TW202326068A - Method and Apparatus for Measuring Three-Dimensional Composite Surface Profile of Object - Google Patents

Method and Apparatus for Measuring Three-Dimensional Composite Surface Profile of Object Download PDF

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TW202326068A
TW202326068A TW110148499A TW110148499A TW202326068A TW 202326068 A TW202326068 A TW 202326068A TW 110148499 A TW110148499 A TW 110148499A TW 110148499 A TW110148499 A TW 110148499A TW 202326068 A TW202326068 A TW 202326068A
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image
sample
dimensional
fringe
reconstruction
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TWI804128B (en
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鄭超仁
杜翰艷
何思嘉
黃崇軒
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國立臺灣師範大學
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Abstract

A method for measuring a three-dimensional composite surface profile of an object includes: (a) projecting an image to a sample through at least one group of a fringe projection device; (b) recording a wave front of the reflected light of the sample through a digital holographic access unit; (c) reconstructing the reflected light of a specular surface of the sample and its three-dimensional profile information through a digital holographic reconstruction method; (d) reconstructing the phase image and three-dimensional profile information of the diffused surface of the sample through a fringe projection analysis method; and (e) performing an image alignment of the three-dimensional image of the specular surface and the diffused surface through an image fitting technology to complete the full-scale image of a composite surface with the specular surface and the diffused surface and its three-dimensional contour reconstruction.

Description

量測物體三維複合表面輪廓之方法與裝置 Method and device for measuring three-dimensional composite surface profile of an object

本發明係關於物體表面之量測,特別係一種結合數位全像術舆條紋投影技術於單一光學量測系統,以重建數位全像(Digital Holography:DH)與條紋投影(Fringe Projection:FP)影像的物體三維複合表面輪廓分佈之裝置與方法。 The present invention relates to the measurement of the surface of objects, especially a combination of digital holography and fringe projection technology in a single optical measurement system to reconstruct digital holography (Digital Holography: DH) and fringe projection (Fringe Projection: FP) images Apparatus and method for three-dimensional composite surface contour distribution of an object.

現今的雷射光電科技日新月異且進步迅速,結合光電技術的生醫影像科技將成為未來廣受期待的新興產業。例如:透過對生醫細胞的造影研究,或是以雷射光束做為治療手段,皆有嶄新的突破。近十年來,脈衝雷射(pulsed laser)在脈衝寬度、脈衝能量及脈衝波長調諧範圍等方面的性能皆大幅提高,使得超短脈衝雷射(ultra-short pulsed laser)系統在整體穩定性和易操作性等方面,得到了巨大的改進。在生醫領域中也已發展出如雷射手術(Photodisruption)、光動力療法(Photodynamic therapy)以及光遺傳學(Optogenetics)等前瞻性應用。而為了提供更完整與精確的生醫影像資訊,三維成像技術成為了現今發展的一項考驗與發展趨勢。 Today's laser optoelectronic technology is changing and progressing rapidly, and biomedical imaging technology combined with optoelectronic technology will become an emerging industry that is widely expected in the future. For example, new breakthroughs have been made through the imaging research of biomedical cells, or the use of laser beams as a treatment method. In the past ten years, the performance of pulsed laser (pulsed laser) in terms of pulse width, pulse energy and pulse wavelength tuning range has been greatly improved, making the overall stability and ease of ultra-short pulsed laser (ultra-short pulsed laser) system Operability and other aspects have been greatly improved. Prospective applications such as laser surgery (Photodisruption), photodynamic therapy (Photodynamic therapy) and optogenetics (Optogenetics) have also been developed in the field of biomedicine. In order to provide more complete and accurate biomedical imaging information, 3D imaging technology has become a test and development trend of today's development.

此外,隨著科技之快速進展使得硬體設備之成本降低與計算機設備之運算速度提升,產品之精準度與輪廓完整性日趨被重視,而光學三維成像為探討精密三維表面輪廓不可或缺的工具。有別於以探針接觸待測物表面以進行掃描之接觸式量測,條紋投影技術使用非接觸式及易操作之量測方式,使許多微型元件可避免因接觸式量測導致表面遭到破壞,再加上近年來高速影像感測器與數位科技之快速發展,使得條紋投影量測已成為三維表面量測使用最廣泛的技術之一。 In addition, with the rapid development of science and technology, the cost of hardware equipment has been reduced and the computing speed of computer equipment has been improved. The accuracy and contour integrity of products have been paid more and more attention. Optical 3D imaging is an indispensable tool for exploring precise 3D surface contours. . Different from the contact measurement where the probe touches the surface of the object to be measured for scanning, the fringe projection technology uses a non-contact and easy-to-operate measurement method, so that many micro components can avoid surface damage due to contact measurement. Destruction, coupled with the rapid development of high-speed image sensors and digital technology in recent years, has made fringe projection measurement one of the most widely used techniques for 3D surface measurement.

然而,當量測具極高/弱漫射表面(diffused surface)時,因無法獲得正確的條紋形變資訊而無法精確的重建物體三維輪廓,降低了條紋投影技術之應用性。因此,許多研究團隊提出關於消除極高漫射表面之相位誤差的研究。舉例而言,在具有高反射表面之物體的表面噴灑薄層粉末使之反射率降低,藉此利於使用條紋投影技術進行三維表面量測。惟,這樣的程序耗時費力,且測量精確度會被塗層粉末厚度影響。 However, when the measurement has a very high/weak diffused surface, the 3D outline of the object cannot be accurately reconstructed due to the inability to obtain correct fringe deformation information, which reduces the applicability of the fringe projection technology. Therefore, many research groups have proposed studies on eliminating the phase error of extremely diffuse surfaces. For example, spraying a thin layer of powder on the surface of an object with a highly reflective surface reduces its reflectivity, thereby facilitating 3D surface measurement using fringe projection techniques. However, such a procedure is time-consuming and laborious, and the measurement accuracy is affected by the coating powder thickness.

由於因量測過強/弱之漫射表面使系統無法獲得物體之完整條紋,而無法取得正確的相位資訊,且目前市面上尚無有效而可靠的量測法得以量測具有鏡射面(specular surface)與漫射面之複合表面物體。因此,本發明發展一種新穎的光學量測方法來解決與克服上述的問題。 Since the system cannot obtain the complete fringe of the object due to the measurement of the overly strong/weak diffuse surface, the correct phase information cannot be obtained, and there is currently no effective and reliable measurement method on the market to measure the specular surface ( composite surface object of specular surface) and diffuse surface. Therefore, the present invention develops a novel optical measurement method to solve and overcome the above-mentioned problems.

鑑於具有鏡射面與漫射面之複合表面的物體難以同時量測;因此,本發明提出利用數位全像術結合條紋投影技術,以量測與重建複合表面物體的影像。 In view of the fact that it is difficult to measure the composite surface object with specular surface and diffuse surface at the same time; therefore, the present invention proposes to use digital holography combined with fringe projection technology to measure and reconstruct the image of the composite surface object.

本發明之三維複合表面成像與量測之方法可應用於微光學元件、光學元件、積體電路與光電半導體相關零組件、工業檢測、面板檢測、雷射加工…等三維輪廓檢測。相對於以接觸式工業檢測難以進行非破壞式、高精確度與高質量的全場三維複合表面成像與量測,顯示出本發明於新型態的科技應用與產業發展的重要性。 The three-dimensional composite surface imaging and measurement method of the present invention can be applied to three-dimensional contour detection of micro-optical components, optical components, integrated circuits and optoelectronic semiconductor related components, industrial inspection, panel inspection, laser processing, etc. Compared with the non-destructive, high-precision and high-quality full-field three-dimensional composite surface imaging and measurement that is difficult to perform by contact industrial inspection, it shows the importance of the present invention in new types of technological applications and industrial development.

根據本發明之一觀點,提供一種量測物體三維複合表面輪廓之方法,包括底下步驟:透過至少一組投影單元,以投影一影像至一樣品;然後,透過一影像存取單元,以記錄該樣品之反射光;隨之,透過一數位全像重建方法,以重建該樣品之鏡射表面的反射光及其表面三維輪廓資訊;之後,透過一條紋投影分析方法,以重建該樣品之漫射表面的相位影像及其表面三維輪廓資訊;最後,透過一影像貼合方法,將該鏡射表面與漫射表面之三維影像進行影像對位,以重建該樣品複合表面之完整三維影像與輪廓資訊。 According to an aspect of the present invention, a method for measuring the three-dimensional composite surface profile of an object is provided, which includes the following steps: projecting an image onto a sample through at least one set of projection units; and then recording the image through an image access unit The reflected light of the sample; then, through a digital hologram reconstruction method, to reconstruct the reflected light of the specular surface of the sample and its surface three-dimensional profile information; after that, through a fringe projection analysis method, to reconstruct the diffuse of the sample The phase image of the surface and its surface three-dimensional contour information; finally, through an image bonding method, the three-dimensional images of the specular surface and the diffuse surface are image-aligned to reconstruct the complete three-dimensional image and contour information of the composite surface of the sample .

上述方法更包含於該條紋投影分析方法之中,透過數位全像重建之該樣品表面反射波前,以重建該樣品之漫射表面的相位影像及其表面三維輪廓資訊。 The above method further includes in the fringe projection analysis method, reconstructing the phase image of the diffuse surface of the sample and its surface three-dimensional profile information through digital hologram reconstruction of the reflected wavefront of the sample surface.

根據本發明之另一觀點,提供一種量測物體三維複合表面輪廓之方法,包括底下步驟:透過一投影單元,以將無條紋資訊光波入射至一樣品;然後,打開一開關(快門),透過一影像存取單元,以記錄從該樣品反射之物體光波與參考光波的干涉影像;隨之,透過一數位全像重建方法,以進行該樣品的數值重建,而獲得該樣品的第一三維影像;之後,透過該投影單元,以將條紋資訊光波入射至該樣品;接下來,關閉該開關(快門),透過該影像存取單元,以記錄從該樣品反射之形變條紋的影像;接著,透過一條紋投影重建方法,以進行該樣品的數值重建,而獲得該樣品的第二三維影像;最後,透過一影像貼合方法,以將該第一三維影像與該第二三維影像進行影像對位,以重建該樣品複合表面之完整三維影像與輪廓資訊。上述投影單元包括投影機、空間光調制器、電控光反射鏡、液晶微型顯示器、光柵或數位微鏡裝置。 According to another aspect of the present invention, a method for measuring the three-dimensional composite surface profile of an object is provided, which includes the following steps: passing through a projection unit, so that the light wave without fringe information is incident on a sample; then, opening a switch (shutter), passing through An image access unit to record the interference image of the object light wave reflected from the sample and the reference light wave; then, through a digital hologram reconstruction method, the numerical reconstruction of the sample is performed to obtain the first three-dimensional image of the sample ; After that, through the projection unit, the fringe information light wave is incident on the sample; next, close the switch (shutter), and through the image access unit, to record the image of the deformed fringe reflected from the sample; then, through A fringe projection reconstruction method for performing numerical reconstruction of the sample to obtain a second 3D image of the sample; finally, image alignment of the first 3D image and the second 3D image through an image bonding method , to reconstruct the complete 3D image and contour information of the composite surface of the sample. The projection unit includes a projector, a spatial light modulator, an electric control light mirror, a liquid crystal microdisplay, a grating or a digital micromirror device.

根據本發明之又一觀點,提供一種量測物體三維複合表面輪廓之方法,包括底下步驟:透過一投影單元,以將條紋資訊光波入射至一樣品;然後,打開一開關(快門),透過一影像存取單元,以記錄從該樣品反射之帶有條紋資訊的物體光波與參考光波的干涉影像;隨之,透過一數位全像重建方法,以進行該樣品的數值重建,而獲得該樣品的第一三維影像;之後,透過一條紋投影重建方法,以進行該樣品的數值重建,而獲得該樣品的第二三維影像;最後,透過一影像貼合方法,以將該第一三維影像與該第二三維影像進行影像對位,以重建該樣品複合表面之完整三維影像與輪廓資訊。 According to another aspect of the present invention, a method for measuring the three-dimensional composite surface profile of an object is provided, which includes the following steps: passing through a projection unit, so that the fringe information light wave is incident on a sample; then, opening a switch (shutter), passing through a The image access unit is used to record the interference image of the object light wave with fringe information reflected from the sample and the reference light wave; then, the numerical reconstruction of the sample is carried out through a digital hologram reconstruction method, and the sample's image is obtained The first three-dimensional image; afterward, performing numerical reconstruction of the sample through a fringe projection reconstruction method to obtain a second three-dimensional image of the sample; finally, using an image bonding method to combine the first three-dimensional image with the sample Image alignment is performed on the second 3D image to reconstruct the complete 3D image and contour information of the composite surface of the sample.

根據本發明之一觀點,其中數位全像重建方法,包括傅立葉轉換法、摺積法、角頻譜法、菲涅耳繞射近似法或深度學習重建法;而條紋投影分析方法包含相移法、傅立葉轉換法或深度學習重建法。 According to one aspect of the present invention, wherein the digital hologram reconstruction method includes Fourier transform method, convolution method, angular spectrum method, Fresnel diffraction approximation method or deep learning reconstruction method; and the fringe projection analysis method includes phase shift method, Fourier transform method or deep learning reconstruction method.

此些優點及其他優點從以下較佳實施例之敘述及申請專利範圍將使讀者得以清楚了解本發明。 These advantages and other advantages will enable readers to clearly understand the present invention from the description of the following preferred embodiments and the patent scope of the application.

100:投影單元 100: projection unit

102、514:全白影像 102, 514: full white image

104、516:條紋分佈影像 104, 516: Stripe distribution image

106:偵測光束 106: Detection Beam

108:分光元件 108: Light splitting element

110:成像透鏡組 110: imaging lens group

112、522:樣品 112, 522: samples

114:形變條紋影像 114: Deformed fringe image

116:參考光束 116: Reference beam

118、534:快門 118, 534: shutter

120:影像存取單元 120: image access unit

202、204、206、208、210:步驟 202, 204, 206, 208, 210: steps

302、304、306、308、310、312、314:步驟 302, 304, 306, 308, 310, 312, 314: steps

402、404、406、408、410:步驟 402, 404, 406, 408, 410: steps

502:發射光源 502: emit light source

504、508、536、540:面鏡 504, 508, 536, 540: mirror

505:光擴束器 505: Optical beam expander

506、530:偏振片 506, 530: Polarizer

510、528、538:分光鏡 510, 528, 538: beam splitter

512:投影單元 512: projection unit

518、520、524、526:透鏡 518, 520, 524, 526: lens

532:光偵測器陣列 532: photodetector array

如下所述之對本發明的詳細描述與實施例之示意圖,應使本發明更被充分地理解;然而,應可理解此僅限於作為理解本發明應用之參考,而非限制本發明於一特定實施例之中。 The following detailed description of the present invention and the schematic diagram of the embodiment should make the present invention more fully understood; however, it should be understood that this is only used as a reference for understanding the application of the present invention, rather than limiting the present invention to a specific implementation Among the examples.

第一圖顯示根據本發明之一實施例之一量測物體三維複合表面輪廓之光學系統之示意圖; The first figure shows a schematic diagram of an optical system for measuring the three-dimensional composite surface profile of an object according to an embodiment of the present invention;

第二圖顯示根據本發明之一實施例之一量測物體三維複合表面輪廓之方法流程圖; The second figure shows a flowchart of a method for measuring the three-dimensional composite surface profile of an object according to an embodiment of the present invention;

第三圖顯示根據本發明之另一實施例之一量測物體三維複合表面輪廓之方法流程圖; The third figure shows a flowchart of a method for measuring the three-dimensional composite surface profile of an object according to another embodiment of the present invention;

第四圖顯示根據本發明之又一實施例之一量測物體三維複合表面輪廓之方法流程圖; The fourth figure shows a flow chart of a method for measuring the three-dimensional composite surface profile of an object according to another embodiment of the present invention;

第五圖顯示根據本發明之一量測物體三維複合表面輪廓之光學系統之示意圖。 Fig. 5 shows a schematic diagram of an optical system for measuring the three-dimensional composite surface profile of an object according to the present invention.

此處本發明將針對發明具體實施例及其觀點加以詳細描述,此類描述為解釋本發明之輪廓或步驟流程,其係供以說明之用而非用以限制本發明之申請專利範圍。因此,除說明書中之具體實施例與較佳實施例外,本發明亦可廣泛施行於其他不同的實施例中。 Herein, the present invention will be described in detail with respect to specific embodiments of the invention and its viewpoints. Such descriptions are for explaining the outline or step flow of the present invention, and are for the purpose of illustration rather than limiting the patent scope of the present invention. Therefore, except for the specific embodiments and preferred embodiments in the description, the present invention can also be widely implemented in other different embodiments.

本發明揭露關於一種物體三維複合表面輪廓分佈之裝置與方 法,其中結合數位全像術舆條紋投影技術於單一光學量測系統,以重建數位全像(Digital Holography:DH)與條紋投影(Fringe Projection:FP)影像的物體三維複合表面輪廓分佈之裝置與方法。實施例中指出本發明只需一次拍攝即可分別重建出數位全像與條紋投影的物體三維影像分佈,以達成高解析成像效果的影像。 The present invention discloses a device and method for the distribution of three-dimensional compound surface contours of an object method, which combines digital holography and fringe projection technology in a single optical measurement system to reconstruct the three-dimensional composite surface profile distribution of digital holography (Digital Holography: DH) and fringe projection (Fringe Projection: FP) images. method. It is pointed out in the embodiment that the present invention can respectively reconstruct the three-dimensional image distribution of the digital hologram and the fringe projection object with only one shot, so as to achieve an image with high-resolution imaging effect.

本發明之物體三維複合表面輪廓分佈之裝置與方法係涉及使用以下幾種技術或方法: The device and method for the three-dimensional composite surface profile distribution of the object of the present invention involve the use of the following technologies or methods:

(i)條紋投影技術:漫射表面樣品透過數位同調光條紋投影技術即時記錄並重建漫射表面樣品之三維表面輪廓。 (i) Fringe projection technology: The diffuse surface sample is recorded and reconstructed in real time through the digital coherent light fringe projection technology to reconstruct the three-dimensional surface profile of the diffuse surface sample.

(ii)數位全像術:鏡射表面樣品透過數位全像術即時記錄並重建鏡射表面様本之三維表面輪廓。 (ii) Digital holography: The mirrored surface sample is recorded and reconstructed in real time by digital holography to reconstruct the three-dimensional surface profile of the mirrored surface sample.

(iii)複合表面合成:利用影像貼合技術分別將同調光條紋投影分析所得之漫射區塊及數位全像術所得之鏡射區塊的三维重建影像進行影像貼合,以重建全場複合表面物體之三維立體輪廓分佈資訊。 (iii) Composite surface synthesis: use image bonding technology to combine the 3D reconstruction images of the diffuse block obtained from coherent light fringe projection analysis and the mirror block obtained by digital holography to reconstruct the full-field composite 3D contour distribution information of surface objects.

(iv)一次拍攝:透過光學調製元件以產生週期性條紋並成像至物體表面上,使物體表面包含條紋影像資訊,並透過數位全像術記錄物體之複數波前資訊,此時振幅影像資訊包含物體本身影像資訊與條紋影像資訊,而相位資訊則只包含物體本身影像資訊;再透過全像波前重建以得到振幅影像(包含物體與條紋影像資訊)與相位(包含物體影像資訊)分佈;此時,若是鏡射面,則可透過相位影像資訊重建鏡射面之物體三維影像分佈,若是漫射面,則使用振幅影像資訊透過同調光條紋投影技術重建漫射面之物體三維影像分佈,再透過影像貼合技術使之完整重建物體複合表面之三維影像輪廓。 (iv) One shot: Periodic fringes are generated through the optical modulation element and imaged on the surface of the object, so that the surface of the object contains fringe image information, and the complex wavefront information of the object is recorded through digital holography. At this time, the amplitude image information includes The image information of the object itself and the fringe image information, while the phase information only includes the image information of the object itself; and then reconstruct the amplitude image (including object and fringe image information) and phase (including object image information) distribution through holographic wavefront reconstruction; When it is a specular surface, the 3D image distribution of the object on the specular surface can be reconstructed through the phase image information; if it is a diffuse surface, the 3D image distribution of the object on the diffuse surface can be reconstructed by using the amplitude image information through coherent light fringe projection technology, and then Through the image bonding technology, it can completely reconstruct the three-dimensional image outline of the compound surface of the object.

本發明提出僅使用一次拍攝之方式,透過數位全像術取得物體之波前複數資訊,並分別利用相位重建鏡射面之物體三维輪廓與利用振幅透過條紋投影技術重建漫射面之物體三維輪廓,再透過影像對位技術將鏡射面與漫射面之物體三維輪廓進行重組,以達到全場複合表面物體三維輪廓成像與量測。 The present invention proposes to use only one shot to obtain the complex wavefront information of the object through digital holography, and reconstruct the three-dimensional contour of the object on the mirror surface by using the phase and reconstruct the three-dimensional contour of the object on the diffuse surface by using the amplitude fringe projection technology. , and then reorganize the three-dimensional contours of the object on the mirror surface and the diffuse surface through the image alignment technology, so as to achieve the three-dimensional contour imaging and measurement of the composite surface object in the whole field.

第一圖顯示根據本發明實施例之一,其為量測物體三維複合表面 輪廓之架構與流程示意圖。在本架構之中包含一光學系統,產生一偵測光束106與一參考光束(Reference Beam)116。舉例而言,光學系統包括一發射光源、至少一分光元件、一投影單元(波前操控元件)、至少一光偵測器陣列(例如:感光耦合元件(Charge-coupled Device;CCD)、互補式金屬氧化物半導體(CMOS)等影像感測器、光感測器(Photodetector)、數個成像透鏡、快門(shutter)以及數個面鏡。發射光源包含但不限於垂直共振腔面射型雷射(Vertical-Cavity Surface-Emitting Laser;VCSEL)、半導體雷射(Semiconductor laser)、固態雷射(Solid-state laser)、氣態雷射(Gas laser)、液體雷射(Dye laser)、光纖雷射(Fiber laser)或發光二極體(LED)。發射光源之光源形式包括線光源、平面光源或球面光源。發射光源之光源特性包括同調光源、低同調光源或非同調光源。此光學系統包括成像透鏡組110,用以收集樣品112之穿透或反射光的波前。此光學系統之光路經包含:雷射光源(例如:二極體雷射光源)產生一個具有中心波長的雷射光,該雷射光經過面鏡反射之後先通過光擴束器以產生一個擴束光,再入射至分光元件而分別輸出兩道光束。其中一道光束經過投影單元(波前操控元件)100之後即改變入射光的波前。入射光波前經分光元件108的分光之後產生光束轉折。其中,分光元件的位置與數量可以依據投影單元(波前操控元件)100而定。舉一實施例而言,投影單元(波前操控元件)100包括投影元件、投影機、空間光調制器(Spatial light modulator:SLM)、電控光反射鏡、液晶微型顯示器、光柵或數位微鏡裝置(Digital micromirror device:DMD),以改變入射光之波前,而將全白(無條紋)的影像或者條紋分佈的影像進行投影。投影單元100可以提供全白影像102以及條紋分佈影像104。條紋分佈影像104的入射光經過成像透鏡組110將以一入射角度入射至樣品112,以形成形變條紋影像114。然後,於樣品112反射之光場進一步經過成像透鏡組110,之後經由分光元件108的分光以成像於影像存取單元120。另一道光束經過一面鏡反射之後作為參考光束116。而反射光束與參考光束116會於影像存取單元120形成干涉。干涉資訊經過影像存取單元120之記錄以取得數位全像記錄。舉例而言,影像存取單元120包含光偵測器陣列或影像感測器。快門118係配置於參考光束116行進的位置上。 The first figure shows one of the embodiments of the present invention, which is to measure the three-dimensional composite surface of the object Schematic diagram of the structure and flow of the outline. This structure includes an optical system to generate a detection beam 106 and a reference beam (Reference Beam) 116 . For example, the optical system includes an emitting light source, at least one spectroscopic element, a projection unit (wavefront manipulation element), at least one photodetector array (for example: charge-coupled device (CCD), complementary Image sensors such as metal oxide semiconductor (CMOS), photodetectors, several imaging lenses, shutters, and several mirrors. The emission light source includes but is not limited to a vertical resonant cavity surface-emitting laser (Vertical-Cavity Surface-Emitting Laser; VCSEL), semiconductor laser (Semiconductor laser), solid-state laser (Solid-state laser), gas laser (Gas laser), liquid laser (Dye laser), fiber laser ( Fiber laser) or light-emitting diode (LED). The light source form of the emitted light source includes line light source, plane light source or spherical light source. The light source characteristics of the emitted light source include coherent light source, low coherent light source or non-coherent light source. The optical system includes imaging lens Group 110 is used to collect the wavefront of the transmitted or reflected light of the sample 112. The optical path of this optical system includes: a laser light source (for example: a diode laser light source) generates a laser light with a central wavelength, the laser light source After the incident light is reflected by the surface mirror, it first passes through the beam expander to generate a beam expander, and then enters the light splitting element to output two beams respectively. After one of the beams passes through the projection unit (wavefront control element) 100, the intensity of the incident light is changed. Wavefront. The incident light wavefront produces beam turning after the light splitting of light-splitting element 108. Wherein, the position and quantity of light-splitting element can be decided according to projection unit (wave front manipulation element) 100.For an embodiment, projection unit (wave front control element) 100 decides. The front control element) 100 includes a projection element, a projector, a spatial light modulator (Spatial light modulator: SLM), an electrically controlled light mirror, a liquid crystal microdisplay, a grating or a digital micromirror device (Digital micromirror device: DMD), to change The wavefront of the incident light, and project the image of all white (no streaks) or the image of fringe distribution. Projection unit 100 can provide all white image 102 and fringe distribution image 104. The incident light of fringe distribution image 104 passes through imaging lens group 110 will be incident on the sample 112 at an incident angle to form a deformed fringe image 114. Then, the light field reflected by the sample 112 further passes through the imaging lens group 110, and then passes through the light splitting element 108 to form an image on the image access unit 120. The other beam is reflected by a mirror as the reference beam 116. The reflected beam and the reference beam 116 will form interference in the image access unit 120. The interference information is recorded in the image access unit 120 to obtain a digital holographic record. For example , the image access unit 120 includes a photodetector array or an image sensor. The shutter 118 is disposed at the position where the reference beam 116 travels.

透過打開或關閉快門118,以使得參考光束116繼續前行或擋住參考光束116。 By opening or closing the shutter 118 , the reference beam 116 can go forward or block the reference beam 116 .

上述面鏡係用於改變雷射光的光路徑。上述透鏡可以為其他可產生擴束波前之元件(平面與球面波)、或其他可產生平面、球面與具任意的曲面波前之元件。 The mirror is used to change the optical path of the laser light. The above-mentioned lens can be other elements capable of generating beam-expanding wavefronts (plane and spherical waves), or other elements capable of generating planar, spherical, and arbitrary curved wavefronts.

如第二圖所示,顯示根據本發明之一實施例之一量測物體三維複合表面輪廓之流程圖。首先,執行步驟202,透過至少一組投影單元,以投影一影像至一樣品。於步驟202之中,第一圖之投影單元100投影全白(無條紋)影像102或條紋分佈影像104,經過成像透鏡組110以投影至一樣品112,其中樣品112包含有鏡射面和漫射面。接下來,執行步驟204,透過影像存取單元,以記錄樣品112之反射光波前。於步驟204之中,經由樣品112反射之光波會通過成像透鏡組110,再經由分光元件108的分光以成像於影像存取單元120之上。而透過影像存取單元,可以記錄樣品112之反射光的波前。然後,執行步驟206,透過數位全像重建方法,以重建樣品112之鏡射表面的反射光波前及其表面三維輪廓資訊。舉一實施例而言,數位全像重建方法包括但不限於傅立葉轉換法、摺積法、角頻譜法、菲涅耳繞射近似法或深度學習重建法。隨之,執行步驟208,透過條紋投影分析方法,以重建樣品112之漫射表面的相位影像及其表面三維輪廓資訊。於步驟208之中,更包含於條紋投影分析方法之中,透過數位全像重建之該樣品表面反射波前,以重建樣品112之漫射表面的相位影像及其表面三維輪廓資訊。舉一實施例而言,條紋投影分析方法包括但不限於相移法、傅立葉轉換法或深度學習重建法。最後,執行步驟210,透過影像貼合方法將鏡射面與漫射面之表面三維影像進行影像對位,以重建物體樣品112複合表面之完整三維影像與輪廓資訊。舉一實施例而言,影像貼合方法包括影像對位技術。 As shown in the second figure, it shows a flow chart of measuring the three-dimensional compound surface profile of an object according to an embodiment of the present invention. Firstly, step 202 is executed to project an image onto a sample through at least one set of projection units. In step 202, the projection unit 100 of the first image projects a completely white (no streak) image 102 or a streak distribution image 104, and projects it onto a sample 112 through the imaging lens group 110, wherein the sample 112 includes a specular surface and a diffuse shooting surface. Next, step 204 is executed to record the reflected light wavefront of the sample 112 through the image access unit. In step 204 , the light wave reflected by the sample 112 passes through the imaging lens group 110 , and is then split by the light splitting element 108 to form an image on the image access unit 120 . And through the image access unit, the wavefront of the reflected light of the sample 112 can be recorded. Then, step 206 is executed to reconstruct the wavefront of the reflected light of the mirror surface of the sample 112 and its surface three-dimensional profile information through the digital hologram reconstruction method. As an example, the digital hologram reconstruction method includes but not limited to Fourier transform method, convolution method, angular spectrum method, Fresnel diffraction approximation method or deep learning reconstruction method. Subsequently, step 208 is executed to reconstruct the phase image of the diffuse surface of the sample 112 and its surface three-dimensional profile information through the fringe projection analysis method. In step 208 , further included in the fringe projection analysis method, the phase image of the diffuse surface of the sample 112 and its surface three-dimensional profile information are reconstructed through the digital hologram reconstructed reflection wavefront of the sample surface. As an example, the fringe projection analysis method includes but not limited to phase shift method, Fourier transform method or deep learning reconstruction method. Finally, step 210 is executed to align the surface 3D images of the specular surface and the diffuse surface through the image bonding method, so as to reconstruct the complete 3D image and contour information of the composite surface of the object sample 112 . In one embodiment, the image bonding method includes image alignment technology.

如第三圖所示,顯示根據本發明之另一實施例之一量測物體三維複合表面輪廓之流程圖。在本實施例之中,進行樣品之多次拍攝,其分別進行數位全像術與條紋投影術的記錄與重建。首先,在數位全像術的記錄與重建之中,執行步驟302,透過投影單元,以將全白(無條紋)資訊光波入射至一樣品。於步驟302之中,第一圖之投影單元100投影全白影像102,經過成像透鏡組110以投影至一樣品112,其中樣品112包含有鏡射面和漫射面。於記錄數位全 像術時,將全白的投影影像透過投影單元(例如:投影機、空間光調制器)進行投影,此時帶有全白資訊的光波經過一或多個透鏡之後,以與物體樣品的法線有一夾角之傾斜角度入射至樣品112。接下來,執行步驟304,打開快門(開關),透過影像存取單元,以記錄從樣品反射之物體光波與參考光波的干涉影像。於步驟304之中,開啟配置於參考光束行進位置上的快門。經由樣品112反射之光波會通過成像透鏡組,再經由分光元件的分光以成像於影像存取單元之上。而透過影像存取單元,可以記錄樣品112反射之物體光波與參考光波的干涉影像。舉例而言,從樣品112反射之物體光波資訊再經由一或多個透鏡,並傳播至影像感測器所在的平面上,同時打開位於參考光位置的快門,使參考光入射至影像感測器所在的平面上,此時物體光與參考光會發生干涉並產生干涉條紋,透過影像感測器記錄其干涉的影像(此干涉影像稱為數位全像片)。然後,執行步驟306,透過數位全像重建方法,以進行樣品的數值重建,而獲得樣品的第一三維影像(包含振幅、相位與高度)。於步驟306之中,此第一三維影像(數位全像片)傳輸至電腦,並透過程式軟體建立(撰寫)一數位全像重建演算法,以進行樣品的數值重建。舉一實施例而言,數位全像重建方法包括但不限於傅立葉轉換法、摺積法、角頻譜法、菲涅耳繞射近似法或深度學習重建法。例如,上述程式軟體建立的程序至少包含,於數位全相片擷取之後進行:傅立葉轉換、圈選一階項、反傅立葉轉換、傾斜/球面修正、取得振幅相位影像。 As shown in the third figure, it shows a flow chart of measuring the three-dimensional composite surface profile of an object according to another embodiment of the present invention. In this embodiment, multiple photographs of the sample are taken, which are respectively recorded and reconstructed by digital holography and fringe projection. Firstly, in the recording and reconstruction of digital holography, step 302 is executed to inject all white (no fringe) information light waves to a sample through the projection unit. In step 302 , the projection unit 100 of the first figure projects a full white image 102 through the imaging lens set 110 to project onto a sample 112 , wherein the sample 112 includes a specular surface and a diffuse surface. in record digits In imaging, the all-white projected image is projected through a projection unit (such as a projector, a spatial light modulator), and at this time, the light wave with all-white information passes through one or more lenses, and is in the same way as the object sample. The line is incident on the sample 112 at an oblique angle. Next, step 304 is executed to open the shutter (switch) to record the interference image of the object light wave reflected from the sample and the reference light wave through the image access unit. In step 304, the shutter disposed at the traveling position of the reference beam is opened. The light wave reflected by the sample 112 will pass through the imaging lens group, and then be imaged on the image access unit through the light splitting of the light splitting element. Through the image access unit, the interference image of the object light wave reflected by the sample 112 and the reference light wave can be recorded. For example, the light wave information of the object reflected from the sample 112 passes through one or more lenses, and propagates to the plane where the image sensor is located. At the same time, the shutter at the position of the reference light is opened, so that the reference light is incident on the image sensor At this time, the object light and the reference light will interfere and generate interference fringes, and the interference image is recorded through the image sensor (this interference image is called a digital hologram). Then, step 306 is executed to perform numerical reconstruction of the sample through a digital hologram reconstruction method to obtain a first three-dimensional image (including amplitude, phase and height) of the sample. In step 306, the first three-dimensional image (digital hologram) is transmitted to the computer, and a digital hologram reconstruction algorithm is created (written) through the programming software to perform numerical reconstruction of the sample. As an example, the digital hologram reconstruction method includes but not limited to Fourier transform method, convolution method, angular spectrum method, Fresnel diffraction approximation method or deep learning reconstruction method. For example, the procedures established by the above-mentioned program software at least include, after digital full photo capture: Fourier transform, circle selection of first-order items, inverse Fourier transform, tilt/spherical correction, and acquisition of amplitude and phase images.

隨之,在條紋投影術的記錄與重建之中,執行步驟308,透過投影單元,以將條紋資訊光波入射至一樣品。於步驟308之中,於記錄條紋投影術時,將透過程式軟體產生弦波條紋影像,並透過投影單元(例如:投影機、空間光調制器)進行投影,此時帶有條紋資訊的光波經過一或多個透鏡後,以與樣品112的法線有一夾角之傾斜角度入射至樣品112。接下來,執行步驟310,關閉快門,透過影像存取單元,以記錄從樣品反射之形變條紋的影像。於步驟310之中,從物體樣品112反射之帶有樣品的形變條紋資訊經過一或多個透鏡,並傳播至影像存取單元所在的平面上,此時關閉位於參考光位置的快門,透過影像存取單元記錄形變條紋的影像。然後,執行步驟312,透過條紋投影重建方法,以進行樣品的數值重建,而獲得樣品的第二三維影像(包含振幅、相位與高度)。於步驟312之中,將第二三維影像傳輸至電腦,並透過程式軟體建立(撰寫)一條 紋投影重建演算法,以進行樣品的數值重建。舉一實施例而言,條紋投影重建(分析)方法包括但不限於相移法、傅立葉轉換法或深度學習重建法。例如,上述程式軟體建立的程序至少包含,於形變條紋擷取之後進行:四步法重建、振幅相位影像、相位轉換至實際相位、相位轉高度,以取得高度影像。最後,於步驟314之中,透過影像貼合(融合)方法將第一三維影像與第二三維影像進行影像對位,以重建樣品複合表面之完整三維影像與輪廓資訊。舉一實施例而言,影像貼合方法包括影像對位技術。例如,上述影像貼合(融合)程式軟體建立的程序至少包含:數位全像影像算表面高度、條紋投影高度影像、進行影像融合。 Subsequently, during the recording and reconstruction of the fringe projection technique, step 308 is executed to inject the fringe information light wave into a sample through the projection unit. In step 308, when recording the fringe projection technique, the sinusoidal fringe image will be generated through the program software, and projected through the projection unit (such as: projector, spatial light modulator), and the light wave with fringe information passes through After one or more lenses, it is incident on the sample 112 at an oblique angle with the normal of the sample 112 . Next, step 310 is executed to close the shutter and record the image of the deformed fringes reflected from the sample through the image access unit. In step 310, the deformed fringe information reflected from the object sample 112 passes through one or more lenses, and propagates to the plane where the image access unit is located. At this time, the shutter at the position of the reference light is closed, and the image transmitted The access unit records images of the deformed stripes. Then, step 312 is executed to perform numerical reconstruction of the sample through the fringe projection reconstruction method to obtain a second 3D image (including amplitude, phase and height) of the sample. In step 312, the second 3D image is transmitted to the computer, and a program software is used to create (write) a A texture projection reconstruction algorithm for numerical reconstruction of samples. As an example, fringe projection reconstruction (analysis) methods include but are not limited to phase shift methods, Fourier transform methods or deep learning reconstruction methods. For example, the procedure established by the above-mentioned program software at least includes, after the deformed fringes are captured, four-step reconstruction, amplitude-phase image, phase conversion to actual phase, and phase-to-height conversion to obtain the height image. Finally, in step 314 , the first 3D image and the second 3D image are image-aligned through an image bonding (fusion) method, so as to reconstruct a complete 3D image and contour information of the composite surface of the sample. In one embodiment, the image bonding method includes image alignment technology. For example, the program established by the above-mentioned image bonding (fusion) program software at least includes: calculating the surface height of the digital hologram image, fringe projection height image, and performing image fusion.

如第四圖所示,顯示根據本發明之又一實施例之一量測物體三維複合表面輪廓之流程圖。在本實施例之中,進行樣品之單次拍攝,其同時進行數位全像術與條紋投影術的記錄與重建。首先,在數位全像術的記錄與重建之中,執行步驟402,透過投影單元,以將條紋資訊光波入射至一樣品。於步驟402之中,第一圖之投影單元100條紋分佈影像104,經過成像透鏡組110以投影至一樣品112,其中樣品112包含有鏡射面和漫射面。於記錄數位全像術時,將具有條紋分佈的投影影像透過投影單元(例如:投影機、空間光調制器)進行投影,此時帶有條紋資訊的光波經過一或多個透鏡之後,以與物體樣品的法線有一夾角之傾斜角度入射至樣品112。接下來,執行步驟404,打開快門(開關),透過數位全像存取單元,以記錄從樣品反射之帶有條紋資訊的物體光波與參考光波的干涉影像。於步驟404之中,從物體樣品反射之帶有樣品的形變條紋資訊經過一或多個透鏡,並傳播至影像存取單元所在的平面上,同時開啟配置於參考光束行進位置上的快門,使參考光入射至影像存取單元所在的平面上,此時帶有條紋資訊的物體光波與參考光波會發生干涉並產生干涉條紋,透過影像存取單元記錄其干涉的影像(此干涉影像稱為數位全像片)。亦即,透過影像存取單元,可以記錄樣品112反射之物體光波與參考光波的干涉影像。 As shown in FIG. 4 , it shows a flow chart of measuring the three-dimensional composite surface profile of an object according to another embodiment of the present invention. In this example, a single shot of the sample is taken, which simultaneously records and reconstructs digital holography and fringe projection. Firstly, in the recording and reconstruction of digital holography, step 402 is executed to inject fringe information light waves into a sample through a projection unit. In step 402 , the fringe distribution image 104 of the projection unit 100 in the first figure is projected onto a sample 112 through the imaging lens group 110 , wherein the sample 112 includes a specular surface and a diffuse surface. When recording digital holography, the projected image with fringe distribution is projected through a projection unit (such as a projector, a spatial light modulator), and at this time, the light wave with fringe information passes through one or more lenses to communicate with the The normal line of the object sample is incident on the sample 112 at an oblique angle. Next, step 404 is executed to open the shutter (switch) and pass through the digital hologram access unit to record the interference image of the object light wave with fringe information reflected from the sample and the reference light wave. In step 404, the deformed fringe information with the sample reflected from the object sample passes through one or more lenses, and spreads to the plane where the image access unit is located, and at the same time opens the shutter arranged at the traveling position of the reference beam, so that The reference light is incident on the plane where the image access unit is located. At this time, the object light wave with fringe information and the reference light wave will interfere and generate interference fringes. The interference image is recorded through the image access unit (this interference image is called digital hologram). That is, through the image access unit, the interference image of the object light wave reflected by the sample 112 and the reference light wave can be recorded.

接下來,執行步驟406,透過數位全像重建方法,以進行樣品的數值重建,而獲得樣品的第一三維影像(包含振幅、相位與高度)。於步驟406之中,此第一三維影像(數位全像片)傳輸至電腦,並透過程式軟體建立(撰寫)一數位全像重建演算法,以進行樣品的數值重建。此時,第一三維影像之振幅影像 將同時含有物體樣品的資訊與形變條紋資訊。舉一實施例而言,數位全像重建方法包括但不限於傅立葉轉換法、摺積法、角頻譜法、菲涅耳繞射近似法或深度學習重建法。隨之,執行步驟408,透過條紋投影重建方法,以進行樣品的數值重建,而獲得樣品的第二三維影像(包含振幅、相位與高度)。於步驟408之中,將第二三維影像之振幅影像傳輸至電腦,並透過程式軟體建立(撰寫)一條紋投影重建演算法,以進行樣品的數值重建。舉一實施例而言,條紋投影重建(分析)演算法包括但不限於相移法、傅立葉轉換法或深度學習重建法。最後,執行步驟410,透過影像貼合方法將第一三維影像與第二三維影像進行影像對位,以重建樣品複合表面之完整三維影像與輪廓資訊。舉一實施例而言,影像貼合方法包括影像對位技術。 Next, step 406 is executed to perform numerical reconstruction of the sample through a digital hologram reconstruction method to obtain a first 3D image (including amplitude, phase and height) of the sample. In step 406, the first three-dimensional image (digital hologram) is transmitted to the computer, and a digital hologram reconstruction algorithm is established (written) through the programming software to perform numerical reconstruction of the sample. At this time, the amplitude image of the first three-dimensional image It will contain both object sample information and deformed fringe information. As an example, the digital hologram reconstruction method includes but not limited to Fourier transform method, convolution method, angular spectrum method, Fresnel diffraction approximation method or deep learning reconstruction method. Subsequently, step 408 is executed to perform numerical reconstruction of the sample through the fringe projection reconstruction method to obtain a second 3D image (including amplitude, phase and height) of the sample. In step 408, the amplitude image of the second 3D image is transmitted to the computer, and a fringe projection reconstruction algorithm is established (written) through the programming software for numerical reconstruction of the sample. As an example, fringe projection reconstruction (analysis) algorithms include but are not limited to phase shifting, Fourier transform or deep learning reconstruction. Finally, step 410 is executed to align the first 3D image and the second 3D image through an image bonding method, so as to reconstruct a complete 3D image and contour information of the composite surface of the sample. In one embodiment, the image bonding method includes image alignment technology.

上述樣品特性:複合表面材質(鏡射面、漫射面)、階高樣品。 The characteristics of the above samples: composite surface material (mirror surface, diffuse surface), high-level samples.

第五圖顯示根據本發明之一實施例之一量測物體三維複合表面輪廓之光學系統之示意圖。本實施例之光學系統包括一發射光源502、一光擴束器(Beam expander;BE)505、三個分光鏡(Beam Splitter)510、528與538、一投影單元512、一光偵測器陣列532(例如:感光耦合元件(Charge-coupled Device;CCD)、互補式金屬氧化物半導體(CMOS)影像感測器、光感測器(Photodetector))、四個透鏡(Lens)518、520、524與526、四個面鏡(Mirror)504、508、536與540、二個偏振片(Polarizer)506與530、快門534。發射光源502包括垂直共振腔面射型雷射(Vertical-Cavity Surface-Emitting Laser;VCSEL)、半導體雷射(Semiconductor laser)、固態雷射(Solid-state laser)、氣態雷射(Gas laser)、液體雷射(Dye laser)、光纖雷射(Fiber laser)或發光二極體(LED)。發射光源502之光源形式包括線光源、平面光源或球面光源。發射光源502之光源特性包括同調光源、低同調光源或非同調光源。上述四個面鏡504、508、536與540僅用於改變雷射光的光路徑。 FIG. 5 shows a schematic diagram of an optical system for measuring the three-dimensional composite surface profile of an object according to an embodiment of the present invention. The optical system of this embodiment includes an emission light source 502, a beam expander (Beam expander; BE) 505, three beam splitters (Beam Splitter) 510, 528 and 538, a projection unit 512, and a photodetector array 532 (for example: Charge-coupled Device (CCD), Complementary Metal Oxide Semiconductor (CMOS) image sensor, Photodetector), four lenses (Lens) 518, 520, 524 and 526 , four mirrors (Mirror) 504 , 508 , 536 and 540 , two polarizers (Polarizer) 506 and 530 , and a shutter 534 . The emitting light source 502 includes vertical-cavity surface-emitting laser (Vertical-Cavity Surface-Emitting Laser; VCSEL), semiconductor laser (Semiconductor laser), solid-state laser (Solid-state laser), gas laser (Gas laser), Liquid laser (Dye laser), fiber laser (Fiber laser) or light emitting diode (LED). The light source form of the emitting light source 502 includes a linear light source, a plane light source or a spherical light source. The light source characteristics of the emitting light source 502 include a coherent light source, a low coherent light source or a non-coherent light source. The above four mirrors 504, 508, 536 and 540 are only used to change the optical path of the laser light.

在本實施例之中,發射光源502採用波長為532nm(奈米)的半導體泵浦固體雷射(Diode-Pumped Solid-State Laser:DPSS Laser)。光學系統之光路經包含:二極體雷射502光源產生一個具有中心波長為532nm的雷射光,該雷 射光經過面鏡504反射之後先通過光擴束器505,將雷射光束擴束並校準直為平行光後,以產生一個擴束光;然後,光束經過偏振片506而產生偏振光,再經由面鏡508反射,透過一分光鏡510將光束分為物體光(Object beam)與參考光(Reference beam)兩道光束;其中物體光的光束經由投影單元(例如數位微鏡裝置:DMD)512以將全白影像514或者條紋分佈影像516進行投影。 In this embodiment, the emitting light source 502 adopts a diode-pumped solid-state laser (Diode-Pumped Solid-State Laser: DPSS Laser) with a wavelength of 532 nm (nanometer). The optical path of the optical system includes: a diode laser 502 light source generates a laser light with a central wavelength of 532nm, the laser After the incident light is reflected by the surface mirror 504, it first passes through the beam expander 505, expands the laser beam and collimates it into parallel light, so as to generate an expanded beam; then, the beam passes through the polarizer 506 to generate polarized light, and then passes through the Reflected by the surface mirror 508, the light beam is divided into two light beams by a beam splitter 510: object light (Object beam) and reference light (Reference beam); wherein the light beam of the object light passes through a projection unit (such as a digital micromirror device: DMD) A full white image 514 or a fringe distribution image 516 is projected.

在此光學系統中,數位全像術與條紋投影術的物體光光路相同,主要是透過數位微鏡裝置(DMD)512以調控振幅,其例如提供像素大小7.6×7.6μm2、像素數量684×608的影像以分別投影不同的電腦全像片(Computer-generated hologram:CGH)以用於數位全像術與條紋投影術的記錄與重建。光束經過DMD反射之後,此時光波帶有CGH的資訊並透過由透鏡518(焦距f=100mm)與透鏡520(焦距f=250mm)組成的成像放大系統,入射至樣品522,其入射角例如為22.5度,而在反射角一樣為22.5度的方向,再通過透鏡524(焦距f=200mm)與透鏡526(焦距f=200mm)組成的一比一成像系統,經由分光鏡528及偏振片530而於光偵測器陣列532成像;透過此成像系統將帶有物體波前的資訊成像至影像感測器上532之上,例如成像為像素大小5.2×5.2μm2、像素數量1280×1024的影像。 In this optical system, the optical path of the object light in digital holography and fringe projection is the same, mainly through the digital micromirror device (DMD) 512 to adjust the amplitude, which provides, for example, a pixel size of 7.6×7.6μm 2 and a number of pixels of 684× The images of 608 are respectively projected into different computer-generated holograms (CGH) for recording and reconstruction of digital holograms and fringe projections. After the light beam is reflected by the DMD, the light wave carries CGH information and passes through the imaging magnification system composed of the lens 518 (focal length f=100mm) and the lens 520 (focal length f=250mm), and enters the sample 522. The incident angle is, for example, 22.5 degrees, and in the same direction as the reflection angle of 22.5 degrees, then through the one-to-one imaging system composed of lens 524 (focal length f=200mm) and lens 526 (focal length f=200mm), through beam splitter 528 and polarizer 530 Imaging on the photodetector array 532; through this imaging system, the information with the wavefront of the object is imaged on the image sensor 532, for example, an image with a pixel size of 5.2×5.2μm 2 and a pixel number of 1280×1024 .

在上述光學系統中,當要進行樣品522的多次拍攝時,分成數位全像術與條紋投影術進行操作。於記錄數位全像術的過程中,透過DMD 512以投影全白的CGH與打開位於參考光位置的快門534而使參考光通過,參考光經過面鏡536的反射、分光鏡538的拉光程與分光鏡528的反射之後,物體光再與參考光產生干涉並透過影像感測器記錄干涉條紋資訊。之後將干涉條紋影像資訊傳輸至電腦,再透過數位全像重建演算法(例如:角頻譜法),以重建獲得樣品522的三維影像(包含振幅、相位與高度)。另外,於記錄條紋投影術的過程中,DMD 512投影透過程式軟體產生的弦波條紋影像,並關閉位於參考光位置的快門534,透過影像感測器記錄形變條紋影像,再透過程式軟體撰寫條紋投影重建演算法(例如:傅立葉轉換法),以重建獲得樣品522的三維影像(包含振幅、相位與高度)。 In the above optical system, when multiple shots of the sample 522 are to be taken, operations are divided into digital holography and fringe projection. In the process of recording the digital hologram, through the DMD 512 to project the all-white CGH and open the shutter 534 located at the position of the reference light to let the reference light pass through, the reference light is reflected by the mirror 536, and the light path of the beam splitter 538 is pulled After being reflected by the beam splitter 528 , the object light interferes with the reference light and passes through the image sensor to record the interference fringe information. Afterwards, the interference fringe image information is transmitted to a computer, and then a three-dimensional image (including amplitude, phase, and height) of the sample 522 is reconstructed through a digital hologram reconstruction algorithm (eg, angle spectrum method). In addition, in the process of recording fringe projection, DMD 512 projects the sinusoidal fringe image generated through the program software, and closes the shutter 534 at the position of the reference light, records the deformed fringe image through the image sensor, and then composes the fringe through the program software A projection reconstruction algorithm (for example: Fourier transform method) is used to reconstruct and obtain a three-dimensional image (including amplitude, phase and height) of the sample 522 .

在上述光學系統中,當要進行樣品522的單次拍攝時,將同時進行數位全像術與條紋投影術的記錄與重建。此時DMD 512投影透過程式軟體產生的弦波條紋影像,並打開位於參考光位置的快門534而使參考光通過,則含有形變條紋資訊的物體光與參考光將產生干涉,並透過影像感測器以記錄干涉條紋資訊;之後將干涉條紋影像資訊傳輸至電腦,透過數位全像重建演算法(例如:角頻譜法),以重建獲得樣品522的三維影像(包含振幅、相位與高度)。其中,振幅影像將同時含有物體樣品522資訊與形變條紋資訊,再將此振幅影像透過程式軟體所撰寫的條紋投影重建演算法(傅立葉轉換法),以進行樣本的數值重建,最終重建以獲得樣品522的三維影像(包含振幅、相位與高度)。 In the above optical system, when a single shot of the sample 522 is to be taken, the recording and reconstruction of digital holography and fringe projection will be performed simultaneously. At this time, the DMD 512 projects the sinusoidal fringe image generated by the program software, and opens the shutter 534 located at the position of the reference light to allow the reference light to pass through, then the object light containing the information of the deformed fringe will interfere with the reference light and pass through the image sensor The device is used to record the interference fringe information; then the interference fringe image information is transmitted to the computer, and the three-dimensional image (including amplitude, phase, and height) of the sample 522 is reconstructed through a digital hologram reconstruction algorithm (eg, angle spectrum method). Among them, the amplitude image will contain both the object sample 522 information and the deformation fringe information, and then the amplitude image will be passed through the fringe projection reconstruction algorithm (Fourier transform method) written by the programming software to perform numerical reconstruction of the sample, and finally reconstruct the sample 522 3D image (including amplitude, phase and height).

綜合上述,本發明之特徵與優點包括: In summary, the features and advantages of the present invention include:

(1)本發明提出利用數位全像術結合條紋投影技術,可量測與重建複合表面物體,並提出僅使用一次拍攝之方式,透過數位全像術取得物體之波前複數資訊。 (1) The present invention proposes to use digital holography combined with fringe projection technology to measure and reconstruct composite surface objects, and proposes to use only one shot to obtain complex wavefront information of objects through digital holography.

(2)本發明分別利用相位重建鏡射面之物體三维輪廓與利用振幅透過條紋投影技術重建漫射面之物體三維輪廓,再透過影像對位技術將鏡射面與漫射面之物體三維輪廓進行重組,以達到全場複合表面物體三維輪廓成像與量測。 (2) The present invention uses the phase to reconstruct the three-dimensional outline of the object on the mirror surface and uses the amplitude to reconstruct the three-dimensional outline of the object on the diffuse surface through fringe projection technology, and then uses the image alignment technology to reconstruct the three-dimensional outline of the object on the mirror surface and the diffuse surface Recombination is carried out to achieve 3D contour imaging and measurement of full-field composite surface objects.

(3)本發明所提供之方法可透過光學非破壞性方式即時獲得複合物體表面三維輪廓分佈,並得以量化分析方法具體呈現物體三维表面輪廓。 (3) The method provided by the present invention can obtain the three-dimensional profile distribution of the surface of the composite object in real time through an optical non-destructive method, and can specifically present the three-dimensional surface profile of the object by a quantitative analysis method.

(4)本發明所提供之方法可同時量測具有鏡射面與漫射面之複合表面物體。 (4) The method provided by the present invention can simultaneously measure composite surface objects with specular surfaces and diffuse surfaces.

(5)為了能達到大面積而高傳真度的量測目的,本發明之數位全像波前記錄與重建單元係結合波前記錄與重建,以提升光學系統中光偵測器陣列之等效解析度以達成廣視野(wide-field)高解析成像效果。 (5) In order to achieve large-area and high-fidelity measurement purposes, the digital hologram wavefront recording and reconstruction unit of the present invention combines wavefront recording and reconstruction to improve the equivalent of the photodetector array in the optical system resolution to achieve wide-field high-resolution imaging.

(6)經實驗結果驗證,本發明配合上述數位全像、條紋影像的波前記錄與重建方法與裝置所取得的高傳真影像,可以準確地達成複合表面物體的影像之量測目的。 (6) As verified by the experimental results, the present invention can accurately achieve the purpose of measuring the image of composite surface objects with the high-fidelity image obtained by the above-mentioned digital hologram and fringe image wavefront recording and reconstruction method and device.

除描述於此之外,可藉由敘述於本發明中之實施例及實施方式所達成之不同改良方式,皆應涵蓋於本發明之範疇中。因此,揭露於此之圖式及 範例皆用以說明而非用以限制本發明,本發明之保護範疇僅應以列於其後之申請專利範圍為主。 In addition to those described here, various improvements that can be achieved through the examples and implementations described in the present invention should be included in the scope of the present invention. Therefore, the schema and The examples are all used to illustrate rather than limit the present invention, and the scope of protection of the present invention should only be based on the scope of patent applications listed thereafter.

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204:步驟 204: step

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Claims (10)

一種量測物體三維複合表面輪廓之方法,包括: A method for measuring the three-dimensional composite surface profile of an object, comprising: 透過至少一組投影單元,以投影至少一組影像至一樣品; Projecting at least one set of images onto a sample through at least one set of projection units; 透過一影像存取單元,以記錄該樣品之反射光; through an image access unit to record the reflected light of the sample; 透過一數位全像重建該樣品之鏡射表面的反射光波前及其表面三維輪廓資訊; Reconstructing the reflected light wavefront of the specular surface of the sample and its surface three-dimensional profile information through a digital hologram; 透過一條紋投影分析以重建該樣品之漫射表面的相位影像及其表面三維輪廓資訊;以及 Reconstructing the phase image of the diffuse surface of the sample and its surface three-dimensional profile information through a fringe projection analysis; and 透過一影像貼合將該鏡射表面與該漫射表面之三維影像進行影像對位,以重建該樣品複合表面之完整三維影像與輪廓資訊。 Image alignment of the specular surface and the 3D image of the diffuse surface is carried out through image lamination, so as to reconstruct the complete 3D image and contour information of the composite surface of the sample. 如請求項1所述之量測物體三維複合表面輪廓之方法,更包含於該條紋投影分析步驟中,透過數位全像以重建該樣品鏡射表面反射波前,並重建該樣品之漫射表面的相位影像及其表面三維輪廓資訊。 The method for measuring the three-dimensional composite surface profile of an object as described in claim 1 further includes, in the fringe projection analysis step, reconstructing the reflected wavefront of the specular surface of the sample through the digital hologram, and reconstructing the diffuse surface of the sample The phase image and its surface three-dimensional profile information. 如請求項1所述之量測物體三維複合表面輪廓之方法,其中該數位全像重建方法,包括傅立葉轉換法、摺積法、角頻譜法、菲涅耳繞射近似法或深度學習重建法。 The method for measuring the three-dimensional composite surface profile of an object as described in Claim 1, wherein the digital hologram reconstruction method includes Fourier transform method, convolution method, angular spectrum method, Fresnel diffraction approximation method or deep learning reconstruction method . 如請求項1所述之量測物體三維複合表面輪廓之方法,其中該條紋投影分析方法包含相移法、傅立葉轉換法或深度學習重建法。 The method for measuring the three-dimensional composite surface profile of an object as described in Claim 1, wherein the fringe projection analysis method includes phase shift method, Fourier transform method or deep learning reconstruction method. 一種量測物體三維複合表面輪廓之方法,包括: A method for measuring the three-dimensional composite surface profile of an object, comprising: 透過一投影單元,以將無條紋資訊光波入射至一樣品; Through a projection unit, the fringe-free information light wave is incident on a sample; 打開一開關,透過一影像存取單元,以記錄從該樣品反射之物體光波與參考光波的干涉影像; Turn on a switch to record the interference image of the object light wave reflected from the sample and the reference light wave through an image access unit; 透過一數位全像重建進行該樣品的數值重建,獲得該樣品的第一三維影像; performing numerical reconstruction of the sample through a digital hologram reconstruction to obtain a first three-dimensional image of the sample; 透過該投影單元,以將條紋資訊光波入射至該樣品; Through the projection unit, the fringe information light wave is incident on the sample; 關閉該開關,透過該影像存取單元,以記錄從該樣品反射之形變條紋的影像; closing the switch, and recording the image of the deformed fringes reflected from the sample through the image access unit; 透過一條紋投影重建進行該樣品的數值重建,而獲得該樣品的第二三維影像;以及 obtaining a second 3D image of the sample by numerically reconstructing the sample through a fringe projection reconstruction; and 透過一影像貼合將該第一三維影像與該第二三維影像進行影像對位,以重建該樣品複合表面之完整三維影像與輪廓資訊。 The first three-dimensional image and the second three-dimensional image are image-aligned through an image lamination, so as to reconstruct the complete three-dimensional image and contour information of the composite surface of the sample. 如請求項5所述之量測物體三維複合表面輪廓之方法,其中該投影單元包括投影機、空間光調制器、電控光反射鏡、液晶微型顯示器、光柵或數位微鏡裝置。 The method for measuring the three-dimensional composite surface profile of an object as described in Claim 5, wherein the projection unit includes a projector, a spatial light modulator, an electrically controlled optical mirror, a liquid crystal microdisplay, a grating or a digital micromirror device. 如請求項5所述之量測物體三維複合表面輪廓之方法,其中該數位全像重建方法,包括傅立葉轉換法、摺積法、角頻譜法、菲涅耳繞射近似法或深度學習重建法。 The method for measuring the three-dimensional composite surface profile of an object as described in Claim 5, wherein the digital hologram reconstruction method includes Fourier transform method, convolution method, angular spectrum method, Fresnel diffraction approximation method or deep learning reconstruction method . 如請求項5所述之量測物體三維複合表面輪廓之方法,其中該條紋投影分析方法包含相移法、傅立葉轉換法或深度學習重建法。 The method for measuring the three-dimensional composite surface profile of an object as described in Claim 5, wherein the fringe projection analysis method includes phase shift method, Fourier transform method or deep learning reconstruction method. 一種量測物體三維複合表面輪廓之方法,包括: A method for measuring the three-dimensional composite surface profile of an object, comprising: 透過一投影單元,以將條紋資訊光波入射至一樣品; Through a projection unit, the fringe information light wave is incident to a sample; 打開一開關,透過一影像存取單元,以記錄從該樣品反射之帶有條紋資訊的物體光波與參考光波的干涉影像; Turn on a switch to record the interference image of the object light wave with fringe information reflected from the sample and the reference light wave through an image access unit; 透過一數位全像重建進行該樣品的數值重建,而獲得該樣品的第一三維影像; obtaining a first three-dimensional image of the sample by numerically reconstructing the sample through a digital hologram reconstruction; 透過一條紋投影重建進行該樣品的數值重建,而獲得該樣品的第二三維影像;以及 obtaining a second 3D image of the sample by numerically reconstructing the sample through a fringe projection reconstruction; and 透過一影像貼合將該第一三維影像與該第二三維影像進行影像對位,以重建該樣品複合表面之完整三維影像與輪廓資訊。 The first three-dimensional image and the second three-dimensional image are image-aligned through an image lamination, so as to reconstruct the complete three-dimensional image and contour information of the composite surface of the sample. 如請求項9所述之量測物體三維複合表面輪廓之方法,其中該數位全像重建 方法,包括傅立葉轉換法、摺積法、角頻譜法、菲涅耳繞射近似法或深度學習重建法;該條紋投影分析方法包含相移法、傅立葉轉換法或深度學習重建法。 The method for measuring the three-dimensional composite surface profile of an object as described in Claim 9, wherein the digital hologram is reconstructed Methods, including Fourier transform method, convolution method, angular spectrum method, Fresnel diffraction approximation method or deep learning reconstruction method; the fringe projection analysis method includes phase shift method, Fourier transform method or deep learning reconstruction method.
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