TW202308155A - Electronic device - Google Patents

Abstract

The present invention discloses an electronic device, which includes a circuit substrate and a functional unit. The circuit substrate includes a circuit layer, a plurality of first circuit units and a plurality of first microchips are electrically connected to the circuit layer. The first microchips correspond to and are electrically connected to the first circuit units. The functional unit and the first microchips are disposed on the same surface of the circuit substrate. The functional unit covers at least one corresponding first microchip. The functional unit has a an carrier board, a second circuit unit disposed on the carrier board, and at least one second microchip electrically connected to the second circuit unit; wherein the current feeding-in terminal of the second circuit unit shares a node with the current feeding-in terminal of the corresponding first circuit unit, the current feeding-out terminal of the second circuit unit shares another node with the current feeding-out terminal of the corresponding first circuit unit.

Description

electronic device

The present invention relates to a device, in particular to an electronic device for easy repair of micro light-emitting diodes at fault locations.

When the world is paying attention to the future display technology, light emitting diode (LED), especially micro light emitting diode (Micro LED) is one of the most promising technologies. To put it simply, Micro LED is a technology that miniaturizes and matrixes LEDs. Millions or even tens of millions of grains smaller than 100 microns and thinner than a hair are neatly arranged on the substrate. Compared with the current OLED (Organic Light Emitting Diode) display technology, Micro LED also emits light independently, but due to the use of different materials, it can solve the most fatal "burn-in" problem of OLED, and also has low power consumption, high Contrast, wide color gamut, high brightness, small size, light and thin, energy saving and other advantages. Therefore, major manufacturers around the world are rushing to invest in the research and development of Micro LED technology.

However, in existing micro-LED electronic devices, due to the relatively small size of micro-LEDs, if micro-LEDs or driving elements at certain locations (such as sub-pixels or pixels) fail (such as light-emitting diode or thin film transistor failure, or insufficient light-emitting diode brightness) is not easy to repair, and often requires the elimination of the entire device; the existing technology also through the configuration of redundant systems in electronic devices, such as in each picture The same function is further configured in the element and used as a spare light-emitting unit or (thin film transistor) electronic unit. However, this method will greatly increase the cost and is not conducive to high micro-density (fine pitch) display technology.

It is an object of the present invention to provide an electronic device that is easy to repair at the location of the fault.

To achieve the above object, an electronic device according to the present invention includes a circuit substrate and a functional unit. The circuit substrate includes a circuit layer, a plurality of first circuit units electrically connected to the circuit layer, and a plurality of first microchips, the first microchips correspond to and are electrically connected to the first circuit units; the functional unit and the first circuit units A microchip is arranged on the same surface of the circuit substrate, and the functional unit covers at least one corresponding first microchip; wherein the functional unit has a carrier board, a second circuit unit arranged on the carrier board, and an electrical connection with the second circuit unit. At least one second microchip connected; wherein, the current feed-in end of the second circuit unit shares a node with the current feed-in end of the corresponding first circuit unit, and the current feed-in end of the second circuit unit shares a node with the corresponding The current feeding end of the first circuit unit shares another node.

In one embodiment, the number of the second microchips in the functional unit is the same as the number of the first microchips in the corresponding first circuit unit.

In one embodiment, an open circuit exists between the first circuit unit corresponding to the functional unit and the circuit layer.

In one embodiment, the circuit substrate further includes a notch, and the notch is located between the current feeding end of the first circuit unit corresponding to the functional unit and the node, or located at the current feeding end of the first circuit unit corresponding to the functional unit. Between the feed-out end and the other node.

In one embodiment, the size of the functional unit is smaller than or equal to the size of one of the first circuit units and its corresponding first microchip.

In one embodiment, the functional unit also covers the first circuit unit corresponding to the at least one first microchip.

In one embodiment, the carrier of the functional unit does not cover adjacent first microchips.

In one embodiment, the circuit substrate and/or the carrier is a flexible substrate.

In one embodiment, the circuit substrate and/or the carrier is provided with a light absorbing layer.

In one embodiment, the carrier and the substrate of the functional unit define a distance, and the distance may be less than or equal to 150 microns.

In one embodiment, the first microchip and the second microchip are optoelectronic chips at or below the micron level.

In one embodiment, the functional unit is millimeter-scale in size.

In one embodiment, a functional unit is defined as a display pixel.

As mentioned above, in the electronic device of the present invention, at least one corresponding first microchip is covered by the functional unit, and the current feeding end of the second circuit unit of the functional unit is connected to the corresponding first circuit unit. The current feed-in end shares one node, and the current feed-out end of the second circuit unit of the functional unit shares another node with the current feed-out end of the corresponding first circuit unit, so that the electronic device of the present invention is easy to repair Advantages at the location of the fault.

Electronic devices according to some embodiments of the present invention will be described below with reference to related drawings, wherein the same elements will be described with the same reference symbols.

The following diagrams only show the connection relationship between components, and do not represent actual dimensions or proportions. The electronic device in the following embodiments is an active matrix (active matrix, AM) electronic device, but it is not limited thereto. In different embodiments, the electronic device can also be a passive matrix (passive matrix, PM) electronic device .

Please refer to FIG. 1A to FIG. 1C , wherein FIG. 1A is a partial schematic view of an electronic device according to an embodiment of the present invention, FIG. 1B is a partially exploded schematic view of the electronic device of FIG. 1A , and FIG. 1C is an embodiment of the present invention. A partial cross-sectional schematic diagram of the electronic device. The electronic device 1 of this embodiment includes a circuit substrate 11 and a functional unit 12 .

The circuit substrate 11 includes a circuit layer 111 , a plurality of first circuit units 112 and a plurality of first microchips 113 , and the circuit layer 111 may include a conductive layer or a signal line for transmitting electrical signals. The first circuit units 112 and the first microchips 113 are respectively electrically connected to the circuit layer 111 , and the first microchips 113 correspond to and are electrically connected to the first circuit units 112 . In this embodiment, the circuit layer 111 includes a plurality of horizontal and side-by-side signal lines L1 and a plurality of vertical and side-by-side signal lines L2 and L3, and the signal lines L1 and the signal lines L2 and L3 are arranged alternately. To define multiple pixels or sub-pixel regions (display pixels). As shown in FIG. 1A and FIG. 1B , each pixel or sub-pixel area includes a first circuit unit 112 and a first microchip 113 corresponding to and electrically connected to the first circuit unit 112 . Here, each first circuit unit 112 is electrically connected to the corresponding signal line L1 and the signal line L2 respectively, and each first microchip 113 is electrically connected to the corresponding first circuit unit 112 and the signal line L3 respectively. Through the control of the signal lines L1 , L2 , L3 , the corresponding first microchip 113 can be driven through the first circuit unit 112 . In some embodiments, one first circuit unit 112 can drive one corresponding first microchip 113; or one first circuit unit 112 can drive multiple (for example but not limited to 3) corresponding first microchips 113, Not limited.

The material of the circuit layer 111 may include metals such as gold, copper, or aluminum, or any combination thereof, or an alloy of any combination thereof, or other conductive materials. In some embodiments, the first circuit unit 112 includes a thin film circuit, but it is not limited thereto, and the first circuit unit 112 can also be a surface mount component. In some embodiments, the first circuit unit 112 may include a circuit architecture such as 2T1C, 4T2C or 5T1C, or other driving circuit architectures. In addition, the first microchip 113 may be a micron-scale optoelectronic chip, such as, but not limited to, a Micro LED chip or a Micro sensor chip. In some embodiments, the first microchip 113 may include a micro light-emitting diode chip, so that the first microchip 113 is understood as a single display pixel; in some embodiments, three first microchips 113 It can correspond to micro light-emitting diode chips of three different colors (for example, red, blue or green), so that the electronic device 1 forms a full-color micro LED display. The aforesaid chips can be crystal grains of horizontal electrodes, or flip-chip electrodes, or vertical electrodes, and are electrically connected by wire bonding or flip chip bonding.

The circuit substrate 11 of this embodiment may further include an encapsulation layer 114 (FIG. 1C). The encapsulation layer 114 covers the first circuit unit 112 corresponding to the functional unit 12 and the first microchip 113 corresponding to the first circuit unit 112. Therefore, the first circuit unit 112 and its corresponding first microchip 113 can be prevented from being damaged by moisture or foreign objects.

The functional unit 12 is a circuit unit used to repair the faulty position of the circuit substrate 11 before the electronic device 1 leaves the factory. In this embodiment, the functional unit 12 and the first microchips 113 are disposed on the same surface of the circuit substrate 11 (the upper surface of the circuit substrate 11 ). The functional unit 12 can cover the corresponding at least one first microchip 113 and the first circuit unit 112 corresponding to the at least one first microchip 113 . In order to show the covered first microchip 113 and its corresponding first circuit unit 112 , the functional unit 12 in FIG. 1A is shown in dashed lines, and the components disposed thereon are not shown. Here, the functional unit 12 may completely cover the corresponding at least one first microchip 113 , and may selectively completely or partially cover the corresponding first circuit unit 112 of the at least one first microchip 113 .

As shown in Figure 1B and Figure 1C, the functional unit 12 of this embodiment is a surface mount device (SMD), and has a carrier board 121, a second circuit unit 122 located on the carrier board 121, and the second circuit The unit 122 is electrically connected to at least one second microchip 123 , and the second circuit unit 122 can drive the corresponding second microchip 123 . In this embodiment, the second circuit unit 122 and the second microchip 123 are arranged on the upper surface of the carrier plate 121 away from the circuit substrate 11, but it is not limited thereto. In different embodiments, the second circuit unit 122 The circuits of the two circuit units 122 can also be disposed on the surface of the carrier 121 facing the circuit substrate 11 , or the upper and lower surfaces of the carrier 121 , or the inner side of the carrier 121 .

The aforementioned circuit substrate 11 and/or carrier 121 may be a rigid substrate, a flexible substrate, or a rigid-flex composite board, without limitation. When both the board body of the circuit substrate 11 and the carrier 121 are flexible substrates, the electronic device 1 can be made into a rollable flexible electronic device, which is easy to store. In some embodiments, the body of the circuit substrate 11 and the carrier 121 can be transparent or non-transparent; when the body of the circuit substrate 11 and the carrier 121 are respectively transparent, the electronic device 1 can be made transparent. Electronics such as but not limited to transparent displays.

The functional unit 12 may be millimeter-scale in size. In addition, the same as the first microchip 113 , the second microchip 123 can be a photoelectric chip of micron scale or below the micron scale. In some embodiments, if the second microchip 123 and the first microchip 113 are both micron-scale or micro-scale micro-light-emitting diode chips, the functional unit 12 can be defined as a display pixel to replace Display pixels at the fault location. In addition, in order to avoid affecting adjacent display pixels, the size of the functional unit 12 needs to be smaller than or equal to the size of one of the first circuit units 112 and its corresponding first microchip 113 . In this embodiment, the size of the functional unit 12 is equal to the size of one of the first circuit units 112 and the corresponding first microchip 113 as an example.

Specifically, assuming that the first microchip 113 at a certain position (or some positions) or/and the corresponding first circuit unit 112 has been detected to be faulty (such as no light or insufficient brightness) before leaving the factory, then The corresponding functional unit 12 can be used to cover the first microchip 113 and its corresponding first circuit unit 112 at the fault location, so as to repair the fault location through the functional unit 12 . Preferably, the quantity of the second microchip 123 of the functional unit 12 is the same as the quantity of the first microchip 113 in the corresponding first circuit unit 112. For example, the functional unit 12 has a second microchip 123, which can be repaired accordingly. One first microchip 113 corresponding to the circuit substrate 11 ; or the functional unit 12 has three second microchips 123 , which can correspond to three corresponding first microchips 113 on the circuit substrate 11 . In addition, the second circuit unit 122 of the functional unit 12 needs to have the same or equal circuit or function as the first circuit unit 112 corresponding to the circuit substrate 11, and the second microchip 123 also needs to have the same or equal function as the first microchip 113. function. In this embodiment, the circuit, function and size of the second circuit unit 122 and the first circuit unit 112 are all the same, and the function and size of the second microchip 123 and the first microchip 113 are also the same as an example.

In order to be able to repair, the current feeding end 1221 of the second circuit unit 122 of the functional unit 12 and the corresponding current feeding end 1121 of the first circuit unit 112 need to share the same node N1, and the current of the second circuit unit 122 The feed-out end 1222 and the corresponding current feed-out end 1122 of the first circuit unit 112 need to share another node N2. In other words, the circuit of the functional unit 12 needs to be connected in parallel with the circuit at the position to be repaired (covered), and the carrier board 121 cannot cover the adjacent first microchip 113 and its corresponding first circuit unit 112, so as to avoid Influence the adjacent first microchip 113 to emit light.

It can be understood that the number of the current feeding end 1221 of the second circuit unit 122 and the corresponding current feeding end 1121 of the first circuit unit 112 may be more than one; The number of the corresponding current feed-out terminal 1122 of the first circuit unit 112 may be more than one, depending on the actual circuit design. In addition, in some embodiments, through-holes can be formed by, for example, digging holes in the carrier board 121 , and conductive materials are filled in the through-holes, so that the second circuit unit 122 can be electrically connected to the current feed-in terminal 1221 through the conductive material in the through-holes. Alternatively, a conductive material, conductive wire or conductive layer (not shown) is provided on the side of the carrier board 121, so that the second circuit unit 122 is electrically connected to the current feeding terminal 1221 through the conductive material, conductive wire or conductive layer. sexual connection.

A plurality of conductive pads P are disposed on the surface of the carrier 121 facing the circuit substrate 11 . In this embodiment, one of the conductive pads P can be regarded as the current feeding end 1221 of the second circuit unit 122, and the other of the conductive pads P can be regarded as the current feeding end 122 of the second circuit unit 122. The output terminal 1222 , while the current input terminal 1221 and the current output terminal 1222 can be electrically connected to the second microchip 123 through the second circuit unit 122 of the carrier board 121 . In addition, the functional unit 12 can be electrically connected to the current input terminal 1221 and the current output terminal 1222 (conductive pad P) of the functional unit 12 to the current input terminal 1121 and the current output terminal of the first circuit unit 112 respectively through a plurality of conductive members C. 1122, so that the functional unit 12 can be electrically connected to the corresponding signal lines L1, L2, L3, so that the functional unit 12 can be driven through the corresponding signal lines L1, L2, L3. The conductive member C can be a solder ball, solder paste or the equivalent thereof, and can be regarded as the aforementioned nodes N1, N2. In addition, in some embodiments, the carrier 121 of the functional unit and the circuit substrate 11 can define a distance (that is, there is a distance d between the carrier 121 and the circuit substrate 11, FIG. 1C), and the distance d can be less than or equal to 150 microns (um).

In some embodiments, as shown in FIG. 1D , a whole layer of encapsulation layer 114 may be provided to cover all the first circuit units 112 and the first microchip 113 on the circuit substrate 11 before the functional unit 12 is repaired. Then, dig a hole at the corresponding positions of the current feed-in end 1121 and the current feed-out end 1122 of the first circuit unit 112 corresponding to the functional unit 12, to expose the current feed-in end 1121 and the current feed-out end 1122, and then , and then set the corresponding conductive elements C (nodes N1 , N2 ) and functional units 12 , which is not limited by the present invention.

In addition, the functional unit 12 of this embodiment can further cover the second circuit unit 122 and its corresponding second microchip 123 on the carrier 121 to have an encapsulation layer 124, whereby the second circuit unit 122 and its corresponding The second microchip 123 is protected from the intrusion of water vapor or foreign matter to destroy its characteristics, so that the functional unit 12 is a package. In some embodiments, the functional unit 12 can be repaired first and then the encapsulation layer 124 is set, or the encapsulation layer 124 can be set first and then the functional unit 12 with the encapsulation layer 124 can be repaired.

In some embodiments, the conductive pad P is used as the current feed-in terminal 1221 and the current feed-out terminal 1222, and can be arranged on the same side of the carrier board 121 (for example, the upper side of the carrier board 121) as the second circuit unit 122. After the unit 12 is placed, laser is applied to the corresponding position of the functional unit 12 to expose the corresponding current input terminal 1121 and current output terminal 1122 of the first circuit unit 112, and then spray conductive material for electrical connection.

In some embodiments, the circuit substrate 11 and/or the carrier 121 can also be provided with a light-absorbing layer (not shown, for example made of black light-absorbing material), and the light-absorbing layer can surround the first microchip of the circuit substrate 11 113 or/and the periphery of the second microchip 123 of the functional unit 12, thereby avoiding light mixing and increasing contrast.

It is worth mentioning that, in order not to affect other circuits of the circuit substrate 11, when the functional unit 12 covers the corresponding first microchip 113 and its corresponding first circuit unit 112 before or after, it is necessary to make the first microchip at the fault The chip 113 and its corresponding first circuit unit 112 are electrically isolated from the circuit layer 111 . Referring to FIG. 1A again, the circuit substrate 11 of this embodiment may further include at least a notch C1, the notch C1 is located between the current feeding end 1121 of the first circuit unit 112 corresponding to the functional unit 12 and the node N1, Make an open circuit (electrically isolated) between the first circuit unit 112 covered (corresponding) by the functional unit 12 and its corresponding first microchip 113 and the circuit layer 111 . Of course, the cut C1 can also be located between the current feed-in end 1122 of the first circuit unit 112 corresponding to the functional unit 12 and the node N2; or between the current feed-in end 1121 of the first circuit unit 112 and the node N1 and between the There is a notch C1 between the current feeding end 1122 of a circuit unit 112 and the node N2, which is not limited. In some embodiments, the cut C1 can be generated by cutting the circuit with a laser.

As mentioned above, in this embodiment, if one or some of the first microchips 113 are found to be faulty, they can be replaced with good-quality functional units 12 before leaving the factory, so fault repair is quite easy. In the present invention, when one or more of the first microchips 113 (or/and the corresponding first circuit unit 112) fail, only the failed first microchip 113 (or/and the corresponding first circuit unit 112) It is sufficient to replace the corresponding functional unit 12 instead of eliminating the entire original device. Therefore, it has the advantage of being easy to repair the fault location and can improve the yield rate.

In addition, please refer to FIG. 2A to FIG. 2C, FIG. 2A is a partial schematic diagram of an electronic device according to different embodiments of the present invention, FIG. 2B is a partial exploded schematic diagram of the electronic device of FIG. 2A, and FIG. 2C is another implementation of the present invention A partial cross-sectional schematic diagram of an example electronic device.

The electronic device 1 a of this embodiment is substantially the same as the electronic device 1 of the previous embodiment in terms of component composition and connection relationship of each component. The difference is that, in the electronic device 1 a of this embodiment, one first circuit unit 112 corresponds to three first microchips 113 . In other words, the functional unit 12a of the present embodiment has a carrier board 121, a second circuit unit 122 disposed on the carrier board 121, and three second microchips 123 electrically connected to the second circuit unit 122, so that the second circuit The unit 122 can drive the corresponding three second microchips 123 to emit light. Wherein, the three second microchips 123 can correspond to micro light-emitting diode chips of three different colors (such as red, blue or green), and one first circuit unit 112 can drive three first microchips 113 to emit light, so , the electronic device 1a can be a full-color micro LED display. In some embodiments, the three first microchips 113 can be designed as common cathode or common anode, but not limited.

In different embodiments, as shown in FIG. 2D , a whole layer of encapsulation layer 114 may be provided to cover all the first circuit units 112 and the first microchip 113 of the circuit substrate 11 before the functional unit 12 is provided. , and then dig holes at the corresponding positions of the current feed-in end 1121 and the current feed-out end 1122 of the first circuit unit 112 corresponding to the functional unit 12a to expose the current feed-in end 1121 and the current feed-out end 1122, and then The setting operation of the corresponding conductive elements C (nodes N1 and N2 ) and the functional unit 12 a is performed.

To sum up, in the electronic device of the present invention, at least one corresponding first microchip is covered by the functional unit, and the current feeding end of the second circuit unit of the functional unit is connected to the corresponding first circuit unit. The current feed-in end shares one node, and the current feed-out end of the second circuit unit of the functional unit shares another node with the current feed-out end of the corresponding first circuit unit, so that the electronic device of the present invention is easy to repair Advantages at the location of the fault.

The above descriptions are illustrative only, not restrictive. Any equivalent modification or change made without departing from the spirit and scope of the present invention shall be included in the scope of the appended patent application.

1,1a: Electronic device 11: Circuit substrate 111: Line layer 112: The first circuit unit 1121, 1221: current feed-in terminal 1122, 1222: current feed-out terminal 113: The first microchip 114,124: encapsulation layer 12,12a: Functional unit 121: carrier board 122: the second circuit unit 123: second microchip C: Conductive parts C1: cut marks d: spacing L1, L2, L3: signal lines N1, N2: nodes P: conductive gasket

FIG. 1A is a partial schematic diagram of an electronic device according to an embodiment of the present invention. FIG. 1B is a partially exploded schematic diagram of the electronic device in FIG. 1A . FIG. 1C is a schematic partial cross-sectional view of an electronic device according to an embodiment of the present invention. FIG. 1D is a schematic partial cross-sectional view of an electronic device according to another embodiment of the present invention. FIG. 2A is a partial schematic diagram of an electronic device according to a different embodiment of the present invention. FIG. 2B is a partially exploded schematic diagram of the electronic device in FIG. 2A . FIG. 2C is a schematic partial cross-sectional view of an electronic device according to another embodiment of the present invention. FIG. 2D is a schematic partial cross-sectional view of an electronic device according to different embodiments of the present invention.

1: Electronic device

11: Circuit substrate

112: The first circuit unit

1121, 1221: current feed-in terminal

1122, 1222: current feed-out terminal

113: The first microchip

114,124: encapsulation layer

12: Functional unit

121: carrier board

122: the second circuit unit

123: second microchip

C: Conductive parts

d: spacing

N1, N2: nodes

P: conductive gasket

Claims (13)

An electronic device comprising: A circuit substrate, including a circuit layer, a plurality of first circuit units electrically connected to the circuit layer, and a plurality of first microchips, the first microchips correspond to and are electrically connected to the first circuit units; and A functional unit is arranged on the same surface of the circuit substrate as the first microchips, and the functional unit covers at least one corresponding first microchip; wherein the functional unit has a carrier board, and a a second circuit unit, and at least one second microchip electrically connected to the second circuit unit; Wherein, the current feeding end of the second circuit unit shares a node with the corresponding current feeding end of the first circuit unit, and the current feeding end of the second circuit unit shares a node with the corresponding first circuit unit. The current feeding ends share another node. The electronic device as claimed in claim 1, wherein the number of the second microchips in the functional unit is the same as the number of the corresponding first microchips in the first circuit unit. The electronic device according to claim 1, wherein an open circuit exists between the first circuit unit corresponding to the functional unit and the circuit layer. The electronic device as claimed in claim 1, wherein the circuit substrate further includes a cut, and the cut is located between the current feeding end of the first circuit unit corresponding to the functional unit and the node, or located at the functional unit between the corresponding current feed-out end of the first circuit unit and the other node. The electronic device as claimed in claim 1, wherein the size of the functional unit is smaller than or equal to the size of one of the first circuit units and its corresponding first microchip. The electronic device as claimed in claim 1, wherein the functional unit also covers the first circuit unit corresponding to the at least one first microchip. The electronic device as claimed in claim 1, wherein the carrier of the functional unit does not cover the adjacent first microchip. The electronic device according to claim 1, wherein the circuit substrate and/or the carrier board are flexible substrates. The electronic device according to claim 1, wherein the circuit substrate and/or the carrier is provided with a light absorbing layer. The electronic device as claimed in claim 1, wherein the carrier and the substrate of the functional unit define a distance, and the distance is less than or equal to 150 microns. The electronic device as claimed in claim 1, wherein the first microchip and the second microchip are optoelectronic chips of micron scale or below micron scale. The electronic device as claimed in claim 1, wherein the functional unit has a millimeter-scale size. The electronic device as claimed in claim 1, wherein the functional unit is defined as a display pixel.

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