TW202320922A - Integrated circuit component disassembling device - Google Patents

Abstract

The present invention relates to an integrated circuit(IC) component disassembling device, and is used to disassemble an IC body from a carrier plate of an IC component. The IC component disassembling device comprises a machine body, a movable pushing element, and a cutting assembly. The machine body has at least one guiding groove. The cutting assembly is mounted in the machine body. While the IC component is pushed by the pushing element to progressively move in the guiding groove, the IC body and the carrier plate are bent by sidewalls of the guiding groove to be separated from each other. During the movement, a blade portion of the cutting assembly separates the IC body from the carrier plate. The IC component disassembling device not only reduces the labor cost, but also indeed separates the IC body and the carrier plate, therefore raising the efficiency of separating the IC body and the carrier plate. As a result, the IC component disassembling device facilitates the different recycling processes of precious metals against the carrier plate and the IC body and raises the total recycling rate of precious metals.

Description

Dismantling device for integrated circuit components

The invention is a device for dismantling integrated circuit components, especially an integrated circuit component dismantling device for separating the carrier board of integrated circuit components from the body of the integrated circuit.

With the evolution of science and technology, electronic products can be seen everywhere in daily life, and under the demand and development of technology, major electronics manufacturers continue to develop and launch new products, resulting in a significant shortening of the product cycle of electronic products, and the replacement of electronic products. The speed of products is getting faster and faster. A large amount of electronic waste has caused serious pollution to the environment and insufficient landfill space. Moreover, circuit boards, integrated circuit components and other electronic components in electronic waste today contain a large amount of precious metals. Recycling The methods can be divided into wet method and fire method. When using the fire method to treat electronic waste, the cost of equipment construction is high, and it will cause the fusion of precious metals in the circuit boards, integrated circuit components and other electronic components with impurities in the components. , making the separation and refining of precious metals more difficult. In addition, if the waste gas generated in the pyroprocessing process is not properly treated, it will also cause air pollution. The difference is large, and it is often accompanied by the pollution of a large amount of acid waste liquid.

Therefore, before recycling precious metals, today's recycling manufacturers will first carry out pre-treatment of electronic waste, including mechanical scraping or manual separation to separate the circuit board from the integrated circuit components and electronic components on the circuit board. Separate treatment to improve the efficiency of precious metal recovery.

For the recycling and processing of integrated circuit components, the integrated circuit components are mainly provided with an integrated circuit body on a carrier board. When disassembling the integrated circuit components, the recycler will manually use The scraper directly removes the integrated circuit body on the carrier board, so that the carrier board is separated from the integrated circuit body, so as to facilitate the subsequent sorting operation of the carrier board and the integrated circuit body.

However, the method of manually detaching the integrated circuit body and the carrier board of the integrated circuit element not only requires a high labor cost, but also the chips inside the integrated circuit body of some integrated circuit elements are mainly connected by wire bonding technology. Connect the contact points of the carrier board, and cover the chip and the contact points of the chip wire bonding connection carrier board by encapsulating the encapsulation material. When the contact range between the chip and the carrier board is larger, the The bonding area between the packaging adhesive of the integrated circuit body and the carrier board will also increase, and the stronger the bonding force between the integrated circuit body and the carrier board, if it is directly removed by a scraper, the integrated circuit body will be damaged. The body may be cracked or fractured and remain on the carrier plate, which affects the recovery efficiency of subsequent precious metals.

The main purpose of this creation is to provide a dismantling device for integrated circuit components, hoping to improve the current manual disassembly of the carrier board of integrated circuit components and the body of the integrated circuit, which not only requires high labor costs, but also And it is easy to have the problem that the integrated circuit body is cracked or broken and remains on the carrier board.

In order to achieve the purpose of the previous disclosure, the integrated circuit component dismantling device of the present invention can be used to separate the carrier board and the integrated circuit body of an integrated circuit component. The integrated circuit component dismantling device includes: A machine body, which defines a component pushing direction, and the machine body forms a guide channel, and the machine body forms at least one guide groove on two opposite side walls of the guide channel, the guide The groove has a guiding section and a bending section connected to each other, and a bending angle is formed between the extending line of the guiding section along the component pushing direction and the bending section, and the bending angle of the two opposite guiding grooves is Similarly, both sides of the carrier board of the integrated circuit element can extend into the guide grooves on both sides of the guide channel; A push piece, which is movably arranged on the machine body, the push piece can push the integrated circuit element from the guide section into the curved section, so that the integrated circuit element The carrier plate is flexibly deformed, and a gap is generated between the integrated circuit body; and A knife set, which is arranged on the machine body and has a blade, the blade of the knife set is in the guide channel, and the blade is parallel to the component pushing direction and extends to the two guide grooves The junction of the guide section and the curved section, the blade of the cutter set can extend into the gap between the carrier board of the integrated circuit element and the integrated circuit body and separate the carrier board with the integrated circuit body.

The inventive dismantling device for integrated circuit components is used to separate the carrier board and the integrated circuit body of the integrated circuit components. Among them, the inventive dismantling device for integrated circuit components has the following advantages: 1. Reduce labor costs and improve work efficiency: When operating the integrated circuit component dismantling device of this invention, it is only necessary to insert the two side edges of the carrier board of the integrated circuit component to be disassembled into the guide groove, and pass through the Operate the pushing member to push the integrated circuit element, so that the carrier board of the integrated circuit element can be guided by the guiding section when passing through the junction of the guiding section and the bending section of the guiding groove. The groove wall of the groove is bent due to stress, and the integrated circuit body that is not affected by the groove wall of the guiding groove will partially break away from the carrier board and form a gap, and when the pushing member continues to push the integrated circuit element, the The blade portion of the cutter set will protrude into the gap between the carrier board and the integrated circuit body, and the cutter group will assist in peeling off the integrated circuit and the carrier board, thus greatly reducing the Reduce labor costs and improve work efficiency. 2. Improve the separation efficiency of the carrier board and the integrated circuit body: the dismantling device for integrated circuit components created in this invention can push the carrier board through the pushing member, and make the carrier board bend gradually according to the guide groove In this way, the integrated circuit body of the integrated circuit element can be gradually detached from the carrier board from the edge, and the blade of the cutter set can be used to assist the stripping, so that the integrated circuit body is not easy to be damaged during the stripping process. The problem of fracture or damage and remaining on the carrier board, and then improve the separation efficiency of the carrier board and the integrated circuit body of the integrated circuit element, so as to facilitate the subsequent recovery of different precious metals for the carrier board and the integrated circuit body, Improve overall recovery of precious metals.

Please refer to Fig. 1 to Fig. 3, it is the first kind of preferred embodiment of the integrated circuit element dismantling device of this invention, it can be used for separating the carrier plate 51 and the integrated circuit body 52 of an integrated circuit element 50, the said The dismantling device for integrated circuit components includes a machine body 10 , a pushing member 20 and a cutter set 30 .

As shown in Figures 1 to 3, the machine body 10 defines a component pushing direction, and the machine body 10 is formed with a guide channel 11, and the machine body 10 is on two opposite side walls of the guide channel 11 At least one guide groove 12 is respectively formed, and the guide groove 12 has a guide segment 121 and a curved segment 122 connected to each other, and the guide segment 121 extends along the extension line of the component pushing direction and the curved segment A bending angle θ is formed between 122, and the bending angle θ of the two opposite guide grooves 12 is the same, and the two sides of the carrier plate 51 of the integrated circuit element 50 can extend into the guide grooves on both sides of the guiding channel 11 within 12.

Wherein, as shown in FIG. 3 , a rounded section 123 is formed at the joint between the guide section 121 and the curved section 122, and the bending angle θ represents: θ=(2×π×r/L)×360° , and 30°≥θ≥15°, where r is the radius of curvature of the fillet segment 123 , and L is the side length of the carrier 51 of the integrated circuit element 50 .

As shown in Fig. 1, Fig. 2, Fig. 6 to Fig. 9, the pushing member 20 is movably arranged on the machine body 10, and the pushing member 20 can move the integrated circuit element 50 from the The guiding section 121 is pushed into the bending section 122 , so that the carrier board 51 of the integrated circuit element 50 is flexibly deformed, and a gap is created between the integrated circuit body 52 and the integrated circuit body 52 .

The pushing member 20 can be pushed manually; or, as shown in Fig. 2, Fig. 6 to Fig. 9, the integrated circuit element disassembly device can further include a driving mechanism 40, and the driving mechanism 40 It is located above the machine body 10 and connected to the pushing member 20. The driving mechanism 40 can drive the pushing member 20 to move linearly along the component pushing direction, wherein the driving mechanism 40 can adopt such as a motor, Cam transmission group, hydraulic cylinder, pneumatic cylinder, spring or other mechanisms that can generate thrust in the direction of the track.

As shown in Fig. 1, Fig. 2, Fig. 6 to Fig. 9, the cutter set 30 is arranged on the machine body 10 and has a blade portion 31, and the blade portion 31 of the cutter set 30 is located in the guide channel 11. Among them, the blade portion 31 is parallel to the pushing direction of the component and stretches toward the junction of the guide section 121 and the curved section 122 of the two guide grooves 12, and the blade portion 31 of the knife set 30 can extend into the gap between the carrier board 51 of the integrated circuit element 50 and the integrated circuit body 52 and separate the carrier board 51 from the integrated circuit body 52 .

As shown in Figures 1 and 2, the cutter set 30 includes an adjustment member 32 and a knife plate 33. The end portion of the adjustment member 32, and the blade portion 31 is formed on the end edge of the knife plate 33 and extends to the junction of the guide section 121 and the curved section 122 of the two guide grooves 12, the The adjusting member 32 can adjust the distance between the blade portion 31 of the knife plate 33 and the curved section 122 of the guiding groove 12 .

In addition, as shown in FIG. 4 and FIG. 5 , the blade portion 31 of the cutter set 30 can be further formed with a notch 34a, 34b, and the notch 34a, 34b can be a U-shaped notch 34a or a trapezoidal The notch 34b.

As shown in Fig. 6 to Fig. 9, the integrated circuit element dismantling device of the present invention is used to decompose the integrated circuit element 50, separate the carrier plate 51 and the integrated circuit body 52 of the integrated circuit element 50, and separate and collect , wherein, as shown in Fig. 6 and Fig. 7, when performing the disassembly operation of the integrated circuit element 50, the operator can put the two side edges of the carrier plate 51 of the integrated circuit element 50 to be disassembled into the guide groove within 12.

Next, as shown in FIG. 6 and FIG. 8 , by operating the pushing member 20 , the pushing member 20 drives the integrated circuit component 50 to move along the component pushing direction and enter the guiding channel 11 , The two side edges of the carrier board 51 of the integrated circuit element 50 will pass through the rounded corner section 123 from the guide section 121 of the guide groove 12 and enter the curved section 122 in sequence. At this time, as shown in Fig. 8 and Fig. 9 As shown, the side wall of the guide groove 12 will exert stress on the carrier board 51 and make the carrier board 51 bend along the angle between the rounded section 123 and the curved section 122 without being affected by the guide groove. The integrated circuit body 52 affected by the groove wall of 12 will be partially detached from the carrier plate 51, so that a gap is formed between the integrated circuit body 52 and the carrier plate 51. When the pushing member 20 continues to push the carrier plate 51 , the blade portion 31 of the cutter set 30 will protrude into the gap between the integrated circuit body 52 and the carrier plate 51, thereby assisting in peeling off the integrated circuit body 52, so that the integrated circuit The main body 52 is indeed separated from the carrier board 51 , so as to facilitate the subsequent sorting operation of the carrier board 51 and the integrated circuit main body 52 .

Wherein, in the process of dismantling the integrated circuit element 50 by the integrated circuit element dismantling device of the present invention, it is only necessary to push the integrated circuit element 50 to be dismantled by operating the pushing member 20, so that all The dismantling of the integrated circuit element 50 through the guide groove 12 and the cutter set 30 in sequence can effectively reduce the cost of manpower operation and improve the working efficiency at the same time.

In addition, as shown in FIGS. 6 to 9 , the device for dismantling integrated circuit components of the present invention can push the carrier plate 51 through the pushing member 20 , and make the carrier plate 51 bend gradually according to the guide groove 12 In this way, the integrated circuit body 52 of the integrated circuit element 50 can be gradually detached from the carrier plate 51 from the edge, and the blade 31 of the cutter set 30 can be used to assist the peeling, so that the integrated circuit body can be 52 is less likely to be broken or damaged during the peeling process and remains on the carrier 51, thereby improving the separation efficiency of the carrier 51 and the integrated circuit body 52 of the integrated circuit element 50, so as to facilitate subsequent targeting of the carrier 51 and the integrated circuit body 52 perform different precious metal recovery processes to increase the total recovery rate of precious metals.

Moreover, as shown in Fig. 4 and Fig. 5, the blade portion 31 of the cutter set 30 can be provided with notches 34a, 34b, so that the integrated circuit body 52 and the carrier board can be inserted into the blade portion 31. When there is a gap between 51, the notches 34a, 34b of the blade 31 can avoid the position where the integrated circuit board body and the center of the carrier board 51 have a stronger bonding force, so that the two side edges of the blade 31 It can first penetrate and peel off the parts with lower adhesive force on both sides of the integrated circuit body 52 and the carrier plate 51, which can effectively increase the force application area between the blade portion 31 and the integrated circuit body 52, so as to It is avoided that the blade portion 31 directly protrudes into a position with a stronger adhesive force when the force application area is insufficient, causing the integrated circuit body 52 to break.

As shown in FIG. 2 , the operator can further adjust the position of the adjustment member 32 of the knife set 30 according to the size of the integrated circuit element 50 to be disassembled, thereby adjusting the blade portion 31 of the knife plate 33 and The relative position of the guide groove 12.

As shown in Figure 2, in the preferred embodiment of the device for dismantling integrated circuit components of the present invention, the machine body 10 can form a plurality of guide grooves on the opposite side walls of the guide channel 11 12. The bending angle θ of two opposite guide grooves 12 is the same, and the bending angle θ of two adjacent guide grooves 12 is different. By setting a plurality of guide grooves 12 with different bending angles θ, the present Create an integrated circuit component dismantling device that can use different guide grooves 12 to perform dismantling operations according to the size and specification of the integrated circuit component 50 to be disassembled.

In addition, as shown in FIG. 1 and FIG. 2, the machine body 10 can further include a base 101 and two guide blocks 102, and the tool set 30 and the pushing member 20 are arranged on the base 101 , the two guide blocks 102 are detachably arranged on the base 101 at intervals, the guide channel 11 is formed between the two guide blocks 102, and passes through the base 101, the two guides A plurality of said guide grooves 12 are respectively formed on opposite sides of the guide block 102, and the bending angle θ of the opposite guide grooves 12 on the inner sides of the two guide blocks 102 is the same, and the relative inner sides of the two guide blocks 102 The bending angles θ of the two adjacent guide grooves 12 are different, and the bending angles θ of the guide grooves 12 corresponding to the outer sides of the two guide blocks 102 are the same. The bending angle θ of the guide grooves 12 is different, and the operator can disassemble the integrated circuit element by replacing the two guide blocks 102 or exchanging the setting positions of the two guide blocks 102. It is suitable for dismantling integrated circuit components 50 of various sizes and specifications, thereby improving the scope of application of the integrated circuit component dismantling device.

In summary, the integrated circuit element 50 of the present invention can cooperate with the structural design of the cutter set 30 through the guide groove 12, and cooperate with the pushing member 20 to push the integrated circuit element 50 to be disassembled, so that all The above-mentioned integrated circuit element 50 is disassembled sequentially through the guide groove 12 and the tool set 30 under the push of the pushing member 20, which can effectively reduce the cost of manpower operation and improve work efficiency at the same time. In addition, the integrated circuit element of this invention When the pushing member 20 of the circuit element 50 pushes the integrated circuit element 50, the carrier plate 51 and the integrated circuit body 52 of the integrated circuit element 50 will be gradually bent and separated under the guidance of the groove wall of the guide groove 12, and With the assistance of the blade portion 31 of the cutter set 30 for stripping, the integrated circuit body 52 can be separated from the carrier board 51, thereby improving the separation between the carrier board 51 and the integrated circuit body 52 of the integrated circuit element 50 Efficiency, so as to facilitate the follow-up to carry out different precious metal recovery processes for the carrier board 51 and the integrated circuit body 52, and improve the total recovery rate of precious metals.

10: Machine body 101: base 102: guide block 11: Guidance channel 12: Guide groove 121: Guidance section 122: Bending section 123: fillet segment 20: push piece 30: Tool set 31: Blade 32: Adjustment parts 33: Knife board 34a, 34b: Notches 40: Driving mechanism 50: Integrated circuit components 51: carrier board 52: Integrated circuit body θ: bending angle

Figure 1: A schematic diagram of the three-dimensional appearance of the device for dismantling integrated circuit components of this invention. Figure 2: A schematic side view of the device for dismantling integrated circuit components of this invention. Figure 3: Schematic diagram of the guide groove of the machine body of the integrated circuit component dismantling device of this invention. Figure 4: A schematic diagram of the U-shaped notches formed on the blades of the cutter set of the integrated circuit component dismantling device of this invention. Figure 5: Schematic diagram of trapezoidal notches formed on the cutting edge of the cutting tool set of the integrated circuit component dismantling device of this invention. Fig. 6: It is a schematic side view sectional view of the device for dismantling the integrated circuit components of the present invention. Fig. 7: It is a schematic cross-sectional top view of the integrated circuit element inserted in the integrated circuit element dismantling device of the present invention. Figure 8: Schematic diagram of the dismantling operation of integrated circuit components of the integrated circuit component dismantling device of this invention (1). Figure 9: Schematic diagram of the dismantling operation of integrated circuit components for the integrated circuit component dismantling device of this invention (2).

10: Machine body

101: base

102: guide block

11: Guidance channel

12: Guide groove

121: Guidance section

122: Bending section

123: fillet segment

20: push piece

30: Tool set

31: Blade

32: Adjustment parts

33: Knife board

Claims (9)

An integrated circuit component dismantling device, which can be used to separate a carrier board of an integrated circuit component from the integrated circuit body, the integrated circuit component dismantling device includes: A machine body, which defines a component pushing direction, and the machine body forms a guide channel, and the machine body forms at least one guide groove on two opposite side walls of the guide channel, the guide The groove has a guiding section and a bending section connected to each other, and a bending angle is formed between the extending line of the guiding section along the component pushing direction and the bending section, and the bending angle of the two opposite guiding grooves is Similarly, both sides of the carrier board of the integrated circuit element can extend into the guide grooves on both sides of the guide channel; A push piece, which is movably arranged on the machine body, the push piece can push the integrated circuit element from the guide section into the curved section, so that the integrated circuit element The carrier plate is flexibly deformed, and a gap is generated between the integrated circuit body; and A knife set, which is arranged on the machine body and has a blade, the blade of the knife set is in the guide channel, and the blade is parallel to the component pushing direction and extends to the two guide grooves The junction of the guide section and the curved section, the blade of the cutter set can extend into the gap between the carrier board of the integrated circuit element and the integrated circuit body and separate the carrier board with the integrated circuit body. The device for dismantling integrated circuit components as described in Claim 1, wherein the machine body can form a plurality of guide grooves on the opposite side walls of the guide channel, and the bending of the two opposite guide grooves The angles are the same, and the bending angles of two adjacent guide grooves are different. The device for dismantling integrated circuit components as described in claim 1, wherein the machine body includes a base and two guide blocks, the cutter set and the pushing member are arranged on the base, and the two The guide blocks are detachably arranged on the base at intervals, the guide channel is formed between the two guide blocks, and passes through the base, and the two opposite sides of the two guide blocks are respectively formed For a plurality of guide grooves, the bending angles of the opposite guide grooves on the inner sides of the two guide blocks are the same, and the bending angles of the two adjacent guide grooves on the inner sides of the two guide blocks are different, and The opposite outer sides of the two guide blocks and the corresponding guide slots have the same bending angle, and the two adjacent guide slots on the outer side of the two guide blocks have different bending angles. The device for dismantling integrated circuit components according to any one of Claims 1 to 3, wherein the connection between the guiding section and the bending section forms a rounded section, and the bending angle θ is expressed as follows:

,and

In the above formula, r is the radius of curvature of the fillet section, and L is the side length of the carrier board of the integrated circuit element. The integrated circuit component dismantling device as described in any one of claims 1 to 3, wherein the integrated circuit component dismantling device includes a driving mechanism, the driving mechanism is located above the machine body and connected to the pusher The abutting member, the drive mechanism can drive the abutting member to move linearly along the pushing direction of the component. The integrated circuit component dismantling device as described in claim 4, wherein the integrated circuit component dismantling device includes a driving mechanism, the driving mechanism is located above the machine body and connected to the pushing member, the driving mechanism The mechanism can drive the pushing member to move linearly along the component pushing direction. The integrated circuit component dismantling device as described in any one of claims 1 to 3, wherein the tool set includes an adjustment piece and a knife plate, and the adjustment piece is arranged on the machine body so that its position can be adjusted, so The knife plate is arranged at the end of the adjustment member, and the blade is formed on the end edge of the knife plate and extends to the junction of the guide section of the two guide grooves and the curved section, so The adjustment member can adjust the distance between the blade portion of the knife plate and the curved section of the guide groove. The device for dismantling integrated circuit components according to claim 7, wherein the cutting edge of the cutter set forms a U-shaped notch. The device for dismantling integrated circuit components according to claim 7, wherein the cutting edge of the tool set forms a trapezoidal notch.

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