TW202310695A - Circuit board and manufacturing method thereof and electronic device - Google Patents

Abstract

A circuit board includes a first substrate, a second substrate, a third substrate, a plurality of conductive structures and a conductive through hole structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate has an opening and includes a first dielectric layer, a second dielectric layer and a third dielectric layer. The opening penetrates the first dielectric layer and the second dielectric layer, and the third dielectric layer fills the opening. The conductive through hole structure penetrates the first substrate, the second substrate, the third dielectric layer of the third substrate, and is electrically connected to the first substrate and the third substrate to define a signal path. The first substrate, the second substrate and the third substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.

Description

Circuit board, manufacturing method thereof, and electronic device

The present invention relates to a substrate structure and its manufacturing method, and in particular to a circuit board, its manufacturing method and an electronic device using the circuit board.

In the existing circuit board, the design of the coaxial via (coaxial via) requires one or more insulating layers between the inner conductor layer and the outer conductor layer for insulation, and the way to form the insulating layer is through lamination. way to achieve. Therefore, there will be impedance mismatch at both ends of the coaxial via and electromagnetic interference (EMI) shielding gaps will appear, thereby affecting the integrity of high-frequency signals. In addition, in the coaxial through-hole design, the two ends of the signal path and the two ends of the ground path are located on different planes, and noise interference cannot be reduced.

The invention provides a circuit board with good signal loop and better signal integrity.

The present invention also provides a method for manufacturing a circuit board, which is used to manufacture the above circuit board.

The present invention further provides an electronic device, which includes the above-mentioned circuit board, which has better electromagnetic interference (EMI) shielding and impedance matching effects, and can improve the reliability of signal transmission.

The circuit board of the present invention includes a first base material, a second base material, a third base material, a plurality of conductive structures and a via hole structure. The second base material is disposed between the first base material and the third base material. The third substrate has an opening and includes a first dielectric layer, a second dielectric layer and a third dielectric layer. The opening penetrates the first dielectric layer and the second dielectric layer, and the third dielectric layer fills the opening. The via hole structure penetrates through the first substrate, the second substrate, and the third dielectric layer of the third substrate, and electrically connects the first substrate and the third substrate to define a signal path. The first substrate, the second substrate and the third substrate are electrically connected through the conductive structure to define a ground path, wherein the ground path surrounds the signal path.

In an embodiment of the present invention, the above-mentioned conductive structure includes a plurality of first via holes, a plurality of conductive pillars, and a conductive connection layer. The first substrate includes a core layer, a first outer circuit layer, a first circuit layer and first via holes. The first external circuit layer and the first circuit layer are respectively arranged on opposite sides of the core layer. The first via hole penetrates through the core layer and electrically connects the first outer circuit layer and the first circuit layer. The second substrate includes a base and conductive pillars penetrating through the base. The third substrate further includes a second circuit layer, a third circuit layer, a second outer circuit layer, a plurality of second via holes and a conductive connection layer. The second circuit layer and the third circuit layer are located on opposite sides of the first dielectric layer, and the second dielectric layer covers the third circuit layer and is located between the third circuit layer and the second outer circuit layer. The second via hole penetrates through the second dielectric layer and electrically connects the second outer circuit layer and the third circuit layer. The conductive connection layer covers the inner wall of the opening and connects the second circuit layer, the third circuit layer and the second outer circuit layer. The via hole structure includes a through hole and a conductive material. The through hole runs through the core layer of the first substrate, the base of the second substrate, and the third dielectric layer of the third substrate. The conductive material covers the inner wall of the through hole and electrically connects the first outer circuit layer and the second outer circuit layer.

In an embodiment of the present invention, the above-mentioned first external circuit layer includes a first signal circuit and a first ground circuit. The second outer circuit layer includes a second signal circuit and a second ground circuit. The first signal line, the conductive material and the second signal line define a signal path. The first ground circuit, the first via hole, the first circuit layer, the conductive column, the second circuit layer, the conductive connection layer and the second ground circuit define a ground path.

In an embodiment of the present invention, the above circuit board further includes a fourth dielectric layer filling the through hole. A first surface and a second surface of the fourth dielectric layer opposite to each other are respectively aligned with an upper surface of the first outer circuit layer and a lower surface of the second outer circuit layer.

In an embodiment of the present invention, the above-mentioned circuit board further includes a cover layer disposed on the upper surface of the first external circuit layer, the lower surface of the second external circuit layer, and the first surface and the fourth dielectric layer. on the second surface.

The manufacturing method of the circuit board of the present invention comprises the following steps. A first base material, a second base material and a third base material are provided. The third substrate has an opening and includes a first dielectric layer, a second dielectric layer and a third dielectric layer. The opening penetrates the first dielectric layer and the second dielectric layer, and the third dielectric layer fills the opening. Pressing the first base material, the second base material and the third base material, so that the second base material is located between the first base material and the third base material. A plurality of conductive structures are formed so that the first base material, the second base material and the third base material are electrically connected through the conductive structures to define a grounding path. A via hole structure is formed to penetrate through the third dielectric layer of the first substrate, the second substrate and the third substrate. The via hole structure electrically connects the first substrate and the third substrate to define a signal path, and the ground path surrounds the signal path.

In an embodiment of the present invention, the step of providing the first substrate, the second substrate and the third substrate includes providing the first substrate. The first base material includes a core layer, a first conductive layer, and a first circuit layer. The first conductive layer and the first circuit layer are respectively arranged on opposite sides of the core layer. A second substrate is provided. The second substrate includes a base and a plurality of conductive pillars penetrating the base. A third substrate is provided. The third substrate further includes a second circuit layer, a third circuit layer, a second conductive layer and a conductive connection layer. The second circuit layer and the third circuit layer are located on opposite sides of the first dielectric layer. The second dielectric layer covers the third circuit layer and is located between the third circuit layer and the second conductive layer. The conductive connection layer covers the inner wall of the opening and connects the second circuit layer, the third circuit layer and the second conductive layer.

In an embodiment of the present invention, the above-mentioned conductive structure includes a plurality of first via holes, a conductive column, and a conductive connection layer.

In an embodiment of the present invention, the step of forming the first via hole and the via hole structure of the conductive structure includes: forming a plurality of first blind holes, a plurality of second blind holes and a through hole. The first blind hole extends from the first conductive layer to the first circuit layer, and the second blind hole extends from the second conductive layer to the third circuit layer. The through hole runs through the core layer of the first substrate, the base of the second substrate and the third dielectric layer of the third substrate. A conductive material layer is formed to fill the first blind hole and the second blind hole and extend to cover the first conductive layer, the second conductive layer and the inner wall of the through hole. The conductive material layer filling the first blind hole defines a first via hole. The conductive material layer filling the second blind holes defines a plurality of second via holes. patterning the conductive material layer, the first conductive layer and the second conductive layer to form a first external circuit layer, a second external circuit layer and the inner wall covering the through hole and electrically connecting the first external circuit layer and the second external circuit layer A conductive material for the outer circuit layer. The first outer circuit layer is located on the core layer of the first base material. The second outer circuit layer is located on the second dielectric layer of the third substrate. The via hole and the conductive material define the via structure.

In an embodiment of the present invention, the above-mentioned first external circuit layer includes a first signal circuit and a first ground circuit. The second outer circuit layer includes a second signal circuit and a second ground circuit. The first signal line, the conductive material and the second signal line define a signal path. The first ground circuit, the first via hole, the first circuit layer, the conductive column, the second circuit layer, the conductive connection layer and the second ground circuit define a ground path.

In one embodiment of the present invention, the above-mentioned circuit board manufacturing method further includes filling a fourth dielectric layer after forming the conductive material layer and before patterning the conductive material layer, the first conductive layer and the second conductive layer in the through hole. The fourth dielectric layer fills the through hole, and a first surface and a second surface of the fourth dielectric layer opposite to each other are respectively aligned with an upper surface and a lower surface of the conductive material layer.

In an embodiment of the present invention, the above-mentioned circuit board manufacturing method further includes forming A metal layer is on the conductive material layer. The metal layer covers the upper surface and the lower surface of the conductive material layer and the first surface and the second surface of the fourth dielectric layer. When patterning the conductive material layer, the first conductive layer and the second conductive layer, the metal layer is patterned at the same time, and a cover layer is formed at the same time. The cover layer covers the first surface and the second surface of the first external circuit layer, the second external circuit layer and the fourth dielectric layer.

The electronic device of the present invention includes a circuit board and an electronic component. The circuit board includes a first base material, a second base material, a third base material, a plurality of conductive structures and a via hole structure. The second base material is disposed between the first base material and the third base material. The third substrate has an opening and includes a first dielectric layer, a second dielectric layer and a third dielectric layer. The opening penetrates the first dielectric layer and the second dielectric layer, and the third dielectric layer fills the opening. The via hole structure penetrates through the first substrate, the second substrate, and the third dielectric layer of the third substrate, and electrically connects the first substrate and the third substrate to define a signal path. The first substrate, the second substrate and the third substrate are electrically connected through the conductive structure to define a ground path, wherein the ground path surrounds the signal path. The electronic components are electrically connected to the circuit board.

In an embodiment of the present invention, the above-mentioned electronic device further includes a plurality of connectors disposed between the third base material of the circuit board and the electronic components. The electronic components are electrically connected with the circuit board through the connector.

Based on the above, in the design of the circuit board of the present invention, the via hole structure penetrates through the third dielectric layer of the first substrate, the second substrate and the third substrate, and electrically connects the first substrate and the third substrate. The signal path is defined by the material, and the first base material, the second base material and the third base material are electrically connected through the conductive structure to define a ground path, wherein the ground path surrounds the signal path. In this way, a good high-frequency and high-speed signal loop can be formed, and the subsequent application of integrated circuits and antennas can also solve the problem of signal interference on the same plane, which can reduce signal energy loss and noise interference, thereby improving the signal transmission reliability.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

1A to 1E are schematic cross-sectional views of a manufacturing method of a circuit board according to an embodiment of the present invention. FIG. 1F is a schematic top view of the circuit board of FIG. 1E . Regarding the manufacturing method of the circuit board of this embodiment, firstly, referring to FIG. 1A , a first base material 110 , a second base material 120 and a third base material 130 are provided.

In detail, in this embodiment, the first substrate 110 includes a core layer 112 , a first conductive layer 114 and a first circuit layer 116 . The first conductive layer 114 and the first circuit layer 116 are respectively disposed on opposite sides of the core layer 112, wherein the first conductive layer 114 is not patterned and completely covers one side surface of the core layer 112, while the first circuit layer 116 is exposed. part of the other side surface of the core layer 112. Here, the material of the core layer 112 is, for example, a dielectric material, wherein the dielectric constant (Dielectric Constant, Dk) of the core layer 112 is, for example, between 2 and 3.5, and the dielectric loss (Dissipation Factor, Dk) of the core layer 112 is, for example, Df) is, for example, less than 0.006, and the material of the first conductive layer 114 and the first circuit layer 116 is, for example, copper, but not limited thereto.

The second substrate 120 includes a base 122 and a plurality of conductive pillars 124 penetrating through the base 122 . The step of providing the second substrate 120 includes firstly providing the substrate 122, wherein the substrate 122 is in a B-stage state at this time, ie has not been fully cured. Then, a release film can be pasted on opposite sides of the base 122 , wherein the material of the release film is polyester polymer (PET). Afterwards, a drilling procedure is performed on the substrate 122 to form through holes, wherein the drilling procedure is, for example, laser drilling or mechanical drilling, but not limited thereto. Finally, the conductive glue is filled in the through hole by printing or injection to form the conductive column 124 . Afterwards, the release film attached to the opposite sides of the base 122 is removed, so that the opposite two surfaces of the conductive pillars 124 respectively protrude from the two opposite surfaces of the base 122 , and the fabrication of the second base material 120 is completed.

The third substrate 130 has an opening 137 and includes a first dielectric layer 131, a second dielectric layer 133, a third dielectric layer 135, a second circuit layer 132, a third circuit layer 134, A second conductive layer 136 and a conductive connection layer 138 . The second circuit layer 132 and the third circuit layer 134 of the third substrate 130 are located on opposite sides of the first dielectric layer 131 . The second dielectric layer 133 covers the third circuit layer 134 and is located between the third circuit layer 134 and the second conductive layer 136 . The opening 137 runs through the first dielectric layer 131 and the second dielectric layer 133 , and the third dielectric layer 135 fills the opening 137 . The conductive connection layer 138 covers the inner wall of the opening 137 and connects the second circuit layer 132 , the third circuit layer 134 and the second conductive layer 136 . Here, the dielectric constant (Dk) of the first dielectric layer 131 is, for example, between 2.4 and 4.0, and the dielectric loss (Df) of the first dielectric layer 131 is, for example, less than 0.02. The dielectric constant (Dk) of the second dielectric layer 133 is, for example, between 2.0 and 3.5, and the dielectric loss (Df) of the second dielectric layer 133 is, for example, less than 0.008. The dielectric constant (Dk) of the third dielectric layer 135 is, for example, between 2.1 and 5.0, and the dielectric loss (Df) of the third dielectric layer 135 is, for example, less than 0.025.

Further, the step of providing the third substrate 130 includes firstly providing the first dielectric layer 131 and two conductive layers disposed on opposite sides of the first dielectric layer 131, wherein the two conductive layers completely cover the first dielectric layer 131 opposite sides of the . Next, a patterning process is performed on the two conductive layers to form the second wiring layer 132 and the third wiring layer 134 . Next, provide the second dielectric layer 133 and the second conductive layer 136 disposed on the second dielectric layer 133, and press the second dielectric layer 133 on the third circuit layer 134, so that the second dielectric layer 133 The layer 133 is located between the third circuit layer 134 and the second conductive layer 136 . At this time, the second conductive layer 136 is not patterned, and completely covers the side of the second dielectric layer 133 that is far away from the first dielectric layer 131 . Next, an opening 137 is formed to penetrate through the second circuit layer 132 , the first dielectric layer 131 , the third circuit layer 134 , the second dielectric layer 133 and the second conductive layer 136 . After that, a conductive connection layer 138 is formed on the inner wall of the opening 137 , wherein the conductive connection layer 138 is electrically connected to the second circuit layer 132 , the third circuit layer 134 and the second conductive layer 136 . Finally, a plugging process is performed to fill the third dielectric layer 135 in the opening 137 , wherein the third dielectric layer 135 fills the opening 137 , and the fabrication of the third substrate 130 is completed.

Next, referring to FIG. 1B , the first base material 110 , the second base material 120 and the third base material 130 are pressed together so that the second base material 120 is located between the first base material 110 and the third base material 130 . Here, due to the thermocompression bonding process, the base 122 of the second base material 120 at this time will change from the original B-stage state to a C-stage state, which means it will be in a fully cured state, so that the first base material 110 is connected to the third substrate 130 and fixed on the second substrate 120 . The conductive posts 124 of the second substrate 120 are deformed due to contacting the first circuit layer 116 and the second circuit layer 132 , and the conductive posts 124 are electrically connected to the first circuit layer 116 of the first substrate 110 and the third substrate. 130 of the second circuit layer 132 .

Next, referring to FIG. 1C , a plurality of first blind holes H1 , a plurality of second blind holes H2 and a through hole T are formed. The first blind hole H1 extends from the first conductive layer 114 to the first circuit layer 116 , and the second blind hole H2 extends from the second conductive layer 136 to the third circuit layer 134 . The through holes T penetrate through the first conductive layer 114 and the core layer 112 of the first substrate 110 , the base 122 of the second substrate 120 , and the third dielectric layer 135 of the third substrate 130 . Here, the method of forming the first blind hole H1 and the second blind hole H2 is, for example, laser drilling, and the method of forming the through hole T is, for example, mechanical drilling, but not limited thereto.

Afterwards, referring to FIG. 1D , a conductive material layer 140 is formed to fill the first blind hole H1 and the second blind hole H2 and extend to cover the inner walls of the first conductive layer 114 , the second conductive layer 136 and the through hole T. . At this time, the conductive material layer 140 filling the first blind hole H1 defines a plurality of first via holes 118 of the conductive structure. The conductive material layer 140 filling the second blind hole H2 defines a plurality of second via holes 139 of the conductive structure. Here, the method of forming the conductive material layer 140 is, for example, electroless plating or electrolytic plating process, and the conductive material layer 140 is, for example, copper, but not limited thereto.

Finally, please refer to FIG. 1D and FIG. 1E at the same time. Through the lithography process, the conductive material layer 140, the first conductive layer 114 and the second conductive layer 136 are patterned to form a first outer circuit layer C1 and a second outer circuit layer C1. The wiring layer C2 and a conductive material 145 covering the inner wall of the through hole T and electrically connecting the first outer wiring layer C1 and the second outer wiring layer C2 . The first outer circuit layer C1 is located on the core layer 112 of the first substrate 110 . The second outer circuit layer C2 is located on the second dielectric layer 133 of the third substrate 130 . The via hole T and the conductive material 145 define a via hole structure 150 .

Here, the conductive structure (namely, the first via hole 118, the conductive pillar 124, and the conductive connection layer 138) has been formed, so that the first substrate 110, the second substrate 120, and the third substrate 130 are electrically connected through the conductive structure. connected to define a ground path L2. A via hole structure 150 has been formed to penetrate through the first substrate 110, the second substrate 120 and the third dielectric layer 135 of the third substrate 130, wherein the via hole structure 150 electrically connects the first substrate 110 and the third substrate 135. The substrate 130 defines the signal path L1, and the ground path L2 surrounds the signal path L1. Furthermore, the first external circuit layer C1 includes a first signal circuit C11 and a first ground circuit C12. The second outer circuit layer C2 includes a second signal circuit C21 and a second ground circuit C22. The first signal line C11 , the conductive material 145 and the second signal line C21 define a signal path L1 . The first ground line C12 , the first via hole 118 , the first line layer 116 , the conductive column 124 , the second line layer 132 , the conductive connection layer 138 and the second ground line C22 define a ground path L2. So far, the fabrication of the circuit board 100a has been completed.

In terms of structure, please refer to FIG. 1E and FIG. 1F at the same time. The circuit board 100 a includes a first substrate 110 a, a second substrate 120 , a third substrate 130 a, a conductive structure and a via structure 150 . The second base material 120 is disposed between the first base material 110a and the third base material 130a. The third substrate 130 a has an opening 137 and includes a first dielectric layer 131 , a second dielectric layer 133 and a third dielectric layer 135 . The opening 137 runs through the first dielectric layer 131 and the second dielectric layer 133 , and the third dielectric layer 135 fills the opening 137 . The via hole structure 150 penetrates through the first substrate 110a, the second substrate 120, and the third dielectric layer 135 of the third substrate 130a, and electrically connects the first substrate 110a and the third substrate 130a, thereby defining a signal Path L1. The first substrate 110a, the second substrate 120 and the third substrate 130a are electrically connected through the conductive structure to define a ground path L2, wherein the ground path L2 surrounds the signal path L1.

In detail, in this embodiment, the conductive structure includes a first via hole 118 , a conductive pillar 124 and a conductive connection layer 138 . The first substrate 110 a includes a core layer 112 , a first outer circuit layer C1 , a first circuit layer 116 and a first via hole 118 . The first outer circuit layer C1 and the first circuit layer 116 are respectively disposed on opposite sides of the core layer 112 . The first via hole 118 penetrates through the core layer 112 and electrically connects the first outer circuit layer C1 and the first circuit layer 116 . The second substrate 120 includes a base 122 and conductive pillars 124 penetrating through the base 122 . The third substrate 130 a further includes a second circuit layer 132 , a third circuit layer 134 , a second outer circuit layer C2 , a second via hole 139 and a conductive connection layer 138 . The second wiring layer 132 and the third wiring layer 134 are located on opposite sides of the first dielectric layer 131, and the second dielectric layer 133 covers the third wiring layer 134 and is located between the third wiring layer 134 and the second outer wiring layer C2. between. The second via hole 139 penetrates through the second dielectric layer 133 and electrically connects the second outer circuit layer C2 and the third circuit layer 134 . The conductive connection layer 138 covers the inner wall of the opening 137 and connects the second circuit layer 132 , the third circuit layer 134 and the second outer circuit layer C2 . The via hole structure 150 includes a through hole T and a conductive material 145 . The through hole T runs through the core layer 112 of the first substrate 110a, the base 122 of the second substrate 120, and the third dielectric layer 135 of the third substrate 130a. The conductive material 145 covers the inner wall of the through hole T and electrically connects the first outer circuit layer C1 and the second outer circuit layer C2 .

Here, the first external circuit layer C1 includes a first signal circuit C11 and a first ground circuit C12. The second external circuit layer C2 includes a second signal circuit C21 and a second ground circuit C22. The first signal line C11 , the conductive material 145 and the second signal line C21 define a signal path L1 . The first ground line C21 , the first via hole 118 , the first line layer 116 , the conductive column 124 , the second line layer 132 , the conductive connection layer 138 and the second ground line C22 define a ground path L2. Since the signal path L1 is surrounded by the ground path L2 in a closed manner, a good high-frequency and high-speed loop can be formed. Furthermore, the arrangement of the first via hole 118, the conductive column 124 and the conductive connection layer 138 can fill up the shielding gap to form a complete shielding, which means a closed shielding surface without electromagnetic shielding (EMI) The notch section can effectively reduce signal energy loss and reduce noise interference, thereby improving signal transmission reliability and high-frequency signal integrity. In addition, because the first signal line C11 and the first ground line C12 of the first external line layer C1 are located on the same plane, they can have better co-planarity (co-planar) and better flatness, so the subsequent During the packaging operation, the components (such as chips) will not be damaged or damaged, and the product yield and structural reliability can be high.

In short, in this example, the signal path L1 defined by the first signal line C11, the conductive material 145 and the second signal line C21 is formed by the first ground line C12, the first via hole 118, the first line layer 116, the conductive material 145 and the second signal line C21. The ground path L2 defined by the column 124 , the second circuit layer 132 , the conductive connection layer 138 and the second ground circuit C22 surrounds it. That is, the signal path L1 capable of transmitting high-frequency and high-speed signals such as 5G is provided with a well-closed grounding path L2, thereby forming a good high-frequency and high-speed loop, so that the circuit board 100a of this embodiment can have better signal integrity. Here, the high frequency refers to a frequency greater than 1 GHz; and the high speed refers to a data transmission speed greater than 100 Mbps. It is generally known that high-frequency circuits focus on the speed and quality of signal transmission, and the main factors affecting these two are the electrical properties of the transmission material, namely the material permittivity ( Dk ) and dielectric loss ( Df ). By reducing the dielectric constant and dielectric loss of the substrate, the signal delay (Signal Propagation Delay Time) can be effectively shortened, and the signal transmission rate can be increased and the signal transmission loss (Signal Transmission Loss) can be reduced.

Furthermore, the second base material 120 provided in this embodiment is a finished circuit board, while the first base material 110 and the third base material 130 belong to the semi-finished circuit board, and the first base material is bonded together by pressing. 110 , the second substrate 120 and the third substrate 130 are integrated together. Therefore, compared with the build-up method of pressing the insulating layer in the prior art to block the inner conductor layer and the outer conductor layer of the coaxial perforation, the manufacturing method of the circuit board 100a in this embodiment can not only avoid impedance mismatch but also In addition to the problems affecting the integrity of high-frequency signals, it also has the advantages of simple manufacturing process and cost saving. In addition, the first via hole 118 , the conductive pillar 124 , and the second via hole 139 in this embodiment are not located on the same axis, so the problem of poor thermal stress reliability of stacked vias can be improved.

It must be noted here that the following embodiments use the component numbers and part of the content of the previous embodiments, wherein the same numbers are used to denote the same or similar components, and descriptions of the same technical content are omitted. For the description of omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.

2A to 2B are schematic cross-sectional views of partial steps of another circuit board manufacturing method according to another embodiment of the present invention. Please refer to FIG. 1D and FIG. 2A first, the manufacturing method of the circuit board 100b of this embodiment is similar to the manufacturing method of the above-mentioned circuit board 100a, the difference between the two is: after the step of forming the conductive material layer 140 in FIG. Four dielectric layers 160 are in the through hole T. The fourth dielectric layer 160 fills the through hole T, and a first surface 161 and a second surface 163 of the fourth dielectric layer 160 opposite to each other are respectively aligned with an upper surface 141 and a lower surface 143 of the conductive material layer 140 . Here, the dielectric constant (Dk) of the fourth dielectric layer 160 is, for example, between 2.0 and 4.8, and the dielectric loss (Df) of the fourth dielectric layer 160 is, for example, less than 0.021.

After that, please refer to FIG. 2A and FIG. 2B at the same time, through the photolithography process, to pattern the conductive material layer 140, the first conductive layer 114 and the second conductive layer 136, and form the first outer circuit layer C1 and the second outer circuit layer. C2 and the conductive material 145 covering the inner wall of the through hole T and electrically connecting the first outer circuit layer C1 and the second outer circuit layer C2 . The first outer circuit layer C1 is located on the core layer 112 of the first substrate 110 . The second outer circuit layer C2 is located on the second dielectric layer 133 of the third substrate 130 . The via hole T and the conductive material 145 define a via hole structure 150 . So far, the fabrication of the circuit board 100b has been completed.

3A to 3B are schematic cross-sectional views of partial steps of another circuit board manufacturing method according to another embodiment of the present invention. Please refer to FIG. 2A and FIG. 3A first. The manufacturing method of the circuit board 100c of this embodiment is similar to the manufacturing method of the above-mentioned circuit board 100b. The difference between the two is that the fourth dielectric layer 160 is filled in the through hole T in FIG. 2A After the step, referring to FIG. 3A , a metal layer 170 is formed on the conductive material layer 140 . The metal layer 170 covers the upper surface 141 and the lower surface 143 of the conductive material layer 140 and the first surface 161 and the second surface 163 of the fourth dielectric layer 160 . Here, the method of forming the metal layer 170 is, for example, electroless plating or electrolytic plating process, and the metal layer 170 is, for example, copper, but not limited thereto.

After that, please refer to FIG. 3A and FIG. 3B at the same time, through the lithography process, the metal layer 170, the conductive material layer 140, the first conductive layer 114 and the second conductive layer 136 are patterned to form the first outer circuit layer C1 and the second conductive layer. Two outer circuit layers C2 , a conductive material 145 covering the inner wall of the through hole T and electrically connecting the first outer circuit layer C1 and the second outer circuit layer C2 , and a cover layer 175 . The first outer circuit layer C1 is located on the core layer 112 of the first substrate 110 . The second outer circuit layer C2 is located on the second dielectric layer 133 of the third substrate 130 . The via hole T and the conductive material 145 define a via hole structure 150 . The cover layer 175 covers the first outer circuit layer C1 , the second outer circuit layer C2 , and the first surface 161 and the second surface 163 of the fourth dielectric layer 160 . So far, the fabrication of the circuit board 100c has been completed.

FIG. 4 is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention. Please refer to FIG. 4. In this embodiment, the electronic device 10a includes the circuit board 100a shown in FIG. 1E and an electronic component 200, wherein the electronic component 200 is electrically connected to the circuit board 100a, and the electronic component 200 includes multiple pads 210. In addition, the electronic device 10a of this embodiment also includes a plurality of connectors 300 disposed between the second outer circuit layer C2 of the third substrate 130a of the circuit board 100a and the electronic component 200, wherein the electronic component 200 passes through the connector 300 It is electrically connected with the circuit board 100a. Here, the connector 300 is, for example, a solder ball, but not limited thereto. In application, an antenna structure may be provided on the other side of the circuit board 100 a relative to the electronic component 200 , and the antenna structure may be electrically connected to the circuit board 100 a. In the application of integrated circuits and antennas, the circuit board 100a of this embodiment can solve the problem of signal interference on the same plane, reduce signal energy loss and noise interference, and further improve the reliability of signal transmission.

FIG. 5 is a schematic cross-sectional view of an electronic device according to another embodiment of the present invention. Please refer to FIG. 5. In this embodiment, the electronic device 10b includes the circuit board 100b shown in FIG. 2B and an electronic component 200, wherein the electronic component 200 is electrically connected to the circuit board 100b, and the electronic component 200 includes a plurality of pads. 210. In addition, the electronic device 10b of this embodiment also includes a plurality of connectors 300 disposed between the second outer circuit layer C2 of the third substrate 130a of the circuit board 100b and the electronic component 200, wherein the electronic component 200 passes through the connector 300 It is electrically connected with the circuit board 100b. Here, the connector 300 is, for example, a solder ball, but not limited thereto. In application, an antenna structure may be provided on the other side of the circuit board 100b relative to the electronic component 200, and the antenna structure may be electrically connected to the circuit board 100b. In the application of integrated circuits and antennas, the circuit board 100b of this embodiment can solve the problem of signal interference on the same plane, reduce signal energy loss and noise interference, and further improve the reliability of signal transmission.

FIG. 6 is a schematic cross-sectional view of an electronic device according to another embodiment of the present invention. Please refer to FIG. 6. In this embodiment, the electronic device 10c includes the circuit board 100c shown in FIG. 3B and an electronic component 200, wherein the electronic component 200 is electrically connected to the circuit board 100c, and the electronic component 200 includes multiple pads 210. In addition, the electronic device 10c of this embodiment further includes a plurality of connectors 300 disposed between the cover layer 165 of the circuit board 100c and the electronic component 200 , wherein the electronic component 200 is electrically connected to the circuit board 100c through the connectors 300 . Here, the connector 300 is, for example, a solder ball, but not limited thereto. In application, an antenna structure may be provided on the other side of the circuit board 100c relative to the electronic component 200, and the antenna structure may be electrically connected to the circuit board 100c. In the application of integrated circuits and antennas, the circuit board 100c of this embodiment can solve the problem of signal interference on the same plane, reduce signal energy loss and noise interference, and further improve the reliability of signal transmission.

To sum up, in the design of the circuit board of the present invention, the via structure penetrates through the third dielectric layer of the first substrate, the second substrate and the third substrate, and electrically connects the first substrate and the third substrate. The three substrates define a signal path, and the first substrate, the second substrate, and the third substrate are electrically connected through a conductive structure to define a ground path, wherein the ground path surrounds the signal path. In this way, a good high-frequency and high-speed signal loop can be formed, and the subsequent application of integrated circuits and antennas can also solve the problem of signal interference on the same plane, which can reduce signal energy loss and noise interference, thereby improving the signal transmission reliability.

Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention should be defined by the scope of the appended patent application.

10a, 10b, 10c: electronic devices 100a, 100b, 100c: circuit boards 110, 110a: first substrate 112: core layer 114: the first conductive layer 116: The first line layer 118: the first via hole 120: second substrate 122: base 124: Conductive column 130, 130a: the third substrate 131: the first dielectric layer 132: Second line layer 133: second dielectric layer 134: The third line layer 135: The third dielectric layer 136: the second conductive layer 137: opening 138: Conductive connection layer 139: Second via hole 140: conductive material layer 141: upper surface 143: lower surface 145: Conductive material 150: Via hole structure 160: the fourth dielectric layer 161: first surface 163: second surface 170: metal layer 175: cover layer 200: electronic components 210: Pad 300: connector C1: the first external line layer C11: The first signal line C12: The first ground line C2: second external line layer C21: Second signal route C22: Second grounding route L1: signal path L2: Ground path H1: The first blind hole H2: Second blind hole T: through hole

1A to 1E are schematic cross-sectional views of a manufacturing method of a circuit board according to an embodiment of the present invention. FIG. 1F is a schematic top view of the circuit board of FIG. 1E . 2A to 2B are schematic cross-sectional views of partial steps of another circuit board manufacturing method according to another embodiment of the present invention. 3A to 3B are schematic cross-sectional views of partial steps of another circuit board manufacturing method according to another embodiment of the present invention. FIG. 4 is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention. FIG. 5 is a schematic cross-sectional view of an electronic device according to another embodiment of the present invention. FIG. 6 is a schematic cross-sectional view of an electronic device according to another embodiment of the present invention.

100a: circuit board

110a: first substrate

112: core layer

116: The first line layer

118: the first via hole

120: second substrate

122: base

124: Conductive column

130a: third substrate

131: the first dielectric layer

132: Second line layer

133: second dielectric layer

134: The third line layer

135: The third dielectric layer

137: opening

138: Conductive connection layer

139: Second via hole

145: Conductive material

150: Via hole structure

C1: the first external line layer

C11: The first signal line

C12: The first ground line

C2: second external line layer

C21: Second signal route

C22: Second grounding route

L1: signal path

L2: Ground path

T: through hole

Claims (14)

A circuit board, comprising a first base material, a second base material, a third base material, a plurality of conductive structures and a via hole structure, wherein the second substrate is disposed between the first substrate and the third substrate; The third substrate has an opening and includes a first dielectric layer, a second dielectric layer and a third dielectric layer, the opening penetrates the first dielectric layer and the second dielectric layer, and the the third dielectric layer fills the opening; The via hole structure penetrates the first substrate, the second substrate, and the third dielectric layer of the third substrate, and electrically connects the first substrate and the third substrate, thereby defining a signal paths; and The first substrate, the second substrate and the third substrate are electrically connected through the conductive structures to define a ground path, wherein the ground path surrounds the signal path. The circuit board as claimed in item 1, wherein the conductive structures include a plurality of first via holes, a plurality of conductive columns and a conductive connection layer; The first base material includes a core layer, a first outer circuit layer, a first circuit layer and the first via holes, and the first outer circuit layer and the first circuit layer are respectively disposed opposite to the core layer. On both sides, the first via holes penetrate the core layer and electrically connect the first outer circuit layer and the first circuit layer; The second substrate includes a base and the conductive pillars penetrating the base; and The third substrate further includes a second circuit layer, a third circuit layer, a second outer circuit layer, a plurality of second via holes and the conductive connection layer, the second circuit layer and the third circuit layer are located On opposite sides of the first dielectric layer, the second dielectric layer covers the third circuit layer and is located between the third circuit layer and the second outer circuit layer, and the second via holes penetrate the first circuit layer. Two dielectric layers electrically connect the second outer wiring layer and the third wiring layer, and the conductive connection layer covers the inner wall of the opening and connects the second wiring layer, the third wiring layer and the second outer wiring layer line layer; and The via structure includes a through hole and a conductive material, the through hole penetrates through the core layer of the first substrate, the base of the second substrate, the third dielectric layer of the third substrate, and the The conductive material covers the inner wall of the through hole and electrically connects the first outer circuit layer and the second outer circuit layer. The circuit board as claimed in item 2, wherein the first external circuit layer includes a first signal circuit and a first ground circuit, and the second external circuit layer includes a second signal circuit and a second ground circuit, The first signal line, the conductive material and the second signal line define the signal path, the first ground line, the first via holes, the first line layer, the conductive columns, the second line layer , the conductive connection layer and the second ground circuit define the ground path. The circuit board as described in claim 2, further comprising: a fourth dielectric layer, filling the through hole, wherein a first surface and a second surface of the fourth dielectric layer opposite to each other are respectively aligned with an upper surface of the first outer circuit layer and the second The lower surface of the outer wiring layer. The circuit board as described in claim item 4, further comprising: A cover layer is disposed on the upper surface of the first external circuit layer, the lower surface of the second external circuit layer, and the first surface and the second surface of the fourth dielectric layer. A method for manufacturing a circuit board, comprising: A first substrate, a second substrate and a third substrate are provided, wherein the third substrate has an opening and includes a first dielectric layer, a second dielectric layer and a third dielectric layer , the opening penetrates the first dielectric layer and the second dielectric layer, and the third dielectric layer fills the opening; pressing the first substrate, the second substrate and the third substrate so that the second substrate is located between the first substrate and the third substrate; forming a plurality of conductive structures such that the first substrate, the second substrate and the third substrate are electrically connected through the conductive structures to define a ground path; and forming a via hole structure to penetrate through the first substrate, the second substrate and the third dielectric layer of the third substrate, wherein the via hole structure electrically connects the first substrate and the third substrate The base material defines a signal path, and the ground path surrounds the signal path. The method for making a circuit board as claimed in item 6, wherein the step of providing the first base material, the second base material and the third base material includes: The first base material is provided, the first base material includes a core layer, a first conductive layer, and a first wiring layer, and the first conductive layer and the first wiring layer are respectively arranged on opposite sides of the core layer ; providing the second substrate, the second substrate includes a base and a plurality of conductive pillars penetrating the base; and The third substrate is provided, and the third substrate further includes a second circuit layer, a third circuit layer, a second conductive layer and a conductive connection layer, the second circuit layer and the third circuit layer are located on the opposite sides of the first dielectric layer, the second dielectric layer covers the third circuit layer and is located between the third circuit layer and the second conductive layer, and the conductive connection layer covers the inner wall of the opening And connect the second circuit layer, the third circuit layer and the second conductive layer. The method for manufacturing a circuit board as claimed in claim 7, wherein the conductive structures include a plurality of first via holes, the conductive pillars, and the conductive connection layer. The method for manufacturing a circuit board as described in Claim 8, wherein the step of forming the first via holes of the conductive structures and the via hole structure includes: A plurality of first blind holes, a plurality of second blind holes and a through hole are formed, wherein the first blind holes extend from the first conductive layer to the first circuit layer, and the second blind holes extend from the second the conductive layer extends to the third circuit layer, the through hole penetrates through the core layer of the first substrate, the base of the second substrate and the third dielectric layer of the third substrate; forming a conductive material layer to fill the first blind holes and the second blind holes, and extend to cover the first conductive layer, the second conductive layer and the inner wall of the through hole, wherein the The conductive material layer of the first blind holes defines the first via holes, and the conductive material layer filling the second blind holes defines a plurality of second via holes; and patterning the conductive material layer, the first conductive layer and the second conductive layer to form a first outer circuit layer, a second outer circuit layer and the inner wall covering the through hole and electrically connecting the first outer circuit layer A conductive material of the wiring layer and the second outer wiring layer, wherein the first outer wiring layer is located on the core layer of the first base material, and the second outer wiring layer is located on the second outer wiring layer of the third base material. on the dielectric layer, and the via hole and the conductive material define the via hole structure. The manufacturing method of the circuit board as described in claim item 9, wherein the first external circuit layer includes a first signal circuit and a first ground circuit, and the second external circuit layer includes a second signal circuit and a second The grounding line, the first signal line, the conductive material and the second signal line define the signal path, the first grounding line, the first via holes, the first line layer, the conductive columns, the second The second circuit layer, the conductive connection layer and the second ground circuit define the ground path. The method for making a circuit board as described in claim item 9 further includes: After forming the conductive material layer, and before patterning the conductive material layer, the first conductive layer and the second conductive layer, filling a fourth dielectric layer in the through hole, the fourth dielectric layer fills The through hole, and a first surface and a second surface of the fourth dielectric layer opposite to each other are respectively aligned with an upper surface and a lower surface of the conductive material layer. The method for making a circuit board as described in claim item 11 further includes: After filling the fourth dielectric layer in the through hole, and before patterning the conductive material layer, the first conductive layer and the second conductive layer, forming a metal layer on the conductive material layer, wherein the metal layer covering the upper surface and the lower surface of the conductive material layer and the first surface and the second surface of the fourth dielectric layer; and When patterning the conductive material layer, the first conductive layer and the second conductive layer, the metal layer is patterned at the same time, and a cover layer is formed at the same time, wherein the cover layer covers the first outer circuit layer, the second Two outer circuit layers and the first surface and the second surface of the fourth dielectric layer. An electronic device comprising: A circuit board, including a first base material, a second base material, a third base material, a plurality of conductive structures and a via hole structure, wherein the second substrate is disposed between the first substrate and the third substrate; The third substrate has an opening and includes a first dielectric layer, a second dielectric layer and a third dielectric layer, the opening penetrates the first dielectric layer and the second dielectric layer, and the the third dielectric layer fills the opening; The via hole structure penetrates the first substrate, the second substrate, and the third dielectric layer of the third substrate, and electrically connects the first substrate and the third substrate, thereby defining a signal paths; and The first substrate, the second substrate and the third substrate are electrically connected through the conductive structures to define a ground path, wherein the ground path surrounds the signal path; and An electronic component is electrically connected to the circuit board. The electronic device as described in claim 13, further comprising: A plurality of connecting pieces are disposed between the third substrate of the circuit board and the electronic component, wherein the electronic component is electrically connected to the circuit board through the connecting pieces.

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