TW202315178A - Method of manufacturing piezoelectric transducer - Google Patents

Abstract

A method of manufacturing a piezoelectric transducer includes: forming at least one metal layer on at least one substrate; forming a plurality of masking units on the at least one metal layer sequentially, in which the masking units form a masking pattern; etching the at least one metal layer through the masking pattern; and removing the masking pattern.

Description

How to make a piezoelectric sensor

The present disclosure relates to a manufacturing method of a piezoelectric sensor.

Today's semiconductor manufacturing methods have matured. In most semiconductor manufacturing processes, the process repeatedly etches and polishes various materials on the substrate, makes the materials into specific patterns, and stacks the materials to form the final integrated circuit. Before the metal layer is etched, a photoresist material is used to make a mask with a specific pattern on the metal layer, and then the metal layer is etched to obtain an etching result of a specific pattern.

However, the steps currently used to manufacture photoresist masks include wet processes such as spin-coating photoresist, exposure and lithography steps, etc. It takes a certain amount of time to complete photoresist production, and requires investment in wet process equipment and photoresist. Making the photoresist mask, the time and cost of these steps contribute a certain amount to the overall manufacturing cost.

Therefore, how to propose a method for manufacturing a piezoelectric sensor that can solve the above-mentioned problems is one of the problems that the industry is eager to invest in research and development resources to solve.

In view of this, one purpose of the present disclosure is to propose a method for manufacturing a piezoelectric sensor that can effectively solve the above problems.

The present disclosure relates to a manufacturing method of a piezoelectric sensor comprising: forming at least one metal layer on at least one substrate; sequentially forming a plurality of mask units on the at least one metal layer, wherein the mask units form a mask pattern; Etching at least one metal layer through the mask pattern; and removing the mask pattern.

In some current embodiments, the step of forming at least one metal layer on at least one substrate includes forming two metal layers on two corresponding surfaces of the at least one substrate.

In some current embodiments, the step of sequentially forming mask units on the at least one metal layer includes sequentially and quantitatively outputting materials at different positions on the at least one metal layer.

In some current embodiments, the step of sequentially forming the mask unit on at least one metal layer includes positioning a mold above the at least one metal layer, wherein the mold has a plurality of hollow parts; and sequentially passing materials through the hollow parts to form on at least one metal layer.

In some current embodiments, the material is a photocurable polymer, and the step of sequentially forming the mask unit on the at least one metal layer further includes irradiating the material with ultraviolet light to cure the material into the mask unit.

In some current embodiments, the step of sequentially forming the mask unit on the at least one metal layer further includes heating the material to solidify the material into the mask unit, wherein the material is a thermosetting polymer.

In some present embodiments, the material comprises ink.

In some current embodiments, the step of removing the mask pattern includes using at least one organic solvent to dissolve the mask pattern.

In some current embodiments, the step of removing the mask pattern includes removing the mask pattern using a mechanical lift-off process.

In some current embodiments, the at least one metal layer and the at least one substrate are plural, and the step of forming the at least one metal layer on the at least one substrate includes stacking the substrate and the metal layer.

In some current embodiments, the step of stacking the substrate and the metal layer includes alternately stacking the substrate and the metal layer.

In some current embodiments, the material of at least one substrate comprises polyvinylidene fluoride or a copolymer thereof.

In some current embodiments, the material of at least one metal layer includes at least one of gold, copper, chromium, nickel, titanium and aluminum.

To sum up, in the manufacturing method of the piezoelectric sensor disclosed in the present disclosure, by spraying or dispensing materials on the metal layer, the steps of exposure and development and the cost of investing in wet process equipment can be saved. , so as to achieve the effect of saving manufacturing steps, manufacturing time and manufacturing cost. On the other hand, by performing a curing process on the material by photocuring (for example, using ultraviolet light irradiation), the manufacturing time can be reduced more efficiently. Furthermore, the selection of materials for making the mask pattern is more diverse, using polymers, inks, or materials with high shear strength and low peel strength instead of general photoresist materials, so as to achieve the effect of saving manufacturing costs. Furthermore, due to the chemical and physical properties of the material, when removing the mask pattern, the material can be removed by dissolving the material with an organic solvent or using a mechanical stripping method, which greatly saves the manufacturing time.

The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only, and are not intended to be limiting. For example, in the following description a first feature is formed on or on a second feature may include embodiments where the first feature is formed in direct contact with the second feature, and may also include embodiments where additional features may be An embodiment formed between a first feature and a second feature such that the first feature and the second feature may not be in direct contact. In addition, the present disclosure may repeat element symbols and/or letters in various examples. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or configurations discussed.

Additionally, for simplicity of description, spatially relative terms such as "below," "beneath," "lower," "above," "upper," and similar terms may be used herein to describe Describes the relationship of one element or feature to another (further) element or feature as shown in the figures. Such spatially relative terms are intended to encompass different orientations of the elements in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

As used herein, "approximately", "approximately", "approximately" or "substantially" means falling within twenty percent, or within ten percent, or within one hundred percent of a given value or range Five out of five. Numerical quantities given herein are approximations, meaning that terms such as "about," "about," "approximately," or "substantially" can be inferred when not expressly stated otherwise.

FIG. 1 is a flowchart of a manufacturing method of a piezoelectric sensor according to an embodiment of the present disclosure. A manufacturing method M1 of a piezoelectric sensor includes: forming at least one metal layer on at least one substrate (step S101); sequentially forming a plurality of mask units on at least one metal layer, wherein the mask units form a mask pattern ( Step S102 ); etching at least one metal layer through the mask pattern (step S103 ); and removing the mask pattern (step S104 ).

FIG. 2A is a schematic diagram of an intermediate stage of the manufacturing method M1 of the piezoelectric sensor 100 according to an embodiment of the present disclosure. FIG. 2B is a schematic diagram of an intermediate stage of the manufacturing method M1 of the piezoelectric sensor 100 according to an embodiment of the present disclosure. FIG. 2C is a schematic diagram of an intermediate stage of the manufacturing method M1 of the piezoelectric sensor 100 according to an embodiment of the present disclosure. FIG. 2D is a schematic diagram of an intermediate stage of the manufacturing method M1 of the piezoelectric sensor 100 according to an embodiment of the present disclosure. Please refer to FIG. 1 to FIG. 2D , specifically, the metal layer 120 can be formed on the substrate 110 by any suitable method, for example, physical deposition method or chemical deposition method. In some embodiments, the material of at least one metal layer 120 includes at least one of gold, copper, chromium, nickel, titanium and aluminum, but the disclosure is not limited thereto. Specifically, the material of the metal layer 120 only needs to be an applicable conductive material. In some embodiments, the material of at least one substrate 110 includes polyvinylidene fluoride or its copolymer, but the disclosure is not limited thereto. Specifically, the substrate 110 is a piezoelectric material, and the characteristic of the piezoelectric material is that a voltage change can be generated by changing the shape of the material, or a voltage can be applied to the piezoelectric material to cause a change in the shape of the material.

Next, the masking units are fabricated sequentially above the metal layer 120. For example, in some embodiments, a plurality of masking units can be fabricated from one side of the metal layer 120 to the corresponding other side of the metal layer 120 along a specific direction. One side, but this disclosure is not limited thereto. In some other embodiments, the sequential fabrication may also be dividing multiple specific regions on the metal layer 120 , and fabricating mask units in the multiple specific regions in a certain order. After the plurality of mask units are manufactured, a mask pattern 130 is jointly formed on the metal layer 120 . After the mask pattern 130 is fabricated, a specific portion of the metal layer 120 is blocked by the mask pattern 130 and the metal layer 120 is etched to form a metal conductive structure with a specific pattern in the metal layer 120 . After the etching is completed, the mask pattern 130 can be removed without damaging the metal layer 120 . Details about the above-mentioned method of making the mask pattern 130 and the method of removing the mask pattern 130 will be described in detail below.

Please refer to FIG. 2A . FIG. 2A shows the formation of the metal layer 120 on the surface of the substrate 110 . Any suitable method can be used to form the metal layer 120 , such as physical deposition or chemical deposition. Please refer to FIG. 2B . FIG. 2B is a schematic diagram illustrating one process of forming the mask pattern 130 on the metal layer 120 . In some embodiments, step S102 includes: positioning the mold 200 above the at least one metal layer 120 , wherein the mold 200 has a plurality of hollows; and forming materials on the at least one metal layer 120 sequentially through the hollows. For example, mask units are planned and arranged in sequence, and marked on a mold 200 that can be used for transfer. In some embodiments, the mold 200 realizes the transfer effect of the mold 200 through the hollow parts arranged according to the mask units. For example, the mold 200 can be a material with multiple hollows, and can be any suitable material, for example, the mesh used for screen printing. In other examples, the material of the mold 200 may also be composed of composite materials, and a material different from the mesh may be used. The mold 200 has a hollowed-out sheet and the edge of the sheet is surrounded by a raised border.

The method of using the mold 200 is to put a certain amount of material into the mold 200 and evenly distribute the material in the mold 200 . For example, the material can be evenly distributed in the mold 200 as it is placed, by means of movable discharge nozzles, such as those used in photocopying devices. The discharge nozzle has a certain direction during operation, so the material is evenly distributed in the mold 200 along a specific direction in sequence. In another example, after putting the material into the mold 200 , the material can be evenly spread in the mold 200 by using a scraper or other mechanical means. When using a scraper or other mechanical means to evenly spread the material, the material will also be distributed in the mold 200 in a certain order according to the spreading direction and position. When evenly coating the material on the mold 200 , the frame of the mold 200 can prevent excess material from overflowing the mold 200 , so as not to contaminate the substrate 110 or the metal layer 120 .

On the other hand, the amount of material distribution can be controlled by the spout to save excess material. For example, after placing the material into the mold 200, using a scraper or other mechanical means to spread the material evenly in the mold 200, the material can be controlled when the material is placed in the mold 200, so as to reduce excess use of materials. Alternatively, using material spouts, the materials are evenly distributed in the mold 200 when inserting materials, and the use of redundant materials can be reduced by controlling the discharge volume of the spouts, but the present disclosure is not limited thereto.

When actually manufacturing the mask pattern 130 , the mold 200 is first positioned above the metal layer 120 , and the material is then placed in the mold 200 . Next, evenly distribute the material on the mold 200 . At the same time, materials are sequentially applied on the metal layer 120 through the mold 200 . The order in which the materials are applied to the metal layer 120 will vary depending on the method chosen to evenly distribute the materials in the mold 200 . Specifically, if the material is sprayed through the nozzle, the material will be evenly distributed on the mold 200 from one end of the mold 200 along a specific direction. On the other hand, if the material is distributed in the mold 200 by squeegee coating, the material will be evenly distributed on the mold 200 sequentially according to the position and sequence of squeegee coating. The material evenly distributed on the mold 200 will be partially passed through the hollow part of the mold 200 and applied above the metal layer 120 to form a mask unit above the metal layer 120 . This method of evenly distributing the material will help to ensure that the material is applied to each position in equal amounts, which will help the manufacturing uniformity of the subsequent curing material process and material removal process.

The method M1 provided by the present disclosure completes the fabrication of the mask pattern 130 while applying materials, compared to the current common method for manufacturing the mask pattern 130 (that is, using photoresist spin coating on the metal layer 120 and using micro The two steps of patterning photoresist to make mask pattern 130) saves manufacturing time and manufacturing cost. The reason is that the method M1 provided in the present disclosure does not require the use of exposure and development equipment, so the time for exposure and development and the manufacturing cost of using exposure and development equipment can be saved.

In some embodiments, the step S102 further includes heating the material to solidify the material into the mask pattern 130 , wherein the material is a thermosetting polymer. Specifically, in some embodiments, after using materials to form the mask unit, the mask pattern 130 can be firmly disposed on the metal layer 120 by properly heating the material, but the disclosure is not limited thereto. .

In some embodiments, the material is a photo-curable material, and the step S102 further includes irradiating the material with ultraviolet light to cure the material into the mask pattern 130 . Specifically, when the material has photocurable properties, the material can be cured by irradiating light with a specific wavelength (for example, ultraviolet light wavelength), but the present disclosure is not limited thereto. Due to the UV curing effect, the mask pattern 130 can be stably placed on the metal layer 120 with a shorter process time. In some embodiments, the material includes ink, although the disclosure is not limited thereto. Specifically, the material used for making the mask pattern 130 needs to have the ability to resist etching, and also be able to be evenly distributed on the metal layer 120 .

Specifically, after the mask pattern 130 is applied on the metal layer 120 , a curing process is still required to ensure that the mask pattern 130 achieves a good masking effect. On the other hand, curing can further fix the mask pattern 130 to protect the integrity of the metal layer 120 under the mask pattern 130 in the subsequent etching process. Further, when the material is cured, the material will have high shear strength and low peel strength. High shear strength means that the cured material has high resistance to parallel and opposite forces applied to the material, so it can avoid deformation or displacement of the cured material due to lateral force. At the same time, the material will have low peel strength when it is cured. Peel strength is an indication of the maximum force required to peel off the material. The low peeling strength of the cured material facilitates the subsequent removal of the mask pattern 130 using a mechanical peeling method. Moreover, the combination of low peel strength and high shear strength can prevent the material from being partially removed when the material is removed by mechanical peeling methods, so as to ensure the efficiency of the process and the integrity of the surface of the metal layer 120 when the mask pattern 130 is removed. .

Please refer to FIG. 2C , which is a schematic diagram illustrating one process of etching the metal layer 120 by blocking the mask pattern 130 . The etching method can be isotropic etching or anisotropic etching on the metal layer 120 and the mask pattern 130 by any suitable etching method. Please refer to FIG. 2D , which is a schematic diagram illustrating one process of removing the mask pattern 130 . In some embodiments, step S104 includes removing the mask pattern 130 by using a mechanical lift-off process. Specifically, when the mask pattern 130 is removed after the metal layer 120 is etched, the mask pattern 130 can be torn off by using the flexible material 300 with viscosity. First, the flexible material 300 is evenly pasted on the surface of the mask pattern 130 . Next, one edge of the flexible material 300 lifts up the mask pattern 130 . The flexible material 300 is torn from one side of the substrate 110 with the metal layer 120 along a specific direction, and the mask pattern 130 is torn off the metal layer 120 by mechanical peeling. In this way, the mask pattern 130 applied on the metal layer 120 can be completely removed from the metal layer 120 by a mechanical lift-off method. Using a mechanical stripping process to remove the mask pattern 130 can save the step of wet stripping the photoresist, so as to save the overall manufacturing cost.

FIG. 3A is a schematic diagram of an intermediate stage of the manufacturing method M1 of the piezoelectric sensor 100 according to another embodiment of the present disclosure. FIG. 3B is a schematic diagram of an intermediate stage of the manufacturing method M1 of the piezoelectric sensor 100 according to another embodiment of the present disclosure. FIG. 3C is a schematic diagram of an intermediate stage of the manufacturing method M1 of the piezoelectric sensor 100 according to another embodiment of the present disclosure. FIG. 3D is a schematic diagram of an intermediate stage of the manufacturing method M1 of the piezoelectric sensor 100 according to another embodiment of the present disclosure. Please refer to FIG. 3A . FIG. 3A shows the formation of the metal layer 120 on the surface of the substrate 110 . Any suitable method can be used to form the metal layer 120 , such as physical deposition or chemical deposition. Please refer to FIG. 3B . FIG. 3B is a schematic diagram illustrating one process of fabricating the mask unit on the metal layer 120 . In some other embodiments, the step S102 includes sequentially and quantitatively outputting materials at different positions on the at least one metal layer 120 . Specifically, the material output end is a material outlet that can quantitatively control the output, and the material output end can be moved to a predetermined position by a moving device for output. The discharge amount and the moving position of the material output end can be controlled in combination with a computer computing device, but the present disclosure is not limited thereto.

For example, when there is a first distance between the material output terminal and the metal layer 120 during operation, the computer will move the material output terminal to a predetermined distance in parallel while maintaining the first distance according to a predetermined pattern. Location. After confirming the movement to the predetermined position, the material output end is moved to have a second distance from the metal layer 120 . Then, the computer makes the material output terminal output the quantitative material at the predetermined position according to the setting. Then, after the distance between the material output end and the metal layer 120 is returned to the first distance, the material output end is moved to the next predetermined position again for discharging. In this way, the material can be sequentially arranged in the pattern of the mask unit on the metal layer 120 by controlling the position of the output end of the material. In some embodiments, multiple material outputs can be used simultaneously for mask unit setup. Alternatively, in some other embodiments, the output end of the material can be fixed, and the positions of the metal layer 120 and the substrate 110 can be moved instead to form the mask pattern 130 on the metal layer 120 . However, the above descriptions are only some of the implementation manners, and the content of the present disclosure is not limited thereto.

After the mask units are manufactured sequentially, a material curing process is then performed. The material curing method can use the light curing method or the thermal curing method described in the preceding paragraphs according to different material properties, but the present disclosure is not limited thereto.

Please refer to FIG. 3C , which is a schematic diagram illustrating one process of etching the metal layer 120 by blocking the mask pattern 130 . The etching method can be isotropic etching or anisotropic etching on the metal layer 120 and the mask pattern 130 by any suitable etching method. Please refer to FIG. 3D , which is a schematic diagram illustrating one process of removing the mask pattern 130 . In some embodiments, step S104 includes using at least one organic solvent 400 to dissolve the mask pattern 130 , but the disclosure is not limited thereto. Specifically, some materials have the property of being soluble by the organic solvent 400, so the organic solvent 400 can be sprayed over a large area on the mask pattern 130 to dissolve the mask pattern 130, while maintaining the metal layer 120 after etching below. integrity. For example, after the metal layer 120 is etched, the organic solvent 400 can be uniformly applied on the mask pattern 130 by a spraying device to dissolve the mask pattern 130 . Using the organic solvent 400 to dissolve the mask pattern 130 can reduce the equipment cost of the wet process used in the manufacturing process, and maintain the same manufacturing effect as the existing wet process.

FIG. 4 is a cross-sectional structure diagram of a piezoelectric sensor 100 according to an embodiment of the present disclosure. In some embodiments, step S101 includes forming two metal layers 120 on two corresponding surfaces of at least one substrate 110 , but the present disclosure is not limited thereto. Specifically, the above two metal layers 120 can be fabricated and etched with the mask pattern 130 through the aforementioned uniform coating or quantitative dispensing method through the mold 200 , but the present disclosure is not limited thereto. The metal layer 120 can be disposed at any position above the substrate 110 , and its number is not limited to two. The mask pattern 130 shown in FIG. 2B and FIG. 3B can be fabricated on any position above the metal layer 120 .

For example, as in the embodiment shown in FIG. 4 , the metal layer 120 is grown on two corresponding surfaces of the substrate 110 (eg, piezoelectric material), so that the two corresponding surfaces of the substrate 110 can transmit electrical signals. This manufacturing method can use the positive piezoelectric effect and the inverse piezoelectric effect of the substrate 110 to trigger the substrate 110 . The positive piezoelectric effect can be used as a switch. Specifically, when a piezoelectric material is subjected to physical pressure, the electric dipole moment in the material becomes shorter due to the pressure compression. In order to resist the change, the piezoelectric material will generate positive and negative charges equal to the compressed electric dipole moment on the opposite surface of the material, which is called material electric polarization. Because piezoelectric materials generate electrical polarization when subjected to physical pressure, they can be used as switches. On the other hand, the inverse piezoelectric effect can be used as vibration feedback. Specifically, when a voltage is applied to the surface of a piezoelectric material, the electric field generated by the voltage difference will elongate the electric dipole moment in the material. In order to resist the change of the electric dipole moment, the piezoelectric material will elongate along the direction of the electric field, resulting in mechanical deformation of the material. Because the piezoelectric material will produce mechanical deformation when an electric field is applied, it can be used as vibration feedback. However, the application scope of the positive piezoelectric effect and the negative piezoelectric effect of the piezoelectric material is not limited to the above examples.

FIG. 5 is a schematic diagram of a piezoelectric sensor 100 according to another embodiment of the present disclosure. In some embodiments, the at least one metal layer 120 and the at least one substrate 110 are plural in number, and the step S101 includes stacking the substrate 110 and the metal layer 120 . In some embodiments, the step of stacking the substrate 110 and the metal layer 120 includes alternately stacking the substrate 110 and the metal layer 120 , but the disclosure is not limited thereto. The specific manufacturing method can be combined with the above-mentioned method of uniform coating or quantitative dispensing through the mold 200 to make the mask pattern 130 and perform etching, and then sequentially make a single piezoelectric sensor 100 and then stack them together. Specifically, the stack connection of piezoelectric materials, such as parallel or series connection, can enhance the effect of the piezoelectric properties of the materials to obtain the desired circuit characteristics. As shown in FIG. 5 , combined with the above-mentioned characteristics of the positive piezoelectric effect, the piezoelectric sensor 100 can be fabricated as a sensing circuit 500 to sense external pressure (eg, touch). On the other hand, combined with the characteristics of the aforementioned inverse piezoelectric effect, the piezoelectric sensor 100 can be fabricated as the driving circuit 600 to provide vibration feedback, but the present disclosure is not limited thereto.

From the above detailed description of the specific implementation of the present disclosure, it can be clearly seen that in the manufacturing method of the piezoelectric sensor of the present disclosure, the exposure can be saved by using the method of spraying or spot-coating materials on the metal layer. The steps of developing and the cost of investing in wet process equipment can achieve the effect of saving manufacturing steps, manufacturing time and manufacturing cost. On the other hand, by performing a curing process on the material by photocuring (for example, using ultraviolet light irradiation), the manufacturing time can be reduced more efficiently. Furthermore, the selection of materials for making the mask pattern is more diverse, using polymers, inks, or materials with high shear strength and low peel strength instead of general photoresist materials, so as to achieve the effect of saving manufacturing costs. Furthermore, due to the chemical and physical properties of the material, when removing the mask pattern, the material can be removed by dissolving the material with an organic solvent or using a mechanical stripping method, which greatly saves the manufacturing time.

The foregoing outlines features of several embodiments so that those skilled in the art may better understand aspects of the disclosure. Those skilled in the art should appreciate that they can readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments described herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions and substitutions herein without departing from the spirit and scope of the present disclosure.

100: piezoelectric sensor 110: Substrate 120: metal layer 130: mask pattern 200: Mold 300: flexible material 400: organic solvent 500: sensing line 600: drive line M1: method S101, S102, S103, S104: steps

Aspects of the present disclosure are best understood from the following Detailed Description when read in conjunction with the accompanying drawings. It should be noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion. FIG. 1 is a flowchart of a manufacturing method of a piezoelectric sensor according to an embodiment of the present disclosure. FIG. 2A is a schematic diagram of an intermediate stage of the fabrication method of the piezoelectric sensor according to an embodiment of the present disclosure. FIG. 2B is a schematic diagram of an intermediate stage of the fabrication method of the piezoelectric sensor according to an embodiment of the present disclosure. FIG. 2C is a schematic diagram of an intermediate stage of the fabrication method of the piezoelectric sensor according to an embodiment of the present disclosure. FIG. 2D is a schematic diagram of an intermediate stage of the manufacturing method of the piezoelectric sensor according to an embodiment of the present disclosure. FIG. 3A is a schematic diagram of an intermediate stage of a fabrication method of a piezoelectric sensor according to another embodiment of the present disclosure. FIG. 3B is a schematic diagram of an intermediate stage of the fabrication method of the piezoelectric sensor according to another embodiment of the present disclosure. FIG. 3C is a schematic diagram of an intermediate stage of a fabrication method of a piezoelectric sensor according to another embodiment of the present disclosure. FIG. 3D is a schematic diagram of an intermediate stage of a fabrication method of a piezoelectric sensor according to another embodiment of the present disclosure. FIG. 4 is a cross-sectional structure diagram of a piezoelectric sensor according to an embodiment of the present disclosure. FIG. 5 is a schematic diagram of a piezoelectric sensor according to another embodiment of the present disclosure.

Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none

M1: method

S101, S102, S103, S104: steps

Claims (13)

A method of manufacturing a piezoelectric sensor, comprising: forming at least one metal layer on at least one substrate; sequentially forming a plurality of mask units on the at least one metal layer, wherein the mask units form a mask pattern; etching the at least one metal layer through the mask pattern; and Remove the mask pattern. The manufacturing method of the piezoelectric sensor as described in claim 1, wherein the step of forming the at least one metal layer on the at least one substrate comprises: Two metal layers are respectively formed on two corresponding surfaces of the at least one substrate. The method for manufacturing a piezoelectric sensor according to claim 1, wherein the step of sequentially forming the mask units on the at least one metal layer includes: A material is sequentially and quantitatively output at different positions on the at least one metal layer. The method for manufacturing a piezoelectric sensor according to claim 1, wherein the step of sequentially forming the mask units on the at least one metal layer includes: positioning a mold over the at least one metal layer, wherein the mold has a plurality of cutouts; and A material is formed on the at least one metal layer through the hollow parts in sequence. The manufacturing method of the piezoelectric sensor as described in claim 3 or 4, wherein the material is a photocurable polymer, and the step of sequentially forming the mask units on the at least one metal layer further includes : The material is irradiated with an ultraviolet light to cure the material into the mask units. The manufacturing method of the piezoelectric sensor as described in Claim 3 or 4, wherein the step of sequentially forming the mask units on the at least one metal layer further comprises: The material is heated to solidify the material into the mask units, wherein the material is a thermosetting polymer. The manufacturing method of the piezoelectric sensor according to claim 3 or 4, wherein the material includes ink. The manufacturing method of the piezoelectric sensor as described in Claim 1, wherein the step of removing the mask pattern comprises: Dissolving the mask pattern with at least one organic solvent. The manufacturing method of the piezoelectric sensor as described in Claim 1, wherein the step of removing the mask pattern comprises: The mask pattern is removed using a mechanical lift-off process. The manufacturing method of the piezoelectric sensor as described in claim 1, wherein the number of the at least one metal layer and the at least one substrate is plural, and the step of forming the at least one metal layer on the at least one substrate includes: The base materials and the metal layers are stacked. The manufacturing method of the piezoelectric sensor as described in claim 10, wherein the step of stacking the base materials and the metal layers comprises: The substrates and the metal layers are alternately stacked. The manufacturing method of the piezoelectric sensor according to claim 1, wherein the material of the at least one substrate comprises polyvinylidene fluoride or a copolymer thereof. The manufacturing method of the piezoelectric sensor according to claim 1, wherein the material of the at least one metal layer includes at least one of gold, copper, chromium, nickel, titanium and aluminum.

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