TW202305759A - Light-emitting smart card - Google Patents

Light-emitting smart card Download PDF

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TW202305759A
TW202305759A TW110126895A TW110126895A TW202305759A TW 202305759 A TW202305759 A TW 202305759A TW 110126895 A TW110126895 A TW 110126895A TW 110126895 A TW110126895 A TW 110126895A TW 202305759 A TW202305759 A TW 202305759A
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light
board
emitting
smart card
power transmission
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TW110126895A
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Chinese (zh)
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TWI779733B (en
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黃文賢
劉啟光
林詩宗
陳岱頤
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宏通數碼科技股份有限公司
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Abstract

A light-emitting smart card includes a plate body, at least one light-emitting element, at least one power transmission element and a light guide element. The plate body has a first surface, a second surface and a side surface. The first surface is opposite to the second surface, and the side surface is located between the first surface and the second surface and is connected to the first surface and the second surface respectively. The at least one light-emitting element is disposed in the plate body. The at least one power transmission element is disposed in the plate body and is electrically connected with the at least one light-emitting element. The at least one power transmission element is used for supplying power to the at least one light-emitting element to emit light.

Description

外型發光智慧卡Light-emitting smart card

本發明是有關於一種智慧卡,特別是有關於一種可發光的智慧卡。The invention relates to a smart card, in particular to a luminous smart card.

可攜式卡片廣泛用於現今日常生活中例如消費、身分識別、交通、財務管理等各種領域。卡片上習知印有文字或圖像,一來提供裝飾效果、二來令使用者能區別卡片的用途。習知的卡片通常沒有提示的功能,因此在使用時僅能透過讀卡設備的提示音來告知使用者讀卡完成。Portable cards are widely used in various fields such as consumption, identification, transportation, financial management, etc. in today's daily life. It is known that text or images are printed on the card, first to provide a decorative effect, and second to enable users to distinguish the purpose of the card. Conventional cards usually do not have a reminder function, so the user can only be notified of the completion of card reading through the prompt sound of the card reading device during use.

本發明提供一種發光智慧卡,以具有動態裝飾功能。The invention provides a luminous smart card with a dynamic decoration function.

本發明提供一種發光智慧卡,以具有提示功能。The invention provides a luminous smart card with a prompt function.

本發明所提供的發光智慧卡包括板體、至少一發光元件、至少一電力傳輸元件以及導光元件。板體具有第一表面、第二表面以及側表面,其中第一表面與第二表面相對,側表面位於第一表面及第二表面間且與第一表面及第二表面分別連接。至少一發光元件設置於板體內。至少一電力傳輸元件設置於板體內,且與至少一發光元件電性連接。至少一電力傳輸元件用以供電予至少一發光元件使其產生光線。The light-emitting smart card provided by the present invention includes a board body, at least one light-emitting element, at least one power transmission element and a light-guiding element. The plate body has a first surface, a second surface and a side surface, wherein the first surface is opposite to the second surface, and the side surface is located between the first surface and the second surface and connected with the first surface and the second surface respectively. At least one light emitting element is arranged in the board body. At least one power transmission element is disposed in the board and electrically connected with at least one light emitting element. At least one power transmission element is used to supply power to at least one light emitting element to generate light.

在本發明的一實施例中,上述之至少一發光元件具有發光面,且發光面面對該導光元件的至少一部分。In an embodiment of the present invention, the above-mentioned at least one light-emitting element has a light-emitting surface, and the light-emitting surface faces at least a part of the light-guiding element.

在本發明的一實施例中,上述之至少一電力傳輸元件包括第一電力傳輸元件。第一電力傳輸元件透過無線感應單元產生電力供予至少一發光元件。In an embodiment of the present invention, the above-mentioned at least one power transmission element includes a first power transmission element. The first power transmission element generates power through the wireless induction unit to supply at least one light emitting element.

在本發明的一實施例中,上述之發光智慧卡更包括電路板,且至少一發光元件設置於電路板上並與電路板電性連接。In an embodiment of the present invention, the above-mentioned light-emitting smart card further includes a circuit board, and at least one light-emitting element is disposed on the circuit board and electrically connected to the circuit board.

在本發明的一實施例中,上述之第一電力傳輸元件與電路板電性連接,且電路板與至少一發光元件是模組化設置於板體內。In an embodiment of the present invention, the above-mentioned first power transmission element is electrically connected to the circuit board, and the circuit board and at least one light-emitting element are modularly arranged in the board.

在本發明的一實施例中,上述之板體具有第一板材、第二板材以及第三板材。第三板材位於第一板材與第二板材間,且第一板材、第二板材以及第三板材平行相疊連接。In an embodiment of the present invention, the above board body has a first board material, a second board material and a third board material. The third board is located between the first board and the second board, and the first board, the second board and the third board are connected parallel to each other.

在本發明的一實施例中,上述之第三板材可透光,且至少一發光元件及導光元件設置於第三板材。In an embodiment of the present invention, the above-mentioned third plate can transmit light, and at least one light emitting element and light guiding element are disposed on the third plate.

在本發明的一實施例中,上述之第三板材更包含第一保護層、第二保護層以及中間層。中間層位於第一保護層與第二保護層間,且至少一發光元件及導光元件設置於中間層。In an embodiment of the present invention, the above-mentioned third plate further includes a first protective layer, a second protective layer and an intermediate layer. The intermediate layer is located between the first protective layer and the second protective layer, and at least one light emitting element and light guiding element are arranged in the intermediate layer.

在本發明的一實施例中,上述之中間層更具有至少一容置槽,且至少一發光元件設置於至少一容置槽。In an embodiment of the present invention, the above-mentioned intermediate layer further has at least one accommodating groove, and at least one light-emitting element is disposed in the at least one accommodating groove.

在本發明的一實施例中,上述之第一板材更包括第一遮光層,第一遮光層上具有由顏料構成的至少一範圍。In an embodiment of the present invention, the above-mentioned first board further includes a first light-shielding layer, and the first light-shielding layer has at least one area formed of pigments.

在本發明的一實施例中,上述之第二板材更包括第二遮光層,第二遮光層上具有由顏料構成的至少一範圍。In an embodiment of the present invention, the above-mentioned second board further includes a second light-shielding layer, and the second light-shielding layer has at least one area formed of pigments.

在本發明的一實施例中,上述之發光智慧卡更包括至少一晶片設置於板體中。In an embodiment of the present invention, the above-mentioned light-emitting smart card further includes at least one chip disposed in the board body.

在本發明的一實施例中,上述之至少一電力傳輸元件更包括第二電力傳輸元件。第二電力傳輸元件與至少一晶片電性連接,且透過無線感應產生電力予至少一晶片。In an embodiment of the present invention, the above at least one power transmission element further includes a second power transmission element. The second power transmission element is electrically connected with at least one chip, and generates power to at least one chip through wireless induction.

在本發明的一實施例中,上述之板體更具有出光區位於側表面,且光線從出光面射出於板體外。In an embodiment of the present invention, the above-mentioned plate body further has a light exit area located on a side surface, and light is emitted from the light exit surface out of the plate body.

本發明還提供一種發光智慧卡,包括板體、至少一發光元件以及至少一電力傳輸元件。板體具有第一板材、第二板材、導光材料層以及側表面。導光材料層位於第一板材與第二板材間,且第一板材、第二板材以及導光材料層平行相疊且連接。至少一發光元件設置於導光材料層。至少一電力傳輸元件設置於板體內,且與至少一發光元件電性連接。至少一電力傳輸元件用以供電予至少一發光元件,使至少一發光元件產生光線,其中導光材料層導引光線至側表面以射出於板體外。The present invention also provides a light-emitting smart card, which includes a board body, at least one light-emitting element and at least one power transmission element. The plate body has a first plate, a second plate, a light guide material layer and side surfaces. The light guide material layer is located between the first board and the second board, and the first board, the second board and the light guide material layer are stacked in parallel and connected. At least one light-emitting element is disposed on the light-guiding material layer. At least one power transmission element is disposed in the board and electrically connected with at least one light emitting element. At least one power transmission element is used to supply power to at least one light-emitting element, so that the at least one light-emitting element generates light, wherein the light-guiding material layer guides the light to the side surface to be emitted out of the board.

相較於習知卡片僅具有文字或圖像,以及使用時僅透過讀卡設備的提示音來知悉讀卡完成,本發明因採用發光元件及導光元件,因此卡片本身即具有提示功能,且提供動態裝飾效果,因而有助提升卡片的附加價值。Compared with the conventional cards that only have text or images, and only know the completion of card reading through the prompt sound of the card reading device during use, the present invention uses light-emitting elements and light-guiding elements, so the card itself has a prompt function, and Provides a dynamic decorative effect, thus helping to increase the added value of the card.

為讓本發明之上述和其他目的、特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式,作詳細說明如下。In order to make the above and other objects, features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

本發明之發光智慧卡適用於例如會員卡、名片、廣告小卡、金融卡、信用卡、儲值卡、交通卡、門禁卡、健保卡及自然人憑證等,但不以此為限。此外本發明之發光智慧卡可為非接觸式或接觸式,前者透過例如與讀寫裝置間的感應生電而發光,並進行資訊的讀取或寫入,後者透過例如金屬觸點、晶片接點或磁條來實現電力供給並完成通訊。The luminescent smart card of the present invention is applicable to, for example, membership cards, business cards, small advertising cards, financial cards, credit cards, stored-value cards, traffic cards, access control cards, health insurance cards, and certificates for natural persons, but not limited thereto. In addition, the light-emitting smart card of the present invention can be non-contact or contact-type. The former emits light through, for example, inductive electricity between the read-write device and reads or writes information, and the latter through, for example, metal contacts, chip contacts, etc. Dots or magnetic stripes for power supply and communication.

圖1是本發明之一實施例的發光智慧卡的立體示意圖,圖2是圖1的分解圖。請參照圖1及圖2,本實施例之發光智慧卡1包括板體10、至少一發光元件220、導光元件300以及至少一電力傳輸元件400。板體10具有第一表面101、第二表面102以及側表面103,其中第一表面101與第二表面102相對,而側表面103位於第一表面101及第二表面102間,且側表面103之上緣與下緣分別與第一表面101及第二表面102連接。本實施例之外形大致為矩形,因而側表面103大致位於矩形的四個邊。然而,本發明不限制發光智慧卡1的外形,且板體10依功能、視覺效果等而可為各種可能的形狀。FIG. 1 is a three-dimensional schematic diagram of a light-emitting smart card according to an embodiment of the present invention, and FIG. 2 is an exploded view of FIG. 1 . Please refer to FIG. 1 and FIG. 2 , the light-emitting smart card 1 of this embodiment includes a board body 10 , at least one light-emitting element 220 , a light-guiding element 300 and at least one power transmission element 400 . The plate body 10 has a first surface 101, a second surface 102 and a side surface 103, wherein the first surface 101 is opposite to the second surface 102, and the side surface 103 is located between the first surface 101 and the second surface 102, and the side surface 103 The upper edge and the lower edge are respectively connected to the first surface 101 and the second surface 102 . The shape of this embodiment is roughly rectangular, so the side surfaces 103 are roughly located on four sides of the rectangle. However, the present invention does not limit the shape of the light-emitting smart card 1 , and the board body 10 can be in various possible shapes according to functions and visual effects.

如圖2所示,進一步而言,板體10至少由第一板材110、第二板材120以及第三板材130組成,其中第三板材130位於第一板材110與第二板材120間,且第一板材110、第二板材120以及第三板材130平行相疊,並透過任何方式而連接,例如在板材的表面上膠並將其貼合、壓合,或對表面進行特殊處理以接合。板材的材料可為聚碳酸酯 (PC)、聚氯乙烯 (PVC)、聚對苯二甲酸乙二醇酯-1,4環己烷二甲醇酯 (PETG)、聚對苯二甲酸乙二酯 (PET)以及丙烯腈-丁二烯-苯乙烯共聚物(ABS)、聚甲基丙烯酸甲酯 (PMMA)或選自其的組合。As shown in Figure 2, further speaking, the board body 10 is at least composed of a first board 110, a second board 120 and a third board 130, wherein the third board 130 is located between the first board 110 and the second board 120, and the second A plate 110 , a second plate 120 and a third plate 130 are stacked in parallel and connected by any means, such as gluing the surfaces of the plates and bonding them, pressing them, or performing special treatment on the surfaces for jointing. The material of the board can be polycarbonate (PC), polyvinyl chloride (PVC), polyethylene terephthalate-1,4 cyclohexanedimethanol (PETG), polyethylene terephthalate (PET) and acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA) or a combination selected from them.

至少一發光元件220及至少一電力傳輸元件400設置於板體100內,且較佳來說,主要設置於第三板材130。第三板材130可透光。至少一電力傳輸元件400可包括第一電力傳輸元件410。第一電力傳輸元件410與至少一發光元件220電性連接,並用以供電予發光元件220,使發光元件220產生光線。發光元件220例如為發光二極體光源,可發出一或多種色光、可連續或間歇發光。進一步而言,第一電力傳輸元件410接收例如讀寫裝置的電磁波而透過感應生成電力。當發光智慧卡10為非接觸式卡片,舉例來說,可藉由感應生電供電予發光元件220。第一電力傳輸元件410亦可與金屬觸點(圖未示)電性連接,金屬觸點並裸露於板體10的第一表面101或第二表面102。當發光智慧卡10為接觸式卡片,舉例來說,可藉由金屬觸點從讀寫裝置接收電力而供電予發光元件220。惟本發明不限制卡片為接觸式時或為非接觸時之電力供應方式及通訊方式。At least one light emitting element 220 and at least one power transmission element 400 are disposed inside the board body 100 , and preferably, are mainly disposed on the third board 130 . The third board 130 is transparent. The at least one power transmission element 400 may include a first power transmission element 410 . The first power transmission element 410 is electrically connected to at least one light emitting element 220 and is used to supply power to the light emitting element 220 so that the light emitting element 220 generates light. The light emitting element 220 is, for example, a light emitting diode light source, which can emit one or more colors of light, and can emit light continuously or intermittently. Furthermore, the first power transmission element 410 receives, for example, electromagnetic waves from a read/write device to generate power through induction. When the light-emitting smart card 10 is a contactless card, for example, it can supply power to the light-emitting element 220 by inductively generating electricity. The first power transmission element 410 can also be electrically connected to a metal contact (not shown in the figure), and the metal contact is exposed on the first surface 101 or the second surface 102 of the board body 10 . When the luminous smart card 10 is a contact card, for example, the power can be supplied to the light-emitting element 220 by receiving power from the read-write device through metal contacts. But the present invention does not limit the power supply method and communication method when the card is contact or non-contact.

第一電力傳輸元件410例如為天線。天線可由漆包線繞線形成並具有金、紅之色澤,而如圖2所示,本實施例之天線為矩形。然本發明不以此為限。首先天線可經染色處理而具有金、紅以外之顏色,例如依據發光元件220之光色而染為銀或其他色,再者天線之形狀、位置可因應發光元件220調整,以最佳化感應效率。The first power transmission element 410 is, for example, an antenna. The antenna can be formed by winding an enameled wire and has gold or red color. As shown in FIG. 2 , the antenna in this embodiment is rectangular. However, the present invention is not limited thereto. First, the antenna can be dyed to have colors other than gold and red, for example, it can be dyed silver or other colors according to the light color of the light emitting element 220, and the shape and position of the antenna can be adjusted according to the light emitting element 220 to optimize the sensing efficiency.

本實施例進一步包括電路板250。電路板250與至少一發光元件220電性連接,且較佳與發光元件220模組化而為發光模組200。如圖2所示,本實施例之發光模組200具有兩個發光元件220,且電路板250上設置焊點260,其中第一電力傳輸元件410可藉由焊點260而與發光元件220電性連接。然而,在其他實施例中,發光模組200亦可具有其他數目之發光元件220。此外第一電力傳輸元件410也可進一步與電路板250、發光元件220模組化而為發光模組200之一部分。This embodiment further includes a circuit board 250 . The circuit board 250 is electrically connected to at least one light emitting element 220 , and is preferably modularized with the light emitting element 220 to form the light emitting module 200 . As shown in FIG. 2 , the light-emitting module 200 of this embodiment has two light-emitting elements 220 , and solder joints 260 are provided on the circuit board 250 , wherein the first power transmission element 410 can be electrically connected to the light-emitting elements 220 through the solder joints 260 . sexual connection. However, in other embodiments, the light emitting module 200 may also have other numbers of light emitting elements 220 . In addition, the first power transmission element 410 can also be further modularized with the circuit board 250 and the light emitting element 220 to become a part of the light emitting module 200 .

導光元件300設置於板體10,用以導引發光元件220產生的光線至板體10的側表面103並射出,以產生發光智慧卡1側邊發光的效果。側邊發光可為在發光智慧卡1的側邊的全部區域或局部發光。因圖2之實施例大致為矩形,側表面103圍繞著矩形的四個邊,舉例來說,當側邊的全部區域發光時,可依發光智慧卡1之矩形外型、輪廓產生發光亮框的效果。如圖2所示,導光元件300進一步設置於第三板材130,而發光元件220的發光面2200面對導光元件300的至少一部分。較佳來說,發光元件220的發光面2200朝向第三板材130的側邊,而在發光面2200與第三板材130的側邊之間設置有導光元件300。The light guide element 300 is disposed on the board body 10 for guiding the light generated by the light emitting element 220 to the side surface 103 of the board body 10 and emitting therefrom, so as to produce the side-side light-emitting effect of the luminous smart card 1 . The side lighting can be the whole area or partial lighting on the side of the luminous smart card 1 . Because the embodiment of FIG. 2 is roughly rectangular, the side surface 103 surrounds the four sides of the rectangle. For example, when the entire area of the side is illuminated, a light-emitting bright frame can be produced according to the rectangular shape and outline of the light-emitting smart card 1. Effect. As shown in FIG. 2 , the light guide element 300 is further disposed on the third plate 130 , and the light emitting surface 2200 of the light emitting element 220 faces at least a part of the light guide element 300 . Preferably, the light-emitting surface 2200 of the light-emitting element 220 faces the side of the third plate 130 , and the light-guiding element 300 is disposed between the light-emitting surface 2200 and the side of the third plate 130 .

在本實施例中,用以形成第三板材130的材料中包含具導光性能的材料(導光材料),因此,第三板材130可即為導光元件300,例如導光板。較佳來說,導光材料更構成側表面103的一部分,並在側表面103形成出光區1300。此外第三板材130可大部分或全部由導光材料所構成,亦即在第一板材110與第二板材120間者為導光材料層。In this embodiment, the material used to form the third plate 130 includes a material with light-guiding performance (light-guiding material). Therefore, the third plate 130 can be the light-guiding element 300 , such as a light-guiding plate. Preferably, the light guide material further constitutes a part of the side surface 103 and forms the light exit area 1300 on the side surface 103 . In addition, most or all of the third plate 130 may be made of light-guiding material, that is, the layer between the first plate 110 and the second plate 120 is a light-guiding material layer.

本實施例更包括至少一晶片500。如圖1-2所示,至少一晶片500設置於板體10內,且較佳而言,主要設置於第三板材130。然不以此為限。舉例來說,晶片500可設置於第一板材110及第三板材130並部分裸露於第一表面101,或設置於第二板材120及第三板材130並部分裸露於第二表面102。當發光智慧卡10為接觸式卡片,裸露的晶片500亦可作為觸點,從讀寫裝置接收電力及/或進行通訊。此外晶片500亦可與第一電力傳輸元件410連接,而第一電力傳輸元件410亦透過無線感應產生電力供予晶片500。This embodiment further includes at least one chip 500 . As shown in FIGS. 1-2 , at least one chip 500 is disposed in the board body 10 , and preferably, is mainly disposed in the third board 130 . However, it is not limited to this. For example, the chip 500 can be disposed on the first plate 110 and the third plate 130 and partially exposed on the first surface 101 , or disposed on the second plate 120 and the third plate 130 and partially exposed on the second surface 102 . When the light-emitting smart card 10 is a contact card, the bare chip 500 can also serve as a contact to receive power and/or communicate from the read-write device. In addition, the chip 500 can also be connected with the first power transmission element 410 , and the first power transmission element 410 also generates power for the chip 500 through wireless induction.

在本實施例中,如圖2所示,至少一電力傳輸元件400更包括第二電力傳輸元件420。第二電力傳輸元件420與晶片500電性連接,且透過無線感應產生電力供予晶片500。第二電力傳輸元件420例如為天線。作為第二電力傳輸元件420之天線如前所述,亦即也可經染色處理,且位置、形狀等都可因應晶片500調整,以最佳化感應效率。In this embodiment, as shown in FIG. 2 , at least one power transmission element 400 further includes a second power transmission element 420 . The second power transmission element 420 is electrically connected to the chip 500 , and generates power for the chip 500 through wireless induction. The second power transmission element 420 is, for example, an antenna. The antenna as the second power transmission element 420 can also be dyed as described above, and its position and shape can be adjusted according to the chip 500 to optimize the induction efficiency.

圖3是本發明之另一實施例的發光智慧卡的剖視示意圖。圖3之實施例與前述實施例的主要差異在於,第一板材110a更包括第一遮光層1101。第一遮光層1101可具有由顏料構成的至少一範圍。具體來說,第一遮光層1101上有顏料形成之色塊、圖案、文字或其組合,其中顏料可透過任何方式分配於第一遮光層1101,例如平版印刷、版印刷與彩色列印。不同的顏料(例如不同顏色)可提供不同的光遮蔽效果,而依據顏料分配的範圍,第一遮光層1101可全部或部分遮蔽光線,以免光線從第一表面101射出。FIG. 3 is a schematic cross-sectional view of a light-emitting smart card according to another embodiment of the present invention. The main difference between the embodiment in FIG. 3 and the previous embodiments is that the first board 110 a further includes a first light-shielding layer 1101 . The first light-shielding layer 1101 may have at least one area composed of pigments. Specifically, the first light-shielding layer 1101 has color blocks, patterns, characters or combinations thereof formed by pigments, wherein the pigments can be distributed on the first light-shielding layer 1101 by any means, such as lithography, plate printing and color printing. Different pigments (eg, different colors) can provide different light shielding effects, and according to the distribution range of the pigments, the first light shielding layer 1101 can completely or partially shield light so as to prevent light from being emitted from the first surface 101 .

如圖3所示,第一板材110a還包括第一透光層1111,設置於第一遮光層1101靠近第一板材110a之第一表面101的層面上。第一透光層1111可透光,因此使色塊、圖案、文字能顯現在板體10的第一表面101。第一透光層1111還有助於維護第一遮光層1101及/或其上顏料。As shown in FIG. 3 , the first plate 110a further includes a first transparent layer 1111 disposed on a layer of the first light shielding layer 1101 close to the first surface 101 of the first plate 110a. The first transparent layer 1111 can transmit light, so that color blocks, patterns and characters can appear on the first surface 101 of the plate body 10 . The first light-transmitting layer 1111 also helps to maintain the first light-shielding layer 1101 and/or the paint thereon.

如圖3所示,第二板材120a也可具有遮光層,即第二遮光層1202。而第二遮光層1202在靠近第二板材120a之第二表面102的層面上還設置第二透光層1212。第二遮光層1202及第二透光層1212的功能如前述第一遮光層1101及第一透光層1111,不再贅述。As shown in FIG. 3 , the second board material 120a may also have a light-shielding layer, that is, a second light-shielding layer 1202 . The second light-shielding layer 1202 is further provided with a second light-transmitting layer 1212 on a layer close to the second surface 102 of the second plate 120a. The functions of the second light-shielding layer 1202 and the second light-transmitting layer 1212 are the same as those of the above-mentioned first light-shielding layer 1101 and the first light-transmitting layer 1111 , and will not be repeated here.

此外,如圖3所示,第三板材130可進一步包含第一發光層1301及第二發光層1302。第一發光層1301及第二發光層1302可透過前述之方法接合形成,其中接合的製程可包括發光模組200與晶片500的設置及佈線。如圖4所示,舉例來說,第一發光層1301上具有容置槽1400,用以設置發光模組200及晶片500。此外第二發光層1302在相應的位置上亦具有容置槽或透孔(圖未示),而第一發光層1301與第二發光層1302的組合可形成第三板材130內的空間,所述空間並分別容納有發光模組200與晶片500。In addition, as shown in FIG. 3 , the third plate 130 may further include a first light emitting layer 1301 and a second light emitting layer 1302 . The first light-emitting layer 1301 and the second light-emitting layer 1302 can be formed by bonding by the aforementioned method, wherein the bonding process can include the arrangement and wiring of the light-emitting module 200 and the chip 500 . As shown in FIG. 4 , for example, the first light-emitting layer 1301 has a receiving groove 1400 for disposing the light-emitting module 200 and the chip 500 . In addition, the second luminescent layer 1302 also has accommodating grooves or through holes (not shown in the figure) at corresponding positions, and the combination of the first luminescent layer 1301 and the second luminescent layer 1302 can form a space in the third board 130, so The above-mentioned space accommodates the light emitting module 200 and the chip 500 respectively.

可知的是,圖1-2的實施例也可具有如圖3-4所示的第三板材130的結構。本發明實施例之第一發光層1301與第二發光層1302可全部或其中之一由導光材料所構成。採用的導光材料例如為PC、PMMA。It can be known that the embodiment shown in FIGS. 1-2 may also have the structure of the third plate 130 as shown in FIGS. 3-4 . All or one of the first light emitting layer 1301 and the second light emitting layer 1302 in the embodiment of the present invention may be made of light guiding material. The light guide material used is, for example, PC and PMMA.

圖5是本發明之另一實施例的發光智慧卡的剖視示意圖。圖5之實施例與前述實施例的主要差異在於,第三板材130更包含第一保護層1313、第二保護層1312以及中間層1313。中間層1313位於第一保護層1311及第二保護層1312間。中間層1313包含導光材料,亦可全部由導光材料所構成,且至少一發光元件200及導光元件300設置於中間層1313。電力傳輸元件400較佳也設置於中間層1313。可知的是,中間層1313可由如前述之第一發光層1301與第二發光層1302所組成。第一保護層1311及第二保護層1312能保護中間層1313及其中的元件。在本實施例中,第一保護層1311及第二保護層1312可透光,然本發明不以此為限。FIG. 5 is a schematic cross-sectional view of a light-emitting smart card according to another embodiment of the present invention. The main difference between the embodiment in FIG. 5 and the previous embodiments is that the third plate 130 further includes a first protective layer 1313 , a second protective layer 1312 and an intermediate layer 1313 . The middle layer 1313 is located between the first protection layer 1311 and the second protection layer 1312 . The middle layer 1313 includes a light-guiding material, or may be entirely made of a light-guiding material, and at least one light-emitting element 200 and the light-guiding element 300 are disposed on the middle layer 1313 . The power transmission element 400 is also preferably disposed on the middle layer 1313 . It is known that the middle layer 1313 can be composed of the first light emitting layer 1301 and the second light emitting layer 1302 as mentioned above. The first protection layer 1311 and the second protection layer 1312 can protect the middle layer 1313 and components therein. In this embodiment, the first protective layer 1311 and the second protective layer 1312 are light-transmissive, but the present invention is not limited thereto.

如圖5所示,發光智慧卡1b可進一步包括封裝材料600設置於發光模組200上,並填充發光模組200與中間層1313間的空隙。此外封裝材料600與中間層1313的導光材料間較佳能形成平整的接合面。封裝材料600可透光,且較佳能將光線有效地導引至中間層1313的導光材料。可知的是,圖1-2之實施例的第三板材130內也可填充有如圖5所示的封裝材料600。在本發明一實施例中,封裝材料600為環氧樹脂。As shown in FIG. 5 , the light-emitting smart card 1b may further include an encapsulation material 600 disposed on the light-emitting module 200 and filling the gap between the light-emitting module 200 and the intermediate layer 1313 . In addition, it is preferable to form a smooth bonding surface between the encapsulation material 600 and the light guide material of the intermediate layer 1313 . The encapsulation material 600 can transmit light, and is preferably a light guide material that can effectively guide light to the middle layer 1313 . It is known that the third board 130 in the embodiment of FIGS. 1-2 may also be filled with the encapsulation material 600 as shown in FIG. 5 . In an embodiment of the invention, the packaging material 600 is epoxy resin.

圖6A及6B示意本發明其他實施例的發光模組。請參照圖6A,發光模組200a與發光模組200的差異在於發光模組200a具有四個發光元件200。再參照圖6B,發光模組200b與發光模組200a的差異在於發光元件200的配置不同,其中發光模組200a的四個發光元件200沿著四個邊配置,發光模組200b的四個發光元件200沿著四個轉角配置。因發光元件200的數目較多,因此發光模組200a或200b相較於發光模組200可以較大。可知的是,前述實施例的發光智慧卡1、1a或1b也可採用發光模組200a或200b。圖6A-6B僅為例示,本發明並不限制發光元件的數目及配置方式。6A and 6B illustrate light emitting modules of other embodiments of the present invention. Please refer to FIG. 6A , the difference between the light emitting module 200 a and the light emitting module 200 is that the light emitting module 200 a has four light emitting elements 200 . Referring to FIG. 6B again, the difference between the light emitting module 200b and the light emitting module 200a is that the configuration of the light emitting elements 200 is different, wherein the four light emitting elements 200 of the light emitting module 200a are arranged along four sides, and the four light emitting elements 200 of the light emitting module 200b are arranged along four sides. The elements 200 are arranged along four corners. Due to the large number of light emitting elements 200 , the light emitting module 200 a or 200 b can be larger than the light emitting module 200 . It can be known that the light-emitting smart card 1, 1a or 1b of the foregoing embodiments can also use the light-emitting module 200a or 200b. 6A-6B are only examples, and the present invention does not limit the number and configuration of the light emitting elements.

圖7及圖8示意本發明其他實施例的發光智慧卡。圖7之實施例與前述實施例的主要差異在於,發光模組200b的數目以及在板體1c內的排列方式。可知的是,圖7僅為例示,本發明不限制發光模組的數目及排列方式。多個發光模組200b可同時或不同時發光,而發出的光色可相同或不同,並可進而產生在側邊的不同區域異色發光及/或多色亮框的效果。此外發光模組200b可全部與第一電力傳輸元件410(請參圖2)連接,然亦可與不同的電力傳輸元件400連接。舉例來說,至少一電力傳輸元件400可更包括第三電力傳輸元件(圖未示)。第三電力傳輸元件與第一電力傳輸元件410例如可分別與兩個發光模組200b電性連接。第三電力傳輸元件與第一電力傳輸元件410還可分別供電予發光模組200b,進而調控多個發光模組200b的發光。7 and 8 illustrate light-emitting smart cards of other embodiments of the present invention. The main difference between the embodiment in FIG. 7 and the previous embodiments lies in the number of light emitting modules 200b and the arrangement in the board body 1c. It can be seen that FIG. 7 is only an example, and the present invention does not limit the number and arrangement of the light emitting modules. The multiple light emitting modules 200b can emit light at the same time or not at the same time, and the emitted light colors can be the same or different, and can further produce the effect of different color light and/or multicolor bright frame in different areas of the side. In addition, the light emitting modules 200 b can all be connected to the first power transmission element 410 (please refer to FIG. 2 ), but can also be connected to different power transmission elements 400 . For example, the at least one power transmission element 400 may further include a third power transmission element (not shown). For example, the third power transmission element and the first power transmission element 410 may be electrically connected to the two light emitting modules 200b respectively. The third power transmission element and the first power transmission element 410 can also supply power to the light emitting module 200b respectively, so as to control the light emission of the plurality of light emitting modules 200b.

圖8之實施例與前述實施例的主要差異在於,發光智慧卡1d為接觸式卡片,其晶片500裸露於板體10d之表面如第一表面101而可作為觸點。當使用時,使用者可將發光智慧卡1d靠在讀寫裝置上以接收電力及進行通訊。此外接觸式卡片亦可透過無線感應而產生電力及/及或進行通訊。電力並供予內部的發光元件220發光,而光線經由第三板材130導引至出光區1300而達到側邊發光的效果。The main difference between the embodiment in FIG. 8 and the previous embodiments is that the light-emitting smart card 1d is a contact card, and its chip 500 is exposed on the surface of the board body 10d such as the first surface 101 and can be used as a contact. When in use, the user can place the light-emitting smart card 1d against the read-write device to receive power and communicate. In addition, the contact card can also generate power and/or communicate through wireless induction. The power is supplied to the internal light-emitting element 220 to emit light, and the light is guided to the light-emitting area 1300 through the third plate 130 to achieve the effect of side-emitting light.

本發明之發光智慧卡亦可包括多個晶片或其他能進行資料存取、識別的設備。舉例來說,本發明之發光智慧卡可兼有交通卡及信用卡的功能。當用於交通場站時,發光智慧卡在進出閘門的靠卡感應能伴隨側邊發光,當購物刷卡時,發光智慧卡的靠卡感應亦能伴隨側邊發光。此外不同的用途可伴隨不同顏色及/或不同區域的發光。舉例來說,在多個發光模組的實施例中,多個晶片可分別屬於不同的發光模組,從而實現與不同設備的感應之不同的發光。卡片讀寫時之不同狀況亦可伴隨不同的發光,舉例來說,在讀取失敗時發出閃爍紅光。The luminescent smart card of the present invention may also include multiple chips or other devices capable of data access and identification. For example, the luminescent smart card of the present invention can have both the functions of a traffic card and a credit card. When used in traffic stations, the light-emitting smart card can emit light along with the card-receiving sensor at the entrance and exit gates. When shopping, the card-receiving sensor of the luminous smart card can also be accompanied by side light. Furthermore, different uses can be accompanied by different colors and/or different areas of light emission. For example, in the embodiment of multiple light emitting modules, the multiple chips can respectively belong to different light emitting modules, so as to realize different light emitting from the induction of different devices. Different conditions when the card is read or written can also be accompanied by different lights, for example, a flashing red light is emitted when the card fails to be read.

圖9示意本發明其他實施例的發光智慧卡。圖9之實施例與前述實施例的主要差異在於,發光智慧卡1e的板體10e具有特殊造型例如具有卡通人物的輪廓,而板體10e的第一遮光層1101(請參前圖)在區域a~f分配有不同顏色之顏料,並形成在第一表面101可看到的圖案。此外板體10e還可形成有穿孔900,用以穿設環圈或鍊條。當發光智慧卡1e用於例如會員卡、門禁卡、交通卡等時,舉例來說,可與鑰匙串接在一起而方便使用,且當感應或接觸發光時,可呈現依卡通人物外型發光的側邊發光。Fig. 9 illustrates a light-emitting smart card of another embodiment of the present invention. The main difference between the embodiment in FIG. 9 and the previous embodiments is that the plate body 10e of the light-emitting smart card 1e has a special shape, such as the outline of a cartoon character, and the first light-shielding layer 1101 of the plate body 10e (please refer to the previous figure) is in the area a~f are distributed with different colors of pigments, and form visible patterns on the first surface 101 . In addition, the plate body 10e can also be formed with a perforation 900 for passing through a ring or a chain. When the luminous smart card 1e is used for membership cards, access control cards, transportation cards, etc., for example, it can be connected with a key chain for easy use, and when sensing or touching light, it can emit light according to the appearance of a cartoon character side glow.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field of the present invention can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the scope of the appended patent application.

1、1a、1b、1c、1d、1e:發光智慧卡 10、10a、10b、10c、10d、10e:板體 101:第一表面 102:第二表面 103:側表面 110、110a:第一板材 1101:第一遮光層 1111:第一保護層 120、120a:第二板材 1202:第二遮光層 1212:第二保護層 130、130b:第三板材 1300:出光區 1301:第一發光層 1302:第二發光層 1311:第一保護層 1312:第二保護層 1313:中間層 1400:容置槽 200、200a、200b:發光模組 220:發光元件 2200:發光面 250:電路板 260:焊點 300:導光元件 400:電力傳輸元件 410:第一電力傳輸元件 420:第二電力傳輸元件 500:晶片 600:封裝材料 900:穿孔 a~f:色塊 1, 1a, 1b, 1c, 1d, 1e: luminous smart card 10, 10a, 10b, 10c, 10d, 10e: plate body 101: First Surface 102: second surface 103: side surface 110, 110a: the first plate 1101: the first shading layer 1111: The first protective layer 120, 120a: the second plate 1202: the second shading layer 1212: second protective layer 130, 130b: the third plate 1300: light output area 1301: the first luminous layer 1302: the second light-emitting layer 1311: The first protective layer 1312: second protective layer 1313: middle layer 1400: storage tank 200, 200a, 200b: light emitting modules 220: light emitting element 2200: Luminous surface 250: circuit board 260: solder joint 300: light guide element 400: Power Transmission Components 410: first power transmission element 420: second power transmission element 500: chip 600: Encapsulation material 900: perforation a~f: color blocks

圖1所示為本發明之一實施例的發光智慧卡的立體示意圖。 圖2所示為圖1之分解示意圖。 圖3為本發明之另一實施例的發光智慧卡的剖視示意圖。 圖4為圖3之實施例的部分立體示意圖。 圖5為本發明又另一實施例的發光智慧卡的剖視示意圖。 圖6A為本發明之一實施例的發光模組的俯視示意圖。 圖6B為本發明另一實施例的發光模組的俯視示意圖。 圖7為本發明又另一實施例的發光智慧卡的部分俯視示意圖。 圖8為本發明之另一實施例的發光智慧卡的立體示意圖。 圖9為本發明又另一實施例的發光智慧卡的立體示意圖。 FIG. 1 is a three-dimensional schematic diagram of a light-emitting smart card according to an embodiment of the present invention. FIG. 2 is an exploded schematic view of FIG. 1 . FIG. 3 is a schematic cross-sectional view of a light-emitting smart card according to another embodiment of the present invention. FIG. 4 is a partial perspective view of the embodiment of FIG. 3 . FIG. 5 is a schematic cross-sectional view of a light-emitting smart card according to yet another embodiment of the present invention. FIG. 6A is a schematic top view of a light emitting module according to an embodiment of the present invention. FIG. 6B is a schematic top view of a light emitting module according to another embodiment of the present invention. FIG. 7 is a schematic partial top view of a luminous smart card according to yet another embodiment of the present invention. FIG. 8 is a three-dimensional schematic diagram of a light-emitting smart card according to another embodiment of the present invention. FIG. 9 is a three-dimensional schematic diagram of a light-emitting smart card according to yet another embodiment of the present invention.

101:第一表面 101: First Surface

102:第二表面 102: second surface

110:第一板材 110: The first plate

120:第二板材 120: Second plate

130:第三板材 130: the third plate

200:發光模組 200: Lighting module

220:發光元件 220: light emitting element

2200:發光面 2200: Luminous surface

250:電路板 250: circuit board

260:焊點 260: solder joint

300:導光元件 300: light guide element

400:電力傳輸元件 400: Power Transmission Components

410:第一電力傳輸元件 410: first power transmission element

420:第二電力傳輸元件 420: second power transmission element

500:晶片 500: chip

Claims (18)

一種發光智慧卡,包括: 一板體,該板體具有一第一表面、一第二表面以及一側表面;其中該第一表面與該第二表面相對,該側表面位於該第一表面及該第二表面間且與該第一表面及該第二表面分別連接; 至少一發光元件,設置於該板體內; 至少一電力傳輸元件,設置於該板體內,且與該至少一發光元件電性連接;該至少一電力傳輸元件用以供電予該至少一發光元件,使該至少一發光元件產生光線; 一導光元件,設置於該板體中,用以導引該光線至該側表面以射出於該板體外。 An illuminated smart card comprising: A plate body, the plate body has a first surface, a second surface and a side surface; wherein the first surface is opposite to the second surface, and the side surface is located between the first surface and the second surface and is connected to the the first surface and the second surface are respectively connected; At least one light-emitting element is arranged in the board; At least one power transmission element is arranged in the board and is electrically connected to the at least one light emitting element; the at least one power transmission element is used to supply power to the at least one light emitting element to make the at least one light emitting element generate light; A light guide element is arranged in the board body and is used to guide the light to the side surface so as to exit the board body. 如請求項1所述之發光智慧卡,其中該至少一發光元件具有一發光面,且該發光面面對該導光元件的至少一部分。The light-emitting smart card according to claim 1, wherein the at least one light-emitting element has a light-emitting surface, and the light-emitting surface faces at least a part of the light-guiding element. 如請求項1所述之發光智慧卡,其中該至少一電力傳輸元件包括一第一電力傳輸元件;該第一電力傳輸元件透過無線感應產生電力供予該至少一發光元件。The light-emitting smart card as described in claim 1, wherein the at least one power transmission element includes a first power transmission element; the first power transmission element generates power through wireless induction to supply the at least one light-emitting element. 如請求項1所述之發光智慧卡,更包括一電路板,且該至少一發光元件設置於該電路板上並與該電路板電性連接。The luminescent smart card as described in claim 1 further includes a circuit board, and the at least one light emitting element is disposed on the circuit board and electrically connected to the circuit board. 如請求項4所述之發光智慧卡,其中該第一電力傳輸元件與該電路板電性連接,且該電路板與該至少一發光元件是模組化設置於該板體內。The light-emitting smart card as claimed in claim 4, wherein the first power transmission element is electrically connected to the circuit board, and the circuit board and the at least one light-emitting element are modularly arranged in the board. 如請求項1所述之發光智慧卡,其中該板體具有一第一板材、一第二板材以及一第三板材;該第三板材位於該第一板材與該第二板材間,且該第一板材、該第二板材以及該第三板材平行相疊連接。The luminescent smart card as described in claim 1, wherein the board body has a first board, a second board and a third board; the third board is located between the first board and the second board, and the third board A board, the second board and the third board are stacked and connected in parallel. 如請求項6所述之發光智慧卡,其中該第三板材可透光,且該至少一發光元件及該導光元件設置於該第三板材。The light-emitting smart card as claimed in claim 6, wherein the third plate is light-transmissive, and the at least one light-emitting element and the light-guiding element are disposed on the third plate. 如請求項7所述之發光智慧卡,其中第三板材更包含一第一保護層、一第二保護層以及一中間層;該中間層位於該第一保護層與該第二保護層間,且該至少一發光元件及該導光元件設置於該中間層。The luminescent smart card according to claim 7, wherein the third board further comprises a first protective layer, a second protective layer and an intermediate layer; the intermediate layer is located between the first protective layer and the second protective layer, and The at least one light emitting element and the light guiding element are arranged on the middle layer. 如請求項8所述之發光智慧卡,其中該中間層更具有至少一容置槽,且該至少一發光元件設置於該至少一容置槽。The luminescent smart card as claimed in claim 8, wherein the middle layer further has at least one accommodating groove, and the at least one light-emitting element is disposed in the at least one accommodating groove. 如請求項6所述之發光智慧卡,其中該第一板材更包括一第一遮光層,該第一遮光層上具有由顏料構成的至少一範圍。The luminescent smart card as described in claim 6, wherein the first board further includes a first light-shielding layer, and the first light-shielding layer has at least one area made of pigments. 如請求項10所述之發光智慧卡,其中該第二板材更包括一第二遮光層,該第二遮光層上具有由顏料構成的至少一範圍。The luminescent smart card as described in claim 10, wherein the second board further includes a second light-shielding layer, and the second light-shielding layer has at least one area made of pigments. 如請求項1所述之發光智慧卡,更包括至少一晶片設置於該板體中。The light-emitting smart card as described in claim 1 further includes at least one chip disposed in the board body. 如請求項12所述之發光智慧卡,其中該至少一電力傳輸元件更包括一第二電力傳輸元件;該第二電力傳輸元件與該至少一晶片電性連接,且透過無線感應產生電力供予該至少一晶片。The light-emitting smart card as described in claim 12, wherein the at least one power transmission element further includes a second power transmission element; the second power transmission element is electrically connected to the at least one chip, and generates power through wireless induction for supply The at least one chip. 如請求項1所述之發光智慧卡,其中該板體更具有一出光區位於該側表面,且該光線從該出光區射出於該板體外。The luminescent smart card as described in Claim 1, wherein the board further has a light emitting area located on the side surface, and the light is emitted from the light emitting area outside the board. 一種發光智慧卡,包括: 一板體,具有一第一板材、一第二板材、一導光材料層以及一側表面;該導光材料層位於該第一板材與該第二板材間;該第一板材、該第二板材以及該導光材料層平行相疊且連接; 至少一發光元件,設置於該導光材料層; 至少一電力傳輸元件,設置於該板體內,且與該至少一發光元件電性連接;該至少一電力傳輸元件用以供電予該至少一發光元件,使該至少一發光元件產生光線; 其中該導光材料層導引該光線至該側表面以射出於該板體外。 An illuminated smart card comprising: A plate body has a first plate material, a second plate material, a light guide material layer and one side surface; the light guide material layer is located between the first plate material and the second plate material; the first plate material, the second plate material The plates and the light-guiding material layers are stacked in parallel and connected; At least one light-emitting element is disposed on the light-guiding material layer; At least one power transmission element is arranged in the board and is electrically connected to the at least one light emitting element; the at least one power transmission element is used to supply power to the at least one light emitting element to make the at least one light emitting element generate light; Wherein the light guide material layer guides the light to the side surface so as to exit the board. 如請求項15所述之智慧發光卡,其中該第一板材具有一第一表面,該第二板材具有一第二表面,該第一表面與該第二表面相對,該側表面位於該第一表面及該第二表面間且與該第一表面及該第二表面分別連接。The smart light-emitting card as described in claim 15, wherein the first plate has a first surface, the second plate has a second surface, the first surface is opposite to the second surface, and the side surface is located on the first The surface and the second surface are respectively connected with the first surface and the second surface. 如請求項15所述之智慧發光卡,更包括一第一保護層以及一第二保護層;該第一保護層位於該第一板材與該導光材料層間,且與該第一板材及該導光材料層平行相疊連接;該第二保護層位於該第二板材與該導光材料層間,且與該第二板材及該導光材料層平行相疊連接。The smart light-emitting card as described in claim 15 further includes a first protective layer and a second protective layer; the first protective layer is located between the first plate and the light guide material layer, and is connected to the first plate and the The light-guiding material layers are stacked and connected in parallel; the second protection layer is located between the second board and the light-guiding material layer, and is parallel-stacked and connected with the second board and the light-guiding material layer. 如請求項15所述之發光智慧卡,更包括至少一晶片設置於該板體中。The luminous smart card as described in claim 15 further includes at least one chip disposed in the board body.
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