TW202300853A - Heat generating device - Google Patents

Heat generating device Download PDF

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TW202300853A
TW202300853A TW111117073A TW111117073A TW202300853A TW 202300853 A TW202300853 A TW 202300853A TW 111117073 A TW111117073 A TW 111117073A TW 111117073 A TW111117073 A TW 111117073A TW 202300853 A TW202300853 A TW 202300853A
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Taiwan
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hydrogen
heat
heating element
flow path
layer
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TW111117073A
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Chinese (zh)
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村上翔一
大畑豊治
岩村康弘
伊藤岳彦
吉野英樹
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日商綠淨星球股份有限公司
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Publication of TW202300853A publication Critical patent/TW202300853A/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24VCOLLECTION, PRODUCTION OR USE OF HEAT NOT OTHERWISE PROVIDED FOR
    • F24V30/00Apparatus or devices using heat produced by exothermal chemical reactions other than combustion
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B17/00Sorption machines, plants or systems, operating intermittently, e.g. absorption or adsorption type
    • F25B17/12Sorption machines, plants or systems, operating intermittently, e.g. absorption or adsorption type using desorption of hydrogen from a hydride
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F23/00Features relating to the use of intermediate heat-exchange materials, e.g. selection of compositions
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02ATECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A30/00Adapting or protecting infrastructure or their operation
    • Y02A30/27Relating to heating, ventilation or air conditioning [HVAC] technologies
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/62Absorption based systems

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Sorption Type Refrigeration Machines (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

Provided is a heat generating device having high heat generating efficiency and heat exchange efficiency, and high durability. This heat generating device comprises: a plate-shaped heat generating body (5) that generates heat through the occlusion and release of hydrogen; a first flow path (6) into which a hydrogen-based gas containing the hydrogen is introduced, and which supplies hydrogen to the heat generating body (5); and a second flow path (7) in which transmitted gas containing hydrogen that has been transmitted through the heat generating body (5) flows, wherein the first flow path (6) and the second flow path (7) are respectively disposed on both sides of the heat generating body (5), and a first partition wall (24) forming the second flow path (7) between the heat generating body (5) and the first partition wall is provided with a support (25) protruding toward the heat generating body (5) in order to receive the deformed heat generating body (5). The support (25) is formed by a plurality of metal pins or plates.

Description

發熱裝置heating device

本發明係關於一種具備藉由氫之吸藏與釋放而發熱之發熱體之發熱裝置。The present invention relates to a heat generating device having a heat generating body that generates heat by absorbing and releasing hydrogen.

已知儲氫合金具有於一定反應條件下反覆吸藏與釋放大量氫之特性,吸藏與釋放該氫時,會伴隨相當多之反應熱。業界揭示有利用該反應熱之熱泵系統、熱輸送系統、冷熱(冷凍)系統等熱利用系統或儲氫系統(例如參照專利文獻1、2)。It is known that hydrogen storage alloys have the property of repeatedly absorbing and releasing a large amount of hydrogen under certain reaction conditions, and the hydrogen storage and release will be accompanied by a considerable amount of reaction heat. Heat utilization systems or hydrogen storage systems such as heat pump systems, heat transfer systems, cooling and heating (refrigerating) systems, and hydrogen storage systems utilizing the heat of reaction have been disclosed in the industry (for example, refer to Patent Documents 1 and 2).

且說,本申請人等已獲得如下見解:於具備使用儲氫合金等之發熱體之發熱裝置中,藉由以支持體及由支持體支持之多層膜構成發熱體,在氫吸藏於該發熱體時及自該發熱體釋放氫時產生熱。而且,本申請人等基於此種見解先提出有熱利用系統及發熱裝置(參照專利文獻3)。In addition, the present applicants have obtained the knowledge that, in a heat generating device equipped with a heat generating body using a hydrogen storage alloy or the like, by constituting the heat generating body with a support and a multilayer film supported by the support, hydrogen is stored in the heat generating device. Heat is generated when hydrogen is released into the body and when hydrogen is released from the heat generating body. Furthermore, the present applicant et al. proposed a heat utilization system and a heat generating device based on such knowledge (refer patent document 3).

具體而言,發熱裝置之發熱體所具備之支持體包含多孔質體、氫透過膜、質子介電體中之至少任一者,由該支持體支持之多層膜例如係藉由將包含儲氫金屬或儲氫合金之厚度未達1000 nm之第1層、及與該第1層不同之包含儲氫金屬、儲氫合金或陶瓷之厚度未達1000 nm之第2層交替積層而構成。 [先前技術文獻] [專利文獻] Specifically, the support of the heating element of the heating device includes at least any one of a porous body, a hydrogen permeable membrane, and a proton dielectric. A first layer of metal or hydrogen storage alloy with a thickness of less than 1000 nm and a second layer different from the first layer including hydrogen storage metal, hydrogen storage alloy or ceramics with a thickness of less than 1000 nm are laminated alternately. [Prior Art Literature] [Patent Document]

[專利文獻1]日本專利特開昭56-100276號公報 [專利文獻2]日本專利特開昭58-022854號公報 [專利文獻3]日本專利第6749035號公報 [Patent Document 1] Japanese Patent Laid-Open No. 56-100276 [Patent Document 2] Japanese Patent Laid-Open No. 58-022854 [Patent Document 3] Japanese Patent No. 6749035

[發明所欲解決之問題][Problem to be solved by the invention]

然而,於專利文獻3中揭示之發熱裝置中,產生熱之發熱體未以高密度集成之狀態組裝,故而發熱體無法效率良好地產生熱,尚有改善餘地。However, in the heat generating device disclosed in Patent Document 3, the heat generating elements that generate heat are not assembled in a highly densely integrated state, so the heat generating elements cannot efficiently generate heat, and there is still room for improvement.

因此,想到如圖15所示,於發熱體105之兩側分別配置用於向發熱體105導入包含氫之氫系氣體之第1流路106及供透過發熱體105之氫流入的第2流路107,將該等發熱體105與第1流路106及第2流路107以高密度積層,藉此使發熱裝置101成為小型、精簡且發熱效率較高之高輸出者。於具有此種構成之發熱裝置101中,藉由導入至第1流路106之氫透過發熱體105而使發熱體105發熱。於此情形時,透過發熱體105之氫(以下,有時稱為「透過氫」)流入至第2流路107,故而第2流路107之壓力低於第1流路106之壓力。Therefore, as shown in FIG. 15, it is conceivable that the first flow path 106 for introducing a hydrogen-based gas containing hydrogen into the heating element 105 and the second flow path for the hydrogen passing through the heating element 105 to flow in are respectively arranged on both sides of the heating element 105. In the channel 107, the heating elements 105, the first flow channel 106 and the second flow channel 107 are stacked at high density, thereby making the heating device 101 small, compact, and high-output with high heating efficiency. In the heat generating device 101 having such a configuration, the heat generating element 105 generates heat as the hydrogen introduced into the first flow path 106 passes through the heat generating element 105 . In this case, the hydrogen passing through the heating element 105 (hereinafter, sometimes referred to as “permeated hydrogen”) flows into the second flow path 107 , so the pressure of the second flow path 107 is lower than the pressure of the first flow path 106 .

此處,發熱體105非常薄且包含易撓曲之儲氫金屬或儲氫合金,故而如圖16所示,以朝向壓力較低之第2流路107側鼓出之方式撓曲變形成圓弧曲面狀,同時於膜面之橫向上受到拉伸應力。若該應力超過發熱體105之素材之降伏應力,則該發熱體105會產生較大之塑性變形。因此,發熱體105中之氫之透過量或第1流路106及第2流路107之截面形狀的變化會導致氫之流量或壓力損失等自起初值發生變化,最壞情況下,可能會因第2流路107封閉而導致氫之流動停止,或者發熱體105產生龜裂,大量氫自第1流路106向第2流路107流出,並且第1流路106與第2流路107之壓力差大幅減小,導致發熱裝置功能停止。為了防止此種不良情況之發生,想到使發熱體105之厚度變厚,但若使發熱體105之厚度變厚,則會產生該發熱體105中之氫之擴散受到阻礙,無法獲得所需之發熱量之問題。Here, the heating element 105 is very thin and contains a hydrogen-absorbing metal or hydrogen-absorbing alloy that is easy to bend. Therefore, as shown in FIG. Arc-curved surface, while being subjected to tensile stress in the transverse direction of the film surface. If the stress exceeds the yield stress of the material of the heating element 105, the heating element 105 will undergo large plastic deformation. Therefore, changes in the amount of hydrogen permeated through the heating element 105 or the cross-sectional shapes of the first flow path 106 and the second flow path 107 may cause the flow rate of hydrogen or pressure loss to change from the initial value. The flow of hydrogen stops due to the closure of the second flow path 107, or the heating element 105 is cracked, and a large amount of hydrogen flows out from the first flow path 106 to the second flow path 107, and the first flow path 106 and the second flow path 107 The pressure difference is greatly reduced, causing the function of the heating device to stop. In order to prevent the generation of this bad situation, it is conceivable to make the thickness of the heating element 105 thicker, but if the thickness of the heating element 105 is thickened, the diffusion of hydrogen in the heating element 105 will be hindered, and the desired effect cannot be obtained. Heat issue.

又,由發熱體105產生之熱傳遞至外部之路徑成為於發熱體105與未圖示之容器之緊固部之固體熱傳導、以及於容器內之第1流路106及第2流路107之熱輻射及氫氣之對流與熱傳導。該等輻射及氫氣之對流、熱傳導之每單位面積之熱導率相對小於金屬等之固體熱傳導,於降低氫氣之密度(壓力)以防止如上所述之發熱體105之變形之動作條件下,熱傳導更小,因此,可能難以獲得適當維持發熱體105之溫度之熱流。換言之,發熱體105可能會過熱。In addition, the heat transfer path generated by the heating element 105 to the outside is the solid heat conduction between the heating element 105 and the fastening part of the container not shown, and the connection between the first flow path 106 and the second flow path 107 in the container. Heat radiation and hydrogen convection and heat conduction. The thermal conductivity per unit area of the radiation and convection of hydrogen gas and heat conduction is relatively smaller than that of solid heat conduction such as metals. Under the operating conditions of reducing the density (pressure) of hydrogen gas to prevent the deformation of the heating element 105 as described above, the heat conduction smaller, and therefore, it may be difficult to obtain a heat flow that properly maintains the temperature of the heat generating body 105 . In other words, the heat generating body 105 may overheat.

本發明係鑒於上述問題而完成者,其目的在於提供一種發熱效率及熱交換效率高且耐久性也高之發熱裝置。 [解決問題之技術手段] The present invention was made in view of the above problems, and an object of the present invention is to provide a heat generating device having high heat generation efficiency and heat exchange efficiency and high durability. [Technical means to solve the problem]

為了達成上述目的,本發明之發熱裝置具備藉由氫之吸藏與釋放而產生熱之平板狀之發熱體、被導入包含上述氫之氫系氣體並向上述發熱體供給氫之第1流路、及供包含透過上述發熱體之氫之透過氣體流動之第2流路,且係將上述第1流路及上述第2流路分別配置於上述發熱體之兩側而構成,於在與上述發熱體之間形成上述第2流路之第1間隔壁,朝向上述發熱體突出設置有用於支承發生變形之上述發熱體之支架。 [發明之效果] In order to achieve the above object, the heat generating device of the present invention includes a flat plate-shaped heat generating element that generates heat by absorbing and releasing hydrogen, and a first flow path that introduces a hydrogen-based gas containing the hydrogen and supplies hydrogen to the heat generating element. , and a second flow path for the permeated gas including hydrogen passing through the above-mentioned heating element to flow, and the above-mentioned first flow path and the above-mentioned second flow path are respectively arranged on both sides of the above-mentioned heating element. The first partition wall forming the second flow path between the heat generating elements is provided with a bracket protruding toward the heat generating element for supporting the deformed heat generating element. [Effect of Invention]

根據本發明,即便發熱體因第1流路與第2流路之差壓而以朝向壓力較低之第2流路側鼓出之方式撓曲變形,該發熱體之撓曲變形亦會藉由支承該發熱體之支架而抑制得較小。因此,伴隨發熱體發生之變形所產生之應力抑制得較小,提高了該發熱體之耐久性,並且發熱體之發熱作用不會因變形而受到阻礙,發熱體能夠穩定地進行發熱作用,故而獲得較高之發熱效率及熱交換效率。According to the present invention, even if the heating element is deflected and deformed in such a way that it bulges toward the side of the second flow path where the pressure is lower due to the differential pressure between the first flow path and the second flow path, the deflection deformation of the heat generating element will be caused by The bracket supporting the heating element is suppressed smaller. Therefore, the stress caused by the deformation of the heating element is suppressed smaller, the durability of the heating element is improved, and the heating effect of the heating element is not hindered by the deformation, and the heating element can perform the heating effect stably. Obtain higher heating efficiency and heat exchange efficiency.

以下,基於隨附圖式對本發明之實施方式進行說明。Embodiments of the present invention will be described below based on the accompanying drawings.

[發熱裝置] 圖1係表示本發明之發熱裝置之基本構成之方塊圖,圖示之發熱裝置1具備發熱模組M、溫度調整部T、氫循環線路L1、控制部2及密閉容器3。再者,於圖1中,黑圓點之連接點表示複數個配管之連接部。 [heating device] 1 is a block diagram showing the basic structure of the heating device of the present invention. The heating device 1 shown in the figure has a heating module M, a temperature adjustment part T, a hydrogen circulation line L1, a control part 2 and an airtight container 3. In addition, in FIG. 1, the connection point of the black dot represents the connection part of several pipes.

發熱模組M收容於密閉容器3之內部,且具備2個積層構造體4及1個電熱器9。各積層構造體4具有藉由氫之吸藏與釋放而產生熱之發熱體5、被導入包含氫之氫系氣體並向發熱體5供給氫之第1流路6、供包含透過發熱體5之氫(以下,稱為「透過氫」)之氫系氣體(以下,稱為「透過氣體」)流動之第2流路7、及供於與流經第2流路7之透過氣體之間進行熱交換之熱媒流動的第3流路8,且係於第3流路8之兩側自該第3流路8起依序將第2流路7、發熱體5、第1流路6對稱地積層而構成。電熱器9係將發熱體5加熱之加熱機構之一例,但並不限定於此。The heating module M is housed inside the airtight container 3 and includes two laminated structures 4 and one electric heater 9 . Each laminated structure 4 has a heating element 5 that generates heat by absorbing and releasing hydrogen, a first flow path 6 that introduces a hydrogen-based gas containing hydrogen and supplies hydrogen to the heating element 5 , and passes through the heating element 5 . Hydrogen (hereinafter referred to as "permeated hydrogen") and hydrogen-based gas (hereinafter referred to as "permeated gas") flow through the second channel 7, and between the permeated gas flowing through the second channel 7 The third flow path 8 where the heat medium for heat exchange flows, and the second flow path 7, the heating element 5, and the first flow path are sequentially connected from the third flow path 8 on both sides of the third flow path 8. It is composed of 6 symmetrical strata. The electric heater 9 is an example of heating means for heating the heating element 5, but is not limited thereto.

此處,氫系氣體包括氫之同位素,作為氫系氣體,包括氕氣及氘氣中之至少任一者。氕氣包括天然存在之氕與氘之混合物,即氕之比率為99.985%、氘之比率為0.015%之混合物。於圖1中,將向發熱體5供給氫之氫系氣體表示為「氫」,將包含透過發熱體5之透過氫之透過氣體表示為「透過氫」。再者,於發熱模組M之製作中,理想的是將各構件擴散接合。發熱模組M之詳細內容將於下文中加以敍述。Here, the hydrogen-based gas includes isotopes of hydrogen, and the hydrogen-based gas includes at least one of protium gas and deuterium gas. Protium gas includes a naturally occurring mixture of protium and deuterium, ie a mixture of 99.985% protium and 0.015% deuterium. In FIG. 1 , the hydrogen-based gas that supplies hydrogen to the heating element 5 is represented as "hydrogen", and the permeated gas including permeated hydrogen passing through the heating element 5 is represented as "permeated hydrogen". Furthermore, in the manufacture of the heat generating module M, it is desirable to diffusely bond each member. The details of the heating module M will be described below.

溫度調整部T發揮調整發熱體5之溫度而將該發熱體5維持於可發熱之溫度(例如,50℃~1500℃)之功能。該溫度調整部T具備電熱器9、向該電熱器9供給電力之電源10、檢測電熱器9之溫度之熱電偶等溫度感測器11、及基於由溫度感測器11檢測出之溫度控制電源10之輸出之控制部2。The temperature adjustment unit T functions to adjust the temperature of the heating element 5 and maintain the heating element 5 at a temperature capable of generating heat (for example, 50° C. to 1500° C.). This temperature adjustment unit T includes an electric heater 9 , a power supply 10 that supplies power to the electric heater 9 , a temperature sensor 11 such as a thermocouple that detects the temperature of the electric heater 9 , and controls the temperature based on the temperature detected by the temperature sensor 11 . The control part 2 of the output of the power supply 10.

氫循環線路L1反覆進行如下動作:向分別設置於發熱模組M之各積層構造體4之第1流路6導入包含氫之氫系氣體,並且將包含藉由自第1流路6透過發熱體5以供該發熱體5發熱並流入至第2流路7之透過氫之透過氣體回收,使其返回至第1流路6。The hydrogen circulation line L1 repeatedly performs the following operation: introduce hydrogen-based gas containing hydrogen into the first flow paths 6 of the laminated structures 4 respectively provided in the heating module M, and transfer the hydrogen-based gas containing hydrogen through the first flow path 6 to generate heat. The element 5 recovers the permeated gas of the permeated hydrogen that the heating element 5 generates and flows into the second flow path 7 , and returns it to the first flow path 6 .

氫循環線路L1具有向設置於發熱模組M之積層構造體4之第1流路6導入氫系氣體之導入配管12、自設置於發熱模組M之積層構造體4之第2流路7回收透過氣體之回收配管13、以及連接於導入配管12及回收配管13之循環泵14。於發熱裝置1中,由發熱模組M及氫循環線路L1構成供氫系氣體循環之閉環。The hydrogen circulation line L1 has an introduction pipe 12 for introducing hydrogen-based gas into the first flow path 6 of the laminated structure 4 provided in the heating module M, and a second flow path 7 from the laminated structure 4 of the heating module M. A recovery pipe 13 for recovering permeated gas, and a circulation pump 14 connected to the introduction pipe 12 and the recovery pipe 13 . In the heating device 1 , the heating module M and the hydrogen circulation line L1 form a closed loop for circulating the hydrogen-based gas.

導入配管12自循環泵14之噴出側延伸,利用分支管15分別連接於設置在發熱模組M之各積層構造體4之各第1流路6。因此,氫系氣體自導入配管12經過分支管15分別導入至各第1流路6。The introduction pipe 12 extends from the discharge side of the circulation pump 14, and is connected to each of the first flow paths 6 of the respective laminated structures 4 provided in the heating module M by branch pipes 15, respectively. Therefore, the hydrogen-based gas is introduced into each of the first channels 6 from the introduction pipe 12 through the branch pipe 15 .

回收配管13連接於循環泵14之吸入口,利用分支管16分別連接於設置在發熱模組M之各積層構造體4之各第2流路7。因此,於第2流路7中流動之透過氣體由發熱體5加熱而成為高溫,經過各分支管16回收至回收配管13,作為用於向發熱體5供給氫之氫系氣體而再利用。The recovery pipe 13 is connected to the suction port of the circulation pump 14, and is connected to the respective second flow paths 7 of the respective laminated structures 4 provided in the heating module M through branch pipes 16, respectively. Therefore, the permeated gas flowing through the second flow path 7 is heated by the heating element 5 to become high temperature, and is recovered to the recovery pipe 13 through each branch pipe 16 to be reused as a hydrogen-based gas for supplying hydrogen to the heating element 5 .

循環泵14係使氫系氣體於構成閉環之發熱模組M與氫循環線路L1之間循環者,例如使用金屬伸縮泵。循環泵14電性連接於控制部2,利用來自控制部2之控制信號控制動作。The circulation pump 14 circulates the hydrogen-based gas between the heating module M and the hydrogen circulation line L1 forming a closed loop, for example, a metal telescopic pump is used. The circulation pump 14 is electrically connected to the control unit 2 and controlled by a control signal from the control unit 2 .

於導入配管12之中途設置有緩衝槽17、壓力調整閥18及過濾器19。緩衝槽17用於貯存氫系氣體而吸收該氫系氣體之流量變動。壓力調整閥18電性連接於控制部2,藉由利用來自控制部2之控制信號調整開度,而發揮調整自緩衝槽17供給之氫系氣體之壓力之功能。A buffer tank 17 , a pressure regulating valve 18 and a filter 19 are provided in the middle of the introduction pipe 12 . The buffer tank 17 is used to store the hydrogen-based gas and absorb the flow rate variation of the hydrogen-based gas. The pressure regulating valve 18 is electrically connected to the control unit 2 and functions to adjust the pressure of the hydrogen-based gas supplied from the buffer tank 17 by adjusting the opening degree using the control signal from the control unit 2 .

過濾器19用於去除氫系氣體中所含之雜質。此處,透過分別設置於發熱模組M之各積層構造體4之發熱體5的氫之量(氫透過量)依存於發熱體5之溫度、發熱體5之兩面側之壓力差、發熱體5之表面狀態,但於氫中包含雜質之情形時,存在雜質附著於發熱體5之表面導致該發熱體5之表面狀態變差之情況。於發熱體5之表面狀態變差之情形時,會產生該發熱體5之表面上之氫分子之吸附與解離受到阻礙導致氫透過量減少的不良情況。作為阻礙發熱體5之表面上之氫分子之吸附與解離者,例如想到水(包括水蒸氣)、烴(甲烷、乙烷、甲醇、乙醇等)、C、S、Si等。藉由過濾器19去除氫中所含之作為雜質之水(包括水蒸汽)、烴、C、S、Si等,而抑制發熱體5中之氫透過量之減少。The filter 19 is used to remove impurities contained in the hydrogen-based gas. Here, the amount of hydrogen passing through the heating element 5 (hydrogen permeation amount) of each laminated structure 4 provided in the heating module M depends on the temperature of the heating element 5, the pressure difference between the two sides of the heating element 5, and the temperature of the heating element. 5, but when impurities are contained in hydrogen, the impurities may adhere to the surface of the heating element 5 and cause the surface condition of the heating element 5 to deteriorate. When the surface state of the heating element 5 deteriorates, the adsorption and dissociation of hydrogen molecules on the surface of the heating element 5 are hindered, resulting in a decrease in the amount of hydrogen permeation. Those that hinder the adsorption and dissociation of hydrogen molecules on the surface of the heating element 5 include, for example, water (including water vapor), hydrocarbons (methane, ethane, methanol, ethanol, etc.), C, S, Si, and the like. Water (including water vapor), hydrocarbons, C, S, Si, etc., which are impurities contained in hydrogen are removed by the filter 19, thereby suppressing a decrease in the hydrogen permeation amount in the heating element 5.

控制部2與發熱裝置1之各部電性連接,控制各部之動作。該控制部2具備CPU(Central Processing Unit,中央處理單元)、ROM(Read Only Memory,唯讀記憶體)或RAM(Random Access Memory,隨機存取記憶體)等記憶部等,於CPU中,使用儲存於ROM或RAM之程式或資料等執行各種運算處理。The control part 2 is electrically connected with each part of the heating device 1, and controls the operation of each part. The control unit 2 is equipped with storage units such as CPU (Central Processing Unit, central processing unit), ROM (Read Only Memory, read-only memory) or RAM (Random Access Memory, random access memory), etc., in the CPU, use Programs or data stored in ROM or RAM perform various calculations.

密閉容器3例如構成為不鏽鋼(SUS)之中空容器。作為密閉容器3之材料,較佳為具有較高之耐蝕性及耐壓性之材料,例如碳鋼、沃斯田鐵系不鏽鋼、耐蝕性非鐵合金鋼等。又,密閉容器3之材料亦可為反射下述發熱體5產生之輻射熱之材料,例如鎳(Ni)、銅(Cu)、鉬(Mo)等。於本實施方式中,密閉容器3之形狀為四角筒狀,但並不限定於此,亦可為除四角筒狀以外之角形柱狀、圓筒狀、橢圓筒狀等。The airtight container 3 is formed as a stainless steel (SUS) hollow container, for example. The material of the airtight container 3 is preferably a material with high corrosion resistance and pressure resistance, such as carbon steel, Worth field stainless steel, corrosion-resistant non-ferrous alloy steel, and the like. Also, the material of the airtight container 3 can also be a material that reflects the radiant heat generated by the heating element 5 below, such as nickel (Ni), copper (Cu), molybdenum (Mo) and the like. In this embodiment, the shape of the airtight container 3 is a square cylinder, but it is not limited thereto, and may be an angular column shape, a cylinder shape, an ellipse cylinder shape, etc. other than the square cylinder shape.

(發熱模組) 接下來,以下基於圖2~圖4對發熱模組M之構成進行說明。 (heating module) Next, the configuration of the heating module M will be described below based on FIGS. 2 to 4 .

圖2係發熱模組M之分解立體圖,圖3係構成發熱模組M之積層構造體4之分解立體圖,圖4係設置於發熱模組M之電熱器9之俯視圖。2 is an exploded perspective view of the heating module M, FIG. 3 is an exploded perspective view of the laminated structure 4 constituting the heating module M, and FIG. 4 is a top view of the electric heater 9 installed in the heating module M.

如圖2所示,發熱模組M係將2個積層構造體4於上下方向(圖2之Z軸方向)上呈2段重疊而構成。上側之積層構造體4之最下部之第1流路6與下側之積層構造體4之最上部的第1流路6相面對。於圖2所示之例中,發熱模組M形成為四角柱狀。於以下之說明中,於發熱裝置1及構成該發熱裝置1之各構件中,將Z軸方向上之上側之面作為上表面,將Z軸方向上之下側之面作為底面,將Y軸方向上之左側之面作為正面,將Y軸方向上之右側之面作為背面,將X軸方向上之右側之面作為右側面,將X軸方向上之左側之面作為左側面。As shown in FIG. 2 , the heating module M is formed by stacking two laminated structures 4 in two stages in the vertical direction (the Z-axis direction in FIG. 2 ). The lowermost first flow channel 6 of the upper layered structure 4 faces the uppermost first flow channel 6 of the lower layered structure 4 . In the example shown in FIG. 2 , the heating module M is formed in a square column shape. In the following description, in the heating device 1 and each member constituting the heating device 1, the surface on the upper side in the Z-axis direction is taken as the upper surface, the surface on the lower side in the Z-axis direction is taken as the bottom surface, and the surface on the Y-axis direction is taken as the bottom surface. The left side in the direction is the front side, the right side in the Y-axis direction is the back side, the right side in the X-axis direction is the right side, and the left side in the X-axis direction is the left side.

如圖3所示,第1流路6包含形成為平板狀之平板部6a及設置於平板部6a之壁部6b。平板部6a及壁部6b例如包含不鏽鋼。平板部6a於俯視下形成為四邊形。壁部6b設置於平板部6a之4邊之緣部分中之3邊的緣部分。於圖3中,壁部6b設置於平板部6a之4邊之緣部分中的X軸方向上之左右之緣部分及Y軸方向上之右側之緣部分。構成下側之第1流路6之壁部6b朝向Z軸方向之上側突出,構成上側之第1流路6之壁部6b朝向Z軸方向之下側突出。於第1流路6之正面(Y軸方向上之左側之面),即平板部6a之4邊緣部分中的未設置壁部6b之1邊之緣部分設置有氫導入口6c。該氫導入口6c連接於氫供給線路L1之分支管15(參照圖1)。As shown in FIG. 3 , the first flow path 6 includes a flat plate portion 6a formed in a flat plate shape and a wall portion 6b provided on the flat plate portion 6a. The flat plate part 6a and the wall part 6b are made of stainless steel, for example. The flat plate portion 6a is formed in a quadrangular shape in plan view. The wall part 6b is provided in the edge part of 3 sides among the edge parts of 4 sides of the flat plate part 6a. In FIG. 3 , the wall portion 6b is provided on the left and right edge portions in the X-axis direction and the right edge portion in the Y-axis direction among the four edge portions of the flat plate portion 6a. The wall portion 6b constituting the first flow path 6 on the lower side protrudes toward the upper side in the Z-axis direction, and the wall portion 6b constituting the first flow path 6 on the upper side protrudes toward the lower side in the Z-axis direction. A hydrogen introduction port 6c is provided on the front side (the left side in the Y-axis direction) of the first flow path 6, that is, the edge portion of one side not provided with the wall portion 6b among the four edge portions of the flat plate portion 6a. The hydrogen introduction port 6c is connected to a branch pipe 15 of the hydrogen supply line L1 (see FIG. 1 ).

第2流路7包含形成為平板狀之平板部7a及設置於平板部7a之壁部7b。平板部7a及壁部7b例如包含不鏽鋼。平板部7a於俯視下形成為四邊形。壁部7b設置於平板部7a之4邊之緣部分中之3邊的緣部分。於圖3中,壁部7b設置於平板部7a之4邊之緣部分中的X軸方向上之左右之緣部分及Y軸方向上之左側之緣部分。構成下側之第2流路7之壁部7b朝向Z軸方向之下側突出,構成上側之第2流路7之壁部7b朝向Z軸方向之上側突出。於第2流路7之背面(Y軸方向上之右側之面),即平板部7a之4邊之緣部分中的未設置壁部7b之1邊之緣部分設置有氫回收口7c。於圖3中,設置於下側之第2流路7之背面之氫回收口7c隱藏於紙面裏側。氫回收口7c連接於氫循環線路L1之分支管16(參照圖1)。The second flow path 7 includes a flat plate portion 7a formed in a flat plate shape and a wall portion 7b provided on the flat plate portion 7a. The flat plate portion 7a and the wall portion 7b are made of stainless steel, for example. The flat plate portion 7a is formed in a quadrangular shape in plan view. The wall part 7b is provided in the edge part of 3 sides among the edge parts of 4 sides of the flat plate part 7a. In FIG. 3 , the wall portion 7b is provided on the left and right edge portions in the X-axis direction and the left edge portion in the Y-axis direction among the edge portions of the four sides of the flat plate portion 7a. The wall portion 7b constituting the second flow path 7 on the lower side protrudes toward the lower side in the Z-axis direction, and the wall portion 7b constituting the second flow path 7 on the upper side protrudes toward the upper side in the Z-axis direction. A hydrogen recovery port 7c is provided on the back side of the second flow path 7 (the right side in the Y-axis direction), that is, the edge portion of one of the four edges of the flat plate portion 7a without the wall portion 7b. In FIG. 3 , the hydrogen recovery port 7c provided on the back side of the second channel 7 on the lower side is hidden behind the paper. The hydrogen recovery port 7c is connected to the branch pipe 16 of the hydrogen circulation line L1 (see FIG. 1 ).

第3流路8形成為平板狀,包含相互隔開間隙配置之2個平板部8a、及設置於2個平板部8a之間且相互隔開間隙配置之2個壁部8b。平板部8a及壁部8b例如包含不鏽鋼。平板部8a於俯視下形成為四邊形,沿Z軸方向之上下配置。壁部8b設置於平板部8a之4邊之緣部分中之相互對向的2邊之緣部分。於圖3中,壁部8b設置於平板部8a之4邊之緣部分中之Y軸方向上之左右的緣部分。於第3流路8之右側面(X軸方向上之右側之面)設置有熱媒導入口8c,於第3流路8之左側面(X軸方向上之左側之面)設置有熱媒回收口8d。熱媒導入口8c連接於下述熱媒循環線路L2之分支管31e(參照圖1)。熱媒回收口8d連接於下述熱媒循環線路L2之分支管31f(參照圖1)。第3流路8構成熱媒循環線路L2之一部分。The third flow path 8 is formed in a flat plate shape, and includes two flat plate portions 8a arranged with a gap between them, and two wall portions 8b provided between the two flat plate portions 8a and arranged with a gap between them. The flat plate part 8a and the wall part 8b are made of stainless steel, for example. The flat plate portion 8a is formed in a quadrangular shape in plan view, and is arranged up and down along the Z-axis direction. The wall part 8b is provided in the edge part of 2 sides which mutually oppose among the edge part of 4 sides of the flat plate part 8a. In FIG. 3 , the wall portion 8 b is provided at the left and right edge portions in the Y-axis direction among the edge portions of the four sides of the flat plate portion 8 a. A heat medium inlet 8c is provided on the right side of the third channel 8 (the right side in the X-axis direction), and a heat medium is provided on the left side of the third channel 8 (the left side in the X-axis direction). Recovery port 8d. The heat medium introduction port 8c is connected to a branch pipe 31e (see FIG. 1 ) of a heat medium circulation line L2 described below. The heat medium recovery port 8d is connected to a branch pipe 31f (see FIG. 1 ) of the heat medium circulation line L2 described below. The third flow path 8 constitutes a part of the heat medium circulation line L2.

電熱器9設置於上下重疊之2個積層構造體4之相面對的2個第1流路6之間,即上側之積層構造體4之最下部之第1流路6與下側之積層構造體4之最上部的第1流路6之間(參照圖2)。電熱器9經由第1流路6將發熱體5加熱至可發熱之溫度(例如,50℃~1500℃)。於本實施方式中,由於電熱器9設置在發熱模組M之上下方向之中心部分,故而發熱模組M整體之溫度效率良好地上升。The electric heater 9 is installed between the two facing first channels 6 of the two laminated structures 4 stacked up and down, that is, the first channel 6 at the bottom of the upper layered structure 4 and the laminated layer on the lower side Between the uppermost first channels 6 of the structure 4 (see FIG. 2 ). The electric heater 9 heats the heating element 5 to a temperature capable of generating heat (for example, 50° C. to 1500° C.) through the first flow path 6 . In this embodiment, since the electric heater 9 is provided at the central portion of the heating module M in the vertical direction, the temperature of the heating module M as a whole rises efficiently.

如圖4所示,電熱器9係藉由將加熱線9b以反覆彎曲成矩形波狀之狀態安裝於矩形平板狀之基底9a之兩面而構成,上述矩形平板狀之基底9a包含耐熱溫度較高之鉬、鎳等金屬或高耐熱合金、或高耐熱且不與氫發生反應之氧化鋁、碳化矽等陶瓷。於基底9a之素材為金屬等呈導電性之情形時,加熱線9b介隔絕緣性陶瓷安裝於基底9a。此處,加熱線9b包含電阻較高之鉬或鎢,藉由如上所述將該加熱線9b以反覆直角彎曲成矩形波狀之狀態安裝,電熱器9之發熱面積增加,從而提高發熱量。再者,於本實施方式中,將加熱線9b安裝於基底9a之兩面而構成電熱器9,但亦可將加熱線9b僅安裝於基底9a之單面。圖4中未圖示,於電熱器9之基底9a設置有溫度感測器11(參照圖1),於加熱線9b電性連接有電源10(參照圖1)。又,於電熱器9中,亦可使用較薄之帶狀之面加熱器代替加熱線9b。As shown in Figure 4, the electric heater 9 is formed by installing the heating wire 9b on both sides of a rectangular plate-shaped base 9a in a state of repeatedly bending into a rectangular wave shape. The above-mentioned rectangular plate-shaped base 9a includes a Molybdenum, nickel and other metals or high heat-resistant alloys, or ceramics such as alumina and silicon carbide that are high heat-resistant and do not react with hydrogen. When the material of the base 9a is conductive such as metal, the heating wire 9b is attached to the base 9a via insulating ceramics. Here, the heating wire 9b is composed of molybdenum or tungsten with high resistance. By installing the heating wire 9b repeatedly bent at right angles into a rectangular wave shape as described above, the heating area of the electric heater 9 is increased, thereby increasing the heat generation. Furthermore, in this embodiment, the heating wire 9b is attached to both surfaces of the base 9a to constitute the electric heater 9, but the heating wire 9b may be attached only to one side of the base 9a. Not shown in FIG. 4 , a temperature sensor 11 (see FIG. 1 ) is provided on the base 9 a of the electric heater 9 , and a power supply 10 (see FIG. 1 ) is electrically connected to the heating wire 9 b. Also, in the electric heater 9, a thin strip-shaped surface heater may be used instead of the heating wire 9b.

此處,以下基於圖5及圖6對本實施方式之發熱裝置1之特徵構成進行說明。Here, the characteristic configuration of the heat generating device 1 of the present embodiment will be described below based on FIGS. 5 and 6 .

圖5係圖1之A部放大細節圖,圖6係圖5之B-B線剖視圖,以下,僅對一(上側)積層構造體4中之特徵構成進行圖示及說明,但另一(下側)積層構造體4之特徵構成亦相同,故而省略與其相關之圖示及說明。Fig. 5 is an enlarged detailed view of part A of Fig. 1, and Fig. 6 is a cross-sectional view of the B-B line of Fig. 5. Below, only one (upper) layered structure 4 is illustrated and described, but the other (lower side) ) The characteristic configuration of the laminated structure 4 is also the same, so the illustrations and descriptions related thereto are omitted.

如圖5所示,於積層構造體4中,於在與發熱體5之間形成第2流路7之第1間隔壁(劃分出第1流路6與第2流路7之間隔壁)24之和發熱體5對向之面(於圖5中為下表面),朝向發熱體5突出設置有用於支承發生變形之發熱體5之支架25。此處,於本實施方式中,如圖6所示,支架25係將複數個金屬製板組裝成格子狀而構成,其突出長度L(參照圖5)設定得小於第2流路7之高度H(L<H)。因此,該發熱裝置1不作動時(發熱體5不發生撓曲變形時),該支架25之前端不接觸發熱體5,於兩者之間形成有圖示之間隙δ。As shown in FIG. 5, in the laminated structure 4, the first partition wall (the partition wall between the first flow path 6 and the second flow path 7) forming the second flow path 7 is formed between the heating element 5 and the heat generating element 5. 24 and the opposite surface of the heating element 5 (the lower surface in FIG. 5 ), protruding toward the heating element 5 is provided with a bracket 25 for supporting the deformed heating element 5 . Here, in this embodiment, as shown in FIG. 6 , the bracket 25 is formed by assembling a plurality of metal plates into a lattice shape, and its protruding length L (refer to FIG. 5 ) is set to be smaller than the height of the second flow path 7 H (L<H). Therefore, when the heating device 1 is not in operation (when the heating element 5 is not deformed), the front end of the bracket 25 does not contact the heating element 5, and a gap δ shown in the figure is formed between the two.

支架25可與第1間隔壁24一體地突出設置,亦可將與第1間隔壁24分開之支架25安裝於第1間隔壁24。此處,支架25只要是耐熱性與耐壓性及熱導率較高之金屬,則可使用任意者,於本實施方式中使用鎳(Ni)。又,作為支架25,除板以外還可使用金屬製之複數個銷等,但於如本實施方式由金屬板構成支架25之情形時,為了不阻礙如下所述透過發熱體5流入至第2流路7之氫(透過氫)之流動,需要如圖5及圖6所述,於各金屬板形成供氫(透過氫)通過之孔25a。再者,亦可於各金屬板形成切口代替孔25a。The bracket 25 may protrude integrally with the first partition wall 24 , or the bracket 25 separated from the first partition wall 24 may be attached to the first partition wall 24 . Here, as the bracket 25, any metal may be used as long as it is a metal having high heat resistance, pressure resistance, and thermal conductivity, and nickel (Ni) is used in the present embodiment. Also, as the bracket 25, a plurality of pins made of metal can be used in addition to the plate, but when the bracket 25 is constituted by a metal plate as in the present embodiment, in order not to hinder the flow through the heating element 5 to the second The flow of hydrogen (permeable hydrogen) in the flow path 7 requires forming holes 25a through which hydrogen (permeable hydrogen) passes in each metal plate as described in FIGS. 5 and 6 . Furthermore, a notch may be formed in each metal plate instead of the hole 25a.

且說,於積層構造體4中,如圖5所示,於與第1間隔壁24之間形成第3流路8之第2間隔壁26係與第1間隔壁24平行配置,但於第1間隔壁24之與第2間隔壁26對向之面(於圖5中為上表面),在熱媒之流動方向(圖5之左右方向)上以等間隔突出設置有散熱銷及散熱片等複數個金屬製之散熱構件27。此處,各散熱構件27之前端與第2間隔壁26接觸。再者,於本實施方式中,第1間隔壁24及第2間隔壁26使用不鏽鋼(SUS)。又,散熱構件27與支架25同樣地只要是耐熱性與耐壓性及熱導率較高之金屬,則可使用任意者,於本實施方式中使用鎳(Ni)。於各散熱構件27,亦可與支架25同樣地形成供熱媒通過之孔或切口。In addition, in the laminated structure 4, as shown in FIG. The surface of the partition wall 24 facing the second partition wall 26 (the upper surface in FIG. 5 ) is protrudingly provided with cooling pins and cooling fins at equal intervals in the flow direction of the heat medium (the left-right direction in FIG. 5 ). A plurality of heat dissipation members 27 made of metal. Here, the front end of each heat dissipation member 27 is in contact with the second partition wall 26 . In addition, in this embodiment, stainless steel (SUS) is used for the 1st partition wall 24 and the 2nd partition wall 26. Moreover, the heat dissipation member 27 can use any metal as long as it is a metal with high heat resistance, pressure resistance, and thermal conductivity similarly to the bracket 25, and nickel (Ni) is used in this embodiment. In each heat dissipation member 27, similarly to the bracket 25, a hole or a cutout through which the heat medium passes may be formed.

又,於本實施方式中,複數個散熱構件27與第1間隔壁24一體地突出設置,但亦可與第1間隔壁24分開地構成散熱構件27,將該等散熱構件27安裝於第1間隔壁24。又,於本實施方式中,將散熱構件27設置於第1間隔壁24,但亦可將散熱構件27設置於第2間隔壁26側,使各散熱構件27之前端與第1間隔壁24接觸。Also, in this embodiment, a plurality of heat dissipation members 27 are protruded integrally with the first partition wall 24, but the heat dissipation members 27 may be formed separately from the first partition wall 24, and these heat dissipation members 27 may be attached to the first partition wall. Partition wall 24 . Also, in this embodiment, the heat dissipation member 27 is provided on the first partition wall 24, but the heat dissipation member 27 may be provided on the second partition wall 26 side so that the front end of each heat dissipation member 27 is in contact with the first partition wall 24. .

且說,於本實施方式中,如圖5所示,發熱裝置1不作動時(發熱體5不發生撓曲變形時),自第1間隔壁24一體地突出之複數個支架25之前端不接觸發熱體5,於兩者之間形成有間隙δ,但亦可如圖7所示,於發熱裝置1不作動時使複數個支架25之前端與發熱體5接觸。Moreover, in this embodiment, as shown in FIG. 5, when the heating device 1 is not in operation (when the heating element 5 is not deformed), the front ends of the plurality of brackets 25 protruding integrally from the first partition wall 24 do not contact with each other. The heating element 5 has a gap δ formed therebetween, but as shown in FIG. 7 , when the heating device 1 is not in operation, the front ends of a plurality of brackets 25 are in contact with the heating element 5 .

<發熱體之構成及發熱機制> 接下來,以下基於圖8對發熱體5之構成進行說明。 <Composition and mechanism of heating element> Next, the configuration of the heating element 5 will be described below based on FIG. 8 .

圖8係表示發熱體5之構成之剖視圖,如該圖所示,發熱體5具有支持體5A及多層膜5B,支持體5A包含儲氫金屬、儲氫合金或質子介電體。此處,作為儲氫金屬,例如使用Ni、Pd、V、Nb、Ta、Ti等。作為儲氫合金,例如使用LaNi 5、CaCu 5、MgZn 2、ZrNi 2、ZrCr 2、TiFe、TiCo、Mg 2Ni、Mg 2Cu等。作為質子介電體,例如使用BaCeO 3系(例如Ba(Ce 0.95Y 0.05)O 3-6)、SrCeO 3系(例如Sr(Ce 0.95Y 0.05)O 3-6)、CaZrO 3系(例如Ca(Zr 0.95Y 0.05)O 3- α)、SrZrO 3系(例如Sr(Zr 0.9Y 0.1)O 3- α)、βAl 2O 3、βGa 2O 3等。 8 is a cross-sectional view showing the structure of the heating element 5. As shown in this figure, the heating element 5 has a support 5A and a multilayer film 5B. The support 5A includes a hydrogen storage metal, a hydrogen storage alloy or a proton dielectric. Here, as the hydrogen absorbing metal, for example, Ni, Pd, V, Nb, Ta, Ti or the like are used. As the hydrogen storage alloy, for example, LaNi 5 , CaCu 5 , MgZn 2 , ZrNi 2 , ZrCr 2 , TiFe, TiCo, Mg 2 Ni, Mg 2 Cu or the like are used. As the proton dielectric, for example, BaCeO 3 system (such as Ba(Ce 0.95 Y 0.05 )O 3-6 ), SrCeO 3 system (such as Sr(Ce 0.95 Y 0.05 )O 3-6 ), CaZrO 3 system (such as Ca (Zr 0.95 Y 0.05 )O 3- α ), SrZrO 3 system (for example, Sr(Zr 0.9 Y 0.1 )O 3- α ), βAl 2 O 3 , βGa 2 O 3 and the like.

支持體5A亦可包含多孔質體或氫透過膜。多孔質體具有容許氫系氣體通過之大小之多個孔。多孔質體例如包含金屬、非金屬、陶瓷等材料。多孔質體理想的是包含不阻礙氫與多層膜5B之發熱反應之材料。氫透過膜包含使氫透過之材料。作為氫透過膜之材料,較佳為儲氫金屬或儲氫合金。氫透過膜亦包括具有網狀之片材者。The support 5A may also include a porous body or a hydrogen permeable membrane. The porous body has a plurality of pores of a size allowing hydrogen-based gas to pass through. The porous body includes, for example, materials such as metals, nonmetals, and ceramics. The porous body preferably contains a material that does not inhibit the exothermic reaction between hydrogen and the multilayer film 5B. The hydrogen permeable membrane includes a material permeable to hydrogen. The material of the hydrogen permeable membrane is preferably a hydrogen storage metal or a hydrogen storage alloy. The hydrogen permeable membrane also includes a sheet having a mesh shape.

多層膜5B形成於支持體5A。於本實施方式中,多層膜5B形成於支持體5A之一面(圖8之左端面及右端面)。於圖8中,僅圖示出形成於支持體5A之一面(圖8之左端面)之多層膜5B,省略了形成於支持體5A之另一面(圖8之右端面)之多層膜5B之圖示。再者,多層膜5B並不限於形成於支持體5A之兩面之情形,亦可僅形成於支持體5A之一面或僅形成於支持體5A之另一面。The multilayer film 5B is formed on the support 5A. In this embodiment, the multilayer film 5B is formed on one surface of the support 5A (the left end surface and the right end surface in FIG. 8 ). In FIG. 8 , only the multilayer film 5B formed on one side of the support 5A (the left end surface of FIG. 8 ) is shown, and the multilayer film 5B formed on the other side of the support 5A (the right end surface of FIG. 8 ) is omitted. icon. Furthermore, the multilayer film 5B is not limited to being formed on both sides of the support 5A, and may be formed only on one side of the support 5A or only on the other side of the support 5A.

多層膜5B具備包含儲氫金屬或儲氫合金之第1層51、及與該第1層51不同之包含儲氫金屬、儲氫合金或陶瓷之第2層52,於該等第1層51與第2層52之間形成有異種物質界面53。於圖8所示之例中,多層膜5B係於支持體5A之一面(圖8之左端面)形成為依序交替積層有第1層51與第2層52各5個之共10層之膜構造。再者,第1層51與第2層52之數量任意,亦可與圖8所示之例不同,於支持體5A之一面(圖8之左端面)依序交替積層複數個第2層52與第1層51而形成多層膜。又,多層膜5B只要具有第1層51及第2層52各至少1層以上,且設置1個以上形成於第1層51與第2層52之間之異種物質界面53即可。The multilayer film 5B has a first layer 51 including a hydrogen-absorbing metal or a hydrogen-absorbing alloy, and a second layer 52 different from the first layer 51 including a hydrogen-absorbing metal, a hydrogen-absorbing alloy, or ceramics. A foreign substance interface 53 is formed with the second layer 52 . In the example shown in FIG. 8 , the multilayer film 5B is formed on one side of the support 5A (the left end surface in FIG. 8 ) so that a total of 10 layers of five first layers 51 and five second layers 52 are alternately stacked in sequence. Membrane structure. Furthermore, the number of the first layer 51 and the second layer 52 is arbitrary, and may be different from the example shown in FIG. and the first layer 51 to form a multilayer film. In addition, the multilayer film 5B only needs to have at least one first layer 51 and at least one second layer 52 each, and to provide one or more dissimilar substance interfaces 53 formed between the first layer 51 and the second layer 52 .

第1層51例如包含Ni、Pd、Cu、Mn、Cr、Fe、Mg、Co及該等之合金中之任一種。此處,作為構成第1層51之合金,較佳為包含Ni、Pd、Cu、Mn、Cr、Fe、Mg、Co中之2種以上者。又,作為構成第1層51之合金,亦可為於Ni、Pd、Cu、Mn、Cr、Fe、Mg、Co中添加有添加物者。The first layer 51 contains, for example, any of Ni, Pd, Cu, Mn, Cr, Fe, Mg, Co, and alloys thereof. Here, as the alloy constituting the first layer 51 , it is preferable to include two or more of Ni, Pd, Cu, Mn, Cr, Fe, Mg, and Co. In addition, as the alloy constituting the first layer 51, Ni, Pd, Cu, Mn, Cr, Fe, Mg, and Co may be added with additives.

第2層52例如包含Ni、Pd、Cu、Mn、Cr、Fe、Mg、Co及該等之合金或SiC中之任一種。此處,作為構成第2層52之合金,較佳為包含Ni、Pd、Cu、Mn、Cr、Fe、Mg、Co中之2種以上者。又,作為構成第2層52之合金,亦可為於Ni、Pd、Cu、Mn、Cr、Fe、Mg、Co中添加有添加物者。The second layer 52 includes, for example, any of Ni, Pd, Cu, Mn, Cr, Fe, Mg, Co, alloys thereof, or SiC. Here, as the alloy constituting the second layer 52, it is preferable to include two or more of Ni, Pd, Cu, Mn, Cr, Fe, Mg, and Co. In addition, as the alloy constituting the second layer 52, Ni, Pd, Cu, Mn, Cr, Fe, Mg, and Co may be added with additives.

關於第1層51與第2層52之組合,若將元素之種類表示為「第1層-第2層」,則較佳為Pd-Ni、Ni-Cu、Ni-Cr、Ni-Fe、Ni-Mg、Ni-Co之組合。再者,在由陶瓷構成第2層52之情形時,理想的是Ni-SiC之組合。Regarding the combination of the first layer 51 and the second layer 52, if the type of element is expressed as "the first layer - the second layer", it is preferably Pd-Ni, Ni-Cu, Ni-Cr, Ni-Fe, Combination of Ni-Mg and Ni-Co. Furthermore, when the second layer 52 is made of ceramics, a combination of Ni-SiC is desirable.

構成發熱體5之多層膜5B之第1層51及第2層52之厚度較佳為各自未達1000 nm。若第1層51及第2層52之各厚度未達1000 nm,則第1層51及第2層52能夠維持不呈現塊體特性之奈米結構。附帶而言,於第1層51及第2層52之各厚度為1000 nm以上之情形時,氫難以透過多層膜5B。第1層51及第2層52之各厚度理想的是未達500 nm。若第1層51及第2層52之各厚度未達500 nm,則第1層51及第2層52能夠維持完全不呈現塊體特性之奈米結構。如圖8所示,發熱體5構成為氫跳躍著透過多層膜5B內。即,形成於第1層51與第2層52之間之異種物質界面53使氫透過。於圖8中,由虛線箭頭表示氫跳躍著透過多層膜5B內之情況。The thicknesses of the first layer 51 and the second layer 52 constituting the multilayer film 5B of the heat generating element 5 are preferably each less than 1000 nm. If the respective thicknesses of the first layer 51 and the second layer 52 are less than 1000 nm, the first layer 51 and the second layer 52 can maintain a nanostructure that does not exhibit bulk characteristics. Incidentally, when the respective thicknesses of the first layer 51 and the second layer 52 are 1000 nm or more, it is difficult for hydrogen to permeate the multilayer film 5B. The respective thicknesses of the first layer 51 and the second layer 52 are preferably less than 500 nm. If the respective thicknesses of the first layer 51 and the second layer 52 are less than 500 nm, the first layer 51 and the second layer 52 can maintain a nanostructure that does not exhibit bulk characteristics at all. As shown in FIG. 8 , the heating element 5 is configured such that hydrogen hops and permeates through the multilayer film 5B. That is, the inter-substance interface 53 formed between the first layer 51 and the second layer 52 allows hydrogen to pass through. In FIG. 8 , the case where hydrogen hops and permeates through the multilayer film 5B is indicated by a dotted arrow.

此處,基於圖9對氫透過發熱體5時之發熱(過量熱之產生)之機制進行說明。Here, the mechanism of heat generation (generation of excess heat) when hydrogen passes through the heating element 5 will be described based on FIG. 9 .

圖9係對發熱體5中之過量熱產生之機制進行說明之模式圖。圖9表示發熱體5之多層膜5B之第1層51及第2層52包含具有面心立方結構之儲氫金屬,且第1層51之金屬晶格中之氫透過異種物質界面53移動至第2層52之金屬晶格中的情況。當向發熱體5供給氫時,支持體5A及多層膜5B吸藏氫。此處,即便停止氫之供給,發熱體5亦維持由支持體5A及多層膜5B吸藏氫之狀態。FIG. 9 is a schematic diagram illustrating the mechanism of excessive heat generation in the heating element 5 . Fig. 9 shows that the first layer 51 and the second layer 52 of the multilayer film 5B of the heating element 5 include a hydrogen storage metal with a face-centered cubic structure, and the hydrogen in the metal lattice of the first layer 51 moves to the The situation in the metal lattice of the second layer 52. When hydrogen is supplied to the heating element 5, the support 5A and the multilayer film 5B absorb hydrogen. Here, even if the supply of hydrogen is stopped, the heating element 5 maintains a state where hydrogen is absorbed by the support body 5A and the multilayer film 5B.

於是,當利用電熱器9開始加熱發熱體5時,釋放由支持體5A及多層膜5B吸藏之氫。此處,已知氫較輕,於某物質A及物質B之氫所占之位置(八面體或四面體位置),氫跳躍著進行量子擴散。發熱體5中,藉由氫利用量子擴散透過異種物質界面53,或者氫利用擴散透過異種物質界面53,而產生熱量為電熱器9之加熱量以上之熱作為過量熱。Then, when the heating of the heating element 5 is started by the electric heater 9, the hydrogen occluded by the support 5A and the multilayer film 5B is released. Here, it is known that hydrogen is relatively light, and in the position (octahedral or tetrahedral position) occupied by the hydrogen of a certain substance A and substance B, the hydrogen jumps and performs quantum diffusion. In the heating element 5, hydrogen permeates the heterogeneous substance interface 53 by quantum diffusion, or hydrogen permeates the heterogeneous substance interface 53 by diffusion, and generates heat exceeding the heating value of the electric heater 9 as excess heat.

於本實施方式中,以發熱體5之一面(正面)面對第1流路6,發熱體5之另一面(背面)面對第2流路7之方式依序積層第1流路6、發熱體5及第2流路7。因此,藉由導入氫系氣體而使第1流路6升壓,藉由回收透過氣體而使第2流路7減壓。藉此,第1流路6之氫之壓力(稱為「氫分壓」)高於第2流路7之氫分壓,於發熱體5之兩側產生氫之壓力差(稱為「氫分壓之差」)。In this embodiment, the first flow path 6, the first flow path 6, The heating element 5 and the second flow path 7. Therefore, the first flow path 6 is pressurized by introducing the hydrogen-based gas, and the second flow path 7 is depressurized by recovering the permeated gas. Thereby, the pressure of hydrogen in the first channel 6 (referred to as "hydrogen partial pressure") is higher than the hydrogen partial pressure in the second channel 7, and a hydrogen pressure difference (referred to as "hydrogen partial pressure") is generated on both sides of the heating element 5. partial pressure difference").

若如上所述於發熱體5之兩側產生氫分壓之差,則導入至第1流路6之氫系氣體中所含之氫分子吸附於發熱體5之一面(正面),該氫分子解離成2個氫原子,解離而得之氫原子滲入至發熱體5之內部。即,氫吸藏於發熱體5。滲入至發熱體5之內部之氫原子藉由量子擴散透過異種物質界面53,或者藉由擴散透過異種物質界面53。在配置於發熱體5之低壓側之另一面(背面),透過發熱體5之氫原子再次鍵結,成為氫分子而釋放至第2流路7。即,氫自發熱體5釋放。If the difference in hydrogen partial pressure occurs on both sides of the heating element 5 as described above, the hydrogen molecules contained in the hydrogen-based gas introduced into the first flow path 6 are adsorbed on one side (front side) of the heating element 5, and the hydrogen molecules It dissociates into two hydrogen atoms, and the dissociated hydrogen atoms permeate into the heating element 5 . That is, hydrogen is stored in the heating element 5 . The hydrogen atoms infiltrated into the heating element 5 permeate the heterogeneous substance interface 53 by quantum diffusion, or permeate the heterogeneous substance interface 53 by diffusion. On the other side (rear surface) disposed on the low-pressure side of the heating element 5 , the hydrogen atoms passing through the heating element 5 are bonded again to become hydrogen molecules and released to the second flow path 7 . That is, hydrogen is released from the heating element 5 .

如上所述,發熱體5藉由使氫自高壓側之第1流路6透過至低壓側之第2流路7而產生過量熱。藉由維持第1流路6相較第2流路7呈高壓之狀態,能夠維持同時進行於發熱體5之正面之氫之吸藏與於發熱體5之背面之氫之釋放的狀態。再者,同時並不限於完全同時,意指微小至實質上被視為同時之程度之時間內。藉由同時進行氫之吸藏與釋放,氫連續透過發熱體5,因此,能夠由發熱體5效率良好地產生過量熱。As described above, the heating element 5 generates excess heat by passing hydrogen from the first flow path 6 on the high-pressure side to the second flow path 7 on the low-pressure side. By keeping the first flow path 6 at a higher pressure than the second flow path 7, it is possible to maintain a state where hydrogen is stored on the front surface of the heating element 5 and hydrogen is released on the back surface of the heating element 5 simultaneously. Furthermore, "simultaneous" is not limited to complete simultaneous, but means a time that is so small that it can be regarded as substantially simultaneous. Since hydrogen is continuously permeated through the heating element 5 by simultaneously storing and releasing hydrogen, excess heat can be efficiently generated from the heating element 5 .

<發熱體之製造方法> 此處,對發熱體5之製造方法之一例進行說明。 <Manufacturing method of heating element> Here, an example of the manufacturing method of the heating element 5 is demonstrated.

發熱體5係藉由如下方式製造發熱體5,即,準備板狀之支持體5A,利用蒸鍍裝置使將要成為第1層51或第2層52之儲氫金屬或儲氫合金成為氣相狀態,使該氣相狀態之儲氫金屬或儲氫合金附著於支持體5A之表面,交替形成第1層51與第2層52之膜。於此情形時,較佳為於真空狀態下連續形成第1層51與第2層52之膜,藉由如此,於第1層51與第2層52之間,僅形成異種物質界面53,而不形成自然氧化膜。作為支持體5A,例如使用Ni板。The heating element 5 is manufactured by preparing the plate-shaped support 5A, and using a vapor deposition device to make the hydrogen-absorbing metal or the hydrogen-absorbing alloy that will become the first layer 51 or the second layer 52 into a gas phase. state, the gas-phase hydrogen-absorbing metal or hydrogen-absorbing alloy is attached to the surface of the support 5A to alternately form the films of the first layer 51 and the second layer 52 . In this case, it is preferable to continuously form the films of the first layer 51 and the second layer 52 in a vacuum state. In this way, only the interface 53 of the different substance is formed between the first layer 51 and the second layer 52. without forming a natural oxide film. As the support body 5A, for example, a Ni plate is used.

作為蒸鍍裝置,使用藉由物理方法使儲氫金屬或儲氫合金蒸鍍於支持體5A之表面之物理蒸鍍裝置、或藉由化學方法使儲氫金屬或儲氫合金蒸鍍於支持體5A之表面之化學蒸鍍裝置等。作為物理蒸鍍裝置,使用濺鍍裝置或真空蒸鍍裝置等。作為化學蒸鍍裝置,使用ALD(Atomic Layer Deposition,原子層沈積)裝置等。又,亦可藉由熔噴法、旋轉塗佈法、噴塗法、浸漬法、電鍍法等,於支持體5A之表面交替形成第1層51與第2層52之膜。As the vapor deposition device, a physical vapor deposition device that vapor-deposits a hydrogen-absorbing metal or a hydrogen-absorbing alloy on the surface of the support 5A by a physical method, or vapor-deposits a hydrogen-absorbing metal or a hydrogen-absorbing alloy on a support by a chemical method is used. 5A surface chemical vapor deposition equipment, etc. As the physical vapor deposition device, a sputtering device, a vacuum vapor deposition device, or the like is used. As the chemical vapor deposition device, an ALD (Atomic Layer Deposition, atomic layer deposition) device or the like is used. In addition, the films of the first layer 51 and the second layer 52 may be alternately formed on the surface of the support 5A by a melt blowing method, a spin coating method, a spray coating method, a dipping method, a plating method, or the like.

如圖8所示,本實施方式之發熱體5係藉由將第1層51與第2層52交替積層於支持體5A而構成多層膜5B,但發熱體5之構成並不限於此。此處,分別基於圖10及圖11對發熱體5之構成之變化例1及變化例2進行說明。再者,圖10係表示變化例1之發熱體60之構成之剖視圖,圖11係表示變化例2之發熱體70之構成之剖視圖。As shown in FIG. 8 , the heat generating body 5 of this embodiment constitutes a multilayer film 5B by alternately laminating first layers 51 and second layers 52 on a support 5A, but the configuration of the heat generating body 5 is not limited thereto. Here, modification 1 and modification 2 of the configuration of the heating element 5 will be described based on FIG. 10 and FIG. 11 , respectively. 10 is a cross-sectional view showing the structure of the heating element 60 of the first modification, and FIG. 11 is a cross-sectional view showing the structure of the heating element 70 of the second modification.

<發熱體之變化例1> 如圖10所示,發熱體60具有支持體60A及多層膜60B。此處,支持體60A之構成與圖8所示之發熱體5之支持體5A的構成相同,故而省略有關該支持體60A之說明。 <Modification 1 of heating element> As shown in FIG. 10 , the heat generating body 60 has a support body 60A and a multilayer film 60B. Here, the structure of the support body 60A is the same as the structure of the support body 5A of the heating element 5 shown in FIG. 8 , and thus the description of the support body 60A is omitted.

多層膜60B形成於支持體60A。多層膜60B除了第1層61及第2層62以外,進而具有與第1層61及第2層62不同之包含儲氫金屬、儲氫合金或陶瓷之第3層63。第1層61之構成與圖7所示之發熱體5之第1層51相同,第2層62之構成與發熱體5之第2層52之構成相同,故而省略第1層61及第2層62之說明。The multilayer film 60B is formed on the support 60A. The multilayer film 60B has, in addition to the first layer 61 and the second layer 62 , a third layer 63 which is different from the first layer 61 and the second layer 62 and includes a hydrogen-absorbing metal, a hydrogen-absorbing alloy, or ceramics. The composition of the first layer 61 is the same as that of the first layer 51 of the heating element 5 shown in FIG. Description of layer 62.

於第1層61與第2層62之間形成有異種物質界面64。而且,於第1層61與第3層63之間形成有異種物質界面65。異種物質界面64及異種物質界面65與發熱體5之異種物質界面53同樣地使氫透過。於發熱體60中,藉由氫透過異種物質界面64及異種物質界面65,或者氫於異種物質界面64及異種物質界面65擴散,而產生過量熱。A heterogeneous substance interface 64 is formed between the first layer 61 and the second layer 62 . Furthermore, a heterogeneous substance interface 65 is formed between the first layer 61 and the third layer 63 . The heterogeneous substance interface 64 and the heterogeneous substance interface 65 transmit hydrogen similarly to the heterogeneous substance interface 53 of the heating element 5 . In the heating element 60 , excess heat is generated by hydrogen permeating through the heterogeneous substance interface 64 and the heterogeneous substance interface 65 , or by hydrogen diffusing through the heterogeneous substance interface 64 and the heterogeneous substance interface 65 .

多層膜60B係以於第2層62與第3層63之間設置有第1層61之多層之膜構造的形式形成於支持體60A。於圖10所示之例中,多層膜60B於支持體60A之一面(圖10之上端面)依序交替積層有第1層61、第2層62、第1層61、第3層63。多層膜60B亦可形成為與圖10所示之例不同之膜構造,即於支持體60A之一面(圖10之上端面)依序交替積層有第1層61、第3層63、第1層61、第2層62之膜構造。多層膜60B並不限於形成於支持體60A之一面(圖10之上端面)之情形,亦可形成於支持體60A之另一面(圖10之下端面)或支持體60A之兩面(圖10之上端面及下端面)。再者,第1層61、第2層62、第3層63之數量任意。作為多層膜60B,只要具有1個以上第3層63即可。The multilayer film 60B is formed on the support body 60A in the form of a multilayer film structure in which the first layer 61 is provided between the second layer 62 and the third layer 63 . In the example shown in FIG. 10 , the multilayer film 60B is alternately laminated with the first layer 61 , the second layer 62 , the first layer 61 , and the third layer 63 sequentially on one surface of the support 60A (the upper end surface in FIG. 10 ). The multilayer film 60B can also be formed into a film structure different from the example shown in FIG. The film structure of the layer 61 and the second layer 62. The multilayer film 60B is not limited to being formed on one side of the support 60A (upper end in FIG. 10 ), but may also be formed on the other side of the support 60A (lower end in FIG. 10 ) or both sides of the support 60A (the upper end of FIG. 10 ). upper end and lower end). In addition, the number of the 1st layer 61, the 2nd layer 62, and the 3rd layer 63 is arbitrary. As the multilayer film 60B, it is only necessary to have one or more third layers 63 .

此處,第3層63包含Ni、Pd、Cu、Cr、Fe、Mg、Co或該等之合金、或者SiC、CaO、Y 2O 3、TiC、LaB 6、SrO、BaO中之任一種。作為構成第3層63之合金,理想的是包含Ni、Pd、Cu、Cr、Fe、Mg、Co中之2種以上者。再者,作為構成第3層63之合金,亦可使用於Ni、Pd、Cu、Cr、Fe、Mg、Co中添加有添加元素者。 Here, the third layer 63 contains Ni, Pd, Cu, Cr, Fe, Mg, Co, or alloys thereof, or any of SiC, CaO, Y 2 O 3 , TiC, LaB 6 , SrO, and BaO. The alloy constituting the third layer 63 preferably contains two or more of Ni, Pd, Cu, Cr, Fe, Mg, and Co. In addition, as the alloy constituting the third layer 63, Ni, Pd, Cu, Cr, Fe, Mg, Co may be used in which additional elements are added.

特別理想的是第3層63包含CaO、Y 2O 3、TiC、LaB 6、SrO、BaO中之任一種。具有包含CaO、Y 2O 3、TiC、LaB 6、SrO、BaO中之任一種之第3層63之發熱體60中,氫之吸藏量增加,透過異種物質界面64及異種物質界面65之氫之量增加,故而該發熱體60所產生之過量熱增加,而謀求高輸出化。 It is particularly preferable that the third layer 63 contains any one of CaO, Y 2 O 3 , TiC, LaB 6 , SrO, and BaO. In the heating element 60 having the third layer 63 containing any one of CaO, Y 2 O 3 , TiC, LaB 6 , SrO, and BaO, the amount of hydrogen absorbed increases, and the amount of hydrogen passing through the interface 64 of the different material and the interface 65 of the different material As the amount of hydrogen increases, the excess heat generated by the heat generating element 60 increases to achieve higher output.

第3層之厚度理想的是未達1000 nm。若第3層63之厚度未達1000 nm,則第3層63能夠維持不呈現塊體特性之奈米結構。尤其是包含CaO、Y 2O 3、TiC、LaB 6、SrO、BaO中之任一種之第3層63之厚度理想的是10 nm以下。若第3層63之厚度為10 nm以下,則多層膜60B能夠容易地使氫透過。 The thickness of the third layer is preferably less than 1000 nm. If the thickness of the third layer 63 is less than 1000 nm, the third layer 63 can maintain a nanostructure that does not exhibit bulk characteristics. In particular, the thickness of the third layer 63 containing any one of CaO, Y 2 O 3 , TiC, LaB 6 , SrO, and BaO is preferably 10 nm or less. When the thickness of the third layer 63 is 10 nm or less, the multilayer film 60B can easily transmit hydrogen.

包含CaO、Y 2O 3、TiC、LaB 6、SrO、BaO中之任一種之第3層63之完整厚度理想的是10 nm以下。藉此,多層膜60B亦可形成為島嶼分佈狀,而不形成為完整之膜狀。又,第1層61及第3層63理想的是於真空狀態下連續形成。藉由如此,於第1層61與第3層63之間僅形成異種物質界面65,而不形成自然氧化膜。 The complete thickness of the third layer 63 containing any one of CaO, Y 2 O 3 , TiC, LaB 6 , SrO, and BaO is preferably 10 nm or less. Thereby, the multilayer film 60B can also be formed in an island-distributed shape instead of being formed in a complete film shape. In addition, the first layer 61 and the third layer 63 are preferably formed continuously in a vacuum state. In this way, only the heterogeneous substance interface 65 is formed between the first layer 61 and the third layer 63 without forming a natural oxide film.

關於第1層61、第2層62及第3層63之組合,若將元素之種類表示為「第1層-第3層-第2層」,則理想的是Pd-CaO-Ni、Pd-Y 2O 3-Ni、Pd-TiC-Ni、Pd-LaB 6-Ni、Ni-CaO-Cu、Ni-Y 2O 3-Cu、Ni-TiC-Cu、Ni-LaB 6-Cu、Ni-Co-Cu、Ni-CaO-Cr、Ni-Y 2O 3-Cr、Ni-TiC-Cr、Ni-LaB 6-Cr、Ni-CaO-Fe、Ni-Y 2O 3-Fe、Ni-TiC-Fe、Ni-LaB 6-Fe、Ni-Cr-Fe、Ni-CaO-Mg、Ni-Y 2O 3-Mg、Ni-TiC-Mg、Ni-LaB 6-Mg、Ni-CaO-Co、Ni-Y 2O 3-Co、Ni-TiC-Co、Ni-LaB 6-Co、Ni-CaO-SiC、Ni-Y 2O 3-SiC、Ni-TiC-SiC、Ni-LaB 6-SiC中之任一者。 Regarding the combination of the first layer 61, the second layer 62, and the third layer 63, if the type of element is expressed as "the first layer-the third layer-the second layer", it is ideal to be Pd-CaO-Ni, Pd -Y 2 O 3 -Ni, Pd-TiC-Ni, Pd-LaB 6 -Ni, Ni-CaO-Cu, Ni-Y 2 O 3 -Cu, Ni-TiC-Cu, Ni-LaB 6 -Cu, Ni -Co-Cu, Ni-CaO-Cr, Ni-Y 2 O 3 -Cr, Ni-TiC-Cr, Ni-LaB 6 -Cr, Ni-CaO-Fe, Ni-Y 2 O 3 -Fe, Ni- TiC-Fe, Ni-LaB 6 -Fe, Ni-Cr-Fe, Ni-CaO-Mg, Ni-Y 2 O 3 -Mg, Ni-TiC-Mg, Ni-LaB 6 -Mg, Ni-CaO-Co , Ni-Y 2 O 3 -Co, Ni-TiC-Co, Ni-LaB 6 -Co, Ni-CaO-SiC, Ni-Y 2 O 3 -SiC, Ni-TiC-SiC, Ni-LaB 6 -SiC either of them.

<發熱體之變化例2> 如圖11所示,本變化例之發熱體70之多層膜70B具有支持體70A及多層膜70B,支持體70A之構成與圖8所示之發熱體5之支持體5A的構成相同,故而省略有關該支持體70A之說明。 <Variation 2 of heating element> As shown in Figure 11, the multilayer film 70B of the heating element 70 of this modification has a support body 70A and a multilayer film 70B, and the composition of the support body 70A is the same as that of the support body 5A of the heating element 5 shown in Figure 8, so it is omitted. Description of the support 70A.

多層膜70B形成於支持體70A,除了第1層71、第2層72及第3層73以外,還具有與該等第1層71、第2層72及第3層73不同之包含儲氫金屬、儲氫合金或陶瓷之第4層74。第1層71、第2層72及第3層73之構成與圖10所示之發熱體60之第1層61、第2層62及第3層63之構成相同,故而省略有關該等第1層71、第2層72及第3層73之說明。The multilayer film 70B is formed on the support 70A, and in addition to the first layer 71, the second layer 72, and the third layer 73, it also has a hydrogen storage layer different from the first layer 71, the second layer 72, and the third layer 73. A fourth layer 74 of metal, hydrogen storage alloy or ceramic. The composition of the first layer 71, the second layer 72 and the third layer 73 is the same as that of the first layer 61, the second layer 62 and the third layer 63 of the heating element 60 shown in FIG. Description of the first layer 71, the second layer 72 and the third layer 73.

於第1層71與第2層72之間形成有異種物質界面75,於第1層71與第3層73之間形成有異種物質界面76。又,於第1層71與第4層74之間形成有異種物質界面77。該等異種物質界面75、76、77與發熱體5之異種物質界面53同樣地使氫透過。於發熱體70中,藉由氫利用量子擴散透過異種物質界面75、76、77,或者氫於異種物質界面75、76、77擴散,而產生過量熱。A heterogeneous substance interface 75 is formed between the first layer 71 and the second layer 72 , and a heterogeneous substance interface 76 is formed between the first layer 71 and the third layer 73 . In addition, a dissimilar substance interface 77 is formed between the first layer 71 and the fourth layer 74 . These heterogeneous substance interfaces 75 , 76 , and 77 allow hydrogen to permeate similarly to the heterogeneous substance interface 53 of the heating element 5 . In the heating element 70 , excess heat is generated by hydrogen permeating through the interfaces 75 , 76 , and 77 of different substances by quantum diffusion, or by hydrogen diffusing at the interfaces 75 , 76 , and 77 of different substances.

於圖11中,在支持體70A之表面依序積層有第1層71、第2層72、第1層71、第3層73、第1層71、第4層74。再者,亦可於支持體70A之表面依序積層第1層71、第4層74、第1層71、第3層73、第1層71、第2層72。即,多層膜70B成為第2層72、第3層73、第4層74按任意順序積層,並且於第2層72、第3層73、第4層74之各者之間設置有第1層71之積層構造。此處,形成於第1層71與第4層74之間之異種物質界面75使氫原子透過。再者,多層膜70B只要具有1個以上第4層74即可。In FIG. 11 , a first layer 71 , a second layer 72 , a first layer 71 , a third layer 73 , a first layer 71 , and a fourth layer 74 are sequentially laminated on the surface of a support 70A. Furthermore, the first layer 71, the fourth layer 74, the first layer 71, the third layer 73, the first layer 71, and the second layer 72 may be sequentially laminated on the surface of the support 70A. That is, the multilayer film 70B is formed by stacking the second layer 72, the third layer 73, and the fourth layer 74 in any order, and the first layer is provided between each of the second layer 72, the third layer 73, and the fourth layer 74. Laminated structure of layer 71. Here, the inter-substance interface 75 formed between the first layer 71 and the fourth layer 74 allows hydrogen atoms to pass through. In addition, the multilayer film 70B only needs to have one or more fourth layers 74 .

且說,第4層74包含Ni、Pd、Cu、Cr、Fe、Mg、Co或該等之合金、或者SiC、CaO、Y 2O 3、TiC、LaB 6、SrO、BaO中之任一種。此處,構成第4層74之合金理想的是包含Ni、Pd、Cu、Cr、Fe、Mg、Co中之2種以上者。再者,作為構成第4層74之合金,亦可使用於Ni、Pd、Cu、Cr、Fe、Mg、Co中添加有添加元素者。 In other words, the fourth layer 74 contains Ni, Pd, Cu, Cr, Fe, Mg, Co, or alloys thereof, or any of SiC, CaO, Y 2 O 3 , TiC, LaB 6 , SrO, and BaO. Here, the alloy constituting the fourth layer 74 preferably contains two or more of Ni, Pd, Cu, Cr, Fe, Mg, and Co. In addition, as the alloy constituting the fourth layer 74, Ni, Pd, Cu, Cr, Fe, Mg, and Co to which additional elements are added may be used.

特別理想的是第4層74包含CaO、Y 2O 3、TiC、LaB 6、SrO、BaO中之任一種。此處,於具有包含CaO、Y 2O 3、TiC、LaB 6、SrO、BaO中之任一種之第4層74之發熱體70中,氫之吸藏量增加,透過異種物質界面75、76、77之氫之量增加,故而謀求該發熱體70所產生之過量熱之高輸出化。 It is particularly preferable that the fourth layer 74 contains any one of CaO, Y 2 O 3 , TiC, LaB 6 , SrO, and BaO. Here, in the heating element 70 having the fourth layer 74 containing any one of CaO, Y 2 O 3 , TiC, LaB 6 , SrO, and BaO, the storage amount of hydrogen is increased, and the inter-substance interfaces 75 and 76 are transmitted. The amount of hydrogen in , 77 increases, so the high output of excess heat generated by the heating element 70 is sought.

第4層74之厚度理想的是未達1000 nm。若第4層74之厚度未達1000 nm,則第4層74能夠維持不呈現塊體特性之奈米結構。尤其是包含CaO、Y 2O 3、TiC、LaB 6、SrO、BaO中之任一種之第4層74理想的是10 nm以下,以便使氫原子透過。若第4層74之厚度為10 nm以下,則多層膜70B能夠容易地使氫透過。 The thickness of the fourth layer 74 is preferably less than 1000 nm. If the thickness of the fourth layer 74 is less than 1000 nm, the fourth layer 74 can maintain a nanostructure that does not exhibit bulk characteristics. In particular, the fourth layer 74 containing any one of CaO, Y 2 O 3 , TiC, LaB 6 , SrO, and BaO is preferably 10 nm or less in order to allow hydrogen atoms to pass through. When the thickness of the fourth layer 74 is 10 nm or less, the multilayer film 70B can easily transmit hydrogen.

又,包含CaO、Y 2O 3、TiC、LaB 6、SrO、BaO中之任一種之第4層74亦可形成為島嶼分佈狀,而不形成為厚度完整之膜狀。進而,第1層71及第4層74理想的是於真空狀態下連續形成,藉由如此,於第1層71與第4層74之間僅形成異種物質界面75,而不形成自然氧化膜。 Also, the fourth layer 74 containing any one of CaO, Y 2 O 3 , TiC, LaB 6 , SrO, and BaO may be formed in an island-distributed shape instead of being formed in a film with a full thickness. Furthermore, it is desirable that the first layer 71 and the fourth layer 74 be continuously formed in a vacuum state. In this way, only the heterogeneous substance interface 75 is formed between the first layer 71 and the fourth layer 74 without forming a natural oxide film. .

關於第1層71、第2層72、第3層73及第4層74之組合,若將元素之種類表示為「第1層-第4層-第3層-第2層」,則理想的是Ni-CaO-Cr-Fe、Ni-Y 2O 3-Cr-Fe、Ni-TiC-Cr-Fe、Ni-LaB 6-Cr-Fe之組合。再者,多層膜70B之構成,例如各層之厚度之比率、各層之數量、材料可根據加熱之溫度適當地任意設定。 Regarding the combination of the first layer 71, the second layer 72, the third layer 73, and the fourth layer 74, it is ideal if the type of elements is expressed as "the first layer - the fourth layer - the third layer - the second layer". It is a combination of Ni-CaO-Cr-Fe, Ni-Y 2 O 3 -Cr-Fe, Ni-TiC-Cr-Fe, Ni-LaB 6 -Cr-Fe. Furthermore, the composition of the multilayer film 70B, such as the ratio of the thickness of each layer, the number of each layer, and the material can be appropriately set arbitrarily according to the heating temperature.

(發熱裝置之作用) 接下來,對以上述方式構成之發熱裝置1之作用進行說明。 (Function of heating device) Next, the operation of the heat generating device 1 configured as described above will be described.

當利用來自控制部2之控制信號驅動循環泵14時,自該循環泵14噴出之氫(氫系氣體)從氫供給線路L1之導入配管12及自該導入配管12分支出之4根分支管15導入至形成於發熱模組M之各積層構造體4的各第1流路6。再者,氫(氫系氣體)於流經導入配管12之過程中利用緩衝槽17抑制壓力變動,並且利用壓力調整閥18減壓至特定值。When the circulation pump 14 is driven by the control signal from the control unit 2, the hydrogen (hydrogen-based gas) ejected from the circulation pump 14 passes through the introduction pipe 12 of the hydrogen supply line L1 and the four branch pipes branched from the introduction pipe 12. 15 is introduced into each first flow path 6 formed in each laminated structure 4 of the heating module M. Furthermore, while hydrogen (hydrogen-based gas) flows through the introduction pipe 12, pressure fluctuations are suppressed by the buffer tank 17, and the pressure is reduced to a specific value by the pressure regulating valve 18.

又,設置於發熱模組M之電熱器9藉由自電源10供給之電力而發熱,經由第1流路6內之氫將發熱體5加熱至特定溫度(例如,50℃~1500℃)。再者,如上所述,發熱體5之溫度係藉由基於由溫度感測器11檢測出之溫度利用控制部2控制電源10之輸出而調整為適當值。此處,由於電熱器9介裝於發熱模組M內之2個積層構造體4之間,具體而言,介裝於2個積層構造體4之相面對之第1流路6之間,故而該電熱器9之熱不會因自密閉容器3之散熱而向周圍散逸。因此,效率良好地將發熱體5加熱至適當溫度,其消耗電力被抑制得較低。Moreover, the electric heater 9 installed in the heating module M generates heat by the power supplied from the power source 10, and heats the heating element 5 to a specific temperature (for example, 50° C. to 1500° C.) through the hydrogen in the first flow path 6 . Furthermore, as described above, the temperature of the heating element 5 is adjusted to an appropriate value by controlling the output of the power supply 10 by the control unit 2 based on the temperature detected by the temperature sensor 11 . Here, since the electric heater 9 is interposed between the two laminated structures 4 in the heating module M, specifically, it is interposed between the facing first flow paths 6 of the two laminated structures 4 , so the heat of the electric heater 9 will not dissipate to the surroundings due to the heat dissipation from the airtight container 3. Therefore, the heating element 5 is efficiently heated to an appropriate temperature, and its power consumption is kept low.

且說,導入至發熱模組M之各第1流路6之氫如上所述透過發熱體5流入至第2流路7,藉由該氫透過發熱體5而使該發熱體5發熱。該發熱體5發熱之機制已於上文中敍述(參照圖9),但於各發熱體5之一面(正面),吸附氫分子,該氫分子解離成2個氫原子,解離而得之氫原子滲入至發熱體5之內部。即,氫吸藏於發熱體5,氫原子擴散著通過發熱體5之內部。又,於發熱體5之另一面(背面),通過該發熱體5之氫原子再次鍵結,成為氫分子而被釋放。即,自發熱體5釋放氫。於是,發熱體5藉由吸藏氫而發熱,又,亦藉由釋放氫而發熱。In other words, the hydrogen introduced into each first channel 6 of the heating module M flows into the second channel 7 through the heating element 5 as described above, and the heating element 5 is heated by the hydrogen passing through the heating element 5 . The mechanism of the heat generation of the heating element 5 has been described above (refer to FIG. 9 ), but on one side (front side) of each heating element 5, hydrogen molecules are adsorbed, and the hydrogen molecules are dissociated into two hydrogen atoms, and the hydrogen atoms obtained by the dissociation Infiltrate into the inside of the heating element 5. That is, hydrogen is stored in the heating element 5 , and hydrogen atoms diffuse through the inside of the heating element 5 . Moreover, on the other side (back surface) of the heating element 5, the hydrogen atoms of the heating element 5 are bonded again to become hydrogen molecules and released. That is, hydrogen is released from the heating element 5 . Then, the heating element 5 generates heat by absorbing hydrogen, and also generates heat by releasing hydrogen.

如上所述,透過(通過)發熱模組M之各發熱體5以供該發熱體5發熱之氫(透過氫)向各分支管16流出,並於回收配管13中合流,之後被抽吸至循環泵14進行回收。以下,反覆進行相同之動作,氫於氫循環線路L1中循環,在該過程中用於發熱模組M之各發熱體5之發熱。如此,於本實施方式中,氫於構成閉環之氫循環線路L1中連續循環,因此無須補給氫,較為經濟。又,由於利用通過發熱體5之高溫之氫(透過氫)防止各發熱體5之過冷,故而促進了各發熱體5之發熱。As described above, the hydrogen (permeated hydrogen) that passes through (passes through) each heating element 5 of the heating element 5 flows out to each branch pipe 16, merges in the recovery pipe 13, and is then sucked to Circulation pump 14 for recovery. Hereinafter, the same operation is repeated, hydrogen circulates in the hydrogen circulation line L1, and is used to generate heat for each heating element 5 of the heating module M during this process. In this way, in this embodiment, hydrogen is continuously circulated in the hydrogen circulation line L1 forming a closed loop, so it is not necessary to supply hydrogen, which is more economical. In addition, since the supercooling of each heating element 5 is prevented by the high-temperature hydrogen passing through the heating element 5 (transmitted hydrogen), the heating of each heating element 5 is promoted.

且說,如圖1所示,被導入氫之第1流路6經由分支管15及導入配管12連接於循環泵14之噴出側,供透過氫流入之第2流路7經由分支管16及回收配管13連接於循環泵14之吸入側,故而第1流路6之壓力高於第2流路7之壓力,因此,於第1流路6與第2流路7之間產生差壓。In other words, as shown in FIG. 1, the first flow path 6 into which hydrogen is introduced is connected to the discharge side of the circulation pump 14 through the branch pipe 15 and the introduction pipe 12, and the second flow path 7 through which hydrogen flows in is passed through the branch pipe 16 and recovered. The pipe 13 is connected to the suction side of the circulation pump 14 , so the pressure of the first flow path 6 is higher than the pressure of the second flow path 7 , so a differential pressure is generated between the first flow path 6 and the second flow path 7 .

且說,發熱體5非常薄,故而容易變形,如上所述第1流路6與第2流路7之差壓會導致如圖12所示,該發熱體5以朝向壓力較低之第2流路7側(圖12之上方)鼓出之方式撓曲變形成圓弧曲面狀(參照圖16)。Moreover, the heating element 5 is very thin, so it is easily deformed. As mentioned above, the differential pressure between the first flow path 6 and the second flow path 7 will cause the heating element 5 to flow toward the second flow with a lower pressure as shown in FIG. 12 . The road 7 side (upper side in FIG. 12 ) bulges and deforms into an arc-shaped curved surface (refer to FIG. 16 ).

於本實施方式之發熱裝置1中,如圖5及圖6所示,於第1間隔壁24之與發熱體5對向之面朝向發熱體5突出設置有複數個支架25,故而如圖12中模式性地示出,撓曲變形之發熱體5與支架25接觸並由該支架25支承。因此,防止發熱體5進一步變形,發熱體5之撓曲變形藉由支架25而抑制得較小。即,發熱體5之最大撓曲量被抑制至δ(間隙)。其結果為,防止了伴隨發熱體5之變形而導致多層膜5B自支持體5A(參照圖8)剝離,該發熱體5之耐久性提高,並且發熱體5之發熱作用不會因變形而受到阻礙,發熱體5能夠穩定地進行發熱作用,故而獲得較高之發熱效率及熱交換效率。In the heating device 1 of this embodiment, as shown in FIGS. 5 and 6 , a plurality of brackets 25 protrude toward the heating element 5 on the surface of the first partition wall 24 facing the heating element 5 , so as shown in FIG. 12 It is schematically shown that the deflected heating element 5 is in contact with the bracket 25 and is supported by the bracket 25 . Therefore, further deformation of the heating element 5 is prevented, and the deflection deformation of the heating element 5 is suppressed to be small by the bracket 25 . That is, the maximum deflection amount of the heating element 5 is suppressed to δ (gap). As a result, the peeling of the multilayer film 5B from the support body 5A (referring to FIG. 8 ) is prevented due to the deformation of the heating element 5, the durability of the heating element 5 is improved, and the heat generation of the heating element 5 is not affected by the deformation. Obstacles, the heating element 5 can stably perform heat generation, so higher heat generation efficiency and heat exchange efficiency are obtained.

又,於本實施方式之發熱裝置1中,在構成發熱模組M之各積層構造體4中,由於將第3流路8與第2流路7相鄰配置,故而流經第3流路8之熱媒藉由與流經第2流路7之透過氫(透過氣體)之熱交換而效率良好地被加熱。即,第2流路7與第3流路8作為熱交換器發揮功能,發熱體5中產生之熱經由透過氫(透過氣體)效率良好地回收至熱媒。而且,發熱體5中產生之熱之一部分自透過氫(透過氣體)經過第1間隔壁24傳遞至複數個散熱構件27,藉由自該等散熱構件27之散熱而效率良好地將熱媒加熱。即,複數個散熱構件27使得第1間隔壁24之傳熱面積變大,故而發熱體5與透過氫(透過氣體)之熱交換效率得到提高,利用熱媒效率更佳地回收發熱體5中產生之熱。In addition, in the heating device 1 of the present embodiment, in each of the laminated structures 4 constituting the heating module M, since the third flow path 8 and the second flow path 7 are arranged adjacent to each other, the flow through the third flow path The heat medium of 8 is efficiently heated by heat exchange with the permeated hydrogen (permeated gas) flowing through the second channel 7 . That is, the second flow path 7 and the third flow path 8 function as a heat exchanger, and the heat generated in the heating element 5 is efficiently recovered to the heat medium through permeated hydrogen (permeated gas). Furthermore, part of the heat generated in the heating element 5 is transmitted from permeated hydrogen (permeated gas) through the first partition wall 24 to the plurality of radiating members 27, and the heat medium is efficiently heated by heat dissipation from these radiating members 27. . That is, the plurality of radiating members 27 makes the heat transfer area of the first partition wall 24 larger, so the heat exchange efficiency between the heating element 5 and permeated hydrogen (permeated gas) is improved, and the heat medium can be efficiently recovered in the heating element 5 heat generated.

進而,發熱體5中產生之熱之一部分與該發熱體5接觸,經過支持其之支架25傳導至第1間隔壁24,該熱自第1間隔壁24導入至散熱構件27以供熱媒之加熱,故而利用熱媒更有效地回收發熱體5中產生之熱。Furthermore, a part of the heat generated in the heating element 5 is in contact with the heating element 5, and is conducted to the first partition wall 24 through the bracket 25 supporting it. Therefore, the heat generated in the heating element 5 is more effectively recovered by using the heat medium.

(傳熱量之計算結果及其考察) 此處,針對不設置支架25之情形與設置有配置成格子狀之支架25之情形,計算第1間隔壁24與第2間隔壁26之溫度及傳熱量(輻射熱量、傳導熱量及該等之合計),將結果示於表1。又,用於支架25及散熱構件27之鎳之物性資料、以及用於第1間隔壁24及第2間隔壁26之不鏽鋼(SUS)之物性資料分別如表2、表3所示,使用該等物性資料計算溫度及傳熱量。再者,作為支架25,使用如圖5所示將板配置成格子狀者,分別如表1所示改變該支架25之數量、格子之劃分數及劃分尺寸,分別設為實例(Case)0、實例1、實例2、實例3。再者,支架25之高度設為1 mm,厚度設為0.1 mm。 (Calculation results of heat transfer and its consideration) Here, the temperature and heat transfer (radiation heat, conduction heat, and the like) of the first partition wall 24 and the second partition wall 26 are calculated for the case where the bracket 25 is not provided and the case where the bracket 25 arranged in a lattice shape is provided. total), the results are shown in Table 1. Also, the physical property data of nickel used for the bracket 25 and the heat dissipation member 27, and the physical property data of the stainless steel (SUS) used for the first partition wall 24 and the second partition wall 26 are shown in Table 2 and Table 3, respectively. Calculation of temperature and heat transfer with other physical data. Furthermore, as the bracket 25, the board is configured into a lattice as shown in FIG. , Example 1, Example 2, Example 3. Furthermore, the height of the bracket 25 is set to 1 mm, and the thickness is set to 0.1 mm.

表1所示之實例0係無支架之情形,實例1係支架25之數量為2、格子之分割數為4、格子之劃分尺寸為10.5 mm之情形,實例2係支架25之數量為6、格子之分割數為16、格子之劃分尺寸為5.25 mm之情形,實例3係支架25之數量為14、格子之分割數為64、格子之劃分尺寸為2.625 mm之情形。In Example 0 shown in Table 1, there is no bracket. In Example 1, the number of brackets 25 is 2, the number of grid divisions is 4, and the division size of the grid is 10.5 mm. In Example 2, the number of brackets 25 is 6. The number of divisions of the grid is 16, and the division size of the grid is 5.25 mm. In Example 3, the number of brackets 25 is 14, the number of divisions of the grid is 64, and the division size of the grid is 2.625 mm.

[表1] 實例 格子型支架 劃分尺寸□[mm] 支架根數 間隔壁溫度[℃] 傳熱量[W] 第1(氫流路) 第2(熱交換器) 輻射 傳導 Σ 0 21 0 836.9 768.4 1.809 0.000 1.18 1 4分割 10.5 2 885.3 870.4 0.448 4.075 4.523 2 16分割 5.25 6 894.2 888.5 0.178 4.816 4.994 3 64分割 2.625 14 897.4 894.8 0.081 5.082 5.163 [Table 1] example Lattice bracket Division size [mm] Number of brackets Partition wall temperature [°C] heat transfer [W] No. 1 (hydrogen flow path) 2nd (heat exchanger) radiation Conduction Σ 0 none twenty one 0 836.9 768.4 1.809 0.000 1.18 1 4 divisions 10.5 2 885.3 870.4 0.448 4.075 4.523 2 16 divisions 5.25 6 894.2 888.5 0.178 4.816 4.994 3 64 split 2.625 14 897.4 894.8 0.081 5.082 5.163

[表2] NO 項目 資料(data) 1 密度 8900 kg/m 3 2 熱導率 66.1 W/m・℃ 3 比熱 4.400E+02 J/kg・℃ 4 輻射率 0.3 [-] [Table 2] NO project data 1 density 8900 kg/ m3 2 Thermal conductivity 66.1 W/m・ 3 specific heat 4.400E+02 J/kg・ 4 Emissivity 0.3 [-]

[表3] NO 項目 資料 1 密度 7980 kg/m 3 2 熱導率 16 W/m・℃ 3 比熱 5.020E+02 J/kg・℃ 4 輻射率 0.35 [-] [table 3] NO project material 1 density 7980 kg/ m3 2 Thermal conductivity 16 W/m・ 3 specific heat 5.020E+02 J/kg・ 4 Emissivity 0.35 [-]

根據表1所示之結果可知,支架25之數量越多,則傳遞至第1間隔壁24及第2間隔壁26之熱量越大。可知,例如無支架之實例0之情形時之第2間隔壁26之溫度為768.4℃,與此相對,於支架25之數量為14(64分割)之實例3中,第2間隔壁26之溫度成為894.8℃,較無支架之實例0之情形高120°。From the results shown in Table 1, it can be seen that the more the number of brackets 25 is, the greater the amount of heat transmitted to the first partition wall 24 and the second partition wall 26 is. It can be seen that, for example, the temperature of the second partition wall 26 in the case of Example 0 without a bracket is 768.4°C. On the other hand, in Example 3 in which the number of brackets 25 is 14 (64 divisions), the temperature of the second partition wall 26 is It was 894.8°C, which was 120° higher than that of Example 0 without a stent.

又,自下述熱利用系統(參照圖14)之熱媒循環線路L2之第4配管31d返回至發熱模組M之熱媒自第4配管31d經過2根分支管31e分別導入至各第3流路8,於流經各第3流路8之過程中,在與流經配置於第3流路8之兩側之2個第2流路7之高溫的透過氫之間進行熱交換而被加熱。即,熱媒自流經第2流路7之高溫之透過氣體奪取熱而被加熱,將該熱輸送至熱利用裝置30(參照圖14)用作該熱利用裝置30之熱源。於此情形時,流經第3流路8之熱媒藉由流經配置於第3流路8之兩側之2個第2流路7的透過氣體有效地被加熱,故而該熱媒之熱回收效率提高。因此,發熱模組M兼具作為熱交換器之功能,具備該發熱模組M之發熱裝置1具備發熱、熱交換一體式形態。Also, the heat medium returned to the heating module M from the fourth pipe 31d of the heat medium circulation line L2 of the following heat utilization system (refer to FIG. The flow paths 8 exchange heat with the high-temperature permeated hydrogen flowing through the two second flow paths 7 disposed on both sides of the third flow paths 8 while flowing through the third flow paths 8. is heated. That is, the heat medium absorbs heat from the high-temperature permeated gas flowing through the second channel 7 to be heated, and sends the heat to the heat utilization device 30 (see FIG. 14 ) as a heat source for the heat utilization device 30 . In this case, the heat medium flowing through the third flow path 8 is effectively heated by the permeated gas flowing through the two second flow paths 7 arranged on both sides of the third flow path 8, so the heat medium Increased heat recovery efficiency. Therefore, the heating module M also functions as a heat exchanger, and the heating device 1 provided with the heating module M has an integrated form of heat generation and heat exchange.

即,於流經發熱模組M之各第3流路8之過程中藉由與透過氣體之熱交換而被加熱之熱媒自各第3流路8經過分支管31f於第1配管31a中合流,經過該第1配管31a供給至熱利用裝置30,熱利用裝置30利用自熱媒供給之熱進行發電等所需之工作。然後,向熱利用裝置30供給熱而溫度下降之熱媒經過第4配管31d及分支管31e返回至發熱模組M,於該發熱模組M中再次被加熱。之後,連續反覆進行相同之作用而連續驅動熱利用裝置30。That is, the heat medium heated by heat exchange with the permeated gas in the process of flowing through each third flow path 8 of the heating module M joins the first pipe 31a through the branch pipe 31f from each third flow path 8 , is supplied to the heat utilization device 30 through the first pipe 31a, and the heat utilization device 30 uses the heat supplied from the heating medium to perform necessary operations such as power generation. Then, the heat medium whose temperature is lowered by supplying heat to the heat utilization device 30 returns to the heating module M through the fourth pipe 31d and the branch pipe 31e, and is heated again in the heating module M. After that, the same action is continuously repeated to continuously drive the heat utilization device 30 .

如上所述,本實施方式之發熱裝置1具備:積層構造體4,其係於供熱媒流通之第3流路8之兩側自該第3流路8起依序將接收透過發熱體5之氫(透過氫)之第2流路7、發熱體5、用於向發熱體5導入氫之第1流路6對稱地積層而構成;及電熱器9,其將發熱體5加熱;且積層構造體4係發熱體5與第1流路6、第2流路7及第3流路8高密度地積層而構成,因此,該積層構造體4能夠效率良好地產生熱,同時謀求積層構造體4及包含其之發熱裝置1之小型、精簡化。As described above, the heat generating device 1 of the present embodiment is provided with: a laminated structure 4 that receives and passes through the heat generating body 5 sequentially from the third flow path 8 on both sides of the third flow path 8 through which the heating medium flows. The second flow path 7 of the hydrogen (through hydrogen), the heating element 5, and the first flow path 6 for introducing hydrogen to the heating element 5 are symmetrically laminated to form; and the electric heater 9, which heats the heating element 5; and The laminated structure 4 is constructed by laminating the heat generating body 5, the first flow path 6, the second flow path 7, and the third flow path 8 at high density. Therefore, the laminated structure 4 can efficiently generate heat and simultaneously achieve a laminated structure. The structure 4 and the heat generating device 1 including it are small and simplified.

又,於積層構造體4中,發熱體5產生之熱藉由流經第3流路8之熱媒與流經配置於第3流路8之兩側之第2流路7之氫(透過氣體)的熱交換,而效率良好地提供給熱媒,故而可利用熱媒效率良好地回收發熱體5中產生之熱。Also, in the laminated structure 4, the heat generated by the heating element 5 is generated by the heat medium flowing through the third flow path 8 and the hydrogen flowing through the second flow paths 7 disposed on both sides of the third flow path 8 (through The heat exchange of gas) is efficiently provided to the heat medium, so the heat generated in the heating element 5 can be efficiently recovered by the heat medium.

再者,於本實施方式中,將2個積層構造體4呈2段重疊而構成發熱模組M,但亦可將3個以上積層構造體4呈3段以上重疊而製成多段構造之發熱模組M,藉由如此,發熱模組M效率更佳地產生熱,謀求其高輸出化。Furthermore, in this embodiment, two laminated structures 4 are stacked in two stages to form the heating module M, but three or more laminated structures 4 can be stacked in three or more stages to form a multi-stage heat generating module. In this way, the module M can generate heat more efficiently and achieve higher output.

發熱裝置1亦可構成為,使用未圖示之非透過氫回收線路回收導入至各第1流路6之氫中之未透過發熱體5的氫(亦稱為「非透過氫」),使其返回至回收配管13之循環泵14之上游側(低壓側),並自導入配管12及分支管15再次導入至各第1流路6以供各發熱體5發熱。The heating device 1 may also be configured to recover the hydrogen that has not passed through the heating element 5 (also referred to as "non-permeable hydrogen") among the hydrogen introduced into each first flow channel 6 by using a non-permeable hydrogen recovery line not shown in the figure, so that It returns to the upstream side (low pressure side) of the circulation pump 14 of the recovery pipe 13, and is reintroduced from the introduction pipe 12 and the branch pipe 15 to each first flow path 6 for each heating element 5 to generate heat.

且說,於如圖5所示,發熱裝置1不作動時,自第1間隔壁24突出之複數個支架25之前端不接觸發熱體5,於兩者之間形成有圖示之間隙δ之情形時,發熱體5於發熱裝置1作動時如圖12所示以朝向圖之上方鼓出之方式彎曲。與此相對,於發熱裝置1不作動時複數個支架25之前端如圖7所示與發熱體5接觸之情形時,如圖13所示,發熱體5以於相鄰之支架25之間分別向上方鼓出之方式撓曲變形。於此情形時,發熱體5之各支架25間之撓曲變形量相對於圖12所示之情形時之撓曲變形量被抑制得較小,因此,作用於發熱體5之應力被抑制得較小,防止了該發熱體5發生塑性變形,其耐久性提高。又,由於所有支架25之前端與發熱體5接觸,故而促進了經過該等支架25向第1間隔壁24側之熱傳導。In addition, as shown in FIG. 5, when the heating device 1 is not in operation, the front ends of the plurality of brackets 25 protruding from the first partition wall 24 do not contact the heating element 5, and a gap δ as shown in the figure is formed between the two. 12, the heating element 5 bends in a manner that bulges upward in the figure as shown in FIG. 12 when the heating device 1 operates. In contrast, when the heating device 1 is not in motion, when the front ends of a plurality of brackets 25 are in contact with the heating element 5 as shown in FIG. 7, as shown in FIG. Bending and deforming in a way that bulges upward. In this case, the amount of deflection and deformation between the brackets 25 of the heating element 5 is suppressed smaller than that of the situation shown in FIG. 12 , so the stress acting on the heating element 5 is suppressed Smaller, prevents the heating element 5 from being plastically deformed, and improves its durability. Moreover, since the front ends of all the brackets 25 are in contact with the heating element 5, heat conduction to the first partition wall 24 side through the brackets 25 is promoted.

此處,於支架25包含如圖6所示之格子狀之金屬板之情形時,即,估算作用於鎳製之發熱體5由格子狀之支架25劃分出之部分(四周由金屬板限制之部分)之最大應力。估算中,當將構成支架25之金屬板之格子間距設為10 mm,將厚度設為0.1 mm,將作用於發熱體5之壓力設為100 KPa時,作用於發熱體5之劃分出之各部分之最大應力為287 MPa。Here, when the bracket 25 includes a grid-shaped metal plate as shown in Figure 6, that is, it is estimated that the heating element 5 made of nickel is divided by the grid-shaped bracket 25 (the surrounding area is limited by the metal plate) part) of the maximum stress. In estimation, when the grid spacing of the metal plate constituting the bracket 25 is set to 10 mm, the thickness is set to 0.1 mm, and the pressure acting on the heating element 5 is set to 100 KPa, each division acting on the heating element 5 The maximum stress of the part is 287 MPa.

且說,作為發熱體5之材料之鎳之強度(拉伸強度及降伏強度)具有溫度依存性,例如,溫度900℃下之降伏應力約成為16 MPa。因此,作用於發熱體5之各劃分部分之最大應力287 MPa超過了鎳於溫度900℃下之降伏應力16 MPa,發熱體5可能發生塑性變形。In addition, the strength (tensile strength and yield strength) of nickel, which is a material of the heating element 5, is temperature-dependent. For example, the yield stress at a temperature of 900° C. is about 16 MPa. Therefore, the maximum stress of 287 MPa acting on each divided part of the heating element 5 exceeds the yield stress of 16 MPa of nickel at a temperature of 900°C, and the heating element 5 may undergo plastic deformation.

因此,為了防止上述塑性變形之發生,需要預估安全係數,例如將應力減小至降伏應力16 MPa之3/4以下之12 MPa(最大應力287 MPa之1/24)。因此,為了將作用於發熱體5之各格子部分之最大應力抑制至12 MPa以下,需要將支架25之間隔(發熱體5之格子間隔)a設定為10 mm/√24=1.8 mm以下。Therefore, in order to prevent the occurrence of the above-mentioned plastic deformation, it is necessary to estimate the safety factor, such as reducing the stress to 12 MPa below 3/4 of the yield stress of 16 MPa (1/24 of the maximum stress of 287 MPa). Therefore, in order to suppress the maximum stress acting on each lattice portion of the heating element 5 to below 12 MPa, it is necessary to set the interval a between the brackets 25 (the interval between the lattices of the heating element 5 ) to 10 mm/√24=1.8 mm or less.

且說,於發熱體5之厚度t及作用於各格子部分之壓力p固定之情形時,作用於發熱體5之各格子部分之最大應力與支架25之間隔(格子間隔)a之平方成正比。又,發熱體5之動作溫度越低,則降伏應力越大,故而可增大支架25之間隔a。又,在作用於發熱體5之壓力差較小之情形時,作用於發熱體5之應力與其成正比,亦會變小,故而仍可增大支架25之間隔a。In other words, when the thickness t of the heating element 5 and the pressure p acting on each lattice portion are fixed, the maximum stress acting on each lattice portion of the heating element 5 is proportional to the square of the interval (lattice interval) a between the brackets 25 . Also, the lower the operating temperature of the heating element 5 is, the greater the yield stress will be, so the interval a between the brackets 25 can be increased. Also, when the pressure difference acting on the heating element 5 is small, the stress acting on the heating element 5 is proportional to it and will also become smaller, so the interval a between the brackets 25 can still be increased.

當將溫度設為T由近似式表示以上之關係時,支架25之間隔a理想的是滿足 a<0.866t{(177-0.183T)/(0.287p)} 0.5When the above relationship is represented by an approximate formula with the temperature as T, the interval a between the brackets 25 ideally satisfies a<0.866t{(177-0.183T)/(0.287p)} 0.5 .

[熱利用系統] 接下來,以下基於圖12對用於利用本發明之發熱裝置1中產生之熱之熱利用系統進行說明。 [Heat Utilization System] Next, a heat utilization system for utilizing the heat generated in the heat generating device 1 of the present invention will be described below based on FIG. 12 .

圖12所示之熱利用系統具備本發明之上述發熱裝置1及熱利用裝置30。此處,熱利用裝置30係將由發熱裝置1中產生之熱加熱之熱媒作為熱源而發電之裝置,且具備熱媒循環線路L2、燃氣渦輪機32、蒸汽發生器33、蒸汽渦輪機34、史特靈引擎35及熱電交換部36。以下,對該等熱媒循環線路L2、燃氣渦輪機32、蒸汽發生器33、蒸汽渦輪機34、史特靈引擎35及熱電交換部36分別進行說明。The heat utilization system shown in FIG. 12 includes the above-mentioned heat generating device 1 and heat utilization device 30 of the present invention. Here, the heat utilization device 30 is a device that uses the heat medium heated by the heat generated in the heat generating device 1 as a heat source to generate electricity, and includes a heat medium circulation line L2, a gas turbine 32, a steam generator 33, a steam turbine 34, and a steam generator. Trane engine 35 and thermoelectric exchange unit 36 . Hereinafter, the heat medium circulation line L2, the gas turbine 32, the steam generator 33, the steam turbine 34, the Stirling engine 35, and the heat-electric exchange unit 36 will be described respectively.

(熱媒循環線路) 熱媒循環線路L2構成使熱媒於與發熱裝置1之發熱模組M、燃氣渦輪機32、蒸汽發生器33、蒸汽渦輪機34、史特靈引擎35及熱電交換部36之間循環之閉環。具體而言,該熱媒循環線路L2具備自發熱模組M之第3流路8之出口側延伸而連接於燃氣渦輪機32之第1配管31a、將燃氣渦輪機32與蒸汽發生器33連接之第2配管31b、將蒸汽發生器33與史特靈引擎35連接之第3配管31c、及自史特靈引擎35延伸而連接於發熱模組M之第3流路8之入口側之第4配管31d。此處,於第1配管31a之中途設置有循環泵37及流量控制閥38。再者,循環泵37使用金屬伸縮泵等,流量控制閥38使用可變漏閥等。 (heat medium circulation line) The heat medium circulation line L2 constitutes a closed loop that circulates the heat medium between the heating module M of the heating device 1 , the gas turbine 32 , the steam generator 33 , the steam turbine 34 , the Stirling engine 35 and the thermoelectric exchange unit 36 . Specifically, the heat medium circulation line L2 includes a first pipe 31a extending from the outlet side of the third flow path 8 of the heating module M and connected to the gas turbine 32, and connecting the gas turbine 32 and the steam generator 33. The second pipe 31b of the steam generator 33 and the third pipe 31c connected to the Stirling engine 35, and the third pipe 31c extending from the Stirling engine 35 and connected to the inlet side of the third flow path 8 of the heating module M 4 piping 31d. Here, a circulation pump 37 and a flow rate control valve 38 are provided in the middle of the first piping 31a. In addition, metal telescopic pump etc. are used for the circulation pump 37, and the variable leak valve etc. are used for the flow control valve 38.

(燃氣渦輪機) 燃氣渦輪機32具備藉由同軸連結之壓縮機32a與渦輪機32b,於渦輪機32b之輸出軸連結有發電機40。 (gas turbine) The gas turbine 32 includes a compressor 32a and a turbine 32b coaxially connected, and an electric generator 40 is connected to an output shaft of the turbine 32b.

(蒸汽發生器) 蒸汽發生器33產生用於驅動蒸汽渦輪機34之高壓蒸汽,且具備與第2配管31b相連之內部配管33a、及與該內部配管33a對向之熱交換配管33b。此處,熱交換配管33b經由蒸汽配管33c連接於蒸汽渦輪機34之入口側,並且經由供水配管33d連接於蒸汽渦輪機34之出口側。再者,雖未圖示,但於供水配管33d設置有冷凝器及供水泵。又,於蒸汽渦輪機34之輸出軸連接有發電機50。 (steam generator) The steam generator 33 generates high-pressure steam for driving the steam turbine 34, and includes an internal pipe 33a connected to the second pipe 31b, and a heat exchange pipe 33b facing the internal pipe 33a. Here, the heat exchange pipe 33b is connected to the inlet side of the steam turbine 34 through the steam pipe 33c, and is connected to the outlet side of the steam turbine 34 through the water supply pipe 33d. In addition, although not shown in figure, the condenser and the water supply pump are installed in the water supply pipe 33d. Also, a generator 50 is connected to an output shaft of the steam turbine 34 .

(史特靈引擎) 史特靈引擎35具備氣缸35a、驅氣活塞35b、動力活塞35c、流路35d及曲軸部35e。此處,氣缸35a之內部由驅氣活塞35b劃分成膨脹空間S1與壓縮空間S2,於該等膨脹空間S1及壓縮空間S2封入有作動流體。再者,作為作動流體,使用氦氣、氫系氣體、空氣等,於本實施方式中使用氦氣。 (Stirling engine) The Stirling engine 35 includes a cylinder 35a, a drive piston 35b, a power piston 35c, a flow path 35d, and a crank portion 35e. Here, the inside of the cylinder 35a is divided into an expansion space S1 and a compression space S2 by the purge piston 35b, and a working fluid is sealed in the expansion space S1 and the compression space S2. In addition, helium gas, hydrogen-based gas, air, etc. are used as a working fluid, and helium gas is used in this embodiment.

又,流路35d設置於氣缸35a之外部,使膨脹空間S1與壓縮空間S2連通。而且,該流路35d發揮使作動流體於膨脹空間S1與壓縮空間S2之間流通之功能,具備高溫部35f、低溫部35g及再生器35h。膨脹空間S1之作動流體依序通過高溫部35f、再生器35h、低溫部35g並流入至壓縮空間S2。而且,壓縮空間S2之作動流體依序通過低溫部35g、再生器35h、高溫部35f並流入至膨脹空間S1。Moreover, the flow path 35d is provided outside the cylinder 35a, and connects the expansion space S1 and the compression space S2. Furthermore, the flow path 35d functions to allow the working fluid to flow between the expansion space S1 and the compression space S2, and includes a high-temperature portion 35f, a low-temperature portion 35g, and a regenerator 35h. The working fluid in the expansion space S1 passes through the high temperature part 35f, the regenerator 35h, and the low temperature part 35g in order and flows into the compression space S2. Furthermore, the working fluid in the compression space S2 flows into the expansion space S1 through the low temperature part 35g, the regenerator 35h, and the high temperature part 35f in sequence.

高溫部35f係用於加熱作動流體之熱交換器,於該高溫部35f之外部設置有傳熱管35i。該傳熱管35i將第3配管31c與第4配管31d連接,發揮使熱媒自第3配管31c流通至第4配管31d之功能。而且,藉由熱媒自第3配管31c流向傳熱管35i,熱媒之熱傳遞至高溫部35f,從而加熱通過高溫部35f之作動流體。The high temperature part 35f is a heat exchanger for heating the working fluid, and a heat transfer tube 35i is arranged outside the high temperature part 35f. This heat transfer pipe 35i connects the 3rd pipe 31c and 31 d of 4th pipes, and performs the function of making a heat medium flow from the 3rd pipe 31c to 31 d of 4th pipes. Furthermore, when the heat medium flows from the third pipe 31c to the heat transfer pipe 35i, the heat of the heat medium is transferred to the high temperature portion 35f, thereby heating the working fluid passing through the high temperature portion 35f.

低溫部35g係用於冷卻作動流體之熱交換器,於該低溫部35g之外部設置有冷卻管35j。該冷卻管35j連接於供給水等冷媒之未圖示之冷媒供給部,使自冷媒供給部供給之冷媒通過。而且,藉由冷媒流向冷卻管35j,通過低溫部35g之作動流體被冷媒奪取熱而冷卻。The low temperature part 35g is a heat exchanger for cooling the working fluid, and a cooling pipe 35j is provided outside the low temperature part 35g. The cooling pipe 35j is connected to a refrigerant supply part (not shown) that supplies a refrigerant such as water, and passes the refrigerant supplied from the refrigerant supply part. Furthermore, as the refrigerant flows to the cooling pipe 35j, the working fluid passing through the low-temperature portion 35g is deprived of heat by the refrigerant to be cooled.

再生器35h係蓄熱用之熱交換器,且設置於高溫部35f與低溫部35g之間。該再生器35h於作動流體自膨脹空間S1移動至壓縮空間S2時,自通過高溫部35f之作動流體接收熱並將其蓄積。又,再生器35h於作動流體自壓縮空間S2移動至膨脹空間S1時,對通過低溫部35g之作動流體提供所蓄積之熱而加熱作動流體。The regenerator 35h is a heat exchanger for heat storage, and is provided between the high temperature part 35f and the low temperature part 35g. The regenerator 35h receives heat from the working fluid passing through the high temperature portion 35f and stores it when the working fluid moves from the expansion space S1 to the compression space S2. Also, the regenerator 35h heats the working fluid by providing the stored heat to the working fluid passing through the low-temperature portion 35g when the working fluid moves from the compression space S2 to the expansion space S1.

曲軸部35e設置於氣缸35a之另一端,具備可旋轉地由未圖示之曲軸箱支持之曲軸、連接於驅氣活塞35b之桿、連接於動力活塞35c之桿、將各桿與曲軸連結之連結構件等,且發揮將驅氣活塞35b及動力活塞35c之往復直線運動轉換成旋轉運動之功能。而且,於該史特靈引擎35之曲軸連接有發電機80。The crankshaft portion 35e is provided at the other end of the cylinder 35a, and includes a crankshaft rotatably supported by a crankcase not shown, a rod connected to the gas-purging piston 35b, a rod connected to the power piston 35c, and a rod for connecting the rods to the crankshaft. Connecting components, etc., and play the function of converting the reciprocating linear motion of the purge piston 35b and the power piston 35c into rotary motion. Furthermore, a generator 80 is connected to the crankshaft of the Stirling engine 35 .

(熱電交換部) 熱電交換部36利用席貝克效應將於第4配管31d中流通之熱媒之熱轉換成電力,例如將300℃以下之熱媒之熱轉換成電力。該熱電交換部36形成為筒狀,且以覆蓋第4配管31d之外周之方式配置。 (Heat and Power Exchange Unit) The thermoelectric exchange unit 36 converts the heat of the heating medium flowing through the fourth pipe 31d into electricity by using the Seebeck effect, for example, converts the heat of the heating medium below 300°C into electricity. This thermoelectric exchange part 36 is formed in a cylindrical shape, and is arrange|positioned so that it may cover the outer periphery of 31 d of 4th pipes.

而且,熱電交換部36具備設置於內表面之熱電交換模組36a及設置於外表面之冷卻部36b。此處,熱電交換模組36a具備與第4配管31d對向之受熱基板、設置於該受熱基板之受熱側電極、與冷卻部36b對向之散熱基板、設置於該散熱基板之散熱側電極、由p型半導體形成之p型熱電元件、由n型半導體形成之n型熱電元件等。於本實施方式中,熱電交換模組36a係p型熱電元件與n型熱電元件交替排列,相鄰之p型熱電元件與n型熱電元件由受熱側電極與散熱側電極電性連接。Furthermore, the thermoelectric exchange unit 36 includes a thermoelectric exchange module 36a provided on the inner surface and a cooling unit 36b provided on the outer surface. Here, the thermoelectric exchange module 36a includes a heat-receiving substrate facing the fourth pipe 31d, a heat-receiving-side electrode provided on the heat-receiving substrate, a heat-radiating substrate facing the cooling portion 36b, a heat-radiating-side electrode provided on the heat-radiating substrate, A p-type thermoelectric element formed of a p-type semiconductor, an n-type thermoelectric element formed of an n-type semiconductor, etc. In this embodiment, the thermoelectric exchange module 36a is arranged alternately with p-type thermoelectric elements and n-type thermoelectric elements, and the adjacent p-type thermoelectric elements and n-type thermoelectric elements are electrically connected by heat-receiving-side electrodes and heat-dissipating-side electrodes.

又,熱電交換模組36a中,導線經由散熱側電極電性連接至配置於一端之p型熱電元件及配置於另一端之n型熱電元件。此處,冷卻部36b例如包含供冷卻水流通之配管,該熱電交換部36產生與在內表面和外表面之間所產生之溫度差對應之電力。Moreover, in the thermoelectric exchange module 36a, the wires are electrically connected to the p-type thermoelectric element arranged at one end and the n-type thermoelectric element arranged at the other end through the heat dissipation side electrode. Here, the cooling unit 36b includes, for example, pipes through which cooling water flows, and the thermoelectric exchange unit 36 generates electric power corresponding to the temperature difference generated between the inner surface and the outer surface.

(熱利用系統之作用) 接下來,對以上述方式構成之熱利用系統之作用進行說明。 (The role of heat utilization system) Next, the action of the heat utilization system configured as described above will be described.

於本發明之發熱裝置1中,如上所述,藉由氫透過發熱模組M之各發熱體5而產生之熱被提供給流經第3流路8之熱媒,而將該熱媒加熱至特定之溫度。於是,當驅動設置於熱利用裝置30之第1配管31a之循環泵37時,經加熱之熱媒於構成閉環之發熱模組M之第3流路8、第1配管31a、第2配管31b、第3配管31c、及第4配管31d中循環,燃氣渦輪機32、蒸汽渦輪機34、史特靈引擎35及熱電交換部36接受來自該熱媒之熱供給,依序被驅動而進行所需之發電。再者,此時,流量控制閥38基於由溫度感測器11檢測出之溫度控制熱媒之流量。即,流量控制閥38在由溫度感測器11(參照圖1)檢測出之發熱體5之溫度超過適當之上限溫度的情形時,增加熱媒之循環流量而抑制發熱體5之溫度上升。又,反之流量控制閥38在由溫度感測器11檢測出之發熱體5之溫度未達適當之下限溫度的情形時,減少熱媒之循環流量而抑制發熱體5之溫度下降。In the heat generating device 1 of the present invention, as described above, the heat generated by hydrogen passing through the heat generating elements 5 of the heat generating module M is supplied to the heat medium flowing through the third flow path 8 to heat the heat medium. to a specific temperature. Therefore, when the circulation pump 37 installed in the first pipe 31a of the heat utilization device 30 is driven, the heated heat medium flows through the third flow path 8, the first pipe 31a, and the second pipe 31b of the heating module M forming a closed loop. , the third pipe 31c, and the fourth pipe 31d, the gas turbine 32, the steam turbine 34, the Stirling engine 35, and the thermoelectric exchange unit 36 receive the heat supply from the heat medium, and are sequentially driven to perform the required power generation. Furthermore, at this time, the flow rate control valve 38 controls the flow rate of the heat medium based on the temperature detected by the temperature sensor 11 . That is, when the temperature of the heating element 5 detected by the temperature sensor 11 (see FIG. 1 ) exceeds an appropriate upper limit temperature, the flow control valve 38 increases the circulating flow rate of the heating medium to suppress the temperature rise of the heating element 5 . On the contrary, when the temperature of the heating element 5 detected by the temperature sensor 11 does not reach the appropriate lower limit temperature, the flow control valve 38 reduces the circulating flow rate of the heat medium to suppress the temperature drop of the heating element 5 .

由發熱裝置1之發熱模組M加熱並自第3流路8流向第1配管31a之高溫(例如,600℃~1500℃)的熱媒被導入至燃氣渦輪機32,藉由該燃氣渦輪機32之壓縮機32a而壓縮。然後,經壓縮之熱媒一面膨脹一面流經渦輪機32b,藉此旋轉驅動該渦輪機32b,從而旋轉驅動連結於該渦輪機32b之輸出軸之發電機40進行所需之發電。即,熱媒所具有之熱之一部分轉換成燃氣渦輪機32之動能,該動能藉由發電機40轉換成電能。The high-temperature (for example, 600° C. to 1500° C.) heat medium heated by the heat-generating module M of the heat-generating device 1 and flowing from the third channel 8 to the first pipe 31 a is introduced into the gas turbine 32 . 32 compressor 32a and compression. Then, the compressed heat medium flows through the turbine 32b while expanding, thereby rotationally driving the turbine 32b, thereby rotationally driving the generator 40 connected to the output shaft of the turbine 32b to perform required power generation. That is, part of the heat of the heat medium is converted into kinetic energy of the gas turbine 32 , and the kinetic energy is converted into electrical energy by the generator 40 .

而且,自燃氣渦輪機32向第2配管31b噴出之熱媒於流經蒸汽發生器33之內部配管33a之過程中,於與流經熱交換配管33b之鍋爐水之間進行熱交換而加熱鍋爐水。其結果為,於蒸汽發生器33中,產生高溫(300℃~700℃)、高壓之蒸汽,該蒸汽經過蒸汽配管33c供給至蒸汽渦輪機34。其結果為,利用蒸汽旋轉驅動蒸汽渦輪機34,藉由該蒸汽渦輪機34之旋轉,發電機50亦同時被旋轉驅動進行所需之發電。即,熱媒所具有之熱之一部分轉換成蒸汽渦輪機34之動能,該動能藉由發電機50轉換成電能。再者,用於驅動蒸汽渦輪機34而溫度下降之蒸汽於未圖示之冷凝器中冷卻並返回至鍋爐水中,該鍋爐水自供水配管33d流向蒸汽發生器33之熱交換配管33b,於該過程中,鍋爐水由流經內部配管33a之熱冷媒加熱而成為蒸汽。In addition, the heat medium discharged from the gas turbine 32 to the second pipe 31b exchanges heat with the boiler water flowing through the heat exchange pipe 33b while flowing through the internal pipe 33a of the steam generator 33 to heat the boiler water. . As a result, high-temperature (300° C. to 700° C.) and high-pressure steam is generated in the steam generator 33 , and the steam is supplied to the steam turbine 34 through the steam pipe 33 c. As a result, the steam turbine 34 is rotationally driven by the steam, and the generator 50 is simultaneously rotationally driven by the rotation of the steam turbine 34 to perform required power generation. That is, part of the heat of the heat medium is converted into kinetic energy of the steam turbine 34 , and the kinetic energy is converted into electrical energy by the generator 50 . Furthermore, the steam that is used to drive the steam turbine 34 and whose temperature has dropped is cooled in a condenser not shown and returned to the boiler water. The boiler water flows from the water supply pipe 33d to the heat exchange pipe 33b of the steam generator 33. During this process, In this process, boiler water is heated by the hot refrigerant flowing through the internal pipe 33a to become steam.

又,於流經蒸汽發生器33之內部配管33a之過程中用於產生蒸汽之溫度300℃~1000℃的熱媒自內部配管33a經過第3配管31c供給至史特靈引擎35,藉由上述作用以供驅動史特靈引擎35。其結果為,旋轉驅動史特靈引擎35之曲軸,使得連結於該曲軸之發電機80亦被旋轉驅動進行所需之發電。即,熱媒所具有之熱之一部分轉換成史特靈引擎35之動能,該動能藉由發電機80轉換成電能。In addition, the heat medium for generating steam at a temperature of 300° C. to 1,000° C. is supplied to the Stirling engine 35 from the internal pipe 33 a through the third pipe 31 c while flowing through the internal pipe 33 a of the steam generator 33 . Function for driving the Stirling engine 35 . As a result, the crankshaft of the Stirling engine 35 is rotationally driven, so that the generator 80 connected to the crankshaft is also rotationally driven to perform required power generation. That is, part of the heat of the heat medium is converted into kinetic energy of the Stirling engine 35 , and the kinetic energy is converted into electrical energy by the generator 80 .

如上所述用於驅動史特靈引擎35之熱媒經過第4配管31d供給至熱電交換部36,該熱媒之熱之一部分如上所述利用席貝克效應轉換成電力。即,熱媒所具有之熱之一部分藉由熱電交換部36轉換成電能。The heat medium for driving the Stirling engine 35 is supplied to the thermoelectric exchange unit 36 through the fourth pipe 31d as described above, and part of the heat of the heat medium is converted into electric power by the Seebeck effect as described above. That is, part of the heat of the heat medium is converted into electric energy by the thermoelectric exchange unit 36 .

於是,熱電交換部36中用於發電而溫度下降之熱媒自第4配管31d返回至發熱模組M之第3流路8之入口側,之後,連續反覆進行相同之作用,利用熱媒回收發熱模組M中產生之熱,該熱能轉換成電能。Then, the heat medium used for power generation in the thermoelectric exchange unit 36 and whose temperature has dropped returns from the fourth pipe 31d to the inlet side of the third flow path 8 of the heating module M, and then the same action is continuously repeated, and the heat medium is recovered. The heat generated in the heating module M is converted into electrical energy.

再者,於本實施方式中,採用如下構成:藉由利用熱媒回收之熱來驅動燃氣渦輪機32、蒸汽渦輪機34及史特靈引擎35,利用發電機40、50、80將該動能轉換成電能,並且利用熱電交換部36將熱能直接轉換成電能,但亦可任意組合燃氣渦輪機32、蒸汽渦輪機34、史特靈引擎35及熱電交換部36而構成熱利用裝置30。Furthermore, in this embodiment, the following configuration is adopted: the gas turbine 32, the steam turbine 34, and the Stirling engine 35 are driven by using the heat recovered from the heat medium, and the kinetic energy is converted by the generators 40, 50, 80 The heat energy is directly converted into electric energy by using the thermoelectric exchange part 36, but the heat utilization device 30 can also be composed of a gas turbine 32, a steam turbine 34, a Stirling engine 35 and a thermoelectric exchange part 36 in any combination.

又,於以上之實施方式中,對將熱能轉換成電能之熱利用裝置30進行了說明,由本發明之發熱裝置1產生之熱可用於除發電以外之其他用途,例如供給至鍋爐之燃燒用空氣之預熱、利用化學吸收法吸收CO 2之吸收液之加熱、甲烷製造裝置中之包含CO 2及H 2之原料氣體之加熱等、以及用於熱泵系統、熱輸送系統、冷熱(冷凍)系統等。 Also, in the above embodiments, the heat utilization device 30 that converts heat energy into electric energy has been described, and the heat generated by the heat generating device 1 of the present invention can be used for purposes other than power generation, such as combustion air supplied to a boiler Preheating, heating of absorption liquid for absorbing CO2 by chemical absorption method, heating of raw material gas containing CO2 and H2 in methane production equipment, etc., as well as heat pump system, heat transport system, cooling and heating (refrigeration) system wait.

且說,於以上說明之熱利用系統中,構成為利用流經第3流路8之熱媒回收發熱裝置1中產生之熱並提供給熱利用裝置30,但亦可不設置第3流路8,直接利用流經第2流路7之透過氣體進行熱回收。於此情形時,無需第2間隔壁26及散熱構件27,第1間隔壁24及支架25作為散熱構件發生功能,故而傳熱面積增加,熱回收效率提高。於採用此種構成之情形時,理想的是構成為,向第2流路7導入另一熱媒,自第2流路7回收透過氣體及熱媒,利用氫透過膜等將透過氣體與熱媒分離,使透過氣體返回至氫循環線路L1,並且將熱媒提供給熱利用裝置30。In addition, in the heat utilization system described above, the heat generated in the heating device 1 is recovered by using the heat medium flowing through the third flow path 8 and supplied to the heat utilization device 30, but the third flow path 8 may not be provided. Heat recovery is performed by directly utilizing the permeated gas flowing through the second flow path 7 . In this case, the second partition wall 26 and the heat dissipation member 27 are unnecessary, and the first partition wall 24 and the bracket 25 function as heat dissipation members, so the heat transfer area increases and the heat recovery efficiency improves. When adopting such a configuration, it is desirable to introduce another heat medium into the second flow path 7, recover the permeated gas and the heat medium from the second flow path 7, and transfer the permeated gas and heat to the second flow path 7 by using a hydrogen permeable membrane or the like. The medium is separated, the permeated gas is returned to the hydrogen circulation line L1 , and the heat medium is supplied to the heat utilization device 30 .

再者,本發明之應用並不限定於以上所說明之實施方式,當然可於申請專利範圍及說明書與圖式中所記載之技術思想之範圍內進行各種變化。Furthermore, the application of the present invention is not limited to the embodiments described above, and of course various changes can be made within the scope of the claims and the technical ideas described in the specification and drawings.

1:發熱裝置 2:控制部 3:密閉容器 4:積層構造體 5:發熱體 5A:支持體 5B:多層膜 6:第1流路 6a:平板部 6b:壁部 6c:氫導入口 7:第2流路 7a:平板部 7b:壁部 7c:氫回收口 8:第3流路 8a:平板部 8b:壁部 8c:熱媒導入口 8d:熱媒回收口 9:電熱器 9a:基底 9b:加熱線 10:電源 11:溫度感測器 12:導入配管 13:回收配管 14:循環泵 15:分支管 16:分支管 17:緩衝槽 18:壓力調整閥 19:過濾器 24:第1間隔壁 25:支架 25a:孔 26:第2間隔壁 27:散熱構件 30:熱利用裝置 31a:第1配管 31b:第2配管 31c:第3配管 31d:第4配管 31e:分支管 31f:分支管 32:第4配管 32a:壓縮機 32b:渦輪機 33:蒸汽發生器 33a:內部配管 33b:熱交換配管 33c:蒸汽配管 33d:供水配管 34:蒸汽渦輪機 35:史特靈引擎 35a:氣缸 35b:驅氣活塞 35c:動力活塞 35d:流路 35e:曲軸部 35f:高溫部 35g:低溫部 35h:再生器 35i:傳熱管 35j:冷卻管 36:熱電交換部 36a:熱電交換模組 36b:冷卻部 37:循環泵 38:流量控制閥 40:發電機 50:發電機 51:第1層 52:第2層 53:異種物質界面 60:發熱體 60A:支持體 60B:多層膜 61:第1層 62:第2層 63:第3層 64:異種物質界面 65:異種物質界面 70:發熱體 70A:支持體 70B:多層膜 71:第1層 72:第2層 73:第3層 74:第4層 75:異種物質界面 76:異種物質界面 77:異種物質界面 80:發電機 101:發熱裝置 105:發熱體 106:第1流路 107:第2流路 L1:氫循環線路 L2:熱媒循環線路 M:發熱模組 S1:膨脹空間 S2:壓縮空間 T:溫度調整部 δ:間隙 1: heating device 2: Control Department 3: airtight container 4: Layered structure 5: Heating body 5A: Support body 5B: Multilayer film 6: The first flow path 6a: flat part 6b: Wall 6c: Hydrogen inlet 7: The second channel 7a: flat part 7b: Wall 7c: Hydrogen recovery port 8: The third channel 8a: flat part 8b: Wall 8c: heat medium inlet 8d: heat medium recovery port 9: electric heater 9a: Base 9b: Heating wire 10: Power 11: Temperature sensor 12: Import piping 13: Recovery piping 14:Circulation pump 15: branch pipe 16: branch pipe 17: buffer tank 18: Pressure adjustment valve 19: filter 24: The first partition wall 25: Bracket 25a: hole 26: The second partition wall 27: cooling components 30: Heat utilization device 31a: 1st piping 31b: Second piping 31c: 3rd piping 31d: No. 4 piping 31e: branch pipe 31f: branch pipe 32: No. 4 piping 32a: Compressor 32b: Turbine 33:Steam generator 33a: Internal Piping 33b: Heat exchange piping 33c: Steam piping 33d: Water supply piping 34:Steam Turbine 35: Stirling engine 35a: Cylinder 35b:Purge piston 35c: Power Piston 35d: flow path 35e: crankshaft 35f: High temperature part 35g: low temperature part 35h: Regenerator 35i: heat transfer tube 35j: cooling pipe 36:Heat and electricity exchange department 36a: Thermoelectric exchange module 36b: cooling part 37:Circulation pump 38: Flow control valve 40: Generator 50: Generator 51: Layer 1 52: Layer 2 53: Heterogeneous substance interface 60: heating element 60A: Support body 60B: multilayer film 61: Layer 1 62: Layer 2 63: Layer 3 64: Heterogeneous substance interface 65: Heterogeneous substance interface 70: heating element 70A: Support body 70B: multilayer film 71: Layer 1 72: Layer 2 73: Layer 3 74: Layer 4 75: Heterogeneous substance interface 76: Heterogeneous substance interface 77: Heterogeneous substance interface 80: Generator 101: heating device 105: heating element 106: 1st channel 107: The second channel L1: Hydrogen circulation line L2: heat medium circulation line M: heating module S1: Expansion space S2: compressed space T: temperature adjustment department δ: Gap

圖1係表示本發明之發熱裝置之基本構成之方塊圖。 圖2係本發明之發熱裝置之發熱模組之分解立體圖。 圖3係本發明之發熱裝置之積層構造體之分解立體圖。 圖4係本發明之發熱裝置之電熱器之俯視圖。 圖5係圖1之A部放大細節圖。 圖6係圖5之B-B線剖視圖。 圖7係表示本發明之發熱裝置之另一實施方式之與圖5相同的圖。 圖8係表示本發明之發熱裝置之發熱體之構成的剖視圖。 圖9係對本發明之發熱裝置之發熱體中之過量熱之產生機制進行說明的模式圖。 圖10係表示發熱體之構成之變化例1之剖視圖。 圖11係表示發熱體之構成之變化例2之剖視圖。 圖12係對本發明之發熱裝置之發熱體之撓曲變形及對其進行抑制之機構進行說明的模式性剖視圖。 圖13係對本發明之另一實施方式之發熱裝置之發熱體之撓曲變形及對其進行抑制之機構進行說明的模式性剖視圖。 圖14係表示具備本發明之發熱裝置之熱利用系統之構成的方塊圖。 圖15係表示具備平板狀之發熱體之發熱裝置之基本構成的剖視圖。 圖16係表示圖15所示之發熱裝置之發熱體之變形的模式性剖視圖。 Fig. 1 is a block diagram showing the basic structure of the heat generating device of the present invention. Fig. 2 is an exploded perspective view of the heating module of the heating device of the present invention. Fig. 3 is an exploded perspective view of the laminated structure of the heat generating device of the present invention. Fig. 4 is a top view of the electric heater of the heating device of the present invention. Fig. 5 is an enlarged detailed view of part A of Fig. 1 . Fig. 6 is a cross-sectional view of line B-B in Fig. 5 . Fig. 7 is a view similar to Fig. 5 showing another embodiment of the heat generating device of the present invention. Fig. 8 is a cross-sectional view showing the structure of the heating element of the heating device of the present invention. Fig. 9 is a schematic diagram illustrating the mechanism of excess heat generation in the heat generating body of the heat generating device of the present invention. Fig. 10 is a cross-sectional view showing Variation 1 of the configuration of the heating element. Fig. 11 is a cross-sectional view showing Variation 2 of the configuration of the heating element. Fig. 12 is a schematic sectional view illustrating deflection deformation of the heating element of the heat generating device of the present invention and a mechanism for suppressing it. Fig. 13 is a schematic cross-sectional view illustrating the deflection deformation of the heating element of the heating device according to another embodiment of the present invention and a mechanism for suppressing it. Fig. 14 is a block diagram showing the configuration of a heat utilization system provided with the heat generating device of the present invention. Fig. 15 is a cross-sectional view showing the basic configuration of a heat generating device including a flat heat generating body. Fig. 16 is a schematic cross-sectional view showing deformation of the heat generating element of the heat generating device shown in Fig. 15 .

5:發熱體 5: Heating body

6:第1流路 6: The first flow path

7:第2流路 7: The second channel

8:第3流路 8: The third channel

24:第1間隔壁 24: The first partition wall

25:支架 25: Bracket

25a:孔 25a: hole

26:第2間隔壁 26: The second partition wall

27:散熱構件 27: cooling components

δ:間隙 δ: Gap

Claims (4)

一種發熱裝置,其具備藉由氫之吸藏與釋放而產生熱之平板狀之發熱體、被導入包含上述氫之氫系氣體並向上述發熱體供給氫之第1流路、及供包含透過上述發熱體之氫之透過氣體流動之第2流路,且 係將上述第1流路及上述第2流路分別配置於上述發熱體之兩側而構成, 於在與上述發熱體之間形成上述第2流路之第1間隔壁,朝向上述發熱體突出設置有用於支承發生變形之上述發熱體之支架。 A heat generating device comprising a flat plate-shaped heat generating element that generates heat by absorbing and releasing hydrogen, a first channel through which a hydrogen-based gas containing the hydrogen is introduced to supply the hydrogen to the heat generating element, and a flow path for supplying the hydrogen-based gas containing the hydrogen to the heat generating element; The second channel through which the hydrogen permeating gas of the heating element flows, and It is constituted by arranging the above-mentioned first flow path and the above-mentioned second flow path on both sides of the above-mentioned heating element, respectively, A bracket for supporting the deformed heat generating body is protruded toward the heat generating body on the first partition wall forming the second flow path between the heat generating body and the first partition wall. 如請求項1之發熱裝置,其中上述支架包含金屬製之複數個銷或板。The heating device according to claim 1, wherein the support includes a plurality of pins or plates made of metal. 如請求項1或2之發熱裝置,其中將供熱媒流通之第3流路與上述第2流路相鄰配置,於在與上述第1間隔壁之間形成上述第3流路之第2間隔壁或上述第1間隔壁中之至少一間隔壁,設置有朝向另一間隔壁突出且與上述另一間隔壁接觸之散熱構件。The heating device according to claim 1 or 2, wherein the third flow path through which the heating medium flows is arranged adjacent to the second flow path, and the second flow path forming the third flow path is between the first partition wall and the first partition wall. At least one of the partition walls or the first partition walls is provided with a heat dissipation member protruding toward the other partition wall and in contact with the other partition wall. 如請求項3之發熱裝置,其中上述散熱構件包含金屬製之複數個散熱銷或散熱片。The heating device according to claim 3, wherein the heat dissipation member includes a plurality of heat dissipation pins or fins made of metal.
TW111117073A 2021-05-07 2022-05-06 Heat generating device TW202300853A (en)

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US6126723A (en) * 1994-07-29 2000-10-03 Battelle Memorial Institute Microcomponent assembly for efficient contacting of fluid
JP2001059659A (en) * 1999-08-19 2001-03-06 Rinnai Corp Heat utilizing system utilizing hydrogen storage alloy
DE60235807D1 (en) * 2001-04-30 2010-05-12 Battelle Memorial Institute FAST CYCLIC TEMPERATURE CHANGING SORPTION PROCESS AND ITS DEVICE FOR SEPARATING / CLEANING FLUIDS
US7220390B2 (en) * 2003-05-16 2007-05-22 Velocys, Inc. Microchannel with internal fin support for catalyst or sorption medium
US20110277494A1 (en) * 2009-01-22 2011-11-17 Tomonori Kikuno Heat exchanger and heat pump type hot water supply apparatus equipped with same
JP6805438B2 (en) * 2016-10-19 2020-12-23 国立大学法人東海国立大学機構 Heat exchangers, evaporators, and equipment
WO2020122098A1 (en) * 2018-12-11 2020-06-18 株式会社クリーンプラネット Heat utilization system, and heat generating device
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