TW202239994A - Coating shielding jig - Google Patents
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- TW202239994A TW202239994A TW110145908A TW110145908A TW202239994A TW 202239994 A TW202239994 A TW 202239994A TW 110145908 A TW110145908 A TW 110145908A TW 110145908 A TW110145908 A TW 110145908A TW 202239994 A TW202239994 A TW 202239994A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
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- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
- Physical Vapour Deposition (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
本發明涉及鍍膜領域,更進一步,涉及一鍍膜遮蔽治具。 The invention relates to the coating field, and further relates to a coating masking tool.
本申請要求於2020年12月28日提交中國專利局、申請號為202011575637.5、發明名稱為“鍍膜遮蔽治具”的中國專利申請的優先權,其全部內容通過引用結合在本申請中。 This application claims the priority of the Chinese patent application with the application number 202011575637.5 and the title of the invention " Coating Masking Fixture" submitted to the China Patent Office on December 28, 2020, the entire contents of which are incorporated herein by reference.
隨著智慧化的不斷普及,各種電子產品日益廣泛出現在人們生活、生產的各個領域。電子產品涉及各種電子元器件,因此電子產品的封裝、防水問題也隨之成為人們關心的問題。 With the continuous popularization of intelligence, various electronic products have increasingly appeared in various fields of people's life and production. Electronic products involve various electronic components, so the packaging and waterproofing of electronic products have also become issues of concern to people.
以最為普遍的電子產品手機為例,在手機製造的過程中,手機組裝時,要在手機的螢幕組件的一些特定位置設置防水層,尤其是一些涉及接縫、螢幕與電路板結合的位置等,需要設置防水結構。 Taking the most common electronic product mobile phone as an example, in the process of mobile phone manufacturing, when the mobile phone is assembled, it is necessary to set up a waterproof layer on some specific positions of the screen components of the mobile phone, especially some positions involving joints, screens and circuit boards, etc. , it is necessary to set up a waterproof structure.
現有的一些電子設備防水技術中,主要是採用MS膠(改性矽烷聚醚膠)防護技術。MS膠早期主要是被應用在建築領域,隨著電子產品的發展,逐漸被應用於電子產品的防水密封,但是其存在諸多不利因素。 Among the existing waterproof technologies for electronic equipment, MS glue (modified silane polyether glue) protection technology is mainly used. MS glue was mainly used in the construction field in the early days. With the development of electronic products, it was gradually applied to the waterproof sealing of electronic products, but there are many disadvantages.
首先,MS膠主要是用於大面積的產品表面的防護,不適於小區域的防護。MS膠制程佔有較大的空間,小區域不方便進行施膠,也就是說,小區域施膠難度增加。尤其是在一些邊緣小區域,MS膠更是難以施加。 First of all, MS glue is mainly used for the protection of large-area product surfaces, and is not suitable for the protection of small areas. The MS glue process occupies a large space, and it is inconvenient to apply glue in small areas, that is to say, it is more difficult to apply glue in small areas. Especially in some small edge areas, MS glue is more difficult to apply.
其次,MS膠小區域結合度較差,容易脫落,而脫落後則完全失去對電子產品的防水防護作用。 Secondly, the small area of MS glue has poor bonding and is easy to fall off. After falling off, it will completely lose its waterproof protection effect on electronic products.
第三,為了MS膠牢固地與產品結合,MS膠層本身需要施加的厚度較大,但是這個會在一些程度上影響產品本身的結構,尤其是當其涉及內部組裝的結構後,這個較厚的MS膠層會影響其它部件的組裝。 Third, in order for the MS glue to be firmly combined with the product, the MS glue layer itself needs to be thicker, but this will affect the structure of the product itself to some extent, especially when it involves the internal assembly structure, this is thicker The MS adhesive layer will affect the assembly of other components.
特別地,在涉及電子螢幕的防水設置時,其要求更為嚴苛。舉例地,在一些電子螢幕組件中,電子螢幕組件的不同位置的要求完全不同,比如,電子螢幕正面、背面以及具有電子設備的位置,其分別要求正面不能遮擋,不能影響顯示,背面也就是說內側局部位置需要設置嚴密防水結構,而局部區域又要嚴格防止防護結構滲透。對於這樣的需求,允許的加工偏差很小,對治具制程工藝要求很高,而目前的MS膠制程治具遠不能達到產品的需求,制程良率較低。 Especially, when it comes to the waterproof setting of the electronic screen, its requirements are more stringent. For example, in some electronic screen components, the requirements for different positions of the electronic screen components are completely different. For example, the front, back and positions of electronic devices require that the front cannot be blocked and cannot affect the display. A tight waterproof structure needs to be set up in some parts of the inner side, and the infiltration of the protective structure must be strictly prevented in some parts of the area. For such requirements, the allowable processing deviation is very small, and the requirements for the jig manufacturing process are very high. However, the current MS glue manufacturing jigs are far from meeting the product requirements, and the process yield is low.
本發明的一個優勢在於提供一鍍膜遮蔽治具,其配合電漿增強化學氣相沉積法鍍膜工藝,通過鍍膜的方式在待鍍膜工件預定局部區域形成膜層,具有明確的鍍膜目標位置。 An advantage of the present invention is to provide a coating masking fixture, which cooperates with the plasma-enhanced chemical vapor deposition coating process to form a film layer on a predetermined local area of the workpiece to be coated by means of coating, and has a clear coating target position.
本發明的一個優勢在於提供一鍍膜遮蔽治具,其配合電漿增強化學氣相沉積法鍍膜工藝,通過逐漸沉積的方式在待鍍膜工件的預定區域形成膜層,相比施膠的方式,膜層與產品結合的牢固性更好。 An advantage of the present invention is to provide a coating masking fixture, which cooperates with the plasma-enhanced chemical vapor deposition method coating process to form a film layer on a predetermined area of the workpiece to be coated by gradual deposition. The firmness of the combination of the layer and the product is better.
本發明的一個優勢在於提供一鍍膜遮蔽治具,其中所述鍍膜遮蔽治具採用夾層遮蔽的方式,使得待鍍膜產品的非鍍膜區域被夾持遮蔽於內部,僅使得小部分的待鍍膜區域與外部連通,從而使得鍍膜氣體能夠穿過治具而沉積於待鍍膜區域。 One advantage of the present invention is to provide a coating masking fixture, wherein said coating masking fixture adopts the mode of interlayer shielding, so that the non-coating area of the product to be coated is clamped and shielded inside, so that only a small part of the area to be coated and External communication, so that the coating gas can pass through the fixture and be deposited on the area to be coated.
本發明的一個優勢在於提供一鍍膜遮蔽治具,其中所述鍍膜遮蔽治具通過不同硬度的模板配合,使得較軟的模板層貼靠待鍍膜工件,而較硬的模板層位於外部,從而使得在外部保持穩定的夾持力的同時,內部能夠更加貼合待鍍膜工件,避免待鍍膜動件的不必要移動以及防止外力的損傷。 An advantage of the present invention is to provide a coating masking fixture, wherein the coating masking fixture is matched by templates of different hardness, so that the softer template layer is attached to the workpiece to be coated, while the harder template layer is located on the outside, so that While maintaining a stable clamping force on the outside, the inside can fit the workpiece to be coated more closely, avoiding unnecessary movement of the moving parts to be coated and preventing damage from external forces.
本發明的一個優勢在於提供一鍍膜遮蔽治具,其中所述鍍膜遮蔽治具通過夾持於待鍍膜工件兩側的模板設置凹凸結構來防止邊緣區域出現滲膜。 An advantage of the present invention is to provide a coating masking jig, wherein the coating masking jig sets concave-convex structures on the templates clamped on both sides of the workpiece to be coated to prevent film seepage in the edge area.
本發明的一個優勢在於提供一鍍膜遮蔽治具,其中所述鍍膜遮蔽治具位於內側的較軟的模板層設置與待鍍膜工件匹配的形狀,保護待鍍膜 工件的同時防止不必要的鍍膜。 One advantage of the present invention is to provide a film-coating masking fixture, wherein the softer template layer on the inner side of the film-coating masking fixture is set to match the shape of the workpiece to be coated, so as to protect the film to be coated workpiece while preventing unnecessary coating.
本發明的一個優勢在於提供一鍍膜遮蔽治具,其中所述鍍膜遮蔽治具的位於內側的模板設有排氣孔,使得的內側模板與待鍍膜工件相互貼合,以及使得內外層的模板之間相互貼合。 One advantage of the present invention is to provide a coating film shielding fixture, wherein the template positioned at the inner side of the coating film shielding fixture is provided with an exhaust hole, so that the inner template and the workpiece to be coated are attached to each other, and the templates of the inner and outer layers fit each other.
本發明的一個優勢在於提供一鍍膜遮蔽治具,其中所述鍍膜遮蔽治具的位於內側的模板設有預定高的通道,使得鍍膜氣體能夠充分流動,方便鍍膜氣體有效的流通,提升鍍膜效率以及均勻性。 An advantage of the present invention is to provide a coating shielding fixture, wherein the mold plate located inside the coating shielding fixture is provided with a channel with a predetermined height, so that the coating gas can flow fully, facilitate the effective circulation of the coating gas, improve the coating efficiency and Uniformity.
本發明的一個優勢在於提供一鍍膜遮蔽治具,其中所述鍍膜遮蔽治具的模板設有避讓結構,在確保電子組件不被壓到的前提下,有效地做到遮蔽防護。 An advantage of the present invention is to provide a coating shielding fixture, wherein the template of the coating shielding fixture is provided with an avoidance structure, which can effectively achieve shielding protection under the premise of ensuring that the electronic components are not pressed.
為了實現以上至少一優勢,本發明的一方面提供鍍膜遮蔽治具,其包括: In order to achieve at least one advantage above, an aspect of the present invention provides a coating masking fixture, which includes:
一第一模板組件;和 a first template component; and
一第二模板組件,所述第一模板組件和所述第二模板組件具有一開模狀態和一合模狀態,在所述開模狀態,所述第一模板組件和所述第二模板組件相互分離,在所述合模狀態,所述第一模板組件和所述第二模板組件相互結合形成一容納腔,所述容納腔適於容納一待鍍膜工件,所述第一模板組件具有一局部鍍膜通道,所述局部鍍膜通道連通所述容納腔,以便於通過所述局部鍍膜通道向所述待鍍膜工件的預定鍍膜區進行鍍膜。 A second formwork assembly, the first formwork assembly and the second formwork assembly have a mold opening state and a mold closing state, in the mold opening state, the first formwork assembly and the second formwork assembly Separated from each other, in the mold clamping state, the first template assembly and the second template assembly are combined to form an accommodating cavity, the accommodating cavity is suitable for accommodating a workpiece to be coated, and the first template assembly has a A partial coating channel, the partial coating channel communicates with the accommodating cavity, so as to carry out coating to a predetermined coating area of the workpiece to be coated through the partial coating channel.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第一模板組件包括一第一內模板和一第一外模板,所述第二模板組件包括一第二內模板和一第二外模板,當所述鍍膜遮蔽治具處於所述合模狀態時,所述第一模板組件的所述第一內模板的邊緣和所述第二模板組件的所述第二內模板的邊緣結合,所述第一模板組件的所述第一外模板的邊緣和所述第二模板組件的所述第二外模板的邊緣結合。 The coating masking fixture according to one embodiment, wherein the first template assembly includes a first inner template and a first outer template, and the second template assembly includes a second inner template and a second outer template , when the coating masking fixture is in the clamping state, the edge of the first inner template of the first template assembly is combined with the edge of the second inner template of the second template assembly, so The edge of the first outer formwork of the first formwork assembly is combined with the edge of the second outer formwork of the second formwork assembly.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第一外模板具有一第一凹槽,所述第一內模板被容納於所述第一外模板的所述第一凹槽。 According to an embodiment of the coating masking fixture, wherein the first outer template has a first groove, and the first inner template is accommodated in the first groove of the first outer template.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第一模板組件具有一第一嵌合結構,所述第一嵌合結構被設置於所述第一內模板的外表面和所述第一外模板的內表面之間。 The coating masking fixture according to one embodiment, wherein the first template component has a first fitting structure, and the first fitting structure is arranged on the outer surface of the first inner template and the first fitting structure. between the inner surfaces of an outer formwork.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第一嵌合結構是凹凸配合結構。 According to an embodiment of the coating masking fixture, wherein the first fitting structure is a concave-convex matching structure.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第一內模板的內表面具有一第一仿形結構,所述第一仿形結構與所述待鍍膜工件的上表面適配。 According to one embodiment of the coating masking fixture, the inner surface of the first inner template has a first profiling structure, and the first profiling structure is adapted to the upper surface of the workpiece to be coated.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第一仿形結構的邊緣呈外凸的弧形。 According to an embodiment of the coating masking fixture, wherein the edge of the first profiling structure is in a convex arc shape.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第一仿形結構的邊緣呈大致直角結構。 According to an embodiment of the coating masking tool, the edges of the first profiling structure are approximately right-angled.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第一內模板具有一第一內孔和一第一通道,所述第一內孔連通所述第一通道,所述第一內孔位於所述第一通道上方,所述第一通道連通所述容納腔。 According to an embodiment of the coating shielding fixture, wherein the first inner template has a first inner hole and a first channel, the first inner hole communicates with the first channel, and the first inner hole Located above the first channel, the first channel communicates with the accommodating cavity.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第一內模板具有多個所述第一內孔,多個所述第一內孔按預定位置佈局,所述佈局包括一橫向延伸區和一兩側區。 According to an embodiment of the coating shielding fixture, wherein the first inner template has a plurality of the first inner holes, and the plurality of the first inner holes are laid out at predetermined positions, and the arrangement includes a lateral extension area and a side area.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第一通道的形狀與所述待鍍膜工件的預定鍍膜區配合。 According to one embodiment of the coating masking tool, the shape of the first channel matches the predetermined coating area of the workpiece to be coated.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第一外模板具有一第一外孔,所述第一外孔的位置連通所述第一內孔。 According to an embodiment of the coating masking fixture, wherein the first outer template has a first outer hole, and the position of the first outer hole communicates with the first inner hole.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第一外模板具有多個所述第一外孔,多個所述第一外孔按預定位置佈局,所述佈局包括一橫向延伸區和一兩側區。 According to an embodiment of the coating shielding fixture, wherein the first outer template has a plurality of the first outer holes, the plurality of the first outer holes are laid out at predetermined positions, and the layout includes a lateral extension area and a side area.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第一外孔和所述第一內孔位置對應。 According to an embodiment of the coating masking jig, the positions of the first outer hole and the first inner hole are corresponding.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第一外孔、所述第一內孔和所述第一通道連通形成所述局部鍍膜通道。 The coating shielding fixture according to one embodiment, wherein the first outer hole, the first inner hole and the first channel communicate to form the partial coating channel.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第一內模板具有一第一排氣孔,所述第一排氣孔貫通所述第一內模板的兩側。 According to an embodiment of the coating masking fixture, wherein the first inner template has a first vent hole, and the first vent hole passes through two sides of the first inner template.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第二外模板具有一第二凹槽,所述第二內模板被容納於所述第二外模板的所述第二凹槽。 According to an embodiment of the coating masking fixture, wherein the second outer template has a second groove, and the second inner template is accommodated in the second groove of the second outer template.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第二模板組件具有一第二嵌合結構,所述第二嵌合結構被設置於所述第二內模板的外表面和所述第二外模板的內表面之間。 The coating masking fixture according to one embodiment, wherein the second template component has a second fitting structure, and the second fitting structure is arranged on the outer surface of the second inner template and the first fitting structure. between the inner surfaces of the two outer templates.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第二內模板的內表面具有一第二仿形結構,所述第二仿形結構與所述待鍍膜工件的下表面適配。 According to one embodiment of the coating masking fixture, the inner surface of the second inner template has a second profiling structure, and the second profiling structure is adapted to the lower surface of the workpiece to be coated.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第二仿形結構的邊緣呈內凹的弧形。 According to an embodiment of the coating masking jig, the edge of the second profiling structure is in a concave arc shape.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第二仿形結構的邊緣呈大致直角結構。 According to an embodiment of the coating masking fixture, wherein the edge of the second profiling structure is approximately right-angled.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第一內模板的內表面具有一避讓結構,所述避讓結構的位置與所述待鍍膜工件的電子組件的位置對應。 According to one embodiment of the coating masking fixture, the inner surface of the first inner template has an avoidance structure, and the position of the avoidance structure corresponds to the position of the electronic component of the workpiece to be coated.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第一內模板和所述第二內模板之間設有一第三嵌合結構,所述第三嵌合結構是一凹凸結構。 According to an embodiment of the coating masking fixture, a third fitting structure is provided between the first inner template and the second inner template, and the third fitting structure is a concave-convex structure.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第二內模板具有一第二排氣孔,所述第二排氣孔貫通所述第二內模板的兩側。 According to an embodiment of the coating masking fixture, wherein the second inner template has a second vent hole, and the second vent hole passes through two sides of the second inner template.
根根據一個實施例所述的鍍膜遮蔽治具,其中所述第一內模板和所述第二內模板是矽膠材質。 According to the coating masking jig according to one embodiment, the first inner template and the second inner template are made of silicone.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第一外模板和所述第二外模板是環氧板。 The coating masking fixture according to one embodiment, wherein the first outer template and the second outer template are epoxy boards.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第二外模板具有一輔助孔,所述輔助孔連通所述第二外模板的兩側,以便於分離所述第二內模板和所述第二外模板。 According to the coating masking fixture described in one embodiment, wherein the second outer template has an auxiliary hole, the auxiliary hole communicates with both sides of the second outer template, so as to separate the second inner template from the Describe the second outer template.
根據一個實施例所述的鍍膜遮蔽治具,其中所述鍍膜遮蔽治具包括多個固定組件,所述第一外模板和所述第二外模板各自具有多個固定孔,多個所述固定組件分別穿過所述固定孔固定所述第一外模板和所述第二外模板。 The coating masking fixture according to one embodiment, wherein the coating masking fixture includes a plurality of fixing components, each of the first outer template and the second outer template has a plurality of fixing holes, and a plurality of the fixing components The components respectively pass through the fixing holes to fix the first outer formwork and the second outer formwork.
根據一個實施例所述的鍍膜遮蔽治具,其中當所述第一外模板和所述第二外模板合模時,所述第一外模板和所述第二外模板磁性吸合。 According to an embodiment of the coating masking fixture, when the first outer template and the second outer template are molded together, the first outer template and the second outer template are magnetically attracted together.
根據一個實施例所述的鍍膜遮蔽治具,其中所述第一外模板和所述第二外模板各自具有一定位孔,所述鍍膜遮蔽治具包括一定位銷,所述定位銷能夠穿過所述定位孔定位所述第一外模板和所述第二外模板。 According to an embodiment of the coating masking tool, wherein the first outer template and the second outer template each have a positioning hole, the coating masking tool includes a positioning pin, and the positioning pin can pass through The positioning holes position the first outer template and the second outer template.
根據一個實施例所述的鍍膜遮蔽治具,其中所述鍍膜遮蔽治具配合電漿增強化學氣相沉積法鍍膜工藝向所述待鍍膜工件預定鍍膜區鍍膜。 The coating masking fixture according to one embodiment, wherein the coating masking fixture cooperates with a plasma-enhanced chemical vapor deposition coating process to coat a film on a predetermined coating area of the workpiece to be coated.
1:鍍膜遮蔽治具 1: Coating masking fixture
10:第一模板組件 10: The first template component
100:開模狀態 100: mold opening state
101:容納腔 101: accommodating cavity
102:局部鍍膜通道 102: Partial coating channel
11:第一內模板 11: First Inner Template
1101:第一內孔 1101: the first inner hole
1102:第一通道 1102: the first channel
1103:第一排氣孔 1103: the first exhaust hole
111:內表面 111: inner surface
12:第一外模板 12: First Outer Template
1201:第一外孔 1201: the first outer hole
1202:第一固定孔 1202: the first fixing hole
1204:定位孔 1204: positioning hole
1206:凹槽 1206: Groove
121:內表面 121: inner surface
122:外表面 122: Outer surface
14:磁吸件 14:Magnetic parts
15:定位銷 15: Locating pin
20:第二模板組件 20: The second template component
200:合模狀態 200: Clamping state
21:第二內模板 21: Second inner template
2103:第二排氣孔 2103: Second vent hole
211:內表面 211: inner surface
212:外表面 212: Outer surface
22:第二外模板 22: Second outer formwork
2202:第二固定孔 2202: Second fixing hole
2203:輔助孔 2203: auxiliary hole
2204:定位孔 2204: positioning hole
2206:凹槽 2206: Groove
221:內表面 221: inner surface
222:外表面 222: Outer surface
31:第一嵌合結構 31: The first chimeric structure
32:第二嵌合結構 32: The second chimeric structure
33:第三嵌合結構 33: The third chimeric structure
331:第三凸起 331: third bulge
332:第三凹槽 332: The third groove
333:保護凸起 333: Protection bump
34:第四嵌合結構 34: The fourth chimeric structure
40:避讓結構 40: Avoidance structure
401:第一內避讓腔 401: The first inner avoidance cavity
402:內避讓槽 402: Inner avoidance slot
403:外避讓槽 403: Outer avoidance slot
51:第一仿形結構 51: The first profiling structure
52:第二仿形結構 52: The second profiling structure
9:待鍍膜工件 9: The workpiece to be coated
901:防護區 901: Protected area
902:鍍膜區 902: Coating area
91:螢幕 91: screen
92:電路板 92: circuit board
921:電子組件 921: Electronic components
922:電路板層 922: circuit board layer
A-A:線 A-A: line
B-B:線 B-B: line
C-C:線 C-C: line
圖1A、1B是根據本發明的第一個實施例的鍍膜遮蔽治具的合模狀態的兩個角度示意圖。 1A and 1B are schematic views from two angles of the mold clamping state of the coating and masking fixture according to the first embodiment of the present invention.
圖2A、2B是根據本發明的第一個實施例的鍍膜遮蔽治具的開模狀態的兩個角度示意圖。 2A and 2B are schematic views from two angles of the mold opening state of the coating and masking fixture according to the first embodiment of the present invention.
圖3是根據本發明的第一個實施例的鍍膜遮蔽治具與待鍍膜工件的配合示意圖。 Fig. 3 is a schematic diagram of cooperation between the coating masking fixture and the workpiece to be coated according to the first embodiment of the present invention.
圖4A、4B是根據本發明的第一個實施例的鍍膜遮蔽治具的分解示意圖。 4A and 4B are exploded schematic diagrams of the coating masking fixture according to the first embodiment of the present invention.
圖5A是沿圖1A中A-A線的剖視示意圖以及局部放大示意。 FIG. 5A is a schematic cross-sectional view along line A-A in FIG. 1A and a partially enlarged schematic view.
圖5B是圖5A中放置了待鍍膜工件的示意圖。 FIG. 5B is a schematic diagram of placing the workpiece to be coated in FIG. 5A .
圖6A是沿圖1A中B-B線的剖視示意圖以及局部放大示意。 FIG. 6A is a schematic cross-sectional view along line B-B in FIG. 1A and a partially enlarged schematic view.
圖6B是圖6A中放置了待鍍膜工件的示意圖。 FIG. 6B is a schematic diagram of placing the workpiece to be coated in FIG. 6A .
圖7是沿圖1A中C-C線的剖視示意圖以及局部放大示意。 FIG. 7 is a schematic cross-sectional view along line C-C in FIG. 1A and a partially enlarged schematic view.
圖8A是根據本發明的第二個實施例的鍍膜遮蔽治具的對應A-A線的剖視示意圖。 8A is a schematic cross-sectional view corresponding to line A-A of the coating and masking fixture according to the second embodiment of the present invention.
圖8B是圖8A中放置了待鍍膜工件的示意圖。 FIG. 8B is a schematic diagram of placing the workpiece to be coated in FIG. 8A .
圖9A是根據本發明的第二個實施例的鍍膜遮蔽治具的對應B-B線的剖視示意圖。 9A is a schematic cross-sectional view corresponding to line B-B of the coating and masking fixture according to the second embodiment of the present invention.
圖9B是圖9A中放置了待鍍膜工件的示意圖。 FIG. 9B is a schematic diagram of placing the workpiece to be coated in FIG. 9A .
圖10是根據本發明的第三個實施例的鍍膜遮蔽治具的分解示意圖。 FIG. 10 is an exploded schematic diagram of a coating masking fixture according to a third embodiment of the present invention.
以下描述用於揭露本發明以使本領域技術人員能夠實現本發明。以下描述中的優選實施例只作為舉例,本領域技術人員可以想到其他顯而易見的變型。在以下描述中界定的本發明的基本原理可以應用於其他實施方案、變形方案、改進方案、等同方案以及沒有背離本發明的精神和範圍的其他技術方案。 The following description serves to disclose the present invention to enable those skilled in the art to carry out the present invention. The preferred embodiments described below are only examples, and those skilled in the art can devise other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents and other technical solutions without departing from the spirit and scope of the present invention.
本領域技術人員應理解的是,在本發明的揭露中,術語“縱向”、“橫向”、“上”、“下”、“前”、“後”、“左”、“右”、“豎直”、“水平”、“頂”、“底”、“內”、“外”等指示的方位或位置關係是基於圖式所示的方位或位置關係,其僅是為了便於描述本發明和簡化描述,而不是指示或暗示所指的裝置或組件必須具有特定的方位、以特定的方位構造和操作,因此上述術語不能理解為對本發明的限制。 Those skilled in the art should understand that in the disclosure of the present invention, the terms "vertical", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientations or positional relationships indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present invention and simplified description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operate in a specific orientation, so the above terms should not be construed as limiting the present invention.
可以理解的是,術語“一”應理解為“至少一”或“一個或多個”,即在一個實施例中,一個組件的數量可以為一個,而在另外的實施例中,該組件的數量可以為多個,術語“一”不能理解為對數量的限制。 It can be understood that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of a component can be one, while in another embodiment, the number of the component The quantity can be multiple, and the term "a" cannot be understood as a limitation on the quantity.
對“一個實施例”、“實施例”、“示例實施例”、“各種實施何”、“一些實施例”等的引用指示這樣的描述本發明的實施例可包括特定特徵、結構或特性,但是不是每個實施例必須包括該特徵、結構或特性。此外,一些實施例可具有對其它實施例的描述的特徵中的一些、全部或沒有這樣的特徵。 References to "one embodiment," "an embodiment," "example embodiment," "various implementations," "some embodiments," etc. indicate that such embodiments describing the invention may include a particular feature, structure, or characteristic, But not every embodiment must include this feature, structure or characteristic. Furthermore, some embodiments may have some, all, or none of the features described for other embodiments.
圖1A、1B是根據本發明的第一個實施例的鍍膜遮蔽治具的合模狀態的兩個角度示意圖。圖2A、2B是根據本發明的第一個實施例的鍍膜遮蔽治具的開模狀態的兩個角度示意圖。圖3是根據本發明的第一個實施例的鍍膜遮蔽治具與待鍍膜工件的配合示意圖。圖4A、4B是根據本發明的第一個實施例的鍍膜遮蔽治具的分解示意圖。圖5A是沿圖1A中A-A線的剖視示意圖以及局部放大示意。 1A and 1B are schematic views from two angles of the mold clamping state of the coating and masking fixture according to the first embodiment of the present invention. 2A and 2B are schematic views from two angles of the mold opening state of the coating and masking fixture according to the first embodiment of the present invention. Fig. 3 is a schematic diagram of cooperation between the coating masking fixture and the workpiece to be coated according to the first embodiment of the present invention. 4A and 4B are exploded schematic diagrams of the coating masking fixture according to the first embodiment of the present invention. FIG. 5A is a schematic cross-sectional view along line A-A in FIG. 1A and a partially enlarged schematic view.
圖5B是圖5A中放置了待鍍膜工件的示意圖。圖6A是沿圖1A中B-B線的剖視示意圖以及局部放大示意。圖6B是圖6A中放置了待鍍膜工件的示意圖。圖7是沿圖1A中C-C線的剖視示意圖以及局部放大示意。 FIG. 5B is a schematic diagram of placing the workpiece to be coated in FIG. 5A . FIG. 6A is a schematic cross-sectional view along line B-B in FIG. 1A and a partially enlarged schematic view. FIG. 6B is a schematic diagram of placing the workpiece to be coated in FIG. 6A . FIG. 7 is a schematic cross-sectional view along line C-C in FIG. 1A and a partially enlarged schematic view.
參考圖1A-圖7,根據本發明的第一個實施例的鍍膜遮蔽治具1被闡述。本發明提供一鍍膜遮蔽治具1,所述鍍膜遮蔽治具1配合電漿增強化學氣相沉積法鍍膜工藝,通過鍍膜的方式在一待鍍膜工件9預定局部區域形成膜層。也就是說,在需要為所述待鍍膜工件9的預定局部區域鍍膜時,將帶有所述待鍍膜工件9的所述鍍膜遮蔽治具1整體放置於一反應腔室中,在所述反應腔室內進行沉積鍍膜,從而通過電漿增強化學氣相沉積法(Plasma Enhanced Chemical Vapor Deposition,PECVD)方式在所述待鍍膜工件9的預定局部區域形成預定功能的膜層。
Referring to FIGS. 1A-7 , a
優選地,所述膜層是一防水膜,可選地,所述膜層可以是其它功能的膜層,如耐腐蝕膜、隔熱膜、遮光膜等,本發明在這方面並不限制。 Preferably, the film layer is a waterproof film. Optionally, the film layer can be a film layer with other functions, such as corrosion-resistant film, heat-insulating film, light-shielding film, etc. The present invention is not limited in this respect.
在本發明的一個實施例中,所述待鍍膜工件9是一螢幕組件,其包括一螢幕91和一電路板92。所述電路板層922呈環形地設置於所述螢幕91的邊緣區域。所述螢幕組件9舉例但不限於,電子設備的,如智慧手機的螢幕組件9。所述電路板92包括一電子組件921和一電路板層922,所述電子組件921位於所述電路板92的局部區域。更進一步,所述電子組件921位於靠近所述螢幕91的一端部的位置,比如靠近頭端。所述待鍍膜工件9包括一防護區901和一鍍膜區902,所述防護區901是需要嚴格防止鍍膜的區域,所述鍍膜區902是需要鍍膜的區域。而在所述待鍍膜工件9中,設有電子組
件921的頭端是需要嚴格防護的一端,即防止被鍍膜或者防止滲膜的一端,即,所述防護區901所在區域,而尾端是需要被鍍膜的一端,即所述螢幕91和所述電路板92疊層結合的位置,即,所述鍍膜區902所在區域。值得一提的是,在本發明的實施例中,以所述待鍍膜工件99的尾端局部區域需要鍍膜的情況進行說明,而在本發明的其它實施例中,所述待鍍膜工件9的預定局部區域還可以是其它位置,如,兩側邊緣的局部區域,本發明在這方面並不限制。換句話說,所述待鍍膜工件9的預定局部區域具有選擇性。
In one embodiment of the present invention, the
所述鍍膜遮蔽治具1包括一第一模板組件10和一第二模板組件20,所述第一模板組件10和所述第二模板組件20具有一開模狀態100和一合模狀態200,在所述開模狀態100,所述第一模板組件10和所述第二模板組件20相互分離,所述待鍍膜工件9適於被放置於所述第一模板組件10和所述第二模板組件20之間,以便夾持所述待鍍膜工件9;在所述合模狀態200,所述第一模板組件10和所述第二模板組件20相互結合,形成一容納腔101,用於容納所述待鍍膜工件9,也就是說,在鍍膜時,所述第一模板組件10和所述第二模板組件20容納、遮蔽被放置於所述第一模板組件10和所述第二模板組件20之間的所述待鍍膜工件9,並且使得所述待鍍膜工件9的預定局部區域與外部連通。
The
值得一提的是,根據本發明的實施例,所述鍍膜遮蔽治具1配合電漿增強化學氣相沉積法鍍膜工藝,通過鍍膜的方式在待鍍膜工件9預定局部區域形成膜層,因此在形成膜層時,鍍膜氣體逐漸沉積於預定鍍膜位置形成膜層,不需要像MS膠防護工藝那樣通過施膠組件形成膠層,即,不需要額外施膠組件的佔用空間,因此更適合於在小區域位置或者形狀不規則或者具有拐角的位置形成防護膜層,具有明確的鍍膜目標位置。另一方面,所述鍍膜遮蔽治具1配合電漿增強化學氣相沉積法鍍膜工藝,通過離化的氣體逐漸沉積的方式在待鍍膜工件9的預定區域形成膜層,相比施膠的方式,膜層與產品結合的牢固性更好。
It is worth mentioning that, according to the embodiment of the present invention, the
所述第一模板組件10具有一局部鍍膜通道102,所述局部鍍膜
通道102連通於所述容納腔101,也就是說,在鍍膜時,鍍膜氣體能夠通過所述局部鍍膜通道102到達被放置於所述容納空間的所述待鍍膜工件9的預定局部區域,在所述待鍍膜工件9的預定局部區域沉積形成膜層。值得一提的是,所述鍍膜遮蔽治具1採用夾層遮蔽的方式,使得待鍍膜產品的非鍍膜區域被夾持遮蔽於內部,僅使得小部分的待鍍膜區域通過所述局部鍍膜通道102與外部連通,從而使得鍍膜氣體能夠穿過治具而沉積於待鍍膜區域。
The
在本發明的一個實施例中,所述第一模板組件10位於上方,也稱為上模板組件,所述第二模板組件20位於下方,也稱為下模板組件。在所述待鍍膜工件9與所述鍍膜遮蔽治具1相互結合的過程中,所述第二模板組件20被水平放置,所述待鍍膜工件9被放置於所述第二模板組件20,也就是說,被水平放置於位於下方的所述第二模板組件20,而後將所述第一模板組件10向下靠近所述第一模板組件10至閉合。值得一提的是,所述待鍍膜工件9與所述第一模板組件10以及所述第二模板組件20相互結合的方式並不限於水平放置的方式,還可以是其它方式,舉例地但不限於,豎直開合,或者所述待鍍膜工件9被設置於預定位置,所述第一模板組件10和所述第二模板組件20由開模狀態100分別從兩側移動靠近所述待鍍膜工件9至合模狀態200。
In an embodiment of the present invention, the
在本發明的一個實施例中,所述第一模板組件10和所述第二模板組件20合模後通過螺釘鎖緊固定,在本發明的另一個實施例中,所述第一模板組件10和所述第二模板組件20通過磁吸的方式相互固定,在本發明的另一個實施例中所述第一模板組件10和所述第二模板組件20通過嵌合結構相互固定,本發明在這方面並不限制,並且後續將對螺釘固定和磁吸固定方式分別進行具體說明。
In one embodiment of the present invention, the
所述第一模板組件10包括一第一內模板11和一第一外模板12,所述第一內模板11能夠貼靠套接於所述第一外模板12。所述第一內模板11是位於內側,所述第一外模板12位於外側,也就是說,所述第一內模板11是靠近所述待鍍膜工件9的模板,或者說貼靠所述待鍍膜工件9的模板層,所
述第一外模板12是相對遠離所述待鍍膜工件9的模板層,換句話說,當所述待鍍膜工件9與所述第一模板組件10結合時,所述第一內模板11間隔於所述第一外模板12和所述待鍍膜工件9之間。為了便於說明,在本發明的實施例中,將靠近所述待鍍膜工件9的方向定義為內,而遠離所述待鍍膜工件9的方向定義為外。
The
所述第一外模板12具有一第一凹槽,所述第一內模板11被容納於所述第一凹槽。
The first
進一步,所述第一內模板11由柔性材料製成,舉例地但不限於,矽橡膠、乙烯/乙酸乙烯酯共聚物(Ethylene Vinyl Acetate,EVA)、天然橡膠,優選地,所述第一內模板11是由50度矽橡膠製成。
Further, the first
所述第一外模板12由較硬的材料製成,舉例地但限於,環氧材料、鋁合金材質,優選地。所述第一外模板12是FR-4環氧板。也就是說,所述第一外模板12的硬度大於所述第一內模板11的硬度。
The first
值得一提的是,由於所述第一內模板11是與所述待鍍膜工件9直接接觸的組件,因此,柔性的材料具有一定的彈性,並且表面摩擦力相對較大,能夠更好地保護所述待鍍膜工件9,並且能夠穩定定位所述待鍍膜工件9。另一方面,當所述第一模板組件10和所述第二模板組件20合模時,所述第一內模板11層能夠緩衝接觸面受到的瞬間壓力。所述第一外模板12是位於外部的組件,是需要提供固定以及被直接操作的組件,較硬的材料更適合被操作以及被固定。因此在本發明的實施例中通過這種軟硬內外配合的方式,使得材料性能與組件的功能相結合,使得整體治具的性能更優。
It is worth mentioning that since the first
類似地,所述第二模板組件20包括一第二內模板21和一第二外模板22,所述第二內模板21能夠貼靠套接於所述第二外模板22。所述第二內模板21是位於內側,所述第二外模板22位於外側,也就是說,所述第二內模板21是靠近所述待鍍膜工件9的模板,或者說貼靠所述待鍍膜工件9的模板層,所述第二外模板22是相對遠離所述待鍍膜工件9的模板層,換句話說,當所述待鍍膜工件9與所述第二模板組件20結合時,所述第二內模板
21間隔於所述第二外模板22和所述待鍍膜工件9之間。
Similarly, the
參考圖1A、1B以及圖3,在所述合模狀態200,所述待鍍膜工件9能夠被放置於所述第一內模板11和所述第二內模板21之間。當所述鍍膜遮蔽治具1合模時,所述第一外模板12和所述第二外模板22的邊緣相接,所述第一內模板11和所述第二內模板21的邊緣相接。
Referring to FIG. 1A , 1B and FIG. 3 , in the
更進一步,所述待鍍膜工件9被至少部分地包裹遮蔽於所述第一內模板11和所述第二內模板21內。優選地,所述待鍍膜工件9被遮蔽包裹於所述第一內模板11和所述第二內模板21內,並且使得所述待鍍膜工件9的預定局部區域連通外部。
Furthermore, the
進一步,所述第二內模板21由柔性材料製成,舉例地但不限於,矽橡膠,優選地,所述第二內模板21是由30度矽橡膠製成。所述第一內模板22的硬度大於所述第二內模板21的的硬度,優選地,所述第一內模板的硬度範圍為60±10度,所述第二內模板的硬度範圍為40±10度。
Further, the second
所述第二外模板22由較硬的材料製成,舉例地但限於,環氧材料、鋁合金材質,優選地。所述第二外模板22是FR-4環氧板。也就是說,所述第二外模板22的硬度大於所述第二內模板21的硬度。值得一提的是,根據本發明的一個實施例,外模板的硬度大於內模板的硬度,位於內側的內模板較軟能夠與螢幕的正面貼的更緊致,位於外側的外模板較硬可以提供較大的支撐力,可以壓迫螢幕使其與內模板更貼合,避免正面滲膜。
The second
值得一提的是,由於所述第二內模板21是與所述待鍍膜工件9直接接觸的組件,因此,柔性的材料具有一定的彈性,並且表面摩擦力相對較大,能夠更好地保護所述待鍍膜工件9,並且能夠穩定定位所述待鍍膜工件9。另一方面,當所述第一模板組件10和所述第二模板組件20合模時,所述第一內模板11層和所述第二內模板21層能夠緩衝接觸面受到的瞬間壓力。第一外模板12和所述第二外模板22是位於外部的組件,是需要提供固定以及被直接操作的組件,較硬的材料更適合被操作以及被固定。因此在本發明的實施例中通過這種軟硬內外配合的方式,使得材料性能與組件的功能相結合,使
得整體治具的性能更優。也就是說,在本發明的實施例中,與所述待鍍膜工件9的直接接觸的內模板整體較柔軟,方便保護、定位所述待鍍膜工件9,而被間隔開的所述外模板整體較硬,方便相互固定以及被操作。
It is worth mentioning that since the second
所述鍍膜遮蔽治具1通過不同硬度的模板配合,使得較軟的模板層貼靠待鍍膜工件9,而較硬的模板層位於外部,從而使得在外部保持穩定的夾持力的同時,內部能夠更加貼合待鍍膜工件9,避免待鍍膜工件9的不必要移動以及防止外力的損傷。
The
進一步,所述第一內模板11和所述第一外模板12是大致板型的結構,也就是說,所述第一內模板11和所述第一外模板12的主體是平面延伸的。
Further, the first
參考圖5A-6B,所述第一內模板11和所述第一外模板12各自具有一內表面和一外表面,所述第一外模板12的外表面122大致平面地延伸,也就是說,所述第一外模板12的外部整體平整。所述第一外模板12的內表面121和所述第一內模板11的外表面112之間設有一第一嵌合結構31,以使得所述第一內模板11和所述第一外模板12相互貼靠結合。舉例地但不限於,所述第一嵌合結構31是一凹凸配合的結構,如在所述第一外模板12的內表面121設置凸起,在所述第一內模板11的外表面112設置凹槽,或者所述第一外模板12的內表面121設置凹槽,在所述第一內模板11的外表面112設置凸起。值得一提的是,由於所述第一內模板11是較軟的材料,所述第一外模板12是較硬的材料,因此,所述第一外模板12的內表面121設置凸起、所述第一內模板的外表面設置凹槽構成的第一嵌合結構31的穩定性、安裝的便捷性要高於相反設置的第一嵌合結構31。
5A-6B, the first
所述第一內模板11的內表面111具有與所述待鍍膜工件9的表面相互配合的一第一仿形結構51,以便於穩定定位所述待鍍膜工件9。所述待鍍膜工件9具有一上表面和一下表面,所述第一仿形結構51與所述待鍍膜工件9的上表面適配。進一步,在本發明的這個實施例中,所述待鍍膜工件9的所述上表面邊緣呈向內的弧形,相應地,所述第一內模板11的內表面111
的邊緣呈外凸弧形,也就是說,所述第一仿形結構51具有向內的弧形邊緣。在本發明的其它實施例中,所述第一內模板11的內表面111還可以是其它仿形結構,比如,大致直角結構。
The
相應地,所述第二內模板21和所述第二外模板22是大致板型的結構,也就是說,所述第二內模板21和所述第二外模板22的主體是平面延伸的。
Correspondingly, the second
所述第二內模板21和所述第二外模板22各自具有一內表面和一外表面,所述第二外模板22的外表面222大致平面地延伸,也就是說,所述第一外模板12和所述第二外模板22的外部整體平整,即整個所述鍍膜遮蔽治具1的外表面平整,方便進行操作以及方便施加平衡的夾持力。所述第二外模板22的內表面221和所述第二內模板21的外表面212之間設有一第二嵌合結構32,以使得所述第二內模板21和所述第二外模板22相互貼靠結合。舉例地但不限於,所述第二嵌合結構32是一凹凸配合的結構,如在所述第二外模板22的內表面221設置凸起,在所述第二內模板21的外表面212設置凹槽,或者所述第二外模板22的內表面221設置凹槽,在所述第二內模板21的外表面212設置凸起。值得一提的是,由於所述第二內模板21是較軟的材料,所述第二外模板22是較硬的材料,因此,所述第二外模板22的內表面221設置凸起、所述第二內模板的外表面設置凹槽構成的第二嵌合結構32的穩定性、安裝的便捷性要高於相反設置的第二嵌合結構32。
The second
所述第一模板組件10和所述第二模板組件20的所述第一嵌合結構31的位置和所述第二嵌合結構32的位置相互對應。
The positions of the first
在本發明這個實施例中,所述待鍍膜工件9是大致直角邊,所述第一內模板11的內表面111具有與所述待鍍膜工件9的表面相互配合的一第一仿形結構51。所述第一仿形結構51的邊緣為大致直角結構。
In this embodiment of the present invention, the
相應地,所述第二內模板21的內表面211具有與所述待鍍膜工件9的表面相互配合的一第二仿形結構52,以便於穩定定位所述待鍍膜工件9。所述待鍍膜工件9具有一上表面和一下表面,所述第二內模板21的內表
面211具有的所述第二仿形結構52與所述待鍍膜工件9的下表面適配。所述第二仿形結構52的邊緣為大致直角結構。
Correspondingly, the
進一步,參考圖3,所述第一內模板11的內表面111具有一避讓結構40,所述避讓結構40用於避讓所述待鍍膜工件9的所述電子組件921,以使得當所述第一模板組件10和所述第二模板組件20相互合模時,所述待鍍膜工件9的所述電子組件921不會被壓或者說減輕壓力。也就是說,所述避讓結構40的位置和所述待鍍膜工件9的所述電子組件921的位置對應。在本發明的一個實施例中,所述避讓結構40是一水平L型凹槽。所述鍍膜遮蔽治具1的避讓結構40,在確保所述電子組件921不被壓到的前提下,有效地做到遮蔽防護。
Further, referring to FIG. 3 , the
所述避讓結構40包括一第一內避讓腔401、一內避讓槽402和一外避讓槽403,所述第一內避讓腔401連通所述內避讓槽402,並且被設置於所述第一內模板11。所述外避讓槽403被設置於所述第一外模板12。由此通過所述第一內避讓腔401、所述內避讓槽402以及所述外避讓槽403整個避讓所述電路板92的不同所述電子組件921。值得一提的是,在本發明的一個實施中,所述電子組件921包括一連接排線,其延伸於所述鍍膜遮蔽治具1的外部,在本發明的另一個實施例中,所述螢幕組件9可以不帶連接線,也就是說,可以不設置所述內避讓槽402和所述外避讓槽403。所述避讓結構40可以根據所述螢幕組件9的所述電子組件921的結構位置進行調整。
The
進一步,參考圖5A-6B,所述第一內模板和所述第二內模板21之間設有一第三嵌合結構33,所述第三嵌合結構33用於所述第一內模板11和所述第二內模板21相互結合。更進一步,所述第三嵌合結構33位於所述待鍍膜工件9的外側,也就是說,所述第三嵌合結構33至少部分地環繞於將所述待鍍膜工件9的邊緣外部,從而使得所述待鍍膜工件9的至少部分邊緣與外部完全隔離,即防止鍍膜氣體滲入。優選地,在所述第一內模板11和所述第二內模板21的邊緣周側整體設置所述第三嵌合結構33,使得所述待鍍膜工件9的邊緣整體被隔離,防止鍍膜氣體滲入。
Further, referring to FIGS. 5A-6B , a third
在本發明的一個實施例中,所述第三嵌合結構33是凹槽和凸起配合結構,舉例地但不限於,在所述第一內模板11的內表面111設置凸起,在所述第二內模板21的內表面211設置凹槽,或者相反的設置結構。在本發明的其它實施例中,所述第三嵌合結構33還可以是其它配合結構,比如齒形結構。更進一步,在本發明的一個實施例中,所述第三嵌合結構33包括多組凹槽和凸起的配合結構,也就是說,氣體如果要從第一模板組件10和所述第二模板組件20的結合位置進入到內部,需要逐層穿過多個凹槽凸起結合的路徑,因此通過這樣的方式,一方面使得所述第一模板組件10和所述第二模板組件20連接更加緊密、牢固,另一方面,延長氣體需要通過的路徑,從而最大化地減小氣體的滲入。
In one embodiment of the present invention, the third
所述第三嵌合結33包括一第三凸起331和一第三凹槽332,所述第三凸起331和所述第三凹槽332分別被設置於所述第一內模板11和所述第二內模板21,以使得所述第一內模板11和所述第二內模板21的邊緣相互結合。
The third fitting joint 33 includes a
進一步,參考圖5A-6B,所述第一外模板12和所述第二外模板22之間設有一第四嵌合結構34,所述第四嵌合結構34用於所述第一外模板12和所述第二外模板22之間的相互結合。更進一步,所述第四嵌合結構34位於所述第三嵌合結構33的外側。也就是說,假如氣體要進入內部,先要通過所述第四嵌合結構34,而後再通過所述第三嵌合結構33,由此逐層地來防止鍍膜氣體的滲入。在本發明的一個實施例中,所述第四嵌合結構34是凹凸臺階配合結構。舉例地但不限於,在所述第一外模板12內表面邊緣設置凹臺階,在所述第二外模板22的內表面邊緣設置凸臺階。
Further, referring to Figures 5A-6B, a fourth
值得一提的是,在本發明的這個實施例中,雖然第一嵌合結構31、所述第二嵌合結構32和所述第三嵌合結構33都是大致凹凸配合結構,但是其設置位置以及功能並不相同。
It is worth mentioning that, in this embodiment of the present invention, although the first
進一步,參考圖5A、圖5B、圖7,所述第一內模板11具有一第一內孔1101和一第一通道1102,所述第一內孔1101連通所述第一通道
1102,所述第一外模組具有一第一外孔1201,所述第一外摸板的所述第一外孔1201連通所述第一內模板11的所述第一內孔1101以及所述第一通道1102形成所述局部鍍膜通道102。優選地,所述第一內模板11的所述第一內孔1101和所述第一外模板12的所述第一外孔1201位置相對應。可選地,所述第一內模板11的所述第一內孔1101和所述第一外模板12的所述第一外孔1201錯位佈置,部分連通。
Further, referring to FIG. 5A, FIG. 5B, and FIG. 7, the first
所述第一內孔1101位於所述第一內模板11靠近一端部位置,所述第一內孔1101位於所述第一通道1102上方。所述第一通道1102在豎直方向連通所述第一內孔1101,沿所述第一內模板11的水平方向延伸。所述第一通道1102連通所述容納腔101。所述第一通道1102的橫向尺寸大於所述第一內孔1101的橫向尺寸。
The first
值得一提的是,所述第一通道1102在所述待鍍膜工件9的所述預定局部區域上方,所述第一通道1102的形狀與所述待鍍膜工件9的預定鍍膜局部位置配合,也就是說,鍍膜氣體進入後能夠在所述待鍍膜工件9的所述預定局部區域上方充分流動,從而提高鍍膜效率以及鍍膜的均勻性。
It is worth mentioning that the
優選地,所述第一通道1102的高度尺寸為1.5mm-2.5mm。優選地,所述第一內孔1101和所述第一外孔1201是橢圓孔。所述鍍膜遮蔽治具1的位於內側的模板設有預定高度的通道,使得鍍膜氣體能夠充分流動,方便鍍膜氣體有效的流通,提升鍍膜效率以及均勻性。
Preferably, the height of the
進一步,所述第一內模板11具有多個第一內孔1101,多個所述第一內孔1101按預定位置佈局,並且分別連通所述第一通道1102。所述第一外模板12具有多個第一外孔1201,多個所述第一外孔1201按預定位置佈局。所述第一連通通道的形狀與所述第一內孔1101以及所述第一外孔1201的佈局相配合,以便於形成預定形狀的鍍膜空間。
Further, the first
所述第一外孔1201、所述第一內孔1101以及所述第一通道1102的佈局、形狀根據所述待鍍膜工件9的所述局部鍍膜區域的形狀、位置設置。
The layout and shape of the first
在本發明的這個實施例中,多個所述第一外孔1201的佈局形狀
包括一外橫向延伸區和兩外側區,分別對應所述待鍍膜工件9的端部的橫向區域和兩側區,相應地,多個所述第一內孔1101的佈局形狀包括一內橫向延伸區和兩內側區,分別對應所述待鍍膜工件9的端部的橫向延伸區域和兩側區,所述橫向延伸區和所述兩側區分別連通所述第一通道1102,也就是說,所述第一通道1102形成具有橫向延伸區和兩側區的預定形狀的連通空間,並且連通所述容納腔101,由此形成一個門型的局部鍍膜區域,即,在所述待鍍膜工件9的尾部的三周邊緣形成膜層。在本發明的其它實施例中,所述第一外孔1201、所述第一內孔1101以及所述第一通道1102的佈局、形狀還可以是其它位置和形狀。
In this embodiment of the present invention, the layout shape of a plurality of the first
值得一提的是,根據本發明的這個實施例的技術方案,能夠使得所述待鍍膜工件9的正面以及背面的主體部分都不被鍍膜的情況下,使得所述待鍍膜工件9的僅0.8-1.1mm寬的邊緣區域內形成納米膜層,既滿足防水的需求,同時不影響所述待鍍膜工件9的外觀的美觀性以及與其它組件的配合安裝。
It is worth mentioning that, according to the technical solution of this embodiment of the present invention, when the front and back main parts of the
進一步,所述第一內模板11具有一第一排氣孔1103,所述第一排氣孔1103貫通所述第一內模板11兩側,以便於當所述第一內模板11與所述第一外模板12靠近時,排出所述第一內模板11和所述第一外模板12之間的氣體,使得所述第一內模板11和所述第一外模板12能夠緊密貼合。優選地,所述第一內模板11具有多個所述第一排氣孔1103,按預定位置佈局。
Further, the first
相應地,所述第二內模板21具有一第二排氣孔2103,所述第二排氣孔2103貫通所述第二內模板21兩側,以便於當所述第二內模板21與所述第二外模板22靠近時,排出所述第二內模板21和所述第二外模板22之間的氣體,使得所述第二內模板21和所述第二外模板22能夠緊密貼合。優選地,所述第二內模板21具有多個所述第二排氣孔2103,按預定位置佈局。
Correspondingly, the second
值得一提的是,所述第一內模板11和所述第二內模板21是矽膠材質,而所述第一外模板12和所述第二外模板22是環氧板,在所述第一內模板11和所述第二內模板21能夠更好地貼合所述待鍍膜工件9的表面,
以及使得所述第一內模板11和所述第一外模板12相互緊密貼靠,且不需要在較硬的所述第一外模板12和所述第二外模板22上打孔。在需要清洗或者分離所述第一內模板11和所述第一外模板12時,可以通過高壓水槍將所述第一內模板11和所述第一外模板12衝開,也可以手動將所述第一內模板11和所述第一外模板12分離。
It is worth mentioning that the first
在本發明的一個實施例中,所述第二外模板22具有一輔助孔2203,所述輔助孔2203連通所述第二外模板22的兩側,也就是說,所述輔助孔2203是一通孔。所述輔助孔2203也可用於將所述第二內模板21和所述第二外模板22相互分離。舉例地但不限於,當需要將所述第二內模板21脫離所述第二外模板22時,可以向所述輔助孔2203充水,從而使得所述第二內模板21快速脫離所述第二外模板22,也可以通過輔助孔2203手動將所述第二內模板21與所述第二外模板22分離。
In one embodiment of the present invention, the second
在本發明的其它實施例中,還可以在所述第一內模板11、第一外模板12或所述第二內模板21上設置所述輔助孔2203。
In other embodiments of the present invention, the
進一步,所述第一外模板12具有多個第一固定孔1202,相應地,所述第二外模板22具有多個第二固定孔2202,所述第一固定孔1202和所述第二固定孔2202位置相對應,以便於通過一固定組件進行固定,舉例地但不限於螺釘、鉚釘、固定塞。也就是說,多個所述固定組件分別穿過多個所述第一固定孔1202以及所述第二固定孔2202,將所述第一外模板12和所述第二外模板22相互固定。
Further, the first
值得一提的是,所述第一外模板12的邊緣凸出於所述第一內模板11,所述第一內模板11被容納與所述第一外模板12,所述第二外模板22的邊緣凸出於第二內模板21的邊緣,所述第二內模板21被容納於所述第二外模板22,因此當所述第一模板組件10和所述第二模板組件20合模時,所述第一內模板11和所述第二內模板21的邊緣相互結合,所述第一外模板12和所述第二外模板22的邊緣相互結合,從而多重地將所述待鍍膜工件9的邊緣與外部相隔離,從而有效地防止滲膜。
It is worth mentioning that the edge of the first
圖8A、8B、9A、9B是根據本發明的第二個實施例的鍍膜治具的剖視示意圖。 8A, 8B, 9A, 9B are schematic cross-sectional views of a coating fixture according to a second embodiment of the present invention.
在本發明的這個實施例中,所述待鍍膜工件9的邊緣是弧形,所述第一內模板11的內表面111具有與所述待鍍膜工件9的表面相互配合的一第一仿形結構51,以便於穩定定位所述待鍍膜工件9。所述待鍍膜工件9的具有一上表面和一下表面,所述第一仿形結構51與所述待鍍膜工件9的上表面適配。進一步,在本發明的這個實施例中,所述待鍍膜工件9的所述上表面邊緣呈向內的弧形,相應地,所述第一內模板11的內表面111的邊緣呈外凸弧形,也就是說,所述第一仿形結構51具有向內的弧形邊緣。在本發明的其它實施例中,所述第一內模板11的內表面111還可以是其它仿形結構,比如,大致直角結構。
In this embodiment of the present invention, the edge of the
值得一提的,當所述待鍍膜工件9的邊緣是弧形時,所述第一嵌合結構31和所述第二嵌合結構32的位置位於所述弧形邊緣的內側,也就是說,所述第一嵌合結構31和所述第二嵌合結構32的位置避開所述待鍍膜工件9的弧形位置,防止在合模時損傷所述待鍍膜工件9。
It is worth mentioning that when the edge of the
進一步,所述第三嵌合結構包括一保護凸起333,所述保護凸起333被設置於所述第一內模板11,並且延伸至所述待鍍膜工件9的所述防護區901,從而使得所述待鍍膜工件9的所述防護區901被定位,並且被所述保護凸起333遮擋而不會被鍍膜。
Further, the third fitting structure includes a
所述第二內模板21的內表面211具有與所述待鍍膜工件9的表面相互配合的一第二仿形結構52,以便於穩定定位所述待鍍膜工件9。所述待鍍膜工件9具有一上表面和一下表面,所述第二內模板21的內表面211具有的所述第二仿形結構52與所述待鍍膜工件9的下表面適配。進一步,在本發明的這個實施例中,所述待鍍膜工件9的下表面邊緣呈向外的弧形,相應地,所述第二內模板21的內表面211的邊緣呈內凹的弧形。也就是說,所述第二仿形結構52具有向內的弧形邊緣。在本發明的其它實施例中,所述第二內模板21的內表面211還可以是其它仿形結構,比如,大致直角結構。
The
在本發明的一個實施例中,所述第二內模板能夠倒鉤包裹所述待鍍膜工件9的下表面,便於放置所述待鍍膜工件9。
In an embodiment of the present invention, the second inner template can wrap the lower surface of the
圖10是根據本發明的第三個實施例的鍍膜治具的分解示意圖。 FIG. 10 is an exploded schematic diagram of a coating fixture according to a third embodiment of the present invention.
參考圖10,在本發明的這個實施例中,所述第一模板組件10和所述第二模板組件20通過磁吸的方式相互結合。
Referring to FIG. 10 , in this embodiment of the present invention, the
進一步,所述第一外模板12和所述第二外模板22分別設有多個磁吸件14,以便於吸合所述第一外模板12和所述第二外模板22。優選地,所述第一外模板12和所述第二外模板22的多個所述磁吸件14分別被設置於所述第一外模板12和所述第二外模板22的邊緣區域。
Further, the first
在本發明的一個實施例中,所述第一外模板12和所述第二外模板22各自具有至少一定位孔1204,2204,所述鍍膜遮蔽治具包括至少一定位銷15,所述定位銷15能夠穿過所述定位孔1204,2204定位所述第一外模板12和所述第二外模板22。優選地,多個所述定位孔1204,2204分別被設置於所述第一外模板12和所述第二外模板22的三角位置。
In one embodiment of the present invention, the first
在一個實施例中,所述第一外模板12和所述第二外模板22的磁吸件14被嵌設於所述第一外模板12和所述第二外模板22,也就是說,所述第一外模板12和所述第二外模板22的表面平整,沒有凸起或者沒有額外的螺釘組件。
In one embodiment, the
在製造所述第一外模板12或所述第二外模板22時,可以在所述第一外模板12或所述第二外模板22預定位置形成盲孔,而後將磁吸組件嵌入所述盲孔。或者,將所述磁吸組件14一體成型於所述第一外模板12或所述第二外模板22。舉例地但不限於,將所述第一固定孔1202和所述第二固定孔2202分別設置為盲孔,在對應位置插入所述磁吸件14。
When manufacturing the first
本領域的技術人員應理解,上述描述及圖式中所示的本發明的實施例只作為舉例而並不限制本發明。本發明的目的已經完整並有效地實現。本發明的功能及結構原理已在實施例中展示和說明,在沒有背離所述原理下,本發明的實施方式可以有任何變形或修改。 Those skilled in the art should understand that the embodiments of the present invention shown in the above description and drawings are only examples and do not limit the present invention. The objects of the present invention have been fully and effectively accomplished. The functions and structural principles of the present invention have been shown and described in the embodiments, and the embodiments of the present invention may have any deformation or modification without departing from the principles.
1:鍍膜遮蔽治具 1: Coating masking fixture
10:第一模板組件 10: The first template component
100:開模狀態 100: mold opening state
102:局部鍍膜通道 102: Partial coating channel
11:第一內模板 11: First Inner Template
1101:第一內孔 1101: the first inner hole
1102:第一通道 1102: the first channel
1103:第一排氣孔 1103: the first exhaust hole
111:內表面 111: inner surface
12:第一外模板 12: First Outer Template
1201:第一外孔 1201: the first outer hole
1202:第一固定孔 1202: the first fixing hole
1206:凹槽 1206: Groove
121:內表面 121: inner surface
122:外表面 122: Outer surface
20:第二模板組件 20: The second template component
21:第二內模板 21: Second inner template
2103:第二排氣孔 2103: Second vent hole
211:內表面 211: inner surface
22:第二外模板 22: Second outer formwork
2202:第二固定孔 2202: Second fixing hole
2206:凹槽 2206: Groove
221:內表面 221: inner surface
222:外表面 222: Outer surface
31:第一嵌合結構 31: The first chimeric structure
32:第二嵌合結構 32: The second chimeric structure
40:避讓結構 40: Avoidance structure
401:第一內避讓腔 401: The first inner avoidance cavity
402:內避讓槽 402: Inner avoidance slot
403:外避讓槽 403: Outer avoidance slot
51:第一仿形結構 51: The first profiling structure
52:第二仿形結構 52: The second profiling structure
9:待鍍膜工件 9: The workpiece to be coated
901:防護區 901: Protected area
902:鍍膜區 902: Coating area
91:螢幕 91: screen
92:電路板 92: circuit board
921:電子組件 921: Electronic components
922:電路板層 922: circuit board layer
Claims (32)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011575637.5A CN114682455B (en) | 2020-12-28 | 2020-12-28 | Film coating shielding jig |
CN202011575637.5 | 2020-12-28 |
Publications (2)
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TW202239994A true TW202239994A (en) | 2022-10-16 |
TWI841888B TWI841888B (en) | 2024-05-11 |
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CN114682455B (en) | 2023-03-21 |
WO2022142989A1 (en) | 2022-07-07 |
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