TW202313712A - Curable composition, cured film, pattern forming method, near infrared cut-off filter, solid image pickup element, image display apparatus, and infrared sensor - Google Patents

Abstract

A curable composition comprising an infrared absorption reagent, a polymerizable monomer, and photoinitiators, wherein the photoinitiators include a photoinitiator IA having an absorption coefficient of 1.0*10<SP>3</SP> mL/g.cm or more with respect to a wavelength of 365 nm in methanol, and a photoinitiator IB having, in methanol, an absorption coefficient of less than 1.0*10<SP>3</SP> mL/g.cm with respect to a wavelength of 365 nm and having an absorption coefficient of 1.0*10<SP>3</SP>mL/g.cm or more with respect to a wavelength of 254 nm, and A1/A2, which is the ratio of the maximum value A1 of the absorbance of the curable composition in a wavelength range of 700-2000 nm with respect to the maximum value A2 of the absorbance of the curable composition in a wavelength range of 400-600 nm, is 4.5 or more. A cured film, a pattern forming method, a near infrared cut-off filter, a solid image pickup element, an image display apparatus, and an infrared sensor, in all of which said curable composition is used.

Description

Curable composition, cured film, pattern forming method, near-infrared cut filter, solid-state imaging device, image display device, and infrared sensor

The present invention relates to a curable composition containing an infrared absorber, a polymerizable monomer and a photopolymerization initiator. Also, the present invention relates to a cured film, a method for forming a pattern, a near-infrared cut filter, a solid-state imaging device, an image display device, and an infrared sensor.

CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor) are used as solid-state imaging devices for color images in video cameras, digital cameras, and mobile phones with camera functions. These solid-state imaging devices use silicon photodiodes that are sensitive to infrared rays in their light-receiving parts. Therefore, a near-infrared cut filter is sometimes set for visibility correction.

A near-infrared cut filter is manufactured using a curable composition containing an infrared absorber, a polymerizable monomer, and a photopolymerization initiator (Patent Document 1, etc.).

[Patent Document 1] Japanese Patent Laid-Open No. 2019-211764

In recent years, in solid-state imaging devices, from the viewpoints of high resolution, high sensitivity, power saving, and miniaturization, the use of non-silicon materials such as organic materials, quantum dots, and InGaAs (indium gallium arsenide) is being studied instead of silicon photodiodes. Materials that perform photoelectric conversion. The above-mentioned non-Si-based materials are less heat-resistant than Si-based materials, so it is desired to form a cured film by, for example, a low-temperature process of less than 200° C.

However, when the cured film is formed by a low-temperature process, sometimes the degree of hardening of the cured film is insufficient, and there is room for improvement in the solvent resistance of the cured film.

Therefore, an object of the present invention is to provide a curable composition capable of forming a cured film excellent in solvent resistance. Moreover, the object of this invention is to provide the cured film, the formation method of a pattern, a near-infrared cut filter, a solid-state imaging device, an image display apparatus, and an infrared sensor.

The inventors provide the following. <1> A curable composition comprising an infrared absorber, a polymerizable monomer, and a photopolymerization initiator, wherein the photopolymerization initiator includes methanol and has an absorption coefficient of 1.0×10 ³ mL/g at a wavelength of 365 nm･ Photopolymerization of photopolymerization initiator IA having a wavelength of more than 1.0×10 3 mL/g･cm at a wavelength of 1.0×10 ³ mL/g･cm in methanol and methanol having an absorption coefficient of at least 1.0×10 ³ mL/g･cm at a wavelength of 254 nm Initiator IB, the ratio of the maximum value A ¹ of absorbance in the wavelength range of 700 to 2000 nm of the above-mentioned curable composition to the maximum value A ² of absorbance in the range of wavelength 400 to 600 nm, that is, A ¹ /A ² is 4.5 or above. <2> The curable composition according to <1>, wherein the photopolymerization initiator IA is an oxime compound. <3> The curable composition according to <1> or <2>, wherein the photopolymerization initiator IB is a hydroxyalkylphenone compound. <4> The curable composition according to any one of <1> to <3>, wherein the photopolymerization initiator IA and the photopolymerization initiator IB in the total solid content of the curable composition are The total content of is 1 to 6% by mass. <5> The curable composition according to any one of <1> to <4>, wherein the content of the photopolymerization initiator IB is 5 to 200 parts by mass relative to 100 parts by mass of the photopolymerization initiator IA. parts by mass. <6> The curable composition according to any one of <1> to <5>, wherein the content of the infrared absorber in the total solid content of the curable composition is 10 to 40% by mass. <7> The curable composition according to any one of <1> to <6>, wherein the content of the polymerizable monomer in the total solid content of the curable composition is 10 to 50% by mass. <8> The curable composition according to any one of <1> to <7>, which further contains a resin. <9> The curable composition according to <8>, wherein the content of the resin is 10 to 500 parts by mass relative to 100 parts by mass of the polymerizable monomer. <10> The curable composition according to any one of <1> to <9>, further comprising an ultraviolet absorber, wherein the content of the ultraviolet absorber is 100 parts by mass relative to the photopolymerization initiator IA. 10 to 500 parts by mass. <11> The curable composition according to any one of <1> to <10>, wherein the curable composition has a maximum value ^A1 of absorbance in a wavelength range of 700 to 2000 nm and an absorbance at a wavelength of 365 nm The ratio of A ³ , that is, A ¹ /A ³ is 1 or more and less than 9. <12> The curable composition according to any one of <1> to <11>, which is used for a near-infrared cut filter. <13> A cured film obtained by curing the curable composition according to any one of <1> to <12>. <14> A method for forming a pattern, comprising: a step of forming a curable composition layer on a support using the curable composition described in any one of <1> to <12>; The above-mentioned curable composition layer is irradiated with light having a wavelength of more than 350 nm to 380 nm and exposed in a pattern; a developing step is to develop the above-mentioned curable composition layer; and a second exposure step is after the above-mentioned developing step. The curable composition layer is irradiated with light having a wavelength of not less than 254 nm and not more than 350 nm. <15> The method for forming a pattern as described in <14>, which comprises the step of under a low-oxygen environment at a temperature of less than 200 The step of heating the curable composition layer at a temperature of ℃. <16> A near-infrared cut filter having the cured film described in <13>. <17> A solid-state imaging device having the cured film as described in <13>. <18> An image display device having the cured film described in <13>. <19> An infrared sensor having the cured film described in <13>. [Invention effect]

According to the present invention, it is possible to provide a curable composition capable of forming a cured film excellent in solvent resistance. In addition, it is possible to provide a cured film, a method for forming a pattern, a near-infrared cut filter, a solid-state imaging device, an image display device, and an infrared sensor.

Hereinafter, the content of the present invention will be described in detail. In this specification, "-" is used in the meaning which includes the numerical value described before and after it as a lower limit and an upper limit. In the notation of a group (atomic group) in this specification, the notation indicating substituted and unsubstituted includes a group (atomic group) without a substituent, and also includes a group (atomic group) having a substituent. For example, "alkyl" includes not only an unsubstituted alkyl group (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group). In this specification, "(meth)acrylate" means both or either of acrylate and methacrylate, and "(meth)acryl" means both or either of acrylic acid and methacrylic acid, "(Meth)acryl" means both or either of acryl and methacryl. In this specification, weight average molecular weight and number average molecular weight are defined by the polystyrene conversion value measured by gel permeation chromatography (GPC). In this specification, near-infrared rays refer to light (electromagnetic waves) having a wavelength of 700 to 2500 nm. In this specification, the total solid content refers to the total mass of the components except the solvent from all the components of the composition. In this specification, the term "step" includes not only an independent step, but also includes in this term as long as the desired function of the step is achieved even if it cannot be clearly distinguished from other steps.

<Curable composition> The curable composition of the present invention is characterized in that it contains an infrared absorber, a polymerizable monomer, and a photopolymerization initiator. The photopolymerization initiator includes methanol and has an absorption coefficient of 365 nm of 1.0×10 ³ mL/g･cm or more photopolymerization initiator IA and methanol in which the absorption coefficient at 365 nm is less than 1.0×10 ³ mL/g･cm and the absorption coefficient at 254 nm is 1.0×10 ³ mL/ The photopolymerization initiator IB having gcm or more, the ratio of the maximum value A ¹ of the absorbance in the wavelength range of 700 to 2000 nm of the curable composition above to the maximum value A ² of the absorbance in the wavelength range of 400 to 600 nm That is, A ¹ /A ² is 4.5 or more.

Since the curable composition of this invention contains the above-mentioned photoinitiator IA and photoinitiator IB as a photoinitiator, it can harden firmly to the deep part of a cured film by exposure. Therefore, according to the curable composition of the present invention, it is possible to form a resistant Cured film with excellent solvent resistance. Furthermore, since the curable composition of the present invention contains the above-mentioned photopolymerization initiator IA and photopolymerization initiator IB, it can be cured by exposing the curable composition in two stages, before development and after development. That is, in the first exposure (exposure before development), the curable composition layer can be properly cured. Therefore, a pattern with good rectangularity can be formed. Furthermore, in the subsequent exposure (exposure after development), almost the entire curable composition layer can be cured, so a pattern excellent in solvent resistance can be formed. Therefore, when a pattern is formed by photolithography using the curable composition of the present invention, the solvent resistance and rectangularity of the obtained cured film (pattern) can be achieved at a high level. In addition, the ratio of the maximum value ^A1 of the absorbance of the curable composition in the wavelength range of 700 to 2000 nm to the maximum value ^A2 of the absorbance in the wavelength range of 400 to 600 nm, that is, ^A1 / ^A2 , is 4.5 or more. Therefore, it is possible to form a cured film having excellent visible transparency and near-infrared shielding properties and having spectral characteristics suitable for near-infrared cut filters and the like.

The curable composition of the present invention is the ratio of the maximum value ^A1 of the absorbance in the wavelength range of 700 to 2000 nm to the maximum value ^A2 of the absorbance in the range of the wavelength of 400 to 600 nm (hereinafter also referred to as the absorbance ratio ^A1 /A ² ) is 4.5 or more, preferably 6 or more, more preferably 8 or more, and still more preferably 12 or more. The upper limit is not particularly limited, but can be set to 50 or less. The above condition of absorbance ratio A ¹ /A ² can be realized by any mechanism, but by adjusting the type and content of the infrared absorber, the above condition of absorbance can be preferably realized.

Absorbance Aλ at a certain wavelength λ is defined by the following formula (Ab1). Aλ=-log(Tλ/100)...(Ab1) Aλ is the absorbance at the wavelength λ, and Tλ is the transmittance (%) at the wavelength λ.

In the present invention, the value of absorbance may be a value measured in a solution state, or may be a value of a cured film formed using a curable composition. In the case of measuring absorbance in the state of a film, apply a curable composition on a support such as a glass substrate by a method such as spin coating, heat at 100°C for 120 seconds using a hot plate, etc., and let cool It is better to make a hardened film with a thickness of 1.0 μm at room temperature for measurement.

With regard to the curable composition of the present invention, in the case of exposing through a mask, it is possible to suppress the exposure of the unexposed portion of the peripheral edge of the mask due to reflected light or scattered light from a support and form a rectangular shape. Considering a good pattern, the ratio of the maximum value A ¹ of the absorbance in the wavelength range of 700 to 2000 nm to the absorbance A ³ at the wavelength of 365 nm (hereinafter also referred to as the absorbance ratio A ¹ /A ³ ) is 1 or more and not Up to 9 is better. The lower limit is preferably 1.5 or more, more preferably 2 or more. It is better if the upper limit does not reach 4.5, and it is better if it does not reach 3. The above-mentioned condition of the absorbance ratio A ¹ /A ³ can be realized by any means, but the above-mentioned condition of the absorbance can be preferably realized by a method including an ultraviolet absorber or the like.

In general, an infrared absorber has high transmittance to light such as i-rays used for exposure. Therefore, in the case of forming a pattern by photolithography using a curable composition containing an infrared absorber, a photopolymerization initiator, and a polymerizable monomer, when exposing the curable composition through a mask Therefore, the unexposed portion of the peripheral edge of the mask is easily exposed to reflected light or scattered light from the support or the like, and the rectangularity of the obtained pattern is easily deteriorated. However, when the absorbance ratio A ¹ /A ³ of the curable composition is in the above-mentioned range, when exposure is performed through the mask, the above-mentioned reflected light or scattered light in the unexposed portion around the mask can be absorbed, A pattern with good rectangularity can be formed.

When a cured film having a thickness of 1.0 μm is formed using the curable composition of the present invention, the above-mentioned absorbance ratio A ¹ /A ² for the cured film is preferably 4.5 or more, more preferably 6 or more, and further preferably 8 or more. Preferably, 12 or more is still more preferred. The upper limit is not particularly limited, but can be set to 50 or less. Regarding the above-mentioned cured film, apply a curable composition on a support such as a glass substrate by a method such as spin coating, heat at 100°C for 120 seconds using a hot plate, etc., and leave to cool to room temperature to form a film with a thickness of 1.0 μm hardened film is preferred.

It is preferable that the said absorbance ratio ^A1 / ^A3 is 1 or more and less than 9 about the said cured film. The lower limit is preferably 1.5 or more, more preferably 2 or more. It is better if the upper limit does not reach 4.5, and it is better if it does not reach 3.

The above-mentioned cured film preferably has an average transmittance of light having a wavelength of 400 to 600 nm of 70% or more, more preferably 80% or more, still more preferably 85% or more, and particularly preferably 90% or more. Moreover, it is preferable that the minimum value of the transmittance of the said cured film in the range of wavelength 400-600nm is 70% or more, it is more preferable that it is 80% or more, and it is still more preferable that it is 90% or more.

The curable composition of the present invention can be suitably used as a curable composition for a near-infrared cut filter.

Also, the curable composition of the present invention can be suitably used as a curable composition for pattern formation in photolithography. When the curable composition of the present invention is a composition for photolithography, it is preferable that the curable composition of the present invention further contains an ultraviolet absorber. Moreover, it is preferable that the said absorbance ratio ^A1 / ^A3 of a curable composition is 1.0 or more and less than 9.0. Also, the curable composition preferably contains a resin, and more preferably contains a resin having an acid group.

The solid content concentration of the curable composition of the present invention is preferably 10 to 30% by mass. The lower limit is preferably at least 10% by mass, more preferably at least 15% by mass. The upper limit is preferably at most 30% by mass, more preferably at most 25% by mass.

Hereinafter, each component used for the curable composition of this invention is demonstrated.

＜＜Infrared Absorbent＞＞ The curable composition of the present invention contains an infrared absorber. The infrared absorbing agent used in the present invention may be a pigment (also called an infrared absorbing pigment) or a dye (also called an infrared absorbing dye). In addition, an infrared absorbing dye and an infrared absorbing pigment may be used in combination. When using an infrared-absorbing dye and an infrared-absorbing pigment together, the mass ratio of the infrared-absorbing dye to the infrared-absorbing pigment is preferably 10-200 parts by mass, 10-100 parts by mass, relative to 100 parts by mass of the infrared-absorbing pigment. More preferably, it is still more preferable that it is 10-50 mass parts. When an infrared absorber containing an infrared absorbing pigment (preferably an infrared absorbing agent consisting only of an infrared absorbing pigment) is used, the pattern formability by photolithography is excellent.

The solubility of the infrared absorbing dye in 100 g of propylene glycol methyl ether acetate at 25° C. is preferably 1 g or more, more preferably 2 g or more, and still more preferably 5 g or more. In addition, the solubility of the infrared absorbing pigment in 100 g of propylene glycol methyl ether acetate at 25° C. is preferably less than 1 g, more preferably 0.1 g or less, and still more preferably 0.01 g or less.

Infrared Absorber Compounds with maximum absorption wavelengths in the wavelength range of 690-2000nm are preferred, compounds with maximum absorption wavelengths in the wavelength range of 700-1500nm are more preferred, and compounds with maximum absorption wavelengths in the wavelength range of 700-1300nm A compound having a wavelength is more preferable, and a compound having a maximum absorption wavelength within a wavelength range of 700 to 1000 nm is particularly preferable. Also, the ratio A 500 /A ^max of the absorbance A ⁵⁰⁰ at a wavelength of 500 nm of the infrared absorber to the absorbance A ^max at the maximum absorption wavelength is preferably ^0.08 or less, more preferably 0.04 or less.

Examples of infrared absorbers include pyrrolopyrrole compounds, cyanine compounds, squarylium compounds, phthalocyanine compounds, naphthalocyanine compounds, quaterrylene compounds, merocyanine compounds, crotonium compounds, Oxygenol compounds, iminium compounds, dithiol compounds, triarylmethane compounds, pyrromethene compounds, imine compounds, anthraquinone compounds, dibenzofuranone compounds, boron disulfone compounds, etc. At least one selected from the group consisting of pyrrolopyrrole compounds, cyanine compounds, squarylium compounds, phthalocyanine compounds, naphthalocyanine compounds, and borane compounds is more preferred, and pyrrolopyrrole compounds are still more preferred.

As the pyrrolopyrrole compound, a compound represented by the formula (PP-1) is preferable. [chemical formula 1]

In the formula, Rp ¹ and Rp ² each independently represent an alkyl group, an aryl group or a heteroaryl group, Rp ³ to Rp ⁶ each independently represent a hydrogen atom or a substituent, Rp ⁷ and Rp ⁸ each independently represent a hydrogen atom, an alkane A group, an aryl group, a heteroaryl group, -BRp ¹¹ Rp ¹² or a metal atom, Rp ¹¹ and Rp ¹² each independently represent a substituent, and Rp ¹¹ and Rp ¹² may be bonded to each other to form a ring.

For details of formula (PP-1), refer to paragraphs 0017 to 0047 of Japanese Patent Application Laid-Open No. 2009-263614, paragraphs 0011 to 0036 of Japanese Patent Application Laid-Open No. 2011-068731, and paragraph 0010 of International Publication No. 2015/166873. ~0024 paragraphs, and these contents are incorporated into this specification.

The alkyl group represented by Rp ¹ and Rp ² has preferably 1-30 carbon atoms, more preferably 1-20 carbon atoms, and still more preferably 1-10 carbon atoms. The alkyl group may be any of straight chain, branched chain and cyclic shape, but straight chain or branched chain is preferred. The carbon number of the aryl group represented by Rp ¹ and Rp ² is preferably 6-30, more preferably 6-20, and still more preferably 6-12. The number of carbon atoms in the ring constituting the heteroaryl group represented by Rp ¹ and Rp ² is preferably 1-30, more preferably 1-12. Examples of the type of heteroatom constituting the heteroaryl group include a nitrogen atom, an oxygen atom, and a sulfur atom. The number of heteroatoms constituting the heteroaryl group is preferably 1-3, more preferably 1-2. The heteroaryl group is preferably a monocyclic or condensed ring, more preferably a monocyclic or condensed ring with 2 to 8 condensed rings, and even more preferably a monocyclic or condensed ring with 2 to 4 condensed numbers.

The alkyl, aryl and heteroaryl groups represented by Rp ¹ and Rp ² may have substituents or may be unsubstituted. As a substituent, the substituent T shown below is mentioned. In addition, when the alkyl group, aryl group and heteroaryl group represented by ^Rp1 and ^Rp2 have two or more substituents, the substituents may be bonded to each other to form a ring.

In formula (PP-1), it is preferable that Rp ¹ and Rp ² are each independently an alkyl group or an aryl group. Preferred aspects of Rp ¹ and Rp ² include aspects in which Rp ¹ and Rp ² are each independently an alkyl group. Also, as another preferred aspect of Rp ¹ and Rp ² , an aspect in which Rp ¹ and Rp ² are each independently an aryl group can be mentioned. Also, as another preferred aspect of Rp ¹ and Rp ² , one of Rp ¹ and Rp ² is an alkyl group and the other is an aryl group.

(substituent T) Examples of the substituent T include the following groups. Halogen atom (such as fluorine atom, chlorine atom, bromine atom, iodine atom), alkyl group (preferably an alkyl group with 1 to 30 carbon atoms), alkenyl group (preferably an alkenyl group with 2 to 30 carbon atoms), Alkynyl (preferably an alkynyl with 2 to 30 carbons), aryl (preferably an aryl with 6 to 30 carbons), heteroaryl (preferably a heteroaryl with 1 to 30 carbons), Amino group (preferably an amino group with 0 to 30 carbons), alkoxy group (preferably an alkoxy group with 1 to 30 carbons), aryloxy group (preferably an aryloxy group with 6 to 30 carbons) ), heteroaryloxy (preferably heteroaryloxy with 1 to 30 carbons), acyl (preferably acyl with 2 to 30 carbons), alkoxycarbonyl (preferably with 2 to 30 carbons) 30 alkoxycarbonyl), aryloxycarbonyl (preferably aryloxycarbonyl with 7 to 30 carbons), heteroaryloxycarbonyl (preferably heteroaryloxycarbonyl with 2 to 30 carbons), acyloxy ( Preferably an acyloxy group with 2 to 30 carbons), an amido group (preferably an acylamide group with 2 to 30 carbons), an aminocarbonylamine group (preferably an aminocarbonyl group with 2 to 30 carbons amino), alkoxycarbonylamine (preferably alkoxycarbonylamine with 2 to 30 carbons), aryloxycarbonylamine (preferably aryloxycarbonylamine with 7 to 30 carbons), Sulfamoyl group (preferably sulfamoyl group with 0-30 carbons), sulfamoyl group (preferably sulfamoyl group with 0-30 carbons), carbamoyl group (preferably carbamoyl with 1 to 30 carbons), alkylthio (preferably alkylthio with 1 to 30 carbons), arylthio (preferably arylthio with 6 to 30 carbons), heteroaryl Thio group (preferably a heteroarylthio group with 1 to 30 carbons), alkylsulfonyl group (preferably an alkylsulfonyl group with 1 to 30 carbons), alkylsulfonamide group (preferably Alkylsulfonylamide with 1 to 30 carbons), arylsulfonyl (preferably arylsulfonyl with 6 to 30 carbons), arylsulfonylamide (preferably 6 to 30 carbons) 30 arylsulfonylamino), heteroarylsulfonyl (preferably heteroarylsulfonyl with 1 to 30 carbons), heteroarylsulfonylamide (preferably 1 to 30 carbons Heteroarylsulfinylamino), alkylsulfinyl (preferably alkylsulfinyl with 1 to 30 carbons), arylsulfinyl (preferably with 6 to 30 carbons Arylsulfinyl group), heteroarylsulfinyl group (preferably a heteroarylsulfinyl group with 1 to 30 carbon atoms), ureido group (preferably a ureido group with 1 to 30 carbon atoms), Hydroxyl, nitro, carboxyl, sulfonic acid, phosphoric acid, carboxylic acid amido, sulfonamide, imide, phosphino, mercapto, cyano, alkylsulfinic acid, arylsulfinic Acid group, aryl azo group, heteroaryl azo group, phosphinyl group, phosphinyloxy group, phosphinyl amine group, silyl group, hydrazine group, imine group. When these groups are groups that can further be substituted, they may further have a substituent. As a substituent, what was demonstrated in the said substituent T is mentioned.

In formula (PP-1), Rp ³ to Rp ⁶ each independently represent a hydrogen atom or a substituent. The substituent T mentioned above is mentioned as a substituent.

One of R ³ and R ⁴ is preferably a heteroaryl group and the other is an electron-withdrawing group. Also, one of R ⁵ and R ⁶ is preferably a heteroaryl group and the other is an electron-withdrawing group.

Here, the substituent whose Hammett's σp value (sigma para value) is positive acts as an electron-withdrawing group. In the present specification, as the electron-withdrawing group, a substituent having a Hammett's σp value of 0.2 or more can be exemplified. The σp value is preferably at least 0.25, more preferably at least 0.3, and most preferably at least 0.35. The upper limit is not particularly limited, but is preferably 0.80 or less. Specific examples of electron-withdrawing groups include cyano (0.66), carboxyl (-COOH: 0.45), alkoxycarbonyl (for example, -COOCH ₃ : 0.45), aryloxycarbonyl (for example, -COOCH ₃ : 0.44), carbamoyl (e.g., -CONH ₂ : 0.36), alkylcarbonyl (e.g., -COCH ₃ : 0.50), arylcarbonyl (e.g., -COPh: 0.43), alkylsulfonyl (e.g., -SO ₂ CH ₃ : 0.72), arylsulfonyl (for example, -SO ₂ Ph: 0.68) and the like. The electron-withdrawing group is preferably a cyano group, an alkylcarbonyl group, an alkylsulfonyl group and an arylsulfonyl group, more preferably a cyano group. That is, one of R ¹ and R ² and one of R ³ and R ⁴ in formula (1) is preferably a cyano group. Here, Ph represents a phenyl group. Regarding Hammett's σp value, paragraphs 0024 to 0025 of JP-A-2009-263614 can be referred to, and the contents thereof are incorporated in the present specification.

The carbon of the ring constituting the heteroaryl group represented by any one of ^R3 and ^R4 of formula (PP-1) and the heteroaryl group represented by any one of ^R5 and ^R6 of formula (PP-1) The number of atoms is preferably 1-30, more preferably 1-12. Examples of the type of heteroatom constituting the heteroaryl group include a nitrogen atom, an oxygen atom, and a sulfur atom. The number of heteroatoms constituting the heteroaryl group is preferably 1-3, more preferably 1-2. The heteroaryl group is preferably a monocyclic or condensed ring, more preferably a monocyclic or condensed ring with 2 to 8 condensed rings, and even more preferably a monocyclic or condensed ring with 2 to 4 condensed numbers. The above-mentioned heteroaryl group may be unsubstituted or may have a substituent. As a substituent, what was demonstrated in the said substituent T is mentioned.

Rp ⁷ and Rp ⁸ in the formula (PP-1) each independently represent a hydrogen atom, an alkyl group, an aryl group, a heteroaryl group, -BRp ¹¹ Rp ¹² or a metal atom, and -BRp ¹¹ Rp ¹² is preferred. Examples of substituents represented by Rp ¹¹ and Rp ¹² in the group represented by -BRp ¹¹ Rp ¹² include halogen atoms, alkyl groups, alkenyl groups, aryl groups, heteroaryl groups, alkoxy groups, and aryloxy groups. And a heteroaryloxy group, a halogen atom, an alkyl group, an aryl group or a heteroaryl group is preferable, a halogen atom, an alkyl group or an aryl group is more preferable, and an aryl group is still more preferable.

Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom, with a fluorine atom being preferred. The carbon number of the alkyl group and the alkoxy group is preferably 1-20, more preferably 1-15, and still more preferably 1-8. The alkyl and alkoxy groups may be any of straight chain, branched chain, and cyclic, and straight chain or branched chain is preferred. An alkyl group and an alkoxy group may have a substituent, and may be unsubstituted. As a substituent, an aryl group, a heteroaryl group, a halogen atom, etc. are mentioned. The carbon number of the alkenyl group is preferably 2-20, more preferably 2-15, and still more preferably 2-8. The alkenyl group may have a substituent or may be unsubstituted. As a substituent, an alkoxy group, an aryl group, a heteroaryl group, a halogen atom, etc. are mentioned. The carbon number of the aryl group and the aryloxy group is preferably 6-20, more preferably 6-12. An aryl group and an aryloxy group may have a substituent or may be unsubstituted. As a substituent, an alkyl group, an alkoxy group, a halogen atom, etc. are mentioned. A heteroaryl group and a heteroaryloxy group may be a single ring or a condensed ring. The number of hetero atoms constituting the heteroaryl ring of the heteroaryl group and heteroaryloxy group is preferably 1-3. The heteroatom constituting the heteroaryl ring is preferably a nitrogen atom, an oxygen atom or a sulfur atom. The number of carbon atoms in the ring constituting the heteroaryl ring is preferably 1-30, more preferably 1-18, and still more preferably 1-12. The heteroaryl ring is preferably a 5-membered ring or a 6-membered ring. A heteroaryl group and a heteroaryloxy group may have a substituent or may be unsubstituted. As a substituent, an alkyl group, an alkoxy group, a halogen atom, etc. are mentioned.

Rp ¹¹ and Rp ¹² in the group represented by -BRp ¹¹ Rp ¹² may be bonded to each other to form a ring. Examples of the formed ring include structures represented by formulas (B-1) to (B-5), and the like. Hereinafter, Rb represents a substituent, Rb ¹ to Rb ⁴ each independently represent a hydrogen atom or a substituent, b1 to b3 each independently represent an integer of 0 to 4, b4 represents an integer of 0 to 6, and * represents a bond. The substituents represented by Rb and Rb ¹ to Rb ⁴ include groups exemplified in the above-mentioned substituent T, among which halogen atoms, alkyl groups, and alkoxy groups are preferred. [chemical formula 2]

It is also preferable that the pyrrolopyrrole compound is a compound represented by formula (PP-2). [chemical formula 3]

In the formula, Lp ²¹ represents an n-valent linking group, Rp ²¹ represents an alkyl group, an aryl group or a heteroaryl group, Rp ²² to Rp ²⁵ independently represent a hydrogen atom or a substituent, Rp ²⁶ and Rp ²⁷ represent independently hydrogen atom, alkyl, aryl, heteroaryl, -BRp ³¹ Rp ³² or a metal atom, Rp ³¹ and Rp ³² each independently represent a substituent, Rp ³¹ and Rp ³² can be bonded to each other to form a ring, n represents 2 or more an integer of .

n in the formula (PP-2) represents an integer of 2 or more, preferably an integer of 2 to 4, and more preferably 2.

Examples of the n-valent linking group represented by Lp ²¹ of the formula (PP-2) include aliphatic hydrocarbon groups, aromatic hydrocarbon groups, heterocyclic groups, -O-, -S-, -CO-, -COO-, -OCO-, -SO ₂ -, -NR ^L -, -NR ^L CO-, -CONR ^L -, -NR ^L SO ₂ -, -SO ₂ ^NRL -, and groups consisting of combinations thereof. ^RL represents a hydrogen atom, an alkyl group or an aryl group. The carbon number of the aliphatic hydrocarbon group is preferably 1-20, more preferably 2-20, still more preferably 2-10, and particularly preferably 2-5. The aliphatic hydrocarbon group may be any of linear, branched and cyclic. Also, the cyclic aliphatic hydrocarbon group may be either monocyclic or polycyclic. The number of carbon atoms in the aromatic hydrocarbon group is preferably 6-18, more preferably 6-14, and still more preferably 6-10. The aromatic hydrocarbon group is preferably an aromatic hydrocarbon group having a single ring or a condensed ring having 2 to 4 condensation numbers. As the aromatic hydrocarbon group, a phenyl ring group is preferred. As for the heterocyclic group, a monocyclic ring or a condensed ring having 2 to 4 condensed rings is preferable. The number of heteroatoms in the ring constituting the heterocyclic group is preferably 1-3. The hetero atom constituting the ring of the heterocyclic group is preferably a nitrogen atom, an oxygen atom or a sulfur atom. The number of carbon atoms in the ring constituting the heterocyclic group is preferably 1-30, more preferably 1-18, and more preferably 1-12. An aliphatic hydrocarbon group, an aromatic hydrocarbon group, and a heterocyclic group may have a substituent. As a substituent, the group mentioned as the substituent T mentioned above is mentioned. Moreover, the carbon number of the alkyl group represented by ^RL is preferably 1-20, more preferably 1-15, and still more preferably 1-8. The alkyl group may be any of straight chain, branched chain, and cyclic shape. Straight chain or branched chain is preferable, and straight chain is more preferable. The alkyl group represented by R ^L may have a substituent. The substituent T mentioned above is mentioned as a substituent. The carbon number of the aryl group represented by ^RL is preferably 6-30, more preferably 6-20, and still more preferably 6-12. The aryl group represented by R ^L may have a substituent. The substituent T mentioned above is mentioned as a substituent.

The carbon number of the alkyl group represented by Rp ²¹ of the formula (PP-2) is preferably 1-30, more preferably 1-20, and still more preferably 1-10. The alkyl group may be any of straight chain, branched chain and cyclic shape, but straight chain or branched chain is preferred. The carbon number of the aryl group represented by Rp ²¹ of the formula (PP-2) is preferably 6-30, more preferably 6-20, and still more preferably 6-12. The number of carbon atoms in the ring of the heteroaryl group represented by Rp ²¹ constituting the formula (PP-2) is preferably 1-30, more preferably 1-12. Examples of the type of heteroatom constituting the heteroaryl group include a nitrogen atom, an oxygen atom, and a sulfur atom. The number of heteroatoms constituting the heteroaryl group is preferably 1-3, more preferably 1-2. The heteroaryl group is preferably a monocyclic or condensed ring, more preferably a monocyclic or condensed ring with 2 to 8 condensed rings, and even more preferably a monocyclic or condensed ring with 2 to 4 condensed numbers. The alkyl group, aryl group and heteroaryl group represented by Rp ²¹ of the formula (PP-2) may have a substituent or may be unsubstituted. The substituent T mentioned above is mentioned as a substituent. Also, when the alkyl group, aryl group and heteroaryl group represented by Rp ²¹ have two or more substituents, the substituents may be bonded to each other to form a ring.

Rp ²¹ of the formula (PP-2) is preferably an alkyl or aryl group.

Rp ²² to Rp ²⁵ in the formula (PP-2) each independently represent a hydrogen atom or a substituent. The substituent T mentioned above is mentioned as a substituent.

It is preferred that one of R ²² and R ²³ is a heteroaryl group and the other is an electron-withdrawing group. Also, one of R ²⁴ and R ²⁵ is preferably a heteroaryl group and the other is an electron-withdrawing group. Examples of the electron-withdrawing group include the above-mentioned groups, and a cyano group is preferable. The heteroaryl group can be exemplified as the heteroaryl group represented by any one of ^R3 and ^R4 of formula (PP-1) and the heteroaryl group represented by any one of ^R5 and ^R6 of formula (PP-1). The preferred ranges of the groups described for the aryl group are also the same.

Rp ²⁶ and Rp ²⁷ in formula (PP-2) independently represent a hydrogen atom, an alkyl group, an aryl group, a heteroaryl group, -BRp ³¹ Rp ³² or a metal atom, and -BRp ³¹ Rp ³² is preferred. As the substituents represented by Rp ³¹ and Rp ³² in the group represented by -BRp ³¹ Rp ³² in formula (PP-2), those represented by -BRp ¹¹ Rp ¹² in formula (PP-1) can be mentioned. The preferred ranges of the groups described by the substituents represented by Rp ¹¹ and Rp ¹² in the group are also the same. In addition, Rp ³¹ and Rp ³² in the group represented by -BRp ³¹ Rp ³² may be bonded to each other to form a ring. As a formed ring, the structure etc. which are represented by said formula (B-1) - (B-5) are mentioned, for example.

As a specific example of a pyrrolopyrrole compound, the compound of the structure described in the Example mentioned later is mentioned. In addition, examples of the pyrrolopyrrole compound include compounds described in paragraphs 0016 to 0058 of JP-A-2009-263614 , compounds described in paragraphs 0037-0052 of JP-A-2011-068731 , international Compounds described in paragraphs 0010 to 0033 of Publication No. 2015/166873, etc. Examples of squarylium compounds include compounds described in paragraphs 0044 to 0049 of Japanese Patent Application Laid-Open No. 2011-208101, compounds described in paragraphs 0060 to 0061 of Japanese Patent No. 6065169, International Publication No. 2016/ Compounds described in Paragraph 0040 of No. 181987, compounds described in JP-A No. 2015-176046, compounds described in Paragraph 0072 of International Publication No. 2016/190162, compounds described in JP-A No. 2016-074649 Compounds described in paragraphs 0196 to 0228, compounds described in paragraph 0124 of JP-A-2017-067963, compounds described in International Publication No. 2017/135359, JP-A-2017-114956 Compounds described, compounds described in Japanese Patent No. 6197940, compounds described in International Publication No. 2016/120166, etc.

Specific examples of squaraine compounds include compounds having structures described in Examples described later. In addition, as the squarylium compound and the crotonium compound, the squarylium compound described in Japanese Patent Application Laid-Open No. 2017-197437, the squarylium compound described in Japanese Patent Laid-Open No. 2017-025311, The squaraine compound described in International Publication No. 2016/154782, the squaraine compound described in Japanese Patent No. 5884953, the squaraine compound described in Japanese Patent No. 6036689, and Japanese Patent No. 5810604 The squaraine compound described in Publication No. 2017/213047, the squaraine compound described in paragraphs 0090 to 0107 of International Publication No. 2017/213047, the compound described in paragraphs 0019 to 0075 of Japanese Patent Laid-Open No. 2018-054760 , Compounds described in paragraphs 0078 to 0082 of JP 2018-040955 A, compounds described in paragraphs 0043 to 0069 of JP 2018-002773 A, 0024 to 0024 in JP 2018-041047 A The squaraine compound having an aromatic ring at the amide α-position described in paragraph 0086, the amide-linked squaraine compound described in JP-A-2017-179131, and JP-A-2017-141215 A compound having a pyrrole double-type squarylium skeleton or a crotonium skeleton, a dihydroxycarbazole double-type squaraine compound described in JP-A-2017-082029, JP-A-2017-068120 Compounds described in paragraphs 0027 to 0114 of , and compounds described in JP-A-2017-067963, etc.

Examples of boron disulfone compounds include compounds having structures described in Examples described later. Moreover, examples of boron disulfone compounds include compounds described in paragraphs 0103 to 0117 of JP-A-2015-040231.

Examples of cyanine compounds include compounds described in paragraphs 0044 to 0045 of JP 2009-108267 A, compounds described in paragraphs 0026 to 0030 of JP 2002-194040 A, JP 2015 - Compounds described in Publication No. 172004, Compounds described in Japanese Patent Application Laid-Open No. 2015-172102, Compounds described in Japanese Patent Application Publication No. 2008-088426, Paragraph 0090 of International Publication No. 2016/190162 Compounds described, compounds described in JP-A-2017-031394, etc.

Examples of the phthalocyanine compound include compounds described in paragraph 0093 of JP-A-2012-077153, phthalocyanine-titanium compounds described in JP-A-2006-343631, JP-A-2013-195480 Compounds described in paragraphs 0013 to 0029, vanadium phthalocyanine compounds described in Japanese Patent No. 6081771, vanadium phthalocyanine compounds described in International Publication No. 2020/071486, and vanadium phthalocyanine compounds described in International Publication No. 2020/071470 The recorded phthalocyanine compounds.

Examples of the naphthalocyanine compound include compounds described in paragraph 0093 of JP-A-2012-077153.

In this invention, a commercial item can also be used for an infrared absorber. Examples include SDO-C33 (manufactured by Arimoto Chemical Co. Ltd.), EX Color IR-14, EX Color IR-10A, EX Color TX-EX-801B, EX Color TX-EX-805K (manufactured by NIPPON SHOKUBAI CO., LTD.), ShigenoxNIA-8041, ShigenoxNIA-8042, ShigenoxNIA-814, ShigenoxNIA-820, ShigenoxNIA-839 (manufactured by Hakko Chemical Co., Ltd.), EpoliteV-63, Epolight3801, Epolight3036 (manufactured by EPOLIN INC.), PRO -JET825LDI (manufactured by FUJIFILM CORPORATION), NK-3027, NK-5060 (manufactured by HAYASHIBARA CO.,LTD.), YKR-3070 (manufactured by Mitsui Chemicals, Inc.), FDR-003, FDR-004, FDR-005 (manufactured by YAMADA CHEMICAL CO., LTD.), etc.

The content of the infrared absorber in the total solid content of the curable composition is preferably from 10 to 40% by mass, more preferably from 10 to 30% by mass, and still more preferably from 10 to 25% by mass. When content of an infrared absorber exists in the said range, the cured film which has both near-infrared shielding property and visible transparency at a high level can be obtained. The curable composition of the present invention may contain only one type of infrared absorbing agent, or may contain two or more types. When two or more infrared absorbers are contained, it is preferable that the total amount is within the above range.

＜＜Photopolymerization Initiator＞＞ The curable composition of the present invention contains a photopolymerization initiator. Examples of photopolymerization initiators include halogenated hydrocarbon derivatives (for example, compounds having a trioxane skeleton, compounds having a oxadiazole skeleton, etc.), acylphosphine compounds, hexaarylbiimidazole compounds, oxime compounds, organic Peroxides, sulfur compounds, ketone compounds, aromatic onium salts, aminoalkylphenone compounds, hydroxyalkylphenone compounds, phenylglyoxylate compounds, and the like.

Examples of the phenylglyoxylate compound include methyl phenylglyoxylate and the like. As a commercial item, Omnirad MBF (made by IGM Resins B.V.) etc. are mentioned.

Examples of the aminoalkylphenone compound include Omnirad 907, Omnirad 369, Omnirad 369E, and Omnirad 379EG (the above are manufactured by IGM Resins B.V.).

Examples of the acylphosphine compound include Omnirad 819, Omnirad TPO (the above are manufactured by IGM Resins B.V.), and the like.

式中，Rv ¹表示取代基，Rv ²及Rv ³分別獨立地表示氫原子或取代基，Rv ²與Rv ³可以相互鍵結而形成環，m表示0～5的整數。 Examples of the hydroxyalkylphenone compound include compounds represented by the following formula (V). [chemical formula 4]

In the formula, Rv ¹ represents a substituent, Rv ² and Rv ³ independently represent a hydrogen atom or a substituent, Rv ² and Rv ³ may be bonded to each other to form a ring, and m represents an integer of 0-5.

Examples of the substituent represented by ^Rv1 include an alkyl group (preferably an alkyl group having 1 to 10 carbon atoms) and an alkoxy group (preferably an alkoxy group having 1 to 10 carbon atoms). The alkyl and alkoxy groups are preferably linear or branched, more preferably linear. The alkyl group and alkoxy group represented by ^Rv1 may be unsubstituted or may have a substituent. As a substituent, the group which has a hydroxyl group or a hydroxyalkyl phenone structure, etc. are mentioned. Examples of the group having a hydroxyalkylphenone structure include a benzene ring in which Rv ¹ is bonded in formula (V), or a group having a structure in which one hydrogen atom is removed from Rv ¹ .

Rv ² and Rv ³ each independently represent a hydrogen atom or a substituent. As a substituent, an alkyl group (preferably an alkyl group having 1 to 10 carbon atoms) is preferable. Also, Rv ² and Rv ³ may be bonded to each other to form a ring (preferably a ring having 4 to 8 carbon atoms, more preferably an aliphatic ring having 4 to 8 carbon atoms). The alkyl group is preferably a straight chain or a branched chain, more preferably a straight chain.

Specific examples of the compound represented by formula (V) include compounds of the following structures. [chemical formula 5]

As a commercial item of a hydroxyalkyl phenone compound, Omnirad 184, Omnirad 1173, Omnirad 2959, Omnirad 127 (the above are made by IGM Resins B.V.) etc. are mentioned.

Examples of the oxime compound include compounds described in JP-A-2001-233842, compounds described in JP-A-2000-080068, compounds described in JP-A-2006-342166, J.C.S. Compounds described in Perkin II (1979, pp.1653-1660), compounds described in J.C.S. Perkin II (1979, pp.156-162), Journal of Photopolymer Science and Technology (1995, pp.202) -232), the compound described in JP-A-2000-066385, the compound described in JP-A-2004-534797, the compound described in JP-2006-342166 Compounds, compounds described in Japanese Patent Laid-Open No. 2017-019766, compounds described in Japanese Patent No. 6065596, compounds described in International Publication No. 2015/152153, compounds described in International Publication No. 2017/051680 Compounds described, compounds described in JP-A-2017-198865, compounds described in paragraphs 0025 to 0038 of International Publication No. 2017/164127, compounds described in International Publication No. 2013/167515, etc. Specific examples of oxime compounds include 3-benzoyloxyiminobutan-2-one, 3-acetyloxyiminobutan-2-one, 3-propionyloxyiminobutan-2-one, Aminobutan-2-one, 2-Acetyloxyiminopentan-3-one, 2-Acetyloxyimino-1-phenylpropan-1-one, 2-Benzoyl Oxyimino-1-phenylpropan-1-one, 3-(4-tosyloxy)iminobutan-2-one, 2-ethoxycarbonyloxyimino-1 -Phenylpropan-1-one, 1-[4-(phenylthio)phenyl]-3-cyclohexyl-propane-1,2-dione-2-(O-acetyloxime), etc. Commercially available products include Irgacure OXE01, Irgacure OXE02, Irgacure OXE03, Irgacure OXE04 (the above are manufactured by BASF Corporation), TR-PBG-304, TR-PBG-327 (manufactured by TRONLY Corporation), ADEKA OPTOMER N-1919 ( ADEKA Corporation make, and the photoinitiator 2) described in Unexamined-Japanese-Patent No. 2012-014052. In addition, as the oxime compound, it is also preferable to use a non-coloring compound or a compound with high transparency and low discoloration. As a commercial item, ADEKA ARKLS NCI-730, NCI-831, NCI-930 (the above are made by ADEKA CORPORATION) etc. are mentioned.

It is also preferable that the oxime compound is an oxime compound having a fluorine atom. Specific examples of oxime compounds having a fluorine atom include compounds described in JP-A-2010-262028, compounds 24, 36-40 described in JP-A-2014-500852, JP-A Compound (C-3) described in Publication No. 2013-164471, etc.

As the oxime compound, an oxime compound having a stilbene ring can also be used. Specific examples of the oxime compound having an oxene ring include compounds described in JP-A-2014-137466.

As the oxime compound, an oxime compound having a skeleton in which at least one benzene ring in a carbazole ring becomes a naphthalene ring can also be used. Specific examples of such oxime compounds include compounds described in International Publication No. 2013/083505.

An oxime compound in which a substituent having a hydroxyl group is bonded to the carbazole skeleton can also be used as the oxime compound. Examples of such photopolymerization initiators include compounds described in International Publication No. 2019/088055, and the like.

As the oxime compound, an oxime compound having a nitro group can be used. It is also preferred that the oxime compound having a nitro group be a dimer. Specific examples of oxime compounds having a nitro group include those described in paragraphs 0031 to 0047 of JP-A-2013-114249, and paragraphs 0008-0012 and 0070-0079 of JP-A-2014-137466. Compound, compound described in paragraphs 0007 to 0025 of Japanese Patent No. 4223071, ADEKA ARKLS NCI-831 (manufactured by ADEKA CORPORATION).

An oxime compound having a benzofuran skeleton can also be used as the oxime compound. Specific examples include OE-01 to OE-75 described in International Publication No. 2015/036910.

An oxime compound in which a substituent having a hydroxyl group is bonded to the carbazole skeleton can also be used as the oxime compound. Examples of such photopolymerization initiators include compounds described in International Publication No. 2019/088055, and the like.

Specific examples of oxime compounds are shown below, but the present invention is not limited thereto.

[化學式7]

[化學式8]

[chemical formula 6]

[chemical formula 7]

[chemical formula 8]

In the present invention, as a photopolymerization initiator, a photopolymerization initiator IA (hereinafter also referred to as a photopolymerization initiator) whose absorption coefficient at a wavelength of 365 nm in methanol is 1.0×10 ³ mL/g·cm or more is used together. IA) and photopolymerization initiator IB with an absorption coefficient of less than 1.0×10 ³ mL/g･cm at a wavelength of 365 nm and an absorption coefficient of at least 1.0×10 ³ mL/g･cm at a wavelength of 254 nm in methanol (hereinafter also referred to as called photopolymerization initiator IB). As the photopolymerization initiator IA and the photopolymerization initiator IB, a compound having the above-mentioned light absorption coefficient can be selected and used from the above-mentioned compounds.

上述式中，ε表示吸光係數（mL/g･cm），A表示吸光度，c表示光聚合起始劑的濃度（g/mL），l表示光徑長度（cm）。 Furthermore, in the present specification, the light absorption coefficient at the above-mentioned wavelength of the photopolymerization initiator is a value measured as follows. That is, it is calculated by dissolving the photopolymerization initiator in methanol to prepare a measurement solution and measuring the absorbance of the measurement solution. Specifically, the above-mentioned measurement solution was put into a glass cell with a width of 1 cm, and the absorbance was measured using a UV-Vis-NIR spectrometer (Cary5000) manufactured by Agilent Technologies, and substituted into the following formula to calculate the wavelength at 365 nm and 254 nm. Absorption coefficient (mL/g･cm). [Formula 1]

In the above formula, ε represents the absorption coefficient (mL/g･cm), A represents the absorbance, c represents the concentration of the photopolymerization initiator (g/mL), and l represents the optical path length (cm).

The photopolymerization initiator IA has an absorption coefficient of light with a wavelength of 365 nm in methanol of 1.0×10 ³ mL/g･cm or more, preferably 2.0×10 ³ mL/g･cm or more, and 3.0×10 ³ mL/g More preferably ･cm or more, and still more preferably 5.0×10 ³ mL/g･cm or more. The upper limit is preferably 1.0×10 ⁵ mL/g･cm or less, and more preferably 1.0×10 ⁴ mL/g･cm or less. In addition, the photopolymerization initiator IA preferably has an absorption coefficient of light with a wavelength of 254 nm in methanol of 1.0×10 ³ mL/g･cm or more, more preferably 1.5×10 ³ mL/g･cm or more, and 3.0×10 3 mL/g･cm or more. More than 10 ³ mL/g･cm is more preferable. The upper limit is preferably 1.0×10 ⁵ mL/g･cm or less, more preferably 9.5×10 ⁴ mL/g･cm or less, and still more preferably 8.0×10 ⁴ mL/g･cm or less.

As the photopolymerization initiator IA, an oxime compound, an aminoalkylphenone compound, or an acylphosphine compound is preferable, and an oxime compound or an acylphosphine compound is more preferable, and it is compatible with other components contained in the composition. From the viewpoint of solubility, oxime compounds are more preferable. Specific examples of the photopolymerization initiator IA include Compound (C-7), Compound (C-8), Compound (C-13), Compound (C-14), and Compound (C-14) shown in the specific examples of the oxime compound above. )wait. As a commercial item, Irgacure OXE01 and Irgacure OXE02 manufactured by BASF Corporation as an oxime compound, Omnirad 819 manufactured by IGM Resins B.V. as an acylphosphine compound, etc. are mentioned, for example.

The photopolymerization initiator IB has an absorption coefficient of light with a wavelength of 365 nm in methanol of less than 1.0×10 ³ mL/g･cm, preferably 3.0×10 ² mL/g･cm or less, and 1.0×10 ² mL/g ･Below cm is better. The lower limit is preferably 10 mL/g･cm or more, and more preferably 20 mL/g･cm or more. In addition, the difference between the light absorption coefficient of photopolymerization initiator IA with a wavelength of 365 nm in methanol and the photopolymerization initiator IB with a light absorption coefficient of light with a wavelength of 365 nm in methanol is 9.0×10 ² mL/g·cm or more More preferably, 1.0×10 ³ mL/g･cm or more is more preferable, and 3.0×10 ³ mL/g･cm or more is still more preferable. Also, the photopolymerization initiator IB has an absorption coefficient of light with a wavelength of 254 nm in methanol of 1.0×10 ³ mL/g·cm or more, preferably 5.0×10 ³ mL/g·cm or more. The upper limit is preferably 1.0×10 ⁶ mL/g･cm or less, and more preferably 1.0×10 ⁵ mL/g･cm.

As photopolymerization initiator IB, hydroxyalkyl phenone compound, phenylglyoxylate compound or acyl phosphine compound is better, hydroxyalkyl phenone compound or phenylglyoxylate compound is more preferable, hydroxyalkyl Benzophenone compounds are further preferred. Also, as the hydroxyalkylphenone compound, a compound represented by the above-mentioned formula (V) is preferable. As a specific example of photoinitiator IB, the compound of the structure shown as a specific example of the compound represented by said formula (V) is mentioned. Moreover, as a commercial item of photopolymerization initiator IB, Omnirad 184, Omnirad 2959, etc. by the IGM Resins B.V. company which are a hydroxyalkyl phenone compound are mentioned.

As a combination of the photopolymerization initiator IA and the photopolymerization initiator IB, it is possible to increase the light absorption coefficient of light exceeding a wavelength of 350 nm to 380 nm and the light absorption coefficient of light having a wavelength of 254 nm to 350 nm. The combination of the initiator IA being an oxime compound and the photopolymerization initiator IB being a hydroxyalkylphenone compound is preferable. Moreover, it is preferable that photoinitiator IB is a compound represented by said formula (V).

The total content of the photopolymerization initiator IA and the photopolymerization initiator IB in the total solid content of the curable composition is preferably 1 to 12% by mass, more preferably 1 to 6% by mass. The upper limit is preferably 5% by mass or less. The lower limit is preferably at least 1.5% by mass, more preferably at least 2% by mass. When the total content of the photoinitiator IA and the photoinitiator IB is within the above range, a cured film excellent in solvent resistance can be formed. In addition, the curable composition of the present invention tends to have high light transmittance for exposure, and when the curable composition is exposed through a mask, the unexposed portion at the periphery of the mask is likely to be exposed to light from a support or the like. However, if the total content of photopolymerization initiator IA and photopolymerization initiator IB is within the above range (preferably 1 to 6% by mass), it is possible to suppress The production of active species such as free radicals. Therefore, even when a pattern is formed by photolithography, a pattern with good rectangularity can be formed.

It is preferable that content of photoinitiator IB is 5-200 mass parts with respect to 100 mass parts of photoinitiator IA. The upper limit is preferably at most 100 parts by mass, more preferably at most 60 parts by mass. The lower limit is preferably at least 10 parts by mass, more preferably at least 30 parts by mass. If the ratio of the photopolymerization initiator IA to the photopolymerization initiator IB is within the above range, even if the total amount of the photopolymerization initiator IA and the photopolymerization initiator IB is small, excellent rectangularity and sufficient solvent resistance.

The curable composition of the present invention can also contain photopolymerization initiators other than photopolymerization initiator IA and photopolymerization initiator IB (hereinafter also referred to as other photopolymerization initiators) as photopolymerization initiators, However, it is preferable not to contain other photopolymerization initiators.

＜＜Polymerizable monomer＞＞ The curable composition of the present invention contains a polymerizable monomer. Examples of the polymerizable monomer include compounds having an ethylenically unsaturated bond-containing group, and the like. Examples of the ethylenically unsaturated bond-containing group include vinyl, (meth)allyl, (meth)acryl, and the like. The polymerizable monomer is preferably a compound that can be polymerized by radicals (radical polymerizable monomer).

The molecular weight of the polymerizable monomer is preferably 100-2000. The upper limit is preferably 1500 or less, more preferably 1000 or less. The lower limit is more preferably 150 or more, and more preferably 250 or more.

The ethylenically unsaturated bond-containing group value (hereinafter referred to as C=C value) of the polymerizable monomer is preferably 5 to 20 mmol/g. The lower limit is preferably at least 6 mmol/g, more preferably at least 8 mmol/g. The upper limit is preferably at most 18 mmol/g, more preferably at most 12 mmol/g. The C=C value of the polymerizable monomer is a value calculated by dividing the number of ethylenically unsaturated bond-containing groups contained in one molecule of the polymerizable monomer by the molecular weight of the polymerizable monomer.

The polymerizable monomer is preferably a compound containing two or more ethylenically unsaturated bond-containing groups, more preferably a compound containing three or more ethylenically unsaturated bond-containing groups, and contains 3 to 15 ethylenically unsaturated bond-containing groups. A compound containing a group having an ethylenically unsaturated bond is further preferred, and a compound containing 3 to 6 groups containing an ethylenically unsaturated bond is still more preferred. Moreover, it is preferable that the compound which has an ethylenically unsaturated bond-containing group is a 3-15 functional (meth)acrylate compound, and it is more preferable that it is a 3-6 functional (meth)acrylate compound. Specific examples of compounds having an ethylenically unsaturated bond-containing group include paragraphs 0095 to 0108 of JP-A-2009-288705, paragraph 0227 of JP-A-2013-029760, JP-A-2008 - Paragraphs 0254 to 0257 of Japanese Patent Application Publication No. 292970, paragraphs 0034 to 0038 of Japanese Patent Application Publication No. 2013-253224, paragraph 0477 of Japanese Patent Application Publication No. 2012-208494, Japanese Patent Application Publication No. 2017-048367, and Japanese Patent Publication No. 6057891 The compounds described in the gazette, Japanese Patent No. 6031807, and Japanese Patent Application Laid-Open No. 2017-194662 are incorporated in this specification.

As a polymerizable monomer, diperythritol tri(meth)acrylate (a commercially available product is KAYARAD D-330; manufactured by Nippon Kayaku Co., Ltd.), diperythritol tetra(meth)acrylic acid Ester (KAYARAD D-320 as a commercial product; manufactured by Nippon Kayaku Co., Ltd.), Dineopentaerythritol penta(meth)acrylate (KAYARAD D-310 as a commercial product; manufactured by Nippon Kayaku Co., Ltd.), diperythritol hexa(meth)acrylate (commercially available as KAYARAD DPHA; Nippon Kayaku Co., Ltd., NK ESTER A-DPH-12E; Shin-Nakamura Chemical Co., Ltd.) and compounds in which such (meth)acryl groups are bonded via ethylene glycol and/or propylene glycol residues (for example, SR454, SR499 commercially available from SARTOMER Company, Inc.), etc. is better. In addition, as a polymerizable monomer, diglycerol EO (ethylene oxide) modified (meth)acrylate (commercially available as M-460; manufactured by TOAGOSEI CO., Ltd.), neopentyl tetradecyl Alcohol tetraacrylate (manufactured by Shin Nakamura Chemical Co., Ltd., NK Ester A-TMMT), 1,6-hexanediol diacrylate (manufactured by Nippon Kayaku Co., Ltd., KAYARAD HDDA), RP-1040 ( Nippon Kayaku Co., Ltd.), ARONIX TO-2349 (TOAGOSEI CO., Ltd.), NK Oligo UA-7200 (Shin Nakamura Chemical Co., Ltd.), 8UH-1006, 8UH-1012 (Taisei Fine Chemical Co., Ltd.), LIGHT ACRYLATE POB-A0 (manufactured by KYOEISHA CHEMICAL Co., Ltd.), etc.

Also, as polymerizable monomers, trimethylolpropane tri(meth)acrylate, trimethylolpropane propylene oxide modified tri(meth)acrylate, trimethylolpropane ethylene oxide modified Trifunctional (meth)acrylate compounds such as tri(meth)acrylate, ethylene oxide modified tri(meth)acrylate, and neopentylthritol tri(meth)acrylate are also better. Commercially available trifunctional (meth)acrylate compounds include ARONIX M-309, M-310, M-321, M-350, M-360, M-313, M-315, M- 306, M-305, M-303, M-452, M-450 (manufactured by TOAGOSEI CO., Ltd.), NK ESTER A9300, A-GLY-9E, A-GLY-20E, A-TMM-3, A -TMM-3L, A-TMM-3LM-N, A-TMPT, TMPT (manufactured by Shin Nakamura Chemical Co., Ltd.), KAYARAD GPO-303, TMPTA, THE-330, TPA-330, PET-30 (Nippon Kayaku Co., Ltd.), etc.

A polymerizable monomer having an acid group can also be used as the polymerizable monomer. Examples of the acid group include a carboxyl group, a sulfonic acid group, a phosphoric acid group, and the like, and a carboxyl group is preferable. As a commercial item of the polymerizable monomer which has an acid group, ARONIX M-305, M-510, M-520, ARONIX TO-2349 (made by TOAGOSEI CO., LTD.) etc. are mentioned. The preferred acid value of the polymerizable monomer having an acid group is 0.1 to 40 mgKOH/g, more preferably 5 to 30 mgKOH/g.

A polymerizable monomer having a caprolactone structure can also be used as the polymerizable monomer. Polymerizable monomers having a caprolactone structure are commercially available, for example, from Nippon Kayaku Co., Ltd. as KAYARAD DPCA series, and examples thereof include DPCA-20, DPCA-30, DPCA-60, and DPCA-120.

A polymerizable monomer having an alkyleneoxy group can also be used as the polymerizable monomer. The polymerizable monomers with alkyleneoxy groups are preferably polymerizable monomers with ethyleneoxy and/or propyleneoxy groups, more preferably polymerizable monomers with ethyleneoxy groups, and have 4 to 20 ethyleneoxy groups. A 3-6 functional (meth)acrylate compound is further preferred. Examples of commercially available polymerizable monomers having an alkyleneoxy group include tetrafunctional (meth)acrylate SR-494 having four vinyloxy groups manufactured by Sartomer Company, Inc., Nippon Kayaku Co., Ltd.'s trifunctional (meth)acrylate KAYARAD TPA-330 with 3 iso-butoxyl groups, etc.

As the polymerizable monomer, a polymerizable monomer having a fennel skeleton can also be used. Commercially available polymerizable monomers having a fennel skeleton include OGSOL EA-0200 and EA-0300 (manufactured by Osaka Gas Chemicals Co., Ltd., (meth)acrylate monomers having a fennel skeleton), etc. .

As the polymerizable monomer, it is also preferable to use a polymerizable monomer that does not substantially contain environmentally regulated substances such as toluene. Examples of commercially available products of such polymerizable monomers include KAYARAD DPHA LT, KAYARAD DPEA-12 LT (manufactured by Nippon Kayaku Co., Ltd.), and the like.

As the polymerizable monomer, such as the aminomethyl group described in Japanese Patent Publication No. 48-041708, Japanese Patent Application Publication No. 51-037193, Japanese Patent Publication No. 02-032293, and Japanese Patent Publication No. 02-016765. Acrylic acid esters or Japanese Patent Publication No. 58-049860, Japanese Patent Publication No. 56-017654, Japanese Patent Publication No. 62-039417, and Japanese Patent Publication No. 62-039418 have ethylene oxide A urethane compound having a skeleton is also preferable. In addition, polymerizable monomers having an amino structure or a thioether structure in the molecule described in JP-A-63-277653, JP-A-63-260909, and JP-A-01-105238 are used. The body is also better. In addition, as the polymerizable monomer, UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, and UA-306I can also be used. , AH-600, T-600, AI-600, LINC-202UA (manufactured by KYOEISHA CHEMICAL CO., LTD.) and the like are commercially available.

The content of the polymerizable monomer in the total solid content of the curable composition is preferably 5 to 50% by mass. The effect of this invention will be acquired more notably as content of a polymerizable monomer exists in the said range. The lower limit is preferably 20% by mass or more, more preferably 25% by mass or more, because the curable composition layer can be properly cured by exposure before development to form a pattern with good rectangularity. The upper limit is preferably 45% by mass or less, more preferably 40% by mass or less, for the reason that the hardness of the obtained film can be increased.

Moreover, it is preferable that the curable composition of this invention contains 50-1500 mass parts of polymerizable monomers with respect to the total 100 mass parts of photoinitiator IA and photoinitiator IB. The effect of this invention will be acquired more notably as content of a polymerizable monomer exists in the said range. The lower limit is preferably 500 parts by mass or more, and more preferably 800 parts by mass or more, because the curable composition layer can be properly cured by exposure before development to form a pattern with good rectangularity. The upper limit is preferably 1300 parts by mass or less, more preferably 1200 parts by mass or less, for the reason that the hardness of the obtained film can be improved.

Moreover, it is preferable that the curable composition of this invention contains 100-2000 mass parts of polymerizable monomers with respect to 100 mass parts of photopolymerization initiator IA. The lower limit is preferably at least 1000 parts by mass, more preferably at least 1200 parts by mass. The upper limit is preferably at most 1800 parts by mass, more preferably at most 1500 parts by mass.

Moreover, it is preferable that the curable composition of this invention contains 200-4000 mass parts of polymerizable monomers with respect to 100 mass parts of photopolymerization initiator IB. The lower limit is preferably at least 1500 parts by mass, more preferably at least 2000 parts by mass. The upper limit is preferably at most 3600 parts by mass, more preferably at most 3000 parts by mass.

The curable composition of the present invention may contain only one type of polymerizable monomer, or may contain two or more types. When two or more polymerizable monomers are contained, the total amount is preferably within the above range.

＜＜Resin＞＞ The curable composition of the present invention can contain a resin. The resin is blended, for example, for dispersing particles of a pigment or the like in a curable composition or for a binder. In addition, the resin mainly used for dispersing the particle|grains of a pigment etc. is also called a dispersing agent. However, these uses of the resin are examples, and the resin can also be used for purposes other than these uses.

The weight average molecular weight (Mw) of the resin is preferably 3,000 to 2,000,000. The upper limit is preferably 1,000,000 or less, more preferably 500,000 or less. The lower limit is preferably 4000 or more, more preferably 5000 or more.

Examples of the resin include (meth)acrylic resins, epoxy resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polyphenolic resins, polyethersulfonic resins, polyphenylene resins, Polyaryl ether phosphine oxide resin, polyimide resin, polyamide resin, polyamideimide resin, polyolefin resin, cyclic olefin resin, polyester resin, styrene resin, vinyl acetate resin, Polyvinyl alcohol resin, polyvinyl acetal resin, polyurethane resin, polyurea resin, etc. Among these resins, one type may be used alone, or two or more types may be used in combination. As the cyclic olefin resin, norbornene resin is preferable from the viewpoint of improving heat resistance. As a commercial item of norcamphene resin, the ARTON series (for example, ARTON F4520) etc. made from JSR CORPORATION are mentioned, for example. In addition, as the resin, resins described in the examples of International Publication No. 2016/088645, resins described in JP-A 2017-057265, resins described in JP-A 2017-032685, Resins described in JP-A 2017-075248, resins described in JP-A 2017-066240, resins described in JP-A 2017-167513, and resins described in JP-A 2017-173787 Resins, the resins described in paragraphs 0041 to 0060 of JP-A-2017-206689, the resins described in paragraphs 0022-0071 of JP-A-2018-010856, and the resins described in JP-A-2016-222891 The blocked polyisocyanate resin (cyanate resin), the resin described in JP-A-2020-122052, the resin described in JP-A-2020-111656, the resin described in JP-A-2020-139021, The resin described in JP 2017-138503 A includes a constituent unit having a ring structure on the main chain and a constituent unit having a biphenyl group on the side chain. In addition, as the resin, a resin having a fennel skeleton can also be preferably used. Regarding the resin having a fenugreek skeleton, reference can be made to the description of US Patent Application Publication No. 2017/0102610, which is incorporated in this specification. Also, as the resin, resins described in paragraphs 0199 to 0233 of JP-A-2020-186373, alkali-soluble resins described in JP-A-2020-186325, Korean Laid-Open Patent No. 10-2020 - Resin represented by Formula 1 described in Publication No. 0078339.

As the resin, it is preferable to use a resin having an acid group. As an acidic group, a carboxyl group, a phosphoric acid group, a sulfonic acid group, a phenolic hydroxyl group etc. are mentioned, for example. Resins having acid groups can also be used as alkali-soluble resins.

The acid value of the resin with acid groups is preferably 30-500 mgKOH/g. The lower limit is more preferably 40 mgKOH/g or more, and particularly preferably 50 mgKOH/g or more. The upper limit is more preferably 400 mgKOH/g or less, further preferably 300 mgKOH/g or less, and particularly preferably 200 mgKOH/g or less. The weight average molecular weight (Mw) of the resin having an acid group is preferably from 5,000 to 100,000, more preferably from 5,000 to 50,000. Moreover, it is preferable that the number average molecular weight (Mn) of the resin which has an acid group is 1000-20000.

The resin having an acidic group preferably contains repeating units having an acidic group on the side chain, and more preferably contains 5 to 70 mol % of repeating units having an acidic group on the side chain in all the repeating units of the resin. The upper limit of the content of the repeating unit having an acid group on the side chain is preferably 50 mol % or less, more preferably 30 mol % or less. The lower limit of the content of the repeating unit having an acid group in the side chain is preferably 10 mol % or more, more preferably 20 mol % or more.

Regarding resins having acid groups, reference can be made to the descriptions in paragraphs 0558 to 0571 of JP-A-2012-208494 (corresponding to paragraphs 0685-0700 of US Patent Application Publication No. 2012/0235099), JP-A-2012-198408 No. 0076 to 0099 of the Publication No. 0076 to 0099, these contents are incorporated into this specification. Moreover, the resin which has an acid group can also use a commercial item. Moreover, there are no particular limitations on the method for introducing an acid group into the resin, and examples thereof include the method described in Japanese Patent No. 6349629 . Moreover, as a method of introducing an acid group into a resin, the method of introducing an acid group by reacting an acid anhydride with the hydroxyl group produced|generated in the ring-opening reaction of an epoxy group is also mentioned.

It is also preferable that the curable composition of the present invention contains a resin having a base. The resin with base is preferably the resin containing the repeating unit with base on the side chain, and the copolymer with the repeating unit with base on the side chain and the repeating unit without base is more preferred, with A block copolymer having a repeating unit of a base on a side chain and a repeating unit not containing a base is further preferred. Resins with bases can also be used as dispersants. The amine value of the resin having a base is preferably 5-300 mgKOH/g. The lower limit is preferably at least 10 mgKOH/g, more preferably at least 20 mgKOH/g. The upper limit is preferably 200 mgKOH/g or less, more preferably 100 mgKOH/g or less.

Commercially available resins having bases include DISPERBYK-161, 162, 163, 164, 166, 167, 168, 174, 182, 183, 184, 185, 2000, 2001, 2050, 2150, 2163, 2164, BYK-LPN6919 (the above are manufactured by BYK Chemie), SOLSPERSE11200, 13240, 13650, 13940, 24000, 26000, 28000, 32000, 32500, 32550, 32600, 33000, 34750, 35100, 3520 0, 37500, 38500, 39000, 53095, 56000, 7100 (the above are manufactured by Lubrizol Japan Limited.), Efka PX 4300, 4330, 4046, 4060, 4080 (the above are manufactured by BASF Corporation), etc. In addition, as the resin having a base, the block copolymer (B) described in paragraphs 0063 to 0112 of JP-A-2014-219665 and the block copolymer (B) described in paragraphs 0046-0076 of JP-A-2018-156021 can also be used. The block copolymer A1 described, and the vinyl resin having a base described in paragraphs 0150 to 0153 of JP-A-2019-184763 are incorporated in this specification.

It is also preferable that the curable composition of the present invention contains a resin having an acid group and a resin having a base. According to this aspect, the storage stability of the curable composition can be further improved. In the case of using a resin with an acid group and a resin with a base in combination, the content of the resin with a base is preferably 20 to 500 parts by mass, 30 to 300 parts by mass relative to 100 parts by mass of the resin with an acid group More preferably, 50-200 mass parts is still more preferable.

As the resin, a compound derived from a compound represented by the following formula (ED1) and/or a compound represented by the following formula (ED2) is used (hereinafter, these compounds may also be referred to as "ether dimer".) The resin of the repeating unit of the monomer component is also preferred.

[chemical formula 9]

式（ED2）中，R表示氫原子或碳數1～30的有機基。關於式（ED2）的詳細內容，能夠參閱日本特開2010-168539號公報的記載，該內容被編入本說明書中。 In formula (ED1), R ¹ and R ² each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent. [chemical formula 10]

In formula (ED2), R represents a hydrogen atom or an organic group having 1 to 30 carbon atoms. For details of the formula (ED2), the description in JP 2010-168539 A can be referred to, and the content is incorporated in this specification.

As a specific example of the ether dimer, for example, the description in paragraph 0317 of JP-A-2013-029760 can be referred to, and the content is incorporated in this specification.

式中，R ¹表示氫原子或甲基，R ²¹及R ²²分別獨立地表示伸烷基，n表示0～15的整數。R ²¹及R ²²所表示之伸烷基的碳數為1～10為較佳，1～5為更佳，1～3為進一步較佳，2或3為特佳。n表示0～15的整數，0～5的整數為較佳，0～4的整數為更佳，0～3的整數為進一步較佳。 As the resin, it is also preferable to use a resin comprising a repeating unit derived from the compound represented by formula (X). [chemical formula 11]

In the formula, ^R1 represents a hydrogen atom or a methyl group, ^R21 and ^R22 each independently represent an alkylene group, and n represents an integer of 0-15. The carbon number of the alkylene group represented by R ²¹ and R ²² is preferably 1-10, more preferably 1-5, still more preferably 1-3, particularly preferably 2 or 3. n represents an integer of 0-15, preferably an integer of 0-5, more preferably an integer of 0-4, and further preferably an integer of 0-3.

Examples of the compound represented by the formula (X) include ethylene oxide or propylene oxide modified (meth)acrylate of p-cumylphenol, and the like. As a commercial item, ARONIX M-110 (made by TOAGOSEI CO., LTD.) etc. are mentioned.

The curable composition of the present invention may also contain a resin as a dispersant. Examples of the dispersant include acidic dispersants (acidic resins) and basic dispersants (basic resins). Here, the acidic dispersant (acidic resin) means a resin having more acidic groups than basic groups. As the acidic dispersant (acidic resin), when the total amount of the amount of acid groups and the amount of bases is 100 mol%, a resin having an amount of acid groups of 70 mol% or more is preferable. It is preferable that the acidic group which the acidic dispersant (acidic resin) has is a carboxyl group. The acid value of the acidic dispersant (acidic resin) is preferably 10-105 mgKOH/g. In addition, the basic dispersant (basic resin) means a resin having more basic groups than acid groups. As the basic dispersant (basic resin), when the total amount of the amount of acid groups and the amount of bases is 100 mol%, the resin with the amount of bases exceeding 50 mol% is preferable. It is preferable that the basic group which the basic dispersant has is an amine group.

It is preferable that the resin used as a dispersant comprises a repeating unit having an acid group. The resin used as the dispersant contains repeating units with acid groups, so that when photolithography is used for pattern formation, residues generated on the substrate of the pixels can be further reduced.

It is also preferred that the resin used as the dispersant is a grafted resin. For details of the graft resin, the description in paragraphs 0025 to 0094 of JP-A-2012-255128 can be referred to, and the content is incorporated in this specification.

It is also preferable that the resin used as the dispersant is a polyimide-based dispersant containing nitrogen atoms in at least one of the main chain and the side chain. As a polyimide-based dispersant, it is preferable to have a main chain and a side chain, and at least one of the main chain and the side chain has a basic nitrogen atom. In a partial structure, the number of atoms in the side chain is 40 to 10,000. The basic nitrogen atom is not particularly limited as long as it is a basic nitrogen atom. Regarding the polyimide-based dispersant, the description in paragraphs 0102 to 0166 of JP-A-2012-255128 can be referred to, and the content is incorporated in this specification.

It is also preferable that the resin used as the dispersant has a structure in which a plurality of polymer chains are bonded to the core. Examples of such resins include dendrimers (including star polymers). Moreover, as a specific example of a dendrimer, polymer compound C-1-C-31 etc. which are described in paragraph 0196-0209 of Unexamined-Japanese-Patent No. 2013-043962 are mentioned.

It is also preferable that the resin used as a dispersant is a resin containing a repeating unit having an ethylenically unsaturated bond-containing group on a side chain. The content of the repeating unit having an ethylenically unsaturated bond-containing group on the side chain is preferably 10 mol% or more in all the repeating units of the resin, more preferably 10-80 mol%, 20-70 mol% % is further preferred.

Also, as a dispersant, resins described in JP-A-2018-087939 and block copolymers (EB-1)-(EB-1) described in paragraphs 0219-0221 of JP-A-6432077 can also be used. -9), Polyethyleneimine having a polyester side chain described in International Publication No. 2016/104803, a block copolymer described in International Publication No. 2019/125940, JP-A-2020-066687 A block polymer having an acrylamide structural unit described in , a block polymer having an acrylamide structural unit described in Japanese Patent Laid-Open No. 2020-066688, and a block polymer having an acrylamide structural unit described in International Publication No. 2016/104803 dispersant, etc.

The dispersant can also be obtained as a commercial product, and such specific examples include DSIPERBYK series manufactured by BYK Chemie (for example, DSIPERBYK-111, 140, 161, 2001, 2026, etc.), manufactured by Lubrizol Japan Limited. SOLSPERSE series (for example, SOLSPERSE 20000, 76500, etc.), AJISPER series manufactured by Ajinomoto Fine-Techno Co., Inc., etc. Moreover, the product described in paragraph 0129 of JP-A-2012-137564 and the product described in paragraph 0235 of JP-A-2017-194662 can also be used as a dispersant.

The content of the resin in the total solid content of the curable composition is preferably 10 to 70% by mass. The lower limit is preferably at least 20% by mass, more preferably at least 25% by mass. The upper limit is preferably at most 65% by mass, more preferably at most 50% by mass, and still more preferably at most 40% by mass. Moreover, it is preferable that content of the resin which has an acid group is 1-70 mass % with respect to the total solid content of the composition of this invention. The lower limit is preferably 2% by mass or more, more preferably 3% by mass or more, still more preferably 5% by mass or more, still more preferably 10% by mass or more, still more preferably 20% by mass or more, and 25% by mass The above is excellent. The upper limit is preferably at most 65% by mass, more preferably at most 50% by mass, further preferably at most 40% by mass, and most preferably at most 30% by mass. The composition of this invention may contain only 1 type of resin, and may contain 2 or more types. When containing 2 or more types, it is preferable that these total amounts are in the said range.

In the curable composition of the present invention, the content of the resin is preferably 10 to 1000 parts by mass relative to 100 parts by mass of the polymerizable monomer. When content of resin exists in the said range, the cured film excellent in solvent resistance can be formed. In addition, when forming a pattern by photolithography, it is also possible to form a pattern with good rectangularity. The upper limit of the resin content is preferably at most 700 parts by mass, more preferably at most 200 parts by mass. The lower limit of the content of the resin is preferably at least 30 parts by mass, more preferably at least 70 parts by mass.

When the curable composition of the present invention contains a resin as a dispersant, the content of the dispersant is preferably 50 to 300 parts by mass relative to 100 parts by mass of the infrared absorber. The lower limit is preferably at least 70 parts by mass, more preferably at least 90 parts by mass. The upper limit is preferably at most 200 parts by mass, more preferably at most 150 parts by mass.

From the viewpoint of easily forming a cured film with excellent rectangularity and solvent resistance, the content of the resin having an acid group in the resin contained in the curable composition of the present invention is preferably 50 to 100% by mass, and 60 to 100% by mass. The mass % is more preferable, 70-100 mass % is still more preferable, and 80-100 mass % is especially preferable.

＜＜Ultraviolet absorber＞＞ The curable composition of the present invention preferably contains an ultraviolet absorber. According to this aspect, when a pattern is formed by photolithography using the curable composition of the present invention, it is possible to form a pattern (cured film) having excellent solvent resistance and good rectangularity.

In addition, the ultraviolet absorber in this specification refers to the organic compound which has ultraviolet absorbing function, and is different from the photopolymerization initiator which generate|occur|produces active species, such as a free radical efficiently, by irradiation of ultraviolet rays. The ultraviolet absorber is preferably a compound that absorbs ultraviolet rays, converts them into thermal energy, and emits them. Moreover, it is preferable that a ultraviolet absorber is a compound stable with respect to ultraviolet rays. In other words, the ultraviolet absorber is preferably a compound that does not easily undergo molecular cleavage due to reactions such as decomposition, oxidation, and reduction by ultraviolet irradiation.

The ultraviolet absorber is preferably a compound with a maximum absorption wavelength in the range of 340-420nm, more preferably a compound with a maximum absorption wavelength in the range of 345-400nm, and a compound with a maximum absorption wavelength in the range of 350-390nm. Compounds that absorb wavelengths are further preferred. In addition, the maximum value of the molar absorption coefficient in the wavelength range of 340 to 420nm of the ultraviolet absorber is preferably 5000L･mol ^-1 ･cm ^-1 or more, more preferably 10000L･mol ^-1 ･cm ^-1 or more, and 13000L ･mol ^-1 ･cm ^-1 or more is more preferable. The upper limit is preferably, for example, 100000 L･mol ^-1 ･cm ^-1 or less.

Examples of the ultraviolet absorber include conjugated diene compounds, benzotriazole compounds, dibenzoyl compounds, tristannium compounds, benzophenone compounds, salicylate compounds, coumarin compounds, and acrylonitrile compounds. , benzobithiazole compounds, cinnamic acid compounds, α-β unsaturated ketones, 2-hydroxyquinoline compounds, merocyanine compounds, etc., conjugated diene compounds or dibenzoyl compounds are preferred, dibenzoyl compound is more preferred.

The conjugated diene compound is preferably a compound represented by the following formula (UV-1). [chemical formula 12]

In formula (UV-1), R ¹ and R ² independently represent a hydrogen atom, an alkyl group with 1 to 20 carbons, or an aryl group with 6 to 20 carbons, and R ¹ and R ² can be the same or different . Wherein, at least one of R ¹ and R ² is an alkyl group with 1 to 20 carbons or an aryl group with 6 to 20 carbons. R ¹ and R ² may form a cyclic amine group together with the nitrogen atom to which R ¹ and R ² are bonded. Examples of the cyclic amino group include piperidyl, oxalinyl, pyrrolidinyl, hexahydroazanyl, piperoxanyl and the like. R ¹ and R ² are each independently preferably an alkyl group having 1 to 20 carbons, more preferably an alkyl group having 1 to 10 carbons, and even more preferably an alkyl group having 1 to 5 carbons.

In the formula (UV-1), R ³ and R ⁴ each independently represent an electron-withdrawing group. R and ^R are independently acyl, carbamoyl, alkoxycarbonyl, aryloxycarbonyl, cyano, nitro, alkylsulfonyl, arylsulfonyl, sulfonyloxy ^or amine Sulfonyl is preferred, and acyl, carbamoyl, alkoxycarbonyl, aryloxycarbonyl, cyano, alkylsulfonyl, arylsulfonyl, sulfonyloxy or sulfamoyl are more preferred. good. In addition, R ³ and R ⁴ may be bonded to each other to form a cyclic electron-withdrawing group. As the cyclic electron-withdrawing group formed by R ³ and R ⁴ being bonded to each other, for example, a 6-membered ring including two carbonyl groups is mentioned.

At least one of R ¹ , R ² , R ³ and R ⁴ in the formula (UV-1) may be in the form of a polymer derived from a monomer bonded to a vinyl group via a linker. Alternatively, it may be a copolymer with other monomers.

Regarding the ultraviolet absorber represented by the formula (UV-1), the description in paragraphs 0024 to 0033 of JP-A-2009-265642 can be referred to, and the content is incorporated in this specification. Specific examples of the ultraviolet absorber represented by the formula (UV-1) include compounds having the following structures, compounds described in paragraphs 0034 to 0036 of JP-A-2009-265642, and the like. Moreover, as a commercial item of the ultraviolet absorber represented by Formula (UV-1), UV-503 (made by DAITO CHEMICAL CO., LTD.) etc. are mentioned. [chemical formula 13]

The dibenzoyl compound is preferably a compound represented by the following formula (UV-2). [chemical formula 14]

In formula (UV-2), R ¹⁰¹ and R ¹⁰² each independently represent a substituent, and m1 and m2 each independently represent an integer of 0-5.

Examples of substituents represented by R ¹⁰¹ and R ¹⁰² include halogen atoms, cyano groups, nitro groups, alkyl groups, aryl groups, heteroaryl groups, alkoxy groups, aryloxy groups, heteroaryloxy groups, and alkylthio groups. , Arylthio, Heteroarylthio, -NR ^U1 R ^U2 , -COR ^U3 , -COOR ^U4 , -OCOR ^U5 , -NHCOR ^U6 , -CONR ^U7 R ^U8 , -NHCONR ^U9 R ^U10 , -NHCOOR ^U11 , -SO ₂ R ^U12 , -SO ₂ OR ^U13 , -NHSO ₂ R ^U14 and -SO ₂ NR ^U15 R ^U16 . R ^U1 to R ^U16 each independently represent a hydrogen atom, an alkyl group or an aryl group having 1 to 8 carbon atoms.

Preferably, the substituents represented by R ¹⁰¹ and R ¹⁰² are independently alkyl or alkoxy. The carbon number of the alkyl group is preferably 1-20, more preferably 1-10. Examples of the alkyl group include straight chain, branched chain, and cyclic shape. Straight chain or branched chain is preferable, and branched chain is more preferable. The number of carbon atoms in the alkoxy group is preferably 1-20, more preferably 1-10. The alkoxy group is preferably linear or branched, more preferably branched.

In formula (UV-2), a combination in which one of R ¹⁰¹ and R ¹⁰² is an alkyl group and the other is an alkoxy group is preferable.

m1 and m2 each independently represent the integer of 0-5. m1 and m2 are each independently an integer of 0-4, preferably an integer of 0-2, more preferably 0 or 1, and particularly preferably 1.

Specific examples of dibenzoyl compounds include avobenzone and the like. Moreover, Neo Heliopan 357 (manufactured by Symrise) etc. are mentioned as a commercial item of a dibenzoyl compound.

It is preferable that the trioxane compound is represented by the following formula (UV-3-1), formula (UV-3-2) or formula (UV-3-3). [chemical formula 15]

In the formula, R ^d1 independently represent a hydrogen atom, an alkyl group with 1 to 15 carbons, an alkenyl group with 3 to 8 carbons, an aryl group with 6 to 18 carbons, an alkylaryl group with 7 to 18 carbons, or An arylalkyl group having 7 to 18 carbon atoms. An alkyl group, an alkenyl group, an aryl group, an alkylaryl group, and an arylalkyl group may have a substituent. Examples of the substituent include groups described for the substituent Ti shown below. In the formula, ^Rd2 to ^Rd9 independently represent a hydrogen atom, a halogen atom, a hydroxyl group, an alkyl group with 1 to 15 carbons, an alkenyl group with 3 to 8 carbons, an aryl group with 6 to 18 carbons, or an aryl group with 7 carbons. An alkylaryl group having ∼18 carbon atoms or an arylalkyl group having 7∼18 carbon atoms. An alkyl group, an alkenyl group, an aryl group, an alkylaryl group, and an arylalkyl group may have a substituent. Examples of the substituent include groups described for the substituent Ti shown below.

Examples of substituent Ti include halogen atom, cyano group, nitro group, hydrocarbon group, heterocyclic group, -ORti ¹ , -CORti ¹ , -COORti ¹ , -OCORti ¹ , -NRti ¹ Rti ² , -NHCORti ¹ , - CONRti ¹ Rti ² , -NHCONRti ¹ Rti ² , -NHCOORti ¹ , -SRti ¹ , -SO ₂ Rti ¹ , -SO ₂ ORti ¹ , -NHSO ₂ Rti ^{1 ,} or -SO ₂ NRti ¹ Rti ² . Rti ¹ and Rti ² each independently represent a hydrogen atom, a hydrocarbon group or a heterocyclic group. Rti ¹ and Rti ² may be bonded to form a ring.

Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Examples of the hydrocarbon group include an alkyl group, an alkenyl group, an alkynyl group, and an aryl group. The carbon number of the alkyl group is preferably 1-30, more preferably 1-15, and still more preferably 1-8. The alkyl group may be any of straight chain, branched chain, and cyclic, and straight chain or branched chain is preferable, and branched chain is more preferable. The carbon number of the alkenyl group is preferably 2-30, more preferably 2-12, and particularly preferably 2-8. The alkenyl group can be any of straight chain, branched chain, and cyclic, and straight chain or branched chain is preferred. The carbon number of the alkyl group is preferably 2-30, more preferably 2-25. The alkynyl group may be any of straight chain, branched chain, and cyclic, and straight chain or branched chain is preferred. The carbon number of the aryl group is preferably 6-30, more preferably 6-20, and still more preferably 6-12. The heterocyclic group may be a monocyclic ring or a condensed ring. As for the heterocyclic group, a monocyclic ring or a condensed ring having 2 to 4 condensed rings is preferable. The number of heteroatoms in the ring constituting the heterocyclic group is preferably 1-3. The hetero atom constituting the ring of the heterocyclic group is preferably a nitrogen atom, an oxygen atom or a sulfur atom. The number of carbon atoms in the ring constituting the heterocyclic group is preferably 3-30, more preferably 3-18, and still more preferably 3-12. A hydrocarbon group and a heterocyclic group may have a substituent or may be unsubstituted. As a substituent, the substituent demonstrated in the said substituent Ti is mentioned.

As a specific example of the trioxane compound, 2-[4-[(2-hydroxy-3-dodecyloxypropyl)oxy]-2-hydroxyphenyl]-4,6-bis(2 ,4-Dimethylphenyl)-1,3,5-trimethalone, 2-[4-[(2-hydroxy-3-tridecyloxypropyl)oxy]-2-hydroxyphenyl] -4,6-bis(2,4-dimethylphenyl)-1,3,5-trimethylphenyl, 2-(2,4-dihydroxyphenyl)-4,6-bis(2,4- Dimethylphenyl)-1,3,5-trimethanone and other mono(hydroxyphenyl)trimethanium compounds; 2,4-bis(2-hydroxy-4-propyloxyphenyl)-6-(2 ,4-Dimethylphenyl)-1,3,5-trimethanone, 2,4-bis(2-hydroxy-3-methyl-4-propyloxyphenyl)-6-(4-methyl phenyl)-1,3,5-trimethanone, 2,4-bis(2-hydroxy-3-methyl-4-hexyloxyphenyl)-6-(2,4-dimethylphenyl )-1,3,5-tris(hydroxyphenyl)tris(hydroxyphenyl)tris(2,4-bis(2-hydroxy-4-butoxyphenyl)-6-(2,4-dibutoxy) phenyl)-1,3,5-trimethanone, 2,4,6-tris(2-hydroxy-4-octyloxyphenyl)-1,3,5-trimethanium, 2,4,6- Tris[2-hydroxy-4-(3-butoxy-2-hydroxypropyloxy)phenyl]-1,3,5-trisanthene and other tris(hydroxyphenyl)trisanthene compounds, etc. Commercially available products of the trioxane compound include TINUVIN 400, TINUVIN 405, TINUVIN 460, TINUVIN 477, TINUVIN 479 (manufactured by BASF Corporation), KEMISORB 102 (manufactured by CHEMIPRO KASEI KAISHA, LTD.), and the like.

式中，R ^e1～R ^e3分別獨立地表示氫原子、鹵素原子、羥基、碳數1～9的烷基、碳數1～9的烷氧基、碳數7～18的烷基芳基或碳數7～18的芳基烷基。烷基、烷基芳基及芳基烷基可以具有取代基。作為取代基，可舉出在上述之取代基Ti中所說明之基團，碳數1～9的烷氧基羰基為較佳。 The benzotriazole compound is preferably a compound represented by the following formula (UV-4). [chemical formula 16]

In the formula, R ^e1 to R ^e3 independently represent a hydrogen atom, a halogen atom, a hydroxyl group, an alkyl group with 1 to 9 carbons, an alkoxy group with 1 to 9 carbons, an alkylaryl group with 7 to 18 carbons, or An arylalkyl group having 7 to 18 carbon atoms. An alkyl group, an alkylaryl group, and an arylalkyl group may have a substituent. Examples of the substituent include those described above for the substituent Ti, and an alkoxycarbonyl group having 1 to 9 carbon atoms is preferred.

Specific examples of benzotriazole compounds include 2-(2'-hydroxy-3',5'-di-tertiary butylphenyl)-5-chlorobenzotriazole, 2-(2' -Hydroxy-3'-tertiary butyl-5'-methylphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-3'-tertiary pentyl-5'-isobutyl Phenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-3'-isobutyl-5'-methylphenyl)-5-chlorobenzotriazole, 2-(2'- Hydroxy-3'-isobutyl-5'-propylphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-3',5'-di-tertiary butylphenyl)benzene Triazole, 2-(2'-hydroxy-5'-methylphenyl)benzotriazole, 2-[2'-hydroxy-5'-(1,1,3,3-tetramethyl)benzene Base] benzotriazole, 2-(2-hydroxy-5-tertiary butylphenyl)-2H-benzotriazole, 3-(2H-benzotriazol-2-yl)-5-(1 ,1-dimethylethyl)-4-hydroxyl, 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, 2 -(2H-Benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol, etc. Commercially available products include TINUVIN P, TINUVIN PS, TINUVIN 99-2, TINUVIN 109, TINUVIN 326, TINUVIN 328, TINUVIN 384-2, TINUVIN 900, TINUVIN 928, TINUVIN 171, TINUVIN 1130 (the above are manufactured by BASF Corporation) ), Sumisorb 200, Sumisorb 250, Sumisorb 300, Sumisorb 340, Sumisorb 350 (the above are made by Sumika Chemtex Company, Limited), KEMISORB 71, KEMISORB 73, KEMISORB 74, KEMISORB 79, KEMISORB 279 (the above are CHE MIPRO KASEI KAISHA, LTD. system), etc. As the benzotriazole compound, MYUA series manufactured by MIYOSHI OIL & FAT CO., LTD. can also be used.

Examples of the benzophenone compound include 2,2'-dihydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2,2',4,4'-tetrahydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2,4-dihydroxybenzophenone, 2-hydroxy-4-octyloxy benzophenone etc. Commercially available benzophenone compounds include UvinulA, Uvinul049, Uvinul3050 (manufactured by BASF Corporation), Sumisorb 130 (manufactured by Sumika Chemtex Company, Limited), KEMISORB 10, KEMISORB 11, KEMISORB 11S, KEMISORB 12, KEMISORB 111 (manufactured by CHEMIPRO KASEI KAISHA, LTD.), etc.

Examples of the salicylate compound include phenyl salicylate, p-octylphenyl salicylate, p-tertiary butylphenyl salicylate, and the like.

As a coumarin compound, coumarin-4, 4-hydroxycoumarin, 7-hydroxycoumarin etc. are mentioned, for example.

Examples of the acrylonitrile compound include ethyl 2-cyano-3,3-diphenylacrylate, 2-ethylhexyl 2-cyano-3,3-diphenylacrylate, and the like.

In addition, as the ultraviolet absorber, paragraphs 0038 to 0052 of JP-A-2009-217221, paragraphs 0052-0072 of JP-A 2012-208374, paragraphs 0317-0334 of JP-A 2013-068814, Compounds described in paragraphs 0061 to 0080 of Japanese Patent Application Laid-Open No. 2016-162946, paragraphs 0049 to 0059 of Japanese Patent No. 6268967, and paragraphs 0059 to 0076 of International Publication No. 2016/181987.

The content of the ultraviolet absorber in the total solid content of the curable composition is preferably 1 to 20% by mass. The upper limit is preferably at most 15% by mass, more preferably at most 10% by mass. The lower limit is preferably at least 2% by mass, more preferably at least 4% by mass. Moreover, it is preferable that content of an ultraviolet absorber is 10-500 mass parts with respect to 100 mass parts of photoinitiator IA. The upper limit is preferably at most 400 parts by mass, more preferably at most 300 parts by mass. The lower limit is preferably at least 30 parts by mass, more preferably at least 50 parts by mass. If the ratio of the ultraviolet absorber to the photopolymerization initiator IA is within the above range, when the curable composition of the present invention is used to form a pattern by photolithography, the obtained pattern (cured film) can be obtained at a high level. ) Solvent resistance and rectangularity. Moreover, it is preferable that content of an ultraviolet absorber is 10-300 mass parts with respect to 100 mass parts of photoinitiator IA and photoinitiator IB. The upper limit is preferably at most 250 parts by mass, more preferably at most 200 parts by mass. The lower limit is preferably at least 30 parts by mass, more preferably at least 50 parts by mass. If the ratio of the ultraviolet absorber to the photopolymerization initiator IA is within the above range, when the curable composition of the present invention is used to form a pattern by photolithography, the obtained pattern (cured film) can be obtained at a high level. ) Solvent resistance and rectangularity.

The curable composition of the present invention may contain only one type of ultraviolet absorber, or may contain two or more types. When containing two or more kinds of ultraviolet absorbers, the total amount is preferably within the above range.

＜＜Solvent＞＞ The curable composition of the present invention preferably contains a solvent. Examples of the solvent include water and organic solvents, and organic solvents are preferred. Examples of the organic solvent include ester-based solvents, ketone-based solvents, alcohol-based solvents, amide-based solvents, ether-based solvents, and hydrocarbon-based solvents. Regarding such details, refer to paragraph 0223 of International Publication No. 2015/166779, which is incorporated in this specification. Also, a cyclic alkyl-substituted ester solvent and a cyclic alkyl-substituted ketone solvent can also be preferably used. Specific examples of organic solvents include polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl celuxoacetate , ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, 2-pentanone, 3-pentanone, 4-heptanone, cyclohexanone , 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate, Butyl carbitol acetate, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, 3-methoxy-N,N-dimethylacrylamide, 3-butoxy-N,N-di Methacrylamide, Propylene Glycol Diacetate, 3-Methoxybutanol, Methyl Ethyl Ketone, γ-Butyrolactone, Cyclobutane, Anisole, 1,4-Diacetyloxybutanol alkane, diethylene glycol monoethyl ether acetate, butane-1,3-diyl diacetate, dipropylene glycol methyl ether acetate, diacetone alcohol (also known as diacetone alcohol, 4-hydroxy-4-methyl yl-2-pentanone), 2-methoxypropyl acetate, 2-methoxy-1-propanol, isopropanol, etc. However, sometimes it is better to reduce aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) as organic solvents due to reasons such as the environment (for example, it can also be set to 50 Mass ppm (parts per million) or less may be 10 mass ppm or less, or may be 1 mass ppm or less).

In the present invention, it is preferable to use an organic solvent with a low metal content, and it is preferable that the metal content of the organic solvent is, for example, 10 mass ppb (parts per billion) or less. Organic solvents of ppt (parts per trillion) level can be used as needed, such organic solvents are provided by TOYO Gosei Co., Ltd. (Chemical Industry Daily, November 13, 2015).

Examples of methods for removing impurities such as metals from organic solvents include distillation (molecular distillation, thin film distillation, etc.) and filtration using a filter. The filter pore size of the filter used for filtration is preferably 10 μm or less, more preferably 5 μm or less, and still more preferably 3 μm or less. The filter material is preferably polytetrafluoroethylene, polyethylene or nylon.

Organic solvents may contain isomers (compounds with the same number of atoms but different structures). In addition, the isomer may contain only 1 type, and may contain plural types.

The content of the peroxide in the organic solvent is preferably at most 0.8 mmol/L, and it is more preferably not substantially containing the peroxide.

The content of the solvent in the curable composition is preferably 10 to 97% by mass. The lower limit is preferably 30% by mass or more, more preferably 40% by mass or more, still more preferably 50% by mass or more, still more preferably 60% by mass or more, and particularly preferably 70% by mass or more. The upper limit is preferably at most 96% by mass, more preferably at most 95% by mass. The curable composition of the present invention may contain only one solvent, or may contain two or more solvents. When two or more solvents are contained, the total amount is preferably within the above range.

＜＜Pigment Derivatives＞＞ The curable composition of the present invention may further contain pigment derivatives. Pigment derivatives can be used as dispersing aids. The dispersing aid is a material for improving the dispersibility of the pigment in the curable composition. When the curable composition further contains a resin such as a dispersant, a network is formed between the pigment, the dispersant and the resin, and the dispersibility of the pigment can be improved.

Examples of pigment derivatives include compounds having a structure in which an acidic group or a basic group is bonded to a pigment skeleton.

Examples of the dye skeleton constituting the pigment derivative include squarylium dye skeleton, pyrrolopyrrole dye skeleton, diketopyrrolopyrrole dye skeleton, quinacridone dye skeleton, anthraquinone dye skeleton, dianthraquinone dye skeleton, benzene And isoindole pigment skeleton, thioindigo pigment skeleton, azo pigment skeleton, quinoline yellow pigment skeleton, phthalocyanine pigment skeleton, naphthalene phthalocyanine pigment skeleton, di㗁𠯤 pigment skeleton, perylene pigment skeleton, pyrene pigment skeleton, Benzimidazolone pigment skeleton, benzothiazole pigment skeleton, benzimidazole pigment skeleton and benzoxazole pigment skeleton, squaraine pigment skeleton, pyrrolopyrrole pigment skeleton, diketopyrrolopyrrole pigment skeleton, phthalocyanine pigment skeleton , quinacridone pigment skeleton and benzimidazolone pigment skeleton are preferred, squaraine pigment skeleton and pyrrolopyrrole pigment skeleton are more preferred.

Examples of the acid group include a carboxyl group, a sulfonic acid group, a phosphoric acid group, a boronic acid group, a carboxylic acid amide group, a sulfonic acid amide group, an imidic acid group, and salts thereof. The atoms or atomic groups constituting the salt include alkali metal ions (Li ⁺ , Na ⁺ , K ^+, etc.), alkaline earth metal ions (Ca ²⁺ , Mg ^{2+ ,} etc.), ammonium ions, imidazolium ions, pyridinium ions, etc. ions, phosphonium ions, etc. As the carboxylic acid amide group, a group represented by -NHCOR ^A1 is preferable. As the sulfonamide group, a group represented by -NHSO ₂ R ^A2 is preferable. As the imidic acid group, a group represented by -SO ₂ NHSO ₂ R ^A3 , -CONHSO ₂ R ^A4 , -CONHCOR ^A5 or -SO ₂ NHCOR ^A6 is preferable, and -SO ₂ NHSO ₂ R ^A3 is more preferable. R ^A1 to R ^A6 each independently represent an alkyl group or an aryl group. The alkyl and aryl groups represented by R ^A1 to R ^A6 may have a substituent. As the substituent, a halogen atom is preferable, and a fluorine atom is more preferable.

Examples of the base include an amino group, a pyridyl group and salts thereof, ammonium group salts, and phthalimidomethyl group. Examples of the atoms or atomic groups constituting the salt include hydroxide ions, halogen ions, carboxylate ions, sulfonate ions, and phenoxide ions.

As a specific example of a pigment derivative, the compound described in the Example mentioned later is mentioned. Also, compounds described in Japanese Patent Application Laid-Open No. 56-118462, compounds described in Japanese Patent Application Publication No. 63-264674, compounds described in Japanese Patent Application Laid-Open No. 01-217077, Japanese Compounds described in JP-A-03-009961, compounds described in JP-A-03-026767, compounds described in JP-A-03-153780, JP-A-03-045662 Compounds described, compounds described in JP-A-04-285669, compounds described in JP-A-06-145546, compounds described in JP-A-06-212088, JP-A Compounds described in JP-A No. 06-240158, compounds described in JP-A-10-030063, compounds described in JP-A-10-195326, 0086-0098 of International Publication No. 2011/024896 The compounds described in paragraphs, the compounds described in paragraphs 0063 to 0094 of International Publication No. 2012/102399, the compounds described in paragraph 0082 of International Publication No. 2017/038252, and the compounds described in Japanese Patent Laid-Open No. 2015-151530 Compounds described in paragraph 0171, compounds described in paragraphs 0162 to 0183 of JP-A-2011-252065, compounds described in JP-A-2003-081972, JP-A-5299151 Compounds described in JP-A No. 2015-172732, compounds described in JP-A No. 2014-199308, compounds described in JP-A No. 2014-085562, JP-A 2014- Compounds described in Japanese Patent Application Laid-Open No. 035351, Compounds described in Japanese Patent Application Laid-Open No. 2008-081565, Compounds described in Japanese Patent Application Laid-Open No. 2019-109512, Compounds described in Japanese Patent Application Laid-Open No. 2019-133154 , the diketopyrrolopyrrole compound having a thiol linker described in International Publication No. 2020/002106, the benzimidazolone compound described in JP-A-2018-168244, or salts thereof.

It is preferable that content of a pigment derivative is 1-50 mass parts with respect to 100 mass parts of infrared absorbers. The lower limit is preferably 3 parts by mass or more, more preferably 5 parts by mass or more. The upper limit is preferably 40 parts by mass or less, more preferably 30 parts by mass or less. Also, the content of the pigment derivative is preferably 1 to 50 parts by mass relative to 100 parts by mass of the infrared absorbing pigment. The lower limit is preferably 3 parts by mass or more, more preferably 5 parts by mass or more. The upper limit is preferably 40 parts by mass or less, more preferably 30 parts by mass or less. The curable composition of the present invention may contain only one type of pigment derivative, or may contain two or more types. When containing two or more kinds of pigment derivatives, the total amount is preferably within the above range.

＜＜Compounds with cyclic ether group＞＞ The curable composition of the present invention can also contain a compound having a cyclic ether group. As a cyclic ether group, an epoxy group and an oxetanyl group are mentioned, and an epoxy group is preferable. As a compound which has a cyclic ether group, the compound which has 1-100 cyclic ether groups in 1 molecule is mentioned. The upper limit of the number of cyclic ether groups can also be set as 10 or less, for example, and can also be set as 5 or less. The lower limit of the number of cyclic ether groups is preferably two or more.

The compound having a cyclic ether group may be a low-molecular compound (for example, a molecular weight of less than 1,000) or a macromolecule (for example, in the case of a polymer with a molecular weight of 1,000 or more, the weight-average molecular weight of 1,000 or more) . The weight average molecular weight of the cyclic ether group is preferably from 200 to 100,000, more preferably from 500 to 50,000. The upper limit of the weight average molecular weight is preferably at most 10,000, more preferably at most 5,000, and still more preferably at most 3,000.

As the compound having a cyclic ether group, compounds described in paragraphs 0034 to 0036 of JP-A-2013-011869, compounds described in paragraphs 0147-0156 of JP-A-2014-043556, Compounds described in paragraphs 0085 to 0092 of JP-A-2014-089408 and compounds described in JP-A-2017-179172.

Examples of commercially available compounds having a cyclic ether group include DENACOL EX-212L, EX-212, EX-214L, EX-214, EX-216L, EX-216, EX-321L, EX-321, EX -850L, EX-850 (manufactured by Nagase ChemteX Corporation), ADEKA RESIN EP-4000S, EP-4003S, EP-4010S, EP-4011S (manufactured by ADEKA Corporation), NC-2000, NC-3000, NC- 7300, XD-1000, EPPN-501, EPPN-502 (the above are made by ADEKA Corporation), CELLOXIDE 2021P, CELLOXIDE 2081, CELLOXIDE 2083, CELLOXIDE 2085, EHPE3150, EPOLEAD PB 3600, PB 4700 (the above are Daicel Corporation), CYCLOMER P ACA 200M, ACA 230AA, ACA Z250, ACA Z251, ACA Z300, ACA Z320 (the above are manufactured by Daicel Corporation), jER1031S, jER157S65, jER152, jER154, jER157S70 (the above are manufactured by Mitsubishi Chemical Corporation), Aron OxetaneOXT- 121、OXT -221, OX-SQ, PNOX (manufactured by TOAGOSEI CO., LTD. above), ADEKA Glycirol ED-505 (manufactured by ADEKA Corporation, epoxy group-containing monomer), MARPROOF G-0150M, G-0105SA, G- 0130SP, G-0250SP, G-1005S, G-1005SA, G-1010S, G-2050M, G-01100, G-01758 (manufactured by NOF Corporation, epoxy group-containing polymer), OXT-101, OXT-121 . Heterocyclobutyl monomer), etc.

The content of the compound having a cyclic ether group in the total solid content of the curable composition is preferably 0.1 to 40% by mass. The lower limit is preferably at least 1% by mass, and more preferably at least 2% by mass. The upper limit is preferably at most 30% by mass, more preferably at most 20% by mass. Moreover, content of the compound which has a cyclic ether group is 1-400 mass parts with respect to 100 mass parts of polymerizable monomers, Preferably it is 1-100 mass parts, More preferably, it is 1-50 mass parts. The curable composition of the present invention may contain only one type of compound having a cyclic ether group, or may contain two or more types. When containing two or more compounds having a cyclic ether group, it is preferable that the total amount is within the above range.

＜＜Hardener＞＞ When the curable composition of the present invention contains a compound having a cyclic ether group, it is preferable to further contain a curing agent. Examples of the curing agent include amine compounds, acid anhydride compounds, amide compounds, phenol compounds, polyvalent carboxylic acids, and thiol compounds. Specific examples of hardening agents include succinic acid, trimellitic acid, pyromellitic acid, N,N-dimethyl-4-aminopyridine, neopentylthritol tetrakis(3-mercaptopropionate) )wait. As the curing agent, compounds described in paragraphs 0072 to 0078 of JP-A-2016-075720 and compounds described in JP-A-2017-036379 can also be used. The content of the curing agent is preferably from 0.01 to 20 parts by mass, more preferably from 0.01 to 10 parts by mass, and still more preferably from 0.1 to 6.0 parts by mass, based on 100 parts by mass of the compound having a cyclic ether group. The curable composition of the present invention may contain only one type of curing agent, or may contain two or more types. When two or more curing agents are contained, the total amount is preferably within the above range.

＜＜Surfactant＞＞ The curable composition of the present invention preferably contains a surfactant. As the surfactant, various surfactants such as fluorine-based surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and polysiloxane-based surfactants can be used. The surfactant is preferably a polysiloxane-based surfactant or a fluorine-based surfactant. Surfactants include those described in paragraphs 0238 to 0245 of International Publication No. 2015/166779, which are incorporated in this specification.

Examples of fluorine-based surfactants include those described in paragraphs 0060 to 0064 of JP 2014-041318 (corresponding to paragraphs 0060 to 0064 of International Publication No. 2014/017669), etc. The surfactants described in paragraphs 0117 to 0132 of KOKAI Publication No. 2011-132503 and the surfactants described in JP-A-2020-008634 are incorporated in this specification. Examples of commercially available fluorine-based surfactants include MEGAFACE F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F- 144, F-437, F-475, F-477, F-479, F-482, F-554, F-555-A, F-556, F-557, F-558, F-559, F- 560, F-561, F-563, F-565, F-568, F-575, F-780, EXP, MFS-330, R-01, R-40, R-40-LM, R-41, R-41-LM, RS-43, TF-1956, RS-90, R-94, RS-72-K, DS-21 (the above are made by DIC CORPORATION), FLUORAD FC430, FC431, FC171 (the above are Sumitomo 3M Limited), SURFLON S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 (the above are AGC INC. ), PolyFox PF636, PF656, PF6320, PF6520, PF7002 (manufactured by OMNOVA SOLUTIONS INC.), Futurgent 208G, 215M, 245F, 601AD, 601ADH2, 602A, 610FM, 710FL, 710FM, 710FS, FTX-218 ( The above is NEOS COMPANY LIMITED), etc.

Also, as the fluorine-based surfactant, an acrylic compound having a molecular structure having a functional group containing a fluorine atom, and the functional group containing a fluorine atom being partly cut off when heat is applied can also be preferably used. Fluorine atoms evaporate. Examples of such fluorine-based surfactants include MEGAFACE DS series manufactured by DIC Corporation (Chemical Industry Daily (February 22, 2016), Nikkei Sangyo Shimbun (February 23, 2016)), for example, MEGAFACE DS-21.

Furthermore, it is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound as the fluorine-based surfactant. Examples of such fluorine-based surfactants include fluorine-based surfactants described in JP-A-2016-216602, and the content is incorporated in this specification.

上述化合物的重量平均分子量較佳為3000～50000，例如為14000。上述化合物中，表示重複單元的比例之%為莫耳%。 A block polymer can also be used as a fluorine-type surfactant. As a fluorine-based surfactant, a fluorine-containing polymer compound including a repeating unit derived from a (meth)acrylate compound having a fluorine atom and a fluorine-containing polymer compound derived from two or more ( It is preferably a repeating unit of (meth)acrylate compound having 5 or more) alkoxyl groups (preferably ethyleneoxyl, propoxyl groups). In addition, the fluorine-containing surfactant described in paragraphs 0016 to 0037 of JP-A-2010-032698 and the following compounds are also exemplified as the fluorine-based surfactant used in the present invention. [chemical formula 17]

The weight average molecular weight of the above compound is preferably 3000-50000, for example 14000. In the above-mentioned compounds, % representing the ratio of repeating units is mole %.

In addition, as the fluorine-based surfactant, a fluorine-containing polymer having an ethylenically unsaturated bond-containing group on a side chain can also be used. Specific examples include compounds described in paragraphs 0050 to 0090 and paragraphs 0289 to 0295 of JP-A-2010-164965, MEGAFACE RS-101, RS-102, RS-718K, RS- 72-K et al. In addition, as the fluorine-based surfactant, compounds described in paragraphs 0015 to 0158 of JP-A-2015-117327 can also be used.

Also, from the viewpoint of environmental control, it is also preferable to use the surfactant described in International Publication No. 2020/084854 as a substitute for the surfactant having a perfluoroalkyl group having 6 or more carbon atoms.

式（fi-1）中，m表示1或2，n表示1～4的整數，a表示1或2，X ^a+表示a價的金屬離子、一級銨離子、二級銨離子、三級銨離子、四級銨離子或NH ₄ ⁺。 Furthermore, it is also preferable to use a fluoroimide salt-containing compound represented by the formula (fi-1) as a surfactant. [chemical formula 18]

In the formula (fi-1), m represents 1 or 2, n represents an integer from 1 to 4, a represents 1 or 2, X ^a+ represents a-valent metal ions, primary ammonium ions, secondary ammonium ions, and tertiary ammonium ions , quaternary ammonium ion or NH ₄ ⁺ .

Examples of nonionic surfactants include glycerin, trimethylolpropane, trimethylolethane, and their ethoxylates and propoxylates (for example, glycerin propoxylate, glycerin ethoxylate base compounds, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol di Laurate, polyethylene glycol distearate, sorbitan fatty acid ester, Pluronic L10, L31, L61, L62, 10R5, 17R2, 25R2 (manufactured by BASF Corporation), Tetronic 304, 701, 704, 901 , 904, 150R1 (manufactured by BASF Corporation), Solsperse 20000 (manufactured by Lubrizol Japan Limited.), NCW-101, NCW-1001, NCW-1002 (manufactured by Wako Pure Chemical, Ltd.), PIONIN D-6112, D-6112- W, D-6315 (manufactured by Takemoto Oil & Fat Co., Ltd.), Olfine E1010, Surfynol 104, 400, 440 (manufactured by Nissin Chemical Co., Ltd.), etc.

Examples of cationic surfactants include tetraalkylammonium salts, alkylamine salts, benzalkonium chloride, alkylpyridinium salts, imidazolium salts, and the like. Specific examples include dihydroxyethylstearylamine, 2-heptadecenyl-hydroxyethylimidazoline, lauryldimethylbenzyl ammonium chloride, cetylpyridinium chloride, stearyl Aminomethylpyridinium chloride, etc.

Examples of anionic surfactants include dodecylbenzenesulfonic acid, sodium dodecylbenzenesulfonate, sodium lauryl sulfate, sodium alkyldiphenyl ether disulfonate, sodium alkylnaphthalenesulfonate, dioxane Sodium Sulfosuccinate, Sodium Stearate, Potassium Oleate, Dioctyl Sodium Sulfosuccinate, Sodium Polyoxyethylene Alkyl Ether Sulfate, Sodium Polyoxyethylene Alkyl Phenyl Ether Sulfate, Dialkyl Sulfonate Sodium succinate, sodium oleate, tertiary octylphenoxyethoxypolyethoxyethylsulfate sodium salt, etc.

Examples of silicone-based surfactants include SH8400, SH 8400 FLUID, FZ-2122, 67 Additive, 74 Additive, M Additive, SF 8419 OIL (manufactured by Dow Toray Co., Ltd.), TSF- 4440, TSF-4300, TSF-4445, TSF-4460, TSF-4452 (the above are manufactured by Momentive Performance Materials Inc.), KP-341, KF-6000, KF-6001, KF-6002, KF-6003 (the above are Shin-Etsu Chemical Co., Ltd.), BYK-307, BYK-322, BYK-323, BYK-330, BYK-3760, BYK-UV3510 (the above are manufactured by BYK Chemie), etc.

Moreover, the compound of the following structures can also be used among polysiloxane-type surfactants. [chemical formula 19]

The content of the surfactant in the total solids of the curable composition is preferably 0.001 to 1% by mass, more preferably 0.001 to 0.5% by mass, and still more preferably 0.001 to 0.2% by mass. The curable composition of the present invention may contain only one type of surfactant, or may contain two or more types. When containing two or more types of surfactants, the total amount is preferably within the above range.

＜＜Silane coupling agent＞＞ The curable composition of the present invention can contain a silane coupling agent. In this specification, a silane coupling agent refers to a silane compound having a hydrolyzable group and other functional groups. Also, the hydrolyzable group refers to a substituent that is directly bonded to a silicon atom and can generate a siloxane bond by at least one of a hydrolysis reaction and a condensation reaction. As a hydrolyzable group, a halogen atom, an alkoxy group, an acyloxy group etc. are mentioned, for example, An alkoxy group is preferable. That is, the silane coupling agent is preferably a compound having an alkoxysilyl group. In addition, examples of functional groups other than hydrolyzable groups include vinyl groups, (meth)acryl groups, mercapto groups, epoxy groups, oxetanyl groups, amine groups, urea groups, thioether groups, and isocyanate groups. , phenyl, etc., (meth)acryl and epoxy are preferred. Examples of the silane coupling agent include compounds described in paragraphs 0018 to 0036 of JP-A-2009-288703 and compounds described in paragraphs 0056-0066 of JP-A-2009-242604. incorporated into this manual. The content of the silane coupling agent in the total solid content of the curable composition is preferably 0.01 to 15.0% by mass, more preferably 0.05 to 10.0% by mass. The curable composition of the present invention may contain only one type of silane coupling agent, or may contain two or more types. When containing 2 or more types of silane coupling agents, it is preferable that these total amounts are in the said range.

＜＜Polymerization inhibitor＞＞ The curable composition of the present invention can contain a polymerization inhibitor. Examples of polymerization inhibitors include hydroquinone, p-methoxyphenol, di-tertiary butyl-p-cresol, gallicol, tertiary butylcatechol, benzoquinone, 4,4'-thio Bis(3-methyl-6-tertiary butylphenol), 2,2'-methylene bis(4-methyl-6-tertiary butylphenol), N-nitrosophenylhydroxylamine salt ( ammonium salt, primary cerium salt, etc.), p-methoxyphenol is preferred. The content of the polymerization inhibitor in the total solid content of the curable composition is preferably 0.0001 to 5% by mass. The curable composition of the present invention may contain only one type of polymerization inhibitor, or may contain two or more types. When containing two or more kinds of polymerization inhibitors, the total amount is preferably within the above range.

＜＜Antioxidant＞＞ The curable composition of the present invention can contain an antioxidant. As an antioxidant, a phenolic compound, a phosphite compound, a thioether compound, etc. are mentioned. As the phenolic compound, any phenolic compound called a phenolic antioxidant can be used. A hindered phenol compound is mentioned as a preferable phenol compound. A compound having a substituent at a position adjacent to the phenolic hydroxyl group (ortho position) is preferred. As the aforementioned substituent, a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms is preferred. Moreover, it is also preferable that an antioxidant is a compound which has a phenolic group and a phosphite group in the same molecule. Moreover, phosphorus antioxidant can also be used preferably as an antioxidant. Examples of phosphorus-based antioxidants include tris[2-[[2,4,8,10-tetrakis(1,1-dimethylethyl)dibenzo[d,f][1,3,2] Dioxaphosphine-6-yl]oxy]ethyl]amine, tris[2-[(4,6,9,11-tetra-tertiary butyldibenzo[d,f] [1,3,2]dioxaphosphine-2-yl)oxy]ethyl]amine, bis(2,4-di-tertiary butyl-6-methylphenyl) Ethyl phosphate etc. Examples of commercially available antioxidants include ADK STAB AO-20, ADK STAB AO-30, ADK STAB AO-40, ADK STAB AO-50, ADK STAB AO-50F, ADK STAB AO-60, ADK STAB AO-60G, ADK STAB AO-80, ADK STAB AO-330 (the above are manufactured by ADEKA Corporation), etc. In addition, as an antioxidant, compounds described in paragraphs 0023 to 0048 of Japanese Patent No. 6268967, compounds described in International Publication No. 2017/006600, and compounds described in International Publication No. 2017/164024 can also be used. The content of the antioxidant in the total solid content of the curable composition is preferably 0.01 to 20% by mass, more preferably 0.3 to 15% by mass. The curable composition of this invention may contain only 1 type of antioxidant, and may contain 2 or more types. When containing two or more types of antioxidants, it is preferable that the total amount is within the above range.

＜＜Coloring agent＞＞ The curable composition of the present invention can contain a colorant. As a coloring agent, a green coloring agent, a red coloring agent, a yellow coloring agent, a purple coloring agent, a blue coloring agent, an orange coloring agent, a black coloring agent etc. are mentioned. The coloring agent may be a pigment or a dye. The content of the coloring agent in the total solid content of the curable composition is preferably 5% by mass or less, more preferably 1% by mass or less. It is preferable that the curable composition of this invention does not contain a coloring agent substantially. Furthermore, when the curable composition of the present invention does not substantially contain a colorant, it means that the content of the colorant in the total solid content of the curable composition is 0.1% by mass or less, preferably 0.05% by mass or less, and not more than 0.05% by mass. It is more preferable to contain a coloring agent.

＜＜Other ingredients＞＞ The curable composition of the present invention may contain sensitizers, hardening accelerators, fillers, thermosetting accelerators, plasticizers, and other additives (such as conductive particles, defoamers, flame retardants, leveling agents, etc.) agents, peel accelerators, fragrances, surface tension regulators, chain transfer agents, etc.). Properties such as film physical properties can be adjusted by appropriately containing these components. Regarding these components, for example, reference can be made to the description in paragraph 0183 and subsequent paragraphs of Japanese Patent Application Publication No. 2012-003225 (corresponding to paragraph 0237 of US Patent Application Publication No. 2013/0034812), and paragraph 0101 of Japanese Patent Application Publication No. 2008-250074. ~0104, 0107~0109 paragraphs, etc., these contents are incorporated into this specification. Moreover, the composition of this invention may contain a latent antioxidant as needed. As a potential antioxidant, the portion that functions as an antioxidant is protected by a protecting group and the protecting group is heated at 100 to 250°C or heated at 80 to 200°C in the presence of an acid/base catalyst. A compound that breaks away and functions as an antioxidant. Examples of potential antioxidants include compounds described in International Publication No. 2014/021023, International Publication No. 2017/030005, and JP-A-2017-008219. As a commercial item of a latent antioxidant, ADEKA ARKLS GPA-5001 (made by ADEKA CORPORATION) etc. are mentioned.

＜Containment container＞ The storage container for the curable composition of the present invention is not particularly limited, and known storage containers can be used. Also, as a storage container, for the purpose of preventing impurities from mixing into raw materials or curable compositions, it is also preferable to use a multi-layer bottle whose inner wall is made of 6 types of 6-layer resins or a bottle with 6 types of resins as a 7-layer structure. . As such a container, the container described in Unexamined-Japanese-Patent No. 2015-123351 is mentioned, for example. In addition, it is also preferable that the inner wall of the container is made of glass or stainless steel for the purpose of preventing elution of metal from the inner wall of the container, improving the stability of the curable composition over time, or suppressing deterioration of the components.

<Preparation method of curable composition> The curable composition of the present invention can be prepared by mixing the aforementioned components. When preparing the curable composition, all the components can be dissolved or dispersed in a solvent at the same time to prepare the curable composition, or two or more kinds of solutions or dispersions prepared by properly blending each component as needed can be prepared in advance, and These are mixed at the time of use (at the time of coating) to prepare a composition.

When preparing the curable composition, the process of dispersing the pigment may be included. In the process of dispersing the pigment, the mechanical force used for dispersing the pigment includes compression, extrusion, impact, shearing, cavitation, and the like. Specific examples of these processes include bead mills, sand mills, roller mills, ball mills, pain shakers, microfluidizers, high-speed impellers, and sand mills. , jet mixer (flowjet mixer), high-pressure wet micronization, ultrasonic dispersion, etc. In addition, in the pulverization of the pigment in the sand mixer (bead mill), it is preferable to process under the conditions that the pulverization efficiency is improved by using small-diameter beads, increasing the filling rate of the beads, and the like. In addition, after pulverization, it is preferable to remove coarse particles by filtration, centrifugation, or the like. Also, regarding the process and dispersing machine for dispersing pigments, it is possible to preferably use the "Compendium of Dispersion Technology, JOHOKIKO CO., LTD. Issued, July 15, 2005" or "Suspension (solid/liquid dispersion system)" as The center's dispersion technology and industrial practical application comprehensive data collection, issued by the publishing department of the management and development center, October 10, 1978", the process and dispersion machine recorded in paragraph 0022 of Japanese Patent Application Laid-Open No. 2015-157893. In addition, in the process of dispersing the pigment, the micronization treatment of the pigment may be performed in the salt milling step. For materials, equipment, and processing conditions used in the salt milling step, for example, reference can be made to the descriptions in JP-A-2015-194521 and JP-A-2012-046629. As microbeads for dispersion, zirconia, agate, quartz, titanium dioxide, tungsten carbide, silicon nitride, aluminum oxide, stainless steel, glass or combinations thereof can be used. Moreover, the inorganic compound whose Mohs hardness is 2 or more can also be used as a microbead. The curable composition may contain 1 to 10000 ppm of the aforementioned microbeads.

When preparing the curable composition, it is preferable to filter the curable composition with a filter for the purpose of removing foreign matter or reducing defects. As a filter, if it is a filter conventionally used for a filtration use etc., it can use without limitation in particular. For example, fluorine resins such as polytetrafluoroethylene (PTFE), polyamide resins such as nylon (such as nylon-6, nylon-6,6), polyolefin resins such as polyethylene and polypropylene (PP) (including high Density, ultra-high molecular weight polyolefin resin) and other materials. Among these materials, polypropylene (including high density polypropylene) and nylon are preferred.

The pore size of the filter is preferably from 0.01 to 7.0 μm, more preferably from 0.01 to 3.0 μm, and still more preferably from 0.05 to 0.5 μm. As long as the pore size of the filter is within the above range, fine foreign matter can be removed more reliably. For the pore diameter value of the filter, you can refer to the nominal value of the filter manufacturer. As for the filter, various filters provided by NIHON PALL Corporation (DFA4201NXEY, DFA4201NAEY, DFA4201J006P, etc.), Advantec Toyo Kaisha, Ltd., Nihon Entegris K.K. (Formerly Nippon Mykrolis Corporation), KITZ MICROFILTER Corporation, etc. can be used.

Moreover, it is also preferable to use a fibrous filter material as a filter. As a fibrous filter material, a polypropylene fiber, a nylon fiber, a glass fiber etc. are mentioned, for example. Examples of commercially available products include SBP type series (SBP008, etc.), TPR type series (TPR002, TPR005, etc.), and SHPX type series (SHPX003, etc.) manufactured by ROKI TECHNO CO., LTD.

When using filters, it is possible to combine different filters (for example, 1st filter and 2nd filter, etc.). In this case, the filtration by each filter may be performed only once, or may be performed two or more times. Also, filters with different pore diameters may be combined within the above range. In addition, the filtration by the first filter may be performed only on the dispersion liquid, and after mixing other components, it may be filtered by the second filter.

＜Cured film＞ Next, the cured film of the present invention will be described. The cured film of the present invention is obtained by curing the curable composition of the present invention described above. The cured film of the present invention can be preferably used as a near-infrared cut filter. Examples of near-infrared cut filters include near-infrared cut filters on the light-receiving side of solid-state imaging devices (such as near-infrared cut filters for wafer-level lenses), The infrared cut filter on the opposite side), the near infrared cut filter for the ambient light sensor (such as the illuminance sensor that adjusts the color tone of the display by sensing the illuminance or color tone of the environment where the information terminal device is installed, or the color of the color tone sensor for calibration), etc. In particular, it can be suitably used as a near-infrared cut filter on the light-receiving side of a solid-state imaging element.

The cured film of the present invention may have a pattern, or may be a film (flat film) not having a pattern.

The thickness of the cured film of this invention can be adjusted suitably according to the objective. The thickness of the cured film is preferably 20 μm or less, more preferably 10 μm or less, still more preferably 5 μm or less, still more preferably 4 μm or less, still more preferably 2.5 μm or less. The lower limit of the thickness of the film is preferably at least 0.1 μm, more preferably at least 0.2 μm, and still more preferably at least 0.5 μm.

The cured film of the present invention has a transmittance of at least 20% or less in at least one point in the wavelength range of 700 to 2000 nm (preferably 700 to 1500 nm, more preferably 700 to 1300 nm, further preferably 700 to 1000 nm) More preferably, less than 15%, more preferably less than 10%. Also, the average transmittance of light having a wavelength of 400 to 600 nm is preferably 70% or more, more preferably 80% or more, still more preferably 85% or more, and particularly preferably 90% or more. In addition, the minimum value of the transmittance of light in a wavelength range of 400 to 600 nm is preferably 70% or more, more preferably 80% or more, and still more preferably 90% or more.

The cured film of the present invention has a ratio (absorbance ratio A ¹ /A ² ) of the maximum value A ¹ of the absorbance in the wavelength range of 700 to 2000 nm to the maximum value A ² of the absorbance in the range of the wavelength of 400 to 600 nm of 4.5 or more 6 or more is more preferable, 8 or more is still more preferable, and 12 or more is still more preferable. The upper limit is not particularly limited, but can be set to 50 or less.

The cured film of the present invention preferably has a ratio (absorbance ratio A ¹ /A ³ ) of the maximum absorbance A ¹ at a wavelength of 700 to 2000 nm to the absorbance A ³ at a wavelength of 365 nm of 1 or more and less than 9. The lower limit is preferably 1.5 or more, more preferably 2 or more. It is better if the upper limit does not reach 4.5, and it is better if it does not reach 3.

The cured film of the present invention can also be used in combination with a color filter containing a coloring agent. A color filter can be manufactured using the coloring composition containing a coloring agent. When using the cured film of this invention and a color filter in combination, it is preferable to arrange|position a color filter on the optical path of the cured film of this invention. For example, it is preferable to laminate the cured film of this invention and a color filter, and use it as a laminated body. In the laminate, both the cured film and the color filter of the present invention may or may not be adjacent to each other in the thickness direction. When the cured film of the present invention is not adjacent to the color filter in the thickness direction, the cured film of the present invention may be formed on a support different from the support on which the color filter is formed, or may be formed on the support of the present invention. Other components (for example, microlenses, planarization layers, etc.) constituting the solid-state imaging device are interposed between the film and the color filter.

The cured film of the present invention can be used in various devices such as solid-state imaging devices such as CCD (charge coupled device) and CMOS (complementary metal oxide semiconductor), infrared sensors, and image display devices.

＜How to form the pattern＞ The forming method of pattern of the present invention comprises: A step of forming a curable composition layer on a support using the curable composition of the present invention; In the first exposure step, the curable composition layer is irradiated with light having a wavelength of more than 350 nm and less than 380 nm and exposed in a pattern; a developing step of developing the curable composition layer; and In the second exposure step, after the development step, the curable composition layer is irradiated with light having a wavelength of not less than 254 nm and not more than 350 nm.

In the pattern forming method of the present invention, it is preferable to perform the treatment at a temperature of less than 200°C through all the steps, more preferably at a temperature of 150°C or lower. In addition, in this specification, "processing at the temperature of less than 200 degreeC through all steps" means performing all the steps of forming a patterned cured film using a curable composition at the temperature of less than 200 degreeC.

In the pattern forming method of the present invention, a heating step can also be provided after the second exposure step. However, in this case, the heating temperature is set to less than 200°C. Each step will be described in detail below.

＜＜Formation procedure of curable composition layer＞＞ In the step of forming the curable composition layer, the curable composition of the present invention is coated on a support to form the curable composition layer.

Examples of the support include semiconductor substrates such as silicon substrates and transparent substrates.

Charge-coupled devices (CCD), complementary metal oxide semiconductor (CMOS), transparent conductive films, etc. can be formed on the semiconductor substrate used as a support. In addition, partition walls or black matrices for isolating each pixel may be formed on the semiconductor substrate. In addition, an undercoat layer may be provided on the semiconductor base material if necessary in order to improve the adhesion with the upper layer, prevent the diffusion of substances, or planarize the substrate surface.

The transparent substrate used as the support is not particularly limited as long as it is made of a material that can transmit at least visible light. For example, substrates made of materials such as glass and resin are mentioned. Examples of the resin include polyester resins such as polyethylene terephthalate and polybutylene terephthalate, polyolefin resins such as polyethylene, polypropylene, and ethylene vinyl acetate copolymers, norbornene resins, polyacrylic acid resins, and the like. Acrylic resins such as esters, polymethyl methacrylate, polyurethane resins, vinyl chloride resins, fluororesins, polycarbonate resins, polyvinyl butyral resins, polyvinyl alcohol resins, etc. Examples of glass include soda-lime glass, borosilicate glass, non-alkali glass, quartz glass, copper-containing glass, and the like. Examples of copper-containing glass include copper-containing phosphate glass, copper-containing fluorophosphate glass, and the like. Commercially available glass can also be used for copper-containing glass. As a commercial item of copper-containing glass, NF-50 (made by AGC TECHNO GLASS Co., Ltd.) etc. are mentioned.

As a coating method of the curable composition, known methods can be used. For example, there may be mentioned dropping method (drip casting); slit coating method; spray method; roll coating method; spin coating method (spin coating); , the method described in Japanese Patent Laid-Open No. 2009-145395); inkjet (such as on-demand method, piezoelectric method, thermal method), nozzle jetting and other jetting printing, flexographic printing, screen printing, gravure printing, Various printing methods such as reverse offset printing and metal mask printing; transfer printing using a mold, etc.; nanoimprinting, etc. There are no particular limitations on the method of application in inkjet, and examples include "Inkjet that can be promoted and used-Infinite Possibilities Appeared in Patents-, Issued in February 2005, Sumitbe Techon Research Co., Ltd." The method shown (especially pages 115 to 133) or Japanese Patent Application Publication No. 2003-262716, Japanese Patent Application Publication No. 2003-185831, Japanese Patent Application Publication No. 2003-261827, Japanese Patent Application Publication No. 2012-126830, The method described in Japanese Unexamined Patent Application Publication No. 2006-169325 and the like.

The curable composition layer formed on the support may be dried (prebaked). In the case of prebaking, the prebaking temperature is preferably 80°C or lower, more preferably 70°C or lower, still more preferably 60°C or lower, and particularly preferably 50°C or lower. The lower limit can be set to, for example, 40° C. or higher. The pre-baking time is preferably 10-3600 seconds. Prebaking can be performed with a hot plate, an oven, or the like.

＜＜1st exposure step＞＞ In the first exposure step, the curable composition layer is irradiated with light having a wavelength of more than 350 nm and not more than 380 nm to expose in a pattern. For example, by exposing the curable composition layer through a mask having a predetermined mask pattern using an exposure device such as a stepper, patternwise exposure can be performed. Thereby, the exposed portion of the curable composition layer can be cured. The light that can be used at the time of exposure is preferably light having a wavelength of more than 350 nm and not more than 370 nm, more preferably i-rays (365 nm).

The amount of irradiation (exposure amount) is, for example, preferably 30 to 1500 mJ/cm ² , more preferably 50 to 1000 mJ/cm ² . The oxygen concentration at the time of exposure can be appropriately selected. In addition to exposure in the atmosphere, for example, a low-oxygen environment with an oxygen concentration of 19% by volume or less (for example, 15% by volume, 5% by volume, substantially oxygen-free) can be used. Exposure may be performed under a high-oxygen environment (for example, 22 volume %, 30 volume %, 50 volume %) where the oxygen concentration exceeds 21 volume %. In addition, the exposure illuminance can be appropriately set, and usually can be selected from the range of 1000 W/m ² to 100,000 W/m ² (for example, 5,000 W/m ² , 15,000 W/m ² , 35,000 W/m ² ). The conditions of oxygen concentration and exposure illuminance can be appropriately combined, for example, an oxygen concentration of 10% by volume and an illuminance of 10,000 W/m ² , an oxygen concentration of 35% by volume and an illuminance of 20,000 W/m ² .

＜<Development step＞＞ In the developing step, unexposed portions of the curable composition layer are removed by development to form a pattern (pixel). The development and removal of the unexposed portion of the curable composition layer can be performed using a developer. Thereby, the curable composition layer of the unexposed portion in the exposure step is dissolved in the developing solution, and only the photocured portion remains. As a developing solution, an organic solvent, an alkali developing solution, etc. are mentioned, and an alkali developing solution is preferable. The temperature of the developer is preferably, for example, 20 to 30°C. The development time is preferably 20 to 180 seconds. In addition, in order to improve the residue removal performance, the step of shaking off the developing solution every 60 seconds and supplying a new developing solution may be repeated several times.

Alkaline developer is preferably an alkaline aqueous solution obtained by diluting an alkaline agent with pure water. Examples of alkaline agents include ammonia, ethylamine, diethylamine, dimethylethanolamine, diglycolamine, diethanolamine, hydroxylamine, ethylenediamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide Ammonium, Tetrapropylammonium Hydroxide, Tetrabutylammonium Hydroxide, Ethyltrimethylammonium Hydroxide, Benzyltrimethylammonium Hydroxide, Dimethylbis(2-hydroxyethyl)ammonium Hydroxide, Bile Alkali, pyrrole, piperidine, 1,8-diazabicyclo[5.4.0]-7-undecene and other organic basic compounds or sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, silicic acid Sodium, sodium metasilicate and other inorganic alkaline compounds. From the viewpoint of environment and safety, it is preferable that the alkali agent is a compound with a large molecular weight. The concentration of the alkaline agent in the alkaline aqueous solution is preferably from 0.001 to 10% by mass, more preferably from 0.01 to 1% by mass. In addition, the developer may further contain a surfactant. As the surfactant, a nonionic surfactant is preferred. From the viewpoint of convenient transportation and storage, the developer can be temporarily produced as a concentrated solution and diluted to the required concentration when used. The dilution ratio is not particularly limited, and can be set, for example, within a range of 1.5 to 100 times.

Moreover, it is also preferable to wash (rinse) with pure water after image development. Further, rinsing is preferably performed by supplying a rinsing liquid to the developed curable composition layer while rotating the support on which the developed curable composition layer is formed. Moreover, it is also preferable to carry out by moving the nozzle which discharges a rinse liquid from the center part of a support body to the peripheral part of a support body. At this time, when moving from the central part of the support body of the nozzle to the peripheral part, the moving speed of the nozzle may be gradually reduced while moving. By performing rinsing in this manner, in-plane variation in rinsing can be suppressed. Also, the same effect can be obtained by gradually reducing the rotational speed of the support while moving the nozzle from the center portion of the support to the peripheral portion.

＜＜Second Exposure Step＞＞ In the second exposure step, the curable composition layer is exposed by irradiating light having a wavelength of not less than 254 nm and not more than 350 nm. The light to be irradiated preferably includes light having a wavelength of 300 nm or less, more preferably includes light having a wavelength of 254 nm. The second exposure step can be performed using, for example, an ultraviolet photoresist curing device. From the ultraviolet resist curing device, other light (for example, i-ray) may be irradiated together with light having a wavelength of, for example, 254 nm or more and 350 nm or less. The difference between the wavelength of light used for exposure before development and the wavelength of light used for exposure after development (post-exposure) is preferably 200 nm or less, more preferably 100 to 150 nm.

The irradiation dose (exposure dose) is preferably 30 to 4000 mJ/cm ² , more preferably 50 to 3500 mJ/cm ² . The oxygen concentration at the time of exposure can be appropriately selected in the same manner as the conditions at the time of the first exposure step.

In the present invention, by exposing the curable composition layer in two steps before and after development, the curable composition layer can be properly cured in the first exposure (exposure before development), and can be cured in the second exposure. (exposure after development) almost completely hardens the entire curable composition layer. As a result, the curable composition is fully cured even under low temperature conditions of less than 200° C., and a pattern-shaped cured film having excellent adhesion and excellent solvent resistance, flatness, and rectangularity can be formed.

＜＜Post-baking＞＞ In the pattern formation of the present invention, a step of heating the curable composition layer at a predetermined temperature (post-baking) may be further performed during at least any period between the development step and the second exposure step and after the second exposure step. The heating temperature of the post-baking is preferably less than 200°C, more preferably 150°C or lower, and still more preferably 120°C or lower. Moreover, the heating temperature of the post-baking is preferably 45° C. or higher, more preferably 50° C. or higher, and still more preferably 80° C. or higher. In particular, when a resin substrate is used or the photoelectric conversion layer is formed of an organic material, the heating temperature is preferably 50 to 120°C, more preferably 80 to 100°C, and still more preferably 80 to 90°C. The heating time can be appropriately selected, for example, 1 to 10 minutes, preferably 2 to 8 minutes, more preferably 3 to 6 minutes.

The post-baking can be performed in the atmosphere or in a low-oxygen environment. From the viewpoint of suppressing deterioration due to oxidation of the film, etc., post-baking is preferably carried out in a low-oxygen environment with an oxygen concentration of 19% by volume or less, more preferably 15% by volume or less, and 5% by volume. % or less is further preferred, and 1 volume % or less (substantially free of oxygen) is particularly preferred.

Post-baking can be performed continuously or batchwise using a heating mechanism such as a hot plate, a convection oven (hot air circulation dryer), or a high-frequency heater. On the other hand, post-baking may not be performed when there is a problem in heating the exposed structure or when the curable composition layer is sufficiently cured.

It is preferable that the thickness of the patterned cured film after the 2nd exposure process (after post-baking when post-baking is performed after the 2nd exposure process) is 0.1-5 micrometers. The lower limit is preferably 0.2 μm or more, more preferably 0.3 μm or more. The upper limit is preferably 3 μm or less, more preferably 1.5 μm or less. It is preferable that the width of the pattern of a cured film is 0.1-20 micrometers. The lower limit is preferably 0.3 μm or more, more preferably 0.5 μm or more. The upper limit is preferably 15 μm or less, more preferably 10 μm or less.

＜Near Infrared Cut Filter＞ The near-infrared cut filter of the present invention has the above-mentioned cured film of the present invention. The near-infrared cut filter of the present invention has an average transmittance of light having a wavelength of 400 to 600 nm is preferably 70% or more, more preferably 80% or more, still more preferably 85% or more, and most preferably 90% or more. In addition, the minimum value of the transmittance of light in a wavelength range of 400 to 600 nm is preferably 70% or more, more preferably 80% or more, and still more preferably 90% or more. The preferred range of the near-infrared shielding property of the near-infrared cut filter varies depending on the application, but at a wavelength of 700 to 2000 nm (preferably a wavelength of 700 to 1500 nm, more preferably a wavelength of 700 to 1300 nm, and more preferably a wavelength of 700 to 1000 nm) range, the transmittance of at least one point is preferably 20% or less, more preferably 15% or less, and still more preferably 10% or less.

The near-infrared cut filter of the present invention may have a copper-containing layer, a dielectric multilayer film, an ultraviolet absorbing layer, and the like in addition to the above-mentioned cured film of the present invention. Examples of the ultraviolet absorbing layer include absorbing layers described in paragraphs 0040 to 0070 and paragraphs 0119 to 0145 of International Publication No. 2015/099060. Examples of the dielectric multilayer film include dielectric multilayer films described in paragraphs 0255 to 0259 of JP-A-2014-041318. As the copper-containing layer, a glass substrate (copper-containing glass substrate) or a copper complex-containing layer (copper complex-containing layer) formed of copper-containing glass can also be used. Copper-containing phosphate glass, copper-containing fluorophosphate glass, etc. are mentioned as a copper-containing glass substrate. Examples of commercially available copper-containing glass include NF-50 (manufactured by AGC TECHNO GLASS CO., LTD.), BG-60, BG-61 (manufactured by Schott AG), CD5000 (manufactured by HOYA GROUP), etc. .

＜Solid state image sensor＞ The solid-state imaging device of the present invention includes the above-mentioned cured film of the present invention. As a structure of a solid-state imaging element, it is a structure which has the cured film of this invention, and it will not specifically limit if it is a structure which functions as a solid-state imaging element. For example, the following structures are mentioned.

It has the following structure: on the support body, there are a plurality of photodiodes constituting the light-receiving area of the solid-state imaging element and a transmission electrode composed of polysilicon, etc., and on the photodiode and the transmission electrode, there is a reason for the opening of the light-receiving part of the photodiode only A light-shielding film made of tungsten, etc., has a device protection film made of silicon nitride on the light-shielding film so as to cover the entire surface of the light-shielding film and the light-receiving part of the photodiode, and has a cured film of the present invention on the device protection film . In addition, on the protective film of the device and on the lower side (the side closer to the support) of the cured film of the present invention, there may be a light-condensing mechanism (for example, a microlens, etc., the same below) or a structure in which the cured film of the present invention It has the structure of the light-gathering mechanism, etc. In addition, the color filter may have a structure in which a film forming each pixel is embedded in a space partitioned by a partition wall, for example, in a grid pattern. In this case, the refractive index of the partition wall is preferably lower than the refractive index of each pixel. As an example of the imaging device which has such a structure, the apparatus described in Unexamined-Japanese-Patent No. 2012-227478 and Unexamined-Japanese-Patent No. 2014-179577 is mentioned.

＜Image Display Device＞ The image display device of this invention contains the cured film of this invention. As an image display device, a liquid crystal display device, an organic electroluminescence (organic EL) display device, etc. are mentioned. Regarding the definition or details of the image display device, for example, it is described in "Electronic Display Device (written by Akio Sasaki, published by Kogyo Chosakai Publishing Co., Ltd., 1990)", "Display Device (written by Junaki Ibuki, Sangyo Tosho Publishing Co., Ltd., issued in 1989)" and so on. Also, liquid crystal display devices are described, for example, in "Next Generation Liquid Crystal Display Technology (edited by Tatsuo Uchida, published by Kogyo Chosakai Publishing Co., Ltd., 1994)". The liquid crystal display device to which the present invention can be applied is not particularly limited, and for example, it can be applied to liquid crystal display devices of various types described in the above-mentioned "next-generation liquid crystal display technology". The image display device may have a white organic EL element. As a white organic EL element, a tandem structure is preferable. The series structure of organic EL elements is described in JP-A-2003-045676, supervised by Akiyoshi Mikami, "The Frontier of Organic EL Technology Development - High Brightness, High Precision, Long Life, Skill Collection-", Technical Information Institute Co., Ltd., pp. 326-328, 2008, etc. The spectrum of the white light emitted by the organic EL element is preferably one with strong maximum luminescence peaks in the blue region (430-485nm), green region (530-580nm) and yellow region (580-620nm). In addition to these luminescence peaks, those having a very large luminescence peak in the red region (650 to 700 nm) are more preferable.

＜Infrared sensor＞ The infrared sensor of this invention contains the above-mentioned cured film of this invention. The structure of the infrared sensor is not particularly limited as long as it functions as an infrared sensor. Hereinafter, an embodiment of the infrared sensor of the present invention will be described using the drawings.

In FIG. 1 , reference numeral 110 denotes a solid-state imaging element. A near-infrared cut filter 111 and an infrared transmission filter 114 are arranged in the imaging area of the solid-state imaging device 110 . Also, a color filter 112 is arranged on the near-infrared cut filter 111 . A microlens 115 is disposed on the incident light hν side of the color filter 112 and the infrared transmission filter 114 . A planarization layer 116 is formed to cover the microlenses 115 .

The near-infrared cut filter 111 can be formed using the curable composition of the present invention. The color filter 112 is a color filter formed with a pixel that transmits and absorbs light of a specific wavelength in the visible region, and is not particularly limited, and a conventionally known color filter for forming a pixel can be used. For example, a color filter in which pixels of red (R), green (G), and blue (B) are formed can be used. For example, descriptions in paragraphs 0214 to 0263 of JP-A-2014-043556 can be referred to, and the content is incorporated in this specification. The characteristics of the infrared transmission filter 114 can be selected according to the emission wavelength of the infrared LED used.

In the infrared sensor shown in FIG. 1 , a near-infrared cut filter (other near-infrared cut filter) different from the near-infrared cut filter 111 may be arranged on the planarization layer 116 . Examples of other near-infrared cut filters include those having a copper-containing layer and/or a dielectric multilayer film. The above-mentioned ones are mentioned about these details. Also, as another near-infrared cut filter, a double bandpass filter can be used. [Example]

Hereinafter, the present invention will be described in detail with reference to examples. Materials, usage amounts, proportions, processing contents, processing steps, etc. shown in the following examples can be appropriately changed as long as they do not depart from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below.

＜Manufacture of curable composition＞ Materials listed in the following tables were mixed to produce curable compositions. Furthermore, regarding the dispersion liquid, a dispersion liquid prepared as follows was used by mixing the components described in the column of the dispersion liquid in the following table with the blending amounts expressed in parts by mass described in the column of the dispersion liquid in the following table. 230 parts by mass of zirconia beads with a diameter of 0.3 mm were further added to the material of each type, dispersion treatment was performed for 5 hours using a paint shaker, and the beads were separated by filtration to prepare a dispersion liquid. In addition, those described in the column of the compounding amount in infrared absorber, dispersing aid, dispersant, polymerizable monomer, photopolymerization initiator, ultraviolet absorber, additive, resin, surfactant, and polymerization inhibitor The numerical value is the value converted into solid content.

[Table 1] Dispersions infrared absorber infrared absorber Dispersing aid Dispersant solvent type parts by mass type parts by mass type parts by mass type parts by mass type parts by mass Example 1 A1 2.5 S1 0.5 C1 2.4 J1 35 Example 2 A2 2.5 S2 0.5 C1 2.4 J1 35 Example 3 A3 2.5 S3 0.5 C1 2.4 J1 35 Example 4 A4 2.5 S4 0.5 C1 2.4 J1 35 Example 5 A5 2.5 S5 0.5 C1 2.4 J1 35 Example 6 A6 2.5 S6 0.5 C1 2.4 J1 35 Example 7 A7 2.5 S7 0.5 C1 2.4 J1 35 Example 8 A8 2.5 S8 0.5 C1 2.4 J1 35 Example 9 A9 3.3 Example 10 A10 3.3 Example 11 A11 3.3 Example 12 A12 3.3 Example 13 A13 3.3 Example 14 A14 3.3 Example 15 A15 3.3 Example 16 A16 3.3 Example 17 A17 3.3 Example 18 A18 3.3 Example 19 A1 2.5 S1 0.5 C1 2.4 J1 35 Example 20 A2 2.5 S2 0.5 C1 2.4 J1 35 Example 21 A3 2.5 S3 0.5 C1 2.4 J1 35 Example 22 A4 2.5 S4 0.5 C1 2.4 J1 35 Example 23 A5 2.5 S5 0.5 C1 2.4 J1 35 Example 24 A6 2.5 S6 0.5 C1 2.4 J1 35 Example 25 A7 2.5 S7 0.5 C1 2.4 J1 35 Example 26 A8 2.5 S8 0.5 C1 2.4 J1 35 Example 27 A1 2.5 S1 0.5 C1 2.4 J1 35 Example 28 A2 2.5 S2 0.5 C1 2.4 J1 35 Example 29 A3 2.5 S3 0.5 C1 2.4 J1 35 Example 30 A4 2.5 S4 0.5 C1 2.4 J1 35 Example 31 A5 2.5 S5 0.5 C1 2.4 J1 35 Example 32 A6 2.5 S6 0.5 C1 2.4 J1 35 Example 33 A7 2.5 S7 0.5 C1 2.4 J1 35 Example 34 A8 2.5 S8 0.5 C1 2.4 J1 35 Example 35 A1 2.5 S1 0.5 C1 2.4 J1 35 Example 36 A2 2.5 S2 0.5 C1 2.4 J1 35 Example 37 A3 2.5 S3 0.5 C1 2.4 J1 35 Example 38 A4 2.5 S4 0.5 C1 2.4 J1 35 Example 39 A5 2.5 S5 0.5 C1 2.4 J1 35 Example 40 A6 2.5 S6 0.5 C1 2.4 J1 35 [Table 2] polymerizable monomer Photopolymerization initiator UV absorber Photopolymerization initiator IA Photopolymerization initiator IB type parts by mass type parts by mass type parts by mass type parts by mass type parts by mass Example 1 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 2 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 3 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 4 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 5 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 6 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 7 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 8 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 9 D3 2.4 I-A1 1.75 I-B1 0.86 Example 10 D3 2.4 I-A1 1.75 I-B1 0.86 Example 11 D3 2.4 I-A1 1.75 I-B1 0.86 Example 12 D3 2.4 I-A1 1.75 I-B1 0.86 Example 13 D3 2.4 I-A1 1.75 I-B1 0.86 Example 14 D3 2.4 I-A1 1.75 I-B1 0.86 Example 15 D3 2.4 I-A1 1.75 I-B1 0.86 Example 16 D3 2.4 I-A1 1.75 I-B1 0.86 Example 17 D3 2.4 I-A1 1.75 I-B1 0.86 Example 18 D3 2.4 I-A1 1.75 I-B1 0.86 Example 19 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U2 1.7 Example 20 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U2 1.7 Example 21 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U2 1.7 Example 22 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U2 1.7 Example 23 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U2 1.7 Example 24 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U2 1.7 Example 25 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U2 1.7 Example 26 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U2 1.7 Example 27 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 0.5 Example 28 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 0.5 Example 29 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 0.5 Example 30 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 0.5 Example 31 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 0.5 Example 32 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 0.5 Example 33 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 0.5 Example 34 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 0.5 Example 35 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 Example 36 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 Example 37 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 Example 38 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 Example 39 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 Example 40 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 [table 3] additive resin Surfactant polymerization inhibitor solvent type parts by mass type parts by mass type parts by mass type parts by mass type parts by mass Example 1 E1 0.21 P1 4.2 F1 0.02 G1 0.004 J1 44 Example 2 E1 0.21 P1 4.2 F1 0.02 G1 0.004 J1 44 Example 3 E1 0.21 P1 4.2 F1 0.02 G1 0.004 J1 44 Example 4 E1 0.21 P1 4.2 F1 0.02 G1 0.004 J1 44 Example 5 E1 0.21 P1 4.2 F1 0.02 G1 0.004 J1 44 Example 6 E1 0.21 P1 4.2 F1 0.02 G1 0.004 J1 44 Example 7 E1 0.21 P1 4.2 F1 0.02 G1 0.004 J1 44 Example 8 E1 0.21 P1 4.2 F1 0.02 G1 0.004 J1 44 Example 9 P1 12.5 F2 9.09 G1 0.001 J1 70 Example 10 P1 12.5 F2 9.09 G1 0.001 J1 70 Example 11 P1 12.5 F2 9.09 G1 0.001 J1 70 Example 12 P1 12.5 F2 9.09 G1 0.001 J1 70 Example 13 P1 15.2 F1 0.02 G1 0.001 J1 76 Example 14 P1 15.2 F1 0.02 G1 0.001 J1 76 Example 15 P1 15.2 F1 0.02 G1 0.001 J1 76 Example 16 P1 15.2 F1 0.02 G1 0.001 J1 76 Example 17 P1 15.2 F1 0.02 G1 0.001 J1 76 Example 18 P1 15.2 F1 0.02 G1 0.001 J1 76 Example 19 E1 0.21 P1 4.2 F1 0.02 G1 0.004 J1 44 Example 20 E1 0.21 P1 4.2 F1 0.02 G1 0.004 J1 44 Example 21 E1 0.21 P1 4.2 F1 0.02 G1 0.004 J1 44 Example 22 E1 0.21 P1 4.2 F1 0.02 G1 0.004 J1 44 Example 23 E1 0.21 P1 4.2 F1 0.02 G1 0.004 J1 44 Example 24 E1 0.21 P1 4.2 F1 0.02 G1 0.004 J1 44 Example 25 E1 0.21 P1 4.2 F1 0.02 G1 0.004 J1 44 Example 26 E1 0.21 P1 4.2 F1 0.02 G1 0.004 J1 44 Example 27 E1 0.21 P1 5.4 F1 0.02 G1 0.004 J1 44 Example 28 E1 0.21 P1 5.4 F1 0.02 G1 0.004 J1 44 Example 29 E1 0.21 P1 5.4 F1 0.02 G1 0.004 J1 44 Example 30 E1 0.21 P1 5.4 F1 0.02 G1 0.004 J1 44 Example 31 E1 0.21 P1 5.4 F1 0.02 G1 0.004 J1 44 Example 32 E1 0.21 P1 5.4 F1 0.02 G1 0.004 J1 44 Example 33 E1 0.21 P1 5.4 F1 0.02 G1 0.004 J1 44 Example 34 E1 0.21 P1 5.4 F1 0.02 G1 0.004 J1 44 Example 35 E1 0.21 P1 5.9 F1 0.02 G1 0.004 J1 44 Example 36 E1 0.21 P1 5.9 F1 0.02 G1 0.004 J1 44 Example 37 E1 0.21 P1 5.9 F1 0.02 G1 0.004 J1 44 Example 38 E1 0.21 P1 5.9 F1 0.02 G1 0.004 J1 44 Example 39 E1 0.21 P1 5.9 F1 0.02 G1 0.004 J1 44 Example 40 E1 0.21 P1 5.9 F1 0.02 G1 0.004 J1 44

[Table 4] Dispersions infrared absorber infrared absorber Dispersing aid Dispersant solvent type parts by mass type parts by mass type parts by mass type parts by mass type parts by mass Example 41 A7 2.5 S7 0.5 C1 2.4 J1 35 Example 42 A8 2.5 S8 0.5 C1 2.4 J1 35 Example 43 A1 2.5 S1 0.5 C1 2.4 J1 35 Example 44 A2 2.5 S2 0.5 C1 2.4 J1 35 Example 45 A3 2.5 S3 0.5 C1 2.4 J1 35 Example 46 A4 2.5 S4 0.5 C1 2.4 J1 35 Example 47 A5 2.5 S5 0.5 C1 2.4 J1 35 Example 48 A6 2.5 S6 0.5 C1 2.4 J1 35 Example 49 A7 2.5 S7 0.5 C1 2.4 J1 35 Example 50 A8 2.5 S8 0.5 C1 2.4 J1 35 Example 51 A1 2.5 S1 0.5 C1 2.4 J1 35 Example 52 A2 2.5 S2 0.5 C1 2.4 J1 35 Example 53 A3 2.5 S3 0.5 C1 2.4 J1 35 Example 54 A4 2.5 S4 0.5 C1 2.4 J1 35 Example 55 A5 2.5 S5 0.5 C1 2.4 J1 35 Example 56 A6 2.5 S6 0.5 C1 2.4 J1 35 Example 57 A7 2.5 S7 0.5 C1 2.4 J1 35 Example 58 A8 2.5 S8 0.5 C1 2.4 J1 35 Example 59 A1 2.5 S1 0.5 C1 2.4 J1 35 Example 60 A2 2.5 S2 0.5 C1 2.4 J1 35 Example 61 A3 2.5 S3 0.5 C1 2.4 J1 35 Example 62 A4 2.5 S4 0.5 C1 2.4 J1 35 Example 63 A5 2.5 S5 0.5 C1 2.4 J1 35 Example 64 A6 2.5 S6 0.5 C1 2.4 J1 35 Example 65 A7 2.5 S7 0.5 C1 2.4 J1 35 Example 66 A8 2.5 S8 0.5 C1 2.4 J1 35 Example 67 A1 2.5 S1 0.5 C1 2.4 J1 35 Example 68 A2 2.5 S2 0.5 C1 2.4 J1 35 Example 69 A3 2.5 S3 0.5 C1 2.4 J1 35 Example 70 A4 2.5 S4 0.5 C1 2.4 J1 35 Example 71 A5 2.5 S5 0.5 C1 2.4 J1 35 Example 72 A6 2.5 S6 0.5 C1 2.4 J1 35 Example 73 A7 2.5 S7 0.5 C1 2.4 J1 35 Example 74 A8 2.5 S8 0.5 C1 2.4 J1 35 Example 75 A1 2.5 S1 0.5 C1 2.4 J1 35 Example 76 A2 2.5 S2 0.5 C1 2.4 J1 35 Example 77 A3 2.5 S3 0.5 C1 2.4 J1 35 Example 78 A4 2.5 S4 0.5 C1 2.4 J1 35 Example 79 A5 2.5 S5 0.5 C1 2.4 J1 35 Example 80 A6 2.5 S6 0.5 C1 2.4 J1 35 [table 5] polymerizable monomer Photopolymerization initiator UV absorber Photopolymerization initiator IA Photopolymerization initiator IB type parts by mass type parts by mass type parts by mass type parts by mass type parts by mass Example 41 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 Example 42 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 Example 43 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 44 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 45 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 46 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 47 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 48 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 49 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 50 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 51 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 52 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 53 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 54 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 55 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 56 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 57 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 58 D1 4.3 D2 4.3 I-A1 0.61 I-B1 0.30 U1 1.7 Example 59 D1 4.3 D2 4.3 I-A2 0.61 I-B1 0.30 U1 1.7 Example 60 D1 4.3 D2 4.3 I-A2 0.61 I-B1 0.30 U1 1.7 Example 61 D1 4.3 D2 4.3 I-A2 0.61 I-B1 0.30 U1 1.7 Example 62 D1 4.3 D2 4.3 I-A2 0.61 I-B1 0.30 U1 1.7 Example 63 D1 4.3 D2 4.3 I-A2 0.61 I-B1 0.30 U1 1.7 Example 64 D1 4.3 D2 4.3 I-A2 0.61 I-B1 0.30 U1 1.7 Example 65 D1 4.3 D2 4.3 I-A2 0.61 I-B1 0.30 U1 1.7 Example 66 D1 4.3 D2 4.3 I-A2 0.61 I-B1 0.30 U1 1.7 Example 67 D1 4.3 D2 4.3 I-A1 0.61 I-B2 0.30 U1 1.7 Example 68 D1 4.3 D2 4.3 I-A1 0.61 I-B2 0.30 U1 1.7 Example 69 D1 4.3 D2 4.3 I-A1 0.61 I-B2 0.30 U1 1.7 Example 70 D1 4.3 D2 4.3 I-A1 0.61 I-B2 0.30 U1 1.7 Example 71 D1 4.3 D2 4.3 I-A1 0.61 I-B2 0.30 U1 1.7 Example 72 D1 4.3 D2 4.3 I-A1 0.61 I-B2 0.30 U1 1.7 Example 73 D1 4.3 D2 4.3 I-A1 0.61 I-B2 0.30 U1 1.7 Example 74 D1 4.3 D2 4.3 I-A1 0.61 I-B2 0.30 U1 1.7 Example 75 D1 4.3 D2 4.3 I-A1 0.46 I-B1 0.46 U1 1.7 Example 76 D1 4.3 D2 4.3 I-A1 0.46 I-B1 0.46 U1 1.7 Example 77 D1 4.3 D2 4.3 I-A1 0.46 I-B1 0.46 U1 1.7 Example 78 D1 4.3 D2 4.3 I-A1 0.46 I-B1 0.46 U1 1.7 Example 79 D1 4.3 D2 4.3 I-A1 0.46 I-B1 0.46 U1 1.7 Example 80 D1 4.3 D2 4.3 I-A1 0.46 I-B1 0.46 U1 1.7 [Table 6] additive resin Surfactant polymerization inhibitor solvent type parts by mass type parts by mass type parts by mass type parts by mass type parts by mass Example 41 E1 0.21 P1 5.9 F1 0.02 G1 0.004 J1 44 Example 42 E1 0.21 P1 5.9 F1 0.02 G1 0.004 J1 44 Example 43 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 44 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 45 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 46 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 47 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 48 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 49 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 50 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 51 E1 0.21 P3 4.2 F1 0.02 G1 0.004 J1 44 Example 52 E1 0.21 P3 4.2 F1 0.02 G1 0.004 J1 44 Example 53 E1 0.21 P3 4.2 F1 0.02 G1 0.004 J1 44 Example 54 E1 0.21 P3 4.2 F1 0.02 G1 0.004 J1 44 Example 55 E1 0.21 P3 4.2 F1 0.02 G1 0.004 J1 44 Example 56 E1 0.21 P3 4.2 F1 0.02 G1 0.004 J1 44 Example 57 E1 0.21 P3 4.2 F1 0.02 G1 0.004 J1 44 Example 58 E1 0.21 P3 4.2 F1 0.02 G1 0.004 J1 44 Example 59 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 60 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 61 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 62 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 63 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 64 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 65 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 66 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 67 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 68 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 69 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 70 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 71 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 72 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 73 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 74 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 75 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 76 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 77 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 78 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 79 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 80 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44

[Table 7] Dispersions infrared absorber infrared absorber Dispersing aid Dispersant solvent type parts by mass type parts by mass type parts by mass type parts by mass type parts by mass Example 81 A7 2.5 S7 0.5 C1 2.4 J1 35 Example 82 A8 2.5 S8 0.5 C1 2.4 J1 35 Example 83 A1 2.5 S1 0.5 C1 2.4 J1 35 Example 84 A2 2.5 S2 0.5 C1 2.4 J1 35 Example 85 A3 2.5 S3 0.5 C1 2.4 J1 35 Example 86 A4 2.5 S4 0.5 C1 2.4 J1 35 Example 87 A5 2.5 S5 0.5 C1 2.4 J1 35 Example 88 A6 2.5 S6 0.5 C1 2.4 J1 35 Example 89 A7 2.5 S7 0.5 C1 2.4 J1 35 Example 90 A8 2.5 S8 0.5 C1 2.4 J1 35 Example 91 A1 3.3 S1 0.7 C2 3.2 J1 45 Example 92 A2 3.3 S2 0.7 C2 3.2 J1 45 Example 93 A3 3.3 S3 0.7 C2 3.2 J1 45 Example 94 A4 3.3 S4 0.7 C2 3.2 J1 45 Example 95 A5 3.3 S5 0.7 C2 3.2 J1 45 Example 96 A6 3.3 S6 0.7 C2 3.2 J1 45 Example 97 A7 3.3 S7 0.7 C2 3.2 J1 45 Example 98 A8 3.3 S8 0.7 C2 3.2 J1 45 Example 99 A1 3.3 S1 0.7 C2 4.4 J1 45 Example 100 A2 3.3 S2 0.7 C2 4.4 J1 45 Example 101 A3 3.3 S3 0.7 C2 4.4 J1 45 Example 102 A4 3.3 S4 0.7 C2 4.4 J1 45 Example 103 A5 3.3 S5 0.7 C2 4.4 J1 45 Example 104 A6 3.3 S6 0.7 C2 4.4 J1 45 Example 105 A7 3.3 S7 0.7 C2 4.4 J1 45 Example 106 A8 3.3 S8 0.7 C2 4.4 J1 45 Example 107 A1 3.3 S1 0.7 C2 4.4 J1 45 Example 108 A2 3.3 S2 0.7 C2 4.4 J1 45 Example 109 A3 3.3 S3 0.7 C2 4.4 J1 45 Example 110 A4 3.3 S4 0.7 C2 4.4 J1 45 Example 111 A5 3.3 S5 0.7 C2 4.4 J1 45 Example 112 A6 3.3 S6 0.7 C2 4.4 J1 45 Example 113 A7 3.3 S7 0.7 C2 4.4 J1 45 Example 114 A8 3.3 S8 0.7 C2 4.4 J1 45 Example 115 A1 3.2 S1 0.7 C2 4.4 J1 45 Example 116 A2 3.2 S2 0.7 C2 4.4 J1 45 Example 117 A3 3.2 S9 0.7 C2 4.4 J1 45 Example 118 A4 3.2 S4 0.7 C2 4.4 J1 45 Example 119 A5 3.2 S5 0.7 C2 4.4 J1 45 Example 120 A6 3.2 S6 0.7 C2 4.4 J1 45 [Table 8] polymerizable monomer Photopolymerization initiator UV absorber Photopolymerization initiator IA Photopolymerization initiator IB type parts by mass type parts by mass type parts by mass type parts by mass type parts by mass Example 81 D1 4.3 D2 4.3 I-A1 0.46 I-B1 0.46 U1 1.7 Example 82 D1 4.3 D2 4.3 I-A1 0.46 I-B1 0.46 U1 1.7 Example 83 D1 4.3 D2 4.3 I-A1 0.45 I-B1 0.22 U1 1.7 Example 84 D1 4.3 D2 4.3 I-A1 0.45 I-B1 0.22 U1 1.7 Example 85 D1 4.3 D2 4.3 I-A1 0.45 I-B1 0.22 U1 1.7 Example 86 D1 4.3 D2 4.3 I-A1 0.45 I-B1 0.22 U1 1.7 Example 87 D1 4.3 D2 4.3 I-A1 0.45 I-B1 0.22 U1 1.7 Example 88 D1 4.3 D2 4.3 I-A1 0.45 I-B1 0.22 U1 1.7 Example 89 D1 4.3 D2 4.3 I-A1 0.45 I-B1 0.22 U1 1.7 Example 90 D1 4.3 D2 4.3 I-A1 0.45 I-B1 0.22 U1 1.7 Example 91 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 92 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 93 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 94 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 95 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 96 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 97 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 98 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 99 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 100 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 101 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 102 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 103 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 104 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 105 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 106 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 107 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 108 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 109 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 110 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 111 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 112 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 113 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 114 D1 2.9 D2 2.9 I-A1 0.41 I-B1 0.20 U1 1.3 Example 115 D1 2.3 D2 2.3 I-A2 1.05 I-B1 0.12 U1 1.5 Example 116 D1 2.3 D2 2.3 I-A2 1.05 I-B1 0.12 U1 1.5 Example 117 D1 2.3 D2 2.3 I-A2 1.05 I-B1 0.12 U1 1.5 Example 118 D1 2.3 D2 2.3 I-A2 1.05 I-B1 0.12 U1 1.5 Example 119 D1 2.3 D2 2.3 I-A2 1.05 I-B1 0.12 U1 1.5 Example 120 D1 2.3 D2 2.3 I-A2 1.05 I-B1 0.12 U1 1.5 [Table 9] additive resin Surfactant polymerization inhibitor solvent type parts by mass type parts by mass type parts by mass type parts by mass type parts by mass Example 81 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 82 E1 0.21 P2 4.2 F1 0.02 G1 0.004 J1 44 Example 83 E1 0.21 P2 4.5 F1 0.02 G1 0.004 J1 44 Example 84 E1 0.21 P2 4.5 F1 0.02 G1 0.004 J1 44 Example 85 E1 0.21 P2 4.5 F1 0.02 G1 0.004 J1 44 Example 86 E1 0.21 P2 4.5 F1 0.02 G1 0.004 J1 44 Example 87 E1 0.21 P2 4.5 F1 0.02 G1 0.004 J1 44 Example 88 E1 0.21 P2 4.5 F1 0.02 G1 0.004 J1 44 Example 89 E1 0.21 P2 4.5 F1 0.02 G1 0.004 J1 44 Example 90 E1 0.21 P2 4.5 F1 0.02 G1 0.004 J1 44 Example 91 E1 0.16 P1 1.3 F1 0.02 G1 0.004 J1 38 Example 92 E1 0.16 P1 1.3 F1 0.02 G1 0.004 J1 38 Example 93 E1 0.16 P1 1.3 F1 0.02 G1 0.004 J1 38 Example 94 E1 0.16 P1 1.3 F1 0.02 G1 0.004 J1 38 Example 95 E1 0.16 P1 1.3 F1 0.02 G1 0.004 J1 38 Example 96 E1 0.16 P1 1.3 F1 0.02 G1 0.004 J1 38 Example 97 E1 0.16 P1 1.3 F1 0.02 G1 0.004 J1 38 Example 98 E1 0.16 P1 1.3 F1 0.02 G1 0.004 J1 38 Example 99 E1 0.16 P1 0.4 F1 0.02 G1 0.004 J1 38 Example 100 E1 0.16 P1 0.4 F1 0.02 G1 0.004 J1 38 Example 101 E1 0.16 P1 0.4 F1 0.02 G1 0.004 J1 38 Example 102 E1 0.16 P1 0.4 F1 0.02 G1 0.004 J1 38 Example 103 E1 0.16 P1 0.4 F1 0.02 G1 0.004 J1 38 Example 104 E1 0.16 P1 0.4 F1 0.02 G1 0.004 J1 38 Example 105 E1 0.16 P1 0.4 F1 0.02 G1 0.004 J1 38 Example 106 E1 0.16 P1 0.4 F1 0.02 G1 0.004 J1 38 Example 107 E1 0.16 P4 0.4 F1 0.02 G1 0.004 J1 38 Example 108 E1 0.16 P4 0.4 F1 0.02 G1 0.004 J1 38 Example 109 E1 0.16 P4 0.4 F1 0.02 G1 0.004 J1 38 Example 110 E1 0.16 P4 0.4 F1 0.02 G1 0.004 J1 38 Example 111 E1 0.16 P4 0.4 F1 0.02 G1 0.004 J1 38 Example 112 E1 0.16 P4 0.4 F1 0.02 G1 0.004 J1 38 Example 113 E1 0.16 P4 0.4 F1 0.02 G1 0.004 J1 38 Example 114 E1 0.16 P4 0.4 F1 0.02 G1 0.004 J1 38 Example 115 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38 Example 116 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38 Example 117 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38 Example 118 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38 Example 119 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38 Example 120 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38

[Table 10] Dispersions infrared absorber infrared absorber Dispersing aid Dispersant solvent type parts by mass type parts by mass type parts by mass type parts by mass type parts by mass Example 121 A7 3.2 S7 0.7 C2 4.4 J1 45 Example 122 A8 3.2 S8 0.7 C2 4.4 J1 45 Example 123 A1 3.2 S1 0.7 C2 4.4 J1 45 Example 124 A2 3.2 S2 0.7 C2 4.4 J1 45 Example 125 A3 3.2 S9 0.7 C2 4.4 J1 45 Example 126 A4 3.2 S4 0.7 C2 4.4 J1 45 Example 127 A5 3.2 S5 0.7 C2 4.4 J1 45 Example 128 A6 3.2 S6 0.7 C2 4.4 J1 45 Example 129 A7 3.2 S7 0.7 C2 4.4 J1 45 Example 130 A8 3.2 S8 0.7 C2 4.4 J1 45 Example 131 A1 3.2 S1 0.7 C2 4.4 J1 45 Example 132 A2 3.2 S2 0.7 C2 4.4 J1 45 Example 133 A3 3.2 S9 0.7 C2 4.4 J1 45 Example 134 A4 3.2 S4 0.7 C2 4.4 J1 45 Example 135 A5 3.2 S5 0.7 C2 4.4 J1 45 Example 136 A6 3.2 S6 0.7 C2 4.4 J1 45 Example 137 A7 3.2 S7 0.7 C2 4.4 J1 45 Example 138 A8 3.2 S8 0.7 C2 4.4 J1 45 Example 139 A1 3.5 S1 0.7 C2 4.6 J1 45 Example 140 A2 3.5 S2 0.7 C2 4.4 J1 45 Example 141 A3 3.5 S9 0.7 C2 4.4 J1 45 Example 142 A4 3.5 S4 0.7 C2 4.4 J1 45 Example 143 A5 3.5 S5 0.7 C2 4.4 J1 45 Example 144 A6 3.5 S6 0.7 C2 4.4 J1 45 Example 145 A7 3.5 S7 0.7 C2 4.4 J1 45 Example 146 A8 3.5 S8 0.7 C2 4.4 J1 45 Example 147 A1 3.5 S1 0.7 C2 4.6 J1 45 Example 148 A2 3.5 S2 0.7 C2 4.4 J1 45 Example 149 A3 3.5 S9 0.7 C2 4.4 J1 45 Example 150 A4 3.5 S4 0.7 C2 4.4 J1 45 Example 151 A5 3.5 S5 0.7 C2 4.4 J1 45 Example 152 A6 3.5 S6 0.7 C2 4.4 J1 45 Example 153 A7 3.5 S7 0.7 C2 4.4 J1 45 Example 154 A8 3.5 S8 0.7 C2 4.4 J1 45 Example 155 A1 3.5 S1 0.7 C2 4.6 J1 45 Example 156 A2 3.5 S2 0.7 C2 4.4 J1 45 Example 157 A3 3.5 S9 0.7 C2 4.4 J1 45 Example 158 A4 3.5 S4 0.7 C2 4.4 J1 45 Example 159 A5 3.5 S5 0.7 C2 4.4 J1 45 Example 160 A6 3.5 S6 0.7 C2 4.4 J1 45 Example 161 A7 3.5 S7 0.7 C2 4.4 J1 45 Example 162 A8 3.5 S8 0.7 C2 4.4 J1 45 Comparative example 1 A13 3.0 Comparative example 2 A14 3.0 [Table 11] polymerizable monomer Photopolymerization initiator UV absorber Photopolymerization initiator IA Photopolymerization initiator IB type parts by mass type parts by mass type parts by mass type parts by mass type parts by mass Example 121 D1 2.3 D2 2.3 I-A2 1.05 I-B1 0.12 U1 1.5 Example 122 D1 2.3 D2 2.3 I-A2 1.05 I-B1 0.12 U1 1.5 Example 123 D1 2.2 D2 2.2 I-A2 1.18 I-B1 0.13 U1 1.5 Example 124 D1 2.2 D2 2.2 I-A2 1.18 I-B1 0.13 U1 1.5 Example 125 D1 2.2 D2 2.2 I-A2 1.18 I-B1 0.13 U1 1.5 Example 126 D1 2.2 D2 2.2 I-A2 1.18 I-B1 0.13 U1 1.5 Example 127 D1 2.2 D2 2.2 I-A2 1.18 I-B1 0.13 U1 1.5 Example 128 D1 2.2 D2 2.2 I-A2 1.18 I-B1 0.13 U1 1.5 Example 129 D1 2.2 D2 2.2 I-A2 1.18 I-B1 0.13 U1 1.5 Example 130 D1 2.2 D2 2.2 I-A2 1.18 I-B1 0.13 U1 1.5 Example 131 D1 2.2 D2 2.2 I-A2 1.30 I-B1 0.14 U1 1.5 Example 132 D1 2.2 D2 2.2 I-A2 1.30 I-B1 0.14 U1 1.5 Example 133 D1 2.2 D2 2.2 I-A2 1.30 I-B1 0.14 U1 1.5 Example 134 D1 2.2 D2 2.2 I-A2 1.30 I-B1 0.14 U1 1.5 Example 135 D1 2.2 D2 2.2 I-A2 1.30 I-B1 0.14 U1 1.5 Example 136 D1 2.2 D2 2.2 I-A2 1.30 I-B1 0.14 U1 1.5 Example 137 D1 2.2 D2 2.2 I-A2 1.30 I-B1 0.14 U1 1.5 Example 138 D1 2.2 D2 2.2 I-A2 1.30 I-B1 0.14 U1 1.5 Example 139 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Example 140 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Example 141 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Example 142 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Example 143 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Example 144 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Example 145 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Example 146 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Example 147 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Example 148 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Example 149 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Example 150 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Example 151 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Example 152 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Example 153 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Example 154 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Example 155 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Example 156 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Example 157 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Example 158 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Example 159 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Example 160 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Example 161 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Example 162 D1 2.6 D2 2.6 I-A2 0.88 I-B1 0.14 U1 1.6 Comparative example 1 D1 4.3 D2 4.3 I-A1 0.91 C1 1.7 Comparative example 2 D1 4.3 D2 4.3 I-B1 0.91 C1 1.7 [Table 12] additive resin Surfactant polymerization inhibitor solvent type parts by mass type parts by mass type parts by mass type parts by mass type parts by mass Example 121 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38 Example 122 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38 Example 123 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38 Example 124 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38 Example 125 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38 Example 126 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38 Example 127 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38 Example 128 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38 Example 129 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38 Example 130 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38 Example 131 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38 Example 132 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38 Example 133 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38 Example 134 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38 Example 135 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38 Example 136 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38 Example 137 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38 Example 138 E1 0.16 P4 0.5 F1 0.02 G1 0.002 J1 38 Example 139 E1 0.17 P5 0.6 F1 0.02 G1 0.002 J1 37 Example 140 E1 0.17 P5 0.6 F1 0.02 G1 0.002 J1 37 Example 141 E1 0.17 P5 0.6 F1 0.02 G1 0.002 J1 37 Example 142 E1 0.17 P5 0.6 F1 0.02 G1 0.002 J1 37 Example 143 E1 0.17 P5 0.6 F1 0.02 G1 0.002 J1 37 Example 144 E1 0.17 P5 0.6 F1 0.02 G1 0.002 J1 37 Example 145 E1 0.17 P5 0.6 F1 0.02 G1 0.002 J1 37 Example 146 E1 0.17 P5 0.6 F1 0.02 G1 0.002 J1 37 Example 147 E1 0.17 P6 0.6 F1 0.02 G1 0.002 J1 37 Example 148 E1 0.17 P6 0.6 F1 0.02 G1 0.002 J1 37 Example 149 E1 0.17 P6 0.6 F1 0.02 G1 0.002 J1 37 Example 150 E1 0.17 P6 0.6 F1 0.02 G1 0.002 J1 37 Example 151 E1 0.17 P6 0.6 F1 0.02 G1 0.002 J1 37 Example 152 E1 0.17 P6 0.6 F1 0.02 G1 0.002 J1 37 Example 153 E1 0.17 P6 0.6 F1 0.02 G1 0.002 J1 37 Example 154 E1 0.17 P6 0.6 F1 0.02 G1 0.002 J1 37 Example 155 E1 0.17 P7 0.6 F1 0.02 G1 0.002 J1 37 Example 156 E1 0.17 P7 0.6 F1 0.02 G1 0.002 J1 37 Example 157 E1 0.17 P7 0.6 F1 0.02 G1 0.002 J1 37 Example 158 E1 0.17 P7 0.6 F1 0.02 G1 0.002 J1 37 Example 159 E1 0.17 P7 0.6 F1 0.02 G1 0.002 J1 37 Example 160 E1 0.17 P7 0.6 F1 0.02 G1 0.002 J1 37 Example 161 E1 0.17 P7 0.6 F1 0.02 G1 0.002 J1 37 Example 162 E1 0.17 P7 0.6 F1 0.02 G1 0.002 J1 37 Comparative example 1 E1 0.21 P1 6.6 F1 0.02 G1 0.004 J1 79 Comparative example 2 E1 0.21 P1 6.6 F1 0.02 G1 0.004 J1 79

The details of the materials described in the above table are as follows.

[化學式21]

[化學式22]

A16：FDR-003（YAMADA CHEMICAL CO.,LTD.） A17：FDR-004（YAMADA CHEMICAL CO.,LTD.） A18：FDR-005（YAMADA CHEMICAL CO.,LTD.） (Infrared Absorber) A1 to A15: Compounds of the following structure [Chemical Formula 20]

[chemical formula 21]

[chemical formula 22]

A16: FDR-003 (YAMADA CHEMICAL CO.,LTD.) A17: FDR-004 (YAMADA CHEMICAL CO.,LTD.) A18: FDR-005 (YAMADA CHEMICAL CO.,LTD.)

[化學式24]

[化學式25]

(Dispersion aid) S1 to S9: Compounds of the following structure [Chemical formula 23]

[chemical formula 24]

[chemical formula 25]

C2：下述結構的樹脂（附註於主鏈之數值為莫耳比，附註於側鏈之數值為重複單元的數量。重量平均分子量10000） [化學式27]

C3：DSIPERBYK-140（BYK Chemie公司製） C4：DSIPERBYK-2026（BYK Chemie公司製） (Dispersant) C1: Resin with the following structure (the value attached to the main chain is the molar ratio, and the value attached to the side chain is the number of repeating units. The weight average molecular weight is 20000) [Chemical formula 26]

C2: Resin with the following structure (the value attached to the main chain is the molar ratio, and the value attached to the side chain is the number of repeating units. The weight average molecular weight is 10000) [Chemical formula 27]

C3: DSIPERBYK-140 (manufactured by BYK Chemie) C4: DSIPERBYK-2026 (manufactured by BYK Chemie)

(solvent) J1: Propylene Glycol Monomethyl Ether Acetate (PGMEA)

(polymerizable monomer) D1: ARONIX M-305 (manufactured by TOAGOSEI CO.,LTD.) D2: NK ESTER A-TMMT (manufactured by Shin-Nakamura Chemical Co., Ltd.) D3: KAYARAD DPHA (manufactured by Nippon Kayaku Co., Ltd.))

[光聚合起始劑IB] I-B1：下述結構的化合物（羥烷基苯酮化合物、甲醇中的波長365nm的吸光係數為48.9mL/g･cm且波長254nm的吸光係數為3.0×10 ⁴mL/g･cm） I-B2：下述結構的化合物（羥烷基苯酮化合物、甲醇中的波長365nm的吸光係數為48.9mL/g･cm且波長254nm的吸光係數為5.0×10 ⁴mL/g･cm） [化學式29]

(Photopolymerization initiator) [Photopolymerization initiator IA] I-A1: Compound with the following structure (an oxime compound, the absorption coefficient at a wavelength of 365 nm in methanol is 7.0×10 ³ mL/g･cm) I-A2 : A compound of the following structure (an oxime compound and methanol have an absorption coefficient of 7.7×10 ³ mL/g･cm at a wavelength of 365 nm) [Chemical Formula 28]

[Photopolymerization initiator IB] I-B1: Compound of the following structure (hydroxyalkyl phenone compound, the absorption coefficient at a wavelength of 365 nm in methanol is 48.9 mL/g･cm and the absorption coefficient at a wavelength of 254 nm is 3.0×10 ⁴ mL/g･cm) I-B2: Compounds with the following structure (hydroxyalkyl phenone compound, the absorption coefficient at 365 nm in methanol is 48.9 mL/g･cm and the absorption coefficient at 254 nm is 5.0×10 ⁴ mL/g･cm) [Chemical Formula 29]

U2：下述結構的化合物（共軛二烯化合物） [化學式31]

(ultraviolet absorber) U1: avobenzone (compound of the following structure, dibenzoyl compound) [chemical formula 30]

U2: A compound of the following structure (conjugated diene compound) [Chemical formula 31]

(additive) E1: ADK STAB AO-80 (manufactured by ADEKA Corporation, antioxidant)

[化學式33]

(Resin) P1: Resin with the following structure (the value attached to the main chain is the molar ratio. The weight average molecular weight is 30000) P2: The resin with the following structure (the value attached to the main chain is the molar ratio. The weight average molecular weight is 30000) ) P3: Resin with the following structure (the value attached to the main chain is the molar ratio. The weight average molecular weight is 10,000) P4: Resin with the following structure (the weight average molecular weight is 20,000) P5: Resin with the following structure (annotated to the main chain The value is the molar ratio. The weight average molecular weight is 15000) P6: Resin with the following structure (the value attached to the main chain is the molar ratio. The weight average molecular weight is 15000) P7: The resin with the following structure (the value attached to the main chain is the molar ratio. The weight average molecular weight is 15000) [chemical formula 32]

[chemical formula 33]

F2：MEGAFACE RS-72-K（DIC CORPORATION製、固體成分濃度30%丙二醇單甲醚乙酸酯溶液、氟系界面活性劑） (Surfactant) F1: A compound of the following structure (polysiloxane-based surfactant) [Chemical formula 34]

F2: MEGAFACE RS-72-K (manufactured by DIC CORPORATION, 30% solid content concentration propylene glycol monomethyl ether acetate solution, fluorine-based surfactant)

(polymerization inhibitor) G1: p-methoxyphenol

For each curable composition, the value of the total content of photopolymerization initiator IA and photopolymerization initiator IB in the total solid content of the curable composition is described in the column of "content of photopolymerization initiator" , the value of the content of the photopolymerization initiator IB relative to 100 parts by mass of the photopolymerization initiator IA is described in the column of "content of the photopolymerization initiator IB", and the total solid content of the curable composition is The value of the content of the infrared absorber is described in the column of "content of the infrared absorber", and the value of the content of the polymerizable monomer in the total solid content of the curable composition is described in the column of "content of the polymerizable monomer". In the column of ", the value of the content of resin relative to 100 parts by mass of the polymerizable monomer is described in the column of "content of resin", and the value of the content of the ultraviolet absorber relative to 100 parts by mass of the photopolymerization initiator IA The value of the content of is described in the column of "the content of an ultraviolet absorber".

[Table 13] Content of photopolymerization initiator Content of photopolymerization initiator IB Content of infrared absorber Content of polymerizable monomer resin content Content of UV absorber quality% parts by mass quality% parts by mass parts by mass parts by mass Example 1 4.4 49.3 11.9 40.8 31.4 272.4 Example 2 4.4 49.3 11.9 40.8 31.4 272.4 Example 3 4.4 49.3 11.9 40.8 31.4 272.4 Example 4 4.4 49.3 11.9 40.8 31.4 272.4 Example 5 4.4 49.3 11.9 40.8 31.4 272.4 Example 6 4.4 49.3 11.9 40.8 31.4 272.4 Example 7 4.4 49.3 11.9 40.8 31.4 272.4 Example 8 4.4 49.3 11.9 40.8 31.4 272.4 Example 9 8.7 49.3 11.0 8.0 53.2 0.0 Example 10 8.7 49.3 11.0 8.0 53.2 0.0 Example 11 8.7 49.3 11.0 8.0 53.2 0.0 Example 12 8.7 49.3 11.0 8.0 53.2 0.0 Example 13 10.9 49.3 13.7 9.9 63.4 0.0 Example 14 10.9 49.3 13.7 9.9 63.4 0.0 Example 15 10.9 49.3 13.7 9.9 63.4 0.0 Example 16 10.9 49.3 13.7 9.9 63.4 0.0 Example 17 10.9 49.3 13.7 9.9 63.4 0.0 Example 18 10.9 49.3 13.7 9.9 63.4 0.0 Example 19 4.4 49.3 11.9 40.8 31.5 272.4 Example 20 4.4 49.3 11.9 40.8 31.5 272.4 Example 21 4.4 49.3 11.9 40.8 31.5 272.4 Example 22 4.4 49.3 11.9 40.8 31.5 272.4 Example 23 4.4 49.3 11.9 40.8 31.5 272.4 Example 24 4.4 49.3 11.9 40.8 31.5 272.4 Example 25 4.4 49.3 11.9 40.8 31.5 272.4 Example 26 4.4 49.3 11.9 40.8 31.5 272.4 Example 27 4.4 49.3 11.9 40.8 37.2 81.6 Example 28 4.4 49.3 11.9 40.8 37.2 81.6 Example 29 4.4 49.3 11.9 40.8 37.2 81.6 Example 30 4.4 49.3 11.9 40.8 37.2 81.6 Example 31 4.4 49.3 11.9 40.8 37.2 81.6 Example 32 4.4 49.3 11.9 40.8 37.2 81.6 Example 33 4.4 49.3 11.9 40.8 37.2 81.6 Example 34 4.4 49.3 11.9 40.8 37.2 81.6 Example 35 4.4 49.3 11.9 40.8 39.6 0.0 Example 36 4.4 49.3 11.9 40.8 39.6 0.0 Example 37 4.4 49.3 11.9 40.8 39.6 0.0 Example 38 4.4 49.3 11.9 40.8 39.6 0.0 Example 39 4.4 49.3 11.9 40.8 39.6 0.0 Example 40 4.4 49.3 11.9 40.8 39.6 0.0 [Table 14] Content of photopolymerization initiator Content of photopolymerization initiator IB Content of infrared absorber Content of polymerizable monomer resin content Content of UV absorber quality% parts by mass quality% parts by mass parts by mass parts by mass Example 41 4.4 49.3 11.9 40.8 39.6 0.0 Example 42 4.4 49.3 11.9 40.8 39.6 0.0 Example 43 4.4 49.3 11.9 40.8 31.4 272.4 Example 44 4.4 49.3 11.9 40.8 31.4 272.4 Example 45 4.4 49.3 11.9 40.8 31.4 272.4 Example 46 4.4 49.3 11.9 40.8 31.4 272.4 Example 47 4.4 49.3 11.9 40.8 31.4 272.4 Example 48 4.4 49.3 11.9 40.8 31.4 272.4 Example 49 4.4 49.3 11.9 40.8 31.4 272.4 Example 50 4.4 49.3 11.9 40.8 31.4 272.4 Example 51 4.4 49.3 11.9 40.8 31.4 272.4 Example 52 4.4 49.3 11.9 40.8 31.4 272.4 Example 53 4.4 49.3 11.9 40.8 31.4 272.4 Example 54 4.4 49.3 11.9 40.8 31.4 272.4 Example 55 4.4 49.3 11.9 40.8 31.4 272.4 Example 56 4.4 49.3 11.9 40.8 31.4 272.4 Example 57 4.4 49.3 11.9 40.8 31.4 272.4 Example 58 4.4 49.3 11.9 40.8 31.4 272.4 Example 59 4.4 49.3 11.9 40.8 31.4 272.4 Example 60 4.4 49.3 11.9 40.8 31.4 272.4 Example 61 4.4 49.3 11.9 40.8 31.4 272.4 Example 62 4.4 49.3 11.9 40.8 31.4 272.4 Example 63 4.4 49.3 11.9 40.8 31.4 272.4 Example 64 4.4 49.3 11.9 40.8 31.4 272.4 Example 65 4.4 49.3 11.9 40.8 31.4 272.4 Example 66 4.4 49.3 11.9 40.8 31.4 272.4 Example 67 4.4 49.3 11.9 40.8 31.4 272.4 Example 68 4.4 49.3 11.9 40.8 31.4 272.4 Example 69 4.4 49.3 11.9 40.8 31.4 272.4 Example 70 4.4 49.3 11.9 40.8 31.4 272.4 Example 71 4.4 49.3 11.9 40.8 31.4 272.4 Example 72 4.4 49.3 11.9 40.8 31.4 272.4 Example 73 4.4 49.3 11.9 40.8 31.4 272.4 Example 74 4.4 49.3 11.9 40.8 31.4 272.4 Example 75 4.3 100.0 11.9 40.8 31.4 367.0 Example 76 4.3 100.0 11.9 40.8 31.4 367.0 Example 77 4.3 100.0 11.9 40.8 31.4 367.0 Example 78 4.3 100.0 11.9 40.8 31.4 367.0 Example 79 4.3 100.0 11.9 40.8 31.4 367.0 Example 80 4.3 100.0 11.9 40.8 31.4 367.0 [Table 15] Content of photopolymerization initiator Content of photopolymerization initiator IB Content of infrared absorber Content of polymerizable monomer resin content Content of UV absorber quality% parts by mass quality% parts by mass parts by mass parts by mass Example 81 4.3 100.0 11.9 40.8 31.4 367.0 Example 82 4.3 100.0 11.9 40.8 31.4 367.0 Example 83 3.2 50.0 11.9 40.8 32.9 374.4 Example 84 3.2 50.0 11.9 40.8 32.9 374.4 Example 85 3.2 50.0 11.9 40.8 32.9 374.4 Example 86 3.2 50.0 11.9 40.8 32.9 374.4 Example 87 3.2 50.0 11.9 40.8 32.9 374.4 Example 88 3.2 50.0 11.9 40.8 32.9 374.4 Example 89 3.2 50.0 11.9 40.8 32.9 374.4 Example 90 3.2 50.0 11.9 40.8 32.9 374.4 Example 91 3.7 49.1 20.0 34.5 26.7 313.0 Example 92 3.7 49.1 20.0 34.5 26.7 313.0 Example 93 3.7 49.1 20.0 34.5 26.7 313.0 Example 94 3.7 49.1 20.0 34.5 26.7 313.0 Example 95 3.7 49.1 20.0 34.5 26.7 313.0 Example 96 3.7 49.1 20.0 34.5 26.7 313.0 Example 97 3.7 49.1 20.0 34.5 26.7 313.0 Example 98 3.7 49.1 20.0 34.5 26.7 313.0 Example 99 3.7 49.1 20.0 34.5 28.8 313.0 Example 100 3.7 49.1 20.0 34.5 28.8 313.0 Example 101 3.7 49.1 20.0 34.5 28.8 313.0 Example 102 3.7 49.1 20.0 34.5 28.8 313.0 Example 103 3.7 49.1 20.0 34.5 28.8 313.0 Example 104 3.7 49.1 20.0 34.5 28.8 313.0 Example 105 3.7 49.1 20.0 34.5 28.8 313.0 Example 106 3.7 49.1 20.0 34.5 28.8 313.0 Example 107 3.7 49.1 20.0 34.5 28.8 313.0 Example 108 3.7 49.1 20.0 34.5 28.8 313.0 Example 109 3.7 49.1 20.0 34.5 28.8 313.0 Example 110 3.7 49.1 20.0 34.5 28.8 313.0 Example 111 3.7 49.1 20.0 34.5 28.8 313.0 Example 112 3.7 49.1 20.0 34.5 28.8 313.0 Example 113 3.7 49.1 20.0 34.5 28.8 313.0 Example 114 3.7 49.1 20.0 34.5 28.8 313.0 Example 115 7.1 11.4 19.6 28.0 29.4 139.0 Example 116 7.1 11.4 19.6 28.0 29.4 139.0 Example 117 7.1 11.4 19.6 28.0 29.4 139.0 Example 118 7.1 11.4 19.6 28.0 29.4 139.0 Example 119 7.1 11.4 19.6 28.0 29.4 139.0 Example 120 7.1 11.4 19.6 28.0 29.4 139.0

[Table 16] Content of photopolymerization initiator Content of photopolymerization initiator IB Content of infrared absorber Content of polymerizable monomer resin content Content of UV absorber quality% parts by mass quality% parts by mass parts by mass parts by mass Example 121 7.1 11.4 19.6 28.0 29.4 139.0 Example 122 7.1 11.4 19.6 28.0 29.4 139.0 Example 123 7.9 11.0 19.6 27.0 29.4 123.7 Example 124 7.9 11.0 19.6 27.0 29.4 123.7 Example 125 7.9 11.0 19.6 27.0 29.4 123.7 Example 126 7.9 11.0 19.6 27.0 29.4 123.7 Example 127 7.9 11.0 19.6 27.0 29.4 123.7 Example 128 7.9 11.0 19.6 27.0 29.4 123.7 Example 129 7.9 11.0 19.6 27.0 29.4 123.7 Example 130 7.9 11.0 19.6 27.0 29.4 123.7 Example 131 8.7 10.8 19.6 27.0 29.4 112.3 Example 132 8.7 10.8 19.6 27.0 29.4 112.3 Example 133 8.7 10.8 19.6 27.0 29.4 112.3 Example 134 8.7 10.8 19.6 27.0 29.4 112.3 Example 135 8.7 10.8 19.6 27.0 29.4 112.3 Example 136 8.7 10.8 19.6 27.0 29.4 112.3 Example 137 8.7 10.8 19.6 27.0 29.4 112.3 Example 138 8.7 10.8 19.6 27.0 29.4 112.3 Example 139 5.8 15.9 19.9 29.5 29.5 181.8 Example 140 5.8 15.9 19.9 29.5 28.2 181.8 Example 141 5.8 15.9 19.9 29.5 28.2 181.8 Example 142 5.8 15.9 19.9 29.5 28.2 181.8 Example 143 5.8 15.9 19.9 29.5 28.2 181.8 Example 144 5.8 15.9 19.9 29.5 28.2 181.8 Example 145 5.8 15.9 19.9 29.5 28.2 181.8 Example 146 5.8 15.9 19.9 29.5 28.2 181.8 Example 147 5.8 15.9 19.9 29.5 29.5 181.8 Example 148 5.8 15.9 19.9 29.5 28.2 181.8 Example 149 5.8 15.9 19.9 29.5 28.2 181.8 Example 150 5.8 15.9 19.9 29.5 28.2 181.8 Example 151 5.8 15.9 19.9 29.5 28.2 181.8 Example 152 5.8 15.9 19.9 29.5 28.2 181.8 Example 153 5.8 15.9 19.9 29.5 28.2 181.8 Example 154 5.8 15.9 19.9 29.5 28.2 181.8 Example 155 5.8 15.9 19.9 29.5 29.5 181.8 Example 156 5.8 15.9 19.9 29.5 28.2 181.8 Example 157 5.8 15.9 19.9 29.5 28.2 181.8 Example 158 5.8 15.9 19.9 29.5 28.2 181.8 Example 159 5.8 15.9 19.9 29.5 28.2 181.8 Example 160 5.8 15.9 19.9 29.5 28.2 181.8 Example 161 5.8 15.9 19.9 29.5 28.2 181.8 Example 162 5.8 15.9 19.9 29.5 28.2 181.8 Comparative example 1 4.3 0.0 14.3 40.8 31.4 183.5 Comparative example 2 4.3 - 14.3 40.8 31.4 - <Evaluation of Spectral Characteristics> Each curable composition was applied to a glass substrate using a spin coater to form a coating film. Then, heat treatment (pre-baking) was performed for 120 seconds using a 100° C. hot plate so that the dry film thickness of the coating film would be 1.0 μm. Next, using an i-ray stepper exposure device FPA-i5+ (manufactured by Canon Inc.), the coating film was irradiated with light having a wavelength of 365 nm at an exposure dose of 1000 mJ/cm ² , and the first exposure was performed. Next, using an ultraviolet photoresist curing device (MMA-802-HC-552, manufactured by USHIO INC.), the entire glass substrate was irradiated with an exposure amount of 10000 mJ/cm ² , and a second exposure was performed to obtain a cured film. For the spectrum of the obtained cured film, using a spectrophotometer (U-4100, manufactured by Hitachi High-Tech Corporation), the absorption spectrum in the range of wavelength 300-2000nm was measured, and the absorbance in the range of wavelength 700-2000nm was measured respectively. The ratio of the maximum value A ¹ of the wavelength to the maximum value A ² of the absorbance in the wavelength range of 400-600nm (absorbance ratio A ¹ /A ² ) and the ratio of the maximum value A ¹ of the absorbance in the wavelength range of 700-2000nm to the wavelength Ratio of absorbance A ³ at 365 nm (absorbance ratio A ¹ /A ³ ).

- Evaluation criteria for A ¹ /A ² - 5: A ¹ /A ² value of 8 or more 4: A ¹ /A ² value of 6 or more but less than 8 3: A ¹ /A ² value of 4.5 or more And less than 6 2: The value of A ¹ /A ² is 2 or more and less than 4.5 1: The value of A ¹ /A ² is less than 2

- Evaluation criteria of A ¹ /A ³ - 5: The value of A ¹ /A ³ is 2 or more and less than 3 4: The value of A ¹ /A ³ is 1.5 or more and less than 2 or 3 or more and less than 4.5 3 : The value of A ¹ /A ³ is 1 or more and less than 1.5 or 4.5 or more and less than 9 2: The value of A ¹ /A ³ is 0.5 or more and less than 1 or 9 or more and less than 12 1: A ¹ / The value of A ³ does not reach 0.5 or more than 12

<Evaluation of Solvent Resistance> Each curable composition was applied to a glass substrate using a spin coater to form a coating film. Then, heat treatment (pre-baking) was performed for 120 seconds using a 100° C. hot plate so that the dry film thickness of the coating film would be 1.0 μm. Next, using an i-ray stepper exposure device FPA-i5+ (manufactured by Canon Inc.), the coating film was irradiated with light having a wavelength of 365 nm at an exposure amount of 1000 mJ/cm ² , and the first exposure was performed. Next, using an ultraviolet photoresist curing device (MMA-802-HC-552, manufactured by USHIO INC.), the entire glass substrate was irradiated with an exposure amount of 10000 mJ/cm ² , and a second exposure was performed to obtain a cured film. The spectrum of the obtained cured film was measured using an ultraviolet-visible-near-infrared spectrophotometer. Moreover, after performing the immersion process in acetone for 600 second about the obtained cured film, it spray-dried (solvent resistance test). The spectrum of the cured film after the solvent resistance test was measured using an ultraviolet-visible-near-infrared spectrophotometer, and solvent resistance was evaluated by the following criteria. -Evaluation Criteria for Solvent Resistance- Let the minimum transmittance value in the wavelength range of 700 to 2000 nm before the solvent resistance test be C1, and the minimum transmittance value in the wavelength range of 700 to 2000 nm after the solvent resistance test Set to D1. 5: The value of D1-C1 is less than 0.1% 4: The value of D1-C1 is more than 0.1% and less than 0.5% 3: The value of D1-C1 is more than 0.5% and less than 1.0% 2: The value of D1-C1 1.0% or more and less than 5.0% 1: The value of D1-C1 is 5.0% or more

<Evaluation of Rectangularity> Each curable composition was coated on a silicon wafer using a spin coater (manufactured by MIKASA CO., LTD.) to form a coating film so that the film thickness after prebaking would be 1.0 μm. Next, using a hot plate, it was heated (pre-baked) at 100° C. for 2 minutes. Next, using an i-ray stepper exposure device FPA-3000i5+ (manufactured by Canon Inc.), exposure was performed with an exposure amount of 1000 mJ/cm ² through a mask of a Bayer pattern of 1 μm square. Next, spin-on-immersion image development was performed at 23° C. for 60 seconds using a 0.3% by mass aqueous solution of tetramethylammonium hydroxide (TMAH). Thereafter, it was rinsed with a rotary shower, and further washed with pure water to form a pattern. The silicon wafer on which the above-mentioned pattern was formed was divided and platinum vapor-deposited, and then a cross-sectional scanning electron microscope (SEM) image of the pattern was obtained using a scanning electron microscope (manufactured by Hitachi High-Tech Corporation). Five patterns were extracted from the obtained cross-sectional SEM images, and the average slopes of the cross-sections of the five patterns were obtained and evaluated according to the following criteria. Furthermore, regarding the slope of the cross section of the pattern, the slope in the thickness direction of the cured film on the silicon wafer in the portion where the pattern was formed was measured. Specifically, the angle of the portion formed by the silicon wafer and the side in the thickness direction of the cured film was measured. When the slope of the pattern is less than 90 degrees with respect to the silicon wafer, it means that the cured film is tapered (tapered) from the silicon wafer side toward the surface side of the cured film. 5: The average slope of 5 patterns is more than 80 degrees and less than 100 degrees relative to the silicon wafer 4: The average slope of 5 patterns is more than 70 degrees and less than 80 degrees relative to the silicon wafer 3: 5 patterns The average slope is more than 60 degrees and less than 70 degrees relative to the silicon wafer 2: The average slope of 5 patterns is more than 50 degrees and less than 60 degrees relative to the silicon wafer 1: The average slope of 5 patterns is relative to the silicon wafer Circle less than 50 degrees or more than 100 degrees

[Table 17] Spectral characteristics Solvent resistance Rectangularity A ¹ /A ² A ¹ /A ³ Example 1 5 5 5 5 Example 2 5 5 5 5 Example 3 5 5 5 5 Example 4 5 5 5 5 Example 5 5 5 5 5 Example 6 5 5 5 5 Example 7 5 5 5 5 Example 8 5 5 5 5 Example 9 5 3 5 - Example 10 5 3 5 - Example 11 5 3 5 - Example 12 5 3 5 - Example 13 5 3 5 - Example 14 5 3 5 - Example 15 5 3 5 - Example 16 5 3 5 - Example 17 5 3 5 - Example 18 5 3 5 - Example 19 5 4 5 4 Example 20 5 4 5 4 Example 21 5 4 5 4 Example 22 5 4 5 4 Example 23 5 4 5 4 Example 24 5 4 5 4 Example 25 5 4 5 4 Example 26 5 4 5 4 Example 27 5 4 5 4 Example 28 5 4 5 4 Example 29 5 4 5 4 Example 30 5 4 5 4 Example 31 5 4 5 4 Example 32 5 4 5 4 Example 33 5 4 5 4 Example 34 5 4 5 4 Example 35 5 3 5 3 Example 36 5 3 5 3 Example 37 5 3 5 3 Example 38 5 3 5 3 Example 39 5 3 5 3 Example 40 5 3 5 3 [Table 18] Spectral characteristics Solvent resistance Rectangularity A ¹ /A ² A ¹ /A ³ Example 41 5 3 5 3 Example 42 5 3 5 3 Example 43 5 5 5 5 Example 44 5 5 5 5 Example 45 5 5 5 5 Example 46 5 5 5 5 Example 47 5 5 5 5 Example 48 5 5 5 5 Example 49 5 5 5 5 Example 50 5 5 5 5 Example 51 5 5 5 5 Example 52 5 5 5 5 Example 53 5 5 5 5 Example 54 5 5 5 5 Example 55 5 5 5 5 Example 56 5 5 5 5 Example 57 5 5 5 5 Example 58 5 5 5 5 Example 59 5 5 5 5 Example 60 5 5 5 5 Example 61 5 5 5 5 Example 62 5 5 5 5 Example 63 5 5 5 5 Example 64 5 5 5 5 Example 65 5 5 5 5 Example 66 5 5 5 5 Example 67 5 5 5 5 Example 68 5 5 5 5 Example 69 5 5 5 5 Example 70 5 5 5 5 Example 71 5 5 5 5 Example 72 5 5 5 5 Example 73 5 5 5 5 Example 74 5 5 5 5 Example 75 5 4 5 4 Example 76 5 4 5 4 Example 77 5 4 5 4 Example 78 5 4 5 4 Example 79 5 4 5 4 Example 80 5 4 5 4 [Table 19] Spectral characteristics Solvent resistance Rectangularity A ¹ /A ² A ¹ /A ³ Example 81 5 4 5 4 Example 82 5 4 5 4 Example 83 5 4 5 4 Example 84 5 4 5 4 Example 85 5 4 5 4 Example 86 5 4 5 4 Example 87 5 4 5 4 Example 88 5 4 5 4 Example 89 5 4 5 4 Example 90 5 4 5 4 Example 91 5 5 5 5 Example 92 5 5 5 5 Example 93 5 5 5 5 Example 94 5 5 5 5 Example 95 5 5 5 5 Example 96 5 5 5 5 Example 97 5 5 5 5 Example 98 5 5 5 5 Example 99 5 5 5 5 Example 100 5 5 5 5 Example 101 5 5 5 5 Example 102 5 5 5 5 Example 103 5 5 5 5 Example 104 5 5 5 5 Example 105 5 5 5 5 Example 106 5 5 5 5 Example 107 5 5 5 5 Example 108 5 5 5 5 Example 109 5 5 5 5 Example 110 5 5 5 5 Example 111 5 5 5 5 Example 112 5 5 5 5 Example 113 5 5 5 5 Example 114 5 5 5 5 Example 115 5 5 5 5 Example 116 5 5 5 5 Example 117 5 5 5 5 Example 118 5 5 5 5 Example 119 5 5 5 5 Example 120 5 5 5 5 [Table 20] Spectral characteristics Solvent resistance Rectangularity A ¹ /A ² A ¹ /A ³ Example 121 5 5 5 5 Example 122 5 5 5 5 Example 123 5 5 5 5 Example 124 5 5 5 5 Example 125 5 5 5 5 Example 126 5 5 5 5 Example 127 5 5 5 5 Example 128 5 5 5 5 Example 129 5 5 5 5 Example 130 5 5 5 5 Example 131 5 5 5 5 Example 132 5 5 5 5 Example 133 5 5 5 5 Example 134 5 5 5 5 Example 135 5 5 5 5 Example 136 5 5 5 5 Example 137 5 5 5 5 Example 138 5 5 5 5 Example 139 5 5 5 5 Example 140 5 5 5 5 Example 141 5 5 5 5 Example 142 5 5 5 5 Example 143 5 5 5 5 Example 144 5 5 5 5 Example 145 5 5 5 5 Example 146 5 5 5 5 Example 147 5 5 5 5 Example 148 5 5 5 5 Example 149 5 5 5 5 Example 150 5 5 5 5 Example 151 5 5 5 5 Example 152 5 5 5 5 Example 153 5 5 5 5 Example 154 5 5 5 5 Example 155 5 5 5 5 Example 156 5 5 5 5 Example 157 5 5 5 5 Example 158 5 5 5 5 Example 159 5 5 5 5 Example 160 5 5 5 5 Example 161 5 5 5 5 Example 162 5 5 5 5 Comparative example 1 5 3 2 3 Comparative example 2 5 3 1 1

As shown in the above table, the curable compositions of Examples can form cured films excellent in solvent resistance. On the other hand, Comparative Examples 1 and 2 containing only one of photopolymerization initiator IA and photopolymerization initiator IB were inferior in evaluation of solvent resistance compared to Examples.

In the curable composition of Example 9, except that the infrared absorber A9 was changed to the infrared absorbers A19 to A32 shown below, a curable composition was produced in the same manner as in Example 9. Even when each characteristic was evaluated by the same method as above, the same performance (spectral characteristic, solvent resistance) as Example 9 was obtained. In particular, infrared absorbers A19 to A32 have high visible light transmittance, and curable compositions using these infrared absorbers can form the maximum value ^A1 of absorbance in the wavelength range of 700 to 2000 nm and the maximum value of absorbance in the wavelength range of 400 to 600 nm. The greater the ratio of absorbance within A ² (absorbance ratio A ¹ /A ² ), the larger the cured film.

[化學式36]

[化學式37]

Infrared absorbers A19 to A32: compounds of the following structure [chemical formula 35]

[chemical formula 36]

[chemical formula 37]

110: Solid-state imaging element 111: near infrared cut filter 112: color filter 114: infrared transmission filter 115: micro lens 116: Planarization layer hν: incident light

FIG. 1 is a schematic diagram showing one aspect of the infrared sensor of the present invention.

110: Solid-state imaging element

111: near infrared cut filter

112: color filter

114: infrared transmission filter

115: micro lens

116: Planarization layer

hν: incident light

Claims (19)

A curable composition comprising an infrared absorber, a polymerizable monomer, and a photopolymerization initiator, wherein the photopolymerization initiator includes methanol with an absorption coefficient of 1.0×10 ³ mL/g･cm or more at a wavelength of 365 nm Photopolymerization initiator IA and photopolymerization initiator IB having an absorption coefficient of less than 1.0×10 ³ mL/g･cm at a wavelength of 365 nm and an absorption coefficient of 1.0×10 ³ mL/g･cm or more at a wavelength of 254 nm in methanol , the ratio of the maximum absorbance A ¹ of the curable composition in the wavelength range of 700 nm to 2000 nm to the maximum absorbance A ² in the wavelength range of 400 nm to 600 nm, that is, A ¹ /A ^{2 ,} is 4.5 or more. The curable composition as described in Claim 1, wherein The aforementioned photopolymerization initiator IA is an oxime compound. The curable composition as described in Claim 1 or Claim 2, wherein The aforementioned photopolymerization initiator IB is a hydroxyalkylphenone compound. The curable composition as described in Claim 1 or Claim 2, wherein The total content of the photopolymerization initiator IA and the photopolymerization initiator IB in the total solid content of the curable composition is 1% by mass to 6% by mass. The curable composition as described in Claim 1 or Claim 2, wherein Content of the said photoinitiator IB is 5 mass parts - 200 mass parts with respect to 100 mass parts of said photoinitiator IA. The curable composition as described in Claim 1 or Claim 2, wherein Content of the said infrared absorber in the total solid content of the said curable composition is 10 mass % - 40 mass %. The curable composition as described in Claim 1 or Claim 2, wherein Content of the said polymerizable monomer in the total solid content of the said curable composition is 10 mass % - 50 mass %. The curable composition according to Claim 1 or Claim 2, which further contains a resin. The curable composition as described in Claim 8, wherein Content of the said resin is 10 mass parts - 500 mass parts with respect to 100 mass parts of the said polymerizable monomer. The curable composition according to Claim 1 or Claim 2, further comprising a UV absorber, wherein the content of the UV absorber is 10 to 500 parts by mass relative to 100 parts by mass of the photopolymerization initiator IA . The curable composition according to claim 1 or claim 2, wherein the ratio of the maximum absorbance A ¹ of the curable composition in the wavelength range of 700 nm to 2000 nm to the absorbance A ³ at a wavelength of 365 nm is A ¹ /A ³ is more than 1 and less than 9. The curable composition according to Claim 1 or Claim 2, which is used for a near-infrared cut filter. A cured film obtained by curing the curable composition described in Claim 1 or Claim 2. A method for forming a pattern, comprising: A step of forming a curable composition layer on a support using the curable composition described in claim 1 or claim 2; In the first exposure step, irradiating the curable composition layer with light having a wavelength of more than 350 nm and not more than 380 nm and exposing in a pattern; A developing step of developing the aforementioned curable composition layer; and In the second exposure step, after the development step, the curable composition layer is irradiated with light having a wavelength of not less than 254 nm and not more than 350 nm. The method for forming a pattern according to claim 14, which comprises a method of forming a pattern under a low-oxygen environment at a temperature of less than 200° C. during at least any period between the developing step and the second exposing step and after the second exposing step A step of heating the aforementioned curable composition layer. A near-infrared cut filter having the hardened film as described in claim 13. A solid-state imaging device having the cured film as described in claim 13. An image display device having the cured film according to claim 13. An infrared sensor having the cured film as described in claim 13.

Images