TW202230381A - Operation method for a memory device - Google Patents

Operation method for a memory device Download PDF

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TW202230381A
TW202230381A TW110102308A TW110102308A TW202230381A TW 202230381 A TW202230381 A TW 202230381A TW 110102308 A TW110102308 A TW 110102308A TW 110102308 A TW110102308 A TW 110102308A TW 202230381 A TW202230381 A TW 202230381A
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word line
selected word
voltage
line voltage
adjacent
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TW110102308A
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Chinese (zh)
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鄭致杰
呂君章
蔡文哲
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旺宏電子股份有限公司
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Abstract

An operation method for a memory device is provided. The operation method includes: increasing an adjacent word line voltage to a first adjacent word line voltage during a pre-turn on period; and increasing the adjacent word line voltage from the first adjacent word line voltage to a second adjacent word line voltage after the pre-turn on period is finished; wherein the first adjacent word line voltage is lower than the second adjacent word line voltage; the adjacent word line voltage is applied to at least one adjacent word line, and the at least one adjacent word line is adjacent to a selected word line.

Description

記憶體裝置之操作方法How to operate a memory device

本發明是有關於一種記憶體裝置之操作方法,特別是有關於一種記憶體裝置之讀取操作方法。The present invention relates to an operation method of a memory device, in particular, to a read operation method of the memory device.

對於三維(3D)記憶體裝置而言,在對被選字元線很多次讀取周期後(例如100K讀取周期後),該被選字元線的相鄰字元線可能會遇到讀取干擾(read disturbance)的問題。For three-dimensional (3D) memory devices, after many read cycles of a selected word line (eg, after 100K read cycles), adjacent word lines of the selected word line may encounter read Take the problem of read disturbance.

經由分析後可得知,在該目標字元線之預導通(pre-turn-on)期間被關閉時,如果該目標字元線的通過電壓(pass voltage,Vpass)低於該目標字元線之臨界值的話,將會發生向下耦合效應(down-coupling effect)。這將會在該目標字元線與其相鄰字元線之間很大造成通道電位差異(channel potential difference),且在其相鄰字元線造成很高的垂直電場(vertical electronic field)。導致熱載子注入(hot carrier injection)更容易發生,進而造成讀取干擾。After analysis, it can be known that when the pre-turn-on period of the target word line is turned off, if the pass voltage (Vpass) of the target word line is lower than the target word line If the critical value is exceeded, the down-coupling effect will occur. This will cause a large channel potential difference between the target word line and its neighboring word lines, and a high vertical electronic field on its neighboring word lines. As a result, hot carrier injection is more likely to occur, which in turn causes read disturb.

根據本案一例,提出一種記憶體裝置的操作方法,包括:在一預導通期間,一相鄰字元線電壓上升至一第一相鄰字元線電壓;以及在該預導通期間結束後,該相鄰字元線電壓從該第一相鄰字元線電壓上升至一第二相鄰字元線電壓。該第一相鄰字元線電壓低於該第二相鄰字元線電壓。該相鄰字元線電壓施加到至少一相鄰字元線,該至少一相鄰字元線係相鄰於一被選字元線。According to an example of the present application, an operation method of a memory device is proposed, which includes: during a pre-on period, the voltage of an adjacent word line rises to a voltage of a first adjacent word line; and after the pre-on period ends, the The adjacent word line voltage rises from the first adjacent word line voltage to a second adjacent word line voltage. The first adjacent word line voltage is lower than the second adjacent word line voltage. The adjacent word line voltage is applied to at least one adjacent word line that is adjacent to a selected word line.

根據本案另一例,提出一種記憶體裝置的操作方法,包括:在一預導通期間內,一被選字元線電壓上升到一第一被選字元線電壓,以及該被選字元線電壓從該第一被選字元線電壓以多階下降,在多階下降時,階數多於2階。According to another example of the present application, an operation method of a memory device is proposed, including: during a pre-on period, a voltage of a selected word line rises to a voltage of a first selected word line, and the voltage of the selected word line The voltage from the first selected word line drops in multiple steps, and when the voltage drops in multiple steps, the number of steps is more than two.

根據本案又一例,提出一種記憶體裝置的操作方法,包括:在一預導通期間,一被選字元線電壓上升至一第一被選字元線電壓;以及從一第一時序至一第二時序,該被選字元線電壓從該第一被選字元線電壓以一平滑曲線下降。According to yet another example of the present application, an operation method of a memory device is proposed, including: during a pre-on period, a selected word line voltage rises to a first selected word line voltage; and from a first timing to a In the second time sequence, the voltage of the selected word line decreases with a smooth curve from the voltage of the first selected word line.

為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下:In order to have a better understanding of the above-mentioned and other aspects of the present invention, the following specific examples are given and described in detail in conjunction with the accompanying drawings as follows:

本說明書的技術用語係參照本技術領域之習慣用語,如本說明書對部分用語有加以說明或定義,該部分用語之解釋係以本說明書之說明或定義為準。本揭露之各個實施例分別具有一或多個技術特徵。在可能實施的前提下,本技術領域具有通常知識者可選擇性地實施任一實施例中部分或全部的技術特徵,或者選擇性地將這些實施例中部分或全部的技術特徵加以組合。The technical terms in this specification refer to the common terms in the technical field. If some terms are described or defined in this description, the interpretations of these terms are subject to the descriptions or definitions in this description. Each embodiment of the present disclosure has one or more technical features. Under the premise of possible implementation, those skilled in the art can selectively implement some or all of the technical features in any embodiment, or selectively combine some or all of the technical features in these embodiments.

請參照第1圖,其繪示根據本案一實施例的記憶體裝置的功能方塊圖。記憶體裝置100包括:控制器110與記憶體陣列120。控制器110耦接至記憶體陣列120。控制器110控制記憶體陣列120的操作,例如讀取操作等。Please refer to FIG. 1, which shows a functional block diagram of a memory device according to an embodiment of the present application. The memory device 100 includes a controller 110 and a memory array 120 . The controller 110 is coupled to the memory array 120 . The controller 110 controls operations of the memory array 120, such as read operations and the like.

第2圖顯示本案一實施例的記憶體陣列120的三維(3D)電路圖。記憶體陣列120包括:複數條串選擇線(SSL)(SSL0_0~SSL2_3)、複數條冗餘字元線(DWLT1、DWLT0、DWLB1、DWLB0)、複數條字元線(WL0~WLN-1,N為正整數)、複數條位元線(BL0~BL3)、複數條整體選擇線(GSL0~GSL3)與複數個記憶體晶胞。當知,第2圖乃是示範例,本案並不受限於此。FIG. 2 shows a three-dimensional (3D) circuit diagram of the memory array 120 according to an embodiment of the present invention. The memory array 120 includes: a plurality of string select lines (SSL) (SSL0_0~SSL2_3), a plurality of redundant word lines (DWLT1, DWLT0, DWLB1, DWLB0), a plurality of word lines (WL0~WLN-1, N is a positive integer), a plurality of bit lines (BL0~BL3), a plurality of global select lines (GSL0~GSL3), and a plurality of memory cells. It should be known that Figure 2 is an example, and this case is not limited to this.

通常而言,記憶體陣列120會包括多個記憶體方塊(memory block)。各記憶體方塊包括,舉例但不受限於,4個子方塊(sub-block)。以第2圖而言,該些子方塊SB0~SB3可分別被該些串選擇線SSL0_0~SSL2_3與該些整體選擇線GSL0~GSL3所獨立選擇。Generally speaking, the memory array 120 includes a plurality of memory blocks. Each memory block includes, by way of example and not limitation, 4 sub-blocks. As shown in FIG. 2, the sub-blocks SB0-SB3 can be independently selected by the string selection lines SSL0_0-SSL2_3 and the global selection lines GSL0-GSL3, respectively.

第3圖顯示本案第一實施例的記憶體裝置的讀取操作波形圖。VBL代表位元線電壓;VSWL代表被選字元線電壓;VUWL代表未選字元線電壓;VAWL代表相鄰字元線電壓;VSSL代表串選擇線電壓;以及VGSL代表整體選擇線電壓。在底下說明中,以字元線WLn(n為整數,介於0~N-1之間)為「被選字元線(目標字元線)」,而相鄰於被選字元線WLn的字元線WLn+1與WLn-1則被稱為「相鄰字元線」。被選字元線電壓VSWL施加至被選字元線,而相鄰字元線電壓VAWL則施加至相鄰字元線。FIG. 3 shows a waveform diagram of a read operation of the memory device according to the first embodiment of the present application. VBL is the bit line voltage; VSWL is the selected word line voltage; VUWL is the unselected word line voltage; VAWL is the adjacent word line voltage; VSSL is the string select line voltage; and VGSL is the global select line voltage. In the following description, the word line WLn (n is an integer between 0 and N-1) is used as the "selected word line (target word line)", and is adjacent to the selected word line WLn The word lines WLn+1 and WLn-1 are called "adjacent word lines". The selected word line voltage VSWL is applied to the selected word line, and the adjacent word line voltage VAWL is applied to the adjacent word line.

在本案第一實施例中,在預導通期間,位元線電壓VBL處於低電壓(亦可稱為參考電壓)(例如但不受限於,0V),而在讀取期間,位元線電壓VBL轉態至高電壓(T34),且在讀取期間結束時(T37),位元線電壓VBL轉態至低電壓。In the first embodiment of the present application, during the pre-on period, the bit line voltage VBL is at a low voltage (also referred to as a reference voltage) (such as, but not limited to, 0V), and during the read period, the bit line voltage VBL transitions to a high voltage (T34), and at the end of the read period (T37), the bit line voltage VBL transitions to a low voltage.

在本案第一實施例中,在預導通期間,被選字元線電壓VSWL在時序T31上升至第一被選字元線電壓VSWL1且在時序T32下降。在讀取期間,被選字元線電壓VSWL具有多階電壓(亦可稱為多階增加電壓):第一階電壓(亦即第二被選字元線電壓VSWL2),係從低電壓在時序T34上升而得;以及第二階電壓(亦即第三被選字元線電壓VSWL3)從第一階電壓(亦即第二被選字元線電壓VSWL2)在時序T35上升而得。在時序T36時,被選字元線電壓VSWL從第三被選字元線電壓VSWL3上升至第一被選字元線電壓VSWL1。在讀取期間結束時,被選字元線電壓VSWL轉態至低電壓(時序T37)。第二被選字元線電壓VSWL2與第三被選字元線電壓VSWL3乃是讀取電壓。In the first embodiment of the present invention, during the pre-on period, the selected word line voltage VSWL rises to the first selected word line voltage VSWL1 at the timing T31 and falls at the timing T32. During reading, the selected word line voltage VSWL has multi-level voltages (also called multi-level increasing voltages): the first level voltage (ie the second selected word line voltage VSWL2) is and the second-level voltage (ie, the third selected word line voltage VSWL3 ) rises from the first-level voltage (ie, the second selected word line voltage VSWL2 ) at the timing T35 . At timing T36, the selected word line voltage VSWL rises from the third selected word line voltage VSWL3 to the first selected word line voltage VSWL1. At the end of the read period, the selected word line voltage VSWL transitions to a low voltage (timing T37). The second selected word line voltage VSWL2 and the third selected word line voltage VSWL3 are read voltages.

在本案第一實施例中,在預導通期間,未選字元線電壓VUWL在時序T31上升;在讀取期間結束時,未選字元線電壓VUWL轉態至低電壓。In the first embodiment of the present application, during the pre-on period, the unselected word line voltage VUWL rises at time sequence T31; when the read period ends, the unselected word line voltage VUWL transitions to a low voltage.

在本案第一實施例中,在預導通期間,相鄰字元線電壓VAWL在時序T31上升至第一相鄰字元線電壓VAWL1。在預導通期間結束後,相鄰字元線電壓VAWL在時序T33從第一相鄰字元線電壓VAWL1上升至第二相鄰字元線電壓VAWL2。在讀取期間結束時,相鄰字元線電壓VAWL轉態至低電壓。第一相鄰字元線電壓VAWL1低於第二相鄰字元線電壓VAWL2;第二相鄰字元線電壓VAWL2則相同於未選字元線電壓VUWL。In the first embodiment of the present application, during the pre-on period, the adjacent word line voltage VAWL rises to the first adjacent word line voltage VAWL1 at the time sequence T31. After the pre-on period ends, the adjacent word line voltage VAWL rises from the first adjacent word line voltage VAWL1 to the second adjacent word line voltage VAWL2 at timing T33. At the end of the read period, the adjacent word line voltage VAWL transitions to a low voltage. The first adjacent word line voltage VAWL1 is lower than the second adjacent word line voltage VAWL2; the second adjacent word line voltage VAWL2 is the same as the unselected word line voltage VUWL.

在本案第一實施例中,在預導通期間,相鄰字元線的電壓(第一相鄰字元線電壓VAWL1)低於被選字元線的被選字元線電壓VSWL,可減少在預導通期間的相鄰字元線上的垂直電場。In the first embodiment of the present application, during the pre-on period, the voltage of the adjacent word line (the first adjacent word line voltage VAWL1 ) is lower than the selected word line voltage VSWL of the selected word line, which can reduce the Vertical electric field on adjacent word lines during pre-on.

在本案第一實施例中,讓相鄰字元線電壓VAWL上升至第二相鄰字元線電壓VAWL2的時序(T33)晚於預導通期間之結束,可減少在讀取期間的相鄰字元線上的水平電場。In the first embodiment of the present application, the timing ( T33 ) when the adjacent word line voltage VAWL rises to the second adjacent word line voltage VAWL2 is later than the end of the pre-on period, which can reduce the number of adjacent words in the read period. The horizontal electric field on the element line.

在本案第一實施例中,第一相鄰字元線電壓VAWL1的值,例如但不受限於,大於相鄰字元線上的記憶體晶胞的臨界電壓,可介於2V~5V之間。In the first embodiment of the present application, the value of the voltage VAWL1 of the first adjacent word line, for example, but not limited to, is greater than the threshold voltage of the memory cell on the adjacent word line, and may be between 2V and 5V .

在本案第一實施例中,第二相鄰字元線電壓VAWL2的值相關於通過電壓(Vpass)。例如,第二相鄰字元線電壓VAWL2的值,例如但不受限於,為足夠高的通過電壓(Vpass),可介於6V~9V(或6V~10V)之間。In the first embodiment of the present case, the value of the second adjacent word line voltage VAWL2 is related to the pass voltage (Vpass). For example, the value of the second adjacent word line voltage VAWL2, such as but not limited to, is a sufficiently high pass voltage (Vpass), which may be between 6V~9V (or 6V~10V).

在本案第一實施例中,在預導通期間,被選子方塊的串選擇線電壓VSSL(由曲線L31所標示)與未選子方塊的串選擇線電壓VSSL(由曲線L32所標示)在時序T31上升。而且,在預導通期間結束時,未選子方塊的串選擇線電壓VSSL(由曲線L32所標示)在時序T32下降。在讀取期間結束時,被選子方塊的串選擇線電壓VSSL(由曲線L31所標示)下降。在讀取期間內,未選子方塊的串選擇線電壓VSSL(由曲線L32所標示)則持續保持低電壓。In the first embodiment of the present case, during the pre-on period, the string selection line voltage VSSL (indicated by the curve L31 ) of the selected sub-block and the string selection line voltage VSSL (indicated by the curve L32 ) of the unselected sub-block are in the timing sequence T31 goes up. Also, at the end of the pre-on period, the string select line voltage VSSL (indicated by the curve L32 ) of the unselected sub-blocks drops at timing T32. At the end of the read period, the string select line voltage VSSL (indicated by curve L31 ) of the selected sub-block drops. During the read period, the string select line voltage VSSL (indicated by curve L32 ) of the unselected sub-blocks remains low.

在本案第一實施例中,在預導通期間,被選子方塊的整體選擇線電壓VGSL(由曲線L33所標示)與未選子方塊的整體選擇線電壓VGSL(由曲線L34所標示)在時序T31上升。而且,在預導通期間結束時,未選子方塊的整體選擇線電壓VGSL(由曲線L34所標示)在時序T32下降。在讀取期間結束時,被選子方塊的整體選擇線電壓VGSL(由曲線L33所標示)下降。在讀取期間內,未選子方塊的整體選擇線電壓VGSL(由曲線L34所標示)則持續保持低電壓。In the first embodiment of the present application, during the pre-on period, the overall selection line voltage VGSL of the selected sub-blocks (indicated by the curve L33 ) and the overall selection line voltage VGSL of the unselected sub-blocks (indicated by the curve L34 ) are in the timing sequence T31 goes up. Also, at the end of the pre-on period, the overall select line voltage VGSL of the unselected sub-blocks (indicated by curve L34 ) drops at timing T32. At the end of the read period, the overall select line voltage VGSL (indicated by curve L33 ) of the selected sub-block drops. During the reading period, the overall select line voltage VGSL (indicated by curve L34 ) of the unselected sub-blocks remains low.

第4圖顯示習知技術與本案第一實施例的水平電場與垂直電場比較圖。曲線L41代表在預導通期間結束時,於習知技術記憶體裝置中(未應用本案第一實施例的讀取操作),在被選字元線WLn與相鄰字元線WLn-1、WLn+1的通道與ONO(oxide-nitride-oxide,氧化物-氮化物-氧化物)之間的水平電場曲線圖。曲線L42代表在相鄰字元線電壓VAWL上升至第二相鄰字元線電壓VAWL2(時序T33)時,於習知技術記憶體裝置中(未應用本案第一實施例的讀取操作),在被選字元線WLn與相鄰字元線WLn-1、WLn+1的通道與ONO之間的水平電場曲線圖。FIG. 4 shows a comparison diagram of the horizontal electric field and the vertical electric field of the prior art and the first embodiment of the present application. Curve L41 represents at the end of the pre-on period, in the conventional memory device (the read operation of the first embodiment of the present application is not applied), the selected word line WLn and the adjacent word lines WLn-1, WLn Horizontal electric field plot between +1 channel and ONO (oxide-nitride-oxide). The curve L42 represents when the adjacent word line voltage VAWL rises to the second adjacent word line voltage VAWL2 (time sequence T33), in the conventional memory device (the read operation of the first embodiment of the present application is not applied), Graph of the horizontal electric field between the channel of the selected word line WLn and the adjacent word lines WLn-1, WLn+1 and ONO.

曲線L43代表在預導通期間結束時,於習知技術記憶體裝置中(未應用本案第一實施例的讀取操作),在被選字元線WLn與相鄰字元線WLn-1、WLn+1處的ONO與閘極之間的垂直電場曲線圖。曲線L44代表在相鄰字元線電壓VAWL上升至第二相鄰字元線電壓VAWL2(時序T33)時,於習知技術記憶體裝置中(未應用本案第一實施例的讀取操作),在被選字元線WLn與相鄰字元線WLn-1、WLn+1處的ONO與閘極之間的垂直電場曲線圖。Curve L43 represents at the end of the pre-on period, in the conventional memory device (the read operation of the first embodiment of the present application is not applied), between the selected word line WLn and the adjacent word lines WLn-1, WLn Plot of vertical electric field between ONO and gate at +1. Curve L44 represents when the adjacent word line voltage VAWL rises to the second adjacent word line voltage VAWL2 (time sequence T33), in the conventional memory device (the read operation of the first embodiment of the present application is not applied), Plot of vertical electric field between ONO and gate at selected word line WLn and adjacent word lines WLn-1, WLn+1.

曲線L45代表在預導通期間結束時,於本案第一實施例中,在被選字元線WLn與相鄰字元線WLn-1、WLn+1的通道與ONO之間的水平電場曲線圖。曲線L46代表在相鄰字元線電壓VAWL上升至第二相鄰字元線電壓VAWL2(時序T33)時,於本案第一實施例中,在被選字元線WLn與相鄰字元線WLn-1、WLn+1的通道與ONO之間的水平電場曲線圖。Curve L45 represents the horizontal electric field curve between the channel of the selected word line WLn and the adjacent word lines WLn-1, WLn+1 and ONO in the first embodiment of the present application at the end of the pre-on period. The curve L46 represents that when the adjacent word line voltage VAWL rises to the second adjacent word line voltage VAWL2 (time sequence T33), in the first embodiment of the present application, the selected word line WLn and the adjacent word line WLn -1. The horizontal electric field curve between the channel of WLn+1 and ONO.

曲線L47代表在預導通期間結束時,於本案第一實施例中,在被選字元線WLn與相鄰字元線WLn-1、WLn+1處的ONO與閘極之間的垂直電場曲線圖。曲線L48代表在相鄰字元線電壓VAWL上升至第二相鄰字元線電壓VAWL2(時序T33)時,於本案第一實施例中,在被選字元線WLn與相鄰字元線WLn-1、WLn+1處的ONO與閘極之間的垂直電場曲線圖。Curve L47 represents the vertical electric field curve between ONO and gate at the selected word line WLn and adjacent word lines WLn-1, WLn+1 in the first embodiment of the present case at the end of the pre-on period picture. The curve L48 represents that when the adjacent word line voltage VAWL rises to the second adjacent word line voltage VAWL2 (time sequence T33), in the first embodiment of the present application, the selected word line WLn and the adjacent word line WLn -1. The vertical electric field curve between the ONO and the gate at WLn+1.

比較曲線L43與曲線L47可知,本案第一實施例的讀取操作可以有效減少相鄰字元線的垂直電場,進而減少讀取干擾。Comparing the curve L43 and the curve L47, it can be seen that the read operation of the first embodiment of the present application can effectively reduce the vertical electric field of the adjacent word line, thereby reducing the read disturbance.

第5圖顯示習知技術與本案第一實施例的臨界電壓變化量對讀取次數的關係曲線圖。由第5圖可看出,本案第一實施例可以減少臨界電壓變化量,進而減少讀取干擾。FIG. 5 is a graph showing the relationship between the variation of the threshold voltage and the number of readings in the prior art and the first embodiment of the present application. It can be seen from FIG. 5 that the first embodiment of the present application can reduce the variation of the threshold voltage, thereby reducing the read disturbance.

第6A圖與第6B圖顯示本案第二實施例的記憶體裝置的兩種讀取操作波形圖。在第6A圖與第6B圖中,位元線電壓VBL、未選字元線電壓VUWL、串選擇線電壓VSSL與整體選擇線電壓VGSL的波形原則上相同或相似於第3圖的位元線電壓VBL、未選字元線電壓VUWL、串選擇線電壓VSSL與整體選擇線電壓VGSL的波形,故其細節在此省略。6A and 6B show waveforms of two read operations of the memory device according to the second embodiment of the present application. In FIGS. 6A and 6B , the waveforms of the bit line voltage VBL, the unselected word line voltage VUWL, the string select line voltage VSSL and the global select line voltage VGSL are in principle the same or similar to the bit lines in FIG. 3 . The waveforms of the voltage VBL, the unselected word line voltage VUWL, the string select line voltage VSSL and the overall select line voltage VGSL are omitted here.

請參考第6A圖。在本案第二實施例中,在預導通期間,被選字元線電壓VSWL在時序T601上升到第一被選字元線電壓VSWL601且在時序T602以多階電壓下降(亦可稱為多階降低電壓)。被選字元線電壓VSWL在時序T602從第一被選字元線電壓VSWL601下降至第二被選字元線電壓VSWL602,被選字元線電壓VSWL在時序T603從第二被選字元線電壓VSWL602下降至第三被選字元線電壓VSWL603,被選字元線電壓VSWL在時序T604從第三被選字元線電壓VSWL603下降至低電壓,被選字元線電壓VSWL在時序T605從低電壓上升至第一被選字元線電壓VSWL601。其中,時序603、604與605位於讀取期間內。在讀取期間結束時(T606),被選字元線電壓VSWL轉態至低電壓。其中,第二被選字元線電壓VSWL602與第三被選字元線電壓VSWL603亦可當成讀取電壓。Please refer to Figure 6A. In the second embodiment of the present application, during the pre-on period, the selected word line voltage VSWL rises to the first selected word line voltage VSWL601 at the time sequence T601 and drops with a multi-stage voltage at the time sequence T602 (also called multi-stage voltage). lower voltage). The selected word line voltage VSWL drops from the first selected word line voltage VSWL601 to the second selected word line voltage VSWL 602 at the time sequence T602, and the selected word line voltage VSWL decreases from the second selected word line voltage VSWL at the time sequence T603. The voltage VSWL602 drops to the third selected word line voltage VSWL603, the selected word line voltage VSWL drops from the third selected word line voltage VSWL603 to a low voltage at the time sequence T604, and the selected word line voltage VSWL drops from the third selected word line voltage VSWL603 to the low voltage at the time sequence T605. The low voltage rises to the first selected word line voltage VSWL601. The sequences 603, 604 and 605 are in the read period. At the end of the read period (T606), the selected word line voltage VSWL transitions to a low voltage. The second selected word line voltage VSWL602 and the third selected word line voltage VSWL603 can also be used as read voltages.

請參考第6A圖。在本案第二實施例中,在預導通期間開始時,相鄰字元線電壓VAWL上升且在讀取期間結束時下降。Please refer to Figure 6A. In the second embodiment of the present case, the adjacent word line voltage VAWL rises at the beginning of the pre-on period and falls at the end of the read period.

請參考第6B圖。在本案第二實施例中,在預導通期間,被選字元線電壓VSWL在時序T611上升到第一被選字元線電壓VSWL611且在時序T612以多階下降。被選字元線電壓VSWL在時序T612從第一被選字元線電壓VSWL611下降至第二被選字元線電壓VSWL612,被選字元線電壓VSWL在時序T613從第二被選字元線電壓VSWL612下降至第三被選字元線電壓VSWL613,被選字元線電壓VSWL在時序T614從第三被選字元線電壓VSWL613下降至低電壓。第6B圖的被選字元線電壓VSWL的多階下降乃是相似於第6A圖的被選字元線電壓VSWL的多階下降。Please refer to Figure 6B. In the second embodiment of the present application, during the pre-on period, the selected word line voltage VSWL rises to the first selected word line voltage VSWL611 at the time sequence T611 and decreases in multiple steps at the time sequence T612. The selected word line voltage VSWL drops from the first selected word line voltage VSWL611 to the second selected word line voltage VSWL612 at the time sequence T612, and the selected word line voltage VSWL decreases from the second selected word line voltage VSWL at the time sequence T613. The voltage VSWL612 drops to the third selected word line voltage VSWL613, and the selected word line voltage VSWL drops from the third selected word line voltage VSWL613 to a low voltage at timing T614. The multi-step drop of the selected word line voltage VSWL of FIG. 6B is similar to the multi-step drop of the selected word line voltage VSWL of FIG. 6A.

被選字元線電壓VSWL在時序T615從低電壓上升至第四被選字元線電壓VSWL614。被選字元線電壓VSWL在時序T616從第四被選字元線電壓VSWL614上升至第五被選字元線電壓VSWL615。被選字元線電壓VSWL在時序T617從第五被選字元線電壓VSWL615上升至第一被選字元線電壓VSWL611。第6B圖的被選字元線電壓VSWL的多階上升(在讀取期間)乃是相似於第3圖的被選字元線電壓VSWL的多階上升(在讀取期間)。The selected word line voltage VSWL rises from the low voltage to the fourth selected word line voltage VSWL 614 at timing T615. The selected word line voltage VSWL rises from the fourth selected word line voltage VSWL 614 to the fifth selected word line voltage VSWL 615 at timing T616. The selected word line voltage VSWL rises from the fifth selected word line voltage VSWL 615 to the first selected word line voltage VSWL 611 at timing T617. The multi-step rise of the selected word line voltage VSWL (during the read period) in FIG. 6B is similar to the multi-step rise of the selected word line voltage VSWL (during the read period) in FIG. 3 .

在讀取期間結束時(T618),被選字元線電壓VSWL轉態至低電壓。其中,第二被選字元線電壓VSWL612、第三被選字元線電壓VSWL613、第四被選字元線電壓VSWL614與第五被選字元線電壓VSWL615亦可當成讀取電壓。At the end of the read period (T618), the selected word line voltage VSWL transitions to a low voltage. The second selected word line voltage VSWL612, the third selected word line voltage VSWL613, the fourth selected word line voltage VSWL614 and the fifth selected word line voltage VSWL615 can also be used as read voltages.

第6B圖的相鄰字元線電壓VAWL波形相同或相似於第6A圖的相鄰字元線電壓VAWL波形,故其細節在此省略。The waveform of the adjacent word line voltage VAWL in FIG. 6B is the same as or similar to the waveform of the adjacent word line voltage VAWL in FIG. 6A, so its details are omitted here.

在本案第二實施例中,第一被選字元線電壓/VSWL611高於被選字元線WLn的複數個記憶體晶胞的最高臨界電壓,例如,第一被選字元線電壓VSWL601/VSWL611可為6V~10V之間。In the second embodiment of the present application, the first selected word line voltage /VSWL611 is higher than the highest threshold voltage of the plurality of memory cells of the selected word line WLn, for example, the first selected word line voltage VSWL601 / VSWL611 can be between 6V~10V.

在本案第二實施例中,在多階下降時,第二被選字元線電壓VSWL602/VSWL612低於第一被選字元線電壓VSWL601/VSWL611,第三被選字元線電壓VSWL603/ VSWL613低於第二被選字元線電壓VSWL602/VSWL612,其餘可依類推。In the second embodiment of the present case, during the multi-step drop, the second selected word line voltage VSWL602/VSWL612 is lower than the first selected word line voltage VSWL601/VSWL611, and the third selected word line voltage VSWL603/ VSWL613 It is lower than the second selected word line voltage VSWL602/VSWL612, and the rest can be deduced by analogy.

在本案第二實施例中,在多階下降時,階段至少要多於2階。In the second embodiment of the present case, during the multi-order descent, the stages are at least more than 2 stages.

第7圖顯示習知技術與本案第二實施例的水平電場與垂直電場比較圖。曲線L71代表在預導通期間結束時,於習知技術記憶體裝置中(未應用本案第二實施例的讀取操作),在被選字元線WLn與相鄰字元線WLn-1、WLn+1處的通道與ONO之間的水平電場曲線圖;曲線L72代表在時序T605/T615處,於習知技術記憶體裝置中(未應用本案第二實施例的讀取操作),在被選字元線WLn與相鄰字元線WLn-1、WLn+1處的通道與ONO之間的水平電場曲線圖。曲線L73代表在預導通期間結束時,於習知技術記憶體裝置中(未應用本案第二實施例的讀取操作),在被選字元線WLn與相鄰字元線WLn-1、WLn+1處的ONO與閘極之間的垂直電場曲線圖;曲線L74代表在時序T605/T615處,於習知技術記憶體裝置中(未應用本案第二實施例的讀取操作),在被選字元線WLn與相鄰字元線WLn-1、WLn+1處的ONO與閘極之間的垂直電場曲線圖。曲線L75代表在預導通期間結束時,於本案第二實施例記憶體裝置中,在被選字元線WLn與相鄰字元線WLn-1、WLn+1處的通道與ONO之間的水平電場曲線圖;曲線L76代表在時序T605/T615時,於本案第二實施例記憶體裝置中,在被選字元線WLn與相鄰字元線WLn-1、WLn+1處的通道與ONO之間的水平電場曲線圖。曲線L77代表在預導通期間結束時,於本案第二實施例記憶體裝置中,在被選字元線WLn與相鄰字元線WLn-1、WLn+1處的ONO與閘極之間的垂直電場曲線圖;曲線L78代表在時序T605/T615處,於本案第二實施例記憶體裝置中,在被選字元線WLn與相鄰字元線WLn-1、WLn+1處的ONO與閘極之間的垂直電場曲線圖。FIG. 7 shows a comparison diagram of the horizontal electric field and the vertical electric field between the prior art and the second embodiment of the present application. Curve L71 represents at the end of the pre-on period, in the conventional memory device (the read operation of the second embodiment of this case is not applied), the selected word line WLn and the adjacent word lines WLn-1, WLn A graph of the horizontal electric field between the channel at +1 and the ONO; the curve L72 represents at the time sequence T605/T615, in the prior art memory device (the read operation of the second embodiment of this case is not applied), when the selected Graph of the horizontal electric field between the channel and ONO at word line WLn and adjacent word lines WLn-1, WLn+1. Curve L73 represents at the end of the pre-on period, in the conventional memory device (the read operation of the second embodiment of the present application is not applied), the selected word line WLn and the adjacent word lines WLn-1, WLn The vertical electric field curve between the ONO and the gate at +1; the curve L74 represents at the time sequence T605/T615, in the conventional memory device (the read operation of the second embodiment of this case is not applied), when the Graph of vertical electric field between ONO and gate at selected word line WLn and adjacent word lines WLn-1, WLn+1. Curve L75 represents the level between the channel and ONO at the selected word line WLn and the adjacent word lines WLn-1, WLn+1 in the memory device of the second embodiment of the present application at the end of the pre-on period The electric field curve diagram; the curve L76 represents the channel and ONO at the selected word line WLn and the adjacent word lines WLn-1, WLn+1 in the memory device of the second embodiment of the present case at the time sequence T605/T615 The horizontal electric field curve between. Curve L77 represents at the end of the pre-on period, in the memory device of the second embodiment of the present application, between the ONO and the gate at the selected word line WLn and the adjacent word lines WLn-1 and WLn+1. The vertical electric field curve diagram; the curve L78 represents at the time sequence T605/T615, in the memory device of the second embodiment of this case, the ONO and ONO at the selected word line WLn and adjacent word lines WLn-1, WLn+1 Plot of vertical electric field between gates.

比較曲線L71與L75可知,本案第二實施例的讀取操作可以有效減少在被選字元線WLn的水平電場,進而減少讀取干擾。比較曲線L73與L77可知,本案第二實施例的讀取操作可以有效減少被選字元線WLn的垂直電場,進而減少讀取干擾。Comparing the curves L71 and L75, it can be seen that the read operation of the second embodiment of the present application can effectively reduce the horizontal electric field on the selected word line WLn, thereby reducing the read disturbance. Comparing the curves L73 and L77, it can be seen that the read operation of the second embodiment of the present application can effectively reduce the vertical electric field of the selected word line WLn, thereby reducing the read disturbance.

第8圖顯示習知技術與本案第二實施例的臨界電壓變化量對讀取次數的關係曲線圖。由第8圖可看出,本案第二實施例可以減少臨界電壓變化量,進而減少讀取干擾。FIG. 8 is a graph showing the relationship between the variation of the threshold voltage and the number of readings in the prior art and the second embodiment of the present application. It can be seen from FIG. 8 that the second embodiment of the present application can reduce the variation of the threshold voltage, thereby reducing the read disturbance.

第9圖顯示本案第三實施例的記憶體裝置的讀取操作波形圖。在第9圖中,位元線電壓VBL、未選字元線電壓VUWL、相鄰字元線VAWL、串選擇線電壓VSSL與整體選擇線電壓VGSL的波形原則上相同或相似於第6A圖或第6B圖的位元線電壓VBL、未選字元線電壓VUWL、相鄰字元線VAWL、串選擇線電壓VSSL與整體選擇線電壓VGSL的波形,故其細節在此省略。FIG. 9 shows a waveform diagram of a read operation of the memory device according to the third embodiment of the present application. In FIG. 9, the waveforms of the bit line voltage VBL, the unselected word line voltage VUWL, the adjacent word line VAWL, the string select line voltage VSSL and the overall select line voltage VGSL are in principle the same or similar to those shown in FIG. 6A or The waveforms of the bit line voltage VBL, the unselected word line voltage VUWL, the adjacent word line VAWL, the string select line voltage VSSL and the global select line voltage VGSL in FIG. 6B are omitted here.

在本案第三實施例中,在預導通期間,被選字元線電壓VSWL在時序T91上升至第一被選字元線電壓VSWL91。從時序T92至時序T93,被選字元線電壓VSWL從第一被選字元線電壓VSWL91以平滑曲線下降至低電壓。在本案一可能實施例中,平滑曲線例如但不受限於,為直線。In the third embodiment of the present application, during the pre-on period, the selected word line voltage VSWL rises to the first selected word line voltage VSWL91 at the time sequence T91. From the time sequence T92 to the time sequence T93, the selected word line voltage VSWL drops from the first selected word line voltage VSWL91 to a low voltage with a smooth curve. In a possible embodiment of the present application, the smooth curve is, for example, but not limited to, a straight line.

在本案第三實施例中,時序T92至時序T93之間的時間間隔大於1μs,例如,是介於1μs~10μs之間。In the third embodiment of the present application, the time interval between the time sequence T92 and the time sequence T93 is greater than 1 μs, for example, between 1 μs and 10 μs.

在本案第三實施例中,在讀取期間,被選字元線電壓VSWL有多階電壓:第一階電壓(亦即第二被選字元線電壓VSWL92),係從低電壓在時序T94上升;以及第二階電壓(亦即第三被選字元線電壓VSWL93)從第一階電壓(亦即第二被選字元線電壓VSWL92)在時序T95上升。在時序T96時,被選字元線電壓VSWL上升至第一被選字元線電壓VSWL91。在讀取期間結束時,被選字元線電壓VSWL轉態至低電壓(時序T97)。第二被選字元線電壓VSWL92與第三被選字元線電壓VSWL93乃是讀取電壓。In the third embodiment of the present application, during the reading period, the selected word line voltage VSWL has multiple levels of voltages: the first level voltage (ie, the second selected word line voltage VSWL92 ) is from a low voltage at time sequence T94 rising; and the second-level voltage (ie, the third selected word line voltage VSWL93 ) rises from the first-level voltage (ie, the second selected word line voltage VSWL92 ) at timing T95 . At timing T96, the selected word line voltage VSWL rises to the first selected word line voltage VSWL91. At the end of the read period, the selected word line voltage VSWL transitions to a low voltage (timing T97). The second selected word line voltage VSWL92 and the third selected word line voltage VSWL93 are read voltages.

第10圖顯示習知技術與本案第三實施例的水平電場與垂直電場比較圖。曲線L101代表在預導通期間結束時,於習知技術記憶體裝置中(未應用本案第三實施例的讀取操作),在被選字元線WLn與相鄰字元線WLn-1、WLn+1處的通道與ONO之間的水平電場曲線圖。曲線L102代表在預導通期間結束時,於習知技術記憶體裝置中(未應用本案第三實施例的讀取操作),在被選字元線WLn與相鄰字元線WLn-1、WLn+1處的ONO與閘極之間的垂直電場曲線圖。曲線L103代表在時序T93處,於本案第三實施例記憶體裝置中,在被選字元線WLn與相鄰字元線WLn-1、WLn+1處的通道與ONO之間的水平電場曲線圖。曲線L104代表在時序T93處,於本案第三實施例記憶體裝置中,在被選字元線WLn與相鄰字元線WLn-1、WLn+1處的ONO與閘極之間的垂直電場曲線圖。FIG. 10 shows a comparison diagram of the horizontal electric field and the vertical electric field of the prior art and the third embodiment of the present application. The curve L101 represents at the end of the pre-on period, in the conventional memory device (the read operation of the third embodiment of this case is not applied), the selected word line WLn and the adjacent word lines WLn-1, WLn Plot of the horizontal electric field between the channel at +1 and the ONO. The curve L102 represents at the end of the pre-on period, in the conventional memory device (the read operation of the third embodiment of this case is not applied), the selected word line WLn and the adjacent word lines WLn-1, WLn Plot of vertical electric field between ONO and gate at +1. The curve L103 represents the horizontal electric field curve between the channel and ONO at the selected word line WLn and the adjacent word lines WLn-1 and WLn+1 in the memory device of the third embodiment at the time sequence T93 picture. The curve L104 represents the vertical electric field between the ONO and the gate at the selected word line WLn and the adjacent word lines WLn-1 and WLn+1 in the memory device of the third embodiment of the present case at the time sequence T93 Graph.

比較這些曲線L101~L104可知,本案第三實施例的讀取操作可以有效減少被選字元線WLn的水平電場與垂直電場,進而減少讀取干擾。Comparing these curves L101 to L104, it can be seen that the read operation of the third embodiment of the present application can effectively reduce the horizontal electric field and the vertical electric field of the selected word line WLn, thereby reducing the read disturbance.

第11圖顯示習知技術與本案第三實施例的臨界電壓變化量對讀取次數的關係曲線圖。由第11圖可看出,本案第三實施例可以減少臨界電壓變化量,進而減少讀取干擾。FIG. 11 is a graph showing the relationship between the variation of the threshold voltage and the number of readings in the prior art and the third embodiment of the present application. It can be seen from FIG. 11 that the third embodiment of the present application can reduce the variation of the threshold voltage, thereby reducing the read disturbance.

上述該第一至第三實施例可以分別獨立實施,或者組合實施。亦即,第一與第二實施例可以組合實施;或者,第一與第三實施例可以組合實施。此皆在本案精神範圍內。The above-mentioned first to third embodiments may be implemented independently or in combination. That is, the first and second embodiments may be implemented in combination; alternatively, the first and third embodiments may be implemented in combination. This is all within the spirit of this case.

由上述說明可知,本案上述該些實施例可以有效減緩被選字元線的不正常讀取干擾。It can be seen from the above description that the above-mentioned embodiments of the present application can effectively reduce the abnormal read disturbance of the selected word line.

綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。To sum up, although the present invention has been disclosed by the above embodiments, it is not intended to limit the present invention. Those skilled in the art to which the present invention pertains can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the appended patent application.

100:記憶體裝置 110:控制器 120:記憶體陣列 SSL0_0~SSL2_3:串選擇線 DWLT1、DWLT0、DWLB1、DWLT1:冗餘字元線 WL0~WLN-1:字元線 BL0~BL3:位元線 GSL0~GSL3:整體選擇線 VBL:位元線電壓 VSWL:被選字元線電壓 VUWL:未選字元線電壓 VAWL:相鄰字元線電壓 VSSL:串選擇線電壓 VGSL:整體選擇線電壓 VSWL1:第一被選字元線電壓 VSWL2:第二被選字元線電壓 VSWL3:第三被選字元線電壓 VAWL1:第一相鄰字元線電壓 VAWL2:第二相鄰字元線電壓 T31~T37:時序 BL:位元線 SSL0~SSL2:串選擇線 GSL:整體選擇線 L31~L34、L41~L48:曲線 T601~T618:時序 VSWL601:第一被選字元線電壓 VSWL602:第二被選字元線電壓 VSWL603:第三被選字元線電壓 VSWL611:第一被選字元線電壓 VSWL612:第二被選字元線電壓 VSWL613:第三被選字元線電壓 VSWL614:第四被選字元線電壓 VSWL615:第五被選字元線電壓 L71~L78:曲線 T91~T97:時序 VSWL91:第一被選字元線電壓 VSWL92:第二被選字元線電壓 VSWL93:第三被選字元線電壓 L101~L104:曲線 100: Memory device 110: Controller 120: Memory array SSL0_0~SSL2_3: String selection line DWLT1, DWLT0, DWLB1, DWLT1: redundant word lines WL0~WLN-1: word line BL0~BL3: bit lines GSL0~GSL3: Overall selection line VBL: bit line voltage VSWL: selected word line voltage VUWL: Unselected word line voltage VAWL: Adjacent word line voltage VSSL: String Select Line Voltage VGSL: Overall Select Line Voltage VSWL1: The voltage of the first selected word line VSWL2: The second selected word line voltage VSWL3: The third selected word line voltage VAWL1: first adjacent word line voltage VAWL2: Second Adjacent Word Line Voltage T31~T37: Timing BL: bit line SSL0~SSL2: String selection line GSL: Overall Selection Line L31~L34, L41~L48: Curve T601~T618: Timing VSWL601: The voltage of the first selected word line VSWL602: The second selected word line voltage VSWL603: The third selected word line voltage VSWL611: The first selected word line voltage VSWL612: Second selected word line voltage VSWL613: The third selected word line voltage VSWL614: Fourth selected word line voltage VSWL615: Fifth selected word line voltage L71~L78: Curve T91~T97: Timing VSWL91: The voltage of the first selected word line VSWL92: The second selected word line voltage VSWL93: The third selected word line voltage L101~L104: Curve

第1圖繪示根據本案一實施例的記憶體裝置的功能方塊圖。 第2圖顯示本案一實施例的記憶體陣列的三維(3D)電路圖。 第3圖顯示本案第一實施例的記憶體裝置的讀取操作波形圖。 第4圖顯示習知技術與本案第一實施例的水平電場與垂直電場比較圖。 第5圖顯示習知技術與本案第一實施例的臨界電壓變化量對讀取次數的關係曲線圖。 第6A圖與第6B圖顯示本案第二實施例的記憶體裝置的兩種讀取操作波形圖。 第7圖顯示習知技術與本案第二實施例的水平電場與垂直電場比較圖。 第8圖顯示習知技術與本案第二實施例的臨界電壓變化量對讀取次數的關係曲線圖。 第9圖顯示本案第三實施例的記憶體裝置的讀取操作波形圖。 第10圖顯示習知技術與本案第三實施例的水平電場與垂直電場比較圖。 第11圖顯示習知技術與本案第三實施例的臨界電壓變化量對讀取次數的關係曲線圖。 FIG. 1 is a functional block diagram of a memory device according to an embodiment of the present invention. FIG. 2 shows a three-dimensional (3D) circuit diagram of a memory array according to an embodiment of the present application. FIG. 3 shows a waveform diagram of a read operation of the memory device according to the first embodiment of the present application. FIG. 4 shows a comparison diagram of the horizontal electric field and the vertical electric field of the prior art and the first embodiment of the present application. FIG. 5 is a graph showing the relationship between the variation of the threshold voltage and the number of readings in the prior art and the first embodiment of the present application. 6A and 6B show waveforms of two read operations of the memory device according to the second embodiment of the present application. FIG. 7 shows a comparison diagram of the horizontal electric field and the vertical electric field between the prior art and the second embodiment of the present application. FIG. 8 is a graph showing the relationship between the variation of the threshold voltage and the number of readings in the prior art and the second embodiment of the present application. FIG. 9 shows a waveform diagram of a read operation of the memory device according to the third embodiment of the present application. FIG. 10 shows a comparison diagram of the horizontal electric field and the vertical electric field of the prior art and the third embodiment of the present application. FIG. 11 is a graph showing the relationship between the variation of the threshold voltage and the number of readings in the prior art and the third embodiment of the present application.

VBL:位元線電壓 VBL: bit line voltage

VSWL:被選字元線電壓 VSWL: selected word line voltage

VUWL:未選字元線電壓 VUWL: Unselected word line voltage

VAWL:相鄰字元線電壓 VAWL: Adjacent word line voltage

VSSL:串選擇線電壓 VSSL: String Select Line Voltage

VGSL:整體選擇線電壓 VGSL: Overall Select Line Voltage

VSWL1:第一被選字元線電壓 VSWL1: The voltage of the first selected word line

VSWL2:第二被選字元線電壓 VSWL2: The second selected word line voltage

VSWL3:第三被選字元線電壓 VSWL3: The third selected word line voltage

VAWL1:第一相鄰字元線電壓 VAWL1: first adjacent word line voltage

VAWL2:第二相鄰字元線電壓 VAWL2: Second Adjacent Word Line Voltage

T31~T37:時序 T31~T37: Timing

L31~L34:曲線 L31~L34: Curve

BL:位元線 BL: bit line

SSL0~SSL2:串選擇線 SSL0~SSL2: String selection line

WL0~WLN-1:字元線 WL0~WLN-1: word line

DWLT1、DWLT0、DWLB1、DWLT1:冗餘字元線 DWLT1, DWLT0, DWLB1, DWLT1: redundant word lines

GSL:整體選擇線 GSL: Overall Selection Line

Claims (10)

一種記憶體裝置的操作方法,包括: 在一預導通期間,一相鄰字元線電壓上升至一第一相鄰字元線電壓;以及 在該預導通期間結束後,該相鄰字元線電壓從該第一相鄰字元線電壓上升至一第二相鄰字元線電壓; 其中,該第一相鄰字元線電壓低於該第二相鄰字元線電壓, 該相鄰字元線電壓施加到至少一相鄰字元線,該至少一相鄰字元線係相鄰於一被選字元線。 A method of operating a memory device, comprising: during a pre-on period, an adjacent word line voltage rises to a first adjacent word line voltage; and After the pre-on period ends, the adjacent word line voltage rises from the first adjacent word line voltage to a second adjacent word line voltage; wherein the voltage of the first adjacent word line is lower than the voltage of the second adjacent word line, The adjacent word line voltage is applied to at least one adjacent word line that is adjacent to a selected word line. 如請求項1所述之記憶體裝置的操作方法,其中, 在該預導通期間,該相鄰字元線低於該被選字元線的一被選字元線電壓。 The operating method of a memory device as claimed in claim 1, wherein, During the pre-on period, the adjacent word line is lower than a selected word line voltage of the selected word line. 如請求項1所述之記憶體裝置的操作方法,其中, 該第一相鄰字元線電壓大於該至少一相鄰字元線上的複數個記憶體晶胞的一臨界電壓;以及 該第二相鄰字元線電壓相關於一通過電壓。 The operating method of a memory device as claimed in claim 1, wherein, the first adjacent word line voltage is greater than a threshold voltage of a plurality of memory cells on the at least one adjacent word line; and The second adjacent word line voltage is related to a pass voltage. 如請求項1所述之記憶體裝置的操作方法,更包括: 在該預導通期間內,一被選字元線電壓上升到一第一被選字元線電壓,以及 該被選字元線電壓從該第一被選字元線電壓以多階下降,在多階下降時,階數多於2階。 The operation method of the memory device as claimed in claim 1, further comprising: During the pre-on period, a selected word line voltage rises to a first selected word line voltage, and The voltage of the selected word line drops from the voltage of the first selected word line in multiple steps. When the voltage of the selected word line drops in multiple steps, the number of steps is more than two. 如請求項1所述之記憶體裝置的操作方法,更包括: 在該預導通期間,一被選字元線電壓上升至一第一被選字元線電壓;以及 從一第一時序至一第二時序,該被選字元線電壓從該第一被選字元線電壓以一平滑曲線下降。 The operation method of the memory device as claimed in claim 1, further comprising: During the pre-on period, a selected word line voltage rises to a first selected word line voltage; and From a first time sequence to a second time sequence, the voltage of the selected word line decreases with a smooth curve from the voltage of the first selected word line. 一種記憶體裝置的操作方法,包括: 在一預導通期間內,一被選字元線電壓上升到一第一被選字元線電壓,以及 該被選字元線電壓從該第一被選字元線電壓以多階下降,在多階下降時,階數多於2階。 A method of operating a memory device, comprising: during a pre-on period, a selected word line voltage rises to a first selected word line voltage, and The voltage of the selected word line drops from the voltage of the first selected word line in multiple steps. When the voltage of the selected word line drops in multiple steps, the number of steps is more than two. 如請求項6所述之記憶體裝置的操作方法,其中, 在一讀取期間內,該被選字元線電壓從一第一被選字元線電壓下降至一第二被選字元線電壓;以及 在該讀取期間內,該被選字元線電壓從該第二被選字元線電壓下降至一第三被選字元線電壓, 該第二被選字元線電壓與該第三被選字元線電壓當成複數個讀取電壓。 The operating method of a memory device as claimed in claim 6, wherein, During a read period, the selected word line voltage drops from a first selected word line voltage to a second selected word line voltage; and During the read period, the selected word line voltage drops from the second selected word line voltage to a third selected word line voltage, The second selected word line voltage and the third selected word line voltage are used as a plurality of read voltages. 如請求項6所述之記憶體裝置的操作方法,其中,該第一被選字元線電壓高於一被選字元線的複數個記憶體晶胞的一最高臨界電壓。The operation method of the memory device of claim 6, wherein the voltage of the first selected word line is higher than a highest threshold voltage of a plurality of memory cells of a selected word line. 一種記憶體裝置的操作方法,包括: 在一預導通期間,一被選字元線電壓上升至一第一被選字元線電壓;以及 從一第一時序至一第二時序,該被選字元線電壓從該第一被選字元線電壓以一平滑曲線下降。 A method of operating a memory device, comprising: During a pre-on period, a selected word line voltage rises to a first selected word line voltage; and From a first time sequence to a second time sequence, the voltage of the selected word line decreases with a smooth curve from the voltage of the first selected word line. 如請求項9所述之記憶體裝置的操作方法,其中,該第一時序至該第二時序之間的一時間間隔大於一既定時間。The operating method of a memory device as claimed in claim 9, wherein a time interval between the first timing sequence and the second timing sequence is greater than a predetermined time.
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