TW202248193A - Compound - Google Patents
Compound Download PDFInfo
- Publication number
- TW202248193A TW202248193A TW111104355A TW111104355A TW202248193A TW 202248193 A TW202248193 A TW 202248193A TW 111104355 A TW111104355 A TW 111104355A TW 111104355 A TW111104355 A TW 111104355A TW 202248193 A TW202248193 A TW 202248193A
- Authority
- TW
- Taiwan
- Prior art keywords
- ring
- compound
- formula
- substituent
- represented
- Prior art date
Links
- 150000001875 compounds Chemical class 0.000 title claims abstract description 500
- 125000001424 substituent group Chemical group 0.000 claims abstract description 99
- 150000001450 anions Chemical class 0.000 claims abstract description 35
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 29
- 239000000470 constituent Substances 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims description 99
- 239000011347 resin Substances 0.000 claims description 99
- 238000010521 absorption reaction Methods 0.000 claims description 78
- 239000000203 mixture Substances 0.000 claims description 64
- 230000003287 optical effect Effects 0.000 claims description 35
- 239000011342 resin composition Substances 0.000 claims description 35
- 239000000178 monomer Substances 0.000 claims description 30
- 125000000217 alkyl group Chemical group 0.000 claims description 21
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 18
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 18
- 125000003118 aryl group Chemical group 0.000 claims description 16
- 239000003054 catalyst Substances 0.000 claims description 15
- 125000005843 halogen group Chemical group 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 13
- 125000005647 linker group Chemical group 0.000 claims description 6
- -1 containers Substances 0.000 description 171
- 239000010408 film Substances 0.000 description 61
- 238000002835 absorbance Methods 0.000 description 57
- 150000001768 cations Chemical class 0.000 description 53
- 239000002904 solvent Substances 0.000 description 51
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 48
- 239000002585 base Substances 0.000 description 42
- 238000006243 chemical reaction Methods 0.000 description 38
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 36
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 35
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 24
- 238000000926 separation method Methods 0.000 description 24
- 229920000178 Acrylic resin Polymers 0.000 description 21
- 239000004925 Acrylic resin Substances 0.000 description 21
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 21
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 21
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 21
- 239000010410 layer Substances 0.000 description 21
- 229910052757 nitrogen Inorganic materials 0.000 description 21
- 238000004895 liquid chromatography mass spectrometry Methods 0.000 description 20
- 230000014759 maintenance of location Effects 0.000 description 20
- 239000012790 adhesive layer Substances 0.000 description 19
- 238000005160 1H NMR spectroscopy Methods 0.000 description 18
- 238000005259 measurement Methods 0.000 description 16
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 15
- 238000004458 analytical method Methods 0.000 description 15
- 238000011156 evaluation Methods 0.000 description 15
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 14
- JGFZNNIVVJXRND-UHFFFAOYSA-N N,N-Diisopropylethylamine (DIPEA) Chemical compound CCN(C(C)C)C(C)C JGFZNNIVVJXRND-UHFFFAOYSA-N 0.000 description 14
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 14
- 125000004432 carbon atom Chemical group C* 0.000 description 14
- 238000000576 coating method Methods 0.000 description 14
- 239000011521 glass Substances 0.000 description 14
- 150000003254 radicals Chemical group 0.000 description 14
- 150000001925 cycloalkenes Chemical class 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 238000001816 cooling Methods 0.000 description 12
- 229920000728 polyester Polymers 0.000 description 12
- 239000003505 polymerization initiator Substances 0.000 description 12
- WJKHJLXJJJATHN-UHFFFAOYSA-N triflic anhydride Chemical compound FC(F)(F)S(=O)(=O)OS(=O)(=O)C(F)(F)F WJKHJLXJJJATHN-UHFFFAOYSA-N 0.000 description 12
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 11
- 239000003431 cross linking reagent Substances 0.000 description 11
- 235000013365 dairy product Nutrition 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 238000002834 transmittance Methods 0.000 description 11
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical group C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 10
- 125000001931 aliphatic group Chemical group 0.000 description 10
- 229910052700 potassium Inorganic materials 0.000 description 10
- 239000011591 potassium Substances 0.000 description 10
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 10
- 238000003786 synthesis reaction Methods 0.000 description 10
- OISVCGZHLKNMSJ-UHFFFAOYSA-N 2,6-dimethylpyridine Chemical compound CC1=CC=CC(C)=N1 OISVCGZHLKNMSJ-UHFFFAOYSA-N 0.000 description 9
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 9
- 238000002156 mixing Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical group C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 8
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 8
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 description 8
- 239000003999 initiator Substances 0.000 description 8
- 238000006116 polymerization reaction Methods 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical group C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 7
- 230000000740 bleeding effect Effects 0.000 description 7
- 210000004027 cell Anatomy 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 7
- OIRDBPQYVWXNSJ-UHFFFAOYSA-N methyl trifluoromethansulfonate Chemical compound COS(=O)(=O)C(F)(F)F OIRDBPQYVWXNSJ-UHFFFAOYSA-N 0.000 description 7
- 238000000465 moulding Methods 0.000 description 7
- 239000000049 pigment Substances 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 239000010453 quartz Substances 0.000 description 7
- 238000000550 scanning electron microscopy energy dispersive X-ray spectroscopy Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- RKMGAJGJIURJSJ-UHFFFAOYSA-N 2,2,6,6-tetramethylpiperidine Chemical compound CC1(C)CCCC(C)(C)N1 RKMGAJGJIURJSJ-UHFFFAOYSA-N 0.000 description 6
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 6
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 6
- JRNVZBWKYDBUCA-UHFFFAOYSA-N N-chlorosuccinimide Chemical compound ClN1C(=O)CCC1=O JRNVZBWKYDBUCA-UHFFFAOYSA-N 0.000 description 6
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 6
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 6
- 238000002425 crystallisation Methods 0.000 description 6
- 230000008025 crystallization Effects 0.000 description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 6
- 230000009477 glass transition Effects 0.000 description 6
- CUONGYYJJVDODC-UHFFFAOYSA-N malononitrile Chemical compound N#CCC#N CUONGYYJJVDODC-UHFFFAOYSA-N 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 6
- KEAYESYHFKHZAL-UHFFFAOYSA-N Sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 description 5
- 150000007960 acetonitrile Chemical class 0.000 description 5
- 125000003545 alkoxy group Chemical group 0.000 description 5
- 150000007942 carboxylates Chemical class 0.000 description 5
- 125000000623 heterocyclic group Chemical group 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- WQYVRQLZKVEZGA-UHFFFAOYSA-N hypochlorite Chemical compound Cl[O-] WQYVRQLZKVEZGA-UHFFFAOYSA-N 0.000 description 5
- 238000005342 ion exchange Methods 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 125000006574 non-aromatic ring group Chemical group 0.000 description 5
- 150000002892 organic cations Chemical class 0.000 description 5
- 229910000027 potassium carbonate Inorganic materials 0.000 description 5
- 235000011181 potassium carbonates Nutrition 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 230000035484 reaction time Effects 0.000 description 5
- 239000012312 sodium hydride Substances 0.000 description 5
- 229910000104 sodium hydride Inorganic materials 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- JONIMGVUGJVFQD-UHFFFAOYSA-N (4-methylphenyl)sulfonylformonitrile Chemical compound CC1=CC=C(S(=O)(=O)C#N)C=C1 JONIMGVUGJVFQD-UHFFFAOYSA-N 0.000 description 4
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 4
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 4
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 4
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 4
- PCLIMKBDDGJMGD-UHFFFAOYSA-N N-bromosuccinimide Chemical compound BrN1C(=O)CCC1=O PCLIMKBDDGJMGD-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- 230000018044 dehydration Effects 0.000 description 4
- 238000006297 dehydration reaction Methods 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910052740 iodine Inorganic materials 0.000 description 4
- 239000012948 isocyanate Substances 0.000 description 4
- 229910052744 lithium Inorganic materials 0.000 description 4
- 229910021645 metal ion Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 4
- 239000011736 potassium bicarbonate Substances 0.000 description 4
- 229910000028 potassium bicarbonate Inorganic materials 0.000 description 4
- 235000015497 potassium bicarbonate Nutrition 0.000 description 4
- 229910001414 potassium ion Inorganic materials 0.000 description 4
- 239000007870 radical polymerization initiator Substances 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 4
- PDVFSPNIEOYOQL-UHFFFAOYSA-N (4-methylphenyl)sulfonyl 4-methylbenzenesulfonate Chemical compound C1=CC(C)=CC=C1S(=O)(=O)OS(=O)(=O)C1=CC=C(C)C=C1 PDVFSPNIEOYOQL-UHFFFAOYSA-N 0.000 description 3
- UWKQJZCTQGMHKD-UHFFFAOYSA-N 2,6-di-tert-butylpyridine Chemical compound CC(C)(C)C1=CC=CC(C(C)(C)C)=N1 UWKQJZCTQGMHKD-UHFFFAOYSA-N 0.000 description 3
- XWKFPIODWVPXLX-UHFFFAOYSA-N 2-methyl-5-methylpyridine Natural products CC1=CC=C(C)N=C1 XWKFPIODWVPXLX-UHFFFAOYSA-N 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 3
- LWNFFISCITYFKK-UHFFFAOYSA-N 7-hydroxy-4,4a,5,6-tetrahydro-3h-naphthalen-2-one Chemical compound O=C1CCC2CCC(O)=CC2=C1 LWNFFISCITYFKK-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 description 3
- 239000005695 Ammonium acetate Substances 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- ONIBWKKTOPOVIA-BYPYZUCNSA-N L-Proline Chemical compound OC(=O)[C@@H]1CCCN1 ONIBWKKTOPOVIA-BYPYZUCNSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 3
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 3
- ONIBWKKTOPOVIA-UHFFFAOYSA-N Proline Natural products OC(=O)C1CCCN1 ONIBWKKTOPOVIA-UHFFFAOYSA-N 0.000 description 3
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 3
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 description 3
- 239000004280 Sodium formate Substances 0.000 description 3
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 3
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 3
- 150000004703 alkoxides Chemical class 0.000 description 3
- 239000002168 alkylating agent Substances 0.000 description 3
- 229940100198 alkylating agent Drugs 0.000 description 3
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 235000019257 ammonium acetate Nutrition 0.000 description 3
- 229940043376 ammonium acetate Drugs 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- 239000004410 anthocyanin Substances 0.000 description 3
- 229930002877 anthocyanin Natural products 0.000 description 3
- 235000010208 anthocyanin Nutrition 0.000 description 3
- 150000004636 anthocyanins Chemical class 0.000 description 3
- 125000002178 anthracenyl group Chemical group C1(=CC=CC2=CC3=CC=CC=C3C=C12)* 0.000 description 3
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
- 235000010290 biphenyl Nutrition 0.000 description 3
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 125000001309 chloro group Chemical group Cl* 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- VAYGXNSJCAHWJZ-UHFFFAOYSA-N dimethyl sulfate Chemical compound COS(=O)(=O)OC VAYGXNSJCAHWJZ-UHFFFAOYSA-N 0.000 description 3
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 3
- 125000001153 fluoro group Chemical group F* 0.000 description 3
- 125000005842 heteroatom Chemical group 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 150000002430 hydrocarbons Chemical class 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000012280 lithium aluminium hydride Substances 0.000 description 3
- ZCSHNCUQKCANBX-UHFFFAOYSA-N lithium diisopropylamide Chemical compound [Li+].CC(C)[N-]C(C)C ZCSHNCUQKCANBX-UHFFFAOYSA-N 0.000 description 3
- BNHFWQQYLUPDOG-UHFFFAOYSA-N lithium;1,2,2,3-tetramethylpiperidine Chemical compound [Li].CC1CCCN(C)C1(C)C BNHFWQQYLUPDOG-UHFFFAOYSA-N 0.000 description 3
- JCIVHYBIFRUGKO-UHFFFAOYSA-N lithium;2,2,6,6-tetramethylpiperidine Chemical compound [Li].CC1(C)CCCC(C)(C)N1 JCIVHYBIFRUGKO-UHFFFAOYSA-N 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 229910052987 metal hydride Inorganic materials 0.000 description 3
- 150000004681 metal hydrides Chemical class 0.000 description 3
- 229910000000 metal hydroxide Inorganic materials 0.000 description 3
- 150000004692 metal hydroxides Chemical class 0.000 description 3
- DVSDBMFJEQPWNO-UHFFFAOYSA-N methyllithium Chemical compound C[Li] DVSDBMFJEQPWNO-UHFFFAOYSA-N 0.000 description 3
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 3
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000001624 naphthyl group Chemical group 0.000 description 3
- 229910001453 nickel ion Inorganic materials 0.000 description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 description 3
- 125000004430 oxygen atom Chemical group O* 0.000 description 3
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 description 3
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 3
- 125000002568 propynyl group Chemical group [*]C#CC([H])([H])[H] 0.000 description 3
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 239000001632 sodium acetate Substances 0.000 description 3
- 235000017281 sodium acetate Nutrition 0.000 description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 description 3
- 235000017550 sodium carbonate Nutrition 0.000 description 3
- HLBBKKJFGFRGMU-UHFFFAOYSA-M sodium formate Chemical compound [Na+].[O-]C=O HLBBKKJFGFRGMU-UHFFFAOYSA-M 0.000 description 3
- 235000019254 sodium formate Nutrition 0.000 description 3
- MFRIHAYPQRLWNB-UHFFFAOYSA-N sodium tert-butoxide Chemical compound [Na+].CC(C)(C)[O-] MFRIHAYPQRLWNB-UHFFFAOYSA-N 0.000 description 3
- 229910052717 sulfur Inorganic materials 0.000 description 3
- 125000004434 sulfur atom Chemical group 0.000 description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- GRGCWBWNLSTIEN-UHFFFAOYSA-N trifluoromethanesulfonyl chloride Chemical compound FC(F)(F)S(Cl)(=O)=O GRGCWBWNLSTIEN-UHFFFAOYSA-N 0.000 description 3
- RKBCYCFRFCNLTO-UHFFFAOYSA-N triisopropylamine Chemical compound CC(C)N(C(C)C)C(C)C RKBCYCFRFCNLTO-UHFFFAOYSA-N 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- KNDYXRJLEZMPBC-UHFFFAOYSA-N 1,1-dioxo-2-(trifluoromethylsulfanyl)-1,2-benzothiazol-3-one Chemical compound FC(SN1S(=O)(=O)C2=CC=CC=C2C1=O)(F)F KNDYXRJLEZMPBC-UHFFFAOYSA-N 0.000 description 2
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 2
- MAXSYFSJUKUMRE-UHFFFAOYSA-N 1-ethenyl-3-ethylimidazol-3-ium Chemical compound CCN1C=C[N+](C=C)=C1 MAXSYFSJUKUMRE-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 2
- YYROPELSRYBVMQ-UHFFFAOYSA-N 4-toluenesulfonyl chloride Chemical compound CC1=CC=C(S(Cl)(=O)=O)C=C1 YYROPELSRYBVMQ-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 2
- BHPQYMZQTOCNFJ-UHFFFAOYSA-N Calcium cation Chemical compound [Ca+2] BHPQYMZQTOCNFJ-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 2
- JLVVSXFLKOJNIY-UHFFFAOYSA-N Magnesium ion Chemical compound [Mg+2] JLVVSXFLKOJNIY-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- LQZMLBORDGWNPD-UHFFFAOYSA-N N-iodosuccinimide Chemical compound IN1C(=O)CCC1=O LQZMLBORDGWNPD-UHFFFAOYSA-N 0.000 description 2
- 229910002651 NO3 Inorganic materials 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 2
- GHVZOJONCUEWAV-UHFFFAOYSA-N [K].CCO Chemical compound [K].CCO GHVZOJONCUEWAV-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 239000004480 active ingredient Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910001413 alkali metal ion Inorganic materials 0.000 description 2
- 229910001420 alkaline earth metal ion Inorganic materials 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- 125000004414 alkyl thio group Chemical group 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- HNYOPLTXPVRDBG-UHFFFAOYSA-N barbituric acid Chemical compound O=C1CC(=O)NC(=O)N1 HNYOPLTXPVRDBG-UHFFFAOYSA-N 0.000 description 2
- 229910001422 barium ion Inorganic materials 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- ABNDFSOIUFLJAH-UHFFFAOYSA-N benzyl thiocyanate Chemical compound N#CSCC1=CC=CC=C1 ABNDFSOIUFLJAH-UHFFFAOYSA-N 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- ILAHWRKJUDSMFH-UHFFFAOYSA-N boron tribromide Chemical compound BrB(Br)Br ILAHWRKJUDSMFH-UHFFFAOYSA-N 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- 150000003842 bromide salts Chemical class 0.000 description 2
- 229910001424 calcium ion Inorganic materials 0.000 description 2
- 150000001767 cationic compounds Chemical class 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000003841 chloride salts Chemical class 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- MLIREBYILWEBDM-UHFFFAOYSA-N cyanoacetic acid Chemical compound OC(=O)CC#N MLIREBYILWEBDM-UHFFFAOYSA-N 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 125000004407 fluoroaryl group Chemical group 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 239000000976 ink Substances 0.000 description 2
- 229910001411 inorganic cation Inorganic materials 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 150000004694 iodide salts Chemical class 0.000 description 2
- INQOMBQAUSQDDS-UHFFFAOYSA-N iodomethane Chemical compound IC INQOMBQAUSQDDS-UHFFFAOYSA-N 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N iron (II) ion Substances [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 229910001416 lithium ion Inorganic materials 0.000 description 2
- UBJFKNSINUCEAL-UHFFFAOYSA-N lithium;2-methylpropane Chemical compound [Li+].C[C-](C)C UBJFKNSINUCEAL-UHFFFAOYSA-N 0.000 description 2
- 229910001425 magnesium ion Inorganic materials 0.000 description 2
- IUYHWZFSGMZEOG-UHFFFAOYSA-M magnesium;propane;chloride Chemical compound [Mg+2].[Cl-].C[CH-]C IUYHWZFSGMZEOG-UHFFFAOYSA-M 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- IZDROVVXIHRYMH-UHFFFAOYSA-N methanesulfonic anhydride Chemical compound CS(=O)(=O)OS(C)(=O)=O IZDROVVXIHRYMH-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- 125000004170 methylsulfonyl group Chemical group [H]C([H])([H])S(*)(=O)=O 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 125000002950 monocyclic group Chemical group 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000004923 naphthylmethyl group Chemical group C1(=CC=CC2=CC=CC=C12)C* 0.000 description 2
- 150000002823 nitrates Chemical class 0.000 description 2
- 150000002825 nitriles Chemical class 0.000 description 2
- 239000012788 optical film Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 2
- 125000003170 phenylsulfonyl group Chemical group C1(=CC=CC=C1)S(=O)(=O)* 0.000 description 2
- 125000003386 piperidinyl group Chemical group 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- YKYONYBAUNKHLG-UHFFFAOYSA-N propyl acetate Chemical compound CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 2
- 125000001422 pyrrolinyl group Chemical group 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 125000003548 sec-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- PNGLEYLFMHGIQO-UHFFFAOYSA-M sodium;3-(n-ethyl-3-methoxyanilino)-2-hydroxypropane-1-sulfonate;dihydrate Chemical compound O.O.[Na+].[O-]S(=O)(=O)CC(O)CN(CC)C1=CC=CC(OC)=C1 PNGLEYLFMHGIQO-UHFFFAOYSA-M 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 2
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 2
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 2
- 238000012719 thermal polymerization Methods 0.000 description 2
- 125000002769 thiazolinyl group Chemical group 0.000 description 2
- XKFPGUWSSPXXMF-UHFFFAOYSA-N tributyl(methyl)phosphanium Chemical compound CCCC[P+](C)(CCCC)CCCC XKFPGUWSSPXXMF-UHFFFAOYSA-N 0.000 description 2
- KEHGIVWHHBDQAD-UHFFFAOYSA-N tributyl(octyl)phosphanium Chemical compound CCCCCCCC[P+](CCCC)(CCCC)CCCC KEHGIVWHHBDQAD-UHFFFAOYSA-N 0.000 description 2
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 2
- 125000001889 triflyl group Chemical group FC(F)(F)S(*)(=O)=O 0.000 description 2
- PYVOHVLEZJMINC-UHFFFAOYSA-N trihexyl(tetradecyl)phosphanium Chemical compound CCCCCCCCCCCCCC[P+](CCCCCC)(CCCCCC)CCCCCC PYVOHVLEZJMINC-UHFFFAOYSA-N 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- LFAIHVPBSXATTE-UHFFFAOYSA-N (1-ethylpyridin-1-ium-3-yl)methanol Chemical compound CC[N+]1=CC=CC(CO)=C1 LFAIHVPBSXATTE-UHFFFAOYSA-N 0.000 description 1
- BYEAHWXPCBROCE-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropan-2-ol Chemical compound FC(F)(F)C(O)C(F)(F)F BYEAHWXPCBROCE-UHFFFAOYSA-N 0.000 description 1
- OXDSKEQSEGDAFN-UHFFFAOYSA-N 1,1,1-trifluoro-n-phenylmethanesulfonamide Chemical compound FC(F)(F)S(=O)(=O)NC1=CC=CC=C1 OXDSKEQSEGDAFN-UHFFFAOYSA-N 0.000 description 1
- SHXHPUAKLCCLDV-UHFFFAOYSA-N 1,1,1-trifluoropentane-2,4-dione Chemical compound CC(=O)CC(=O)C(F)(F)F SHXHPUAKLCCLDV-UHFFFAOYSA-N 0.000 description 1
- QKIHLPFZYGFMDK-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,4-nonafluorobutylsulfonyl 1,1,2,2,3,3,4,4,4-nonafluorobutane-1-sulfonate Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)S(=O)(=O)OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F QKIHLPFZYGFMDK-UHFFFAOYSA-N 0.000 description 1
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- ILFIRBGRMCGNOO-UHFFFAOYSA-N 1,1-bis($l^{1}-oxidanyl)ethene Chemical group [O]C([O])=C ILFIRBGRMCGNOO-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- HMXQIFUGFZEJEO-UHFFFAOYSA-N 1,2-dihydropyrrol-3-one Chemical compound O=C1CNC=C1 HMXQIFUGFZEJEO-UHFFFAOYSA-N 0.000 description 1
- MXLZUALXSYVAIV-UHFFFAOYSA-N 1,2-dimethyl-3-propylimidazol-1-ium Chemical compound CCCN1C=C[N+](C)=C1C MXLZUALXSYVAIV-UHFFFAOYSA-N 0.000 description 1
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 1
- ZPQOPVIELGIULI-UHFFFAOYSA-N 1,3-dichlorobenzene Chemical compound ClC1=CC=CC(Cl)=C1 ZPQOPVIELGIULI-UHFFFAOYSA-N 0.000 description 1
- SHBTUGJAKBRBBJ-UHFFFAOYSA-N 1,3-diethyl-2-sulfanylidene-1,3-diazinane-4,6-dione Chemical compound CCN1C(=O)CC(=O)N(CC)C1=S SHBTUGJAKBRBBJ-UHFFFAOYSA-N 0.000 description 1
- HVVRUQBMAZRKPJ-UHFFFAOYSA-N 1,3-dimethylimidazolium Chemical compound CN1C=C[N+](C)=C1 HVVRUQBMAZRKPJ-UHFFFAOYSA-N 0.000 description 1
- UHKAJLSKXBADFT-UHFFFAOYSA-N 1,3-indandione Chemical compound C1=CC=C2C(=O)CC(=O)C2=C1 UHKAJLSKXBADFT-UHFFFAOYSA-N 0.000 description 1
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 1
- IDTCZPKYVMKLRZ-UHFFFAOYSA-N 1-(2-methoxyethyl)-1-methylpyrrolidin-1-ium Chemical compound COCC[N+]1(C)CCCC1 IDTCZPKYVMKLRZ-UHFFFAOYSA-N 0.000 description 1
- COSSPXYCRNRXRX-UHFFFAOYSA-N 1-benzyl-3-methylimidazol-3-ium Chemical compound C1=[N+](C)C=CN1CC1=CC=CC=C1 COSSPXYCRNRXRX-UHFFFAOYSA-N 0.000 description 1
- UVCPHBWNKAXVPC-UHFFFAOYSA-N 1-butyl-1-methylpiperidin-1-ium Chemical compound CCCC[N+]1(C)CCCCC1 UVCPHBWNKAXVPC-UHFFFAOYSA-N 0.000 description 1
- PXELHGDYRQLRQO-UHFFFAOYSA-N 1-butyl-1-methylpyrrolidin-1-ium Chemical compound CCCC[N+]1(C)CCCC1 PXELHGDYRQLRQO-UHFFFAOYSA-N 0.000 description 1
- XUAXVBUVQVRIIQ-UHFFFAOYSA-N 1-butyl-2,3-dimethylimidazol-3-ium Chemical compound CCCCN1C=C[N+](C)=C1C XUAXVBUVQVRIIQ-UHFFFAOYSA-N 0.000 description 1
- IQQRAVYLUAZUGX-UHFFFAOYSA-N 1-butyl-3-methylimidazolium Chemical compound CCCCN1C=C[N+](C)=C1 IQQRAVYLUAZUGX-UHFFFAOYSA-N 0.000 description 1
- DADKKHHMGSWSPH-UHFFFAOYSA-N 1-butyl-3-methylpyridin-1-ium Chemical compound CCCC[N+]1=CC=CC(C)=C1 DADKKHHMGSWSPH-UHFFFAOYSA-N 0.000 description 1
- NNLHWTTWXYBJBQ-UHFFFAOYSA-N 1-butyl-4-methylpyridin-1-ium Chemical compound CCCC[N+]1=CC=C(C)C=C1 NNLHWTTWXYBJBQ-UHFFFAOYSA-N 0.000 description 1
- LDVVBLGHGCHZBJ-UHFFFAOYSA-N 1-decyl-3-methylimidazolium Chemical compound CCCCCCCCCCN1C=C[N+](C)=C1 LDVVBLGHGCHZBJ-UHFFFAOYSA-N 0.000 description 1
- ILQHIGIKULUQFQ-UHFFFAOYSA-N 1-dodecyl-3-methylimidazolium Chemical compound CCCCCCCCCCCCN1C=C[N+](C)=C1 ILQHIGIKULUQFQ-UHFFFAOYSA-N 0.000 description 1
- QGAWSIYIFXMWCF-UHFFFAOYSA-N 1-ethenyl-3-[4-(3-ethenylimidazol-1-ium-1-yl)butyl]imidazol-3-ium Chemical compound C=CN1C=C[N+](CCCC[N+]2=CN(C=C)C=C2)=C1 QGAWSIYIFXMWCF-UHFFFAOYSA-N 0.000 description 1
- NIHOUJYFWMURBG-UHFFFAOYSA-N 1-ethyl-1-methylpyrrolidin-1-ium Chemical compound CC[N+]1(C)CCCC1 NIHOUJYFWMURBG-UHFFFAOYSA-N 0.000 description 1
- IRGDPGYNHSIIJJ-UHFFFAOYSA-N 1-ethyl-2,3-dimethylimidazol-3-ium Chemical compound CCN1C=C[N+](C)=C1C IRGDPGYNHSIIJJ-UHFFFAOYSA-N 0.000 description 1
- FUZQTBHDJAOMJB-UHFFFAOYSA-N 1-ethyl-2-methylpyridin-1-ium Chemical compound CC[N+]1=CC=CC=C1C FUZQTBHDJAOMJB-UHFFFAOYSA-N 0.000 description 1
- NJMWOUFKYKNWDW-UHFFFAOYSA-N 1-ethyl-3-methylimidazolium Chemical compound CCN1C=C[N+](C)=C1 NJMWOUFKYKNWDW-UHFFFAOYSA-N 0.000 description 1
- REITYCXGQIGALX-UHFFFAOYSA-N 1-ethyl-3-methylpyridin-1-ium Chemical compound CC[N+]1=CC=CC(C)=C1 REITYCXGQIGALX-UHFFFAOYSA-N 0.000 description 1
- OIDIRWZVUWCCCO-UHFFFAOYSA-N 1-ethylpyridin-1-ium Chemical compound CC[N+]1=CC=CC=C1 OIDIRWZVUWCCCO-UHFFFAOYSA-N 0.000 description 1
- AMKUSFIBHAUBIJ-UHFFFAOYSA-N 1-hexylpyridin-1-ium Chemical compound CCCCCC[N+]1=CC=CC=C1 AMKUSFIBHAUBIJ-UHFFFAOYSA-N 0.000 description 1
- JWPBORWCDZAHAU-UHFFFAOYSA-N 1-methyl-1-octylpyrrolidin-1-ium Chemical compound CCCCCCCC[N+]1(C)CCCC1 JWPBORWCDZAHAU-UHFFFAOYSA-N 0.000 description 1
- RRYKUXCBJXYIOD-UHFFFAOYSA-N 1-methyl-1-pentylpyrrolidin-1-ium Chemical compound CCCCC[N+]1(C)CCCC1 RRYKUXCBJXYIOD-UHFFFAOYSA-N 0.000 description 1
- JCRKOOWDIOIJIN-UHFFFAOYSA-N 1-methyl-1-prop-2-enylpyrrolidin-1-ium Chemical compound C=CC[N+]1(C)CCCC1 JCRKOOWDIOIJIN-UHFFFAOYSA-N 0.000 description 1
- OGLIVJFAKNJZRE-UHFFFAOYSA-N 1-methyl-1-propylpiperidin-1-ium Chemical compound CCC[N+]1(C)CCCCC1 OGLIVJFAKNJZRE-UHFFFAOYSA-N 0.000 description 1
- YQFWGCSKGJMGHE-UHFFFAOYSA-N 1-methyl-1-propylpyrrolidin-1-ium Chemical compound CCC[N+]1(C)CCCC1 YQFWGCSKGJMGHE-UHFFFAOYSA-N 0.000 description 1
- XDEQOBPALZZTCA-UHFFFAOYSA-N 1-octylpyridin-1-ium Chemical compound CCCCCCCC[N+]1=CC=CC=C1 XDEQOBPALZZTCA-UHFFFAOYSA-N 0.000 description 1
- CRTKBIFIDSNKCN-UHFFFAOYSA-N 1-propylpyridin-1-ium Chemical compound CCC[N+]1=CC=CC=C1 CRTKBIFIDSNKCN-UHFFFAOYSA-N 0.000 description 1
- 125000004206 2,2,2-trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 1
- MEKOFIRRDATTAG-UHFFFAOYSA-N 2,2,5,8-tetramethyl-3,4-dihydrochromen-6-ol Chemical compound C1CC(C)(C)OC2=C1C(C)=C(O)C=C2C MEKOFIRRDATTAG-UHFFFAOYSA-N 0.000 description 1
- 125000004778 2,2-difluoroethyl group Chemical group [H]C([H])(*)C([H])(F)F 0.000 description 1
- XGBWXISUZXYULS-UHFFFAOYSA-N 2,3-ditert-butylpyridine Chemical compound CC(C)(C)C1=CC=CN=C1C(C)(C)C XGBWXISUZXYULS-UHFFFAOYSA-N 0.000 description 1
- WLVWCXRDONBKDB-UHFFFAOYSA-M 2,8-difluoro-5-(trifluoromethyl)dibenzothiophen-5-ium trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.Fc1ccc2[S+](c3ccc(F)cc3-c2c1)C(F)(F)F WLVWCXRDONBKDB-UHFFFAOYSA-M 0.000 description 1
- HLIQLHSBZXDKLV-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-phenoxyethanol Chemical compound OCCOCC(O)OC1=CC=CC=C1 HLIQLHSBZXDKLV-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- QRADPXNAURXMSB-UHFFFAOYSA-N 2-bromo-1,1-dioxo-1,2-benzothiazol-3-one Chemical compound C1=CC=C2S(=O)(=O)N(Br)C(=O)C2=C1 QRADPXNAURXMSB-UHFFFAOYSA-N 0.000 description 1
- MARXMDRWROUXMD-UHFFFAOYSA-N 2-bromoisoindole-1,3-dione Chemical compound C1=CC=C2C(=O)N(Br)C(=O)C2=C1 MARXMDRWROUXMD-UHFFFAOYSA-N 0.000 description 1
- WDRFYIPWHMGQPN-UHFFFAOYSA-N 2-chloroisoindole-1,3-dione Chemical compound C1=CC=C2C(=O)N(Cl)C(=O)C2=C1 WDRFYIPWHMGQPN-UHFFFAOYSA-N 0.000 description 1
- MATJPVGBSAQWAC-UHFFFAOYSA-N 2-cyano-n,n-dimethylacetamide Chemical compound CN(C)C(=O)CC#N MATJPVGBSAQWAC-UHFFFAOYSA-N 0.000 description 1
- XCTQPMCULSZKLT-UHFFFAOYSA-N 2-cyano-n-phenylacetamide Chemical compound N#CCC(=O)NC1=CC=CC=C1 XCTQPMCULSZKLT-UHFFFAOYSA-N 0.000 description 1
- IJJJSNBMFDDFBC-UHFFFAOYSA-N 2-cyanoethyl acetate Chemical compound CC(=O)OCCC#N IJJJSNBMFDDFBC-UHFFFAOYSA-N 0.000 description 1
- ZNYBQVBNSXLZNI-UHFFFAOYSA-N 2-ethylhexyl 2-cyanoacetate Chemical compound CCCCC(CC)COC(=O)CC#N ZNYBQVBNSXLZNI-UHFFFAOYSA-N 0.000 description 1
- 125000004777 2-fluoroethyl group Chemical group [H]C([H])(F)C([H])([H])* 0.000 description 1
- ISZGNNPTDCJIIS-UHFFFAOYSA-N 2-iodoisoindole-1,3-dione Chemical compound C1=CC=C2C(=O)N(I)C(=O)C2=C1 ISZGNNPTDCJIIS-UHFFFAOYSA-N 0.000 description 1
- CTSZPNIMMLSKDV-UHFFFAOYSA-O 2-methyl-1-pyrrolinium Chemical compound CC1=[NH+]CCC1 CTSZPNIMMLSKDV-UHFFFAOYSA-O 0.000 description 1
- JWUJQDFVADABEY-UHFFFAOYSA-N 2-methyltetrahydrofuran Chemical compound CC1CCCO1 JWUJQDFVADABEY-UHFFFAOYSA-N 0.000 description 1
- 125000003504 2-oxazolinyl group Chemical group O1C(=NCC1)* 0.000 description 1
- RVBUGGBMJDPOST-UHFFFAOYSA-N 2-thiobarbituric acid Chemical compound O=C1CC(=O)NC(=S)N1 RVBUGGBMJDPOST-UHFFFAOYSA-N 0.000 description 1
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- KNTKCYKJRSMRMZ-UHFFFAOYSA-N 3-chloropropyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCCl KNTKCYKJRSMRMZ-UHFFFAOYSA-N 0.000 description 1
- NVBCFOQYDFKXJJ-UHFFFAOYSA-N 3-formyl-1h-indole-5-carbonitrile Chemical compound C1=C(C#N)C=C2C(C=O)=CNC2=C1 NVBCFOQYDFKXJJ-UHFFFAOYSA-N 0.000 description 1
- LJPCNSSTRWGCMZ-UHFFFAOYSA-N 3-methyloxolane Chemical compound CC1CCOC1 LJPCNSSTRWGCMZ-UHFFFAOYSA-N 0.000 description 1
- XWWUQBHVRILEPB-UHFFFAOYSA-N 3-oxo-3-thiophen-2-ylpropanenitrile Chemical compound N#CCC(=O)C1=CC=CS1 XWWUQBHVRILEPB-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- MXZMACXOMZKYHJ-UHFFFAOYSA-N 4,4-dimethyl-3-oxopentanenitrile Chemical compound CC(C)(C)C(=O)CC#N MXZMACXOMZKYHJ-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- NWORVTSPNLVHSH-UHFFFAOYSA-N 4-ethyl-4-methylmorpholin-4-ium Chemical compound CC[N+]1(C)CCOCC1 NWORVTSPNLVHSH-UHFFFAOYSA-N 0.000 description 1
- OSCFFOTZWZZXPR-UHFFFAOYSA-N 4-methyl-1-octylpyridin-1-ium Chemical compound CCCCCCCC[N+]1=CC=C(C)C=C1 OSCFFOTZWZZXPR-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- RAXXELZNTBOGNW-UHFFFAOYSA-O Imidazolium Chemical compound C1=C[NH+]=CN1 RAXXELZNTBOGNW-UHFFFAOYSA-O 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- BZLVMXJERCGZMT-UHFFFAOYSA-N Methyl tert-butyl ether Chemical compound COC(C)(C)C BZLVMXJERCGZMT-UHFFFAOYSA-N 0.000 description 1
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical group C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 1
- PQBAWAQIRZIWIV-UHFFFAOYSA-N N-methylpyridinium Chemical compound C[N+]1=CC=CC=C1 PQBAWAQIRZIWIV-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical group ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Natural products P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical group C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 1
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- WETWJCDKMRHUPV-UHFFFAOYSA-N acetyl chloride Chemical compound CC(Cl)=O WETWJCDKMRHUPV-UHFFFAOYSA-N 0.000 description 1
- 239000012346 acetyl chloride Substances 0.000 description 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 125000003172 aldehyde group Chemical group 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 1
- 125000005138 alkoxysulfonyl group Chemical group 0.000 description 1
- 125000004685 alkoxythiocarbonyl group Chemical group 0.000 description 1
- 125000005196 alkyl carbonyloxy group Chemical group 0.000 description 1
- 125000005119 alkyl cycloalkyl group Chemical group 0.000 description 1
- 150000001350 alkyl halides Chemical class 0.000 description 1
- 125000004390 alkyl sulfonyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- SMZOGRDCAXLAAR-UHFFFAOYSA-N aluminium isopropoxide Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] SMZOGRDCAXLAAR-UHFFFAOYSA-N 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 150000001449 anionic compounds Chemical class 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000006615 aromatic heterocyclic group Chemical group 0.000 description 1
- 125000002102 aryl alkyloxo group Chemical group 0.000 description 1
- 125000004391 aryl sulfonyl group Chemical group 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 1
- ZJRCIQAMTAINCB-UHFFFAOYSA-N benzoylacetonitrile Chemical compound N#CCC(=O)C1=CC=CC=C1 ZJRCIQAMTAINCB-UHFFFAOYSA-N 0.000 description 1
- ODRZUUBZEIXMOS-UHFFFAOYSA-N benzyl-ethyl-dimethylazanium Chemical compound CC[N+](C)(C)CC1=CC=CC=C1 ODRZUUBZEIXMOS-UHFFFAOYSA-N 0.000 description 1
- 229910001423 beryllium ion Inorganic materials 0.000 description 1
- XHIHMDHAPXMAQK-UHFFFAOYSA-N bis(trifluoromethylsulfonyl)azanide;1-butylpyridin-1-ium Chemical compound CCCC[N+]1=CC=CC=C1.FC(F)(F)S(=O)(=O)[N-]S(=O)(=O)C(F)(F)F XHIHMDHAPXMAQK-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000005997 bromomethyl group Chemical group 0.000 description 1
- 125000004799 bromophenyl group Chemical group 0.000 description 1
- DJACTCNGCHPGOI-UHFFFAOYSA-N butyl 2-cyanoacetate Chemical compound CCCCOC(=O)CC#N DJACTCNGCHPGOI-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- SEXLAQXMAFCJCO-UHFFFAOYSA-N butyl trifluoromethanesulfonate Chemical compound CCCCOS(=O)(=O)C(F)(F)F SEXLAQXMAFCJCO-UHFFFAOYSA-N 0.000 description 1
- IUNCEDRRUNZACO-UHFFFAOYSA-N butyl(trimethyl)azanium Chemical compound CCCC[N+](C)(C)C IUNCEDRRUNZACO-UHFFFAOYSA-N 0.000 description 1
- 125000004744 butyloxycarbonyl group Chemical group 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- FJDQFPXHSGXQBY-UHFFFAOYSA-L caesium carbonate Chemical compound [Cs+].[Cs+].[O-]C([O-])=O FJDQFPXHSGXQBY-UHFFFAOYSA-L 0.000 description 1
- 229910000024 caesium carbonate Inorganic materials 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 125000000068 chlorophenyl group Chemical group 0.000 description 1
- 125000002676 chrysenyl group Chemical group C1(=CC=CC=2C3=CC=C4C=CC=CC4=C3C=CC12)* 0.000 description 1
- 229910001429 cobalt ion Inorganic materials 0.000 description 1
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- DGJMPUGMZIKDRO-UHFFFAOYSA-N cyanoacetamide Chemical compound NC(=O)CC#N DGJMPUGMZIKDRO-UHFFFAOYSA-N 0.000 description 1
- ATDGTVJJHBUTRL-UHFFFAOYSA-N cyanogen bromide Chemical compound BrC#N ATDGTVJJHBUTRL-UHFFFAOYSA-N 0.000 description 1
- QPJDMGCKMHUXFD-UHFFFAOYSA-N cyanogen chloride Chemical compound ClC#N QPJDMGCKMHUXFD-UHFFFAOYSA-N 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000000392 cycloalkenyl group Chemical group 0.000 description 1
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- HJSLFCCWAKVHIW-UHFFFAOYSA-N cyclohexane-1,3-dione Chemical compound O=C1CCCC(=O)C1 HJSLFCCWAKVHIW-UHFFFAOYSA-N 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- HCKMSHYCAFVSGW-UHFFFAOYSA-N cyclohexyl(trimethyl)azanium Chemical compound C[N+](C)(C)C1CCCCC1 HCKMSHYCAFVSGW-UHFFFAOYSA-N 0.000 description 1
- 125000004210 cyclohexylmethyl group Chemical group [H]C([H])(*)C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- MPGMMGPFTLLOGN-UHFFFAOYSA-N cyclopropane-1,2-dione Chemical compound O=C1CC1=O MPGMMGPFTLLOGN-UHFFFAOYSA-N 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- PGRHXDWITVMQBC-UHFFFAOYSA-N dehydroacetic acid Natural products CC(=O)C1C(=O)OC(C)=CC1=O PGRHXDWITVMQBC-UHFFFAOYSA-N 0.000 description 1
- 125000004663 dialkyl amino group Chemical group 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 125000004772 dichloromethyl group Chemical group [H]C(Cl)(Cl)* 0.000 description 1
- KSRKBDUROZKZBR-UHFFFAOYSA-N diethyl-methyl-propylazanium Chemical compound CCC[N+](C)(CC)CC KSRKBDUROZKZBR-UHFFFAOYSA-N 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 125000001028 difluoromethyl group Chemical group [H]C(F)(F)* 0.000 description 1
- BADXJIPKFRBFOT-UHFFFAOYSA-N dimedone Chemical compound CC1(C)CC(=O)CC(=O)C1 BADXJIPKFRBFOT-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- BEPAFCGSDWSTEL-UHFFFAOYSA-N dimethyl malonate Chemical compound COC(=O)CC(=O)OC BEPAFCGSDWSTEL-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 210000005069 ears Anatomy 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- HHBOIIOOTUCYQD-UHFFFAOYSA-N ethoxy-dimethyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(C)CCCOCC1CO1 HHBOIIOOTUCYQD-UHFFFAOYSA-N 0.000 description 1
- 125000003754 ethoxycarbonyl group Chemical group C(=O)(OCC)* 0.000 description 1
- KLKFAASOGCDTDT-UHFFFAOYSA-N ethoxymethoxyethane Chemical compound CCOCOCC KLKFAASOGCDTDT-UHFFFAOYSA-N 0.000 description 1
- SPGPSFWOMJQSDF-UHFFFAOYSA-N ethyl 4-oxo-6-(trifluoromethyl)-1h-quinoline-3-carboxylate Chemical compound C1=C(C(F)(F)F)C=C2C(=O)C(C(=O)OCC)=CNC2=C1 SPGPSFWOMJQSDF-UHFFFAOYSA-N 0.000 description 1
- UVECLJDRPFNRRQ-UHFFFAOYSA-N ethyl trifluoromethanesulfonate Chemical compound CCOS(=O)(=O)C(F)(F)F UVECLJDRPFNRRQ-UHFFFAOYSA-N 0.000 description 1
- KIJWMNYEVKNAGY-UHFFFAOYSA-N ethyl-(2-methoxyethyl)-dimethylazanium Chemical compound CC[N+](C)(C)CCOC KIJWMNYEVKNAGY-UHFFFAOYSA-N 0.000 description 1
- SRYUVPBJVKBYRG-UHFFFAOYSA-N ethyl-dimethyl-(2-phenylethyl)azanium Chemical compound CC[N+](C)(C)CCC1=CC=CC=C1 SRYUVPBJVKBYRG-UHFFFAOYSA-N 0.000 description 1
- 125000004672 ethylcarbonyl group Chemical group [H]C([H])([H])C([H])([H])C(*)=O 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 125000006125 ethylsulfonyl group Chemical group 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 150000004673 fluoride salts Chemical class 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000003709 fluoroalkyl group Chemical group 0.000 description 1
- 125000005817 fluorobutyl group Chemical group [H]C([H])(F)C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004216 fluoromethyl group Chemical group [H]C([H])(F)* 0.000 description 1
- 125000001207 fluorophenyl group Chemical group 0.000 description 1
- UQSQSQZYBQSBJZ-UHFFFAOYSA-N fluorosulfonic acid Chemical compound OS(F)(=O)=O UQSQSQZYBQSBJZ-UHFFFAOYSA-N 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- DGCTVLNZTFDPDJ-UHFFFAOYSA-N heptane-3,5-dione Chemical compound CCC(=O)CC(=O)CC DGCTVLNZTFDPDJ-UHFFFAOYSA-N 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- VPUGDVKSAQVFFS-UHFFFAOYSA-N hexabenzobenzene Natural products C1=C(C2=C34)C=CC3=CC=C(C=C3)C4=C4C3=CC=C(C=C3)C4=C2C3=C1 VPUGDVKSAQVFFS-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000012510 hollow fiber Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000002632 imidazolidinyl group Chemical group 0.000 description 1
- 125000002636 imidazolinyl group Chemical group 0.000 description 1
- 125000005462 imide group Chemical group 0.000 description 1
- 125000001041 indolyl group Chemical group 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- SNHMUERNLJLMHN-UHFFFAOYSA-N iodobenzene Chemical compound IC1=CC=CC=C1 SNHMUERNLJLMHN-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- 125000004491 isohexyl group Chemical group C(CCC(C)C)* 0.000 description 1
- 125000000904 isoindolyl group Chemical group C=1(NC=C2C=CC=CC12)* 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- YNESATAKKCNGOF-UHFFFAOYSA-N lithium bis(trimethylsilyl)amide Chemical compound [Li+].C[Si](C)(C)[N-][Si](C)(C)C YNESATAKKCNGOF-UHFFFAOYSA-N 0.000 description 1
- XGZVUEUWXADBQD-UHFFFAOYSA-L lithium carbonate Chemical compound [Li+].[Li+].[O-]C([O-])=O XGZVUEUWXADBQD-UHFFFAOYSA-L 0.000 description 1
- 229910052808 lithium carbonate Inorganic materials 0.000 description 1
- 150000002642 lithium compounds Chemical class 0.000 description 1
- JILPJDVXYVTZDQ-UHFFFAOYSA-N lithium methoxide Chemical compound [Li+].[O-]C JILPJDVXYVTZDQ-UHFFFAOYSA-N 0.000 description 1
- AZVCGYPLLBEUNV-UHFFFAOYSA-N lithium;ethanolate Chemical compound [Li+].CC[O-] AZVCGYPLLBEUNV-UHFFFAOYSA-N 0.000 description 1
- HQRPHMAXFVUBJX-UHFFFAOYSA-M lithium;hydrogen carbonate Chemical compound [Li+].OC([O-])=O HQRPHMAXFVUBJX-UHFFFAOYSA-M 0.000 description 1
- LWLPYZUDBNFNAH-UHFFFAOYSA-M magnesium;butane;bromide Chemical compound [Mg+2].[Br-].CCC[CH2-] LWLPYZUDBNFNAH-UHFFFAOYSA-M 0.000 description 1
- NXPHGHWWQRMDIA-UHFFFAOYSA-M magnesium;carbanide;bromide Chemical compound [CH3-].[Mg+2].[Br-] NXPHGHWWQRMDIA-UHFFFAOYSA-M 0.000 description 1
- LVKCSZQWLOVUGB-UHFFFAOYSA-M magnesium;propane;bromide Chemical compound [Mg+2].[Br-].C[CH-]C LVKCSZQWLOVUGB-UHFFFAOYSA-M 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- WRIRWRKPLXCTFD-UHFFFAOYSA-N malonamide Chemical compound NC(=O)CC(N)=O WRIRWRKPLXCTFD-UHFFFAOYSA-N 0.000 description 1
- 229910001437 manganese ion Inorganic materials 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 125000001434 methanylylidene group Chemical group [H]C#[*] 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- 125000001160 methoxycarbonyl group Chemical group [H]C([H])([H])OC(*)=O 0.000 description 1
- SKTCDJAMAYNROS-UHFFFAOYSA-N methoxycyclopentane Chemical compound COC1CCCC1 SKTCDJAMAYNROS-UHFFFAOYSA-N 0.000 description 1
- ANGDWNBGPBMQHW-UHFFFAOYSA-N methyl cyanoacetate Chemical compound COC(=O)CC#N ANGDWNBGPBMQHW-UHFFFAOYSA-N 0.000 description 1
- MBABOKRGFJTBAE-UHFFFAOYSA-N methyl methanesulfonate Chemical compound COS(C)(=O)=O MBABOKRGFJTBAE-UHFFFAOYSA-N 0.000 description 1
- JZMJDSHXVKJFKW-UHFFFAOYSA-N methyl sulfate Chemical compound COS(O)(=O)=O JZMJDSHXVKJFKW-UHFFFAOYSA-N 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- 125000000250 methylamino group Chemical group [H]N(*)C([H])([H])[H] 0.000 description 1
- ZUZLIXGTXQBUDC-UHFFFAOYSA-N methyltrioctylammonium Chemical compound CCCCCCCC[N+](C)(CCCCCCCC)CCCCCCCC ZUZLIXGTXQBUDC-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- GYSYFBPOQKDJLU-UHFFFAOYSA-N n-(trifluoromethylsulfanyl)aniline Chemical compound FC(F)(F)SNC1=CC=CC=C1 GYSYFBPOQKDJLU-UHFFFAOYSA-N 0.000 description 1
- QJGRPCPCQQPZLZ-UHFFFAOYSA-N n-carbamoyl-2-cyanoacetamide Chemical compound NC(=O)NC(=O)CC#N QJGRPCPCQQPZLZ-UHFFFAOYSA-N 0.000 description 1
- PEQJBOMPGWYIRO-UHFFFAOYSA-N n-ethyl-3,4-dimethoxyaniline Chemical compound CCNC1=CC=C(OC)C(OC)=C1 PEQJBOMPGWYIRO-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 125000005151 nonafluorobutanesulfonyl group Chemical group FC(C(C(S(=O)(=O)*)(F)F)(F)F)(C(F)(F)F)F 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- INFDPOAKFNIJBF-UHFFFAOYSA-N paraquat Chemical compound C1=C[N+](C)=CC=C1C1=CC=[N+](C)C=C1 INFDPOAKFNIJBF-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- SLIUAWYAILUBJU-UHFFFAOYSA-N pentacene Chemical compound C1=CC=CC2=CC3=CC4=CC5=CC=CC=C5C=C4C=C3C=C21 SLIUAWYAILUBJU-UHFFFAOYSA-N 0.000 description 1
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 1
- 125000005003 perfluorobutyl group Chemical group FC(F)(F)C(F)(F)C(F)(F)C(F)(F)* 0.000 description 1
- 125000005004 perfluoroethyl group Chemical group FC(F)(F)C(F)(F)* 0.000 description 1
- 125000005005 perfluorohexyl group Chemical group FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)* 0.000 description 1
- 125000005008 perfluoropentyl group Chemical group FC(C(C(C(C(F)(F)F)(F)F)(F)F)(F)F)(F)* 0.000 description 1
- 125000005009 perfluoropropyl group Chemical group FC(C(C(F)(F)F)(F)F)(F)* 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 125000001792 phenanthrenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C=CC12)* 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- NHKJPPKXDNZFBJ-UHFFFAOYSA-N phenyllithium Chemical compound [Li]C1=CC=CC=C1 NHKJPPKXDNZFBJ-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 125000004193 piperazinyl group Chemical group 0.000 description 1
- RDNZDMDLRIQQAX-UHFFFAOYSA-N piperidine-2,4-dione Chemical compound O=C1CCNC(=O)C1 RDNZDMDLRIQQAX-UHFFFAOYSA-N 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920003050 poly-cycloolefin Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- RPDAUEIUDPHABB-UHFFFAOYSA-N potassium ethoxide Chemical compound [K+].CC[O-] RPDAUEIUDPHABB-UHFFFAOYSA-N 0.000 description 1
- NTTOTNSKUYCDAV-UHFFFAOYSA-N potassium hydride Chemical compound [KH] NTTOTNSKUYCDAV-UHFFFAOYSA-N 0.000 description 1
- 229910000105 potassium hydride Inorganic materials 0.000 description 1
- BDAWXSQJJCIFIK-UHFFFAOYSA-N potassium methoxide Chemical compound [K+].[O-]C BDAWXSQJJCIFIK-UHFFFAOYSA-N 0.000 description 1
- LPNYRYFBWFDTMA-UHFFFAOYSA-N potassium tert-butoxide Chemical compound [K+].CC(C)(C)[O-] LPNYRYFBWFDTMA-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- BESQLCCRQYTQQI-UHFFFAOYSA-N propan-2-yl 2-cyanoacetate Chemical compound CC(C)OC(=O)CC#N BESQLCCRQYTQQI-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- NLFIMXLLXGTDME-UHFFFAOYSA-N propyl 2-cyanoacetate Chemical compound CCCOC(=O)CC#N NLFIMXLLXGTDME-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004742 propyloxycarbonyl group Chemical group 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 125000001725 pyrenyl group Chemical group 0.000 description 1
- 125000000719 pyrrolidinyl group Chemical group 0.000 description 1
- 125000000168 pyrrolyl group Chemical group 0.000 description 1
- 125000002943 quinolinyl group Chemical group N1=C(C=CC2=CC=CC=C12)* 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229910001419 rubidium ion Inorganic materials 0.000 description 1
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 1
- 229940081974 saccharin Drugs 0.000 description 1
- 235000019204 saccharin Nutrition 0.000 description 1
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 1
- 239000005336 safety glass Substances 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- 239000012363 selectfluor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000002453 shampoo Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- QDRKDTQENPPHOJ-UHFFFAOYSA-N sodium ethoxide Chemical compound [Na+].CC[O-] QDRKDTQENPPHOJ-UHFFFAOYSA-N 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- WBQTXTBONIWRGK-UHFFFAOYSA-N sodium;propan-2-olate Chemical compound [Na+].CC(C)[O-] WBQTXTBONIWRGK-UHFFFAOYSA-N 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910001427 strontium ion Inorganic materials 0.000 description 1
- 239000011145 styrene acrylonitrile resin Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical group O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- YBBRCQOCSYXUOC-UHFFFAOYSA-N sulfuryl dichloride Chemical compound ClS(Cl)(=O)=O YBBRCQOCSYXUOC-UHFFFAOYSA-N 0.000 description 1
- 230000000475 sunscreen effect Effects 0.000 description 1
- 239000000516 sunscreening agent Substances 0.000 description 1
- BFNYNEMRWHFIMR-UHFFFAOYSA-N tert-butyl 2-cyanoacetate Chemical compound CC(C)(C)OC(=O)CC#N BFNYNEMRWHFIMR-UHFFFAOYSA-N 0.000 description 1
- FAGLEPBREOXSAC-UHFFFAOYSA-N tert-butyl isocyanide Chemical compound CC(C)(C)[N+]#[C-] FAGLEPBREOXSAC-UHFFFAOYSA-N 0.000 description 1
- DZLFLBLQUQXARW-UHFFFAOYSA-N tetrabutylammonium Chemical compound CCCC[N+](CCCC)(CCCC)CCCC DZLFLBLQUQXARW-UHFFFAOYSA-N 0.000 description 1
- IFLREYGFSNHWGE-UHFFFAOYSA-N tetracene Chemical compound C1=CC=CC2=CC3=CC4=CC=CC=C4C=C3C=C21 IFLREYGFSNHWGE-UHFFFAOYSA-N 0.000 description 1
- 229950011008 tetrachloroethylene Drugs 0.000 description 1
- DTIFFPXSSXFQCJ-UHFFFAOYSA-N tetrahexylazanium Chemical compound CCCCCC[N+](CCCCCC)(CCCCCC)CCCCCC DTIFFPXSSXFQCJ-UHFFFAOYSA-N 0.000 description 1
- CHYBTAZWINMGHA-UHFFFAOYSA-N tetraoctylazanium Chemical compound CCCCCCCC[N+](CCCCCCCC)(CCCCCCCC)CCCCCCCC CHYBTAZWINMGHA-UHFFFAOYSA-N 0.000 description 1
- KTQYWNARBMKMCX-UHFFFAOYSA-N tetraphenylene Chemical group C1=CC=C2C3=CC=CC=C3C3=CC=CC=C3C3=CC=CC=C3C2=C1 KTQYWNARBMKMCX-UHFFFAOYSA-N 0.000 description 1
- OSBSFAARYOCBHB-UHFFFAOYSA-N tetrapropylammonium Chemical compound CCC[N+](CCC)(CCC)CCC OSBSFAARYOCBHB-UHFFFAOYSA-N 0.000 description 1
- 125000004001 thioalkyl group Chemical group 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- CFOAUYCPAUGDFF-UHFFFAOYSA-N tosmic Chemical compound CC1=CC=C(S(=O)(=O)C[N+]#[C-])C=C1 CFOAUYCPAUGDFF-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- ISLMUNSNHGLMCV-UHFFFAOYSA-N tributyl(2-methoxyethyl)phosphanium Chemical compound CCCC[P+](CCCC)(CCCC)CCOC ISLMUNSNHGLMCV-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- NFRBUOMQJKUACC-UHFFFAOYSA-N triethyl(pentyl)azanium Chemical compound CCCCC[N+](CC)(CC)CC NFRBUOMQJKUACC-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- 125000005034 trifluormethylthio group Chemical group FC(S*)(F)F 0.000 description 1
- NJKNTCJZOHYIIM-UHFFFAOYSA-N trifluoromethylsulfonylformonitrile Chemical compound FC(F)(F)S(=O)(=O)C#N NJKNTCJZOHYIIM-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- OLFPYUPGPBITMH-UHFFFAOYSA-N tritylium Chemical compound C1=CC=CC=C1[C+](C=1C=CC=CC=1)C1=CC=CC=C1 OLFPYUPGPBITMH-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C253/00—Preparation of carboxylic acid nitriles
- C07C253/30—Preparation of carboxylic acid nitriles by reactions not involving the formation of cyano groups
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C255/00—Carboxylic acid nitriles
- C07C255/01—Carboxylic acid nitriles having cyano groups bound to acyclic carbon atoms
- C07C255/31—Carboxylic acid nitriles having cyano groups bound to acyclic carbon atoms having cyano groups bound to acyclic carbon atoms of a carbon skeleton containing rings other than six-membered aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C255/00—Carboxylic acid nitriles
- C07C255/45—Carboxylic acid nitriles having cyano groups bound to carbon atoms of rings other than six-membered aromatic rings
- C07C255/47—Carboxylic acid nitriles having cyano groups bound to carbon atoms of rings other than six-membered aromatic rings to carbon atoms of rings being part of condensed ring systems
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C319/00—Preparation of thiols, sulfides, hydropolysulfides or polysulfides
- C07C319/14—Preparation of thiols, sulfides, hydropolysulfides or polysulfides of sulfides
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C321/00—Thiols, sulfides, hydropolysulfides or polysulfides
- C07C321/22—Thiols, sulfides, hydropolysulfides, or polysulfides having thio groups bound to carbon atoms of rings other than six-membered aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Nitrogen Condensed Heterocyclic Rings (AREA)
Abstract
Description
本發明係關於化合物。 The present invention relates to compounds.
吸收可見光之光之色素化合物係以物體著色、特定波長之光之穿透或吸收等目的,於纖維、墨水、塗料、容器、包材、印刷物、光學物品、眼鏡、顯示裝置等廣泛用途中使用。就色素化合物之重要特性而言,可列舉選擇吸收性(吸收光譜之銳度)及耐久性(尤其是耐光性)。於色素化合物之中,從藉由控制聚次甲基骨架中之次甲基碳數,而可控制從波長380nm以下之紫外線區域至波長780nm以上之近紅外線區域顯示廣泛圍之最大吸收之波長之點或花青素大多顯示較高之選擇吸收性之點而言,花青素係被廣泛地使用(例如美國專利第6004536號說明書(專利文獻1))。 Pigment compounds that absorb visible light are used for the purpose of coloring objects, penetrating or absorbing light of specific wavelengths, etc., and are used in a wide range of applications such as fibers, inks, paints, containers, packaging materials, printed materials, optical articles, glasses, and display devices. . As important characteristics of a pigment compound, selective absorption (sharpness of absorption spectrum) and durability (especially light fastness) can be cited. Among the pigment compounds, by controlling the number of methine carbons in the polymethine skeleton, it is possible to control the wavelength of the maximum absorption in a wide range from the ultraviolet region with a wavelength of 380 nm or less to the near-infrared region with a wavelength of 780 nm or more Anthocyanins are widely used for dots or dots in which many anthocyanins show high selective absorption (for example, US Pat. No. 6,004,536 specification (Patent Document 1)).
[先前技術文獻] [Prior Art Literature]
[專利文獻1]美國專利第6004536號說明書 [Patent Document 1] Specification of US Patent No. 6004536
惟,花青素雖具有高選擇吸收性,但是大多為耐久性(尤其是耐光性)差者,因而尋求高選擇吸收性及耐久性兩者兼具之化合物。 However, although anthocyanins have high selective absorption, most of them are poor in durability (especially light fastness), so compounds with both high selective absorption and durability are sought.
本發明包含以下之發明。 The present invention includes the following inventions.
[1]一種化合物,係具有下述式(I)表示之陰離子。 [1] A compound having an anion represented by the following formula (I).
環W2表示具有將至少1個雙鍵作為環之構成要件之環,環W2可具有取代基; The ring W2 represents a ring having at least one double bond as a constituent element of the ring, and the ring W2 may have a substituent ;
R1及R2各自獨立地表示氫原子或1價之取代基,R1及R2至少一者具有1價之取代基; R 1 and R 2 each independently represent a hydrogen atom or a monovalent substituent, and at least one of R 1 and R 2 has a monovalent substituent;
R3、R4、R5及R6各自獨立地表示氫原子或1價之取代基; R 3 , R 4 , R 5 and R 6 each independently represent a hydrogen atom or a monovalent substituent;
R1與R4可相互地連結並形成環; R 1 and R 4 can be linked to each other and form a ring;
R3與R4可相互地連結並形成環; R 3 and R 4 can be connected to each other and form a ring;
R2與R6可相互地連結並形成環; R 2 and R 6 can be connected to each other and form a ring;
R5與R6可相互地連結並形成環] R 5 and R 6 may be linked to each other and form a ring]
[2]如[1]所述之化合物,其中,選自R1及R2中之至少1個為電子吸引基(electron attractive group)。 [2] The compound according to [1], wherein at least one selected from R 1 and R 2 is an electron attractive group.
[3]如[2]所述之化合物,其中,選自R1及R2中之至少1個為氰基、硝基、鹵化烷基、鹵化芳基、-CO-R1、-CO-O-R2、-CO-NR3R3z、-CO-S-R4、-CS-R5、-CS-O-R6、-CS-S-R7、-SO-R8、-SO2-R9(R1、R2、R3、R3z、R4、R5、R6、R7、R8及R9各自獨立地 表示可具有取代基之烴基或鹵素原子)、-OCF3、-SCF3、-SF5、-SF3、-SO2H或-SO3H。 [3] The compound according to [2], wherein at least one selected from R 1 and R 2 is cyano, nitro, halogenated alkyl, halogenated aryl, -CO-R 1 , -CO- OR 2 , -CO-NR 3 R 3z , -CO-SR 4 , -CS-R 5 , -CS-OR 6 , -CS-SR 7 , -SO-R 8 , -SO 2 -R 9 (R 1 , R 2 , R 3 , R 3z , R 4 , R 5 , R 6 , R 7 , R 8 and R 9 each independently represent a hydrocarbon group which may have a substituent or a halogen atom), -OCF 3 , -SCF 3 , -SF 5 , -SF 3 , -SO 2 H or -SO 3 H.
[4]如[1]至[3]中任一項所述之化合物,其中,選自R3、R4、R5及R6中之至少1個為電子吸引基。 [4] The compound according to any one of [1] to [3], wherein at least one selected from R 3 , R 4 , R 5 and R 6 is an electron-attracting group.
[5]如[1]至[4]中任一項所述之化合物,其中,R3、R4、R5及R6各自獨立地為電子吸引基。 [5] The compound according to any one of [1] to [4], wherein R 3 , R 4 , R 5 and R 6 are each independently an electron-attracting group.
[6]如[5]所述之化合物,其中,選自R3、R4、R5及R6中之至少1個為氰基、硝基、鹵化烷基、鹵化芳基、-CO-R1、-CO-O-R2、-CO-NR3R3z、-CO-S-R4、-CS-R5、-CS-O-R6、-CS-S-R7、-SO-R8、-SO2-R9(R1、R2、R3、R3z、R4、R5、R6、R7、R8及R9各自獨立地表示可具有取代基之烴基或鹵素原子)、-OCF3、-SCF3、-SF5、-SF3、-SO2H或-SO3H。 [6] The compound as described in [5], wherein at least one selected from R 3 , R 4 , R 5 and R 6 is cyano, nitro, halogenated alkyl, halogenated aryl, -CO- R 1 , -CO-OR 2 , -CO-NR 3 R 3z , -CO-SR 4 , -CS-R 5 , -CS-OR 6 , -CS-SR 7 , -SO-R 8 , -SO 2 -R 9 (R 1 , R 2 , R 3 , R 3z , R 4 , R 5 , R 6 , R 7 , R 8 and R 9 each independently represent a hydrocarbon group that may have a substituent or a halogen atom), -OCF 3. -SCF 3 , -SF 5 , -SF 3 , -SO 2 H or -SO 3 H.
[7]如[1]至[6]中任一項所述之化合物,係於波長400nm至700nm之間顯示最大吸收。 [7] The compound according to any one of [1] to [6], which exhibits maximum absorption at a wavelength of 400 nm to 700 nm.
[8]如[1]至[7]中任一項所述之化合物,其中,於最大吸收波長之克吸光係數為50[L/(g‧cm)]以上。 [8] The compound according to any one of [1] to [7], wherein the gram absorption coefficient at the maximum absorption wavelength is 50 [L/(g·cm)] or more.
[9]一種樹脂組成物,係含有[1]至[8]中任一項所述之化合物及樹脂。 [9] A resin composition comprising the compound described in any one of [1] to [8] and a resin.
[10]一種組成物,係含有[1]至[8]中任一項所述之化合物及聚合性單體。 [10] A composition comprising the compound described in any one of [1] to [8] and a polymerizable monomer.
[11]一種成形體,係由[9]所述之樹脂組成物或申請專利範圍第10項所述之組成物成形者。 [11] A molded body formed from the resin composition described in [9] or the composition described in claim 10.
[12]一種光學層,係由[9]所述之樹脂組成物或申請專利範圍第10項所述之組成物組成者。 [12] An optical layer composed of the resin composition described in [9] or the composition described in claim 10.
[13]一種光學積層體,係含有[12]所述之光學層。 [13] An optical laminate comprising the optical layer described in [12].
[14]一種影像顯示裝置,係含有[13]所述之光學積層體。 [14] An image display device comprising the optical laminate described in [13].
[15]一種具有式(I)表示之陰離子之化合物之製造方法,係包含使式(M-A)表示之化合物與式(b-3)表示之化合物進行反應之步驟。 [15] A method for producing a compound having an anion represented by formula (I), comprising the step of reacting a compound represented by formula (M-A) with a compound represented by formula (b-3).
環W2表示具有將至少1個雙鍵作為環之構成要件之環,環W2可具有取代基; The ring W2 represents a ring having at least one double bond as a constituent element of the ring, and the ring W2 may have a substituent ;
R1及R2各自獨立地表示氫原子或1價之取代基,R1及R2至少一者具有1價之取代基; R 1 and R 2 each independently represent a hydrogen atom or a monovalent substituent, and at least one of R 1 and R 2 has a monovalent substituent;
R3及R4各自獨立地表示氫原子或1價之取代基; R 3 and R 4 each independently represent a hydrogen atom or a monovalent substituent;
R1與R4可相互地連結並形成環; R 1 and R 4 can be linked to each other and form a ring;
R3與R4可相互地連結並形成環;] R 3 and R 4 can be linked to each other and form a ring;]
X2表示2價連結基] X 2 represents a divalent linking group]
[16]如[15]中所述之製造方法,係更包含於催化劑存在下,使式(M)表示之化合物與式(b-2)表示之化合物進行反應,獲得式(M-A)表示之化合物之步驟。 [16] The production method described in [15] further comprises reacting the compound represented by the formula (M) with the compound represented by the formula (b-2) in the presence of a catalyst to obtain the compound represented by the formula (M-A). compound steps.
X1表示2價之連結基] X 1 represents a 2-valent linking group]
[17]一種具有式(I)表示之陰離子之化合物之製造方法,係將選自式(M1-2)表示之化合物及式(M1-3)表示之化合物中之至少一種之化合物與具有式(M1-1)表示之陰離子之化合物進行反應之步驟。 [17] A method for producing an anion compound represented by formula (I), comprising combining at least one compound selected from the compound represented by formula (M1-2) and the compound represented by formula (M1-3) with the compound represented by formula The step of reacting the anionic compound represented by (M1-1).
R2'───E1 (M1-2)[式(M1-2)中,R2’表示1價之取代基,E1表示脫離基] R 2' ─── E 1 (M1-2) [In the formula (M1-2), R 2' represents a monovalent substituent, E 1 represents a leaving group]
R1'───E2 (M1-3)[式(M1-3)中,R1’表示1價之取代基,E2表示脫離基] R 1' ─── E 2 (M1-3) [In the formula (M1-3), R 1' represents a monovalent substituent, and E 2 represents a leaving group]
環W2表示具有將至少1個雙鍵作為環之構成要件之環,環W2可具有取代基; The ring W2 represents a ring having at least one double bond as a constituent element of the ring, and the ring W2 may have a substituent ;
R3、R4、R5及R6各自獨立地表示氫原子或1價之取代基; R 3 , R 4 , R 5 and R 6 each independently represent a hydrogen atom or a monovalent substituent;
R3與R4可相互地連結並形成環; R 3 and R 4 can be connected to each other and form a ring;
R5與R6可相互地連結並形成環;] R 5 and R 6 can be connected to each other and form a ring;]
R1及R2各自獨立地表示氫原子或1價之取代基,R1及R2至少一者具有1價之取代基] R 1 and R 2 each independently represent a hydrogen atom or a monovalent substituent, and at least one of R 1 and R 2 has a monovalent substituent]
[18]一種式(M)表示之化合物。 [18] A compound represented by formula (M).
環W2表示具有將至少1個雙鍵作為環之構成要件之環,環W2可具有取代基; The ring W2 represents a ring having at least one double bond as a constituent element of the ring, and the ring W2 may have a substituent ;
R1及R2各自獨立地表示氫原子或1價之取代基,R1及R2至少一者具有1價之取代基;] R 1 and R 2 each independently represent a hydrogen atom or a monovalent substituent, and at least one of R 1 and R 2 has a monovalent substituent;]
[19]一種式(M-A)表示之化合物。 [19] A compound represented by the formula (M-A).
環W2表示具有將至少1個雙鍵作為環之構成要件之環,環W2可具有取代基; The ring W2 represents a ring having at least one double bond as a constituent element of the ring, and the ring W2 may have a substituent ;
R1及R2各自獨立地表示氫原子或1價之取代基,R1及R2至少一者具有1價之 取代基; R 1 and R 2 each independently represent a hydrogen atom or a monovalent substituent, and at least one of R 1 and R 2 has a monovalent substituent;
R3及R4各自獨立地表示氫原子或1價之取代基; R 3 and R 4 each independently represent a hydrogen atom or a monovalent substituent;
R1與R4可相互地連結並形成環; R 1 and R 4 can be linked to each other and form a ring;
R3與R4可相互地連結並形成環;] R 3 and R 4 can be linked to each other and form a ring;]
本發明之目的係提供一種於可見光區域(波長400nm至波長750nm,較佳為波長450至波長600nm)中,對於最大吸收波長附近之光顯示良好選擇吸收性且具有良好耐光性之新穎化合物。 The object of the present invention is to provide a novel compound that shows good selective absorption for light near the maximum absorption wavelength and has good light resistance in the visible light region (wavelength 400nm to wavelength 750nm, preferably wavelength 450 to 600nm).
本發明之化合物為具有式(I)表示之陰離子之化合物(以下,亦稱為化合物(I))。 The compound of the present invention is a compound having an anion represented by formula (I) (hereinafter also referred to as compound (I)).
環W2表示具有將至少1個雙鍵作為環之構成要件之環,環W2可具有取代基; The ring W2 represents a ring having at least one double bond as a constituent element of the ring, and the ring W2 may have a substituent ;
R1及R2各自獨立地表示氫原子或1價之取代基,R1及R2至少一者具有1價之取代基; R 1 and R 2 each independently represent a hydrogen atom or a monovalent substituent, and at least one of R 1 and R 2 has a monovalent substituent;
R3、R4、R5及R6各自獨立地表示氫原子或1價之取代基; R 3 , R 4 , R 5 and R 6 each independently represent a hydrogen atom or a monovalent substituent;
R1與R4可相互地連結並形成環; R 1 and R 4 can be linked to each other and form a ring;
R3與R4可相互地連結並形成環; R 3 and R 4 can be connected to each other and form a ring;
R2與R6可相互地連結並形成環; R 2 and R 6 can be connected to each other and form a ring;
R5與R6可相互地連結並形成環;] R 5 and R 6 can be connected to each other and form a ring;]
<陰離子> <anion>
式(I)表示之陰離子亦包含所有如下述所示之共振結構。 The anions represented by the formula (I) also include all resonance structures as shown below.
又,根據R3、R4、R5及R6表示之1價取代基之種類,亦存在電子之非定域化擴及至R3、R4、R5及R6者。例如,電子之非定域化擴及至如下述之R3、R4、R5及R6表示之1價取代基時,其共振結構亦包含於式(I)表示之陰離子。 Also, depending on the types of monovalent substituents represented by R 3 , R 4 , R 5 and R 6 , electron delocalization may extend to R 3 , R 4 , R 5 and R 6 . For example, when delocalization of electrons extends to monovalent substituents represented by R 3 , R 4 , R 5 and R 6 below, the resonance structure is also included in the anion represented by formula (I).
環W1之環結構無特別限定。環W1可為單環,亦可為稠環。 The ring structure of ring W1 is not particularly limited. Ring W1 may be a single ring or a condensed ring.
環W1可為含有雜原子(例如氧原子、硫原子、氮原子等)作為環的構成要件之雜環,亦可為由碳原子及氫原子組成之烴環。環W1較佳為由烴組成之環。環W1 可為未具有芳香族性之環(脂肪族環),亦可為芳香環,惟,較佳為脂肪族環。若為未具有芳香族性之環,可更提高選擇吸收性。 The ring W1 may be a heterocyclic ring containing a heteroatom (such as an oxygen atom, a sulfur atom, a nitrogen atom, etc.) as a constituent element of the ring, or may be a hydrocarbon ring composed of carbon atoms and hydrogen atoms. Ring W 1 is preferably a ring composed of hydrocarbons. The ring W 1 may be a non-aromatic ring (aliphatic ring) or an aromatic ring, but is preferably an aliphatic ring. If it is a non-aromatic ring, the selective absorption can be further improved.
環W1較佳為3員環至20員環之環結構,更佳為3員環至12員環,較佳為4員環至6員環。 Ring W 1 is preferably a ring structure of 3-20-membered rings, more preferably 3-12-membered rings, more preferably 4-6-membered rings.
環W1較佳為單環。 Ring W 1 is preferably a monocyclic ring.
環W2表示具有至少1個雙鍵作為環的構成要件之環結構。環W2具有1個以上之雙鍵作為環的構成要件,惟環W2所含有之雙鍵通常為1至4,較佳為1至3,更佳為1或2,再更佳為1個。 Ring W 2 represents a ring structure having at least one double bond as a constituent element of the ring. Ring W2 has at least one double bond as a constituent element of the ring, but the double bond contained in ring W2 is usually 1 to 4, preferably 1 to 3, more preferably 1 or 2, and even more preferably 1 indivual.
環W2可為單環,亦可為多環。環W2可為芳香環,亦可為未具有芳香族性之環(脂肪族環),較佳為未具有芳香族性之環。若為未具有芳香族性之環,可更提高選擇吸收性。 Ring W 2 may be monocyclic or polycyclic. The ring W 2 may be an aromatic ring or a non-aromatic ring (aliphatic ring), preferably a non-aromatic ring. If it is a non-aromatic ring, the selective absorption can be further improved.
環W2可為含有雜原子(例如氮原子、氧原子、硫原子等)之雜環,亦可為由烴組成之環。環W2較佳為由烴組成之環。 The ring W 2 may be a heterocycle containing a heteroatom (such as a nitrogen atom, an oxygen atom, a sulfur atom, etc.), or a ring composed of hydrocarbons. Ring W 2 is preferably a ring composed of hydrocarbons.
環W2較佳為3員環至20員環之環結構,更佳為3員環至12員環,較佳為4員環至6員環。 Ring W 2 is preferably a ring structure of 3-20-membered rings, more preferably 3-12-membered rings, more preferably 4-6-membered rings.
環W1與環W2形成稠環。於環W1及環W2形成之稠環較佳為脂肪族烴之稠環,更佳為碳數6至40之脂肪族烴之稠環。 Ring W 1 and ring W 2 form a condensed ring. The condensed ring formed in ring W 1 and ring W 2 is preferably a condensed ring of an aliphatic hydrocarbon, more preferably a condensed ring of an aliphatic hydrocarbon having 6 to 40 carbon atoms.
以環W1及環W2形成之稠環可列舉例如下述之式(W1-1)至式(W1-19)表示之環等。又,以環W1及環W2形成之稠環亦包含所有上述之陰離子電荷非定域化之結構。 Examples of the condensed ring formed by the ring W 1 and the ring W 2 include rings represented by the following formula (W 1 -1) to formula (W 1 -19). In addition, the condensed ring formed by the ring W 1 and the ring W 2 also includes all the above-mentioned anionic charge delocalized structures.
環W1及環W2可各自獨立地具有取代基。該取代基可列舉:氟原子、氯原子、溴原子、碘原子等鹵素原子;甲基、乙基、丙基、正丁基、異丁基、第三丁基、戊基、己基、庚基、辛基、壬基、癸基、2-乙基己基、4-丁基辛基、乙烯基、丙烯基、丁烯基、戊烯基、乙炔基、丙炔基、烯丙基、環己烯基、丁二烯基等碳數1至25之脂肪族烴基(較佳為碳數1至12之烷基);氟甲基、二氟甲基、三氟甲基、2-氟乙基、2,2-二氟乙基、2,2,2-三氟乙基、1,1,2,2-四氟乙基、1,1,2,2,2-五氟乙基、九氟丁基等碳數1至25之鹵化烷基;甲氧基、乙氧基、丙氧基、異丙氧基、丁氧基、第三丁氧基、戊基氧基、己基氧基、2-乙基己基氧基、4-丁基辛基氧基等碳數1至25之烷氧基;甲硫基、乙硫基、丙硫基、丁硫基、戊硫基、己硫基等碳數1至12之烷基硫基;單氟甲氧基、二氟甲氧基、三氟甲氧基、2-氟乙氧基、1,1,2,2,2-五氟乙氧基、六氟異丙氧基等碳數1至12之氟化烷氧基;三氟甲 烷硫代烷氧基等碳數1至12之氟化烷氧基;胺基、甲胺基、乙胺基、二甲胺基、二乙胺基、二苯胺基、哌啶基、吡咯啶基、甲基乙胺基等可經1個或2個碳數1至25之烴基取代之胺基;胺基甲醯基、N-甲胺基甲醯基、N,N-二甲胺基甲醯基等N-位可經碳數1至6之烷基取代之胺基甲醯基;甲基羰基氧基、乙基羰基氧基等碳數2至12之烷基羰基氧基;甲磺醯基、乙磺醯基等碳數1至12之烷基磺醯基;苯基、萘基、聯苯基、蒽基等碳數6至25之芳香族烴基(較佳為碳數6至18之芳基);苯磺醯基等碳數6至12之芳基磺醯基;甲氧基磺醯基、乙氧基磺醯基等碳數1至12之烷氧基磺醯基;三氟甲磺醯基、五氟乙磺醯基、三氟乙磺醯基等碳數1至12之氟烷基磺醯基;乙醯基、乙基羰基等碳數2至12之醯基;醛基;甲氧基羰基、乙氧基羰基、丙氧基羰基、丁基氧基羰基等碳數2至12之烷氧基羰基;甲氧基硫代羰基、乙氧基硫代羰基等碳數2至12之烷氧基硫代羰基;氰基;硝基;羥基;硫醇基;磺基;胺基甲醯基;羧基;-SF3;-SF5等。 Ring W1 and ring W2 may each independently have a substituent. Examples of the substituent include halogen atoms such as fluorine atom, chlorine atom, bromine atom, and iodine atom; methyl, ethyl, propyl, n-butyl, isobutyl, tert-butyl, pentyl, hexyl, heptyl , octyl, nonyl, decyl, 2-ethylhexyl, 4-butyloctyl, vinyl, propenyl, butenyl, pentenyl, ethynyl, propynyl, allyl, cyclohexyl Alkenyl, butadienyl and other aliphatic hydrocarbon groups with 1 to 25 carbons (preferably alkyl with 1 to 12 carbons); fluoromethyl, difluoromethyl, trifluoromethyl, 2-fluoroethyl , 2,2-difluoroethyl, 2,2,2-trifluoroethyl, 1,1,2,2-tetrafluoroethyl, 1,1,2,2,2-pentafluoroethyl, nine Alkyl halides with 1 to 25 carbons such as fluorobutyl; methoxy, ethoxy, propoxy, isopropoxy, butoxy, tert-butoxy, pentyloxy, hexyloxy, 2-ethylhexyloxy, 4-butyloctyloxy and other alkoxy groups with 1 to 25 carbons; methylthio, ethylthio, propylthio, butylthio, pentylthio, hexylthio Alkylthio groups with 1 to 12 carbon atoms; monofluoromethoxy, difluoromethoxy, trifluoromethoxy, 2-fluoroethoxy, 1,1,2,2,2-pentafluoroethyl Fluorinated alkoxy groups with 1 to 12 carbons such as oxy and hexafluoroisopropoxy; fluorinated alkoxy groups with 1 to 12 carbons such as trifluoromethanethioalkoxy; amino group, methylamino group, Ethylamino, dimethylamino, diethylamino, diphenylamino, piperidinyl, pyrrolidinyl, methylethylamino, etc., which may be substituted by one or two hydrocarbon groups with 1 to 25 carbons ; Aminoformyl, N-methylaminoformyl, N,N-dimethylaminoformyl, and other aminoformyl groups whose N-position can be substituted by an alkyl group with 1 to 6 carbons; Alkylcarbonyloxy groups with 2 to 12 carbons such as methylcarbonyloxy and ethylcarbonyloxy; alkylsulfonyl groups with 1 to 12 carbons such as methylsulfonyl and ethylsulfonyl; phenyl and naphthyl , biphenyl, anthracenyl and other aromatic hydrocarbon groups with 6 to 25 carbons (preferably aryl with 6 to 18 carbons); arylsulfonyl with 6 to 12 carbons such as benzenesulfonyl; methoxy Alkoxysulfonyl groups with 1 to 12 carbon atoms such as sulfonyl and ethoxysulfonyl groups; trifluoromethylsulfonyl, pentafluoroethanesulfonyl, and trifluoroethanesulfonyl groups with 1 to 12 carbon atoms 12-fluoroalkylsulfonyl; acetyl, ethylcarbonyl and other acyl groups with 2 to 12 carbons; aldehyde groups; methoxycarbonyl, ethoxycarbonyl, propoxycarbonyl, butyloxycarbonyl, etc. Alkoxycarbonyl with 2 to 12 carbons; alkoxythiocarbonyl with 2 to 12 carbons such as methoxythiocarbonyl and ethoxythiocarbonyl; cyano; nitro; hydroxyl; thiol; Sulfonyl; Aminoformyl; Carboxyl; -SF 3 ; -SF 5 etc.
由環W1及環W2形成之稠環亦可具有取代基,該取代基可列舉環W1或環W2可具有之取代基。 The condensed ring formed by the ring W1 and the ring W2 may have a substituent, and examples of the substituent include substituents that the ring W1 or the ring W2 may have.
R1及R2各自獨立地表示氫原子或1價之取代基,選自R1及R2中之至少1個為1價取代基。 R 1 and R 2 each independently represent a hydrogen atom or a monovalent substituent, and at least one selected from R 1 and R 2 is a monovalent substituent.
R1及R2表示之1價取代基只要不是氫原子則無特別限定,可列舉例如1價之脂肪族烴基、1價之芳香族烴基、電子吸引基、電子供給基、雜環基、具有聚氧基伸烷基之基等。 The monovalent substituent represented by R1 and R2 is not particularly limited as long as it is not a hydrogen atom, and examples thereof include a monovalent aliphatic hydrocarbon group, a monovalent aromatic hydrocarbon group, an electron-attracting group, an electron-donating group, a heterocyclic group, a The base of polyoxyalkylene, etc.
R1及R2表示之1價脂肪族烴基可列舉:甲基、乙基、正丙基、異丙基、正丁基、第三丁基、第二丁基、正戊基、異戊基、正己基、異己基、正辛基、異辛基、正壬基、異壬基、正癸基、異癸基、正十二烷基、異十二烷基、十一烷 基、月桂基、肉豆蔻基、鯨蠟基、硬脂醯基、2-乙基己基、4-丁基辛基等碳數1至25之直鏈或支鏈烷基:環丙基、環丁基、環戊基、環己基等碳數3至25之環烷基;環己基甲基等碳數4至25之環烷基烷基:異冰片基等碳數4至25之烷基環烷基;乙烯基、丙烯基、丁烯基、戊烯基、乙炔基、丙炔基、烯丙基、環己烯基、丁二烯基等不飽和脂肪族烴基。較佳為碳數1至12之直鏈或支鏈烷基。 The monovalent aliphatic hydrocarbon groups represented by R1 and R2 include: methyl, ethyl, n -propyl, isopropyl, n-butyl, tert-butyl, second-butyl, n-pentyl, isopentyl , n-hexyl, isohexyl, n-octyl, isooctyl, n-nonyl, isononyl, n-decyl, isodecyl, n-dodecyl, isododecyl, undecyl, lauryl , myristyl, cetyl, stearyl, 2-ethylhexyl, 4-butyloctyl and other straight-chain or branched-chain alkyl groups with 1 to 25 carbons: cyclopropyl, cyclobutyl, cyclo Cycloalkyl with 3 to 25 carbons such as pentyl and cyclohexyl; cycloalkyl with 4 to 25 carbons such as cyclohexylmethyl; alkylcycloalkyl with 4 to 25 carbons such as isobornyl; ethylene unsaturated aliphatic hydrocarbon groups such as propenyl, butenyl, pentenyl, ethynyl, propynyl, allyl, cyclohexenyl, butadienyl, etc. It is preferably a straight-chain or branched-chain alkyl group having 1 to 12 carbon atoms.
R1及R2表示之1價芳香族烴基可列舉:苯基、萘基、蒽基、并四苯基、并五苯基、菲基、屈基(chrysenyl)、三鄰亞苯基、四苯基、芘基、苝基、暈苯基、聯苯基等碳數6至18之芳基;苯甲基、苯乙基、萘甲基等碳數7至18之芳烷基;苯氧基乙基、苯氧基二甘醇基、苯氧基聚伸烷基二醇基之芳基烷氧基等,較佳為碳數6至18之芳基,為苯基或苯甲基。 The monovalent aromatic hydrocarbon groups represented by R1 and R2 can be exemplified: phenyl, naphthyl, anthracenyl, naphthacene, pentacene, phenanthrenyl, chrysenyl , tri-o-phenylene, tetraphenylene, Aryl groups with 6 to 18 carbons such as phenyl, pyrenyl, perylene, coronene phenyl, and biphenyl; aralkyl groups with 7 to 18 carbons such as benzyl, phenethyl, and naphthylmethyl; phenoxy Ethyl, phenoxydiethylene glycol, arylalkoxy of phenoxypolyalkylene glycol, etc., preferably aryl having 6 to 18 carbons, phenyl or benzyl.
R1及R2表示之電子供給基可列舉:羥基;甲氧基、乙氧基、丙氧基、丁氧基、戊基氧基、己基氧基、庚基氧基、辛基氧基、2-乙基己基氧基、4-丁基辛基氧基等碳數1至25之烷氧基;甲硫基、乙硫基、丙硫基、丁硫基、戊硫基、己硫基等碳數1至12之烷硫基;胺基、單甲胺基、單乙胺基、二甲胺基、二乙胺基、甲基乙胺基等可經1個或2個碳數1至6之烷基取代之胺基等。 The electron donor groups represented by R1 and R2 can be listed as: hydroxyl; methoxy, ethoxy, propoxy, butoxy, pentyloxy, hexyloxy, heptyloxy, octyloxy, 2-ethylhexyloxy, 4-butyloctyloxy and other alkoxy groups with 1 to 25 carbons; methylthio, ethylthio, propylthio, butylthio, pentylthio, hexylthio Alkylthio groups with 1 to 12 carbons; amine, monomethylamino, monoethylamino, dimethylamino, diethylamino, methylethylamino, etc. can be modified by 1 or 2 carbons 1 Amino groups substituted with alkyl groups from 6 to 6, etc.
R1及R2表示之雜環基可列舉:吡咯啶環基、哌啶環基、吡咯啉環基、咪唑啶環基、咪唑啉環基、噁唑啉環基、噻唑啉環基、哌啶環基、嗎啉環基、六氫吡嗪環基、吲哚環基、異吲哚環基、喹啉環基、噻吩環基、吡咯環基、噻唑啉環基及呋喃環基、四氫呋喃環基等碳數4至20之脂肪族雜環基或碳數3至20之芳香族雜環基等等。 The heterocyclic group represented by R1 and R2 can include : pyrrolidine ring group, piperidine ring group, pyrroline ring group, imidazolidine ring group, imidazoline ring group, oxazoline ring group, thiazoline ring group, piperidine ring group Pyridine ring group, morpholine ring group, hexahydropyrazine ring group, indole ring group, isoindole ring group, quinoline ring group, thiophene ring group, pyrrole ring group, thiazoline ring group and furan ring group, tetrahydrofuran An aliphatic heterocyclic group having 4 to 20 carbon atoms or an aromatic heterocyclic group having 3 to 20 carbon atoms, such as a ring group.
R1及R2表示之具有聚氧基伸烷基之基為具有氧基乙烯基(-CH2CH2O-)、氧基丙基(-CH2CH2CH2O-)等之基。更具體而言,可列舉-(X11O)m-R11 表示之基(X11表示碳數1至6之伸烷基,R11表示可具有羥基之碳數1至6之烷基,m表示1至6之整數)等。 The group having a polyoxyalkylene group represented by R 1 and R 2 is a group having an oxyvinyl group (-CH 2 CH 2 O-), an oxypropyl group (-CH 2 CH 2 CH 2 O-) or the like. More specifically, a group represented by -(X 11 O)mR 11 (X 11 represents an alkylene group having 1 to 6 carbons, R 11 represents an alkyl group having 1 to 6 carbons which may have a hydroxyl group, m represents an integer from 1 to 6), etc.
R1及R2表示之電子吸引基可列舉例如:鹵素原子、硝基、氰基、羧基、鹵化烷基、鹵化芳基、-OCF3、-SCF3、-SF5、-SF3、-SO3H、-SO2H、式(z-1)表示之基。 The electron-attracting groups represented by R 1 and R 2 include, for example: halogen atoms, nitro groups, cyano groups, carboxyl groups, halogenated alkyl groups, halogenated aryl groups, -OCF 3 , -SCF 3 , -SF 5 , -SF 3 , - SO 3 H, -SO 2 H, and a group represented by the formula (z-1).
*-X1-R222 (z-1)[式(z-1)中,R222表示氫原子、鹵素原子、可具有取代基之烴基、具有聚氧基伸烷基之基; *-X 1 -R 222 (z-1)[In the formula (z-1), R 222 represents a hydrogen atom, a halogen atom, a hydrocarbon group that may have a substituent, or a group with a polyoxyalkylene group;
X1表示-CO-、-COO-、-OCO-、-CS-、-CSS-、-COS-、-CSO-、-SO2-、-NR223CO-或-CONR224-; X 1 represents -CO-, -COO-, -OCO-, -CS-, -CSS-, -COS-, -CSO-, -SO 2 -, -NR 223 CO- or -CONR 224 -;
R223及R224各自獨立地表示氫原子、碳數1至6之烷基或苯基; R 223 and R 224 each independently represent a hydrogen atom, an alkyl group with 1 to 6 carbons or a phenyl group;
*表示鍵結處] *Indicates a bond]
鹵素原子可列舉:氟原子、氯原子、溴原子、碘原子。 Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
鹵化烷基可列舉:三氟甲基、全氟乙基、全氟丙基、全氟異丙基、全氟丁基、全氟第二丁基、全氟第三丁基、全氟戊基、全氟己基、二氯甲基、溴甲基、碘甲基等碳數1至25之鹵化烷基。較佳為碳數1至12之鹵化烷基,更佳為碳數1至12之氟烷基,再更佳為碳數1至12之全氟烷基。 Examples of halogenated alkyl groups include: trifluoromethyl, perfluoroethyl, perfluoropropyl, perfluoroisopropyl, perfluorobutyl, perfluorosecond butyl, perfluorotertiary butyl, perfluoropentyl , perfluorohexyl, dichloromethyl, bromomethyl, iodomethyl and other halogenated alkyl groups with 1 to 25 carbons. Preferably it is a halogenated alkyl group having 1 to 12 carbons, more preferably a fluoroalkyl group having 1 to 12 carbons, still more preferably a perfluoroalkyl group having 1 to 12 carbons.
鹵化芳基可列舉:氟苯基、氯苯基、溴苯基等碳數6至18之鹵化芳基,較佳為碳數6至18之氟芳基,更佳為碳數6至12之全氟芳基,再更佳為五氟苯基。 Halogenated aryl groups include: fluorophenyl, chlorophenyl, bromophenyl and other halogenated aryl groups with 6 to 18 carbon atoms, preferably fluoroaryl groups with 6 to 18 carbon atoms, more preferably fluoroaryl groups with 6 to 12 carbon atoms Perfluoroaryl, still more preferably pentafluorophenyl.
X1較佳為-CO-、-COO-或-SO2-。 X 1 is preferably -CO-, -COO- or -SO 2 -.
R222表示之鹵素原子可列舉:氟原子、氯原子、溴原子、碘原子。 The halogen atom represented by R222 includes fluorine atom, chlorine atom, bromine atom and iodine atom.
R222表示之烴基可列舉碳數1至25之脂肪族烴基或碳數6至18之芳香族烴基 等。 The hydrocarbon group represented by R222 includes an aliphatic hydrocarbon group with 1 to 25 carbon atoms or an aromatic hydrocarbon group with 6 to 18 carbon atoms.
碳數1至25之脂肪族烴基可列舉:甲基、乙基、正丙基、異丙基、正丁基、第三丁基、第二丁基、正戊基、正己基、1-甲基丁基、3-甲基丁基、正辛基、正癸基、2-己基辛基、4-丁基辛基、環己基等直鏈、支鏈狀、環狀之碳數1至25之烷基;乙烯基、丙烯基、丁烯基、戊烯基、乙炔基、丙炔基、烯丙基、環己烯基、丁二烯基等不飽和脂肪族烴基等,較佳為碳數1至12之烷基。 Examples of aliphatic hydrocarbon groups with carbon numbers from 1 to 25 include: methyl, ethyl, n-propyl, isopropyl, n-butyl, tert-butyl, second-butyl, n-pentyl, n-hexyl, 1-methyl butyl, 3-methylbutyl, n-octyl, n-decyl, 2-hexyl octyl, 4-butyl octyl, cyclohexyl, etc. straight chain, branched chain, cyclic carbon number 1 to 25 Alkyl; unsaturated aliphatic hydrocarbon groups such as vinyl, propenyl, butenyl, pentenyl, ethynyl, propynyl, allyl, cyclohexenyl, butadienyl, etc., preferably carbon Alkyl groups of numbers 1 to 12.
碳數6至18之芳香族烴基可列舉:苯基、萘基、蒽基、聯苯基等碳數6至18之芳基;苯甲基、苯乙基、萘甲基等碳數7至18之芳烷基等。 Aromatic hydrocarbon groups with 6 to 18 carbons include: aryl groups with 6 to 18 carbons such as phenyl, naphthyl, anthracenyl, and biphenyl; phenylmethyl, phenethyl, and naphthylmethyl with 7 to 18 carbons. Aralkyl groups of 18, etc.
R222表示之烴基可具有之取代基可列舉:鹵素原子、羥基、烷氧基、硫代烷基、二烷基胺基等。 The substituents that the hydrocarbon group represented by R222 may have include halogen atoms, hydroxyl groups, alkoxy groups, thioalkyl groups, dialkylamino groups, and the like.
R222表示之具有聚氧基伸烷基之基可列舉與R1表示之具有聚氧基伸烷基相同之基者。 The group having a polyoxyalkylene group represented by R 222 includes the same groups as those having a polyoxyalkylene group represented by R 1 .
R223及R224表示之碳數1至6之烷基可列舉:甲基、乙基、正丙基、異丙基、正丁基、第三丁基、第二丁基、正戊基、正己基、1-甲基丁基等直鏈或支鏈狀之碳數1至6之烷基。 R 223 and R 224 The alkyl groups with 1 to 6 carbons represented by: methyl, ethyl, n-propyl, isopropyl, n-butyl, tertiary butyl, second butyl, n-pentyl, straight-chain or branched-chain alkyl having 1 to 6 carbons, such as n-hexyl and 1-methylbutyl.
式(z-1)表示之基較佳為-CO-R1、-CO-O-R2、-CO-NR3R3z、-CO-S-R4、-CS-R5、-CS-O-R6、-CS-S-R7、-SO-R8、-SO2-R9(R1、R2、R3、R3z、R4、R5、R6、R7、R8及R9各自獨立地表示可具有取代基之烴基或鹵素原子), The group represented by formula (z-1) is preferably -CO-R 1 , -CO-OR 2 , -CO-NR 3 R 3z , -CO-SR 4 , -CS-R 5 , -CS-OR 6 , -CS-SR 7 , -SO-R 8 , -SO 2 -R 9 (R 1 , R 2 , R 3 , R 3z , R 4 , R 5 , R 6 , R 7 , R 8 and R 9 are independently means a hydrocarbon group or a halogen atom which may have a substituent),
更佳為-CO-R1、-CO-O-R2、-SO2-R9, More preferably -CO-R 1 , -CO-OR 2 , -SO 2 -R 9 ,
再更佳為-SO2-R9, Still more preferably -SO 2 -R 9 ,
又再更佳為-SO2-R10(R10為可具有取代基之碳數6至18之芳香族烴基)、-SO2CF3、-SO2CHF2、-SO2CH2F。 Still more preferably -SO 2 -R 10 (R 10 is an aromatic hydrocarbon group having 6 to 18 carbon atoms which may have substituents), -SO 2 CF 3 , -SO 2 CHF 2 , -SO 2 CH 2 F.
選自R1及R2中之至少1個較佳為電子吸引基,更佳為氰基、硝基、鹵化烷基、鹵化芳基、-SCF3、-SF3、-SF3、-SO3H、-SO2H、-CO-R1、-CO-O-R2、-CO-NR3R3z、-CO-S-R4、-CS-R5、-CS-O-R6、-CS-S-R7、-SO-R8、-SO2-R9(R1、R2、R3、R3z、R4、R5、R6、R7、R8及R9各自獨立地表示可具有取代基之烴基或鹵素原子)、-OCF3或-SCF3, At least one selected from R 1 and R 2 is preferably an electron-attracting group, more preferably cyano, nitro, halogenated alkyl, halogenated aryl, -SCF 3 , -SF 3 , -SF 3 , -SO 3 H, -SO 2 H, -CO-R 1 , -CO-OR 2 , -CO-NR 3 R 3z , -CO-SR 4 , -CS-R 5 , -CS-OR 6 , -CS-SR 7 , -SO-R 8 , -SO 2 -R 9 (R 1 , R 2 , R 3 , R 3z , R 4 , R 5 , R 6 , R 7 , R 8 and R 9 each independently represent that they may have Hydrocarbyl group or halogen atom of the substituent), -OCF 3 or -SCF 3 ,
再更佳為氰基、硝基、-OCF3、-SCF3、-SF5、-SF3、-SO3H、-SO2H、-CO-R1、-CO-O-R2、-SO2-R9, Still more preferably cyano, nitro, -OCF 3 , -SCF 3 , -SF 5 , -SF 3 , -SO 3 H, -SO 2 H, -CO-R 1 , -CO-OR 2 , -SO 2 - R9 ,
又再更佳為氰基、硝基、-OCF3、-SCF3、-SF5、-SO2CF3、-SO2-R10, Still more preferably cyano, nitro, -OCF 3 , -SCF 3 , -SF 5 , -SO 2 CF 3 , -SO 2 -R 10 ,
最佳為氰基或硝基。 Most preferred are cyano or nitro.
R3、R4、R5及R6表示之1價取代基可列舉與R1表示之1價取代基相同之基。 Examples of the monovalent substituent represented by R 3 , R 4 , R 5 and R 6 are the same as the monovalent substituent represented by R 1 .
選自R3、R4、R5及R6中之至少1個較佳為電子吸引基, At least one selected from R 3 , R 4 , R 5 and R 6 is preferably an electron-attracting group,
更佳為氰基、硝基、鹵化烷基、鹵化芳基、-SCF3、-SF5、-SF3、-SO3H、-SO2H、-CO-R1、-CO-O-R2、-CO-NR3R3z、-CO-S-R4、-CS-R5、-CS-O-R6、-CS-S-R7、-SO-R8、-SO2-R9(R1、R2、R3、R3z、R4、R5、R6、R7、R8及R9各自獨立地表示可具有取代基之烴基或鹵素原子)、-OCF3或-SCF3, More preferably cyano, nitro, halogenated alkyl, halogenated aryl, -SCF 3 , -SF 5 , -SF 3 , -SO 3 H, -SO 2 H, -CO-R 1 , -CO-OR 2 , -CO-NR 3 R 3z , -CO-SR 4 , -CS-R 5 , -CS-OR 6 , -CS-SR 7 , -SO-R 8 , -SO 2 -R 9 (R 1 , R 2 , R 3 , R 3z , R 4 , R 5 , R 6 , R 7 , R 8 and R 9 each independently represent a hydrocarbon group which may have a substituent or a halogen atom), -OCF 3 or -SCF 3 ,
再更佳為氰基、硝基、-OCF3、-SCF3、-SF5、-SF3、-SO3H、-SO2H、-CO-R1、-CO-O-R2、-SO2-R9, Still more preferably cyano, nitro, -OCF 3 , -SCF 3 , -SF 5 , -SF 3 , -SO 3 H, -SO 2 H, -CO-R 1 , -CO-OR 2 , -SO 2 - R9 ,
又再更佳為氰基、硝基、-OCF3、-SCF3、-SF5、-SO2CF3、-SO2-R10, Still more preferably cyano, nitro, -OCF 3 , -SCF 3 , -SF 5 , -SO 2 CF 3 , -SO 2 -R 10 ,
最佳為氰基或硝基。 Most preferred are cyano or nitro.
R3、R4、R5及R6各自獨立地較佳為電子吸引基。 R 3 , R 4 , R 5 and R 6 are each independently preferably an electron-attracting group.
R3、R4、R5及R6各自獨立地更佳為氰基、硝基、鹵化烷基、鹵化芳基、-SCF3、 -SF5、-SF3、-SO3H、-SO2H、-CO-R1、-CO-O-R2、-CO-NR3R3z、-CO-S-R4、-CS-R5、-CS-O-R6、-CS-S-R7、-SO-R8、-SO2-R9(R1、R2、R3、R3z、R4、R5、R6、R7、R8及R9各自獨立地表示可具有取代基之烴基或鹵素原子)、-OCF3或-SCF3, R 3 , R 4 , R 5 and R 6 are each independently more preferably cyano, nitro, halogenated alkyl, halogenated aryl, -SCF 3 , -SF 5 , -SF 3 , -SO 3 H, -SO 2 H, -CO-R 1 , -CO-OR 2 , -CO-NR 3 R 3z , -CO-SR 4 , -CS-R5, -CS-OR 6 , -CS-SR 7 , -SO-R 8. -SO 2 -R 9 (R 1 , R 2 , R 3 , R 3z , R 4 , R 5 , R 6 , R 7 , R 8 and R 9 each independently represent a hydrocarbon group that may have a substituent or a halogen atom), -OCF 3 or -SCF 3 ,
再更佳為氰基、硝基、-OCF3、-SCF3、-SF5、-SF3、-SO3H、-SO2H、-CO-R1、-CO-O-R2、-SO2-R9, Still more preferably cyano, nitro, -OCF 3 , -SCF 3 , -SF 5 , -SF 3 , -SO 3 H, -SO 2 H, -CO-R 1 , -CO-OR 2 , -SO 2 - R9 ,
又更再佳為氰基、硝基、-OCF3、-SCF3、-SF5、-SO2CF3、-SO2-R10, Still more preferably cyano, nitro, -OCF 3 , -SCF 3 , -SF 5 , -SO 2 CF 3 , -SO 2 -R 10 ,
最佳為氰基或硝基。 Most preferred are cyano or nitro.
R1與R4可相互地連結並形成環。R1與R4相互地連結並形成之環為以R1與R4相互地連結並形成之環、環W1及環W2形成至少3環以上之稠環。具有以R1與R4相互地連結並形成之環、環W1及環W2形成之稠環之式(I)表示之陰離子可列舉例如下述之陰離子。 R 1 and R 4 may be linked to each other to form a ring. The ring formed by connecting R 1 and R 4 to each other is a ring formed by connecting R 1 and R 4 to each other, and the ring W 1 and ring W 2 form at least three condensed rings. The anion represented by the formula (I) having a ring formed by linking R 1 and R 4 to each other and a condensed ring formed by ring W 1 and ring W 2 includes, for example, the following anions.
具有以R1與R4相互地連結並形成之環、環W1及環W2形成之稠環之式(I)表示之陰離子較佳為式(I-W2)、式(I-W3)、式(I-W4)、式(I-W5)、式(I-W6)、式(I-W7)或式(I-W14)表示之陰離子。 The anion represented by formula (I) having a ring formed by R 1 and R 4 connected to each other and a condensed ring formed by ring W 1 and ring W 2 is preferably formula (I-W2), formula (I-W3) , the anion represented by formula (I-W4), formula (I-W5), formula (I-W6), formula (I-W7) or formula (I-W14).
R1與R4相互地連結並形成之環可具有取代基。該取代基可列舉與環W1及環W2可具有之取代基相同之基。 The ring formed by connecting R1 and R4 to each other may have a substituent. Examples of the substituent include the same substituents that ring W 1 and ring W 2 may have.
R2與R6可相互地連結並形成環。R2與R6相互地連結並形成之環係 以R2與R6相互地連結並形成之環、環W1及環W2形成至少3環以上之稠環。具有以R2與R6相互地連結並形成之環、環W1及環W2形成之稠環之式(1)表示之陰離子可列舉例如下述之陰離子。 R 2 and R 6 may be linked to each other to form a ring. The ring formed by R 2 and R 6 linked to each other is the ring formed by linked R 2 and R 6 to each other, and ring W 1 and ring W 2 form a condensed ring of at least 3 rings. Examples of the anion represented by formula (1) having a ring formed by linking R 2 and R 6 to each other, and a condensed ring formed by ring W 1 and ring W 2 include the following anions.
具有以R2與R6相互地連結並形成之環、環W1及環W2形成之稠環之式(I)表示之陰離子較佳為式(I-w2)、式(I-w3)、式(I-w4)、式(I-w5)、式(I-w6)、式(I-w7)或式(I-w14)表示之陰離子。 The anion represented by formula (I) having a ring formed by R 2 and R 6 linked to each other and a condensed ring formed by ring W 1 and ring W 2 is preferably formula (I-w2), formula (I-w3) , the anion represented by formula (I-w4), formula (I-w5), formula (I-w6), formula (I-w7) or formula (I-w14).
R2與R6相互地連結並形成之環可具有取代基。該取代基可列舉與環W1及環W2可具有之取代基相同之基。 The ring formed by connecting R 2 and R 6 to each other may have a substituent. Examples of the substituent include the same substituents that ring W 1 and ring W 2 may have.
R3與R4可相互地連結並形成環。R3與R4相互地連結並形成之環可為單環,亦可為稠環,較佳為單環。R3與R4相互地連結並形成之環,係可含有雜原子(氮原子、氧原子、硫原子)等作為環的構成要素。 R 3 and R 4 may be linked to each other to form a ring. The ring formed by R 3 and R 4 linked to each other may be a single ring or a condensed ring, preferably a single ring. R 3 and R 4 are connected to each other to form a ring, which may contain heteroatoms (nitrogen atom, oxygen atom, sulfur atom) etc. as constituent elements of the ring.
R3與R4相互地連結並形成之環通常為3至10員環,較佳為5至7員環,更佳為5員環或6員環。 The ring formed by R 3 and R 4 being connected to each other is usually a 3- to 10-membered ring, preferably a 5- to 7-membered ring, more preferably a 5-membered ring or a 6-membered ring.
R3與R4相互地連結並形成之環可列舉下述之環等。以下所述之環中*表示與環W1之鍵結處。 The ring formed by R 3 and R 4 being connected to each other includes the following rings and the like. In the rings described below, * represents a bond with the ring W1.
R3與R4相互地連結並形成之環較佳為式(w-1)、式(w-4)、式(w-5)、 式(w-6)、式(w-8)、式(w-9)、式(w-10)、式(w-11)、式(w-13)、式(w-31)、式(w-32)、式(w-35)、式(w-36)、式(w-37)、式(w-45)、式(w-47)或式(w-48)表示之環。 The ring formed by R 3 and R 4 being connected to each other is preferably formula (w-1), formula (w-4), formula (w-5), formula (w-6), formula (w-8), Formula (w-9), Formula (w-10), Formula (w-11), Formula (w-13), Formula (w-31), Formula (w-32), Formula (w-35), Formula A ring represented by (w-36), formula (w-37), formula (w-45), formula (w-47) or formula (w-48).
R5與R6相互地連結並形成之環可列舉與R3及R4相互地連結並形成之環相同之環。R5與R6相互地連結並形成之環較佳為式(w-1)、式(w-4)、式(w-5)、式(w-6)、式(w-8)、式(w-9)、式(w-10)、式(w-11)、式(w-13)、式(w-31)、式(w-32)、式(w-35)、式(w-36)、式(w-37)、式(w-45)、式(w-47)或式(w-48)表示之環。 The ring formed by mutual linkage of R5 and R6 includes the same rings as the ring formed by mutual linkage of R3 and R4 . R 5 and R 6 are connected to each other to form a ring, preferably formula (w-1), formula (w-4), formula (w-5), formula (w-6), formula (w-8), Formula (w-9), Formula (w-10), Formula (w-11), Formula (w-13), Formula (w-31), Formula (w-32), Formula (w-35), Formula A ring represented by (w-36), formula (w-37), formula (w-45), formula (w-47) or formula (w-48).
式(I)表示之陰離子更佳為式(I-A)表示之陰離子。 The anion represented by formula (I) is more preferably an anion represented by formula (I-A).
式(I)表示之陰離子可列舉例如下述之陰離子。此外,式中之Me表示甲基。 Examples of the anion represented by the formula (I) include the following anions. In addition, Me in the formula represents a methyl group.
<陽離子> <cation>
本發明之化合物由式(I)表示之陰離子與成對之陽離子構成。本發明之化合物不限定式(I)表示之陰離子與陽離子之組合。 The compound of the present invention consists of an anion represented by formula (I) and a pair of cations. The compound of the present invention is not limited to the combination of anion and cation represented by formula (I).
陽離子可為有機陽離子,亦可為無機陽離子。 The cation may be an organic cation or an inorganic cation.
有機陽離子可列舉:N-甲基吡啶鎓、N-乙基吡啶鎓、N-丙基吡啶鎓、N-乙基-2-甲基吡啶鎓、N-乙基-3-甲基吡啶鎓、1-乙基-3-(羥甲基)吡啶鎓、N-丁基吡啶鎓、N-丁基-4-甲基吡啶鎓、N-丁基-3-甲基吡啶鎓、N-己基吡啶鎓、N-辛基吡啶鎓、N-辛基-4-甲基吡啶鎓、1,1’-二甲基-4,4’-聯吡啶鎓、1,1’-二苯甲基-4,4’-聯吡啶鎓等吡啶鎓陽離子; Examples of organic cations include: N-methylpyridinium, N-ethylpyridinium, N-propylpyridinium, N-ethyl-2-methylpyridinium, N-ethyl-3-methylpyridinium, 1-Ethyl-3-(hydroxymethyl)pyridinium, N-butylpyridinium, N-butyl-4-methylpyridinium, N-butyl-3-methylpyridinium, N-hexylpyridinium Onium, N-octylpyridinium, N-octyl-4-methylpyridinium, 1,1'-dimethyl-4,4'-bipyridinium, 1,1'-benzhydryl-4 , 4'-bipyridinium and other pyridinium cations;
1-丁基-1-甲基哌啶鎓、1-甲基-1-丙基哌啶鎓等哌啶鎓陽離子; Piperidinium cations such as 1-butyl-1-methylpiperidinium and 1-methyl-1-propylpiperidinium;
1-烯丙基-1-甲基吡咯啶鎓、1-丁基-1-甲基吡咯啶鎓、1-乙基-1-甲基吡咯啶 鎓、1-甲基-1-丙基吡咯啶鎓、1-(2-甲氧基乙基)-1-甲基吡咯啶鎓、1-甲基-1-正辛基吡咯啶鎓、1-甲基-1-戊基吡咯啶鎓等吡咯啶鎓陽離子; 1-allyl-1-methylpyrrolidinium, 1-butyl-1-methylpyrrolidinium, 1-ethyl-1-methylpyrrolidinium Onium, 1-methyl-1-propylpyrrolidinium, 1-(2-methoxyethyl)-1-methylpyrrolidinium, 1-methyl-1-n-octylpyrrolidinium, 1 - pyrrolidinium cations such as methyl-1-pentylpyrrolidinium;
2-甲基-1-吡咯啉鎓等具有吡咯啉骨架之陽離子; cations with a pyrroline skeleton such as 2-methyl-1-pyrrolinium;
1-丁基-2,3-二甲基咪唑鎓、3,3’-(丁烷-1,4-二基)雙(1-乙烯基-3-咪唑鎓)、1-苯甲基-3-甲基咪唑鎓、1,3-二甲基咪唑鎓、1,2-二甲基-3-丙基咪唑鎓、1-癸基-3-甲基咪唑鎓、1-十二烷基-3-甲基咪唑鎓、1-乙基-2,3-二甲基咪唑鎓、3-乙基-1-乙烯基咪唑鎓、3-乙基-1-乙烯基咪唑鎓、1-甲基-3-(4-磺丁基)咪唑鎓、1-乙基-3-甲基咪唑鎓、1-丁基-3-甲基咪唑鎓等咪唑鎓陽離子; 1-butyl-2,3-dimethylimidazolium, 3,3'-(butane-1,4-diyl)bis(1-vinyl-3-imidazolium), 1-benzyl- 3-methylimidazolium, 1,3-dimethylimidazolium, 1,2-dimethyl-3-propylimidazolium, 1-decyl-3-methylimidazolium, 1-dodecyl -3-methylimidazolium, 1-ethyl-2,3-dimethylimidazolium, 3-ethyl-1-vinylimidazolium, 3-ethyl-1-vinylimidazolium, 1-methylimidazolium Imidazolium cations such as base-3-(4-sulfobutyl)imidazolium, 1-ethyl-3-methylimidazolium, 1-butyl-3-methylimidazolium;
戊基三乙銨、丁基三甲銨、苯甲基(乙基)二甲銨、環己基三甲銨、二乙基(甲基)丙銨、二乙基(2-甲氧基乙基)甲銨、乙基(2-甲氧基乙基)二甲銨、乙基(二甲基)(2-苯基乙基)銨、甲基三-正辛銨、四丁銨、四己銨、四戊銨、四-正辛銨、四庚銨、四丙銨等銨陽離子; Amyltriethylammonium, Butyltrimethylammonium, Benzyl(ethyl)dimethylammonium, Cyclohexyltrimethylammonium, Diethyl(methyl)propylammonium, Diethyl(2-methoxyethyl)methylammonium Ammonium, ethyl(2-methoxyethyl)dimethylammonium, ethyl(dimethyl)(2-phenylethyl)ammonium, methyltri-n-octylammonium, tetrabutylammonium, tetrahexylammonium, Ammonium cations such as tetrapentammonium, tetra-n-octylammonium, tetraheptammonium, and tetrapropylammonium;
三甲基鋶、三丁基鋶、三乙基鋶等三烷基鋶陽離子; Trimethyl-Caudium, Tributyl-Caudium, Triethyl-Caudium and other trialkyl-Caudium cations;
三丁基十六烷基鏻、三丁基甲基鏻、三丁基-正辛基鏻、三丁基-正辛基鏻、四-正辛基鏻、三丁基(2-甲氧基乙基)鏻、三丁基甲基鏻、三己基(十四烷基)鏻、三己基(十四烷基)鏻等鏻陽離子; Tributylhexadecylphosphonium, tributylmethylphosphonium, tributyl-n-octylphosphonium, tributyl-n-octylphosphonium, tetra-n-octylphosphonium, tributyl(2-methoxyethyl ) phosphonium, tributylmethylphosphonium, trihexyl (tetradecyl) phosphonium, trihexyl (tetradecyl) phosphonium and other phosphonium cations;
4-乙基-4-甲基嗎啉鎓等嗎啉鎓陽離子; Morpholinium cations such as 4-ethyl-4-methylmorpholinium;
三苯基甲基鎓等三芳基甲烷陽離子等。 Triarylmethane cations such as triphenylmethylium, etc.
無機陽離子可列舉:鋰離子、鈉離子、鉀離子、銣離子、銫離子等鹼金屬離子;銅(I)離子、銀離子等1價金屬離子;鈹離子、鎂離子、鈣離子、鍶離子、鋇離子等鹼土金屬離子;銅(II)離子、鎳離子、鈷離子、鐵(II)離子、錳離子、鈀離子、鋅離子、鍺(II)離子等2價金屬離子;鈷(III)離子、鐵(III)離子、鉻 (III)離子、鈧離子、釔離子、釕(III)離子、鎵離子等3價金屬離子;鈦離子、鋯離子、鉿離子、鍺(IV)離子、鉬(IV)離子等4價金屬離子;NH4+等。 Examples of inorganic cations include alkali metal ions such as lithium ions, sodium ions, potassium ions, rubidium ions, and cesium ions; monovalent metal ions such as copper (I) ions and silver ions; beryllium ions, magnesium ions, calcium ions, strontium ions, Alkaline earth metal ions such as barium ions; divalent metal ions such as copper (II) ions, nickel ions, cobalt ions, iron (II) ions, manganese ions, palladium ions, zinc ions, germanium (II) ions; cobalt (III) ions , iron (III) ions, chromium (III) ions, scandium ions, yttrium ions, ruthenium (III) ions, gallium ions and other trivalent metal ions; titanium ions, zirconium ions, hafnium ions, germanium (IV) ions, molybdenum ( IV) Tetravalent metal ions such as ions; NH4 + etc.
陽離子較佳為鹼金屬離子、鹼土金屬離子、銅(I)離子、銅(II)離子、鎳離子、鈷(III)離子、鐵(II)離子、鐵(III)離子、鈀離子及有機陽離子,更佳為鉀離子、鈣離子、鋇離子、鎂離子、銅(I)離子、銅(II)離子、鎳離子及有機陽離子,再更佳為鉀離子及有機陽離子。 The cations are preferably alkali metal ions, alkaline earth metal ions, copper(I) ions, copper(II) ions, nickel ions, cobalt(III) ions, iron(II) ions, iron(III) ions, palladium ions and organic cations , more preferably potassium ions, calcium ions, barium ions, magnesium ions, copper (I) ions, copper (II) ions, nickel ions and organic cations, more preferably potassium ions and organic cations.
化合物(I)不限定為式(I)表示之陰離子與陽離子之組合,較佳為式(IA)表示之化合物。 Compound (I) is not limited to the combination of anion and cation represented by formula (I), and is preferably a compound represented by formula (IA).
g表示1至4之整數; g represents an integer from 1 to 4;
G表示1價陽離子、2價陽離子、3價陽離子或4價陽離子] G represents 1-valent cation, 2-valent cation, 3-valent cation or 4-valent cation]
化合物(I)之分子量較佳為3000以下,更佳為2000以下,再更佳為1000以下。又,較佳為100以上,更佳為200以上,再更佳為300以上。 The molecular weight of the compound (I) is preferably 3000 or less, more preferably 2000 or less, still more preferably 1000 or less. Also, it is preferably at least 100, more preferably at least 200, and still more preferably at least 300.
化合物(I)較佳為於波長450nm至波長650nm顯示最大吸收。 Compound (I) preferably exhibits maximum absorption at a wavelength of 450 nm to 650 nm.
化合物(I)之最大吸收波長(λ max)中之克吸光係數ε較佳為50[L/(g‧cm)]以上,更佳為100[L/(g‧cm)]以上,最佳為150[L/(g‧cm)]以上。上限雖無特別限制,通常為100000[L/(g‧cm)]以下。 The gram light absorption coefficient ε in the maximum absorption wavelength (λ max) of compound (I) is preferably 50 [L/(g‧cm)] or more, more preferably 100 [L/(g‧cm)] or more, most preferably 150 [L/(g‧cm)] or more. Although the upper limit is not particularly limited, it is usually 100000 [L/(g·cm)] or less.
化合物(I)之λ max中之克吸光係數ε為50[L/(g‧cm)]以上時,從可高效率地吸收最大吸收波長附近之光之點而言為較佳。 When the gram absorption coefficient ε in λ max of the compound (I) is 50 [L/(g·cm)] or more, it is preferable in terms of efficiently absorbing light near the maximum absorption wavelength.
化合物(I)之半峰全寬較佳為45nm以下,更佳為40nm,再更佳為35nm,最佳為30nm以下。半峰全寬可以實施例中記載之方法測定。 The full width at half maximum of compound (I) is preferably 45 nm or less, more preferably 40 nm, still more preferably 35 nm, most preferably 30 nm or less. The full width at half maximum can be measured by the method described in the Examples.
化合物(I)可列舉例如下列表1至表6中記載的化合物。化合物(1)具有式(I-1)表示之陰離子及鋰離子,並顯示下述記載的結構。 Compound (I) includes, for example, the compounds described in Table 1 to Table 6 below. Compound (1) has an anion represented by formula (I-1) and a lithium ion, and has the structure described below.
[表1]
[表2]
[表3]
[表4]
[表5]
[表6]
化合物(I)較佳為化合物(1)至化合物(3)、化合物(6)至化合物(11)、化合物(14)至化合物(16)、化合物(18)、化合物(19)、化合物(21)、化合物(24)至化合物(30)、化合物(32)、化合物(35)至化合物(38)、化合物(41)、化合物(44)、化合物(47)、化合物(50)、化合物(52)至化合物(55)、化合物(57)、化合物(59)、化合物(61)、化合物(63)、化合物(65)、化合物(67)、化合物(70)、化合物(72)、化合物(74)、化合物(76)、化合物(78)、化合物(80)、化合物(81)、化合物(83)、化合物(86)至化合物(88)、化合物(95)、化合物(96)、化合物(107)、化合物(108)、化合物(110)至化合物(112)、化合物(114)至化合物(121)、化合物(123)至化合物(129)、化合物(132)、化合物(133)、化合物(135)至化合物(138)、化合物(140)至化合物(143)、化合物(145)至化合物(147)、化合物(149)至化合物(155)、化合物(158)、化合物(159)、化合物(161)至化合物(164)、化合物(166)至化合物(169)、化合物(171)至化合物(173)、化合物(175)、化合物(176)、化合物(179)至化合物(181)、化合物(184)、化 合物(185)、化合物(187)至化合物(189)、化合物(191)、化合物(193)至化合物(198)。 Compound (I) is preferably compound (1) to compound (3), compound (6) to compound (11), compound (14) to compound (16), compound (18), compound (19), compound (21 ), Compound (24) to Compound (30), Compound (32), Compound (35) to Compound (38), Compound (41), Compound (44), Compound (47), Compound (50), Compound (52 ) to Compound (55), Compound (57), Compound (59), Compound (61), Compound (63), Compound (65), Compound (67), Compound (70), Compound (72), Compound (74 ), Compound (76), Compound (78), Compound (80), Compound (81), Compound (83), Compound (86) to Compound (88), Compound (95), Compound (96), Compound (107 ), Compound (108), Compound (110) to Compound (112), Compound (114) to Compound (121), Compound (123) to Compound (129), Compound (132), Compound (133), Compound (135 ) to compound (138), compound (140) to compound (143), compound (145) to compound (147), compound (149) to compound (155), compound (158), compound (159), compound (161 ) to compound (164), compound (166) to compound (169), compound (171) to compound (173), compound (175), compound (176), compound (179) to compound (181), compound (184 ),change Compound (185), Compound (187) to Compound (189), Compound (191), Compound (193) to Compound (198).
<化合物(I)之製造方法(1)> <Production method (1) of compound (I)>
化合物(I)可例如藉由將選自式(M1-2)表示之化合物(以下,亦稱為化合物(M1-2))及式(M1-3)表示之化合物(以下,亦稱為化合物(M1-3))中之至少一種化合物與具有式(M1-1)表示之陰離子之化合物(以下,亦稱為化合物(M1-1))進行反應而獲得。 Compound (I) can, for example, be selected from a compound represented by formula (M1-2) (hereinafter also referred to as compound (M1-2)) and a compound represented by formula (M1-3) (hereinafter also referred to as compound (M1-3)) obtained by reacting at least one compound with a compound having an anion represented by formula (M1-1) (hereinafter also referred to as compound (M1-1)).
式(M1-2)中,R2’表示1價之取代基,E1表示脫離基; In the formula (M1-2), R 2' represents a monovalent substituent, and E 1 represents a leaving group;
式(M1-3)中,R1’表示1價之取代基,E2表示脫離基] In the formula (M1-3), R 1' represents a monovalent substituent, and E 2 represents a leaving group]
R2’表示之1價取代基可列舉與R2表示之1價取代基相同之基。 The monovalent substituent represented by R 2' includes the same ones as the monovalent substituent represented by R 2 .
R1’表示之1價取代基可列舉與R1表示之1價取代基相同之基。 Examples of the monovalent substituent represented by R 1′ include the same ones as the monovalent substituent represented by R 1 .
E1及E2表示之脫離基各自獨立,可列舉鹵素原子、琥珀醯亞胺基、馬來醯亞胺基、鄰-磺基苯甲醯亞胺基、甲磺醯基、對-甲氧基苯磺醯基、對-甲苯磺醯基、三氟甲磺醯基、九氟丁磺醯基等。 The leaving groups represented by E1 and E2 are independently independent, and examples include halogen atoms, succinimide groups, maleimide groups, o-sulfobenzyl imide groups, methylsulfonyl groups, and p-methoxyl groups. phenylsulfonyl, p-toluenesulfonyl, trifluoromethanesulfonyl, nonafluorobutanesulfonyl, etc.
選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少一種化合物與化合物(M1-1)之反應,係可藉由將選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少一種化合物與化合物(M1-1)混合而實施。 The reaction of at least one compound selected from the group consisting of the compound (M1-2) and the compound (M1-3) with the compound (M1-1) can be performed by combining the compound selected from the compound (M1-2) and the compound ( At least one compound in the group consisting of M1-3) is mixed with the compound (M1-1).
相對於化合物(M1-1)1莫耳,化合物(M1-2)之使用量通常為0.1至20莫耳,較佳為0.5至10莫耳。 Compound (M1-2) is usually used in an amount of 0.1 to 20 mol, preferably 0.5 to 10 mol, relative to 1 mol of compound (M1-1).
相對於化合物(M1-1)1莫耳,化合物(M1-3)之使用量通常為0.1至20莫耳,較佳為0.5至10莫耳。 Compound (M1-3) is usually used in an amount of 0.1 to 20 mol, preferably 0.5 to 10 mol, relative to 1 mol of compound (M1-1).
選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少一種化合物與化合物(M1-1)之反應較佳是在鹼存在下進行。 The reaction of at least one compound selected from the group consisting of compound (M1-2) and compound (M1-3) with compound (M1-1) is preferably carried out in the presence of a base.
鹼可列舉:甲醇鈉、甲醇鉀、甲醇鋰、乙醇鈉、乙醇鉀、乙醇鋰、異丙醇鈉、第三丁醇鈉、第三丁醇鉀等金屬醇鹽(較佳為鹼金屬醇鹽)等;氫氧化鋰、氫氧化鈉、氫氧化鉀等金屬氫氧化物;氫化鈉、氫化鉀、氫化鋁鋰、硼氫化鈉等金屬氫化物;碳酸鈉、碳酸氫鈉、碳酸鉀、碳酸氫鉀、碳酸鋰、碳酸氫鋰、碳酸銫等金屬碳酸鹽;甲基鋰、正丁基鋰、第二丁基鋰、第三丁基鋰、苯基鋰等有機鋰化合物;甲基溴化鎂、異丙基溴化鎂、正丁基溴化鎂、異丙基氯化鎂等烷基金屬鹵化物;二異丙基胺基鋰、2,2,6,6-四甲基哌啶鋰、(雙三甲基矽基)醯胺化鋰、四甲基哌啶鋰等金屬醯胺化合物;吡啶、2,6-二甲基吡啶、2,6-二-第三丁基吡啶、三乙胺、二異丙基乙胺、三異丙胺、2,2,6,6-四甲基哌啶、哌啶、吡咯啶、脯胺酸、苯胺、N,N-二甲基苯胺、乙二胺等胺化合物;乙酸鈉、乙酸鉀、甲酸鈉等金屬羧酸鹽;乙酸銨等羧酸銨鹽等。 The base can be exemplified: metal alkoxides such as sodium methoxide, potassium methoxide, lithium methoxide, sodium ethoxide, potassium ethoxide, lithium ethoxide, sodium isopropoxide, sodium tertiary butoxide, potassium tertiary butoxide (preferably alkali metal alkoxide ), etc.; metal hydroxides such as lithium hydroxide, sodium hydroxide, and potassium hydroxide; metal hydrides such as sodium hydride, potassium hydride, lithium aluminum hydride, and sodium borohydride; sodium carbonate, sodium bicarbonate, potassium carbonate, and bicarbonate Metal carbonates such as potassium, lithium carbonate, lithium bicarbonate, and cesium carbonate; organic lithium compounds such as methyllithium, n-butyllithium, second-butyllithium, third-butyllithium, and phenyllithium; methylmagnesium bromide , isopropylmagnesium bromide, n-butylmagnesium bromide, isopropylmagnesium chloride and other alkyl metal halides; diisopropylamide lithium, 2,2,6,6-tetramethylpiperidine lithium, ( Metal amide compounds such as lithium bis(trimethylsilyl)amide, lithium tetramethylpiperidine; pyridine, 2,6-lutidine, 2,6-di-tert-butylpyridine, triethylamine , diisopropylethylamine, triisopropylamine, 2,2,6,6-tetramethylpiperidine, piperidine, pyrrolidine, proline, aniline, N,N-dimethylaniline, ethylenediamine Other amine compounds; metal carboxylates such as sodium acetate, potassium acetate, sodium formate; ammonium carboxylate such as ammonium acetate, etc.
相對於化合物(M1-1)1莫耳,鹼的使用量通常為0.001至20莫耳,較佳為0.03至10莫耳,更佳為0.05至5莫耳,再更佳為0.1至3莫耳,最佳為0.5至2莫耳。 The amount of base used is usually 0.001 to 20 moles, preferably 0.03 to 10 moles, more preferably 0.05 to 5 moles, and even more preferably 0.1 to 3 moles, relative to 1 mole of compound (M1-1). ears, preferably 0.5 to 2 moles.
選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少一種化合物與化合物(M1-1)之反應係可在溶劑存在下進行。 The reaction of at least one compound selected from the group consisting of compound (M1-2) and compound (M1-3) with compound (M1-1) can be performed in the presence of a solvent.
溶劑可列舉:乙腈、苯甲腈等腈溶劑;苯、甲苯、二甲苯、茴香醚之芳香族烴溶劑;正己烷、正庚烷、環己烷、甲基環己烷等脂肪族烴溶劑;氯苯、鄰二氯苯、間二氯苯、對二氯苯、二氯甲烷、二氯乙烷、四氯乙烷、四氯乙烯、氯仿等 鹵素系溶劑;乙酸甲酯、乙酸乙酯、乙酸丁酯、乙酸異丁酯、乙酸正丙酯等酯溶劑;甲醇、乙醇、異丙醇、六氟異丙醇、正丁醇、異丁醇、第三丁醇等醇溶劑;丙酮、甲基乙基酮、甲基異丁基酮、二異丁基酮、環己醇等酮系溶劑;四氫呋喃、2-甲基四氫呋喃、環戊基甲醚、4-甲基四氫呋喃、二噁烷、二乙醚、第三丁基甲醚、二異丙醚、二甲氧基乙烷、二乙氧基甲烷等醚溶劑;N,N-二甲基乙醯胺、N,N-二甲基甲醯胺等醯胺溶劑;二甲亞碸;1,3-二甲基-2-咪唑啉酮;六甲基磷酸三醯胺;水等。溶劑較佳為腈溶劑、醇溶劑、醚系溶劑、酮溶劑、芳香族烴溶劑,更佳為乙腈、四氫呋喃、二乙醚、甲醇、乙醇、異丙醇、2-丁酮或甲苯,再更佳為乙腈、四氫呋喃、甲醇、乙醇、異丙醇、2-丁酮、甲苯,最佳為甲醇、乙醇、異丙醇、乙腈、2-丁酮或甲苯。 Examples of solvents include: nitrile solvents such as acetonitrile and benzonitrile; aromatic hydrocarbon solvents such as benzene, toluene, xylene, and anisole; aliphatic hydrocarbon solvents such as n-hexane, n-heptane, cyclohexane, and methylcyclohexane; Chlorobenzene, o-dichlorobenzene, m-dichlorobenzene, p-dichlorobenzene, methylene chloride, dichloroethane, tetrachloroethane, tetrachloroethylene, chloroform, etc. Halogen solvents; methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, n-propyl acetate and other ester solvents; methanol, ethanol, isopropanol, hexafluoroisopropanol, n-butanol, isobutanol , tertiary butanol and other alcohol solvents; acetone, methyl ethyl ketone, methyl isobutyl ketone, diisobutyl ketone, cyclohexanol and other ketone solvents; tetrahydrofuran, 2-methyltetrahydrofuran, cyclopentyl methyl Ether, 4-methyltetrahydrofuran, dioxane, diethyl ether, tertiary butyl methyl ether, diisopropyl ether, dimethoxyethane, diethoxymethane and other ether solvents; N,N-dimethylacetamide Amide solvents such as amines, N,N-dimethylformamide, etc.; dimethylsulfoxide; 1,3-dimethyl-2-imidazolidinone; hexamethyltriamide phosphate; water, etc. The solvent is preferably a nitrile solvent, an alcohol solvent, an ether solvent, a ketone solvent, an aromatic hydrocarbon solvent, more preferably acetonitrile, tetrahydrofuran, diethyl ether, methanol, ethanol, isopropanol, 2-butanone or toluene, and more preferably It is acetonitrile, tetrahydrofuran, methanol, ethanol, isopropanol, 2-butanone, toluene, most preferably methanol, ethanol, isopropanol, acetonitrile, 2-butanone or toluene.
選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少一種化合物與化合物(M1-1)之反應時間通常為0.01至200小時。 The reaction time of at least one compound selected from the group consisting of compound (M1-2) and compound (M1-3) and compound (M1-1) is usually 0.01 to 200 hours.
選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少一種之化合物與化合物(M1-1)之反應溫度通常為-100至200℃。 The reaction temperature of at least one compound selected from the group consisting of compound (M1-2) and compound (M1-3) and compound (M1-1) is usually -100 to 200°C.
化合物(M1-1)可列舉下列化合物等。 Compound (M1-1) includes the following compounds and the like.
化合物(M1-2)及化合物(M1-3)可使用市售品。可列舉例如:氯化氰、溴化氰、對甲苯磺醯氰、三氟甲烷磺醯氰、硫氰酸苯甲酯、第三丁基異腈、氰化銅(I)、氰化鉀、1-氰基-4-(二甲胺基)吡啶鎓四氟硼酸鹽、對-甲苯磺醯基甲基異腈、1-氯甲基-4-氟-1,4-重氮鎓雙環[2.2.2]辛烷雙(四氟硼酸鹽)(亦稱為氟試劑(Selectfluor)(Air Products and Chemicals之註冊商標)、苯甲醯基(苯基碘)(三氟甲磺醯基)間苯胺、2,8-二氟-5-(三氟甲基)-5H-二苯并[b,d]噻吩-5-鎓三氟甲磺酸酯、1-氟-3,3-二甲基-1,2-苯并碘唑、N-溴琥珀醯亞胺、N-氯琥珀醯亞胺、N-碘琥珀醯亞胺、四甲基三溴化銨、氟(F2)、溴(Br2)、氯(Cl2)、碘(I2)、N-溴鄰苯二甲醯亞胺、N-氯鄰苯二甲醯亞胺、N-碘鄰苯二甲醯亞胺、N-溴糖精、N-(三氟甲硫基)糖精、N-(三氟甲硫基)糖精、N-(三氟甲硫基)苯胺、N-甲基-N-[(三氟甲基)硫代]-對甲苯磺醯胺、1-三氟甲基-3,3-二甲基-1,2-苯并碘唑、1-三氟甲基-1,2-苯并碘唑-3(1H)-酮、硝酸、碘甲烷、二甲基硫酸、三氟甲磺酸甲酯、三氟甲磺酸乙酯、三氟甲磺酸正丁酯、乙醯氯等。 Compound (M1-2) and compound (M1-3) can use a commercial item. Examples include: cyanogen chloride, cyanogen bromide, p-toluenesulfonyl cyanide, trifluoromethanesulfonyl cyanide, benzyl thiocyanate, tert-butylisocyanide, copper(I) cyanide, potassium cyanide, 1-cyano-4-(dimethylamino)pyridinium tetrafluoroborate, p-toluenesulfonylmethylisonitrile, 1-chloromethyl-4-fluoro-1,4-diazonium bicyclo[ 2.2.2] Octane bis(tetrafluoroborate) (also known as Selectfluor (registered trademark of Air Products and Chemicals), benzoyl (phenyl iodide) (trifluoromethanesulfonyl) Aniline, 2,8-difluoro-5-(trifluoromethyl)-5H-dibenzo[b,d]thiophen-5-ium triflate, 1-fluoro-3,3-dimethyl -1,2-benzoiodazole, N-bromosuccinimide, N-chlorosuccinimide, N-iodosuccinimide, tetramethylammonium tribromide, fluorine (F 2 ), bromine (Br 2 ), chlorine (Cl 2 ), iodine (I 2 ), N-bromophthalimide, N-chlorophthalimide, N-iodophthalimide, N-bromosaccharin, N-(trifluoromethylthio)saccharin, N-(trifluoromethylthio)saccharin, N-(trifluoromethylthio)aniline, N-methyl-N-[(trifluoromethylthio) base) thio]-p-toluenesulfonamide, 1-trifluoromethyl-3,3-dimethyl-1,2-benzoiodazole, 1-trifluoromethyl-1,2-benzoiodide Azol-3(1H)-one, nitric acid, methyl iodide, dimethylsulfuric acid, methyl trifluoromethanesulfonate, ethyl trifluoromethanesulfonate, n-butyl trifluoromethanesulfonate, acetyl chloride, etc.
此外,R1’及R2’為相同之基且E1及E2為相同之基時,化合物(M1-2)與化合物(M1-3)為相同之化合物。 In addition, when R 1' and R 2' are the same group and E 1 and E 2 are the same group, compound (M1-2) and compound (M1-3) are the same compound.
使選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少一種之化合物與化合物(M1-1)進行反應時,可獲得具有源自化合物(M1-1)之陽離子及式(I)表示之陰離子之化合物(I)。 When at least one compound selected from the group consisting of compound (M1-2) and compound (M1-3) is reacted with compound (M1-1), a compound having a cation derived from compound (M1-1) can be obtained. and compound (I) having an anion represented by formula (I).
欲將化合物(I)之陽離子交換成期望之陽離子時,可藉由將化合物(I)與具有期望之陽離子之鹽混合,進行離子交換。前述離子交換可在溶劑存在下進行。具有期望之陽離子之鹽可列舉例如由期望之陽離子及氯化物離子構成之氯化物鹽、由期望之陽離子及溴化物離子構成之溴化物鹽、由期望之陽離子及碘化物離 子構成之碘化物鹽、由期望之陽離子及氟化物離子構成之氟化物鹽、由期望之陽離子及硝酸離子構成之硝酸鹽、由期望之陽離子及硫酸離子構成之硫酸鹽、由期望之陽離子及過氯酸離子構成之過氯酸鹽、由期望之陽離子及磺酸離子構成之磺酸鹽、由期望之陽離子及羧酸離子構成之羧酸鹽、由期望之陽離子及次氯酸離子構成之次氯酸鹽、由期望之陽離子及六氟磷酸構成之六氟磷酸鹽、由期望之陽離子及醯亞胺構成之醯亞胺鹽等。 When the cation of compound (I) is to be exchanged for a desired cation, ion exchange can be performed by mixing compound (I) with a salt having the desired cation. The aforementioned ion exchange can be performed in the presence of a solvent. Salts with desired cations include, for example, chloride salts composed of desired cations and chloride ions, bromide salts composed of desired cations and bromide ions, and salts composed of desired cations and iodide ions. Iodide salts composed of desired cations and fluoride ions, nitrate salts composed of desired cations and nitrate ions, sulfate salts composed of desired cations and sulfate ions, desired cations and Perchlorate composed of perchlorate ion, sulfonate composed of desired cation and sulfonate ion, carboxylate composed of desired cation and carboxylate ion, Hypochlorite, hexafluorophosphate salt consisting of a desired cation and hexafluorophosphoric acid, imide salt consisting of a desired cation and imide, and the like.
此外,具有2價以上陽離子之化合物(I)係可在獲得具有1價陽離子之化合物(I)後藉由進行離子交換而獲得。又,使選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少一種之化合物與化合物(M1-1)進行反應時,亦可藉由使用具有2價以上陽離子之化合物(M1-1)而獲得。 In addition, the compound (I) having a divalent or higher cation can be obtained by performing ion exchange after obtaining the compound (I) having a monovalent cation. In addition, when reacting at least one compound selected from the group consisting of compound (M1-2) and compound (M1-3) with compound (M1-1), it is also possible to use a compound having a divalent or higher cation Compound (M1-1) was obtained.
化合物(M1-1)中之陰離子部係可藉由使式(M1-4)表示之化合物(以下,亦稱為化合物(M1-4))、式(b-2)表示之化合物(以下,亦稱為化合物(b-2))及式(b-3)表示之化合物(以下,亦稱為化合物(b-3))進行反應而製造之。 The anion part in the compound (M1-1) can be obtained by making the compound represented by the formula (M1-4) (hereinafter, also referred to as the compound (M1-4)), the compound represented by the formula (b-2) (hereinafter, Also referred to as compound (b-2)) and a compound represented by formula (b-3) (hereinafter, also referred to as compound (b-3)) are produced by reacting.
式(b-2)中,R3及R4表示與上述者相同意義,X1表示2價之連結基; In formula (b-2), R 3 and R 4 represent the same meaning as above, and X 1 represents a divalent linking group;
式(b-3)中,R5及R6表示與上述者相同意義,X2表示2價之連結基] In formula (b-3), R 5 and R 6 represent the same meaning as above, and X 2 represents a divalent linking group]
化合物(M1-4)、化合物(b-2)及化合物(b-3)之反應係可藉由將化合物(M1-4)、化合物(b-2)及化合物(b-3)混合而實施。 The reaction of compound (M1-4), compound (b-2) and compound (b-3) can be implemented by mixing compound (M1-4), compound (b-2) and compound (b-3) .
化合物(M1-4)、化合物(b-2)及化合物(b-3)之反應較佳在鹼存在下實施,以將 化合物(M1-4)、化合物(b-2)及化合物(b-3)及鹼混合較佳。 The reaction of compound (M1-4), compound (b-2) and compound (b-3) is preferably implemented in the presence of a base, so that Compound (M1-4), compound (b-2) and compound (b-3) are preferably mixed with a base.
化合物(M1-4)、化合物(b-2)及化合物(b-3)與鹼之混合較佳為於化合物(M1-4)及鹼之一部分之混合物(1)中添加化合物(b-2)而獲得混合物(2),於獲得之混合物(2)中添加化合物(b-3)及鹼之剩餘部分之混合物(3)。 The mixing of compound (M1-4), compound (b-2) and compound (b-3) with a base is preferably by adding compound (b-2) to a mixture (1) of compound (M1-4) and a part of the base ) to obtain a mixture (2), and to the obtained mixture (2), add a mixture (3) of the compound (b-3) and the remainder of the base.
化合物(M1-4)、化合物(b-2)及化合物(b-3)與鹼之反應係可在溶劑存在下進行。溶劑可列舉與可使用於選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少一種之化合物與化合物(M1-1)之反應時之溶劑相同之溶劑。較佳為乙腈、乙醇、甲醇、2-丁酮、甲苯、2-丁酮、四氫呋喃、二噁烷。 The reaction of compound (M1-4), compound (b-2) and compound (b-3) with a base can be carried out in the presence of a solvent. Examples of the solvent include the same solvents as those used for the reaction of at least one compound selected from the group consisting of compound (M1-2) and compound (M1-3) and compound (M1-1). Preferred are acetonitrile, ethanol, methanol, 2-butanone, toluene, 2-butanone, tetrahydrofuran, and dioxane.
又,溶劑較佳為脫水溶劑。 Also, the solvent is preferably a dehydration solvent.
化合物(M1-4)、化合物(b-2)及化合物(b-3)與鹼之反應時間通常為0.05至100小時。 The reaction time of compound (M1-4), compound (b-2) and compound (b-3) with the base is usually 0.05 to 100 hours.
化合物(M1-4)、化合物(b-2)及化合物(b-3)與鹼之反應溫度通常為-100至200℃。 The reaction temperature of compound (M1-4), compound (b-2) and compound (b-3) with a base is usually -100 to 200°C.
相對於化合物(M1-4)1莫耳,化合物(b-2)之使用量通常為0.01至10莫耳。 Compound (b-2) is usually used in an amount of 0.01 to 10 moles relative to 1 mole of compound (M1-4).
相對於化合物(M1-4)1莫耳,化合物(b-3)之使用量通常為0.01至10莫耳。 Compound (b-3) is usually used in an amount of 0.01 to 10 moles relative to 1 mole of compound (M1-4).
相對於化合物(M1-4)1莫耳,鹼之使用量通常為0.01至10莫耳。 The base is usually used in an amount of 0.01 to 10 moles relative to 1 mole of compound (M1-4).
化合物(M1-4)可使用市售品,可舉出7-羥基-2,3,4,4a,5,6-六氫萘-2-酮等。 Compound (M1-4) can use a commercial item, and 7-hydroxy-2,3,4,4a,5,6-hexahydronaphthalene-2-one etc. are mentioned.
化合物(b-2)及化合物(b-3)各自獨立地可使用市售品,可列舉例如:丙二腈、2-氰基乙醯胺、氰基乙酸、氰基乙酸甲酯、氰基乙酸乙酯、氰基乙酸丙酯、氰基乙酸異丙酯、氰基乙酸丁酯、氰基乙酸第三丁酯、氰基乙酸2-乙基己酯、氰基乙酸2-乙氧基乙酯、2-氰基-N,N-二甲基乙醯胺、新戊醯基乙腈、氰基乙醯脲、 苯甲醯基乙腈、2-氰基乙醯苯胺、3-側氧基-3-(2-噻吩基)丙腈、乙醯基乙酸甲酯、雙甲酮、1,3-環丙二酮、特羅尼酸(Tetronic acid)、乙醯基丙酮、丙二醯胺、丙二酸、1,3-環己烷二酮、2,4-哌啶二酮、1,3-環庚烷二酮、巴比妥酸、3,5-庚烷二酮、丙二酸二甲酯、米氏酸、1,3-茚滿二酮、三氟乙醯基丙酮、1,3-二甲基巴比妥酸、1,3-二環己基巴比妥酸、2-硫代巴比妥酸、1,3-二乙基-2-硫代巴比妥酸等。 Compound (b-2) and compound (b-3) each independently can use a commercial item, for example: malononitrile, 2-cyanoacetamide, cyanoacetic acid, methyl cyanoacetate, cyano Ethyl acetate, propyl cyanoacetate, isopropyl cyanoacetate, butyl cyanoacetate, tert-butyl cyanoacetate, 2-ethylhexyl cyanoacetate, 2-ethoxyethyl cyanoacetate ester, 2-cyano-N,N-dimethylacetamide, pivalylacetonitrile, cyanoacetylurea, Benzoylacetonitrile, 2-cyanoacetylaniline, 3-oxo-3-(2-thienyl)propionitrile, methyl acetylacetate, dimedone, 1,3-cyclopropanedione , Tetronic acid, acetylacetone, malonamide, malonic acid, 1,3-cyclohexanedione, 2,4-piperidinedione, 1,3-cycloheptane Diketone, barbituric acid, 3,5-heptanedione, dimethyl malonate, Michaelis acid, 1,3-indandione, trifluoroacetylacetone, 1,3-dimethyl Base barbituric acid, 1,3-dicyclohexyl barbituric acid, 2-thiobarbituric acid, 1,3-diethyl-2-thiobarbituric acid, etc.
此外,X1及X2為相同之基,R3及R4為相同之基且R5及R6為相同之基時,化合物(b-2)與化合物(b-3)為相同之化合物。 In addition, when X1 and X2 are the same group, R3 and R4 are the same group, and R5 and R6 are the same group, compound (b - 2 ) and compound (b- 3 ) are the same compound .
鹼可列舉與可使用於選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少一種之化合物與化合物(M1-1)進行反應時之鹼相同之鹼。 Examples of the base include the same bases as those used in the reaction between at least one compound selected from the group consisting of compound (M1-2) and compound (M1-3) and compound (M1-1).
化合物(M1-1)通常具有源自鹼之陽離子。例如,只要源自鹼之陽離子為1價,則可獲得1價陽離子與1個式(M1-1)表示之陰離子構成之化合物。只要源自鹼之陽離子為2價,則可獲得2價陽離子與2個式(M1-1)表示之陰離子構成之化合物。 Compound (M1-1) usually has a cation derived from a base. For example, as long as the cation derived from the base is monovalent, a compound composed of a monovalent cation and one anion represented by the formula (M1-1) can be obtained. As long as the cation derived from the base is divalent, a compound composed of a divalent cation and two anions represented by the formula (M1-1) can be obtained.
<化合物(I)之製造方法(2)> <Production method (2) of compound (I)>
化合物(I)之陰離子部係可藉由使式(M-A)表示之化合物(以下,亦稱為化合物(M-A))及化合物(b-3)進行反應而製造。 The anion portion of compound (I) can be produced by reacting a compound represented by formula (M-A) (hereinafter also referred to as compound (M-A)) and compound (b-3).
化合物(M-A)與化合物(b-3)之反應較佳在催化劑存在下進行。 The reaction of compound (M-A) and compound (b-3) is preferably carried out in the presence of a catalyst.
催化劑可列舉:甲酸、乙酸、三氟乙酸等羧酸;氯化銨;四氯化鈦、氯化鋁、異丙醇鋁、三溴化硼、三氟化硼、氯化鐵、氯化鉀、四氯化锡、鑭系元素三氟甲 磺酸鹽等路易士酸;甲磺酸酐、對甲苯磺酸酐、三氟甲磺酸酐、九氟丁磺酸酐等磺酸酐;對甲苯磺酸、三氟甲磺酸、氟硫酸等磺酸;二甲基硫酸、三氟甲磺酸甲酯(三氟甲磺酸甲酯)、碘甲烷、三甲基氧鎓四氟硼酸鹽、氟硫酸二甲酯等親電子性烷基化劑;對甲苯磺醯氯、三氟甲磺醯氯等磺酸鹵化物等。較佳為親電子性烷基化劑、磺酸酐或磺酸鹵化物,更佳為二甲基硫酸、三氟甲磺酸甲酯、對甲苯磺酸酐或三氟甲磺酸酐、對甲苯磺醯氯、三氟甲磺醯氯,再更佳為三氟甲磺酸甲酯或三氟甲磺酸酐。 Catalysts include: carboxylic acids such as formic acid, acetic acid, and trifluoroacetic acid; ammonium chloride; titanium tetrachloride, aluminum chloride, aluminum isopropoxide, boron tribromide, boron trifluoride, ferric chloride, potassium chloride , tin tetrachloride, lanthanide trifluoromethane Sulfonates and other Lewis acids; methanesulfonic anhydride, p-toluenesulfonic anhydride, trifluoromethanesulfonic anhydride, nonafluorobutanesulfonic anhydride and other sulfonic anhydrides; p-toluenesulfonic acid, trifluoromethanesulfonic acid, fluorosulfuric acid and other sulfonic acids; Electrophilic alkylating agents such as methyl sulfuric acid, methyl trifluoromethanesulfonate (methyl trifluoromethanesulfonate), methyl iodide, trimethyloxonium tetrafluoroborate, dimethyl fluorosulfate, etc.; p-toluene Sulphonic acid halides such as sulfonyl chloride and trifluoromethanesulfonyl chloride, etc. Preferred are electrophilic alkylating agents, sulfonic anhydrides or sulfonic acid halides, more preferred are dimethylsulfuric acid, methyl trifluoromethanesulfonate, p-toluenesulfonic anhydride or trifluoromethanesulfonic anhydride, p-toluenesulfonyl Chlorine, trifluoromethanesulfonyl chloride, more preferably methyl trifluoromethanesulfonate or trifluoromethanesulfonic anhydride.
化合物(M-A)與化合物(b-3)之反應較佳是在鹼存在下進行。 The reaction of compound (M-A) and compound (b-3) is preferably carried out in the presence of a base.
鹼可列舉與可使用於選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少一種之化合物與化合物(M1-1)之反應時之鹼相同之鹼。 Examples of the base include the same bases as those used in the reaction between at least one compound selected from the group consisting of compound (M1-2) and compound (M1-3) and compound (M1-1).
化合物(M-A)與化合物(b-3)之反應可在溶劑存在下進行。溶劑可列舉與可使用於選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少一種之化合物與化合物(M1-1)之反應時之溶劑相同之溶劑。 The reaction of compound (M-A) and compound (b-3) can be carried out in the presence of a solvent. Examples of the solvent include the same solvents as those used for the reaction of at least one compound selected from the group consisting of compound (M1-2) and compound (M1-3) and compound (M1-1).
又,溶劑較佳為脫水溶劑。 Also, the solvent is preferably a dehydration solvent.
化合物(M-A)與化合物(b-3)之反應較佳為藉由將催化劑與化合物(M-A)及化合物(b-3)混合實施,更佳為藉由將催化劑、鹼、化合物(M-A)及化合物(b-3)混合而實施。 The reaction of compound (M-A) and compound (b-3) is preferably carried out by mixing catalyst with compound (M-A) and compound (b-3), more preferably by catalyst, base, compound (M-A) and Compound (b-3) is mixed and implemented.
化合物(M-A)與化合物(b-3)之反應較佳於脫氧環境下(例如氮環境下)實施。 The reaction between compound (M-A) and compound (b-3) is preferably carried out in a deoxygenated environment (such as nitrogen environment).
相對於化合物(M-A)1莫耳,化合物(b-3)之使用量通常為0.01至20莫耳,較佳為0.1至10莫耳。 Compound (b-3) is usually used in an amount of 0.01 to 20 mol, preferably 0.1 to 10 mol, relative to 1 mol of compound (M-A).
相對於化合物(M-A)1莫耳,催化劑之使用量通常為0.001至20莫耳,較佳為0.1至10莫耳。 The catalyst is usually used in an amount of 0.001 to 20 moles, preferably 0.1 to 10 moles, relative to 1 mole of compound (M-A).
相對於化合物(M-A)1莫耳,鹼之使用量通常為0.001至20莫耳,較佳為0.1至10莫耳。 The base is usually used in an amount of 0.001 to 20 moles, preferably 0.1 to 10 moles, relative to 1 mole of compound (M-A).
化合物(M-A)與化合物(b-3)之反應時間通常為0.01至200小時。 The reaction time of compound (M-A) and compound (b-3) is usually 0.01 to 200 hours.
化合物(M-A)與化合物(b-3)之反應溫度通常為-100至200℃。 The reaction temperature of compound (M-A) and compound (b-3) is usually -100 to 200°C.
化合物(M-A)可列舉例如下列化合物。 Compound (M-A) includes, for example, the following compounds.
將化合物(M-A)及化合物(b-3)於鹼存在下進行反應時,可獲得具有源自鹼之陽離子及式(I)表示之陰離子之化合物(I)。 When compound (M-A) and compound (b-3) are reacted in the presence of a base, compound (I) having a cation derived from the base and an anion represented by formula (I) can be obtained.
欲將化合物(I)之陽離子交換成期望之陽離子時,可藉由將化合物(I)與具有期望之陽離子之鹽混合,進行離子交換。前述離子交換可在溶劑存在下進行。具有期望之陽離子之鹽可列舉例如:由期望之陽離子及氯化物離子構成之氯化物鹽、由期望之陽離子及溴化物離子構成之溴化物鹽、由期望之陽離子及碘化物離子構成之碘化物鹽、由期望之陽離子及氟化物離子構成之氟化物鹽、由期望之陽離子及硝酸離子構成之硝酸鹽、由期望之陽離子及硫酸離子構成之硫酸鹽、由期望之陽離子及過氯酸離子構成之過氯酸鹽、由期望之陽離子及磺酸離子構成之磺酸鹽、由期望之陽離子及羧酸離子構成之羧酸鹽、由期望之陽離子及次氯酸離子構成之次氯酸鹽、由期望之陽離子及六氟磷酸構成之六氟磷酸鹽、由期望之陽離子及醯亞胺構成之醯亞胺鹽等。 When the cation of compound (I) is to be exchanged for a desired cation, ion exchange can be performed by mixing compound (I) with a salt having the desired cation. The aforementioned ion exchange can be performed in the presence of a solvent. Salts with desired cations include, for example, chloride salts composed of desired cations and chloride ions, bromide salts composed of desired cations and bromide ions, and iodides composed of desired cations and iodide ions. Salts, fluoride salts consisting of desired cations and fluoride ions, nitrates consisting of desired cations and nitrate ions, sulfate salts consisting of desired cations and sulfate ions, desired cations and perchlorate ions Perchlorate, sulfonate composed of desired cation and sulfonate ion, carboxylate composed of desired cation and carboxylate ion, hypochlorite composed of desired cation and hypochlorite ion, A hexafluorophosphate salt consisting of a desired cation and hexafluorophosphoric acid, an imide salt consisting of a desired cation and an imide, and the like.
化合物(M-A)可藉由在催化劑存在下,使式(M)表示之化合物(以下,亦稱為化合物(M))與化合物(b-2)進行反應而製造。 Compound (M-A) can be produced by reacting a compound represented by formula (M) (hereinafter also referred to as compound (M)) and compound (b-2) in the presence of a catalyst.
催化劑可列舉與可使用於化合物(M-A)與化合物(b-3)之反應時之催化劑相同之催化劑。較佳為親電子性烷基化劑、磺酸酐或磺酸鹵化物,更佳為二甲基硫酸、三氟甲磺酸甲酯、對甲苯磺酸酐或三氟甲磺酸酐、對甲苯磺醯氯、三氟甲烷磺醯氯,再更佳為三氟甲磺酸甲酯或三氟甲磺酸酐。 Examples of the catalyst include the same catalysts as those usable for the reaction between the compound (M-A) and the compound (b-3). Preferred are electrophilic alkylating agents, sulfonic anhydrides or sulfonic acid halides, more preferred are dimethylsulfuric acid, methyl trifluoromethanesulfonate, p-toluenesulfonic anhydride or trifluoromethanesulfonic anhydride, p-toluenesulfonyl Chlorine, trifluoromethanesulfonyl chloride, more preferably methyl trifluoromethanesulfonate or trifluoromethanesulfonic anhydride.
化合物(M)與化合物(b-2)之反應較佳是進一步於鹼存在下進行。 The reaction between compound (M) and compound (b-2) is preferably further carried out in the presence of a base.
鹼可列舉與可使用於選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少一種之化合物與化合物(M1-1)之反應時之鹼相同之鹼,較佳為金屬醇鹽、金屬氫氧化物、金屬氫化物、金屬碳酸鹽、有機鋰、金屬醯胺化合物、胺化合物或金屬羧酸鹽,更佳為乙醇鉀、第三丁醇鈉、第三丁醇鉀、氫氧化鈉、氫氧化鉀、氫化鈉、氫化鋁鋰、碳酸鈉、碳酸氫鈉、碳酸鉀、碳酸氫鉀、甲基鋰、正丁基鋰、第三丁基鋰、二異丙基胺基鋰、2,2,6,6-四甲基哌啶鋰、(雙三甲基矽基)醯胺化鋰、四甲基哌啶鋰、吡啶、2,6-二甲基吡啶、2,6-二第三丁基吡啶、三乙胺、二異丙基乙胺、三異丙胺、2,2,6,6-四甲基哌啶、哌啶、吡咯啶、脯胺酸、苯胺、N,N-二甲基苯胺、乙酸鈉、甲酸鈉、乙酸銨。 Examples of the base include the same base as the base that can be used in the reaction between at least one compound selected from the group consisting of compound (M1-2) and compound (M1-3) and compound (M1-1), preferably It is metal alkoxide, metal hydroxide, metal hydride, metal carbonate, organic lithium, metal amide compound, amine compound or metal carboxylate, more preferably potassium ethylate, sodium tertiary butoxide, tertiary butanol Potassium, sodium hydroxide, potassium hydroxide, sodium hydride, lithium aluminum hydride, sodium carbonate, sodium bicarbonate, potassium carbonate, potassium bicarbonate, methyl lithium, n-butyl lithium, tertiary butyl lithium, diisopropyl Lithium amide, lithium 2,2,6,6-tetramethylpiperidine, lithium (bistrimethylsilyl)amide, lithium tetramethylpiperidine, pyridine, 2,6-lutidine, 2,6-di-tert-butylpyridine, triethylamine, diisopropylethylamine, triisopropylamine, 2,2,6,6-tetramethylpiperidine, piperidine, pyrrolidine, proline, Aniline, N,N-dimethylaniline, sodium acetate, sodium formate, ammonium acetate.
化合物(M)與化合物(b-2)之反應可在溶劑存在下進行。溶劑可列舉與可使用於選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少一種之化合物與化合物(M1-1)之反應時之溶劑相同之溶劑。溶劑較佳為乙腈、甲醇、乙醇、甲苯、2-丁酮、二噁烷、四氫呋喃、二甲亞碸、二甲基甲醯胺或二甲基乙醯胺。 The reaction of compound (M) and compound (b-2) can be carried out in the presence of a solvent. Examples of the solvent include the same solvents as those used for the reaction of at least one compound selected from the group consisting of compound (M1-2) and compound (M1-3) and compound (M1-1). The solvent is preferably acetonitrile, methanol, ethanol, toluene, 2-butanone, dioxane, tetrahydrofuran, dimethylsulfoxide, dimethylformamide or dimethylacetamide.
又,溶劑較佳為脫水溶劑。 Also, the solvent is preferably a dehydration solvent.
化合物(M)與化合物(b-2)之反應係藉由將催化劑、化合物(M)及化合物(b-2)混合實施,較佳為藉由將催化劑、鹼、化合物(M)及化合物(b-2)混合而實施。 The reaction of the compound (M) and the compound (b-2) is carried out by mixing the catalyst, the compound (M) and the compound (b-2), preferably by mixing the catalyst, the base, the compound (M) and the compound ( b-2) mixed and implemented.
化合物(M)與化合物(b-2)之反應較佳在脫氧環境下(例如氮環境下)實施。 The reaction between compound (M) and compound (b-2) is preferably carried out in a deoxygenated environment (for example, nitrogen environment).
相對於化合物(M)1莫耳,化合物(b-2)之使用量通常為0.01至20莫耳,較佳為0.1至10莫耳。 The compound (b-2) is usually used in an amount of 0.01 to 20 mol, preferably 0.1 to 10 mol, relative to 1 mol of compound (M).
相對於化合物(M)1莫耳,催化劑之使用量通常為0.001至20莫耳,較佳為0.1至10莫耳。 The catalyst is usually used in an amount of 0.001 to 20 mol, preferably 0.1 to 10 mol, relative to 1 mol of compound (M).
相對於化合物(M)1莫耳,鹼之使用量通常為0.001至20莫耳,較佳為0.1至10莫耳。 The base is usually used in an amount of 0.001 to 20 moles, preferably 0.1 to 10 moles, relative to 1 mole of compound (M).
化合物(M)與化合物(b-2)之反應時間通常為0.1至200小時。 The reaction time of compound (M) and compound (b-2) is usually 0.1 to 200 hours.
化合物(M)與化合物(b-2)之反應溫度通常為-100至200℃。 The reaction temperature of compound (M) and compound (b-2) is usually -100 to 200°C.
<化合物(M)> <compound (M)>
化合物(M)為具有下述式表示之結構之新穎化合物,為化合物(I)之合成中間物。 Compound (M) is a novel compound having a structure represented by the following formula, and is a synthetic intermediate of compound (I).
化合物(M)可列舉下列化合物等。 As compound (M), the following compounds etc. are mentioned.
<化合物(M)之製造方法> <Method for producing compound (M)>
化合物(M)係可藉由使式(M1-4)表示之化合物(以下,亦稱為化合物(M1-4))與選自由化合物(M1-2)及式(M1-3)構成之群組中之至少一種化合物進行反應而製造。 Compound (M) can be obtained by making a compound represented by formula (M1-4) (hereinafter also referred to as compound (M1-4)) and a group selected from compound (M1-2) and formula (M1-3) At least one compound in the group is reacted to produce.
E2表示之脫離基可列舉與E1表示之脫離基相同之基。 The leaving group represented by E2 includes the same groups as the leaving group represented by E1.
化合物(M1-4)與選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少一種之化合物之反應較佳是在鹼存在下進行。 The reaction between compound (M1-4) and at least one compound selected from the group consisting of compound (M1-2) and compound (M1-3) is preferably performed in the presence of a base.
鹼可列舉與可使用於選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少一種之化合物與化合物(M1-1)之反應時之鹼相同之鹼,較佳為金屬醇鹽、金屬氫氧化物、金屬氫化物、金屬碳酸鹽、有機鋰、金屬醯胺化合物、胺化合物或金屬羧酸鹽,更佳為乙醇鉀、第三丁醇鈉、第三丁醇鉀、氫氧化鈉、氫氧化鉀、氫化鈉、氫化鋁鋰、碳酸鈉、碳酸氫鈉、碳酸鉀、碳酸氫鉀、甲基鋰、正丁基鋰、第三丁基鋰、二異丙基胺基鋰、2,2,6,6-四甲基哌啶鋰、(雙三甲基矽基)醯胺化鋰、四甲基哌啶鋰、吡啶、2,6-二甲基吡啶、2,6-二第三丁基吡啶、三乙胺、二異丙基乙胺、三異丙胺、2,2,6,6-四甲基哌啶、哌啶、吡咯啶、脯胺酸、苯胺、N,N-二甲基苯胺、乙酸鈉、甲酸鈉、乙酸銨。 Examples of the base include the same base as the base that can be used in the reaction between at least one compound selected from the group consisting of compound (M1-2) and compound (M1-3) and compound (M1-1), preferably It is metal alkoxide, metal hydroxide, metal hydride, metal carbonate, organic lithium, metal amide compound, amine compound or metal carboxylate, more preferably potassium ethylate, sodium tertiary butoxide, tertiary butanol Potassium, sodium hydroxide, potassium hydroxide, sodium hydride, lithium aluminum hydride, sodium carbonate, sodium bicarbonate, potassium carbonate, potassium bicarbonate, methyl lithium, n-butyl lithium, tertiary butyl lithium, diisopropyl Lithium amide, lithium 2,2,6,6-tetramethylpiperidine, lithium (bistrimethylsilyl)amide, lithium tetramethylpiperidine, pyridine, 2,6-lutidine, 2,6-di-tert-butylpyridine, triethylamine, diisopropylethylamine, triisopropylamine, 2,2,6,6-tetramethylpiperidine, piperidine, pyrrolidine, proline, Aniline, N,N-dimethylaniline, sodium acetate, sodium formate, ammonium acetate.
相對於化合物(M1-4)1莫耳,鹼之使用量通常為0.001至20莫耳,較佳為0.1至10莫耳。 The base is usually used in an amount of 0.001 to 20 moles, preferably 0.1 to 10 moles, relative to 1 mole of compound (M1-4).
化合物(M1-4)與選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少一種之化合物之反應係可在溶劑存在下進行。溶劑可列舉與可使用於選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少一種之化合物與化合物(M1-1)之反應時之溶劑相同之溶劑。較佳為乙腈、甲醇、乙醇、甲苯、2-丁酮、二噁烷、四氫呋喃、二甲亞碸、二甲基甲醯胺、二甲基乙醯胺。 The reaction between compound (M1-4) and at least one compound selected from the group consisting of compound (M1-2) and compound (M1-3) can be performed in the presence of a solvent. Examples of the solvent include the same solvents as those used in the reaction of at least one compound selected from the group consisting of compound (M1-2) and compound (M1-3) and compound (M1-1). Preferred are acetonitrile, methanol, ethanol, toluene, 2-butanone, dioxane, tetrahydrofuran, dimethylsulfoxide, dimethylformamide, and dimethylacetamide.
又,溶劑較佳為脫水溶劑。 Also, the solvent is preferably a dehydration solvent.
化合物(M1-4)與選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少一種之化合物之反應,係藉由將化合物(M1-4)與選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少一種之化合物混合實施,較佳為藉由將鹼、化合物(M1-4)、選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少一種之化合物混合而實施。 The reaction of the compound (M1-4) with at least one compound selected from the group consisting of the compound (M1-2) and the compound (M1-3) is carried out by combining the compound (M1-4) with the compound selected from the compound ( ( M1-3) at least one compound in the group consisting of mixed and implemented.
化合物(M1-4)與選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少一種之化合物之反應較佳是在脫氧環境下(例如氮環境下)實施。 The reaction of compound (M1-4) with at least one compound selected from the group consisting of compound (M1-2) and compound (M1-3) is preferably carried out in a deoxygenated environment (for example, nitrogen environment).
相對於化合物(M1-4)1莫耳,化合物(M1-2)之使用量通常為0.1至20莫耳,較佳為0.5至10莫耳。 Compound (M1-2) is usually used in an amount of 0.1 to 20 mol, preferably 0.5 to 10 mol, relative to 1 mol of compound (M1-4).
相對於化合物(M1-4)1莫耳,化合物(M1-3)之使用量通常為0.1至20莫耳,較佳為0.5至10莫耳。 Compound (M1-3) is usually used in an amount of 0.1 to 20 mol, preferably 0.5 to 10 mol, relative to 1 mol of compound (M1-4).
相對於化合物(M1-4)1莫耳,鹼之使用量通常為0.001至20莫耳,較佳為0.1至10莫耳。 The base is usually used in an amount of 0.001 to 20 moles, preferably 0.1 to 10 moles, relative to 1 mole of compound (M1-4).
化合物(M1-4)與選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少一種之化合物之反應時間通常為0.1至200小時。 The reaction time between compound (M1-4) and at least one compound selected from the group consisting of compound (M1-2) and compound (M1-3) is usually 0.1 to 200 hours.
化合物(M1-4)與選自由化合物(M1-2)及化合物(M1-3)構成之群組中之至少 一種之化合物之反應溫度通常為-100至200℃。 Compound (M1-4) and at least one selected from the group consisting of compound (M1-2) and compound (M1-3) The reaction temperature of one compound is usually -100 to 200°C.
<含有化合物(I)之組成物> <Composition Containing Compound (I)>
本發明亦包含含有化合物(I)之組成物。由含有化合物(I)組成物成形之成形體,係於含有之化合物(I)最大吸收波長[nm]中之穿透率較佳為50%以下,更佳為30%以下,再更佳為15%以下,最佳為10%以下。 The present invention also includes compositions containing compound (I). The shaped article formed from a composition containing compound (I) preferably has a transmittance at the maximum absorption wavelength [nm] of the compound (I) contained at 50% or less, more preferably 30% or less, even more preferably Below 15%, the best is below 10%.
含有化合物(I)之組成物較佳為含有化合物(I)及樹脂之樹脂組成物(以下,亦稱為「樹脂組成物」)或含有化合物(I)及聚合性單體之組成物(以下,亦稱為「組成物(1)」)。 The composition containing compound (I) is preferably a resin composition containing compound (I) and a resin (hereinafter also referred to as "resin composition") or a composition containing compound (I) and a polymerizable monomer (hereinafter , also referred to as "composition (1)").
含有化合物(I)之組成物可使用於所有之用途中,其中,特別適合使用於有可能暴露於日光或含有紫外線之光之用途。具體例可列舉例如:玻璃代替品及其表面塗覆材料;住宅、設備、輸送機器等窗玻璃、採光玻璃及光源保護玻璃用之塗覆材料;住宅、設備、輸送機器等之窗膜;住宅、設備、輸送機器等之內外部材料及內外部用塗料及經由該塗料形成之塗膜;醇酸樹脂漆塗料及經由該塗料形成之塗膜;丙烯酸漆塗料及經由該塗料形成之塗膜;螢光燈、水銀燈等發出紫外線之光源用材料;精密機械、電子電氣機器用材料、從各種顯示器發生之電磁波等之遮斷用材料;食品、化學品、藥品等之容器或包裝材料;瓶子、盒子、水泡、杯子、特殊包裝用、光盤外套、農工業用片或膜材料;印刷物、染色物、染顏料等之褪色防止劑;聚合物載體用(例如如機械及汽車零件之塑膠製零件用)之保護膜;印刷物外塗層;噴墨介質被膜;積層啞光;光學光膜;安全玻璃/擋風玻璃中間層;電致色變/光致變色用途;覆膜;太陽能熱控制膜;防曬霜、洗髮乳、潤絲精、整髮料等化妝品;運動服、長筒襪、帽子等衣料用纖維製品及纖維;窗簾、地毯、壁紙等家庭用內裝品;塑料鏡片、隱形眼鏡、義眼等醫 療用器具;濾光器、背光顯示膜、稜鏡、鏡、照片材料等光學用品;模膜、轉移貼紙、防塗鴉膜、膠帶、墨水等文具;標示板、標示器等及其表面塗覆材料等。 The composition containing compound (I) can be used in all applications, and among them, it is particularly suitable for applications that may be exposed to sunlight or light containing ultraviolet rays. Specific examples include: glass substitutes and their surface coating materials; window glass, lighting glass, and light source protection glass for housing, equipment, and conveying equipment; coating materials for housing, equipment, and conveying equipment, etc.; window films for housing, equipment, and conveying equipment; , equipment, conveying machines, etc., internal and external materials, internal and external coatings and coating films formed by such coatings; alkyd resin coatings and coating films formed by such coatings; acrylic paint coatings and coating films formed by such coatings; Materials for light sources emitting ultraviolet rays such as fluorescent lamps and mercury lamps; materials for precision machinery, electronic and electrical equipment, and materials for blocking electromagnetic waves generated from various displays; containers or packaging materials for food, chemicals, medicines, etc.; bottles, Boxes, blisters, cups, special packaging, disc jackets, sheet or film materials for agricultural industry; anti-fading agents for printed matter, dyed matter, dyed pigments, etc.; for polymer carriers (such as plastic parts for machinery and automobile parts) ) protective film; outer coating of printed matter; inkjet media coating; laminated matte; optical light film; safety glass/windshield interlayer; electrochromic/photochromic applications; Cosmetics such as sunscreen, shampoo, conditioner, and hair styling materials; fiber products and fibers for clothing such as sportswear, stockings, and hats; household interior products such as curtains, carpets, and wallpapers; plastic lenses, contact lenses , prosthetic eye and other doctors Medical appliances; optical products such as optical filters, backlight display films, screens, mirrors, and photographic materials; stationery such as mold films, transfer stickers, anti-graffiti films, tapes, inks, etc.; sign boards, markers, etc. and their surface coatings materials etc.
由本發明之組成物形成之成形體之形狀可為平膜狀、粉狀、球狀粒子狀、破碎粒子狀、塊狀連續體、纖維狀、管狀、中空絲狀、粒狀、板狀、多孔質狀等任一種形狀。 The shape of the molded body formed by the composition of the present invention can be flat film, powder, spherical particle, broken particle, block continuous body, fiber, tube, hollow fiber, granular, plate, porous Any kind of shape.
於上述樹脂組成物中使用之樹脂可列舉公知之各種成形體、於製造片、膜等傳統使用之熱塑性樹脂及熱固化性樹脂等。 The resin used in the above-mentioned resin composition includes various known moldings, thermoplastic resins and thermosetting resins conventionally used in the production of sheets, films, and the like.
熱塑性樹脂可列舉例如:聚乙烯樹脂、聚丙烯樹脂、聚環烯烴樹脂等烯烴系樹脂、聚(甲基)丙烯酸酯系樹脂、聚苯乙烯系樹脂、苯乙烯-丙烯腈系樹脂、丙烯腈-丁二烯-苯乙烯系樹脂、聚氯化乙烯系樹脂、聚氯化亞乙烯系樹脂、聚乙酸乙烯系樹脂、聚乙烯醇縮丁醛系樹脂、乙烯-乙酸乙烯系共聚物、乙烯-乙烯醇系樹脂、聚對苯二甲酸乙二醇酯樹脂、聚對苯二甲酸丁二醇酯樹脂、液晶聚酯樹脂等聚酯系樹脂、聚縮醛樹脂、聚醯胺樹脂、聚碳酸酯樹脂、聚胺基甲酸乙酯樹脂及聚苯硫醚樹脂等。亦可將此等樹脂作為一種或二種以上之聚合物共混物或聚合物合金使用。 Examples of thermoplastic resins include olefin resins such as polyethylene resins, polypropylene resins, and polycycloolefin resins, poly(meth)acrylate resins, polystyrene resins, styrene-acrylonitrile resins, acrylonitrile- Butadiene-styrene resin, polyvinyl chloride resin, polyvinylidene chloride resin, polyvinyl acetate resin, polyvinyl butyral resin, ethylene-vinyl acetate copolymer, ethylene-ethylene Polyester resins such as alcohol resins, polyethylene terephthalate resins, polybutylene terephthalate resins, liquid crystal polyester resins, polyacetal resins, polyamide resins, polycarbonate resins , polyurethane resin and polyphenylene sulfide resin, etc. These resins can also be used as one or two or more polymer blends or polymer alloys.
熱固化性樹脂可列舉例如:環氧樹脂、三聚氰胺樹脂、不飽和聚酯樹脂、苯酚樹脂、脲樹脂、醇酸樹脂、熱固化性聚醯亞胺樹脂等。 Examples of thermosetting resins include epoxy resins, melamine resins, unsaturated polyester resins, phenol resins, urea resins, alkyd resins, and thermosetting polyimide resins.
於將上述樹脂組成物作為紫外線吸收濾光片或紫外線吸收膜使用時,樹脂較佳為透明樹脂。 When the above-mentioned resin composition is used as an ultraviolet absorbing filter or an ultraviolet absorbing film, the resin is preferably a transparent resin.
上述樹脂組成物可藉由將化合物(I)與樹脂混合獲得。化合物(I)可含有用以賦予所期望性能之必須量即可,例如對於樹脂100質量份,可含有0.00001至99質量份等。 The above-mentioned resin composition can be obtained by mixing compound (I) with a resin. The compound (I) may be contained in an amount necessary to impart desired performance, for example, 0.00001 to 99 parts by mass with respect to 100 parts by mass of the resin.
樹脂組成物因應所需可含有溶劑、交聯催化劑、黏著賦予樹脂、塑化劑、軟化劑、染料、顏料、無機填料等其他添加物。 The resin composition may contain other additives such as solvents, crosslinking catalysts, tackifying resins, plasticizers, softeners, dyes, pigments, inorganic fillers, etc. as needed.
於上述組成物(1)中使用之聚合性單體無特別限定,較佳為自由基聚合性單體,更佳為光自由基聚合性單體,再更佳為(甲基)丙烯酸酯。 The polymerizable monomer used in the above composition (1) is not particularly limited, but is preferably a radical polymerizable monomer, more preferably a photoradical polymerizable monomer, and even more preferably a (meth)acrylate.
(甲基)丙烯酸酯可列舉於分子內具有1個(甲基)丙烯醯氧基之單官能(甲基)丙烯酸酯單體、分子內具有2個(甲基)丙烯醯氧基之2官能(甲基)丙烯酸酯單體、分子內具有3個以上(甲基)丙烯醯氧基之多官能(甲基)丙烯酸酯單體。 (Meth)acrylates include monofunctional (meth)acrylate monomers with one (meth)acryloxy group in the molecule, and bifunctional (meth)acrylate monomers with two (meth)acryloxy groups in the molecule. (Meth)acrylate monomers, polyfunctional (meth)acrylate monomers having 3 or more (meth)acryloxy groups in the molecule.
組成物(1)較佳為更含有聚合起始劑。聚合性單體為自由基聚合性單體時,聚合起始劑較佳為自由基聚合起始劑,更佳為光聚合起始劑。 The composition (1) preferably further contains a polymerization initiator. When the polymerizable monomer is a radical polymerizable monomer, the polymerization initiator is preferably a radical polymerization initiator, more preferably a photopolymerization initiator.
組成物(1)可藉由將化合物(I)與聚合性單體混合獲得。化合物(I)可含有用以賦予期望性能之必須量即可,例如相對於聚合性單體100質量份,可含有0.01至20質量份等。 Composition (1) can be obtained by mixing compound (I) and a polymerizable monomer. The compound (I) may be contained in an amount necessary to impart desired performance, for example, 0.01 to 20 parts by mass based on 100 parts by mass of the polymerizable monomer.
組成物(1)因應所需時可含有溶劑、交聯催化劑、黏著賦予樹脂、塑化劑、軟化劑、染料、顏料、無機填料等其他添加物。 The composition (1) may contain solvents, crosslinking catalysts, tackifier resins, plasticizers, softeners, dyes, pigments, inorganic fillers, and other additives as needed.
將本發明之組成物使用於光學膜等光學用品時,可適用於例如影像顯示裝置。將本發明之組成物適用於影像顯示裝置時,由本發明之組成物形成之光學層可適用於膜層、黏著劑層、塗覆層等任一種,較佳為黏著劑層或塗覆層。 When the composition of the present invention is used in optical articles such as optical films, it can be applied to image display devices, for example. When the composition of the present invention is applied to an image display device, the optical layer formed from the composition of the present invention can be applied to any of film layer, adhesive layer, coating layer, etc., preferably adhesive layer or coating layer.
將本發明之組成物使用於光學用品時,可為只由本發明之組成物形成之光學層,亦可為將由本發明之組成物形成之光學層與其他層進行積層之光學積層體。其他層可列舉例如:偏光膜、相位差膜、熱塑性樹脂膜等。光學積層體只要是以本發明之光學層、黏接著劑層、偏光膜之順序進行積層之積層體,則本發明之光學層較佳為由本發明之組成物形成之光學層(光學膜)。光學積層體只要是以 本發明之光學層、熱塑性樹脂膜、黏接著劑層、偏光膜之順序進行積層之積層體,則本發明之光學層較佳為由本發明之組成物形成之光學層(塗覆層)。光學積層體只要是以相位差膜、本發明之光學層、相位差膜之順序進行積層之積層體,則本發明之光學層較佳為由本發明之組成物形成之光學層(黏著劑層)。 When the composition of the present invention is used in an optical article, it may be an optical layer formed only of the composition of the present invention, or an optical layered product in which an optical layer formed of the composition of the present invention is laminated with other layers. As for other layers, a polarizing film, a retardation film, a thermoplastic resin film, etc. are mentioned, for example. The optical layer of the present invention is preferably an optical layer (optical film) formed of the composition of the present invention as long as the optical layered product is a laminate in which the optical layer of the present invention, the adhesive layer, and the polarizing film are laminated in this order. As long as the optical laminate is based on The optical layer of the present invention, a thermoplastic resin film, an adhesive layer, and a polarizing film are laminated in this order, and the optical layer of the present invention is preferably an optical layer (coating layer) formed of the composition of the present invention. The optical layer of the present invention is preferably an optical layer (adhesive layer) formed of the composition of the present invention as long as the optical laminate is a laminate in which the retardation film, the optical layer of the present invention, and the retardation film are laminated in this order. .
<黏著劑組成物> <Adhesive composition>
由本發明之組成物形成之層為黏著劑層時,該層為由含有樹脂(A)、化合物(I)、交聯劑(B)及矽烷化合物(C)之黏著劑組成物(以下,亦稱為黏著劑組成物(i))形成。黏著劑組成物(i)可更含有自由基固化性成分(D)、起始劑(E)、化合物(I)以外之光吸收性化合物(F)(以下,亦稱為光選擇吸收化合物(F))、抗靜電劑等,較佳為含有選自由自由基固化性成分(D)、起始劑(E)及光選擇吸收化合物(F)構成之群組中之至少一種。 When the layer formed by the composition of the present invention is an adhesive layer, the layer is composed of an adhesive composition (hereinafter, also referred to as It is called the formation of adhesive composition (i)). The adhesive composition (i) may further contain a radical curable component (D), an initiator (E), and a light-absorbing compound (F) other than the compound (I) (hereinafter also referred to as a light-selective absorption compound ( F)), antistatic agent, etc., preferably contain at least one selected from the group consisting of radical curable component (D), initiator (E) and photoselective absorption compound (F).
樹脂(A)只要是使用於黏著劑組成物中之樹脂,則無特別限定。樹脂(A)較佳為於波長300nm至波長780nm之範圍未顯示最大吸收者。 Resin (A) will not be specifically limited if it is resin used for an adhesive composition. The resin (A) is preferably one that does not show the maximum absorption in the wavelength range from 300 nm to 780 nm.
樹脂(A)較佳為玻璃轉化溫度(Tg)為40℃以下之樹脂。樹脂(A)之玻璃轉化溫度(Tg)更佳為20℃以下,再更佳為10℃以下,最佳為0℃以下。又,樹脂(A)之玻璃轉化溫度通常為-80℃以上,較佳為-70℃以上,更佳為-60℃以上,再更佳為-55℃以上,最佳為-50℃以上。樹脂(A)之玻璃轉化溫度若為40℃以下,則於提昇對於由黏著劑組成物(i)形成之黏著劑層之黏附物之密著性有利。又,樹脂(A)之玻璃轉化溫度若為-80℃以上,則於提昇由黏著劑組成物(i)形成之黏著劑層之耐久性有利。又,玻璃轉化溫度可藉由差示掃描量熱法(DSC)測定。 The resin (A) is preferably a resin having a glass transition temperature (Tg) of 40°C or lower. The glass transition temperature (Tg) of the resin (A) is more preferably 20°C or lower, still more preferably 10°C or lower, most preferably 0°C or lower. Also, the glass transition temperature of the resin (A) is usually -80°C or higher, preferably -70°C or higher, more preferably -60°C or higher, still more preferably -55°C or higher, most preferably -50°C or higher. If the glass transition temperature of the resin (A) is 40° C. or lower, it is advantageous in improving the adhesion to the adherend of the adhesive layer formed from the adhesive composition (i). In addition, when the glass transition temperature of the resin (A) is -80° C. or higher, it is advantageous in improving the durability of the adhesive layer formed from the adhesive composition (i). In addition, the glass transition temperature can be measured by differential scanning calorimetry (DSC).
樹脂(A)可列舉(甲基)丙烯酸樹脂、聚矽氧系樹脂、橡膠系樹脂、胺基甲酸乙酯系樹脂等,較佳為(甲基)丙烯酸樹脂。 Examples of the resin (A) include (meth)acrylic resins, silicone-based resins, rubber-based resins, and urethane-based resins, and are preferably (meth)acrylic resins.
(甲基)丙烯酸樹脂較佳為將源自(甲基)丙烯酸酯之構成單元作為主成分(較佳含有50質量%以上)之共聚物。源自(甲基)丙烯酸酯之結構單元可含有一種以上源自(甲基)丙烯酸酯以外之單體之結構單元(例如源自具有羥基、羧基、胺基等極性官能基之單體之結構單元)。 The (meth)acrylic resin is preferably a copolymer having a (meth)acrylate-derived structural unit as a main component (preferably containing 50% by mass or more). Structural units derived from (meth)acrylate may contain more than one structural unit derived from monomers other than (meth)acrylate (such as structures derived from monomers with polar functional groups such as hydroxyl, carboxyl, and amino groups) unit).
於黏著劑組成物(i)之固形份100質量%中,樹脂(A)之含量通常為50質量%至99.9質量%,較佳為60質量%至95質量%,更佳為70質量%至90質量%。 The content of the resin (A) in the solid content of the adhesive composition (i) is usually 50 to 99.9% by mass, preferably 60 to 95% by mass, more preferably 70 to 95% by mass. 90% by mass.
相對於樹脂(A)100質量份,化合物(I)之含量通常為0.01至20質量份,較佳為0.1至20質量份,更佳為0.2至10質量份,最佳為0.5至5質量份。 Relative to 100 parts by mass of resin (A), the content of compound (I) is usually 0.01 to 20 parts by mass, preferably 0.1 to 20 parts by mass, more preferably 0.2 to 10 parts by mass, most preferably 0.5 to 5 parts by mass .
交聯劑(B)可列舉:異氰酸酯系交聯劑、環氧系交聯劑、氮丙啶系交聯劑、金屬螯合物系交聯劑等,尤其是從黏著劑組成物之適用期及黏著劑層之耐久性、交聯速度等之觀點而言,較佳為異氰酸酯系交聯劑。 Cross-linking agent (B) can include: isocyanate-based cross-linking agent, epoxy-based cross-linking agent, aziridine-based cross-linking agent, metal chelate-based cross-linking agent, etc., especially from the pot life of the adhesive composition From the viewpoints of the durability of the adhesive layer and the crosslinking speed, etc., an isocyanate-based crosslinking agent is preferred.
相對於樹脂(A)100質量份,交聯劑(B)之含量通常為0.01至25質量份,較佳為0.1至15質量份,更佳為0.15至7質量份,再更佳為0.2至5質量份,最佳為0.25至2質量份。 With respect to 100 parts by mass of the resin (A), the content of the crosslinking agent (B) is usually 0.01 to 25 parts by mass, preferably 0.1 to 15 parts by mass, more preferably 0.15 to 7 parts by mass, and more preferably 0.2 to 7 parts by mass. 5 parts by mass, preferably 0.25 to 2 parts by mass.
矽烷化合物(C)可列舉例如:乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、乙烯基三(2-甲氧基乙氧基)矽烷、3-縮水甘油氧基丙基三甲氧基矽烷、3-縮水甘油氧基丙基三乙氧基矽烷、3-縮水甘油氧基丙基甲基二甲氧基矽烷、3-縮水甘油氧基丙基乙氧基二甲基矽烷、2-(3,4-環氧環己基)乙基三甲氧基矽烷、3-氯丙基甲基二甲氧基矽烷、3-氯丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-巰基丙基三甲氧基矽烷等。 Silane compounds (C) include, for example: vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris(2-methoxyethoxy)silane, 3-glycidyloxypropyltrimethoxy Silane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylethoxydimethylsilane, 2- (3,4-Epoxycyclohexyl)ethyltrimethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, 3-methacryloxypropyl Trimethoxysilane, 3-mercaptopropyltrimethoxysilane, etc.
矽烷化合物(C)亦可為聚矽氧寡聚物。 The silane compound (C) may also be a polysiloxane oligomer.
相對於樹脂(A)100質量份,矽烷化合物(C)之含量通常為0.01至20質量份,較 佳為0.1至10質量份,更佳為0.15至7質量份,再更佳為0.2至5質量份,最佳為0.25至2質量份。 The content of the silane compound (C) is usually 0.01 to 20 parts by mass relative to 100 parts by mass of the resin (A). Preferably it is 0.1 to 10 parts by mass, more preferably 0.15 to 7 parts by mass, still more preferably 0.2 to 5 parts by mass, most preferably 0.25 to 2 parts by mass.
自由基固化性成分(D)可列舉藉由自由基聚合反應進行固化之化合物或寡聚物等自由基固化性成分。 Examples of the radical curable component (D) include radical curable components such as compounds or oligomers that are cured by a radical polymerization reaction.
自由基聚合性成分(D)可列舉:(甲基)丙烯酸酯系化合物、苯乙烯系化合物、乙烯基系化合物等。 As a radical polymerizable component (D), a (meth)acrylate type compound, a styrene type compound, a vinyl type compound, etc. are mentioned.
黏著劑組成物(i)可含有2種以上之自由基固化性成分(D)。 The adhesive composition (i) may contain two or more radical curable components (D).
(甲基)丙烯酸酯系化合物可列舉分子內具有至少1個(甲基)丙烯醯氧基之(甲基)丙烯酸酯單體、(甲基)丙烯醯胺單體及分子內具有至少2個(甲基)丙烯醯基之(甲基)丙烯酸寡聚物等含有(甲基)丙烯醯基之化合物。(甲基)丙烯酸寡聚物較佳為分子內具有至少2個(甲基)丙烯醯氧基之(甲基)丙烯酸酯寡聚物。(甲基)丙烯酸酯系化合物可單獨使用1種,亦可將2種以上併用。 Examples of (meth)acrylate compounds include (meth)acrylate monomers having at least one (meth)acryloxy group in the molecule, (meth)acrylamide monomers and at least two (meth)acryloxy groups in the molecule. Compounds containing (meth)acryl groups such as (meth)acryl oligomers of (meth)acryl groups. The (meth)acrylic oligomer is preferably a (meth)acrylate oligomer having at least two (meth)acryloxy groups in the molecule. A (meth)acrylate type compound may be used individually by 1 type, and may use 2 or more types together.
(甲基)丙烯酸酯單體可列舉於分子內具有1個(甲基)丙烯醯氧基之單官能(甲基)丙烯酸酯單體、分子內具有2個(甲基)丙烯醯氧基之2官能(甲基)丙烯酸酯單體、分子內具有3個以上(甲基)丙烯醯氧基之多官能(甲基)丙烯酸酯單體。 (Meth)acrylate monomers include monofunctional (meth)acrylate monomers with one (meth)acryloxy group in the molecule, and monofunctional (meth)acrylate monomers with two (meth)acryloxy groups in the molecule. Bifunctional (meth)acrylate monomers, polyfunctional (meth)acrylate monomers with 3 or more (meth)acryloxy groups in the molecule.
較佳為(甲基)丙烯酸酯化合物,更佳為多官能(甲基)丙烯酸酯化合物。多官能(甲基)丙烯酸酯化合物較佳為3官能以上。 Preferably it is a (meth)acrylate compound, More preferably, it is a polyfunctional (meth)acrylate compound. The polyfunctional (meth)acrylate compound is preferably trifunctional or more.
相對於樹脂(A)100質量份,自由基固化性成分(D)之含量通常為0.5至100質量份,較佳為1至70質量份,更佳為3至50質量份,再更佳為5至30質量份,最佳為7.5至25質量份。 With respect to 100 parts by mass of the resin (A), the content of the radical curable component (D) is usually 0.5 to 100 parts by mass, preferably 1 to 70 parts by mass, more preferably 3 to 50 parts by mass, and more preferably 5 to 30 parts by mass, preferably 7.5 to 25 parts by mass.
起始劑(E)可為藉由吸收熱之能量引起聚合反應之化合物(熱聚合 起始劑)、藉由吸收光之能量引起聚合反應之化合物(光聚合起始劑)中之任一種。此外,在此之光較佳為可見光線、紫外線、X射線或如電子射線之活性能量線。 The initiator (E) can be a compound that causes a polymerization reaction by absorbing heat energy (thermal polymerization Initiator), any of compounds (photopolymerization initiators) that cause polymerization by absorbing light energy. In addition, the light here is preferably visible rays, ultraviolet rays, X-rays, or active energy rays such as electron rays.
熱聚合起始劑可列舉藉由加熱等產生自由基之化合物(熱自由基產生劑)、藉由加熱等產生酸之化合物(熱酸產生劑)、藉由加熱等產生鹼之化合物(熱鹼產生劑)等。 Examples of thermal polymerization initiators include compounds that generate radicals by heating, etc. (thermal radical generators), compounds that generate acids by heating, etc. (thermal acid generators), compounds that generate bases by heating, etc. (thermal bases) generating agent), etc.
光聚合起始劑可列舉:藉由吸收光之能量產生自由基之化合物(光自由基產生劑)、藉由吸收光之能量產生酸之化合物(光酸產生劑)、藉由吸收光之能量產生鹼之化合物(光鹼產生劑)等。 Examples of photopolymerization initiators include compounds that generate free radicals by absorbing light energy (photoradical generators), compounds that generate acid by absorbing light energy (photoacid generators), and Compounds that generate bases (photobase generators), etc.
起始劑(E)較佳是選擇適合上述之自由基固化性成分(D)之聚合反應者,較佳為自由基聚合起始劑,更佳為光自由基聚合起始劑。 The initiator (E) is preferably selected to be suitable for the polymerization reaction of the above radical curable component (D), preferably a radical polymerization initiator, more preferably a photoradical polymerization initiator.
自由基聚合起始劑可列舉例如:烷基苯酮化合物、苯偶因化合物、二苯甲酮化合物、肟酯化合物、膦化合物等。自由基聚合起始劑較佳為光自由基聚合起始劑,從聚合反應反應性之觀點而言,更佳為肟酯系光自由基聚合起始劑。使用肟酯系光自由基聚合起始劑,即使於照度或光量弱之固化條件,亦可提高自由基固化成分(D)之反應率。 As a radical polymerization initiator, an alkylphenone compound, a benzophenone compound, a benzophenone compound, an oxime ester compound, a phosphine compound, etc. are mentioned, for example. The radical polymerization initiator is preferably a photoradical polymerization initiator, and more preferably an oxime ester-based photoradical polymerization initiator from the viewpoint of polymerization reactivity. Using an oxime ester-based photoradical polymerization initiator can increase the reaction rate of the radical curing component (D) even under curing conditions with low illuminance or light intensity.
相對於樹脂(A)100質量份,起始劑(E)之含量通常為0.01至20質量份,較佳為0.3至10質量份,更佳為0.5至5質量份,再更佳為0.75至4質量份,最佳為1至3質量份。 With respect to 100 parts by mass of the resin (A), the content of the initiator (E) is usually 0.01 to 20 parts by mass, preferably 0.3 to 10 parts by mass, more preferably 0.5 to 5 parts by mass, and more preferably 0.75 to 4 parts by mass, preferably 1 to 3 parts by mass.
選擇吸收化合物(F)為化合物(I)以外之光吸收性化合物,例如吸收波長250nm至波長380nm(較佳為波長250nm以上未達波長360nm)之光之化合物(紫外線吸收劑)或吸收380至780nm之化合物(色素)或吸收780至1500nm之化合物(紅外線吸收劑)。 The selective absorption compound (F) is a light-absorbing compound other than compound (I), such as a compound (ultraviolet absorber) that absorbs light with a wavelength of 250nm to 380nm (preferably a wavelength of 250nm or more but less than 360nm) or a compound (ultraviolet absorber) that absorbs light from 380nm to 380nm Compounds (pigments) at 780nm or compounds that absorb 780 to 1500nm (infrared absorbers).
紫外線吸收劑只要是吸收波長250nm至波長380nm之光之化合物,則其結構無特別限定,較佳為苯并三唑系化合物、二苯甲酮系化合物、三嗪系化合物、水楊酸系化合物、氰基丙烯酸酯系化合物、苯并噁嗪系化合物等化合物等。 The structure of the ultraviolet absorber is not particularly limited as long as it is a compound that absorbs light with a wavelength of 250nm to 380nm, and is preferably a benzotriazole-based compound, a benzophenone-based compound, a triazine-based compound, or a salicylic acid-based compound , cyanoacrylate-based compounds, benzoxazine-based compounds, and the like.
相對於樹脂(A)100質量份,光選擇吸收化合物(F)之含量通常為0.1至50質量份,較佳為0.2至40質量份,更佳為0.5至30質量份,再更佳為1至25質量份,最佳為2至20質量份。 With respect to 100 parts by mass of the resin (A), the content of the light selective absorption compound (F) is usually 0.1 to 50 parts by mass, preferably 0.2 to 40 parts by mass, more preferably 0.5 to 30 parts by mass, and more preferably 1 to 25 parts by mass, preferably 2 to 20 parts by mass.
本發明之光學層及含有該光學層之光學積層體,係可與有機EL元件、液晶胞等顯示元件進行積層,可用於有機EL顯示裝置或液晶顯示裝置等影像顯示裝置(FPD:平板顯示器)。 The optical layer of the present invention and the optical laminate containing the optical layer can be laminated with display elements such as organic EL elements and liquid crystal cells, and can be used in image display devices such as organic EL display devices or liquid crystal display devices (FPD: flat panel display) .
[實施例] [Example]
以下呈示實施例及比較例將本發明更具體地說明,惟,本發明不限定於此等例。例中,表示含量或使用量之%及份若無特別說明,為質量基準。 Examples and comparative examples are shown below to describe the present invention more specifically, but the present invention is not limited to these examples. In the examples, % and parts indicating the content or usage amount are based on mass unless otherwise specified.
(實施例1)式(1)表示之化合物之合成 (Embodiment 1) Synthesis of the compound represented by formula (1)
將設置有戴氏冷卻管(Dimroth condense)及溫度計之300mL-四頸燒瓶內設成氮環境,添加7-羥基-2,3,4,4a,5,6-六氫萘-2-酮7份、乙醇70份、氫氧化鉀2.4份、丙二腈6.2份,於80℃加熱回流攪拌3小時。於獲得之混合物中添加乙醇62份、丙二腈6.2份、氫氧化鉀4.8份,於80℃加熱回流攪拌3小時。從獲得之混合物蒸餾除去溶劑後進行精製,而獲得式(a1)表示之化合物6.9份。 Set a 300mL-four-neck flask equipped with a Dimroth condense and a thermometer to a nitrogen environment, add 7-hydroxy-2,3,4,4a,5,6-hexahydronaphthalene-2-one 7 parts, 70 parts of ethanol, 2.4 parts of potassium hydroxide, and 6.2 parts of malononitrile, heated at reflux and stirred at 80°C for 3 hours. 62 parts of ethanol, 6.2 parts of malononitrile, and 4.8 parts of potassium hydroxide were added to the obtained mixture, followed by heating under reflux at 80° C. and stirring for 3 hours. The obtained mixture was purified by distilling off the solvent to obtain 6.9 parts of the compound represented by the formula (a1).
將設置有戴氏冷卻管及溫度計之20mL-四頸燒瓶內設成氮環境,饋入式(a1)表示之化合物1.5份、對甲苯磺醯氰1.0份、氫氧化鉀0.3份、乙醇10份,加熱回流攪拌3小時。從獲得之混合物蒸餾除去溶劑後進行精製,而獲得式(1)表示之化合物0.7份。 Set the 20mL-four-neck flask equipped with a Dairy cooling tube and a thermometer into a nitrogen environment, feed 1.5 parts of the compound represented by formula (a1), 1.0 parts of p-toluenesulfonyl cyanide, 0.3 parts of potassium hydroxide, and 10 parts of ethanol , heated to reflux and stirred for 3 hours. The obtained mixture was purified by distilling off the solvent to obtain 0.7 parts of the compound represented by the formula (1).
進行LC-MS測定及1H-NMR分析,確認生成式(1)表示之化合物。又,藉由能量分散型X射線分光法(SEM-EDX分析)確認鉀陽離子存在。 LC-MS measurement and 1 H-NMR analysis were performed, and it was confirmed that the compound represented by the formula (1) was produced. Also, the presence of potassium cations was confirmed by energy dispersive X-ray spectroscopy (SEM-EDX analysis).
1H-NMR(重二甲亞碸)δ:1.21-1.40(m、2H)、1.84-1.99(m、2H)、2.33-2.76(m、5H)、6.38(s、1H) 1 H-NMR (heavy dimethyloxide) δ: 1.21-1.40 (m, 2H), 1.84-1.99 (m, 2H), 2.33-2.76 (m, 5H), 6.38 (s, 1H)
LC-MS;[M]-=284.2 LC-MS; [M] - =284.2
<最大吸收波長及克吸光係數ε測定> <Determination of maximum absorption wavelength and gram absorption coefficient ε>
將獲得之式(1)表示之化合物之2-丁酮溶液(0.003g/L)饋入1cm之石英槽(quartz cell),將石英槽安裝於分光光度計UV-2450(島津製作所(股)公司製造),藉由雙光束法於每1nm距離測定300至800nm波長範圍之吸光度。從獲得之吸光度值及溶液中式(1)表示之化合物之濃度、石英槽之光程長度算出每個波長之克吸光係數。 The 2-butanone solution (0.003g/L) of the compound represented by the obtained formula (1) was fed into a 1cm quartz cell (quartz cell), and the quartz cell was installed in a spectrophotometer UV-2450 (Shimadzu Corporation (stock) manufactured by the company), the absorbance in the wavelength range of 300 to 800 nm was measured at every 1 nm distance by the double-beam method. From the obtained absorbance value, the concentration of the compound represented by the formula (1) in the solution, and the optical path length of the quartz cell, the gram absorption coefficient of each wavelength was calculated.
ε(λ)=A(λ)/CL[式中,ε(λ)表示於波長λ nm式(1)表示之化合物之克吸光係數(L/(g‧cm)),A(λ)表示於波長λ nm之吸光度,C表示濃度(g/L),L表示石英槽之光程長度(m)] ε(λ)=A(λ)/CL [In the formula, ε(λ) represents the gram absorption coefficient (L/(g‧cm)) of the compound represented by the formula (1) at a wavelength of λ nm, and A(λ) represents Absorbance at wavelength λ nm, C represents the concentration (g/L), L represents the optical path length of the quartz cell (m)]
獲得之式(1)表示之化合物之最大吸收波長為518nm。獲得之式(1)表示之化合物之ε(λ max)為444L/(g‧cm)。 The maximum absorption wavelength of the compound represented by the obtained formula (1) was 518 nm. The ε(λ max) of the obtained compound represented by the formula (1) was 444 L/(g·cm).
<化合物半峰全寬之測定> <Measurement of Full Width at Half Maximum of Compound>
將獲得之式(1)表示之化合物之2-丁酮溶液(濃度:0.003g/L)饋入1cm之石英槽,將石英槽安裝於分光光度計UV-2450(島津製作所(股)公司製造),藉由雙光束法於每1nm距離測定300至800nm波長範圍之吸光度。確認成為最大吸收波長吸光度之半吸光度之2點波長。2點波長中從長波側之波長扣除短波側之波長,作為半峰全寬。式(1)表示之化合物之半峰全寬為26nm。 The 2-butanone solution (concentration: 0.003 g/L) of the compound represented by the obtained formula (1) was fed into a 1 cm quartz cell, and the quartz cell was installed in a spectrophotometer UV-2450 (manufactured by Shimadzu Corporation Co., Ltd. ), the absorbance in the wavelength range from 300 to 800 nm was measured at every 1 nm distance by the double-beam method. Confirm the two wavelengths that become the half-absorbance of the maximum absorption wavelength absorbance. The wavelength of the short-wave side is subtracted from the wavelength of the long-wave side from the wavelength of the two points, and it is used as the full width at half maximum. The full width at half maximum of the compound represented by formula (1) is 26 nm.
(實施例2)式(M-2)表示之化合物之合成 (Embodiment 2) Synthesis of the compound represented by formula (M-2)
將設置有戴氏冷卻管及溫度計之500mL-四頸燒瓶內設成氮環境,添加式(M-1)表示之化合物(7-羥基-2,3,4,4a,5,6-六氫萘-2-酮)25份、乙醇150份、氫氧化鉀10.3份、對甲苯磺醯氰33.11份,於冰浴中攪拌4小時。從獲得之混合物蒸餾除去溶劑後精製之,獲得式(M-2)表示之化合物17.4份。 Set the 500mL-four-necked flask equipped with a Dairy cooling tube and a thermometer into a nitrogen environment, and add the compound represented by formula (M-1) (7-hydroxy-2,3,4,4a,5,6-hexahydro Naphthalene-2-one) 25 parts, ethanol 150 parts, potassium hydroxide 10.3 parts, p-toluenesulfonyl cyanide 33.11 parts, stirred in an ice bath for 4 hours. The obtained mixture was purified by distilling off the solvent to obtain 17.4 parts of the compound represented by the formula (M-2).
進行LC-MS測定及1H-NMR分析,確認生成式(M-2)表示之化合物。 LC-MS measurement and 1 H-NMR analysis were performed, and it was confirmed that the compound represented by the formula (M-2) was produced.
1H-NMR(重二甲亞碸)δ:1.49-1.65(m、2H)、1.91-2.00(m、2H)、2.30-2.67(m、5H)、5.89(s、1H) 1 H-NMR (heavy dimethyloxide) δ: 1.49-1.65 (m, 2H), 1.91-2.00 (m, 2H), 2.30-2.67 (m, 5H), 5.89 (s, 1H)
LC-MS;[M]=188.1 LC-MS; [M]=188.1
(實施例3)式(M-3)表示之化合物之合成 (Embodiment 3) Synthesis of the compound represented by formula (M-3)
將設置有戴氏冷卻管及溫度計之300mL-四頸燒瓶內設成氮環境,添加式(M-2)表示之化合物5份、脫水乙腈100份、二異丙基乙胺4.4份、三氟甲磺酸酐9份,於冰浴中攪拌10分鐘。於獲得之混合物中添加丙二腈2.1份、二異丙基乙胺4.4份,再攪拌30分鐘。從獲得之混合物蒸餾除去溶劑後精製之,獲得式(M-3)表示之化合物5.4份。 Set the 300mL-four-necked flask equipped with a Dairy cooling tube and a thermometer into a nitrogen environment, add 5 parts of the compound represented by formula (M-2), 100 parts of dehydrated acetonitrile, 4.4 parts of diisopropylethylamine, trifluoro 9 parts of methanesulfonic anhydride were stirred in an ice bath for 10 minutes. 2.1 parts of malononitrile and 4.4 parts of diisopropylethylamine were added to the obtained mixture, followed by stirring for 30 minutes. The obtained mixture was purified by distilling off the solvent to obtain 5.4 parts of the compound represented by the formula (M-3).
進行LC-MS測定及1H-NMR,確認生成式(M-3)表示之化合物。 LC-MS measurement and 1 H-NMR were performed, and it was confirmed that the compound represented by the formula (M-3) was produced.
1H-NMR(重二甲亞碸)δ:1.14-1.54(m、2H)、1.87-1.99(m、2H)、2.22-2.68(m、5H)、6.08(s、1H) 1 H-NMR (heavy dimethyloxide) δ: 1.14-1.54 (m, 2H), 1.87-1.99 (m, 2H), 2.22-2.68 (m, 5H), 6.08 (s, 1H)
LC-MS;[M]=236.3 LC-MS; [M]=236.3
(實施例4)式(1)表示之化合物之合成 (Embodiment 4) Synthesis of the compound represented by formula (1)
將設置有戴氏冷卻管及溫度計之100mL-四頸燒瓶內設成氮環境,將式(M-3)表示之化合物2份、脫水甲基乙基酮20份、碳酸鉀1.2份、三氟甲磺酸甲酯2.8份混合,於冰浴中攪拌2小時。於獲得之混合物中添加丙二腈0.7份、二異丙基乙胺1.4份,再攪拌30分鐘。從獲得之混合物蒸餾除去溶劑後精製之,獲得式(1)表示之化合物1.4份。 Set the 100mL-four-neck flask equipped with a Dairy cooling tube and a thermometer into a nitrogen environment, and add 2 parts of the compound represented by formula (M-3), 20 parts of dehydrated methyl ethyl ketone, 1.2 parts of potassium carbonate, trifluoro 2.8 parts of methyl methanesulfonate were mixed and stirred in an ice bath for 2 hours. 0.7 parts of malononitrile and 1.4 parts of diisopropylethylamine were added to the obtained mixture, followed by stirring for 30 minutes. The obtained mixture was purified by distilling off the solvent to obtain 1.4 parts of the compound represented by the formula (1).
進行LC-MS測定及1H-NMR分析,確認生成式(1)表示之化合物。 又,藉由能量分散型X射線分光法(SEM-EDX分析)確認鉀陽離子存在。 LC-MS measurement and 1 H-NMR analysis were performed, and it was confirmed that the compound represented by the formula (1) was produced. Also, the presence of potassium cations was confirmed by energy dispersive X-ray spectroscopy (SEM-EDX analysis).
1H-NMR(重二甲亞碸)δ:1.21-1.40(m、2H)、1.84-1.99(m、2H)、2.33-2.76(m、5H)、6.38(s、1H) 1 H-NMR (heavy dimethyloxide) δ: 1.21-1.40 (m, 2H), 1.84-1.99 (m, 2H), 2.33-2.76 (m, 5H), 6.38 (s, 1H)
LC-MS;[M]-=284.2 LC-MS; [M] - =284.2
(實施例5)式(2)表示之化合物之合成 (Embodiment 5) Synthesis of the compound represented by formula (2)
將設置有戴氏冷卻管及溫度計之50mL-四頸燒瓶內設成氮環境,添加式(a1)表示之化合物0.5份、脫水乙腈5份、二異丙基乙胺0.3份、N-(三氟甲硫基)糖精0.7份,於冰浴中攪拌3小時。從獲得之混合物蒸餾除去溶劑後精製之,獲得式(2)表示之化合物0.4份。 Set the 50mL-four-neck flask equipped with a Dairy cooling tube and a thermometer into a nitrogen environment, add 0.5 parts of the compound represented by formula (a1), 5 parts of dehydrated acetonitrile, 0.3 parts of diisopropylethylamine, N-(three Fluoromethylthio) saccharin 0.7 parts, stirred in ice bath for 3 hours. The obtained mixture was purified by distilling off the solvent to obtain 0.4 parts of the compound represented by the formula (2).
進行LC-MS測定及1H-NMR分析,確認生成式(2)表示之化合物。又,藉由能量分散型X射線分光法(SEM-EDX分析)確認鉀陽離子存在。進一步,以與上述相同之操作測定最大吸收波長、克吸光係數及半峰全寬時,式(2)表示之化合物之最大吸收波長為526nm,於最大吸收波長之克吸光係數ε(λ max)為189L/(g‧cm),半峰全寬為26nm。 LC-MS measurement and 1 H-NMR analysis were performed, and it was confirmed that the compound represented by the formula (2) was produced. Also, the presence of potassium cations was confirmed by energy dispersive X-ray spectroscopy (SEM-EDX analysis). Further, when measuring the maximum absorption wavelength, gram absorption coefficient and full width at half maximum with the same operation as above, the maximum absorption wavelength of the compound represented by formula (2) is 526nm, and the gram absorption coefficient ε(λ max) at the maximum absorption wavelength It is 189L/(g‧cm), and the full width at half maximum is 26nm.
1H-NMR(重二甲亞碸)δ:1.16-1.19(m、2H)、1.33-1.36(m、2H)、1.91-1.99(m、5H)、6.88-6.91(m、1H) 1 H-NMR (heavy dimethyloxide) δ: 1.16-1.19 (m, 2H), 1.33-1.36 (m, 2H), 1.91-1.99 (m, 5H), 6.88-6.91 (m, 1H)
LC-MS;[M]-=359.4 LC-MS; [M] - =359.4
(實施例6)式(3)表示之化合物之合成 (Embodiment 6) Synthesis of the compound represented by formula (3)
將設置有戴氏冷卻管及溫度計之20mL-四頸燒瓶內設成氮環境,添加式(a1)表示之化合物0.5份、脫水乙腈5份、N-氯琥珀醯亞胺0.3份,於冰浴中攪拌3小時。從獲得之混合物蒸餾除去溶劑後精製之,獲得式(3)表示之化合物0.4份。 Set the 20mL-four-neck flask equipped with a Dairy cooling tube and a thermometer into a nitrogen environment, add 0.5 parts of the compound represented by formula (a1), 5 parts of dehydrated acetonitrile, and 0.3 parts of N-chlorosuccinimide, and place in an ice bath Stir for 3 hours. The obtained mixture was purified by distilling off the solvent to obtain 0.4 parts of the compound represented by the formula (3).
進行LC-MS測定,確認生成式(3)表示之化合物。又,藉由能量分散型X射線分光法(SEM-EDX分析)確認鉀陽離子存在。進一步,以與上述相同之操作測定最大吸收波長、克吸光係數及半峰全寬時,式(3)表示之化合物之最大吸收波長為551nm,於最大吸收波長之克吸光係數ε(λ max)為130L/(g‧cm),半峰全寬為28nm。 LC-MS measurement was performed, and it was confirmed that the compound represented by the formula (3) was produced. Also, the presence of potassium cations was confirmed by energy dispersive X-ray spectroscopy (SEM-EDX analysis). Further, when measuring the maximum absorption wavelength, gram absorption coefficient and full width at half maximum with the same operation as above, the maximum absorption wavelength of the compound represented by formula (3) is 551nm, and the gram absorption coefficient ε(λ max) at the maximum absorption wavelength It is 130L/(g‧cm), and the full width at half maximum is 28nm.
LC-MS;[M]-=293.5 LC-MS; [M] - =293.5
(實施例7)式(4)表示之化合物之合成 (Embodiment 7) Synthesis of the compound represented by formula (4)
將設置有戴氏冷卻管及溫度計之20mL-四頸燒瓶內設成氮環境,添加式(a1)表示之化合物0.5份、脫水二甲基甲醯胺5份、N-氯琥珀醯亞胺0.5份,於冰浴中攪拌3小時。從獲得之混合物蒸餾除去溶劑後精製之,獲得式(4)表示之化合物0.4份。 Set the 20mL-four-necked flask equipped with a Dairy cooling tube and a thermometer into a nitrogen environment, add 0.5 parts of the compound represented by formula (a1), 5 parts of dehydrated dimethylformamide, and 0.5 parts of N-chlorosuccinimide portion, stirred in an ice bath for 3 hours. The obtained mixture was purified by distilling off the solvent to obtain 0.4 parts of the compound represented by the formula (4).
進行LC-MS測定及1H-NMR分析,確認生成式(4)表示之化合物。又,藉由能量分散型X射線分光法(SEM-EDX分析)確認鉀陽離子存在。進一步,以與上述相同之操作測定最大吸收波長、克吸光係數及半峰全寬時,式(4)表示之化合物之最大吸收波長為572nm,於最大吸收波長之克吸光係數ε(λ max)為 126L/(g‧cm),半峰全寬為44nm。 LC-MS measurement and 1 H-NMR analysis were performed, and it was confirmed that the compound represented by the formula (4) was produced. Also, the presence of potassium cations was confirmed by energy dispersive X-ray spectroscopy (SEM-EDX analysis). Further, when measuring the maximum absorption wavelength, gram absorption coefficient and full width at half maximum with the same operation as above, the maximum absorption wavelength of the compound represented by formula (4) is 572nm, and the gram absorption coefficient ε(λ max) at the maximum absorption wavelength It is 126L/(g‧cm), and the full width at half maximum is 44nm.
LC-MS;[M]-=328.2 LC-MS; [M] - =328.2
1H-NMR(重二甲亞碸)δ:1.24-1.25(m、2H)、1.88-2.33(m、7H) 1 H-NMR (heavy dimethyloxide) δ: 1.24-1.25 (m, 2H), 1.88-2.33 (m, 7H)
(實施例8)式(5)表示之化合物之合成 (Embodiment 8) Synthesis of the compound represented by formula (5)
將設置有戴氏冷卻管及溫度計之20mL-四頸燒瓶內設成氮環境,添加式(a1)表示之化合物1份、脫水二甲基甲醯胺10份、N-溴琥珀醯亞胺0.7份,於冰浴中攪拌3小時。從獲得之混合物蒸餾除去溶劑後精製之,獲得式(5)表示之化合物0.7份。 Set the 20mL-four-necked flask equipped with a Dairy cooling tube and a thermometer into a nitrogen environment, add 1 part of the compound represented by formula (a1), 10 parts of dehydrated dimethylformamide, and 0.7 parts of N-bromosuccinimide portion, stirred in an ice bath for 3 hours. The obtained mixture was purified by distilling off the solvent to obtain 0.7 parts of the compound represented by the formula (5).
進行LC-MS測定及1H-NMR分析,確認生成式(5)表示之化合物。又,藉由能量分散型X射線分光法(SEM-EDX分析)確認鉀陽離子存在。再者,以與上述相同之操作測定最大吸收波長、克吸光係數及半峰全寬時,式(5)表示之化合物之最大吸收波長為548nm,於最大吸收波長之克吸光係數ε(λ max)為180L/(g‧cm),半峰全寬為26nm。 LC-MS measurement and 1 H-NMR analysis were performed, and it was confirmed that the compound represented by the formula (5) was produced. Also, the presence of potassium cations was confirmed by energy dispersive X-ray spectroscopy (SEM-EDX analysis). Furthermore, when measuring the maximum absorption wavelength, gram absorption coefficient and full width at half maximum with the same operation as above, the maximum absorption wavelength of the compound represented by formula (5) is 548nm, and the gram absorption coefficient ε(λ max at the maximum absorption wavelength ) is 180L/(g‧cm), and the full width at half maximum is 26nm.
LC-MS;[M]-=338.2 LC-MS; [M] - =338.2
1H-NMR(重二甲亞碸)δ:1.31-1.37(m、2H)、1.82-1.99(m、2H)、2.43-2.79(m、5H)、6.46(s、1H) 1 H-NMR (heavy dimethyloxide) δ: 1.31-1.37 (m, 2H), 1.82-1.99 (m, 2H), 2.43-2.79 (m, 5H), 6.46 (s, 1H)
(實施例9)式(M-4)表示之化合物之合成 (Example 9) Synthesis of the compound represented by formula (M-4)
將設置有戴氏冷卻管及溫度計之100mL-四頸燒瓶內設成氮環境,添加式(M- 2)表示之化合物5份、脫水乙腈50份、氫化鈉0.7份,於冰浴中攪拌30分鐘。於獲得之混合物中添加對甲苯磺醯氰9.6份,於50℃攪拌4小時。從獲得之混合物蒸餾除去溶劑後精製之,獲得式(M-4)表示之化合物3.8份。 Set the 100mL-four-necked flask equipped with a Dairy cooling tube and a thermometer into a nitrogen environment, and add the formula (M- 2) 5 parts of the indicated compound, 50 parts of dehydrated acetonitrile, and 0.7 part of sodium hydride were stirred in an ice bath for 30 minutes. 9.6 parts of p-toluenesulfonyl cyanide was added to the obtained mixture, and it stirred at 50 degreeC for 4 hours. The obtained mixture was purified by distilling off the solvent to obtain 3.8 parts of the compound represented by the formula (M-4).
進行LC-MS測定及1H-NMR分析,確認生成式(M-4)表示之化合物。 LC-MS measurement and 1 H-NMR analysis were performed, and it was confirmed that the compound represented by the formula (M-4) was produced.
LC-MS;[M]-=213.1 LC-MS; [M] - =213.1
1H-NMR(重二甲亞碸)δ:1.46-1.57(m、2H)、1.82-1.91(m、2H)、2.16-2.39(m、5H) 1 H-NMR (heavy dimethyloxide) δ: 1.46-1.57 (m, 2H), 1.82-1.91 (m, 2H), 2.16-2.39 (m, 5H)
(實施例10)式(6)表示之化合物之合成 (Example 10) Synthesis of the compound represented by formula (6)
將設置有戴氏冷卻管及溫度計之200mL-四頸燒瓶內設成氮環境,添加式(M-4)表示之化合物4.5份、脫水乙腈68份、氫化鈉0.6份,於冰浴中攪拌30分鐘。於獲得之混合物中添加三氟甲磺酸酐7.1份,於冰浴中攪拌30分鐘,再添加丙二腈1.7份及碳酸鉀3.5份,於50℃攪拌2小時。從獲得之混合物蒸餾除去溶劑後精製之,獲得式(M-5)表示之化合物2.1份。 Set the 200mL-four-necked flask equipped with a Dairy cooling tube and a thermometer into a nitrogen environment, add 4.5 parts of the compound represented by formula (M-4), 68 parts of dehydrated acetonitrile, and 0.6 parts of sodium hydride, and stir in an ice bath for 30 minute. To the obtained mixture was added 7.1 parts of trifluoromethanesulfonic anhydride, stirred in an ice bath for 30 minutes, further added 1.7 parts of malononitrile and 3.5 parts of potassium carbonate, and stirred at 50° C. for 2 hours. The obtained mixture was purified by distilling off the solvent to obtain 2.1 parts of the compound represented by the formula (M-5).
將設置有戴氏冷卻管及溫度計之300mL-四頸燒瓶內設成氮環境,將式(M-5)表示之化合物1.2份、乙腈36份、二第三丁基吡啶8.8份、對甲苯磺酸酐7.5份、丙 二腈1.5份混合,於冰浴中攪拌24小時。從獲得之混合物蒸餾除去溶劑後精製之,獲得式(6)表示之化合物0.4份。又,式(6)表示之化合物中之鉀離子為源自於精製時使用之碳酸氫鉀。 Set the 300mL-four-neck flask equipped with a Dairy cooling tube and a thermometer into a nitrogen environment, and add 1.2 parts of the compound represented by formula (M-5), 36 parts of acetonitrile, 8.8 parts of di-tert-butylpyridine, p-toluenesulfonate 7.5 parts of acid anhydride, propane 1.5 parts of dinitrile were mixed and stirred in an ice bath for 24 hours. The obtained mixture was purified by distilling off the solvent to obtain 0.4 parts of the compound represented by the formula (6). In addition, potassium ions in the compound represented by formula (6) are derived from potassium bicarbonate used for purification.
進行LC-MS測定及1H-NMR分析,確認於式(6)表示之化合物中生成陰離子。又,藉由能量分散型X射線分光法(SEM-EDX分析)確認鉀原子(鉀陽離子)存在。 LC-MS measurement and 1 H-NMR analysis were performed, and it was confirmed that an anion was generated in the compound represented by formula (6). Also, the presence of potassium atoms (potassium cations) was confirmed by energy dispersive X-ray spectroscopy (SEM-EDX analysis).
進一步,以與上述相同之操作測定最大吸收波長、克吸光係數及半峰全寬時,式(6)表示之化合物之最大吸收波長為511nm,於最大吸收波長之克吸光係數ε(λ max)為211L/(g‧cm),半峰全寬為29nm。 Further, when measuring the maximum absorption wavelength, gram absorption coefficient and full width at half maximum with the same operation as above, the maximum absorption wavelength of the compound represented by formula (6) is 511nm, and the gram absorption coefficient ε(λ max) at the maximum absorption wavelength It is 211L/(g‧cm), and the full width at half maximum is 29nm.
LC-MS;[M]-=309.3 LC-MS; [M] - =309.3
1H-NMR(重二甲亞碸)δ:1.16-1.21(m、2H)、1.30-1.37(m、2H)、1.62-1.65(m、2H)、1.88-1.91(m、3H) 1 H-NMR (heavy dimethyloxide) δ: 1.16-1.21 (m, 2H), 1.30-1.37 (m, 2H), 1.62-1.65 (m, 2H), 1.88-1.91 (m, 3H)
<丙烯酸樹脂之調製> <Preparation of Acrylic Resin>
聚合例1:丙烯酸樹脂(A1)之調製 Polymerization Example 1: Preparation of Acrylic Resin (A1)
於具備冷卻管、氮導入管、溫度計及攪拌機之反應容器中饋入作為溶劑之乙酸乙酯81.8份、丙烯酸丁酯96份、丙烯酸2-羥乙基甲酯3份及丙烯酸1份之混合溶液,一邊以氮氣置換裝置內的空氣作成不含氧,一邊將內溫昇溫至55℃。之後,將偶氮二異丁腈(聚合起始劑)0.14份溶解於乙酸乙酯10份之溶液全量添加。添加聚合起始劑後保持此溫度1小時,接著,一邊將內溫邊維持於54至56℃,一邊將乙酸乙酯以添加速度17.3份/小時連續地添加至反應容器內,於丙烯酸樹脂之濃度成為35%之時間點停止添加乙酸乙酯,再從開始添加乙酸乙酯至經過12小時為止於此溫度保溫。最後以使丙烯酸樹脂之濃度成為20%之方式,添加乙酸乙酯進 行調整而調製出丙烯酸樹脂之乙酸乙酯溶液。所得之丙烯酸樹脂藉由GPC,聚苯乙烯換算之重量平均分子量Mw為140萬,Mw/Mn為5.5。將此作為丙烯酸樹脂(A1)。 Feed a mixed solution of 81.8 parts of ethyl acetate, 96 parts of butyl acrylate, 3 parts of 2-hydroxyethyl methyl acrylate and 1 part of acrylic acid as a solvent into a reaction vessel equipped with a cooling tube, a nitrogen introduction tube, a thermometer and a stirrer , while substituting the air in the apparatus with nitrogen so as not to contain oxygen, the internal temperature was raised to 55°C. Thereafter, the entire amount of a solution of 0.14 parts of azobisisobutyronitrile (polymerization initiator) dissolved in 10 parts of ethyl acetate was added. After adding the polymerization initiator, keep this temperature for 1 hour, then, while maintaining the internal temperature at 54 to 56°C, continuously add ethyl acetate into the reaction vessel at an addition rate of 17.3 parts/hour, between the acrylic resin Addition of ethyl acetate was stopped when the concentration became 35%, and the temperature was kept at this temperature until 12 hours from the start of addition of ethyl acetate. Finally, the concentration of the acrylic resin becomes 20%, adding ethyl acetate Adjust to prepare an ethyl acetate solution of acrylic resin. The weight average molecular weight Mw of polystyrene conversion of the obtained acrylic resin by GPC was 1.4 million, and Mw/Mn was 5.5. Let this be an acrylic resin (A1).
聚合例2:丙烯酸樹脂(A2)之調製 Polymerization Example 2: Preparation of Acrylic Resin (A2)
於具備冷卻管、氮導入管、溫度計及攪拌機之反應容器中饋入作為溶劑之乙酸乙酯81.8份、丙烯酸甲酯60份、丙烯酸10份、丙烯酸2-羥乙基甲酯10份及丙烯酸2-苯氧基乙酯20份之混合溶液,一邊以氮氣置換裝置內的空氣作成不含氧,一邊將內溫昇溫至55℃。之後,將偶氮二異丁腈(聚合起始劑)0.14份溶解於乙酸乙酯10份之溶液全量添加。添加聚合起始劑後保持此溫度1小時,接著,一邊將內溫邊維持於54至56℃,一邊將乙酸乙酯以添加速度17.3份/小時連續地添加反應容器內,於丙烯酸樹脂之濃度成為35%之時間點停止添加乙酸乙酯,再從開始添加乙酸乙酯至經過12小時為止於此溫度保溫。最後以使丙烯酸樹脂之濃度成為20%之方式,添加乙酸乙酯進行調整而調製出丙烯酸樹脂之乙酸乙酯溶液。所得之丙烯酸樹脂藉由GPC,聚苯乙烯換算之重量平均分子量Mw為92萬,Mw/Mn為4.7。將此作為丙烯酸樹脂(A2)。 Feed 81.8 parts of ethyl acetate, 60 parts of methyl acrylate, 10 parts of acrylic acid, 10 parts of 2-hydroxyethyl methyl acrylate and 2 - The mixed solution of 20 parts of phenoxyethyl ester was heated up to 55° C. while replacing the air in the apparatus with nitrogen to make it free of oxygen. Thereafter, the entire amount of a solution of 0.14 parts of azobisisobutyronitrile (polymerization initiator) dissolved in 10 parts of ethyl acetate was added. After adding the polymerization initiator, keep this temperature for 1 hour, and then, while maintaining the internal temperature at 54 to 56°C, continuously add ethyl acetate into the reaction vessel at an addition rate of 17.3 parts/hour, at the concentration of the acrylic resin Addition of ethyl acetate was stopped at the point when it reached 35%, and the temperature was kept at this temperature until 12 hours from the start of addition of ethyl acetate. Finally, ethyl acetate was added and adjusted so that the concentration of the acrylic resin would be 20%, and an ethyl acetate solution of the acrylic resin was prepared. The obtained acrylic resin had a weight average molecular weight Mw of 920,000 in terms of polystyrene by GPC, and Mw/Mn was 4.7. Let this be an acrylic resin (A2).
(實施例11)樹脂組成物(1)(黏著劑組成物(1))之製作 (Example 11) Preparation of resin composition (1) (adhesive composition (1))
<樹脂組成物(1)之調製> <Preparation of resin composition (1)>
相對於丙烯酸樹脂(A1)之乙酸乙酯溶液(樹脂濃度:20%)之固形份100份,將交聯劑(東索(股)公司製造:商品名「Coronate L」,異氰酸酯系化合物,固形份75%)0.5份、矽烷化合物(信越化學工業(股)公司製造:商品名「KBM3066」)0.28份、式(1)表示之化合物1.5份混合,進一步以使固形份濃度成為14%之方式添加2-丁酮,獲得樹脂組成物(1)(黏著劑組成物(1))。此外,上述交聯劑之調配量為作 為有效成分之質量份數。 With respect to the solid content of 100 parts of the ethyl acetate solution (resin concentration: 20%) of the acrylic resin (A1), a crosslinking agent (manufactured by Toso Co., Ltd.: trade name "Coronate L", isocyanate compound, solid 75%) 0.5 parts, 0.28 parts of a silane compound (manufactured by Shin-Etsu Chemical Co., Ltd.: trade name "KBM3066"), and 1.5 parts of a compound represented by formula (1), and further make the solid content concentration 14% 2-Butanone was added to obtain a resin composition (1) (adhesive composition (1)). In addition, the compounding amount of the above-mentioned cross-linking agent is as It is the mass parts of active ingredients.
(實施例12至18、比較例1)樹脂組成物(2)至(9)之製作 (Examples 12 to 18, Comparative Example 1) Production of Resin Compositions (2) to (9)
除了如表7所示,變更各成分及各成分之含量以外,進行與實施例11相同之操作,製作出黏著劑組成物(2)至黏著劑組成物(9)。又,上述交聯劑之調配量為作為有效成分之質量份數,樹脂(A)為固形份之質量份數。 Except for changing each component and the content of each component as shown in Table 7, the same operation as in Example 11 was carried out to produce adhesive composition (2) to adhesive composition (9). Also, the compounding amount of the above-mentioned crosslinking agent is the mass fraction of the active ingredient, and the resin (A) is the mass fraction of the solid content.
[表7]
又,於表7之各簡稱表示下列意思。 In addition, each abbreviation in Table 7 has the following meanings.
丙烯酸樹脂(A1):於聚合例1合成之丙烯酸樹脂(A1) Acrylic resin (A1): Acrylic resin (A1) synthesized in Polymerization Example 1
丙烯酸樹脂(A2):於聚合例2合成之丙烯酸樹脂(A2) Acrylic resin (A2): Acrylic resin (A2) synthesized in Polymerization Example 2
式(1):於實施例1或實施例4合成之式(1)表示之化合物 Formula (1): the compound represented by the formula (1) synthesized in Example 1 or Example 4
式(6):於實施例10合成之式(6)表示之化合物 Formula (6): the compound represented by the formula (6) synthesized in Example 10
Coronate L:東索(股)公司製造,商品名:Coronate L,異氰酸酯系交聯劑 Coronate L: manufactured by Toso Co., Ltd., trade name: Coronate L, isocyanate-based crosslinking agent
KBM3066:信越化學工業(股)公司製造,商品名:KBM3066,矽烷偶聯劑 KBM3066: Manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM3066, silane coupling agent
A-DPH-12E:新中村化學工業(股)公司製造,商品名;A-DPH-12E,6官能(甲基)丙烯酸酯化合物 A-DPH-12E: manufactured by Shin-Nakamura Chemical Co., Ltd., trade name; A-DPH-12E, hexafunctional (meth)acrylate compound
NCI-730:ADEKA(股)公司製造,商品名:NCI-730,屬於肟酯化合物之光自 由基發生劑 NCI-730: Manufactured by ADEKA Co., Ltd., trade name: NCI-730, belongs to the light of the oxime ester compound radical generator
RUV-93:大塚化學(股)公司製造,苯并三唑系紫外線吸收劑,商品名:RUVA-93,最大吸收波長λ max=337nm RUV-93: Otsuka Chemical Co., Ltd., benzotriazole-based ultraviolet absorber, trade name: RUVA-93, maximum absorption wavelength λ max = 337nm
式(B):參照美國專利第6004536號說明書合成之下述式(B)表示之化合物(3-丁基-2-[3-(-3-丁基-5-苯基-2(3H)-亞苯甲基)-1-丙烯-1-基]-5-苯基-苯并噁唑鎓對甲苯磺酸酯),與上述同樣地操作而求得之半峰全寬為44nm。 Formula (B): The compound represented by the following formula (B) (3-butyl-2-[3-(-3-butyl-5-phenyl-2(3H) -benzylidene)-1-propen-1-yl]-5-phenyl-benzoxazolium p-toluenesulfonate), the full width at half maximum obtained in the same manner as above was 44 nm.
<樹脂組成物(1)成形體之評估> <Evaluation of resin composition (1) molded body>
[樹脂成形體(1)之製作] [Production of resin molded body (1)]
將獲得之樹脂組成物(1)(黏著劑組成物(1))使用塗佈器塗佈於由經實施離型處理之由聚對苯二甲酸乙二醇酯膜構成之分離膜[購自林特(股)公司(LINTEC Corporation),商品名「PLR-382190」]之離型處理面,於100℃乾燥1分鐘,形成樹脂成形體(黏著劑層)(1),製作出附有分離膜之樹脂成形體(1)。獲得之樹脂成形體(1)之厚度為15μm。 The obtained resin composition (1) (adhesive composition (1)) was coated on a release film made of polyethylene terephthalate film [purchased from Linte (stock) company (LINTEC Corporation, trade name "PLR-382190"]'s release treatment surface, dried at 100 ° C for 1 minute to form a resin molded body (adhesive layer) (1), produced with a release A resin molded body (1) of a film. The obtained resin molded body (1) had a thickness of 15 μm.
將獲得之附有分離膜之樹脂成形體(1)藉由積層機貼合於含有23μm之紫外線吸收劑之環烯烴膜[購自日本瑞翁(股)公司(Zeon Corporation),商品名「ZEONOR」]後,於溫度23℃,相對濕度65%之條件熟成7日,獲得具有環烯烴膜/樹脂成形體(1)/分離膜之積層結構之積層體(1-1)。 The obtained resin molded body (1) with a separation film was bonded to a cycloolefin film containing a 23 μm ultraviolet absorber [purchased from Zeon Corporation, trade name "ZEONOR" by a laminator. ”], and aged for 7 days at a temperature of 23°C and a relative humidity of 65% to obtain a laminate (1-1) having a laminated structure of cycloolefin film/resin molded article (1)/separation membrane.
[樹脂成形體(1)之吸光度測定] [Measurement of Absorbance of Resin Molded Article (1)]
將獲得之積層體(1-1)切成30mm×30mm大小,將分離膜剝離,將樹脂成形體 (1)及無鹼玻璃[康寧公司(Corning Incorporated)製造,商品名“EAGLE XG”]貼合,將此作為試樣(1)。使用分光光度計(UV-2450:島津製作所(股)公司製造),於每1nm距離測定作成之試樣(1)於波長300至800nm範圍之吸光度。將測定之於波長330nm之吸光度作為樹脂成形體(1)之波長330nm之吸光度。此外,無鹼玻璃單體及環烯烴膜單體分別之波長330nm之吸光度為0。 The obtained laminate (1-1) was cut into a size of 30mm×30mm, the separation membrane was peeled off, and the resin molded body (1) and an alkali-free glass [manufactured by Corning Incorporated, trade name "EAGLE XG"] were bonded together, and this was made into the sample (1). Using a spectrophotometer (UV-2450: manufactured by Shimadzu Corporation), the absorbance of the prepared sample (1) in the wavelength range of 300 to 800 nm was measured at every 1 nm distance. The measured absorbance at a wavelength of 330 nm was defined as the absorbance at a wavelength of 330 nm of the resin molded article (1). In addition, the absorbance of the alkali-free glass monomer and the cycloolefin film monomer at a wavelength of 330 nm is zero.
又,以下式為基礎,求得波長330nm之穿透率。將結果示於表8之穿透率欄。 Also, based on the following formula, the transmittance at a wavelength of 330 nm was obtained. The results are shown in the column of the transmittance in Table 8.
T=10-A×100(T表示穿透率,A表示吸光度) T=10 -A ×100 (T means transmittance, A means absorbance)
從上述測得之吸光度決定試樣(1)之最大吸收波長,將決定之最大吸收波長之吸光度作為於樹脂成形體(1)之上述最大吸收波長之吸光度。此外,無鹼玻璃單體及環烯烴膜單體分別之上述最大吸收波長之吸光度為0。 The maximum absorption wavelength of the sample (1) was determined from the absorbance measured above, and the absorbance at the determined maximum absorption wavelength was used as the absorbance at the above maximum absorption wavelength of the resin molded article (1). In addition, the absorbance of the above-mentioned maximum absorption wavelengths of the alkali-free glass monomer and the cycloolefin film monomer is zero.
以下式為基礎,求得上述最大吸收波長之穿透率(%)。將結果示於表9。 Based on the following formula, the transmittance (%) of the above-mentioned maximum absorption wavelength was obtained. The results are shown in Table 9.
T1=10-A1×100 T1=10 -A1 ×100
(T1表示於上述最大吸收波長之穿透率,A1表示於上述最大吸收波長之吸光度) (T1 represents the transmittance at the above-mentioned maximum absorption wavelength, A1 represents the absorbance at the above-mentioned maximum absorption wavelength)
[樹脂成形體(1)之抗滲出性評估] [Evaluation of Bleeding Resistance of Resin Molded Articles (1)]
於獲得之附有分離膜之樹脂成形體(1)的一面進一步積層分離膜,獲得兩面附有分離膜之黏著劑層(1)。將獲得之兩面附有分離膜之黏著劑層(1)於23至25℃之空氣下保管1個月。將保管後之兩面附有分離膜之黏著劑層(1)使用顯微鏡確認面內有無化合物之結晶析出。無結晶析出者作為a,有結晶析出者作為b。將評估結果示於表8之抗滲出性欄。 A separation film is further laminated on one side of the obtained resin molded body (1) with a separation film to obtain an adhesive layer (1) with a separation film on both sides. The obtained adhesive layer (1) with separation films on both sides was stored in the air at 23 to 25° C. for 1 month. After storage, use a microscope to confirm whether there is crystallization of the compound on the surface of the adhesive layer (1) with the separation film on both sides. Those without crystallization were designated as a, and those with crystallization were designated as b. The evaluation results are shown in the anti-bleeding column of Table 8.
[樹脂成形體(1)吸光度保持率之測定] [Measurement of Absorbance Retention of Resin Molded Article (1)]
準備於厚度8μm之偏光子單面使用接著劑層並貼合有13μm之環烯烴膜之 偏光板。 Prepare to use an adhesive layer on one side of the polarizer with a thickness of 8 μm and attach a 13 μm cycloolefin film Polarizer.
將附有分離膜之樹脂成形體(1)之樹脂成形體(1)側藉由積層機貼合於偏光板之偏光子側後,於溫度23℃,相對濕度65%之條件熟成7日,獲得具有環烯烴膜/偏光子/樹脂成形體(1)/分離膜之積層結構之積層體。 After laminating the resin molded body (1) side of the resin molded body (1) with a separation film on the polarizer side of the polarizer by a laminator, it was aged for 7 days at a temperature of 23°C and a relative humidity of 65%. A laminate having a laminated structure of cycloolefin film/polarizer/resin molded body (1)/separation film was obtained.
將獲得之積層體切成30mm×30mm大小,將分離膜剝離,將樹脂成形體(1)及無鹼玻璃[康寧公司製造,商品名“EAGLEXG”]貼合,獲得具有環烯烴膜/偏光子/樹脂成形體(1)/玻璃之積層結構之積層體(1-2)。 The obtained laminate was cut into a size of 30 mm × 30 mm, the separation film was peeled off, and the resin molded body (1) and alkali-free glass [manufactured by Corning, trade name "EAGLEXG"] were bonded to obtain a cycloolefin film/polarizer /Resin molded body (1)/Laminate (1-2) of laminated structure of glass.
將獲得之積層體(1-2)於溫度63℃,相對濕度50%RH之條件投入於陽光天氣儀(Suga Test Instruments(股)公司製造)75小時,實施耐候性試驗。以與上述相同之方法測定取出之積層體(1-2)之吸光度。從測定之吸光度,以下式為基礎,求得於波長540nm之積層體(1-2)之吸光度保持率[%]。將結果示於表8。吸光度保持率越接近100%,越表示光選擇吸收功能無劣化,具有良好之耐候性。 The obtained laminate (1-2) was put into a sunshine weather instrument (manufactured by Suga Test Instruments Co., Ltd.) at a temperature of 63° C. and a relative humidity of 50% RH for 75 hours to perform a weather resistance test. The absorbance of the taken-out laminate (1-2) was measured in the same manner as above. From the measured absorbance, the absorbance retention [%] of the laminate (1-2) at a wavelength of 540 nm was obtained based on the following formula. The results are shown in Table 8. The closer the absorbance retention rate is to 100%, the more it means that the light selective absorption function has not deteriorated and has good weather resistance.
此外,用以評估吸光度保持率之吸收波長,係於測定之吸光度中選擇於最大吸收波長之長波側吸光度成為1至1.5之波長。此等係為前述波長於分光測定裝置之測定精度上為靈敏度最佳之吸光度區域。 In addition, the absorption wavelength used to evaluate the absorbance retention rate is selected from the measured absorbance at which the absorbance on the long-wave side of the maximum absorption wavelength becomes 1 to 1.5. These are the absorbance regions at which the aforementioned wavelengths have the best sensitivity in terms of the measurement accuracy of the spectrometer.
吸光度保持率(%)=(耐久試驗後之A(540)/耐久試驗前之A(540))×100 Absorbance retention (%)=(A(540) after durability test/A(540) before durability test)×100
[A(540)表示於波長540nm之積層體(1-2)之吸光度] [A(540) represents the absorbance of the laminate (1-2) at a wavelength of 540nm]
使用樹脂組成物(2)替代樹脂組成物(1),製作樹脂成形體(2)、積層體(2-1)及積層體(2-2),進行相同之評估。將結果示於表8。 Using the resin composition (2) instead of the resin composition (1), the resin molding (2), the laminate (2-1), and the laminate (2-2) were produced, and the same evaluation was performed. The results are shown in Table 8.
使用樹脂組成物(3)替代樹脂組成物(1),製作樹脂成形體(3)、積層體(3-1)及積層體(3-2),進行相同之評估。將結果示於表8。 Using the resin composition (3) instead of the resin composition (1), the resin molding (3), the laminate (3-1), and the laminate (3-2) were produced, and the same evaluation was performed. The results are shown in Table 8.
使用樹脂組成物(5)替代樹脂組成物(1),製作厚度20μm之樹脂成形體(5)。除了使用樹脂成形體(5)替代樹脂成形體(1)以外,進行相同之操作,作成積層體(5-1)及積層體(5-2),進行抗滲出性評估、吸光度保持率之評估。又,吸光度保持率之評估於波長520nm進行。將結果示於表8。 The resin composition (5) was used instead of the resin composition (1), and the 20-micrometer-thick resin molding (5) was produced. Except that the resin molded body (5) was used instead of the resin molded body (1), the same operation was carried out to make laminates (5-1) and laminates (5-2), and evaluations of bleeding resistance and absorbance retention were performed. . In addition, the evaluation of the absorbance retention rate was performed at a wavelength of 520 nm. The results are shown in Table 8.
使用樹脂組成物(6)替代樹脂組成物(1),製作厚度20μm之樹脂成形體(6)。除了使用樹脂成形體(6)替代樹脂成形體(1)以外,進行相同之操作,作成積層體(6-1)及積層體(6-2),進行抗滲出性評估、吸光度保持率之評估。又,吸光度保持率之評估於波長530nm進行。將結果示於表8。 The resin composition (6) was used instead of the resin composition (1), and the resin molding (6) of thickness 20 micrometers was produced. Except for using the resin molded body (6) instead of the resin molded body (1), perform the same operation to make a laminate (6-1) and a laminate (6-2), and evaluate the bleeding resistance and the absorbance retention rate . In addition, the evaluation of the absorbance retention rate was performed at a wavelength of 530 nm. The results are shown in Table 8.
使用樹脂組成物(7)替代樹脂組成物(1),製作厚度20μm之樹脂成形體(7)。除了使用樹脂成形體(7)替代樹脂成形體(1)以外,進行相同之操作,製作積層體(7-1)及積層體(7-2),進行抗滲出性評估、吸光度保持率之評估。又,吸光度保持率之評估於波長520nm進行。將結果示於表8。 The resin composition (7) was used instead of the resin composition (1), and the 20-micrometer-thick resin molding (7) was produced. Except that the resin molded body (7) was used instead of the resin molded body (1), the same operation was carried out to produce laminates (7-1) and laminates (7-2), and evaluations of bleeding resistance and absorbance retention were performed. . In addition, the evaluation of the absorbance retention rate was performed at a wavelength of 520 nm. The results are shown in Table 8.
使用樹脂組成物(8)替代樹脂組成物(1),製作厚度20μm之樹脂成形體(8)。除了使用樹脂成形體(8)替代樹脂成形體(1)以外,進行相同之操作,製作積層體(8-1)及積層體(8-2),進行抗滲出性評估、吸光度保持率之評估。又,吸光度保持率之評估於波長520nm進行。將結果示於表8。 The resin composition (8) was used instead of the resin composition (1), and the resin molding (8) of thickness 20 micrometers was produced. Except for using the resin molded body (8) instead of the resin molded body (1), perform the same operation to make laminates (8-1) and laminates (8-2), and evaluate the bleeding resistance and absorbance retention rate. . In addition, the evaluation of the absorbance retention rate was performed at a wavelength of 520 nm. The results are shown in Table 8.
使用樹脂組成物(9)替代樹脂組成物(1),製作厚度20μm之樹脂成形體(9)。除了使用樹脂成形體(9)替代樹脂成形體(1)以外,進行相同之操作,製作積層體(9-1)及積層體(9-2),進行抗滲出性評估、吸光度保持率之評估。又,吸光度保持率之評估於波長510nm進行。將結果示於表8。 Using the resin composition (9) instead of the resin composition (1), a resin molded body (9) having a thickness of 20 μm was produced. Except for using the resin molded body (9) instead of the resin molded body (1), perform the same operation to make laminates (9-1) and laminates (9-2), and evaluate the bleeding resistance and absorbance retention rate. . In addition, the evaluation of the absorbance retention rate was performed at a wavelength of 510 nm. The results are shown in Table 8.
<樹脂組成物(4)成形體之評估> <Evaluation of resin composition (4) molded body>
[樹脂脂成形體(4)之製作] [Production of resin molded body (4)]
以使乾燥後之厚度成為5μm之方式,將樹脂組成物(4)使用塗佈器塗佈於由經實施離型處理之聚對苯二甲酸乙二醇酯膜構成之分離膜[購自林特(股)公司,商品名「PLR-382190」]之離型處理面,於100℃乾燥1分鐘。之後,從分離膜側使用紫外線照射裝置(Fusion UV Systems Inc製造「無電極紫外線燈系統H燈泡」),調整UV-A(波長320至390nm)使照度成為500mW、積算光量成為500mJ,以紫外線照射形成樹脂成形體(黏著劑層)(4),製作出附有分離膜之樹脂成形體(4)。 The resin composition (4) was coated on a separation film made of a release-treated polyethylene terephthalate film using an applicator so that the thickness after drying would be 5 μm [purchased from Lin Special Co., Ltd., product name "PLR-382190"], the release treatment surface was dried at 100°C for 1 minute. After that, from the separation membrane side, use an ultraviolet irradiation device (manufactured by Fusion UV Systems Inc. "electrodeless ultraviolet lamp system H bulb") to adjust the UV-A (wavelength 320 to 390nm) so that the illuminance becomes 500mW and the integrated light intensity becomes 500mJ, and then irradiates with ultraviolet rays A resin molded body (adhesive layer) (4) is formed to produce a resin molded body (4) with a separation film.
將獲得之附有分離膜之樹脂成形體(4)貼合於無鹼玻璃,將分離膜剝離後,將含有23μm之紫外線吸收劑之環烯烴膜[購自日本瑞翁(股)公司,商品名「ZEONOR」]貼合於樹脂成形體(4),製作出具有環烯烴膜/樹脂成形體(4)/玻璃之積層結構之積層體(4-1)。 The obtained resin molded body (4) with a separation film was attached to an alkali-free glass, and after the separation film was peeled off, a cycloolefin film containing a 23 μm ultraviolet absorber [purchased from Nippon Zeon Co., Ltd., commercial product name "ZEONOR"] was bonded to the resin molded body (4) to produce a laminate (4-1) having a laminated structure of cycloolefin film/resin molded body (4)/glass.
將製作之積層體(4-1)安裝於分光光度計UV-2450(島津製作所(股)公司製造),藉由雙光束法測定於1nm距離300至800nm之波長範圍之吸光度。將於測定之波長330nm之吸光度作為樹脂成形體(4)之波長330nm之吸光度。此外,無鹼玻璃單體及環烯烴膜皆為波長330nm之吸光度為0。 The produced laminate (4-1) was installed in a spectrophotometer UV-2450 (manufactured by Shimadzu Corporation), and the absorbance in the wavelength range of 300 to 800 nm at a distance of 1 nm was measured by the double-beam method. The measured absorbance at a wavelength of 330 nm was used as the absorbance at a wavelength of 330 nm of the resin molded article (4). In addition, both the alkali-free glass monomer and the cycloolefin film have an absorbance of 0 at a wavelength of 330 nm.
又,以下式為基礎,求得波長330nm之穿透率(%)。將結果示於表8。 Also, based on the following formula, the transmittance (%) at a wavelength of 330 nm was obtained. The results are shown in Table 8.
T=10-A×100(T表示穿透率,A表示吸光度) T=10 -A ×100 (T means transmittance, A means absorbance)
從於上述測定之吸光度決定積層體(4-1)之最大吸收波長,將所決定之最大吸收波長之吸光度作為樹脂成形體(4)於上述最大吸收波長之吸光度。此外,無鹼玻璃單體及環烯烴膜單體分別之上述最大吸收波長之吸光度為0。 The maximum absorption wavelength of the laminate (4-1) was determined from the absorbance measured above, and the determined absorbance at the maximum absorption wavelength was used as the absorbance of the resin molded article (4) at the above maximum absorption wavelength. In addition, the absorbance of the above-mentioned maximum absorption wavelengths of the alkali-free glass monomer and the cycloolefin film monomer is zero.
以下述式為基礎,尋求上述最大吸收波長之穿透率(%)。結果表示於表9。 Based on the following formula, the transmittance (%) of the above-mentioned maximum absorption wavelength was found. The results are shown in Table 9.
T1=10-A1×100 T1=10 -A1 ×100
(T1表示於上述最大吸收波長之穿透率,A1表示於上述最大吸收波長之吸光 度) (T1 represents the transmittance at the above-mentioned maximum absorption wavelength, A1 represents the light absorption at the above-mentioned maximum absorption wavelength Spend)
[樹脂成形體(4)之抗滲出性評估] [Evaluation of Bleeding Resistance of Resin Molded Article (4)]
於獲得之附有分離膜之樹脂成形體(4)之一面進一步積層分離膜,獲得兩面附有分離膜之黏著劑層(4)。將獲得之兩面附有分離膜之黏著劑層(4)於23至25℃之空氣下保管1個月。將保管後之兩面附有分離膜之黏著劑層(4)使用顯微鏡確認面內有無化合物之結晶析出。無結晶析出者作為a,有結晶析出者作為b。將評估結果示於表8之抗滲出性欄。 A separation film is further laminated on one side of the obtained resin molded body (4) with a separation film to obtain an adhesive layer (4) with a separation film on both sides. The obtained adhesive layer (4) with separation films on both sides was stored in the air at 23 to 25° C. for 1 month. Use a microscope to check whether there is crystallization of the compound on the surface of the adhesive layer (4) with the separation film on both sides after storage. Those without crystallization were designated as a, and those with crystallization were designated as b. The evaluation results are shown in the anti-bleeding column of Table 8.
[樹脂成形體(4)吸光度保持率之測定] [Measurement of Absorbance Retention of Resin Molded Article (4)]
準備於厚度8μm之偏光子單面使用接著劑層並貼合有13μm之環烯烴膜之偏光板。 Prepared a polarizing plate with an adhesive layer on one side of the polarizer with a thickness of 8 μm and a cycloolefin film of 13 μm attached.
將附有分離膜之樹脂成形體(4)之樹脂成形體(4)側藉由積層機貼合於偏光板之偏光子側後,於溫度23℃,相對濕度65%之條件熟成7日,獲得具有環烯烴膜/偏光子/樹脂成形體(1)/分離膜之積層結構之積層體。 After laminating the resin molded body (4) side of the resin molded body (4) with a separation film on the polarizer side of the polarizer by a laminator, it was aged for 7 days at a temperature of 23°C and a relative humidity of 65%. A laminate having a laminated structure of cycloolefin film/polarizer/resin molded body (1)/separation film was obtained.
將分離膜從獲得之積層體剝離,將樹脂成形體(4)貼合於無鹼玻璃[康寧公司製造,商品名“EAGLE XG”],獲得具有環烯烴膜/偏光子/樹脂成形體(4)/玻璃之積層結構之積層體(4-2)。 The separation film was peeled off from the obtained laminate, and the resin molded body (4) was attached to an alkali-free glass [manufactured by Corning, trade name "EAGLE XG"] to obtain a cycloolefin film/polarizer/resin molded body (4 )/glass laminate structure (4-2).
將獲得之積層體(4-2)於溫度63℃,相對濕度50%RH之條件投入陽光天氣儀(Suga Test Instruments(股)公司製造)75小時,實施耐候性試驗。以與上述相同之方法測定取出之積層體(4-2)之吸光度。從測定之吸光度,以下式為基礎,求得於波長540nm試樣之吸光度保持率[%]。將結果示於表8。吸光度保持率越接近100%,越表示光選擇吸收功能無劣化,具有良好之耐候性。 The obtained laminate (4-2) was put into a sunshine weather instrument (manufactured by Suga Test Instruments Co., Ltd.) at a temperature of 63° C. and a relative humidity of 50% RH for 75 hours to perform a weather resistance test. The absorbance of the taken-out laminate (4-2) was measured in the same manner as above. From the measured absorbance, based on the following formula, obtain the absorbance retention [%] of the sample at a wavelength of 540nm. The results are shown in Table 8. The closer the absorbance retention rate is to 100%, the more it means that the light selective absorption function has not deteriorated and has good weather resistance.
吸光度保持率(%) =(耐久試驗後之A(540)/耐久試驗前之A(540))×100 Absorbance retention rate (%) =(A(540) after durability test/A(540) before durability test)×100
[A(540)表示於波長540nm之積層體(4-2)之吸光度] [A(540) represents the absorbance of the laminate (4-2) at a wavelength of 540nm]
[表8]
[表9]
於實施例11至13之最大吸收波長之穿透率值,係顯示超過分光光 度計吸光度之測定極限(吸光度:5)。 The transmittance value of the maximum absorption wavelength in Examples 11 to 13 shows that it exceeds the spectroscopic light The measurement limit of the absorbance of the meter (absorbance: 5).
本發明之化合物係對於最大吸收波長附近之光具有高吸收選擇性。又,含有本發明之化合物之樹脂組成物係於耐候性試驗後亦具有高吸光度保持率,具有良好之耐候性。 The compounds of the present invention have high absorption selectivity for light near the maximum absorption wavelength. In addition, the resin composition containing the compound of the present invention also has a high absorbance retention rate after a weather resistance test, and has good weather resistance.
Claims (19)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021016354 | 2021-02-04 | ||
JP2021-016354 | 2021-02-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202248193A true TW202248193A (en) | 2022-12-16 |
Family
ID=82741366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111104355A TW202248193A (en) | 2021-02-04 | 2022-02-07 | Compound |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2022168754A1 (en) |
KR (1) | KR20230138491A (en) |
CN (1) | CN116761793A (en) |
TW (1) | TW202248193A (en) |
WO (1) | WO2022168754A1 (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2783869B2 (en) * | 1989-10-30 | 1998-08-06 | 三菱化学株式会社 | Nonlinear optical element |
US6004536A (en) | 1995-11-14 | 1999-12-21 | Molecular Probes, Inc. | Lipophilic cyanine dyes with enchanced aqueous solubilty |
JP6331940B2 (en) * | 2014-10-03 | 2018-05-30 | 東洋インキScホールディングス株式会社 | Coloring composition for color filter and color filter |
JP2021006517A (en) * | 2019-02-28 | 2021-01-21 | 住友化学株式会社 | Compound |
CN115443265A (en) * | 2020-04-03 | 2022-12-06 | 住友化学株式会社 | Compound (I) |
-
2022
- 2022-01-28 JP JP2022579508A patent/JPWO2022168754A1/ja active Pending
- 2022-01-28 KR KR1020237028724A patent/KR20230138491A/en unknown
- 2022-01-28 CN CN202280012885.XA patent/CN116761793A/en active Pending
- 2022-01-28 WO PCT/JP2022/003334 patent/WO2022168754A1/en active Application Filing
- 2022-02-07 TW TW111104355A patent/TW202248193A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JPWO2022168754A1 (en) | 2022-08-11 |
WO2022168754A1 (en) | 2022-08-11 |
CN116761793A (en) | 2023-09-15 |
KR20230138491A (en) | 2023-10-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6027962B2 (en) | Polymerizable liquid crystal composition, polarized luminescent paint, novel naphtholactam derivative, novel coumarin derivative, novel nile red derivative and novel anthracene derivative | |
TW201231518A (en) | Optical film | |
TWI592394B (en) | A compound containing a structural unit derived from a vinyl ether compound | |
CN109790186A (en) | Nitrogenous compound and color conversion coatings film comprising it | |
TW202204312A (en) | Compound | |
JP6772126B2 (en) | A device that controls the passage of energy | |
US11214580B2 (en) | Compound, color conversion film comprising same, back-light unit, and display device | |
TW202248193A (en) | Compound | |
TWI833915B (en) | Compound | |
CN110325538A (en) | Nitrogenous cyclic compound and color conversion coatings film comprising it | |
KR20230131477A (en) | Compounds, compositions containing them, molded bodies, dyes, and optical layers | |
JP2021006517A (en) | Compound | |
TWI837310B (en) | Compound | |
CN117203201A (en) | Compound, composition containing the same, molded article, substrate, optical layer, and laminate | |
TW202235541A (en) | Compositioin | |
CN113490660B (en) | Compounds of formula (I) | |
TW202138347A (en) | Compound | |
US20210222060A1 (en) | Compound and color conversion film comprising same, backlight unit, and display device | |
KR20190063855A (en) | Polymethine compound |