TW202330839A - Composition for adhesive, and laminate - Google Patents
Composition for adhesive, and laminate Download PDFInfo
- Publication number
- TW202330839A TW202330839A TW111133725A TW111133725A TW202330839A TW 202330839 A TW202330839 A TW 202330839A TW 111133725 A TW111133725 A TW 111133725A TW 111133725 A TW111133725 A TW 111133725A TW 202330839 A TW202330839 A TW 202330839A
- Authority
- TW
- Taiwan
- Prior art keywords
- component
- compound
- modified
- adhesive
- aforementioned
- Prior art date
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- 239000000853 adhesive Substances 0.000 title claims abstract description 108
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 88
- 239000000203 mixture Substances 0.000 title claims abstract description 87
- -1 isocyanate compound Chemical class 0.000 claims abstract description 68
- 150000001875 compounds Chemical class 0.000 claims abstract description 65
- 239000005056 polyisocyanate Substances 0.000 claims abstract description 56
- 229920001228 polyisocyanate Polymers 0.000 claims abstract description 56
- 229920000098 polyolefin Polymers 0.000 claims abstract description 56
- 239000011888 foil Substances 0.000 claims abstract description 48
- 229910052751 metal Inorganic materials 0.000 claims abstract description 38
- 239000002184 metal Substances 0.000 claims abstract description 38
- 239000012948 isocyanate Substances 0.000 claims abstract description 36
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 26
- 239000002904 solvent Substances 0.000 claims abstract description 24
- 239000007809 chemical reaction catalyst Substances 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims description 58
- 239000011347 resin Substances 0.000 claims description 58
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 45
- 238000006243 chemical reaction Methods 0.000 claims description 34
- 239000001257 hydrogen Substances 0.000 claims description 22
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 20
- 239000012790 adhesive layer Substances 0.000 claims description 16
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 15
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 125000000524 functional group Chemical group 0.000 claims description 12
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 claims description 11
- 125000001931 aliphatic group Chemical group 0.000 claims description 11
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 claims description 11
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 10
- 150000001735 carboxylic acids Chemical class 0.000 claims description 9
- 239000007795 chemical reaction product Substances 0.000 claims description 9
- 239000004615 ingredient Substances 0.000 claims description 8
- 239000000047 product Substances 0.000 claims description 8
- 150000008064 anhydrides Chemical class 0.000 claims description 6
- 150000001298 alcohols Chemical class 0.000 claims description 5
- 239000000178 monomer Substances 0.000 claims description 5
- 239000004840 adhesive resin Substances 0.000 claims description 2
- 229920006223 adhesive resin Polymers 0.000 claims description 2
- AVWRKZWQTYIKIY-UHFFFAOYSA-N urea-1-carboxylic acid Chemical compound NC(=O)NC(O)=O AVWRKZWQTYIKIY-UHFFFAOYSA-N 0.000 claims description 2
- 125000001261 isocyanato group Chemical group *N=C=O 0.000 abstract 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 24
- 238000010438 heat treatment Methods 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 16
- 239000003960 organic solvent Substances 0.000 description 13
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 12
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 12
- 238000002844 melting Methods 0.000 description 11
- 230000008018 melting Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 239000000126 substance Substances 0.000 description 11
- 239000002253 acid Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 125000005442 diisocyanate group Chemical group 0.000 description 10
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 9
- 239000005022 packaging material Substances 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- 239000004743 Polypropylene Substances 0.000 description 8
- 229920001155 polypropylene Polymers 0.000 description 8
- 229920005672 polyolefin resin Polymers 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000007334 copolymerization reaction Methods 0.000 description 6
- 235000013305 food Nutrition 0.000 description 6
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 6
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 6
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- UAEPNZWRGJTJPN-UHFFFAOYSA-N Methylcyclohexane Natural products CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000004927 fusion Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000000691 measurement method Methods 0.000 description 5
- 239000011342 resin composition Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 239000003814 drug Substances 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 4
- 229920005606 polypropylene copolymer Polymers 0.000 description 4
- 239000004800 polyvinyl chloride Substances 0.000 description 4
- 229920000915 polyvinyl chloride Polymers 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 3
- 150000001336 alkenes Chemical class 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 239000012943 hotmelt Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 3
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 description 2
- 229920006243 acrylic copolymer Polymers 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N caprylic alcohol Natural products CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 2
- 239000012975 dibutyltin dilaurate Substances 0.000 description 2
- 238000000113 differential scanning calorimetry Methods 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007646 gravure printing Methods 0.000 description 2
- 238000007602 hot air drying Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001083 polybutene Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- YKYONYBAUNKHLG-UHFFFAOYSA-N propyl acetate Chemical compound CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- XSCLFFBWRKTMTE-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCCC(CN=C=O)C1 XSCLFFBWRKTMTE-UHFFFAOYSA-N 0.000 description 1
- ROHUXHMNZLHBSF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCC(CN=C=O)CC1 ROHUXHMNZLHBSF-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- DFPJRUKWEPYFJT-UHFFFAOYSA-N 1,5-diisocyanatopentane Chemical compound O=C=NCCCCCN=C=O DFPJRUKWEPYFJT-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- BYPFICORERPGJY-UHFFFAOYSA-N 3,4-diisocyanatobicyclo[2.2.1]hept-2-ene Chemical compound C1CC2(N=C=O)C(N=C=O)=CC1C2 BYPFICORERPGJY-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- HVCNXQOWACZAFN-UHFFFAOYSA-N 4-ethylmorpholine Chemical compound CCN1CCOCC1 HVCNXQOWACZAFN-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-OUBTZVSYSA-N Carbon-13 Chemical compound [13C] OKTJSMMVPCPJKN-OUBTZVSYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
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- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
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- HEDRZPFGACZZDS-MICDWDOJSA-N Trichloro(2H)methane Chemical class [2H]C(Cl)(Cl)Cl HEDRZPFGACZZDS-MICDWDOJSA-N 0.000 description 1
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- WNQITGRHOWFLEA-LMWFVWJRSA-N [(1R,4S,5R,8S,9R,10S,12R,13R)-1,5,9-trimethyl-11,14,15,16-tetraoxatetracyclo[10.3.1.04,13.08,13]hexadecan-10-yl] acetate Chemical compound C([C@](OO1)(C)O2)C[C@H]3[C@H](C)CC[C@@H]4[C@@]31[C@@H]2O[C@@H](OC(C)=O)[C@@H]4C WNQITGRHOWFLEA-LMWFVWJRSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
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- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- CYUOWZRAOZFACA-UHFFFAOYSA-N aluminum iron Chemical compound [Al].[Fe] CYUOWZRAOZFACA-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
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- HIFVAOIJYDXIJG-UHFFFAOYSA-N benzylbenzene;isocyanic acid Chemical class N=C=O.N=C=O.C=1C=CC=CC=1CC1=CC=CC=C1 HIFVAOIJYDXIJG-UHFFFAOYSA-N 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
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- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
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- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000002993 cycloalkylene group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- WCRDXYSYPCEIAK-UHFFFAOYSA-N dibutylstannane Chemical compound CCCC[SnH2]CCCC WCRDXYSYPCEIAK-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- WNEDOMBPJDUQPS-BFIADXHOSA-L dioctyltin(2+);(z)-4-hydroxy-4-oxobut-2-enoate Chemical compound CCCCCCCC[Sn](OC(=O)\C=C/C(O)=O)(OC(=O)\C=C/C(O)=O)CCCCCCCC WNEDOMBPJDUQPS-BFIADXHOSA-L 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
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- 238000001035 drying Methods 0.000 description 1
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- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
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- 235000021588 free fatty acids Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
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- 238000004817 gas chromatography Methods 0.000 description 1
- 150000002391 heterocyclic compounds Chemical class 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 238000004128 high performance liquid chromatography Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 150000002483 hydrogen compounds Chemical class 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- HZVOZRGWRWCICA-UHFFFAOYSA-N methanediyl Chemical compound [CH2] HZVOZRGWRWCICA-UHFFFAOYSA-N 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- DSBNOWUAKLFCBH-UHFFFAOYSA-N n,n-dimethyl-2-(1-methylpiperidin-4-yl)ethanamine Chemical compound CN(C)CCC1CCN(C)CC1 DSBNOWUAKLFCBH-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- 229940094933 n-dodecane Drugs 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 150000003097 polyterpenes Chemical class 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
- C09J123/30—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment by oxidation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
Abstract
Description
本發明有關接著劑用組成物及使用該接著劑用組成物所得之積層體。The present invention relates to an adhesive composition and a laminate obtained by using the adhesive composition.
具有藉由接著劑將金屬箔與樹脂製薄膜予以接著並積層之積層構造的積層體,可使用作為收容水、油、食品、醫藥品、化學藥品等之包裝材。此等包裝材由於有暴露於高溫之情況,故對於接著劑要求在高溫下之優異接著性。 [先前技術文獻] [專利文獻] A laminate having a laminated structure in which metal foil and a resin film are bonded and laminated with an adhesive can be used as a packaging material for water, oil, food, pharmaceuticals, chemicals, etc. Since these packaging materials are exposed to high temperature, the adhesive is required to have excellent adhesiveness at high temperature. [Prior Art Literature] [Patent Document]
[專利文獻1]國際公開第2018/116555號[Patent Document 1] International Publication No. 2018/116555
[發明欲解決之課題][Problem to be solved by the invention]
例如,專利文獻1中揭示金屬箔與樹脂製薄膜之層合用接著劑,其記載即使在高溫下亦表現出良好接著性,但對於接著劑要求在高溫下之接著性之進一步提高。 本發明之課題在於提供可獲得即使於高溫下亦可將金屬箔與樹脂製薄膜強固地接著之接著劑的接著劑用組成物,及即使在高溫下亦難以將金屬箔與樹脂製薄膜剝離之積層體。 [用以解決課題之手段] For example, Patent Document 1 discloses an adhesive for lamination of a metal foil and a resin film, and describes that it exhibits good adhesiveness even at high temperatures, but further improvement in adhesiveness at high temperatures is required for the adhesive. The object of the present invention is to provide an adhesive composition that can obtain an adhesive that can firmly bond a metal foil and a resin film even at high temperatures, and that is difficult to peel off the metal foil and the resin film even at high temperatures. laminated body. [Means to solve the problem]
為了解決上述課題,本發明之一態樣係如以下[1]~[9]。
[1] 一種接著劑用組成物,其係用以獲得將金屬箔與樹脂製薄膜予以接著之接著劑的接著劑用組成物,其含有:
(成分1)具有羧基之酸改質聚烯烴,
(成分2)於母核鍵結有p個(p係2以上之整數)異氰酸酯基之化合物的聚異氰酸酯化合物,
(成分3)於與前述成分2之聚異氰酸酯化合物相同構造之母核,鍵結有q個(q係1以上之整數)異氰酸酯基及r個(r係1以上之整數,且滿足q+r=p)改質基之化合物的改質異氰酸酯化合物,
(成分4)促進前述成分1所具有之羧基與前述成分2及前述成分3所具有之異氰酸酯基之反應的反應觸媒,及
(成分5)溶劑,
前述成分3之改質異氰酸酯化合物所具有之前述改質基,係藉由鍵結於前述母核之異氰酸酯基與具備具有活性氫之官能基的活性氫化合物之前述具有活性氫之官能基之反應所生成之基,
將前述成分2之聚異氰酸酯化合物所具有之異氰酸酯基之總莫耳數設為Ia,將前述成分3之改質異氰酸酯化合物所具有之異氰酸酯基之總莫耳數設為Ib,及將前述成分3之改質異氰酸酯化合物所具有之前述改質基之總莫耳數設為H時,H相對於Ia、Ib與H之合計莫耳數之比H/(Ia+Ib+H)超過0且0.5以下。
In order to solve the above-mentioned problems, one aspect of the present invention is as follows [1]-[9].
[1] An adhesive composition for obtaining an adhesive for bonding a metal foil and a resin film, comprising:
(Component 1) Acid-modified polyolefin having carboxyl groups,
(Component 2) A polyisocyanate compound having p (p is an integer greater than 2) isocyanate groups bonded to the core,
(Component 3) On the mother core having the same structure as the polyisocyanate compound of the
[2] 如[1]之接著劑用組成物,其中前述具有活性氫之官能基係羥基及羧基中之至少任一者。 [3] 如[1]之接著劑用組成物,其中前述活性氫化合物係選自1價醇及1價羧酸中之至少1種化合物。 [4] 如[1]至[3]中任一項之接著劑用組成物,其中前述聚異氰酸酯化合物係飽和脂肪族聚異氰酸酯。 [2] The adhesive composition according to [1], wherein the functional group having an active hydrogen is at least any one of a hydroxyl group and a carboxyl group. [3] The adhesive composition according to [1], wherein the active hydrogen compound is at least one compound selected from monovalent alcohols and monovalent carboxylic acids. [4] The adhesive composition according to any one of [1] to [3], wherein the polyisocyanate compound is a saturated aliphatic polyisocyanate.
[5] 如[1]至[3]中任一項之接著劑用組成物,其中前述聚異氰酸酯化合物係選自飽和脂肪族聚異氰酸酯之異氰尿酸酯體及飽和脂肪族聚異氰酸酯之脲基甲酸酯體中之至少1種化合物。 [6] 如[1]至[5]中任一項之接著劑用組成物,其中前述酸改質聚烯烴係含有使用丙烯、乙烯及丁烯中之1種以上作為單體之聚烯烴之酸改質物。 [5] The adhesive composition according to any one of [1] to [3], wherein the polyisocyanate compound is an isocyanurate body of a saturated aliphatic polyisocyanate and a urea of a saturated aliphatic polyisocyanate At least one compound in the carbamate body. [6] The adhesive composition according to any one of [1] to [5], wherein the acid-modified polyolefin is a polyolefin containing one or more of propylene, ethylene, and butene as a monomer acid modifier.
[7] 如[1]至[6]中任一項之接著劑用組成物,其中前述酸改質聚烯烴含有以選自乙烯不飽和羧酸及其酸酐中之至少1種將聚烯烴改質之酸改質物。[7] The adhesive composition according to any one of [1] to [6], wherein the acid-modified polyolefin contains polyolefin modified with at least one kind selected from ethylenically unsaturated carboxylic acids and their anhydrides. Acid modifier of quality.
[8] 一種積層體,其具備金屬箔、樹脂製薄膜及介於前述金屬箔與前述樹脂製薄膜之間將前述金屬箔與前述樹脂製薄膜予以接著之接著劑層,且前述接著劑層係由含有如[1]至[7]中任一項之接著劑用組成物的反應生成物之接著劑所形成。 [9] 如[8]之積層體,其中前述金屬箔係鋁箔,前述樹脂製薄膜係熱熔著性樹脂製薄膜。 [發明效果] [8] A laminate comprising a metal foil, a resin film, and an adhesive layer for bonding the metal foil and the resin film between the metal foil and the resin film, wherein the adhesive layer is Formed from an adhesive containing a reaction product of the adhesive composition according to any one of [1] to [7]. [9] The laminate according to [8], wherein the metal foil is an aluminum foil, and the resin film is a heat-fusible resin film. [Invention effect]
依據本發明,可提供可獲得即使於高溫下亦可將金屬箔與樹脂製薄膜強固地接著,即使在高溫下亦難以將金屬箔與樹脂製薄膜剝離之積層體。According to the present invention, it is possible to provide a laminate in which the metal foil and the resin film can be firmly bonded even at high temperatures, and the metal foil and the resin film are difficult to peel off even at high temperatures.
以下針對本發明之一實施形態加以說明。又本實施形態係顯示本發明之一例,本發明並不限於本實施形態。且,可對本實施形態進行各種變更或改良,加上該等變更或改良之形態亦可包含於本發明。One embodiment of the present invention will be described below. Moreover, this embodiment shows an example of this invention, and this invention is not limited to this embodiment. Furthermore, various changes or improvements can be made to this embodiment, and the form which added these changes or improvements can also be included in this invention.
針對本實施形態之積層體1將參照圖1進行說明。圖1所示之積層體1具備金屬箔2、樹脂製薄膜3、及介於金屬箔2與樹脂製薄膜3之間將金屬箔2與樹脂製薄膜3予以接著之接著劑層4。該接著劑層4係以含有將於後面詳述之本實施形態之接著劑用組成物的反應生成物的接著劑而形成。A laminate 1 of this embodiment will be described with reference to FIG. 1 . A laminate 1 shown in FIG. 1 includes a
該積層體1可作為收容各種物品的包裝材使用,但由於即使高溫下金屬箔2與樹脂製薄膜3藉由接著劑層4強固地接著而不易剝離,故可較佳地使用作為有暴露於高溫(例如80℃以上之溫度或100℃以上的溫度)之情況的包裝材。例如可作為收容水、油、食品、醫藥品、化學藥品等之包裝材使用。作為食品之例舉例為食用醋或游離脂肪酸含量較多的高酸性食品。作為化學藥品之例舉例為酸、鹼及有機溶劑。This laminated body 1 can be used as a packaging material for storing various articles, but since the
[金屬箔]
形成金屬箔2之金屬種類未特別限制,但舉例為例如鋁、鋁合金、不鏽鋼、鋁-鐵合金。作為收容食品、醫藥品、化學藥品等之包裝材使用積層體時,可藉由金屬箔2對包裝材之內部賦予抑制氧及水分侵入之氣體阻隔性。金屬箔2的厚度未特別限制,但可為5μm以上50μm以下。
[metal foil]
The type of metal forming the
[樹脂製薄膜] 形成樹脂製薄膜3之樹脂種類未特別限制,但舉例為例如聚烯烴、聚酯、聚氯乙烯、聚醯胺。作為聚烯烴之具體例,舉例為聚乙烯、聚丙烯及該等之共聚物,以及該等之酸改質物及離子聚合物。作為聚酯之具體例,舉例為聚對苯二甲酸乙二酯(PET)、聚對苯二甲酸丁二酯(PBT)。作為聚氯乙烯之具體例舉例為不含可塑劑之硬質聚氯乙烯及軟質聚氯乙烯。作為聚醯胺之具體例,舉例為聚六亞甲基己二醯胺(66尼龍)、聚己內醯胺(6尼龍)。作為收容食品、醫藥品、化學藥品等之包裝材使用積層體時,可藉由樹脂製薄膜3賦予優異之耐酸性、耐藥品性。 [resin film] The type of resin forming the resin film 3 is not particularly limited, but examples thereof include polyolefin, polyester, polyvinyl chloride, and polyamide. Specific examples of polyolefins include polyethylene, polypropylene, and their copolymers, and their acid-modified products and ionomers. Specific examples of polyester include polyethylene terephthalate (PET) and polybutylene terephthalate (PBT). Specific examples of polyvinyl chloride include rigid polyvinyl chloride and soft polyvinyl chloride that do not contain a plasticizer. Specific examples of polyamide include polyhexamethylene adipamide (66 nylon) and polycaprolactamide (6 nylon). When the laminate is used as a packaging material for storing food, pharmaceuticals, chemicals, etc., excellent acid resistance and chemical resistance can be imparted by the resin film 3 .
又,樹脂製薄膜3若為熱熔著性樹脂製薄膜,則可對積層體1賦予熱密封性。形成熱熔著性樹脂製薄膜之熱熔著性樹脂的種類,只要為具有熱熔著性、熱塑性之樹脂,則未特別限制,舉例為例如聚丙烯或聚丙烯共聚物。本發明中所謂熱熔著性意指將熱熔著性樹脂加熱到某溫度以上時軟化,與該熱熔著性樹脂密接接觸之與由相同材料或不同材料所成的樹脂熔著。Moreover, if the resin film 3 is a heat-fusible resin film, heat sealability can be imparted to the laminate 1 . The type of the heat-fusible resin forming the heat-fusible resin film is not particularly limited as long as it is a heat-fusible and thermoplastic resin, and examples thereof include polypropylene and polypropylene copolymers. The term "hot-melt" in the present invention means that when the hot-melt resin is heated above a certain temperature, it softens, and the resin that is in close contact with the hot-melt resin melts with a resin made of the same material or a different material.
樹脂製薄膜3的厚度未特別限制,但例如可設定為20μm以上150μm以下,亦可設定為30μm以上100μm以下。藉由設為20μm以上,可充分防止針孔發生。且,藉由設定為150μm以下,可減低樹脂使用量而可實現成本減低。The thickness of the resin film 3 is not particularly limited, but may be set to, for example, not less than 20 μm and not more than 150 μm, or may be set to be not less than 30 μm and not more than 100 μm. By making it 20 micrometers or more, pinhole generation|occurrence|production can be fully prevented. In addition, by setting the thickness to 150 μm or less, the amount of resin used can be reduced and cost reduction can be achieved.
[接著劑層]
將金屬箔2與樹脂製薄膜3接著的接著劑層4係由含有本實施形態之接著劑用組成物的反應生成物的接著劑所形成。以下,針對用以獲得形成接著劑層4的接著劑而使用之本實施形態之接著劑用組成物加以說明。
[adhesive layer]
The
本實施形態之接著劑用組成物含有下述(成分1)、(成分2)、(成分3)、(成分4)及(成分5)。
(成分1)具有羧基之酸改質聚烯烴,
(成分2)於母核鍵結有p個(p係2以上之整數)異氰酸酯基之化合物的聚異氰酸酯化合物,
(成分3)於與成分2之聚異氰酸酯化合物相同構造之母核,鍵結有q個(q係1以上之整數)異氰酸酯基及r個(r係1以上之整數,且滿足q+r=p)改質基之化合物的改質異氰酸酯化合物,
(成分4)促進成分1所具有之羧基與前述成分2及成分3所具有之異氰酸酯基之反應的反應觸媒,及
(成分5)溶劑。
The adhesive composition of this embodiment contains the following (component 1), (component 2), (component 3), (component 4) and (component 5).
(Component 1) Acid-modified polyolefin having carboxyl groups,
(Component 2) A polyisocyanate compound having p (p is an integer greater than 2) isocyanate groups bonded to the core,
(Ingredient 3) On the mother core with the same structure as the polyisocyanate compound of
以下,針對本實施形態之接著劑用組成物之各成分加以說明。 (1)酸改質聚烯烴(成分1) 酸改質聚烯烴係對聚烯烴實施酸改質並導入羧基者。 作為酸改質聚烯烴,可使用例如將選自乙烯性不飽和羧酸及其酸酐之至少1種予以接枝之改質聚烯烴樹脂,及使乙烯、丙烯、丁烯等之單體與選自乙烯性不飽和羧酸及其酸酐之至少1種共聚合成之共聚合樹脂。 Hereinafter, each component of the adhesive composition of this embodiment is demonstrated. (1) Acid-modified polyolefin (ingredient 1) Acid-modified polyolefins are polyolefins acid-modified and carboxyl groups introduced. As the acid-modified polyolefin, for example, a modified polyolefin resin grafted with at least one selected from ethylenically unsaturated carboxylic acids and their anhydrides, and monomers such as ethylene, propylene, butene, etc. A copolymer resin obtained by copolymerizing at least one kind of ethylenically unsaturated carboxylic acid and its anhydride.
作為酸改質聚烯烴之聚烯烴成分,舉例為例如乙烯、丙烯、丁烯等之單體的均聚物,及該等單體中之1種以上共聚合成之共聚物。作為酸改質聚烯烴的酸成分(將聚烯烴改質的酸),可使用例如丙烯酸、甲基丙烯酸、巴豆酸、馬來酸、馬來酸酐、富馬酸、富馬酸酐、衣康酸、衣康酸酐等。該等乙烯性不飽和羧酸可單獨使用1種,亦可併用2種以上。Examples of the polyolefin component of the acid-modified polyolefin include homopolymers of monomers such as ethylene, propylene, and butene, and copolymers obtained by copolymerizing one or more of these monomers. As the acid component of acid-modified polyolefin (acid for modifying polyolefin), for example, acrylic acid, methacrylic acid, crotonic acid, maleic acid, maleic anhydride, fumaric acid, fumaric anhydride, itaconic acid can be used , itaconic anhydride, etc. These ethylenically unsaturated carboxylic acids may be used alone or in combination of two or more.
上述聚烯烴成分中,較佳為丙烯與丙烯以外的烯烴之共聚物,更佳為丙烯與包含丁烯之烯烴的共聚物。於丙烯與丁烯之共聚物時,其共聚合比例,較佳為丙烯:丁烯為90:10~70:30(莫耳比),更佳為87:13~72:28,又更佳為82:18~75:25。Among the above-mentioned polyolefin components, a copolymer of propylene and an olefin other than propylene is preferable, and a copolymer of propylene and an olefin including butene is more preferable. For the copolymer of propylene and butene, the copolymerization ratio is preferably 90:10~70:30 (molar ratio) of propylene:butene, more preferably 87:13~72:28, and more preferably For 82:18~75:25.
且作為酸改質聚烯烴,較佳使用使選自乙烯性不飽和羧酸及其酸酐之至少1種接枝於聚烯烴之改質聚烯烴樹脂,更佳使用使選自馬來酸酐及其酸酐之至少1種接枝於聚烯烴之改質聚烯烴樹脂。And as the acid-modified polyolefin, it is preferable to use at least one modified polyolefin resin selected from ethylenically unsaturated carboxylic acids and their anhydrides grafted on polyolefin, more preferably to use the modified polyolefin resin selected from maleic anhydride and its anhydrides. Modified polyolefin resin in which at least one acid anhydride is grafted to polyolefin.
作為酸改質聚烯烴,使用於聚烯烴上接枝有馬來酸酐之改質聚烯烴樹脂(馬來酸酐改質聚烯烴樹脂)時,馬來酸酐相對於該酸改質聚烯烴總量的比例較佳為0.6質量%以上3.0質量%以下之範圍,更佳為0.7質量%以上2.5質量%以下之範圍,又更佳為0.8質量%以上2.0質量%以下之範圍。When the acid-modified polyolefin is used as a modified polyolefin resin (maleic anhydride-modified polyolefin resin) grafted with maleic anhydride on the polyolefin, the ratio of maleic anhydride to the total amount of the acid-modified polyolefin It is preferably in the range of 0.6 mass % to 3.0 mass %, more preferably in the range of 0.7 mass % to 2.5 mass %, still more preferably in the range of 0.8 mass % to 2.0 mass %.
酸改質聚烯烴之酸價較佳為1mgKOH/g以上40mgKOH/g以下,更佳為3mgKOH/g以上30mgKOH/g以下,又更佳為5mgKOH/g以上20mg KOH/g以下。又,本發明中所謂酸價係中和1g聚烯烴樹脂所需之氫氧化鉀(KOH)的質量,可根據JIS K0070中記載之方法求出。The acid value of the acid-modified polyolefin is preferably not less than 1 mgKOH/g and not more than 40 mgKOH/g, more preferably not less than 3 mgKOH/g and not more than 30 mgKOH/g, and more preferably not less than 5 mgKOH/g and not more than 20 mgKOH/g. In addition, the mass of potassium hydroxide (KOH) required to neutralize 1 g of polyolefin resin in the acid value system in the present invention can be obtained by the method described in JIS K0070.
又,酸改質聚烯烴之熔點較佳為70℃以上110℃以下,更佳為70℃以上100℃以下,又更佳為75℃以上95℃以下,特佳為75℃以上90℃以下。此處之熔點,係於示差掃描熱量測定中,以於實施例項之後述條件下,以升溫速度10℃/min測定者。In addition, the melting point of the acid-modified polyolefin is preferably 70°C to 110°C, more preferably 70°C to 100°C, more preferably 75°C to 95°C, particularly preferably 75°C to 90°C. The melting point here is measured at a heating rate of 10° C./min in differential scanning calorimetry under the conditions described in the Examples.
酸改質聚烯烴之熔解熱量較佳為5J/g以上60J/g以下之範圍,更佳為10J/g以上50J/g以下之範圍,又更佳為15J/g以上40J/g以下之範圍。酸改質聚烯烴之熔解熱量若為5J/g以上60J/g以下之範圍,則可維持源自結晶的凝集力,故可保持接著性及耐熱性,且可維持酸改質聚烯烴對於後述溶劑之溶解穩定性及流動性。其結果,在處理接著劑用組成物時之操作性良好。此處之熔解熱量之測定係於與上述熔點測定相同的條件進行,從由基準線的延伸線與熔解峰包圍的面積算出熔解熱量。The heat of fusion of the acid-modified polyolefin is preferably in the range of 5 J/g to 60 J/g, more preferably in the range of 10 J/g to 50 J/g, and more preferably in the range of 15 J/g to 40 J/g . If the heat of fusion of the acid-modified polyolefin is in the range of 5 J/g to 60 J/g, the cohesive force derived from crystallization can be maintained, so the adhesiveness and heat resistance can be maintained, and the acid-modified polyolefin can be maintained. Solvent stability and fluidity. As a result, the workability at the time of handling the composition for adhesive agents is favorable. The heat of fusion here is measured under the same conditions as the above-mentioned melting point measurement, and the heat of fusion is calculated from the area surrounded by the extended line of the reference line and the melting peak.
酸改質聚烯烴的重量平均分子量(Mw)較佳為60000以上150000以下之範圍,更佳為70000以上140000以下之範圍,又更佳為80000以上130000以下之範圍。酸改質聚烯烴的數平均分子量(Mn)較佳為30000以上90000以下之範圍,更佳為35000以上80000以下之範圍,又更佳為40000以上70000以下之範圍。此處之重量平均分子量(Mw)及數平均分子量(Mn)係以凝膠滲透層析儀測定之聚苯乙烯換算的重量平均分子量及數平均分子量。The weight average molecular weight (Mw) of the acid-modified polyolefin is preferably in the range of 60,000 to 150,000, more preferably in the range of 70,000 to 140,000, and more preferably in the range of 80,000 to 130,000. The number average molecular weight (Mn) of the acid-modified polyolefin is preferably in the range of 30,000 to 90,000, more preferably in the range of 35,000 to 80,000, and more preferably in the range of 40,000 to 70,000. Here, the weight average molecular weight (Mw) and the number average molecular weight (Mn) are the weight average molecular weight and number average molecular weight in terms of polystyrene measured by the gel permeation chromatography.
酸改質聚烯烴的熔融質量流動速率較佳為2g/10分鐘以上60g/10分鐘以下之範圍,更佳為10g/10分鐘以上50g/10分鐘以下之範圍,又更佳為25g/10分鐘以上45g/10分鐘以下之範圍。此處之熔融質量流動速率係依據JIS K7210-1:2014於溫度130℃、荷重2.16 kg之條件下測定者。The melt mass flow rate of the acid-modified polyolefin is preferably in the range of 2 g/10 minutes to 60 g/10 minutes, more preferably 10 g/10 minutes to 50 g/10 minutes, and more preferably 25 g/10 minutes Above 45g/10 minutes below the range. The melt mass flow rate here is measured in accordance with JIS K7210-1:2014 under the conditions of a temperature of 130° C. and a load of 2.16 kg.
本實施形態之接著劑用組成物中的酸改質聚烯烴之含有率未特別限定,但於將本實施形態之接著劑用組成物中的非揮發分、即自接著劑用組成物的總量減去成分5的溶劑之量後的量設為100質量%時,酸改質聚烯烴的含有率較佳為55質量%以上96質量%以下,更佳為60質量%以上90質量%以下,又更佳為65質量%以上85質量%以下。The content of the acid-modified polyolefin in the adhesive composition of this embodiment is not particularly limited, but the non-volatile matter in the adhesive composition of this embodiment, that is, the total amount of the self-adhesive composition When the amount obtained by subtracting the amount of the solvent of component 5 is 100% by mass, the content of the acid-modified polyolefin is preferably from 55% by mass to 96% by mass, more preferably from 60% by mass to 90% by mass , and more preferably not less than 65% by mass and not more than 85% by mass.
(2)聚異氰酸酯化合物(成分2)
成分2的聚異氰酸酯化合物具有複數個異氰酸酯基(-NCO),若詳述,則係於母核上鍵結有p個(p為2以上之整數)異氰酸酯基的化合物。本發明中,所謂母核係指自成分2的聚異氰酸酯化合物去除異氰酸酯基後之部分。作為構成母核的化學構造,即異氰酸酯基鍵結之前的化學構造體之例,舉例為苯、甲苯、二甲苯、萘、蒽等之芳香族化合物,或甲烷、丁烷、正己烷、環己烷等之鏈狀或環狀飽和或不飽和之脂肪族化合物,或雜環化合物等。作為p為2時之母核的例舉例為伸苯基、伸烷基及伸環烷基。
(2) Polyisocyanate compound (component 2)
The polyisocyanate compound of
作為成分2的聚異氰酸酯化合物,可使用飽和脂肪族聚異氰酸酯。且,作為成分2的聚異氰酸酯化合物,可使用選自飽和脂肪族聚異氰酸酯之異氰尿酸酯體,及自飽和脂肪族聚異氰酸酯之脲基甲酸酯體中之至少1種化合物。As the polyisocyanate compound of the
作為成分2的聚異氰酸酯化合物之具體例,可舉例為伸丁基二異氰酸酯、五亞甲基二異氰酸酯(PDI)、六亞甲基二異氰酸酯(HDI)、異佛爾酮二異氰酸酯(IPDI)、伸環戊基二異氰酸酯、伸環己基二異氰酸酯、降冰片烯二異氰酸酯、氫化二甲苯二異氰酸酯、4,4’-二環己基甲烷二異氰酸酯、甲苯二異氰酸酯(TDI)、二苯基甲烷二異氰酸酯(MDI)、氫化二苯基甲烷二異氰酸酯、氫化甲苯二異氰酸酯、1,3-雙(異氰酸酯基甲基)環己烷、1,4-雙(異氰酸酯基甲基)環己烷等。Specific examples of the polyisocyanate compound of
且,作為成分2的聚異氰酸酯化合物之具體例,舉例為上述各二異氰酸酯之改質體。舉例為例如,二異氰酸酯的三聚戊之異氰尿酸酯體,及由二異氰酸酯與醇反應而形成之胺基甲酸酯基與二異氰酸酯的加成體之胺基甲酸酯體,及二異氰酸酯的碳二醯亞胺改質物,及二異氰酸酯之二醇改質物。Moreover, as a specific example of the polyisocyanate compound of
成分2的聚異氰酸酯化合物可為具有2個異氰酸酯基的如上述之二異氰酸酯,亦可為具有3個異氰酸酯基的三異氰酸酯,亦可為具有4個以上異氰酸酯基的異氰酸酯化合物。該等成分2的聚異氰酸酯化合物可單獨使用1種,亦可併用2種以上。The polyisocyanate compound of
(3)改質異氰酸酯化合物(成分3)
成分3的改質異氰酸酯化合物係具有1個以上異氰酸酯基及1個以上改質基之異氰酸酯化合物,若詳述,則係於母核鍵結有q個異氰酸酯基及r個改質基的化合物。q及r均為1以上之整數,且滿足q+r=p。如前述,p係成分2的聚異氰酸酯化合物之與母核鍵結的異氰酸酯基的個數。且,成分2的聚異氰酸酯化合物之母核與成分3的改質異氰酸酯化合物的母核為相同構造。
(3) Modified isocyanate compound (component 3)
The modified isocyanate compound of component 3 is an isocyanate compound having one or more isocyanate groups and one or more modifying groups. If described in detail, it is a compound in which q isocyanate groups and r modifying groups are bonded to the core. Both q and r are integers of 1 or more, and satisfy q+r=p. As mentioned above, p is the number of isocyanate groups bonded to the core of the polyisocyanate compound of
成分3的改質異氰酸酯化合物所具有的改質基係由鍵結於母核之異氰酸酯基與具備具有活性氫之官能基的活性氫化合物之前述具有活性氫的官能基反應所產生之基。作為具有活性氫之官能基之例舉例為羥基、羧基、巰基、胺基,但較佳為羥基及羧基之至少一者。具有活性氫之官能基若為羥基,則改質基成為具有胺基甲酸酯鍵之基,具有活性氫之官能基若為羧基,則改質基成為具有醯胺鍵之基。The modifying group of the modified isocyanate compound of component 3 is a group produced by the reaction of the isocyanate group bonded to the core and the active hydrogen compound having the functional group having active hydrogen. Examples of the functional group having active hydrogen include hydroxyl group, carboxyl group, mercapto group, and amino group, but preferably at least one of hydroxyl group and carboxyl group. When the functional group having active hydrogen is a hydroxyl group, the modifying group becomes a group having a urethane bond, and when the functional group having active hydrogen is a carboxyl group, the modifying group becomes a group having an amide bond.
該改質異氰酸酯化合物之製造方法未特別限制,但可藉由使活性氫化合物與具有與成分2的聚異氰酸酯化合物相同化學構造之聚異氰酸酯化合物反應而製造。
例如,若使具備1個羥基的活性氫化合物與二異氰酸酯反應,適當控制該反應中具備1個羥基之活性氫化合物的使用量,則可獲得改質異氰酸酯化合物。此例所得之改質異氰酸酯化合物係二異氰酸酯所具有之2個異氰酸酯基之僅一者與活性氫化合物的羥基反應成為胺基甲酸酯鍵之化合物,係具有1個異氰酸酯基及1個改質基之化合物。
The method for producing the modified isocyanate compound is not particularly limited, but can be produced by reacting an active hydrogen compound with a polyisocyanate compound having the same chemical structure as the polyisocyanate compound of
因此,分別準備成分2的聚異氰酸酯化合物與成分3的改質異氰酸酯化合物,作為接著劑用組成物的原料使用,但亦可如下般準備。即,將活性氫化合物添加於成分2的聚異氰酸酯化合物中,使成分2的聚異氰酸酯化合物的一部分與活性氫化合物反應生成成分3的改質異氰酸酯化合物,製造成分2的聚異氰酸酯化合物與成分3的改質異氰酸酯化合物之混合物,該混合物可作為接著劑用組成物的原料使用。Therefore, the polyisocyanate compound of
作為活性氫化合物之例,舉例為1元醇、1元羧酸、1元硫醇、1元胺等,較佳為選自1元醇及1元羧酸中之至少1種化合物。而且,1元醇及1元羧酸的碳數較佳為1以上20以下,更佳為2以上15以下,又更佳為3以上12以下。Examples of active hydrogen compounds include monohydric alcohols, monovalent carboxylic acids, monohydric mercaptans, and monovalent amines, and are preferably at least one compound selected from monohydric alcohols and monovalent carboxylic acids. Furthermore, the carbon number of the monovalent alcohol and the monovalent carboxylic acid is preferably from 1 to 20, more preferably from 2 to 15, and still more preferably from 3 to 12.
作為1元醇之具體例舉例為甲醇、乙醇、正丙醇、異丙醇、正丁醇、2-丁醇、第三丁醇、2-乙基己醇、正癸醇、正十二烷醇、正辛醇。作為1元羧酸之具體例舉例為乙酸、丙酸、丁酸。活性氫化合物可單獨使用1種,亦可併用2種以上。Specific examples of monohydric alcohols include methanol, ethanol, n-propanol, isopropanol, n-butanol, 2-butanol, tert-butanol, 2-ethylhexanol, n-decyl alcohol, and n-dodecane alcohol, n-octanol. Specific examples of the monovalent carboxylic acid include acetic acid, propionic acid, and butyric acid. The active hydrogen compound may be used alone or in combination of two or more.
此處,本實施形態之接著劑用組成物中,將成分2的聚異氰酸酯化合物所具有的異氰酸酯基之總莫耳數設為Ia,將成分3的改質異氰酸酯化合物所具有的異氰酸酯基之總莫耳數設為Ib,將成分3的改質異氰酸酯化合物所具有的前述改質基之總莫耳數設為H時,H相對於Ia、Ib及H的總莫耳數之比H/(Ia+Ib+H)係超過0且0.5以下。Here, in the adhesive composition of the present embodiment, the total molar number of isocyanate groups possessed by the polyisocyanate compound of
自該比H/(Ia+Ib+H)在上述範圍內之接著劑用組成物,可獲得即使在高溫下亦可使金屬箔與樹脂製薄膜強固接著之接著劑。該比H/(Ia+Ib+H)較佳超過0且0.5以下,更佳為0.01以上0.4以下,又更佳為0.015以上0.34以下。From the composition for an adhesive agent in which the ratio H/(Ia+Ib+H) is within the above range, an adhesive agent capable of firmly adhering metal foil and a resin film even at high temperature can be obtained. The ratio H/(Ia+Ib+H) is preferably more than 0 and not more than 0.5, more preferably not less than 0.01 and not more than 0.4, and still more preferably not less than 0.015 and not more than 0.34.
又,本實施形態之接著劑用組成物中,將酸改質聚烯烴所具有的羧基之總莫耳數設為C,將成分2的聚異氰酸酯化合物所具有的異氰酸酯基之總莫耳數設為Ia,將成分3的改質異氰酸酯化合物所具有的異氰酸酯基之總莫耳數設為Ib時,Ia與Ib的合計莫耳數相對於C之比(Ia+Ib)/C較佳為0.3以上30以下。In addition, in the adhesive composition of the present embodiment, the total molar number of carboxyl groups possessed by the acid-modified polyolefin is represented as C, and the total molar number of isocyanate groups possessed by the polyisocyanate compound of
自該比(Ia+Ib)/C在上述範圍內之接著劑用組成物,可獲得即使在高溫下亦可使金屬箔與樹脂製薄膜強固接著之接著劑。該比(Ia+Ib)/C更佳為1.0以上20以下,更佳為2.0以上15以下,特佳為3.0以上12以下。 又本發明中,2個羧基之脫水縮合生成物的羧酸酐(-C(=O)-O-C(=O)-)定為羧酸酐基1個且為2個羧基者。 From the adhesive composition in which the ratio (Ia+Ib)/C is within the above range, an adhesive capable of firmly bonding metal foil and a resin film even at high temperature can be obtained. The ratio (Ia+Ib)/C is more preferably from 1.0 to 20, more preferably from 2.0 to 15, particularly preferably from 3.0 to 12. In the present invention, the carboxylic acid anhydride (-C(=O)-O-C(=O)-) of the dehydration condensation product of two carboxyl groups is defined as one having one carboxylic acid anhydride group and two carboxyl groups.
此外,本實施形態之接著劑用組成物中,成分2的聚異氰酸酯化合物及成分3的改質異氰酸酯化合物之合計量較佳為如下。亦即將自接著劑用組成物之總量減去成分5的量後之量設為100質量%時,成分2及成分3之合計量較佳超過0質量%且未達40質量%,更佳為2質量%以上35質量%以下。In addition, in the adhesive composition of the present embodiment, the total amount of the polyisocyanate compound of
(4)反應觸媒(成分4)
成分4的反應觸媒係促進成分1的酸改質聚烯烴所具有的羧基與成分2的聚異氰酸酯化合物及成分3的改質異氰酸酯化合物所具有之異氰酸酯基之反應的觸媒。成分4的反應觸媒種類,只要為可促進羧基與異氰酸酯基之反應,則未特別限制,但例如可使用有機錫化合物、3級胺等。
(4) Reaction catalyst (ingredient 4)
The reaction catalyst of
作為有機錫化合物之具體例可舉例為二丁基錫二月桂酸鹽、二丁基錫二馬來酸鹽、二辛基錫二月桂酸鹽及二辛基錫二馬來酸鹽等。 且,作為3級胺之具體例,可舉例為四甲基乙二胺等之四烷基乙二胺、二甲基苄基胺等之N,N’-二烷基苄基胺、三伸乙基二胺、五亞甲基二伸乙基三胺、N-乙基嗎啉、N-甲基嗎啉、1-甲基-4-二甲胺乙基哌啶及二氮雜雙環十一碳烯等。 反應觸媒可僅單獨使用1種,亦可併用2種以上。 Specific examples of the organotin compound include dibutyltin dilaurate, dibutyltin dimaleate, dioctyltin dilaurate, and dioctyltin dimaleate. In addition, specific examples of tertiary amines include tetraalkylethylenediamine such as tetramethylethylenediamine, N,N'-dialkylbenzylamine such as dimethylbenzylamine, trialkylene Ethyldiamine, pentamethylenediethylenetriamine, N-ethylmorpholine, N-methylmorpholine, 1-methyl-4-dimethylaminoethylpiperidine and diazabicyclodeca One carbene etc. The reaction catalyst may be used alone or in combination of two or more.
使用該反應觸媒時,於將自本實施形態之接著劑用組成物的總量減去成分5的溶劑之量及成分4的反應觸媒之量所得之量設為100質量份時,反應觸媒的量之比例較佳為0.01質量份以上3質量份以下, 更佳為0.05質量份以上2.5質量份以下,又更佳為0.2質量份以上2質量份以下。反應觸媒量的比例若為此範圍內,則容易取得混合後的可使用時間與介隔本實施形態之接著劑用組成物的反應生成物將金屬箔與樹脂製薄膜貼合後至展現接著力之時間的平衡。When using this reaction catalyst, when the amount obtained by subtracting the amount of the solvent of component 5 and the amount of the reaction catalyst of
(5)溶劑(成分5) 本實施形態之接著劑用組成物中使用的溶劑種類,只要為可溶解或分散酸改質聚烯烴者,則未特別限制,但較佳為可溶解酸改質聚烯烴之有機溶劑。且作為有機溶劑,較佳為藉由加熱等容易自本實施形態之接著劑用組成物使該有機溶劑揮發去除之有機溶劑。 (5) Solvent (ingredient 5) The type of solvent used in the adhesive composition of this embodiment is not particularly limited as long as it can dissolve or disperse the acid-modified polyolefin, but is preferably an organic solvent that can dissolve the acid-modified polyolefin. And as an organic solvent, it is preferable that it is easy to volatilize and remove this organic solvent from the adhesive composition of this embodiment by heating etc.
作為可溶解酸改質聚烯烴且藉由加熱等容易揮發去除之有機溶劑,舉例為例如甲苯、二甲苯等之芳香族系有機溶劑、正己烷等之脂肪族系有機溶劑、環己烷、甲基環己烷(MCH)等之脂環族系有機溶劑、甲基乙基酮(MEK)等之酮系有機溶劑等。該等有機溶劑可僅單獨使用1種,亦可併用2種以上。Examples of organic solvents that can dissolve acid-modified polyolefins and can be easily volatilized and removed by heating include aromatic organic solvents such as toluene and xylene, aliphatic organic solvents such as n-hexane, cyclohexane, methyl alcohol, etc. Alicyclic organic solvents such as cyclohexane (MCH), ketone organic solvents such as methyl ethyl ketone (MEK), etc. These organic solvents may be used alone or in combination of two or more.
且,亦可與上述可溶解酸改質聚烯烴且藉由加熱等容易揮發去除之有機溶劑併用,使用其他種類的有機溶劑。作為其他有機溶劑,較佳使用乙酸乙酯、乙酸正丙酯、乙酸正丁酯等之乙酸酯系有機溶劑。In addition, other types of organic solvents may be used in combination with the above-mentioned organic solvents that can dissolve the acid-modified polyolefin and are easily volatilized and removed by heating. As other organic solvents, acetate-based organic solvents such as ethyl acetate, n-propyl acetate, and n-butyl acetate are preferably used.
成分5的溶劑量之比例,於將本實施形態之接著劑用組成物的總量設為100質量%時,較佳為60質量%以上97質量%以下,更佳為70質量%以上96質量%以下,又更佳為80質量%以上95質量%以下。溶劑量之比例在此範圍內時,可適當保持接著劑用組成物的黏度,且容易使塗佈接著劑用組成物去除溶劑所得之接著劑層的厚度變得適當。又接著劑用組成物塗佈時之黏度於25℃下較佳為200mPa·s以下。The ratio of the solvent amount of component 5 is preferably 60 mass % to 97 mass %, more preferably 70 mass % to 96 mass %, when the total amount of the adhesive composition of the present embodiment is 100 mass % % or less, more preferably more than 80% by mass and less than 95% by mass. When the ratio of the amount of solvent is within this range, the viscosity of the adhesive composition can be properly maintained, and the thickness of the adhesive layer obtained by applying the adhesive composition and removing the solvent can be easily made appropriate. In addition, the viscosity of the adhesive composition when applied is preferably 200 mPa·s or less at 25°C.
又,本實施形態之接著劑用組成物中,若於不阻礙本發明效果之範圍內,則可含有黏著賦予劑、可塑劑或不具有酸性官能基之聚烯烴,亦可含有聚烯烴以外的熱塑性樹脂。 黏著賦予劑之種類未特別限制,但例如作為天然系之黏著賦予劑,舉例為聚萜烯系樹脂、松香系樹脂等,作為石油系黏著賦予劑,舉例為自石油腦之分解油餾分所得之脂肪族(C5)系樹脂、芳香族(C9)系樹脂、共聚合(C5/C9)系樹脂、脂環族系樹脂等。且,亦可舉例將該等樹脂之雙鍵部分氫化後之氫化樹脂。該等黏著賦予劑可僅單獨使用1種,亦可併用2種以上。 Also, in the adhesive composition of the present embodiment, if it is within the range that does not hinder the effect of the present invention, it may contain a tackifier, a plasticizer, or a polyolefin without an acidic functional group, or it may contain polyolefins other than polyolefins. thermoplastic resin. The type of tackifier is not particularly limited, but for example, natural tackifiers include polyterpene-based resins, rosin-based resins, etc., and petroleum-based tackifiers include those obtained from the decomposition oil fraction of naphtha. Aliphatic (C5) resin, aromatic (C9) resin, copolymer (C5/C9) resin, alicyclic resin, etc. Moreover, the hydrogenated resin obtained by hydrogenating the double bond part of these resins is also mentioned. These tackifiers may be used alone or in combination of two or more.
不具有酸性官能基之聚烯烴及聚烯烴以外的熱塑性樹脂之種類未特別限制,但舉例為例如乙烯-乙酸乙烯酯共聚合樹脂、乙烯-丙烯酸乙酯共聚合樹脂、蠟等。作為不具有羧基之烯烴系熱塑性彈性體之例,舉例為SEBS(苯乙烯-乙烯-丁烯-苯乙烯)、SEPS(苯乙烯-乙烯-丙烯-苯乙烯)。The types of polyolefins without acidic functional groups and thermoplastic resins other than polyolefins are not particularly limited, but examples include ethylene-vinyl acetate copolymer resins, ethylene-ethyl acrylate copolymer resins, waxes, and the like. Examples of olefin-based thermoplastic elastomers not having a carboxyl group include SEBS (styrene-ethylene-butylene-styrene) and SEPS (styrene-ethylene-propylene-styrene).
其次,針對本實施形態之積層體1之製造方法加以說明。本實施形態之積層體1之製造方法具備:形成接著劑用組成物膜之成膜步驟、將金屬箔2與樹脂製薄膜3貼合之積層步驟、加熱接著劑用組成物之膜使接著劑用組成物反應而形成接著劑層4之反應步驟。關於成膜步驟、積層步驟及反應步驟於以下說明。Next, the manufacturing method of the laminated body 1 of this embodiment is demonstrated. The manufacturing method of the laminated body 1 of this embodiment includes: a film forming step of forming a film of the adhesive composition film, a lamination step of bonding the
成膜步驟係將本實施形態之接著劑用組成物塗佈於金屬箔2的表面及樹脂製薄膜3的表面之一者或兩者,形成本實施形態之接著劑用組成物的膜之步驟。
接著劑組成物之塗佈方法未特別限制,但可舉例為例如凹版印刷、膠版印刷、網版印刷、棒塗佈印刷等之印刷方法。但,考慮到接著劑用組成物之膜厚,最佳使用利用凹版印刷之塗佈方法。
The film forming step is a step of applying the adhesive composition of the present embodiment to one or both of the surface of the
可自接著劑用組成物的膜,去除成分5的溶劑之一部分或全部。自接著劑用組成物的膜去除成分5的溶劑之方法未特別限制,可採用例如加熱、減壓等方法,但較佳為藉由加熱去除成分5的溶劑之方法。Part or all of the solvent in component 5 may be removed from the film of the adhesive composition. The method of removing the solvent of component 5 from the film of the adhesive composition is not particularly limited, and methods such as heating and decompression can be used, but the method of removing the solvent of component 5 by heating is preferred.
藉由加熱去除成分5的溶劑時,只要將接著劑用組成物的膜暴露於室溫以上的特定溫度即可。上述特定溫度較佳為未達成分5的溶劑沸點之溫度。混合複數種溶劑作成成分5時,上述特定溫度較佳低於作為成分5使用之複數種溶劑的各沸點中最低沸點之溫度。When the solvent of component 5 is removed by heating, it is only necessary to expose the film of the adhesive composition to a specific temperature higher than room temperature. The above-mentioned specific temperature is preferably a temperature below the boiling point of the solvent of component 5. When a plurality of solvents are mixed to form the component 5, the above-mentioned specific temperature is preferably lower than the temperature of the lowest boiling point among the boiling points of the plurality of solvents used as the component 5.
藉由此等成膜步驟,於金屬箔2之表面及樹脂製薄膜3之表面的一者或兩者上形成接著劑用組成物的膜,以於金屬箔2與樹脂製薄膜3之間配置接著劑用組成物的膜之方式,將金屬箔2與樹脂製薄膜3重疊貼合(積層步驟)。藉由此等積層步驟,將金屬箔2與樹脂製薄膜3與接著劑用組成物的膜積層。Through these film forming steps, a film of the adhesive composition is formed on one or both of the surface of the
其次,將藉由積層步驟所得者進行加熱,使接著劑用組成物反應形成接著劑層4(反應步驟)。若詳述,則接著劑用組成物中的成分1、成分2及成分3藉由加熱而反應,並交聯而高分子量化。藉此,接著劑用組成物的膜成為由含有接著劑用組成物之反應生成物的接著劑形成之接著劑層4,藉由該接著劑層4將金屬箔2與樹脂製薄膜3予以接著,成為積層體1。
藉由反應步驟之加熱,而促進成分1的酸改質聚烯烴具有的羧基與成分2的聚異氰酸酯化合物所具有之異氰酸酯基及成分3的改質異氰酸酯化合物所具有之異氰酸酯基反應,使反應進行。
Next, the product obtained in the layering step is heated to react the adhesive composition to form the adhesive layer 4 (reaction step). If described in detail, the component 1, the
反應步驟之加熱溫度,只要為使反應充分進行之溫度則未特別限制,但為使反應充分地進行較佳為30℃以上,更佳為40℃以上。且,為了抑制樹脂製薄膜3的物性因反應步驟之加熱而變化,反應步驟之加熱溫度較佳為70℃以下,更佳為60℃以下。 又,反應步驟之加熱時間,只要為使反應充分進行的時間則未特別的限制,但較佳為1小時以上,更佳為3小時以上,又更佳為6小時以上。 [實施例] The heating temperature in the reaction step is not particularly limited as long as the reaction is sufficiently advanced, but it is preferably 30°C or higher, more preferably 40°C or higher, in order to allow the reaction to proceed sufficiently. In addition, in order to suppress changes in the physical properties of the resin film 3 due to heating in the reaction step, the heating temperature in the reaction step is preferably 70°C or lower, more preferably 60°C or lower. Also, the heating time in the reaction step is not particularly limited as long as the reaction is sufficiently advanced, but it is preferably at least 1 hour, more preferably at least 3 hours, and still more preferably at least 6 hours. [Example]
以下顯示實施例及比較例,更具體說明本發明。 [製造例1] 於具備冷卻管及攪拌機之容量1000mL的燒瓶中,饋入丙烯-丁烯共聚物的馬來酸酐接枝改質物75.0質量份、溶劑的甲基環己烷290質量份及乙酸乙酯120質量份,於60℃攪拌10分鐘,獲得液狀樹脂組成物。隨後,將該樹脂組成物冷卻至室溫。該樹脂組成物之固形分濃度為15.0質量%。此處,固形分濃度係相對於樹脂組成物的總質量之溶劑除外的其他成分的質量百分比。固形分濃度係根據105℃下進行真空乾燥1小時後之質量減少率而計算。 Examples and comparative examples are shown below, and the present invention will be described more specifically. [manufacturing example 1] Into a 1000mL flask equipped with a cooling tube and a stirrer, 75.0 parts by mass of a maleic anhydride graft-modified propylene-butene copolymer, 290 parts by mass of methylcyclohexane as a solvent, and 120 parts by mass of ethyl acetate were charged , stirred at 60° C. for 10 minutes to obtain a liquid resin composition. Subsequently, the resin composition was cooled to room temperature. The solid content concentration of this resin composition was 15.0 mass %. Here, the solid content concentration is the percentage by mass of other components except the solvent with respect to the total mass of the resin composition. The solid content concentration is calculated based on the mass loss rate after vacuum drying at 105° C. for 1 hour.
成分1的酸改質聚烯烴的上述接枝改質物的酸價為12.6mg-KOH/g,熔點為80℃。且,上述接枝改質物之丙烯與丁烯之共聚合比率(莫耳比)為丙烯:丁烯=78:22。此外,上述接枝改質物的重量平均分子量(Mw)為110000,數平均分子量(Mn)為58000。此外,上述接枝改質物的熔融質量流動速率為29g/10分鐘,熔解熱為35J/g。The acid value of the graft-modified product of the acid-modified polyolefin of Component 1 was 12.6 mg-KOH/g, and its melting point was 80°C. In addition, the copolymerization ratio (molar ratio) of propylene and butene in the graft-modified product is propylene:butene=78:22. In addition, the weight average molecular weight (Mw) of the above-mentioned graft-modified product was 110,000, and the number average molecular weight (Mn) was 58,000. In addition, the melt mass flow rate of the above-mentioned graft-modified product was 29 g/10 minutes, and the heat of fusion was 35 J/g.
上述接枝改質物之上述各種特性之測定方法如下。 (酸價之測定方法) 依據JIS K0070:1992規定之方法測定。 (熔點之測定方法) 熔點係依據以JIS K7121(1987年制定)「塑膠之轉移溫度測定方法」中規定的方法測定。測定係使用島津製作所股份有限公司製之DSC(示差掃描熱量計)(型號DSC-60A),以升溫速度10°C/分鐘進行示差掃描熱量測定之結果所得熔解峰值溫度設為「熔點」。 The measurement methods of the above-mentioned various properties of the above-mentioned graft-modified product are as follows. (Determination method of acid value) Measured according to the method specified in JIS K0070:1992. (Measurement method of melting point) The melting point is measured in accordance with the method stipulated in JIS K7121 (established in 1987) "Measurement method of transition temperature of plastics". The measurement was performed using a DSC (Differential Scanning Calorimeter) (model DSC-60A) manufactured by Shimadzu Corporation, and the melting peak temperature obtained as a result of differential scanning calorimetry at a heating rate of 10°C/min was set as the "melting point".
更詳細的測定條件如下。即,將酸改質聚烯烴之粉狀樣品,以升溫速度10℃/分鐘自室溫升溫至180℃,於180℃下保持5分鐘使熔解,然後降溫至-30℃,於-30℃保持5分鐘。隨後,以升溫速度10℃/分鐘再次升溫,於該再升溫時檢測到的熔融峰值溫度設為熔點。More detailed measurement conditions are as follows. That is, the powdery sample of acid-modified polyolefin was heated from room temperature to 180°C at a heating rate of 10°C/min, kept at 180°C for 5 minutes to melt, then cooled to -30°C, and kept at -30°C for 5 minutes. minute. Subsequently, the temperature was raised again at a heating rate of 10° C./minute, and the melting peak temperature detected during the reheating was defined as the melting point.
(丙烯與丁烯之共聚比率的測定方法) 使用氘化氯仿(CDCl 3)作為溶劑,進行酸改質聚烯烴之碳13核磁共振測定( 13C NMR測定),藉由以下方法進行解析。 13C NMR光譜的 34.0ppm之波峰係源自聚丁烯的甲基的碳,27.0ppm~28.0ppm的波峰係源自聚丁烯之側鏈的亞甲基的碳與聚丙烯之甲基的碳。 (Method for Measuring Copolymerization Ratio of Propylene and Butene) Using deuterated chloroform (CDCl 3 ) as a solvent, carbon 13 nuclear magnetic resonance measurement ( 13 C NMR measurement) of acid-modified polyolefin was performed, and the analysis was performed by the following method. The 34.0ppm peak of the 13 C NMR spectrum is derived from the carbon of the methyl group of polybutene, and the peak of 27.0ppm~28.0ppm is derived from the carbon of the methylene group of the side chain of polybutene and the methyl group of polypropylene carbon.
因此,藉由將34.0ppm之波峰的積分比除以27.0ppm~28.0ppm的波峰的積分比並乘以100所得之值,算出丁烯之共聚合比率(莫耳%)。且,藉由自100減去如上述算出之丁烯的共聚合比率,算出丙烯的共聚合比率(莫耳%)。Therefore, the copolymerization ratio (mol %) of butene was calculated by dividing the integral ratio of the peak of 34.0 ppm by the integral ratio of the peak of 27.0 ppm to 28.0 ppm and multiplying by 100. Then, the copolymerization ratio (mol %) of propylene was calculated by subtracting the copolymerization ratio of butene calculated as above from 100.
(重量平均分子量及數平均分子量之測定方法) 酸改質聚烯烴之重量平均分子量及數平均分子量係以凝膠滲透層析儀測定之聚苯乙烯換算的重量平均分子量及數平均分子量。凝膠滲透層析儀之測定條件如下。 (Measurement method of weight average molecular weight and number average molecular weight) The weight-average molecular weight and number-average molecular weight of the acid-modified polyolefin are weight-average molecular weights and number-average molecular weights in terms of polystyrene measured by gel permeation chromatography. The measurement conditions of the gel permeation chromatography are as follows.
裝置名:日本分光股份有限公司製HPLC單元HSS-2000 管柱:昭和電工股份有限公司製Shodex管柱LF-805L×3根(串聯) 移動相:四氫呋喃 流速:1.0mL/min 檢測器:日本分光股份有限公司製RI-2031Plus 溫度:40.0℃ 試料量:取樣迴路100μL 試料濃度:約0.1質量% 聚苯乙烯標準物質:昭和電工股份有限公司製STANDARD SM-105 (熔融質量流動速率之測定方法) 依據JIS K7210-1:2014,於溫度130℃、荷重2.16kg的條件下測定。 Device name: HPLC unit HSS-2000 manufactured by JASCO Co., Ltd. Column: Showa Denko Co., Ltd. Shodex column LF-805L × 3 pieces (series) Mobile Phase: Tetrahydrofuran Flow rate: 1.0mL/min Detector: RI-2031Plus manufactured by JASCO Co., Ltd. Temperature: 40.0°C Sample volume: sampling loop 100μL Sample concentration: about 0.1% by mass Polystyrene standard substance: Standard SM-105 manufactured by Showa Denko Co., Ltd. (Measurement method of melt mass flow rate) Based on JIS K7210-1:2014, it was measured under the conditions of a temperature of 130°C and a load of 2.16 kg.
[製造例2] 於具備冷卻管、氮氣導入管、溫度計及攪拌機之反應容器中,饋入乙酸乙酯470質量份、丙烯酸丁酯172質量份、丙烯酸2-乙基己酯172質量份、丙烯酸5.6質量份、2,2’-偶氮雙(異丁腈)0.6質量份。然後,於氮氣流中將反應容器的內溫升溫至90℃,保持8小時,使丙烯酸丁酯、丙烯酸2-乙基己酯及丙烯酸聚合後,冷卻至30℃獲得丙烯酸共聚物。聚合結束後,測定反應容器內之丙烯酸共聚物溶液中的固形分濃度結果為43.1質量%。 [Manufacturing example 2] In a reaction vessel equipped with a cooling pipe, a nitrogen inlet pipe, a thermometer and a stirrer, 470 parts by mass of ethyl acetate, 172 parts by mass of butyl acrylate, 172 parts by mass of 2-ethylhexyl acrylate, 5.6 parts by mass of acrylic acid, 2 , 0.6 parts by mass of 2'-azobis(isobutyronitrile). Then, the internal temperature of the reaction container was raised to 90° C. in a nitrogen stream, and held for 8 hours to polymerize butyl acrylate, 2-ethylhexyl acrylate, and acrylic acid, and then cooled to 30° C. to obtain an acrylic acid copolymer. After the completion of the polymerization, the solid content concentration in the acrylic copolymer solution in the reaction container was measured and found to be 43.1% by mass.
[製造例3] 具備上部安裝有氯化鈣管之冷卻管、溫度計、滴加漏斗及附攪拌翼之攪拌機的三頸燒瓶裝,饋入旭化成股份有限公司製之DURANATE(註冊商標)TKA-100(六亞甲基二異氰酸酯之異氰尿酸酯體,異氰酸酯基濃度:21.7質量%)83.0質量份及觸媒的二辛基錫二月桂酸鹽0.003質量份。 且,於滴加漏斗中饋入將正丁醇0.53質量份溶解於乙酸乙酯16.5質量份之乙酸乙酯溶液,進行滴加之準備。 [Manufacturing example 3] Equipped with a three-necked flask equipped with a cooling tube with a calcium chloride tube installed on the top, a thermometer, a dropping funnel, and a stirrer with stirring wings, it was fed into DURANATE (registered trademark) TKA-100 (hexamethylene The isocyanurate body of diisocyanate, isocyanate group concentration: 21.7% by mass) 83.0 parts by mass, and 0.003 parts by mass of dioctyltin dilaurate as a catalyst. And the ethyl acetate solution which melt|dissolved 0.53 mass parts of n-butanols in the ethyl acetate 16.5 mass parts was fed into the dropping funnel, and it prepared for dripping.
然後,藉由攪拌機開始攪拌三頸燒瓶之內容物,使用油浴將三頸燒瓶的內溫升溫至70℃。邊持續以攪拌機之攪拌,邊自滴加漏斗歷時60分鐘將上述乙酸乙酯溶液滴入三頸燒瓶中,進行六亞甲基二異氰酸酯之異氰尿酸酯體與正丁醇之反應。此時邊將三頸燒瓶的內溫控制為70℃以上75℃以下,邊進行滴加。 乙酸乙酯溶液之滴加結束後,反應持續1小時,以氣相層析儀進行三頸燒瓶內之反應液之分析。而且,確認不再觀測到正丁醇的波峰後,結束反應。 Then, the contents of the three-necked flask were started to be stirred by a stirrer, and the inner temperature of the three-necked flask was raised to 70° C. using an oil bath. While continuing to stir with the mixer, drop the above ethyl acetate solution into the three-necked flask from the dropping funnel over 60 minutes to react the isocyanurate body of hexamethylene diisocyanate with n-butanol. At this time, the dropwise addition was performed while controlling the internal temperature of the three-necked flask to be 70°C or higher and 75°C or lower. After the addition of the ethyl acetate solution was completed, the reaction was continued for 1 hour, and the reaction solution in the three-necked flask was analyzed by gas chromatography. Then, after confirming that the peak of n-butanol was no longer observed, the reaction was terminated.
藉由此反應,獲得六亞甲基二異氰酸酯之異氰尿酸酯體(聚異氰酸酯化合物)與使正丁醇之羥基加成反應至六亞甲基二異氰酸酯之異氰尿酸酯體所具有的異氰酸酯基而生成的加成反應物(具有胺基甲酸酯鍵之改質異氰酸酯化合物)的混合物。三頸燒瓶內之反應液的固形分濃度為83.5質量%。By this reaction, the isocyanurate body (polyisocyanate compound) of hexamethylene diisocyanate is obtained, and the hydroxyl group of n-butanol is added to the isocyanurate body of hexamethylene diisocyanate. A mixture of addition reactants (modified isocyanate compounds with urethane bonds) generated from isocyanate groups. The solid content concentration of the reaction liquid in the three-necked flask was 83.5% by mass.
該混合物中,將六亞甲基二異氰酸酯之異氰尿酸酯體(聚異氰酸酯化合物)所具有的異氰酸酯基的總莫耳數設為Ia,將上述加成反應物(改質異氰酸酯化合物)所具有的異氰酸酯基的總莫耳數設為Ib,將上述加成反應物(改質異氰酸酯化合物)具有之改質基(胺基甲酸酯鍵)的總莫耳數設為H時,H相對於Ia與Ib與H之合計莫耳數之比H/(Ia+Ib+ H)為0.017。In this mixture, the total number of moles of isocyanate groups in the isocyanurate body (polyisocyanate compound) of hexamethylene diisocyanate is defined as Ia, and the above-mentioned addition reaction product (modified isocyanate compound) is When the total number of moles of the isocyanate groups possessed is Ib, and the total moles of the modified groups (urethane bonds) possessed by the above-mentioned addition reaction product (modified isocyanate compound) is represented as H, H is relative to The ratio H/(Ia+Ib+H) of the total moles of Ia, Ib, and H was 0.017.
[製造例4~16] 除了將六亞甲基二異氰酸酯之異氰尿酸酯體(聚異氰酸酯化合物)的使用量與1元醇的種類及使用量變更如表1所記載以外,進行與製造例3同樣之操作。藉此,獲得含有六亞甲基二異氰酸酯之異氰尿酸酯體(聚異氰酸酯化合物)與使1元醇之羥基加成反應至六亞甲基二異氰酸酯之異氰尿酸酯體所具有的異氰酸酯基而生成的加成反應物(改質異氰酸酯化合物)的混合物之反應液。又,三頸燒瓶內之反應液的固形份濃度於任一製造例中均為83.5質量%。 [Manufacturing example 4~16] Except having changed the usage-amount of the isocyanurate body (polyisocyanate compound) of hexamethylene diisocyanate and the kind and usage-amount of a monohydric alcohol to what was described in Table 1, the same operation as Production Example 3 was performed. Thereby, the isocyanurate body (polyisocyanate compound) containing hexamethylene diisocyanate and the isocyanurate body which added the hydroxyl group of the monohydric alcohol to hexamethylene diisocyanate are obtained. A reaction solution of a mixture of addition reactants (modified isocyanate compounds) generated by isocyanate groups. In addition, the solid content concentration of the reaction solution in the three-necked flask was 83.5% by mass in any production example.
[實施例1~11及比較例1~10] 將製造例1之樹脂組成物或製造例2之丙烯酸共聚物溶液、六亞甲基二異氰酸酯之異氰尿酸酯體或製造例3~16之反應液、反應觸媒的二丁基錫二月桂酸鹽、溶劑的甲基環己烷及乙酸乙酯混合,獲得實施例1~11及比較例1~10之接著劑用組成物。經混合之該等各成分的質量如表2所記載。 [Examples 1-11 and Comparative Examples 1-10] The resin composition of Production Example 1 or the acrylic acid copolymer solution of Production Example 2, the isocyanurate body of hexamethylene diisocyanate or the reaction solution of Production Examples 3 to 16, and the dibutyltin dilaurate of the reaction catalyst Salt, solvent methylcyclohexane, and ethyl acetate were mixed to obtain adhesive compositions of Examples 1-11 and Comparative Examples 1-10. The quality of the mixed components is listed in Table 2.
該等接著劑用組成物中,H相對於Ia與Ib與H之合計莫耳數之比H/(Ia+Ib+H)如表2所述。且,該等接著劑用組成物中,將製造例1之酸改質聚烯烴或製造例2之丙烯酸共聚物所具有之羧基的總莫耳數設為C、將聚異氰酸酯化合物所具有之異氰酸酯基的總莫耳數設為Ia、將改質異氰酸酯化合物所具有的異氰酸酯基之總莫耳數設為Ib時,Ia與Ib之合計莫耳數相對於C之比(Ia+Ib)/C如表2所記載。In these adhesive compositions, the ratio H/(Ia+Ib+H) of H to the total number of moles of Ia, Ib, and H is as described in Table 2. In addition, in these adhesive compositions, the total molar number of the carboxyl groups possessed by the acid-modified polyolefin in Production Example 1 or the acrylic copolymer in Production Example 2 is C, and the isocyanate contained in the polyisocyanate compound is When the total number of moles of Ia and the total number of moles of isocyanate groups possessed by the modified isocyanate compound is taken as Ib, the ratio of the total number of moles of Ia and Ib to C is (Ia+Ib)/C As recorded in Table 2.
其次,使用實施例1~11及比較例1~10之接著劑用組成物,製作積層體的試驗片。以下說明積層體之試驗片的製作方法。 準備於表面具有防腐處理(化成處理)層之鋁箔(寬:10cm,厚:40 μm),於該鋁箔表面塗佈接著劑用組成物,於鋁箔表面上形成接著劑用組成物之膜。使用棒塗佈器進行接著劑用組成物之塗佈。且接著劑用組成物的塗佈量為2g/m 2。 Next, using the adhesive composition of Examples 1-11 and Comparative Examples 1-10, the test piece of a laminated body was produced. Next, a method for producing a test piece of a laminate will be described. Prepare an aluminum foil (width: 10 cm, thickness: 40 μm) with an anti-corrosion treatment (chemical conversion treatment) layer on the surface, apply the composition for adhesive on the surface of the aluminum foil, and form a film of the composition for adhesive on the surface of the aluminum foil. Coating of the adhesive composition was performed using a bar coater. In addition, the coating amount of the adhesive composition was 2 g/m 2 .
形成有接著劑用組成物的膜之鋁箔,放入80℃的熱風乾燥爐中20秒,使接著劑用組成物中的溶劑蒸發進行乾燥。 準備厚度80μm的未延伸聚丙烯薄膜作為熱熔著性樹脂製薄膜,於熱風乾燥爐中,以於未延伸聚丙烯薄膜與鋁箔之間配置接著劑用組成物的膜之方式將未延伸聚丙烯薄膜與鋁箔重疊,使用橡膠輥貼合。藉此,獲得未延伸聚丙烯薄膜與接著劑用組成物的膜與鋁箔積層而成之薄片狀積層薄膜。 The aluminum foil formed with the film of the adhesive composition was placed in a hot air drying oven at 80° C. for 20 seconds, and the solvent in the adhesive composition was evaporated for drying. An unstretched polypropylene film with a thickness of 80 μm was prepared as a heat-adhesive resin film, and the unstretched polypropylene film was placed between the unstretched polypropylene film and the aluminum foil in a hot air drying oven. The film is overlaid with aluminum foil and laminated using a rubber roller. Thereby, a sheet-shaped laminated film obtained by laminating the unstretched polypropylene film, the film of the adhesive composition, and the aluminum foil was obtained.
其次,將所得薄片狀之積層薄膜放入溫度40℃的熱風循環式烘箱中保持1週。藉由該熱處理,進行接著劑用組成物之反應,接著劑用組成物的膜成為以含有接著劑用組成物之反應生成物的接著劑形成之接著劑層,獲得藉由該接著劑層將未延伸聚丙烯薄膜與鋁箔接著之積層體。所得積層體自熱風循環式烘箱中取出並切割,製作寬15mm的短條狀試驗片。Next, the obtained sheet-shaped laminated film was placed in a hot-air circulation oven at a temperature of 40° C. for one week. By this heat treatment, the reaction of the adhesive composition proceeds, and the film of the adhesive composition becomes an adhesive layer formed of an adhesive containing the reaction product of the adhesive composition, and the adhesive layer is obtained. A laminate of unstretched polypropylene film and aluminum foil. The obtained laminate was taken out from the hot-air circulation oven and cut to produce short strip-shaped test pieces with a width of 15 mm.
針對所得之試驗片,於85℃的溫度下測定未延伸聚丙烯薄膜與鋁箔之間的剝離強度,評價高溫下之接著劑的接著性。剝離強度係藉由依據JIS K6854-3:1999規定之方法之T字剝離試驗測定。拉伸速度為100mm/min。With regard to the obtained test piece, the peel strength between the unstretched polypropylene film and the aluminum foil was measured at a temperature of 85° C., and the adhesiveness of the adhesive agent at high temperature was evaluated. The peel strength is measured by the T-peel test according to the method stipulated in JIS K6854-3:1999. The stretching speed was 100 mm/min.
如表2所示,實施例1~11之試驗片,由於比H/(Ia+Ib+H)在超過0且0.5以下之範圍內,故即使在85℃的高溫下亦具有優異的剝離強度,可知高溫下之接著劑的接著性優異。 相對於此,比較例1~4之試驗片,由於比H/(Ia+Ib+H)在超過0且0.5以下之範圍外,與實施例1~11相比,高溫下之剝離強度低,可知高溫下之接著劑的接著性不足。 As shown in Table 2, the test pieces of Examples 1 to 11 have excellent peel strength even at a high temperature of 85°C because the ratio H/(Ia+Ib+H) is in the range of more than 0 and less than 0.5. , it can be seen that the adhesive agent at high temperature has excellent adhesiveness. In contrast, the test pieces of Comparative Examples 1 to 4 had lower peel strengths at high temperatures than those of Examples 1 to 11 because the ratio H/(Ia+Ib+H) was outside the range of more than 0 and not more than 0.5. It can be seen that the adhesiveness of the adhesive at high temperature is insufficient.
且,比較例5~7係藉由減少聚異氰酸酯化合物(六亞甲基二異氰酸酯之異氰尿酸酯體)的使用量,而使接著劑用組成物中所含的異氰酸酯基的數少於比較例1之例。關於實施例1~11,藉由將聚異氰酸酯化合物(六亞甲基二異氰酸酯之異氰尿酸酯體)之一部分替換為改質異氰酸酯化合物,與比較例5~7同樣,使接著劑用組成物中所含之異氰酸酯基的數少於比較例1。And, Comparative Examples 5-7 are by reducing the usage amount of polyisocyanate compound (isocyanurate body of hexamethylene diisocyanate), and make the number of the isocyanate group contained in the adhesive composition be less than Example of Comparative Example 1. Regarding Examples 1 to 11, by substituting part of the polyisocyanate compound (isocyanurate body of hexamethylene diisocyanate) with a modified isocyanate compound, the same composition as Comparative Examples 5 to 7 was used for the adhesive agent. The number of isocyanate groups contained in the compound is less than that of Comparative Example 1.
然而,實施例1~11之試驗片於高溫下的剝離強度高於比較例5~7的試驗片,於高溫下之接著劑的接著性優異。由此結果可知為了提高接著劑於高溫下之接著性,不僅需控制接著劑用組成物中所含的異氰酸酯基之數,且接著劑用組成物亦必須含有改質異氰酸酯化合物。However, the peel strength of the test pieces of Examples 1-11 at high temperature is higher than that of Comparative Examples 5-7, and the adhesiveness of the adhesive agent at high temperature is excellent. From the results, it can be seen that in order to improve the adhesiveness of the adhesive at high temperature, not only must the number of isocyanate groups contained in the adhesive composition be controlled, but the adhesive composition must also contain a modified isocyanate compound.
1:積層體 2:金屬箔 3:樹脂製薄膜 4:接著劑層 1: laminated body 2: metal foil 3: Resin film 4: Adhesive layer
[圖1]係說明本發明之積層體之一實施形態的剖面圖。[ Fig. 1 ] is a sectional view illustrating an embodiment of a laminate of the present invention.
1:積層體 1: laminated body
2:金屬箔 2: metal foil
3:樹脂製薄膜 3: Resin film
4:接著劑層 4: Adhesive layer
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