers at least one of the flexible boards Due to the structural design of the splicing area, the present invention allows users to achieve seamless splicing of multiple flexible boards through the overlapping of adhesive parts according to their required sizes, and can be infinitely extended to solve the problem of large product sizes.

The following will describe a detachable flexible splicing device according to some embodiments of the present invention with reference to the relevant drawings, where the same elements will be described with the same reference numerals.

The dimensions (length, width or height) and proportions of components, units or devices appearing in the following drawings only illustrate the mutual relationship between components, units or devices and have nothing to do with the actual dimensions and proportions.

FIG. 1A is an exploded schematic view of a detachable flexible electronic device according to an embodiment of the present invention when viewed from above. FIG. 1B is a partially enlarged schematic view of the flexible electronic device of FIG. 1A . FIG. 1C is a schematic view of the flexible electronic device of FIG. 1A when viewed from above. 1D is a three-dimensional exploded schematic diagram of a flexible electronic device according to an embodiment of the present invention, and FIG. 1E is a side-view exploded schematic diagram of a flexible electronic device according to an embodiment of the present invention.

The detachable flexible splicing device of the present invention (hereinafter referred to as the flexible splicing device) includes a plurality of flexible plates and a plurality of adhesive parts. The flexible boards are spliced through the adhesive parts to form a flexible splicing device; after disassembly, each adhesive part can be completely separated from the flexible board without leaving any adhesive residue, which is convenient for re-processing and reuse.

Referring to FIGS. 1A to 1E , the detachable flexible splicing device 1 of this embodiment (hereinafter referred to as the flexible splicing device 1 ) includes two or more flexible plates 11 a and 11 b and a plurality of adhesive members 12 . These adhesive members 12 connect two adjacent flexible boards 11a and 11b. At least part of the adhesive members 12 are spaced apart from each other on one of the flexible boards 11b and connected to the other flexible board 11a. In addition, one end of the adhesive member 12 is exposed. On the side of one of the substrates 11b, and two adjacent flexible boards 11a and 11b partially overlap, another flexible board 11a covers at least a part of one of the flexible boards 11b. Of course, it is not limited to this. In different embodiments, more flexible boards can be seamlessly spliced through overlapping adhesive parts to solve the problem of product size requirements. Detailed implementation examples are described below.

Each flexible board 11a, 11b is a flexible circuit board, which may include a substrate 111a, 111b, an electrical area 112a, 112b, and a splicing area 113a, 113b respectively. The substrates 111a and 111b are made of light-transmissive or light-impermeable materials, such as but not limited to polyethylene terephthalate (PET), polycarbonate (PC), polyimide ( Polyimide (PI), or cyclic olefin polymer (COP), or other materials, or any combination of the foregoing materials. The material of the substrates 111a and 111b in this embodiment is PI as an example.

Each of the substrates 111a and 111b can respectively define an opposite first surface P1 and a second surface P2 (Fig. 1E). The first surface P1 is the upper surface and the second surface P2 is the lower surface. The electrical region 112a is located on the first surface P1 of the substrate 111a, and the electrical region 112b is located on the first surface P1 of the substrate 111b. Each of the substrates 111a, 111b and the electrical regions 112a, 112b can respectively define an opposite first side and a second side, and the first side is substantially parallel to the second side. In this embodiment, the substrate 111a has a first side S11a (left side in Figure 1E) and a second side S12a (right side in Figure 1E). The first side S11a is substantially parallel to the second side S12a; the electrical region 112a has a first side S11a' and a second side S12a', and the first side S11a' is substantially parallel to the second side S12a'; the substrate 111b has a first side S11b (left side in Figure 1E) and a second side Side S12b (right side of Figure 1E), the first side S11b is substantially parallel to the second side S12b; the electrical region 112b has a first side S11b' and a second side S12b', the first side S11b' is substantially Parallel to the second side S12b'. The second side S12a' of the electrical region 112a of the flexible board 11a is close to (close to or coincident with) the second side S12a of the substrate 111a, and the first side S11a' of the electrical region 112a is connected to the first side S11a of the substrate 111a. The splicing area 113a is defined between them; the second side S12b' of the electrical area 112b of the flexible board 11b is close to (close to or coincident with) the second side S12b of the substrate 111b, and the first side S11b' of the electrical area 112b is A splice area 113b is defined between the first sides S11b of the substrate 111b.

A plurality of adhesive members 12 connect two adjacent flexible boards 11a and 11b; in this embodiment, at least some of the adhesive members 12 are spaced apart from each other in the splicing area 113a of the flexible board 11a and connected to the second surface of the flexible board 11b. P2, and one end E1 of the adhesive member 12 is exposed from the first side S11a of the substrate 111a. In addition, two adjacent flexible boards 11a and 11b partially overlap, and the flexible board 11b at least covers the splicing area 113a of the flexible board 11a. As shown in Figure 1E, the flexible board 11b of this embodiment just covers the splicing area 113a of the flexible board 11a (the second side S12b is aligned with the first side S11a').

Each adhesive member 12 has a body 121, and the body 121 has adhesiveness. Each flexible board 11a, 11b defines a stretching direction D (Fig. 1E). The stretching direction D is substantially perpendicular to the first side S11a, S11b or the second side S12a, S12b of the substrate 111a or 111b, and each adhesive member The percentage of elongation at break (percentage of elongation) of 12 (body 121) along the tensile direction D is preferably greater than 850%. The reason is that the adhesive member 12 (body 121) will begin to shrink when it is stressed along the tensile direction D. The adhesive part 12 (body 121) reduces its overall bonding area with the adhered surface due to the necking phenomenon until it is separated from the adhered surface. Therefore, when the elongation at break of the adhesive part 12 (body 121) is greater than 850%, the adhesive After the component 12 (body 121) is stressed along the tensile direction D, it can be extended and not easily broken, and can be completely detached from the surface to which it is adhered; the so-called "necking phenomenon" means that the adhesive component 12 (body 121) is stretched along the vertical direction. The cross section in the direction of extension direction D becomes narrower. In addition, the adhesion retention (adhesion retention) of each adhesive member 12 (body 121) of this embodiment is not less than its viscosity. Therefore, when it is removed, the adhesive member 12 has sufficient adhesion and the overall viscosity gradually decreases when it is removed. This makes it less likely to leave residual glue when detached; the so-called "adhesion force" refers to the force that the materials contained in the colloid are fixed to each other and remain in place when the adhesive part 12 (body 121) is stressed. It should be noted that Remaining stable means that the colloid does not deform. Therefore, when splicing this case, two adjacent flexible boards 11a and 11b partially overlap, and the flexible board 11b covers the splicing area 113a of the flexible board 11a; and when disassembling, each adhesive member 12 can be completely separated from the two adjacent flexible boards 11a and 11b. There will be no residual glue left on the flexible boards 11a and 11b, which facilitates the reuse of the two flexible boards 11a and 11b. In some embodiments, each adhesive member 12 further has an application portion 122 disposed on one side of the body 121; in some embodiments, the body 121 and the application portion 122 of each adhesive member 12 can be integrally formed; in some embodiments, In embodiments, the application part 122 is anti-sticky and does not have tackiness, which facilitates the user to take the adhesive member 12 through the application part 122; in some embodiments, the body 121 of each adhesive member 12 and the application part A boundary line L can be defined between 122, and the boundary line L can be substantially parallel to the first side S11a of the substrate 111a; in some embodiments, the cross-sections of the body 121 and the application portion 122 of each adhesive member 12 are at non-intersections. They may be the same or different; in some embodiments, the adhesive members 12 may have the same or different configurations, and the configurations of the body 121 and the application part 122 may also be the same or different. It can be deduced from this that the structure and shape of the adhesive member 12 are not limited, and the form and method of attaching the flexible boards 11a and 11b are also not limited. The adhesive member 12 can connect two adjacent flexible boards 11a and 11b.

Please refer to FIGS. 1A to 1D again. Each flexible board 11a and 11b may further include a plurality of ears 13 that are electrically connected to the electrical areas 112a and 112b and spaced apart from each other (the ears are not shown in FIG. 1E ); each ear is 13 may be, for example, but not limited to, a Flexible Printed Circuit (FPC), which is protruding from the first side S11a of the substrate 111a, and the ears 13 and the adhesive members 12 are arranged in a staggered manner. Here, "staggered arrangement" means that an adhesive member 12 can be arranged between two ears 13 (Fig. 1A); or, an adhesive member 12 can be arranged between two or more ears 13. (That is, there are no adhesive members 12 between some ears 13 ), as long as multiple flexible boards can be spliced through the adhesive members 12 to form the flexible splicing device 1 . The adhesive member 12 of this embodiment is disposed between two adjacent ears 13 (that is, the adhesive member 12 avoids the position of the ears 13 and does not overlap with the ears 13); however, it is not limited to this. , in different embodiments, the adhesive member 12 may also partially overlap the ear portion 13, as long as it does not affect the function of the ear portion 13 (FPC). It is worth noting that the ear portion 13 can be an electrical base material with the electrical regions 112a and 112b extending integrally, or an electrical substrate added to a flexible board; in addition, the ear portion 13 can be understood as a flexible circuit board, but Not limited to this.

The flexible splicing device 1 of this embodiment is, for example, but not limited to, a flexible display. The flexible boards 11a and 11b are flexible circuit boards, and the electrical areas 112a and 112b include the display areas of the flexible boards 11a and 11b. In some embodiments, each of the flexible boards 11a and 11b may further include a plurality of electronic components 14 corresponding to the electrical regions 112a and 112b and arranged in an array (which may be a one-dimensional or two-dimensional array). As shown in FIG. 1D , the electronic components 14 are arranged in a matrix in a two-dimensional array. Here, the electronic components 14 of each flexible board 11a, 11b may include multiple columns of electronic components 14 respectively. Among them, the electronic components 14 of each flexible board 11a, 11b, counting from the first sides S11a, S11b of the substrates 111a, 111b to the second sides S12a, S12b, have a first row R1 (electronics) in sequence. components 14), the second column R2 (electronic components 14), the third column R3 (electronic components 14), ..., and the extending directions of the electronic components 14 in each column are substantially parallel to the first sides S11a and S11b respectively.

In some embodiments, each electronic component 14 may be an optoelectronic component or a non-optoelectric component. Optoelectronic components are used as examples below. Each electronic component 14 may be a chip or package, such as an optoelectronic chip or optoelectronic package; in some embodiments, each electronic component 14 may be a millimeter- or micron-scale optoelectronic chip or optoelectronic package; in some embodiments, , each electronic component 14 may include, for example but not limited to, at least one light emitting diode chip (LED chip), milli light emitting diode chip (Mini LED chip), micro light emitting diode chip (Micro LED chip) or at least one package. components, or optoelectronic chips or optoelectronic packages with no size limit on millimeter level, micron level or below. Among them, millimeter-level packages may include micron-level wafers. In some embodiments, the electronic component 14 may be understood as a single pixel or include multiple pixels. In some embodiments, the electronic component 14 may include, for example, red, blue, or green LEDs, Mini LEDs, or Micro LED wafers, or LEDs, Mini LEDs, or Micro LED wafers or packages of other colors. When the multiple optoelectronic chips or packages included in the electronic component 14 are respectively red, blue and green LED, Mini LED, or Micro LED chips, the flexible board can be used to form a full-color LED, Mini LED, or micro LED display.

In some embodiments, the electronic component 14 may include a wafer of horizontal electrodes, flip-chip electrodes, or vertical electrodes, and may be disposed on the substrates 111 a and 111 b by wire bonding or flip chip bonding. superior.

In some embodiments, the aforementioned packages are not limited to packages with active components or passive packages without active components. Active components include, but are not limited to, thin film transistors (TFTs), silicon integrated circuits (Silicon ICs), Or non-Silicon IC. In some embodiments, each flexible board 11a, 11b may further include one or more active components corresponding to at least one of the aforementioned electronic components 14, such as but not limited to thin film transistors or active components based on the above examples. In some embodiments, the electronic component 14 itself can also be a driving component, and the driving component can include at least one thin film transistor, silicon semiconductor, or an integrated circuit (IC) based on non-silicon integrated circuits for driving other components or packages.

Although the flexible splicing device 1 of this embodiment includes two flexible boards 11a and 11b as an example, it can be understood that the number of flexible boards is not limited to this. The user can adjust the size of the flexible boards through the adhesive according to their required size. The 12-inch overlap enables the seamless splicing of more flexible boards, which can be infinitely extended to solve product size problems, while improving the consistency of appearance and reducing the cost of manufacturing equipment.

2A and 2B are respectively an exploded schematic side view of a flexible splicing device according to different embodiments of the present invention.

As shown in FIG. 2A , the flexible splicing device 1a of this embodiment is substantially the same as the flexible splicing device 1 of the previous embodiment in terms of component composition and connection relationship of each component. The difference is that in the area where the two adjacent flexible boards 11a and 11b of the flexible splicing device 1a of this embodiment are connected by the adhesive member 12, the first row R1 of the electronic components 14 of the flexible board 11a It is located between the second side S12b of the substrate 111b of the flexible board 11b and the second row R2 of the electronic components 14 of the flexible board 11a.

In addition, as shown in FIG. 2B , the flexible splicing device 1 b of this embodiment is substantially the same as the flexible splicing device 1 of the previous embodiment in terms of component composition and connection relationship of each component. The difference is that in the area where the two adjacent flexible boards 11a and 11b of the flexible splicing device 1b of this embodiment are connected by the adhesive member 12, the first row R1 of the electronic components 14 of the flexible board 11a It is at least covered by the second side S12b of the base plate 111b of the flexible board 11b.

To sum up, in the detachable flexible splicing device of the present invention, two adjacent flexible boards are connected through a plurality of adhesive members; at least some of the adhesive members are spaced apart from each other in the splicing area of one of the flexible boards. And connected to the second side of another flexible board, and one end of the adhesive parts is exposed from the first side of one of the substrates, and two adjacent flexible boards partially overlap, and the other flexible board covers at least one of the flexible boards Due to the structural design of the splicing area, the present invention allows users to achieve seamless splicing of multiple flexible boards through the overlapping of adhesive parts according to their required sizes, and can be infinitely extended to solve the problem of large product sizes. In addition, the present invention can also improve the consistency of appearance and reduce the cost of manufacturing equipment. After disassembly, each adhesive part can be completely separated from the flexible board without leaving any residual glue, which is convenient for re-processing and reuse, or can provide customized products. Size flexible splicing device and other advantages.

The above is only illustrative and not restrictive. Any equivalent modifications or changes that do not depart from the spirit and scope of the present invention shall be included in the appended patent scope.

1,1a,1b: Flexible splicing device 11a,11b: Flexible board 111a,111b:Substrate 112a,112b: Electrical area 113a,113b: splicing area 12: Adhesive parts 121:Ontology 122:Building Ministry 13: Ears 14: Electronic components D: Stretching direction E1: end L: boundary P1: First side P2: Second side R1: first column R2: second column R3: The third column S11a, S11a’, S11b, S11b’: first side S12a, S12a’, S12b, S12b’: second side

1A is an exploded schematic top view of a detachable flexible electronic device according to an embodiment of the present invention. FIG. 1B is a partially enlarged schematic diagram of the flexible electronic device of FIG. 1A . FIG. 1C is a schematic diagram of the flexible electronic device in FIG. 1A when viewed from above. FIG. 1D is a three-dimensional exploded schematic diagram of a flexible electronic device according to an embodiment of the present invention. 1E is an exploded schematic side view of a flexible electronic device according to an embodiment of the present invention. 2A and 2B are respectively an exploded schematic side view of a flexible splicing device according to different embodiments of the present invention.

1: Flexible splicing device

11a,11b: Flexible board

111a,111b:Substrate

112a,112b: Electrical area

113a,113b: splicing area

12: Adhesive parts

121:Ontology

122:Building Ministry

14: Electronic components

D: Stretching direction

E1: end

L: boundary

P1: First side

P2: Second side

S11a, S11a’, S11b, S11b’: first side

S12a, S12a’, S12b, S12b’: second side

Claims (10)

A detachable flexible splicing device including: A plurality of flexible boards; each flexible board includes a substrate, an electrical area, and a splicing area; the substrate defines an opposite first side and a second side, and the substrate and the electrical area respectively define an opposite side A first side and a second side; the electrical region is located on the first side of the substrate, the second side of the electrical region is close to the second side of the substrate, and the electrical region The splicing area is defined between the first side and the first side of the substrate; and A plurality of adhesive members connect two adjacent flexible boards; wherein, at least some of the adhesive members are spaced apart from each other in the splicing area of one of the flexible boards and connected to the second surface of the other flexible board; One end of the adhesive members protrudes from the first side of one of the substrates; Wherein, two adjacent flexible boards partially overlap, and the other flexible board at least covers the splicing area of one of the flexible boards. The flexible splicing device of claim 1, wherein each flexible board further includes: a plurality of ears electrically connected to the electrical area and spaced apart from each other; the ears protrude from the third of one of the substrates. On one side, the ears and the adhesive parts are arranged in a staggered manner. The flexible splicing device of claim 1, wherein each flexible board further includes: a plurality of ears electrically connected to the electrical area and spaced apart from each other; the ears protrude from the third of one of the substrates. One side is provided with one of the adhesive parts between two adjacent ears. The flexible splicing device according to claim 1, wherein each flexible plate defines a stretching direction that is perpendicular to the first side or the second side of the substrate; each adhesive member extends along the The elongation at break in the tensile direction is greater than 850%. The flexible splicing device according to claim 1, wherein each flexible board further includes: a plurality of electronic components located in the electrical area and arranged in an array. The flexible splicing device according to claim 5, wherein among the two adjacent flexible boards, the first row of the electronic components of one of the flexible boards is located on the second side of the substrate of the other flexible board. between the edge and the second row of the electronic components of one of the flexible boards. The flexible splicing device as claimed in claim 5, wherein in two adjacent flexible boards, the first row of the electronic components of one of the flexible boards is at least connected to the second row of the substrate of the other flexible board. Covered on the sides. The flexible splicing device according to claim 5, wherein each of the electronic components is an optoelectronic component. The flexible splicing device according to claim 5, wherein each of the electronic components is a chip or a package. A detachable flexible splicing device including: A plurality of flexible boards; each flexible board includes a substrate, an electrical area, and a splicing area; the substrate defines an opposite first side and a second side, and the substrate and the electrical area respectively define an opposite side A first side and a second side; the electrical region is located on the first side of the substrate, the second side of the electrical region is close to the second side of the substrate, and the electrical region The splicing area is defined between the first side and the first side of the substrate; and A plurality of adhesive members connect two adjacent flexible boards; wherein, at least some of the adhesive members are spaced apart from each other in the splicing area of one of the flexible boards and connected to the second surface of the other flexible board; One end of the adhesive members protrudes from the first side of one of the substrates; the adhesive force of the adhesive members is greater than the stickiness; Wherein, during splicing, two adjacent flexible boards partially overlap, and the other flexible board at least covers the splicing area of one of the flexible boards; During disassembly, each adhesive member is completely separated from two adjacent flexible boards.

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