TW202243341A - Electrical connection mechanism - Google Patents
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Abstract
Description
本發明是有關於一種電性連接機構,特別是有關於一種具有彈性薄膜之電性連接機構。The present invention relates to an electrical connection mechanism, in particular to an electrical connection mechanism with an elastic film.
一般筆記型電腦已逐漸朝向輕薄短小的趨勢發展,然而由於筆記型電腦在使用時常需要連接不同的周邊設備(例如印表機、隨身碟或行動電源等),因此往往需要在筆記型電腦的側邊設置多個連接器,然而如此將會占用到殼體側邊的空間,從而難以達成筆記型電腦體積的微型化,同時也容易導致灰塵或異物進入筆記型電腦內部,且不利於保持筆記型電腦整體外觀的簡潔。General notebook computers have been gradually developing towards thinner and smaller. However, since notebook computers often need to be connected to different peripheral devices (such as printers, flash drives, or mobile power supplies, etc.), it is often necessary to connect them to the side of the notebook computer. Multiple connectors are arranged on one side, but this will occupy the space on the side of the casing, making it difficult to miniaturize the size of the notebook computer, and it is also easy to cause dust or foreign objects to enter the interior of the notebook computer, which is not conducive to maintaining the notebook computer. The overall appearance of the computer is simple.
有鑒於此,如何提供一種電性連接機構,使其能兼顧使用上的便利性與電子裝置整體外觀的簡潔,已成為本技術領域研發人員之一重要挑戰。In view of this, how to provide an electrical connection mechanism that can balance the convenience of use and the overall appearance of the electronic device has become an important challenge for researchers in this technical field.
有鑑於前述習知問題點,本發明之一實施例提供一種電性連接機構,包括一殼體、一中空之可動件、一第一連接器、一彈性薄膜、一第二連接器以及一第三連接器。前述可動件設置於前述殼體內,並且形成有一第一穿孔。前述第一連接器設置於前述可動件內,並且對準前述第一穿孔。前述彈性薄膜設置於前述殼體內,並且形成有一第一開口。前述第二連接器設置於前述彈性薄膜上,且前述第三連接器亦設置於前述彈性薄膜上。In view of the foregoing conventional problems, an embodiment of the present invention provides an electrical connection mechanism, including a housing, a hollow movable member, a first connector, an elastic film, a second connector and a first Three connectors. The aforementioned movable element is arranged in the aforementioned casing and forms a first through hole. The aforementioned first connector is disposed in the aforementioned movable element and aligned with the aforementioned first through hole. The aforementioned elastic film is arranged in the aforementioned casing and forms a first opening. The aforementioned second connector is disposed on the aforementioned elastic film, and the aforementioned third connector is also disposed on the aforementioned elastic film.
特別地是,當前述可動件位於前述殼體內部之一收納位置時,前述彈性薄膜位在前述可動件以及前述第二、第三連接器之間,且前述第一開口具有一第一寬度。當前述可動件由前述收納位置相對於前述殼體滑動至一展開位置時,前述可動件壓迫前述彈性薄膜,並使前述第一開口由前述第一寬度擴張至一第二寬度,且前述第一連接器透過前述第一穿孔以及前述第一開口而顯露於前述殼體之一側。Especially, when the movable element is located at a storage position inside the casing, the elastic film is located between the movable element and the second and third connectors, and the first opening has a first width. When the movable part slides from the storage position to an unfolded position relative to the casing, the movable part presses the elastic film and expands the first opening from the first width to a second width, and the first The connector is exposed on one side of the housing through the first through hole and the first opening.
於一實施例中,前述電性連接機構更包括一第一基板、一第二基板以及一第三基板,其中前述第一基板設置於前述可動件內部,前述第一、第二、第三連接器分別固定於前述第一、第二、第三基板上,且前述第二、第三基板固定於前述彈性薄膜上。In one embodiment, the aforementioned electrical connection mechanism further includes a first substrate, a second substrate, and a third substrate, wherein the aforementioned first substrate is disposed inside the aforementioned movable element, and the aforementioned first, second, and third connections The devices are respectively fixed on the first, second and third substrates, and the second and third substrates are fixed on the elastic film.
於一實施例中,前述電性連接機構更包括一第一導線、一第二導線以及一第三導線,分別電性連接前述第一連接器、前述第二連接器以及前述第三連接器。In one embodiment, the aforementioned electrical connection mechanism further includes a first wire, a second wire, and a third wire electrically connected to the first connector, the second connector, and the third connector respectively.
於一實施例中,前述可動件更形成有一第二穿孔以及一第三穿孔,且前述彈性薄膜更形成有一第二開口以及一第三開口,其中前述第二導線依序穿過前述第二穿孔以及前述第二開口而連接前述第二基板,且前述第三導線依序穿過前述第三穿孔以及前述第三開口而連接前述第三基板。In one embodiment, the aforementioned movable element is further formed with a second through hole and a third through hole, and the aforementioned elastic film is further formed with a second opening and a third opening, wherein the aforementioned second wires are sequentially passed through the aforementioned second through hole and the second opening to connect to the second substrate, and the third wire to pass through the third through hole and the third opening in sequence to connect to the third substrate.
於一實施例中,前述第一開口位於前述第第二開口以及前述第三開口之間。In one embodiment, the first opening is located between the second opening and the third opening.
於一實施例中,前述可動件具有一第一表面、一第二表面以及一第三表面,且前述第一、第二、第三穿孔分別形成於前述第一、第二、第三表面上,其中前述第二、第三表面相對前述第一表面分別具有一傾斜角。In one embodiment, the aforementioned movable element has a first surface, a second surface and a third surface, and the aforementioned first, second, and third through holes are respectively formed on the aforementioned first, second, and third surfaces , wherein the second and third surfaces respectively have an inclination angle relative to the first surface.
於一實施例中,當前述可動件由前述收納位置相對於前述殼體滑動至前述展開位置時,前述可動件壓迫前述彈性薄膜,並使前述彈性薄膜貼附於前述第一、第二、第三表面上。In one embodiment, when the movable element slides from the storage position to the unfolded position relative to the housing, the movable element presses the elastic film, and makes the elastic film adhere to the first, second, second Three surfaces.
於一實施例中,當前述可動件由前述收納位置相對於前述殼體滑動至前述展開位置時,前述可動件凸出於前述殼體之前述側。In one embodiment, when the movable element slides from the stored position to the deployed position relative to the casing, the movable element protrudes from the side of the casing.
於一實施例中,前述可動件具有一梯形結構。In one embodiment, the aforementioned movable element has a trapezoidal structure.
於一實施例中,前述電性連接機構更包括兩個支撐桿,設置於前述彈性薄膜的兩端並且固定於前述殼體內部。In one embodiment, the aforementioned electrical connection mechanism further includes two supporting rods, which are arranged at both ends of the aforementioned elastic film and fixed inside the aforementioned casing.
以下說明本發明實施例之電性連接機構。然而,可輕易了解本發明實施例提供許多合適的發明概念而可實施於廣泛的各種特定背景。所揭示的特定實施例僅僅用於說明以特定方法使用本發明,並非用以侷限本發明的範圍。The electrical connection mechanism of the embodiment of the present invention is described below. It should be readily appreciated, however, that the embodiments of the invention provide many suitable inventive concepts that can be implemented in a wide variety of specific contexts. The specific embodiments disclosed are merely illustrative of specific ways to use the invention and do not limit the scope of the invention.
除非另外定義,在此使用的全部用語(包括技術及科學用語)具有與此篇揭露所屬之一般技藝者所通常理解的相同涵義。能理解的是這些用語,例如在通常使用的字典中定義的用語,應被解讀成具有一與相關技術及本揭露的背景或上下文一致的意思,而不應以一理想化或過度正式的方式解讀,除非在此特別定義。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the related art and the present disclosure, and not in an idealized or overly formal manner Interpretation, unless specifically defined herein.
有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之一較佳實施例的詳細說明中,將可清楚的呈現。以下各實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,實施方式中所使用的方向用語是用來說明並非用來限制本發明。The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front or back, etc., are only directions referring to the attached drawings. Therefore, the directional terms used in the embodiments are used to illustrate but not to limit the present invention.
首先請參閱第1圖,其中第1圖表示本發明一實施例之電性連接機構100的爆炸。如第1圖所示,本發明一實施例之電性連接機構100例如可設置於一筆記型電腦或其他可攜式電子裝置上,其主要包括一上機殼B1、一下機殼B2、一導電模組10(包含第一基板11以及第一連接器C1)、一中空之可動件20、一彈性薄膜30、一第二基板40、一第三基板50、一第二連接器C2以及一第三連接器C3。First, please refer to FIG. 1 , which shows the explosion of an
其中,前述上機殼B1以及下機殼B2係組成電性連接機構100之一殼體,而前述導電模組10(包含第一基板11以及第一連接器C1)、可動件20、彈性薄膜30、第二基板40、第三基板50、第二連接器C2以及第三連接器C3皆是容置在上機殼B1以及下機殼B2所組成的殼體內。Wherein, the above-mentioned upper casing B1 and the lower casing B2 constitute a shell of the
如前所述,導電模組10係包含第一基板11以及第一連接器C1,其中第一連接器C1設置於第一基板11上,且在第一基板11上形成有孔洞12、13;此外,前述第二連接器C2係設置於第二基板11上,前述前述第三連接器C3係設置於第三基板31上。As mentioned above, the
接著請一併參閱第1、2圖,其中第2圖表示當可動件20位於殼體內部之一收納位置時的示意圖。如第1、2圖所示,前述可動件20具有一梯形結構,且前述梯形結構形成有一第一表面21、一第二表面22以及一第三表面23,其中前述第二、第三表面22、23係相對第一表面21分別具有一傾斜角;此外,在第一、第二、第三表面上21、22、23上分別形成有一第一穿孔H1、一第二穿孔H2以及一第三穿孔H3,其中位在導電模組10前側之第一連接器C1係對準該第一穿孔H1,並可透過第一穿孔H1而顯露於可動件20的第一表面21。Next, please refer to FIGS. 1 and 2 together, wherein FIG. 2 shows a schematic diagram when the
應了解的是,當可動件20位於殼體內部之一收納位置時(如弟2圖所示),第二連接器C2以及第三連接器C3係顯露於殼體之一側,且此時使用者可透過第二連接器C2及/或第三連接器C3來連接兩個不同之外部裝置(例如印表機、隨身碟或行動電源等),惟此時導電模組10因為隱藏在殼體內部而不會顯露出來,所以並不會占用到殼體外側的空間,從而能夠有助於達成電子裝置體積之微型化,且可維持電子裝置整體外觀的簡潔。It should be understood that when the
舉例而言,前述第一連接器C1、第二連接器C2以及第三連接器C3可以是通用序列匯排流(Universal Serial Bus, USB)連接器、HDMI連接器或其他形式的電性連接器,而前述第一基板11、第二基板40以及第三基板50則可為金屬基板、絕緣基板或印刷電路板(Printed Circuit Board, PCB)。For example, the aforementioned first connector C1, second connector C2 and third connector C3 may be Universal Serial Bus (USB) connectors, HDMI connectors or other forms of electrical connectors , and the aforementioned
請繼續參閱第1、2圖,在前述彈性薄膜30的兩端分別設有支撐桿R,且前述支撐桿R係固定在殼體內部(例如固定在下機殼B2的內側表面)。又,從第1、2圖中可以看出,彈性薄膜30形成有一第一開口h1、一第二開口h2以及一第三開口h3,其中第一開口h1位於第二開口h2以及第三開口h3之間,第二基板40以及第三基板50係固定在彈性薄膜30上,且第一連接器C1、第二連接器C2以及第三連接器C3的位置係分別對應於前述第一開口h1、第二開口h2以及第三開口h3。Please continue to refer to Figs. 1 and 2, the two ends of the
需特別說明的是,當可動件20位在殼體內部之一收納位置時(如弟2圖所示),彈性薄膜30係位於可動件20以及第二、第三連接器C2、C3之間,且此時彈性薄膜30上之第一開口h1係具有一第一寬度,其中該第一寬度係小於第一穿孔H1之寬度。此外,可動件20之第一表面21的寬度係小於第二連接器C2之中心與第三連接器C3之中心間的距離。It should be noted that when the
另一方面,從第1、2圖中也可以看出,本實施例中之電性連接機構100更包括有一第一導線W1、一第二導線W2以及一第三導線W3,其可用以分別電性連接前述第一連接器C1、第二連接器C2以及第三連接器C3。具體而言,前述第一導線W1可直接透過第一基板11而電性連接第一連接器C1,第二導線W2則可依序穿過第一基板11上的孔洞12、可動件20上的第二穿孔H2以及彈性薄膜30上的第二開口h2而連接到第二基板40,並可進一步透過第二基板40而電性連接第二連接器C2;同理,第三導線W3可依序穿過第一基板11上的孔洞13、可動件20上的第三穿孔H3以及彈性薄膜30上的第三開口h3而連接到第三基板50,並可進一步透過第三基板50而電性連接第三連接器C3。On the other hand, it can also be seen from Figures 1 and 2 that the
再請一併參閱第1、2、3圖,其中第3圖表示當可動件20由第2圖所示之收納位置相對於殼體朝右側滑動至一過渡位置時的示意圖。Please also refer to Figures 1, 2, and 3 together, wherein Figure 3 shows a schematic diagram when the
如第3圖所示,當使用者欲使用隱藏在可動件20內部之第一連接器C1時,需先將可動件20由第2圖所示之收納位置相對於殼體朝右側滑動至一過渡位置,此時可動件20會壓迫彈性薄膜30,並使彈性薄膜30上的第一開口h1由原本的第一寬度(第2圖)略為撐開並擴張,惟此時第一開口h1的寬度仍小於可動件20上之第一穿孔H1的寬度。As shown in Figure 3, when the user wants to use the first connector C1 hidden inside the
從第3圖中可以看出,因為前述可動件20具有梯形結構,且第二、第三基板40、50係固定在彈性薄膜30上,因此當可動件20相對於殼體朝右側滑動時,彈性薄膜30會受到可動件20之第一表面21壓迫而變形,而第二、第三基板40、50則會分別被可動件20朝分別下、上兩側頂開,並使第二連接器C2和第三連接器C3略為轉向而呈傾斜。It can be seen from Fig. 3 that because the aforementioned
接著請參閱第4圖,其中第4圖表示當可動件20由第3圖所示之過渡位置相對於殼體朝右側滑動至一展開位置時的示意圖。Please refer to FIG. 4, which shows a schematic diagram of when the
如第4圖所示,當使用者將可動件20由第3圖所示之過渡位置持續朝右側滑動至一展開位置時,可動件20會凸出於殼體之一側,且可動件20會進一步地壓迫彈性薄膜30,並使彈性薄膜30彎折並貼附在可動件20前側的第一、第二、第三表面21、22、23上。此時,彈性薄膜30上的第一開口h1會由原本的第一寬度(第2圖)變形並擴張成為第二寬度(第4圖),其中該第二寬度係大於該第一寬度,且約略等同於可動件20上之第一穿孔H1的寬度。如此一來,第一連接器C1即可透過可動件20上的第一穿孔H1以及彈性薄膜30的第一開口h1而顯露於殼體之一側。As shown in FIG. 4, when the user continuously slides the
再請參閱第5圖,第5圖表示第一連接器C1、第二連接器C2以及第三連接器C3分別電性連接一第四連接器C4、一第五連接器C5以及一第六連接器C6的示意圖,其中第5圖係省略繪示第一、第二、第三導線W1、W2、W3以方便理解。Please refer to Fig. 5 again. Fig. 5 shows that the first connector C1, the second connector C2 and the third connector C3 are respectively electrically connected to a fourth connector C4, a fifth connector C5 and a sixth connection A schematic diagram of the device C6, in which the first, second, and third wires W1, W2, and W3 are omitted in FIG. 5 for easy understanding.
如第5圖所示,當可動件20相對於殼體朝右側滑動至展開位置後,由於第一連接器C1、第二連接器C2以及第三連接器C3皆會凸出並顯露於殼體之一側,此時使用者即可任意地使用第一連接器C1、第二連接器C2及/或第三連接器C3。舉例而言,使用者可同時將一第四連接器C4、一第五連接器C5以及一第六連接器C6結合於第一連接器C1、第二連接器C2以及第三連接器C3上,並可透過導線以分別電性連接不同的外部裝置(例如印表機、隨身碟或行動電源等),其中第四連接器C4可伸入彈性薄膜30的第一開口h1以及可動件20上的第一穿孔H1而與第一連接器C1相互結合。As shown in FIG. 5, when the
反之,當使用者結束使用時,則可將可動件20相對於殼體朝左側推回到如第2圖所示之位置,藉以使可動件20和導電模組10隱藏在殼體內部而不會顯露出來,從而可防止灰塵或異物經由第一連接器C1而進入電子裝置內部,同時也能保持電子裝置外觀的完整性。Conversely, when the user finishes using it, the
綜上所述,本發明之一實施例提供一種電性連接機構100,其中在電性連接機構100的殼體內部設有可動件20、彈性薄膜30以及第一、第二、第三連接器C1、C2、C3,其中前述第一連接器C1係固設於可動件20內部。In summary, an embodiment of the present invention provides an
應了解的是,當可動件20位於殼體內部之一收納位置時,彈性薄膜30係位在可動件20以及該第二、第三連接器C2、C3之間,而當可動件20由該收納位置相對於殼體滑動至一展開位置時,可動件20會壓迫彈性薄膜30,並使第一連接器C1透過可動件20上的第一穿孔H1以及彈性薄膜30的第一開口h1而顯露於殼體之一側,如此一來使用者即可同時使用前述第一、第二、第三連接器C1、C2、C3,從而大幅提升使用上的便利性。It should be understood that when the
應了解的是,由於本發明之電性連接機構100可在平時提供兩個連接器使用,而在有特殊需要時可再延伸出另一個連接器,因此能夠有助於達成電子裝置體積之微型化並節省空間,同時也可保持電子裝置整體外觀的簡潔。It should be understood that since the
雖然本發明的實施例及其優點已揭露如上,但應該瞭解的是,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作更動、替代與潤飾。此外,本發明之保護範圍並未侷限於說明書內所述特定實施例中的製程、機器、製造、物質組成、裝置、方法及步驟,任何所屬技術領域中具有通常知識者可從本發明揭示內容中理解現行或未來所發展出的製程、機器、製造、物質組成、裝置、方法及步驟,只要可以在此處所述實施例中實施大抵相同功能或獲得大抵相同結果皆可根據本發明使用。因此,本發明之保護範圍包括上述製程、機器、製造、物質組成、裝置、方法及步驟。另外,每一申請專利範圍構成個別的實施例,且本發明之保護範圍也包括各個申請專利範圍及實施例的組合。Although the embodiments of the present invention and their advantages have been disclosed above, it should be understood that those skilled in the art can make changes, substitutions and modifications without departing from the spirit and scope of the present invention. In addition, the protection scope of the present invention is not limited to the process, machine, manufacture, material composition, device, method and steps in the specific embodiments described in the description, and anyone with ordinary knowledge in the technical field can learn from the disclosure of the present invention It is understood that the current or future developed processes, machines, manufactures, material compositions, devices, methods and steps can be used in accordance with the present invention as long as they can perform substantially the same functions or obtain substantially the same results in the embodiments described herein. Therefore, the protection scope of the present invention includes the above-mentioned process, machine, manufacture, composition of matter, device, method and steps. In addition, each patent application scope constitutes an individual embodiment, and the protection scope of the present invention also includes the combination of each patent application scope and the embodiments.
雖然本發明已以較佳實施例揭露於上,然其並非用以限定本發明,任何熟習此項工藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Anyone who is familiar with this technology can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore The scope of protection of the present invention should be defined by the scope of the appended patent application.
100:電性連接機構 10:導電模組 11:第一基板 12:孔洞 13:孔洞 20:可動件 21:第一表面 22:第二表面 23:第三表面 30:彈性薄膜 40:第二基板 50:第三基板 B1:上機殼 B2:下機殼 C1:第一連接器 C2:第二連接器 C3:第三連接器 C4:第四連接器 C5:第五連接器 C6:第六連接器 H1:第一穿孔 H2:第二穿孔 H3:第三穿孔 h1:第一開口 h2:第二開口 h3:第三開口 R:支撐桿 W1:第一導線 W2:第二導線 W3:第三導線 100: electrical connection mechanism 10: Conductive module 11: The first substrate 12: hole 13: hole 20: Movable parts 21: First Surface 22: Second Surface 23: The third surface 30: elastic film 40: Second substrate 50: The third substrate B1: Upper case B2: Lower case C1: first connector C2: Second connector C3: Third connector C4: Fourth connector C5: fifth connector C6: Sixth connector H1: First piercing H2: Second perforation H3: Third perforation h1: first opening h2: second opening h3: third opening R: support rod W1: first wire W2: Second wire W3: Third wire
第1圖表示本發明一實施例之電性連接機構100的爆炸。
第2圖表示當可動件20位於殼體內部之一收納位置時的示意圖。
第3圖表示當可動件20由第2圖所示之收納位置相對於殼體朝右側滑動至一過渡位置時的示意圖。
第4圖表示當可動件20由第3圖所示之過渡位置相對於殼體朝右側滑動至一展開位置時的示意圖。
第5圖表示第一連接器C1、第二連接器C2以及第三連接器C3分別電性連接一第四連接器C4、一第五連接器C5以及一第六連接器C6的示意圖,其中第5圖係省略繪示第一、第二、第三導線W1、W2、W3以方便理解。
FIG. 1 shows an explosion of an
100:電性連接機構 100: electrical connection mechanism
10:導電模組 10: Conductive module
11:第一基板 11: The first substrate
12:孔洞 12: hole
13:孔洞 13: hole
20:可動件 20: Movable parts
21:第一表面 21: First Surface
22:第二表面 22: Second Surface
23:第三表面 23: The third surface
30:彈性薄膜 30: elastic film
40:第二基板 40: Second substrate
50:第三基板 50: The third substrate
B1:上機殼 B1: Upper case
B2:下機殼 B2: Lower case
C1:第一連接器 C1: first connector
C2:第二連接器 C2: Second connector
C3:第三連接器 C3: Third connector
H1:第一穿孔 H1: First piercing
H2:第二穿孔 H2: Second perforation
H3:第三穿孔 H3: Third perforation
h1:第一開口 h1: first opening
h2:第二開口 h2: second opening
h3:第三開口 h3: third opening
R:支撐桿 R: support rod
Claims (10)
Priority Applications (1)
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TW110115101A TWI763462B (en) | 2021-04-27 | 2021-04-27 | Electrical connection mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW110115101A TWI763462B (en) | 2021-04-27 | 2021-04-27 | Electrical connection mechanism |
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TWI763462B TWI763462B (en) | 2022-05-01 |
TW202243341A true TW202243341A (en) | 2022-11-01 |
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Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7074061B1 (en) * | 1993-11-12 | 2006-07-11 | Intel Corporation | Versatile communications connectors |
JP2000208952A (en) * | 1999-01-12 | 2000-07-28 | Sony Corp | Electronic apparatus |
US7483262B2 (en) * | 2004-01-15 | 2009-01-27 | Hewlett-Packard Development Company, L.P. | Computer system with multiple-connector apparatus |
US7217144B1 (en) * | 2006-01-11 | 2007-05-15 | International Business Machines Corporation | Connector drawer |
WO2009105101A1 (en) * | 2008-02-21 | 2009-08-27 | Hewlett-Packard Development Company, L.P. | Computing devices having pop-out connector port arrays |
TWI473359B (en) * | 2011-08-02 | 2015-02-11 | Compal Electronics Inc | Electronic device and connecting port thereof |
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