TW202300587A - Ethylene vinyl alcohol copolymer resin composition, ethylene vinyl alcohol copolymer film formed therefrom, as well as multilayer structure containing the same - Google Patents

Ethylene vinyl alcohol copolymer resin composition, ethylene vinyl alcohol copolymer film formed therefrom, as well as multilayer structure containing the same Download PDF

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TW202300587A
TW202300587A TW110121918A TW110121918A TW202300587A TW 202300587 A TW202300587 A TW 202300587A TW 110121918 A TW110121918 A TW 110121918A TW 110121918 A TW110121918 A TW 110121918A TW 202300587 A TW202300587 A TW 202300587A
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evoh
resin composition
ethylene
vinyl alcohol
alcohol copolymer
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TW110121918A
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TWI767756B (en
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梁志傑
林文星
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長春石油化學股份有限公司
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Priority to JP2021181405A priority patent/JP7285298B2/en
Priority to EP22162253.3A priority patent/EP4105025A1/en
Priority to KR1020220032551A priority patent/KR102502823B1/en
Priority to US17/701,173 priority patent/US11643575B2/en
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Priority to CN202210692339.7A priority patent/CN115477805A/en
Priority to CN202210691641.0A priority patent/CN115477803A/en
Priority to CN202210691644.4A priority patent/CN115477804A/en
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Abstract

The instant disclosure relates to an ethylene vinyl alcohol copolymer (EVOH) resin composition, an EVOH film formed therefrom, and a multilayer structure containing the same. The surface roughness of the EVOH resin composition isthe peak material volume (Vmp) between 0.0008 and 10 μm 3/μm 2. The EVOH of the present invention can reduce the torque output during processing, and can obtain the EVOH film with excellent appearance.

Description

乙烯-乙烯醇共聚物樹脂組合物、由其形成之乙烯-乙烯醇共聚物膜及包含其之多層結構Ethylene-vinyl alcohol copolymer resin composition, ethylene-vinyl alcohol copolymer film formed therefrom, and multilayer structure comprising same

本發明係關於一種乙烯-乙烯醇共聚物(ethylene-vinyl alcohol, EVOH)樹脂組合物。該乙烯-乙烯醇共聚物樹脂組合物具有高表面均勻性,特別係其表面之粗糙度係介於0.0008至10μm 3/μm 2之波峰部實體體積(Vmp)。本發明亦揭示一種由該EVOH樹脂組合物形成之膜及包含該EVOH樹脂組合物的多層結構。 The invention relates to an ethylene-vinyl alcohol copolymer (ethylene-vinyl alcohol, EVOH) resin composition. The ethylene-vinyl alcohol copolymer resin composition has high surface uniformity, especially the surface roughness is between 0.0008 and 10 μm 3 /μm 2 and the volume of peak portion (Vmp). The present invention also discloses a film formed from the EVOH resin composition and a multilayer structure comprising the EVOH resin composition.

EVOH樹脂廣泛應用於多層體,用於保存易腐物品。例如,EVOH樹脂和多層體通常用於食品包裝工業、醫療設備和耗材工業、製藥工業、電子工業和農業化學品工業。EVOH樹脂通常用於加入多層體中作為一獨特層,以用作氧氣阻隔層。EVOH resin is widely used in multilayer bodies for preserving perishable items. For example, EVOH resins and multilayers are commonly used in the food packaging industry, medical equipment and consumables industry, pharmaceutical industry, electronics industry, and agricultural chemical industry. EVOH resins are commonly used in multilayer bodies as a unique layer to serve as an oxygen barrier layer.

目前習知由EVOH樹脂形成的EVOH顆粒表面粗糙度大,顆粒間摩擦較高,導致EVOH加工時扭力極高。過去雖有以添加滑劑來調整EVOH的加工性,但仍有進一步改善的必要性。It is currently known that EVOH particles formed by EVOH resin have large surface roughness and high friction between particles, resulting in extremely high torque during EVOH processing. Although the processability of EVOH has been adjusted by adding a slip agent in the past, there is still a need for further improvement.

有鑑於對可提供降低加工時扭力輸出並實現高表面均勻性的EVOH樹脂組合物有持續性的需求。In view of the continuing need for EVOH resin compositions that provide reduced torque output during processing and achieve high surface uniformity.

本發明係關於一種乙烯-乙烯醇共聚物(EVOH)樹脂組合物,其具有高表面均勻性,其中該乙烯-乙烯醇共聚物樹脂組合物包括一乙烯-乙烯醇共聚物樹脂,例如,所述之EVOH樹脂組合物其表面之粗糙度係介於0.0008至10μm 3/μm 2之波峰部實體體積(Vmp)。此外,所述之EVOH樹脂組合物其表面之粗糙度還可進一步係介於0.005至50μm 3/μm 2之核心部實體體積(Vmc)、及/或介於0.005至7μm之最大波峰高度(Sp)。該EVOH樹脂組合物係可呈顆粒、膜、纖維等形式。該EVOH樹脂組合物可用於製備膜或多層結構。發明人發現,藉由控制EVOH樹脂組合物的表面粗糙度,可降低EVOH加工時扭力輸出,並且由該EVOH樹脂組合物形成之膜及包含該EVOH樹脂組合物的多層結構具有優良外觀。 The present invention relates to an ethylene-vinyl alcohol copolymer (EVOH) resin composition having high surface uniformity, wherein the ethylene-vinyl alcohol copolymer resin composition comprises an ethylene-vinyl alcohol copolymer resin, for example, said The surface roughness of the EVOH resin composition ranges from 0.0008 to 10 μm 3 /μm 2 of the peak volume (Vmp). In addition, the surface roughness of the EVOH resin composition can further be a core solid volume (Vmc) between 0.005 and 50 μm 3 /μm 2 , and/or a maximum peak height (Sp) between 0.005 and 7 μm. ). The EVOH resin composition can be in the form of particles, films, fibers, and the like. The EVOH resin composition can be used to prepare films or multilayer structures. The inventors found that by controlling the surface roughness of the EVOH resin composition, the torque output during EVOH processing can be reduced, and the film formed from the EVOH resin composition and the multilayer structure comprising the EVOH resin composition have excellent appearance.

此外/或者,所述之EVOH樹脂組合物其表面之線最大高度(Rz)介於約0.01~13 μm;或所述之EVOH樹脂組合物其表面之Rz介於0.01~9.9 μm。In addition/or, the maximum line height (Rz) of the surface of the EVOH resin composition is about 0.01-13 μm; or the Rz of the surface of the EVOH resin composition is 0.01-9.9 μm.

在非限制性實例中,該EVOH樹脂組合物含水率小於1重量百分比。In a non-limiting example, the moisture content of the EVOH resin composition is less than 1 weight percent.

在本發明的其他方面,提供一種EVOH樹脂組合物(或其顆粒)可具有硼含量介於5-550 ppm。該EVOH樹脂組合物可具有鹼金屬含量約介於5-550 ppm。此外/或者,該EVOH樹脂組合物還可進一步包含由肉桂酸、共軛多烯、滑劑及鹼土金屬所組成之群組之其一或其組合。In other aspects of the present invention, there is provided an EVOH resin composition (or its particles) having a boron content ranging from 5-550 ppm. The EVOH resin composition may have an alkali metal content of about 5-550 ppm. In addition/or, the EVOH resin composition may further include one or a combination of the group consisting of cinnamic acid, conjugated polyene, lubricant and alkaline earth metal.

此外/或者,該EVOH樹脂組合物中該乙烯-乙烯醇共聚物樹脂可具有99.5 mole%或更高的皂化度。該EVOH樹脂組合物中該乙烯-乙烯醇共聚物樹脂可具有約20至約48 mole%的乙烯含量。例如,該乙烯-乙烯醇共聚物的乙烯含量可為約25至約45 mole%。。該EVOH樹脂組合物係可由具有不同乙烯含量的兩種或更多種EVOH形成。Additionally/alternatively, the ethylene-vinyl alcohol copolymer resin in the EVOH resin composition may have a saponification degree of 99.5 mole% or higher. The ethylene-vinyl alcohol copolymer resin in the EVOH resin composition may have an ethylene content of about 20 to about 48 mole%. For example, the ethylene-vinyl alcohol copolymer may have an ethylene content of about 25 to about 45 mole percent. . The EVOH resin composition can be formed from two or more EVOHs having different ethylene contents.

根據至少一實施例,該多層結構,包括:(a) 至少一層由如前所述之乙烯-乙烯醇共聚物樹脂所形成;(b) 至少一層聚合物層;及(c) 至少一層黏合層。該聚合物層可以係例如:選自由低密度聚乙烯層、聚乙烯接枝馬來酸酐(polyethylene grafted maleic anhydride)層、聚丙烯層及尼龍層所組成的群組。該黏合層係一黏結層(tie layer)。According to at least one embodiment, the multilayer structure includes: (a) at least one layer formed of the aforementioned ethylene-vinyl alcohol copolymer resin; (b) at least one polymer layer; and (c) at least one adhesive layer . The polymer layer may be, for example, selected from the group consisting of a low density polyethylene layer, a polyethylene grafted maleic anhydride layer, a polypropylene layer and a nylon layer. The adhesive layer is a tie layer.

本發明係關於一種乙烯-乙烯醇共聚物(EVOH)樹脂組合物。該EVOH樹脂組合物具有低表面粗糙度,特別是其表面之粗糙度係介於0.0008至10μm 3/μm 2之波峰部實體體積(Vmp)。此外,該EVOH樹脂組合物表面之粗糙度還可以進一步係介於0.005至50μm 3/μm 2之核心部實體體積(Vmc)及/或介於0.005至7μm之最大波峰高度(Sp)。EVOH樹脂組合物表面粗糙度的控制,可以藉由在EVOH製程之造粒後洗滌階段之調控來達成,而使EVOH樹脂組合物及其膜具有良好的功效。該EVOH樹脂組合物可用於製備膜或多層結構。發明人發現,藉由控制EVOH顆粒表面粗糙度參數Vmp於特定範圍,可降低EVOH加工時扭力輸出,並且可改善由其形成的膜和多層結構的凝膠生成情形。 The present invention relates to an ethylene-vinyl alcohol copolymer (EVOH) resin composition. The EVOH resin composition has a low surface roughness, especially the surface roughness is between 0.0008 and 10 μm 3 /μm 2 of the volume of peak portion (Vmp). In addition, the surface roughness of the EVOH resin composition can further be a core solid volume (Vmc) between 0.005-50 μm 3 /μm 2 and/or a maximum peak height (Sp) between 0.005-7 μm. The control of the surface roughness of the EVOH resin composition can be achieved by adjusting the washing stage after granulation in the EVOH process, so that the EVOH resin composition and its film have good efficacy. The EVOH resin composition can be used to prepare films or multilayer structures. The inventors found that by controlling the surface roughness parameter Vmp of EVOH particles within a specific range, the torque output during EVOH processing can be reduced, and the gel formation of the film and multilayer structure formed therefrom can be improved.

所述之波峰部實體體積(Vmp)之定義參照ISO 25178:2012,係以體積參數定量突出波峰部的大小,使用體積參數時,必須指定分離核心部與突出波峰部的負荷面積率,及核心部與突出波谷部的負荷面積率,通常分別指定為10%、80%。該表面之粗糙度Vmp係較佳係介於0.0008至10μm 3/μm 2,所述之Vmp可以係例如:介於0.0008至10μm 3/μm 2、介於0.0008至9μm 3/μm 2、介於0.0008至8μm 3/μm 2、介於0.0008至7μm 3/μm 2、介於0.0008至6μm 3/μm 2、介於0.0008至5μm 3/μm 2、介於0.0008至4μm 3/μm 2、介於0.0008至3μm 3/μm 2、介於0.0008至2μm 3/μm 2、介於0.0008至1μm 3/μm 2、介於0.0008至0.1μm 3/μm 2、介於0.0008至0.01μm 3/μm 2、介於0.0008至0.001μm 3/μm 2、介於0.001至10μm 3/μm 2、介於0.001至9μm 3/μm 2、介於0.001至8μm 3/μm 2、介於0.001至7μm 3/μm 2、介於0.001至6μm 3/μm 2、介於0.001至5μm 3/μm 2、介於0.001至4μm 3/μm 2、介於0.001至3μm 3/μm 2、介於0.001至2μm 3/μm 2、介於0.001至1μm 3/μm 2、介於0.001至0.1μm 3/μm 2、介於0.001至0.01μm 3/μm 2、介於0.1至10μm 3/μm 2、介於0.1至9μm 3/μm 2、介於0.1至8μm 3/μm 2、介於0.1至7μm 3/μm 2、介於0.1至6μm 3/μm 2、介於0.1至5μm 3/μm 2、介於0.1至4μm 3/μm 2、介於0.1至3μm 3/μm 2、介於0.1至2μm 3/μm 2、介於0.1至1μm 3/μm 2、介於0.8至10μm 3/μm 2、介於0.8至9μm 3/μm 2、介於0.8至8μm 3/μm 2、介於0.8至7μm 3/μm 2、介於0.8至6μm 3/μm 2、介於0.8至5μm 3/μm 2、介於0.8至4μm 3/μm 2、介於0.8至3μm 3/μm 2、介於0.8至2μm 3/μm 2、介於0.8至1μm 3/μm 2、介於2至10μm 3/μm 2、介於2至9μm 3/μm 2、介於2至8μm 3/μm 2、介於2至7μm 3/μm 2、介於2至6μm 3/μm 2、介於2至5μm 3/μm 2、介於2至4μm 3/μm 2、介於4至10μm 3/μm 2、介於4至9μm 3/μm 2、介於4至8μm 3/μm 2、介於4至7μm 3/μm 2、介於4至6μm 3/μm 2、介於6至10μm 3/μm 2、介於6至9μm 3/μm 2、介於6至8μm 3/μm 2、介於8至10μm 3/μm 2或介於9至10μm 3/μm 2The definition of the peak volume (Vmp) refers to ISO 25178:2012, which is to quantify the size of the protruding peak with the volume parameter. When using the volume parameter, the load area ratio separating the core and the protruding peak must be specified, and the core The load area ratios of the bottom part and the protruding trough part are usually specified as 10% and 80%, respectively. The surface roughness Vmp is preferably between 0.0008 and 10 μm 3 /μm 2 , and the Vmp can be, for example: between 0.0008 and 10 μm 3 /μm 2 , between 0.0008 and 9 μm 3 /μm 2 , between 0.0008 to 8 μm 3 /μm 2 , between 0.0008 and 7 μm 3 /μm 2 , between 0.0008 and 6 μm 3 /μm 2 , between 0.0008 and 5 μm 3 /μm 2 , between 0.0008 and 4 μm 3 /μm 2 , between 0.0008 to 3 μm 3 /μm 2 , 0.0008 to 2 μm 3 /μm 2 , 0.0008 to 1 μm 3 /μm 2 , 0.0008 to 0.1 μm 3 /μm 2 , 0.0008 to 0.01 μm 3 /μm 2 , Between 0.0008 and 0.001 μm 3 /μm 2 , between 0.001 and 10 μm 3 /μm 2 , between 0.001 and 9 μm 3 /μm 2 , between 0.001 and 8 μm 3 /μm 2 , between 0.001 and 7 μm 3 /μm 2 , between 0.001 and 6 μm 3 /μm 2 , between 0.001 and 5 μm 3 /μm 2 , between 0.001 and 4 μm 3 /μm 2 , between 0.001 and 3 μm 3 /μm 2 , between 0.001 and 2 μm 3 /μm 2 , between 0.001 and 1 μm 3 /μm 2 , between 0.001 and 0.1 μm 3 /μm 2 , between 0.001 and 0.01 μm 3 /μm 2 , between 0.1 and 10 μm 3 /μm 2 , between 0.1 and 9 μm 3 / μm 2 , between 0.1 and 8 μm 3 /μm 2 , between 0.1 and 7 μm 3 /μm 2 , between 0.1 and 6 μm 3 /μm 2 , between 0.1 and 5 μm 3 /μm 2 , between 0.1 and 4 μm 3 / μm 2 , between 0.1 and 3 μm 3 /μm 2 , between 0.1 and 2 μm 3 /μm 2 , between 0.1 and 1 μm 3 /μm 2 , between 0.8 and 10 μm 3 /μm 2 , between 0.8 and 9 μm 3 / μm 2 , between 0.8 and 8 μm 3 /μm 2 , between 0.8 and 7 μm 3 /μm 2 , between 0.8 and 6 μm 3 / μm 2 , between 0.8 and 5 μm 3 /μm 2 , between 0.8 and 4 μm 3 / μm 2 , between 0.8 and 3 μm 3 /μm 2 , between 0.8 and 2 μm 3 /μm 2 , between 0.8 and 1 μm 3 /μm 2 , between 2 and 10 μm 3 /μm 2. Between 2 and 9 μm 3 /μm 2 , between 2 and 8 μm 3 /μm 2 , between 2 and 7 μm 3 /μm 2 , between 2 and 6 μm 3 / μm 2 , between 2 and 5 μm 3 /μm 2. Between 2 and 4 μm 3 /μm 2 , between 4 and 10 μm 3 /μm 2 , between 4 and 9 μm 3 /μm 2 , between 4 and 8 μm 3 /μm 2 , between 4 and 7 μm 3 /μm 2. Between 4 and 6 μm 3 /μm 2 , between 6 and 10 μm 3 /μm 2 , between 6 and 9 μm 3 /μm 2 , between 6 and 8 μm 3 /μm 2 , between 8 and 10 μm 3 /μm 2 or between 9 and 10 μm 3 /μm 2 .

所述之核心部實體體積(Vmc)之定義參照ISO 25178:2012,係以體積參數定量核心部的大小,如同波峰部實體體積之說明,使用體積參數時,必須指定分離核心部與突出波峰部的負荷面積率,及核心部與突出波谷部的負荷面積率,通常分別指定為10%、80%。該表面之粗糙度Vmc係較佳係介於0.005至50μm 3/μm 2,所述之Vmc可以係例如:介於0.005至50μm 3/μm 2、介於0.005至45μm 3/μm 2、介於0.005至40μm 3/μm 2、介於0.005至35μm 3/μm 2、介於0.005至30μm 3/μm 2、介於0.005至25μm 3/μm 2、介於0.005至20μm 3/μm 2、介於0.005至15μm 3/μm 2、介於0.005至10μm 3/μm 2、介於0.005至5μm 3/μm 2、介於0.005至1μm 3/μm 2、介於0.005至0.1μm 3/μm 2、介於0.005至0.01μm 3/μm 2、介於0.01至50μm 3/μm 2、介於0.01至45μm 3/μm 2、介於0.01至40μm 3/μm 2、介於0.01至35μm 3/μm 2、介於0.01至30μm 3/μm 2、介於0.01至25μm 3/μm 2、介於0.01至20μm 3/μm 2、介於0.01至15μm 3/μm 2、介於0.01至10μm 3/μm 2、介於0.01至5μm 3/μm 2、介於0.01至1μm 3/μm 2、介於0.01至0.1μm 3/μm 2、介於1至50μm 3/μm 2、介於1至45μm 3/μm 2、介於1至40μm 3/μm 2、介於1至35μm 3/μm 2、介於1至30μm 3/μm 2、介於1至25μm 3/μm 2、介於1至20μm 3/μm 2、介於1至15μm 3/μm 2、介於1至10μm 3/μm 2、介於1至5μm 3/μm 2、介於5至50μm 3/μm 2、介於5至45μm 3/μm 2、介於5至40μm 3/μm 2、介於5至35μm 3/μm 2、介於5至30μm 3/μm 2、介於5至25μm 3/μm 2、介於5至20μm 3/μm 2、介於5至15μm 3/μm 2、介於5至10μm 3/μm 2、介於10至50μm 3/μm 2、介於10至45μm 3/μm 2、介於10至40μm 3/μm 2、介於10至35μm 3/μm 2、介於10至30μm 3/μm 2、介於10至25μm 3/μm 2、介於10至20μm 3/μm 2、介於10至15μm 3/μm 2、介於10至10μm 3/μm 2、介於20至50μm 3/μm 2、介於20至45μm 3/μm 2、介於20至40μm 3/μm 2、介於20至35μm 3/μm 2、介於20至30μm 3/μm 2、介於20至25μm 3/μm 2、介於30至50μm 3/μm 2、介於30至45μm 3/μm 2、介於30至40μm 3/μm 2、介於35至50μm 3/μm 2、介於35至45μm 3/μm 2、介於35至40μm 3/μm 2、介於40至50μm 3/μm 2或介於40至45μm 3/μm 2The definition of the solid volume of the core (Vmc) refers to ISO 25178:2012. It uses the volume parameter to quantify the size of the core, just like the description of the solid volume of the peak. When using the volume parameter, it must be specified to separate the core and the prominent peak The load area ratio of the core part and the load area ratio of the protruding trough part are usually specified as 10% and 80% respectively. The surface roughness Vmc is preferably between 0.005 and 50 μm 3 /μm 2 , and the Vmc can be, for example: between 0.005 and 50 μm 3 /μm 2 , between 0.005 and 45 μm 3 /μm 2 , between 0.005 to 40 μm 3 /μm 2 , between 0.005 and 35 μm 3 /μm 2 , between 0.005 and 30 μm 3 /μm 2 , between 0.005 and 25 μm 3 /μm 2 , between 0.005 and 20 μm 3 /μm 2 , between 0.005 to 15 μm 3 /μm 2 , between 0.005 and 10 μm 3 /μm 2 , between 0.005 and 5 μm 3 /μm 2 , between 0.005 and 1 μm 3 /μm 2 , between 0.005 and 0.1 μm 3 /μm 2 , between Between 0.005 and 0.01 μm 3 /μm 2 , between 0.01 and 50 μm 3 /μm 2 , between 0.01 and 45 μm 3 /μm 2 , between 0.01 and 40 μm 3 /μm 2 , between 0.01 and 35 μm 3 /μm 2 , 0.01 to 30 μm 3 /μm 2 , 0.01 to 25 μm 3 /μm 2 , 0.01 to 20 μm 3 /μm 2 , 0.01 to 15 μm 3 /μm 2 , 0.01 to 10 μm 3 /μm 2 , Between 0.01 and 5 μm 3 /μm 2 , between 0.01 and 1 μm 3 /μm 2 , between 0.01 and 0.1 μm 3 /μm 2 , between 1 and 50 μm 3 /μm 2 , between 1 and 45 μm 3 /μm 2 , between 1 and 40 μm 3 /μm 2 , between 1 and 35 μm 3 /μm 2 , between 1 and 30 μm 3 /μm 2 , between 1 and 25 μm 3 /μm 2 , between 1 and 20 μm 3 /μm 2 , between 1 and 15 μm 3 /μm 2 , between 1 and 10 μm 3 /μm 2 , between 1 and 5 μm 3 /μm 2 , between 5 and 50 μm 3 /μm 2 , between 5 and 45 μm 3 /μm 2 , between 5 and 40 μm 3 /μm 2 , between 5 and 35 μm 3 /μm 2 , between 5 and 30 μm 3 /μm 2 , between 5 and 25 μm 3 /μm 2 , between 5 and 20 μm 3 /μm 2 , between 5 and 15 μm 3 /μm 2 , between 5 and 10 μm 3 /μm 2 , between 10 and 50 μm 3 /μm 2 , between 10 and 45 μm 3 /μm 2 , between 10 and 40 μm 3 /μm 2 , between 10 and 35μm 3 /μm 2. Between 10 and 30 μm 3 /μm 2 , between 10 and 25 μm 3 /μm 2 , between 10 and 20 μm 3 /μm 2 , between 10 and 15 μm 3 /μm 2 , between 10 and 10 μm 3 /μm 2. Between 20 and 50 μm 3 /μm 2 , between 20 and 45 μm 3 /μm 2 , between 20 and 40 μm 3 /μm 2 , between 20 and 35 μm 3 /μm 2 , between 20 and 30 μm 3 /μm 2. Between 20 to 25 μm 3 /μm 2 , between 30 to 50 μm 3 /μm 2 , between 30 to 45 μm 3 /μm 2 , between 30 to 40 μm 3 /μm 2 , between 35 to 50 μm 3 /μm 2. Between 35 to 45 μm 3 /μm 2 , between 35 to 40 μm 3 /μm 2 , between 40 to 50 μm 3 /μm 2 or between 40 to 45 μm 3 /μm 2 .

所述之最大波峰高度(Sp)為面的最大波峰高度,其定義參照ISO 25178:2012,係定義範圍中最高點的高度。該表面之粗糙度Sp係較佳係介於0.005至7μm,所述之Sp可以係例如:介於0.005至7μm、介於0.005至6μm、介於0.005至5μm、介於0.005至4μm、介於0.005至3μm、介於0.005至2μm、介於0.005至1μm、介於0.005至0.1μm、介於0.005至0.01μm、介於0.01至7μm、介於0.01至6μm、介於0.01至5μm、介於0.01至4μm、介於0.01至3μm、介於0.01至2μm、介於0.01至1μm、介於0.01至0.1μm、介於0.1至7μm、介於0.1至6μm、介於0.1至5μm、介於0.1至4μm、介於0.1至3μm、介於0.1至2μm、介於0.1至1μm、介於1至7μm、介於1至6μm、介於1至5μm、介於1至4μm、介於1至3μm、介於1至2μm、介於2至7μm、介於2至6μm、介於2至5μm、介於2至4μm、介於2至3μm、介於4至7μm、介於4至6μm或介於4至5μm。The maximum peak height (Sp) is the maximum peak height of the surface, and its definition refers to ISO 25178:2012, which is the height of the highest point in the defined range. The surface roughness Sp is preferably between 0.005 and 7 μm, and the Sp can be, for example: between 0.005 and 7 μm, between 0.005 and 6 μm, between 0.005 and 5 μm, between 0.005 and 4 μm, between 0.005 to 3 μm, between 0.005 and 2 μm, between 0.005 and 1 μm, between 0.005 and 0.1 μm, between 0.005 and 0.01 μm, between 0.01 and 7 μm, between 0.01 and 6 μm, between 0.01 and 5 μm, between 0.01 to 4 μm, 0.01 to 3 μm, 0.01 to 2 μm, 0.01 to 1 μm, 0.01 to 0.1 μm, 0.1 to 7 μm, 0.1 to 6 μm, 0.1 to 5 μm, 0.1 to 4 μm, between 0.1 to 3 μm, between 0.1 to 2 μm, between 0.1 to 1 μm, between 1 to 7 μm, between 1 to 6 μm, between 1 to 5 μm, between 1 to 4 μm, between 1 to 3 μm , between 1 to 2 μm, between 2 to 7 μm, between 2 to 6 μm, between 2 to 5 μm, between 2 to 4 μm, between 2 to 3 μm, between 4 to 7 μm, between 4 to 6 μm or between at 4 to 5 μm.

一方面,本發明提供一種EVOH樹脂組合物。該EVOH樹脂組合物係可呈顆粒、膜、纖維等形式。本文所述之EVOH顆粒係指EVOH樹脂組合物經過造粒而形成一或多個顆粒的形式及/或形狀。儘管在本發明全文中係描述經過造粒而形成一或多個EVOH顆粒形式的EVOH樹脂組合物,但該EVOH樹脂組合物係可被加工成珠粒、立方體、碎片、刨花等形式。於一些實施例中,該EVOH樹脂組合物為顆粒型態,所謂顆粒型態可為柱狀、粒狀或扁平狀。圓粒狀可為球狀、橢圓球狀或圍棋狀,柱狀可為圓柱狀、橢圓柱狀、角柱狀。In one aspect, the present invention provides an EVOH resin composition. The EVOH resin composition can be in the form of particles, films, fibers, and the like. The EVOH granules described herein refer to the form and/or shape of one or more granules formed from the EVOH resin composition after granulation. Although throughout this disclosure the EVOH resin composition is described as being pelletized to form one or more EVOH particles, the EVOH resin composition may be processed into beads, cubes, chips, shavings, and the like. In some embodiments, the EVOH resin composition is in the form of particles, which can be columnar, granular or flat. The round granular shape can be spherical, ellipsoidal or go-shaped, and the columnar shape can be cylindrical, elliptical cylindrical, or angular cylindrical.

當EVOH顆粒為球狀、橢圓球狀或圍棋狀時,其中係以顆粒的最大外徑作為長邊,以垂直於長邊的橫截面中面積最大的橫截面中的最大直徑作為短邊,其長邊的範圍可以係介於0.5~6.0 mm、2.2~5.0 mm、2.4~5.0 mm、2.6~5.0 mm、2.8~5.0 mm、3.0~5.0 mm、3.2~5.0 mm、3.4~5.0 mm、3.6~5.0 mm、3.8~5.0 mm、4.0~5.0 mm、2.0~4.5 mm、2.0~4.4 mm、2.0~4.2 mm、2.0~4.0 mm、2.0~3.8 mm、2.0~3.6 mm、2.0~3.4 mm、2.0~3.2 mm、2.0~3.0 mm;其短邊的範圍可以係介於0.5~6.0 mm、1.8~4.6 mm、2.4~4.6 mm、2.6~4.6 mm、2.8~4.6 mm、3.0~4.6 mm、3.2~4.6 mm、3.4~4.6 mm、3.6~4.6 mm、3.8~4.6 mm、4.0~4.6 mm、1.6~4.5 mm、1.6~4.4 mm、1.6~4.2 mm、1.6~4.0 mm、1.6~3.8 mm、1.6~3.6 mm、1.6~3.4 mm、1.6~3.2 mm、1.6~3.0 mm。When the EVOH particles are spherical, ellipsoidal or Go-shaped, the maximum outer diameter of the particle is used as the long side, and the maximum diameter in the cross-section perpendicular to the long side is the short side. The range of the long side can be between 0.5~6.0 mm, 2.2~5.0 mm, 2.4~5.0 mm, 2.6~5.0 mm, 2.8~5.0 mm, 3.0~5.0 mm, 3.2~5.0 mm, 3.4~5.0 mm, 3.6~ 5.0 mm, 3.8~5.0 mm, 4.0~5.0 mm, 2.0~4.5 mm, 2.0~4.4 mm, 2.0~4.2 mm, 2.0~4.0 mm, 2.0~3.8 mm, 2.0~3.6 mm, 2.0~3.4 mm, 2.0~ 3.2 mm, 2.0~3.0 mm; the range of its short side can be between 0.5~6.0 mm, 1.8~4.6 mm, 2.4~4.6 mm, 2.6~4.6 mm, 2.8~4.6 mm, 3.0~4.6 mm, 3.2~4.6 mm, 3.4~4.6 mm, 3.6~4.6 mm, 3.8~4.6 mm, 4.0~4.6 mm, 1.6~4.5 mm, 1.6~4.4 mm, 1.6~4.2 mm, 1.6~4.0 mm, 1.6~3.8 mm, 1.6~3.6 mm mm, 1.6~3.4mm, 1.6~3.2mm, 1.6~3.0mm.

當EVOH顆粒為圓柱狀或橢圓柱狀時,其高的範圍可以係介於1.5~5.0 mm、1.7~5.0 mm 、2.2~5.0 mm、2.4~5.0 mm、2.6~5.0 mm、2.8~5.0 mm、3.0~5.0 mm、3.2~5.0 mm、3.4~5.0 mm、3.6~5.0 mm、3.8~5.0 mm、4.0~5.0 mm、1.7~4.5 mm、1.7~4.4 mm、1.7~4.2 mm、1.7~4.0 mm、1.7~3.8 mm、1.7~3.6 mm、1.7~3.4 mm、1.7~3.2 mm、1.7~3.0 mm;其截面積的長軸範圍可以係介於1.5~5.0 mm、1.7~5.0 mm 、2.2~5.0 mm、2.4~5.0 mm、2.6~5.0 mm、2.8~5.0 mm、3.0~5.0 mm、3.2~5.0 mm、3.4~5.0 mm、3.6~5.0 mm、3.8~5.0 mm、4.0~5.0 mm、1.7~4.5 mm、1.7~4.4 mm、1.7~4.2 mm、1.7~4.0 mm、1.7~3.8 mm、1.7~3.6 mm、1.7~3.4 mm、1.7~3.2 mm、1.7~3.0 mm。When EVOH particles are cylindrical or elliptical, their height can range from 1.5~5.0 mm, 1.7~5.0 mm, 2.2~5.0 mm, 2.4~5.0 mm, 2.6~5.0 mm, 2.8~5.0 mm, 3.0~5.0 mm, 3.2~5.0 mm, 3.4~5.0 mm, 3.6~5.0 mm, 3.8~5.0 mm, 4.0~5.0 mm, 1.7~4.5 mm, 1.7~4.4 mm, 1.7~4.2 mm, 1.7~4.0 mm, 1.7~3.8 mm, 1.7~3.6 mm, 1.7~3.4 mm, 1.7~3.2 mm, 1.7~3.0 mm; the long axis range of its cross-sectional area can be between 1.5~5.0 mm, 1.7~5.0 mm, 2.2~5.0 mm , 2.4~5.0 mm, 2.6~5.0 mm, 2.8~5.0 mm, 3.0~5.0 mm, 3.2~5.0 mm, 3.4~5.0 mm, 3.6~5.0 mm, 3.8~5.0 mm, 4.0~5.0 mm, 1.7~4.5 mm , 1.7~4.4 mm, 1.7~4.2 mm, 1.7~4.0 mm, 1.7~3.8 mm, 1.7~3.6 mm, 1.7~3.4 mm, 1.7~3.2 mm, 1.7~3.0 mm.

所述之EVOH樹脂組合物的表面粗糙度特徵還可以藉由該表面之線最大高度(Rz) ,其定義標準參照JIS B 0601 (2001版本) ,係為在基準長度上的輪廓曲線中,最高波峰的高度與最深波谷的深度之和。The surface roughness characteristics of the EVOH resin composition can also be determined by the maximum line height (Rz) of the surface. Its definition standard refers to JIS B 0601 (2001 version), which is the profile curve on the reference length, the highest The sum of the height of the peak and the depth of the deepest trough.

在一實施例中,該EVOH樹脂組合物的表面之Rz可以係介於0.01~13 μm,例如:介於0.01~13 μm 、介於0.01~12 μm、介於0.01~11 μm、介於0.01~10 μm、介於0.01~9 μm、介於0.01~8 μm、介於0.01~7 μm、介於0.01~6 μm、介於0.01~5 μm、介於0.01~4 μm、介於0.01~3 μm、介於0.01~2 μm、介於0.01~1 μm、介於0.01~0.1 μm、介於0.02~13 μm、介於0.02~12 μm、介於0.02~11 μm、介於0.02~10 μm、介於0.02~9 μm、介於0.02~8 μm、介於0.02~7 μm、介於0.02~6 μm、介於0.02~5 μm、介於0.02~4 μm、介於0.02~3 μm、介於0.02~2 μm、介於0.02~1 μm、介於0.02~0.1 μm、介於0.1~13 μm、介於0.1~12 μm、介於0.1~11 μm、介於0.1~10 μm、介於0.1~9 μm、介於0.1~8 μm、介於0.1~7 μm、介於0.1~6 μm、介於0.1~5 μm、介於0.1~4 μm、介於0.1~3 μm、介於0.1~2 μm、介於0.1~1 μm、介於1~13 μm、介於1~12 μm、介於1~11 μm、介於1~10 μm、介於1~9 μm、介於1~8 μm、介於1~7 μm、介於1~6 μm、介於1~5 μm、介於1~4 μm、介於1~3 μm、介於1~2 μm、介於5~13 μm、介於5~12 μm、介於5~11 μm、介於5~10 μm、介於5~9 μm、介於5~8 μm、介於5~7 μm、介於7~13 μm、介於7~12 μm、介於7~11 μm、介於7~10 μm、介於7~9 μm、介於7~8 μm、介於8~13 μm、介於8~12 μm、介於8~11 μm、介於8~10 μm、介於8~9 μm、介於10~13 μm或介於10~12 μm。在一較佳的實施例中,該表面之Rz介於約0.01~約9.9 μm。In one embodiment, the Rz of the surface of the EVOH resin composition can be between 0.01-13 μm, for example: between 0.01-13 μm, between 0.01-12 μm, between 0.01-11 μm, between 0.01 ~10 μm, between 0.01~9 μm, between 0.01~8 μm, between 0.01~7 μm, between 0.01~6 μm, between 0.01~5 μm, between 0.01~4 μm, between 0.01~ 3 μm, between 0.01~2 μm, between 0.01~1 μm, between 0.01~0.1 μm, between 0.02~13 μm, between 0.02~12 μm, between 0.02~11 μm, between 0.02~10 μm, between 0.02~9 μm, between 0.02~8 μm, between 0.02~7 μm, between 0.02~6 μm, between 0.02~5 μm, between 0.02~4 μm, between 0.02~3 μm , between 0.02~2 μm, between 0.02~1 μm, between 0.02~0.1 μm, between 0.1~13 μm, between 0.1~12 μm, between 0.1~11 μm, between 0.1~10 μm, Between 0.1~9 μm, between 0.1~8 μm, between 0.1~7 μm, between 0.1~6 μm, between 0.1~5 μm, between 0.1~4 μm, between 0.1~3 μm, between Between 0.1~2 μm, between 0.1~1 μm, between 1~13 μm, between 1~12 μm, between 1~11 μm, between 1~10 μm, between 1~9 μm, between 1~8 μm, between 1~7 μm, between 1~6 μm, between 1~5 μm, between 1~4 μm, between 1~3 μm, between 1~2 μm, between 5 ~13 μm, between 5~12 μm, between 5~11 μm, between 5~10 μm, between 5~9 μm, between 5~8 μm, between 5~7 μm, between 7~ 13 μm, between 7~12 μm, between 7~11 μm, between 7~10 μm, between 7~9 μm, between 7~8 μm, between 8~13 μm, between 8~12 μm μm, between 8~11 μm, between 8~10 μm, between 8~9 μm, between 10~13 μm or between 10~12 μm. In a preferred embodiment, the Rz of the surface ranges from about 0.01 to about 9.9 μm.

該EVOH顆粒係由一EVOH形成,該EVOH具有一乙烯含量。例如,該EVOH之該乙烯含量可為約20至約48 mole%、約20至約45 mole%、約25至約45 mole%、約28至約42 mole%或約30至約40 mole%。該EVOH樹脂組合物係可由具有不同乙烯含量的兩種或更多種EVOH形成。例如,其中一種EVOH的乙烯含量可介於約20至約35 mole%的範圍內,例如約24至約35 mole%、約28至約35 mole%、約20至約32 mole%、約24至約32 mole%、約28至約32 mole%、約20至約30 mole%或約24至約30 mole%。此外/或者,其中一種EVOH的乙烯含量可介於約36至約48 mole%的範圍內,例如約40至約48 mole%、約44至約48 mole%、約36至約45 mole%或約40至約45 mole%。然而,在一些較佳實施例中,該EVOH樹脂組合物係由乙烯含量為約20至約48 mole%的單一EVOH形成。The EVOH particles are formed from an EVOH having an ethylene content. For example, the ethylene content of the EVOH can be about 20 to about 48 mole%, about 20 to about 45 mole%, about 25 to about 45 mole%, about 28 to about 42 mole%, or about 30 to about 40 mole%. The EVOH resin composition can be formed from two or more EVOHs having different ethylene contents. For example, the ethylene content of one of the EVOHs can range from about 20 to about 35 mole%, such as about 24 to about 35 mole%, about 28 to about 35 mole%, about 20 to about 32 mole%, about 24 to About 32 mole%, about 28 to about 32 mole%, about 20 to about 30 mole%, or about 24 to about 30 mole%. Additionally/alternatively, one of the EVOHs may have an ethylene content in the range of about 36 to about 48 mole%, such as about 40 to about 48 mole%, about 44 to about 48 mole%, about 36 to about 45 mole%, or about 40 to about 45 mole%. However, in some preferred embodiments, the EVOH resin composition is formed from a single EVOH having an ethylene content of about 20 to about 48 mole%.

此外/或者,該EVOH樹脂組合物中之EVOH的皂化度可為90 mole%或更高,較佳為95 mole%或更高,較佳為97 mole%或更高,較佳為99.5 mole%或更高。Additionally/or, the saponification degree of EVOH in the EVOH resin composition may be 90 mole% or higher, preferably 95 mole% or higher, preferably 97 mole% or higher, preferably 99.5 mole% or higher.

該EVOH樹脂組合物在某些情況下可包含硼化合物及/或硼酸及/或肉桂酸及/或鹼金屬及/或共軛多烯及/或滑劑及/或鹼土金屬、其鹽及/或其混合物。上述物質可賦予EVOH樹脂組合物更好的性質。The EVOH resin composition may contain boron compound and/or boric acid and/or cinnamic acid and/or alkali metal and/or conjugated polyene and/or lubricant and/or alkaline earth metal, its salt and/or or a mixture thereof. The above substances can impart better properties to the EVOH resin composition.

在本發明的其他方面,提供一種EVOH樹脂組合物(或其顆粒)可包含一乙烯-乙烯醇共聚物;及一硼化合物,其中該乙烯-乙烯醇共聚物樹脂組合物的硼含量為介於約5-550 ppm。在一些情況下,該EVOH樹脂組合物的硼含量基於該EVOH樹脂組合物的總重量可為:介於約5-550 ppm、介於約5-500 ppm、介於約5-450 ppm、介於約5-400 ppm、介於約5-350 ppm、介於約5-300 ppm、介於約5-250 ppm、介於約5-200 ppm、介於約5-150 ppm、介於約5-100 ppm、介於約5-50 ppm、介於約10-550 ppm、介於約10-500 ppm、介於約10-450 ppm、介於約10-400 ppm、介於約10-350 ppm、介於約10-300 ppm、介於約10-250 ppm、介於約10-200 ppm、介於約10-150 ppm、介於約10-100 ppm、介於約10-50 ppm、介於約50-550 ppm、介於約50-500 ppm、介於約50-450 ppm、介於約50-400 ppm、介於約50-350 ppm、介於約50-300 ppm、介於約50-250 ppm、介於約50-200 ppm、介於約50-150 ppm、介於約50-100 ppm、介於約100-550 ppm、介於約100-500 ppm、介於約100-450 ppm、介於約100-400 ppm、介於約100-350 ppm、介於約100-300 ppm、介於約100-250 ppm、介於約100-200 ppm、介於約100-150 ppm、介於約200-550 ppm、介於約200-500 ppm、介於約200-450 ppm、介於約200-400 ppm、介於約200-350 ppm、介於約200-300 ppm、介於約200-250 ppm、介於約300-550 ppm、介於約300-500 ppm、介於約300-450 ppm、介於約300-400 ppm、介於約300-350 ppm、介於約400-550 ppm、介於約400-500 ppm、介於約400-450 ppm或介於約500-550 ppm。不限於任何特定理論,相信在EVOH樹脂組合物中添加硼化合物,使EVOH的硼含量為5至550 ppm,在通過螺桿式擠出機的擠出過程中減少或消除了EVOH樹脂組合物的黏附,並進一步改善膜厚度的均勻性和可撓性。在某些情況下,這樣的EVOH樹脂組合物可在擠出過程中,透過除去或至少部分除去先前黏附在螺桿式擠出機內表面上的EVOH樹脂來清潔螺桿式擠出機,從而使材料具有自潔功能,可進一步改善膜厚均勻性。In other aspects of the present invention, a kind of EVOH resin composition (or its particle) can comprise an ethylene-vinyl alcohol copolymer; And a boron compound, wherein the boron content of the ethylene-vinyl alcohol copolymer resin composition is between About 5-550ppm. In some cases, the boron content of the EVOH resin composition can be based on the total weight of the EVOH resin composition: between about 5-550 ppm, between about 5-500 ppm, between about 5-450 ppm, between Between about 5-400 ppm, between about 5-350 ppm, between about 5-300 ppm, between about 5-250 ppm, between about 5-200 ppm, between about 5-150 ppm, between about 5-100 ppm, between about 5-50 ppm, between about 10-550 ppm, between about 10-500 ppm, between about 10-450 ppm, between about 10-400 ppm, between about 10- 350 ppm, about 10-300 ppm, about 10-250 ppm, about 10-200 ppm, about 10-150 ppm, about 10-100 ppm, about 10-50 ppm , between about 50-550 ppm, between about 50-500 ppm, between about 50-450 ppm, between about 50-400 ppm, between about 50-350 ppm, between about 50-300 ppm, between At about 50-250 ppm, between about 50-200 ppm, between about 50-150 ppm, between about 50-100 ppm, between about 100-550 ppm, between about 100-500 ppm, between about 100-450 ppm, between about 100-400 ppm, between about 100-350 ppm, between about 100-300 ppm, between about 100-250 ppm, between about 100-200 ppm, between about 100- 150 ppm, about 200-550 ppm, about 200-500 ppm, about 200-450 ppm, about 200-400 ppm, about 200-350 ppm, about 200-300 ppm , between about 200-250 ppm, between about 300-550 ppm, between about 300-500 ppm, between about 300-450 ppm, between about 300-400 ppm, between about 300-350 ppm, between At about 400-550 ppm, between about 400-500 ppm, between about 400-450 ppm, or between about 500-550 ppm. Without being bound by any particular theory, it is believed that adding a boron compound to the EVOH resin composition such that the EVOH has a boron content of 5 to 550 ppm reduces or eliminates sticking of the EVOH resin composition during extrusion through a screw extruder , and further improve the uniformity and flexibility of the film thickness. In some cases, such EVOH resin compositions can be used to clean the screw extruder during extrusion by removing, or at least partially removing, the EVOH resin previously adhering to the inner surface of the screw extruder, thereby making the material With self-cleaning function, it can further improve the uniformity of film thickness.

在某些情況下,所述硼化合物可包括硼酸或其金屬鹽。金屬鹽的實例包括但不限於硼酸鈣、硼酸鈷、硼酸鋅(例如四硼酸鋅、偏硼酸鋅)、硼酸鋁鉀、硼酸銨(例如偏硼酸銨、四硼酸銨、五硼酸銨、八硼酸銨)、硼酸鎘(例如正硼酸鎘、四硼酸鎘)、硼酸鉀(例如偏硼酸鉀、四硼酸鉀、五硼酸鉀、六硼酸鉀、八硼酸鉀)、硼酸銀(例如偏硼酸銀、四硼酸銀)、硼酸銅(例如硼酸銅(II)、偏硼酸銅、四硼酸銅)、硼酸鈉(例如偏硼酸鈉、二硼酸鈉、四硼酸鈉、五硼酸鈉、六硼酸鈉、八硼酸鈉)、硼酸鉛(例如偏硼酸鉛、六硼酸鉛)、硼酸鎳(例如正硼酸鎳、二硼酸鎳、四硼酸鎳、八硼酸鎳)、硼酸鋇(例如正硼酸鋇、偏硼酸鋇、二硼酸鋇、四硼酸鋇)、硼酸鉍、硼酸鎂(例如正硼酸鎂、二硼酸鎂、偏硼酸鎂、四硼酸三鎂、四硼酸五鎂)、硼酸錳(例如硼酸錳(I)、偏硼酸錳、四硼酸錳)、硼酸鋰(例如偏硼酸鋰、四硼酸鋰、五硼酸鋰)、其鹽或其組合。可包括硼酸鹽礦物,例如硼砂、鉀鹽鎂礬、板硼石、粒鎂硼石、硼鎂石/遂安石(suanite)和硼鎂石(szaibelyite)。其中,較佳係使用硼砂、硼酸和硼酸鈉(例如偏硼酸鈉、二硼酸鈉、四硼酸鈉、五硼酸鈉、六硼酸鈉和八硼酸鈉)。In some cases, the boron compound may include boric acid or a metal salt thereof. Examples of metal salts include, but are not limited to, calcium borate, cobalt borate, zinc borate (e.g. zinc tetraborate, zinc metaborate), aluminum potassium borate, ammonium borate (e.g. ammonium metaborate, ammonium tetraborate, ammonium pentaborate, ammonium octaborate ), cadmium borate (such as cadmium orthoborate, cadmium tetraborate), potassium borate (such as potassium metaborate, potassium tetraborate, potassium pentaborate, potassium hexaborate, potassium octaborate), silver borate (such as silver metaborate, tetraborate silver), copper borates (e.g. copper(II) borate, copper metaborate, copper tetraborate), sodium borates (e.g. sodium metaborate, sodium diborate, sodium tetraborate, sodium pentaborate, sodium hexaborate, sodium octaborate) , lead borate (such as lead metaborate, lead hexaborate), nickel borate (such as nickel orthoborate, nickel diborate, nickel tetraborate, nickel octaborate), barium borate (such as barium orthoborate, barium metaborate, barium diborate , barium tetraborate), bismuth borate, magnesium borate (such as magnesium orthoborate, magnesium diborate, magnesium metaborate, trimagnesium tetraborate, pentamagnesium tetraborate), manganese borate (such as manganese (I) borate, manganese metaborate, manganese tetraborate), lithium borate (eg, lithium metaborate, lithium tetraborate, lithium pentaborate), salts thereof, or combinations thereof. Borate minerals may be included such as borax, langbenesite, boborite, gerberite, boorite/suanite and szaibelyite. Among them, borax, boric acid, and sodium borates (such as sodium metaborate, sodium diborate, sodium tetraborate, sodium pentaborate, sodium hexaborate, and sodium octaborate) are preferably used.

在某些情況下,該EVOH樹脂組合物還可包含鹼金屬。用以使本發明的EVOH樹脂組合物含有上述鹼金屬的鹼金屬源,可列舉鹼金屬氧化物、鹼金屬氫氧化物、鹼金屬鹽等鹼金屬化合物。它們為水溶性較佳。其中,考慮分散性的觀點,鹼金屬鹽為較佳。鹼金屬鹽,可列舉出例如:鹼金屬的碳酸鹽、碳酸氫鹽、磷酸鹽、硼酸鹽、硫酸鹽、氯化物鹽等無機鹽;鹼金屬的乙酸鹽、丁酸鹽、丙酸鹽、庚酸鹽、癸酸鹽等碳數2~11的單羧酸鹽;鹼金屬的草酸鹽、丙二酸鹽、琥珀酸鹽、己二酸鹽、辛二酸鹽、癸二酸鹽等碳數2~11的二羧酸鹽;與EVOH的聚合末端羧基的羧酸鹽等。可將它們單獨使用或併用2種以上。In some cases, the EVOH resin composition may also contain alkali metals. The alkali metal source for making the EVOH resin composition of the present invention contain the above-mentioned alkali metal includes alkali metal compounds such as alkali metal oxides, alkali metal hydroxides, and alkali metal salts. They are preferably water soluble. Among these, alkali metal salts are preferred from the viewpoint of dispersibility. Alkali metal salts include, for example: inorganic salts such as carbonates, bicarbonates, phosphates, borates, sulfates, and chloride salts of alkali metals; acetates, butyrates, propionates, and heptanoates of alkali metals; Monocarboxylates with 2 to 11 carbons, such as acid salts and caprates; alkali metal oxalates, malonates, succinates, adipates, suberates, sebacates, etc. Dicarboxylates with numbers 2 to 11; carboxylates of polymerized terminal carboxyl groups with EVOH, etc. These can be used individually or in combination of 2 or more types.

發明中使用的鹼金屬可列舉鋰、鈉、鉀、銣、銫。可將它們單獨使用或併用2種以上。其中,較佳為鈉及鉀,尤佳為鈉。Examples of alkali metals used in the invention include lithium, sodium, potassium, rubidium, and cesium. These can be used individually or in combination of 2 or more types. Among them, sodium and potassium are preferred, and sodium is particularly preferred.

該EVOH樹脂組合物可具有鹼金屬含量約介於5-550 ppm,所述之鹼金屬含量可以係例如:介於5-550 ppm、介於約5-500 ppm、介於約5-450 ppm、介於約5-400 ppm、介於約5-350 ppm、介於約5-300 ppm、介於約5-250 ppm、介於約5-200 ppm、介於約5-150 ppm、介於約5-100 ppm、介於約5-50 ppm、介於10-550 ppm、介於約10-500 ppm、介於約10-450 ppm、介於約10-400 ppm、介於約10-350 ppm、介於約10-300 ppm、介於約10-250 ppm、介於約10-200 ppm、介於約10-150 ppm、介於約10-100 ppm、介於約10-50 ppm、介於約50-550 ppm、介於約50-500 ppm、介於約50-450 ppm、介於約50-400 ppm、介於約50-350 ppm、介於約50-300 ppm、介於約50-250 ppm、介於約50-200 ppm、介於約50-150 ppm、介於約50-100 ppm、介於約100-550 ppm、介於約100-500 ppm、介於約100-450 ppm、介於約100-400 ppm、介於約100-350 ppm、介於約100-300 ppm、介於約100-250 ppm、介於約100-200 ppm、介於約100-150 ppm、介於約200-550 ppm、介於約200-500 ppm、介於約200-450 ppm、介於約200-400 ppm、介於約200-350 ppm、介於約200-300 ppm、介於約200-250 ppm、介於約300-550 ppm、介於約300-500 ppm、介於約300-450 ppm、介於約300-400 ppm、介於約300-350 ppm、介於約400-550 ppm、介於約400-500 ppm、介於約400-450 ppm或介於約500-550 ppm。The EVOH resin composition can have an alkali metal content of about 5-550 ppm, and the alkali metal content can be, for example: between 5-550 ppm, between about 5-500 ppm, between about 5-450 ppm , between about 5-400 ppm, between about 5-350 ppm, between about 5-300 ppm, between about 5-250 ppm, between about 5-200 ppm, between about 5-150 ppm, between At about 5-100 ppm, between about 5-50 ppm, between 10-550 ppm, between about 10-500 ppm, between about 10-450 ppm, between about 10-400 ppm, between about 10 -350 ppm, between about 10-300 ppm, between about 10-250 ppm, between about 10-200 ppm, between about 10-150 ppm, between about 10-100 ppm, between about 10-50 ppm, between about 50-550 ppm, between about 50-500 ppm, between about 50-450 ppm, between about 50-400 ppm, between about 50-350 ppm, between about 50-300 ppm, Between about 50-250 ppm, between about 50-200 ppm, between about 50-150 ppm, between about 50-100 ppm, between about 100-550 ppm, between about 100-500 ppm, between about 100-450 ppm, between about 100-400 ppm, between about 100-350 ppm, between about 100-300 ppm, between about 100-250 ppm, between about 100-200 ppm, between about 100 -150 ppm, between about 200-550 ppm, between about 200-500 ppm, between about 200-450 ppm, between about 200-400 ppm, between about 200-350 ppm, between about 200-300 ppm, between about 200-250 ppm, between about 300-550 ppm, between about 300-500 ppm, between about 300-450 ppm, between about 300-400 ppm, between about 300-350 ppm, Between about 400-550 ppm, between about 400-500 ppm, between about 400-450 ppm, or between about 500-550 ppm.

此外/或者,該EVOH樹脂組合物還可進一步包含由肉桂酸、共軛多烯、滑劑及鹼土金屬所組成之群組之其一或其組合,或者是其鹽及/或其混合物。上述物質是通常存在於EVOH樹脂組合物中的常見物質,使其有更好的性質。上述具有共軛多烯結構化合物之含量,在每單位重量之EVOH樹脂組成物中為1~30000ppm的話,可進一步抑制加熱後之著色,熱穩定性更優異。而上述具有鹼金屬化合物或鹼土金屬化合物,若每單位重量之EVOH樹脂組成物中具有該鹼金屬化合物或鹼土金屬化合物之含量以金屬換算計為1~1000ppm的話,則能成為長時運轉成形性更優異者。Additionally or alternatively, the EVOH resin composition may further include one or a combination of cinnamic acid, a conjugated polyene, a lubricant and an alkaline earth metal, or a salt thereof and/or a mixture thereof. The above-mentioned substances are common substances usually present in EVOH resin compositions to make them have better properties. If the content of the above-mentioned compound having a conjugated polyene structure is 1 to 30,000 ppm per unit weight of the EVOH resin composition, the coloring after heating can be further suppressed, and the thermal stability is more excellent. And the above-mentioned alkali metal compound or alkaline earth metal compound, if the content of the alkali metal compound or alkaline earth metal compound per unit weight of the EVOH resin composition is 1~1000ppm in terms of metal, it can become long-running moldability more excellent.

所述共軛多烯例如但不限於:異戊二烯、2,3-二甲基-1,3-丁二烯、2-叔丁基-1,3-丁二烯、1,3-戊二烯、2,4-二甲基-1,3-戊二烯、3,4-二甲基-1,3-戊二烯、3-乙基-1,3-戊二烯、2-甲基-1,3-戊二烯、4-甲基-1,3-戊二烯、1,3-己二烯、2,5-二甲基-2,4-己二烯、1,3-辛二烯、1,3-環戊二烯、1,3-環己二烯、1,4-二苯基-1,3-丁二烯、1-甲氧基-1,3-丁二烯、2-甲氧基-1,3-丁二烯、1-乙氧基-1,3-丁二烯、2-乙氧基-1,3-丁二烯、2-硝基-1,3-丁二烯、氯丁二烯、1-氯-1,3-丁二烯、1-溴-1,3-丁二烯、環庚三烯酮(tropone)、羅勒萜(ocimene)、ferrandrene、香葉烯(myrcene)、金合歡烯(farnesene)、山梨酸、山梨酸酯、山梨酸鹽等山梨酸類、松脂酸(abietic acid)等由2個碳-碳雙鍵共軛結構構成的共軛二烯; 2,4,6-辛三烯-1-羧酸、桐酸(eleostearic acid)、桐油、膽鈣化醇等由3個碳-碳雙鍵的共軛結構構成的共軛三烯,該共軛多烯也可組合使用2種以上。較佳之共軛多烯為山梨酸、山梨酸酯、山梨酸鹽等山梨酸類。The conjugated polyenes are for example but not limited to: isoprene, 2,3-dimethyl-1,3-butadiene, 2-tert-butyl-1,3-butadiene, 1,3- Pentadiene, 2,4-dimethyl-1,3-pentadiene, 3,4-dimethyl-1,3-pentadiene, 3-ethyl-1,3-pentadiene, 2 -Methyl-1,3-pentadiene, 4-methyl-1,3-pentadiene, 1,3-hexadiene, 2,5-dimethyl-2,4-hexadiene, 1 ,3-octadiene, 1,3-cyclopentadiene, 1,3-cyclohexadiene, 1,4-diphenyl-1,3-butadiene, 1-methoxy-1,3 -butadiene, 2-methoxy-1,3-butadiene, 1-ethoxy-1,3-butadiene, 2-ethoxy-1,3-butadiene, 2-nitrate 1,3-butadiene, chloroprene, 1-chloro-1,3-butadiene, 1-bromo-1,3-butadiene, tropone, ocimene (ocimene), ferrandrene, myrcene (myrcene), farnesene (farnesene), sorbic acid, sorbate, sorbate and other sorbic acids, rosinic acid (abietic acid), etc. are composed of two carbon-carbon double bonds Conjugated dienes composed of conjugated structures; 2,4,6-octatriene-1-carboxylic acid, eleostearic acid, tung oil, cholecalciferol, etc. are composed of conjugated structures of three carbon-carbon double bonds The conjugated triene and the conjugated polyene may be used in combination of two or more. Preferred conjugated polyenes are sorbic acids such as sorbic acid, sorbic acid esters, and sorbic acid salts.

作為本發明中使用的滑劑,可列舉高級脂肪酸類,例如:油酸、月桂酸、棕櫚酸、肉豆蔲酸、硬脂酸、二十二酸等高級脂肪酸;這些高級脂肪酸的鋁鹽、鈣鹽、鋅鹽、鎂鹽、鋇鹽等高級脂肪酸的金屬鹽;上述高級脂肪酸的甲酯、異丙酯、丁酯、辛酯等高級脂肪酸的酯;硬脂酸醯胺、二十二酸醯胺等飽和高級脂肪酸醯胺、油酸醯胺、芥酸醯胺等不飽和高級脂肪酸醯胺、乙烯基雙硬脂醯胺、乙烯基雙油酸醯胺、乙烯基雙芥酸醯胺、乙烯基雙月桂酸醯胺等雙高級脂肪酸醯胺等高級脂肪酸的醯胺,可將其單獨使用或組合使用2種以上。As the slip agent used in the present invention, higher fatty acids can be enumerated, for example: higher fatty acids such as oleic acid, lauric acid, palmitic acid, myristic acid, stearic acid, behenic acid; aluminum salts of these higher fatty acids, Metal salts of higher fatty acids such as calcium salts, zinc salts, magnesium salts, and barium salts; esters of higher fatty acids such as methyl esters, isopropyl esters, butyl esters, and octyl esters of the above-mentioned higher fatty acids; stearic acid amide, behenic acid Saturated higher fatty acid amide such as amide, oleic acid amide, unsaturated higher fatty acid amide such as erucamide, vinylbisstearamide, vinylbisoleamide, vinylbiserucamide, Amides of higher fatty acids such as dihigher fatty acid amides such as vinylbislauric acid amide can be used alone or in combination of two or more.

所述之EVOH樹脂組合物有利於更有效率地製備由其形成的EVOH膜。製備EVOH膜的適當方法和設備可包括本領域一般技術人員所容易理解的方法和設備。發明人相信,透過控制EVOH樹脂組合物的表面粗糙度,使該EVOH樹脂組合物可降低壓出機內的扭力,還可降低該EVOH樹脂組成物所形成之膜或多層結構的凝膠產生,改善該EVOH樹脂組成物所形成之膜或多層結構的外觀。The EVOH resin composition is conducive to more efficient preparation of the EVOH film formed therefrom. Suitable methods and equipment for making EVOH films may include those readily understood by those of ordinary skill in the art. The inventor believes that by controlling the surface roughness of the EVOH resin composition, the EVOH resin composition can reduce the torsion in the extruder, and also reduce the gel generation of the film or multilayer structure formed by the EVOH resin composition, Improve the appearance of the film or multilayer structure formed by the EVOH resin composition.

本發明EVOH樹脂組合物通常具有特定範圍之含水率,例如,以揮發份作為EVOH樹脂組合物含水率之評估,該EVOH樹脂組合物含水率可以係小於1 重量百分比(wt%)、小於0.9 %、小於0.8 %、小於0.7 %、小於0.6 %、小於0.5 %、小於0.4 %、小於0.3 %、小於0.2 %或小於0.1 %,或介於0.01至1wt%、介於0.08至1wt%、介於0.05至1wt%或介於0.01至0.5wt%。意外發現,必須EVOH樹脂組合物的含水率控制在一定範圍,當含水率過高時,會使EVOH樹脂組成物所形成之膜或多層結構的產生氣泡、膜厚不均及流痕增加等,產生後續加工上的問題。揮發份,使用ISO 14663-2 Annex A方法分析。The EVOH resin composition of the present invention usually has a specific range of water content, for example, with volatile matter as the evaluation of the water content of the EVOH resin composition, the EVOH resin composition water content can be less than 1 weight percent (wt%), less than 0.9% , less than 0.8%, less than 0.7%, less than 0.6%, less than 0.5%, less than 0.4%, less than 0.3%, less than 0.2% or less than 0.1%, or between 0.01 and 1wt%, between 0.08 and 1wt%, between 0.05 to 1 wt% or between 0.01 to 0.5 wt%. Surprisingly, it was found that the moisture content of the EVOH resin composition must be controlled within a certain range. When the moisture content is too high, the film or multi-layer structure formed by the EVOH resin composition will cause bubbles, uneven film thickness, and increased flow marks. problems in subsequent processing. Volatile matter, analyzed using ISO 14663-2 Annex A method.

又另一方面,本發明提供一種多層結構,其具有至少一由本發明EVOH樹脂組合物形成的層;至少一聚合物層;及至少一黏合劑層(adhesive layer)。該聚合物層係可選自低密度聚乙烯層、聚乙烯接枝馬來酸酐層、聚丙烯層、尼龍層及其組合。 該黏合劑層可為黏結層(tie layer),例如ARKEMA公司的ARKEMA OREVAC 18729。 實施例 In yet another aspect, the present invention provides a multilayer structure having at least one layer formed from the EVOH resin composition of the present invention; at least one polymer layer; and at least one adhesive layer. The polymer layer system can be selected from low density polyethylene layer, polyethylene grafted maleic anhydride layer, polypropylene layer, nylon layer and combinations thereof. The adhesive layer can be a tie layer, such as ARKEMA OREVAC 18729 from ARKEMA Company. Example

提供以下本發明各方面的非限制性實施例主要是為了闡明本發明的各方面及其所達到的效益。 實施例 1 The following non-limiting examples of aspects of the invention are provided primarily to illustrate the aspects of the invention and the benefits achieved therein. Example 1

以下提供由EVOH樹脂組合物形成之EVOH顆粒的非限制性製備方法。根據與以下揭示的方法相似的方法,製備6種非限制性實施例EVOH樹脂組合物(實施例EVOH 1-6)及4種比較例EVOH樹脂組合物(比較例EVOH 1-4)。然而,製備實施例EVOH 1-6及比較例EVOH 1-4的具體方法通常會與以下揭示的方法在一個或多個方面有所不同。 實施例 EVOH 1 顆粒 A non-limiting method for preparing EVOH particles formed from the EVOH resin composition is provided below. Six non-limiting Example EVOH resin compositions (Examples EVOH 1-6) and four Comparative Example EVOH resin compositions (Comparative Example EVOH 1-4) were prepared according to methods similar to those disclosed below. However, the specific methods for preparing Example EVOH 1-6 and Comparative Example EVOH 1-4 will generally differ in one or more respects from the methods disclosed below. Example EVOH 1 Granules

於具備冷卻盤管的聚合釜加入乙酸乙烯酯500 kg、甲醇100 kg、過氧化乙酰0.0585 kg、檸檬酸0.015 kg,將聚合釜內以氮氣暫時置換後,然後以乙烯置換並壓入直到乙烯壓力成為45kg/cm 2。於乙烯加壓下,邊攪拌邊升溫到67℃,以開始聚合。聚合開始6小時後,於聚合率到達60%的時點,添加作為阻聚劑的山梨酸共軛多烯0.0525 kg。由此,獲得乙烯結構單元的含量44 mole%的乙烯-乙酸乙烯酯共聚物。然後,將含有乙烯-乙酸乙烯酯共聚物的反應液供給到蒸餾塔,從塔下部導入甲醇蒸氣以去除未反應的乙酸乙烯酯,獲得乙烯-乙酸乙烯酯共聚物的甲醇溶液。 Add 500 kg of vinyl acetate, 100 kg of methanol, 0.0585 kg of acetyl peroxide, and 0.015 kg of citric acid into a polymerization kettle equipped with a cooling coil, and temporarily replace the inside of the polymerization kettle with nitrogen, then replace it with ethylene and press it in until the ethylene pressure It becomes 45kg/cm 2 . Under ethylene pressure, the temperature was raised to 67°C while stirring to start polymerization. Six hours after the start of the polymerization, when the polymerization rate reached 60%, 0.0525 kg of sorbic acid-conjugated polyene was added as a polymerization inhibitor. Thus, an ethylene-vinyl acetate copolymer having an ethylene structural unit content of 44 mole % was obtained. Then, the reaction solution containing the ethylene-vinyl acetate copolymer was supplied to a distillation column, and methanol vapor was introduced from the lower part of the column to remove unreacted vinyl acetate to obtain a methanol solution of the ethylene-vinyl acetate copolymer.

對於實施例EVOH 1,藉由將乙烯單體和乙酸乙烯酯單體聚合而形成之組分(ethylene-vinyl acetate copolymer,以下稱“EVAC”聚合物),進行皂化以形成EVOH。For Example EVOH 1, the component formed by polymerizing ethylene monomer and vinyl acetate monomer (ethylene-vinyl acetate copolymer, hereinafter referred to as "EVAC" polymer) was saponified to form EVOH.

隨後,將EVOH溶解於甲醇與水的比例為60:40的醇水溶液中。將EVOH/甲醇/水之溶液放置在60℃下1小時,以促進EVOH溶解於EVOH/甲醇/水之溶液中。該EVOH/甲醇/水溶液的固體含量為41 wt%。Subsequently, EVOH was dissolved in an aqueous alcohol solution with a ratio of methanol to water of 60:40. The EVOH/methanol/water solution was placed at 60° C. for 1 hour to promote the dissolution of EVOH in the EVOH/methanol/water solution. The EVOH/methanol/water solution had a solids content of 41 wt%.

後透過水下切粒(underwater pelletization)將前述甲醇、水及EVOH之溶液進行造粒。具體而言,使用泵以120 L/min的流速將前述甲醇、水及EVOH之溶液抽送至進料管中,然後送入直徑為2.8 mm的輸入管,使用旋轉刀以1500 rpm切割,以獲得EVOH之顆粒。同時利用5°C的循環冷凝水以冷卻EVOH顆粒。隨後,將該EVOH顆粒離心以分離出EVOH粒子並以水洗滌分離後的EVOH圓粒狀粒子,再離心脫水一次,然後將該EVOH粒子浸入硼酸/乙酸鈉溶液中,然後進行乾燥並添加硬脂酸鈣以獲得EVOH顆粒最終產物。該EVOH圓粒狀顆粒最終產物之長邊為2.4 mm、短邊為1.5 mm的顆粒。Afterwards, the above solution of methanol, water and EVOH was pelletized by underwater pelletization. Specifically, a pump was used to pump the aforementioned methanol, water and EVOH solution into the feed pipe at a flow rate of 120 L/min, and then sent into an input pipe with a diameter of 2.8 mm, and cut with a rotary knife at 1500 rpm to obtain Particles of EVOH. At the same time, the circulating condensed water at 5°C is used to cool the EVOH particles. Subsequently, the EVOH particles were centrifuged to separate the EVOH particles and the separated EVOH pellets were washed with water, centrifuged once more, and then the EVOH particles were immersed in a boric acid/sodium acetate solution, dried and stearin was added Calcium acid to obtain the EVOH granule final product. The EVOH spherical granules end up being granules with a long side of 2.4 mm and a short side of 1.5 mm.

所謂離心及洗滌步驟,其中第一次脫水機轉速為3000 rpm;輸送時水/濕粒比例為10;輸送用離心式泵(pump)種類為半開放式;輸送泵(pump)轉速為2000 rpm;水洗時水/濕粒重量比例為20;水洗時水流速度為1 m/min;第二次脫水機轉速為4000 rpm;乾燥至含水率為0.1%。 實施例 EVOH 2 顆粒 The so-called centrifugation and washing steps, wherein the first dehydrator speed is 3000 rpm; the water/wet particle ratio is 10 during transportation; the type of centrifugal pump (pump) for transportation is semi-open; the speed of the delivery pump (pump) is 2000 rpm ; The weight ratio of water/wet grains is 20 during washing; the water velocity is 1 m/min during washing; Example EVOH 2 Granules

使用與實施例EVOH 1顆粒相似的製程,製備用於實施例EVOH 2的EVOH顆粒。然而,製備實施例EVOH 2的EVOH顆粒時,將該EVOH粒子浸入硼酸/乙酸鈉溶液中,其濕粒顆粒大小(長邊)為3.0 mm、短邊為2.4mm;第一次脫水機轉速為2000 rpm;輸送時水/濕粒比例為20;輸送用離心式泵種類為開放式;輸送泵轉速為4000 rpm;水洗時水/濕粒比例為10;水洗時水流速度為1.5 m/min;第二次脫水機轉速為3000 rpm;乾燥至含水率為0.01%。 實施例 EVOH 3 顆粒 The EVOH granules used in Example EVOH 2 were prepared using a similar process to the Example EVOH 1 granules. However, when preparing the EVOH granules of Example EVOH 2, the EVOH granules were immersed in the boric acid/sodium acetate solution, and the wet granule size (long side) was 3.0 mm, and the short side was 2.4 mm; 2000 rpm; the ratio of water/wet particles during transportation is 20; the type of centrifugal pump for transportation is open; the rotation speed of the delivery pump is 4000 rpm; the ratio of water/wet particles during washing is 10; the water flow speed during washing is 1.5 m/min; The rotational speed of the second dehydrator is 3000 rpm; dry to a moisture content of 0.01%. Example EVOH 3 Granules

使用與實施例EVOH 1顆粒相似的製程,製備用於實施例EVOH 3的EVOH顆粒。然而,製備實施例EVOH 3的EVOH顆粒時,將該EVOH粒子浸入硼酸/乙酸鈉溶液中,其濕粒顆粒大小長邊為5.0 mm、短邊為5.0 mm;第一次脫水機轉速為1500 rpm;輸送時水/濕粒比例為5;輸送用離心式泵種類為開放式;輸送泵轉速為3000 rpm;水洗時水/濕粒比例為25;水洗時水流速度為2.5 m/min;第二次脫水機轉速為1000 rpm;乾燥至含水率為0.3%。 實施例 EVOH 4 顆粒 The EVOH granules used in Example EVOH 3 were prepared using a similar process to the Example EVOH 1 granules. However, when preparing the EVOH granules of Example EVOH 3, the EVOH granules were immersed in the boric acid/sodium acetate solution, and the wet granule particle size was 5.0 mm on the long side and 5.0 mm on the short side; the spin speed of the dehydrator for the first time was 1500 rpm ; The water/wet particle ratio is 5 when conveying; the type of centrifugal pump for conveying is open; the speed of the conveying pump is 3000 rpm; The speed of the secondary dehydrator is 1000 rpm; dry to a moisture content of 0.3%. Example EVOH 4 Granules

使用與實施例EVOH 1顆粒相似的製程,製備用於實施例EVOH 4的EVOH顆粒。然而,製備實施例EVOH 4的EVOH顆粒時,將該EVOH粒子浸入硼酸/乙酸鈉溶液中,其濕粒顆粒大小長邊為0.5 mm、短邊為0.5 mm;第一次脫水機轉速為4000 rpm;輸送時水/濕粒比例為15;輸送用離心式泵種類為半開放式;輸送泵轉速為1000 rpm;水洗時水/濕粒比例為15;水洗時水流速度為5 m/min;第二次脫水機轉速為2000 rpm;乾燥至含水率為0.5%。 實施例 EVOH 5 顆粒 The EVOH granules used in Example EVOH 4 were prepared using a similar process to the Example EVOH 1 granules. However, when preparing the EVOH granules of Example EVOH 4, the EVOH granules were immersed in the boric acid/sodium acetate solution, and the wet granule particle size was 0.5 mm on the long side and 0.5 mm on the short side; the spin speed of the dehydrator for the first time was 4000 rpm ; The ratio of water/wet particles during transportation is 15; the type of centrifugal pump for transportation is semi-open; the rotation speed of the delivery pump is 1000 rpm; the ratio of water/wet particles during washing is 15; The rotation speed of the secondary dehydrator is 2000 rpm; it is dried to a moisture content of 0.5%. Example EVOH 5 Granules

使用與實施例EVOH 1顆粒相似的製程,製備用於實施例EVOH 5的EVOH顆粒。然而,實施例EVOH 5的EVOH顆粒之乙烯含量為28莫耳百分比,且製備實施例EVOH 5的EVOH顆粒時,將該EVOH粒子浸入硼酸/乙酸鈉溶液中,其濕粒顆粒大小長短邊皆為2.5 mm;第一次脫水機轉速為1000 rpm;輸送時水/濕粒比例為5;輸送用離心式泵種類為開放式;輸送泵轉速為3000 rpm;水洗時水/濕粒比例為20;水洗時水流速度為3.5 m/min;第二次脫水機轉速為3000 rpm;乾燥至含水率為0.04%。 實施例 EVOH 6 顆粒 The EVOH granules used in Example EVOH 5 were prepared using a similar process to the Example EVOH 1 granules. However, the ethylene content of the EVOH granules of Example EVOH 5 is 28 mole percent, and when preparing the EVOH granules of Example EVOH 5, the EVOH granules are immersed in the boric acid/sodium acetate solution, and the size of the wet granules is 2.5 mm; the rotational speed of the dehydrator for the first time is 1000 rpm; the ratio of water/wet grains during transportation is 5; the type of centrifugal pump for transportation is open; the rotational speed of the conveying pump is 3000 rpm; the ratio of water/wet grains during washing is 20; The water flow rate during washing is 3.5 m/min; the speed of the dehydrator for the second time is 3000 rpm; and the water content is dried to 0.04%. Example EVOH 6 Granules

使用與實施例EVOH 1顆粒相似的製程,製備用於實施例EVOH 6的EVOH顆粒。然而,實施例EVOH 6的EVOH顆粒之乙烯含量為28莫耳百分比,且製備實施例EVOH 6的EVOH顆粒時,將該EVOH粒子浸入硼酸/乙酸鈉溶液中,其濕粒顆粒大小長短邊皆為5 mm;第一次脫水機轉速為3000 rpm;輸送時水/濕粒比例為5;輸送用離心式泵種類為半開放式;輸送泵轉速為4000 rpm;水洗時水/濕粒比例為15;水洗時水流速度為2.5 m/min;第二次脫水機轉速為3000 rpm;乾燥至含水率為0.05%。 比較例 EVOH 1 顆粒 The EVOH granules used in Example EVOH 6 were prepared using a similar process to the Example EVOH 1 granules. However, the ethylene content of the EVOH particles of Example EVOH 6 is 28 mole percent, and when preparing the EVOH particles of Example EVOH 6, the EVOH particles are immersed in the boric acid/sodium acetate solution, and the wet particle size of the long and short sides is 5 mm; the rotational speed of the dehydrator for the first time is 3000 rpm; the ratio of water/wet grains during transportation is 5; the type of centrifugal pump for transportation is semi-open; the rotational speed of the conveying pump is 4000 rpm; the ratio of water/wet grains during washing is 15 ; The water flow rate during washing is 2.5 m/min; the second spin speed of the dehydrator is 3000 rpm; dry to a moisture content of 0.05%. Comparative example EVOH 1 granules

使用與實施例EVOH 1顆粒相似的製程,製備用於比較例EVOH 1的EVOH顆粒。然而,製備比較例EVOH 1的EVOH顆粒時,將該EVOH粒子浸入硼酸/乙酸鈉溶液中,其濕粒顆粒大小長短邊皆為6 mm;第一次脫水機轉速為2000 rpm;輸送時水/濕粒比例為1;輸送用離心式泵種類為半開放式;輸送泵轉速為4000 rpm;水洗時水/濕粒比例為5;水洗時水流速度為20 m/min;第二次脫水機轉速為8000 rpm;乾燥至含水率為0.07%。 比較例 EVOH 2 顆粒 EVOH granules for Comparative Example EVOH 1 were prepared using a similar process to Example EVOH 1 granules. Yet, when preparing the EVOH granule of comparative example EVOH 1, this EVOH granule is immersed in the boric acid/sodium acetate solution, and the long and short sides of its wet granule particle size are all 6 mm; The proportion of wet grains is 1; the type of centrifugal pump for conveying is semi-open; the speed of the conveying pump is 4000 rpm; the ratio of water/wet grains during washing is 5; the water flow speed during washing is 20 m/min; the speed of the second dehydrator at 8000 rpm; dry to a moisture content of 0.07%. Comparative Example EVOH 2 Granules

使用與實施例EVOH 1顆粒相似的製程,製備用於比較例EVOH 2的EVOH顆粒。然而,製備比較例EVOH 2的EVOH顆粒時,將該EVOH粒子浸入硼酸/乙酸鈉溶液中,其濕粒顆粒大小長短邊皆為1 mm;第一次脫水機轉速為5000 rpm;輸送時水/濕粒比例為10;輸送用離心式泵種類為封閉式;輸送泵轉速為7000 rpm;水洗時水/濕粒比例為0.5;水洗時水流速度為5 m/min;第二次脫水機轉速為3000 rpm;乾燥至含水率為0.8%。 比較例 EVOH 3 顆粒 EVOH granules for Comparative Example EVOH 2 were prepared using a similar process to Example EVOH 1 granules. Yet, when preparing the EVOH granule of comparative example EVOH 2, this EVOH granule is immersed in the boric acid/sodium acetate solution, and the long and short sides of its wet granule particle size are all 1 mm; The dehydrator rotating speed is 5000 rpm for the first time; The proportion of wet grains is 10; the type of centrifugal pump for conveying is closed; the rotation speed of the conveying pump is 7000 rpm; the ratio of water/wet grains during washing is 0.5; the water flow speed during washing is 5 m/min; 3000 rpm; dry to a moisture content of 0.8%. Comparative Example EVOH 3 Granules

使用與實施例EVOH 1顆粒相似的製程,製備用於比較例EVOH 3的EVOH顆粒。然而,製備比較例EVOH 3的EVOH顆粒時,將該EVOH粒子浸入硼酸/乙酸鈉溶液中,其濕粒顆粒大小長短邊皆為4.5 mm;第一次脫水機轉速為2000 rpm;輸送時水/濕粒比例為50;輸送用離心式泵種類為開放式;輸送泵轉速為1000 rpm;水洗時水/濕粒比例為100;水洗時水流速度為0.5 m/min;第二次脫水機轉速為1000 rpm;乾燥至含水率為0.5%。 比較例 EVOH 4 顆粒 EVOH granules for Comparative Example EVOH 3 were prepared using a similar process to Example EVOH 1 granules. Yet, when preparing the EVOH granule of comparative example EVOH 3, this EVOH granule is immersed in the boric acid/sodium acetate solution, and the long and short sides of its wet granule particle size are all 4.5 mm; The dehydrator rotating speed is 2000 rpm for the first time; The proportion of wet grains is 50; the type of centrifugal pump for conveying is open; the speed of the conveying pump is 1000 rpm; the ratio of water/wet grains during washing is 100; the water flow speed during washing is 0.5 m/min; 1000 rpm; dry to a moisture content of 0.5%. Comparative Example EVOH 4 Granules

使用與實施例EVOH 1顆粒相似的製程,製備用於比較例EVOH 4的EVOH顆粒。然而,製備比較例EVOH 4的EVOH顆粒時,將該EVOH粒子浸入硼酸/乙酸鈉溶液中,其濕粒顆粒大小長短邊皆為5.1 mm;第一次脫水機轉速為3000 rpm;輸送時水/濕粒比例為3;輸送用離心式泵種類為半開放式;輸送泵轉速為3000 rpm;水洗時水/濕粒比例為8;水洗時水流速度為10 m/min;第二次脫水機轉速為3000 rpm;乾燥至含水率為0.4%。 實施例 2 EVOH granules for Comparative Example EVOH 4 were prepared using a similar process to Example EVOH 1 granules. Yet, when preparing the EVOH granule of comparative example EVOH 4, this EVOH granule is immersed in the boric acid/sodium acetate solution, and the long and short sides of its wet granule particle size are all 5.1 mm; The dehydrator rotating speed is 3000 rpm for the first time; The proportion of wet grains is 3; the type of centrifugal pump for conveying is semi-open; the rotation speed of the conveying pump is 3000 rpm; the ratio of water/wet grains during washing is 8; the water flow speed during washing is 10 m/min; at 3000 rpm; dry to a moisture content of 0.4%. Example 2

根據下述方法使用實施例EVOH 1-6顆粒分別形成膜。將實施例EVOH 1-6顆粒及比較例EVOH 1-4顆粒送入單層T字模鑄膜壓出機(光學控制系統MEV4)以製備膜。由實施例EVOH 1-6顆粒及比較例EVOH 1-4顆粒形成的膜的厚度各為20 μm。將壓出機的溫度設為220℃,而模具(即T字模)的溫度設為230℃。螺桿的轉動頻率為7 rpm (rotations/minutes)。 實施例 3 Films were formed using the particles of Example EVOH 1-6, respectively, according to the method described below. The Example EVOH 1-6 granules and the Comparative Example EVOH 1-4 granules were fed into a single-layer T-die casting film extruder (optical control system MEV4) to prepare a film. The thicknesses of the films formed from the particles of Example EVOH 1-6 and Comparative Example EVOH 1-4 were each 20 μm. The temperature of the extruder was set at 220°C, and the temperature of the mold (ie, T-shaped mold) was set at 230°C. The rotation frequency of the screw was 7 rpm (rotations/minutes). Example 3

評估實施例EVOH 1-6顆粒和比較例EVOH 1-4顆粒,以判斷這些EVOH顆粒及由其形成的膜的性質。如上所述,根據與上述實施例1中描述的方法類似的方法製備實施例EVOH 1-6顆粒。然而,製備EVOH 1-6顆粒的方法在以下方面對於製備的EVOH顆粒有所不同:具有不同Vmp、Vmc、Sp、Rz、硼含量或鹼金屬含量。比較例EVOH 1-4顆粒也是根據類似於實施例1中所述的方法製備。The Example EVOH 1-6 granules and the Comparative EVOH 1-4 granules were evaluated to judge the properties of these EVOH granules and the films formed therefrom. Example EVOH 1-6 granules were prepared according to a method similar to that described in Example 1 above, as described above. However, the method of preparing EVOH 1-6 particles differs in that EVOH particles are prepared with different Vmp, Vmc, Sp, Rz, boron content or alkali metal content. Comparative EVOH 1-4 granules were also prepared in a manner similar to that described in Example 1.

進一步評估單螺桿壓出機平均扭力及壓出機電流。按照與實施例2中所述相似的方法,個別由實施例EVOH 1-6和比較例EVOH 1-4形成膜,對膜進行評估以判斷薄膜上凝膠(Gel)大小及數量。Further evaluate the average torque and extruder current of the single-screw extruder. In a similar manner to that described in Example 2, films were formed from Example EVOH 1-6 and Comparative Example EVOH 1-4 individually, and the films were evaluated to determine the size and amount of gel (Gel) on the film.

下表1提供實施例EVOH顆粒1-6和比較例EVOH顆粒1-4的一些屬性的概述,即Vmp、Vmc、Sp、Rz、硼含量、鹼金屬含量、壓出機平均扭力及壓出機電流,以及由實施例EVOH 1-6和比較例EVOH 1-4形成的膜的EVOH膜上凝膠產生情形。Table 1 below provides an overview of some attributes of Example EVOH Granules 1-6 and Comparative Example EVOH Granules 1-4, namely Vmp, Vmc, Sp, Rz, boron content, alkali metal content, extruder average torque, and extruder Current, and gel generation on EVOH membranes of membranes formed from Example EVOH 1-6 and Comparative Example EVOH 1-4.

表1     實施例EVOH 1 實施例EVOH 2 實施例EVOH 3 實施例EVOH 4 實施例EVOH 5 實施例EVOH 6 技術特徵 Vmp波峰部實體體積(μm 3/μm 2) 0.001 0.8 3.1 5.2 9.8 9.2 Vmc核心部實體體積 (μm 3/μm 2) 0.01 4.3 10.6 22.3 39.5 35.4 Sp最大波峰高度(μm) 0.01 0.35 1.0 2.2 4.7 4.1 Rz線最大高度(μm) 0.02 0.899 9.34 0.644 5.41 12.35 硼含量(ppm) 50 150 280 10 500 430 鈉含量(ppm) 10 70 500 430 220 370 功 效 0~100μm Gel O O O O O O 100~200μm Gel O O O O O Δ >200μm Gel O O O O O O 單螺桿壓出機平均扭力(Torque) 21 15 33 41 24 63 單螺桿壓出機電流(Å) 33 26.2 48 65 42 71.4 Table 1 Example EVOH 1 Example EVOH 2 Example EVOH 3 Example EVOH 4 Example EVOH 5 Example EVOH 6 technical features Solid volume of Vmp crest (μm 3 /μm 2 ) 0.001 0.8 3.1 5.2 9.8 9.2 Solid volume of Vmc core (μm 3 /μm 2 ) 0.01 4.3 10.6 22.3 39.5 35.4 Sp maximum peak height (μm) 0.01 0.35 1.0 2.2 4.7 4.1 Maximum height of Rz line (μm) 0.02 0.899 9.34 0.644 5.41 12.35 Boron content (ppm) 50 150 280 10 500 430 Sodium content (ppm) 10 70 500 430 220 370 effect 0~100μm Gel o o o o o o 100~200μm Gel o o o o o Δ >200μm Gel o o o o o o Average torque of single screw extruder (Torque) twenty one 15 33 41 twenty four 63 Single screw extruder current(Å) 33 26.2 48 65 42 71.4

表1 (續)     比較例EVOH 1 比較例EVOH 2 比較例EVOH 3 比較例EVOH 4 技術特徵 Vmp波峰部實體體積(μm 3/μm 2) 22.3 44.6 0.0005 12.1 Vmc核心部實體體積(μm 3/μm 2) 66.4 110.3 0.004 72.3 Sp最大波峰高度(μm) 12 15 0.0005 8.2 Rz線最大高度(μm) 11.05 29.73 0.01 3.66 硼含量(ppm) 180 220 170 50 鈉含量(ppm) 80 500 240 360 功 效 0~100μm Gel O O X O 100~200μm Gel X X O X >200μm Gel X X O O 單螺桿壓出機平均扭力(Torque) 133 169 10 78.9 單螺桿壓出機電流(Å) 271 312 11 92.1 Table 1 (continued) Comparative example EVOH 1 Comparative example EVOH 2 Comparative example EVOH 3 Comparative example EVOH 4 technical features Solid volume of Vmp crest (μm 3 /μm 2 ) 22.3 44.6 0.0005 12.1 Solid volume of Vmc core (μm 3 /μm 2 ) 66.4 110.3 0.004 72.3 Sp maximum peak height (μm) 12 15 0.0005 8.2 Maximum height of Rz line (μm) 11.05 29.73 0.01 3.66 Boron content (ppm) 180 220 170 50 Sodium content (ppm) 80 500 240 360 effect 0~100μm Gel o o x o 100~200μm Gel x x o x >200μm Gel x x o o Average torque of single screw extruder (Torque) 133 169 10 78.9 Single screw extruder current(Å) 271 312 11 92.1

各實施例及比較例的硼含量,係藉由下述方法測得。首先,使用濃硝酸和微波分解0.1 g EVOH顆粒樣品,使EVOH顆粒形成樣品溶液。然後使用純水稀釋樣品溶液以將其濃度調整為0.75 mg/ml。使用感應偶合電漿放射光譜化學分析儀(ICP emission spectrochemical analysis device,ICP-OES;分析儀:iCAP7000 (賽默飛世爾科技公司,Thermo)測量樣品溶液中的硼含量。所述之硼含量係指對應於衍生自所使用之硼化合物之硼含量的測量值。The boron content of each embodiment and comparative example is measured by the following method. First, 0.1 g of EVOH particle samples were decomposed using concentrated nitric acid and microwave to make EVOH particles form a sample solution. The sample solution was then diluted with pure water to adjust its concentration to 0.75 mg/ml. Use an inductively coupled plasma emission spectrochemical analyzer (ICP emission spectrochemical analysis device, ICP-OES; Analyzer: iCAP7000 (Thermo Fisher Scientific, Thermo) to measure the boron content in the sample solution. The boron content refers to Corresponds to the measured value derived from the boron content of the boron compound used.

另外,也測定各實施例及比較例的EVOH顆粒中的鹼金屬含量。取上述EVOH顆粒2g到鉑皿,添加幾mL硫酸,以氣體燃燒器加熱。確認顆粒碳化且硫酸白煙消失後,添加幾滴硫酸並再加熱。重複此操作直到有機物消失為止,使其完全灰化。將灰化結束的容器放冷,添加鹽酸1mL,使其溶解。將此鹽酸溶液以超純水洗淨,定容到50mL。此樣本溶液中的鹼金屬含量以感應耦合等離子體光譜儀(ICP-AES)(AgilentTechnology公司製、720-ES型)測定。最終,從溶液中的鹼金屬濃度換算上述EVOH組合物粒料中的鹼金屬含量。In addition, the alkali metal content in the EVOH pellets of each Example and Comparative Example was also measured. Take 2g of the above-mentioned EVOH particles to a platinum dish, add several mL of sulfuric acid, and heat with a gas burner. After confirming that the particles are carbonized and the white smoke of sulfuric acid disappears, add a few drops of sulfuric acid and reheat. Repeat this until the organic matter is gone, allowing it to ash completely. The ashed container was left to cool, and 1 mL of hydrochloric acid was added to dissolve it. This hydrochloric acid solution was washed with ultrapure water, and the volume was adjusted to 50 mL. The alkali metal content in this sample solution was measured with an inductively coupled plasma spectrometer (ICP-AES) (manufactured by Agilent Technology, Model 720-ES). Finally, the alkali metal content in the EVOH composition pellets was converted from the alkali metal concentration in the solution.

為了評估實施例EVOH 1-6和比較例EVOH 1-4的顆粒表面粗糙度,將EVOH顆粒平放於板子上方,測量顆粒表面粗糙度,測量時需排除傾斜度大於0.5時的數據,以確保掃描平面係呈相對水平的狀態(傾斜度=面最大高度Sz/分析範圍的邊長129 μm)。雷射顯微鏡係Olympus製造之LEXT OLS5000-SAF,且圖像係於24 ± 3℃之空氣溫度以及63 ± 3%之相對濕度下製成。濾波器設定為無濾波。光源係405 nm-波長之光源。物鏡係100x放大 (MPLAPON-100xLEXT)。光學變焦設定為1.0x。圖像面積設定為129 µm x 129 µm(量測Rz時,係取圖像面積的中心線)。解析度設定為1024像素 x 1024像素。量測100個顆粒之數值,並取其平均值。其中,Vmp、Vmc、Sp係利用ISO 25178:2012方法測量; Rz係利用 JIS B 0601 (2001)方法測量。In order to evaluate the granule surface roughness of embodiment EVOH 1-6 and comparative example EVOH 1-4, EVOH granule is placed flatly on the plate top, measure granule surface roughness, need exclude the data when inclination is greater than 0.5 during measurement, to ensure The scanning plane is in a relatively horizontal state (inclination = maximum surface height Sz/side length of the analysis range 129 μm). The laser microscope was LEXT OLS5000-SAF manufactured by Olympus, and the images were made at an air temperature of 24±3°C and a relative humidity of 63±3%. The filter is set to no filter. The light source is a 405 nm-wavelength light source. The objective lens is 100x magnification (MPLAPON-100xLEXT). Optical zoom was set to 1.0x. The image area is set to 129 µm x 129 µm (when measuring Rz, take the centerline of the image area). Resolution is set to 1024px x 1024px. Measure the value of 100 particles and take the average value. Among them, Vmp, Vmc and Sp are measured by ISO 25178:2012 method; Rz is measured by JIS B 0601 (2001) method.

實施例EVOH 1-6和比較例EVOH 1-4於加工時壓出機扭力計算及電流計算,將EVOH顆粒利用單螺桿壓出機進行壓出時(型號ME25/5800V4,廠牌OCS) ,測量壓出機扭力值和電流值,壓出條件如下:螺桿溫度為Zone1 195℃、 Zone2 215℃ 、 Zone3 220℃ 、 Zone4 230℃ 、 Zone5 230℃;螺桿轉速為7 rpm。計算時間為10至60分鐘,每1分鐘紀錄1點,計算平均值。Example EVOH 1-6 and comparative example EVOH 1-4 were calculated by extruder torque calculation and current calculation during processing, and when EVOH particles were extruded by a single-screw extruder (model ME25/5800V4, brand OCS), measure The extruder torque value and current value, the extrusion conditions are as follows: the screw temperature is Zone1 195°C, Zone2 215°C, Zone3 220°C, Zone4 230°C, Zone5 230°C; the screw speed is 7 rpm. The calculation time is from 10 to 60 minutes, record 1 point every minute, and calculate the average value.

結果顯示,實施例EVOH 1-6具有較低的扭力輸出(15至41 Torque)及電流(26.2至65Å),顯示實施例EVOH 1-6具有優異的加工扭力輸出表現。The results show that Example EVOH 1-6 has lower torque output (15 to 41 Torque) and current (26.2 to 65Å), showing that Example EVOH 1-6 has excellent processing torque output performance.

此外,對於由實施例EVOH 1-6和比較例EVOH 1-4形成的薄膜的凝膠/膠料(Gel)計算,將EVOH加工製作成單層薄膜後,利用FSA-100薄膜品質測試系統分析單層膜Gel數量,並以評價標準進行評價。若<100 μm的凝膠數量為<450者,以「O」表示最佳;若<100 μm的凝膠數量為450~1000者,以「Δ」表示尚可;若<100 μm的凝膠數量為>1000者,則以「X」表示不佳。若100~200 μm的凝膠數量為<50者,以「O」表示最佳;若100~200 μm的凝膠數量為50~100者,以「Δ」表示尚可;若100~200 μm的凝膠數量為>100者,則以「X」表示不佳。若>200 μm的凝膠數量為小於10者,以「O」表示最佳;若>200 μm的凝膠數量為10~20者,以「Δ」表示尚可;若>200 μm的凝膠數量為>20者,則以「X」表示不佳。In addition, for the calculation of the gel/glue (Gel) of the film formed by the EVOH 1-6 of the embodiment and the EVOH 1-4 of the comparative example, after the EVOH is processed into a single-layer film, the FSA-100 film quality test system is used to analyze The number of Gel in the monolayer film is evaluated by the evaluation standard. If the number of gels < 100 μm is < 450, "O" is the best; if the number of gels < 100 μm is 450-1000, it is acceptable by "Δ"; If the quantity is more than 1000, "X" is used to indicate that it is not good. If the number of 100-200 μm gels is less than 50, "O" is the best; if the number of 100-200 μm gels is 50-100, it is acceptable to use "Δ"; If the number of gels is >100, then "X" means poor. If the number of gels >200 μm is less than 10, "O" is the best; if the number of gels >200 μm is 10-20, it is acceptable; if the number of gels >200 μm is 10-20, it is acceptable; If the quantity is > 20, it is indicated by "X" as unsatisfactory.

實施例EVOH 1-6所形成的膜<100 μm的凝膠數量皆小於450,100~200 μm的凝膠數量皆小於100,>200 μm的凝膠數量皆小於10,表現出優異的特性。In the examples EVOH 1-6, the number of gels <100 μm is less than 450, the number of gels of 100-200 μm is less than 100, and the number of gels >200 μm is less than 10, showing excellent characteristics.

發明人發現,當EVOH顆粒表面粗糙度過高時,顆粒在單螺桿加工發生磨擦時,容易發生局部過熱造成交聯,在加工時容易產生大凝膠。當EVOH顆粒表面粗糙度過低時,造成EVOH在加工時磨擦熱不足無法融熔,在押出後會產生微小凝膠。因此,需將EVOH顆粒表面粗糙度控制在一定範圍,避免產生凝膠。The inventors found that when the surface roughness of EVOH particles is too high, when the particles are rubbed during single-screw processing, local overheating is likely to cause crosslinking, and large gels are likely to be generated during processing. When the surface roughness of EVOH particles is too low, the friction heat of EVOH cannot be melted due to insufficient friction during processing, and tiny gels will be produced after extrusion. Therefore, it is necessary to control the surface roughness of EVOH particles within a certain range to avoid gelation.

經由比對表1中之實施例與比較例,發明人發現EVOH顆粒加工時調控洗滌程序之製法變因,亦即控制將EVOH粒子浸入硼/乙酸鈉溶液的變因,可獲得本發明期望之表面粗糙度,具有以下特性: ●  顆粒過大或過小皆容易在水中輸送時相互碰撞造成摩擦; ●  脫水機轉速過高、水/濕粒比例過低、輸送時離心泵使用封閉式、輸送泵轉速過高、水流速度過快等皆會造成濕粒在洗滌程序中相互碰撞摩擦。 By comparing the examples and comparative examples in Table 1, the inventors found that the manufacturing method variable of adjusting and controlling the washing procedure during EVOH particle processing, that is, controlling the variable factor of immersing EVOH particles in boron/sodium acetate solution, can obtain the desired effect of the present invention. Surface roughness, with the following properties: ● Particles that are too large or too small are likely to collide with each other and cause friction when transported in water; ● Excessive speed of the dehydrator, low ratio of water/wet grains, closed centrifugal pump for conveying, high rotational speed of the delivery pump, too fast water flow, etc. will cause the wet grains to collide and rub against each other during the washing process.

比較例1因粒子顆粒大、輸送時水/濕粒比過低、第二次脫水機轉速過高,造成濕粒高摩擦,粗糙度上升。而比較例2因粒子顆粒過小、第一次脫水機轉速過高、使用封閉式離心泵、輸送泵轉速過高、水洗時水/濕料比例太低,造成濕粒高摩擦,粗糙度上升。比較例3因輸送時水/濕粒比率過高、輸送泵轉速過低、水洗時濕粒比粒過高、水流速度過低,造成粒子摩擦度不足,粗糙度不足。In Comparative Example 1, due to the large particle size, the low water/wet particle ratio during transportation, and the high speed of the second dehydrator, the wet particle has high friction and roughness increases. In Comparative Example 2, the particle size was too small, the spin speed of the dehydrator was too high for the first time, a closed centrifugal pump was used, the delivery pump speed was too high, and the water/wet material ratio was too low during washing, resulting in high friction of wet grains and increased roughness. In comparative example 3, the ratio of water/wet particles during transportation is too high, the speed of the delivery pump is too low, the ratio of wet particles to particles during water washing is too high, and the water flow rate is too low, resulting in insufficient particle friction and roughness.

本發明所測試出來之結果,只要透過將EVOH表面粗糙度控制在特定範圍內,就可以降低單螺桿壓出機內的扭力電流、及EVOH膜的凝膠產生。如表1顯示,比較例EVOH 1、2及4具有超出本文所述之期望範圍的Vmp、Vmc及Sp,而測試結果皆具有較高的壓出機扭力輸出及壓出機電流,且其等所形成的膜產生過多的凝膠。比較例EVOH 3具有低於本文所述之期望範圍的Vmp、Vmc及Sp,而測試結果雖具有良好的扭力輸出及電流,但由比較例EVOH 3所形成的膜產生過多的凝膠,而具有不期望的性質。According to the test results of the present invention, as long as the EVOH surface roughness is controlled within a specific range, the torsional current in the single-screw extruder and the gel generation of the EVOH film can be reduced. As shown in Table 1, comparative examples EVOH 1, 2 and 4 have Vmp, Vmc and Sp beyond the expected range described herein, and the test results all have higher extruder torque output and extruder current, and the like The formed film produced too much gel. Comparative example EVOH 3 has Vmp, Vmc and Sp lower than the expected range described herein, and although the test results have good torque output and current, the film formed by comparative example EVOH 3 produces too much gel, and has undesired nature.

綜上所述,本發明之EVOH樹脂組合物具有低表面粗糙度,特別是其表面之粗糙度係介於0.0008至10μm 3/μm 2之Vmp。此外,本發明之EVOH樹脂組合物表面之粗糙度還可以進一步係介於0.005至50μm 3/μm 2之Vmc及/或介於0.005至7μm之Sp。EVOH樹脂組合物表面粗糙度的控制可以藉由操控在EVOH製程之洗滌階段的變因來達成。該EVOH樹脂組合物可用於製備膜或多層結構。發明人發現,藉由控制EVOH顆粒表面粗糙度,可降低EVOH加工時扭力輸出,並且可減少EVOH形成的膜產生數量過多的凝膠。 In summary, the EVOH resin composition of the present invention has a low surface roughness, especially a Vmp whose surface roughness is between 0.0008 and 10 μm 3 /μm 2 . In addition, the surface roughness of the EVOH resin composition of the present invention can further be a Vmc ranging from 0.005 to 50 μm 3 /μm 2 and/or a Sp ranging from 0.005 to 7 μm. The control of the surface roughness of the EVOH resin composition can be achieved by manipulating the variables in the washing stage of the EVOH process. The EVOH resin composition can be used to prepare films or multilayer structures. The inventors have found that by controlling the surface roughness of EVOH particles, the torque output during EVOH processing can be reduced, and the excess gel produced by the film formed by EVOH can be reduced.

本文中,所提供的所有範圍旨在包括在給定之範圍內的每個特定範圍以及在該給定範圍之間的子範圍的組合。此外,除非另有說明,否則本文提供的所有範圍皆包括所述範圍的端點。從而,範圍1-5具體包括1、2、3、4和5,以及諸如2-5、3-5、2-3、2-4、1-4等子範圍。Herein, all ranges provided are intended to include each specific range within the given range as well as combinations of subranges between the given ranges. Additionally, unless otherwise stated, all ranges provided herein include the endpoints of the stated range. Thus, the range 1-5 specifically includes 1, 2, 3, 4, and 5, and sub-ranges such as 2-5, 3-5, 2-3, 2-4, 1-4, and so on.

在本說明書中引用的所有刊物和專利申請案皆透過引用併入本文,並且出於任何及所有目的,每一個別刊物或專利申請案皆明確且個別地指出以透過引用併入本文。在本文與透過引用併入本文的任何刊物或專利申請案之間存在不一致的情況下,以本文為準。All publications and patent applications cited in this specification are herein incorporated by reference, and for any and all purposes, each individual publication or patent application is specifically and individually indicated to be incorporated by reference. In the event of any inconsistency between this document and any publication or patent application incorporated herein by reference, this document controls.

本文所用之術語「包括」、「具有」和「包含」具有開放、非限制性的意義。術語「一」和「該」應理解為涵蓋複數及單數。術語「一個或多個」係指「至少一個」,因此可包括單一特徵或混合物/組合特徵。The terms "including", "having" and "comprising" are used herein in an open, non-limiting sense. The terms "a" and "the" should be understood to cover both the plural and the singular. The term "one or more" means "at least one" and thus may include a single feature or a mixture/combination of features.

除了在操作實施例中或在另外指出的地方,所有表示成分及/或反應條件的量的數字在所有情況下皆可使用術語「約」修飾,意指在所指示的數字的±5%以內。本文所用之術語「基本上不含」或「實質上不含」係指少於約2%的特定特徵。在申請專利範圍中可否定地排除本文中肯定地闡述的所有要素或特徵。Except in the working examples or where otherwise indicated, all figures expressing amounts of ingredients and/or reaction conditions are in all instances modified by the term "about", meaning within ± 5% of the indicated figure . As used herein, the term "substantially free" or "substantially free" means less than about 2% of a specified characteristic. All elements or features affirmatively stated herein may be negatively excluded from the scope of claims.

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無。none.

Claims (15)

一種乙烯-乙烯醇共聚物樹脂組合物,其包括一乙烯-乙烯醇共聚物樹脂;其中該乙烯-乙烯醇共聚物樹脂組合物具有一表面,該表面具有介於0.0008至10μm 3/μm 2之波峰部實體體積(Vmp)。 An ethylene-vinyl alcohol copolymer resin composition, which includes an ethylene-vinyl alcohol copolymer resin; wherein the ethylene-vinyl alcohol copolymer resin composition has a surface, and the surface has a ratio of 0.0008 to 10 μm 3 /μm 2 Peak solid volume (Vmp). 如申請專利範圍第1項所述之乙烯-乙烯醇共聚物樹脂組合物,該乙烯-乙烯醇共聚物樹脂組合物表面具有介於0.005至50μm 3/μm 2之核心部實體體積(Vmc)。 As for the ethylene-vinyl alcohol copolymer resin composition described in claim 1 of the patent application, the surface of the ethylene-vinyl alcohol copolymer resin composition has a core volume (Vmc) between 0.005 and 50 μm 3 /μm 2 . 如申請專利範圍第1項所述之乙烯-乙烯醇共聚物樹脂組合物,該乙烯-乙烯醇共聚物樹脂組合物表面具有介於0.005至7μm之最大波峰高度(Sp)。As for the ethylene-vinyl alcohol copolymer resin composition described in claim 1, the surface of the ethylene-vinyl alcohol copolymer resin composition has a maximum peak height (Sp) between 0.005 and 7 μm. 如申請專利範圍第1項所述之乙烯-乙烯醇共聚物樹脂組合物,該乙烯-乙烯醇共聚物樹脂組合物為顆粒型態。As for the ethylene-vinyl alcohol copolymer resin composition described in item 1 of the scope of the patent application, the ethylene-vinyl alcohol copolymer resin composition is in the form of particles. 如申請專利範圍第1項所述之乙烯-乙烯醇共聚物樹脂組合物,該乙烯-乙烯醇共聚物樹脂之乙烯含量介於20-48莫耳百分比。As for the ethylene-vinyl alcohol copolymer resin composition described in claim 1 of the patent application, the ethylene content of the ethylene-vinyl alcohol copolymer resin is between 20-48 mole percent. 如申請專利範圍第1項所述之乙烯-乙烯醇共聚物樹脂組合物,該乙烯-乙烯醇共聚物樹脂之皂化度大於99.5莫耳百分比。As for the ethylene-vinyl alcohol copolymer resin composition described in item 1 of the patent application, the saponification degree of the ethylene-vinyl alcohol copolymer resin is greater than 99.5 mole percent. 如申請專利範圍第1至6任一項所述之乙烯-乙烯醇共聚物樹脂組合物,該表面之線最大高度(Rz)介於0.01~13 μm。As for the ethylene-vinyl alcohol copolymer resin composition described in any one of claims 1 to 6, the maximum line height (Rz) of the surface is between 0.01 and 13 μm. 如申請專利範圍第7項所述之乙烯-乙烯醇共聚物樹脂組合物,該表面之線最大高度(Rz)介於0.01~9.9 μm。For the ethylene-vinyl alcohol copolymer resin composition described in item 7 of the patent application, the maximum line height (Rz) of the surface is between 0.01 and 9.9 μm. 如申請專利範圍第1至6任一項所述之乙烯-乙烯醇共聚物樹脂組合物,其含水率小於1重量百分比。As the ethylene-vinyl alcohol copolymer resin composition described in any one of claims 1 to 6, the water content is less than 1% by weight. 如申請專利範圍第1至6任一項所述之乙烯-乙烯醇共聚物樹脂組合物,其具有硼含量介於5-550 ppm。The ethylene-vinyl alcohol copolymer resin composition as described in any one of claims 1 to 6 of the patent application has a boron content of 5-550 ppm. 如申請專利範圍第1至6任一項所述之乙烯-乙烯醇共聚物樹脂組合物,其具有鹼金屬含量介於5-550 ppm。The ethylene-vinyl alcohol copolymer resin composition as described in any one of claims 1 to 6 of the patent application has an alkali metal content of 5-550 ppm. 如申請專利範圍第1至6任一項所述之乙烯-乙烯醇共聚物樹脂組合物,其進一步包含由肉桂酸、共軛多烯、滑劑及鹼土金屬所組成之群組之其一或其組合。The ethylene-vinyl alcohol copolymer resin composition as described in any one of claims 1 to 6, further comprising one of the group consisting of cinnamic acid, conjugated polyene, lubricant and alkaline earth metal or its combination. 一種乙烯-乙烯醇共聚物膜,其係由如申請專利範圍1至12任一項所述之乙烯-乙烯醇共聚物樹脂組合物所形成。An ethylene-vinyl alcohol copolymer film is formed from the ethylene-vinyl alcohol copolymer resin composition described in any one of the patent scopes 1 to 12. 一種多層結構,包括: (a) 至少一層由申請專利範圍第1至12任一項之乙烯-乙烯醇共聚物樹脂所形成; (b) 至少一層聚合物層;及 (c) 至少一層黏合層。 A multi-layered structure comprising: (a) At least one layer is formed of the ethylene-vinyl alcohol copolymer resin of any one of the claims 1 to 12; (b) at least one polymer layer; and (c) At least one adhesive layer. 如申請專利範圍第14項所述之多層結構,其中該聚合物層係選自由低密度聚乙烯層、聚乙烯接枝馬來酸酐(polyethylene grafted maleic anhydride)層、聚丙烯層及尼龍層所組成的群組,且該黏合層係一黏結層(tie layer)。The multi-layer structure as described in item 14 of the patent application, wherein the polymer layer is selected from a low-density polyethylene layer, a polyethylene grafted maleic anhydride (polyethylene grafted maleic anhydride) layer, a polypropylene layer and a nylon layer. group, and the bonding layer is a bonding layer (tie layer).
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