TW202306679A - Laser processing apparatus - Google Patents

Abstract

A laser processing apparatus includes: a support unit that supports an object; an irradiation unit that irradiates laser light; an information acquisition unit that acquires information for position alignment of the focusing position of the laser light in the object; an interior observation unit that has a transmitted light condensing lens that condenses transmitted light on the object, and that observes the interior of the object by means of the transmitted light; a first vertical movement mechanism that moves the irradiation unit together with the information acquisition unit in the vertical direction; a second vertical movement mechanism that moves at least either the internal observation unit or the transmitted light condensing lens in the vertical direction; a horizontal movement mechanism that moves the support part in the horizontal direction; and a control unit that controls the operation of the first vertical movement mechanism, the second vertical movement mechanism, and the horizontal movement mechanism.

Description

Laser processing device

The present invention relates to a laser processing device.

There is known a laser processing apparatus that forms a modified region on an object by irradiating the object with laser light. As such a technique, for example, Japanese Patent Application Laid-Open No. 2020-055030 describes a laser processing device comprising: a laser processing head (irradiation unit) for irradiating laser light; An imaging unit (information acquisition unit) that aligns (aligned) images, and an imaging unit (internal observation unit) that captures the interior of the object with penetrating light that is penetrating to the object.

In the aforementioned laser processing apparatus, the information acquisition unit and the internal observation unit move together in the vertical direction by the same moving mechanism (vertical axis). Therefore, when the internal observation unit is used for observation, if the internal observation unit is moved in the vertical direction, the vibration becomes large due to its heavy weight, and observation failure may occur. Also, when either one of the information acquisition unit and the internal observation unit is in operation, the other cannot move in the vertical direction, and tact time (tact time) increases (work efficiency decreases).

Therefore, an object of the present invention is to provide a laser processing apparatus capable of speeding up takt time (increasing work efficiency) and reducing observation defects caused by an internal observation unit.

A laser processing device according to an aspect of the present invention, which forms a modified region in an object by irradiating laser light to the object, is characterized in that the laser processing device includes: a support unit that supports the object object; an irradiation unit, which irradiates laser light to an object supported by a support unit; an information acquisition unit, which is installed in the irradiation unit, and acquires information on the alignment of the laser beam’s focusing position in the object; internal observation part, which has a penetrating light converging lens for converging the penetrating light on the target object, and observes the inside of the target object through the penetrating light; the first vertical movement mechanism, which makes the irradiation The part moves along the vertical direction together with the information obtaining part; the second vertical movement mechanism moves at least one of the internal observation part and the transmitted light converging lens along the vertical direction; the horizontal movement mechanism makes the supporting part move along the moving in the horizontal direction; the control unit at least controls the actions of the first vertical movement mechanism, the second vertical movement mechanism and the horizontal movement mechanism.

In this laser processing device, at least any one of the information acquisition unit, the internal observation unit, and the transmitted light condensing lens can be moved in the vertical direction by mutually different moving mechanisms. Thereby, it is possible to reduce the weight moving in the vertical direction and suppress vibration when observing with the internal observation unit. In addition, even if either one of the information acquisition unit and the internal observation unit is in operation, the other can move in the vertical direction. Therefore, according to an aspect of the present invention, it is possible to realize a takt acceleration and reduce observation failures caused by the internal observation unit.

In the laser processing device according to one aspect of the present invention, the horizontal movement mechanism may also include: a first horizontal movement mechanism that moves the support portion along the first horizontal direction; a second horizontal movement mechanism that moves the support portion along the first horizontal direction; moving along a second horizontal direction orthogonal to the first horizontal direction. In this case, by moving the supporting part in the first horizontal direction and the second horizontal direction, the laser light irradiation position of the object by the irradiation part, the information acquisition position of the object by the information acquisition part, and The observation position of the object by the internal observation unit moves in the first horizontal direction and the second horizontal direction.

In the laser processing device according to an aspect of the present invention, the first vertical movement mechanism may also have a first vertical axis provided on the first base portion, and move the irradiation portion in the vertical direction along the first vertical axis. The two vertical movement mechanisms have a second vertical axis disposed on the second base portion separated from the first base portion in the first horizontal direction, and move the inner observation portion in the vertical direction along the second vertical axis. In this case, a compact device structure in the second horizontal direction can be achieved.

In the laser processing device according to an aspect of the present invention, the first vertical movement mechanism may also have a first vertical axis provided on one side of the first base portion in the first horizontal direction, so that the irradiation portion moves along the first vertical axis. The shaft moves in the vertical direction, and the second vertical moving mechanism has a second vertical shaft disposed on the other side of the first base part in the first horizontal direction, and moves the inner observation part in the vertical direction along the second vertical shaft. In this case, it is possible to realize a device structure in which the base part on which the first vertical axis and the second vertical axis are provided is shared.

In the laser processing device according to an aspect of the present invention, the first vertical movement mechanism may also have a first vertical axis provided on the first base portion, and move the irradiation portion in the vertical direction along the first vertical axis. The two vertical moving mechanisms have a second vertical axis disposed on a second base portion separated from the first base portion in a second horizontal direction, and move the inner observation portion in a vertical direction along the second vertical axis. In this case, a compact device structure in the first horizontal direction can be achieved.

In the laser processing apparatus according to one aspect of the present invention, the irradiation unit and the internal observation unit may be configured so as not to move in the horizontal direction. In this case, since the information acquisition unit and the internal observation unit do not move in the horizontal direction, generation of vibration accompanying the movement can be avoided.

In the laser processing apparatus according to one aspect of the present invention, the support portion may be configured to be rotatable around a rotation axis along the vertical direction. In this case, by rotating the supporting part, the laser light irradiation position of the object by the irradiation part, the information acquisition position of the object by the information acquisition part, and the observation of the object by internal observation can be adjusted. The position moves in a rotation direction centered on a rotation axis along the vertical direction.

In the laser processing device according to the present invention, the information acquiring unit may acquire information for alignment of the laser light condensing position by irradiating the object with light and receiving the light returned from the object. In this case, it is possible to specifically acquire information for alignment of the laser light condensing position.

In the laser processing device according to one aspect of the present invention, the control unit may also execute: according to the information obtained by the information obtaining unit, the support unit is moved in the horizontal direction by the horizontal movement mechanism, so that the focusing position of the laser light Align with the specified position of the object, and obtain the alignment information related to the position information of the support part during the alignment; in the case of using the internal observation part to observe the inside of the object, based on the alignment information and the internal observation part With respect to the position correction information related to the positional relationship of the irradiating part, the support part is moved in the horizontal direction by the horizontal movement mechanism, and the focusing position of the transmitted light is aligned with a predetermined position in the object. Thereby, the condensing position of the laser light can be aligned to a predetermined position, and the alignment information at this time can be shared for observation by the internal observation unit.

In the laser processing apparatus according to an aspect of the present invention, the irradiation unit may also have a laser light focusing lens for condensing the laser light on the object, and the control unit executes: the reference of the test object supported by the support unit. The position is located on the optical axis of the laser light condensing lens, the support part is moved along the horizontal direction by the horizontal movement mechanism, and the processing of obtaining the first information as the position information of the support part after the movement; to be supported The reference position of the test object supported by the part is located on the optical axis of the transmitted light condenser lens. The support part is moved in the horizontal direction by the horizontal movement mechanism, and the position information of the support part after the movement is obtained. processing of the second information; and processing of obtaining position correction information according to the first information and the second information. In this case, it is possible to specifically obtain position correction information.

Hereinafter, the embodiments will be described in detail with reference to the drawings. In addition, in description of each figure, the same code|symbol is attached|subjected to the same or corresponding part, and overlapping description may be abbreviate|omitted. In addition, each drawing may show a rectangular coordinate system defined by an X axis, a Y axis, and a Z axis. As an example, the X direction and the Y direction are a first horizontal direction and a second horizontal direction intersecting (orthogonal) with each other, and the Z direction is a vertical direction intersecting (orthogonal) with the X direction and the Y direction.

[First Embodiment] As shown in FIG. 1 , the laser processing apparatus 1 of the first embodiment includes: Observation unit (internal observation section) 4, first vertical movement mechanism 7A, second vertical movement mechanism 7B, first horizontal movement mechanism (horizontal movement mechanism) 8A, second horizontal movement mechanism (horizontal movement mechanism) 8B, control unit 9 , and GUI (Graphical User Interface, Graphical User Interface) 10 . The laser processing device 1 is a device for forming a modified region 12 (see FIG. 4 ) on an object 20 by irradiating the object 20 with laser light L.

As shown in FIGS. 2 and 3 , the object 20 is, for example, a wafer. The object 20 includes a semiconductor substrate 21 and a functional element layer 22 . The semiconductor substrate 21 has a front surface 21a and a back surface 21b. The semiconductor substrate 21 is, for example, a silicon substrate. The functional element layer 22 is formed on the surface 21 a of the semiconductor substrate 21 . The functional element layer 22 includes a plurality of functional elements 22a arranged two-dimensionally along the surface 21a. The functional element 22 a is, for example, a light-receiving element such as a photodiode, a light-emitting element such as a laser diode, or a circuit element such as a memory. The functional element 22a may also be formed three-dimensionally by stacking a plurality of layers. Furthermore, the object 20 may have the functional device layer 22 or may not have the functional device layer 22 , or may be a bare wafer. The semiconductor substrate 21 is provided with a notch 21c indicating the crystal orientation, but an orientation flat may be provided instead of the notch 21c.

The object 20 is cut along each of the plurality of lines 15 into individual functional elements 22a. When viewed from the thickness direction of the object 20, the several lines 15 pass between each of the several functional elements 22a. More specifically, the line 15 passes through the center (the center in the width direction) of the street region 23 when viewed from the thickness direction of the object 20 . The scribe region 23 extends in the functional element layer 22 so as to pass between adjacent functional elements 22a. In this embodiment, a plurality of functional elements 22a are arranged in a matrix along the surface 21a, and a plurality of lines 15 are set in a grid. In addition, although the line 15 is an imaginary line, it may be the line actually drawn.

As shown in FIG. 1 , an object 20 is placed on the stage 2 . The stage 2 supports the object 20 by, for example, absorbing the object 20 . The stage 2 can move along the X direction by the first horizontal movement mechanism 8A. The stage 2 can move along the Y direction by the second horizontal movement mechanism 8B. The stage 2 is configured to be rotatable about a rotation axis along the Z direction. The stage 2 has a known rotary drive device (not shown) such as a motor, and the rotary shaft is driven to rotate centrally by the driving force thereof. The rotation of the stage 2 (operation of the rotation driving device) is controlled by the control unit 9 .

As shown in FIGS. 1 and 4 , the laser processing head 3 irradiates laser light L having penetrating properties with respect to an object 20 supported by the stage 2 . The laser machining head 3 condenses the laser light L inside the object 20 . When the laser light L is condensed inside the object 20 supported by the stage 2, the laser light L is particularly absorbed at a portion corresponding to the condensing position (at least a part of the condensing area) of the laser light L, Modified region 12 is formed inside object 20 .

The modified region 12 is a region different in density, refractive index, mechanical strength, and other physical properties from the surrounding non-modified region. The modified region 12 includes, for example, a melt-processed region, a cracked region, a dielectric breakdown region, a refractive index change region, and the like. The modified region 12 has a characteristic that cracks easily extend from the modified region 12 to the incident side of the laser light L and the opposite side. Such properties of the modified region 12 are utilized for cutting the object 20 .

The laser processing head 3 has a laser light condensing lens 33 and an observation camera 35 in a housing H3. Laser light L is injected into the housing H3 of the laser processing head 3 from an external light source 31 . The light source 31 outputs laser light L by, for example, pulse oscillation. The laser light condensing lens 33 condenses the laser light L on the object 20 supported by the stage 2 . In the laser machining head 3, the laser light L incident from the light source 31 enters the laser light condensing lens 33 through the dichroic mirror 32 in the housing H3, and is condensed on the object by the laser light condensing lens 33. 20. The laser light condensing lens 33 can also be a lens unit including a plurality of objective lenses. The housing H3 includes a mounting portion 39 provided on the side surface thereof, and the housing H3 is connected to and supported by a first vertical movement mechanism 7A described later via the mounting portion 39 .

The observation camera 35 images the object 20 supported by the stage 2 with visible light V. The observation camera 35 captures an image of the object 20 by the visible light V emitted from the visible light source 36 . Specifically, the visible light V emitted from the visible light source 36 is reflected by the dichroic mirror 37 , passes through the dichroic mirror 32 , and is irradiated to the object 20 through the laser light condensing lens 33 . This visible light V is reflected by the laser light incident surface of the object 20 , passes through the laser light condensing lens 33 and the dichroic mirrors 32 and 37 , and is received by the observation camera 35 through the lens 38 . It is also possible to provide a scale line (not shown) that provides a scale line for the visible light V on the optical path of the visible light V. The observation camera 35 is connected to the control unit 9 . The observation camera 35 outputs the captured visible image to the control unit 9 . The observation camera 35 is not particularly limited, and various known cameras can be used as long as the required performance is satisfied.

The alignment cameras 5 and 6 acquire information on alignment (hereinafter, sometimes simply referred to as “alignment”) for the condensing position of the laser light L in the object 20 . The alignment cameras 5 and 6 irradiate the object 20 with light and detect the light returned from the object 20 to acquire an image as information for alignment. The alignment cameras 5 and 6 image the object 20 supported by the stage 2 .

For example, the alignment camera 5 irradiates light on the object 20 from the back surface 21b side, which is the laser light incident surface, and detects light returned from the surface 21a (functional element layer 22 ), thereby imaging the functional element layer 22 . In addition, for example, the alignment camera 5 similarly irradiates the object 20 with light from the rear surface 21b side, and detects the light returning from the position where the modified region 12 is formed in the semiconductor substrate 21, thereby obtaining a region including the modified region 12. Image. These images are used in the alignment. The alignment camera 6 has the same structure as the alignment camera 5 except that the lens has a lower magnification. Like the camera 5 for alignment, the camera 6 for alignment is used for alignment.

Alignment cameras 5 and 6 are installed on the laser processing head 3 and move integrally with the laser processing head 3 . In the illustrated example, the alignment cameras 5 and 6 are fixed to the mounting portion 39 of the laser processing head 3 . The alignment cameras 5 and 6 are connected to a control unit 9 . The cameras 5 and 6 for alignment output captured images to the control unit 9 . The alignment cameras 5 and 6 are not particularly limited, and various known cameras can be used as long as the required performance is satisfied.

As shown in FIGS. 1 and 5 , the internal observation unit 4 observes the interior of the object 20 with transmitted light. The internal observation unit 4 observes the inside of the object 20 by irradiating the object 20 with transmitted light and detecting the transmitted light returned from the object 20 . For example, the internal observation unit 4 images the modified region 12 formed in the object 20 and the tip of the crack 14 extending from the modified region 12 .

As shown in FIG. 5 , the internal observation unit 4 has a light source 41 , a reflection mirror 42 , a transmitted light condenser lens 43 , and a light detection unit 44 in a housing H4 . The light source 41 outputs penetrating light I1 that is penetrating to the semiconductor substrate 21 . The light source 41 is composed of, for example, a halogen lamp and a screening program, and outputs the penetrating light I1 in the near-infrared region. The transmitted light I1 output from the light source 41 is reflected by the reflector 42 , passes through the transmitted light condenser lens 43 , and is irradiated toward the object 20 from the back surface 21 b side of the semiconductor substrate 21 . The transmitted light condensing lens 43 is a lens that condenses the transmitted light I1 on the semiconductor substrate 21 . The transmitted light condenser lens 43 passes the transmitted light I1 reflected by the surface 21 a of the semiconductor substrate 21 .

The light detection unit 44 detects the transmitted light I1 that has passed through the transmitted light condensing lens 43 and the reflection mirror 42 . The photodetector 44 is composed of, for example, an InGaAs camera, and detects the transmitted light I1 in the near-infrared region. The frame body H4 includes a mounting portion 49 provided on the side surface thereof, and the frame body H4 is connected to and supported by a second vertical movement mechanism 7B described later via the mounting portion 49 . The internal observation unit 4 is connected to the control unit 9 . The internal observation unit 4 outputs captured images (internal images) to the control unit 9 . The internal observation unit 4 is not particularly limited, and various known cameras can be used as long as the required performance is satisfied.

As shown in FIG. 1 , the first vertical movement mechanism 7A is a mechanism that moves the laser processing head 3 in the Z direction together with the alignment cameras 5 and 6 . The first vertical movement mechanism 7A has a first vertical shaft 71 provided on a columnar first base portion 75 . The first base portion 75 is fixed to, for example, an installation surface or the like. The first vertical axis 71 extends along the Z direction. On the first vertical axis 71, the mounting part 39 of the laser machining head 3 is mounted so as to be movable in the Z direction. Such a first vertical movement mechanism 7A moves the laser machining head 3 in the Z direction along the first vertical axis 71 by the driving force of a driving source not shown. The first vertical movement mechanism 7A is not particularly limited, and various mechanisms can be used as long as the laser processing head 3 can be moved in the Z direction.

The second vertical movement mechanism 7B is a mechanism that moves the internal observation unit 4 in the Z direction. The second vertical movement mechanism 7B has, for example, a second vertical shaft 72 provided on a columnar second base portion 76 fixed to an installation surface or the like. The second base portion 76 is separated from the first base portion 75 in the X direction. For example, the separation distance of the second base portion 76 from the first base portion 75 is equal to or greater than the width of the laser machining head 3 in the X direction.

The second vertical axis 72 extends along the Z direction. On the second vertical axis 72, the mounting portion 49 of the internal observation unit 4 is mounted so as to be movable in the Z direction. Such a second vertical movement mechanism 7B moves the internal observation unit 4 in the Z direction along the second vertical axis 72 by the driving force of a driving source not shown. The second vertical movement mechanism 7B is not particularly limited, and various mechanisms can be used as long as the internal observation unit 4 can be moved in the Z direction.

The first horizontal movement mechanism 8A is a mechanism that moves the stage 2 in the X direction. The first horizontal movement mechanism 8A has, for example, a first horizontal shaft 81 fixed to an installation surface or the like. The first horizontal axis 81 extends along the X direction. On the first horizontal axis 81 , the stage 2 is attached so as to be movable in the X direction via the second horizontal movement mechanism 8B. Such a first horizontal movement mechanism 8A moves the stage 2 and the second horizontal movement mechanism 8B in the X direction along the first horizontal axis 81 by the driving force of a driving source not shown. The first horizontal movement mechanism 8A is not particularly limited, and various mechanisms can be used as long as the stage 2 can be moved in the X direction.

The second horizontal movement mechanism 8B is a mechanism that moves the stage 2 in the Y direction. The second horizontal movement mechanism 8B has, for example, a second horizontal shaft 82 provided on the first horizontal movement mechanism 8A. The second horizontal axis 82 extends along the Y direction. On the second horizontal axis 82, the stage 2 is mounted so as to be movable in the Y direction. The second horizontal axis 82 can move along the first horizontal axis 81 together with the stage 2 . Such a second horizontal movement mechanism 8B moves the stage 2 in the Y direction along the second horizontal axis 82 by the driving force of a driving source not shown. The second horizontal movement mechanism 8B is not particularly limited, and various mechanisms can be used as long as the stage 2 can be moved in the Y direction.

The control unit 9 is configured as a computer device including a processor, a memory, a storage device, a communication device, and the like. In the control unit 9, the processor executes software (program) read from the memory, etc., and controls the reading and writing of data in the memory and the storage device, and the communication through the communication device. The control unit 9 controls various operations of the laser processing device 1 . The control unit 9 controls the rotary driving device of the stage 2, the laser processing head 3, the alignment cameras 5 and 6, the internal observation unit 4, the first vertical movement mechanism 7A, the second vertical movement mechanism 7B, and the first horizontal movement mechanism. 8A, the actions of the second horizontal movement mechanism 8B and GUI10.

The control unit 9 executes alignment based on the information acquired by the alignment cameras 5 and 6, and acquires alignment information related to the position information of the stage 2 at the time of alignment. The position information of the stage 2 is, for example, information related to the position of the stage 2 in the X direction, the Y direction, and the θ direction (the rotation direction of the stage 2 around the rotation axis).

When the inside of the object 20 is observed by the internal observation unit 4, the control unit 9 executes a process of moving the stage 2 based on the alignment information and the XYθ correction information (position correction information), and concentrating the transmitted light I1 The position coincides with the alignment position of the object 20 (the condensing position of the laser light L at the time of alignment). The XYθ correction information is information related to the positional relationship of the internal observation unit 4 with respect to the laser processing head 3 . For example, the XYθ correction information corresponds to the position of the stage 2 in the X direction, Y direction and θ direction when the optical axis of the transmitted light condenser lens 43 of the internal observation unit 4 is located at the center of the object 20 relative to the current position. Differences in positions of the stage 2 in the X direction, Y direction, and θ direction when the optical axis of the laser light condensing lens 33 of the laser processing head 3 is positioned at the center of the object 20 .

The control section 9 executes the following processing: using the rotary drive device of the stage 2, the first horizontal movement and The mechanism 8A and the second horizontal movement mechanism 8B move the stage 2 in the X direction, the Y direction, and the θ direction, and obtain XYθ information (first information) which is position information of the stage 2 after the movement. The control unit 9 executes the following process: using the rotary drive device of the stage 2, the first The horizontal moving mechanism 8A and the second horizontal moving mechanism 8B move the stage 2 in the X direction, the Y direction, and the θ direction, and obtain the second XYθ information (the second XYθ information) as the position information of the stage 2 after the movement. Information). The control unit 9 executes a process of obtaining XYθ correction information based on the first XYθ information and the second XYθ information. The details of the processing by the control unit 9 will be described later.

GUI 10 displays various information. The GUI 10 displays the imaging results of the internal observation unit 4 and the imaging results of the alignment cameras 5 and 6 . GUI 10 includes, for example, a touch panel display. Various settings related to processing conditions and the like are input to the GUI 10 through operations such as touch by the user.

In the laser processing apparatus 1, as an example, the object 20 is irradiated with the laser light L from the back surface 21b side of the semiconductor substrate 21, and the stage 2 is moved along the line 15 so that the focusing position of the laser light L (focusing position) is adjusted. The light spot) moves relative to the object 20 along the line 15 , thereby forming a plurality of modified spots arranged along the line 15 . One modified spot is formed by irradiation of one pulse of laser light L. One row of modified regions 12 is a collection of a plurality of modified spots arranged in one row. Adjacent modified spots may be connected to each other or may be separated from each other due to differences in the relative movement speed of the condensing position with respect to the object 20 and the repetition frequency of the laser light L. In the present embodiment, as shown in FIG. 4 , two rows of modified regions 12 a and 12 b are formed inside a semiconductor substrate 21 along a line 15 . The two rows of modified regions 12 a and 12 b are adjacent to each other in the thickness direction (Z direction) of the object 20 . The two rows of modified regions 12a and 12b are formed by relatively moving the two condensing positions C along the line 15 with respect to the semiconductor substrate 21 .

As mentioned above, in the laser processing device 1, the frame H3 of the laser processing head 3 is supported by the first vertical movement mechanism 7A so as to be able to move in the Z direction. The alignment cameras 5 and 6 of the processing head 3 are configured so as to be movable in the Z direction and immovable in the X direction and the Y direction. In the laser processing apparatus 1, as described above, the housing H4 of the internal observation unit 4 is supported so as to be movable in the Z direction by the second vertical movement mechanism 7B, whereby the internal observation unit 4 is configured to be movable in the Z direction. Move, and cannot move in X direction and Y direction.

Next, an example of the operation of the laser processing apparatus 1 will be described with reference to the flowchart of FIG. 6 .

First, after starting, each device is warmed up and calibrated, the object 20 is placed on the stage 2 by a robot arm not shown, and the object 20 is adsorbed on the stage 2 (step S1).

Next, alignment is performed (step S2). In step S2, the first horizontal movement mechanism 8A and the first horizontal movement mechanism 8A are controlled by the control unit 9 according to the image obtained by the alignment camera 5 or the alignment camera 6 (for example, the image of the functional element layer 22 of the object 20). The operation of the second horizontal movement mechanism 8B moves the stage 2 along the X direction and the Y direction, so that the focusing position of the laser light L coincides with the alignment position. For example, the alignment position is a machining start position (predetermined position) on the line 15 when viewed from the Z direction. In addition, in step S2, the positional information of the stage 2 at the time of alignment can be acquired as alignment information.

Next, height setting is performed (step S3). In step S3, the control unit 9 controls the operation of the first vertical movement mechanism 7A according to the visible image (for example, the image of the laser light incident surface of the object 20) obtained by the observation camera 35, so that the laser The processing head 3 (that is, the laser light condensing lens 33 ) moves along the Z direction so that the condensing position of the laser light L is located on the laser light incident surface. Then, by controlling the action of the first vertical movement mechanism 7A by the control part 9, the laser processing head 3 is moved along the Z direction with the position when the height is set as a reference, so that the laser beam L's focusing position is located at a distance from the laser beam L. The specified depth of the incident surface.

Next, the ON/OFF of the laser light L from the laser processing head 3, and the operations of the first horizontal movement mechanism 8A, the second horizontal movement mechanism 8B, and the rotary driving device of the stage 2 are appropriately controlled by the control unit 9. , the stage 2 is moved so that the focusing position of the laser light L moves relatively along the plurality of lines 15 . Thereby, the modified region 12 is formed inside the object 20 along the plurality of lines 15 (step S4).

Next, internal observation of the object 20 is performed. During internal observation of the object 20, the control unit 9 controls the operation of the rotary drive device of the stage 2, the first horizontal movement mechanism 8A, and the second horizontal movement mechanism 8B to move the stage 2 so that the object 20 is located at the start position of the internal observation by the internal observation unit 4 (step S5). In step S5, according to the alignment information obtained in the aforementioned step S2 and the preset XYθ correction information, the position of the object 20 in the X direction, the Y direction, and the θ direction is controlled so that the optical axis of the penetrating light converging lens 43 This coincides with the alignment position of the object 20 (here, the processing start position on the line 15).

Next, internal observation of the object 20 is performed by the internal observation unit 4, and a plurality of internal images are acquired (step S6). In step S6 , for example, at least one portion of each line 15 , the next internal observation process is executed by the internal observation unit 4 under the control of the control unit 9 . That is, the internal observation unit 4 is moved in the Z direction by the second vertical movement mechanism 7B so that the converging position of the transmitted light I1 coincides with a plurality of positions inside the object 20, and the object 20 is imaged to obtain a plurality of internal observation units. image. Information on the amount of movement of the internal observation unit 4 is associated with each of a plurality of internal images, and the association is acquired as imaging data. Acquisition of such imaging data is repeated by making the optical axis of the transmitted light condenser lens 43 coincide with other locations on the same line 15 or on other lines 15 .

Next, the processing state is judged according to the obtained imaging data by the control unit 9 (step S7). In step S7, as an example, any one of the internal images among the plurality of photographed data is automatically determined by image recognition (AI determination is performed). The control unit 9 calculates the crack position based on the movement amount when the determined internal image is captured. The crack position can be calculated by, for example, multiplying the amount of movement by a predetermined correction coefficient set in advance. The correction coefficient will be described later. In addition, the control unit 9 estimates the position of the modified region 12 and the like based on the obtained crack positions and the like. Next, the control unit 9 stores the determination result determined in the aforementioned step S7 in an arbitrary storage device. The control unit 9 causes the GUI 10 to display the determination result determined in the aforementioned step S7 (step S8). With the above, the process ends.

Next, an acquisition example of XYθ correction information will be described with reference to the flowchart of FIG. 7 .

Before the above-mentioned processing of steps S1 to S8, the following XYθ correction information acquisition processing is executed. First, the test object is placed on the stage 2 by a robot arm (not shown), and the test object is adsorbed on the stage 2 (step S11 ). As shown in FIG. 8 , the test object 20T includes, for example, a disc-shaped semiconductor substrate 121 , and on the main surface of the semiconductor substrate 121 , indicator lines 122 such as cutouts passing through a center 125 and eighth in the circumferential direction are formed.

Through the control unit 9, according to the visible image obtained by the observation camera 35 of the laser processing head 3, the rotary drive device of the stage 2, the first vertical movement mechanism 7A, the first horizontal movement mechanism 8A and the second horizontal movement mechanism are controlled. The action of the moving mechanism 8B moves the stage 2 along the θ direction, the X direction, the Y direction and the Z direction, so that the reference position (for example, the center 125) of the test object 20T is located on the optical axis of the laser light condensing lens 33 on (step S12). The position information of the stage 2 at this time is acquired as the first XYθ information (step S13).

Through the control part 9, according to the image obtained by the internal observation unit 4, the operation of the rotary driving device of the stage 2, the second vertical movement mechanism 7B, the first horizontal movement mechanism 8A and the second horizontal movement mechanism 8B is controlled, The stage 2 is moved in the θ direction, the X direction, the Y direction, and the Z direction so that the reference position of the test object 20T is positioned on the optical axis of the transmitted light condenser lens 43 (step S14 ). The position information of the stage 2 at this time is acquired as the second XYθ information (step S15). Moreover, XYθ correction information is obtained from the difference between the first XYθ information and the second XYθ information (step S16 ).

Furthermore, as another example, the coordinates of the alignment cameras 5, 6 and the observation camera 35 of the laser processing head 3 are correlated, and the coordinates of the alignment cameras 5, 6 and the internal observation unit 4 are also correlated, another On the other hand, sometimes the coordinates of the observation camera 35 of the laser processing head 3 and the internal observation unit 4 are not directly related. In this case, the coordinates of the observation camera 35 of the laser machining head 3 and the internal observation unit 4 are indirectly associated with each other based on the alignment cameras 5 and 6 .

Next, an acquisition example of a correction coefficient used for internal observation by the internal observation unit 4 will be described with reference to the flowchart of FIG. 9 .

Prior to the above-described processing of steps S1 to S8, the following correction coefficient acquisition processing is executed. First, an object for correction coefficient is placed on stage 2 by a robot arm (not shown), and the object for correction coefficient is adsorbed on stage 2 (step S21 ). By controlling the operation of the rotary driving device of the stage 2, the first horizontal movement mechanism 8A, and the second horizontal movement mechanism 8B by the control unit 9, the control unit correction coefficient object is moved to the penetrating light beam of the internal observation unit 4. The lower part of the optical lens 43.

FIG. 10 is a side view showing the correction factor object 60 . As shown in FIG. 10 , the correction factor target object 60 includes a back surface 60 b and a surface 60 a opposite to the back surface 60 b. The modified region 12 aligned in the X direction along the back surface 60 b and the front surface 60 a and the cracks extending from the modified region 12 are formed on the correction coefficient target object 60 by laser processing. In particular, in the object for correction coefficient 60 , cracks 14 extending from the modified region 12 in a direction intersecting the Z direction and the X direction are formed. In the object for correction coefficient 60 , a plurality of rows of modified regions 12 are formed so as to be aligned in the Z direction.

On the object 60 for correction coefficient, a fractured surface is formed so that the modified region 12 is exposed, and the position of each modified region 12 in the Z direction is actually measured as, for example, the position of the crack 14 by observing the fractured surface. And known. The known measured value may be held by the control unit 9 or may be held in any storage device accessible to the control unit 9 .

Next, the correction factor object 60 is imaged by the transmitted light I1 (step S22). In step S22 , under the control of the internal observation unit 4 , among the cracks extending from the modified region 12 , the crack 14 extending in the direction intersecting the Z direction and the X direction is imaged with the transmitted light I1 . In step S2, the control unit 9 controls the internal observation unit 4 and the second vertical movement mechanism 7B so that the transmitted light I1 enters from the back surface 60b of the correction factor object 60 and moves the internal observation unit 4 in the Z direction. , the condensing position of the transmitted light I1 is moved along the Z direction so that the condensing position of the transmitted light I1 coincides with a plurality of positions inside the correction factor object 60, and the correction factor object 60 is photographed multiple times. . Thereby, a plurality of internal images are acquired. Furthermore, in step S22 , the correction coefficient target object 60 may be captured while adjusting the luminance value of the internal image and blocking the internal image according to the observation area.

Next, the imaging data related to the internal image is saved (step S23). In step S23, information on the amount of movement is associated with each of the internal images and stored as imaging data. Next, the control unit 9 inputs imaging data (step S24). Furthermore, the control unit 9 judges the formation state of the crack 14 (step S25). Here, as an example, the control unit 9 automatically determines an internal image in which cracks are relatively clear among a plurality of internal images by image recognition (performs AI determination).

Next, the correction coefficient is exported by the control unit 9 (step S26). In step S26, the control unit 9 outputs a correction coefficient for each of the plurality of modified regions 12 aligned in the Z direction so that the value obtained by multiplying the movement amount by the correction coefficient, that is, the measured value of the position of the modified region 12 becomes The corresponding measured value. In other words, the control unit 9 outputs the correction coefficient as correction coefficient=actually measured value/movement amount. Then, the control unit 9 saves the data indicating the exported correction coefficient (step S27), and ends the process.

As mentioned above, in the laser processing apparatus 1, the cameras 5 and 6 for alignment, and the internal observation unit 4 are each movable in the Z direction by mutually different moving mechanisms. Thereby, during observation by the internal observation unit 4 , the weight moving in the Z direction can be reduced and vibration can be suppressed. The time it takes for this vibration to stop can be reduced. In addition, even if any one of the alignment cameras 5 and 6 and the internal observation unit 4 is in operation, the other can be moved in the Z direction. Therefore, according to the laser processing device 1 , it is possible to realize a takt acceleration, and to reduce observation failures caused by the internal observation unit 4 .

The laser processing apparatus 1 has the 1st horizontal movement mechanism 8A which moves the stage 2 to X direction, and the 2nd horizontal movement mechanism 8B which moves the stage 2 to the Y direction. In this case, by moving the stage 2 in the X direction and the Y direction, the laser light irradiation position of the object 20 generated by the laser processing head 3 (the focusing position of the laser light L), and the position for alignment can be adjusted. The imaging position (information acquisition position) of the object 20 by the cameras 5 and 6 and the observation position of the object 20 by the internal observation unit 4 move in the X direction and the Y direction.

In the laser processing apparatus 1 , the first vertical movement mechanism 7A has a first vertical axis 71 provided on the first base portion 75 and moves the laser processing head 3 in the Z direction along the first vertical axis 71 . The second vertical movement mechanism 7B has a second vertical axis 72 provided on a second base portion 76 separated from the first base portion in the X horizontal direction, and moves the internal observation unit 4 in the Z direction along the second vertical axis 72 . In this case, a compact device structure in the Y direction can be achieved. By arranging the laser processing apparatus 1 such that the X direction is along the direction of the production line, an apparatus configuration suitable for the production line can be realized.

In the laser processing apparatus 1, the laser processing head 3 and the internal observation unit 4 are configured so as to be immovable in the X direction and the Y direction. In this case, since the alignment cameras 5, 6 and the internal observation unit 4 do not move in the X direction and the Y direction, it is possible to avoid movement of the alignment cameras 5, 6 and the internal observation unit 4 in the X direction and the Y direction. generation of vibration.

In the laser processing apparatus 1 , the stage 2 is configured to be rotatable about a rotation axis along the Z direction. In this case, by rotating the stage 2, the laser light irradiation position of the object 20 by the laser processing head 3, the imaging position of the object 20 by the alignment cameras 5 and 6, and internal observation can be made. The observation position of the object 20 generated by the unit 4 moves in the rotation direction.

In the laser processing device 1 , the alignment cameras 5 and 6 are used as information acquisition units to irradiate the object 20 with light and receive the light returned from the object 20 to acquire an image for alignment. In this case, acquisition of information for alignment and internal observation of the object 20 can be realized concretely.

In the laser processing device 1, the control unit 9 moves the stage 2 in the X direction, the Y direction, and the θ direction based on the imaging results of the alignment cameras 5 and 6, so that the focusing position of the laser light L is aligned with the target object. 20's specified position, and get the alignment information. When using the internal observation unit 4 to observe the inside of the object 20, the control unit 9 moves the stage 2 in the X direction, the Y direction, and the θ direction according to the alignment information and the XYθ correction information, and makes the transmitted light condensing lens The optical axis of 43 coincides with this predetermined position. Thereby, alignment can be performed, and the alignment information at this time can be shared for observation by the internal observation unit 4 .

In the laser processing apparatus 1, the control unit 9 makes the stage 2 rotate in the X direction, It moves in the Y direction and the θ direction, and obtains the first XYθ information which is the position information of the stage 2 after the movement. The control unit 9 moves the stage 2 in the X direction, the Y direction, and the θ direction so that the center 125 of the test object 20T supported by the stage 2 is located on the optical axis of the transmitted light condenser lens 43 , and obtain the second XYθ information as the position information of the stage 2 after the movement. The control unit 9 obtains XYθ correction information according to the first XYθ information and the second XYθ information. In this case, XYθ correction information can be obtained specifically.

The laser processing device 1 includes only one stage 2 . In other words, in the laser processing apparatus 1, one stage 2 is used for a plurality of units (laser processing head 3 and internal observation unit 4). In this way, since each process is performed by one stage 2, it is possible to realize takt acceleration.

[Second Embodiment] Next, a second embodiment will be described. In the description of this embodiment, the same points as those of the first embodiment will be omitted, and the different points will be described.

As shown in FIG. 11 , the laser processing apparatus 101 of the second embodiment is different from the laser processing apparatus 1 of the first embodiment (see FIG. 1 ) in that a first vertical movement mechanism 107A is provided instead of the first vertical movement mechanism. The mechanism 7A (see FIG. 1 ) includes a second vertical movement mechanism 107B instead of the second vertical movement mechanism 7B (see FIG. 1 ).

The first vertical movement mechanism 107A is a mechanism that moves the laser processing head 3 in the Z direction together with the alignment cameras 5 and 6 . The first vertical movement mechanism 107A has a first vertical shaft 171 provided on one side in the X direction of a columnar first base portion 175 . The first base portion 175 is fixed to, for example, an installation surface or the like. The first vertical axis 171 extends along the Z direction. On the first vertical axis 171, the mounting part 39 of the laser machining head 3 is mounted so as to be movable in the Z direction. Such a first vertical movement mechanism 107A moves the laser machining head 3 in the Z direction along the first vertical axis 171 by the driving force of a driving source not shown. The first vertical movement mechanism 107A is not particularly limited, and various mechanisms can be used as long as the laser processing head 3 can be moved in the Z direction.

The second vertical movement mechanism 107B is a mechanism that moves the internal observation unit 4 in the Z direction. The second vertical movement mechanism 107B has a second vertical shaft 172 provided on the other side of the first base portion 175 in the X direction. That is, both the first vertical axis 171 and the second vertical axis 172 are provided on the first base portion 175 and arranged to face each other through the first base portion 175 . The second vertical axis 172 extends along the Z direction. On the second vertical axis 172, the mounting portion 49 of the internal observation unit 4 is mounted so as to be movable in the Z direction. Such a second vertical movement mechanism 107B moves the internal observation unit 4 in the Z direction along the second vertical axis 172 by the driving force of a driving source not shown. The second vertical movement mechanism 107B is not particularly limited, and various mechanisms can be used as long as the internal observation unit 4 can be moved in the Z direction.

As described above, also in the laser processing apparatus 101 , the takt acceleration can be realized, and observation failures and the like caused by the internal observation unit 4 can be reduced. In addition, in the laser processing apparatus 101 , it is possible to realize an apparatus configuration in which the base portion on which the first vertical axis 171 and the second vertical axis 172 are provided is shared as the first base portion 175 .

[Third Embodiment] Next, a third embodiment will be described. In the description of this embodiment, the same points as those of the first embodiment will be omitted, and the different points will be described.

As shown in FIG. 12 , the laser processing apparatus 201 of the third embodiment differs from the laser processing apparatus 1 of the first embodiment (see FIG. 1 ) in that a first vertical movement mechanism 207A is provided instead of the first vertical movement. Mechanism 7A (see FIG. 1 ) includes second vertical movement mechanism 207B instead of second vertical movement mechanism 7B (see FIG. 1 ), and further includes laser processing head 203 similar to laser processing head 3 .

The first vertical movement mechanism 207A is a mechanism that moves the laser processing head 3 in the Z direction together with the alignment cameras 5 and 6 . The first vertical movement mechanism 207A has a first vertical axis 271 provided on a columnar first base portion 275 . The first base portion 275 is fixed to, for example, an installation surface or the like. The 1st base part 275 is arrange|positioned apart from the 1st horizontal axis 81 of 8 A of 1st horizontal movement mechanisms to one side of a Y direction. The first vertical axis 271 extends along the Z direction. On the first vertical axis 271, the mounting part 39 of the laser machining head 3 is mounted so as to be movable in the Z direction. Such a first vertical movement mechanism 207A moves the laser machining head 3 in the Z direction along the first vertical axis 271 by the driving force of a driving source not shown. The first vertical movement mechanism 207A is not particularly limited, and various mechanisms can be used as long as the laser processing head 3 can be moved in the Z direction.

The second vertical movement mechanism 207B is a mechanism that moves the internal observation unit 4 in the Z direction together with the laser processing head 203 . The second vertical movement mechanism 207B has a second vertical axis 272 provided on a columnar second base portion 276 . The second base portion 276 is fixed on, for example, an installation surface or the like. The second base portion 276 is separated from the first base portion 275 to the other side in the Y direction. The second base portion 276 is separated to the other side in the Y direction with respect to the first horizontal axis 81 of the first horizontal movement mechanism 8A. The second vertical axis 272 extends along the Z direction. On the second vertical axis 272, the mounting part 49 of the internal observation unit 4 is mounted so as to be movable in the Z direction. Such a second vertical movement mechanism 207B moves the internal observation unit 4 in the Z direction along the second vertical axis 272 by the driving force of a driving source not shown. The second vertical movement mechanism 207B is not particularly limited, and various mechanisms can be used as long as the internal observation unit 4 can be moved in the Z direction.

The laser processing head 203 is configured similarly to the laser processing head 3 . The laser processing head 203 is installed on the mounting part 49 . The laser processing head 203 is arranged on the attachment part 49 so as to face the laser processing head 3 in the Y direction.

As described above, also in the laser processing apparatus 201 , there is an effect that the takt speed can be realized, and observation failures and the like caused by the internal observation unit 4 can be reduced. In addition, in the laser processing apparatus 201, a compact apparatus structure in the X direction can be realized.

The above embodiments have described one embodiment of the present invention. Therefore, the present invention is not limited to the aforementioned embodiments, and can be modified arbitrarily.

In the aforementioned embodiment, the cameras 5 and 6 for alignment are used as the information acquisition unit, but it is not limited thereto, and a sensor or the like may be used as long as information for alignment can be acquired. In the aforementioned embodiment, the second vertical movement mechanisms 7B, 107B, and 207B that move the entire internal observation unit 4 in the Z direction are used, but instead, the transmitted light condensing lens 43 can be used to move the transmitted light condensing lens 43 in the Z direction. A moving actuator or the like acts as a second vertical movement mechanism. In this case, the alignment cameras 5 and 6 and the transmitted light condenser lens 43 can be moved in the Z direction by mutually different moving mechanisms.

In the aforementioned embodiment, the alignment information is information related to the positions in the X direction, the Y direction, and the θ direction, but the alignment information may be information related to the positions in the X direction and the Y direction only. In the aforementioned embodiment, the position correction information is XYθ correction information related to positions in the X direction, Y direction, and θ direction, but it may be information related to only the positions in the X direction and Y direction. In each configuration in the above-mentioned embodiments and modifications, the above-mentioned materials and shapes are not limited, and various materials and shapes can be applied. In addition, each structure in the above-mentioned embodiment and modification can be arbitrarily applied to each structure in another embodiment or modification.

According to the present invention, it is possible to provide a laser processing apparatus capable of speeding up the takt and reducing observation failures in the internal observation unit.

1,201: Laser processing device 2: stage 3,203: laser processing head 4: Internal Observation Unit 5,6: Camera for alignment 7A, 107A, 207A: the first vertical movement mechanism 7B, 107B, 207B: the second vertical movement mechanism 8A: The first horizontal movement mechanism 8B: The second horizontal movement mechanism 9: Control Department 10: GUI 12,12a,12b: modified area 14: Crack 15: line 20: object 21: Semiconductor substrate 21a: Surface 21b: back 21c: notch 22: Functional component layer 22a: Functional elements 23: cutting lane area 31: light source 32: dichroic mirror 33:Laser light condenser lens 35: Observation camera 36: visible light source 37: dichroic mirror 38: lens 39: Installation Department 41: light source 42: Mirror 43: penetrating light condenser lens 44: Light detection unit 49: Installation department 60: Object for correction coefficient 60a: surface 60b: back 71,171,271: first vertical axis 72,172,272: Second vertical axis 75,175,275: first base 76,276: second base 81: First horizontal axis 82: Second horizontal axis 125: center C: spotlight position H3, H4: frame I1: penetrating light L: laser light 20T: Object for testing V: Visible light

[ Fig. 1 ] is a configuration diagram showing a laser processing apparatus according to a first embodiment.

[FIG. 2] It is a top view which shows the object of FIG. 1. [FIG.

[ Fig. 3 ] is a cross-sectional view showing part of the object in Fig. 2 .

[ Fig. 4 ] is a configuration diagram showing the laser processing head of Fig. 1 .

[ Fig. 5 ] is a configuration diagram showing the internal observation unit of Fig. 1 .

[ Fig. 6 ] is a flowchart showing an example of operation in the laser processing apparatus of Fig. 1 .

[FIG. 7] It is a flowchart which shows the acquisition process of XYθ correction information performed by the laser processing apparatus of FIG. 1. [FIG.

[ Fig. 8 ] is a plan view showing a test object.

[FIG. 9] It is a flowchart which shows the correction coefficient acquisition process performed by the laser processing apparatus of FIG. 1. [FIG.

[ Fig. 10 ] is a side view showing an object for correction coefficient.

[ Fig. 11 ] is a configuration diagram showing a laser processing apparatus according to a second embodiment.

[ Fig. 12 ] is a configuration diagram showing a laser processing apparatus according to a third embodiment.

1: Laser processing device

2: stage

3: Laser processing head

4: Internal Observation Unit

5,6: Camera for alignment

7A: The first vertical movement mechanism

7B: The second vertical movement mechanism

8A: The first horizontal movement mechanism

8B: The second horizontal movement mechanism

9: Control Department

10: GUI

20: object

39: Installation Department

49: Installation Department

71: First vertical axis

72: Second vertical axis

75: First base part

76:Second basal part

81: First horizontal axis

82: Second horizontal axis

Claims (10)

A laser processing device that forms a modified region on the object by irradiating laser light on the object, and is characterized by having: a support unit that supports the aforementioned object; an irradiation unit for irradiating the laser light on the object supported by the support unit; an information acquisition unit, which is provided in the irradiation unit, and acquires information on the alignment of the focusing position of the laser light in the object; an internal observation unit having a penetrating light converging lens for converging penetrating light penetrating the object on the object, and observing the inside of the object through the penetrating light; a first vertical movement mechanism, which moves the irradiation unit together with the information acquisition unit in the vertical direction; a second vertical movement mechanism that moves at least one of the internal observation unit and the transmitted light condensing lens in a vertical direction; a horizontal movement mechanism that moves the aforementioned support portion in the horizontal direction; and A control unit at least controls operations of the first vertical movement mechanism, the second vertical movement mechanism, and the horizontal movement mechanism. The laser processing device as claimed in item 1, wherein, The aforementioned horizontal movement mechanism has: a first horizontal movement mechanism that moves the aforementioned support portion along a first horizontal direction; and A second horizontal movement mechanism that moves the support portion along a second horizontal direction perpendicular to the first horizontal direction. Such as the laser processing device of claim 2, wherein, The first vertical movement mechanism has a first vertical shaft provided on the first base part, and moves the irradiation part in a vertical direction along the first vertical shaft, The aforementioned second vertical movement mechanism has a second vertical axis arranged on the second base portion separated from the aforementioned first base portion in the aforementioned first horizontal direction, so that the aforementioned internal observation portion moves in the vertical direction along the aforementioned second vertical axis. move up. Such as the laser processing device of claim 2, wherein, The first vertical movement mechanism has a first vertical shaft provided on one side of the first horizontal direction of the first base part, and moves the irradiation part in the vertical direction along the first vertical shaft, The second vertical movement mechanism has a second vertical axis provided on the other side of the first base portion in the first horizontal direction, and moves the internal observation portion in the vertical direction along the second vertical axis. Such as the laser processing device of claim 2, wherein, The first vertical movement mechanism has a first vertical shaft provided on the first base part, and moves the irradiation part in a vertical direction along the first vertical shaft, The second vertical movement mechanism has a second vertical axis arranged on the second base portion, and moves the inner observation portion in the vertical direction along the second vertical axis, and the second base portion is opposite to each other in the second horizontal direction. separate from the aforementioned first base. The laser processing device according to any one of claims 1 to 5, wherein, The irradiation unit and the internal observation unit are configured so as not to move in the horizontal direction. The laser processing device according to any one of claims 1 to 5, wherein, The support portion is configured to be rotatable about a rotation axis along the vertical direction. The laser processing device according to any one of claims 1 to 7, wherein, The information acquisition unit acquires information for aligning a light-converging position of the laser light by irradiating light to the object and receiving the light returned from the object. The laser processing device according to any one of claims 1 to 8, wherein, The aforementioned control department executes: Based on the information acquired by the information acquisition unit, the support unit is moved in the horizontal direction by the horizontal movement mechanism to align the focusing position of the laser light with a predetermined position in the object, and obtain the alignment time The processing of the alignment information related to the position information of the aforementioned support portion; and When observing the inside of the object with the internal observation unit, the support unit is moved along the horizontal movement mechanism based on the alignment information and the position correction information related to the positional relationship of the internal observation unit with respect to the irradiation unit. Moving in the horizontal direction to align the optical axis of the transmitted light condenser lens with the predetermined position in the object. Such as the laser processing device of claim 9, wherein, The irradiation unit has a laser light condensing lens for condensing the laser light on the object, The aforementioned control department executes: With the reference position of the test object supported by the support part on the optical axis of the laser light condensing lens, the support part is moved along the horizontal direction by the horizontal movement mechanism, and the moved Processing of the first information as the position information of the aforementioned support portion; In such a manner that the reference position of the test object supported by the support is on the optical axis of the transmitted light condenser lens, the support is moved in the horizontal direction by the horizontal movement mechanism, and the movement is obtained. The subsequent processing of the second information as the position information of the aforementioned support portion; and The process of obtaining the aforementioned location correction information according to the aforementioned first information and the aforementioned second information.

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