TW202334797A - Protective assembly and touch module - Google Patents

Abstract

A protective assembly includes a cover plate, a buffer layer, and a flexible substrate. The buffer layer is disposed on the cover plate and made of transparent polymer. The buffer layer has a light transmittance greater than about 85%, a thickness ranging from about 3 µm to about 15 µm, and a Posson ratio greater than about 0.4. The flexible substrate is disposed on the buffer layer and doped with an inorganic compound. The flexible substrate has a thickness ranging from about 3 µm to about 10 µm and a Young's coefficient ranging from about 1 Gpa to about 10 Gpa.

Description

Protection components and touch modules

This disclosure relates to a protection component and a touch module.

The requirements for the durability of touch panels in electronic devices are getting higher and higher. In addition to breaking through the two major performances of touch sensitivity and display refresh rate, how to also have a drop-resistant and impact-resistant design is a focus of efforts.

After checking the Chinese patent application publication number CN 100378541C, in order to increase the hardness, wear resistance and impact resistance of the cover, it discloses the use of a composite protective substrate including a buffer layer and a sapphire substrate, which can be applied to the touch sensing device. However, sapphire material has the disadvantages of being prone to cracks and not flexible.

Therefore, how to come up with a protection component and touch module that can solve the above problems is one of the problems that the industry is currently eager to invest in research and development resources to solve.

In view of this, one purpose of the present disclosure is to provide a protection component, a protection component and a touch module that can solve the above problems.

In order to achieve the above object, according to an embodiment of the present disclosure, a protection component includes a cover plate, a buffer layer and a flexible substrate. The buffer layer is arranged on the cover plate and is made of transparent polymer. The buffer layer has a light transmittance greater than about 85%, a thickness ranging from about 3 µm to about 15 µm, and a Poisson ratio greater than about 0.4. The flexible substrate is disposed on the buffer layer and doped with an inorganic mixture. The flexible substrate has a thickness of about 3 µm to about 10 µm and a Young's coefficient of about 1 Gpa to about 10 Gpa.

In one or more embodiments of the present disclosure, the buffer layer has a Poisson ratio greater than about 0.5.

In one or more embodiments of the present disclosure, the buffer layer has an elongation of between about 200% and about 1600%.

In one or more embodiments of the present disclosure, at least one of the buffer layer and the flexible substrate has a cracking temperature greater than about 340 degrees Celsius.

In one or more embodiments of the present disclosure, at least one of the buffer layer and the flexible substrate has a maximum service temperature greater than about 350 degrees Celsius.

In one or more embodiments of the present disclosure, the inorganic mixture includes graphene, diamond, or mixtures thereof.

In one or more embodiments of the present disclosure, the inorganic mixture includes between about 100 ppm and about 1000 ppm graphene oxide.

In one or more embodiments of the present disclosure, the protective component further includes a bonding layer. The bonding layer joins the cover plate and the buffer layer and has a thickness ranging from about 10 nm to about 100 nm.

In one or more embodiments of the present disclosure, the material of the bonding layer includes epoxysiloxane, aminosiloxane or thiolsiloxane.

In one or more embodiments of the present disclosure, the host material of the buffer layer includes polydimethylsiloxane, polymethylmethacrylate or polycarbonate.

In one or more embodiments of the present disclosure, the component materials in the buffer layer include epoxy-based organic matter, amino-based organic matter, or thiol-based organic matter.

In one or more embodiments of the present disclosure, the component materials in the flexible substrate include epoxy-based organic matter or thiol-based organic matter.

In order to achieve the above object, according to an embodiment of the present disclosure, a touch module includes a protection component, a bridge pattern layer and an electrode pattern layer. The bridging pattern layer is disposed on a side of the flexible substrate away from the cover plate and includes a plurality of bridging electrodes. The electrode pattern layer is disposed above the bridge pattern layer and includes a first transparent conductive layer, a metal layer and a second transparent conductive layer that are sequentially stacked and have a first resistance value, a second resistance value and a third resistance value respectively.

In one or more embodiments of the present disclosure, the electrode pattern layer has two through-hole regions directly above one of the bridge electrodes. The touch module further includes a first insulation layer and a second insulation layer. The first insulation layer is disposed between the bridge pattern layer and the electrode pattern layer and has two exposed areas. The electrode pattern layer is electrically connected to the bridge electrode through the exposed area. The second insulating layer is disposed on the electrode pattern layer and covers and fills the through hole area.

In one or more embodiments of the present disclosure, the first insulating layer includes a first insulating block and a second insulating block respectively formed at both ends of the bridge electrode, and is located on the first insulating block separated by an exposed area. The third insulating block is between the insulating block and the second insulating block.

In one or more embodiments of the present disclosure, the electrode pattern layer includes two first electrode blocks and a second electrode block. The first electrode blocks are electrically connected to the one of the bridge electrodes through the exposed areas respectively. The second electrode blocks are located between the first electrode blocks separated by via holes.

In one or more embodiments of the present disclosure, the first transparent conductive layer is a first transparent oxide conductive layer, and the second transparent conductive layer is a second transparent oxide conductive layer.

In one or more embodiments of the present disclosure, at least one of the first transparent oxide conductive layer and the second transparent oxide conductive layer has a first region and a second region. The oxygen content in the first region is greater than the oxygen content in the second region.

In one or more embodiments of the present disclosure, the second region is located between the first region and the metal layer.

In summary, in the protection component of the present disclosure, the elasticity provided by the buffer layer and the high Young's coefficient provided by the flexible substrate can resist impact when it is hit, thus making the touch module Touch functionality is still available. Moreover, the touch module of the present disclosure also uses a composite touch electrode design to match the protective component. Therefore, the composite touch electrode can not only maintain the touch function by protecting the component against impact, but also effectively reduce the impedance to increase the touch sensitivity. Control the refresh rate.

The above is only used to describe the problems to be solved by the present disclosure, the technical means to solve the problems, the effects thereof, etc. The specific details of the present disclosure will be introduced in detail in the following implementation modes and related drawings.

A plurality of implementation manners of the present disclosure will be disclosed below with drawings. For clarity of explanation, many practical details will be explained together in the following description. However, it should be understood that these practical details should not be used to limit the disclosure. That is to say, in some implementations of the present disclosure, these practical details are not necessary. In addition, for the sake of simplifying the drawings, some commonly used structures and components will be illustrated in a simple schematic manner in the drawings.

Please refer to FIG. 1 , which is a schematic diagram of a touch module 100 according to an embodiment of the present disclosure. As shown in FIG. 1 , in this embodiment, the touch module 100 includes a flexible substrate 110 , a touch electrode layer, a plurality of traces 160 and a flexible circuit board 170 . A touch area Z1 and a peripheral area Z2 are defined on the flexible substrate 110 . The peripheral area Z2 is located at the outer edge of the touch area Z1. The touch electrode layer is disposed in the touch area Z1. The traces 160 are located in the peripheral area Z2, and both ends of each trace 160 are respectively connected to the touch electrode layer and the flexible circuit board 170, thereby transmitting the touch signal generated by the touch electrode layer to the flexible circuit board 170.

Please refer to Figure 2 and Figure 3. Figure 2 is a partial enlarged view of the touch module 100 in Figure 1 . Figure 3 is a cross-sectional view along line 3-3 of the structure in Figure 2. The area shown in Figure 2 is located in the touch area Z1. As shown in FIGS. 2 and 3 , in this embodiment, the touch electrode layer includes a bridge pattern layer 120 and an electrode pattern layer 140 . The touch module 100 further includes a first insulation layer 130 and a second insulation layer 150 . The bridging pattern layer 120 is disposed on the flexible substrate 110 and includes a plurality of bridging electrodes 121 . One of the bridging electrodes 121 is used for description below. The first insulating layer 130 is disposed on the bridge pattern layer 120 and has two exposed areas 130a and 130b respectively adjacent to opposite ends of the bridge electrode 121. The electrode pattern layer 140 is disposed on the first insulating layer 130 and is electrically connected to the bridge electrode 121 through the exposed areas 130a and 130b. The electrode pattern layer 140 has two through-hole regions 140c1 and 140c2 directly above the bridge electrode 121. The second insulating layer 150 is disposed on the electrode pattern layer 140 and covers and fills the through hole regions 140c1 and 140c2.

In some embodiments, the thickness of the first insulating layer 130 is about 1.25 μm, and the thickness of the second insulating layer 150 is about 2 μm, but the disclosure is not limited thereto.

Specifically, as shown in FIGS. 2 and 3 , in this embodiment, the electrode pattern layer 140 includes two first electrode blocks 140a1 and 140a2 and a second electrode block 140b. The first electrode blocks 140a1 and 140a2 are electrically connected to the bridge electrode 121 through the exposed areas 130a and 130b respectively. The second electrode block 140b is separated by the through hole areas 140c1 and 140c2 and is located between the first electrode blocks 140a1 and 140a2. Thereby, the two first electrode blocks 140a1 and 140a2 can transmit touch signals through the bridge electrode 121 and be electrically isolated from the second electrode block 140b.

In some embodiments, the electrode pattern layer 140 includes a plurality of first-axis conductive units separated from each other and a plurality of second-axis conductive units separated from each other and spanning the first-axis conductive units. Specifically, the aforementioned "first axis" and "second axis" are, for example, two axes that are perpendicular to each other (such as the Y axis and the X axis). In other words, the first axis conductive units are conductive lines extending along the first axis and arranged at intervals. The combination of the two first electrode blocks 140a1, 140a2 and the bridge electrode 121 is part of one of the first axis conductive units. The second axis conductive units are conductive lines extending along the second axis and arranged at intervals. The aforementioned second electrode block 140b is one of the second-axis conductive units, which spans the opposite sides of the bridge electrode 121 (separated by the first insulating layer 130). It can be seen that the aforementioned exposed areas 130a and 130b span the opposite sides of the bridge electrode 121 and divide the electrode pattern layer 140 into the first electrode blocks 140a1, 140a2 and the second electrode block 140b.

As shown in FIG. 3 , in this embodiment, the electrode pattern layer 140 includes a first transparent oxide conductive layer 141 stacked in sequence and having a first resistance value, a second resistance value and a third resistance value respectively (i.e., the third resistance value). a transparent conductive oxide layer), a metal layer 142 and a second transparent conductive oxide layer 143 (ie, the second transparent conductive layer). The first resistance value and the third resistance value are greater than the second resistance value. By using the electrode pattern layer 140 with the aforementioned composite conductive structure to form the touch electrode layer, the resistance of the circuits in the touch module 100 can be effectively reduced, thereby making the touch module 100 suitable for use in medium and large-sized products.

In some embodiments, the materials of the first transparent oxide conductive layer 141 and the second transparent oxide conductive layer 143 include indium tin oxide (ITO). Thereby, the first transparent oxide conductive layer 141 and the second transparent oxide conductive layer 143 can have good light transmittance. In some embodiments, the material of the metal layer 142 includes silver, but the present disclosure is not limited thereto. In some embodiments, the metal layer 142 can be a nanosilver ink layer, a nanosilver paste layer, a nanosputtering layer, etc., but is not limited thereto. Thereby, the metal layer 142 can have a lower resistance value.

In some embodiments, the thickness of the first transparent oxide conductive layer 141 is about 40 nm, but the present disclosure is not limited thereto. In some embodiments, the thickness of the metal layer 142 is about 8.5 nm to about 9.5 nm, but the present disclosure is not limited thereto. In some embodiments, the thickness of the second transparent oxide conductive layer 143 is about 40 nm, but the disclosure is not limited thereto.

As shown in FIGS. 2 and 3 , in this embodiment, the first insulating layer 130 includes a first insulating block 131 a and a second insulating block 131 b respectively formed at opposite ends of the bridge electrode 121 , and is formed by exposing The regions 130a and 130b are separately located in the third insulating block 131c between the first insulating block 131a and the second insulating block 131b. In detail, the first insulating block 131a and the second insulating block 131b respectively cover the opposite ends of the bridge electrode 121 without being exposed. The first insulating block 131a, the third insulating block 131c and the second insulating block 131b cover the bridging electrode 121 in sequence along the extending direction of the bridging electrode 121. The exposed areas 130a and 130b are respectively formed between the first insulating block 131a and the third insulating block 131c and between the third insulating block 131c and the second insulating block 131b. In addition, as shown in FIG. 3, the first insulating block 131a, the second insulating block 131b and the third insulating block 131c have slopes. Specifically, the first insulating block 131a, the second insulating block 131b, and the third insulating block 131c are shaped like hills with slopes.

Through the foregoing structural configuration, the problem of cracks in the electrode pattern layer 140 disposed on the first insulating layer 130 can be effectively improved. Specifically, since the electrode pattern layer 140 is located above the opposite ends of the bridge electrode 121 by climbing up the first insulating block 131a and the second insulating block 131b, the position of the electrode pattern layer 140 adjacent to the bridge electrode 121 can be effectively improved. The problem of cracks at opposite ends.

As shown in FIG. 2 , in this embodiment, the exposed areas 130 a and 130 b span opposite sides of the bridge electrode 121 . Thereby, the contact area between the first electrode blocks 140a1 and 140a2 of the electrode pattern layer 140 and the bridge electrode 121 can be increased, thereby reducing the impedance.

Please refer to FIG. 4 , which is a partial cross-sectional view of the electrode pattern layer 140 in FIG. 2 . As shown in FIG. 4 , in this embodiment, the first transparent oxide conductive layer 141 has a first region 141 a and a second region 141 b. The oxygen content of the first region 141a is greater than the oxygen content of the second region 141b. The second region 141b of the first transparent oxide conductive layer 141 is located between the first region 141a and the metal layer 142. The second transparent oxide conductive layer 143 has a first region 143a and a second region 143b. The second region 143b of the second transparent oxide conductive layer 143 is located between the first region 143a and the metal layer 142. Through this structural configuration, the first transparent oxide conductive layer 141 and the second transparent oxide conductive layer 143 can effectively have high transmittance and low resistance.

Table 1 below is a table of process parameters for manufacturing the electrode pattern layer 140 of Embodiments A to C. Layer 1 Layer 2 Layer 3 Layer 4 Layer 5 Oxygen flux/sccm Power/kw Oxygen flux/sccm Power/kw Power/kw Oxygen flux/sccm Power/kw Oxygen flux/sccm Power/kw A 1.0 5.1 1.0 5.1 1.0 1.0 5.1 1.0 5.1 B 0.3 5.1 0.3 5.1 1.0 0.3 5.1 0.3 5.1 C 1.0 5.1 0.3 5.1 1.0 1.0 0.3 1.0 5.1

It should be noted that layer 1 and layer 2 in Table 1 are the process parameters used in manufacturing the first region 141a and the second region 141b of the first transparent oxide conductive layer 141 respectively, and layer 3 is the process parameters used in manufacturing the metal layer 142. The process parameters of layer 4 and layer 5 are respectively the process parameters used in manufacturing the second region 143b and the first region 143a of the second transparent oxide conductive layer 143. It can be seen from Table 1 above that when manufacturing the first transparent oxide conductive layer 141 and the second transparent oxide conductive layer 143 of Embodiment A, the first regions 141a, 143a and the second regions 141b, 143b adopt high oxygen flux. (i.e. 1.0 sccm). When manufacturing the first transparent oxide conductive layer 141 and the second transparent oxide conductive layer 143 of Embodiment B, the first regions 141a, 143a and the second regions 141b, 143b adopt low oxygen permeability (ie, 0.3 sccm). . When manufacturing the first transparent oxide conductive layer 141 and the second transparent oxide conductive layer 143 of Embodiment C, the first regions 141a and 143a both adopt high oxygen flux (ie, 1.0 sccm), while the second regions 141b and 143b All use low oxygen flow (i.e. 0.3 sccm).

Table 2 below is a table of physical parameters of the electrode pattern layer 140 of Embodiments A to C. Optical parameters Grilled rear blocker/ops T% Haze L* a* b* A 89.1 0.19 26.28 4.50 1.53 7.09 B 87.0 0.26 26.36 11.15 2.04 6.79 C 87.6 0.24 25.96 9.64 0.78 6.70

It can be seen from Table 2 above that the transmittance of the electrode pattern layer 140 of Embodiment C (that is, the first transparent oxide conductive layer 141 and the second transparent oxide conductive layer 143 each include regions with different oxygen contents) can be maintained at Greater than 87%, and the impedance can also be maintained below 10 ops.

As shown in FIG. 3 , in this embodiment, the touch module 100 further includes a protection component 200 . The protection component 200 includes a cover 210 , a buffer layer 220 and a flexible substrate 110 . The buffer layer 220 is disposed on a side of the flexible substrate 110 away from the bridging pattern layer 120 and is located between the cover plate 210 and the flexible substrate 110 . The buffer layer 220 is made of transparent polymer. The buffer layer 220 has a light transmittance greater than about 85%, a thickness between about 3 µm and about 15 µm, and a Pusson ratio greater than about 0.4. The flexible substrate 110 has a thickness ranging from about 3 µm to about 10 µm, preferably from about 3 µm to about 6 µm. The flexible substrate 110 is doped with the inorganic mixture to have a Young's coefficient ranging from about 1 Gpa to about 10 Gpa. The aforementioned thickness limitation is to make the touch module 100 suitable for folding applications.

In some embodiments, the Pu-Song ratio of the buffer layer 220 is further greater than about 0.5.

In some embodiments, the buffer layer 220 has an elongation of between about 200% and about 1600%.

In some embodiments, at least one of the buffer layer 220 and the flexible substrate 110 has a decomposition temperature greater than about 340 degrees Celsius. In some embodiments, at least one of the buffer layer 220 and the flexible substrate 110 has a maximum service temperature greater than about 350 degrees Celsius. Thereby, the protection component 200 can withstand the high-temperature process when manufacturing the electrode pattern layer 140 .

In some embodiments, the main body material of the flexible substrate 110 preferably includes colorless polyimide (CPI), but the present disclosure is not limited thereto.

In some embodiments, the inorganic mixture includes graphene, diamond, or mixtures thereof.

In some embodiments, the inorganic mixture includes between about 100 ppm and about 1000 ppm graphene oxide, preferably between about 300 ppm and about 500 ppm.

In some embodiments, the component materials in the flexible substrate 110 may also include components such as epoxy functional organics (Epoxy functional organics) or thiol functional organics (Thiol functional organics), in order to increase the compatibility with inorganic mixtures. sex. In addition, acetic acid can also be added to inhibit premature gelation.

In some embodiments, the host material of the buffer layer 220 includes polydimethylsiloxane (PDMS), poly(methyl methacrylate) (PMMA) or polycarbonate (PC). , preferably polydimethylsiloxane, but the present disclosure is not limited thereto.

Table 3 below is a parameter table of the physical, mechanical and chemical properties of various materials. Main item secondary term PDMS PC PMMA CPI physical properties Transmittance ＞90% ＞88% ＞90% ＞88% Cracking temperature >340°C 420°C 170°C 400°C Maximum operating temperature 350°C 130°C 350°C Mechanical Elongation 200~ 1600% 66~140% 2~6% 7~95% Pusumbi 0.50 0.42 0.40 0.15~ 0.42 chemical Acid dilute/concentrated good very poor Difference very poor base good very poor Difference very poor Aliphatic hydrocarbons good good Good-Pu good Aromatic hydrocarbons very poor Difference Difference good

As can be seen from the above table, PDMS and CPI have better performance in terms of physical, mechanical and chemical properties, so they have better ability to withstand high temperatures or corrosive processes. In other words, in some embodiments, the material of the buffer layer 220 may be preferably PDMS, and the material of the flexible substrate 110 may be preferably CPI.

In some embodiments, the component materials in the buffer layer 220 also include components such as epoxy-based organic matter, amino-based organic matter, or thiol-based organic matter. In some embodiments, the buffer layer 220 includes PDMS-Epoxy composite material. In some embodiments, the ratio of PDMS to Epoxy is about 3:2 to about 1:1, and IPA-xylene solvent is used. It is worth noting that in addition to IPA, it also relies on water to help hydrolysis and acetic acid to inhibit premature gelation.

Please refer to FIG. 5 , which is a chart illustrating the ball drop test of the protection component 200 of different embodiments. It should be noted that Embodiment 1 is an embodiment in which the buffer layer 220 is omitted from the touch module 100 and the flexible substrate 110 is not doped with an inorganic mixture. Embodiment II is an embodiment in which the buffer layer 220 is omitted from the touch module 100 and the flexible substrate 110 is doped with an inorganic mixture. Embodiment III is a touch module 100 including a protection component 200 as shown in FIG. 3 . As shown in Figure 5, compared with Embodiments I and II, Embodiment III can significantly increase the ball falling height.

It can be seen from the above configuration that the protection component 200 of this embodiment can resist impact when it is hit through the elasticity provided by the buffer layer 220 and the high Young's coefficient provided by the flexible substrate 110 , thus making the touch module The touch function of 100 can still be used.

Please refer to FIG. 6 , which is a cross-sectional view of a touch module 100A according to another embodiment of the present disclosure. As shown in FIG. 6 , this embodiment is modified for the protection component 200 of the touch module 100 shown in FIG. 3 . Specifically, the protection component 300 of this embodiment further includes a bonding layer 330 . The bonding layer 330 joins the cover 210 and the buffer layer 220 and has a thickness ranging from about 10 nm to about 100 nm, preferably from about 40 nm to about 60 nm. The purpose of the bonding layer 330 (Primer) is to better serve as a bonding medium between the cover plate 210 and the buffer layer 220 .

In some embodiments, the material of the bonding layer 330 includes epoxy functional silane (Epoxy functional silane), amino siloxane (Amine functional silane) or thiol functional silane (Thiol functional silane), but the present disclosure does not Not limited to this.

From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that in the protective component of the present disclosure, the elasticity provided by the buffer layer and the high Young's coefficient provided by the flexible substrate can be used to withstand the stress. It can resist impact when hit, so the touch function of the touch module can still be used. Moreover, the touch module of the present disclosure also uses a composite touch electrode design to match the protective component. Therefore, the composite touch electrode can not only maintain the touch function by protecting the component against impact, but also effectively reduce the impedance to increase the touch sensitivity. Control the refresh rate.

Although the disclosure has been disclosed in the above embodiments, it is not intended to limit the disclosure. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the disclosure. Therefore, the protection of the disclosure is The scope shall be determined by the appended patent application scope.

100,100A:Touch module 110:Flexible substrate 120: Bridge pattern layer 121:Bridging electrode 130: First insulation layer 130a,130b: exposed area 131a: First insulation block 131b: Second insulation block 131c: The third insulating block 140: Electrode pattern layer 140a1,140a2: first electrode block 140b: Second electrode block 140c1,140c2:Through hole area 141: First transparent oxide conductive layer 141a,143a: first area 141b,143b: Second area 143: Second transparent oxide conductive layer 150: Second insulation layer 160: routing 170:Flexible circuit board 200,300: Protection components 210:Cover 220:Buffer layer 330:Jointing layer Z1:Touch area Z2: Surrounding area

In order to make the above and other objects, features, advantages and embodiments of the present disclosure more obvious and understandable, the accompanying drawings are described as follows: Figure 1 is a schematic diagram illustrating a touch module according to an embodiment of the present disclosure. Figure 2 is a partial enlarged view of the touch module in Figure 1. Figure 3 is a cross-sectional view along line 3-3 of the structure in Figure 2. FIG. 4 is a partial cross-sectional view of the electrode pattern layer in FIG. 2 . Figure 5 is a chart illustrating the ball drop test of the protection components of different embodiments. Figure 6 is a cross-sectional view of a touch module according to another embodiment of the present disclosure.

Domestic storage information (please note in order of storage institution, date and number) without Overseas storage information (please note in order of storage country, institution, date, and number) without

100:Touch module

110:Substrate

120: Bridge pattern layer

121:Bridging electrode

130: First insulation layer

130a,130b: exposed area

131a: First insulation block

131b: Second insulation block

131c: The third insulating block

140: Electrode pattern layer

140c1,140c2:Through hole area

141: First transparent oxide conductive layer

142:Metal layer

143: Second transparent oxide conductive layer

150: Second insulation layer

200: Protection components

210:Cover

220:Buffer layer

Claims (20)

A protective component includes: a cover plate; A buffer layer is provided on the cover plate and is composed of a transparent polymer. The buffer layer has a light transmittance greater than about 85%; and A flexible substrate is disposed on the buffer layer and doped with an inorganic mixture. The flexible substrate has a Young's coefficient ranging from about 1 Gpa to about 10 Gpa, wherein the inorganic mixture includes graphene, diamond or a mixture thereof. The protective component of claim 1, wherein the buffer layer has a thickness of between about 3 µm and about 15 µm, and the flexible substrate has a thickness of between about 3 µm and about 10 µm. The protection component of claim 1, wherein the buffer layer has a Poisson's ratio greater than about 0.4. The protective component of claim 1, wherein the flexible substrate contains colorless polyimide (CPI). The protection component of claim 1, wherein the flexible substrate has a Poisson's ratio greater than about 0.15. The protective component of claim 1, wherein the buffer layer has an elongation of between about 200% and about 1600%. The protection component of claim 1, wherein at least one of the buffer layer and the flexible substrate has a cracking temperature greater than about 340 degrees Celsius. The protection component of claim 1, wherein at least one of the buffer layer and the flexible substrate has a maximum service temperature greater than about 350 degrees Celsius. The protection component of claim 1, wherein the inorganic mixture contains graphene oxide between about 100 ppm and about 1000 ppm. The protection component of claim 1, further comprising a bonding layer bonding the cover plate and the buffer layer, and having a thickness ranging from about 10 nm to about 100 nm. The protective component of claim 10, wherein the material of the bonding layer includes epoxysiloxane, aminosiloxane or thiolsiloxane. The protective component of claim 1, wherein the main material of the buffer layer includes polydimethylsiloxane, polymethylmethacrylate or polycarbonate. The protective component of claim 1, wherein the component materials in the buffer layer include epoxy-based organic matter, amino-based organic matter or thiol-based organic matter. The protective component of claim 1, wherein the component materials in the flexible substrate include epoxy-based organic matter or thiol-based organic matter. A touch module including: A protection component as described in any one of claims 1 to 14; A bridge pattern layer is provided on the side of the flexible substrate away from the cover plate and includes a plurality of bridge electrodes; and An electrode pattern layer is disposed above the bridging pattern layer and includes a first transparent conductive layer, a metal layer and a first transparent conductive layer stacked in sequence and each having a first resistance value, a second resistance value and a third resistance value; a second transparent conductive layer. The touch module of claim 15, wherein the electrode pattern layer has two through-hole areas directly above one of the bridge electrodes, the touch module further includes: A first insulating layer is disposed between the bridging pattern layer and the electrode pattern layer and has two exposed areas, wherein the electrode pattern layer is electrically connected to the bridging electrode through the exposed areas; and A second insulating layer is disposed on the electrode pattern layer and covers and fills the through hole areas. The touch module of claim 16, wherein the first insulating layer includes a first insulating block and a second insulating block respectively formed at both ends of the bridging electrodes, and by the A third insulating block is spaced between the first insulating block and the second insulating block. The touch module as described in claim 15, wherein the electrode pattern layer includes: The two first electrode blocks are electrically connected to the one of the bridge electrodes through the exposed areas respectively; and A second electrode block is located between the first electrode blocks separated by the through hole areas. The touch module of claim 15, wherein the first transparent conductive layer is a first transparent oxide conductive layer, and the second transparent conductive layer is a second transparent oxide conductive layer. The touch module of claim 19, wherein at least one of the first transparent oxide conductive layer and the second transparent oxide conductive layer has a first region and a second region, and the first The oxygen content of the region is greater than the oxygen content of the second region.