TW202247380A - Method for manufacturing thermally conductive member, and dispenser apparatus - Google Patents

Abstract

This method for manufacturing a thermally conductive member comprises: a step for preparing a thermally conductive composition R which includes a liquid resin and an anisotropic thermally conductive filler and which, when pierced with a pressing rod having a pressing surface with a diameter of 3 mm at a piercing rate of 10 mm/min, exhibits a piercing load, or stress, of 8 to 60 gf; and a step for obtaining a stack by ejecting, using a dispenser apparatus having a wide ejection opening 53, the thermally conductive composition R so as to form a plurality of layered sheets.

Description

Manufacturing method of thermally conductive member, and distributor device

The present invention relates to a manufacturing method of a thermally conductive member, and, for example, a dispenser device used in the manufacturing method of the thermally conductive member.

In electronic devices such as computers, auto parts, and mobile phones, in order to dissipate the heat generated from heating elements such as semiconductor elements and mechanical parts, heat sinks and other heat sinks are usually used. It is known that a thermally conductive member such as a thermally conductive sheet is arranged between a heat generating body and a heat sink in order to improve heat transfer efficiency to a heat sink. The thermally conductive sheet usually contains a polymer matrix and a thermally conductive filler dispersed in the polymer matrix. In order to improve thermal conductivity in a specific direction, in the thermally conductive sheet, an anisotropic filler having anisotropy in shape is often aligned in one direction.

The thermally conductive sheet in which the anisotropic filler is aligned in one direction is produced, for example, by stretching and extrusion molding, etc., to align the anisotropic filler along the surface direction of the sheet to form a primary sheet, and to make the primary sheet The sheet is hardened or semi-hardened, and a plurality of the primary sheets are laminated to be integrated, and the obtained product is sliced vertically. This manufacturing method is also called flow alignment method. According to the flow alignment method, a thermally conductive sheet formed by laminating a plurality of unit layers with a small thickness is obtained. In addition, the anisotropic filler may be aligned in the thickness direction of the sheet (for example, refer to Patent Document 1).

Also, as the polymer matrix of the thermally conductive sheet, polysiloxane resins are widely used from the viewpoint of thermal conductivity, heat resistance, and the like. However, if a polysiloxane resin is used for a polymer matrix and a thermally conductive sheet is produced by a flow alignment method, there is a case where the adhesion between the primary sheets becomes weak, which causes the primary sheet Defects such as separation from the primary sheet occur. Therefore, for example, Patent Document 2 discloses that in the case of using polysiloxane resin as a polymer matrix, in order to improve the adhesion between the primary sheets, the surface of the primary sheet is irradiated with vacuum ultraviolet rays (VUV) and the primary sheet is irradiated. overlapping. [Prior Art Literature] [Patent Document]

Patent Document 1: Japanese Patent Laid-Open No. 2013-254880 Patent Document 2: International Publication No. 2020/105601

[Problem to be Solved by the Invention]

However, as disclosed in Patent Document 1, in the method of forming a primary sheet by extrusion and then slicing, there is a problem that a lot of scrap material is generated in each step, and there is a lot of waste of material. In addition, if VUV irradiation is used as disclosed in Patent Document 2, the equipment scale becomes large, so it is desired to be able to manufacture with simple equipment.

Therefore, an object of the present invention is to provide a method of manufacturing a thermally conductive member, which can appropriately manufacture an anisotropic thermally conductive filler aligned in one direction by using simple equipment with less material waste. Thermally conductive member. [Technical means to solve the problem]

The inventors of the present invention have conducted diligent research and found that, by using a dispenser device having a wide-shaped discharge port, a thermally conductive composition having specific physical properties is discharged into a sheet and deposited into a laminate to solve the problem. In order to solve the above-mentioned problems, the following present invention has been accomplished. The present invention makes the following [1] to [16] the gist. [1] A method of manufacturing a thermally conductive member, comprising the steps of: Prepare a thermally conductive composition, the thermally conductive composition includes a liquid resin and an anisotropic thermally conductive filler, and when it is pierced at a speed of 10 mm/min by a pressing rod with a pressing surface of 3 mm in diameter The stress, i.e. thrust load, is 8 to 60 gf; and A laminate is obtained by discharging the above-mentioned thermally conductive composition in a sheet-like stacked plurality using a dispenser device having a wide-shaped discharge port. [2] The method for producing a thermally conductive member according to [1] above, wherein the liquid resin is a hardenable liquid resin, and The manufacturing method of this thermally conductive member further includes the step of hardening the said thermally conductive composition after obtaining the said laminated body. [3] The method for producing a thermally conductive member according to [1] or [2] above, further comprising a step of cutting the laminate in a direction intersecting with the laminate layer. [4] The method for producing a heat conductive member according to any one of [1] to [3] above, wherein the liquid resin contains a volatile compound. [5] The method for producing a thermally conductive member according to [4] above, further comprising a step of volatilizing the volatile compound. [6] The method for producing a thermally conductive member as described in any one of [1] to [5] above, which further includes a method of compressing the laminated body in the lamination direction to compressively deform it to a thickness of 75 to 97%. step. [7] The method for producing a thermally conductive member according to any one of [1] to [6] above, wherein the thermally conductive composition ejected into the sheet shape is stacked on one side while being cut, and the above-mentioned The laminated body has a plurality of sheets stacked on top of each other. [8] The method for producing a thermally conductive member as described in [7] above, wherein the above-mentioned sheet-like ejection is performed by a cutter provided at the ejection port and moving along the longitudinal direction of the ejection port. The thermally conductive composition is cut off. [9] The method for producing a thermally conductive member according to any one of [1] to [6] above, wherein the laminate is obtained by folding and stacking the thermally conductive composition ejected into the sheet shape. [10] The method for producing a thermally conductive member as described in any one of [1] to [9] above, wherein the above-mentioned thermally conductive material is ejected between the radiator and the heat generating body in a sheet-like stacked manner. Composition, thereby forming a laminated body between the heat dissipation body and the heat generation body. [11] The method for producing a thermally conductive member according to [10] above, wherein the thermally conductive composition is ejected in a sheet form in a direction connecting the radiator and the heat generating body. [12] The method for producing a thermally conductive member according to any one of [1] to [11] above, wherein each sheet in the laminate has a thickness of 0.1 to 9.0 mm. [13] The method for producing a thermally conductive member according to any one of [1] to [12] above, wherein the thermally conductive composition is sprayed at room temperature. [14] A dispenser device comprising: a head; and a supply passage for supplying a fluid material to the head; The head has a wide-shaped ejection port and a connection path connecting the supply path and the ejection port, and The connection path is connected to the discharge port such that an inner diameter in one direction becomes larger from the supply passage toward the discharge port. [15] The dispenser device according to the above [14], further comprising a cutter arranged at the discharge port and moving along the longitudinal direction of the discharge port. [16] The dispenser device described in the above [14] or [15], wherein at least one of the head and the ejected member from which the fluid material is ejected can be aligned with the longitudinal direction of the ejection port. Move in the orthogonal direction. [Effect of Invention]

According to the present invention, it is possible to appropriately manufacture a thermally conductive member in which an anisotropic thermally conductive filler is aligned in one direction by using simple equipment with little material waste.

Embodiments of the present invention will be described in detail below. Hereinafter, the dispenser device used in the manufacturing method of a thermally conductive member is demonstrated first.

[Dispenser device] As shown in FIG. 1 , the dispenser device 50 includes: a head 51 ; and a supply path 52 for supplying a fluid material to the head 51 . The head portion 51 includes a discharge port 53 and a connection passage 54 . The connecting passage 54 connects the discharge port 53 and the supply passage 52 . A platform 57 is provided below the head 51 , and the ejection outlet 53 is opposite to the platform 57 . Furthermore, in this manufacturing method, the fluid material is a thermally conductive composition, as long as it has fluidity and can maintain a certain shape (for example, a sheet shape) when it is ejected to the platform 57 or the like. In addition, in the following description, the ejection direction of the fluid material is referred to as MD (Machine Direction, machine direction), and the lateral direction is referred to as TD (Transverse Direction, transverse direction). MD is the direction orthogonal to TD. Also, the vertical direction perpendicular to both MD and TD is described as ZD.

As shown in FIG. 2 , the head portion 51 has a shape extending in the transverse direction (TD), and the ejection port 53 is provided on the lower surface 51A thereof. The discharge port 53 has a wide shape, that is, as shown in FIGS. 1 and 2 , the discharge port 53 has a long and thin shape in which the transverse direction (TD) is the longitudinal direction. Furthermore, the ejection port 53 is generally rectangular. The size of the ejection port 53 is not particularly limited. The length L1 on the TD is, for example, 2-100 cm, preferably 5-50 cm, and the length L2 on the MD is, for example, 0.1-9.0 mm, preferably 1.0-5.0 mm. Moreover, length ratio L1/L2 is 3-1000, for example, Preferably it is 5-500, More preferably, it is 20-200.

The connection passage 54 is connected to the discharge port 53 such that the inner diameter in one direction (TD) increases from the supply passage 52 toward the discharge port 53 to a size corresponding to the length L1 of the discharge port. Furthermore, the connection path 54 is connected to the discharge port 53 such that the inner diameter from the supply passage 52 toward the discharge port 53 decreases to a size corresponding to the length L2 in the direction (MD) perpendicular to TD.

In the dispenser device 50 , one end of the supply path 52 is connected to a storage tank 56 . A pump (not shown) is provided in the storage tank 56 , and the fluid material stored in the storage tank 56 can be supplied to the head 51 through the supply passage 52 in a pressurized state by the pump. The supply passage 52 is formed of a pressure-resistant pipe so as to be able to supply pressurized fluid material.

The platform 57 can move along the MD (that is, the direction perpendicular to the direction of the long side of the ejection port 53), by ejecting the fluid material from the ejection port 53 on one side, and moving the platform 57 on the MD, the flow ejected from the ejection port 53 Sexual material flows on the MD and becomes a sheet. The thickness of the ejected sheet-like fluid material is approximately the same as the length L2. In addition, the platform 57 can also move on ZD, for example, it can move downward when the fluid material is further superimposed on the fluid material that has been jetted into a sheet and jetted.

Moreover, the dispenser device 50 is provided with the cutter 58 arrange|positioned at the discharge port 53. In this embodiment, the cutter 58 is a wire cutter arranged on the lower side of the lower surface 51A. Both ends of the wire cutter are attached to attachment portions 51X, 51Y provided in the head portion 51 . The mounting parts 51X and 51Y can move in the TD (ie, the longitudinal direction of the discharge port 53 ) on the head 51 , and the cutter 58 can also move in the transverse direction (TD) by moving the mounting parts 51X and 51Y. And, by moving the cutter 58 on TD, the fluid material ejected from the ejection port 53 can be cut. Furthermore, the cutter 58 may be omitted in the case where the fluid material is not cut every time each layer is formed, such as in the second embodiment described below.

In addition, in the dispenser apparatus 50, instead of moving the table 57, the head 51 may be moved. Specifically, the head 51 can move on MD, and can also move on ZD. By moving the head on the MD, the fluid material can be ejected in sheet form along the MD without moving the platform 57 . Also, by moving the head on the ZD, the fluid material can be further jetted onto the fluid material already jetted into a sheet without moving the stage 57 . Furthermore, in the dispenser device 50, only one of the platform 57 and the head 51 may be movable, but both may be movable. Also, the member from which the fluid material is ejected (the member to be ejected) does not need to be the platform 57, and the platform 57 may be omitted for members other than the platform 57. Also, it may be a member arranged on the platform 57 . These discharged members only need to be able to move along ZD or MD similarly to the stage 57 .

Furthermore, the head 51 of the dispenser device 50 may also be able to swing around the upper end. If the head 51 swings around the upper end, for example, as shown in the third embodiment below, when the fluid material is sprayed between two members arranged on the upper side of the member to be sprayed, the fluid material can be Spray, etc., so as to come into contact with two members separately. Also, there is one storage tank 56 of the distributor device 50, but when the liquid resin is a two-liquid hardening type, storage tanks for storing the first liquid and the second liquid can also be provided respectively, and when the liquid resin is about to be supplied to the head These liquids are mixed and supplied to the head 51 before 51 .

[First Embodiment] <Manufacturing method of thermally conductive member> Next, the manufacturing method of the heat conductive member which concerns on 1st Embodiment of this invention is demonstrated in detail. Regarding the thermally conductive member of the first embodiment, the thermally conductive member is manufactured by a manufacturing method including steps 1 to 5 below. Furthermore, in the first embodiment, step 1 to step 5 can be performed in sequence. Step 1: Step of preparing a thermally conductive composition comprising a hardenable liquid resin and a thermally conductive filler Step 2: Using a dispenser device, spray the thermally conductive composition obtained in Step 1 in the form of stacking a plurality of sheets, thereby obtaining a laminated body Step 3: Step of compressing the obtained laminated body in the laminated direction Step 4: The step of hardening the thermally conductive composition Step 5: The step of cutting the laminated body along the direction intersecting with the laminated layer

[step 1] In step 1, a thermally conductive composition including a hardenable liquid resin and a thermally conductive filler is prepared. The thermally conductive composition contains an anisotropic thermally conductive filler (hereinafter, also simply referred to as “anisotropic filler”) as a thermally conductive filler. The anisotropic filler is a thermally conductive filler that has anisotropy in shape, and is a filler that can be aligned. In this manufacturing method, the anisotropic filler is aligned in the ejection direction in step 2, so the thermal conductivity in one direction of the thermally conductive member can be improved. However, the thermally conductive composition preferably contains an anisotropic thermally conductive filler (hereinafter also simply referred to as "non-anisotropic filler") as a thermally conductive filler in addition to an anisotropic filler as a thermally conductive filler. sex filler. The details of the thermally conductive filler will be described below.

The thermally conductive composition prepared in step 1 has a thrust load of 8-60 gf when the thrust speed is 10 mm/min. If the thrust load is less than 8 gf or more, the following disadvantages will occur: when a plurality of sheet-shaped thermally conductive compositions ejected from the dispenser device are stacked, the thermally conductive composition will expand due to its own weight, and it will not be possible to obtain a thermally conductive composition. A laminate with a thickness above a certain level; the alignment will be disordered. In addition, when the thrust load exceeds 60 gf, problems such as failure to discharge the thermally conductive composition from the dispenser device 50 may occur. From the viewpoint of further suppressing expansion due to its own weight, the thrust load is preferably 10 gf or more, more preferably 16 gf or more. Also, from the viewpoint of improving the ejection property from the dispenser device 50, the thrust load is preferably 50 gf or less, more preferably 35 gf or less. The stabbing load at the stabbing speed of 10 mm/min is the stress when the thermally conductive composition is stabbed at a stabbing speed of 10 mm/min by a pressing rod with a pressing surface of 3 mm in diameter. In addition, the measurement of the thrust load was performed at the temperature (discharge temperature) at which the thermally conductive composition is discharged from the discharge port. The thrust load can be adjusted by proper selection of the raw materials used in the thermally conductive composition. Specifically, the viscosity of the liquid resin, the type and blending amount of the anisotropic filler, the type and blending amount of the following non-anisotropic filler, and the ratio of the liquid components other than the liquid resin The presence or absence of blending, type and content are adjusted.

In the present invention, in order for the thermally conductive composition to be ejected from the dispenser device in a sheet form and stacked to form a laminate, the thermally conductive composition must have a high viscosity. Generally speaking, the viscosity measured by a viscometer such as a B-type viscometer is usually used as an index to indicate the viscosity of a thermally conductive composition, but the following situations exist in a high-viscosity thermally conductive composition containing an anisotropic filler: B The rotor of the type viscometer will slide relative to the sample, etc., making it difficult to accurately measure the viscosity with the viscometer. On the other hand, the value of the thrust load is effective as an index indicating the viscosity of a high-viscosity composition containing a thermally conductive filler such as an anisotropic filler. Therefore, the thrust load is used in the present invention.

In addition, the thrust load of the thermally conductive composition at a thrust speed of 100 mm/min is preferably 10 to 100 gf. By setting the thrust load at the thrust speed of 100 mm/min within the above-mentioned range, the expansion due to its own weight can be further suppressed, and the ejection property from the dispenser device can also be easily improved. From these points of view, the thrust load at a thrust speed of 100 mm/min is more preferably 13 gf or more, further preferably 25 gf or more, further preferably 75 gf or less, further preferably 45 gf or less. Furthermore, the thrust load when the thrust speed is 100 mm/min can be measured by the same method as the thrust load when the thrust speed is 10 mm/min except the thrust speed. Also, the hardenable liquid resin is preferably composed of a main ingredient and a curing agent for curing the main ingredient. In this case, in step 1, you can prepare: the first liquid, which is obtained by mixing at least an anisotropic filler into the main ingredient of the hardenable liquid resin; and the second liquid, which is made into the hardenable liquid resin It is obtained by mixing at least an anisotropic filler into the hardener of the liquid resin. In the first liquid and the second liquid, in addition to the anisotropic filler, other components such as an anisotropic filler and a liquid component described below may be appropriately blended. The first liquid and the second liquid can be mixed and stored in the storage tank 61, or can be stored in different storage tanks and mixed immediately before step 2.

[step 2] The thermally conductive composition obtained in Step 1 can be filled into the storage tank 56 of the dispenser device 50 (refer to FIG. 1 ). Then, by driving a pump not shown in the figure, the heat conductive composition in a pressurized state is supplied to the head 51 through the supply passage 52, and as shown in FIG. 3(A), the heat conductive composition R is discharged from the discharge port 53 is ejected to the outside. At this time, as shown in FIG. 3(A), by ejecting the thermally conductive composition R and moving the platform 57 in one direction (also referred to as "forward") of the MD, the thermally conductive composition R is ejected in a sheet form. to above platform 57.

After the thermally conductive composition R is ejected for a certain length along the MD, the cutter 58 is moved along the TD (direction perpendicular to the paper in FIG. 3 ), as shown in FIG. 3(B), it will be ejected from the ejection port 53 The thermally conductive composition R is cut to form the first sheet S1 on the platform 57 .

Then, as shown in FIG. 3(C), the stage 57 is moved downward. Thereafter, as shown in FIG. 3(D), the thermally conductive composition R is sprayed onto the sheet S1, and the stage 57 is moved in the reverse direction along the MD (direction opposite to the forward direction described above). Then, after being sprayed for a certain length along the MD, as shown in FIG. The body of the film S2. Thereafter, the platform 57 is moved downward again, and the above-mentioned operation is repeated, whereby a laminate 22 (refer to FIG. 4 ( A)). Furthermore, Fig. 4 shows a state in which a plurality of sheet bodies are overlapped, and the number of overlapping sheets (the number of layers) is not particularly limited, as long as it is 2 or more, for example, it can be 10 or more, and it can be 1000 or less. It may be about 100 or less.

In step 2, the temperature (discharge temperature) when the thermally conductive composition R is discharged from the discharge port 53 is preferably room temperature. In step 2, by setting the discharge temperature to room temperature, it is not necessary to provide a heating device or the like in the dispenser device 50, and the device can be simplified. Furthermore, the room temperature here means substantially the same as the ambient temperature in which the dispenser device is installed. Therefore, the aspect in which the thermally conductive composition R is ejected without being heated by the heating means in the dispenser device 50 is also included in the aspect in which the ejection temperature is room temperature. The specific discharge temperature is, for example, about 0 to 40°C, preferably about 10 to 30°C.

In step 2, by ejecting the thermally conductive composition R along the MD, the anisotropic filler blended in the thermally conductive composition R is aligned in the ejection direction (MD). Thereby, in each of the sheets S1, S2, ... Sn, the anisotropic filler is aligned in one direction (MD) along the surface direction of the sheet. In addition, as described below, the anisotropic filler is also aligned in one direction along the plane direction in the unit layer of the thermally conductive member, whereby it can be aligned along the thickness direction of the thermally conductive member.

More specifically, the orientation of the anisotropic filler is described. When the anisotropic filler is a fibrous filler as described below, it refers to a direction in which the long axis of the fibrous filler is relative to the direction along the plane ( MD, the ratio of the number of anisotropic fillers with an angle of less than 30° in the following thermally conductive members (thickness direction) exceeds 50% of the total amount of anisotropic fillers, the ratio is better is more than 80%. In addition, when the anisotropic filler is a scaly filler, it refers to the difference between the scale surface of the scaly filler and one direction (MD, thickness direction in the following thermally conductive members) relative to the direction along the surface. When the ratio of the number of anisotropic fillers with an angle of less than 30° to the total amount of anisotropic fillers exceeds 50%, it is preferable to set this ratio to more than 80%.

Furthermore, regarding the anisotropic filler, from the viewpoint of improving the thermal conductivity, the long axis or the scale surface is formed with respect to one direction along the surface direction (MD, thickness direction in the thermally conductive member described below). The angle is preferably 0° or more and less than 10°, more preferably 0° or more and less than 5°. Furthermore, these angles are the average value of the alignment angles of anisotropic fillers of a certain number (for example, any 50 anisotropic fillers). Furthermore, when the anisotropic filler is not fibrous or scaly, it also refers to the direction in which the long axis of the anisotropic filler is relative to the direction along the surface (ie, MD, in the following thermally conductive member When the ratio of the number of anisotropic fillers whose angle formed by the thickness direction) is less than 30° to the total amount of anisotropic fillers exceeds 50%, the ratio is preferably set to exceed 80%.

Also, when the anisotropic filler is a scaly material, it is further preferable that the normal direction of the scale surface of the anisotropic filler is oriented in a specific direction, specifically, it is preferably oriented in the thickness direction of each sheet ( ZD, the lamination direction of the following plural unit layers 13). By directing the normal direction toward the lamination direction in this way, the thermal conductivity in one direction (thickness direction in the thermally conductive member) improves. In addition, the thermal conductivity along the surface direction of the sheet-shaped thermally conductive member and in the direction perpendicular to the lamination direction is also improved. Furthermore, the so-called normal direction of the scale surface faces the thickness direction of the flake body (that is, the lamination direction) refers to the number of scale-shaped materials whose angle formed by the normal direction relative to the thickness direction (lamination direction) is less than 30° In the state where the ratio exceeds 50%, the ratio is preferably more than 80%.

In the laminate obtained in step 2, the thickness of each sheet S1, S2, ... Sn is not particularly limited, and is preferably 0.1-9.0 mm. By setting the thickness of the sheet to 0.1 mm or more, the thermally conductive composition R can be discharged without increasing the discharge pressure, and a thermally conductive composition mixed with a large amount of thermally conductive filler can be easily discharged. Moreover, by making the thickness of a sheet|seat into 9.0 mm or less, it becomes easy to improve the orientation of an anisotropic filler. From these viewpoints, the thickness of each sheet body S1, S2, ... Sn is more preferably 0.5-7 mm. Furthermore, due to the weight of the laminated thermally conductive composition itself, the thickness of each sheet in the laminate may be compressed and thinner relative to the discharge thickness of the sheet (thickness of the unlaminated sheet), and as a result The thickness of each sheet is, for example, 80% to 100% of the ejected thickness, preferably 90 to 100% of the ejected thickness.

[Step 3] In step 3, the laminated body 22 obtained in the compressing step 2 can be compressed by pressurizing the laminated body 22 in the lamination direction. In Step 3, by compressing the laminated body 22 by pressurization, the plurality of sheets S1, S2, ... Sn can be closely adhered to each other, thereby preventing peeling between the sheets. Furthermore, since a plurality of sheet bodies are not hardened, even when a silicone resin is used as the liquid resin, the sheet bodies can be firmly bonded to each other by compression by pressurization. Regarding the laminated body 22 , if the original thickness is set to 100%, it is preferable to compress and deform to a thickness of 75 to 97% by compression. By compressively deforming within the above range, it is easy to firmly bond the sheet bodies without excessively deforming the laminated body 22 . In addition, the laminated body 22 is more preferably a thickness of 85 to 95% of compression deformation. Furthermore, the laminated body 22 is plastically compressed and deformed by compression, so even if the compressed laminated body is released from pressurization, the thickness of the laminated body 22 is maintained within the thickness within the above-mentioned range. The compression of the laminate can be carried out, for example, by applying pressure using a roll or a press. The pressure at the time of pressurization is not particularly limited. For example, when a roll is used, the pressure is preferably 0.3 to 3 kgf/50 mm.

[Step 4] Next, in step 4, the laminated body compressed and deformed in step 3 is hardened. The curing method can be appropriately set according to the type of curable liquid resin. For example, if the curable liquid resin is photocurable, it is only necessary to irradiate the laminated body with ultraviolet light or the like to harden the laminated body (heat conductive composition). Also, if the curable liquid resin is thermosetting, it is only necessary to harden the laminate (heat conductive composition) by heating. The hardenable liquid resin is preferably thermosetting. Therefore, the hardening of the thermally conductive composition in step 4 is preferably performed by heating. Specifically, for example, it can carry out at the temperature of about 50-150 degreeC. Moreover, heating time is about 10 minutes - 10 hours, for example.

Furthermore, when a volatile compound is blended in the thermally conductive composition described below, the volatile compound can be volatilized at any point of time. Specifically, it can also be volatilized by heating during curing. More specifically, in the heating during curing, the thermally conductive composition is first cured, and then the volatile compound can be volatilized by continuing to heat or heating at an elevated temperature. However, it is preferable to volatilize by further performing a heating step after step 5 described below. This is because the volatile compound can be volatilized more efficiently than in the case of a laminate by making it into a sheet form in step 5. Moreover, it is also possible to volatilize a part by heating during curing, and further volatilize the volatile compound after step 5 below. There are no particular limitations on heating after step 5 below. For example, heating may be performed at 70-170° C., preferably 100-160° C., and the heating time is, for example, about 30 minutes to 24 hours.

[step 5] Then, as shown in FIG. 4(B), the hardened laminate 22 is cut along the stacking direction of the sheets S1, S2, ... Sn by using the cutter 18 to obtain a sheet-shaped thermally conductive member 10 (thermally conductive sheet) . At this time, the laminate 22 can be cut in a direction perpendicular to the alignment direction of the anisotropic filler. As the knife 18, for example, a double-edged knife such as a razor blade or a cutting knife, a single-edged knife, a round knife, a wire knife, a saw blade, or the like can be used. Using the cutter 18, the laminate 22 is cut by, for example, press cutting, shearing, rotation, sliding, or the like. Furthermore, the cutting direction in step 5 is preferably the same direction as the lamination direction, but it may be deviated from the same lamination direction as long as it is a direction intersecting the lamination layer of the laminated body 22 .

According to the manufacturing method of the present embodiment described above, it is possible to manufacture a thermally conductive member in which the anisotropic filler is aligned in one direction without using large-scale equipment and rarely generating scrap materials. Therefore, a thermally conductive member with good thermal conductivity can be manufactured with less material waste and simple equipment. In addition, according to the manufacturing method of this embodiment, when obtaining the laminated body 22, since the thermally conductive composition R is cut for each layer, the thickness becomes uniform and the alignment is less likely to be disturbed at the end of the laminated body 22, thereby Generation of scrap material can be further suppressed.

[Thermal conductive member] An example of a thermally conductive member obtained by the above-mentioned manufacturing method is shown in FIG. 5 . The thermally conductive member 10 has a sheet shape and includes a plurality of unit layers 13 each containing a matrix resin 11 and a thermally conductive filler. A plurality of unit layers 13 are laminated along one direction x, and adjacent unit layers 13 are connected to each other. In each unit layer 13 , the matrix resin 11 becomes a matrix resin holding a thermally conductive filler, and the thermally conductive filler is mixed into the matrix resin 11 in a dispersed manner. The matrix resin 11 is obtained by hardening the above-mentioned curable liquid resin, preferably polysiloxane resin. The direction x of the stacked unit layer 13 is a direction perpendicular to the thickness direction z of the thermally conductive member.

The thermally conductive member 10 shown in FIG. 5 includes an anisotropic filler 14 and an anisotropic filler 15 as thermally conductive fillers. The anisotropic filler 14 is aligned in the thickness direction z of the sheet-shaped thermally conductive member 10 . That is, the anisotropic filler 14 is aligned along one of the plane directions of each unit layer 13 . The thermally conductive member 10 improves thermal conductivity in the thickness direction by including the anisotropic filler 14 aligned in the thickness direction z. Moreover, thermal conductivity is further improved by further including the anisotropic filler 15 in the thermally conductive member 10 . However, the heat conductive member 10 may not contain the anisotropic filler 15 .

In the thermally conductive member 10 , the filling rate of the matrix resin 11 is preferably 15 to 60 vol %, more preferably 20 to 45 vol %, based on the entire thermally conductive member, expressed in volume %. In addition, in the thermally conductive member 10, the filling rate of the anisotropic filler 14 is preferably 2 to 45% by volume, more preferably 8 to 45% by volume, based on the volume of the entire thermally conductive member. 35% by volume. If the filling rate of the anisotropic filler 14 exists in the said range, high thermal conductivity can be given to the heat conductive member 10, and it can manufacture suitably by a dispenser apparatus. Also, when the non-anisotropic filler 15 is included, the filling rate of the non-anisotropic filler 15 is preferably 10 to 75% by volume relative to the thermally conductive member, expressed on a volume basis. , more preferably 30 to 60% by volume.

The anisotropic filler 14 is exposed on both surfaces 10A and 10B of the heat conductive member 10 in the thickness direction z. In addition, the exposed anisotropic filler 14 may protrude from both surfaces 10A and 10B, respectively. In the heat conductive member 10, since the anisotropic filler 14 is exposed to both surfaces 10A, 10B, both surfaces 10A, 10B become a non-adhesive surface. In addition, in the thermally conductive member, since both surfaces 10A, 10B become cut surfaces by the above-mentioned cutting with a cutter, the anisotropic filler 14 is exposed to both surfaces 10A, 10B. However, either one or both of the two surfaces 10A and 10B may be an adhesive surface without exposing the anisotropic filler.

The thickness of the thermally conductive member 10 is appropriately changed according to the shape or application of the electronic device on which the thermally conductive member is mounted. The thickness of a heat conductive member is not specifically limited, For example, it can use it in the range of 0.1-5 mm. Also, the thickness of each unit layer 13 is not particularly limited, but is preferably 0.1 to 8.5 mm, more preferably 0.5 to 6 mm. Furthermore, the thickness of the unit layer 13 refers to the length of the unit layer 13 along the lamination direction z of the unit layer 13 .

Thermally conductive members are used inside electronic devices and the like. Specifically, the thermally conductive member is interposed between the heating body and the cooling body, transfers the heat generated by the heating body to move to the cooling body, and releases it from the cooling body. Here, examples of the heating element include various electronic components such as CPUs, power amplifiers, and power supplies used inside electronic equipment. In addition, examples of the radiator include radiator fins, heat pumps, and metal casings of electronic equipment. The thermally conductive member 10 can be used after both surfaces 10A and 10B are in close contact with each of the heat generating body and the heat sink, respectively, and compressed.

[Thermal conductive composition] Hereinafter, components used in the thermally conductive composition will be described in detail. (liquid resin) In this embodiment, as described above, the thermally conductive composition contains a curable liquid resin. By using a hardenable liquid resin, the thermally conductive composition can be properly ejected into a sheet form from the dispenser device, and appropriate mechanical strength can be imparted to the thermally conductive member by curing. In addition, in this specification, a liquid state means what is a liquid at 25 degreeC and 1 atmospheric pressure. The curable liquid resin may be photocurable or thermosetting, but is preferably thermosetting.

Specific examples of the hardenable liquid resin include epoxy resin, polyurethane resin, silicone resin, acrylic resin, and polyisobutylene resin. Also, the curable liquid resin is not limited to the above-mentioned resins, and may be acrylic rubber, nitrile rubber, isoprene rubber, urethane rubber, ethylene propylene rubber, styrene-butadiene rubber, etc. , butadiene rubber, fluororubber, butyl rubber, etc. In the case of using these rubbers, it is only necessary to use uncrosslinked rubber, and it is only necessary to mix a crosslinking agent in the thermally conductive composition.

Among the above-mentioned hardenable liquid resins, silicone resins are preferable. The silicone resin is not particularly limited as long as it is a thermosetting hardening silicone resin, but it is preferable to use an addition reaction silicone resin. In the case of an addition reaction type, the curable silicone resin is preferably composed of a polysiloxane compound (organopolysiloxane) as a main ingredient, and a curing agent that hardens the main ingredient. The polysiloxane compound used as the main agent is preferably an alkenyl-containing organopolysiloxane, for example: polydimethylsiloxane with both vinyl ends capped, polyphenylene with both vinyl ends capped Methylsiloxane, vinyl two-capped dimethylsiloxane-diphenylsiloxane copolymer, vinyl two-capped dimethylsiloxane-phenylmethylsiloxane copolymer , Vinyl double-capped dimethylsiloxane-diethylsiloxane copolymer, vinyl double-capped organopolysiloxane, etc. The hardening agent is not particularly limited as long as it can harden the above-mentioned polysiloxane as the main agent, but it is preferably an organopolysiloxane having two or more hydrosilyl groups (SiH). Organohydrogenpolysiloxane.

The liquid resin is not particularly limited, but has a viscosity of, for example, about 30 to 2000 mPa·s, preferably about 100 to 500 mPa·s. By setting the viscosity within the above-mentioned range, it is easy to adjust the thrust load to be within the above-mentioned specific range. Furthermore, the so-called viscosity here refers to the viscosity measured by using a rotational viscometer (Brookfield viscometer DV-E, spindle SC4-14) at a rotation speed of 10 rpm, and the measurement temperature refers to the temperature when the thermally conductive composition is ejected. Furthermore, when the liquid resin is composed of a main ingredient and a curing agent like the above-mentioned polysiloxane resin, the viscosity of the liquid resin is the viscosity after mixing these.

(anisotropic filler) The anisotropic filler is a thermally conductive filler that has anisotropy in shape, and is a filler that can be aligned. As an anisotropic filler, a fibrous material, a scaly material, etc. are mentioned. The anisotropic filler usually has a high aspect ratio, and the aspect ratio exceeds 2, more preferably 5 or more. By making the aspect ratio larger than 2, it is easy to align the anisotropic filler in the ejection direction, and it is easy to improve the thermal conductivity of the thermally conductive member.

Moreover, although the upper limit of an aspect ratio is not specifically limited, It is 100 practically. Furthermore, the so-called aspect ratio refers to the ratio of the length of the long axis direction of the anisotropic filler to the length of the short axis direction, which means "fiber length/fiber diameter" in fibrous materials and means "The length/thickness of the long axis direction of the flaky material".

The content of the anisotropic filler in the thermally conductive composition is preferably from 10 to 500 parts by mass, more preferably from 50 to 350 parts by mass, relative to 100 parts by mass of the liquid resin. By making content of an anisotropic filler 10 mass parts or more, it becomes easy to improve the heat conductivity of a heat conductive member. Moreover, by making content of an anisotropic filler into the said range, it becomes easy to make the value of the said thrust load of a thermally conductive composition into an appropriate value.

When the anisotropic filler is a fibrous material, the average fiber length is preferably 10-500 μm, more preferably 20-350 μm. When the average fiber length is set to be 10 μm or more, the anisotropic fillers will be in proper contact with each other in each thermally conductive member, a heat transfer path will be secured, and the thermal conductivity of the thermally conductive member will become good. On the other hand, if the average fiber length is 500 μm or less, the volume of the anisotropic filler becomes low, and it can be highly filled in the liquid resin. In addition, the said average fiber length can be computed by observing an anisotropic filler with a microscope. More specifically, the fiber lengths of 50 arbitrary anisotropic fillers can be measured using an electron microscope or an optical microscope, and the average (arithmetic mean) thereof can be defined as the average fiber length. In addition, the average fiber length can be measured similarly to the anisotropic filler obtained by dissolving and separating a matrix resin, for example about the anisotropic filler mixed with a thermally conductive member. At this time, do not apply a large shearing force so as not to crush the fibers. Also, when it is difficult to separate the anisotropic filler from the thermally conductive member, the fiber length of the anisotropic filler can be measured using an X-ray CT apparatus, and the average fiber length can be calculated. Furthermore, in the present invention, the term "random" refers to random selection.

Also, when the anisotropic filler is a scaly material, the average particle diameter is preferably from 5 to 400 μm, more preferably from 10 to 300 μm. Moreover, it is more preferably 20 to 200 μm. By setting the average particle size to 5 μm or more, the anisotropic fillers are easily in contact with each other in the thermally conductive member, a heat transfer path is secured, and the thermal conductivity of the thermally conductive member becomes good. On the other hand, if the average particle diameter is 400 μm or less, the volume of the anisotropic filler becomes low, and the anisotropic filler in the liquid resin can be highly filled. Furthermore, the average particle size of the flaky material can be calculated by observing the anisotropic filler with a microscope and taking the long axis as the diameter. More specifically, the major diameters of any 50 anisotropic fillers can be measured using an electron microscope, an optical microscope, or an X-ray CT device in the same manner as the above-mentioned average fiber length, and the average (arithmetic mean) thereof can be defined as The average particle size. Moreover, the thickness of the said anisotropic filler can also be measured using an electron microscope, an optical microscope, and an X-ray CT apparatus similarly.

As the anisotropic filler, a known material having thermal conductivity may be used. In addition, the anisotropic filler may have conductivity or insulation. If the anisotropic filler has insulation, the insulation in the direction in which the anisotropic filler of the thermally conductive member is aligned can be improved, so it is suitable for use in electrical equipment. In addition, in the present invention, having conductivity means, for example, that the volume resistivity is 1×10 ⁹ Ω·cm or less. In addition, having insulating properties means, for example, that the volume resistivity exceeds 1×10 ⁹ Ω·cm.

唑纖維等。其中，碳系材料因比重較小且於液狀樹脂中之分散性良好，故較佳，其中，導熱率較高之石墨化碳材料更佳。又，就具有絕緣性之觀點而言，較佳為氮化硼、聚對伸苯基苯并

唑纖維，其中，更佳為氮化硼。氮化硼並無特別限定，但較佳為用作鱗片狀材料。鱗片狀之氮化硼可凝集，亦可不凝集，但較佳為一部分或全部不凝集。 各向異性填充材可單獨使用1種，亦可併用2種以上。 Specific examples of anisotropic fillers include carbon-based materials represented by carbon fibers and scaly carbon powders, metal materials represented by metal fibers or metal oxides, boron nitride or metal nitrides, and metal carbides. compounds, metal hydroxides, polyparaphenylene benzos

Azole fiber, etc. Among them, carbon-based materials are preferable because of their small specific gravity and good dispersibility in liquid resins. Among them, graphitized carbon materials with high thermal conductivity are more preferable. Also, from the viewpoint of insulating properties, boron nitride, polyphenylenebenzo

Azole fiber, wherein, boron nitride is more preferable. Boron nitride is not particularly limited, but is preferably used as a scaly material. The scaly boron nitride may or may not be agglomerated, but it is preferable that part or all of it is not agglomerated. Anisotropic fillers may be used alone or in combination of two or more.

The anisotropic filler is not particularly limited, and the thermal conductivity along the anisotropic direction (ie, the long-axis direction) is usually 30 W/m·K or higher, preferably 100 W/m·K or higher. The upper limit of the thermal conductivity of the anisotropic filler is not particularly limited, and is, for example, 2000 W/m·K or less. The thermal conductivity is measured by the laser flash method.

Anisotropic fillers may be used alone or in combination of two or more. For example, at least two anisotropic fillers having different average particle diameters or average fiber lengths may be used as the anisotropic filler. It is considered that if anisotropic fillers of different sizes are used, the smaller anisotropic fillers will enter between the relatively larger anisotropic fillers, thereby filling the anisotropic fillers to a liquid state with high density In the resin, and can improve the heat conduction efficiency.

The carbon fiber used as the anisotropic filler is preferably graphitized carbon fiber. Also, as the flaky carbon powder, flaky graphite powder is preferable. Among them, the anisotropic filler is more preferably graphitized carbon fiber. The graphitized carbon fiber has graphite crystal planes connected in the direction of the fiber axis, and has higher thermal conductivity in the direction of the fiber axis. Therefore, by aligning the fiber axis directions in a specific direction, the thermal conductivity in the specific direction can be improved. In addition, the graphite crystal planes of the flaky graphite powder are connected in the in-plane direction of the flaky graphite powder, and have high thermal conductivity in the in-plane direction. Therefore, by aligning the scale faces in a specific direction, the thermal conductivity in a specific direction can be improved. Graphitized carbon fiber and flake graphite powder are preferably those with a higher degree of graphitization.

As the graphitized carbon material such as the above-mentioned graphitized carbon fiber, those obtained by graphitizing the following raw materials can be used. For example, condensed polycyclic hydrocarbon compounds such as naphthalene, PAN (polyacrylonitrile), condensed heterocyclic compounds such as pitch, etc., but it is particularly preferable to use graphitized mesophase pitch or polyimide with a high degree of graphitization, Polybenzoxazole. For example, by using mesophase pitch, the pitch is aligned in the fiber axis direction due to its anisotropy in the following spinning step, so that graphitized carbon fibers having excellent thermal conductivity in the fiber axis direction can be obtained. The usage of the mesophase pitch in the graphitized carbon fiber is not particularly limited, as long as it can be spun, the mesophase pitch can be used alone or in combination with other materials. However, in terms of high thermal conductivity, spinnability, and quality stability, it is best to use mesophase pitch alone, that is, graphitized carbon fibers with a mesophase pitch content of 100%.

Graphitized carbon fibers can be used: spinning, infusible, and carbonized in sequence, crushed or cut into a specific particle size, and then graphitized; or carbonized, crushed or cut, and then graphitized earner. In the case of pulverization or cutting before graphitization, on the surface newly exposed by pulverization, polycondensation reaction and cyclization reaction are easy to proceed during graphitization treatment, so the degree of graphitization can be improved and heat conduction can be obtained. Graphitized carbon fiber with further improved properties. On the other hand, when the spun carbon fiber is pulverized after graphitization, the carbon fiber after graphitization is relatively hard, so it is easy to pulverize, so that a relatively narrow fiber length distribution can be obtained by pulverizing for a short time. Carbon fiber powder.

The average fiber length of the graphitized carbon fiber is preferably 50-500 μm, more preferably 70-350 μm. Also, as mentioned above, the aspect ratio of the graphitized carbon fiber is more than 2, preferably 5 or more. The thermal conductivity of the graphitized carbon fiber is not particularly limited, but the thermal conductivity in the fiber axis direction is preferably 400 W/m·K or higher, more preferably 800 W/m·K or higher.

(non-anisotropic filler) As described above, the thermally conductive composition may further contain an anisotropic filler. The non-anisotropic filler is a material that imparts thermal conductivity to the thermally conductive member together with the anisotropic filler. In this embodiment, by including the non-anisotropic filler, it is possible to obtain a thermally conductive member having a high thermal conductivity by interposing the filler in the gap between the aligned anisotropic fillers. The non-anisotropic filler is a filler that does not substantially have anisotropy in shape, and is aligned in a specific direction even when the thermally conductive composition is ejected from the ejection port in one direction as described below. In the environment, the filling material will not be aligned in the specific direction.

The aspect ratio of the non-anisotropic filler is 2 or less, more preferably 1.5 or less. By including the anisotropic filler with such a low aspect ratio, it is possible to obtain a thermally conductive member having a high thermal conductivity by interposing the thermally conductive filler properly in the gaps between the anisotropic fillers. In addition, by setting the aspect ratio to be 2 or less, it is possible to prevent an increase in the thrust load of the thermally conductive composition and achieve high filling.

The non-anisotropic filler may also have electrical conductivity, but preferably has insulating properties. In the thermally conductive member, it is preferable that both the anisotropic filler and the non-anisotropic filler have insulating properties. In this way, both the anisotropic filler and the non-anisotropic filler are insulating, and it is easy to further improve the insulation in the direction in which the anisotropic filler of the thermally conductive member is aligned.

Specific examples of the non-anisotropic filler include metals, metal oxides, metal nitrides, metal hydroxides, carbon materials, oxides other than metals, nitrides, and carbides. Also, the shape of the non-anisotropic filler may, for example, be spherical or amorphous powder. Among the anisotropic fillers, examples of metals include aluminum, copper, nickel, etc., examples of metal oxides such as aluminum oxide, magnesium oxide, and zinc oxide represented by alumina, and examples of metal nitrogen As the compound, aluminum nitride and the like can be exemplified. As the metal hydroxide, aluminum hydroxide may, for example, be mentioned. Furthermore, spherical graphite etc. are mentioned as a carbon material. Examples of oxides, nitrides, and carbides other than metals include quartz, boron nitride, and silicon carbide. Among them, aluminum oxide or aluminum is preferable in terms of high thermal conductivity and easy availability of spherical materials, and aluminum hydroxide is preferred in terms of easy availability and improvement of the flame retardancy of thermally conductive members. . The non-anisotropic insulating filler includes, among the above, metal oxides, metal nitrides, metal hydroxides, and metal carbides, particularly preferably aluminum oxide and aluminum hydroxide. As the non-anisotropic filler, one of the above-mentioned materials may be used alone, or two or more of them may be used in combination.

The average particle diameter of the non-anisotropic filler is preferably 0.1-100 μm, more preferably 0.3-50 μm. Moreover, it is more preferably 0.5 to 15 μm. By setting the average particle size to 50 μm or less, troubles such as disturbing the alignment of the anisotropic filler are less likely to occur. In addition, by setting the average particle size to 0.1 μm or more, the specific surface area of the anisotropic filler does not increase more than necessary, and even if it is blended in a large amount, the spike load does not easily increase, and it is easy to highly fill the anisotropic filler. filler. In addition, the average particle diameter of an anisotropic filler can be measured by observation with an electron microscope etc. More specifically, the particle diameters of any 50 non-anisotropic fillers can be measured using an electron microscope or an optical microscope, or an X-ray CT device in the same manner as the measurement of the above-mentioned anisotropic filler, and the average value ( Arithmetic mean) is set as the average particle size.

The content of the non-anisotropic filler in the thermally conductive composition is preferably in the range of 50 to 1500 parts by mass, more preferably in the range of 200 to 800 parts by mass, relative to 100 parts by mass of the liquid resin . By setting it as 50 mass parts or more, the quantity of the anisotropic filler interposed in the gap between anisotropic fillers will become more than a certain amount, and thermal conductivity will become favorable. On the other hand, by setting it as 1500 parts by mass or less, the effect of improving the thermal conductivity corresponding to the content can be obtained, and the heat conduction by the anisotropic filler will not be hindered by the anisotropic filler. Furthermore, by setting it as the said range, the value of the said thrust load of a heat conductive composition becomes an appropriate value easily. Moreover, by setting it as the range of 200-800 mass parts, the heat conductivity of a heat conductive member is excellent, and a thrust load also becomes suitable.

(liquid component) The thermally conductive composition may also contain a liquid component in addition to the above-mentioned liquid resin. By containing a liquid component, even if the content of the thermally conductive filler is increased, it is easy to adjust the thrust load within a specific range. As a liquid component, a volatile compound and silicone oil are mentioned below. Either one of a volatile compound and a silicone oil may be used, or both may be used. In the thermally conductive composition, the liquid components other than the liquid resin are preferably 5 to 120 parts by mass, more preferably 10 to 80 parts by mass, and still more preferably 15 to 50 parts by mass. By making the liquid components other than the liquid resin within the above-mentioned range, even if the content of the thermally conductive filler is increased, the thrust load can be adjusted within a specific range.

(volatile compounds) In this specification, a volatile compound means a compound having at least one of the following properties: In thermogravimetric analysis, the temperature T1 at which the weight loss reaches 90% when the temperature is raised at 2°C/min is in the range of 70 to 300°C and the boiling point (1 atmosphere) is in the range of 60-200°C. Here, the temperature T1 at which the weight decreases by 90% means the temperature at which 90% of the weight of the sample before the thermogravimetric analysis is set to 100% and the weight decreases by 90% (that is, when it becomes 10% of the weight before the measurement temperature).

Since the thermally conductive composition contains a volatile compound, even if the content of the thermally conductive filler is increased, the thrust load can be kept low, and the ejection property when ejected from the dispenser device becomes good. On the other hand, the filling rate of the thermally conductive filler in the thermally conductive member can be increased by volatilizing it during the production process of the thermally conductive member. Therefore, when the thermally conductive composition contains a volatile compound, the thermal conductivity of the thermally conductive member can be improved, and the ejection property can also be improved.

As a volatile compound, a volatile silane compound, a volatile solvent, etc. are mentioned, for example, Among them, a volatile silane compound is preferable. As said volatile silane compound, an alkoxysilane compound is mentioned, for example. The alkoxysilane compound is a compound having a structure in which 1 to 3 bonds among 4 bonds of a silicon atom (Si) are bonded to an alkoxy group and the remaining bonds are bonded to an organic substituent. As an alkoxy group which an alkoxysilane compound has, a methoxy group, an ethoxy group, a propoxy group, a butoxy group, a pentyloxy group, and a hexyloxy group are mentioned, for example. The alkoxysilane compound may also be contained in the form of a dimer.

Among the alkoxysilane compounds, those having a methoxy group or an ethoxy group are preferable from the viewpoint of easy acquisition. It is preferable that the number of alkoxy groups which an alkoxysilane compound has is 3 from a viewpoint of improving the affinity with the thermally conductive filler which is an inorganic substance. The alkoxysilane compound is more preferably at least one selected from trimethoxysilane compounds and triethoxysilane compounds.

Examples of the functional group included in the organic substituent of the alkoxysilane compound include: acryl group, alkyl group, carboxyl group, vinyl group, methacryl group, aromatic group, amino group, isocyano group Acid group, isocyanurate group, epoxy group, hydroxyl group and mercapto group. Here, when using an addition reaction-curable polysiloxane resin as the above-mentioned liquid resin and using a platinum catalyst, it is preferable to select an alkoxy group that does not easily affect the hardening reaction of the organopolysiloxane. Silane compounds. Specifically, in the case of using an addition reaction type organopolysiloxane containing a platinum catalyst, the organic substituent of the alkoxysilane compound preferably does not contain an amine group, an isocyanate group, or an isocyanurate group. , hydroxyl or mercapto.

Since it is easy to highly fill the thermally conductive filler by improving the dispersibility of the thermally conductive filler, the alkoxysilane compound is preferably an alkylalkoxysilane compound having an alkyl group bonded to a silicon atom, that is, having An alkoxysilane compound with an alkyl group as an organic substituent. The carbon number of the alkyl group bonded to the silicon atom is preferably 4 or more. In addition, from the viewpoint that the viscosity of the alkoxysilane compound itself is relatively low and the viscosity of the thermally conductive composition is kept low, the carbon number of the alkyl group bonded to the silicon atom is preferably 16 or less.

One kind or two or more kinds of alkoxysilane compounds can be used. Specific examples of alkoxysilane compounds include: alkyl-containing alkoxysilane compounds, vinyl-containing alkoxysilane compounds, acryl-containing alkoxysilane compounds, methacryl-containing Alkoxysilane compounds, alkoxysilane compounds containing aromatic groups, alkoxysilane compounds containing amino groups, alkoxysilane compounds containing isocyanate groups, alkoxysilane compounds containing isocyanurate groups Compounds, epoxy-containing alkoxysilane compounds, and mercapto-containing alkoxysilane compounds. Among them, an alkyl group-containing alkoxysilane compound is preferable.

Examples of alkyl group-containing alkoxysilane compounds include: methyltrimethoxysilane, dimethyldimethoxysilane, trimethylmethoxysilane, methyltriethoxysilane, dimethyl Diethoxysilane, ethyltrimethoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, isobutyltrimethoxysilane, isobutyltriethoxysilane, n-hexyl Trimethoxysilane, n-hexyltriethoxysilane, cyclohexylmethyldimethoxysilane, n-octyltriethoxysilane, and n-decyltrimethoxysilane. Among the alkyl group-containing alkoxysilane compounds, preferably selected from isobutyltrimethoxysilane, isobutyltriethoxysilane, n-hexyltrimethoxysilane, n-hexyltriethoxysilane, cyclo At least one of hexylmethyldimethoxysilane, n-octyltriethoxysilane, and n-decyltrimethoxysilane, more preferably selected from n-octyltriethoxysilane and n-decyltrimethoxysilane At least one of the base silanes, especially n-decyltrimethoxysilane.

As the above-mentioned volatile solvent, a solvent having a boiling point (1 atmosphere) of 60 to 200°C can be used, preferably a solvent having a boiling point of 100 to 130°C. Also, the volatile solvent preferably has a boiling point higher than the curing temperature of the organopolysiloxane by 10°C or higher, more preferably has a boiling point higher than the curing temperature of the organopolysiloxane by 20°C or higher. As for the type of volatile solvent, a solvent that satisfies the above requirements can be appropriately selected, for example, aromatic compounds such as toluene are preferably used. A volatile compound may be used individually by 1 type, and may use 2 or more types together.

The content of the volatile compound in the thermally conductive composition is preferably from 5 to 100 parts by mass, more preferably from 10 to 70 parts by mass, and still more preferably from 12 to 45 parts by mass, based on 100 parts by mass of the liquid resin.

(polysiloxane oil) As mentioned above, the thermally conductive composition may also contain silicone oil. By containing silicone oil and blending volatile compounds into the thermally conductive composition, even if the content of the thermally conductive filler is increased, the thrust load can be adjusted within a specific range. Therefore, the thermal conductivity of the thermally conductive member can be improved, and the dischargeability of the thermally conductive composition can be improved.

The silicone oil may, for example, be pure silicone oil or modified silicone oil. The pure silicone oil may, for example, be dimethylpolysiloxane oil (dimethylpolysiloxane), methylphenylpolysiloxane oil (methylphenylpolysiloxane), or the like. Examples of the modified silicone oil include: polyether modified silicone oil, aralkyl modified silicone oil, fluoroalkyl modified silicone oil, long chain alkyl modified silicone oil Oxygen oil, higher fatty acid ester modified silicone oil, higher fatty acid amide modified silicone oil, and phenyl modified silicone oil. Among polysiloxane oils, pure silicone oil is preferred. One type of silicone oil may be used alone, or two or more types may be used in combination. From the viewpoint of improving the dischargeability of the thermally conductive composition, the kinematic viscosity of the polysiloxane oil is preferably 10 to 10,000 mm ² /s or less at 25°C, more preferably 50 to 1,000 mm ² /s the following. The content of silicone oil is preferably in the range of 1 to 70 parts by mass, more preferably in the range of 2 to 50 parts by mass, and still more preferably in the range of 3 to 20 parts by mass relative to 100 parts by mass of the liquid resin within the range of parts.

(additional ingredients) Various additives may be further blended into the thermally conductive composition within the range not impairing the function as a thermally conductive member. As an additive, for example, at least one or more selected from the group consisting of dispersants, coupling agents, adhesives, flame retardants, antioxidants, colorants, and anti-sedimentation agents may be mentioned. In addition, a curing catalyst or the like that accelerates the curing of the curable liquid resin may be blended. As the curing catalyst, when the liquid resin is a curing type silicone resin, a platinum-based catalyst is exemplified. Also, when using uncrosslinked rubber as the curable liquid resin, crosslinking agents such as sulfur compounds and peroxides may be contained.

[Second Embodiment] Next, the manufacturing method of the heat conductive member of 2nd Embodiment is demonstrated in detail. In the first embodiment, a plurality of sheets S1, S2, . On the other hand, in this embodiment, each layer is formed without cutting by the cutter 58 , and the layered system is formed by folding and stacking the thermally conductive composition (sheet S) discharged into a sheet. Hereinafter, regarding the second embodiment, only the differences from the first embodiment will be described in detail. Hereinafter, the contents whose description is omitted are the same as those of the first embodiment.

In this embodiment, as shown in FIG. 6(A), similarly to the first embodiment, by ejecting the thermally conductive composition R and moving the platform 57 in one direction (forward direction) of the MD, the thermally conductive composition R R is ejected onto the platform 57 in a sheet form. Next, in the present embodiment, after being ejected to a certain length as described above, the stage 57 is moved downward as shown in FIG. 6(B) without cutting the thermally conductive composition R with a cutter. Thereafter, as shown in FIG. 6(C), the thermally conductive composition R is continuously sprayed onto the thermally conductive composition R that has been sprayed onto the platform 57, and the platform 57 is directed in the opposite direction along the MD (above-mentioned The opposite direction along the direction) to move a certain distance. By repeating such operations, as shown in FIG. 6(D), multiple layers of sheets S made of the thermally conductive composition R are folded and stacked on the stage 57 to obtain a laminated body 22B. The number of layers of the laminated body 22B is not particularly limited, as described in the first embodiment. Thereafter, the obtained laminated body 22B can be formed into a thermally conductive member by the same steps as in the first embodiment. Details of the obtained heat conductive member are the same as those of the first embodiment.

Also in this embodiment, a thermally conductive member containing an anisotropic filler and aligned in one direction can be manufactured without using large-scale equipment and without generating many corner materials. Therefore, a thermally conductive member with good thermal conductivity can be manufactured with less material waste and simple equipment. Furthermore, according to the manufacturing method of this embodiment, when obtaining the laminated body 22B, the heat conductive composition R is not cut|disconnected for each layer, but the folded part 23B is provided in the edge part of the laminated body 22B. The thickness of the folded portion 23B tends to vary and may have a thickness different from that of the portion other than the end portion, or the alignment of the anisotropic filler may be disordered. Therefore, in this case, the folded portion 23B only needs to be properly cut off. The cut-off turn-back portion 23B becomes scrap material that cannot be used as a thermally conductive member, but compared to the case of manufacturing a thermally conductive member by extrusion molding or the like, the generation of scrap material can be suppressed to a small amount.

[Modifications of the first and second embodiments] The above-mentioned first and second embodiments represent one embodiment of the present invention, and the present invention is not limited to the above configuration, and various changes can be made. Specifically, any one of the above steps 3 to 5 may be appropriately omitted.

For example, if Step 3 is omitted, the adhesiveness between the unit layers in the thermally conductive member tends to be low, but it can be used for applications that do not require high mechanical strength. Also, when Step 3 is omitted, in Step 4, the laminate that has not been compressed and deformed is hardened. Other configurations are the same as those of the first and second embodiments. Also, if Step 5 is omitted, the laminate is used as the thermally conductive member without using a sheet-shaped thermally conductive member as the thermally conductive member.

Also, for example, if Step 4 (curing) is omitted, the mechanical strength of the thermally conductive member will be lowered, so the thermally conductive member can be used for applications that do not require high mechanical strength. Furthermore, if step 4 is omitted, it is difficult to cut the laminated body, and thus it is difficult to mass-produce heat conductive members, etc., so when step 4 is omitted, it is preferable to omit step 5 at the same time. Furthermore, when step 4 is omitted, the liquid resin contained in the thermally conductive composition does not have to be a hardenable liquid resin, and may be a liquid resin that does not harden even when heated or irradiated with light. Specifically, for example, the above-mentioned uncrosslinked rubber may be used as the liquid resin without mixing a crosslinking agent in the thermally conductive composition.

In addition, in addition to omitting steps 4 and 5, two or more steps among steps 3 to 5 may also be omitted. For example, step 3 and step 4 can be omitted, and step 3 and step 5 can also be omitted. Furthermore, all of steps 3 to 5 may be omitted. When steps 4 and 5 are omitted, or steps 3 to 5 are omitted, the unhardened liquid resin can be directly used as a matrix resin, and the laminate can be directly used as a thermally conductive member. Furthermore, in each of the above-mentioned embodiments, the platform 57 is moved on MD and ZD, but the head 51 may be moved on the MD and ZD instead of moving the platform 57, and both the platform 57 and the head 51 may be moved. move.

[third embodiment] Next, a third embodiment of the present invention will be described. In the first and second embodiments, the thermally conductive composition is sprayed onto the platform 57 to form a laminate, but the thermally conductive composition can also be sprayed out of the platform 57, for example, it can be sprayed onto the actually used member and directly used as a thermally conductive member. Specifically, the thermally conductive composition can be sprayed between the heat generating body and the heat sink so that a plurality of sheets are stacked so as to form a laminate between the heat sink and the heat sink.

Hereinafter, a method of manufacturing a heat conductive member according to a third embodiment will be described in detail with reference to FIG. 7 . In the following description, only the differences from the first and second embodiments will be described in detail, and the contents whose description is omitted are the same as those of the first and second embodiments. Also in this embodiment, steps 1 and 2 can be performed sequentially in the same manner as in each of the above-mentioned embodiments. That is, in step 2, the thermally conductive composition prepared in step 1 is sprayed from the head portion 51 of the dispenser device to form a laminate 22C. In this embodiment, 22 C of laminated bodies can be formed as follows. Furthermore, in the following description, the following will be described, that is, the radiator 61 has a base portion 61B and a side portion 61A connected to the base portion 61B, and heat conduction is conducted between the side portion 61A and the heat generating body 62 . The active composition is ejected onto the base portion 61B (member to be ejected). Specific examples of the radiator 61 and the heat generator 62 are as described above.

First, as shown in FIG. 7 , the radiator 61 and the heating element 62 are placed on the platform 57 . Then, between the side portion 61A of the radiator 61 and the heating element 62 , the thermally conductive composition R is sprayed onto the base portion 61B. At this time, similarly to the second embodiment, while moving the platform 57 (that is, the radiator 61 and the heat generator 62 ) on the MD and moving downward, the laminated body 22C formed by folding and stacking the sheets S is formed. . Furthermore, when forming the laminated body 22C, when spraying the thermally conductive composition R, as shown in FIG.

Here, when forming the laminated body 22C, the ejection direction (MD) of the thermally conductive composition R is the direction connecting the radiator 61 (side portion 61A) and the heating element 62, and in the laminated body 22C, the anisotropic filler Alignment is in the direction connecting the radiator 61 (side portion 61A) and the heat generator 62 . Therefore, the heat generated in the heat generating body 62 can be efficiently transferred to the radiator 61 (side portion 61A), and dissipated from the radiator 61 .

As described above, also in this embodiment, a thermally conductive member including an anisotropic filler and aligned in one direction can be produced without using large-scale equipment and without generating scrap material. Also, since no large-scale equipment is used, for example, the dispenser device can be brought to the site where electronic equipment is used, and the thermally conductive member can be formed between the heat generating body and the heat sink on site.

Furthermore, in this embodiment, laminated body 22C formed of thermally conductive composition R may be formed so as to be in contact with side portion 61A of radiator 61 and heat generating body 62 respectively. By bringing laminated body 22C into contact with side portion 61A of radiator 61 and heating element 62 , heat generated in heating element 62 can be efficiently released from side portion 61A of radiator 61 . Moreover, in order to make the laminated body 22C contact with the side portion 61A of the radiator 61 and the heating element 62, as shown in FIG. The heat conductive composition R is ejected after the head 51 is swung about the upper end.

In this embodiment, as shown in FIG. 7, the laminated body 22C formed between the side part 61A and the heating element 62 can be used as a thermally conductive member as it is. However, one or both of Step 3 and Step 4 may be performed similarly to the first and second embodiments, and it is preferable to perform at least Step 4. The details of steps 3 and 4 are as above. Also, in the case of performing step 4, as described in the first embodiment, the first liquid and the second liquid can be prepared as the above-mentioned thermally conductive composition, and they are mixed immediately before step 2, and then step 2 is performed. .

In addition, if the laminated body 22C is compressively deformed by performing step 3, the laminated body 22C will expand by a certain amount in the plane direction. Therefore, when performing step 3, it is not necessary to swing the head 51 when forming both ends of the laminated body 22C. Even if the laminated body 22C is formed without swinging the head 51 in step 2, so that the two ends on the MD of the laminated body 22C are not in contact with the side portion 61A of the radiator 61 and the heating element 62, the 22C of the laminated body is spread on the MD, and the laminated body 22C is brought into contact with the side portion 61A of the radiator 61 and the heating element 62 .

In addition, in the above description of the third embodiment, it was shown that, in the same manner as in the second embodiment, when producing the laminated body 22C, each layer is formed without cutting with the cutter 58, and the layered The body 22C is formed by folding and overlapping the sheets S. However, as shown in the first embodiment, each layer may be cut with a cutter every time each layer is formed, and a plurality of sheets S1, S2 ... Sn formed by cutting may be stacked to obtain a laminated body 22C.

In this embodiment, the radiating body 61 and the heating body 62 are arranged on the platform 57, and they are moved up and down in the MD to obtain a laminated body 22C, but it is not necessary to arrange the radiating body 61 and the heating body 62. On the platform 57, the platform 57 may be omitted as long as the radiator 61 and the heat generating body 62 can move on the MD and move downward. In addition, as described in the first and second embodiments, the head portion 51 of the dispenser device can also be moved on the MD and downward.

Also, in the present embodiment, the laminated body 22C is formed by being laminated on a part of the radiator 61 (the base part 61B), but the laminated body 22C does not need to be formed on a part of the radiator 61, and may also be laminated on a part of the radiator 61. The cooling body 61 is on different components. Example

Hereinafter, the present invention will be described in more detail with examples, but the present invention is not limited by these examples.

The raw materials used in the examples and comparative examples are as follows. [Hardenable liquid resin] Curable polysiloxane resin: the main agent composed of alkenyl-containing organopolysiloxane and the hardener composed of organohydrogenpolysiloxane, the mixture of which is heated at 25°C Viscosity: 300 mPa・s [Liquid components] Methylphenyl polysiloxane: dynamic viscosity at 25°C is 125 mm ² /s, refractive index is 1.496 n-decyltrimethoxysilane: thermogravimetric analysis at 2°C Conditions per minute The temperature T1 at which the weight loss reaches 90% when the temperature rises is 187°C [Anisotropic filler] Boron nitride (1): Scale-like, aspect ratio 4-8, average particle size 40 μm boron nitride (2): Scaly shape, aspect ratio 2-3, average particle size 10 μm [Anisotropic filler] Alumina (1): Spherical, average particle size 0.5 μm Alumina (2): Spherical, average Particle size 4 μm Alumina (3): spherical, average particle size 71 μm Aluminum hydroxide: amorphous, average particle size 1 μm

[Example 1] (step 1) Alkenyl-group-containing organopolysiloxane (main agent) and organohydrogenpolysiloxane (hardening agent) (100 parts by mass in total) as hardening silicone resin, methylphenyl polysiloxane 3 Parts by mass, 12 parts by mass of n-decyltrimethoxysilane, 168 parts by mass of boron nitride (1), 274 parts by mass of alumina (1), and 239 parts by mass of alumina (2) were mixed to obtain a thermally conductive composition. Table 1 shows the thrust load of the obtained thermally conductive composition.

(step 2) Fill the obtained thermally conductive composition into the storage tank of the dispenser device shown in Figure 1, supply it to the head at a pressure of 0.5 MPa, and make the thermally conductive composition from length L1 = 50 mm to length L2 at 25°C = 3 mm rectangular nozzle ejection. At this time, the platform was moved in the forward direction of the MD at a speed of 100 mm/min, and the sheet-shaped thermally conductive composition was ejected to a length of about 50 mm with a thickness of 3 mm. After spraying out to a length of 50 mm, use a cutter to cut off the sheet-shaped thermally conductive composition, and form the first sheet on the platform. Afterwards, move the platform downward, and continue to move the platform in the reverse direction of the MD at a speed of 100 mm/min. After spraying the thermally conductive composition with the same thickness and the same length, use a cutter to cut it off, and in the second The sheet body of the second sheet is superimposed on the sheet body of the first sheet. This operation was repeated until 20 sheet bodies were folded and overlapped to obtain a laminate.

(step 3~5) Next, in an environment of 25° C., the laminate was pressurized with a roller at a pressure of 1.5 kgf/50 mm to obtain a compressively deformed laminate, and then heated at 80° C. for 480 minutes to harden the laminate. Then, slice parallel to the stacking direction and perpendicular to the alignment direction of the anisotropic filler, and then heat at 150°C for 300 minutes to volatilize n-decyltrimethoxysilane, and obtain each unit layer with a thickness of 2 Sheet-shaped thermally conductive member with a thickness of mm and a thickness of 2 mm.

[Examples 2 to 5, Comparative Examples 1 and 2] Except having changed the composition of the thermally conductive composition as shown in Table 1, it carried out similarly to Example 1.

[Spurt Load] The thrust load of the thermally conductive composition was measured by the following method. The thermally conductive composition was defoamed, and 30 g of the defoamed thermally conductive composition was introduced into a cylindrical container with a diameter of 25 mm. Then, a stabbing rod (1 mm in diameter of the rod) having a disc-shaped member with a diameter of 3 mm and a thickness of 1 mm at the front end is introduced into the container from the front end side of the stabbing rod at a speed of 10 mm/min (thrusting speed) The thermally conductive composition is pressed against, and the load (gf) when the front end of the stabbing rod reaches a depth of 12 mm from the liquid surface is measured. The material of the spike rod is stainless steel. Measurements were performed at 25°C. When the stabbing speed of the stabbing rod was set at 100 mm/min, the stabbing load was also measured in the same manner.

Each Example and Comparative Example was evaluated on the following evaluation criteria. (1) Ejection of the distributor device Visually confirm whether the thermally conductive composition can be ejected from the dispenser device in step 2, and if it can be ejected, whether the ejected thermally conductive composition maintains its shape in a single layer state, and perform the following evaluation criteria Evaluation. A: It can be ejected, and the ejected shape can be maintained without spreading in the surface direction in a single layer state. B: It can be sprayed, and the expansion in the direction of the surface in a single layer state is less than 10%, and the shape of spraying can basically be maintained. C: It can be sprayed out, but the expansion in the surface direction in a single layer state is 10% or more, which is too large, and the shape of the sprayed out cannot be maintained. D: Unable to eject. (2) Lamination The shape retention of the laminate obtained by stacking a plurality of sheets in step 2 was evaluated according to the following evaluation criteria. A: It will not expand due to its own weight, and obtain a laminate with a thickness that meets the design. B: Although it will expand due to its own weight, the expansion is less than 25%, and a laminate with a thickness roughly in line with the design is obtained. C: Due to its own weight, it greatly expands by more than 25%, and it is impossible to obtain a laminate with a thickness that meets the design. (3) Compression test of laminated body The compressibility (thickness change) when the laminate obtained in step 2 was pressurized at a pressure of 1 kPa for 10 seconds is shown. (4) Production of scrap materials The amount of scrap material generated in the steps up to obtaining the heat conductive member was evaluated according to the following evaluation criteria. A: Most of the ejected thermally conductive composition can be used to form a thermally conductive member. C: Most of the ejected thermally conductive composition could not be used to form a thermally conductive member. (5) Orientation of anisotropic fillers In the obtained thermally conductive member, evaluation was performed based on the orientation of the anisotropic filler according to the following evaluation criteria. A: The anisotropic filler is oriented in the thickness direction of the thermally conductive member. B: The anisotropic filler is aligned in the thickness direction of the thermally conductive member, but the alignment is slightly disturbed. C: The anisotropic filler is not aligned in the thickness direction of the thermally conductive member.

3 mm，10 mm/min) 8.0 10.3 20.7 25.1 60.0 3.0 3.3 突刺負載（gf，

3 mm，100 mm/min) 11.0 13.8 27.5 34.4 82.5 4.1 4.5 填充率 （體積%） 基質樹脂填充率（體積%） 32% 28% 25% 25% 24% 28% 40% 各向異性填充材填充率（體積%） 24% 25% 27% 27% 27% 0% 21% 非各向異性填充材填充率（體積%） 43% 46% 47% 47% 47% 72% 40% 評價 分配器裝置 噴出性 B B A A B C C 分配器裝置 積層性 B B A A A C C 積層體之壓縮試驗 29% 23% 8% 5% 3% 50% 48% 邊角材料之產生量 A A A A A A A 各向異性填充材之配向性 A A A A A - B ※再者，填充率係假設正癸基三甲氧基矽烷全部揮發，根據各成分之比重及質量份而算出。 [Table 1] Example 1 Example 2 Example 3 Example 4 Example 5 Comparative example 1 Comparative example 2 Composition (parts by mass) hardening polysiloxane 100 100 100 100 100 100 100 Methylphenylpolysiloxane 3 5 5 5 5 n-decyltrimethoxysilane 12 17 17 10 17 1 Boron Nitride (1) 168 200 245 245 245 120 Boron Nitride (2) 0 10 Aluminum Oxide (1) 274 350 400 400 400 40 Aluminum Oxide (2) 239 300 350 350 350 200 350 Aluminum Oxide (3) 600 Aluminum hydroxide 140 physical properties thrust load (gf,

3 mm, 10 mm/min) 8.0 10.3 20.7 25.1 60.0 3.0 3.3 thrust load (gf,

3 mm, 100 mm/min) 11.0 13.8 27.5 34.4 82.5 4.1 4.5 Filling rate (volume%) Matrix resin filling rate (volume%) 32% 28% 25% 25% twenty four% 28% 40% Filling rate of anisotropic filler (volume%) twenty four% 25% 27% 27% 27% 0% twenty one% Filling rate of non-anisotropic filler (volume%) 43% 46% 47% 47% 47% 72% 40% Evaluation Dispenser device ejection B B A A B C C Distributor unit stackability B B A A A C C Compression test of laminated body 29% twenty three% 8% 5% 3% 50% 48% Production of scrap materials A A A A A A A Orientation of anisotropic filler A A A A A - B ※In addition, the filling rate is calculated based on the specific gravity and mass parts of each component assuming that n-decyltrimethoxysilane is completely volatilized.

As shown in the above embodiments, by using a dispenser device to discharge a thermally conductive composition having a specific thrust load into a sheet and then layering it, good discharge performance can be achieved, and there is almost no problem during the discharge and layering. The thermal conductivity member with the anisotropic filler aligned in one direction can be manufactured in such a way that the self-weight expands and the alignment is not chaotic and conforms to the designed thickness. In addition, the thermally conductive member can be manufactured without using large-scale manufacturing equipment, and scrap materials are hardly generated during the manufacturing process. Therefore, it can be said that it is possible to manufacture a thermally conductive member having good thermal conductivity with less material waste and simple equipment. On the other hand, in the comparative example, the stabbing load was low, so if the thermally conductive composition was ejected into a sheet form and laminated using a dispenser, the thermally conductive composition would expand due to its own weight during ejection and lamination. , so that it is impossible to manufacture thermally conductive components with a thickness that meets the design.

10: Thermally conductive member 10A, 10B: One side of the thermally conductive member 11: Matrix resin 13: unit layer 14: Anisotropic filler 15: Non-anisotropic filler 18: Knife 22, 22B, 22C: laminated body 23B, 23C: turning part 50: Distributor device 51: head 51A: lower surface 51X, 51Y: Installation part 52: supply channel 53: Jet outlet 54: Connection path 56: storage tank 57: platform 58: Cutter 61: radiator 61A: side 61B: base part 62: heating element L1, L2: Length R: thermally conductive composition S, S1, S2, ..., Sn: sheet

[ Fig. 1 ] is a schematic diagram showing a dispenser device according to an embodiment. [Fig. 2] is a front view showing the head of the dispenser device. [FIG. 3] It is a schematic diagram for demonstrating the 2nd step in the manufacturing method of the heat conductive member of 1st Embodiment. [FIG. 4] It is a schematic diagram for demonstrating the step 5 in the manufacturing method of the heat conductive member of 1st Embodiment. [ Fig. 5 ] is a schematic sectional view showing an example of a heat conductive member. [FIG. 6] It is a schematic diagram for demonstrating the manufacturing method of the heat conductive member of 2nd Embodiment. [FIG. 7] It is a schematic diagram for demonstrating the manufacturing method of the heat conductive member of 3rd Embodiment.

51: head

51A: lower surface

51X, 51Y: Installation part

53: Jet outlet

54: Connection path

57: platform

58: Cutter

R: thermally conductive composition

S1, S2: sheet

MD: ejection direction

Claims (16)

A method of manufacturing a thermally conductive member, comprising the following steps: Prepare a thermally conductive composition, the thermally conductive composition includes a liquid resin and an anisotropic thermally conductive filler, and when it is pierced at a speed of 10 mm/min by a pressing rod with a pressing surface of 3 mm in diameter The stress, i.e. thrust load, is 8 to 60 gf; and A laminate is obtained by discharging the above-mentioned thermally conductive composition in a sheet-like stacked plurality using a dispenser device having a wide-shaped discharge port. The method of manufacturing a thermally conductive member according to claim 1, wherein the liquid resin is a hardenable liquid resin, and The manufacturing method of this thermally conductive member further includes the step of hardening the said thermally conductive composition after obtaining the said laminated body. The method of manufacturing a thermally conductive member according to claim 1 or 2, further comprising a step of cutting the above-mentioned laminate in a direction intersecting with the laminate layer. The method of manufacturing a thermally conductive member according to any one of claims 1 to 3, wherein the liquid resin contains a volatile compound. The method of manufacturing a thermally conductive member according to claim 4, further comprising a step of volatilizing the above-mentioned volatile compound. The method of manufacturing a thermally conductive member according to any one of claims 1 to 5, further comprising a step of compressing the laminated body in the lamination direction to compressively deform it to a thickness of 75% to 97%. The method for producing a thermally conductive member according to any one of claims 1 to 6, wherein a plurality of sheets are stacked on the laminated body by cutting and stacking the thermally conductive composition ejected into the sheet shape . The method of manufacturing a thermally conductive member according to claim 7, wherein the above-mentioned heat-conductive composition discharged into the sheet shape is cut by a cutter provided at the above-mentioned discharge port and moving along the longitudinal direction of the above-mentioned discharge port . The method for producing a thermally conductive member according to any one of claims 1 to 6, wherein the laminate is obtained by folding and stacking the thermally conductive composition ejected into the sheet shape. The method for manufacturing a thermally conductive member according to any one of Claims 1 to 9, wherein the above-mentioned thermally conductive composition is sprayed between the radiator and the heat generating body in a sheet-like overlapping manner, so that the thermally conductive composition is sprayed on the radiator A laminate is formed between the heating element and the heating element. The method of manufacturing a thermally conductive member according to claim 10, wherein the thermally conductive composition is ejected in a sheet shape in a direction connecting the radiator and the heating body. The method of manufacturing a thermally conductive member according to any one of claims 1 to 11, wherein the thickness of each sheet in the laminate is 0.1 to 9.0 mm. The method of manufacturing a thermally conductive member according to any one of Claims 1 to 12, wherein the above-mentioned thermally conductive composition is sprayed at room temperature. A dispenser device comprising: a head; and a supply passage for supplying a fluid material to the head; The head has a wide-shaped ejection port and a connection path connecting the supply path and the ejection port, and The connection path is connected to the discharge port such that an inner diameter in one direction becomes larger from the supply passage toward the discharge port. The dispenser device according to claim 14, further comprising a cutter arranged at the discharge port and moving along the longitudinal direction of the discharge port. The dispenser device according to claim 14 or 15, wherein at least one of the head and the ejected member from which the fluid material is ejected can move in a direction perpendicular to the longitudinal direction of the ejection port.

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