TW202312021A - Automatic recognizing system and automatic recognizing method for a pick-up position of a printed circuit board - Google Patents

Automatic recognizing system and automatic recognizing method for a pick-up position of a printed circuit board Download PDF

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TW202312021A
TW202312021A TW110134173A TW110134173A TW202312021A TW 202312021 A TW202312021 A TW 202312021A TW 110134173 A TW110134173 A TW 110134173A TW 110134173 A TW110134173 A TW 110134173A TW 202312021 A TW202312021 A TW 202312021A
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circuit board
training
layout
target
target image
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TW110134173A
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TWI772181B (en
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簡浩宇
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台達電子工業股份有限公司
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Abstract

An automatic recognizing system and an automatic recognizing method for a pick-up position of a printed circuit board are provided. A simplifying process is executed to filter out the recognition noise in a layout drawing of a standard printed circuit board to obtain a training layout drawing, and the training layout drawing configured a pick-up position is inputted to a training model to update the training model to obtain a capacity of recognizing the same type of the standard printed circuit board. A matching process is executed on a target image of a target printed circuit board to determine a pick-up position of the target image while the target image is recognized as the standard circuit board by the training model. The present disclosure can accurately recognize the pick-up position of the target image, and implement the unmanned automatic pick-up for the printed circuit board.

Description

電路板抓取位置的自動辨識系統與自動辨識方法Automatic identification system and automatic identification method for circuit board grasping position

本發明係有關自動辨識系統與方法,特別有關於電路板抓取位置的自動辨識系統與自動辨識方法。The invention relates to an automatic identification system and method, in particular to an automatic identification system and an automatic identification method for the grasping position of a circuit board.

為了從正確的抓取位置抓取電路板,目前已有一種自動辨識抓取位置的方法被提出。In order to grasp the circuit board from the correct grasping position, a method for automatically identifying the grasping position has been proposed.

具體而言,現有的方法是透過人工方式拍攝電路板的大量影像,使用這些影像執行訓練來產生辨識模型,再使用此辨識模型來辨識電路板。Specifically, the existing method is to manually capture a large number of images of the circuit board, use these images to perform training to generate a recognition model, and then use the recognition model to recognize the circuit board.

於上述方法中,由於不同人所蒐集的影像內容與所使用的學習演算法通常不同,會導致辨識模型的精準度參差不齊。In the above method, because the image content collected by different people and the learning algorithm used are usually different, the accuracy of the recognition model will be uneven.

具體而言,由於電路板存在大量且複雜的元件,其軟板容易產生形變,且容易導致反光,以人工方式所拍攝的訓練影像,通常會包含大量雜訊,而降低辨識模型的精確度。Specifically, since there are a large number of complex components on the circuit board, the flexible board is prone to deformation and reflection, and the training images captured manually usually contain a lot of noise, which reduces the accuracy of the recognition model.

此外,辨識模型的精確度是與訓練影像中的辨識區域和辨識特徵的選擇的息息相關,不適合的學習演算法與不當的辨識特徵都會降低辨識模型的精確度。In addition, the accuracy of the recognition model is closely related to the selection of the recognition region and recognition features in the training images. Inappropriate learning algorithms and improper recognition features will reduce the accuracy of the recognition model.

是以,現有自動辨識電路板抓取位置的方法存在上述人為因素造成的問題,而亟待更有效的方案被提出。Therefore, the existing method for automatically identifying the grasping position of the circuit board has the above-mentioned problems caused by human factors, and a more effective solution is urgently needed to be proposed.

本發明之主要目的,係在於提供一種電路板抓取位置的自動辨識系統與自動辨識方法,可完全排除造成訓練模型的精確度不穩定的人為介入並提供穩定的辨識特徵。The main purpose of the present invention is to provide an automatic identification system and automatic identification method for the grasping position of the circuit board, which can completely eliminate the human intervention that causes the accuracy of the training model to be unstable and provide stable identification features.

於一實施例中,一種電路板抓取位置的自動辨識方法,包括:a) 取得不同類型的多個標準電路板的多個佈局圖,並對各該標準電路板的該佈局圖執行一簡化處理,來獲得剔除辨識雜訊的一訓練佈局圖;b) 基於各該訓練佈局圖對一訓練模型執行一訓練處理來使該訓練模型具備辨識不同類型的該多個標準電路板的能力,其中各該訓練佈局圖設定有一抓取位置;c) 輸入一目標電路板的一目標影像至該訓練模型來對該目標影像執行一辨識處理;及,d) 於辨識該目標影像符合任一該標準電路板時,對該目標影像執行一匹配處理來基於符合的該標準電路板的該訓練佈局圖的該抓取位置決定該目標影像的一抓取位置;該辨識處理包括:e1) 對該目標影像執行一目標邊緣分析以獲得該目標影像的多個目標元件邊緣特徵;e2) 基於該目標元件邊緣特徵與各該標準電路板的多個辨識特徵計算該目標影像對各該標準電路板的一相似分數;及,e3) 基於分數最高的該標準電路板決定一辨識結果。In one embodiment, a method for automatic identification of a circuit board picking position includes: a) Obtaining a plurality of layout diagrams of a plurality of standard circuit boards of different types, and performing a simplification on the layout diagrams of each of the standard circuit boards processing, to obtain a training layout that eliminates identification noise; b) performing a training process on a training model based on each of the training layouts so that the training model has the ability to identify different types of the plurality of standard circuit boards, wherein Each of the training layouts is set with a grab position; c) inputting a target image of a target circuit board into the training model to perform a recognition process on the target image; and, d) identifying that the target image meets any of the criteria circuit board, a matching process is performed on the target image to determine a capture position of the target image based on the capture position of the training layout diagram of the standard circuit board; the recognition process includes: e1) the target performing a target edge analysis on the image to obtain a plurality of target component edge features of the target image; e2) calculating a target image for each of the standard circuit boards based on the target component edge features and a plurality of identification features of each of the standard circuit boards similarity score; and, e3) determining an identification result based on the standard circuit board with the highest score.

於一實施例中,一種電路板抓取位置的自動辨識系統,包含:一影像擷取設備、一抓取設備及一控制設備。該影像擷取設備用以拍攝一目標電路板來獲得一目標影像。該抓取設備用以抓取電路板。該控制設備連接該影像擷取設備及該抓取設備,包括一簡化模組、一訓練模組及一辨識模組。該簡化模組被設定來對一標準電路板的一佈局圖執行一簡化處理,來獲得剔除辨識雜訊以獲得一訓練佈局圖。該訓練模組被設定來輸入該訓練佈局圖至一訓練模型來使該訓練模型具備辨識相同類型電路板的能力,其中該訓練佈局圖上設定有一抓取位置。該辨識模組輸入該目標影像至該訓練模型以執行辨識,於辨識該目標影像為該標準電路板時,對該目標影像執行一匹配處理來基於符合的該標準電路板的該訓練佈局圖的該抓取位置決定該目標影像的一抓取位置。該控制設備被設定來基於該目標影像的該抓取位置控制該抓取設備抓取該目標電路板。In one embodiment, an automatic identification system for picking a circuit board position includes: an image capturing device, a picking device and a control device. The image capture device is used to photograph a target circuit board to obtain a target image. The grabbing device is used for grabbing the circuit board. The control device is connected with the image capture device and the capture device, and includes a simplified module, a training module and a recognition module. The simplification module is configured to perform a simplification process on a layout of a standard circuit board to remove identification noise to obtain a training layout. The training module is set to input the training layout to a training model to enable the training model to have the ability to recognize the same type of circuit boards, wherein a grasping position is set on the training layout. The identification module inputs the target image to the training model to perform identification, and when identifying the target image as the standard circuit board, performs a matching process on the target image based on the matching training layout diagram of the standard circuit board The capture position determines a capture position of the target image. The control device is configured to control the grabbing device to grab the target circuit board based on the grabbing position of the target image.

本發明可準確辨識目標影像的抓取位置,並可實現無人化的電路板自動抓取。The invention can accurately identify the grabbing position of the target image, and can realize unmanned automatic grabbing of the circuit board.

茲就本發明之一較佳實施例,配合圖式,詳細說明如後。A preferred embodiment of the present invention will be described in detail below with reference to the drawings.

為了實現自動化與無人產線,電路板的自動夾取的準確度相當重要。In order to realize automation and unmanned production line, the accuracy of automatic clamping of circuit boards is very important.

為了能夠精準地辨識電路板的夾取位置(即執行夾取時不會破壞電路板及其上元件的位置),本發明提出一種電路板抓取位置的自動辨識系統與自動辨識方法,可使用佈局圖(layout drawing)對訓練模型進行訓練,使訓練模型可以正確辨識此類電路板。並且,本發明使用訓練完成的訓練模型來辨識目標電路板(即目前要加工的實體電路板)的類型,並依據辨識結果來進行抓取位置的定位。In order to accurately identify the clamping position of the circuit board (that is, the position where the circuit board and its components will not be damaged when performing clamping), the present invention proposes an automatic identification system and automatic identification method for the grasping position of the circuit board, which can be used The layout drawing trains the training model so that the training model can correctly identify such circuit boards. Moreover, the present invention uses the trained training model to identify the type of the target circuit board (that is, the physical circuit board currently to be processed), and locates the grabbing position according to the identification result.

請參閱圖1,為本發明一實施例的自動辨識系統的架構圖。本實施例的自動辨識系統主要包含影像擷取設備11、抓取設備12、儲存設備13及連接上述設備的控制設備10。Please refer to FIG. 1 , which is a structural diagram of an automatic identification system according to an embodiment of the present invention. The automatic identification system of this embodiment mainly includes an image capture device 11 , a capture device 12 , a storage device 13 and a control device 10 connected to the above devices.

影像擷取設備11,如彩色攝影機、紅外線攝影機、3D攝影機或其他光學攝影機,用來拍攝目標電路板20來獲得目標影像(如彩色影像、灰階影像、黑白影像、3D影像等)。The image capture device 11, such as a color camera, an infrared camera, a 3D camera or other optical cameras, is used to photograph the target circuit board 20 to obtain target images (such as color images, grayscale images, black and white images, 3D images, etc.).

抓取設備12,如可抓取電路板的自動化機械,用來抓取目標電路板20,並搬移至指定的位置(如後述之加工位置)。抓取設備12可以透過包含夾取(如機械夾)、吸取(如磁力或吸力)等方式來抓取電路板。The grabbing device 12 , such as an automated machine capable of grabbing circuit boards, is used to grab the target circuit board 20 and move it to a designated location (such as a processing location described later). The grabbing device 12 can grab the circuit board through methods including clamping (such as mechanical clamping), suction (such as magnetic force or suction force), and the like.

儲存設備13用來儲存資料。於一實施例中,儲存設備13可儲存各類標準電路板的佈局圖130,前述佈局圖130為2D影像,並可透過對各類標準電路板的設計圖(通常為向量圖或立體圖)執行轉檔來加以獲得。The storage device 13 is used for storing data. In one embodiment, the storage device 13 can store the layout diagrams 130 of various standard circuit boards. The aforementioned layout diagrams 130 are 2D images, and can be executed through the design diagrams (usually vector diagrams or three-dimensional diagrams) of various standard circuit boards. Convert to get it.

於一實施例中,儲存設備13可儲存訓練模型131,如機器學習模型或記錄影像辨識特徵的資料模型。訓練模型131用來於接受資料訓練來學習辨識各類標準電路板的能力。In one embodiment, the storage device 13 can store the training model 131 , such as a machine learning model or a data model that records image recognition features. The training model 131 is used to receive data training to learn the ability to recognize various standard circuit boards.

控制設備10,如處理器、搭載處理器的機台控制電腦或控制盒等、用來控制自動辨識系統的各設備運作,如執行後述之訓練模式與抓取模式。The control device 10, such as a processor, a machine control computer or a control box equipped with a processor, is used to control the operation of each device of the automatic identification system, such as executing the training mode and grasping mode described later.

請一併參閱圖2,為本發明一實施例的自動辨識系統的架構圖。相較於圖1的實施例,本實施例的自動辨識系統更包含連接控制設備10的加工設備30,如電路板的製造設備(如焊接/組裝設備)或檢測設備(如檢查元件/接點的設備)。加工設備30用來對放置於加工位置的目標電路板20執行加工(如焊接、組裝或檢查)。Please also refer to FIG. 2 , which is a structural diagram of an automatic identification system according to an embodiment of the present invention. Compared with the embodiment of FIG. 1, the automatic identification system of this embodiment further includes processing equipment 30 connected to the control equipment 10, such as circuit board manufacturing equipment (such as welding/assembly equipment) or testing equipment (such as inspection components/contacts) device of). The processing equipment 30 is used to perform processing (such as soldering, assembly or inspection) on the target circuit board 20 placed at the processing position.

於一實施例中,自動辨識系統更包含連接控制設備10的人機介面31,如觸控螢幕、按鍵、顯示螢幕、指示燈、蜂鳴器等輸入/輸出裝置的任意組合,用來提供資訊並與用戶進行互動。In one embodiment, the automatic identification system further includes a human-machine interface 31 connected to the control device 10, such as any combination of input/output devices such as touch screens, buttons, display screens, indicator lights, and buzzers, for providing information and interact with users.

於一實施例中,自動辨識系統更包含連接控制設備10的通訊介面32,如網路卡、Wi-Fi模組、蜂巢網路模組等可連接區域網路或網際網路的網路介面。In one embodiment, the automatic identification system further includes a communication interface 32 connected to the control device 10, such as a network interface card, a Wi-Fi module, a cellular network module, etc., which can be connected to a local area network or the Internet. .

於一實施例中,通訊介面32可用來連接運算平台40(如雲端伺服器或遠端主機),並與運算平台40進行通訊。In one embodiment, the communication interface 32 can be used to connect to the computing platform 40 (such as a cloud server or a remote host) and communicate with the computing platform 40 .

於一實施例中,前述佈局圖130與訓練模型131可儲存於運算平台40,運算平台40可用來執行後述之訓練模式來使用佈局圖130(可由自動辨識系統提供、自電路板資料庫中取得或自行從設計圖轉檔獲得)對訓練模型131執行訓練,並將訓練完成的訓練模型131傳送至自動辨識系統以執行抓取模式。In one embodiment, the aforementioned layout diagram 130 and training model 131 can be stored in the computing platform 40, and the computing platform 40 can be used to execute the training mode described later to use the layout diagram 130 (which can be provided by the automatic identification system and obtained from the circuit board database. Or obtain it from the design drawing by itself) to perform training on the training model 131, and send the trained training model 131 to the automatic recognition system to execute the grasping mode.

於一實施例中,自動辨識系統更包含連接控制設備10的電力設備(圖未標示),電力設備用來連接固定電源(如市電)並將接收電力轉換為自動辨識系統運作所需電力。In one embodiment, the automatic identification system further includes an electric device (not shown) connected to the control device 10. The electric device is used to connect to a fixed power source (such as mains) and convert the received power into the power required for the operation of the automatic identification system.

請一併參閱圖3,為本發明一實施例的控制設備的架構圖。於本實施例中,控制設備10可包含模組500-510。這些模組500-510分別被設定來實做不同的功能。Please also refer to FIG. 3 , which is a structural diagram of a control device according to an embodiment of the present invention. In this embodiment, the control device 10 may include modules 500-510. These modules 500-510 are respectively set to implement different functions.

拍攝控制模組500,被設定來控制影像擷取設備11對目標電路板20進行拍攝來獲得目標影像。The photographing control module 500 is configured to control the image capture device 11 to photograph the target circuit board 20 to obtain a target image.

簡化模組501,被設定來對影像執行簡化處理,來濾除影像中的辨識雜訊,並保留可辨識度較高的辨識特徵,如較具特色的圖案、圖案組合及/或圖案分佈等。The simplification module 501 is set to perform simplification processing on the image to filter out the identification noise in the image and retain identification features with high identifiability, such as distinctive patterns, pattern combinations and/or pattern distribution, etc. .

於一實施例中,簡化模組501可包含模組502-506。In one embodiment, simplified module 501 may include modules 502-506.

預處理模組502,被設定來對影像執行預處理,如裁切、色彩空間轉換、對比強調等,來使影像符合規定的格式或提高可辨識度。The pre-processing module 502 is configured to perform pre-processing on the image, such as cropping, color space conversion, contrast emphasis, etc., so as to make the image conform to the specified format or improve the visibility.

輪廓提取模組503,被設定來於影像中辨識電路板的多個元件的輪廓。The contour extraction module 503 is configured to recognize the contours of multiple components of the circuit board in the image.

零碎元件過濾模組504,被設定來從影像中濾除面積較小的元件。這些面積較小的元件(如細小的銅箔或線路)於影像上如同小面積雜點,無法作為辨識特徵,且會成為影像辨識的雜訊。Fragmentary element filtering module 504 is configured to filter out smaller area elements from the image. These smaller components (such as tiny copper foils or lines) are like small-area noise on the image, which cannot be used as identification features and will become noise for image identification.

重複元件過濾模組505,被設定來於影像中辨識大量重複出現的多個元件,並從影像中濾除重複的多個元件。這些重複元件是位置相近的重複或相似的設計,具有相同或相似的外型而會影響後續的定位精確度,不適合作為辨識特徵。The repeated element filtering module 505 is configured to identify a large number of repeated elements in the image, and filter out the repeated elements from the image. These repeating elements are repeating or similar designs in close positions, have the same or similar appearance and will affect the subsequent positioning accuracy, and are not suitable as identification features.

曲折元件過濾模組506,被設定來於影像中辨識曲折元件(如具有多個角點的元件),並從影像中濾除此元件。曲折元件由於元件角度不穩定,會影響後續的定位精確度,不適合作為辨識特徵。The zigzag component filtering module 506 is configured to identify zigzag components (such as components with multiple corners) in the image and filter the component from the image. Due to the unstable angle of the component, the bending component will affect the subsequent positioning accuracy, so it is not suitable as an identification feature.

訓練模組507,被設定來執行訓練模式。訓練模組507可輸入訓練影像(如訓練佈局圖)至訓練模型131來對訓練模型131執行訓練處理,以使其具備辨識相同類型電路板的能力。The training module 507 is configured to execute the training mode. The training module 507 can input a training image (such as a training layout) to the training model 131 to perform a training process on the training model 131 so that it has the ability to recognize the same type of circuit board.

於一實施例中,訓練影像可設定有抓取位置,而使得訓練後的訓練模型131可以自動辨識抓取位置。In one embodiment, the training image can be set with grasping positions, so that the trained training model 131 can automatically recognize the grasping positions.

抓取控制模組509,被設定來基於辨識獲得的目標影像的抓取位置控制抓取設備12對目標電路板20的抓取位置執行抓取。The grasping control module 509 is configured to control the grasping device 12 to perform grasping on the grasping position of the target circuit board 20 based on the grasping position of the recognized target image.

於一實施例中,抓取控制模組509,於完成抓取後,可進一步控制抓取設備12將目標電路板20運送至加工位置。In one embodiment, the grabbing control module 509 can further control the grabbing device 12 to transport the target circuit board 20 to the processing position after the grabbing is completed.

加工控制模組510,被設定來控制加工設備30對加工位置的目標電路板20執行加工。The processing control module 510 is configured to control the processing equipment 30 to process the target circuit board 20 at the processing position.

前述模組500-510是相互連接(可為電性連接與資訊連接),並可為硬體模組(例如是電子電路模組、積體電路模組、SoC等等)、軟體模組(例如是韌體、作業系統或應用程式)或軟硬體模組混搭,不加以限定。The aforementioned modules 500-510 are connected to each other (which may be electrical connection and information connection), and may be hardware modules (such as electronic circuit modules, integrated circuit modules, SoC, etc.), software modules ( For example, firmware, operating system, or application program) or a mix of software and hardware modules, without limitation.

值得一提的是,當前述模組為軟體模組(例如是韌體、作業系統或應用程式)時,儲存設備13或運算平台40可包含非暫態電腦可讀取記錄媒體(圖未標示),前述非暫態電腦可讀取記錄媒體儲存有電腦程式132,電腦程式132記錄有電腦可執行之程式碼,當控制設備10或運算平台40的處理器執行前述程式碼後,可實做對應模組之功能。It is worth mentioning that when the aforementioned modules are software modules (such as firmware, operating system or application program), the storage device 13 or the computing platform 40 may include a non-transitory computer-readable recording medium (not shown in the figure) ), the aforementioned non-transitory computer-readable recording medium stores a computer program 132, and the computer program 132 records a computer-executable program code. After the processor of the control device 10 or the computing platform 40 executes the aforementioned program code, it can implement Corresponding to the function of the module.

請一併參閱圖4,為本發明一實施例的自動辨識的資料流的示意圖。圖4示出了本發明一實施例的訓練模式(上圖)與抓取模式(下圖)的資料流。Please also refer to FIG. 4 , which is a schematic diagram of an automatic identification data flow according to an embodiment of the present invention. FIG. 4 shows the data flow of the training mode (upper figure) and the capture mode (lower figure) of an embodiment of the present invention.

如圖4上圖所示,本發明首先對標準電路板的佈局圖130執行簡化處理來產生訓練資料(即訓練佈局圖),再將訓練資料輸入至訓練模型131來執行訓練,以獲得訓練資料的辨識特徵。透過對不同的訓練資料執行訓練,即可獲得不同標準電路板的辨識特徵,即訓練模型131可辨識不同類型的電路板。As shown in the upper figure of FIG. 4 , the present invention first performs simplified processing on the layout diagram 130 of the standard circuit board to generate training data (i.e., the training layout diagram), and then inputs the training data into the training model 131 to perform training to obtain the training data identifying features. By performing training on different training data, the identification features of different standard circuit boards can be obtained, that is, the training model 131 can identify different types of circuit boards.

如圖4下圖所示,本發明接著將目標電路板20的目標影像輸入至完成訓練的訓練模型131,來辨識目標電路板20的電路板類型,並依據辨識獲得的電路板類型取得對應的辨識特徵(包含抓取位置),最後使用所取得的辨識特徵對目標影像執行匹配處理,來透過定位這些辨識特徵來確認目標影像的抓取位置。As shown in the lower figure of FIG. 4 , the present invention then inputs the target image of the target circuit board 20 into the trained training model 131 to identify the circuit board type of the target circuit board 20 , and obtains the corresponding circuit board type according to the identified circuit board type. Identification features (including the capture position), and finally use the obtained identification features to perform matching processing on the target image, so as to confirm the capture position of the target image by locating these identification features.

本發明由於是使用無雜訊或雜訊極少的訓練佈局圖(由設計圖獲得的電子圖檔)來訓練辨識特徵,而非透過拍攝獲得的影像(包含大量雜訊),而具有極高的辨識精確度與定位精確度。The present invention has a very high performance because it uses the training layout diagram (electronic image file obtained from the design drawing) without noise or with little noise to train the identification features, rather than the image obtained by shooting (including a large amount of noise). Identification accuracy and positioning accuracy.

請一併參閱圖5,為本發明一實施例的自動辨識方法的流程圖。本發明各實施例的自動辨識方法可應用於圖1-4、8所示的任一系統。Please also refer to FIG. 5 , which is a flowchart of an automatic identification method according to an embodiment of the present invention. The automatic identification method of each embodiment of the present invention can be applied to any system shown in FIGS. 1-4 and 8 .

本實施例的自動辨識方法包含訓練模式(步驟S10-S11)。The automatic identification method of this embodiment includes a training mode (steps S10-S11).

步驟S10:控制設備10先取得標準電路板的佈局圖130,並透過簡化模組501對佈局圖130執行簡化處理來濾除辨識雜訊,藉以獲得剔除辨識雜訊的訓練佈局圖。Step S10: The control device 10 first obtains the layout diagram 130 of the standard circuit board, and performs a simplified process on the layout diagram 130 through the simplification module 501 to filter out the recognition noise, so as to obtain a training layout diagram without the recognition noise.

前述佈局圖130是呈現標準電路板的電子元件分佈與線路佈局的2D影像。The aforementioned layout diagram 130 is a 2D image showing the distribution of electronic components and circuit layout of a standard circuit board.

步驟S11:控制設備10透過訓練模組507輸入所產生訓練佈局圖至訓練模型131,來對訓練模型131執行訓練處理,而使訓練模型131具備辨識相同類型電路板的能力。Step S11: The control device 10 inputs the generated training layout diagram to the training model 131 through the training module 507 to perform training processing on the training model 131, so that the training model 131 has the ability to identify the same type of circuit boards.

於一實施例中,訓練佈局圖設定有適合此類電路板的抓取位置,如立體元件較少的位置、元件較少或沒有元件的位置、電路板中韌性較高的位置、容易於抓取過程中保持平衡的位置(如電路板的重心或中心)等。經過訓練的訓練模型131可以於輸入相同類型的電路板影像時,從輸入影像中辨識出適合此電路板的抓取位置。並且,當以此抓取位置抓取電路板時,由於抓取位置的元件較少、韌性較高及/或容易平衡,可大幅降低抓取動作對電路板造成破壞的機率,如可以避免損毀元件、損毀電路板、夾取過程中電路板掉落等情況。In one embodiment, the training layout diagram is set with grasping positions suitable for this type of circuit board, such as a position with fewer three-dimensional components, a position with fewer or no components, a position with higher toughness in the circuit board, and a position that is easy to grasp. Take the position to maintain balance in the process (such as the center of gravity or center of the circuit board), etc. When the trained training model 131 is input with the same type of circuit board image, it can recognize the grasping position suitable for the circuit board from the input image. Moreover, when grabbing the circuit board in this grabbing position, since the grabbing position has fewer components, higher toughness and/or easy balance, the probability of the grabbing action causing damage to the circuit board can be greatly reduced, such as damage can be avoided Components, damaged circuit boards, dropped circuit boards during clamping, etc.

於一實施例中,本發明可取得不同類型的多個標準電路板的多個佈局圖130,並對多個佈局圖130分別執行上述訓練模式,來使訓練模型131同時具備辨識不同類型的多個標準電路板的能力。In one embodiment, the present invention can obtain multiple layout diagrams 130 of multiple standard circuit boards of different types, and execute the above-mentioned training mode on the multiple layout diagrams 130, so that the training model 131 can simultaneously recognize different types of multiple layout diagrams. capacity of a standard circuit board.

於一實施例中,本發明對多類型的多個標準電路板的多個佈局圖130執行訓練模式,可以產生多個標準電路板的分類規則,這些分類規則可以用來對輸入影像的影像特徵進行分類,來決定輸入影像所屬的電路板類型。In one embodiment, the present invention executes the training mode on multiple layout diagrams 130 of multiple standard circuit boards of multiple types, and can generate classification rules for multiple standard circuit boards, and these classification rules can be used to classify the image features of the input image Classification is performed to determine the type of board to which the input image belongs.

本實施例的自動辨識方法還包含訓練完成後執行的抓取模式(步驟S20-S24)。The automatic recognition method of this embodiment also includes a grasping mode executed after the training is completed (steps S20-S24).

步驟S20:控制設備10可先透過拍攝控制模組500控制影像擷取設備11對抵達準備位置的目標電路板20拍攝進行拍攝來獲得目標影像,並透過辨識模組508將目標影像輸入至訓練模型131來執行辨識處理。Step S20: The control device 10 can firstly control the image capture device 11 through the shooting control module 500 to take pictures of the target circuit board 20 arriving at the ready position to obtain the target image, and input the target image into the training model through the identification module 508 131 to perform identification processing.

步驟S21:控制設備10依據辨識處理的結果決定所輸入的目標影像是否符合任一種事先建立的標準電路板。Step S21: The control device 10 determines whether the input target image conforms to any pre-established standard circuit board according to the result of the identification process.

於一實施例中,於辨識處理中,訓練模型131可將目標影像與事先建立的各標準電路板的影像特徵進行比對,並於判斷目標影像包含任一標準電路板的全部或大部分影像特徵(包括形狀比對相符與位置比對相符)時,判定目標電路板20屬於此標準電路板。In one embodiment, in the identification process, the training model 131 can compare the target image with the image features of each standard circuit board established in advance, and determine that the target image contains all or most of the images of any standard circuit board When the characteristics (including the shape comparison and the position comparison match), it is determined that the target circuit board 20 belongs to the standard circuit board.

於一實施例中,於辨識處理中,訓練模型131可提取目標影像的影像特徵,並將影像特徵與事先建立的各分類規則進行比對,以透過分類來決定目標電路板20所屬的標準電路板。In one embodiment, during the identification process, the training model 131 can extract the image features of the target image, and compare the image features with the classification rules established in advance, so as to determine the standard circuit to which the target circuit board 20 belongs through classification. plate.

若控制設備10判定目標影像符合任一標準電路板,則執行步驟S22;否則,控制設備10執行步驟S24。If the control device 10 determines that the target image conforms to any standard circuit board, step S22 is executed; otherwise, the control device 10 executes step S24.

步驟S22:控制設備10取得符合的標準電路板的辨識相關資料(如辨識特徵或訓練佈局圖,並包含抓取位置),並透過辨識模組508對目標影像與辨識相關資執行匹配處理來決定目標影像中的抓取位置,前述目標影像中的抓取位置是對應執行訓練模式時所設定的訓練佈局圖的抓取位置。Step S22: The control device 10 obtains the identification-related data (such as identification features or training layout diagrams, including the grasping position) of the standard circuit board that meets the requirements, and performs matching processing on the target image and the identification-related information through the identification module 508 to determine The capture position in the target image. The capture position in the target image corresponds to the capture position of the training layout map set when executing the training mode.

於一實施例中,辨識相關資料包含辨識特徵與抓取位置之間的排列關係,控制設備10從目標影像中辨識出這些辨識特徵後,即可依據上述排列關係計算出目標影像中的抓取位置。In one embodiment, the identification-related data includes the arrangement relationship between identification features and grasping positions. After the control device 10 identifies these identification features from the target image, it can calculate the grasping position in the target image according to the above-mentioned arrangement relationship. Location.

於一實施例中,辨識相關資料包含設定有抓取位置的訓練佈局圖,控制設備10從目標影像中辨識出多個辨識特徵後,可以依據這些特徵在訓練佈局圖中的方向、旋轉角度、距離等,來調整目標影像(如縮放及/或旋轉),而使目標影像與訓練佈局圖呈現相同的方向及/或尺寸,而可以清楚得知訓練佈局圖的抓取位置於目標影像中的對應位置。In one embodiment, the recognition-related data includes a training layout with grasping positions set. After the control device 10 recognizes a plurality of recognition features from the target image, it can use these features in the training layout according to the direction, rotation angle, distance, etc., to adjust the target image (such as scaling and/or rotation), so that the target image and the training layout map present the same direction and/or size, and it can be clearly known that the capture position of the training layout map is located in the target image Corresponding position.

步驟S23:控制設備10依據所決定目標影像的抓取位置,透過抓取控制模組509將此影像位置轉換為機器人座標位置,並產生對應的抓取命令,並執行此抓取命令來控制抓取設備12從目標電路板20的抓取位置抓取目標電路板20。Step S23: According to the capture position of the determined target image, the control device 10 converts the image position into the robot coordinate position through the capture control module 509, generates a corresponding capture command, and executes the capture command to control the capture The picking device 12 grabs the target circuit board 20 from the grabbing position of the target circuit board 20 .

於一實施例中,控制設備10可進一步控制抓取設備12將抓起的目標電路板20移動至加工設備30的加工位置。In one embodiment, the control device 10 can further control the grabbing device 12 to move the grabbed target circuit board 20 to the processing position of the processing device 30 .

並且,控制設備10可透過加工控制模組510加工設備30對加工位置的目標電路板20執行加工。Moreover, the control device 10 can process the target circuit board 20 at the processing position by the processing device 30 through the processing control module 510 .

若於步驟S21中,控制設備10判定目標影像不符合所有標準電路板,則執行步驟S24:控制設備10透過人機介面31發出警示,以提醒用戶辨識失敗。If in step S21, the control device 10 determines that the target image does not conform to all standard circuit boards, then execute step S24: the control device 10 issues a warning through the man-machine interface 31 to remind the user that the identification fails.

於一實施例中,於目標影像不符合所有標準電路板時,控制設備10可自動改採用機器學習方式來辨識目標電路板20的適合的抓取位置,如元件密度較低的位置、中央或重心位置等,再對辨識出的抓取位置執行抓取。In one embodiment, when the target image does not conform to all standard circuit boards, the control device 10 can automatically use machine learning to identify the suitable grabbing position of the target circuit board 20, such as the position with low component density, the center or The position of the center of gravity, etc., and then perform grabbing on the identified grabbing position.

於一實施例中,於目標影像不符合所有標準電路板時,控制設備10可接受人工操作來執行抓取。In one embodiment, when the target image does not conform to all standard circuit boards, the control device 10 can be manually operated to perform the capture.

本發明可準確辨識目標影像的抓取位置,並可實現無人化的電路板自動抓取。The invention can accurately identify the grabbing position of the target image, and can realize unmanned automatic grabbing of the circuit board.

請參閱圖8,為本發明一實施例的夾取電路板的示意圖。於本實施例中,抓取設備12包括連接控制設備10的吸取與驅動設備60與電路板運輸設備61。Please refer to FIG. 8 , which is a schematic diagram of clamping a circuit board according to an embodiment of the present invention. In this embodiment, the grabbing device 12 includes a suction and driving device 60 and a circuit board transport device 61 connected to the control device 10 .

首先,電路板運輸設備61可將目標電路板20移動至吸取與驅動設備60的抓取範圍內(即準備位置62)。於此為透過無軌自動搬運車運輸,並由升降台將目標電路板20送到指定高度的拍照位置來觸發影像擷取設備11拍攝目標影像,亦可改用輸送帶或其他電路板運輸設備。Firstly, the circuit board transportation device 61 can move the target circuit board 20 to the grasping range of the suction and driving device 60 (ie, the ready position 62 ). Here, the target circuit board 20 is transported by the trackless automatic transfer vehicle, and the target circuit board 20 is sent to the photographing position at a specified height by the lifting platform to trigger the image capture device 11 to capture the target image, or a conveyor belt or other circuit board transport equipment can be used instead.

接著,吸取與驅動設備60可透過驅動機構(如機械手臂)來移動吸嘴至準備位置62並對目標電路板20的抓取位置進行吸取並離開準備位置62,如位置62’所示。Then, the suction and driving device 60 can move the suction nozzle to the preparation position 62 through a driving mechanism (such as a robot arm) to suction the target circuit board 20 and leave the preparation position 62, as shown in position 62'.

接著,吸取與驅動設備60可透過於驅動機構移動至加工位置,並釋放目標電路板20於加工位置。Then, the suction and driving device 60 can move to the processing position through the driving mechanism, and release the target circuit board 20 at the processing position.

藉此,本發明可實現電路板的無人化自動抓取與放置。Thereby, the present invention can realize unmanned automatic grabbing and placing of the circuit board.

請一併參閱圖5及圖6,圖6為本發明一實施例的簡化處理的流程圖。相較於圖5的實施例,本實施例的自動辨識方法的簡化處理包括以下步驟S30-S35。Please refer to FIG. 5 and FIG. 6 together. FIG. 6 is a flowchart of simplified processing according to an embodiment of the present invention. Compared with the embodiment in FIG. 5 , the simplified processing of the automatic identification method in this embodiment includes the following steps S30 - S35 .

步驟S30:控制設備10取得標準電路板的佈局圖130。Step S30: The control device 10 obtains the layout diagram 130 of the standard circuit board.

於一實施例中,控制設備10可先取得標準電路板的設計圖,並對設計圖執行2D轉檔處理來獲得2D的佈局圖。In one embodiment, the control device 10 may first obtain the design drawing of the standard circuit board, and perform 2D conversion processing on the design drawing to obtain the 2D layout drawing.

前述設計圖可為Gerber格式或電腦輔助設計(CAD)格式。所獲得的佈局圖130可為彩色、黑白或灰階的2D影像。The aforementioned design drawings can be in Gerber format or computer-aided design (CAD) format. The obtained layout map 130 can be a color, black and white or gray scale 2D image.

接著,控制設備10可執行步驟S31-S35來從佈局圖13中過濾雜訊,以獲得沒有辨識雜訊或辨識雜訊極少的訓練佈局圖。Next, the control device 10 may execute steps S31-S35 to filter noise from the layout diagram 13 to obtain a training layout diagram with no recognition noise or very little recognition noise.

值得一提的是,後述步驟S31-S35可全部執行或僅部分執行,且其之間並沒有執行的先後順序,其執行與否與執行順序可依用戶需求任意變更。It is worth mentioning that the following steps S31-S35 can be executed in whole or only in part, and there is no order of execution among them, and whether they are executed or not and the order of execution can be changed arbitrarily according to user's needs.

步驟S31:控制設備10透過預處理模組502對所取得的佈局圖130執行預處理,來使佈局圖130符合規定的格式或提高可辨識度。Step S31 : the control device 10 executes preprocessing on the obtained layout diagram 130 through the preprocessing module 502 , so as to make the layout diagram 130 conform to a prescribed format or improve the visibility.

步驟S32-S35是透過元件輪廓來執行雜訊偵測。Steps S32-S35 are to perform noise detection through device outline.

步驟S32:控制設備10透過輪廓提取模組503對佈局圖130執行輪廓提取處理來於佈局圖130中辨識目標電路板20的最外圍輪廓以界定目標電路板20的範圍,並可進一步辨識目標電路板20的多個元件的輪廓。Step S32: the control device 10 performs contour extraction processing on the layout diagram 130 through the contour extraction module 503 to identify the outermost contour of the target circuit board 20 in the layout diagram 130 to define the range of the target circuit board 20, and further identify the target circuit Outlines of various elements of the board 20 .

於一實施例中,前述輪廓提取處理可包含肯尼演算法(Canny Algorithm)、索貝爾運算子(Sobel Operator)或其他邊緣偵測演算法,不加以限定。In one embodiment, the aforementioned contour extraction process may include Canny Algorithm, Sobel Operator or other edge detection algorithms, without limitation.

步驟S33:控制設備10透過零碎元件過濾模組504對佈局圖130執行零碎元件過濾處理,來從佈局圖130中濾除面積小於零碎臨界值的元件的圖案。Step S33 : The control device 10 performs a piecemeal component filtering process on the layout diagram 130 through the piecemeal component filtering module 504 to filter out patterns of components whose area is smaller than the piecemeal threshold value from the layout diagram 130 .

於一實施例中,零碎臨界值是基於目標電路板20的銅箔面積與第一比例所決定,如將銅箔面積乘上第一比例(可大於1)作為零碎臨界值。In one embodiment, the fragmentation threshold is determined based on the copper foil area of the target circuit board 20 and the first ratio, for example, the copper foil area multiplied by the first ratio (which may be greater than 1) is used as the fragmentation threshold.

步驟S34:控制設備10透過重複元件處理模組505對佈局圖130執行重複元件過濾處理,來辨識指定的搜尋範圍內數量超過重複臨界值的重複的多個元件,並從佈局圖130濾除重複的多個元件的圖案。Step S34: The control device 10 performs a repeated component filtering process on the layout drawing 130 through the repeated component processing module 505 to identify multiple repeated components whose number exceeds the repetition threshold within the specified search range, and filter out the repeated components from the layout drawing 130 A pattern of multiple elements.

於一實施例中,重複元件過濾處理包含以各元件為中心向外擴張指定的搜尋半徑作為搜尋範圍。In one embodiment, the repetitive component filtering process includes expanding a specified search radius outward from the center of each component as a search range.

於一實施例中,前述搜尋半徑是基於各元件的邊長與第二比例所決定,如將邊長(如最長邊的邊長)乘上第二比例(可大於1)作為搜尋半徑。In one embodiment, the aforementioned search radius is determined based on the side length of each element and the second ratio, for example, the side length (such as the side length of the longest side) multiplied by the second ratio (which may be greater than 1) is used as the search radius.

步驟S35:控制設備10透過曲折元件過濾模組506對佈局圖130執行曲折元件過濾處理,來從佈局圖130中辨識具有多個角點的元件(曲折元件),並從佈局圖130濾除元件的圖案。Step S35: The control device 10 performs zigzag component filtering processing on the layout diagram 130 through the zigzag component filtering module 506 to identify components with multiple corner points (zigzag components) from the layout diagram 130 and filter out components from the layout diagram 130 picture of.

於一實施例中,曲折元件過濾處理是辨識角點數量大於角點臨界值的元件作為曲折元件。In one embodiment, the meander element filtering process identifies elements whose number of corner points is greater than a corner point threshold as meander elements.

於一實施例中,曲折元件過濾處理是計算個元件的多個角點的數量與多個輪廓點的數量之間的角點-輪廓點比例(即角點占所有邊緣的比例),並將角點-輪廓點比例大於第三比例(可小於1)的元件作為曲折元件。In one embodiment, the zigzag component filtering process is to calculate the corner point-contour point ratio (ie, the ratio of corner points to all edges) between the number of corner points and the number of contour points of a component, and Elements whose corner point-contour point ratio is greater than the third ratio (may be less than 1) are regarded as meander elements.

請一併參閱圖9至圖12,圖9為本發明一實施例的佈局圖的輪廓示意圖,圖10為本發明一實施例的零碎元件過濾處理的處理結果的示意圖,圖11為本發明一實施例的重複元件過濾處理的處理結果的示意圖,圖12為本發明一實施例的曲折元件過濾處理的處理結果的示意圖。Please refer to FIG. 9 to FIG. 12 together. FIG. 9 is a schematic diagram of the layout of an embodiment of the present invention, FIG. 10 is a schematic diagram of the processing result of fragmentary component filtering processing according to an embodiment of the present invention, and FIG. 11 is a schematic diagram of an embodiment of the present invention. A schematic diagram of the processing result of the repetitive component filtering process in an embodiment, and FIG. 12 is a schematic diagram of the processing result of the zigzag component filtering process in an embodiment of the present invention.

如圖9所示,原始未處理的佈局圖70存在大量零碎元件的圖案80,這些零碎元件的圖案80會成為辨識雜訊。As shown in FIG. 9 , there are a large number of patterns 80 of fragmented components in the original unprocessed layout diagram 70 , and these patterns 80 of fragmented components will become identification noise.

如圖10所示,零碎元件過濾處理後獲得的佈局圖71,已經濾除零碎元件的圖案80,但存在大量重複元件的圖案81,這些重複元件的圖案81會降低辨識精確度。As shown in FIG. 10 , the layout diagram 71 obtained after fragmentary element filtering process has filtered fragmentary element patterns 80 , but there are a large number of repetitive element patterns 81 , which will reduce the recognition accuracy.

如圖11所示,重複元件過濾處理後獲得的佈局圖72,已經濾除重複元件的圖案81,但存在少量曲折元件的圖案82,這些曲折元件的圖案82會降低定位精確度。As shown in FIG. 11 , in the layout diagram 72 obtained after filtering the repetitive elements, the pattern 81 of the repetitive element has been filtered out, but there are a small number of patterns 82 of meandering elements, which will reduce the positioning accuracy.

如圖12所示,曲折元件過濾處理後獲得的佈局圖73,已經濾除曲折元件的圖案82,且沒有可能成為雜訊的其他圖案。因此,佈局圖73可直接作為訓練佈局圖,並且,佈局圖73中的影像特徵830-838(包括位置與形狀)可於後續用來辨識目標影像是否屬於相同類型電路板(如具有相同元件排列與線路佈局)。As shown in FIG. 12 , the pattern 82 of the meander element has been filtered out in the layout diagram 73 obtained after the meander element filtering process, and there are no other patterns that may become noise. Therefore, the layout diagram 73 can be directly used as a training layout diagram, and the image features 830-838 (including position and shape) in the layout diagram 73 can be used to identify whether the target image belongs to the same type of circuit board (such as having the same component arrangement) and line layout).

值得一提的是,由於不同類型的電路板通常具有差異極大的元件排列與線路佈局,過濾上述元件的動作並不會造成辨識精確度的下降,反而因為辨識特徵更為明顯,可以提升辨識速度與精確度。It is worth mentioning that since different types of circuit boards usually have very different component arrangements and circuit layouts, the action of filtering the above components will not cause a decrease in the recognition accuracy, but because the recognition features are more obvious, the recognition speed can be improved with precision.

請一併參閱圖9與圖12-14,圖13為本發明一實施例的目標影像的示意圖,圖14為本發明一實施例的另一目標影像的示意圖。如圖12,透過訓練可以獲得標準電路板的影像特徵830-838。Please refer to FIGS. 9 and 12-14 together. FIG. 13 is a schematic diagram of an object image according to an embodiment of the present invention, and FIG. 14 is a schematic diagram of another object image according to an embodiment of the present invention. As shown in FIG. 12 , image features 830 - 838 of standard circuit boards can be obtained through training.

於圖13所示的例子中,於拍攝目標電路板的目標影像後,可對目標影像執行處理,如執行預處理或執行輪廓提取處理來提取多個元件的輪廓,以獲得處理後的目標影像74。In the example shown in FIG. 13, after capturing the target image of the target circuit board, processing can be performed on the target image, such as performing pre-processing or performing contour extraction processing to extract the contours of a plurality of components to obtain a processed target image 74.

於一實施例中,亦可對目標影像74執行簡化處理來降低雜訊成分。In one embodiment, simplification processing may also be performed on the target image 74 to reduce noise components.

接著,控制設備10可將目標影像74的影像特徵740-748與標準電路板的影像特徵830-838執行匹配處理,並發現完全匹配。藉此,控制設備10可判定目標電路板為圖9所示的標準電路板。Next, the control device 10 may perform a matching process on the image features 740-748 of the target image 74 and the image features 830-838 of the standard circuit board, and find a complete match. Thereby, the control device 10 can determine that the target circuit board is the standard circuit board shown in FIG. 9 .

於圖14的例子中,於拍攝另一目標電路板的另一目標影像後,可對另一目標影像執行處理,如執行預處理、輪廓提取處理及/或簡化處理,以獲得處理後的另一目標影像75。In the example of FIG. 14 , after capturing another target image of another target circuit board, processing can be performed on another target image, such as performing preprocessing, contour extraction processing and/or simplification processing, to obtain another processed target image. A target image 75 .

接著,控制設備10可將另一目標影像75的影像特徵(如圖14的多個方塊)與標準電路板的影像特徵830-838執行匹配處理,並發現不匹配。藉此,控制設備10可判定目標電路板不屬於為圖9所示的標準電路板。Next, the control device 10 may perform a matching process on the image features of another target image 75 (such as a plurality of squares in FIG. 14 ) and the image features 830-838 of the standard circuit board, and find a mismatch. Thereby, the control device 10 can determine that the target circuit board does not belong to the standard circuit board shown in FIG. 9 .

請一併參閱圖5及圖7,圖7為本發明一實施例的訓練處理與辨識處理的流程圖。相較於圖5的實施例,本實施例的訓練處理包括步驟S40-S41。Please refer to FIG. 5 and FIG. 7 together. FIG. 7 is a flowchart of training processing and recognition processing according to an embodiment of the present invention. Compared with the embodiment in FIG. 5 , the training process in this embodiment includes steps S40-S41.

步驟S40:控制設備10透過訓練模組507對所輸入的訓練影像(即對應標準電路板的訓練佈局影像)執行訓練邊緣分析以獲得訓練影像的多個訓練元件邊緣特徵。Step S40: The control device 10 performs training edge analysis on the input training image (ie, the training layout image corresponding to the standard circuit board) through the training module 507 to obtain a plurality of training component edge features of the training image.

步驟S41:控制設備10透過訓練模組507基於多個訓練元件邊緣特徵計算標準電路板的多個辨識特徵。Step S41: The control device 10 calculates a plurality of identification features of the standard circuit board based on the edge features of the training components through the training module 507 .

前述基於影像邊緣計算辨識特徵於影像辨識處理領域已有許多現有技術,本發明是將其應用於電路板特徵辨識。There are many existing technologies in the field of image recognition processing for feature recognition based on image edge calculation, and the present invention applies it to circuit board feature recognition.

相較於圖5的實施例,本實施例的辨識處理包括步驟S50-S52。Compared with the embodiment of FIG. 5 , the identification process of this embodiment includes steps S50-S52.

步驟S50:控制設備10透過辨識模組508對目標影像執行目標邊緣分析以獲得目標影像的多個目標元件邊緣特徵。Step S50: The control device 10 performs target edge analysis on the target image through the identification module 508 to obtain a plurality of target component edge features of the target image.

於一實施例中,步驟S40與步驟S50的邊緣分析可包含肯尼演算法(Canny Algorithm)、索貝爾運算子(Sobel Operator)或其他邊緣偵測演算法,訓練邊緣分析與目標邊緣分析可使用相同或不同演算法,不加以限定。In one embodiment, the edge analysis in step S40 and step S50 may include Canny Algorithm, Sobel Operator or other edge detection algorithms, and the training edge analysis and target edge analysis may use The same or different algorithms, without limitation.

步驟S51:控制設備10透過辨識模組508基於目標元件邊緣特徵與各標準電路板的多個辨識特徵計算目標影像對各標準電路板的相似分數。Step S51: The control device 10 calculates the similarity score of the target image to each standard circuit board based on the edge features of the target component and multiple identification features of each standard circuit board through the recognition module 508 .

步驟S52:控制設備10透過辨識模組508基於分數最高的標準電路板決定辨識結果,並基於對應的相似分數來對目標影像的多個元件進行定位。Step S52: The control device 10 determines the recognition result based on the standard circuit board with the highest score through the recognition module 508, and locates the multiple components of the target image based on the corresponding similarity score.

於一實施例中,若最高的相似分數低於預設的分數臨界值時,控制設備10可決定辨識結果為全部不匹配;若最高的相似分數不低於預設的分數臨界值時,控制設備10可設定辨識結果為最高的相似分數所對應的標準電路板。In one embodiment, if the highest similarity score is lower than the preset score critical value, the control device 10 may determine that the identification result is all mismatches; if the highest similarity score is not lower than the preset score critical value, the control device 10 The device 10 can set the identification result to be the standard circuit board corresponding to the highest similarity score.

於一實施例中,當辨識結果為全部不匹配時,由於分數最高的標準電路板與目標電路板20是具有最高的相似度,控制設備10可使用分數最高的標準電路板來對目標影像的多個元件進行定位。In one embodiment, when the identification result is all mismatches, since the standard circuit board with the highest score has the highest similarity with the target circuit board 20, the control device 10 can use the standard circuit board with the highest score to compare the target image. Multiple components are positioned.

於一實施例中,於訓練處理中,控制設備10可對訓練影像(如訓練佈局圖)執行訓練邊緣分析來獲得訓練影像的多個訓練取樣邊緣點(的位置)及各訓練取樣邊緣點的梯度方向與重心(即訓練元件邊緣特徵,為影像特徵),並依據這些訓練取樣邊緣點及預設的邊緣偵測範圍與容許差異範圍來計算多個訓練相似分數(即此種標準電路板的辨識特徵)。In one embodiment, during the training process, the control device 10 may perform training edge analysis on the training image (such as a training layout map) to obtain a plurality of training sample edge points (positions) of the training image and each training sample edge point Gradient direction and center of gravity (that is, the edge feature of the training component, which is an image feature), and based on these training sampling edge points and the preset edge detection range and allowable difference range to calculate multiple training similarity scores (that is, the standard circuit board identifying features).

舉例來說,控制設備10可將各訓練取樣邊緣點擴張前述邊緣偵測範圍,並設定梯度方向的角度的容許差異範圍,並與一假設即時影像的取樣邊緣點與梯度方向進行比較來獲得各訓練取樣邊緣點的距離差異與梯度差異,並作為前述訓練相似分數。For example, the control device 10 can expand the edge detection range of each training sampling edge point, and set the allowable difference range of the angle of the gradient direction, and compare it with the sampling edge point and the gradient direction of a hypothetical real-time image to obtain each The distance difference and gradient difference of the training sampling edge points are used as the aforementioned training similarity score.

並且,於辨識處理中,控制設備10可依序選擇各標準電路板的辨識特徵來執行以下處理。控制設備10可對目標影像執行目標分析來獲得目標影像的多個目標取樣邊緣點(的位置)及各目標取樣邊緣點的梯度方向(即目標元件邊緣特徵,為影像特徵),計算目標取樣邊緣點所對應的預測重心,比較多個訓練相似分數與多個預測重心所對應的多個重心相似分數(對多個重心相似分數執行加總或平均等運算處理即可獲得相似分數),以比較目標影像與標準電路板的影像特徵的相似度。Moreover, in the identification processing, the control device 10 may sequentially select the identification features of each standard circuit board to perform the following processing. The control device 10 can perform target analysis on the target image to obtain multiple target sampling edge points (positions) of the target image and the gradient direction of each target sampling edge point (that is, the edge feature of the target element, which is an image feature), and calculate the target sampling edge The predicted center of gravity corresponding to the point, compare multiple training similarity scores with multiple predicted gravity similarity scores corresponding to multiple predicted centers of gravity (similarity scores can be obtained by summing or averaging multiple similar scores for multiple centers of gravity), to compare The similarity of the target image to the image characteristics of the standard board.

並且,控制設備10可進一步以分數高於分數臨界值的預測重心作為對應訓練影像的重心,藉此達成目標影像與訓練影像之間的多個影像特徵的比對、匹配與定位。Moreover, the control device 10 may further use the predicted center of gravity whose score is higher than the score threshold as the center of gravity of the corresponding training image, thereby achieving comparison, matching and positioning of multiple image features between the target image and the training image.

於一實施例中,控制設備10可基於多個目標取樣邊緣點與其梯度方向(可進一步參考梯度方向的角度的容許差異範圍)篩選出部分的目標取樣邊緣點,並計算這些目標取樣邊緣點的預測重心。In an embodiment, the control device 10 can filter out some target sampling edge points based on a plurality of target sampling edge points and their gradient directions (the allowable difference range of the angle of the gradient direction can be further referred to), and calculate the Predict the center of gravity.

以上所述僅為本發明之較佳具體實例,非因此即侷限本發明之申請專利範圍,故舉凡運用本發明內容所為之等效變化,均同理皆包含於本發明之範圍內,合予陳明。The above descriptions are only preferred specific examples of the present invention, and are not intended to limit the patent scope of the present invention. Therefore, all equivalent changes made by using the content of the present invention are all included in the scope of the present invention in the same way. Chen Ming.

10:控制設備10: Control equipment

11:影像擷取設備11: Image capture device

12:抓取設備12: Grabbing equipment

13:儲存設備13: Storage equipment

130:佈局圖130: Layout diagram

131:訓練模型131:Training model

132:電腦程式132: Computer program

20:目標電路板20: Target board

30:加工設備30: Processing equipment

31:人機介面31: Man-machine interface

32:通訊介面32: Communication interface

40:運算平台40:Computing platform

500:拍攝控制模組500: Shooting control module

501:簡化模組501: Simplify the module

502:預處理模組502: Preprocessing module

503:輪廓提取模組503:Contour extraction module

504:零碎元件過濾模組504: Fragmentary component filter module

505:重複元件過濾模組505: Duplicate component filter module

506:曲折元件過濾模組506: Zigzag element filter module

507:訓練模組507:Training module

508:辨識模組508: Identification module

509:抓取控制模組509: Grabbing Control Module

510:加工控制模組510: Processing control module

60:吸取與驅動設備60: Suction and drive equipment

61:電路板運輸設備61: Circuit board transportation equipment

62、62’:位置62, 62': position

70-73:佈局圖70-73: layout diagram

74、75:目標影像74, 75: target image

740-748、830-838:影像特徵740-748, 830-838: image characteristics

80-82:圖案80-82: pattern

S10-S11:訓練步驟S10-S11: training steps

S20-S24:抓取步驟S20-S24: grabbing steps

S30-S35:簡化步驟S30-S35: simplified steps

S40-S41:訓練處理步驟S40-S41: training processing steps

S50-S52:辨識處理步驟S50-S52: Identification processing steps

圖1為本發明一實施例的自動辨識系統的架構圖。FIG. 1 is a structural diagram of an automatic identification system according to an embodiment of the present invention.

圖2為本發明一實施例的自動辨識系統的架構圖。FIG. 2 is a structural diagram of an automatic identification system according to an embodiment of the present invention.

圖3為本發明一實施例的控制設備的架構圖。FIG. 3 is a structural diagram of a control device according to an embodiment of the present invention.

圖4為本發明一實施例的自動辨識的資料流的示意圖。FIG. 4 is a schematic diagram of an automatically identified data flow according to an embodiment of the present invention.

圖5為本發明一實施例的自動辨識方法的流程圖。FIG. 5 is a flowchart of an automatic identification method according to an embodiment of the present invention.

圖6為本發明一實施例的簡化處理的流程圖。Figure 6 is a flowchart of a simplified process according to one embodiment of the present invention.

圖7為本發明一實施例的訓練處理與辨識處理的流程圖。FIG. 7 is a flowchart of training processing and recognition processing according to an embodiment of the present invention.

圖8為本發明一實施例的夾取電路板的示意圖。FIG. 8 is a schematic diagram of clamping a circuit board according to an embodiment of the present invention.

圖9為本發明一實施例的佈局圖的輪廓示意圖。FIG. 9 is a schematic outline diagram of a layout diagram of an embodiment of the present invention.

圖10為本發明一實施例的零碎元件過濾處理的處理結果的示意圖。FIG. 10 is a schematic diagram of processing results of fragmentary component filtering processing according to an embodiment of the present invention.

圖11為本發明一實施例的重複元件過濾處理的處理結果的示意圖。FIG. 11 is a schematic diagram of processing results of repeated element filtering processing according to an embodiment of the present invention.

圖12為本發明一實施例的曲折元件過濾處理的處理結果的示意圖。FIG. 12 is a schematic diagram of processing results of meander element filtering processing according to an embodiment of the present invention.

圖13為本發明一實施例的目標影像的示意圖。FIG. 13 is a schematic diagram of an object image according to an embodiment of the present invention.

圖14為本發明一實施例的另一目標影像的示意圖。FIG. 14 is a schematic diagram of another target image according to an embodiment of the present invention.

S10-S11:訓練步驟 S10-S11: training steps

S20-S24:抓取步驟 S20-S24: grabbing steps

Claims (14)

一種電路板抓取位置的自動辨識方法,包括: a) 取得不同類型的多個標準電路板的多個佈局圖,並對各該標準電路板的該佈局圖執行一簡化處理,來獲得剔除辨識雜訊的一訓練佈局圖; b) 基於各該訓練佈局圖對一訓練模型執行一訓練處理來使該訓練模型具備辨識不同類型的該多個標準電路板的能力,其中各該訓練佈局圖設定有一抓取位置; c) 輸入一目標電路板的一目標影像至該訓練模型來對該目標影像執行一辨識處理;及 d) 於辨識該目標影像符合任一該標準電路板時,對該目標影像執行一匹配處理來基於符合的該標準電路板的該訓練佈局圖的該抓取位置決定該目標影像的一抓取位置; 其中,該辨識處理包括: e1) 對該目標影像執行一目標邊緣分析以獲得該目標影像的多個目標元件邊緣特徵; e2) 基於該多個目標元件邊緣特徵與各該標準電路板的多個辨識特徵計算該目標影像對各該標準電路板的一相似分數;及 e3) 基於分數最高的該標準電路板決定一辨識結果。 An automatic identification method for a circuit board grasping position, comprising: a) obtaining a plurality of layout diagrams of a plurality of standard circuit boards of different types, and performing a simplification process on the layout diagrams of each of the standard circuit boards, to obtain a training layout diagram for eliminating identification noise; b) performing a training process on a training model based on each of the training layout diagrams to enable the training model to have the ability to identify different types of the plurality of standard circuit boards, wherein each of the training layout diagrams is set with a grasping position; c) inputting a target image of a target circuit board into the training model to perform a recognition process on the target image; and d) when identifying that the target image matches any of the standard circuit boards, performing a matching process on the target image to determine a capture of the target image based on the capture position of the training layout diagram of the standard circuit board that matches Location; Among them, the identification process includes: e1) performing a target edge analysis on the target image to obtain a plurality of target component edge features of the target image; e2) calculating a similarity score of the target image to each of the standard circuit boards based on the plurality of target component edge features and the plurality of identification features of each of the standard circuit boards; and e3) Determine an identification result based on the standard circuit board with the highest score. 如請求項1所述之電路板抓取位置的自動辨識方法,其中該簡化處理包括一步驟f1) 對該佈局圖執行一輪廓提取處理來於該佈局圖中辨識該目標電路板的多個元件的輪廓。The method for automatically identifying the picking position of a circuit board as described in Claim 1, wherein the simplified process includes a step f1) performing a contour extraction process on the layout to identify a plurality of components of the target circuit board in the layout Outline. 如請求項2所述之電路板抓取位置的自動辨識方法,其中該簡化處理包括以下步驟的至少其中之一: f2) 對該佈局圖執行一零碎元件過濾處理,來從該佈局圖濾除面積小於一零碎臨界值的該元件; f3) 對該佈局圖執行一重複元件過濾處理,來辨識一搜尋範圍內數量超過一重複臨界值的重複的該多個元件,並從該佈局圖濾除重複的該多個元件;及 f4) 對該佈局圖執行一曲折元件過濾處理,來辨識具有多個角點的該元件,並從該佈局圖濾除該元件。 The automatic identification method of the circuit board grasping position as described in claim 2, wherein the simplified process includes at least one of the following steps: f2) performing a fragment filtering process on the layout to filter out the components from the layout having an area smaller than a fragment threshold; f3) performing a duplicate component filtering process on the layout diagram to identify duplicate components within a search range whose number exceeds a duplicate threshold, and filter out the duplicate components from the layout diagram; and f4) performing a zigzag component filtering process on the layout graph to identify the component with multiple corners, and filter the component from the layout graph. 如請求項3所述之電路板抓取位置的自動辨識方法,其中該零碎臨界值是基於該目標電路板的銅箔面積與一第一比例所決定; 其中,該重複元件過濾處理包括以各該元件為中心向外擴張一搜尋半徑作為該搜尋範圍,該搜尋半徑是基於各該元件的一邊長與一第二比例所決定; 其中,該曲折元件過濾處理是過濾角點數量大於一角點臨界值或該多個角點的數量與多個輪廓點的數量之間的一角點-輪廓點比例大於一第三比例的該元件。 The method for automatically identifying the grab position of the circuit board as described in claim 3, wherein the fragmentation threshold is determined based on the copper foil area of the target circuit board and a first ratio; Wherein, the repeated component filtering process includes expanding a search radius outward from the center of each component as the search range, and the search radius is determined based on a side length of each component and a second ratio; Wherein, the zigzag element filtering process is to filter the element whose number of corner points is larger than a corner point threshold or a corner-to-contour point ratio between the number of corner points and the number of contour points is greater than a third ratio. 如請求項1所述之電路板抓取位置的自動辨識方法,其中該訓練處理包括: g1) 對該訓練佈局圖執行一訓練邊緣分析以獲得該訓練佈局圖的多個訓練元件邊緣特徵;及 g2) 基於該多個訓練元件邊緣特徵計算該標準電路板的該多個辨識特徵。 The method for automatic identification of the grasping position of the circuit board as described in claim 1, wherein the training process includes: g1) performing a training edge analysis on the training layout to obtain training element edge features of the training layout; and g2) Calculating the identification features of the standard circuit board based on the edge features of the training components. 如請求項5所述之電路板抓取位置的自動辨識方法,其中該訓練處理更包括: h1) 執行該訓練邊緣分析來獲得該訓練佈局圖的多個訓練取樣邊緣點的位置、梯度方向與重心,以作為該多個訓練元件邊緣特徵;及 h2) 基於該多個訓練取樣邊緣點、一邊緣偵測範圍及一容許差異範圍來計算多個訓練相似分數,作為該多個辨識特徵。 The automatic identification method for the grasping position of the circuit board as described in claim 5, wherein the training process further includes: h1) performing the training edge analysis to obtain the positions, gradient directions, and centers of gravity of a plurality of training sampling edge points of the training layout graph as edge features of the plurality of training elements; and h2) Calculate a plurality of training similarity scores based on the plurality of training sample edge points, an edge detection range and an allowable difference range, as the plurality of identification features. 如請求項1所述之電路板抓取位置的自動辨識方法,其中該辨識處理更包括: e4) 以最高的該標準電路板的該相似分數來對該目標影像的多個元件進行定位。 The automatic identification method for the grasping position of the circuit board as described in claim 1, wherein the identification process further includes: e4) Locating the components of the target image with the highest similarity score of the standard circuit board. 如請求項7所述之電路板抓取位置的自動辨識方法,其中該辨識處理更包括: i1) 執行該目標邊緣分析來獲得該目標影像的多個目標取樣邊緣點及各該目標取樣邊緣點的梯度方向,以作為該多個目標元件邊緣特徵;及 i2) 基於各該目標取樣邊緣點的位置與梯度方向計算各該目標取樣邊緣點的一預測重心,比較多個訓練相似分數與該多個預測重心所對應的多個重心相似分數,並基於該多個重心相似分數決定該標準電路板的該相似分數。 The automatic identification method for the grasping position of the circuit board as described in claim item 7, wherein the identification processing further includes: i1) performing the target edge analysis to obtain a plurality of target sampling edge points of the target image and a gradient direction of each of the target sampling edge points as edge features of the plurality of target components; and i2) Calculate a predicted center of gravity of each target sampling edge point based on the position and gradient direction of each of the target sampling edge points, compare multiple training similarity scores with multiple center of gravity similarity scores corresponding to the multiple predicted centers of gravity, and based on the Center of gravity similarity scores determine the similarity score for the standard circuit board. 一種電路板抓取位置的自動辨識系統,包括: 一影像擷取設備,用以拍攝一目標電路板來獲得一目標影像; 一抓取設備,用以抓取電路板;及 一控制設備,連接該影像擷取設備及該抓取設備,包括: 一簡化模組,被設定來對一標準電路板的一佈局圖執行一簡化處理,來獲得剔除辨識雜訊以獲得一訓練佈局圖; 一訓練模組,被設定來輸入該訓練佈局圖至一訓練模型來使該訓練模型具備辨識相同類型電路板的能力,其中該訓練佈局圖上設定有一抓取位置; 一辨識模組,輸入該目標影像至該訓練模型以執行辨識,於辨識該目標影像為該標準電路板時,對該目標影像執行一匹配處理來基於符合的該標準電路板的該訓練佈局圖的該抓取位置決定該目標影像的一抓取位置; 其中,該控制設備被設定來基於該目標影像的該抓取位置控制該抓取設備抓取該目標電路板。 An automatic identification system for a circuit board grasping position, comprising: An image capture device, used to photograph a target circuit board to obtain a target image; a gripping device for gripping circuit boards; and A control device, connected to the image capture device and the capture device, including: a simplification module configured to perform a simplification process on a layout diagram of a standard circuit board to obtain a training layout diagram by removing identification noise; A training module, which is set to input the training layout to a training model so that the training model has the ability to identify the same type of circuit board, wherein a grasping position is set on the training layout; A recognition module that inputs the target image to the training model to perform recognition, and when recognizing the target image as the standard circuit board, performs a matching process on the target image based on the training layout diagram of the standard circuit board The capture position of determines a capture position of the target image; Wherein, the control device is configured to control the grabbing device to grab the target circuit board based on the grabbing position of the target image. 如請求項9所述之電路板抓取位置的自動辨識系統,其中該控制設備更包括: 一輪廓提取模組,被設定來於該佈局圖中辨識該目標電路板的多個元件的輪廓;及 一零碎元件過濾模組,被設定來從該佈局圖濾除面積小於一零碎臨界值的該元件,其中該零碎臨界值是基於該目標電路板的銅箔面積與一第一比例所決定。 The automatic identification system for the grasping position of the circuit board as described in claim 9, wherein the control device further includes: an outline extraction module configured to identify outlines of components of the target circuit board in the layout; and an odds and ends filter module configured to filter out the components from the layout with an area smaller than an odds and ends threshold, wherein the odds and ends threshold is determined based on a first ratio of copper foil area of the target circuit board . 如請求項9所述之電路板抓取位置的自動辨識系統,其中該控制設備更包括: 一輪廓提取模組,被設定來於該佈局圖中辨識該目標電路板的多個元件的輪廓;及 一重複元件過濾模組,被設定來於該佈局圖中辨識一搜尋範圍內數量超過一重複臨界值的重複的該多個元件,並從該佈局圖濾除重複的該多個元件; 其中,該重複元件過濾模組更被設定來以各該元件為中心向外擴張一搜尋半徑作為該搜尋範圍,該搜尋半徑是基於各該元件的一邊長與一第二比例所決定。 The automatic identification system for the grasping position of the circuit board as described in claim 9, wherein the control device further includes: an outline extraction module configured to identify outlines of components of the target circuit board in the layout; and a duplicate component filtering module configured to identify duplicate components within a search range exceeding a duplicate threshold in the layout, and filter out the duplicate components from the layout; Wherein, the repeated component filtering module is further set to expand a search radius outward from the center of each component as the search range, and the search radius is determined based on a side length of each component and a second ratio. 如請求項9所述之電路板抓取位置的自動辨識系統,其中該控制設備更包括: 一輪廓提取模組,被設定來於該佈局圖中辨識該目標電路板的多個元件的輪廓;及 一曲折元件過濾模組,被設定來於佈局圖中辨識具有多個角點的該元件,並從該佈局圖濾除該元件; 其中,該曲折元件過濾模組更被設定來過濾角點數量大於一角點臨界值或該多個角點的數量與多個輪廓點的數量之間的一角點-輪廓點比例大於一第三比例的該元件。 The automatic identification system for the grasping position of the circuit board as described in claim 9, wherein the control device further includes: an outline extraction module configured to identify outlines of components of the target circuit board in the layout; and a zigzag component filtering module configured to identify the component with multiple corners in the layout and filter the component from the layout; Wherein, the zigzag element filtering module is further set to filter the number of corner points greater than a corner point threshold or a corner point-contour point ratio between the number of corner points and the number of contour points is greater than a third ratio of the component. 如請求項9所述之電路板抓取位置的自動辨識系統,其中該訓練模組更被設定來對該訓練佈局圖執行一訓練邊緣分析以獲得該訓練佈局圖的多個訓練元件邊緣特徵,並基於該多個訓練元件邊緣特徵計算多個辨識特徵。The automatic recognition system of the circuit board picking position as described in claim 9, wherein the training module is further configured to perform a training edge analysis on the training layout to obtain a plurality of training component edge features of the training layout, and calculating a plurality of identification features based on the plurality of edge features of the training elements. 如請求項9所述之電路板抓取位置的自動辨識系統,其中該辨識模組更被設定來對該目標影像執行邊緣分析以獲得該目標影像的多個目標元件邊緣特徵,基於該多個目標元件邊緣特徵與各該標準電路板的多個辨識特徵計算該目標影像對各該標準電路板的一相似分數,基於分數最高的該標準電路板決定一辨識結果,並以對應的該相似分數來對該目標影像的多個元件進行定位。The automatic identification system for the grasping position of the circuit board as described in claim 9, wherein the identification module is further configured to perform edge analysis on the target image to obtain multiple target component edge features of the target image, based on the multiple Compute a similarity score of the target image to each of the standard circuit boards based on the edge features of the target component and multiple identification features of each of the standard circuit boards, determine an identification result based on the standard circuit board with the highest score, and use the corresponding similarity score to locate multiple elements of the target image.
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