TW202338053A - Adhesive agent composition, adhesive agent layer, and adhesive sheet - Google Patents
Adhesive agent composition, adhesive agent layer, and adhesive sheet Download PDFInfo
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- TW202338053A TW202338053A TW112103060A TW112103060A TW202338053A TW 202338053 A TW202338053 A TW 202338053A TW 112103060 A TW112103060 A TW 112103060A TW 112103060 A TW112103060 A TW 112103060A TW 202338053 A TW202338053 A TW 202338053A
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- Prior art keywords
- adhesive layer
- adhesive
- mentioned
- mass
- millimeter wave
- Prior art date
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- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical class OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 229960002479 isosorbide Drugs 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- LHNJUHRGZRLKKM-UHFFFAOYSA-N methylcyclohexane;1-(oxiran-2-yl)-n-(oxiran-2-ylmethyl)methanamine Chemical compound CC1CCCCC1.C1OC1CNCC1CO1 LHNJUHRGZRLKKM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000005404 monopole Effects 0.000 description 1
- SQEHYBILZVXINP-UHFFFAOYSA-N n'-tert-butyl-n-propan-2-ylmethanediimine Chemical compound CC(C)N=C=NC(C)(C)C SQEHYBILZVXINP-UHFFFAOYSA-N 0.000 description 1
- JEQPWXGHMRFTRF-UHFFFAOYSA-N n,n'-bis(2-methylpropyl)methanediimine Chemical compound CC(C)CN=C=NCC(C)C JEQPWXGHMRFTRF-UHFFFAOYSA-N 0.000 description 1
- NASVTBDJHWPMOO-UHFFFAOYSA-N n,n'-dimethylmethanediimine Chemical compound CN=C=NC NASVTBDJHWPMOO-UHFFFAOYSA-N 0.000 description 1
- ATYQZACNIHLXIS-UHFFFAOYSA-N n,n'-dinaphthalen-2-ylmethanediimine Chemical compound C1=CC=CC2=CC(N=C=NC3=CC4=CC=CC=C4C=C3)=CC=C21 ATYQZACNIHLXIS-UHFFFAOYSA-N 0.000 description 1
- NWBVGPKHJHHPTA-UHFFFAOYSA-N n,n'-dioctylmethanediimine Chemical compound CCCCCCCCN=C=NCCCCCCCC NWBVGPKHJHHPTA-UHFFFAOYSA-N 0.000 description 1
- CMESPBFFDMPSIY-UHFFFAOYSA-N n,n'-diphenylmethanediimine Chemical compound C1=CC=CC=C1N=C=NC1=CC=CC=C1 CMESPBFFDMPSIY-UHFFFAOYSA-N 0.000 description 1
- IDVWLLCLTVBSCS-UHFFFAOYSA-N n,n'-ditert-butylmethanediimine Chemical compound CC(C)(C)N=C=NC(C)(C)C IDVWLLCLTVBSCS-UHFFFAOYSA-N 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- FZZQNEVOYIYFPF-UHFFFAOYSA-N naphthalene-1,6-diol Chemical compound OC1=CC=CC2=CC(O)=CC=C21 FZZQNEVOYIYFPF-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- KSCKTBJJRVPGKM-UHFFFAOYSA-N octan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCCCCCC[O-].CCCCCCCC[O-].CCCCCCCC[O-].CCCCCCCC[O-] KSCKTBJJRVPGKM-UHFFFAOYSA-N 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical group 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002540 palm oil Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 150000003097 polyterpenes Chemical class 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 229920006264 polyurethane film Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- RLJWTAURUFQFJP-UHFFFAOYSA-N propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)O.CC(C)O.CC(C)O RLJWTAURUFQFJP-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000008159 sesame oil Substances 0.000 description 1
- 235000011803 sesame oil Nutrition 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- AFCAKJKUYFLYFK-UHFFFAOYSA-N tetrabutyltin Chemical compound CCCC[Sn](CCCC)(CCCC)CCCC AFCAKJKUYFLYFK-UHFFFAOYSA-N 0.000 description 1
- VXUYXOFXAQZZMF-UHFFFAOYSA-N tetraisopropyl titanate Substances CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 1
- YCGAZNXXGKTASZ-UHFFFAOYSA-N thiophene-2,5-dicarboxylic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)S1 YCGAZNXXGKTASZ-UHFFFAOYSA-N 0.000 description 1
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 1
- 150000003608 titanium Chemical class 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- WOZZOSDBXABUFO-UHFFFAOYSA-N tri(butan-2-yloxy)alumane Chemical compound [Al+3].CCC(C)[O-].CCC(C)[O-].CCC(C)[O-] WOZZOSDBXABUFO-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 235000015112 vegetable and seed oil Nutrition 0.000 description 1
- 239000008158 vegetable oil Substances 0.000 description 1
- 210000000707 wrist Anatomy 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
- 150000003755 zirconium compounds Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
本發明係關於一種黏著劑組合物、黏著劑層、及黏著片材。更詳細而言,本發明係關於一種能夠良好地用於光學用途之黏著劑組合物、黏著劑層、及黏著片材。The invention relates to an adhesive composition, an adhesive layer, and an adhesive sheet. More specifically, the present invention relates to an adhesive composition, an adhesive layer, and an adhesive sheet that can be favorably used for optical applications.
有機EL顯示裝置等圖像顯示裝置係與具有靜電電容方式觸控感測器之觸控面板組合而使用。隨著靜電電容方式觸控感測器之普及,對其進一步要求高性能化。因此,對應用於靜電電容方式觸控感測器之黏著劑層亦要求高性能。Image display devices such as organic EL display devices are used in combination with a touch panel having an electrostatic capacitive touch sensor. As electrostatic capacitive touch sensors become more popular, they are increasingly required to have higher performance. Therefore, high performance is also required for the adhesive layer used in electrostatic capacitive touch sensors.
然而,由於上述圖像顯示裝置中之模組之薄型化、大畫面化、光半導體元件之高精細化,有圖像顯示裝置之顯示驅動時之驅動雜訊會對靜電電容方式觸控感測器之感測產生不良影響而出現誤動作的擔憂。若黏著劑層之介電常數較高,則可能會引起上述驅動雜訊所致之誤動作。因此,作為形成低介電常數化之黏著劑層之黏著劑,例如提出有以(甲基)丙烯酸系聚合物作為基礎聚合物之黏著劑,該(甲基)丙烯酸系聚合物將具有長鏈烷基之(甲基)丙烯酸烷基酯作為主成分(例如專利文獻1)。根據低介電常數化之黏著劑層,能夠降低來自有機EL面板之驅動雜訊對靜電電容方式觸控感測器之影響。 先前技術文獻 專利文獻 However, due to the thinning and large-screen modules in the above-mentioned image display devices, and the high-definition optical semiconductor elements, the driving noise during the display driving of the image display device will affect the electrostatic capacitive touch sensing. There is a concern that the sensor of the device may have adverse effects and cause malfunction. If the dielectric constant of the adhesive layer is high, it may cause the above-mentioned malfunction caused by driving noise. Therefore, as an adhesive for forming an adhesive layer with a low dielectric constant, for example, an adhesive using a (meth)acrylic polymer as a base polymer has been proposed. The (meth)acrylic polymer will have a long chain. Alkyl (meth)acrylic acid alkyl ester serves as the main component (for example, Patent Document 1). The low dielectric constant adhesive layer can reduce the impact of driving noise from the organic EL panel on the electrostatic capacitive touch sensor. Prior technical literature patent documents
專利文獻1:日本專利特開2013-082880號公報Patent Document 1: Japanese Patent Application Publication No. 2013-082880
[發明所欲解決之問題][Problem to be solved by the invention]
近年來,圖像顯示裝置進一步要求大畫面化及高清化。隨著大畫面化,有圖像顯示裝置之驅動之電壓增高、雜訊進一步增大之傾向。又,隨著高清化,所使用之半導體元件量增多,因此有因產生較高之電壓而導致雜訊進一步增大之傾向。In recent years, image display devices have been increasingly required to have larger screens and higher definition. As the screen becomes larger, the driving voltage of the image display device increases, and the noise tends to further increase. In addition, as high-definition becomes higher, the number of semiconductor components used increases, so there is a tendency for noise to further increase due to the generation of higher voltages.
又,近年來,有將以往設置於圖像顯示裝置內之觸控感測器設置於圖像顯示裝置外部之傾向。於圖像顯示裝置要求輕量化及薄膜化時,將觸控感測器設置於圖像顯示裝置外部之情形時,隨著圖像顯示裝置內外所使用之構件之薄膜化,自圖像顯示裝置發出之雜訊容易傳遞至經由黏著劑層而貼合於圖像顯示裝置之觸控感測器,有觸控感測器之雜訊增大之傾向。因此,對黏著劑層進一步要求低介電常數化。又,要求黏著劑層所使用之樹脂之耐水解性等耐久性優異。In addition, in recent years, there has been a tendency to install touch sensors that have been conventionally installed in image display devices outside the image display device. When the image display device is required to be lighter and thinner, when the touch sensor is installed outside the image display device, as the members used inside and outside the image display device become thinner, the image display device becomes thinner. The emitted noise is easily transmitted to the touch sensor attached to the image display device through the adhesive layer, and the noise of the touch sensor tends to increase. Therefore, the adhesive layer is further required to have a lower dielectric constant. In addition, the resin used for the adhesive layer is required to have excellent durability such as hydrolysis resistance.
本發明係用以解決上述問題,其目的在於提供一種構成樹脂之耐水解性優異且能夠形成介電常數較低之黏著劑層之黏著劑組合物。 [解決問題之技術手段] The present invention is made to solve the above problems, and an object thereof is to provide an adhesive composition that is excellent in hydrolysis resistance of the constituting resin and can form an adhesive layer with a low dielectric constant. [Technical means to solve problems]
本發明提供一種黏著劑組合物,其包含如下聚酯系樹脂,上述聚酯系樹脂包含來自碳數20以上之多元醇之結構單元及來自芳香族多元羧酸之結構單元。The present invention provides an adhesive composition containing a polyester resin containing a structural unit derived from a polyol having 20 or more carbon atoms and a structural unit derived from an aromatic polycarboxylic acid.
上述聚酯系樹脂以結構單元之形式包含之碳數20以上之多元醇因碳數較多故而有極性較低之傾向。因此,由包含該聚酯系樹脂之黏著劑組合物所形成之黏著劑層之介電常數降低。而且,藉由使用碳數20以上之多元醇,並且將芳香族多元羧酸用作作為聚酯系樹脂之結構成分之多元羧酸,聚酯系樹脂之耐水解性優異。The polyol with a carbon number of 20 or more contained in the form of a structural unit of the polyester resin tends to have low polarity due to a large number of carbon atoms. Therefore, the dielectric constant of the adhesive layer formed from the adhesive composition containing the polyester resin decreases. Furthermore, by using a polyol having 20 or more carbon atoms and using an aromatic polycarboxylic acid as a polycarboxylic acid that is a structural component of the polyester resin, the polyester resin has excellent hydrolysis resistance.
上述黏著劑組合物較佳為於形成了黏著劑層時於頻率100 kHz下之介電常數為4.0以下。藉此,由上述黏著劑組合物所形成之黏著劑層之介電常數較低,不易引起例如雜訊之放大,又,能夠抑制毫米波之輻射損耗。The adhesive composition preferably has a dielectric constant of 4.0 or less at a frequency of 100 kHz when the adhesive layer is formed. Thereby, the dielectric constant of the adhesive layer formed from the above-mentioned adhesive composition is low, which is less likely to cause amplification of noise, for example, and can suppress the radiation loss of millimeter waves.
上述黏著劑組合物較佳為於相對於上述聚酯系樹脂100質量份添加水解促進劑40質量份而形成了黏著劑層時之水解試驗中,兩週後之凝膠分率保持率為70%以上。若上述凝膠分率保持率為70%以上,則不易產生上述聚酯系樹脂之水解。The above-mentioned adhesive composition preferably has a gel fraction retention rate of 70 after two weeks in a hydrolysis test when adding 40 parts by mass of a hydrolysis accelerator to 100 parts by mass of the above-mentioned polyester resin to form an adhesive layer. %above. If the above-mentioned gel fraction retention rate is 70% or more, hydrolysis of the above-mentioned polyester resin will not easily occur.
又,本發明提供一種藉由上述黏著劑組合物所形成之黏著劑層。Furthermore, the present invention provides an adhesive layer formed from the above-mentioned adhesive composition.
又,本發明提供一種具備上述黏著劑層之黏著片材。 [發明之效果] Furthermore, the present invention provides an adhesive sheet provided with the above-mentioned adhesive layer. [Effects of the invention]
根據本發明之黏著劑組合物,構成樹脂之耐水解性優異,能夠形成介電常數較低之黏著劑層。因此,例如,藉由將上述黏著劑層用於觸控感測器及圖像顯示裝置之貼合,能夠使圖像顯示裝置所發出之雜訊不易傳遞至觸控感測器。又,例如,藉由將上述黏著劑層用作貼合至毫米波天線所使用之毫米波天線基板之黏著劑層,能夠抑制毫米波之輻射損耗。進而,上述黏著劑層之耐久性優異,具備上述黏著劑層之黏著片材之耐久性優異。According to the adhesive composition of the present invention, the constituent resin has excellent hydrolysis resistance and can form an adhesive layer with a low dielectric constant. Therefore, for example, by using the above-mentioned adhesive layer for bonding the touch sensor and the image display device, the noise emitted by the image display device can be prevented from being easily transmitted to the touch sensor. Furthermore, for example, by using the above adhesive layer as an adhesive layer bonded to a millimeter wave antenna substrate used in a millimeter wave antenna, radiation loss of millimeter waves can be suppressed. Furthermore, the adhesive layer has excellent durability, and the adhesive sheet provided with the adhesive layer has excellent durability.
[黏著劑組合物] 本發明之黏著劑組合物至少包含聚酯系樹脂。上述聚酯系樹脂至少包含來自碳數20以上之多元醇之結構單元及來自芳香族多元羧酸之結構單元。再者,於本說明書中,有時將上述多元醇稱為「多元醇(A)」。即,上述聚酯系樹脂係使包含多元醇(A)及上述芳香族多元羧酸之單體組合物進行聚合而獲得之樹脂。上述聚酯系樹脂可分別僅包含一種來自多元醇(A)之結構單元及芳香族多元羧酸,亦可包含兩種以上。 [Adhesive composition] The adhesive composition of the present invention contains at least polyester resin. The polyester resin contains at least a structural unit derived from a polyol having 20 or more carbon atoms and a structural unit derived from an aromatic polycarboxylic acid. In addition, in this specification, the said polyol may be called "polyol (A)". That is, the polyester resin is a resin obtained by polymerizing a monomer composition containing a polyol (A) and an aromatic polycarboxylic acid. The polyester-based resin may contain only one structural unit derived from the polyol (A) and the aromatic polycarboxylic acid, or may contain two or more types thereof.
(聚酯系樹脂) 多元醇(A)中之碳數為20以上,較佳為24以上,更佳為26以上,進而較佳為28以上,進而較佳為30以上,尤佳為32以上。上述聚酯系樹脂以結構單元之形式包含之多元醇(A) 因碳數多達20以上,故而有極性較低之傾向。因此,由包含上述聚酯系樹脂之黏著劑組合物所形成之黏著劑層有介電常數變低之傾向。上述碳數例如為60以下,亦可為58以下、56以下。 (polyester resin) The number of carbon atoms in the polyol (A) is 20 or more, preferably 24 or more, more preferably 26 or more, further preferably 28 or more, further preferably 30 or more, particularly preferably 32 or more. The polyol (A) contained in the polyester resin as a structural unit has a carbon number of 20 or more, and therefore tends to have low polarity. Therefore, the adhesive layer formed of the adhesive composition containing the above-mentioned polyester resin tends to have a low dielectric constant. The carbon number may be, for example, 60 or less, 58 or less, or 56 or less.
多元醇(A)所具有之羥基數為2以上,較佳為2~4,更佳為2~3,進而較佳為2。The number of hydroxyl groups the polyol (A) has is 2 or more, preferably 2 to 4, more preferably 2 to 3, and still more preferably 2.
多元醇(A)除羥基以外,可具有氧原子、氮原子、硫原子等雜原子,亦可不具有該等原子。多元醇(A)之碳數與除羥基以外之雜原子數之比[碳數/雜原子數]較佳為10以上,更佳為15以上,進而較佳為20以上,進而較佳為25以上,尤佳為30以上。若不具有上述雜原子或上述比為10以上,則聚酯系樹脂之極性變低,由包含該聚酯系樹脂之黏著劑組合物所形成之黏著劑層之介電常數變低。In addition to the hydroxyl group, the polyol (A) may or may not have heteroatoms such as oxygen atoms, nitrogen atoms, and sulfur atoms. The ratio of the number of carbon atoms in the polyol (A) to the number of hetero atoms other than hydroxyl groups [number of carbon atoms/number of hetero atoms] is preferably 10 or more, more preferably 15 or more, further preferably 20 or more, still more preferably 25 Above, preferably above 30. If the above-mentioned heteroatom is not present or the above-mentioned ratio is 10 or more, the polarity of the polyester-based resin becomes low, and the dielectric constant of the adhesive layer formed from the adhesive composition containing the polyester-based resin becomes low.
多元醇(A)例如可例舉二聚醇。二聚醇可例舉不飽和脂肪酸之二聚酸之還原物。上述不飽和脂肪酸之碳數較佳為10以上,更佳為12以上,進而較佳為14以上,尤佳為16以上。上述二聚醇可例舉油酸之二聚酸之還原物、亞麻油酸之二聚酸之還原物、芥酸之二聚酸之還原物、將兩種該等不飽和脂肪酸組合而成之二聚酸之還原物等。Examples of the polyol (A) include dimer alcohol. Examples of dimer alcohol include reduced products of dimer acid of unsaturated fatty acids. The carbon number of the unsaturated fatty acid is preferably 10 or more, more preferably 12 or more, further preferably 14 or more, particularly preferably 16 or more. Examples of the above-mentioned dimer alcohol include the reduced product of dimer acid of oleic acid, the reduced product of dimer acid of linoleic acid, the reduced product of dimer acid of erucic acid, and a combination of two of these unsaturated fatty acids. Reduced products of dimer acid, etc.
上述聚酯系樹脂中,來自多元醇(A)之結構單元之含有率相對於來自構成上述聚酯系樹脂之單體之結構單元之總量100質量%較佳為30質量%以上,更佳為35質量%以上,進而較佳為40質量%以上,進而較佳為45質量%以上,尤佳為50質量%以上。若上述含有率為30質量%以上,則聚酯系樹脂之極性變低,由包含該聚酯系樹脂之黏著劑組合物所形成之黏著劑層之介電常數變低。In the above-mentioned polyester-based resin, the content rate of the structural unit derived from the polyol (A) is preferably 30 mass % or more, more preferably, based on 100 mass % of the total structural units derived from the monomers constituting the above-mentioned polyester-based resin. It is 35 mass % or more, more preferably 40 mass % or more, still more preferably 45 mass % or more, especially 50 mass % or more. If the content rate is 30% by mass or more, the polarity of the polyester resin becomes low, and the dielectric constant of the adhesive layer formed of the adhesive composition containing the polyester resin becomes low.
上述聚酯系樹脂中,來自多元醇(A)之結構單元之含有率相對於來自構成上述聚酯系樹脂之多元醇之結構單元的總量100質量%例如為30質量%以上,亦可為40質量%以上、50質量%以上,較佳為60質量%以上,更佳為70質量%以上,進而較佳為80質量%以上,進而較佳為85質量%以上,尤佳為90質量%以上,亦可為95質量%以上。In the polyester resin, the content rate of the structural unit derived from the polyol (A) relative to 100 mass % of the total amount of structural units derived from the polyol constituting the polyester resin may be, for example, 30 mass % or more, or may be 40 mass% or more, 50 mass% or more, preferably 60 mass% or more, more preferably 70 mass% or more, further preferably 80 mass% or more, further preferably 85 mass% or more, especially 90 mass% Above, it may be 95% by mass or above.
上述芳香族多元羧酸係指所具有之芳香環與羧基於分子內直接鍵結之化合物。藉由芳香環與羧基之直接鍵結,形成酯鍵時之共軛系變長,成為對水解更加穩定之結構。上述芳香環之數量為1以上,較佳為1~3,更佳為1~2,進而較佳為1。上述芳香環可例舉芳香族烴環、芳香族雜環。The above-mentioned aromatic polycarboxylic acid refers to a compound in which an aromatic ring and a carboxyl group are directly bonded within the molecule. Through the direct bonding between the aromatic ring and the carboxyl group, the conjugated system becomes longer when forming the ester bond, making it a more stable structure against hydrolysis. The number of the above aromatic rings is 1 or more, preferably 1 to 3, more preferably 1 to 2, and still more preferably 1. Examples of the aromatic ring include aromatic hydrocarbon rings and aromatic heterocyclic rings.
上述芳香族多元羧酸所具有之羧基之數量為2以上,較佳為2~4,更佳為2~3,進而較佳為2。即,上述芳香族多元羧酸較佳為芳香族二羧酸。The number of carboxyl groups the aromatic polycarboxylic acid has is 2 or more, preferably 2 to 4, more preferably 2 to 3, and still more preferably 2. That is, the above-mentioned aromatic polycarboxylic acid is preferably an aromatic dicarboxylic acid.
上述芳香族多元羧酸可例舉:鄰苯二甲酸、間苯二甲酸、對苯二甲酸、2,2'-聯苯二羧酸、4,4'-聯苯二羧酸、4,4'-二羧基二苯醚、2,5-呋喃二羧酸、2,5-噻吩二羧酸、萘二羧酸等。Examples of the aromatic polycarboxylic acid include phthalic acid, isophthalic acid, terephthalic acid, 2,2'-biphenyldicarboxylic acid, 4,4'-biphenyldicarboxylic acid, 4,4 '-Dicarboxyldiphenyl ether, 2,5-furandicarboxylic acid, 2,5-thiophenedicarboxylic acid, naphthalenedicarboxylic acid, etc.
上述聚酯系樹脂亦可包含來自除多元醇(A)以外之多元醇(其他多元醇)之結構單元。即,上述聚酯系樹脂具體而言可例舉包含來自多元醇(A)之結構單元、來自芳香族多元羧酸之結構單元、及視需要之來自其他多元醇之結構單元的聚酯系樹脂。The polyester resin may contain a structural unit derived from polyols other than polyol (A) (other polyols). That is, the polyester-based resin specifically includes a polyester-based resin containing a structural unit derived from polyol (A), a structural unit derived from an aromatic polycarboxylic acid, and optionally a structural unit derived from other polyols. .
上述其他多元醇可例舉二醇或三元以上之多元醇等。二醇例如可例舉:乙二醇、二乙二醇、三乙二醇、聚乙二醇、丙二醇、二丙二醇、聚丙二醇、聚四亞甲基二醇等(聚)伸烷基二醇類;1,3-丙二醇、2-甲基-1,3-丙二醇、2,2-二甲基-1,3-丙二醇(新戊二醇)、2-乙基-2-丁基-1,3-丙二醇、2-乙基-2-異丁基-1,3-丙二醇、1,2-丁二醇、1,3-丁二醇、1,4-丁二醇、1,5-戊二醇、3-甲基-1,5-戊二醇、1,6-己二醇、2-甲基-1,3-己二醇、2,2,4-三甲基-1,6-己二醇、1,8-辛二醇、1,9-壬二醇、1,10-癸二醇等脂肪族二醇;碳數19以下之二聚醇;1,2-環己烷二甲醇、1,3-環己烷二甲醇、1,4-環己烷二甲醇、螺二醇、三環癸烷二甲醇、金剛烷二醇、2,2,4,4-四甲基-1,3-環丁二醇等脂環式二醇;4,4'-硫代二酚、4,4'-亞甲二酚、4,4'-二羥基聯苯、鄰、間及對二羥基苯、2,5-萘二醇、對二甲苯二醇、及其等之環氧乙烷、環氧丙烷加成物等芳香族二醇等。三元以上之多元醇可例舉:季戊四醇、二季戊四醇、四季戊四醇、甘油、三羥甲基丙烷、三羥甲基乙烷、1,3,6-己三醇、金剛烷三醇等。上述其他多元醇可僅使用一種,亦可使用兩種以上。Examples of the above-mentioned other polyhydric alcohols include diols, trihydric or higher polyhydric alcohols, and the like. Examples of glycols include (poly)alkylene glycols such as ethylene glycol, diethylene glycol, triethylene glycol, polyethylene glycol, propylene glycol, dipropylene glycol, polypropylene glycol, and polytetramethylene glycol. Class; 1,3-propanediol, 2-methyl-1,3-propanediol, 2,2-dimethyl-1,3-propanediol (neopentyl glycol), 2-ethyl-2-butyl-1 ,3-propanediol, 2-ethyl-2-isobutyl-1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 1,5- Pentylene glycol, 3-methyl-1,5-pentanediol, 1,6-hexanediol, 2-methyl-1,3-hexanediol, 2,2,4-trimethyl-1, Aliphatic diols such as 6-hexanediol, 1,8-octanediol, 1,9-nonanediol, and 1,10-decanediol; dimer alcohols with less than 19 carbon atoms; 1,2-cyclohexane Alkanedimethanol, 1,3-cyclohexanedimethanol, 1,4-cyclohexanedimethanol, spirodiol, tricyclodecanedimethanol, adamantanediol, 2,2,4,4-tetramethyl Alicyclic diols such as 1,3-cyclobutanediol; 4,4'-thiodiphenol, 4,4'-methylenediol, 4,4'-dihydroxybiphenyl, o-, m- And aromatic diols such as p-dihydroxybenzene, 2,5-naphthalenediol, p-xylene glycol, and their ethylene oxide, propylene oxide adducts, etc. Examples of polyhydric alcohols having a trivalent or higher value include pentaerythritol, dipentaerythritol, pentaerythritol, glycerin, trimethylolpropane, trimethylolethane, 1,3,6-hexanetriol, adamantanetriol, etc. Only one type of the above-mentioned other polyols may be used, or two or more types may be used.
上述多元醇(多元醇(A)及上述其他多元醇)亦可使用來自植物之多元醇。上述來自植物之多元醇可例舉:使用葡萄糖而生成之多元醇(例如乙二醇、丙二醇、丁二醇、異山梨糖醇、聚乙二醇、聚丙二醇、聚四亞甲基二醇等)、作為來自植物油(例如棕櫚油、椰子油、菜籽油等)之不飽和脂肪酸(例如油酸、亞麻油酸、芥酸等)之二聚酸之還原物的二聚醇、作為來自蓖麻油之癸二酸之還原物的1,10-癸二醇等。As the above-mentioned polyol (polyol (A) and the above-mentioned other polyols), plant-derived polyols can also be used. Examples of the above-mentioned plant-derived polyols include polyols produced using glucose (such as ethylene glycol, propylene glycol, butylene glycol, isosorbide, polyethylene glycol, polypropylene glycol, polytetramethylene glycol, etc. ), dimer alcohol as the reducing product of dimer acid of unsaturated fatty acids (such as oleic acid, linoleic acid, erucic acid, etc.) derived from vegetable oils (such as palm oil, coconut oil, rapeseed oil, etc.), as dimer alcohol derived from castor oil 1,10-decanediol, the reduced product of sebacic acid in sesame oil, etc.
上述聚酯系樹脂中,來自芳香族多元羧酸之結構單元之含量相對於多元醇1當量例如為0.5當量以上,較佳為0.58當量以上,更佳為0.66當量以上,進而較佳為0.83當量以上,進而較佳為0.88當量以上,尤佳為0.95當量以上。又,上述含量相對於多元醇1當量例如為2.0當量以下,較佳為1.7當量以下,更佳為1.5當量以下,進而較佳為1.2當量以下,進而較佳為1.1當量以下,尤佳為1.05當量以下。In the above-mentioned polyester resin, the content of the structural unit derived from the aromatic polycarboxylic acid is, for example, 0.5 equivalent or more, preferably 0.58 equivalent or more, more preferably 0.66 equivalent or more, still more preferably 0.83 equivalent, based on 1 equivalent of the polyol. or above, more preferably 0.88 equivalent or more, particularly preferably 0.95 equivalent or more. Moreover, the said content is, for example, 2.0 equivalents or less, preferably 1.7 equivalents or less, more preferably 1.5 equivalents or less, still more preferably 1.2 equivalents or less, still more preferably 1.1 equivalents or less, and particularly preferably 1.05, based on 1 equivalent of the polyol. below the equivalent level.
上述聚酯系樹脂中,來自芳香族多元羧酸(尤其是芳香環之數量為1之芳香族多元羧酸)之結構單元之含有率相對於來自構成上述聚酯系樹脂之多元羧酸之結構單元的總量100質量%例如超過50質量%以上,較佳為60質量%以上,更佳為70質量%以上,進而較佳為80質量%以上,尤佳為90質量%以上。In the above-mentioned polyester resin, the content rate of the structural unit derived from the aromatic polycarboxylic acid (especially the aromatic polycarboxylic acid having 1 aromatic ring number) is relative to the structure derived from the polyvalent carboxylic acid constituting the above-mentioned polyester resin. The total amount of units (100 mass %) exceeds, for example, 50 mass % or more, preferably 60 mass % or more, more preferably 70 mass % or more, further preferably 80 mass % or more, particularly preferably 90 mass % or more.
上述聚酯系樹脂中,來自多元醇之結構單元與來自芳香族多元羧酸之結構單元之當量比並無特別限定,可考慮目標聚合物物性或聚合性等而設定適當之當量比。若多元醇之當量比高,則可容易地表現基於多元醇之特性。又,若芳香族多元羧酸之當量比高,則可容易地表現基於芳香族多元羧酸之特性。In the above-mentioned polyester-based resin, the equivalent ratio of the structural unit derived from the polyol and the structural unit derived from the aromatic polycarboxylic acid is not particularly limited, and an appropriate equivalent ratio can be set taking into consideration the target polymer physical properties, polymerizability, etc. If the equivalent ratio of the polyol is high, the characteristics based on the polyol can be easily expressed. In addition, if the equivalent ratio of the aromatic polycarboxylic acid is high, characteristics based on the aromatic polycarboxylic acid can be easily expressed.
上述聚酯系樹脂之重量平均分子量(Mw)較佳為3000以上,更佳為5000以上,進而較佳為10000以上,進而較佳為15000以上,尤佳為20000以上。若上述重量平均分子量為3000以上,則黏著劑層之凝集力變高,保持力及高溫保持力提高。上述重量平均分子量例如為300000以下,較佳為250000以下,更佳為200000以下,進而較佳為150000以下。The weight average molecular weight (Mw) of the polyester resin is preferably 3,000 or more, more preferably 5,000 or more, further preferably 10,000 or more, further preferably 15,000 or more, and particularly preferably 20,000 or more. If the weight average molecular weight is 3,000 or more, the cohesive force of the adhesive layer becomes high, and the holding power and high temperature holding power are improved. The weight average molecular weight is, for example, 300,000 or less, preferably 250,000 or less, more preferably 200,000 or less, further preferably 150,000 or less.
上述聚酯系樹脂之玻璃轉移溫度(Tg)較佳為10℃以下,更佳為5℃以下,進而較佳為0℃以下,進而較佳為未達-5℃,尤佳為-10℃以下。藉由使用Tg較低之聚酯系樹脂,所形成之黏著劑層之黏著性優異。又,就黏著劑層之凝集力之觀點而言,聚酯系樹脂之Tg較佳為-60℃以上,更佳為-55℃以上,進而較佳為-50℃以上,進而較佳為-45℃以上,尤佳為-30℃以上。聚酯系樹脂之Tg可藉由適當改變單體組成(即,聚酯系樹脂之合成所使用之單體之種類或使用量比)而進行調整。再者,上述聚酯系樹脂之Tg係以黏著劑層之Tg之形式進行測定,具體而言例如以實施例所記載之方法進行測定。The glass transition temperature (Tg) of the above-mentioned polyester-based resin is preferably 10°C or lower, more preferably 5°C or lower, further preferably 0°C or lower, further preferably less than -5°C, and particularly preferably -10°C. the following. By using a polyester resin with a low Tg, the adhesive layer formed has excellent adhesion. In addition, from the viewpoint of the cohesion of the adhesive layer, the Tg of the polyester resin is preferably -60°C or higher, more preferably -55°C or higher, further preferably -50°C or higher, further preferably - - Above 45℃, preferably above -30℃. The Tg of the polyester resin can be adjusted by appropriately changing the monomer composition (ie, the type or usage ratio of the monomers used in the synthesis of the polyester resin). In addition, the Tg of the said polyester-type resin is measured as the Tg of an adhesive layer, specifically, for example, it is measured by the method described in an Example.
上述黏著劑組合物較佳為包含上述聚酯系樹脂作為基礎聚合物。上述聚酯系樹脂相對於上述黏著劑組合物所包含之所有樹脂之總量100質量%的含有率較佳為超過50質量%,更佳為60質量%以上,進而較佳為70質量%以上,亦可為80質量%以上。The adhesive composition preferably contains the polyester resin as a base polymer. The content rate of the polyester resin based on 100 mass% of the total amount of all resins contained in the adhesive composition is preferably more than 50 mass%, more preferably 60 mass% or more, and still more preferably 70 mass% or more. , it can also be 80 mass% or more.
獲得上述聚酯系樹脂之方法並無特別限定,可適當採用公知或常用之聚酯系樹脂之聚合方法。具體而言,上述聚酯系樹脂可與通常之聚酯同樣地藉由多元羧酸與多元醇之縮聚而獲得。更詳細而言,對於多元羧酸所具有之羧基與多元醇所具有之羥基之反應,可一面將藉由上述反應所生成之水(生成水)等去除至反應體系外一面進行上述反應,藉此合成聚酯系樹脂。將上述生成水去除至反應體系外之方法可例舉向反應體系內吹入惰性氣體而將生成水與該惰性氣體一併取出至反應體系外之方法、採用甲苯或二甲苯等反應水排出溶劑而共沸脫水之方法、於減壓下自反應體系中將生成水蒸餾去除之方法(減壓法)等。又,上述聚酯系樹脂亦可採用使用多元酯及多元醇之酯交換反應。The method for obtaining the above-mentioned polyester resin is not particularly limited, and a known or commonly used polyester resin polymerization method can be appropriately used. Specifically, the above-mentioned polyester-based resin can be obtained by polycondensation of a polycarboxylic acid and a polyhydric alcohol in the same manner as a normal polyester. More specifically, the reaction between the carboxyl group of the polycarboxylic acid and the hydroxyl group of the polyhydric alcohol can be carried out while removing the water (generated water) etc. generated by the above reaction to the outside of the reaction system. This synthetic polyester resin. Examples of methods for removing the above-mentioned generated water out of the reaction system include blowing an inert gas into the reaction system and taking out the generated water and the inert gas out of the reaction system, or using reaction water such as toluene or xylene to discharge the solvent. The method of azeotropic dehydration, the method of distilling and removing the generated water from the reaction system under reduced pressure (reduced pressure method), etc. In addition, the above-mentioned polyester-based resin may also adopt a transesterification reaction using a polyester and a polyol.
上述多元酯可例舉上述多元羧酸之酯。上述酯可例舉:甲酯、乙酯等烷基酯;2-羥基乙酯等羥基烷基酯等。其中,較佳為羥基烷基酯,更佳為2-羥基乙酯。於該情形時,有以下優點:有熔點較多元羧酸或其烷基酯低之傾向,操作性優異,所獲得之聚酯系樹脂末端成為羥基,與下述異氰酸酯系硬化劑等硬化劑之反應性優異,又,聚酯系樹脂之耐水解性優異。又,對苯二甲酸雙(2-羥基乙基)酯可藉由PET之化學循環而合成,因此環境適應性優異。Examples of the polyvalent ester include esters of the above-mentioned polycarboxylic acids. Examples of the ester include alkyl esters such as methyl ester and ethyl ester; hydroxyalkyl esters such as 2-hydroxyethyl ester; and the like. Among them, hydroxyalkyl ester is preferred, and 2-hydroxyethyl ester is more preferred. In this case, there are the following advantages: The melting point tends to be lower than that of polycarboxylic acids or alkyl esters thereof, and the workability is excellent. The polyester resin obtained has a hydroxyl group at the terminal end, and is compatible with the following hardeners such as isocyanate hardeners. It has excellent reactivity and the polyester resin has excellent hydrolysis resistance. In addition, bis(2-hydroxyethyl) terephthalate can be synthesized by chemical recycling of PET, so it has excellent environmental adaptability.
進行上述縮聚等各種反應時之反應溫度或反應時間、採用減壓法之情形時之減壓度(反應體系內之壓力)可以高效率地獲得目標特性(例如分子量)之聚酯系樹脂之方式適當設定。通常,上述反應溫度設定為150℃以上(例如180℃~260℃)較為適當,但並無特別限定。藉由將反應溫度設於上述範圍內,可獲得良好之反應速度,生產性提高,且容易防止或抑制所生成之聚酯系樹脂之劣化。反應時間並無特別限定,為3~48小時左右。於採用減壓法之情形時,可將上述減壓度設為例如4 kPa~0.1 kPa,但並無特別限定。藉由將反應體系內之壓力設於上述範圍內,可高效率地將因反應而生成之水蒸餾去除至反應體系外,容易維持良好之反應速度。又,於反應溫度相對較高之情形時,藉由將反應體系內之壓力設為上述下限值以上,容易防止將作為原料之多元羧酸或多元醇蒸餾去除至反應體系外。就維持反應體系內之壓力穩定之觀點而言,通常將反應體系內之壓力設為0.1 kPa以上較為適當。The reaction temperature or reaction time when performing various reactions such as the above-mentioned polycondensation, and the degree of pressure reduction (pressure in the reaction system) when using the pressure reduction method can efficiently obtain a polyester-based resin with target characteristics (such as molecular weight) Set appropriately. Generally, it is appropriate to set the reaction temperature to 150°C or higher (for example, 180°C to 260°C), but it is not particularly limited. By setting the reaction temperature within the above range, a good reaction rate can be obtained, productivity can be improved, and deterioration of the produced polyester-based resin can be easily prevented or suppressed. The reaction time is not particularly limited, but is approximately 3 to 48 hours. When the pressure reduction method is used, the degree of pressure reduction may be, for example, 4 kPa to 0.1 kPa, but is not particularly limited. By setting the pressure in the reaction system within the above range, the water generated by the reaction can be efficiently distilled out of the reaction system, making it easy to maintain a good reaction rate. In addition, when the reaction temperature is relatively high, by setting the pressure in the reaction system to be equal to or higher than the above-mentioned lower limit, it is easy to prevent the polycarboxylic acid or polyhydric alcohol as the raw material from being distilled out of the reaction system. From the viewpoint of maintaining stable pressure within the reaction system, it is usually appropriate to set the pressure within the reaction system to 0.1 kPa or more.
上述反應中可與通常之聚酯合成同樣地使用適當量之公知或常用之觸媒以進行酯化、縮合。上述觸媒例如可例舉:鈦系、鍺系、銻系、錫系、鋅系等金屬化合物;對甲苯磺酸或硫酸等強酸等。觸媒之使用量可根據反應速度等適當設定。In the above reaction, an appropriate amount of a known or commonly used catalyst can be used to perform esterification and condensation in the same manner as in ordinary polyester synthesis. Examples of the catalyst include titanium-based, germanium-based, antimony-based, tin-based, zinc-based metal compounds; strong acids such as p-toluenesulfonic acid or sulfuric acid; and the like. The amount of catalyst used can be appropriately set according to the reaction speed, etc.
於藉由多元醇與芳香族多元羧酸或多元酯之反應合成聚酯系樹脂之上述過程中,可使用溶劑,亦可不使用溶劑。上述合成可於實質上不使用有機溶劑之情況下實施,即有意不使用有機溶劑地實施。In the above-mentioned process of synthesizing polyester resin through the reaction of polyol and aromatic polycarboxylic acid or polyester, a solvent may or may not be used. The above synthesis can be carried out substantially without the use of organic solvents, that is, intentionally without the use of organic solvents.
(交聯劑) 上述黏著劑組合物亦可包含交聯劑。上述交聯劑具有將上述聚酯系樹脂彼此交聯之作用,亦可作為聚酯系樹脂之括鏈劑發揮作用。若包含上述交聯劑,則於所形成之黏著劑層中會形成聚酯系樹脂之交聯結構,凝集力提高。上述交聯劑可僅使用一種,亦可使用兩種以上。 (cross-linking agent) The above-mentioned adhesive composition may also contain a cross-linking agent. The above-mentioned cross-linking agent has the function of cross-linking the above-mentioned polyester-based resins with each other, and can also function as a chain-branching agent for the polyester-based resin. If the above-mentioned cross-linking agent is included, a cross-linked structure of the polyester resin will be formed in the formed adhesive layer, and the cohesive force will be improved. Only one type of cross-linking agent may be used, or two or more types of cross-linking agents may be used.
上述交聯劑例如可例舉:異氰酸酯系交聯劑、環氧系交聯劑、三聚氰胺系交聯劑、過氧化物系交聯劑、脲系交聯劑、金屬烷氧化物系交聯劑、金屬螯合物系交聯劑、金屬鹽系交聯劑、碳二亞胺系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、胺系交聯劑、矽酮系交聯劑、矽烷系交聯劑等。於上述交聯劑中,就所形成之黏著劑層之耐衝擊性優異之觀點而言,較佳為異氰酸酯系交聯劑。Examples of the cross-linking agent include isocyanate-based cross-linking agents, epoxy-based cross-linking agents, melamine-based cross-linking agents, peroxide-based cross-linking agents, urea-based cross-linking agents, and metal alkoxide-based cross-linking agents. , Metal chelate cross-linking agent, metal salt cross-linking agent, carbodiimide cross-linking agent, oxazoline cross-linking agent, aziridine cross-linking agent, amine cross-linking agent, silicone Cross-linking agent, silane cross-linking agent, etc. Among the above-mentioned cross-linking agents, from the viewpoint of excellent impact resistance of the formed adhesive layer, an isocyanate-based cross-linking agent is preferred.
上述交聯劑中之官能基數為2以上,較佳為2~4,更佳為2~3。特別是就所形成之黏著劑層之耐衝擊性尤為優異之觀點而言,較佳為官能基數處於上述範圍內之異氰酸酯系交聯劑。The number of functional groups in the above-mentioned cross-linking agent is 2 or more, preferably 2-4, more preferably 2-3. In particular, from the viewpoint of particularly excellent impact resistance of the adhesive layer formed, an isocyanate-based crosslinking agent having a functional group number within the above range is preferred.
上述異氰酸酯系交聯劑(多官能異氰酸酯化合物)例如可例舉:1,2-伸乙基二異氰酸酯、1,4-伸丁基二異氰酸酯、1,5-五亞甲基二異氰酸酯、1,6-六亞甲基二異氰酸酯等低級脂肪族聚異氰酸酯類;伸環戊基二異氰酸酯、伸環己基二異氰酸酯、異佛爾酮二異氰酸酯、氫化甲苯二異氰酸酯、氫化二甲苯二異氰酸酯等脂環族聚異氰酸酯類;2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、4,4'-二苯甲烷二異氰酸酯、苯二甲基二異氰酸酯等芳香族聚異氰酸酯類等。又,上述異氰酸酯系交聯劑亦可例舉1,5-五亞甲基二異氰酸酯改性異氰尿酸酯、1,6-六亞甲基二異氰酸酯改性異氰尿酸酯等低級脂肪族聚異氰酸酯類改性異氰尿酸酯。進而,亦可例舉:乙二醇/1,2-伸乙基二異氰酸酯、1,4-伸丁基二異氰酸酯、1,5-五亞甲基二異氰酸酯、1,6-六亞甲基二異氰酸酯等低級脂肪族聚異氰酸酯類加成物;1,4-丁二醇/1,2-伸乙基二異氰酸酯、1,4-伸丁基二異氰酸酯、1,5-五亞甲基二異氰酸酯、1,6-六亞甲基二異氰酸酯等低級脂肪族聚異氰酸酯類加成物;1,6-己二醇/1,2-伸乙基二異氰酸酯、1,4-伸丁基二異氰酸酯、1,5-五亞甲基二異氰酸酯、1,6-六亞甲基二異氰酸酯等低級脂肪族聚異氰酸酯類加成物;三羥甲基丙烷/甲苯二異氰酸酯加成物、三羥甲基丙烷/六亞甲基二異氰酸酯加成物、三羥甲基丙烷/苯二甲基二異氰酸酯加成物等。Examples of the isocyanate cross-linking agent (polyfunctional isocyanate compound) include: 1,2-ethylidene diisocyanate, 1,4-butylene diisocyanate, 1,5-pentamethylene diisocyanate, 1, 6-Hexamethylene diisocyanate and other low-grade aliphatic polyisocyanates; cyclopentyl diisocyanate, cyclohexyl diisocyanate, isophorone diisocyanate, hydrogenated toluene diisocyanate, hydrogenated xylene diisocyanate and other alicyclic Polyisocyanates; aromatic polyisocyanates such as 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate, etc. Examples of the isocyanate cross-linking agent include lower fats such as 1,5-pentamethylene diisocyanate-modified isocyanurate and 1,6-hexamethylene diisocyanate-modified isocyanurate. Family polyisocyanate modified isocyanurate. Furthermore, examples may include: ethylene glycol/1,2-ethylene diisocyanate, 1,4-butylene diisocyanate, 1,5-pentamethylene diisocyanate, and 1,6-hexamethylene Lower aliphatic polyisocyanate adducts such as diisocyanate; 1,4-butanediol/1,2-ethylidene diisocyanate, 1,4-butylene diisocyanate, 1,5-pentamethylene diisocyanate Isocyanate, 1,6-hexamethylene diisocyanate and other lower aliphatic polyisocyanate adducts; 1,6-hexanediol/1,2-ethylidene diisocyanate, 1,4-butylene diisocyanate , 1,5-pentamethylene diisocyanate, 1,6-hexamethylene diisocyanate and other lower aliphatic polyisocyanate adducts; trimethylolpropane/toluene diisocyanate adduct, trimethylolpropane Propane/hexamethylene diisocyanate adduct, trimethylolpropane/xylylene diisocyanate adduct, etc.
上述環氧系交聯劑(多官能環氧化合物)例如可例舉:N,N,N',N'-四縮水甘油基間苯二甲胺、二縮水甘油基苯胺、1,3-雙(N,N-二縮水甘油胺甲基)環己烷、1,6-己二醇二縮水甘油醚、新戊二醇二縮水甘油醚、乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、聚乙二醇二縮水甘油醚、聚丙二醇二縮水甘油醚、山梨醇聚縮水甘油醚、甘油聚縮水甘油醚、季戊四醇聚縮水甘油醚、聚甘油聚縮水甘油醚、山梨醇酐聚縮水甘油醚、三羥甲基丙烷聚縮水甘油醚、己二酸二縮水甘油酯、鄰苯二甲酸二縮水甘油酯、三(2-羥基乙基)異氰尿酸三縮水甘油酯、間苯二酚二縮水甘油醚、雙酚-S-二縮水甘油醚、以及於分子內具有2個以上之環氧基之環氧系樹脂等。Examples of the epoxy cross-linking agent (polyfunctional epoxy compound) include: N,N,N',N'-tetraglycidyl metaxylylenediamine, diglycidyl aniline, 1,3-bis (N,N-diglycidylamine methyl)cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether , polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl ether , trimethylolpropane polyglycidyl ether, diglycidyl adipate, diglycidyl phthalate, tris(2-hydroxyethyl)triglycidyl isocyanurate, resorcinol diglycidyl Glyceryl ether, bisphenol-S-diglycidyl ether, and epoxy resins having two or more epoxy groups in the molecule, etc.
上述黏著劑組合物中之上述交聯劑之含量相對於上述聚酯系樹脂之總量100質量份較佳為0.1質量份以上。又,上述含量相對於上述聚酯系樹脂之總量100質量份較佳為30質量份以下,更佳為25質量份以下,進而較佳為20質量份以下,進而較佳為16質量份以下,進而較佳為12質量份以下,尤佳為10質量份以下。若交聯劑之含量為0.1質量份以上,則黏著劑層之凝集力提高。另一方面,若交聯劑之含量為30質量份以下,則黏著劑層具有適度之柔軟性,黏著力容易提高。The content of the cross-linking agent in the adhesive composition is preferably 0.1 parts by mass or more based on 100 parts by mass of the total amount of the polyester resin. Moreover, the above-mentioned content is preferably 30 parts by mass or less, more preferably 25 parts by mass or less, further preferably 20 parts by mass or less, based on 100 parts by mass of the total amount of the polyester-based resin. , more preferably 12 parts by mass or less, particularly preferably 10 parts by mass or less. If the content of the cross-linking agent is 0.1 parts by mass or more, the cohesion of the adhesive layer will be improved. On the other hand, if the content of the cross-linking agent is 30 parts by mass or less, the adhesive layer has moderate flexibility and the adhesive force is easily improved.
(交聯觸媒) 為了使交聯反應更有效地進行,上述黏著劑組合物除上述交聯劑外亦可包含交聯觸媒。上述交聯觸媒可僅使用一種,亦可使用兩種以上。 (cross-linking catalyst) In order to make the cross-linking reaction proceed more efficiently, the above-mentioned adhesive composition may also contain a cross-linking catalyst in addition to the above-mentioned cross-linking agent. Only one type of the above-mentioned cross-linking catalyst may be used, or two or more types may be used.
上述交聯觸媒可例舉:四乙醯丙酮鋯、單乙醯丙酮鋯、乙醯乙酸乙酯鋯、辛酸鋯化合物等含鋯化合物(鋯系觸媒);二月桂酸二辛基錫、二月桂酸二丁基錫、二乙酸二丁基錫、二乙醯丙酮二丁基錫、四正丁基錫、氫氧化三甲基錫、氧化丁基錫等含錫(Sn)化合物(錫系觸媒);第二丁醇鋁、三乙醯丙酮鋁、雙乙醯乙酸乙酯鋁、三乙醯乙酸乙酯鋁等含鋁化合物(鋁系觸媒);乙醯丙酮鐵等含鐵化合物(鐵系觸媒);鈦酸四異丙酯、鈦酸四正丁酯、鈦酸丁酯二聚物、鈦酸四辛酯、乙醯丙酮鈦、四乙醯丙酮鈦、乙醯乙酸乙酯鈦等含鈦化合物(鈦系觸媒)等有機金屬觸媒。Examples of the cross-linking catalyst include zirconium-containing compounds (zirconium-based catalysts) such as zirconium tetraacetyl acetone, zirconium monoacetyl acetonate, zirconium acetate ethyl acetate, and zirconium octoate compounds; dioctyltin dilaurate, Tin (Sn) compounds (tin-based catalysts) such as dibutyltin dilaurate, dibutyltin diacetate, dibutyltin diethyl acetone, tetra-n-butyltin, trimethyltin hydroxide, butyltin oxide, etc.; second aluminum butoxide , aluminum triacetyl acetonate, aluminum bis acetate ethyl acetate, aluminum triacetyl ethyl acetate and other aluminum-containing compounds (aluminum catalysts); iron acetate acetonate and other iron-containing compounds (iron-based catalysts); titanic acid Tetraisopropyl titanate, tetra-n-butyl titanate, butyl titanate dimer, tetraoctyl titanate, titanium acetyl acetonate, titanium tetraacetyl acetonate, titanium acetate ethyl acetate and other titanium-containing compounds (titanium series Catalyst) and other organic metal catalysts.
上述黏著劑組合物中之上述交聯觸媒之含量相對於上述聚酯系樹脂之總量100質量份較佳為0.001質量份以上,更佳為0.005質量份以上,進而較佳為0.01質量份以上。又,上述交聯觸媒之含量相對於上述聚酯系樹脂之總量100質量份較佳為3質量份以下,更佳為2質量份以下,進而較佳為1質量份以下。The content of the cross-linking catalyst in the adhesive composition is preferably 0.001 parts by mass or more, more preferably 0.005 parts by mass or more, and still more preferably 0.01 parts by mass relative to 100 parts by mass of the total amount of the polyester resin. above. Furthermore, the content of the cross-linking catalyst is preferably 3 parts by mass or less, more preferably 2 parts by mass or less, and still more preferably 1 part by mass or less based on 100 parts by mass of the total amount of the polyester resin.
(耐水解劑) 上述黏著劑組合物亦可包含耐水解劑(抗水解劑)。藉由添加耐水解劑,黏著劑組合物或黏著劑層中之水解反應受到抑制,容易獲得良好之耐久性。上述耐水解劑可僅使用一種,亦可使用兩種以上。 (Hydrolysis resistant agent) The above-mentioned adhesive composition may also contain a hydrolysis-resistant agent (anti-hydrolysis agent). By adding a hydrolysis-resistant agent, the hydrolysis reaction in the adhesive composition or adhesive layer is suppressed, making it easier to obtain good durability. Only one type of the above-mentioned hydrolysis-resistant agent may be used, or two or more types may be used.
上述耐水解劑並無特別限定,可使用公知或常用之耐水解劑。上述耐水解劑例如可例舉含㗁唑啉基之化合物、含環氧基之化合物、含碳二亞胺基之化合物等。其中,較佳為含碳二亞胺基之化合物。The above-mentioned hydrolysis-resistant agent is not particularly limited, and known or commonly used hydrolysis-resistant agents can be used. Examples of the hydrolysis-resistant agent include oxazoline group-containing compounds, epoxy group-containing compounds, carbodiimide group-containing compounds, and the like. Among them, compounds containing carbodiimide groups are preferred.
上述含碳二亞胺基之化合物可例舉:二環己基碳二亞胺、二異丙基碳二亞胺、二甲基碳二亞胺、二異丁基碳二亞胺、二辛基碳二亞胺、第三丁基異丙基碳二亞胺、二苯基碳二亞胺、二第三丁基碳二亞胺、二-β-萘基碳二亞胺、聚碳二亞胺、環狀結構碳二亞胺等。上述聚碳二亞胺係2個以上之碳二亞胺基藉由脂肪族基、脂環族基、芳香族基、或由其等之組合構成之鍵結基所鍵結成之化合物。又,上述環狀結構碳二亞胺係如下化合物,其於分子結構內具有1個以上之碳二亞胺基,且藉由脂肪族基、脂環族基、芳香族基、或由其等之組合構成之鍵結基將碳二亞胺基之第1氮原子與第2氮原子鍵結而形成有環結構。上述鍵結基亦可具有雜原子或取代基。Examples of the above carbodiimide group-containing compounds include: dicyclohexylcarbodiimide, diisopropylcarbodiimide, dimethylcarbodiimide, diisobutylcarbodiimide, and dioctyl Carbodiimide, tert-butylisopropylcarbodiimide, diphenylcarbodiimide, di-tert-butylcarbodiimide, di-β-naphthylcarbodiimide, polycarbodiimide Amine, cyclic structure carbodiimide, etc. The above-mentioned polycarbodiimide is a compound in which two or more carbodiimide groups are bonded through a bonding group composed of an aliphatic group, an alicyclic group, an aromatic group, or a combination thereof. Moreover, the above-mentioned cyclic structural carbodiimide is a compound having one or more carbodiimide groups in the molecular structure, and is formed by an aliphatic group, an alicyclic group, an aromatic group, or the like. The bonding group formed by the combination bonds the first nitrogen atom and the second nitrogen atom of the carbodiimide group to form a ring structure. The above-mentioned bonding group may have a heteroatom or a substituent.
上述黏著劑組合物中之上述耐水解劑之含量相對於上述聚酯系樹脂之總量100質量份較佳為0.1質量份以上,更佳為0.2質量份以上,進而較佳為0.3質量份以上。上述耐水解劑之含量例如為5質量份以下,較佳為3質量份以下,更佳為1質量份以下。The content of the hydrolysis-resistant agent in the adhesive composition is preferably 0.1 parts by mass or more, more preferably 0.2 parts by mass or more, and further preferably 0.3 parts by mass or more relative to 100 parts by mass of the total amount of the polyester resin. . The content of the hydrolysis-resistant agent is, for example, 5 parts by mass or less, preferably 3 parts by mass or less, and more preferably 1 part by mass or less.
上述黏著劑組合物亦可於無損本發明之效果之範圍內視需要包含上述各成分以外之其他成分。上述其他成分例如可例舉:上述聚酯系樹脂以外之樹脂、硬化觸媒、交聯促進劑、聚合起始劑、黏著賦予樹脂(松香酯樹脂、萜酚樹脂、聚萜烯樹脂、石油樹脂等)、低聚物、防老化劑、填充劑(金屬粉、有機填充劑、無機填充劑等)、著色劑(顏料或染料等)、抗氧化劑、塑化劑、軟化劑、界面活性劑、抗靜電劑、表面潤滑劑、調平劑、光穩定劑、紫外線吸收劑、聚合抑制劑、防銹劑、粒狀物、箔狀物、阻燃劑、矽烷偶合劑、離子捕捉劑等。上述其他成分分別可僅使用一種,亦可使用兩種以上。The above-mentioned adhesive composition may also contain other components than the above-mentioned components as necessary within the range that does not impair the effects of the present invention. Examples of the above-mentioned other components include resins other than the above-mentioned polyester-based resins, curing catalysts, cross-linking accelerators, polymerization initiators, and adhesion-imparting resins (rosin ester resin, terpene phenol resin, polyterpene resin, petroleum resin). etc.), oligomers, anti-aging agents, fillers (metal powder, organic fillers, inorganic fillers, etc.), colorants (pigments or dyes, etc.), antioxidants, plasticizers, softeners, surfactants, Antistatic agents, surface lubricants, leveling agents, light stabilizers, UV absorbers, polymerization inhibitors, rust inhibitors, granules, foils, flame retardants, silane coupling agents, ion capture agents, etc. Only one type of the above-mentioned other components may be used, or two or more types may be used.
上述黏著劑組合物可具有任意形態,例如可例舉溶劑型、乳液型、熱熔型(hot-melt type)、無溶劑型等。The adhesive composition may have any form, and examples thereof include solvent type, emulsion type, hot-melt type, and solvent-free type.
如上所述,本發明之黏著劑組合物可為溶劑型,即可含有有機溶劑。上述有機溶劑只要為用作溶劑之有機化合物則無特別限定,例如可例舉:環己烷、己烷、庚烷、甲基環己烷等烴系溶劑;甲苯、二甲苯等芳香族系溶劑;乙酸丁酯、乙酸乙酯、乙酸甲酯等酯系溶劑;丙酮、甲基乙基酮、甲基異丁基酮等酮系溶劑;甲醇、乙醇、丙醇、丁醇、異丙醇等醇系溶劑;碳酸二甲酯、碳酸二乙酯等碳酸酯系溶劑等。上述有機溶劑可僅使用一種,亦可使用兩種以上。As mentioned above, the adhesive composition of the present invention can be solvent-based, that is, it can contain an organic solvent. The above-mentioned organic solvent is not particularly limited as long as it is an organic compound used as a solvent. Examples thereof include hydrocarbon solvents such as cyclohexane, hexane, heptane, and methylcyclohexane; and aromatic solvents such as toluene and xylene. ; Ester-based solvents such as butyl acetate, ethyl acetate, methyl acetate, etc.; Ketone-based solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, etc.; Methanol, ethanol, propanol, butanol, isopropyl alcohol, etc. Alcohol-based solvents; carbonate-based solvents such as dimethyl carbonate and diethyl carbonate, etc. Only one type of the above-mentioned organic solvent may be used, or two or more types may be used.
上述黏著劑組合物於相對於上述聚酯系樹脂100質量份添加水解促進劑40質量份而形成了黏著劑層時之水解試驗中,兩週後之凝膠分率保持率較佳為70%以上,更佳為75%以上,進而較佳為80%以上。若上述凝膠分率保持率為70%以上,則不易產生上述聚酯系樹脂之水解。關於上述凝膠分率保持率,具體而言係指對於由對聚酯系樹脂100質量份添加水解促進劑(例如高酸值松香酯樹脂)40質量份而成之黏著劑組合物所形成之凝膠分率,於調整為85℃、85%RH之恆溫恆濕槽中保管336小時(兩週),將保管0小時之樣品之凝膠分率設為(x)、保管336小時之樣品之凝膠分率設為(y),由下式算出凝膠分率保持率。 凝膠分率保持率=(y/x)×100 In the hydrolysis test when the above-mentioned adhesive composition is added with 40 parts by mass of a hydrolysis accelerator to 100 parts by mass of the above-mentioned polyester resin to form an adhesive layer, the gel fraction retention rate after two weeks is preferably 70%. Above, more preferably 75% or more, still more preferably 80% or more. If the above-mentioned gel fraction retention rate is 70% or more, hydrolysis of the above-mentioned polyester resin will not easily occur. The above-mentioned gel fraction retention rate specifically refers to an adhesive composition formed by adding 40 parts by mass of a hydrolysis accelerator (for example, a high acid value rosin ester resin) to 100 parts by mass of a polyester resin. The gel fraction is stored in a constant temperature and humidity chamber adjusted to 85°C and 85%RH for 336 hours (two weeks). The gel fraction of the sample stored for 0 hours is set to (x), and the gel fraction of the sample stored for 336 hours is The gel fraction is set to (y), and the gel fraction retention rate is calculated from the following formula. Gel fraction retention rate=(y/x)×100
[黏著劑層] 可使用上述黏著劑組合物形成黏著劑層。有時將使用本發明之黏著劑組合物所形成之黏著劑層稱為「本發明之黏著劑層」。上述黏著劑層例如可藉由如下方式製作:將上述黏著劑組合物塗佈於剝離襯墊之剝離處理面或基材而形成黏著劑組合物層,隨後藉由利用加熱進行之脫溶劑使上述黏著劑組合物層固化。 [Adhesive layer] The above adhesive composition can be used to form an adhesive layer. The adhesive layer formed using the adhesive composition of the present invention is sometimes referred to as the "adhesive layer of the present invention". The above-mentioned adhesive layer can be produced, for example, by applying the above-mentioned adhesive composition to the release treatment surface of the release liner or the base material to form an adhesive composition layer, and then desolvating the above-mentioned adhesive composition by heating. The adhesive composition layer is cured.
上述黏著劑層較佳為包含上述聚酯系樹脂(尤其是包含上述聚酯系樹脂作為基礎聚合物)。上述聚酯系樹脂相對於上述黏著劑層所包含之所有樹脂之總量100質量%之含有率較佳為超過50質量%,更佳為60質量%以上,進而較佳為70質量%以上,亦可為80質量%以上、90質量%以上、或95質量%以上。The adhesive layer preferably contains the polyester resin (especially the polyester resin as a base polymer). The content rate of the polyester resin based on 100 mass% of the total amount of all resins included in the adhesive layer is preferably more than 50 mass%, more preferably 60 mass% or more, and still more preferably 70 mass% or more. It may be 80 mass% or more, 90 mass% or more, or 95 mass% or more.
上述黏著劑層中之上述聚酯系樹脂之含有率相對於上述黏著劑層之總量100質量%較佳為超過50質量%,更佳為60質量%以上,進而較佳為70質量%以上,亦可為80質量%以上。The content rate of the polyester resin in the adhesive layer is preferably more than 50 mass%, more preferably 60 mass% or more, and further preferably 70 mass% or more relative to 100 mass% of the total amount of the adhesive layer. , it can also be 80 mass% or more.
上述黏著劑層亦可於無損本發明之效果之範圍內包含上述聚酯系樹脂以外之其他成分。上述其他成分可例舉作為上述黏著劑組合物可包含之成分進行例示及說明者。上述其他成分可僅使用一種,亦可使用兩種以上。The above-mentioned adhesive layer may also contain other components other than the above-mentioned polyester resin within the range that does not impair the effects of the present invention. Examples of the above-mentioned other components include those illustrated and described as components that can be included in the above-mentioned adhesive composition. Only one type of the above-mentioned other components may be used, or two or more types may be used.
上述黏著劑層於頻率100 kHz下之介電常數較佳為4.0以下,更佳為3.6以下,進而較佳為3.5以下,進而較佳為3.4以下,進而較佳為3.3以下,尤佳為3.2以下。若上述介電常數為4.0以下,則由上述黏著劑組合物所形成之黏著劑層之介電常數較低,不易引起例如雜訊之放大,又,能夠抑制毫米波之輻射損耗。再者,「相對介電常數」係將「介電常數」除以「真空之介電常數」所得之值,由於「真空之介電常數」為1,故而於本說明書中,將「介電常數」視為與「相對介電常數」含義相同。The dielectric constant of the above-mentioned adhesive layer at a frequency of 100 kHz is preferably 4.0 or less, more preferably 3.6 or less, further preferably 3.5 or less, further preferably 3.4 or less, further preferably 3.3 or less, especially 3.2 the following. If the dielectric constant is 4.0 or less, the adhesive layer formed from the adhesive composition has a low dielectric constant and is less likely to cause amplification of noise, for example, and can suppress millimeter wave radiation losses. Furthermore, "relative permittivity" is the value obtained by dividing "dielectric constant" by "dielectric constant of vacuum". Since "dielectric constant of vacuum" is 1, in this specification, "dielectric constant" "Constant" is considered to have the same meaning as "relative permittivity".
上述黏著劑層於頻率100 kHz下之介電損耗較佳為0.15以下,更佳為0.13以下,進而較佳為0.12以下,進而較佳為0.11以下,進而較佳為0.10以下,進而較佳為0.09以下,尤佳為0.08以下。若上述介電損耗為0.15以下,則由上述黏著劑組合物所形成之黏著劑層之由熱所致之能量損失較小,不易引起例如雜訊之放大,又,能夠抑制毫米波之輻射損耗。上述介電損耗例如為0.0001以上。The dielectric loss of the above-mentioned adhesive layer at a frequency of 100 kHz is preferably 0.15 or less, more preferably 0.13 or less, further preferably 0.12 or less, further preferably 0.11 or less, further preferably 0.10 or less, further preferably 0.10 or less, and further preferably 0.10 or less. 0.09 or less, preferably 0.08 or less. If the above-mentioned dielectric loss is 0.15 or less, the energy loss caused by heat in the adhesive layer formed by the above-mentioned adhesive composition is small, and it is less likely to cause the amplification of noise, and in addition, the radiation loss of millimeter waves can be suppressed. . The dielectric loss is, for example, 0.0001 or more.
於本說明書中,頻率100 kHz下之介電常數及介電損耗係基於JIS K6911進行測定,頻率28 GHz及60 GHz下之介電常數及介電損耗係基於JIS R1660-2進行測定,具體而言係藉由下文所揭示之實施例所記載之方法進行測定。上述介電常數及上述介電損耗可藉由調整聚酯系樹脂之單體組成、添加劑之種類或含量等而進行調整。In this specification, the dielectric constant and dielectric loss at the frequency of 100 kHz are measured based on JIS K6911, and the dielectric constant and dielectric loss at the frequency of 28 GHz and 60 GHz are measured based on JIS R1660-2. Specifically, The expression is measured by the method described in the examples disclosed below. The dielectric constant and the dielectric loss can be adjusted by adjusting the monomer composition of the polyester resin, the type or content of additives, and the like.
上述黏著劑層之全光線透過率(基於JIS K7361-1)並無特別限定,較佳為88%以上,更佳為89%以上,進而較佳為90%以上。若全光線透過率為88%以上,則可獲得優異之透明性或優異之外觀,能夠良好地用於光學用途。The total light transmittance (based on JIS K7361-1) of the above-mentioned adhesive layer is not particularly limited, but is preferably 88% or more, more preferably 89% or more, and further preferably 90% or more. If the total light transmittance is 88% or more, excellent transparency or excellent appearance can be obtained, and it can be used well for optical purposes.
再者,藉由使用積層有黏著劑層及光學膜之積層體,利用與上文相同之方法評價全光線透過率,可設為黏著劑層之全光線透過率之標準。具體而言,例如於上述光學膜之全光線透過率接近100%之情形時,可判斷上述積層體之全光線透過率與上述黏著劑層之全光線透過率程度相同。Furthermore, by using a laminate in which an adhesive layer and an optical film are laminated, the total light transmittance is evaluated using the same method as above, and the total light transmittance of the adhesive layer can be set as a standard. Specifically, for example, when the total light transmittance of the optical film is close to 100%, it can be judged that the total light transmittance of the laminated body and the total light transmittance of the adhesive layer are approximately the same.
上述黏著劑層之霧度(基於JIS K7136)並無特別限定,較佳為1.5%以下,更佳為1.4%以下,進而較佳為1.3%以下,進而較佳為1.2%以下,進而較佳為1.0%以下,進而較佳為0.9%以下,進而較佳為0.8%以下,進而較佳為0.7%以下,尤佳為0.6%以下。若霧度為1.5%以下,則可獲得優異之透明性或優異之外觀,能夠良好地用於光學用途。The haze (based on JIS K7136) of the above-mentioned adhesive layer is not particularly limited, but is preferably 1.5% or less, more preferably 1.4% or less, still more preferably 1.3% or less, still more preferably 1.2% or less, still more preferably It is 1.0% or less, more preferably 0.9% or less, still more preferably 0.8% or less, still more preferably 0.7% or less, particularly preferably 0.6% or less. If the haze is 1.5% or less, excellent transparency or excellent appearance can be obtained, and it can be used favorably for optical purposes.
再者,藉由使用積層有黏著劑層與光學膜之積層體,利用與上文相同之方法評價霧度,可設為黏著劑層之霧度值之標準。具體而言,例如於上述光學膜之霧度值接近0%之情形時,可判斷上述積層體之霧度值與上述黏著劑層之霧度值程度相同。Furthermore, by using a laminate in which an adhesive layer and an optical film are laminated, the haze is evaluated using the same method as above, and the haze value of the adhesive layer can be used as a standard. Specifically, for example, when the haze value of the optical film is close to 0%, it can be determined that the haze value of the laminate is the same as the haze value of the adhesive layer.
關於上述黏著劑層之色相,以L *a *b *表色系統所表示之b *較佳為處於0.0~2.0之範圍內,更佳為0.0~1.5,進而較佳為0.0~1.2,進而較佳為0.0~1.0,進而較佳為0.0~0.8,尤佳為0.0~0.5。b *表示黃-藍之軸,於0.0~2.0之範圍內,值越小黃色調越弱,可獲得優異之透明性或優異之外觀,能夠良好地用於光學用途。於本說明書中,上述黏著劑層之L *a *b *表色系統所表示之b *係根據黏著劑層之直線透過率所算出之值。 Regarding the hue of the adhesive layer, b * represented by the L * a * b * color expression system is preferably in the range of 0.0 to 2.0, more preferably 0.0 to 1.5, further preferably 0.0 to 1.2, and further 0.0 to 1.0 is preferred, 0.0 to 0.8 is more preferred, and 0.0 to 0.5 is particularly preferred. b * represents the yellow-blue axis, in the range of 0.0 to 2.0. The smaller the value, the weaker the yellow tone. Excellent transparency or excellent appearance can be obtained, and it can be used well for optical purposes. In this specification, the b * represented by the above-mentioned L * a * b * color system of the adhesive layer is a value calculated based on the linear transmittance of the adhesive layer.
再者,藉由使用積層有黏著劑層與光學膜之積層體,利用與上文相同之方法評價色相(b *),可設為黏著劑層之色相(b *)之標準。具體而言,例如於上述光學膜之色相接近0之情形時,可判斷上述積層體之色相(b *)與上述黏著劑層之色相(b *)程度相同。 Furthermore, by using a laminate in which an adhesive layer and an optical film are laminated, the hue (b * ) can be evaluated using the same method as above, and the hue (b * ) of the adhesive layer can be set as a standard. Specifically, for example, when the hue of the optical film is close to 0, it can be determined that the hue (b * ) of the laminated body is substantially the same as the hue (b * ) of the adhesive layer.
上述黏著劑層之全光線透過率、霧度、及b *可藉由調整構成用以形成黏著劑層之黏著劑組合物之聚酯系樹脂之單體組成、添加劑之種類或含量等而進行調整。 The total light transmittance, haze, and b * of the above-mentioned adhesive layer can be adjusted by adjusting the monomer composition of the polyester resin constituting the adhesive composition used to form the adhesive layer, the type or content of the additives, etc. adjust.
上述黏著劑層相對於玻璃板之拉伸速度為300 mm/分鐘時之180°剝離黏著力並無特別限定,較佳為1 N/20 mm以上,更佳為2 N/20 mm以上,進而較佳為3 N/20 mm以上。若上述180°剝離黏著力為固定值以上,則對玻璃之黏著性、對階差中之隆起之抑止性更加優異。上述180°剝離黏著力並無特別限定,較佳為20 N/20 mm以下,更佳為18 N/20 mm以下,進而較佳為16 N/20 mm以下。The 180° peeling adhesion force of the above-mentioned adhesive layer relative to the glass plate when the stretching speed is 300 mm/min is not particularly limited, but is preferably 1 N/20 mm or more, more preferably 2 N/20 mm or more, and further Preferably it is 3 N/20 mm or more. If the above-mentioned 180° peeling adhesion force is more than a fixed value, the adhesion to glass and the ability to suppress bulges in steps will be even better. The above-mentioned 180° peeling adhesive force is not particularly limited, but is preferably 20 N/20 mm or less, more preferably 18 N/20 mm or less, and further preferably 16 N/20 mm or less.
再者,藉由使用積層有黏著劑層與光學膜之積層體,利用與上文相同之方法評價180°剝離黏著力,可設為黏著劑層之180°剝離黏著力之標準。Furthermore, by using a laminated body in which an adhesive layer and an optical film are laminated, and evaluating the 180° peel adhesion using the same method as above, it can be set as the standard for the 180° peel adhesion of the adhesive layer.
上述玻璃板並無特別限定,例如可例舉商品名「Soda Lime Glass #0050」(松浪硝子工業股份有限公司製造)。又,亦可例舉無鹼玻璃或化學強化玻璃等。The above-mentioned glass plate is not particularly limited, and for example, the product name is "Soda Lime Glass #0050" (manufactured by Matsunami Glass Industry Co., Ltd.). Moreover, alkali-free glass, chemically strengthened glass, etc. can also be mentioned.
上述180°剝離黏著力可藉由構成用以形成黏著劑層之黏著劑組合物之聚酯系樹脂之單體組成、重量平均分子量、交聯劑之使用量(添加量)、其他添加劑之種類或含量等進行控制。The above-mentioned 180° peel adhesion can be determined by the monomer composition of the polyester resin constituting the adhesive composition used to form the adhesive layer, the weight average molecular weight, the usage amount (added amount) of the cross-linking agent, and the types of other additives. or content, etc. to be controlled.
上述黏著劑層於23℃之儲存彈性模數並無特別限定,較佳為5.0×10 4Pa以上,更佳為7.5×10 4Pa以上,進而較佳為1.0×10 5Pa以上。若上述儲存彈性模數為5.0×10 4Pa以上,則不易於操作中產生凹痕,又,容易獲得良好之接著可靠性,故而較佳。又,就階差追隨性、異物吸收性之觀點而言,上述黏著劑層於25℃之儲存彈性模數較佳為2.0×10 6Pa以下,更佳為1.5×10 6Pa以下,進而較佳為1.0×10 6Pa以下。黏著劑層之儲存彈性模數係於頻率1 Hz下實施動態黏彈性時所測得者。上述儲存彈性模數係以複數表示之剪切模數之實部,可考慮樣品之泊松比而與拉伸彈性模數等進行換算。 The storage elastic modulus of the above-mentioned adhesive layer at 23°C is not particularly limited, but is preferably 5.0×10 4 Pa or above, more preferably 7.5×10 4 Pa or above, and further preferably 1.0×10 5 Pa or above. If the storage elastic modulus is 5.0×10 4 Pa or more, it is less likely to cause dents during operation and it is easier to obtain good bonding reliability, so it is preferable. In addition, from the viewpoint of step followability and foreign matter absorbability, the storage elastic modulus of the above-mentioned adhesive layer at 25°C is preferably 2.0×10 6 Pa or less, more preferably 1.5×10 6 Pa or less, and further preferably Preferably, it is 1.0×10 6 Pa or less. The storage elastic modulus of the adhesive layer is measured when performing dynamic viscoelasticity at a frequency of 1 Hz. The above-mentioned storage elastic modulus is the real part of the shear modulus expressed as a complex number, and can be converted with the tensile elastic modulus, etc. by considering the Poisson's ratio of the sample.
上述黏著劑層之儲存彈性模數可藉由構成用以形成黏著劑層之黏著劑組合物之聚酯系樹脂之單體組成、重量平均分子量、交聯劑之使用量(添加量)、其他添加劑之種類或含量等進行控制。The storage elastic modulus of the above-mentioned adhesive layer can be determined by the monomer composition of the polyester resin constituting the adhesive composition used to form the adhesive layer, the weight average molecular weight, the usage amount (added amount) of the cross-linking agent, and others. Control the type or content of additives.
上述黏著劑層之凝膠分率(不溶成分之比率)並無特別限定,較佳為5%以上,更佳為10%以上,進而較佳為15%以上。上述黏著劑層之凝膠分率(不溶成分之比率)並無特別限定,較佳為95%以下,更佳為90%以下,進而較佳為85%以下。若凝膠分率為5%以上,則上述黏著劑層之凝集力提高,不易於操作中產生凹痕。若凝膠分率為95%以下,則可獲得適度之柔軟性,黏著性、階差追隨性進一步提高,又,不易吸收異物。The gel fraction (ratio of insoluble components) of the adhesive layer is not particularly limited, but is preferably 5% or more, more preferably 10% or more, and still more preferably 15% or more. The gel fraction (ratio of insoluble components) of the adhesive layer is not particularly limited, but is preferably 95% or less, more preferably 90% or less, and still more preferably 85% or less. If the gel fraction is more than 5%, the cohesion of the adhesive layer will be improved, making it less likely to cause dents during operation. If the gel fraction is 95% or less, moderate softness can be obtained, adhesion and step following properties are further improved, and it is less likely to absorb foreign matter.
凝膠分率例如可藉由構成用以形成黏著劑層之黏著劑組合物之聚酯系樹脂之單體組成、重量平均分子量、交聯劑之使用量(添加量)、其他添加劑之種類或含量等進行控制。The gel fraction can be determined, for example, by the monomer composition of the polyester resin constituting the adhesive composition used to form the adhesive layer, the weight average molecular weight, the usage amount (added amount) of the cross-linking agent, the type of other additives, or Content, etc. are controlled.
上述黏著劑層之厚度並無特別限定,較佳為10~250 μm,更佳為10~200 μm,進而較佳為10~175 μm,進而較佳為10~150 μm,進而較佳為10~125 μm,尤佳為10~100 μm。若厚度為固定值以上,則階差追隨性或接著可靠性提高,故而較佳。若厚度為固定值以下,則不易於操作時吸收異物,又,操作性或製造性優異,故而較佳。又,上述黏著劑層即便於厚度較薄之情形時亦能夠抑制雜訊之放大。The thickness of the above-mentioned adhesive layer is not particularly limited, but is preferably 10 to 250 μm, more preferably 10 to 200 μm, further preferably 10 to 175 μm, further preferably 10 to 150 μm, further preferably 10 ~125 μm, preferably 10~100 μm. If the thickness is more than a fixed value, it is preferable because the step followability or the bonding reliability are improved. If the thickness is less than a fixed value, it is less likely to absorb foreign matter during handling, and the handleability and manufacturability are excellent, so it is preferable. In addition, the above-mentioned adhesive layer can suppress the amplification of noise even when the thickness is relatively thin.
上述黏著劑層之製造方法並無特別限定,例如可藉由如下方式製作:將上述黏著劑組合物塗佈(塗敷)於基材或實施過離型處理之剝離襯墊之離型處理面而形成塗佈層,隨後視需要進行利用加熱進行之脫溶劑或熱硬化,使該塗佈層固化。The manufacturing method of the above-mentioned adhesive layer is not particularly limited. For example, it can be manufactured by coating (coating) the above-mentioned adhesive composition on the base material or the release-treated surface of the release liner that has been subjected to release treatment. A coating layer is formed, and then, if necessary, desolvation or thermal hardening by heating is performed to solidify the coating layer.
[黏著片材] 可使用本發明之黏著劑層獲得黏著片材。有時將具備本發明之黏著劑層之黏著片材稱為「本發明之黏著片材」。上述黏著片材可為兩面均成為黏著劑層表面之雙面黏著片材,亦可為僅單面成為黏著劑層表面之單面黏著片材。其中,就將2個構件彼此貼合之觀點而言,較佳為雙面黏著片材。再者,於本說明書中,稱為「黏著片材」之情形亦包含呈帶狀者,即,亦包含「膠帶」。又,於本說明書中,有時將黏著劑層表面稱為「黏著面」。 [Adhesive sheet] An adhesive sheet can be obtained using the adhesive layer of the present invention. The adhesive sheet provided with the adhesive layer of the present invention is sometimes referred to as the "adhesive sheet of the present invention." The above-mentioned adhesive sheet may be a double-sided adhesive sheet in which both sides become the surface of the adhesive layer, or may be a single-sided adhesive sheet in which only one side becomes the surface of the adhesive layer. Among them, from the viewpoint of bonding two members to each other, a double-sided adhesive sheet is preferred. In addition, in this specification, what is called "adhesive sheet" also includes those in the form of a strip, that is, "tape" is also included. In addition, in this specification, the surface of the adhesive layer may be called "adhesive surface".
上述黏著片材可為不具有基材(基材層)之所謂「無基材型」黏著片材(以下,有時稱為「無基材黏著片材」),亦可為具有基材之類型之黏著片材(以下,有時稱為「附基材之黏著片材」)。上述無基材黏著片材例如可例舉僅包含本發明之黏著劑層之雙面黏著片材、或包含本發明之黏著劑層及除本發明之黏著劑層以外之黏著劑層(有時稱為「其他黏著劑層」)之雙面黏著片材等。另一方面,附基材之黏著片材可例舉於基材之至少單面側具有本發明之黏著劑層之黏著片材等。其中,較佳為無基材黏著片材(無基材雙面黏著片材),更佳為僅包含本發明之黏著劑層之無基材雙面黏著片材。又,於基材之兩面具有黏著劑層之黏著片材(附基材之雙面黏著片材)亦較佳。上述附基材之雙面黏著片材中兩面之黏著劑層可均為本發明之黏著劑層,亦可一者為本發明之黏著劑層,另一者為其他黏著劑層。再者,上述「基材(基材層)」不包含於黏著片材之使用(貼附)時所剝離之剝離襯墊。The above-mentioned adhesive sheet may be a so-called "base material-less type" adhesive sheet that does not have a base material (base material layer) (hereinafter, sometimes referred to as a "base material-less adhesive sheet"), or may have a base material. Type of adhesive sheet (hereinafter sometimes referred to as "adhesive sheet with base material"). The above-mentioned base-less adhesive sheet can be, for example, a double-sided adhesive sheet containing only the adhesive layer of the present invention, or an adhesive layer including the adhesive layer of the present invention and an adhesive layer other than the adhesive layer of the present invention (sometimes Double-sided adhesive sheets (called "other adhesive layers"), etc. On the other hand, examples of the adhesive sheet with a base material include an adhesive sheet having the adhesive layer of the present invention on at least one side of the base material. Among them, a substrate-free adhesive sheet (substrate-free double-sided adhesive sheet) is preferred, and a substrate-free double-sided adhesive sheet including only the adhesive layer of the present invention is more preferred. In addition, an adhesive sheet having an adhesive layer on both sides of the base material (a double-sided adhesive sheet with a base material) is also preferred. The adhesive layers on both sides of the above-mentioned double-sided adhesive sheet with a substrate can both be the adhesive layer of the present invention, or one can be the adhesive layer of the present invention and the other can be other adhesive layers. In addition, the above-mentioned "base material (base material layer)" does not include a release liner that is peeled off when using (attaching) the adhesive sheet.
於上述黏著片材為附基材之黏著片材之情形時,會產生由基材所致之毫米波之輻射損耗,因此較佳為無基材黏著片材。惟,於基材由低介電常數、低介電損耗之材料構成之情形時,亦可為附基材之黏著片材。When the above-mentioned adhesive sheet is an adhesive sheet with a base material, radiation loss of millimeter waves caused by the base material will occur, so an adhesive sheet without a base material is preferred. However, when the base material is made of a material with low dielectric constant and low dielectric loss, it can also be an adhesive sheet attached to the base material.
上述基材為於上述黏著片材中作為黏著劑層之支持體發揮作用之元件。基材例如可例舉塑膠基材(尤其是塑膠膜)。上述基材可為單層,亦可為同種或異種基材之積層體。The base material is an element that functions as a support for the adhesive layer in the adhesive sheet. Examples of the base material include plastic base materials (especially plastic films). The above-mentioned base material may be a single layer or a laminate of base materials of the same type or different types.
上述基材並無特別限定,例如可例舉塑膠膜、抗反射(AR)膜、防眩(AG)膜、偏光板、相位差板等各種光學膜。上述塑膠膜等之素材例如可例舉:聚對苯二甲酸乙二酯(PET)等聚酯系樹脂、聚甲基丙烯酸甲酯(PMMA)等丙烯酸系樹脂、聚碳酸酯、三乙醯纖維素(TAC)、聚碸、聚芳酯、聚醯亞胺、聚氯乙烯、聚乙酸乙烯酯、聚乙烯、聚丙烯、乙烯-丙烯共聚物、商品名「ARTON」(環狀烯烴系聚合物、JSR股份有限公司製造)、商品名「ZEONOR」(環狀烯烴系聚合物、日本瑞翁股份有限公司製造)等環狀烯烴系聚合物、氟系聚合物等塑膠材料。再者,該等塑膠材料可僅使用一種,亦可使用兩種以上。The above-mentioned base material is not particularly limited, and examples thereof include various optical films such as plastic films, anti-reflection (AR) films, anti-glare (AG) films, polarizing plates, and phase difference plates. Examples of materials for the plastic film include polyester resins such as polyethylene terephthalate (PET), acrylic resins such as polymethyl methacrylate (PMMA), polycarbonate, and triacetyl fiber. TAC, polystyrene, polyarylate, polyimide, polyvinyl chloride, polyvinyl acetate, polyethylene, polypropylene, ethylene-propylene copolymer, trade name "ARTON" (cyclic olefin polymer , JSR Co., Ltd.), trade name "ZEONOR" (cyclic olefin polymer, manufactured by Japan Zeon Co., Ltd.) and other plastic materials such as cyclic olefin polymers and fluorine polymers. Furthermore, only one type of plastic material can be used, or two or more types of plastic materials can be used.
為了提高與黏著劑層之密接性、保持性等,亦可對上述基材之具備上述黏著劑層一側之表面實施表面處理,例如電暈放電處理、電漿處理、磨砂加工處理、臭氧暴露處理、火焰暴露處理、高壓電擊暴露處理、離子化輻射處理等物理處理;鉻酸處理等化學處理;利用塗佈劑(底塗劑)進行之易接著處理等。較佳為對基材之黏著劑層側之表面整體實施用以提高密接性之表面處理。In order to improve the adhesion and retention with the adhesive layer, the surface of the above-mentioned base material on the side with the above-mentioned adhesive layer can also be subjected to surface treatment, such as corona discharge treatment, plasma treatment, frosting treatment, ozone exposure Physical treatments such as treatment, flame exposure treatment, high-voltage electric shock exposure treatment, and ionizing radiation treatment; chemical treatments such as chromic acid treatment; easy-adhesion treatment using a coating agent (primer), etc. It is preferable that the entire surface of the adhesive layer side of the base material be subjected to surface treatment for improving adhesion.
上述基材亦可為雜訊減輕膜。雜訊減輕膜只要具有減輕雜訊之性能則無特別限定,可例舉於膜基材之至少單面形成有雜訊減輕層者。雜訊減輕層可為單層亦可為複數層,只要具有減輕電磁雜訊之功能則無特別限定,就透明性之觀點而言,較佳為透明導電層。作為透明導電層,可採用由導電性有機或無機材料所形成之薄膜層、導電性有機或無機材料部分接觸而形成之導電層。The above-mentioned base material may also be a noise reduction film. The noise reduction film is not particularly limited as long as it has the performance of reducing noise. An example of the noise reduction film is one in which a noise reduction layer is formed on at least one side of the film base material. The noise reduction layer may be a single layer or a plurality of layers, and is not particularly limited as long as it has the function of reducing electromagnetic noise. From the perspective of transparency, a transparent conductive layer is preferred. As the transparent conductive layer, a thin film layer formed of conductive organic or inorganic materials, or a conductive layer formed by partial contact of conductive organic or inorganic materials can be used.
上述黏著片材亦可於使用前於黏著面設置有剝離襯墊。剝離襯墊於使用上述黏著劑層之前保護相接之黏著面,並於使用上述黏著劑層時剝離。再者,於上述黏著片材為雙面黏著片材之情形時,各黏著面可分別由兩塊剝離襯墊所保護,亦可由兩面成為剝離面之一塊剝離襯墊以捲繞成輥狀之形態加以保護。剝離襯墊係用作黏著劑層之保護材,並於貼附至被黏著體時剝離。又,於上述黏著片材為無基材黏著片材之情形時,剝離襯墊亦可用作黏著劑層之支持體。再者,不一定要設置剝離襯墊。The above-mentioned adhesive sheet may also be provided with a release liner on the adhesive surface before use. The release liner protects the connected adhesive surfaces before using the adhesive layer, and peels off when using the adhesive layer. Furthermore, when the above-mentioned adhesive sheet is a double-sided adhesive sheet, each adhesive surface can be protected by two release liners respectively, or the two surfaces can be used as one of the release surfaces and one release liner can be rolled into a roll shape. form to be protected. The release liner is used as a protective material for the adhesive layer and is peeled off when attached to the adherend. In addition, when the above-mentioned adhesive sheet is an adhesive sheet without a base material, the release liner can also be used as a support for the adhesive layer. Furthermore, it is not necessary to provide a release liner.
上述剝離襯墊之基材例如可例舉:聚乙烯膜、聚丙烯膜、聚丁烯膜、聚丁二烯膜、聚甲基戊烯膜、聚氯乙烯膜、氯乙烯共聚物膜、聚對苯二甲酸乙二酯膜、聚萘二甲酸乙二酯膜、聚對苯二甲酸丁二酯膜、聚胺基甲酸酯膜、乙烯-乙酸乙烯酯膜、離子聚合物樹脂膜、乙烯-(甲基)丙烯酸共聚物膜、乙烯-(甲基)丙烯酸酯共聚物膜、聚苯乙烯膜、聚碳酸酯膜、聚醯亞胺膜、氟樹脂膜等。又,亦可例舉其等之交聯膜。進而,亦可為其等之積層膜。Examples of the base material of the release liner include: polyethylene film, polypropylene film, polybutylene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene film, etc. Ethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film, polyurethane film, ethylene vinyl acetate film, ionomer resin film, ethylene -(meth)acrylic acid copolymer film, ethylene-(meth)acrylate copolymer film, polystyrene film, polycarbonate film, polyimide film, fluororesin film, etc. Furthermore, cross-linked films thereof may also be exemplified. Furthermore, a laminated film thereof may also be used.
較佳為對上述剝離襯墊之剝離面(尤其是與上述黏著劑層相接之面)實施有剝離處理。剝離處理所使用之剝離劑例如可例舉醇酸系、矽酮系、氟系、不飽和聚酯系、聚烯烴系、蠟系剝離劑。It is preferable that the release surface of the release liner (especially the surface in contact with the adhesive layer) is subjected to a release treatment. Examples of the release agent used in the release treatment include alkyd-based, silicone-based, fluorine-based, unsaturated polyester-based, polyolefin-based, and wax-based release agents.
上述剝離襯墊之厚度並無特別限定,例如為20~150 μm左右。The thickness of the release liner is not particularly limited, but is, for example, about 20 to 150 μm.
[用途] 本發明之黏著劑組合物、本發明之黏著劑層、及本發明之黏著片材之用途並無特別限定,可用於任何用途。例如可用於光學用途、即貼合於光學構件之用途。藉由將本發明之黏著劑組合物、本發明之黏著劑層、及本發明之黏著片材用於光學用途,可靠性優異。例如,推測由於上述聚酯系樹脂與丙烯酸系樹脂不同,不具有碳-碳雙鍵,故而不易經時地黃變,特別適於光學用途。 [use] The uses of the adhesive composition of the present invention, the adhesive layer of the present invention, and the adhesive sheet of the present invention are not particularly limited and can be used for any purpose. For example, it can be used for optical applications, that is, for bonding to optical components. By using the adhesive composition of the present invention, the adhesive layer of the present invention, and the adhesive sheet of the present invention for optical purposes, reliability is excellent. For example, it is presumed that the polyester resin, unlike the acrylic resin, does not have a carbon-carbon double bond and therefore is less susceptible to yellowing over time and is particularly suitable for optical applications.
本發明之黏著劑組合物、本發明之黏著劑層、及本發明之黏著片材例如於在電氣電子機器等光學構件中將各種構件或零件安裝(裝配)至特定部位(例如殼體、前面板、窗部分等)時使用。再者,「電氣電子機器」係指屬於電氣機器或電子機器之至少任一者之機器。上述電氣電子機器例如可例舉液晶顯示器、有機/無機電致發光顯示器、電漿顯示器等圖像顯示裝置、或攜帶型電子機器等。上述圖像顯示裝置可例舉上述攜帶型電子機器之圖像顯示裝置、或車載用顯示器、數位標牌(電子看板、電子公告板)等。再者,上述圖像顯示裝置可為所謂之「剛性型」、所謂之「軟性型」等形態(構造),又,亦可為所謂之「可摺疊型」或「可捲曲型」等可彎曲或摺疊之形態(構造)。The adhesive composition of the present invention, the adhesive layer of the present invention, and the adhesive sheet of the present invention are used, for example, in mounting (assembly) various components or parts to specific parts (such as casings, front surfaces, etc.) in optical components such as electrical and electronic equipment. Used when using panels, window parts, etc.). Furthermore, "electrical and electronic equipment" means equipment that is at least either an electrical machine or an electronic machine. Examples of the electrical and electronic equipment include image display devices such as liquid crystal displays, organic/inorganic electroluminescent displays, and plasma displays, and portable electronic equipment. Examples of the image display device include the image display device of the portable electronic device, a vehicle-mounted display, a digital signage (electronic signage, electronic bulletin board), and the like. Furthermore, the above-mentioned image display device may be a so-called "rigid type" or a so-called "soft type" (structure), or may be a so-called "foldable type" or "rollable type" that is bendable. Or folded form (structure).
上述攜帶型電子機器例如可例舉:手機、智慧型手機、平板型個人電腦、筆記型個人電腦、各種可穿戴設備(例如,如手錶般穿戴於手腕之腕具型、利用夾具或帶條等穿戴於身體之一部分之模組型、包含眼鏡型(單眼型或雙眼型,亦包含頭戴型)之眼部佩戴型、例如以飾品之形態佩戴於運動衫或襪子、帽子等之衣服型、如耳機般佩戴於耳部之耳部佩戴型等)、數位相機、數位攝錄影機、聲頻設備(隨身聽、IC記錄器等)、計算機(計算器等)、攜帶型遊戲機、電子詞典、電子記事本、電子書籍、車載用資訊設備、攜帶型收音機、攜帶型電視、攜帶型印表機、攜帶型掃描儀、攜帶型數據機等。再者,於本說明書中,「攜帶」係指不僅可攜帶,而且具有個人(標準成人)可相對容易地攜帶之程度之攜帶性。Examples of the above-mentioned portable electronic devices include mobile phones, smart phones, tablet PCs, notebook PCs, and various wearable devices (for example, wristbands worn on the wrist like watches, using clamps or straps, etc. Modular types that are worn on part of the body, eye-wearing types including glasses types (single-eyed or double-eyed types, including head-mounted types), clothing types that are worn in the form of accessories such as sweatshirts, socks, hats, etc. , ear-worn models worn on the ears like headphones, etc.), digital cameras, digital video recorders, audio equipment (Walkmans, IC recorders, etc.), computers (calculators, etc.), portable game consoles, electronics Dictionaries, electronic notebooks, electronic books, vehicle-mounted information equipment, portable radios, portable TVs, portable printers, portable scanners, portable modems, etc. Furthermore, in this specification, "carrying" means not only being portable, but also having portability to the extent that an individual (standard adult) can carry it relatively easily.
作為本發明之黏著劑層及本發明之黏著片材之用途,具體而言,較佳為設置於觸控感測器及圖像顯示裝置之間之觸控感測器及圖像顯示裝置之貼合用途。本發明之黏著劑層尤佳為與上述觸控感測器直接積層。又,本發明之黏著劑層可直接積層於圖像顯示裝置,亦可隔著偏光膜等其他層而積層。本發明之黏著劑層不易引起雜訊之放大,因此可使自圖像顯示裝置發出之雜訊不易傳遞至觸控感測器。As the use of the adhesive layer of the present invention and the adhesive sheet of the present invention, specifically, the use of the touch sensor and the image display device disposed between the touch sensor and the image display device is preferred. Fit for purpose. The adhesive layer of the present invention is preferably directly laminated with the above-mentioned touch sensor. In addition, the adhesive layer of the present invention can be directly laminated on the image display device, or can be laminated via other layers such as polarizing films. The adhesive layer of the present invention is less likely to cause noise amplification, so that the noise emitted from the image display device is less likely to be transmitted to the touch sensor.
又,本發明之黏著劑層及本發明之黏著片材可用於貼合構成毫米波通信所使用之天線(毫米波天線)之構件的用途。本發明之黏著劑層具有毫米波等高頻帶下之介電常數、介電損耗較低之特性,故而能夠抑制毫米波之輻射損耗。於本說明書中,「毫米波通信」係指20 GHz~300 GHz之頻帶下之通信。Furthermore, the adhesive layer of the present invention and the adhesive sheet of the present invention can be used to bond components constituting an antenna (millimeter wave antenna) used for millimeter wave communications. The adhesive layer of the present invention has the characteristics of low dielectric constant and dielectric loss in high frequency bands such as millimeter waves, so it can suppress the radiation loss of millimeter waves. In this specification, "millimeter wave communication" refers to communication in the frequency band of 20 GHz to 300 GHz.
[光學積層體] 藉由將本發明之黏著劑層或本發明之黏著片材設置於觸控感測器及圖像顯示裝置之間,獲得依序具備觸控感測器、本發明之黏著劑層、及圖像顯示裝置之光學積層體(本發明之光學積層體)。上述光學積層體可分別具備單層或複數層之觸控感測器及黏著劑層。於具備複數個觸控感測器之情形時,各觸控感測器間較佳為經由黏著劑層進行積層。於具備複數個黏著劑層之情形時,複數個黏著劑層可為組成或厚度等相同之層,亦可為不同之層。於具備複數個黏著劑層之情形時,至少一層為本發明之黏著劑層。較佳為設置於觸控感測器及圖像顯示裝置之間之所有黏著劑層均為本發明之黏著劑層。 [Optical laminated body] By arranging the adhesive layer of the present invention or the adhesive sheet of the present invention between the touch sensor and the image display device, a touch sensor, the adhesive layer of the present invention, and an image display device are obtained in sequence. Optical laminated body of image display device (optical laminated body of the present invention). The above-mentioned optical laminate may have a single layer or multiple layers of touch sensors and adhesive layers. When there are multiple touch sensors, each touch sensor is preferably laminated through an adhesive layer. When there are a plurality of adhesive layers, the plurality of adhesive layers may be layers with the same composition or thickness, or may be different layers. When there are multiple adhesive layers, at least one layer is the adhesive layer of the present invention. Preferably, all adhesive layers disposed between the touch sensor and the image display device are adhesive layers of the present invention.
上述圖像顯示裝置可例舉上文之圖像顯示裝置。上述觸控感測器係靜電電容方式之觸控感測器,例如為於玻璃板或透明塑膠膜(尤其是PET膜、聚碳酸酯膜、環狀烯烴系聚合物膜)設置有透明導電層之透明導電性膜。本發明之黏著劑層較佳為以接觸之方式貼合於上述透明導電層。The above image display device can be exemplified by the above image display device. The above-mentioned touch sensor is an electrostatic capacitive touch sensor, for example, a transparent conductive layer is provided on a glass plate or a transparent plastic film (especially PET film, polycarbonate film, cyclic olefin polymer film) transparent conductive film. The adhesive layer of the present invention is preferably bonded to the transparent conductive layer in a contact manner.
上述透明導電層可例舉ITO膜(氧化銦錫)、ZnO、SnO、CTO(氧化鎘錫)之薄膜。此外,上述透明導電層可由銀、銅、CNT(奈米碳管)等形成。又,上述透明導電層亦可採用奈米銀線、Ag/Cu等之金屬網感測器。又,上述觸控感測器亦可於其端部具有由薄膜銅或銀漿所形成之牽引配線。Examples of the transparent conductive layer include ITO film (indium tin oxide), ZnO, SnO, and CTO (cadmium tin oxide) thin film. In addition, the above-mentioned transparent conductive layer may be formed of silver, copper, CNT (carbon nanotube), etc. In addition, the above-mentioned transparent conductive layer can also use metal mesh sensors such as nanosilver wires and Ag/Cu. In addition, the above-mentioned touch sensor may also have traction wiring formed of thin film copper or silver paste at its end.
上述光學積層體亦可具備罩蓋構件。上述罩蓋構件係設置於觸控感測器之與具備圖像顯示裝置一側為相反側之表面,保護上述光學積層體中之觸控感測器或圖像顯示裝置。上述罩蓋構件可例舉罩蓋玻璃或塑膠罩蓋。上述罩蓋構件亦可經由黏著劑層貼合於觸控感測器等構成上述光學積層體之層。上述黏著劑層可為本發明之黏著劑層,但由於不要求抑制圖像顯示裝置所發出之雜訊之放大的功能,故而亦可為其他黏著劑層。又,上述光學積層體亦可於圖像顯示裝置之表面(具備觸控感測器一側之表面)具備偏光膜。The optical laminated body may be provided with a cover member. The cover member is provided on the surface of the touch sensor opposite to the side provided with the image display device, and protects the touch sensor or the image display device in the optical laminate. Examples of the cover member include cover glass or plastic cover. The cover member may be bonded to a layer constituting the optical laminate such as a touch sensor via an adhesive layer. The above-mentioned adhesive layer can be the adhesive layer of the present invention, but since the function of suppressing the amplification of noise emitted by the image display device is not required, it can also be other adhesive layers. Furthermore, the optical laminate may have a polarizing film on the surface of the image display device (the surface having the touch sensor).
上述光學積層體亦可具備雜訊減輕層(雜訊減輕膜等)。就要求抑制圖像顯示裝置所發出之雜訊之放大的功能之觀點而言,上述雜訊減輕層較佳為設置於觸控感測器及圖像顯示裝置之間。上述雜訊減輕層及觸控感測器、以及上述雜訊減輕層及圖像顯示裝置分別經由黏著劑層(較佳為本發明之黏著劑層)進行貼合。上述雜訊減輕層可為單層亦可為複數層。於具備複數個雜訊減輕層之情形時,複數個雜訊減輕層可為組成或厚度等相同之層,亦可為不同之層。The above-mentioned optical laminate may be provided with a noise reduction layer (noise reduction film, etc.). From the viewpoint of the function of suppressing the amplification of noise emitted by the image display device, the noise reduction layer is preferably disposed between the touch sensor and the image display device. The above-mentioned noise reduction layer and the touch sensor, as well as the above-mentioned noise reduction layer and the image display device are respectively bonded through an adhesive layer (preferably the adhesive layer of the present invention). The above-mentioned noise reduction layer may be a single layer or multiple layers. When there are a plurality of noise reduction layers, the plurality of noise reduction layers may be layers with the same composition or thickness, or may be different layers.
圖1~3表示本發明之光學積層體之一實施方式。圖1所示之光學積層體1依序具備圖像顯示裝置5、設置於圖像顯示裝置5上之偏光膜6、觸控感測器41、觸控感測器42、及罩蓋構件3。偏光膜6及觸控感測器41係藉由黏著劑層(黏著片材)21進行貼合,觸控感測器41及觸控感測器42係藉由黏著劑層(黏著片材)22進行貼合。黏著劑層21及22為本發明之黏著劑層。又,觸控感測器42及罩蓋構件3係藉由黏著劑層(黏著片材)23進行貼合。黏著劑層23為其他黏著劑層。1 to 3 show one embodiment of the optical laminate of the present invention. The optical laminated body 1 shown in FIG. 1 includes an image display device 5, a polarizing film 6 provided on the image display device 5, a touch sensor 41, a touch sensor 42, and a cover member 3 in this order. . The polarizing film 6 and the touch sensor 41 are bonded together through an adhesive layer (adhesive sheet) 21, and the touch sensor 41 and the touch sensor 42 are bonded together through an adhesive layer (adhesive sheet). 22 for fitting. Adhesive layers 21 and 22 are adhesive layers of the present invention. In addition, the touch sensor 42 and the cover member 3 are bonded together by the adhesive layer (adhesive sheet) 23 . The adhesive layer 23 is another adhesive layer.
圖2所示之光學積層體1依序具備圖像顯示裝置5、設置於圖像顯示裝置5上之偏光膜6、觸控感測器43、及罩蓋構件3。觸控感測器43例如兼具圖1中之觸控感測器41及42兩者之功能。偏光膜6及觸控感測器43係藉由黏著劑層21進行貼合。黏著劑層21為本發明之黏著劑層。又,觸控感測器43及罩蓋構件3係藉由黏著劑層23進行貼合。黏著劑層23為其他黏著劑層。The optical laminated body 1 shown in FIG. 2 includes an image display device 5, a polarizing film 6 provided on the image display device 5, a touch sensor 43, and a cover member 3 in this order. For example, the touch sensor 43 has the functions of both the touch sensors 41 and 42 in FIG. 1 . The polarizing film 6 and the touch sensor 43 are bonded together through the adhesive layer 21 . The adhesive layer 21 is the adhesive layer of the present invention. In addition, the touch sensor 43 and the cover member 3 are bonded by the adhesive layer 23 . The adhesive layer 23 is another adhesive layer.
圖3所示之光學積層體1依序具備圖像顯示裝置5、設置於圖像顯示裝置5上之偏光膜6、雜訊減輕層44、觸控感測器43、及罩蓋構件3。偏光膜6及雜訊減輕層44係藉由黏著劑層21進行貼合,雜訊減輕層44及觸控感測器43係藉由黏著劑層22進行貼合。黏著劑層21及22為本發明之黏著劑層。又,觸控感測器43及罩蓋構件3係藉由黏著劑層23進行貼合。黏著劑層23為其他黏著劑層。The optical laminated body 1 shown in FIG. 3 includes an image display device 5, a polarizing film 6 provided on the image display device 5, a noise reduction layer 44, a touch sensor 43, and a cover member 3 in this order. The polarizing film 6 and the noise reduction layer 44 are bonded together through the adhesive layer 21 , and the noise reduction layer 44 and the touch sensor 43 are bonded together through the adhesive layer 22 . Adhesive layers 21 and 22 are adhesive layers of the present invention. In addition, the touch sensor 43 and the cover member 3 are bonded by the adhesive layer 23 . The adhesive layer 23 is another adhesive layer.
再者,於圖1~3中,亦可不設置偏光膜6。於該情形時,圖像顯示裝置5與觸控感測器41、43或雜訊減輕層44係藉由黏著劑層21進行貼合。Furthermore, in FIGS. 1 to 3 , the polarizing film 6 does not need to be provided. In this case, the image display device 5 and the touch sensors 41 and 43 or the noise reduction layer 44 are bonded through the adhesive layer 21 .
[毫米波天線] 可使用本發明之黏著劑層獲得毫米波天線。有時將具備本發明之黏著劑層之毫米波天線稱為「本發明之毫米波天線」。構成上述毫米波天線之構件可例舉至少於單面具備用以收發毫米波之天線元件(以下,有時稱為「毫米波天線元件」)之基板(以下,有時稱為「毫米波天線基板」)。 [Millimeter wave antenna] A millimeter wave antenna can be obtained using the adhesive layer of the present invention. The millimeter-wave antenna equipped with the adhesive layer of the present invention is sometimes referred to as the "millimetre-wave antenna of the present invention." Examples of components constituting the millimeter wave antenna include a substrate (hereinafter, sometimes referred to as a "millimeter wave antenna") of an antenna element (hereinafter, sometimes referred to as a "millimeter wave antenna element") for transmitting and receiving millimeter waves. "Substrate").
毫米波天線基板可例舉作為上述基材所例示及說明之塑膠膜。其中,就能夠抑制毫米波之輻射損耗之觀點而言,較佳為低介電常數、低介電損耗之素材,尤佳為商品名「ARTON」(環狀烯烴系聚合物、JSR股份有限公司製造)、商品名「ZEONOR」(環狀烯烴系聚合物、日本瑞翁股份有限公司製造)等環狀烯烴系聚合物。The millimeter-wave antenna substrate can be exemplified by the plastic film illustrated and described as the above-mentioned substrate. Among them, from the viewpoint of being able to suppress the radiation loss of millimeter waves, materials with low dielectric constant and low dielectric loss are preferred, and materials with the trade name "ARTON" (cyclic olefin polymer, JSR Co., Ltd.) are particularly preferred. Cyclic olefin-based polymers such as "ZEONOR" (cyclic olefin-based polymer, manufactured by Nippon Zeon Co., Ltd.), trade name "ZEONOR".
就抑制毫米波之輻射損耗之觀點而言,毫米波天線基板於28 GHz及/或60 GHz之介電常數較佳為2.0~5.0,更佳為2.1~4.5,進而較佳為2.2~4.0,進而較佳為2.2~3.5,進而較佳為2.2~3.4,進而較佳為2.2~3.3,進而較佳為2.2~3.2,進而較佳為2.2~3.1,尤佳為2.2~3.0。又,就抑制毫米波之輻射損耗之觀點而言,毫米波天線基板於28 GHz及/或60 GHz之介電損耗較佳為0.0001~0.05,更佳為0.001~0.02,進而較佳為0.002~0.019,進而較佳為0.003~0.018,進而較佳為0.004~0.017,進而較佳為0.005~0.016,進而較佳為0.006~0.015,進而較佳為0.007~0.014,進而較佳為0.008~0.013,進而較佳為0.009~0.012,尤佳為0.01~0.011。From the perspective of suppressing millimeter wave radiation loss, the dielectric constant of the millimeter wave antenna substrate at 28 GHz and/or 60 GHz is preferably 2.0 to 5.0, more preferably 2.1 to 4.5, and further preferably 2.2 to 4.0. It is more preferably 2.2 to 3.5, still more preferably 2.2 to 3.4, still more preferably 2.2 to 3.3, still more preferably 2.2 to 3.2, still more preferably 2.2 to 3.1, and particularly preferably 2.2 to 3.0. Furthermore, from the viewpoint of suppressing the radiation loss of millimeter waves, the dielectric loss of the millimeter wave antenna substrate at 28 GHz and/or 60 GHz is preferably 0.0001~0.05, more preferably 0.001~0.02, and further preferably 0.002~ 0.019, more preferably 0.003~0.018, still more preferably 0.004~0.017, still more preferably 0.005~0.016, still more preferably 0.006~0.015, still more preferably 0.007~0.014, still more preferably 0.008~0.013, Furthermore, 0.009-0.012 is more preferable, and 0.01-0.011 is especially preferable.
毫米波天線基板以透明者為佳。毫米波天線基板於可見光波長區域之全光線透過率(基於JIS K7361-1)並無特別限定,較佳為85%以上,更佳為88%以上,進而較佳為89%以上,進而較佳為90%以上,進而較佳為91%以上,尤佳為92%以上。又,毫米波天線基板之霧度(基於JIS K7136)並無特別限定,較佳為1.2%以下,更佳為1.1%以下,進而較佳為1.0%以下,進而較佳為0.9%以下,尤佳為0.8%以下。The millimeter wave antenna substrate is preferably transparent. The total light transmittance (based on JIS K7361-1) of the millimeter wave antenna substrate in the visible light wavelength region is not particularly limited, but is preferably 85% or more, more preferably 88% or more, further preferably 89% or more, still more preferably It is 90% or more, more preferably 91% or more, especially 92% or more. In addition, the haze (based on JIS K7136) of the millimeter wave antenna substrate is not particularly limited, but is preferably 1.2% or less, more preferably 1.1% or less, further preferably 1.0% or less, further preferably 0.9% or less, especially The best value is less than 0.8%.
就安裝毫米波天線元件並且抑制毫米波之輻射損耗之觀點而言,毫米波天線基板之厚度較佳為5~250 μm。再者,毫米波天線基板可具有單層及複數層之任一形態。又,亦可對毫米波天線基板之表面適當實施公知或常用之表面處理,例如電暈放電處理、電漿處理等物理處理、底塗處理等化學處理、硬塗層等塗層等。From the viewpoint of mounting millimeter wave antenna elements and suppressing millimeter wave radiation loss, the thickness of the millimeter wave antenna substrate is preferably 5 to 250 μm. Furthermore, the millimeter wave antenna substrate may have either a single layer or multiple layers. In addition, the surface of the millimeter wave antenna substrate may be appropriately subjected to known or commonly used surface treatments, such as physical treatments such as corona discharge treatment and plasma treatment, chemical treatments such as primer treatment, and coatings such as hard coating.
毫米波天線基板所具備之毫米波天線元件只要可收發毫米波則無特別限定,就利用智慧型手機等攜帶型通信設備有效率地接收毫米波之觀點而言,可較佳地使用相位陣列天線。藉由將複數個天線元件呈陣列狀地排列並控制各天線元件之相位,相位陣列天線可於所需之方向進行收發。即,相位陣列天線可不論天線之方向,藉由對各天線元件之相位進行電子式控制(波束控制)而於所需之方向發送電波、或接收電波。The millimeter-wave antenna element included in the millimeter-wave antenna substrate is not particularly limited as long as it can transmit and receive millimeter waves. From the perspective of efficiently receiving millimeter waves with portable communication devices such as smartphones, a phased array antenna can be preferably used. . By arranging multiple antenna elements in an array and controlling the phase of each antenna element, a phased array antenna can transmit and receive in a desired direction. That is, a phased array antenna can transmit or receive radio waves in a desired direction by electronically controlling (beam steering) the phase of each antenna element regardless of the direction of the antenna.
毫米波天線元件可使用公知之天線而無特別限定,例如可例舉:環形天線構造體、貼片天線構造體、堆疊型貼片天線構造體、具有寄生元件之貼片天線構造體、逆F天線構造體、槽孔天線構造體、平面倒F天線構造體、單極、偶極、螺旋天線構造體、八木(八木-宇田)天線構造體、表面集成波導構造體、具有由該等設計之混合等所形成之共振元件之天線元件。亦可針對不同頻帶之組合使用不同種類之毫米波天線元件。就利用智慧型手機等攜帶型通信設備有效率地接收毫米波之觀點而言,較佳為將貼片天線元件呈陣列狀地排列之相位陣列天線。Known antennas can be used as millimeter wave antenna elements without particular limitation. For example, loop antenna structures, patch antenna structures, stacked patch antenna structures, patch antenna structures with parasitic elements, inverse F Antenna structures, slot antenna structures, planar inverted F antenna structures, monopole, dipole, helical antenna structures, Yagi (Yagi-Uda) antenna structures, surface integrated waveguide structures, and structures designed by these The antenna element is a resonant element formed by mixing etc. Different types of millimeter wave antenna elements can also be used for different combinations of frequency bands. From the viewpoint of efficiently receiving millimeter waves using portable communication devices such as smartphones, a phased array antenna in which patch antenna elements are arranged in an array is preferred.
構成毫米波天線元件之素材並無特別限定,例如可例舉:鈦、矽、鈮、銦、鋅、錫、金、銀、銅、鋁、鈷、鉻、鎳、鉛、鐵、鈀、鉑、鎢、鋯、鉭、鉿等金屬;ITO(銦及錫之氧化物)、氧化鋅、氧化錫等金屬氧化物。進而,亦可例舉含有兩種以上之該等金屬或金屬氧化物者、或將該等金屬作為主成分之合金。其中,就導電性之觀點而言,較佳為銀、銅、ITO,就透明性、視認性之方面而言,更佳為ITO。即,上述毫米波天線元件尤佳為包含ITO。又,於天線元件包含銀、銅等金屬之情形時,為了隱藏天線元件以防止金屬之反射所致之視認性降低,亦可藉由形成該金屬之氮化物、氧化物、硫化物等皮膜而實施黑化處理。The materials constituting the millimeter wave antenna elements are not particularly limited, for example, titanium, silicon, niobium, indium, zinc, tin, gold, silver, copper, aluminum, cobalt, chromium, nickel, lead, iron, palladium, platinum , tungsten, zirconium, tantalum, hafnium and other metals; ITO (indium and tin oxide), zinc oxide, tin oxide and other metal oxides. Furthermore, those containing two or more of these metals or metal oxides, or an alloy containing these metals as a main component can also be mentioned. Among them, from the viewpoint of electrical conductivity, silver, copper, and ITO are preferable, and from the viewpoint of transparency and visibility, ITO is more preferable. That is, it is particularly preferable that the above-mentioned millimeter wave antenna element contains ITO. In addition, when the antenna element contains metal such as silver or copper, in order to hide the antenna element and prevent the reduction of visibility due to reflection of the metal, it is also possible to form a film of nitride, oxide, sulfide, etc. of the metal. Implement blackening treatment.
又,毫米波天線基板亦可具備用以將毫米波天線元件所收發之信號傳送至收發機電路之傳輸線路徑。傳輸線路徑可包含同軸電纜路徑、微帶傳輸線、帶狀傳輸線、邊緣耦合微帶傳輸線、邊緣耦合帶狀傳輸線、用以利用毫米波頻帶傳遞信號之波導構造體(例如,共面波導或接地之共面波導)、由該等種類之傳輸線之組合所形成之傳輸線等。構成傳輸線路徑之素材亦無特別限定,可使用構成毫米波天線元件之素材。In addition, the millimeter wave antenna substrate may also be provided with a transmission line path for transmitting signals transmitted and received by the millimeter wave antenna element to the transceiver circuit. Transmission line paths may include coaxial cable paths, microstrip transmission lines, strip transmission lines, edge-coupled microstrip transmission lines, edge-coupled strip transmission lines, waveguide structures (e.g., coplanar waveguides or grounded coaxial Surface waveguide), transmission lines formed by combinations of these types of transmission lines, etc. The material constituting the transmission line path is not particularly limited, and the material constituting the millimeter wave antenna element can be used.
構成毫米波天線之構件可例舉為了保護排列於毫米波天線基板上之毫米波天線元件而積層於毫米波天線基板之罩蓋構件。罩蓋構件並無特別限定,例如可使用玻璃或塑膠膜等光學膜。塑膠膜等之素材例如可例舉:聚對苯二甲酸乙二酯(PET)等聚酯系樹脂、聚甲基丙烯酸甲酯(PMMA)等(甲基)丙烯酸系樹脂、聚碳酸酯、三乙醯纖維素(TAC)、聚碸、聚芳酯、聚醯亞胺、透明聚醯亞胺、聚氯乙烯、聚乙酸乙烯酯、氟系樹脂、聚乙烯、聚丙烯、乙烯-丙烯共聚物、商品名「ARTON」(環狀烯烴系聚合物、JSR股份有限公司製造)、商品名「ZEONOR」(環狀烯烴系聚合物、日本瑞翁股份有限公司製造)等環狀烯烴系聚合物等塑膠材料。再者,該等塑膠材料可僅使用一種,亦可使用兩種以上。An example of a member constituting the millimeter wave antenna is a cover member laminated on the millimeter wave antenna substrate in order to protect the millimeter wave antenna elements arranged on the millimeter wave antenna substrate. The cover member is not particularly limited, and for example, an optical film such as glass or plastic film can be used. Examples of materials for plastic films include polyester resins such as polyethylene terephthalate (PET), (meth)acrylic resins such as polymethyl methacrylate (PMMA), polycarbonate, and tricarbonate resins. Acetyl cellulose (TAC), polystyrene, polyarylate, polyimide, transparent polyimide, polyvinyl chloride, polyvinyl acetate, fluorine resin, polyethylene, polypropylene, ethylene-propylene copolymer Cyclic olefin-based polymers under the trade name "ARTON" (cyclic olefin-based polymer, manufactured by JSR Co., Ltd.), brand name "ZEONOR" (cyclic olefin-based polymer, manufactured by Nippon Zeon Co., Ltd.), etc. Plastic material. Furthermore, only one type of plastic material can be used, or two or more types of plastic materials can be used.
就抑制毫米波之輻射損耗之觀點而言,罩蓋構件於28 GHz及/或60 GHz下之介電常數較佳為2.0~5.0,更佳為2.1~4.5,進而較佳為2.2~4.0,進而較佳為2.2~3.5,進而較佳為2.2~3.4,進而較佳為2.2~3.3,進而較佳為2.2~3.2,進而較佳為2.2~3.1,尤佳為2.2~3.0。又,就抑制毫米波之輻射損耗之觀點而言,罩蓋構件於28 GHz及/或60 GHz下之介電損耗較佳為0.0001~0.05,更佳為0.001~0.02,進而較佳為0.002~0.019,進而較佳為0.003~0.018,進而較佳為0.004~0.017,進而較佳為0.005~0.016,進而較佳為0.006~0.015,進而較佳為0.007~0.014,進而較佳為0.008~0.013,進而較佳為0.009~0.012,尤佳為0.01~0.011。From the viewpoint of suppressing millimeter wave radiation loss, the dielectric constant of the cover member at 28 GHz and/or 60 GHz is preferably 2.0 to 5.0, more preferably 2.1 to 4.5, and further preferably 2.2 to 4.0. It is more preferably 2.2 to 3.5, still more preferably 2.2 to 3.4, still more preferably 2.2 to 3.3, still more preferably 2.2 to 3.2, still more preferably 2.2 to 3.1, and particularly preferably 2.2 to 3.0. Furthermore, from the viewpoint of suppressing the radiation loss of millimeter waves, the dielectric loss of the cover member at 28 GHz and/or 60 GHz is preferably 0.0001 to 0.05, more preferably 0.001 to 0.02, and further preferably 0.002 to 0.002. 0.019, more preferably 0.003~0.018, still more preferably 0.004~0.017, still more preferably 0.005~0.016, still more preferably 0.006~0.015, still more preferably 0.007~0.014, still more preferably 0.008~0.013, Furthermore, 0.009-0.012 is more preferable, and 0.01-0.011 is especially preferable.
上述罩蓋構件以透明者為佳。罩蓋構件於可見光波長區域中之全光線透過率(基於JIS K7361-1)並無特別限定,較佳為85%以上,更佳為88%以上,進而較佳為89%以上,進而較佳為90%以上,進而較佳為91%以上,尤佳為92%以上。又,罩蓋構件之霧度(基於JIS K7136)並無特別限定,較佳為1.2%以下,更佳為1.1%以下,進而較佳為1.0%以下,進而較佳為0.9%以下,尤佳為0.8%以下。The above-mentioned cover member is preferably transparent. The total light transmittance (based on JIS K7361-1) of the cover member in the visible light wavelength range is not particularly limited, but is preferably 85% or more, more preferably 88% or more, further preferably 89% or more, still more preferably It is 90% or more, more preferably 91% or more, especially 92% or more. In addition, the haze (based on JIS K7136) of the cover member is not particularly limited, but it is preferably 1.2% or less, more preferably 1.1% or less, still more preferably 1.0% or less, still more preferably 0.9% or less, and particularly preferably is less than 0.8%.
就抑制毫米波之輻射損耗之觀點而言,罩蓋構件之厚度較佳為0.025~1.5 mm。再者,罩蓋構件可具有單層及複數層之任一形態。又,亦可對罩蓋構件之表面適當實施公知或常用之表面處理,例如電暈放電處理、電漿處理等物理處理、底塗處理等化學處理、硬塗等塗層等。From the viewpoint of suppressing radiation loss of millimeter waves, the thickness of the cover member is preferably 0.025 to 1.5 mm. Furthermore, the cover member may have either a single layer or a plurality of layers. In addition, the surface of the cover member may be appropriately subjected to known or commonly used surface treatments, such as physical treatments such as corona discharge treatment and plasma treatment, chemical treatments such as primer treatment, and coatings such as hard coating.
本發明之黏著片材能夠良好地用於製造攜帶型通信設備所使用之毫米波天線。上述攜帶型通信設備例如可例舉:手機、PHS(Personal Handy-phone System,個人手持電話系統)、智慧型手機、平板(平板型電腦)、行動電腦(mobile PC)、攜帶型資訊終端(PDA)等。The adhesive sheet of the present invention can be well used to manufacture millimeter wave antennas used in portable communication equipment. Examples of the above-mentioned portable communication devices include: mobile phones, PHS (Personal Handy-phone System), smart phones, tablets (tablet computers), mobile computers (mobile PCs), and portable information terminals (PDA). )wait.
毫米波天線亦可具有除上述毫米波天線基板、罩蓋構件、黏著片材以外之構件,例如亦可具有偏光板、波長板、相位差板、光學補償膜、增亮膜、導光板、反射膜、抗反射膜、硬塗膜、透明導電膜、設計膜、裝飾膜、表面保護板、稜鏡、透鏡、彩色濾光片、透明基板、或圖像顯示面板(例如液晶顯示面板、有機EL面板、電漿顯示器面板等)等。圖像顯示面板亦可具有觸控感測器。The millimeter-wave antenna may also have components other than the above-mentioned millimeter-wave antenna substrate, cover member, and adhesive sheet, such as a polarizing plate, a wavelength plate, a phase difference plate, an optical compensation film, a brightness enhancement film, a light guide plate, a reflective Film, anti-reflective film, hard coat film, transparent conductive film, design film, decorative film, surface protection board, lens, color filter, transparent substrate, or image display panel (such as liquid crystal display panel, organic EL panels, plasma display panels, etc.), etc. The image display panel may also have a touch sensor.
毫米波天線可配置於攜帶型通信設備之任意位置,具體而言,可配置於攜帶型通信設備之正面、背面、側面。再者,攜帶型通信設備之正面係指於使用者使用攜帶型通信設備時與使用者對向之面,例如相當於具有顯示器面板之面,背面、側面相當於殼體。再者,顯示器面板係指至少包含透鏡(尤其是玻璃透鏡)及觸控面板之構造物。Millimeter wave antennas can be placed anywhere on the portable communication device. Specifically, they can be placed on the front, back, or side of the portable communication device. Furthermore, the front of the portable communication device refers to the surface facing the user when using the portable communication device, for example, it is equivalent to the surface with the display panel, and the back and side are equivalent to the casing. Furthermore, a display panel refers to a structure including at least a lens (especially a glass lens) and a touch panel.
毫米波天線之大小(寬度)亦無限定,能夠形成於攜帶型通信設備各面之整面,亦可配置於一部分。又,毫米波天線之形狀亦無特別限定,例如可為四邊形、圓形、配線狀。又,亦可配置成邊框狀。進而,配置於攜帶型通信設備之毫米波天線之數量亦無限定,可為一條,亦可將複數條配置於任意位置。於配置複數條毫米波天線之情形時,大小(寬度)可相同亦可不同。於攜帶型通信設備之未配置毫米波天線之部位,為了提高視認性,亦可配置不具備毫米波天線之虛設圖案。The size (width) of the millimeter wave antenna is also not limited, and it can be formed on the entire surface of each surface of the portable communication device, or it can be arranged on a part. In addition, the shape of the millimeter wave antenna is not particularly limited, and may be, for example, quadrangular, circular, or wire-shaped. In addition, it can also be arranged in a frame shape. Furthermore, the number of millimeter wave antennas arranged in the portable communication device is not limited. It can be one, or a plurality of antennas can be arranged at any position. When multiple millimeter wave antennas are configured, the sizes (widths) can be the same or different. In order to improve visibility, dummy patterns without millimeter wave antennas can also be placed in areas of the portable communication device that are not equipped with millimeter wave antennas.
上述毫米波天線為至少具有本發明之黏著片材及基板之毫米波天線,上述基板於單面具備天線元件(毫米波天線元件),只要於上述基板(毫米波天線基板)之具有上述天線元件一側之面上貼有本發明之黏著片材即可,其他方面並無特別限定。再者,上述毫米波天線中之本發明之黏著片材為使用時之黏著片材,因此不具有剝離襯墊。The above-mentioned millimeter wave antenna is a millimeter wave antenna having at least the adhesive sheet of the present invention and a substrate. The above-mentioned substrate has an antenna element (millimeter wave antenna element) on one side, as long as the above-mentioned substrate (millimeter wave antenna substrate) has the above-mentioned antenna element. It only suffices that the adhesive sheet of the present invention is affixed to one side, and other aspects are not particularly limited. Furthermore, the adhesive sheet of the present invention in the above-mentioned millimeter wave antenna is an adhesive sheet during use, and therefore does not have a release liner.
上述毫米波天線較佳為將毫米波天線基板與其他光學構件(可具有本發明之黏著片材,亦可不具有該黏著片材,就進而抑制毫米波之輻射損耗之觀點而言,較佳為具有本發明之黏著片材)貼合而構成之態樣。又,上述其他光學構件可為單數個亦可為複數個。The above-mentioned millimeter wave antenna is preferably a millimeter wave antenna substrate and other optical components (which may or may not have the adhesive sheet of the present invention). From the perspective of further suppressing the radiation loss of millimeter waves, it is preferred that It has a state in which the adhesive sheet of the present invention is laminated together. In addition, the number of the other optical members mentioned above may be singular or plural.
於上述態樣之情形時,毫米波天線與上述其他光學構件之貼合態樣並無特別限定,例如可例舉:(1)經由本發明之黏著片材將毫米波天線基板與上述其他光學構件貼合之態樣;(2)將包含或構成毫米波天線基板之本發明之黏著片材貼合於上述其他光學構件之態樣;(3)經由本發明之黏著片材將毫米波天線基板貼合於毫米波天線基板以外之構件之態樣;(4)將包含或構成毫米波天線基板之本發明之黏著片材貼合於毫米波天線基板以外之構件之態樣等。再者,於上述(2)之態樣中,本發明之黏著片材較佳為基材為毫米波天線基板之雙面黏著片材。In the above situation, the method of bonding the millimeter wave antenna and the other optical components mentioned above is not particularly limited. Examples include: (1) The millimeter wave antenna substrate and the other optical components mentioned above are bonded through the adhesive sheet of the present invention. The manner in which the components are bonded together; (2) The manner in which the adhesive sheet of the present invention, which contains or constitutes the millimeter wave antenna substrate, is bonded to the other optical components mentioned above; (3) The millimeter wave antenna is bonded through the adhesive sheet of the present invention. How the substrate is bonded to components other than the millimeter wave antenna substrate; (4) How the adhesive sheet of the present invention, which includes or constitutes the millimeter wave antenna substrate, is bonded to components other than the millimeter wave antenna substrate, etc. Furthermore, in the aspect (2) above, the adhesive sheet of the present invention is preferably a double-sided adhesive sheet whose base material is a millimeter wave antenna substrate.
其次,參照圖式對上述毫米波天線之較佳之實施方式進行說明。圖4記載有毫米波天線10,其至少具備黏著片材(黏著劑層)11及作為毫米波天線基板12之基板,毫米波天線基板12於單面具備毫米波天線元件13,黏著片材11貼在毫米波天線基板12之具有毫米波天線元件13一側之面上。Next, preferred embodiments of the above-mentioned millimeter wave antenna will be described with reference to the drawings. FIG. 4 shows a millimeter wave antenna 10, which at least includes an adhesive sheet (adhesive layer) 11 and a substrate serving as a millimeter wave antenna substrate 12. The millimeter wave antenna substrate 12 has a millimeter wave antenna element 13 on one side, and the adhesive sheet 11 It is attached to the surface of the millimeter wave antenna substrate 12 on the side with the millimeter wave antenna element 13 .
圖5記載有以依序相互接觸之狀態具備罩蓋構件14、黏著片材11、及毫米波天線基板12之毫米波天線10。毫米波天線基板12於黏著片材11側之面具備毫米波天線元件13,且黏著片材11貼在毫米波天線基板12之具有毫米波天線元件13一側之面上。罩蓋構件14較佳為玻璃,就低介電常數、低介電損耗之方面而言,毫米波天線基板12較佳為COP,毫米波天線元件13較佳為銅、銀、或ITO。FIG. 5 illustrates a millimeter wave antenna 10 including a cover member 14 , an adhesive sheet 11 , and a millimeter wave antenna substrate 12 that are in sequential contact with each other. The millimeter wave antenna substrate 12 is provided with the millimeter wave antenna element 13 on the surface of the adhesive sheet 11 side, and the adhesive sheet 11 is attached to the millimeter wave antenna element 13 side of the millimeter wave antenna substrate 12 . The cover member 14 is preferably glass. In terms of low dielectric constant and low dielectric loss, the millimeter wave antenna substrate 12 is preferably COP, and the millimeter wave antenna element 13 is preferably copper, silver, or ITO.
圖6記載有以依序相互接觸之狀態具備罩蓋構件14、黏著片材(黏著劑層)11a、毫米波天線基板12、黏著片材(黏著劑層)11b、及圖像顯示面板15之毫米波天線10。毫米波天線基板12於黏著片材11a側之面具備毫米波天線元件13,且黏著片材11a貼在毫米波天線基板12之具有毫米波天線元件13一側之面上。罩蓋構件14較佳為玻璃,就低介電常數、低介電損耗之方面而言,毫米波天線基板12較佳為COP,就透明性、視認性之觀點而言,毫米波天線元件13較佳為經ITO、或氮化物、氧化物、硫化物等皮膜進行過黑化處理之銀或銅。黏著片材11b可為本發明之黏著片材,亦可並非本發明之黏著片材,較佳為本發明之黏著片材。圖像顯示面板15亦可具有觸控感測器(省略圖示)。FIG. 6 shows a case including a cover member 14, an adhesive sheet (adhesive layer) 11a, a millimeter-wave antenna substrate 12, an adhesive sheet (adhesive layer) 11b, and an image display panel 15 that are in sequential contact with each other. Millimeter wave antenna 10. The millimeter wave antenna substrate 12 is provided with the millimeter wave antenna element 13 on the surface of the adhesive sheet 11a, and the adhesive sheet 11a is attached to the millimeter wave antenna element 13 side of the millimeter wave antenna substrate 12. The cover member 14 is preferably made of glass, the millimeter-wave antenna substrate 12 is preferably COP from the viewpoint of low dielectric constant and low dielectric loss, and the millimeter-wave antenna element 13 is preferably made from the viewpoint of transparency and visibility. Preferably, it is silver or copper that has been blackened by a film of ITO, nitride, oxide, sulfide or the like. The adhesive sheet 11b may be the adhesive sheet of the present invention, or may not be the adhesive sheet of the present invention, but is preferably the adhesive sheet of the present invention. The image display panel 15 may also have a touch sensor (not shown).
於圖4~6所示之毫米波天線10中,黏著片材11、11a、較佳為以及黏著片材11b包含高頻帶下之介電常數、介電損耗較低之本發明之黏著劑層,因此毫米波之輻射損耗受到抑制,能夠有效率地進行毫米波通信。又,由於能夠有效率地進行毫米波通信,故而能夠使天線面積小型化,能夠使天線微細化。In the millimeter wave antenna 10 shown in Figures 4 to 6, the adhesive sheets 11, 11a, preferably and the adhesive sheet 11b include the adhesive layer of the present invention with low dielectric constant and low dielectric loss in the high frequency band. , so the radiation loss of millimeter waves is suppressed, and millimeter wave communications can be carried out efficiently. Furthermore, since millimeter wave communication can be performed efficiently, the area of the antenna can be reduced and the antenna can be miniaturized.
根據本發明之黏著劑組合物,能夠形成介電常數較低之黏著劑層。因此,例如,藉由將上述黏著劑層用於觸控感測器及圖像顯示裝置之貼合,能夠使圖像顯示裝置所發出之雜訊不易傳遞至觸控感測器。又,例如,藉由將上述黏著劑層用作貼合於毫米波天線所使用之毫米波天線基板之黏著劑層,能夠抑制毫米波之輻射損耗。進而,上述黏著劑層之耐久性優異,具備上述黏著劑層之黏著片材之耐久性優異。According to the adhesive composition of the present invention, an adhesive layer with a lower dielectric constant can be formed. Therefore, for example, by using the above-mentioned adhesive layer for bonding the touch sensor and the image display device, the noise emitted by the image display device can be prevented from being easily transmitted to the touch sensor. Furthermore, for example, by using the above adhesive layer as an adhesive layer bonded to a millimeter wave antenna substrate used in a millimeter wave antenna, the radiation loss of millimeter waves can be suppressed. Furthermore, the adhesive layer has excellent durability, and the adhesive sheet provided with the adhesive layer has excellent durability.
以上所說明之實施方式係為了使本發明容易理解而記載,並非為了限定本發明而記載。 實施例 The embodiments described above are described to facilitate understanding of the present invention and are not described to limit the present invention. Example
以下例舉實施例對本發明進行更詳細之說明,但本發明不受該等實施例之任何限定。The following examples are given to illustrate the present invention in more detail, but the present invention is not limited by these examples.
合成例1 (聚酯系樹脂(A1)之合成) 將攪拌機、溫度計、及真空泵安裝至三口可分離式燒瓶,向其中添加對苯二甲酸雙(2-羥基乙基)酯(東京化成工業股份有限公司製造、分子量254)65 g、二聚醇(製品名「Pripol 2033」、Croda公司製造、分子量537、碳數36、二醇、羥基以外之雜原子數為0)140 g、作為觸媒之四正丁醇鈦(製品名「ORGATIX TA-21」、Matsumoto Fine Chemical股份有限公司製造)0.2 g,於氮氣氛圍下一面攪拌一面升溫至180℃。到達180℃後,於減壓氛圍(2.0 kPa以下)下一面攪拌一面升溫至210℃,保持該溫度。持續進行約4小時之反應,獲得聚酯系樹脂(A1)。該聚酯系樹脂(A1)之重量平均分子量(Mw)為4.1萬,玻璃轉移溫度(Tg)為-20℃。 Synthesis example 1 (Synthesis of polyester resin (A1)) A stirrer, a thermometer, and a vacuum pump were installed in a three-necked separable flask, and 65 g of bis(2-hydroxyethyl) terephthalate (manufactured by Tokyo Chemical Industry Co., Ltd., molecular weight: 254) and dimer alcohol ( Product name "Pripol 2033", manufactured by Croda Co., Ltd., molecular weight 537, carbon number 36, number of heteroatoms other than diol and hydroxyl group: 0) 140 g, titanium tetra-n-butoxide as a catalyst (product name "ORGATIX TA-21 ”, manufactured by Matsumoto Fine Chemical Co., Ltd.) 0.2 g, and the temperature was raised to 180°C while stirring under a nitrogen atmosphere. After reaching 180°C, the temperature was raised to 210°C while stirring in a reduced pressure atmosphere (2.0 kPa or less) and maintained at this temperature. The reaction was continued for about 4 hours to obtain a polyester resin (A1). The polyester resin (A1) has a weight average molecular weight (Mw) of 41,000 and a glass transition temperature (Tg) of -20°C.
合成例2 (聚酯系樹脂(A2)之合成) 將攪拌機、溫度計、及真空泵安裝至三口可分離式燒瓶,向其中添加對苯二甲酸雙(2-羥基乙基)酯(東京化成工業股份有限公司製造、分子量254)60 g、二聚醇(製品名「Pripol 2033」、Croda公司製造、分子量537、碳數36、二醇、羥基以外之雜原子數為0)122.9 g、聚四亞甲基二醇(Mitsubishi Chemical股份有限公司製造、分子量2000)23.6 g、作為觸媒之四正丁醇鈦(製品名「ORGATIX TA-21」、Matsumoto Fine Chemical股份有限公司製造)0.2 g,於氮氣氛圍下一面攪拌一面升溫至180℃。到達180℃後,於減壓氛圍(2.0 kPa以下)下一面攪拌一面升溫至210℃,保持該溫度。持續進行約4小時之反應,獲得聚酯系樹脂(A2)。該聚酯系樹脂(A2)之重量平均分子量Mw為4.3萬,Tg為-29℃。 Synthesis example 2 (Synthesis of polyester resin (A2)) A stirrer, a thermometer, and a vacuum pump were installed in a three-necked separable flask, and 60 g of bis(2-hydroxyethyl) terephthalate (manufactured by Tokyo Chemical Industry Co., Ltd., molecular weight: 254) and dimer alcohol ( Product name "Pripol 2033", manufactured by Croda Co., Ltd., molecular weight 537, carbon number 36, number of heteroatoms other than diol and hydroxyl group (0) 122.9 g, polytetramethylene glycol (manufactured by Mitsubishi Chemical Co., Ltd., molecular weight 2000 ) 23.6 g and 0.2 g of titanium tetra-n-butoxide as a catalyst (product name "ORGATIX TA-21", manufactured by Matsumoto Fine Chemical Co., Ltd.), and the temperature was raised to 180°C while stirring in a nitrogen atmosphere. After reaching 180°C, the temperature was raised to 210°C while stirring in a reduced pressure atmosphere (2.0 kPa or less) and maintained at this temperature. The reaction was continued for about 4 hours to obtain a polyester-based resin (A2). The polyester resin (A2) has a weight average molecular weight Mw of 43,000 and a Tg of -29°C.
合成例3 (聚酯系樹脂(A3)之合成) 將攪拌機、溫度計、氮管、及水分離管安裝至四口可分離式燒瓶,向其中添加乙二醇(東京化成工業股份有限公司製造、分子量62)100 g、二聚酸(製品名「Pripol 1009」、Croda公司製造、分子量567、碳數36、二元羧酸、羧基以外之雜原子數為0)700 g、對苯二甲酸(東京化成工業股份有限公司製造、分子量166)63 g、作為聚合觸媒之氧化二正丁基錫(Kishida Chemical股份有限公司製造、分子量249)0.46 g、作為反應水排出溶劑之二甲苯40 g,於氮氣氛圍下一面攪拌一面升溫至180℃,保持該溫度。片刻之後,觀察到反應水之流出分離,反應開始進行。持續進行約24小時之反應,獲得聚酯系樹脂(A3)。該聚酯系樹脂(A3)之Mw為10萬,Tg為-33℃。 Synthesis example 3 (Synthesis of polyester resin (A3)) A stirrer, thermometer, nitrogen tube, and water separation tube were installed in a four-neck detachable flask, and 100 g of ethylene glycol (manufactured by Tokyo Chemical Industry Co., Ltd., molecular weight 62) and dimer acid (product name "Pripol" were added thereto) 1009", Croda Co., Ltd., molecular weight 567, carbon number 36, dicarboxylic acid, heteroatoms other than carboxyl group (0) 700 g, terephthalic acid (Tokyo Chemical Industry Co., Ltd., molecular weight 166) 63 g, 0.46 g of di-n-butyltin oxide (manufactured by Kishida Chemical Co., Ltd., molecular weight 249) as a polymerization catalyst and 40 g of xylene as a reaction water discharge solvent were heated to 180° C. while stirring in a nitrogen atmosphere, and the temperature was maintained. After a while, the reaction water was observed to flow out and separate, and the reaction began. The reaction was continued for about 24 hours to obtain a polyester resin (A3). The polyester resin (A3) has an Mw of 100,000 and a Tg of -33°C.
實施例1-1 向聚酯系樹脂(A1)100質量份加入作為交聯劑(B1)之六亞甲基二異氰酸酯改性異氰尿酸酯(商品名「Coronate HX」、Tosoh股份有限公司製造)3質量份、作為交聯觸媒之有機鋯化合物(商品名「ORGATIX ZC-162」、Matsumoto Fine Chemical股份有限公司製造)0.03質量份、及甲苯,製備黏著劑組合物(黏著劑溶液)。將該黏著劑溶液以乾燥後之厚度成為25 μm之方式塗敷於經剝離處理之聚對苯二甲酸乙二酯(PET)膜(商品名「DIAFOIL MRF#38」、Mitsubishi Chemical股份有限公司製造)之剝離處理面,並於120℃乾燥3分鐘,獲得黏著劑層。其後,將上述黏著劑層貼合於經剝離處理之PET膜(商品名「DIAFOIL MRE#38」、Mitsubishi Chemical股份有限公司製造)之剝離處理面,進而於60℃放置3日,製作實施例1之無基材黏著片材。 Example 1-1 To 100 parts by mass of the polyester resin (A1), 3 parts by mass of hexamethylene diisocyanate-modified isocyanurate (trade name "Coronate HX", manufactured by Tosoh Co., Ltd.) was added as the cross-linking agent (B1). , 0.03 parts by mass of an organic zirconium compound (trade name "ORGATIX ZC-162", manufactured by Matsumoto Fine Chemical Co., Ltd.) as a cross-linking catalyst, and toluene to prepare an adhesive composition (adhesive solution). The adhesive solution was applied to a peel-treated polyethylene terephthalate (PET) film (trade name "DIAFOIL MRF#38", manufactured by Mitsubishi Chemical Co., Ltd.) so that the thickness after drying became 25 μm. ), and dry at 120°C for 3 minutes to obtain an adhesive layer. Thereafter, the above-mentioned adhesive layer was bonded to the peel-treated surface of a peel-treated PET film (trade name "DIAFOIL MRE#38", manufactured by Mitsubishi Chemical Co., Ltd.), and then left at 60° C. for 3 days to prepare an example. 1. Adhesive sheet without base material.
實施例1-2 對聚酯系樹脂(A1)100質量份追加作為水解促進劑(C1)之高酸值松香酯樹脂(商品名「PENSEL D125」、酸值15、荒川化學工業股份有限公司製造)40質量份。除此以外,以與實施例1-1相同之方式製作實施例1-2之黏著劑組合物及無基材黏著片材。 Example 1-2 To 100 parts by mass of the polyester resin (A1), 40 parts by mass of a high acid value rosin ester resin (trade name "PENSEL D125", acid value 15, manufactured by Arakawa Chemical Industry Co., Ltd.) was added as a hydrolysis accelerator (C1). Except for this, the adhesive composition and substrate-free adhesive sheet of Example 1-2 were produced in the same manner as Example 1-1.
實施例2-1 使用聚酯系樹脂(A2)代替聚酯系樹脂(A1)。除此以外,以與實施例1-1相同之方式製作實施例2-1之黏著劑組合物及無基材黏著片材。 Example 2-1 Polyester-based resin (A2) is used instead of polyester-based resin (A1). Except for this, the adhesive composition and substrate-free adhesive sheet of Example 2-1 were produced in the same manner as Example 1-1.
實施例2-2 使用聚酯系樹脂(A2)代替聚酯系樹脂(A1)。對聚酯系樹脂(A2)100質量份追加作為水解促進劑(C1)之高酸值松香酯樹脂(商品名「PENSEL D125」、酸值15、荒川化學工業股份有限公司製造)40質量份。除此以外,以與實施例1-1相同之方式製作實施例2-2之黏著劑組合物及無基材黏著片材。 Example 2-2 Polyester-based resin (A2) is used instead of polyester-based resin (A1). To 100 parts by mass of the polyester resin (A2), 40 parts by mass of a high acid value rosin ester resin (trade name "PENSEL D125", acid value 15, manufactured by Arakawa Chemical Industry Co., Ltd.) was added as a hydrolysis accelerator (C1). Except for this, the adhesive composition and substrate-free adhesive sheet of Example 2-2 were produced in the same manner as Example 1-1.
比較例1-1 使用聚酯系樹脂(A3)代替聚酯系樹脂(A1)。除此以外,以與實施例1-1相同之方式製作比較例1-1之黏著劑組合物及無基材黏著片材。 Comparative example 1-1 Polyester-based resin (A3) is used instead of polyester-based resin (A1). Except for this, the adhesive composition and substrate-free adhesive sheet of Comparative Example 1-1 were produced in the same manner as Example 1-1.
比較例1-2 使用聚酯系樹脂(A3)代替聚酯系樹脂(A1),將交聯劑(B1)之使用量變更為相對於聚酯系樹脂(A3)100質量份為4.5質量份。又,對聚酯系樹脂(A3)100質量份追加作為水解促進劑(C1)之高酸值松香酯樹脂(商品名「PENSEL D125」、酸值15、荒川化學工業股份有限公司製造)40質量份。除此以外,以與實施例1-1相同之方式製作比較例1-2之黏著劑組合物及無基材黏著片材。 Comparative example 1-2 Polyester resin (A3) was used instead of polyester resin (A1), and the usage amount of crosslinking agent (B1) was changed to 4.5 parts by mass relative to 100 parts by mass of polyester resin (A3). Furthermore, 40 parts by mass of high acid value rosin ester resin (trade name "PENSEL D125", acid value 15, manufactured by Arakawa Chemical Industry Co., Ltd.) was added to 100 parts by mass of the polyester resin (A3) as the hydrolysis accelerator (C1). share. Except for this, the adhesive composition and substrate-free adhesive sheet of Comparative Example 1-2 were produced in the same manner as Example 1-1.
<評價> 將合成例中所製作之聚酯系樹脂、實施例及比較例中所製作之黏著片材之評價方法示於下文。 <Evaluation> The evaluation methods of the polyester resin produced in the synthesis examples and the adhesive sheets produced in the examples and comparative examples are shown below.
(1)重量平均分子量(Mw) 聚酯系樹脂之重量平均分子量(Mw)係藉由GPC(凝膠滲透層析法)所獲得之標準聚苯乙烯換算之值。使用裝置名「HLC-8320 gPC」(管柱:TSKgelGMH-H(S)、Tosoh股份有限公司製造)作為GPC裝置,按以下條件進行。 管柱:TSKgelGMH-H(S) 管柱溫度:40℃ 溶離液:THF(添加0.1質量%之胺系成分) 流速:0.5 mL/min 注入量:100 μL 檢測器:示差折射計(RI) 標準試樣:聚苯乙烯(PS) (1) Weight average molecular weight (Mw) The weight average molecular weight (Mw) of the polyester resin is a standard polystyrene-converted value obtained by GPC (gel permeation chromatography). The device name "HLC-8320 gPC" (column: TSKgelGMH-H(S), manufactured by Tosoh Co., Ltd.) was used as the GPC device, and the following conditions were followed. Column: TSKgelGMH-H(S) Tube string temperature: 40℃ Eluate: THF (add 0.1 mass% amine component) Flow rate: 0.5 mL/min Injection volume: 100 μL Detector: Differential Refractometer (RI) Standard sample: polystyrene (PS)
(2)介電常數及介電損耗 將實施例及比較例中所獲得之黏著劑層(自黏著片材剝離實施過矽酮處理之PET膜而成者)夾於銅箔與電極之間,利用以下裝置測定頻率100 kHz下之介電常數及介電損耗。測定中,製作三個樣品,將該等三個樣品之測定值之平均值設為介電常數、介電損耗。 再者,黏著劑層於頻率100 kHz下之相對介電常數係基於JIS K6911於下述條件下進行測定。 測定方法:電容法(裝置:Agilent Technologies 4294A Precision Impedance Analyzer) 電極構成:12.1 mmΦ、0.5 mm厚之鋁板 對向電極:3 oz銅板 測定環境:23±1℃、52±1%RH (2)Dielectric constant and dielectric loss The adhesive layer obtained in the Examples and Comparative Examples (made by peeling off the silicone-treated PET film from the adhesive sheet) was sandwiched between the copper foil and the electrode, and the following device was used to measure the dielectric constant at a frequency of 100 kHz. Electrical constant and dielectric loss. In the measurement, three samples are prepared, and the average value of the measured values of the three samples is used as the dielectric constant and dielectric loss. In addition, the relative dielectric constant of the adhesive layer at a frequency of 100 kHz was measured under the following conditions based on JIS K6911. Measurement method: capacitance method (device: Agilent Technologies 4294A Precision Impedance Analyzer) Electrode composition: 12.1 mmΦ, 0.5 mm thick aluminum plate Counter electrode: 3 oz copper plate Measurement environment: 23±1℃, 52±1%RH
(3)全光線透過率及霧度 自實施例及比較例中所獲得之黏著片材將實施過剝離處理之一PET膜剝離,將露出之黏著面貼合於載玻片(商品名「白研磨 No.1」(厚度0.8~1.0 mm、全光線透過率92%、霧度0.2%、b *0.15)、松浪硝子工業股份有限公司製造),並進行高壓釜處理(50℃,0.5 MPa,15分鐘)。處理後,將另一實施過剝離處理之PET膜剝離而製作具有[黏著片材(黏著劑層)/載玻片]之層構成之試片。使用霧度計(裝置名「HSP-150Vis」、村上色彩研究所股份有限公司製造),於23±1℃、52±1%RH之環境下測定上述試片於可見光區域中之全光線透過率及霧度。為各樣本製作三個樣品,將該等三個樣品之測定值之平均值設為可見光區域中之全光線透過率及霧度。 (3) Total light transmittance and haze From the adhesive sheet obtained in the Examples and Comparative Examples, the PET film that had been subjected to the peeling process was peeled off, and the exposed adhesive surface was bonded to a glass slide (trade name "White Grinding No. 1" (thickness 0.8 to 1.0 mm, total light transmittance 92%, haze 0.2%, b * 0.15), manufactured by Matsunami Glass Industry Co., Ltd.) and subjected to autoclave treatment (50°C, 0.5 MPa, 15 minutes). After the treatment, another PET film that has been subjected to the peeling treatment is peeled off to prepare a test piece having a layer structure of [adhesive sheet (adhesive layer)/glass slide]. Use a haze meter (device name "HSP-150Vis", manufactured by Murakami Color Laboratory Co., Ltd.) to measure the total light transmittance of the above test piece in the visible light region in an environment of 23±1°C and 52±1%RH. and haze. Three samples were prepared for each sample, and the average of the measured values of the three samples was taken as the total light transmittance and haze in the visible light region.
(4)色相(b *) 自實施例及比較例中所獲得之黏著片材將實施過剝離處理之一PET膜剝離,將露出之黏著面貼合於載玻片(商品名「白研磨 No.1」(厚度0.8~1.0 mm、全光線透過率92%、霧度0.2%、b *0.15)、松浪硝子工業股份有限公司製造),並進行高壓釜處理(50℃,0.5 MPa,15分鐘)。處理後,將另一實施過剝離處理之PET膜剝離而製作具有[黏著片材(黏著劑層)/載玻片]之層構成之試片。使用紫外可見近紅外分光光度計(裝置名「UH4150」、Hitachi High-Tech Science股份有限公司製造),於23±1℃、52±1%RH之環境下測定上述試片於可見光區域內之b *。為各樣本製作三個樣品,將該等三個樣品之測定值之平均值設為可見光區域內之b *。 (4) Hue (b * ) From the adhesive sheet obtained in the Examples and Comparative Examples, the PET film that had been subjected to the peeling process was peeled off, and the exposed adhesive surface was bonded to a glass slide (trade name "White Polished No. .1" (thickness 0.8 to 1.0 mm, total light transmittance 92%, haze 0.2%, b * 0.15), manufactured by Shounami Glass Industry Co., Ltd.) and subjected to autoclave treatment (50°C, 0.5 MPa, 15 minutes ). After the treatment, another PET film that has been subjected to the peeling treatment is peeled off to prepare a test piece having a layer structure of [adhesive sheet (adhesive layer)/glass slide]. Use a UV-visible-near-infrared spectrophotometer (device name "UH4150", manufactured by Hitachi High-Tech Science Co., Ltd.) to measure b in the visible light range of the above test piece in an environment of 23±1°C and 52±1%RH. * . Three samples were prepared for each sample, and the average of the measured values of the three samples was set as b * in the visible light region.
(5)180°剝離黏著力 自實施例及比較例中所獲得之黏著片材中切取長度100 mm、寬度20 mm之片材片。繼而,將黏著片材之實施過剝離處理之一PET膜,對露出之黏著面貼附(襯底)PET膜(商品名「Lumirror S-10#25」、Toray股份有限公司製造)。其次,將另一實施過剝離處理之PET膜剝離,並於2 kg之輥、往返一次之壓接條件下壓接至作為試板之玻璃板(商品名「Soda Lime Glass #0050」、松浪硝子工業股份有限公司製造),製作由[試板/黏著劑層/PET膜]構成之樣品。對所獲得之樣品進行高壓釜處理(50℃,0.5 MPa,15分鐘),其後,於23℃、50%RH之氛圍下放置冷卻30分鐘。放置冷卻後,使用拉伸試驗機(裝置名「EZ Test/EZ-S」、島津製作所股份有限公司製造),依據JIS Z0237於23℃、50%RH之氛圍下,於拉伸速度300 mm/分鐘、剝離角度180°之條件下自試板剝離黏著片材(黏著劑層/PET膜),測定180°剝離黏著力(N/20 mm)。 (5)180° peel adhesion A sheet piece with a length of 100 mm and a width of 20 mm was cut out from the adhesive sheet obtained in the Example and Comparative Example. Next, a PET film that has been peeled off of the adhesive sheet is attached to the exposed adhesive surface (backing) of a PET film (trade name "Lumirror S-10#25", manufactured by Toray Co., Ltd.). Next, another PET film that had been peeled was peeled off, and it was crimped to a glass plate as a test plate (trade name "Soda Lime Glass #0050", Shounami Glass) using a 2 kg roller and one reciprocation. Manufactured by Industrial Co., Ltd.) and prepare a sample composed of [test plate/adhesive layer/PET film]. The obtained sample was subjected to autoclave treatment (50°C, 0.5 MPa, 15 minutes), and then left to cool for 30 minutes in an atmosphere of 23°C and 50% RH. After leaving to cool, use a tensile testing machine (device name "EZ Test/EZ-S", manufactured by Shimadzu Corporation), in accordance with JIS Z0237 in an atmosphere of 23°C and 50%RH at a tensile speed of 300 mm/ Minutes, peel off the adhesive sheet (adhesive layer/PET film) from the test plate at a peeling angle of 180°, and measure the 180° peeling adhesive force (N/20 mm).
(6)Tg及儲存彈性模數 將實施例及比較例中所獲得之黏著劑層積層並進行沖切,製作厚度2 mm×直徑8 mm之圓盤狀之試片。利用剪切試驗用之平行板將該試片夾住,使用動態黏彈性測定裝置(裝置名「ARES-G2」、TA Instruments公司製造)於下文所記載之測定條件下測定損失彈性模數G''及儲存彈性模數G'。將損失彈性模數與儲存彈性模數之比(G''/G')=Tanδ之峰值讀取為黏著劑層之Tg。 ・測定:剪切模式 ・溫度範圍:-50℃~150℃ ・升溫速度:5℃/min ・頻率:1 Hz (6)Tg and storage elastic modulus The adhesive layers obtained in the Examples and Comparative Examples were laminated and die-cut to prepare disc-shaped test pieces with a thickness of 2 mm and a diameter of 8 mm. The specimen was clamped using parallel plates for shear testing, and the loss elastic modulus G' was measured using a dynamic viscoelasticity measuring device (device name "ARES-G2", manufactured by TA Instruments) under the measurement conditions described below. 'and store the elastic modulus G'. The peak value of the ratio of the loss elastic modulus to the storage elastic modulus (G''/G') = Tanδ is read as the Tg of the adhesive layer. ・Measurement: Cut mode ・Temperature range: -50℃~150℃ ・Heating rate: 5℃/min ・Frequency: 1 Hz
(7)凝膠分率 採取實施例及比較例中所獲得之黏著劑層約0.1 g,用平均孔徑0.2 μm之多孔質四氟乙烯片材(商品名「NTF1122」、日東電工股份有限公司製造)包裹後,以風箏線綁住,測定此時之重量並將該重量設為浸漬前重量(Z)。再者,該浸漬前重量為黏著劑層(上文中採取之黏著劑層)、四氟乙烯片材、及風箏線之總重量。又,亦預先測定四氟乙烯片材與風箏線之合計重量,將該重量設為包裝重量(Y)。 其次,將用四氟乙烯片材包裹並以風箏線綁住之黏著劑層(稱為「樣品」)放入填滿乙酸乙酯或甲苯之50 ml容器,於23℃靜置7日。其後,自容器中取出樣品(乙酸乙酯或甲苯處理後),移至鋁製杯中,於130℃在乾燥機中乾燥2小時而去除乙酸乙酯或甲苯,隨後測定重量並將該重量設為浸漬後重量(X)。 繼而,由下式算出凝膠分率。 凝膠分率[%(重量%)]=(X-Y)/(Z-Y)×100 (7) Gel fraction About 0.1 g of the adhesive layer obtained in the Examples and Comparative Examples was wrapped with a porous tetrafluoroethylene sheet (trade name "NTF1122", manufactured by Nitto Denko Co., Ltd.) with an average pore diameter of 0.2 μm, and then wrapped with a kite string Tie, measure the weight at this time, and set this weight as the weight before immersion (Z). Furthermore, the weight before immersion is the total weight of the adhesive layer (the adhesive layer adopted above), the PTFE sheet, and the kite string. Moreover, the total weight of the tetrafluoroethylene sheet and the kite string was also measured in advance, and this weight was set as the packaging weight (Y). Secondly, put the adhesive layer wrapped with tetrafluoroethylene sheet and tied with kite string (called "sample") into a 50 ml container filled with ethyl acetate or toluene, and let it stand at 23°C for 7 days. Thereafter, the sample (after treatment with ethyl acetate or toluene) was taken out from the container, moved to an aluminum cup, dried in a dryer at 130°C for 2 hours to remove the ethyl acetate or toluene, and then the weight was measured and the weight was Let it be the weight after immersion (X). Then, the gel fraction was calculated from the following equation. Gel fraction [%(weight%)]=(X-Y)/(Z-Y)×100
(8)水解試驗(凝膠分率保持率) 將實施例及比較例中所獲得之加入水解促進劑之黏著劑層於調整為85℃、85%RH之恆溫恆濕槽中保管0小時及336小時(兩週),測定保管後之凝膠分率。將保管0小時之樣品之凝膠分率設為(x)、保管336小時之樣品之凝膠分率設為(y),並由下式算出水解試驗後之凝膠分率保持率。 凝膠分率保持率=(y/x)×100 (8) Hydrolysis test (gel fraction retention rate) The adhesive layer added with the hydrolysis accelerator obtained in the Examples and Comparative Examples was stored in a constant temperature and humidity chamber adjusted to 85°C and 85% RH for 0 hours and 336 hours (two weeks), and the gel after storage was measured. Score. Let the gel fraction of the sample stored for 0 hours be (x), and the gel fraction of the sample stored for 336 hours be (y), and calculate the gel fraction retention rate after the hydrolysis test from the following formula. Gel fraction retention rate=(y/x)×100
[表1]
1:光學積層體 3:罩蓋構件 5:圖像顯示裝置 6:偏光膜 10:毫米波天線 11:黏著片材(黏著劑層) 11a:黏著片材(黏著劑層) 11b:黏著片材(黏著劑層) 12:毫米波天線基板 13:毫米波天線元件 14:罩蓋構件 15:圖像顯示面板 21:黏著劑層(黏著片材) 22:黏著劑層(黏著片材) 23:黏著劑層(黏著片材) 41:觸控感測器 42:觸控感測器 43:觸控感測器 44:雜訊減輕層 1: Optical laminated body 3: Cover component 5:Image display device 6:Polarizing film 10: Millimeter wave antenna 11: Adhesive sheet (adhesive layer) 11a: Adhesive sheet (adhesive layer) 11b: Adhesive sheet (adhesive layer) 12: Millimeter wave antenna substrate 13: Millimeter wave antenna elements 14:Cover component 15:Image display panel 21: Adhesive layer (adhesive sheet) 22: Adhesive layer (adhesive sheet) 23: Adhesive layer (adhesive sheet) 41:Touch sensor 42:Touch sensor 43:Touch sensor 44: Noise reduction layer
圖1係表示本發明之光學積層體之一實施方式之模式圖(剖視圖)。 圖2係表示本發明之光學積層體之另一實施方式之模式圖(剖視圖)。 圖3係表示本發明之光學積層體之又一實施方式之模式圖(剖視圖)。 圖4係表示本發明之毫米波天線之一實施方式之模式圖(剖視圖)。 圖5係表示本發明之毫米波天線之另一實施方式之模式圖(剖視圖)。 圖6係表示本發明之毫米波天線之又一實施方式之模式圖(剖視圖)。 FIG. 1 is a schematic diagram (cross-sectional view) showing one embodiment of the optical laminate of the present invention. FIG. 2 is a schematic diagram (cross-sectional view) showing another embodiment of the optical laminate of the present invention. FIG. 3 is a schematic diagram (cross-sectional view) showing another embodiment of the optical laminate of the present invention. FIG. 4 is a schematic diagram (cross-sectional view) showing one embodiment of the millimeter wave antenna of the present invention. FIG. 5 is a schematic diagram (cross-sectional view) showing another embodiment of the millimeter wave antenna of the present invention. FIG. 6 is a schematic diagram (cross-sectional view) showing another embodiment of the millimeter wave antenna of the present invention.
1:光學積層體 1: Optical laminated body
3:罩蓋構件 3: Cover component
5:圖像顯示裝置 5:Image display device
6:偏光膜 6:Polarizing film
21:黏著劑層(黏著片材) 21: Adhesive layer (adhesive sheet)
22:黏著劑層(黏著片材) 22: Adhesive layer (adhesive sheet)
23:黏著劑層(黏著片材) 23: Adhesive layer (adhesive sheet)
41:觸控感測器 41:Touch sensor
42:觸控感測器 42:Touch sensor
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2022013524A JP2023111603A (en) | 2022-01-31 | 2022-01-31 | Adhesive composition, adhesive layer, and adhesive sheet |
JP2022-013524 | 2022-01-31 |
Publications (1)
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TW202338053A true TW202338053A (en) | 2023-10-01 |
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Family Applications (1)
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TW112103060A TW202338053A (en) | 2022-01-31 | 2023-01-30 | Adhesive agent composition, adhesive agent layer, and adhesive sheet |
Country Status (5)
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JP (1) | JP2023111603A (en) |
KR (1) | KR20240140950A (en) |
CN (1) | CN118591606A (en) |
TW (1) | TW202338053A (en) |
WO (1) | WO2023145601A1 (en) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013039784A (en) * | 2011-08-19 | 2013-02-28 | Keiichi Uno | Polyester type adhesive and sheet-like laminate using the same |
JP5426715B2 (en) | 2011-09-30 | 2014-02-26 | 日東電工株式会社 | Adhesive, adhesive layer, and adhesive sheet |
JP2015105286A (en) * | 2013-11-28 | 2015-06-08 | 日東電工株式会社 | Adhesive layer for transparent conductive film, transparent conductive film with adhesive layer, and touch panel |
JP6666181B2 (en) * | 2016-03-25 | 2020-03-13 | マクセルホールディングス株式会社 | Adhesive composition, adhesive member and method for producing the same, adhesive sheet and method for producing the same, and electronic equipment including the adhesive member |
JP6945586B2 (en) * | 2019-04-17 | 2021-10-06 | 住友化学株式会社 | Laminated body and image display device |
CN115298245A (en) * | 2020-03-30 | 2022-11-04 | 东洋纺株式会社 | Polyester, film, adhesive composition, adhesive sheet, laminate, and printed wiring board |
CN116133850A (en) * | 2020-07-22 | 2023-05-16 | 日东电工株式会社 | Adhesive sheet and film with adhesive layer |
-
2022
- 2022-01-31 JP JP2022013524A patent/JP2023111603A/en active Pending
-
2023
- 2023-01-19 CN CN202380018475.0A patent/CN118591606A/en active Pending
- 2023-01-19 WO PCT/JP2023/001525 patent/WO2023145601A1/en unknown
- 2023-01-19 KR KR1020247028598A patent/KR20240140950A/en unknown
- 2023-01-30 TW TW112103060A patent/TW202338053A/en unknown
Also Published As
Publication number | Publication date |
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CN118591606A (en) | 2024-09-03 |
WO2023145601A1 (en) | 2023-08-03 |
KR20240140950A (en) | 2024-09-24 |
JP2023111603A (en) | 2023-08-10 |
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