TW202315726A - Component abnormality monitoring method, electronic equipment, and storage medium - Google Patents

Component abnormality monitoring method, electronic equipment, and storage medium Download PDF

Info

Publication number
TW202315726A
TW202315726A TW110139385A TW110139385A TW202315726A TW 202315726 A TW202315726 A TW 202315726A TW 110139385 A TW110139385 A TW 110139385A TW 110139385 A TW110139385 A TW 110139385A TW 202315726 A TW202315726 A TW 202315726A
Authority
TW
Taiwan
Prior art keywords
data
components
principal
monitoring result
principal components
Prior art date
Application number
TW110139385A
Other languages
Chinese (zh)
Other versions
TWI795048B (en
Inventor
徐鵬
馬晨陽
蔣抱陽
徐曉芝
Original Assignee
大陸商深圳富桂精密工業有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大陸商深圳富桂精密工業有限公司 filed Critical 大陸商深圳富桂精密工業有限公司
Application granted granted Critical
Publication of TWI795048B publication Critical patent/TWI795048B/en
Publication of TW202315726A publication Critical patent/TW202315726A/en

Links

Images

Landscapes

  • Testing And Monitoring For Control Systems (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)

Abstract

The present application provides a component abnormality monitoring method, electronic equipment, and a storage medium. The component abnormality monitoring method includes: acquiring data to be tested of a component; extracting characteristic data from the data to be tested; performing a principal component analysis on the characteristic data to obtain statistics; monitoring whether the component is abnormal according to the statistics and a preset standard value interval. By utilizing this application, the accuracy and efficiency of component abnormality monitoring can be improved.

Description

元器件的異常監測方法、電子設備及儲存介質Abnormality monitoring method of components, electronic equipment and storage medium

本發明涉及資料分析領域,尤其涉及一種元器件的異常監測方法、電子設備及儲存介質。The invention relates to the field of data analysis, in particular to an abnormality monitoring method for components, electronic equipment and a storage medium.

目前,由於生產過程中的機械臂運行狀態不可見,當所述機械臂出現故障問題或即將出現故障問題時,相關人員無法及時的發現故障問題,從而導致故障維修不及時,嚴重影響生產效率和生產品質。At present, due to the invisible running state of the mechanical arm in the production process, when the mechanical arm fails or is about to fail, the relevant personnel cannot find the failure in time, resulting in untimely maintenance of the failure, which seriously affects production efficiency and Production quality.

鑒於以上內容,有必要提供一種元器件的異常監測方法、電子設備及儲存介質,能提高元器件異常監測的準確率和效率,從而提高生產效率。In view of the above, it is necessary to provide a component abnormality monitoring method, electronic equipment and storage medium, which can improve the accuracy and efficiency of component abnormality monitoring, thereby improving production efficiency.

本申請提供一種元器件的異常監測方法,所述方法包括:獲取元器件的待測資料;從所述待測資料中提取特徵資料;對所述特徵資料進行主成分分析,得到統計量;根據所述統計量和預設的標準值區間監測所述元器件是否存在異常。The present application provides a method for abnormal monitoring of components, the method comprising: obtaining the data to be tested of the components; extracting characteristic data from the data to be tested; performing principal component analysis on the characteristic data to obtain statistics; The statistic and the preset standard value interval monitor whether there is any abnormality in the component.

在一種可能的實現方式中,所述獲取元器件的待測資料包括:透過感測器獲取所述元器件的感測器資料;透過控制器獲取所述元器件的控制器資料;將所述感測器資料和所述控制器資料作為所述待測資料。In a possible implementation manner, the acquiring the data to be tested of the component includes: acquiring the sensor data of the component through a sensor; acquiring the controller data of the component through a controller; Sensor data and the controller data are used as the data to be tested.

在一種可能的實現方式中,所述從所述待測資料中提取特徵資料包括:從所述感測器資料中提取振動資料及位置誤差資料;從所述控制器資料中提取電流資料;將所述振動資料、所述位置誤差資料及所述電流資料作為所述特徵資料。In a possible implementation manner, the extracting feature data from the data to be tested includes: extracting vibration data and position error data from the sensor data; extracting current data from the controller data; The vibration data, the position error data and the current data are used as the characteristic data.

在一種可能的實現方式中,所述對所述特徵資料進行主成分分析,得到統計量包括:透過主成分分析演算法提取所述振動資料的多個第一主成分;透過所述主成分分析演算法提取所述位置誤差資料的多個第二主成分;透過所述主成分分析演算法提取所述電流資料的多個第三主成分;根據所述多個第一主成分、所述多個第二主成分和所述多個第三主成分計算所述統計量。In a possible implementation manner, the performing principal component analysis on the feature data to obtain statistics includes: extracting multiple first principal components of the vibration data through a principal component analysis algorithm; The algorithm extracts a plurality of second principal components of the position error data; extracts a plurality of third principal components of the current data through the principal component analysis algorithm; according to the plurality of first principal components, the plurality of The second principal component and the plurality of third principal components are used to calculate the statistics.

在一種可能的實現方式中,所述根據所述多個第一主成分、所述多個第二主成分和所述多個第三主成分計算所述統計量包括:根據所述多個第一主成分、所述多個第二主成分和所述多個第三主成分計算得到T2統計值;根據所述多個第一主成分、所述多個第二主成分和所述多個第三主成分計算得到SPE統計值;將所述T2統計值和所述SPE統計值作為所述統計量。In a possible implementation manner, the calculating the statistics according to the multiple first principal components, the multiple second principal components, and the multiple third principal components includes: according to the multiple first principal components A principal component, the plurality of second principal components and the plurality of third principal components are calculated to obtain T2 statistical values; according to the plurality of first principal components, the plurality of second principal components and the plurality of The third principal component is calculated to obtain the SPE statistical value; the T2 statistical value and the SPE statistical value are used as the statistical quantities.

在一種可能的實現方式中,所述根據所述統計量和預設的標準值區間監測所述元器件是否存在異常包括:根據所述T2統計值及預設的第一標準值區間確定第一監測結果;根據所述SPE統計值及預設的第二標準值區間確定第二監測結果;根據所述第一監測結果和所述第二監測結果監測所述元器件是否存在異常。In a possible implementation manner, the monitoring whether there is an abnormality in the component according to the statistical quantity and a preset standard value interval includes: determining the first T2 statistical value and the preset first standard value interval. Monitoring results; determining a second monitoring result according to the SPE statistical value and a preset second standard value interval; monitoring whether the components are abnormal according to the first monitoring result and the second monitoring result.

在一種可能的實現方式中,所述根據所述T2統計值及所述預設的第一標準值區間確定第一監測結果包括:判斷所述T2統計值是否位於所述預設的第一標準值區間內;當所述T2統計值位於所述預設的第一標準值區間內時,確定所述第一監測結果為正常;當所述T2統計值不位於所述預設的第一標準值區間內時,確定所述第一監測結果為異常。In a possible implementation manner, the determining the first monitoring result according to the T2 statistical value and the preset first standard value interval includes: judging whether the T2 statistical value is within the preset first standard value interval. value interval; when the T2 statistical value is within the preset first standard value interval, it is determined that the first monitoring result is normal; when the T2 statistical value is not within the preset first standard value interval When it is within the value interval, it is determined that the first monitoring result is abnormal.

在一種可能的實現方式中,所述根據所述第一監測結果和所述第二監測結果確定所述元器件是否存在異常包括:當所述第一監測結果及所述第二監測結果中每個監測結果均為正常時,確定所述元器件不存在異常;當所述第一監測結果及所述第二監測結果中至少有一個監測結果為異常時,確定所述元器件存在異常。In a possible implementation manner, the determining whether the component is abnormal according to the first monitoring result and the second monitoring result includes: when each of the first monitoring result and the second monitoring result When all the monitoring results are normal, it is determined that there is no abnormality in the component; when at least one of the first monitoring result and the second monitoring result is abnormal, it is determined that the component is abnormal.

本申請還提供一種電子設備,所述電子設備包括處理器和儲存器,所述處理器用於執行所述儲存器中儲存的電腦程式時實現所述的元器件的異常監測方法。The present application also provides an electronic device, the electronic device includes a processor and a storage, and the processor is used to realize the abnormality monitoring method of components when executing a computer program stored in the storage.

本申請還提供一種電腦可讀儲存介質,所述電腦可讀儲存介質上儲存有電腦程式,所述電腦程式被處理器執行時實現所述的元器件的異常監測方法。The present application also provides a computer-readable storage medium, where a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, the above-mentioned abnormality monitoring method for components is implemented.

本申請公開的元器件的異常監測方法及相關設備,在獲取到元器件的待測資料後,透過從元器件的待測資料中提取特徵資料,將影響元器件的主要資料提取出來,透過利用主成分分析演算法對所述特徵資料進行主成分分析得到統計量,能夠對特徵資料的維度進行降維,從而得到維度較低的統計量,最後根據所述統計量和預設的標準值區間監測所述元器件是否存在異常,由於統計量為維度較低的少量資料,因而基於統計量進行元器件的異常監測,減少了資料計算的複雜性,資料複雜性的減少,有助於提高異常分析的效率。對元件器進行快速有效的異常監測,從而及時的監測出有故障的元器件,並剔除掉有異常的元件器,進而輔助提高產品的生產品質。The component abnormality monitoring method and related equipment disclosed in this application extract the main data affecting the component by extracting the characteristic data from the component to be tested after obtaining the test data of the component. The principal component analysis algorithm performs principal component analysis on the characteristic data to obtain statistics, and can reduce the dimension of the characteristic data to obtain statistics with lower dimensions. Finally, according to the statistics and the preset standard value interval Monitor whether the components are abnormal. Since the statistics are a small amount of data with low dimensions, the abnormal monitoring of components based on statistics reduces the complexity of data calculation, and the reduction of data complexity helps to improve the abnormality. Analysis efficiency. Fast and effective abnormal monitoring of components, so as to detect faulty components in a timely manner and eliminate abnormal components, thereby assisting in improving the production quality of products.

為了使本申請的目的、技術方案和優點更加清楚,下面結合附圖和具體實施例對本申請進行詳細描述。In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

請參閱圖1,圖1為本申請一實施例的電子設備的示意圖。參閱圖1所示,所述電子設備1包括,但不僅限於,儲存器11和至少一個處理器12上述元件之間可以透過匯流排連接,也可以直接連接。Please refer to FIG. 1 , which is a schematic diagram of an electronic device according to an embodiment of the present application. Referring to FIG. 1 , the electronic device 1 includes, but is not limited to, a storage 11 and at least one processor 12. The above-mentioned components may be connected through a bus bar or directly.

所述電子設備1可以是電腦、手機、平板電腦、個人數位助理(Personal Digital Assistant,PDA)等安裝有應用程式的設備。本領域技術人員可以理解,所述示意圖1僅僅是電子設備1的示例,並不構成對電子設備1的限定,可以包括比圖示更多或更少的部件,或者組合某些部件,或者不同的部件,例如所述電子設備1還可以包括輸入輸出設備、網路接入設備、匯流排(例如,圖1所示的13)等。The electronic device 1 may be a computer, a mobile phone, a tablet computer, a personal digital assistant (Personal Digital Assistant, PDA) and other devices installed with application programs. Those skilled in the art can understand that the schematic diagram 1 is only an example of the electronic device 1, and does not constitute a limitation to the electronic device 1, and may include more or less components than those shown in the figure, or combine certain components, or be different For example, the electronic device 1 may also include input and output devices, network access devices, bus bars (for example, 13 shown in FIG. 1 ), and the like.

如圖2所示,是本申請元器件的異常監測方法的較佳實施例的流程圖。所述元器件的異常監測方法應用在所述電子設備1中。根據不同的需求,該流程圖中步驟的順序可以改變,某些步驟可以省略。在本實施方式中,所述元器件的異常監測方法包括:As shown in FIG. 2 , it is a flow chart of a preferred embodiment of the abnormality monitoring method for components of the present application. The abnormality monitoring method of components is applied in the electronic equipment 1 . According to different requirements, the order of the steps in the flowchart can be changed, and some steps can be omitted. In this embodiment, the abnormality monitoring method of the components includes:

S21、獲取元器件的待測資料。S21. Obtain the data to be tested of the components.

在本申請的一個實施例中,所述元器件可以是機械臂(Universal Robots,UR)。UR機械臂主要應用於生產車間,可以用於組裝、噴漆、擰螺絲、貼標籤、注塑成型及焊接。所述UR機械臂具有程式設計簡單、部署靈活、安裝快捷及安全性高等特點。所述獲取元器件的待測資料可以包括:透過感測器獲取所述UR機械臂的感測器資料;透過控制器獲取所述UR機械臂的控制器資料;將所述感測器資料和所述控制器資料作為所述待測資料。In an embodiment of the present application, the component may be a robot arm (Universal Robots, UR). The UR robot arm is mainly used in the production workshop, and can be used for assembly, painting, screwing, labeling, injection molding and welding. The UR robotic arm has the characteristics of simple program design, flexible deployment, quick installation and high safety. The obtaining the data to be tested of the components may include: obtaining the sensor data of the UR mechanical arm through the sensor; obtaining the controller data of the UR mechanical arm through the controller; combining the sensor data and The data of the controller is used as the data to be tested.

具體實施時,During specific implementation,

(1)針對所述UR機械臂硬度高、不易開槽加工的特點,採用粘貼安裝方式在所述UR機械臂的軸關節電機及夾治具機構件上安裝超聲感測器。透過所述超聲感測器即時獲取所述UR機械臂的感測器資料,例如,所述UR機械臂的運動速度、所述UR機械臂的角度及所述UR機械臂的距離目標點的距離。所述超聲感測器將所述感測器資料發送至資料獲取卡,所述資料獲取卡對所述感測器資料進行切分,透過資料切分可以去除掉不規範資料和多餘資料,得到有用資料。進而,所述資料獲取卡將切分後的感測器資料發送至所述電子設備。需要說明的是,所述UR機械臂由多個單軸構成,因此可以分別採集各個單軸的資料,下述的實施方式可以是對每個單軸進行的資料處理和分析。(1) In view of the characteristics of high hardness of the UR robot arm and the difficulty of slotting, the ultrasonic sensor is installed on the shaft joint motor and the clamp mechanism of the UR robot arm by pasting. Real-time acquisition of sensor data of the UR robotic arm through the ultrasonic sensor, for example, the movement speed of the UR robotic arm, the angle of the UR robotic arm, and the distance between the UR robotic arm and the target point . The ultrasonic sensor sends the sensor data to the data acquisition card, and the data acquisition card divides the sensor data, and through data segmentation, irregular data and redundant data can be removed to obtain Useful information. Furthermore, the data acquisition card sends the divided sensor data to the electronic device. It should be noted that the UR robotic arm is composed of multiple single axes, so the data of each single axis can be collected separately, and the following embodiments can be the data processing and analysis for each single axis.

(2)透過所述UR機械臂自帶的控制器獲取所述UR機械臂的控制器資料,其中,所述控制器是指按照預定順序改變主電路或控制電路的接線和改變電路中電阻值來控制電動機的啟動、調速、制動和反向的主令裝置,所述控制器資料包括各種電流資料,例如,電阻值和電流方向。所述控制器將所述控制器資料發送至資料獲取卡,所述資料獲取卡對所述控制器資料進行切分。進而,所述資料獲取卡將切分後的控制器資料發送至所述電子設備。(2) Obtain the controller information of the UR robotic arm through the controller that comes with the UR robotic arm, wherein the controller refers to changing the wiring of the main circuit or control circuit and changing the resistance value in the circuit according to a predetermined sequence To control the starting, speed regulation, braking and reverse of the motor, the controller data includes various current data, such as resistance value and current direction. The controller sends the controller data to a data acquisition card, and the data acquisition card divides the controller data. Furthermore, the data acquisition card sends the divided controller data to the electronic device.

在本申請的一個實施例中,所述超聲感測器相比於傳統應變感測器,具有尺寸小巧,回應快,測量頻率範圍寬,線性度高,無需外接電源等優點。透過採集所述感測器資料和所述控制器資料,提高了資料的準確性和廣泛性,可以使後續的資料分析更為準確。In one embodiment of the present application, compared with traditional strain sensors, the ultrasonic sensor has the advantages of small size, fast response, wide measurement frequency range, high linearity, and no need for external power supply. By collecting the sensor data and the controller data, the accuracy and extensiveness of the data are improved, and subsequent data analysis can be made more accurate.

S22、從所述待測資料中提取特徵資料。S22. Extract feature data from the data to be tested.

在實際應用中,所述感測器資料和所述控制器資料中往往包含大量冗餘的資料類型,因此,為了提高後續資料分析的效率和準確率,需要從所述待測資料中提取出代表性資料。In practical applications, the sensor data and the controller data often contain a large number of redundant data types. Therefore, in order to improve the efficiency and accuracy of subsequent data analysis, it is necessary to extract Representative data.

在本申請的一個實施例中,所述代表性資料包括:振動資料、位置誤差資料及電流資料。所述從所述待測資料中提取特徵資料包括:從所述感測器資料提取所述振動資料及所述位置誤差資料;從所述控制器資料中提取所述電流資料;將所述振動資料、所述位置誤差資料及所述電流資料作為所述特徵資料。In an embodiment of the present application, the representative data include: vibration data, position error data and current data. The extracting characteristic data from the data to be tested includes: extracting the vibration data and the position error data from the sensor data; extracting the current data from the controller data; data, the position error data and the current data are used as the characteristic data.

具體實施時,獲取三類樣本資料,所述三類樣本資料分別為振動資料樣本、位置誤差資料樣本及電流資料樣本。從所述感測器資料中依次提取第一資料,計算所述第一資料與所述振動資料樣本中的每個資料的多個第一距離及與所述位置誤差資料樣本中的每個資料的多個第二距離,對所述多個第一距離取第一均值,將所述第一均值小於預設第一均值閾值的第一資料作為所述振動資料,對所述多個第二距離取第二均值,將所述第二均值小於預設第二均值閾值的第一資料作為所述位置誤差資料,直至所述感測器資料中的第一資料全部被提取。接著,從所述控制器資料中依次提取第二資料,計算所述第二資料與所述電流資料樣本中的每個資料的多個第三距離,對所述多個第三距離取平均值,將所述平均值小於預設第三均值閾值的第三資料作為所述電流資料,直至所述控制器資料中的第三資料全部被提取。During specific implementation, three types of sample data are obtained, and the three types of sample data are respectively vibration data samples, position error data samples and current data samples. sequentially extracting first data from the sensor data, calculating a plurality of first distances between the first data and each of the vibration data samples and each of the position error data samples multiple second distances, take a first average value for the multiple first distances, use the first data whose first average value is less than the preset first average value threshold as the vibration data, and take the first average value for the multiple second distances A second average value is taken for the distance, and the first data whose second average value is smaller than a preset second average threshold value is used as the position error data until all the first data in the sensor data are extracted. Next, sequentially extract second data from the controller data, calculate multiple third distances between the second data and each data in the current data sample, and average the multiple third distances , taking the third data whose average value is smaller than the preset third average threshold value as the current data, until all the third data in the controller data are extracted.

透過提取所述待測資料中的特徵資料,將影響所述UR機械臂的主要資料提取出來,可以提高後續資料分析的效率和準確率。By extracting the characteristic data in the data to be tested, the main data affecting the UR robotic arm are extracted, which can improve the efficiency and accuracy of subsequent data analysis.

S23、對所述特徵資料進行主成分分析,得到統計量。S23. Perform principal component analysis on the feature data to obtain statistics.

在本申請的一個實施例中,所述透過主成分分析演算法計算所述特徵資料的統計量包括:透過主成分分析演算法提取所述振動資料的多個第一主成分;透過主成分分析演算法提取所述位置誤差資料的多個第二主成分;透過主成分分析演算法提取所述電流資料的多個第三主成分;根據所述多個第一主成分、所述多個第二主成分和所述多個第三主成分計算所述統計量。In one embodiment of the present application, the calculation of the statistics of the characteristic data through a principal component analysis algorithm includes: extracting a plurality of first principal components of the vibration data through a principal component analysis algorithm; The algorithm extracts a plurality of second principal components of the position error data; extracts a plurality of third principal components of the current data through a principal component analysis algorithm; according to the plurality of first principal components, the plurality of first principal components, Two principal components and the plurality of third principal components compute the statistic.

所述根據所述多個第一主成分、所述多個第二主成分和所述多個第三主成分計算所述統計量包括:根據所述多個第一主成分、所述多個第二主成分和所述多個第三主成分計算得到T2統計值;根據所述多個第一主成分、所述多個第二主成分和所述多個第三主成分計算得到SPE統計值;將所述T2統計值和所述SPE統計值作為所述統計量。The calculating the statistics according to the multiple first principal components, the multiple second principal components and the multiple third principal components includes: according to the multiple first principal components, the multiple The second principal component and the plurality of third principal components are calculated to obtain T2 statistical values; according to the plurality of first principal components, the plurality of second principal components and the plurality of third principal components are calculated to obtain SPE statistics value; the T2 statistical value and the SPE statistical value are used as the statistical quantities.

具體實施時,對所述振動資料進行標準化處理,得到第一標準化資料。透過所述主成分分析(Principal components analysis, PCA)演算法對所述第一標準化資料進行降維,得到若干個第一主成分,計算所述第一標準化資料的第一協方差矩陣,進而計算所述第一協方差矩陣的第一特徵值和第一特徵向量,獲取每個所述第一特徵值的貢獻率,並將所述貢獻率大於預設第一閾值的第一主成分作為所述多個第一主成分。對所述位置誤差資料進行標準化處理,得到第二標準化資料。透過所述PCA演算法對所述第二標準化資料進行降維,得到若干個第二主成分,計算所述第二標準化資料的第二協方差矩陣,進而計算所述第二協方差矩陣的第二特徵值和第二特徵向量,獲取每個所述第二特徵值的貢獻率,並將所述貢獻率大於預設第二閾值的第二主成分作為所述多個第一主成分。對所述電流資料進行標準化處理,得到第三標準化資料。透過所述PCA演算法對所述第三標準化資料進行降維,得到若干個第三主成分,計算所述第三標準化資料的第三協方差矩陣,進而計算所述第三協方差矩陣的第三特徵值和第三特徵向量,獲取每個所述第三特徵值的貢獻率,並將所述貢獻率大於預設第三閾值的第三主成分作為所述多個第三主成分。進而,可以將所述多個第一主成分、所述多個第二主成分和所述多個第三主成分輸入至PCA演算法模型,輸出所述T2統計值及SPE統計值。During specific implementation, standardization processing is performed on the vibration data to obtain the first normalization data. performing dimensionality reduction on the first standardized data through the principal component analysis (PCA) algorithm to obtain several first principal components, and calculate the first covariance matrix of the first standardized data, and then calculate The first eigenvalue and the first eigenvector of the first covariance matrix, obtaining the contribution rate of each of the first eigenvalues, and using the first principal component whose contribution rate is greater than the preset first threshold as the multiple first principal components. Standardize the position error data to obtain second normalized data. Using the PCA algorithm to reduce the dimension of the second standardized data to obtain a number of second principal components, calculate the second covariance matrix of the second standardized data, and then calculate the second covariance matrix of the second covariance matrix Two eigenvalues and second eigenvectors, obtaining the contribution rate of each of the second eigenvalues, and using the second principal components whose contribution rates are greater than a preset second threshold as the plurality of first principal components. Standardize the current data to obtain third normalized data. Using the PCA algorithm to reduce the dimension of the third standardized data to obtain a number of third principal components, calculate the third covariance matrix of the third normalized data, and then calculate the third covariance matrix of the third covariance matrix Three eigenvalues and a third eigenvector, obtaining the contribution rate of each of the third eigenvalues, and using the third principal components whose contribution rates are greater than a preset third threshold as the plurality of third principal components. Furthermore, the plurality of first principal components, the plurality of second principal components and the plurality of third principal components may be input into the PCA algorithm model, and the T2 statistical value and the SPE statistical value may be output.

透過利用主成分分析演算法將大量資料降維為少量資料,減少了資料的複雜性,可以提高資料異常分析的效率。By using the principal component analysis algorithm to reduce a large amount of data into a small amount of data, the complexity of the data is reduced, and the efficiency of abnormal data analysis can be improved.

S24、根據所述統計量和預設的標準值區間監測所述元器件是否存在異常。S24. Monitor whether the components are abnormal according to the statistics and a preset standard value interval.

當所述UR機械臂正常時,負重會處在5千克至9千克的區間,也就是說,當所述UR機械臂正常時,所述統計量會處在一個標準值區間。可以透過採集正常負重區間的資料來獲取所述標準值區間。When the UR robotic arm is normal, the load will be in the range of 5 kg to 9 kg, that is, when the UR mechanical arm is normal, the statistic will be in a standard value range. The standard value interval can be obtained by collecting data on a normal weight-bearing interval.

在本申請的一個實施例中,獲取負重5千克的UR機械臂的第一正常資料,並利用主成分分析模型得到所述第一正常資料的第一T2標準值和第一SPE標準值。接著,獲取負重9千克的UR機械臂的第二正常資料,並利用主成分分析模型得到所述第二正常資料的第二T2標準值和第二SPE標準值。根據所述第一T2標準值和所述第二T2標準值確定預設的第一標準值區間,例如,所述第一T2標準值為300,所述第二T2標準值為700,因此確定所述預設的第一標準值區間為(300,700)。根據所述第一SPE標準值和所述第二SPE標準值確定預設的第二標準值區間,例如,所述第一SPE標準值為40,所述第二SPE標準值為90,因此確定所述預設的第二標準值區間為(40,90)。In an embodiment of the present application, the first normal data of the UR robotic arm with a load of 5 kg is obtained, and the first T2 standard value and the first SPE standard value of the first normal data are obtained by using the principal component analysis model. Next, obtain the second normal data of the UR robotic arm with a load of 9 kg, and use the principal component analysis model to obtain the second T2 standard value and the second SPE standard value of the second normal data. Determine the preset first standard value interval according to the first T2 standard value and the second T2 standard value, for example, the first T2 standard value is 300, and the second T2 standard value is 700, so it is determined The preset first standard value interval is (300, 700). Determine the preset second standard value interval according to the first SPE standard value and the second SPE standard value, for example, the first SPE standard value is 40, and the second SPE standard value is 90, so it is determined The preset second standard value interval is (40, 90).

在本申請的一個實施例中,所述根據所述統計量和預設的標準值區間確定所述元器件是否存在異常包括:根據所述T2統計值及預設的第一標準值區間確定第一監測結果;根據所述SPE統計值及預設的第二標準值區間確定第二監測結果;根據所述第一監測結果和所述第二監測結果監測所述元器件是否存在異常。In one embodiment of the present application, the determining whether there is an abnormality in the component according to the statistic and the preset standard value interval includes: determining the second T2 statistic value and the preset first standard value interval A monitoring result; determining a second monitoring result according to the SPE statistical value and a preset second standard value interval; monitoring whether the components are abnormal according to the first monitoring result and the second monitoring result.

在本申請的一個實施例中,所述根據所述T2統計值及預設的第一標準值區間確定第一監測結果包括:判斷所述T2統計值是否位於所述預設的第一標準值區間;當所述T2統計值位於所述預設的第一標準值區間時,確定所述第一監測結果為正常;當所述T2統計值不位於所述預設的第一標準值區間時,確定所述第一監測結果為異常。In an embodiment of the present application, the determining the first monitoring result according to the T2 statistical value and the preset first standard value interval includes: judging whether the T2 statistical value is within the preset first standard value interval; when the T2 statistical value is within the preset first standard value interval, it is determined that the first monitoring result is normal; when the T2 statistical value is not within the preset first standard value interval , determining that the first monitoring result is abnormal.

在本申請的一個實施例中,所述根據所述SPE統計值及預設的第二標準值區間確定第二監測結果包括:當所述SPE統計值位於所述預設的第二標準值區間時,確定所述第二監測結果為正常;當所述SPE統計值不位於所述預設的第二標準值區間時,確定所述第二監測結果為異常。In one embodiment of the present application, the determining the second monitoring result according to the SPE statistical value and the preset second standard value range includes: when the SPE statistical value is within the preset second standard value range When the second monitoring result is determined to be normal; when the SPE statistical value is not within the preset second standard value range, it is determined that the second monitoring result is abnormal.

在本申請的一個實施例中,根據所述第一監測結果和所述第二監測結果確定所述元器件是否存在異常包括:當所述第一監測結果及所述第二監測結果中每個監測結果均為正常時,確定所述元器件不存在異常;當所述第一監測結果及所述第二監測結果中至少有一個監測結果是異常,確定所述元器件存在異常。具體地,當所述第一監測結果為存在異常,且所述第二監測結果為無異常時,確定所述UR機械臂存在異常,當所述第一監測結果為無異常,且所述第二監測結果為存在異常時,確定所述UR機械臂存在異常,當所述第一監測結果為存在異常,且所述第二監測結果為存在異常時,確定所述UR機械臂存在異常。In one embodiment of the present application, determining whether the component is abnormal according to the first monitoring result and the second monitoring result includes: when each of the first monitoring result and the second monitoring result When the monitoring results are all normal, it is determined that there is no abnormality in the component; when at least one of the first monitoring result and the second monitoring result is abnormal, it is determined that the component is abnormal. Specifically, when the first monitoring result is abnormal and the second monitoring result is normal, it is determined that the UR robotic arm is abnormal; when the first monitoring result is normal and the second When the second monitoring result is abnormal, it is determined that the UR robotic arm is abnormal, and when the first monitoring result is abnormal and the second monitoring result is abnormal, it is determined that the UR robotic arm is abnormal.

透過即時監控所述UR機械臂的資料,並對資料進行分析,可以對所述UR機械臂的異常情況進行預警,並及時的採取解決方案,減少麻煩,從而可以提高車間的生產效率。採用這種方法可以長期對所述UR機械臂的狀態進行監測。By monitoring the data of the UR robot arm in real time and analyzing the data, early warnings can be given to the abnormal situation of the UR robot arm, and solutions can be taken in time to reduce troubles and improve the production efficiency of the workshop. By adopting this method, the state of the UR mechanical arm can be monitored for a long time.

作為一種可選的實施方式,所述方法還包括:根據所述統計量和對應的時間點繪製統計量走向圖。As an optional implementation manner, the method further includes: drawing a statistical quantity trend graph according to the statistical quantity and corresponding time points.

在本申請的一個實施例中,透過繪製所述統計量走向圖,可以對所述UR機械臂的狀態進行預測,從而可以及時的發現問題。In an embodiment of the present application, by drawing the trend graph of the statistics, the state of the UR robot arm can be predicted, so that problems can be found in time.

請繼續參閱圖1,本實施例中,所述儲存器11可以是電子設備1的內部儲存器,即內置於所述電子設備1的儲存器。在其他實施例中,所述儲存器11也可以是電子設備1的外部儲存器,即外接於所述電子設備1的儲存器。Please continue to refer to FIG. 1 , in this embodiment, the storage 11 may be an internal storage of the electronic device 1 , that is, a storage built in the electronic device 1 . In other embodiments, the storage 11 may also be an external storage of the electronic device 1 , that is, a storage connected externally to the electronic device 1 .

在一些實施例中,所述儲存器11用於儲存程式碼和各種資料,並在電子設備1的運行過程中實現高速、自動地完成程式或資料的存取。In some embodiments, the storage 11 is used to store program codes and various data, and realize high-speed and automatic access to programs or data during the operation of the electronic device 1 .

所述儲存器11可以包括隨機存取儲存器,還可以包括非易失性儲存器,例如硬碟、儲存器、插接式硬碟、智慧儲存卡(Smart Media Card,SMC)、安全數位(Secure Digital,SD)卡、快閃儲存器卡(Flash Card)、至少一個磁碟儲存器件、快閃儲存器器件、或其他易失性固態儲存器件。The storage 11 may include a random access memory, and may also include a non-volatile storage, such as a hard disk, a memory, a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital ( Secure Digital (SD) card, flash memory card (Flash Card), at least one magnetic disk storage device, flash memory device, or other volatile solid-state storage device.

在一實施例中,所述處理器12可以是中央處理單元(Central Processing Unit,CPU),還可以是其他通用處理器、數位訊號處理器 (Digital Signal Processor,DSP)、專用積體電路 (Application Specific Integrated Circuit,ASIC)、現場可程式設計閘陣列(Field-Programmable Gate Array,FPGA) 或者其他可程式設計邏輯器件、分立門或者電晶體邏輯器件、分立硬體元件等。通用處理器可以是微處理器或者所述處理器也可以是其它任何常規的處理器等。In one embodiment, the processor 12 may be a central processing unit (Central Processing Unit, CPU), and may also be other general-purpose processors, digital signal processors (Digital Signal Processor, DSP), application-specific integrated circuits (Application Specific Integrated Circuit, ASIC), Field-Programmable Gate Array (Field-Programmable Gate Array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor, or the processor may be any other conventional processor and the like.

所述儲存器11中的程式碼和各種資料如果以軟體功能單元的形式實現並作為獨立的產品銷售或使用時,可以儲存在一個電腦可讀取儲存介質中。基於這樣的理解,本申請實現上述實施例方法中的全部或部分流程,例如元器件的異常監測方法,也可以透過電腦程式來指令相關的硬體來完成,所述的電腦程式可儲存於一電腦可讀儲存介質中,所述電腦程式在被處理器執行時,可實現上述各個方法實施例的步驟。其中,所述電腦程式包括電腦程式代碼,所述電腦程式代碼可以為原始程式碼形式、物件代碼形式、可執行文檔或某些中間形式等。所述電腦可讀介質可以包括:能夠攜帶所述電腦程式代碼的任何實體或裝置、記錄介質、隨身碟、移動硬碟、磁碟、光碟、電腦儲存器、唯讀儲存器(ROM,Read-Only Memory)等。If the program codes and various data in the storage 11 are realized in the form of software function units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the processes in the methods of the above-mentioned embodiments, such as the abnormality monitoring method of components, which can also be completed by instructing related hardware through computer programs, and the computer programs can be stored in a In the computer-readable storage medium, when the computer program is executed by the processor, the steps of the above-mentioned various method embodiments can be realized. Wherein, the computer program includes computer program code, and the computer program code may be in the form of original code, object code, executable document or some intermediate form. The computer-readable medium may include: any entity or device capable of carrying the computer program code, a recording medium, a flash drive, a removable hard disk, a magnetic disk, an optical disk, a computer storage, a read-only memory (ROM, Read- Only Memory), etc.

可以理解的是,以上所描述的模組劃分,為一種邏輯功能劃分,實際實現時可以有另外的劃分方式。另外,在本申請各個實施例中的各功能模組可以集成在相同處理單元中,也可以是各個模組單獨物理存在,也可以兩個或兩個以上模組集成在相同單元中。上述集成的模組既可以採用硬體的形式實現,也可以採用硬體加軟體功能模組的形式實現。It can be understood that the module division described above is a logical function division, and there may be another division method in actual implementation. In addition, each functional module in each embodiment of the present application may be integrated into the same processing unit, or each module may exist separately physically, or two or more modules may be integrated into the same unit. The above-mentioned integrated modules can be implemented in the form of hardware, or in the form of hardware plus software function modules.

最後應說明的是,以上實施例僅用以說明本申請的技術方案而非限制,儘管參照較佳實施例對本申請進行了詳細說明,本領域的普通技術人員應當理解,可以對本申請的技術方案進行修改或等同替換,而不脫離本申請技術方案的精神和範圍。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application without limitation. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be Make modifications or equivalent replacements without departing from the spirit and scope of the technical solutions of the present application.

1:電子設備 11:儲存器 12:處理器 13:匯流排 S21~S24:步驟 1: Electronic equipment 11: Storage 12: Processor 13: busbar S21~S24: Steps

為了更清楚地說明本申請實施例或習知技術中的技術方案,下面將對實施例或習知技術描述中所需要使用的附圖作簡單地介紹,顯而易見地,下面描述中的附圖僅僅是本申請的實施例,對於本領域普通技術人員來講,在不付出創造性勞動的前提下,還可以根據提供的附圖獲得其他的附圖。In order to more clearly illustrate the technical solutions in the embodiments of the present application or in the prior art, the accompanying drawings that need to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the accompanying drawings in the following description are only It is an embodiment of the present application, and those skilled in the art can also obtain other drawings according to the provided drawings without creative work.

圖1是本申請實施例提供的一種元器件的異常監測方法的電子設備的結構示意圖。FIG. 1 is a schematic structural diagram of an electronic device according to an abnormality monitoring method for components provided by an embodiment of the present application.

圖2是本申請實施例提供的一種元器件的異常監測方法的流程圖。Fig. 2 is a flow chart of a method for monitoring abnormalities of components provided by an embodiment of the present application.

S21~S24:步驟 S21~S24: Steps

Claims (10)

一種元器件的異常監測方法,應用於電子設備,其中,所述方法包括: 獲取元器件的待測資料; 從所述待測資料中提取特徵資料; 對所述特徵資料進行主成分分析,得到統計量; 根據所述統計量和預設的標準值區間監測所述元器件是否存在異常。 A component abnormality monitoring method applied to electronic equipment, wherein the method includes: Obtain the test data of components; extracting feature data from the data to be tested; Performing principal component analysis on the characteristic data to obtain statistics; Whether there is any abnormality in the components is monitored according to the statistics and the preset standard value interval. 如請求項1所述的元器件的異常監測方法,其中,所述獲取元器件的待測資料包括: 透過感測器獲取所述元器件的感測器資料; 透過控制器獲取所述元器件的控制器資料; 將所述感測器資料和所述控制器資料作為所述待測資料。 The abnormality monitoring method of components as described in claim item 1, wherein said obtaining the data to be tested of components includes: Obtaining sensor data of the component through the sensor; Obtaining the controller data of the component through the controller; The sensor data and the controller data are used as the data to be tested. 如請求項2所述的元器件的異常監測方法,其中,所述從所述待測資料中提取特徵資料包括: 從所述感測器資料中提取振動資料及位置誤差資料; 從所述控制器資料中提取電流資料; 將所述振動資料、所述位置誤差資料及所述電流資料作為所述特徵資料。 The abnormality monitoring method of components as described in claim item 2, wherein said extracting characteristic data from said data to be tested includes: extracting vibration data and position error data from the sensor data; extracting current data from said controller data; The vibration data, the position error data and the current data are used as the feature data. 如請求項3所述的元器件的異常監測方法,其中,所述對所述特徵資料進行主成分分析,得到統計量包括: 透過主成分分析演算法提取所述振動資料的多個第一主成分; 透過所述主成分分析演算法提取所述位置誤差資料的多個第二主成分; 透過所述主成分分析演算法提取所述電流資料的多個第三主成分; 根據所述多個第一主成分、所述多個第二主成分和所述多個第三主成分計算所述統計量。 The abnormality monitoring method for components and parts as described in claim item 3, wherein, performing principal component analysis on the characteristic data to obtain statistics includes: extracting a plurality of first principal components of the vibration data through a principal component analysis algorithm; extracting a plurality of second principal components of the position error data through the principal component analysis algorithm; extracting a plurality of third principal components of the current data through the principal component analysis algorithm; The statistic is calculated based on the plurality of first principal components, the plurality of second principal components, and the plurality of third principal components. 如請求項4所述的元器件的異常監測方法,其中,所述根據所述多個第一主成分、所述多個第二主成分和所述多個第三主成分計算所述統計量包括: 根據所述多個第一主成分、所述多個第二主成分和所述多個第三主成分計算得到T2統計值; 根據所述多個第一主成分、所述多個第二主成分和所述多個第三主成分計算得到SPE統計值; 將所述T2統計值和所述SPE統計值作為所述統計量。 The abnormality monitoring method of components as claimed in claim 4, wherein the calculation of the statistics is based on the plurality of first principal components, the plurality of second principal components and the plurality of third principal components include: Calculate T2 statistics according to the plurality of first principal components, the plurality of second principal components and the plurality of third principal components; SPE statistical values are calculated according to the plurality of first principal components, the plurality of second principal components, and the plurality of third principal components; The T2 statistical value and the SPE statistical value are used as the statistical quantities. 如請求項5所述的元器件的異常監測方法,其中,所述根據所述統計量和預設的標準值區間監測所述元器件是否存在異常包括: 根據所述T2統計值及預設的第一標準值區間確定第一監測結果; 根據所述SPE統計值及預設的第二標準值區間確定第二監測結果; 根據所述第一監測結果和所述第二監測結果監測所述元器件是否存在異常。 The abnormality monitoring method of components as described in claim item 5, wherein the monitoring whether there is an abnormality in the components according to the statistics and the preset standard value interval includes: determining a first monitoring result according to the T2 statistical value and the preset first standard value interval; determining a second monitoring result according to the SPE statistical value and a preset second standard value interval; Monitoring whether the components are abnormal according to the first monitoring result and the second monitoring result. 如請求項6所述的元器件的異常監測方法,其中,所述根據所述T2統計值及所述預設的第一標準值區間確定第一監測結果包括: 判斷所述T2統計值是否位於所述預設的第一標準值區間內; 當所述T2統計值位於所述預設的第一標準值區間內時,確定所述第一監測結果為正常; 當所述T2統計值不位於所述預設的第一標準值區間內時,確定所述第一監測結果為異常。 The abnormality monitoring method for components as described in claim 6, wherein said determining the first monitoring result according to the T2 statistical value and the preset first standard value interval includes: judging whether the T2 statistical value is within the preset first standard value interval; When the T2 statistical value is within the preset first standard value interval, it is determined that the first monitoring result is normal; When the T2 statistical value is not within the preset first standard value range, it is determined that the first monitoring result is abnormal. 如請求項7所述的元器件的異常監測方法,其中,所述根據所述第一監測結果和所述第二監測結果確定所述元器件是否存在異常包括: 當所述第一監測結果及所述第二監測結果中每個監測結果均為正常時,確定所述元器件不存在異常; 當所述第一監測結果及所述第二監測結果中至少有一個監測結果為異常時,確定所述元器件存在異常。 The abnormality monitoring method of components as claimed in item 7, wherein the determining whether the components are abnormal according to the first monitoring result and the second monitoring result includes: When each of the first monitoring result and the second monitoring result is normal, it is determined that there is no abnormality in the component; When at least one of the first monitoring result and the second monitoring result is abnormal, it is determined that the component is abnormal. 一種電子設備,其中,所述電子設備包括處理器和儲存器,所述處理器用於執行儲存器中儲存的電腦程式以實現如請求項1至請求項8中任意一項所述的元器件的異常監測方法。An electronic device, wherein the electronic device includes a processor and a memory, and the processor is used to execute a computer program stored in the memory to realize the components described in any one of claim 1 to claim 8 Exception detection method. 一種電腦可讀儲存介質,其中,所述電腦可讀儲存介質儲存有至少一個指令,所述至少一個指令被處理器執行時實現如請求項1至請求項8中任意一項所述的元器件的異常監測方法。A computer-readable storage medium, wherein the computer-readable storage medium stores at least one instruction, and when the at least one instruction is executed by a processor, the component device described in any one of claim 1 to claim 8 is realized abnormality monitoring method.
TW110139385A 2021-10-08 2021-10-22 Component abnormality monitoring method, electronic equipment, and storage medium TWI795048B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202111172845.5 2021-10-08
CN202111172845.5A CN115958586A (en) 2021-10-08 2021-10-08 Component abnormality monitoring method, electronic device, and storage medium

Publications (2)

Publication Number Publication Date
TWI795048B TWI795048B (en) 2023-03-01
TW202315726A true TW202315726A (en) 2023-04-16

Family

ID=85886922

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110139385A TWI795048B (en) 2021-10-08 2021-10-22 Component abnormality monitoring method, electronic equipment, and storage medium

Country Status (2)

Country Link
CN (1) CN115958586A (en)
TW (1) TWI795048B (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1955830B1 (en) * 2007-02-06 2014-04-09 Abb Research Ltd. A method and a control system for monitoring the condition of an industrial robot
CN112199409B (en) * 2020-08-17 2024-06-11 浙江中控技术股份有限公司 Method and device for monitoring real-time working condition of catalytic reforming device
CN112763678A (en) * 2020-12-30 2021-05-07 佛山科学技术学院 PCA-based sewage treatment process monitoring method and system

Also Published As

Publication number Publication date
CN115958586A (en) 2023-04-14
TWI795048B (en) 2023-03-01

Similar Documents

Publication Publication Date Title
Azamfar et al. Intelligent ball screw fault diagnosis using a deep domain adaptation methodology
US20160279794A1 (en) Robot controller capable of performing fault diagnosis of robot
TWI721358B (en) Equipment maintenance device, method, and storage medium
US20100070077A1 (en) Programmed calibration and mechanical impulse response application iin robotic automation systems
US11718007B2 (en) State determination device and state determination method
CN110363339B (en) Method and system for performing predictive maintenance based on motor parameters
US11150636B2 (en) State determination device and state determination method
CN113574358B (en) Abnormality detection device and abnormality detection method
JP2021015573A (en) Abnormality determination device and abnormality determination system
TWI795048B (en) Component abnormality monitoring method, electronic equipment, and storage medium
CN109990803B (en) Method and device for detecting system abnormity and method and device for sensor processing
CN114800486A (en) Industrial robot fault diagnosis method and system based on statistical characteristics
CN117314890B (en) Safety control method, device, equipment and storage medium for button making processing
CN114077919A (en) System for predicting machining anomalies
US11287800B2 (en) Method for monitoring machine, device, and storage medium
KR20220068799A (en) System for detecting error of automation equipment and method thereof
US10862812B2 (en) Information processing apparatus, data management system, data management method, and non-transitory computer readable medium storing program
JP2023178206A (en) Abnormality detection device, abnormality detection method and program
US7895008B2 (en) Method of performing measurement sampling of lots in a manufacturing process
TW202014814A (en) Tools monitoring system and monitoring method thereof
TWM575133U (en) Robotic arm dynamic monitoring system
CN115185837A (en) Software and/or hardware similarity detection method and detection device
CN110597698B (en) Method for analyzing the cause of at least one anomaly
CN113591984A (en) Method and device for detecting equipment operation event, electronic equipment and storage medium
CN114609970B (en) Position monitoring method, monitoring device and storage medium for axis movement of numerical control machine tool