TW202230674A - A terminal and package used in electronic product - Google Patents

Abstract

A terminal of electronic product and a semiconductor package is disclosed, said terminal includes a conductor, said terminal also enables to include either an opening which is situated at a suitable place on said terminal or an extending portion, in case that a portion of encapsulant received in said opening so as to be coupled with the terminal more securely, then it prevents said terminal from the damage of peeling off caused by external force; when a chip is electrically connected to said terminal by a conductive mean such as a bump, and the tin of said bump is placed in said opening, a solder material such as solder ball coupled with both the lower surface of terminal and the tin of said bump, it can avoid the problem of IMC(intermetallic compound) occurred between said solder ball and said bump, then the reliability of the semiconductor package is enhanced.

Description

Endpoint and package of an electronic device

A terminal for an electronic device, especially a package for a semiconductor.

As shown in FIGS. 7A to 7B , it is a leadless flat package (QFN) structure, wherein FIG. 7A is a top view, and FIG. 7B is a cross-sectional view of the cutting line CC in FIG. 7A . The package body 1A includes: a terminal 3, a chip 20. Conductor 18 and plastic 60, the terminal 3 is a part of the lead frame, which is made of C7025 series copper metal, the terminal 3 has a contact 3A, an extension 3C and a die pad 3P, the extension part 3C is arranged adjacent to the contact 3A and can be electrically connected, the contact 3A has an upper surface 31, a lower surface 32 and a side 33, and the extension 3C has an upper surface 31, a lower surface 3C2 and a side 33, wherein , the top surface 31 of the contact 3A and the extension 3C are flush, according to the design criteria: the minimum thickness Ta of the contact 3A is 127 microns (μm), the minimum width W of the contact 3A is 200 microns, and the two contacts The minimum gap S of 3A is 150 microns, and the minimum thickness Tc of the extension 3C is half of the thickness Ta of the contact 3A, that is, 64 microns, so that the lower surface 32 of the contact 3A protrudes from the lower surface 3C2 of the extension 3C, and makes The region 3C2 of the lower surface corresponding to the bonding region 3S is suspended, and the region about 200 microns from the end of the upper surface 31 of the extension portion 3C is the region 3S for the bonding of the conductive member 18, and the minimum thickness T6 of the plastic 60 is known is 200 microns; the chip 20 has a bonding pad 24 on its upper surface 21 and is bonded to the chip seat 3P by an adhesive 40; the conductive member 18 is implemented as a conductive wire, and is connected to the chip 20 with the bonding pads 24 and 3P respectively. The upper surface 31 of the point 3A is electrically connected, so that the chip 20 and the contact point 3A are electrically connected; the plastic 60 is an insulator that is joined to the terminal point 3 and covers the chip 20 and the conductive member 18, and makes the contact point 3A and the lower part of the chip seat 3P. The surface 32 is exposed outside the package body 1A; in addition to the need for high quality and low cost, electronic devices are also required to be thinner and smaller in size. After years of development, the package body 1A is no longer able to meet the above requirements by means of a framework. The description is as follows : 1) It is difficult to reduce the thickness: As shown in FIG. 7B , the thickness of the package body 1A is formed by the superposition of the thicknesses Ta and T6 of the contact 3A and the plastic 60 , so that the thickness Ta of the package body 1A cannot be minimized due to the contact 3A. As shown in FIG. 7C , it is The cross-sectional view of reducing the thickness Ta of the contact 3A to 30 μm in FIG. 7B , the area where the side edge 33 of the contact 3A and the plastic 60 are joined is significantly reduced. When the tin Tn is joined to the contact 3A and pulled by an external force, the plastic 60 is connected to the contact. The joint of the upper surface 31 and the side edge 33 of the point 3A is prone to peeling damage; 2) The extension has many restrictions: as shown in FIG. 7B, when the length L is too long, during the bonding process of the conductive member 18 and the extension 3C, The extension portion 3C will vibrate due to insufficient rigidity, resulting in damage to the conductive member 18 due to insufficient bonding strength. Accordingly, the length L needs to be less than 2,500 μm. As shown in FIG. 7C , when the thickness Ta of the contact 3A is reduced to 30 μm, and When the thickness Tc of the extension portion 3C is only 15 μm, the rigidity is too thin and the conductive member 18 cannot be joined, so that the terminal 3 cannot have the extension portion 3C; from the above, the package body 1A needs to be optimized to meet the requirements of the electronic device demand.

One of the ways to optimize the conventional package is to make the terminals have openings, which can accommodate materials such as plastic, and make the plastic embedded in the terminals, so that the terminals can be more firmly bonded to the plastic; another method The end point has an extension part, the extension part can not only increase the bonding area with the plastic, so that the end point can be more firmly bonded with the plastic, and when the conductive part is connected with the extension part, the lower surface of the extension part is not suspended. The conductive member can be more firmly connected with the extension portion.

3, 30: Endpoint

10, 15, 1A: Package body

18, 28: Conductive parts

20: Wafer

21, 31, 81, 91: upper surface

24: Connection pad

2a: copper pillar

2b: Tin metal

32, 3C2, 3E2, 62, 82, 92: lower surface

33: Side

34: Opening

38: Conductive layer

3A, 3B: Contacts

3C, 3E, 3Ea: Extensions

3P: Chip holder

3S: junction area

40: Viscose

60: plastic

68, 88, 98: Recess

70, 75: Line

80: carrier board

8C, 8D: Components

90, 95: insulating layer

CC: cutting line

D: depth

F: foreign object

L: length

PC: circuit board

S, Se, St: Clearance

Tn: Tin

T3, T6, Ta, Tc, Tp: Thickness

W: width

Y: opening

1A to 1C : top view, bottom view and cross-sectional view of the package body

Figures 2A to 2D: Cross-sectional views of terminals and carrier

FIGS. 3 to 3E1 , 4A to 4C and 5A to 5C : cross-sectional views of the package manufacturing process

6A to 6D: Cross-sectional views of the package body

7A to 7C : a top view and a cross-sectional view of a conventional package

The embodiment shown in FIG. 1A to FIG. 1C, FIG. 1A is a top view of the package body, and FIG. 1B is a diagram of 1A is a cross-sectional view of the cutting line CC, and FIG. 1C is a bottom view of the package body. The package body 10 includes: a terminal 30, a chip 20, a conductive member 18 and a plastic 60. The terminal 30 is a conductor and can be made of conductive materials such as copper or nickel. , or made of stacks of different materials such as nickel and copper, tin and copper, tin and nickel, nickel and gold, nickel and silver, nickel and palladium and gold, the terminal 30 has a contact 3B, and the terminal 30 is more It can have an extension 3E or an opening 34, the contact 3B has an upper surface 31, a lower surface 32 and a side 33, the thickness T3 is 30 microns, the width W is 200 microns, and the gap S between the two contacts 3B is 150 microns, the opening 34 can be set at any position of the contact 3B or the extension 3E, and can be designed into a circular, oval or polygonal shape to accommodate plastic 60 or materials such as tin or nickel, the extension The portion 3E has an upper surface 31, a lower surface 3E2 and a side edge 33, which are arranged on the periphery of the contact 3B and can be electrically connected, and the upper surface 31 and the lower surface 3E2 of the extension portion 3B are respectively connected with the upper surface 31 and the lower surface of the contact 3B. 32 is flush, in addition, the lower surfaces 32 and 3E2 of the contact 3B and the extension 3E are not easily oxidized copper metal, but are composed of metals that are not easily oxidized, such as: nickel or tin and other metals; the wafer 20, The upper surface 21 has connection pads 24, the chip 20 is bonded with the adhesive 40 and arranged on the periphery of the contact 3B, and the chip 20 can be arranged on the surface of the terminal 30 according to the requirements (refer to FIG. 4B); the conductive member 18 is implemented as a conductive Wires, which are in electrical communication with the connection pads 24 of the chip 20 and the upper surface 31 of the contact 3B, respectively, or are in electrical communication with the upper surface 31 of the contact 3B through the upper surface 31 of the extension 3E, so that the chip 20 and the contact 3B are electrically connected; plastic ( molding compound) 60, which is an insulator designed for wrapping the chip 20 and the conductive member 18. The plastic 60 is bonded to the terminal 30 and wraps the chip 20 and the conductive member 18, and makes the contact 3B and the lower surface 32 of the extension 3E. , 3E2, and the adhesive 40 are exposed outside the package body 10; from the above description, the package body 10 has the following advantages compared with the conventional package body 1A shown in FIGS. , the electronic components will be properly encapsulated in the casing to avoid electrical short circuits caused by foreign objects. After analysis, it is found that after the package body 10 is joined to the circuit board (PC_see FIG. 4C ) by means of conductive materials, the The conductive material can be implemented as tin Tn, and the conductive foreign matter F must be smaller than 150 microns to pass through the gap St between the two tin Tn, even if the foreign matter F can enter the periphery of the extension 3E, when the gap Se between the two extensions 3E When the thickness is larger than 150 microns, the risk of electrical short circuit caused by the two extensions 3E can be reduced. Or when the gap Se is less than 150 μm, the plastic 60 can have a concave portion (68_refer to FIG. 4C ) to increase the distance between the two extending portions 3E, and even make the distance larger than the gap Se between the two extending portions, or The periphery of the package body 10 is coated with insulating glue, so that the foreign matter F cannot pass through the two-tin Tn gap St. The above methods can reduce the risk of electrical short circuit caused by the extension 3E, and even make the risk approach zero and can be ignored. The extension portion 3E can be exposed outside the package body 10. In addition, when the conductive member 18 is bonded to the bonding region 3S of the extension portion 3E, the extension portion 3E can be bonded to the carrier board (80_, see FIG. 4B ), so that the conductive member 18 The lack of rigidity will not cause the damage of insufficient bonding strength, so that the extension part 3E is not limited by the length L; 2) The thickness of the terminal and the package body is thinner: the terminal 30 has the opening 34, so that a part of the plastic 60 can accommodate Placed in the opening 34, the plastic 60 is nailed into the end 30 like a nail, so that the contact 3B can be more firmly joined with the plastic 60, or the end 30 has an extension 3E, so that the end 30 can be Increase the bonding area and strength with the plastic 60, and make the contact 3B more firmly bonded with the plastic 60, so that the opening 34 or the extension 3E can make the tin Tn be pulled by external force, reducing the contact 3B and the plastic 60. The thickness T3 of the contact 3B can be less than 30 or 15 or 5 microns, which can be significantly thinner than the thickness Ta of the conventional contact 3A. It can be seen from the above description that the package body 10 can better meet the requirements of electronic devices.

The cross-sectional views of the embodiment shown in FIGS. 2A to 2D are endpoints developed based on the endpoints 30 in FIG. 1B , each endpoint 30 has at least a contact 3B, and the contact 3B has an upper surface 31 , a lower surface 32 and On the side 33, first, as shown in FIG. 2A, the end point 30 has an extension part 3E and an opening 34, the extension part 3E is arranged adjacent to the contact 3B and can be electrically connected, and the opening 34 is arranged in the extension part 3E , for accommodating plastic or tin or conductive parts (28_ refer to FIG. 3B), a carrier board 80, which has an upper surface 81 and a lower surface 82, the carrier board 80 can be composed of conductive materials such as copper, or epoxy resin It is composed of other insulating materials, or is composed of different layers of conductive and insulating materials stacked (refer to FIG. 2B to FIG. 2D ). In this embodiment, copper is used, and the lower surfaces 32 and 3E2 of the contact 3B and the extension 3E are connected to the carrier board 80 . The upper surface 81 is joined; then, as shown in FIG. 2B, the terminal 30 has an opening 34, and a conductor or plastic (60) is accommodated in the opening 34 and is joined to the contact 3B. The conductor can be implemented as tin Tn or conductive materials such as nickel or copper, and the surface of the plastic or conductor can be convex Out or flush or recessed on the upper surface 31 or the lower surface 32 of the contact 3B, a carrier board 80 has at least an upper surface 81, a lower surface 82 and a recess 88, the lower surface 32 of the contact 3B and the upper surface of the carrier board 80 81 is joined, and the concave portion 88 is used to accommodate conductors such as tin, Tn, etc. The carrier board 80 is composed of two conductive elements 8C stacked, and the conductive elements 8C can be made of copper or other conductive materials; then, as shown in FIG. 2C, the terminal 30 further has a conductive layer 38, the conductive layer 38 can be composed of suitable metals such as gold, nickel, silver or tin, or a stack of different conductive materials, such as nickel and gold, nickel and palladium and gold, palladium and gold, etc. , the conductive layer 38 can be disposed on the upper surface 31 or the lower surface 32 of the contact 3B or the extension (not shown), and make the conductive layer 38 become a part of the upper surface 31 or the lower surface of the contact 3B or the extension, conductive The layer 38 has the effect of protecting the surface of the terminal 30 from being oxidized, or not being eroded by chemical solvents, or improving the quality of bonding with other conductors. The lower surface 32 is joined to the upper surface 81 of the carrier board 80, and the depth D of the recess 88 can be greater than 1 or 10 or 20 microns to accommodate insulating materials such as plastic or epoxy resin. The carrier board 80 is composed of conductive elements 8C and insulating materials. Then, as shown in FIG. 2D, the carrier board 80, which has an upper surface 81 and a lower surface 82, is composed of two conductive elements 8C, And an insulating element 8D is stacked, the terminal 30 has a contact 3B, an extension 3E and an insulating layer 90, wherein the lower surfaces 32 and 3E2 of the contact 3B and the extension 3E are joined to the upper surface 81 of the carrier board 80, The insulating layer 90 is implemented as epoxy resin or solder mask or other insulating material, which is disposed on the upper surface 81 of the carrier board 80 and is joined to the contact 3B and the extension 3E, and makes the contact 3B or the extension 3E A part of the upper surface 31 of the insulating layer 90 is not bonded to the insulating layer 90 for power supply connection, or at least one circuit (see FIG. 6C ) or insulating layer can be stacked on the upper surface 91 of the insulating layer 90, so that the terminal 30 has at least one circuit. The structure of the two-layer conductive layer; as shown in FIGS. 2A to 2D , the combination of the terminal 30 and the carrier 80 can be regarded as a component and can be produced, stored and used.

3A to 3D and 3A to 3E1 are cross-sectional views of the manufacturing process of the package. First, as shown in FIG. 3A, a terminal 30 and a carrier 80 are provided. The characteristics of the terminal 30 and the carrier 80 are provided. The features and symbols are the same as those of the terminal 30 in FIG. 2A , please refer to the description of FIG. 2A , and the terminal 30 may or may not have the extension 3E according to product requirements; then, as shown in FIG. 3B , the chip 20 and the conductive member 28 are provided first. , the upper surface 21 of the chip 20 has connection pads 24 and is arranged on the surface of the terminal 30, the conductive member 28 is implemented as a bump with tin metal as the main material, a part of which is accommodated in the opening 34, and is respectively connected with The connection pads 24 of the wafer 20 are electrically connected to the extension portion 3E, and are electrically connected to the upper surface 31 of the contact point 3B through the upper surface 31 of the extension portion 3E, so that the wafer 20 is electrically connected to the contact point 3B, and then the plastic 60 is placed on the carrier board 80 The surface 81, which is bonded to the terminal 30 and covers the chip 20 and the conductive member 28, in addition, the conductive member 28 can replace copper and tin metal as the main material of the copper bump (copper pillar bump_refer to FIG. 6A); then, As shown in FIG. 3C, the carrier board 80 is removed so that a part of the conductive member 28, the lower surface 32 of the contact 3B and the lower surface 3E2 of the extension 3E are exposed to the atmosphere. At this point, the package body 10 has been formed. The plastic 60 is arranged side by side with the contact 3B and the extension 3E, and the thickness of the contact 3B and the extension 3E can be ignored, so that the thickness of the package body 10 is the thickness of the plastic 60; then, as shown in FIG. 3D, according to product requirements , an insulating layer 90 implemented as solder resist ink or other insulating material can be provided, which is bonded to the lower surface 62 of the plastic 60, and at least the lower surface 32 of the contact 3B can be exposed to the atmosphere for external electrical connection. The layer 90 can make the contact 3B and the extension 3E more firmly bonded to the plastic 60, and can prevent the extension 3E from causing electrical short-circuit damage; then, as shown in FIG. 3C1, according to product requirements, the step of FIG. 3B is completed. , and when the upper surface 81 of the carrier board 80 is implemented as a conductive element (8C_refer to FIG. 2B ), a part of the carrier board 80 is removed, so that the unremoved carrier board 80 is converted into a circuit 70, and the circuit 70 can be connected with Contact 3B is electrically connected or not; then, as shown in FIG. 3D1, an insulating layer 90 implemented as solder mask ink or epoxy resin or other insulating material is provided, the insulating layer 90 is provided on the lower surface 62 of the plastic 60 and is connected to the lower surface 62 of the plastic 60. The circuit 70 is bonded, so that a part of the circuit 70 is not covered by the insulating layer 90, which can be used for tin bonding or external electrical connection. At this point, the package body 15 has been formed; then, as shown in FIG. The lower surface 92 of the insulating layer 90 is further stacked with at least one second circuit 75 or a second insulating layer 95 , so that the terminal 30 has a multi-layer circuit structure.

As shown in FIG. 4A to FIG. 4C, it is a cross-sectional view of the package manufacturing process. First, as shown in FIG. 4A~FIG. 4C As shown in FIG. 4A, a terminal 30 and a carrier 80 are provided. The carrier 80 is composed of a stack of conductive elements 8C and insulating elements 8D, and has an upper surface 81, a lower surface 82 and a recess 88, wherein the recess 88 is located on the upper side The surface 81 has a depth D between the bottom of the recess 88 and the upper surface 81, and the element 8D can be replaced with an element 8C. The end point 30 has a contact 3B, an extension 3E and a wafer holder 3P, and has an upper surface 31 respectively. and the lower surfaces 32, 3E2, the lower surfaces 32, 3E2 are implemented with nickel or tin, and are respectively connected with the upper surface 81 of the carrier board 80, an extension 3E is adjacent to the contact 3B and can be electrically connected, and the other is connected The point (3B_ is not shown) is disposed adjacent to the extension portion 3Ea and can be electrically connected. The contact 3B or the upper surface 31 of the extension portion 3Ea can be provided with a conductive layer 38, or the terminal 30 can be provided without the extension portion 3E as required. 3Ea; then, as shown in FIG. 4B , the chip 20 is provided first, and after the chip 20 is bonded to the chip seat 3P by the adhesive 40 , the conductive members 18 are respectively bonded to the connection pads 24 , the contacts 3B and the extension 3Ea of the chip 20 , so that the The chip 20 is in electrical communication with the contact 3B, and then, the plastic 60 is bonded to the terminal 30 and covers the chip 20 and the conductive member 18, and a part of the plastic 60 is accommodated in the recess 88 of the carrier plate 80; then, as shown in FIG. 4C , remove the carrier board 80, so far, the package body 10 has been formed, and the plastic 60 has a recess 68, the depth of the recess 68 can be greater than 1 or 10 or 20 microns, so that the lower surface 62 of the plastic 60 protrudes from the contact The lower surface 32 of 3B, the lower surface 3E2 of the extension part 3E and the lower surface 32 of the wafer seat 39, and the lower surfaces 32 and 3E2 of the contact 3B, the extension part 3E and the wafer seat 3P are exposed at the bottom of the recessed part 68; The effects are described as follows: 1) Reduce the risk of electrical short circuit: after the package body 10 is joined to the terminal of the circuit board PC by the tin Tn, a part of the tin Tn is accommodated in the concave portion 68, so that the gap between the package body 10 and the circuit board PC is reduced. The thickness Tp is reduced, thereby, in addition to making it possible to pass through the gap between the two tin Tn (St_ refer to FIG. 1C ), the foreign matter F reaching the periphery of the extension parts 3E, 3Ea is smaller and less, and the concave part can be used. The depth of 68 increases the distance between the two extension parts 3E, 3Ea, and the distance can even be larger than the gap (St), accordingly, the risk of electrical short circuit between the two extension parts 3E, 3Ea caused by the foreign object F will be lower, and then This risk can be ignored; 2) reduce the risk of electrical disconnection: since a part of the tin Tn is accommodated in the concave portion 68 of the plastic 60, the tin Tn is embedded in the plastic 60, and can be more firmly bonded to the contact 3B, when the tin Tn receives When the external force pulls left and right, the pulling of the contact 3B by the external force can be reduced, and the distance between the contact 3B and the plastic 60 can be reduced. 3) The thinnest package thickness: the contact 3B and the extension parts 3E, 3Ea are exposed at the bottom of the recess 68 by virtue of the feature that the contact 3B is exposed at the bottom of the recess 68, so that the contact 3B and the extension parts 3E, 3Ea are arranged side by side with the plastic 60, and the thickness (T3) of the components such as the contact 3B can be ignored, so that the thickness of the package body 10 is only composed of the thickness T6 of the plastic 60, which is the thinnest known so far. The thickness is 200 microns; 4) Reduce the amount of conductive material: increase the depth of the concave portion 68, or do not have the chip seat 3P, or make the adhesive 40 and the bottom of the concave portion 88 of the carrier 80 join, so that the adhesive 40 is connected to the lower surface 62 of the plastic 60 By being flush, the contacts 3B and the extension portions 3Ea are brought closer to the connection pads 24 of the chip 20 , which can reduce the amount and cost of the length of the conductive member 18 and improve the production efficiency.

As shown in FIGS. 5A to 5C , which are cross-sectional views of the package fabrication process, first, as shown in FIG. 5A , the terminals 30 and the carrier 80 are provided, and the carrier 80 is composed of a stack of conductive elements 8C and insulating elements 8D , and has an upper surface 81, a lower surface 82 and a recess 88, wherein the recess 88 is located on the upper surface 81, so that there is a depth D between the bottom of the recess 88 and the upper surface 81, and the endpoint 30 has a contact 3B and an extension 3E , and have an upper surface 31 and a lower surface 32, 3E2 respectively, the lower surface and the lower surface 32, 3E2 are implemented as nickel or tin, and are respectively connected with the upper surface 81 of the carrier board 80, at the same time, a contact 3B and the extension 3E are connected Next, as shown in FIG. 5B, the chip 20 is provided first, which is arranged on the surface of the terminal 30, and the conductive members 28 are respectively connected with the connection pads 24, the contacts 3B and the extension parts 3E of the chip 20, so that the chip 20 is in electrical communication with the contact 3B, then, the plastic 60 is bonded to the terminal 30 and covers the chip 20 and the conductive member 28, and a part of the plastic 60 is accommodated in the recess 88 of the carrier board 80; then, as shown in FIG. 5C, The carrier board 80 is removed, so far, the package body 10 has been formed, and the plastic 60 has a concave portion 68, the depth of the concave portion 68 can be greater than 1 or 10 or 20 microns, so that the lower surface 62 of the plastic 60 protrudes from the contact 3B , the lower surfaces 32, 3E2 of the extension 3E, and the lower surfaces 32, 3E2 of the contact 3B and the extension 3E are exposed at the bottom of the recess 68, and the width of the opening Y of the recess 68 is smaller than the width of the lower surface 32 of the contact 3B (W_refer to FIG. 1A ), or a part of the components 8C of the carrier board 80 can be accommodated in the recess 68 to engage with the lower surface 32 of the contact 3B; the plastic 60 recess 68 reduces the risk of peeling of the contact 3B, as follows: 1) When a conductive material is contained in the concave When the conductive material is pulled by external force, the opening Y of the concave portion 68 is smaller than the lower surface 32 of the contact 3B, so that the concave portion 68 has a trapezoidal shape, so that the conductive material can be more stable is accommodated in the concave portion 68 to engage with the contact 3B, and reduce the pulling of the contact 3B by external force, thereby reducing the risk of peeling between the contact 3B and the plastic 60; 2) No matter whether the concave portion 68 is trapezoidal or not, as long as a part of the When the lower surface 32 of the contact 3B is engaged with the plastic 60, the contact 3B is stuck in the plastic 60, which can reduce the risk of peeling caused by pulling by external force. For example, the thin film can be smaller than 7 or 3 or 1 micron, so that the material and manufacturing cost of the terminal 30 can be effectively reduced.

6A to FIG. 6B , FIG. 6A is a cross-sectional view of the package body, and FIG. 6B is a cross-sectional view of the package body after bonding with tin Tn. The package body 10 includes: terminals 30 , chips 20 , plastics 60 and conductive parts 28, the terminal 30 has a contact 3B and an opening 34, the contact 3B has an upper surface 31, a lower surface 32 and a side edge 33, and the opening 34 is arranged at the contact 3B; the wafer 20, the upper surface 21 has connection pads 24; The conductive member 28 is implemented as a copper bump, which has a copper pillar 2a and a tin metal 2b, the copper pillar 2a is bonded to the connection pad 24 of the chip 20, and the tin metal 2b is accommodated in the opening 34, but not connected to the terminal 30 bonding; according to requirements, the tin metal 2b can be electrically connected to the contact 3B (refer to FIG. 3C), or the terminal 30 can be made without the opening 34, so that the tin metal 2b can be connected with the upper surface 31 of the contact 3B, or can be opened The hole 34 has tin, so that the conductive member 28 may not have the tin metal 2b to reduce the cost; the plastic 60 is an insulator bonded to the terminal 30 and covers the chip 20 and the conductive member 28, and a part of the plastic 60 is accommodated in the opening In the hole 34, part of the conductive member 28 and the lower surface 32 of the contact 3B are exposed on the lower surface 62 of the plastic 60; as shown in FIG. 6B, a conductive material is bonded to the lower surface 32 of the contact 3B, and the conductive material can be implemented It is tin Tn, so that the tin Tn can be directly electrically connected with the conductive member 28, and the conductive member 28 is electrically connected with the contact 3B; the following advantages can be obtained from the above description; 1) The quality is better: the tin Tn is directly connected to the conductive member 28 The tin metal 2b is bonded, so that there is no interface of different metals between the conductive member 28 and the tin Tn, so that no intermetallic compound is generated, which can avoid electrical attenuation or damage caused by impedance changes; 2) Better bonding: tin Tn and The tin metal 2b of the conductive member 28 is joined, so that the tin Tn is nailed into the plastic 60 like a thumbtack, so that the contact 3B is more firmly joined with the plastic 60 and the tin Tn, which can reduce the pulling of the tin Tn Therefore, the thickness (T3) of the contact 3B can be made thinner, for example, less than 10 or 5 or 1 μm, and a thinner contact 3B can be used to The thickness of the package body 10 is reduced, and the effect of using less material and lower cost for the contacts 3B and the plastic 60 is achieved.

The embodiment shown in FIG. 6C is a cross-sectional view of the package body. The features and symbols of the chip 20 , the adhesive 40 , the plastic 60 and the conductive member 18 of the package body 10 are the same as those shown in FIG. 1B . Please refer to FIG. 1B for description. 30 not only has the contact 3B and the extension part 3E, but also has an insulating layer 90 and a line 70. The extension part 3E is arranged adjacent to the contact 3B and can be electrically connected, and its lower surfaces 32 and 3E2 are not easily oxidized copper. The insulating layer 90 is connected to the contact 3B and the extension 3E, and the lower surfaces 32 and 3E2 of the contact 3B and the extension 3E are exposed. At the bottom of the concave portion 98 of the insulator 90, the concave portion 98 is formed by the concave portion (88_refer to FIG. 2C) of the carrier board, and the insulator 90 can also not have the concave portion 98 according to requirements, and the circuit 70 is disposed on the upper surface 91 of the insulating layer 90. And it is electrically connected with the contact 3B, or a second insulating layer can be provided on the upper surface 91 of the insulating layer 90 and bonded with the circuit 70, so that a part of the circuit 70 is exposed outside the second insulating layer, and the wafer 20 is arranged on the surface of the terminal 30, The adhesive 40 is bonded to the terminal 30, and the conductive member 18 is electrically connected to the circuit 70, so that the chip 20 is electrically connected to the contact 3B. The plastic 60 is bonded to the terminal 30 and covers the chip 20 and the conductive member 18, and The lower surfaces 32 and 3E2 of the contact point 3B and the extension portion 3E are exposed outside the package body 10, so that the contact point 3B can be electrically connected to the outside; it can be seen from the above description that the insulating layer 90 and the line 70 are provided, so that the terminal 30 and the conventional two The circuit board structure of the layered circuit is the same, but it is not necessary to provide a solder mask (not shown) on the lower surface 92 of the insulating layer 90 as in the conventional circuit board to cover the lower surface 3E2 of the extension part 3E, so that the lower surface 3E2 The outside of the package body 10 is not exposed. Accordingly, the package body 10 does not need to be provided with a solder mask, thereby achieving the effects of reducing cost and reducing thickness.

The embodiments of the present invention merely illustrate the principles and effects of the present invention, but are not intended to limit the present invention. Anyone skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalents accomplished by those with ordinary knowledge in the technical field without departing from the disclosed spirit and technical idea of the present invention Modifications or changes should still be covered by the claims of the present invention.

10: Package body

20: Wafer

21, 31: upper surface

24: Connection pad

28: Conductive parts

2a: copper pillar

2b: Tin metal

30: Endpoint

32, 62: lower surface

33: Side

34: Opening

3B: Contact

60: plastic

Claims (23)

A terminal and a carrier board, characterized in that: The carrier plate has an upper surface, a lower surface and a recess, and the upper surface is composed of conductive elements, and the recess is located on the upper surface and has a depth; and The end point has a contact point, the contact point has an upper surface, a lower surface and a side edge, and the lower surface is joined to the upper surface of the carrier. According to the end point and the carrier board described in the first item of the patent application scope, the end point further has an extension portion, which has an upper surface, a lower surface and a side edge, wherein the lower surface of the contact point and the extension portion is made of a material that is not easily oxidized. It is composed of metal, the extension part is arranged adjacent to the contact point and can be electrically connected, and the lower surface is joined with the upper surface of the carrier board. According to the end point and the carrier plate as described in item 1 of the scope of the application, the end point has an opening, and the opening can be arranged at any position of the end point. A terminal and a carrier board, characterized in that: The carrier board has an upper surface and a lower surface, and the upper surface is composed of conductive elements; and The end point has a contact point and an opening, the contact point has an upper surface, a lower surface and a side edge, and the lower surface is joined to the upper surface of the carrier, and the opening hole is arranged at any position of the end point. According to the end point and the carrier board described in claim 4, the end point further has an extension portion, which has an upper surface, a lower surface and a side edge, wherein the lower surface of the contact point and the extension portion is made of a material that is not easily oxidized. It is composed of metal, the extension part is arranged adjacent to the contact point and can be electrically connected, and the lower surface is joined with the upper surface of the carrier board. A terminal and a carrier board, characterized in that: The carrier board has an upper surface and a lower surface, and the upper surface is composed of conductive elements; and The end point has a contact point and an extension part, and both the contact point and the extension part have an upper surface and a lower surface and the side, wherein the lower surfaces of the contacts and the extension parts are made of metal that is not easily oxidized, the extension parts are adjacent to the contacts and can be electrically connected, and each lower surface is joined to the upper surface of the carrier. According to the terminal and the carrier as described in item 6 of the scope of the patent application, the terminal further has an insulating layer, which has an upper surface and a lower surface, and is disposed on the upper surface of the carrier, and the insulating layer is joined to the contact and the extension portion, A part of the upper surface of the contact or extension is exposed outside the upper surface of the insulating layer. According to the terminal and the carrier as described in claim 7, the terminal further has a circuit, which is arranged on the upper surface of the insulating layer and is in electrical communication with the contact. An end point, which has a contact, an extension, an insulating layer and a circuit, and is characterized by: The contact has an upper surface, a lower surface and a side edge, wherein the lower surface is composed of a metal that is not easily oxidized; the extension part has an upper surface, a lower surface and a side edge, wherein the lower surface is composed of a metal that is not easily oxidized, and the extension part is arranged adjacent to the contact and can be electrically connected; The insulating layer has an upper surface and a lower surface, and the insulating layer is joined to the contacts and the extension parts, so that the lower surfaces of the contacts and the extension parts are exposed on the lower surface of the insulating layer, and part of the upper surfaces of the contacts or the extension parts are exposed on the upper surface of the insulating layer; and The circuit is arranged on the upper surface of the insulating layer and is in electrical communication with the contact point. As described in the end point of claim 9, the lower surface of the insulating layer has a concave portion, and the lower surfaces of the contact point and the extension portion are exposed at the bottom of the concave portion. An encapsulation body, comprising a terminal, a chip, a conductive member and a plastic, is characterized in that: the end point has a joint, and the joint has an upper surface, a lower surface and a side; The wafer has connection pads on the upper surface; the conductive member, the conductive member is engaged with the chip connection pad, and is in electrical communication with the upper surface of the contact point, so that the chip and the terminal point are electrically connected; and The plastic has a concave portion on the lower surface, and the plastic is joined to the terminal and covers the chip and the conductive member, The lower surface of the contact is exposed at the bottom of the plastic concave portion for external electrical connection, so that the lower surface of the plastic protrudes from the lower surface of the contact by a depth. According to the package described in claim 11, the end point further has an extension part, the extension part is arranged adjacent to the contact point and can be electrically connected, and has an upper surface, a lower surface and a side edge, wherein the contact point and The lower surface of the extension part is made of metal that is not easily oxidized, and the lower surface is exposed at the bottom of the plastic recess. For the package described in item 11 of the scope of the patent application, the end points are further provided with openings, and the openings are arranged at any positions of the end points for accommodating a part of plastic or tin metal and other materials. According to the package described in claim 13, a part of the conductive member is accommodated in the opening and is not connected to the terminal, and the package further has a conductive material, and the conductive material is connected to the contact or the extension portion. The lower surface of the contactor is engaged with the conductive member accommodated in the opening, so that the conductive member is electrically communicated with the contact point. According to the package described in claim 11, the width of the opening of the plastic recess is smaller than the width of the lower surface of the contact. The package body described in claim 11, wherein a portion of the lower surface of the contact is bonded to plastic. An encapsulation body, comprising a terminal, a chip, a conductive member and a plastic, is characterized in that: The end point has a contact point and an opening, the contact point has an upper surface, a lower surface and a side edge, and the opening hole is arranged at any position of the end point to accommodate materials such as plastic or tin metal; The wafer has connection pads on the upper surface; the conductive member, which is engaged with the die attach pad and is in electrical communication with the upper surface of the contact, so that the die is in electrical communication with the terminal; and The plastic is bonded to the terminal and covers the chip and the conductive member, and the lower surface of the contact is exposed to the plastic for external electrical communication. According to the package described in claim 17, the end point further has an extension portion, the extension portion is disposed adjacent to the contact point and can be electrically connected, and has an upper surface, a lower surface and a side edge, wherein the contact point and The lower surface of the extension part is made of metal that is not easily oxidized, and the lower surface is exposed to the outside of the plastic. According to the package body described in claim 17, a part of the conductive member is accommodated in the opening and is not connected to the terminal, and the package body further has a conductive material, and the conductive material is connected to the contact point or the extension part. The lower surface of the contactor is engaged with the conductive member accommodated in the opening, so that the conductive member is electrically communicated with the contact point. A package body has a chip, a conductive member, a terminal and a plastic, and is characterized by: The end point has a contact point and an extension part, the extension part is adjacent to the contact point and can be electrically connected, and each has an upper surface, a lower surface and a side, wherein the contact point and the lower surface of the extension part are not easily oxidized. metal composition; The wafer has connection pads on the upper surface; the conductive member, which is engaged with the die attach pad and is in electrical communication with the upper surface of the contact, so that the die is in electrical communication with the terminal; and The plastic is bonded to the terminal and covers the chip and the conductive member, and exposes the lower surface of the contact point and the extension part to the package body, so that the contact point can be electrically connected to the outside. According to the package described in item 20 of the scope of the patent application, the terminal is further provided with an insulating layer, which has an upper surface and a lower surface, and the insulating layer is joined to the contact and the extension, so that a part of the upper surface of the contact or the extension is exposed on the upper surface of the insulating layer, the lower surfaces of the contacts and the extension part are exposed on the lower surface of the insulating layer, and the chip is positioned on the upper surface of the insulating layer. According to the package described in claim 21, a lower surface of the insulating layer has a concave portion, and the lower surfaces of the contacts and the extension portion are exposed at the bottom of the concave portion. According to the package body described in the claim 21, the end point is further provided with a circuit, and the circuit is arranged on the upper surface of the insulating layer and is electrically connected with the contact point.

Images