TW202338341A - Piping life prediction method - Google Patents
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- 238000000034 method Methods 0.000 title claims abstract description 74
- 239000012530 fluid Substances 0.000 claims abstract description 15
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 9
- 239000010935 stainless steel Substances 0.000 claims abstract description 9
- 238000012360 testing method Methods 0.000 claims description 53
- 238000005498 polishing Methods 0.000 abstract description 12
- 238000001514 detection method Methods 0.000 description 15
- 230000003287 optical effect Effects 0.000 description 7
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- 238000007689 inspection Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000001066 destructive effect Effects 0.000 description 3
- 238000000399 optical microscopy Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000008119 colloidal silica Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
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- 230000002123 temporal effect Effects 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
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- 230000000737 periodic effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
Description
本揭露係關於配管之壽命預測方法。 本申請案是主張基於2022年3月30日於日本申請之日本特願2022-055622號的優先權,並將其內容援用於此。 This disclosure is about the life prediction method of piping. This application claims priority based on Japanese Patent Application No. 2022-055622 filed in Japan on March 30, 2022, and the content is incorporated herein by reference.
在鍋爐等中之供高溫流體流過的配管,會受到高溫流體之壓力及熱的影響。因此,為了將配管在適切的時機進行維護,是預測直到在配管產生潛變損傷等而使配管變得無法使用為止之配管壽命。關於配管壽命的預測,可採用各種的非破壞性檢驗手法。The piping through which high-temperature fluid flows in boilers, etc. is affected by the pressure and heat of the high-temperature fluid. Therefore, in order to maintain the piping at an appropriate time, it is necessary to predict the piping life until creep damage or the like occurs in the piping and the piping becomes unusable. Regarding the prediction of piping life, various non-destructive inspection methods can be used.
作為如此般非破壞檢驗手法之一,例如在專利文獻1揭示對配管之對象部位進行基於超音波探傷等之探傷檢查。As one of such non-destructive inspection methods, for example,
又作為其他的非破壞檢驗手法,有一種量測配管外徑的手法。該手法著眼於經長期間使用後的配管受到壓力及熱的影響會以膨出的方式產生變形,藉由量測配管外徑來掌握配管表面的膨出,而推定配管之壽命。 [先前技術文獻] [專利文獻] As another non-destructive inspection method, there is a method of measuring the outer diameter of piping. This method focuses on the fact that piping will be deformed by bulging due to the influence of pressure and heat after long-term use. By measuring the outer diameter of the piping, the bulging on the surface of the piping is understood, and the life of the piping can be estimated. [Prior technical literature] [Patent Document]
[專利文獻1] 日本特開2021-6801號公報[Patent Document 1] Japanese Patent Application Laid-Open No. 2021-6801
[發明所欲解決之問題][Problem to be solved by the invention]
然而,採用了高溫下的強度高之材料等之配管,可測定的程度之外徑變化是在配管的壽命之後期到末期。因此,在量測配管外徑的手法,難以更早掌握配管的壽命。However, for piping made of materials with high strength at high temperatures, the measurable change in outer diameter occurs late to the end of the life of the piping. Therefore, it is difficult to grasp the life of the pipe earlier by measuring the outer diameter of the pipe.
本揭露是為了提供可更早預測配管壽命的配管之壽命預測方法。 [解決問題之技術手段] The purpose of this disclosure is to provide a pipe life prediction method that can predict the pipe life earlier. [Technical means to solve problems]
本揭露的配管之壽命預測方法,係供高溫流體流過且由不鏽鋼所形成的配管之壽命預測方法,係包含:將前述配管的表面進行研磨之工序、從研磨後之前述配管的前述表面採取複製樣本之工序、將前述複製樣本利用掃描型電子顯微鏡或雷射顯微鏡進行觀察並取得前述複製樣本中之微孔洞的產生量之工序、以及根據前述微孔洞的產生量來預測前述配管的使用壽命之工序。 [發明之效果] The disclosed method of predicting the life of pipes is a method of predicting the life of pipes made of stainless steel through which high-temperature fluids flow. The method includes: a process of grinding the surface of the pipe, and sampling from the surface of the pipe after grinding. The process of copying a sample, the process of observing the copied sample using a scanning electron microscope or a laser microscope and obtaining the amount of microvoids produced in the copied sample, and predicting the piping based on the amount of microvoids produced. The process of service life. [Effects of the invention]
依據本揭露的配管之壽命預測方法,可更早預測配管的壽命。According to the piping life prediction method disclosed in the present disclosure, the piping life can be predicted earlier.
以下,參照所附圖式來說明用於實施本揭露的配管之壽命預測方法的形態。但本揭露並不僅限定於該實施形態。Hereinafter, a mode for implementing the pipe life prediction method of the present disclosure will be described with reference to the attached drawings. However, the present disclosure is not limited to this embodiment.
(配管)
本實施形態的配管之壽命預測方法,是預測供高溫流體流過的配管之壽命。如圖1所示般,作為壽命的預測對象之配管1,其剖面呈圓環狀,是朝延伸方向連續地呈筒狀延伸。配管1應用於供作為高溫流體之鍋爐等的高溫蒸氣流過的機器。配管1應用於例如發電廠。配管1是由縱使曝露於高溫蒸氣也不容易腐蝕的不鏽鋼所形成。配管1是例如由外徑30mm~40mm左右、壁厚3mm~4mm左右之高強度不鏽鋼所形成的管材。配管1受到在配管1內流動之高溫流體的熱及壓力的影響。
(Piping)
The piping life prediction method of this embodiment predicts the life of piping through which high-temperature fluid flows. As shown in FIG. 1 , the
本案發明人等發現,在如此般供高溫流體流過且由不鏽鋼所形成的配管1中,比起產生潛變損傷等而到達配管1壽命的時期,在更早的時期就有微孔洞101在配管1的表面產生。在此,微孔洞是指壽命中期以後所產生之1nm~1μm的極小缺陷。以下,在本說明書將這個尺寸的缺陷稱為「微孔洞」。The inventors of the present invention discovered that in the
具體而言,如圖2所示般,本案發明人等發現到,當將開始使用配管1到產生潛變損傷等而到達配管1壽命的期間設為100%的情況,迄壽命比50%為止,在配管1不會產生孔洞。然後,隨著時間經過,若壽命比成為60%左右,在配管1中,在朝向徑方向Dr的外側Dro之表面1f的附近,開始產生微孔洞101。進一步隨著時間經過,在壽命比80%左右的階段,會產生比微孔洞101更大的孔洞102,產生孔洞102的範圍也從表面1f往徑方向Dr的內側Dri擴大。進一步隨著時間經過,在壽命比90%左右的階段,複數個孔洞102相連結而導致微裂縫103的產生。如此般,在產生了許多個孔洞102、微裂縫103的階段(例如壽命比80%、90%),配管1的外徑才會開始產生可測定的程度之變化。另一方面,在僅產生了微孔洞101的階段(例如壽命比60%),配管1的外徑無法產生可測定的程度之變化。Specifically, as shown in FIG. 2 , the inventors of the present invention found that when the period from the start of use of the
在此,以往利用光學顯微鏡、超音波探傷可偵測之孔洞大小是例如0.2μm以上。如圖3所示般,在壽命比80%左右的階段之孔洞102的大小為1μm~20μm左右,基於光學顯微鏡的觀察可偵測孔洞102的產生。相對於此,在壽命比60%左右的階段所產生之微孔洞101的大小為1nm~1.0μm,基於光學顯微鏡的觀察難以偵測微孔洞101。因此,以往是認為,直到配管1的外徑開始產生可測定的程度之變化為止,在配管1的內部沒有產生可確認的損傷。然而,本案發明人等發現,比起基於光學顯微鏡的觀察或基於超音波探傷的探傷檢查可偵測的大小之孔洞102產生的時期,在更早期就已經產生了微孔洞101。Here, in the past, the hole size that could be detected using optical microscopes and ultrasonic flaw detection was, for example, 0.2 μm or more. As shown in FIG. 3 , the size of the
(配管之壽命預測方法)
在以下所示之本實施形態的配管之壽命預測方法S10,是偵測難以用光學顯微鏡偵測之微孔洞101的產生,藉此預測配管1的壽命。如圖4所示般,配管之壽命預測方法S10包含:研磨配管之工序S11、採取複製樣本之工序S12、取得微孔洞的產生量之工序S13、預測配管的使用壽命之工序S14、及作成主資料之工序S21。
(Piping life prediction method)
In the pipe life prediction method S10 of this embodiment shown below, the life of the
在研磨配管之工序S11,是將配管1的表面1f實施研磨。配管1的表面1f之研磨,較佳為採用:可抑制在表面1f所析出的析出物之脫落並使微孔洞101的偵測成為可能之手法。如此般配管1的表面1f之研磨,例如可採用:使用膠體二氧化矽的CMP(Chemical Mechanical Polishing,化學機械研磨)、使用草酸的電解研磨。In the pipe polishing step S11, the
在採取複製樣本之工序S12,是從研磨後的配管1之表面1f採取複製樣本。複製樣本是以不破壞研磨後之配管1的方式進行採取。複製樣本是利用公知的複製法(replica method)來採取。例如,在配管1的表面1f塗布液狀的樹脂,讓樹脂硬化,藉此獲得轉印有配管1的表面1f之複製樣本。又在配管1的表面1f將固體聚合物進行加熱加壓成型,藉此也能獲得轉印有配管1的表面1f之複製樣本。若從研磨後之配管1的表面採取複製樣本,當在配管1的表面1f產生了微孔洞101的情況,微孔洞101會轉印到複製樣本。In the process of collecting the replica sample S12, the replica sample is collected from the
在取得微孔洞的產生量之工序S13,是將在工序S12所採取的複製樣本利用掃描型電子顯微鏡(SEM)或雷射顯微鏡進行觀察,藉此取得複製樣本中之微孔洞的產生量。利用掃描型電子顯微鏡或雷射顯微鏡,可充分地觀察上述般大小的微孔洞101。圖5係將複製樣本利用掃描型顯微鏡進行觀察而得之觀察影像的例子。為了做比較,圖6係將實際的配管1的表面1f利用掃描型顯微鏡進行觀察而得之觀察影像的例子。如圖5及圖6所示般,藉由將如上述般獲得之複製樣本利用掃描型電子顯微鏡或雷射顯微鏡進行觀察,可觀察到與實際的配管1相同之微孔洞101的產生。在工序S13,作為複製樣本中之微孔洞101的產生量,例如是取得每單位面積之微孔洞101的個數、即孔洞個數密度。In step S13 of obtaining the amount of microvoids, the replicated sample taken in step S12 is observed using a scanning electron microscope (SEM) or a laser microscope, thereby obtaining the amount of microvoids in the replicated sample. .
在預測配管的使用壽命之工序S14,是根據在工序S13所取得之微孔洞的產生量來預測配管1的使用壽命。在本實施形態的工序S14,是將在工序S13所取得之微孔洞的產生量、和表示微孔洞的產生量與配管1的使用壽命之相關性的資料做比較,藉此預測配管1的使用壽命。在工序S14,藉由將實際的配管1中之微孔洞101的產生狀態(產生量)和後述主資料做比較,藉此預測實際的配管1之使用壽命。具體而言,在包含於主資料之複數個資料當中,確定使在工序S13所取得之微孔洞101的產生量與實際的配管1中之微孔洞101的產生狀態(產生量)最接近的資料。然後,取得與所確定的資料相關聯之使用壽命來作為配管1的使用壽命。In the step S14 of predicting the service life of the pipe, the service life of the
當在工序S14使用主資料的情況,是在實施預測配管1的使用壽命之工序S14之前,先實施工序S21來作成主資料。在作成主資料之工序S21,是作成在預測配管1的使用壽命之工序S14所使用的主資料。主資料,不是使用實際的配管1,而是使用模擬配管1的試驗體所作成。這時,是使用模擬不同使用狀態的複數個配管1之複數個試驗體。試驗體具有與配管1相同的材質、徑尺寸及壁厚。對複數個試驗體進行潛變試驗並觀察,藉此取得作成主資料所需的資料。When the master data is used in step S14, the step S21 is first executed to create the master data before the step S14 of predicting the service life of the
作為對試驗體進行的試驗,是模擬讓高溫流體流過,進行既定的溫度及施加了應力之潛變試驗。這時,例如,將從試驗開始起的經過時間分成複數個不同階段,觀察在各階段之試驗體的表面之微孔洞101的產生狀態。進而,改變試驗時的溫度、施加的應力,觀察在各階段之試驗體的表面之微孔洞101的產生狀態。直到試驗體最終因潛變損傷而斷裂為止持續進行試驗。藉此,利用模擬不同使用狀態之複數個配管1之複數個試驗體來實施試驗。The test performed on the test body is a creep test that simulates the flow of a high-temperature fluid at a predetermined temperature and applies stress. At this time, for example, the elapsed time from the start of the test is divided into a plurality of different stages, and the occurrence state of the
又對試驗體進行的試驗,較佳為在比流過實際的配管1之高溫流體的溫度及應力更嚴苛的條件下實施。藉此,可在更短的時間作成主資料。Furthermore, the test performed on the test body is preferably conducted under conditions of temperature and stress that are more severe than those of the high-temperature fluid flowing through the
在試驗體的觀察時,首先利用與研磨配管之工序S11相同的研磨法來研磨試驗體的表面。然後,與採取複製樣本之工序S12同樣的,取得試驗體的表面之複製樣本。接著,與取得微孔洞101的產生量之工序S13同樣的,將所獲得的試驗體之複製樣本利用掃描型電子顯微鏡或雷射顯微鏡進行觀察,取得複製樣本中之微孔洞101的產生量。如此,從模擬不同使用狀態之複數個配管1之複數個試驗體的表面,取得複數個複製樣本的資料。又例如根據從各試驗體之試驗開始起之觀察時的經過時間T、和從試驗開始到斷裂為止的經過時間Tb,算出各試驗體的壽命比(T/Tb)。觀察時的經過時間T,是取得了複製樣本的時機,是取得了微孔洞101的產生量的時機。而且,按照壽命比(T/Tb)而從試驗體的表面取得複製樣本。藉此,取得試驗體中之微孔洞101的產生量之歷時變化資料。亦即,取得微孔洞101的產生量之歷時變化、和直到斷裂為止的經過時間(壽命)之相關關係來作為主資料。When observing the test object, first, the surface of the test object is polished using the same polishing method as in step S11 of polishing the pipe. Then, similarly to the step S12 of obtaining the replica sample, a replica sample of the surface of the test object is obtained. Next, similar to the step S13 of obtaining the amount of
圖7係顯示在上述工序S21作成主資料時之試驗體的具體條件之一例。如圖7所示般,例如在750℃並將61MPa施加於試驗體的狀態下進行潛變試驗。從試驗開始起每經過1000小時將試驗中斷,從試驗體的表面採取複製樣本,利用雷射顯微鏡進行複製樣本的狀態(試驗體的表面狀態)之觀察。試驗體,在試驗開始後之11911小時因潛變損傷而斷裂。因此,讓在斷裂前之從試驗開始起之7000小時、8000小時、9000小時之微孔洞101的產生量和壽命比相關聯來作成主資料。FIG. 7 shows an example of the specific conditions of the test object when the master data is created in the above-mentioned step S21. As shown in FIG. 7 , for example, a creep test is performed at 750° C. and 61 MPa is applied to the test body. The test is interrupted every 1000 hours from the start of the test, a replica sample is taken from the surface of the test object, and the state of the replica sample (surface condition of the test object) is observed using a laser microscope. The test body broke due to creep damage 11911 hours after the start of the test. Therefore, the master data is created by correlating the generation amount of
又圖7只不過是作成主資料時之試驗體的具體條件之一例,實際上是按照使壽命延長之配管1的種類、所使用的環境,來適宜地選擇作成主資料時之試驗體的試驗條件。In addition, Figure 7 is only an example of the specific conditions of the test body when creating the master data. In fact, it is a test in which the test body when creating the master data is appropriately selected according to the type of
如此般,將所取得的微孔洞101之產生量和主資料做比較來預測配管1的使用壽命。In this way, the obtained production amount of
(作用效果)
在上述構成的配管之壽命預測方法S10,是將配管1的表面1f實施研磨,並從研磨後之配管1的表面採取複製樣本。當在配管1的表面1f產生了微孔洞101的情況,微孔洞101會轉印到複製樣本。將轉印有微孔洞101之複製樣本利用掃描型電子顯微鏡或雷射顯微鏡進行觀察,可高精度地取得複製樣本中之微孔洞的產生量。根據上述新的發現,亦即比起孔洞大小成長到基於光學顯微鏡的觀察或基於超音波探傷的探傷檢查可偵測的時期,在更早期就有微孔洞101產生,而藉由觀察微孔洞101來取得微孔洞101的產生量。如此,比起配管1的外徑測定、基於光學顯微鏡的觀察、基於超音波探傷的探傷檢查,可在更早的時機預測配管1的使用壽命。因此,可更早預測配管1的壽命。如此,以往難以評估之在配管1的中期之壽命預測成為可能。再者,藉由使在中期的壽命預測成為可能,還能有效率地策劃檢查時對配管1進行之更換工事等的各種工事。
(Effect)
In the method S10 for predicting the life of the pipe having the above structure, the
又在預測配管的使用壽命之工序S14,是根據表示微孔洞的產生量和配管1的使用壽命之相關性的主資料、及實際的微孔洞產生量,來預測配管1的使用壽命。藉由事先作成主資料,能夠事先高精度地掌握微孔洞101的產生量和配管1的使用壽命之相關性。結果,可更容易且精確地進行配管1的使用壽命之預測。In step S14 of predicting the service life of the piping, the service life of the
又從模擬不同使用狀態之複數個配管1之複數個試驗體的表面來取得複製樣本。而且,取得複數個試驗體之複製樣本中之微孔洞的產生量來作成主資料。藉此如此般作成主資料,可取得與不同使用狀態之實際的配管1之微孔洞101的產生狀態接近的資料。根據如此般取得的主資料來預測配管1的使用壽命,可更高精度地進行配管1之使用壽命的預測。Replicate samples are also obtained from the surfaces of a plurality of test bodies simulating a plurality of
(其他實施形態) 以上,針對本揭露的實施形態參照圖式詳細地說明,具體的構成並不限定於該實施形態,還包含在不脫離本揭露之要旨的範圍內之設計變更等。 (Other embodiments) As mentioned above, the embodiment of the present disclosure has been described in detail with reference to the drawings. However, the specific configuration is not limited to the embodiment and includes design changes within the scope that does not deviate from the gist of the present disclosure.
又在上述實施形態,雖針對配管1之壽命預測方法S10的程序做說明,但各工序中的作業內容、程序的細節是可適宜變更的。Furthermore, in the above-mentioned embodiment, the procedure of the life prediction method S10 of the
例如,並不限定於利用表示微孔洞的產生量和配管的使用壽命之相關性的主資料來預測配管1的壽命。在此情況,不實施作成主資料之工序S21就實施預測配管的使用壽命之工序S14亦可。這時,在預測配管的使用壽命之工序S14,是將過去測定配管1時之微孔洞101之實際產生量的資料事前積存在儲存器(storage)等,以所積存的資料作為表示微孔洞的產生量和配管1的使用壽命之相關性的資料。因此,可將微孔洞101的產生量對照所積存的資料來進行使用壽命的預測。For example, the prediction of the life of the
又當實施作成主資料之工序S21的情況,在將配管1實施複數次定期檢查時,可將作成主資料之工序S21僅實施一次,亦可每次都實施。亦即,可將事先作成之同一主資料用於每次的配管1之定期檢查,亦可在每次進行配管1的定期檢查時重新作成主資料。In addition, when the process S21 of creating master data is implemented, when the
又在作成主資料之工序S21,並不限定於對模擬不同使用狀態之複數個配管1之複數個試驗體實施試驗來作成主資料。在作成主資料之工序S21,例如不是進行實際的試驗而是藉由模擬來作成主資料亦可。In addition, the step S21 of creating the master data is not limited to executing tests on a plurality of test bodies simulating a plurality of
又流過配管1的內部之高溫流體並不限定於蒸氣。也可以是讓由不鏽鋼所形成之配管1產生腐蝕等的損傷之高溫的氣體或液體。The high-temperature fluid flowing through the inside of the
又在研磨配管之工序S11的研磨方法,並不限定於使用了膠體二氧化矽之CMP、使用了草酸之電解研磨。研磨方法較佳為,事先對配管1、試驗體嘗試不同種類的研磨劑、研磨方法,而採用對預測對象之配管1最適當的研磨方法。Furthermore, the polishing method in step S11 of polishing the pipe is not limited to CMP using colloidal silica or electrolytic polishing using oxalic acid. As for the polishing method, it is preferable to try different types of abrasives and polishing methods on the
<附記>
實施形態所記載的配管1之壽命預測方法S10,例如可如以下般掌握。
<Note>
The life prediction method S10 of the
(1)第1態樣的配管1之壽命預測方法S10,係供高溫流體流過且由不鏽鋼所形成的配管1之壽命預測方法S10,其係包含:研磨前述配管1的表面1f之工序S11、從研磨後之前述配管1的前述表面1f採取複製樣本之工序S12、將前述複製樣本利用掃描型電子顯微鏡或雷射顯微鏡進行觀察並取得前述複製樣本中之微孔洞的產生量之工序S13、以及根據前述微孔洞的產生量來預測前述配管1的使用壽命之工序S14。(1) The life prediction method S10 of the
本案發明人等發現,供高溫流體流過且由不鏽鋼所形成的配管1,隨著時間經過,受到高溫流體之溫度及壓力的影響,在配管1的徑方向Dr上之表面1f的附近會產生微孔洞101。該微孔洞101在比配管1的外徑產生可測定的程度的變化之時期更早就開始產生。又比起基於光學顯微鏡的觀察、基於超音波探傷的探傷檢查可偵測之孔洞大小,微孔洞101是非常小。亦即,比起孔洞大小成長到基於光學顯微鏡的觀察或基於超音波探傷的探傷檢查可偵測的時期,在更早期就有微孔洞101產生。The inventors of the present case discovered that the
該配管1之壽命預測方法S10,是根據上述全新的發現,來取得複製樣本中之微孔洞的產生量。藉此,比起配管1的外徑測定、基於光學顯微鏡的觀察、基於超音波探傷的探傷檢查,可在更早的時機預測配管1之使用壽命。因此,可更早預測配管1的壽命。The life prediction method S10 of the
(2)第2態樣的配管1之壽命預測方法S10,係在(1)配管1之壽命預測方法S10中,進一步具備作成主資料之工序S21,在作成前述主資料之工序S21,係事先作成表示前述微孔洞的產生量和前述配管1的使用壽命之相關性之主資料,在預測前述配管1的使用壽命之工序S14,係根據前述主資料和前述微孔洞的產生量來預測前述配管1的使用壽命。(2) The life prediction method S10 of the
藉由事先作成主資料,可事先高精度地掌握微孔洞101的產生量和配管1的使用壽命之相關性。結果,可更容易且準確地進行配管1的使用壽命之預測。By creating master data in advance, the correlation between the amount of
(3)第3態樣的配管1之壽命預測方法S10,係在(2)配管1之壽命預測方法S10中,在作成前述主資料之工序S21,係從模擬不同使用狀態之複數個前述配管1之複數個試驗體的表面取得複製樣本,並取得複數個前述試驗體之複製樣本中之微孔洞的產生量,藉此作成前述主資料。(3) The life prediction method S10 of the
藉由如此般作成主資料,可取得與不同使用狀態之實際的配管1之微孔洞101的產生狀態接近的資料。藉由根據如此般取得的主資料來預測配管1的使用壽命,可更高精度地進行配管1的使用壽命之預測。
[產業利用性]
By creating the master data in this way, it is possible to obtain data close to the occurrence state of the
依據本揭露的配管之壽命預測方法,可更早預測配管的壽命。According to the piping life prediction method disclosed in the present disclosure, the piping life can be predicted earlier.
1:配管
1f:表面
101:微孔洞
102:孔洞
103:微裂縫
Dr:徑方向
Dri:內側
Dro:外側
S10:配管之壽命預測方法
S11:研磨配管之工序
S12:採取複製樣本之工序
S13:取得微孔洞的產生量之工序
S14:預測配管的使用壽命之工序
S21:作成主資料之工序
T:觀察時的經過時間
Tb:從試驗開始到斷裂為止的經過時間
1:
[圖1]係顯示本揭露的實施形態的配管之壽命預測方法之壽命預測對象的配管例之剖面圖。 [圖2]係顯示上述配管中的微孔洞(microvoid)、孔洞、微裂縫(microcrack)的產生狀態。 [圖3]係顯示在不同壽命比的蒸氣配管所產生之孔洞的大小和孔洞個數密度的相關性。 [圖4]係顯示本揭露的實施形態的配管之壽命預測方法的程序之流程圖。 [圖5]係將複製樣本利用掃描型顯微鏡進行觀察而得之觀察影像的例子。 [圖6]係將實際的配管表面利用掃描型顯微鏡進行觀察而得之觀察影像的例。 [圖7]係顯示依上述配管之壽命預測方法來作成主資料(master data)時之試驗體的具體條件之一例。 [Fig. 1] is a cross-sectional view showing an example of a piping that is a life prediction target of the piping life prediction method according to the embodiment of the present disclosure. [Figure 2] shows the occurrence state of microvoids, holes, and microcracks in the above-mentioned piping. [Figure 3] shows the correlation between the size of holes and the number density of holes produced in steam piping with different life ratios. [Fig. 4] is a flowchart showing the procedure of the pipe life prediction method according to the embodiment of the present disclosure. [Figure 5] is an example of an observation image obtained by observing a replicated sample using a scanning microscope. [Fig. 6] is an example of an observation image obtained by observing the actual piping surface with a scanning microscope. [Figure 7] shows an example of the specific conditions of the test body when master data is created according to the above-mentioned piping life prediction method.
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