TW202223163A - Electrolytic copper foil, negative electrode for lithium ion secondary cell, and lithium ion secondary cell - Google Patents

Electrolytic copper foil, negative electrode for lithium ion secondary cell, and lithium ion secondary cell Download PDF

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TW202223163A
TW202223163A TW110138342A TW110138342A TW202223163A TW 202223163 A TW202223163 A TW 202223163A TW 110138342 A TW110138342 A TW 110138342A TW 110138342 A TW110138342 A TW 110138342A TW 202223163 A TW202223163 A TW 202223163A
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copper foil
electrolytic copper
lithium ion
ion secondary
negative electrode
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菊池伸
高澤亮二
笠原正靖
中崎龍介
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日商古河電氣工業股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • C25D1/04Wires; Strips; Foils
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • H01M4/13Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • H01M4/64Carriers or collectors
    • H01M4/66Selection of materials
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

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Abstract

The present invention provides an electrolytic copper foil which is not susceptible to breaking. In this electrolytic copper foil, where t is the foil thickness (in units of [mu]m), VAV is the recess average volume (in units of [mu]m3), which is the average value of the volume of recesses formed in an electrolytic-deposition-completed surface, E is the elongation (in units of %) measured by pulling along a length direction, and the recess average volume VAV is measured using a white interference microscope, the foil thickness t is 10 to 20[mu]m, the product VAV*t of the recess average volume VAV and the foil thickness t is more than 0[mu]m4 and no more than 1000[mu]m4, and the quotient E/t of the elongation E divided by the foil thickness t is 0.9%/[mu]m to 1.8%/[mu]m.

Description

電解銅箔、鋰離子二次電池用負極、及鋰離子二次電池Electrolytic copper foil, negative electrode for lithium ion secondary battery, and lithium ion secondary battery

本發明關於一種電解銅箔、使用了該電解銅箔之鋰離子二次電池用負極、及具備該鋰離子二次電池用負極之鋰離子二次電池。The present invention relates to an electrolytic copper foil, a negative electrode for a lithium ion secondary battery using the electrolytic copper foil, and a lithium ion secondary battery including the negative electrode for a lithium ion secondary battery.

作為鋰離子二次電池的負極集電體,有使用銅箔的情況,由於在鋰離子二次電池的充放電時負極材料發生膨脹收縮,銅箔會有發生破斷的情況。又,密合的銅箔與負極材料在充放電時局部地剝離,且由於在膨脹收縮時的應力會集中於剝離部分,因此銅箔會有破斷的情況。 在專利文獻1、2中,揭示一種電解銅箔,其可使用作為鋰離子二次電池的負極集電體,並藉由控制表面粗糙度來提升與負極材料的密合性。在專利文獻3中,揭示一種抗撓性優異的二次電池用電解銅箔,其能夠耐受充放電時負極材料的膨脹收縮。在專利文獻4中,揭示一種製造性能優異的二次電池的技術,其使用了已藉由控制表面粗糙度等來控制鬆弛、皺紋及撕裂的銅箔。 近年來,鋰離子二次電池的研究持續進行,由於要求性能的進一步提升,因而要求一種在充放電時更加難以發生破斷的銅箔。在專利文獻1〜4中所揭示的電解銅箔,由於機械特性和與負極材料的密合性不充分,因此在鋰離子二次電池的充放電時會有破斷的可能性。 As the negative electrode current collector of the lithium ion secondary battery, copper foil is sometimes used, and the copper foil may be broken due to expansion and contraction of the negative electrode material during charge and discharge of the lithium ion secondary battery. In addition, the adhered copper foil and the negative electrode material are partially peeled off during charge and discharge, and since the stress during expansion and contraction is concentrated on the peeled portion, the copper foil may be broken. Patent Documents 1 and 2 disclose an electrolytic copper foil which can be used as a negative electrode current collector of a lithium ion secondary battery, and which improves adhesion to a negative electrode material by controlling the surface roughness. Patent Document 3 discloses an electrolytic copper foil for a secondary battery excellent in flexibility, which can withstand expansion and contraction of a negative electrode material during charge and discharge. Patent Document 4 discloses a technique for producing a secondary battery having excellent performance using a copper foil whose slack, wrinkles, and tearing have been controlled by controlling surface roughness and the like. In recent years, research on lithium ion secondary batteries has continued, and further improvement in performance has been demanded. Therefore, there has been demand for a copper foil that is more difficult to break during charge and discharge. The electrolytic copper foils disclosed in Patent Documents 1 to 4 have insufficient mechanical properties and adhesion to the negative electrode material, and therefore may be broken during charging and discharging of the lithium ion secondary battery.

[先前技術文獻] (專利文獻) 專利文獻1:日本專利公報第6587701號 專利文獻2:國際公開第2018/207786號 專利文獻3:日本專利公開公報2020年第502728號 專利文獻4:日本專利公開公報2020年第26563號 [Prior Art Literature] (patent literature) Patent Document 1: Japanese Patent Publication No. 6587701 Patent Document 2: International Publication No. 2018/207786 Patent Document 3: Japanese Patent Laid-Open Publication No. 502728 of 2020 Patent Document 4: Japanese Patent Laid-Open Publication No. 26563 of 2020

[發明所欲解決的問題] 本發明所欲解決的問題在於提供一種難以發生破斷的電解銅箔。又,本發明一併要解決的問題在於提供一種鋰離子二次電池用負極及鋰離子二次電池,其在充放電時負極集電體難以發生破斷。 [Problems to be Solved by Invention] The problem to be solved by the present invention is to provide an electrolytic copper foil that is difficult to break. In addition, the problem to be solved by the present invention is to provide a negative electrode for a lithium ion secondary battery and a lithium ion secondary battery in which the negative electrode current collector is less likely to be broken during charge and discharge.

[用以解決問題的技術手段] 關於本發明的一態樣的電解銅箔,其要旨為:當將箔厚設為t(μm)、將被形成在電解析出結束面上的凹部的體積的平均值也就是凹部平均體積設為VAV(μm 3)、將沿著長度方向拉伸而測得的拉伸率設為E(%),並使用白光干涉顯微鏡來測定凹部平均體積VAV時,箔厚t為10μm以上且20μm以下,凹部平均體積VAV與箔厚t的乘積也就是VAV×t為超過0μm 4且1000μm 4以下,將拉伸率E除以箔厚t而得的E/t為0.9%/μm以上且1.8%/μm以下。 [MEANS TO SOLVE THE PROBLEM] Regarding the electrolytic copper foil of one aspect of the present invention, the gist is: when the foil thickness is t (μm), the volume of the concave portion to be formed on the electrolytic desorption end surface is The average value, that is, the average volume of the concave portion is set to VAV (μm 3 ), the elongation rate measured by stretching in the longitudinal direction is set to E (%), and the average volume of the concave portion VAV is measured using a white light interference microscope, When the foil thickness t is 10 μm or more and 20 μm or less, the product of the average volume VAV of the concave portion and the foil thickness t, that is, VAV×t is more than 0 μm 4 and 1000 μm 4 or less, E/t obtained by dividing the elongation E by the foil thickness t It is 0.9%/μm or more and 1.8%/μm or less.

又,關於本發明的其他態樣的鋰離子二次電池用負極,其要旨為:具備上述一態樣之電解銅箔。 進一步,關於本發明的其他態樣的鋰離子二次電池,其要旨為:具備上述其他態樣之鋰離子二次電池用負極。 Moreover, about the negative electrode for lithium ion secondary batteries of another aspect of this invention, the summary is provided with the electrolytic copper foil of the said aspect. Furthermore, about the lithium ion secondary battery of another aspect of this invention, the gist is provided with the negative electrode for lithium ion secondary batteries of the said other aspect.

[功效] 本發明的電解銅箔難以發生破斷。又,本發明的鋰離子二次電池用負極及鋰離子二次電池,在充放電時負極集電體難以發生破斷。 [effect] The electrolytic copper foil of the present invention is hardly broken. In addition, in the negative electrode for a lithium ion secondary battery and the lithium ion secondary battery of the present invention, the negative electrode current collector is less likely to be broken during charge and discharge.

說明關於本發明的一實施形態。再者,以下說明的實施形態是表示本發明的一例。又,可對本實施形態作各種變化或改良,且作這樣的變化或改良後的形態也包含在本發明中。 關於本發明的一實施形態的電解銅箔,當將箔厚設為t(單位為μm)、將被形成在電解析出結束面上的凹部的體積的平均值也就是凹部平均體積(Valleys Average Volume)設為VAV(單位為μm 3)、將沿著長度方向拉伸而測得的拉伸率設為E(單位為%),並使用白光干涉顯微鏡來測定凹部平均體積VAV時,箔厚t為10μm以上且20μm以下,凹部平均體積VAV與箔厚t的乘積也就是VAV×t為超過0μm 4且1000μm 4以下,將拉伸率E除以箔厚t而得的E/t為0.9%/μm以上且1.8%/μm以下。 依據這樣的結構,本實施形態的電解銅箔難以發生破斷。 An embodiment of the present invention will be described. In addition, the embodiment described below is an example which shows this invention. In addition, various changes or improvements can be made to the present embodiment, and such changes or improvements are also included in the present invention. Regarding the electrolytic copper foil of one embodiment of the present invention, when the foil thickness is t (unit is μm), the average value of the volume of the recesses to be formed on the electrolytic desorption end surface is the average volume of the recesses (Valleys Average). When the mean volume VAV of the concave portion is measured using a white light interference microscope, the thickness of the foil is t is 10 μm or more and 20 μm or less, the product of the average volume VAV of the concave portion and the foil thickness t, that is, VAV×t is more than 0 μm 4 and 1000 μm 4 or less, and E/t obtained by dividing the elongation E by the foil thickness t is 0.9 %/μm or more and 1.8%/μm or less. With such a structure, the electrolytic copper foil of the present embodiment is less likely to be broken.

本實施形態的電解銅箔,能夠作為鋰離子二次電池(主要是圓筒形的鋰離子二次電池)的負極集電體來使用。亦即,本實施形態的鋰離子二次電池用負極,具備本實施形態的電解銅箔。又,本實施形態的鋰離子二次電池,具備本實施形態的鋰離子二次電池用負極。 由於本實施形態的電解銅箔難以破斷,所以本實施形態的鋰離子二次電池用負極及鋰離子二次電池,在充放電時負極集電體難以發生破斷。 The electrolytic copper foil of the present embodiment can be used as a negative electrode current collector of a lithium ion secondary battery (mainly a cylindrical lithium ion secondary battery). That is, the negative electrode for lithium ion secondary batteries of this embodiment is equipped with the electrolytic copper foil of this embodiment. Moreover, the lithium ion secondary battery of this embodiment is equipped with the negative electrode for lithium ion secondary batteries of this embodiment. Since the electrolytic copper foil of the present embodiment is difficult to break, the negative electrode for a lithium ion secondary battery and the lithium ion secondary battery of the present embodiment are less likely to break the negative electrode current collector during charge and discharge.

以下,關於本實施形態的的電解銅箔,進一步詳細地說明。 本發明人,深入檢討的結果,發現了下述事實:具備高延伸性與電解析出結束面的平滑性(低輪廓)雙方的特性之電解銅箔,在鋰離子二次電池的充放電時,即便負極材料膨脹收縮,也難以發生破斷。 Hereinafter, the electrolytic copper foil of the present embodiment will be described in further detail. The inventors of the present invention, as a result of intensive examination, found the fact that an electrolytic copper foil having both characteristics of high elongation and smoothness (low profile) of the electrolytically decomposed finish surface can be used during charging and discharging of lithium ion secondary batteries. , even if the negative electrode material expands and contracts, it is difficult to break.

如果電解銅箔為高延伸性,則由於電解銅箔可追隨負極材料的膨脹收縮,因此難以發生破斷。又,如果被形成在電解析出結束面上的微細的凹部的體積的平均值也就是凹部平均體積VAV小且電解析出結束面平滑,則由於密合的電解銅箔與負極材料的密合力遍及密合面整體成為均勻,所以在密合的電解銅箔與負極材料之間,在充放電時發生局部的剝離的情況會受到抑制。若在電解銅箔與負極材料之間發生局部的剝離,則由於膨脹收縮時的應力會集中在剝離的部分,所以電解銅箔容易破斷,但是本實施形態的電解銅箔,由於難以發生局部的剝離,所以在鋰離子二次電池的充放電時難以發生破斷。針對此點,以下進一步詳細地說明。When the electrolytic copper foil has high stretchability, the electrolytic copper foil can follow the expansion and contraction of the negative electrode material, and thus it is difficult to break. In addition, if the average value of the volume of the fine concave portions formed on the electrodeposition finish surface, that is, the concave portion average volume VAV is small, and the electrodeposition finish surface is smooth, the adhesion force between the electrodeposited copper foil and the negative electrode material will be reduced due to the adhesion. Since it becomes uniform over the entire adhesion surface, the occurrence of local peeling during charge and discharge is suppressed between the adhered electrodeposited copper foil and the negative electrode material. If local peeling occurs between the electrolytic copper foil and the negative electrode material, the stress during expansion and contraction is concentrated on the peeled part, so the electrolytic copper foil is easily broken, but the electrolytic copper foil of this embodiment is less likely to locally occur Therefore, it is difficult to break during the charging and discharging of the lithium ion secondary battery. This point will be described in further detail below.

從前,電解銅箔的箔厚t與由於拉伸而導致的拉伸率的關係,有許多不明確之處,即便是相同箔厚的電解銅箔,拉伸率等的特性也會有偏差。又,若增大箔厚,則由於電解鍍覆(為了製造電解銅箔的鍍銅)中的銅的析出機制的變化,在鋰離子二次電池的充放電時,也會有電解銅箔的拉伸破斷過早等問題。In the past, the relationship between the foil thickness t of the electrolytic copper foil and the elongation rate due to stretching has many uncertainties, and even electrolytic copper foils with the same foil thickness have variations in the properties such as elongation rate. In addition, if the thickness of the foil is increased, the deposition mechanism of copper in the electrolytic plating (copper plating for producing the electrolytic copper foil) changes, and the electrolytic copper foil may also be damaged during charging and discharging of the lithium ion secondary battery. Problems such as premature breakage.

本發明人深入檢討的結果,發現藉由控制電解鍍覆的電解條件,將拉伸率以箔厚進行標準化後的值(亦即參數E/t)會落入規定的區域。而且,將以此種方式獲得的電解銅箔作為負極集電體使用而製造的鋰離子二次電池,在充放電時負極集電體難以發生破斷。As a result of intensive examination, the present inventors found that by controlling the electrolytic conditions of electrolytic plating, the value obtained by normalizing the elongation ratio to the foil thickness (that is, the parameter E/t) falls within a predetermined range. Moreover, in the lithium ion secondary battery manufactured using the electrolytic copper foil obtained in this way as a negative electrode current collector, the negative electrode current collector is less likely to be broken during charge and discharge.

又,從前,一直認為Ra、Rz等的表面粗糙度越小的平滑的電解銅箔,越難以發生破斷。然而,Ra、Rz等的表面粗糙度,是由在電解銅箔的表面之中的任意一條線上的輪廓算出,因而是一種並未充分地顯現存在於具有一定面積的區域內的微細的凹部的尺寸等的數值。Moreover, conventionally, it was thought that a smooth electrolytic copper foil with a smaller surface roughness such as Ra and Rz is less likely to be broken. However, since the surface roughness of Ra, Rz, etc. is calculated from the contour on any line in the surface of the electrolytic copper foil, the fine recesses existing in the region having a certain area are not sufficiently expressed. size, etc.

本發明人深入檢討的結果,發現在電解鍍覆時,由於銅在電解銅箔的厚度方向上結晶成長,因而在電解銅箔的表面上形成有多數個立方微米級的微細的凹部。而且,當此凹部的體積大的情況,在鋰離子二次電池的充放電時,若負極材料發生膨脹收縮,則此凹部成為起點,電解銅箔容易發生破斷。由於此銅的結晶成長而形成的凹部,與箔厚成比例,也有變成更大的情況。As a result of intensive examination, the present inventors found that copper crystals grow in the thickness direction of the electrolytic copper foil during electrolytic plating, so that many fine recesses on the order of cubic micrometers are formed on the surface of the electrolytic copper foil. When the volume of the concave portion is large, when the negative electrode material expands and contracts during charging and discharging of the lithium ion secondary battery, the concave portion becomes a starting point, and the electrolytic copper foil is likely to be broken. The concave portion formed by this copper crystal growth may become larger in proportion to the thickness of the foil.

本發明人發現下述事實:藉由控制電解鍍覆的條件,如果使被形成在電解析出結束面上的凹部的體積的平均值也就是凹部平均體積VAV變小且控制由於箔厚所造成的對凹部平均體積VAV的影響,則可獲得一種具有高拉伸率且難以破斷的電解銅箔。The present inventors have found the fact that by controlling the conditions of electrolytic plating, if the average value of the volumes of the concave portions formed on the electro-deposited finish surface, that is, the concave portion average volume VAV, is made small and the effect due to the thickness of the foil is controlled The effect on the average volume VAV of the concave portion is not high, and an electrolytic copper foil with high elongation ratio and difficult to break can be obtained.

第2圖是表示被形成在電解銅箔的電解析出結束面上的凹凸的白光干涉顯微照片,以顏色的濃淡來表示高度。第3圖是表示電解銅箔的電解析出結束面的輪廓的圖,是表示第2圖的白光干涉顯微照片內的一條線上的輪廓。比以國際標準ISO25178的規定作為基準而設定的高度0μm的橫線更低的部分,是被形成在電解析出結束面上的凹部。FIG. 2 is a white light interference photomicrograph showing the unevenness formed on the electrolytic desorption end surface of the electrolytic copper foil, and the height is indicated by the shade of color. FIG. 3 is a diagram showing the outline of the electrolytic desorption end surface of the electrolytic copper foil, and shows the outline of one line in the white light interference micrograph of FIG. 2 . The portion lower than the horizontal line with a height of 0 μm set on the basis of the international standard ISO25178 is a concave portion formed on the end surface of the electrolytic desorption.

凹部平均體積VAV,受到下述二個因素的影響:電解銅箔的抑制銅往厚度方向的成長、及箔厚的增加。因此,關於相異箔厚的電解銅箔,在由凹部平均體積VAV來類推上述結晶成長的抑制程度的情況,需要比較凹部平均體積VAV與箔厚t的乘積也就是VAV×t。 根據上述,藉由規定參數VAV×t與參數E/t雙方,可獲得一種以難以發生破斷作為目的之電解銅箔。 The concave portion average volume VAV is influenced by the following two factors: inhibition of copper growth in the thickness direction of the electrolytic copper foil and increase in the thickness of the foil. Therefore, for electrolytic copper foils with different foil thicknesses, when the above-mentioned degree of suppression of crystal growth is derived from the average volume VAV of the recesses, it is necessary to compare the product of the average volume VAV of the recesses and the foil thickness t, that is, VAV×t. As described above, by specifying both the parameter VAV×t and the parameter E/t, an electrolytic copper foil for which breakage is unlikely to occur can be obtained.

[箔厚t] 箔厚t必須為10μm以上且20μm以下,較佳為12μm以上且20μm以下。如果箔厚t在上述範圍內,則電解液中的有機添加物發揮填埋電解銅箔的由於往厚度方向成長而產生的大的凹凸的功能,而可獲得抑制電解銅箔的往厚度方向的結晶成長的效果。其結果,可發揮下述效果:可獲得一種電解銅箔,其被形成在電解析出結束面上的凹部的體積的平均值也就是凹部平均體積VAV變小,具有高拉伸率且難以發生破斷。 [foil thickness t] The foil thickness t must be 10 μm or more and 20 μm or less, preferably 12 μm or more and 20 μm or less. When the foil thickness t is within the above-mentioned range, the organic additive in the electrolytic solution functions to fill the large irregularities of the electro-deposited copper foil due to the growth in the thickness direction, so that it is possible to suppress the thickness direction of the electro-deposited copper foil. The effect of crystal growth. As a result, it is possible to obtain an electrolytic copper foil in which the average value of the volume of the concave portions formed on the electrolytic desorption finished surface, that is, the concave portion average volume VAV, is reduced, has a high elongation ratio, and is less likely to occur. break.

開始向陰極通電時,亦即在箔厚t從0μm至未滿10μm的區域,電解銅箔的往厚度方向的結晶成長優先,凹部平均體積VAV有變大的傾向,拉伸破斷過早的機率變高。在箔厚t超過20μm的區域,由於製箔所需要的電解時間變長,容易受到有機添加劑的分解和消耗等所造成的影響,會發生凹部平均體積VAV明顯變大的處所,其結果,發生局部的拉伸率降低的機率高。When starting to energize the cathode, that is, in the area of the foil thickness t from 0 μm to less than 10 μm, the crystal growth in the thickness direction of the electrolytic copper foil takes priority, the average volume VAV of the concave part tends to increase, and the tensile fracture is premature. Chances are higher. In the area where the foil thickness t exceeds 20 μm, since the electrolysis time required for foil production becomes longer, it is easily affected by the decomposition and consumption of organic additives, and the average volume VAV of the concave portion becomes significantly larger. As a result, the occurrence of There is a high possibility that the local elongation rate decreases.

[VAV×t] 參數VAV×t必須為超過0μm 4且1000μm 4以下,較佳為超過0μm 4且400μm 4以下。如果參數VAV×t在上述範圍內,則由於電解銅箔的表面平滑,因此電解銅箔與負極材料的密合力容易遍及密合面整體成為均勻。因此,在密合的電解銅箔與負極材料之間,在充放電時發生局部的剝離的情況會受到抑制,充放電時難以發生破斷。另一方面,如果參數VAV×t在上述範圍內,則由於電解銅箔與負極材料的密合力充分地顯現,所以在充放電時難以發生破斷。 [VAV×t] The parameter VAV×t must be more than 0 μm 4 and 1000 μm 4 or less, preferably more than 0 μm 4 and 400 μm 4 or less. When the parameter VAV×t is within the above range, since the surface of the electrolytic copper foil is smooth, the adhesion force between the electrolytic copper foil and the negative electrode material tends to be uniform over the entire adhesion surface. Therefore, local peeling during charge and discharge is suppressed between the closely-contacted electrolytic copper foil and the negative electrode material, and breakage during charge and discharge is less likely to occur. On the other hand, when the parameter VAV×t is within the above-mentioned range, since the adhesive force between the electrolytic copper foil and the negative electrode material is sufficiently exhibited, breakage is unlikely to occur during charge and discharge.

[E/t] 參數E/t必須為0.9%/μm以上且1.8%/μm以下,較佳為1.2%/μm以上且1.7%/μm以下,更佳為1.3%/μm以上且1.6%/μm以下。如果參數E/t在上述範圍內,則由於電解銅箔具有高拉伸率,所以在充放電時難以發生破斷。 [E/t] The parameter E/t must be 0.9%/μm or more and 1.8%/μm or less, preferably 1.2%/μm or more and 1.7%/μm or less, more preferably 1.3%/μm or more and 1.6%/μm or less. If the parameter E/t is within the above-mentioned range, since the electrolytic copper foil has a high elongation ratio, it is difficult to break during charging and discharging.

[均方根高度Sq] 使用白光干涉顯微鏡來測量本實施形態的電解銅箔的電解析出結束面而得的均方根高度Sq,較佳為0.1μm以上且0.4μm以下,更佳為0.1μm以上且0.25μm以下。 [Root mean square height Sq] The root mean square height Sq of the electrolytic copper foil of the present embodiment measured using a white light interference microscope is preferably 0.1 μm or more and 0.4 μm or less, and more preferably 0.1 μm or more and 0.25 μm or less.

如果電解析出結束面的均方根高度Sq在上述範圍內,則藉由定錨效應,電解銅箔與負極材料的密合力更容易變高。又,如果電解析出結束面的均方根高度Sq在上述範圍內,則由於電解析出結束面充分地平滑,所以密合的電解銅箔與負極材料的密合力遍及密合面整體成為均勻。藉此,在密合的電解銅箔與負極材料之間,在充放電時發生局部的剝離的情況會受到抑制,所以在充放電時難以發生破斷。If the root-mean-square height Sq of the electrodeposition end surface is within the above-mentioned range, the adhesion between the electrolytic copper foil and the negative electrode material is more likely to be increased by the anchoring effect. In addition, when the root mean square height Sq of the electro-deposition end surface is within the above-mentioned range, since the electro-deposition end surface is sufficiently smooth, the adhesion force between the adhered electrolytic copper foil and the negative electrode material becomes uniform over the entire adherence surface. . Thereby, the occurrence of local peeling during charge and discharge is suppressed between the closely-contacted electrolytic copper foil and the negative electrode material, so that breakage during charge and discharge is less likely to occur.

[拉伸強度] 本實施形態的電解銅箔,其沿著長度方向拉伸而測得的拉伸強度為300MPa以上且380MPa以下。如果拉伸強度在上述範圍內,則除了電解銅箔更難以破斷以外,對於負極材料的膨脹收縮的追隨性也更優異。 [Tensile Strength] The electrolytic copper foil of the present embodiment has a tensile strength of 300 MPa or more and 380 MPa or less measured by being stretched in the longitudinal direction. When the tensile strength is within the above range, the electrolytic copper foil is more difficult to be broken, and the followability to the expansion and contraction of the negative electrode material is also more excellent.

電解銅箔的拉伸強度是沿著長度方向拉伸而測得,本發明中的所謂的電解銅箔的「長度方向」是意謂MD(機器方向,Machine Direction),例如在電解銅箔的製造時,如果是使用旋轉電極並藉由對旋轉電極的表面進行鍍覆來形成銅箔的情況,則意謂為旋轉電極的旋轉方向。The tensile strength of the electro-deposited copper foil is measured by stretching along the longitudinal direction. The "longitudinal direction" of the electro-deposited copper foil in the present invention means MD (Machine Direction). For example, in the electro-deposited copper foil At the time of manufacture, when a rotating electrode is used and the surface of the rotating electrode is plated to form a copper foil, it means the rotation direction of the rotating electrode.

再者,本實施形態的電解銅箔,不僅能夠使用於鋰離子二次電池的負極集電體,也能夠使用於其他用途中。例如,本實施形態的電解銅箔,能夠適合作為印刷線路板用的銅箔來使用。本實施形態的電解銅箔,由於具備高延伸性與電解析出結束面的平滑性雙方的特性,所以在印刷線路板的製造時(例如熱壓時),即便被貼合在銅箔上的環氧樹脂等樹脂發生膨脹收縮的情況,因於銅箔追隨該膨脹收縮,因而難以破斷。In addition, the electrolytic copper foil of this embodiment can be used not only for the negative electrode current collector of a lithium ion secondary battery, but also for other applications. For example, the electrolytic copper foil of the present embodiment can be suitably used as a copper foil for a printed wiring board. Since the electrodeposited copper foil of the present embodiment has both high elongation and smoothness of the electrolytically decomposed surface, even if the electrodeposited copper foil is bonded to the copper foil during the manufacture of printed wiring boards (for example, during hot pressing) When resin, such as an epoxy resin, expands and contracts, since copper foil follows this expansion and contraction, it is hard to break.

[電解銅箔的製造方法] 關於本實施形態的電解銅箔的製造方法的一例,如以下說明。 電解銅箔,例如能夠使用第1圖所示的電解析出裝置來製造。第1圖的電解析出裝置,具備:不溶性電極12,其由覆蓋有鉑族元素或其氧化物之鈦所構成;及,鈦製的旋轉電極11,其設置成與不溶性電極12相對向。使用第1圖的電解析出裝置來實行鍍銅,使銅析出在圓柱狀的旋轉電極11的表面(圓柱面)上而形成銅箔,然後從旋轉電極11的表面剝離銅箔,藉此能夠製造本實施形態的電解銅箔。 [Manufacturing method of electrolytic copper foil] An example of the manufacturing method of the electrolytic copper foil of this embodiment is demonstrated below. The electrolytic copper foil can be produced using, for example, the electrolytic separation apparatus shown in FIG. 1 . The electro-desorption apparatus of FIG. 1 includes an insoluble electrode 12 made of titanium covered with a platinum group element or its oxide, and a titanium rotating electrode 11 provided to face the insoluble electrode 12 . Copper plating is performed using the electrolytic precipitation apparatus shown in FIG. 1, copper is deposited on the surface (cylindrical surface) of the cylindrical rotating electrode 11 to form a copper foil, and then the copper foil is peeled off from the surface of the rotating electrode 11, whereby it is possible to The electrolytic copper foil of this embodiment was manufactured.

而且,藉由在鍍銅時控制電流密度、電解液的溫度、電解液的組成(例如電解液中的銅離子、硫酸、氯離子、添加劑的濃度)等條件,能夠抑制電解銅箔的往厚度方向的銅的結晶成長。其結果,能夠獲得一種電解銅箔,其凹部平均體積VAV小,由於電解銅箔的箔厚所導致的表面性狀(例如凹部平均體積VAV、均方根高度Sq)的變化小且具有高拉伸率。In addition, by controlling the current density, the temperature of the electrolyte, the composition of the electrolyte (for example, the concentration of copper ions, sulfuric acid, chloride ions, additives in the electrolyte) and other conditions during copper plating, the thickness of the electrolytic copper foil can be suppressed. direction of copper crystal growth. As a result, it is possible to obtain an electro-deposited copper foil having a small concave portion average volume VAV, a small change in surface properties (eg, concave portion average volume VAV, root-mean-square height Sq) due to the foil thickness of the electrolytic copper foil, and high elongation. Rate.

一邊參照第1圖一邊詳細地說明實行鍍銅來製造電解銅箔的方法的一例。在實行鍍銅的情況,將旋轉電極11作為陰極並將不溶性電極12作為陽極來施加電流。作為不溶性電極12,例如能夠使用DSE電極(塗層鈦電極,Dimensionally Stable Electrode)(註冊商標)。 又,作為電解液13,例如能夠使用一種含有硫酸和硫酸銅之水溶液。電解液13的銅濃度,例如能夠設為50〜150g(克)/L(公升),硫酸濃度能夠設為20〜200g/L。 An example of the method of performing copper plating to manufacture an electrolytic copper foil will be described in detail with reference to FIG. 1 . When copper plating is performed, a current is applied with the rotating electrode 11 serving as a cathode and the insoluble electrode 12 serving as an anode. As the insoluble electrode 12 , for example, a DSE electrode (coated titanium electrode, Dimensionally Stable Electrode) (registered trademark) can be used. In addition, as the electrolytic solution 13, for example, an aqueous solution containing sulfuric acid and copper sulfate can be used. The copper concentration of the electrolyte solution 13 can be, for example, 50 to 150 g (grams)/L (liters), and the sulfuric acid concentration can be 20 to 200 g/L.

從未圖示的電解液供給部,將電解液13供給至旋轉電極11與不溶性電極12之間(參照白色箭頭),並且,若一邊使旋轉電極11往以虛線箭頭所示的方向以規定速度旋轉,一邊將直流電流施加在旋轉電極11與不溶性電極12之間,則銅析出在旋轉電極11的表面。如果將析出的銅從旋轉電極11的表面剝離,且如第1圖的實線箭頭所示般地拉起並連續地捲繞,則可獲得電解銅箔14。The electrolyte solution 13 is supplied between the rotating electrode 11 and the insoluble electrode 12 (refer to the white arrow) from the electrolyte solution supply unit (not shown), and the rotating electrode 11 is moved at a predetermined speed in the direction indicated by the broken line arrow. While rotating and applying a direct current between the rotating electrode 11 and the insoluble electrode 12 , copper is deposited on the surface of the rotating electrode 11 . The electrolytic copper foil 14 can be obtained by peeling the deposited copper from the surface of the rotating electrode 11 , pulling up as indicated by the solid arrow in FIG. 1 and continuously winding.

在用於鍍銅的電解液13中,從電解銅箔的平滑化和機械特性的控制的觀點,也可添加有機添加劑、無機添加劑等添加劑。藉由添加有添加劑,能夠提升常態中的電解銅箔的強度、拉伸率、表面粗糙度或是抑制鍍銅中的銅的結晶成長。添加劑可單獨地使用一種,也可以合併使用二種以上。In the electrolytic solution 13 for copper plating, additives such as organic additives and inorganic additives may be added from the viewpoint of smoothing of the electrolytic copper foil and control of mechanical properties. By adding an additive, the strength, elongation, and surface roughness of the electrolytic copper foil in a normal state can be improved, or the crystal growth of copper in copper plating can be suppressed. An additive may be used individually by 1 type, and may be used in combination of 2 or more types.

作為有機添加劑,例如可舉出乙烯硫代尿素、聚乙二醇、健那綠(Janus green)。 作為無機添加劑,例如能夠使用:作為氯化物離子的供給源之氯化鈉(NaCl)等金屬氯化物、或氯化氫(HCl)。 Examples of organic additives include ethylene thiourea, polyethylene glycol, and Janus green. As the inorganic additive, for example, metal chlorides such as sodium chloride (NaCl), which are sources of chloride ions, or hydrogen chloride (HCl) can be used.

在用於鍍銅的電解液13中,作為無機添加劑,較佳是添加20〜50mg/L的氯化物離子(氯)。又,在用於鍍銅的電解液13中,作為有機添加劑,較佳是將乙烯硫代尿素、聚乙二醇及健那綠之中的至少一種,以合計為3〜30mg/L的方式進行添加,更佳是以合計為3〜10mg/L的方式進行添加。In the electrolytic solution 13 for copper plating, it is preferable to add 20 to 50 mg/L of chloride ions (chlorine) as an inorganic additive. In addition, in the electrolytic solution 13 for copper plating, as the organic additive, at least one of ethylene thiourea, polyethylene glycol, and kena green is preferably added in a total amount of 3 to 30 mg/L It is added, and it is more preferable to add it in a total amount of 3 to 10 mg/L.

在鍍銅時,銅的結晶有可能往電解銅箔的厚度方向成長,但是如果將乙烯硫代尿素、聚乙二醇及健那綠之中的至少一種,以上述範圍的濃度添加至電解液13中,則抑制電解銅箔的往厚度方向的銅的結晶成長的效果變大。During copper plating, copper crystals may grow in the thickness direction of the electrolytic copper foil, but if at least one of ethylene thiourea, polyethylene glycol, and kena green is added to the electrolyte at a concentration within the above range In 13, the effect of suppressing the crystal growth of copper in the thickness direction of the electrolytic copper foil becomes large.

鍍銅中的電解條件,例如能夠設為以下的條件。亦即,電解液13的液溫為45〜65℃,電流密度為25〜50A/dm 2。在鍍銅時,由於陽極和陰極的電阻發熱,電解液13的溫度上升,有機添加劑有可能分解,因此較佳是將電流密度抑制在上述較低的值。 The electrolytic conditions in copper plating can be, for example, the following conditions. That is, the liquid temperature of the electrolyte solution 13 is 45 to 65° C., and the current density is 25 to 50 A/dm 2 . During copper plating, the temperature of the electrolyte 13 rises due to resistance heating of the anode and the cathode, and the organic additives may be decomposed. Therefore, it is preferable to suppress the current density to the above-mentioned low value.

如上述般地製造出來的電解銅箔的表面,根據希望也可以施行表面處理。關於表面處理,說明如下。 也可以對電解銅箔的表面施行防銹處理。作為防銹處理,可舉出無機與有機防銹處理。作為無機防銹處理,例如可舉出鉻酸鹽處理、鍍覆處理,也可以對藉由該鍍覆處理而形成的鍍覆層上施行鉻酸鹽處理。作為鍍覆處理,例如可舉出鍍鎳、鍍鎳合金、鍍鈷、鍍鈷合金、鍍鋅、鍍鋅合金、鍍錫、鍍錫合金。作為有機防銹處理,例如可舉出使用了苯並三唑之表面處理。 The surface of the electrolytic copper foil produced as described above may be surface-treated as desired. The surface treatment is explained below. Antirust treatment can also be applied to the surface of the electrolytic copper foil. Examples of the antirust treatment include inorganic and organic antirust treatments. As an inorganic rust-proofing process, a chromate process and a plating process are mentioned, for example, You may give a chromate process to the plating layer formed by this plating process. Examples of the plating treatment include nickel plating, nickel alloy plating, cobalt plating, cobalt alloy plating, zinc plating, zinc alloy plating, tin plating, and tin alloy plating. As an organic rust preventive treatment, the surface treatment using benzotriazole is mentioned, for example.

對於已施行防銹處理的表面,也可進一步實行使用了矽烷耦合劑之表面處理(矽烷改質處理)。藉由使用了矽烷耦合劑之表面處理,由於在電解銅箔的表面(與負極材料或樹脂等的接合側的表面)上被賦予了與黏著劑的親和力強的官能基,所以電解銅箔與負極材料或樹脂等的密合性更加提高,也進一步提高電解銅箔的防銹性和吸濕耐熱性等。藉此,此種電解銅箔,適合作為鋰離子二次電池的負極集電體用或印刷線路板用的電解銅箔。 防銹處理和使用了矽烷耦合劑之表面處理,提高鋰離子二次電池的活性物質與電解銅箔的密合強度,實現防止鋰離子二次電池的充放電循環特性降低的作用。 For the surface that has been subjected to anti-rust treatment, surface treatment (silane modification treatment) using a silane coupling agent can also be further carried out. By surface treatment using a silane coupling agent, the surface of the electrolytic copper foil (the surface on the bonding side with the negative electrode material or resin, etc.) is given a functional group with a strong affinity for the adhesive, so the electrolytic copper foil is Adhesion of the negative electrode material, resin, etc. is further improved, and the rust resistance, moisture absorption heat resistance, etc. of the electrolytic copper foil are further improved. Therefore, such an electrolytic copper foil is suitable as an electrolytic copper foil for negative electrode current collectors of lithium ion secondary batteries or for printed wiring boards. Anti-rust treatment and surface treatment using silane coupling agent improve the adhesion strength between the active material of the lithium ion secondary battery and the electrolytic copper foil, and achieve the effect of preventing the deterioration of the charge-discharge cycle characteristics of the lithium ion secondary battery.

又,在施行上述防銹處理前,也可對電解銅箔的表面實行粗糙化處理。作為粗糙化處理,例如能夠適宜地採用鍍覆法、蝕刻法等。鍍覆法是藉由在未處理的電解銅箔的表面上形成具有凹凸之薄膜層,將表面粗糙化的方法。作為鍍覆法,可舉出電解鍍覆法、無電解鍍覆法。Moreover, you may perform roughening process on the surface of an electrolytic copper foil before performing the said rust-proof process. As a roughening process, a plating method, an etching method, etc. can be suitably used, for example. The plating method is a method of roughening the surface by forming a thin film layer having irregularities on the surface of an untreated electrolytic copper foil. As a plating method, an electrolytic plating method and an electroless plating method are mentioned.

作為藉由鍍覆法而實行的粗糙化處理,較佳是例如將銅或銅合金等的以銅作為主成分之鍍覆膜,形成在未處理的電解銅箔的表面上的方法。作為藉由蝕刻法而實行的粗糙化處理,較佳是例如藉由物理性蝕刻和化學性蝕刻等而實行的方法。作為物理性蝕刻,可舉出利用噴砂等來進行蝕刻的方法;作為化學性蝕刻,可舉出一種使用處理液來實行的蝕刻,該處理液含有無機酸或有機酸、氧化劑及添加劑。As the roughening treatment by the plating method, for example, a method of forming a plating film containing copper as a main component, such as copper or a copper alloy, on the surface of an untreated electrolytic copper foil is preferable. As a roughening process performed by an etching method, the method performed by physical etching, chemical etching, etc. is preferable, for example. Examples of physical etching include a method of etching by sandblasting or the like, and examples of chemical etching include etching using a treatment liquid containing an inorganic acid or an organic acid, an oxidizing agent, and an additive.

[實施例] 以下,表示實施例和比較例,進一步具體地說明本發明。先製造實施例1〜19及比較例1、2的電解銅箔,然後使用這些電解銅箔分別製造負極集電體,並使用這些負極集電體來分別製造鋰離子二次電池。然後,評價電解銅箔和鋰離子二次電池的各種特性。說明關於電解銅箔和鋰離子二次電池的製造方法與各種特性的評價方法。 [Example] Hereinafter, an Example and a comparative example are shown, and this invention is demonstrated more concretely. First, the electrolytic copper foils of Examples 1 to 19 and Comparative Examples 1 and 2 were produced, and then negative electrode current collectors were produced using these electrodeposited copper foils, respectively, and lithium ion secondary batteries were produced using these negative electrode current collectors, respectively. Then, various properties of the electrolytic copper foil and the lithium ion secondary battery were evaluated. A method for producing an electrolytic copper foil and a lithium ion secondary battery and an evaluation method for various properties will be described.

(A)鍍銅 使用與第1圖同樣的裝置,並利用與前述同樣的操作來實行鍍銅,使銅析出在旋轉電極的表面上。然後,從旋轉電極的表面剝下所析出的銅,並藉由連續地捲取,製造出實施例和比較例的電解銅箔(參照第1圖)。鍍銅時的電解液的溫度和電流密度,如表1所示。 (A) Copper plating Using the same apparatus as in Fig. 1, copper plating was performed by the same operation as described above, and copper was deposited on the surface of the rotating electrode. Then, the deposited copper was peeled off from the surface of the rotating electrode, and the electrolytic copper foils of Examples and Comparative Examples were produced by continuous winding (see FIG. 1 ). The temperature and current density of the electrolyte during copper plating are shown in Table 1.

電解液使用含有硫酸、硫酸銅五水合物及添加劑之水溶液。作為添加劑,使用乙烯硫代尿素、聚乙二醇及健那綠。將硫酸、硫酸銅五水合物及各添加劑的濃度表示於表1中。硫酸銅五水合物的濃度是作為銅的濃度。又,將電解液中的氯濃度表示於表1中。As the electrolyte, an aqueous solution containing sulfuric acid, copper sulfate pentahydrate and additives was used. As additives, ethylene thiourea, polyethylene glycol, and kena green were used. Table 1 shows the concentrations of sulfuric acid, copper sulfate pentahydrate, and each additive. The concentration of copper sulfate pentahydrate is the concentration of copper. In addition, Table 1 shows the chlorine concentration in the electrolyte solution.

[表1]

Figure 02_image001
[Table 1]
Figure 02_image001

(B)正極的製造 在將鈷酸鋰(LiCoO 2)90質量%、石墨粉末7質量%、聚偏二氟乙烯粉末3質量%混合而成的混合物中,添加N-甲基吡咯烷酮與乙醇作為溶劑並加以混揉,調製正極材料糊。將此正極材料糊以厚度成為15μm的方式均勻地塗佈在鋁箔上。在將塗佈有正極材料糊之鋁箔在氮氣氛中乾燥而使溶劑揮發後,實行輥軋,製作出整體的厚度為150μm的片材。將此片材裁切成寬度43mm、長度285mm的帶狀之後,利用超音波熔接將鋁箔的引線端子安裝在其一端,作成正極。 (B) Production of Positive Electrode N-methylpyrrolidone and ethanol were added to a mixture of 90% by mass of lithium cobaltate (LiCoO 2 ), 7% by mass of graphite powder, and 3% by mass of polyvinylidene fluoride powder. The solvent is mixed and kneaded to prepare a positive electrode material paste. This positive electrode material paste was uniformly coated on the aluminum foil so as to have a thickness of 15 μm. After drying the aluminum foil coated with the positive electrode material paste in a nitrogen atmosphere to volatilize the solvent, rolling was performed to produce a sheet having a total thickness of 150 μm. This sheet was cut into a strip having a width of 43 mm and a length of 285 mm, and then a lead terminal of an aluminum foil was attached to one end by ultrasonic welding to prepare a positive electrode.

(C)負極的製造 在將平均粒徑10μm的天然石墨粉末90質量%與聚偏二氟乙烯粉末10質量%混合而成的混合物中,添加N-甲基吡咯烷酮與乙醇作為溶劑並加以混揉,調製負極材料糊。 將在上述(A)項中製造出來的各電解銅箔裁切成寬度720mm的帶狀,作成負極集電體。此時,電解銅箔的寬度方向設為與裁切而獲得的帶狀的負極集電體的寬度方向一致。 (C) Manufacture of negative electrode A negative electrode material paste was prepared by adding N-methylpyrrolidone and ethanol as a solvent to a mixture of 90 mass % of natural graphite powder having an average particle diameter of 10 μm and 10 mass % of polyvinylidene fluoride powder. Each of the electrolytic copper foils produced in the above (A) was cut into a strip having a width of 720 mm to prepare a negative electrode current collector. At this time, the width direction of the electrolytic copper foil was set to coincide with the width direction of the strip-shaped negative electrode current collector obtained by cutting.

接著,將負極材料糊雙層條紋狀地塗佈在負極集電體的雙面上。線狀的負極材料糊的塗膜的寬度為300mm,線狀的負極材料糊的塗膜的伸長方向設為與帶狀的負極集電體的長度方向一致。 在將塗佈有負極材料糊之負極集電體在氮氣氛中乾燥而使溶劑揮發後,實行輥軋,製作出整體的厚度為150μm的片材。將此片材裁切成寬度43mm、長度280mm的長方形狀之後,利用超音波熔接將鎳箔的引線端子安裝在其一端,作成負極。 Next, the negative electrode material paste was coated on both sides of the negative electrode current collector in a double-layered stripe shape. The width of the coating film of the linear negative electrode material paste was 300 mm, and the extension direction of the coating film of the linear negative electrode material paste was set to coincide with the longitudinal direction of the strip-shaped negative electrode current collector. After the negative electrode current collector coated with the negative electrode material paste was dried in a nitrogen atmosphere to volatilize the solvent, rolling was performed to produce a sheet having an overall thickness of 150 μm. This sheet was cut into a rectangular shape with a width of 43 mm and a length of 280 mm, and then a lead terminal of a nickel foil was attached to one end by ultrasonic welding to prepare a negative electrode.

(D)鋰離子二次電池的製作 在如上述般地製作出來的正極與負極之間,夾持厚度25μm的聚丙烯製的隔離膜,並將這些整體捲繞而獲得捲繞體。將此捲繞體收容在圓筒形的電池罐中,並將負極的引線端子點焊在電池罐的底部。再者,電池罐是由在表面施行了鍍鎳之軟鋼形成。 (D) Fabrication of lithium ion secondary battery Between the positive electrode and the negative electrode produced as described above, a separator made of polypropylene with a thickness of 25 μm was sandwiched, and the entirety was wound to obtain a wound body. This wound body was accommodated in a cylindrical battery can, and the lead terminal of the negative electrode was spot welded to the bottom of the battery can. Furthermore, the battery can is formed of mild steel with nickel plating applied to the surface.

接著,將絕緣材料製的上蓋放置在電池罐上,在插入墊圈後,將正極的引線端子與鋁製安全閥進行超音波熔接而接合。並且,在將由丙烯碳酸酯、碳酸二乙酯及碳酸伸乙酯組成之非水電解液體注入電池罐中之後,將上蓋安裝在安全閥上,組裝成外徑14mm、高度50mm的圓筒形的密閉結構型鋰離子二次電池。Next, the top cover made of insulating material was placed on the battery can, and after inserting the gasket, the lead terminal of the positive electrode and the aluminum safety valve were ultrasonically welded and joined. And, after injecting the non-aqueous electrolytic liquid consisting of acrylic carbonate, diethyl carbonate and ethylene carbonate into the battery can, the upper cover is mounted on the safety valve, and assembled into a cylindrical shape with an outer diameter of 14 mm and a height of 50 mm. Sealed structure type lithium ion secondary battery.

接著,評價在上述(A)項中製造出來的各電解銅箔與在上述(D)項中製造出來各鋰離子二次電池的各種特性。以下說明評價方法。再者,在上述(A)項中製造出來的各電解銅箔的箔厚,如表2中的記載所示。Next, various characteristics of each of the electrolytic copper foils produced in the above item (A) and each of the lithium ion secondary batteries produced in the above item (D) were evaluated. The evaluation method will be described below. In addition, the foil thickness of each electrolytic copper foil manufactured in the said item (A) is as described in Table 2.

[表2]

Figure 02_image003
[Table 2]
Figure 02_image003

[電解銅箔的電解析出結束面的凹部平均體積VAV和均方根高度Sq] 以上所述的凹部平均體積VAV和均方根高度Sq的測定方法,是參照在國際標準ISO25178中記載的內容而設定的方法。使用Bruker公司製造的白光干涉型顯微鏡Wyko ContourGT-K,測量電解銅箔的電解析出結束面的表面形狀,實行形狀分析,求取凹部平均體積VAV和均方根高度Sq。表面形狀的測定,在電解析出結束面的任意五處實行,實行五處各自的形狀分析,求取五處各自的凹部平均體積VAV和均方根高度Sq。然後,將所獲得的五處的結果的平均值設為電解銅箔的電解析出結束面的凹部平均體積VAV和均方根高度Sq。 [Average volume VAV and root mean square height Sq of the concave portion at the end surface of electrolytic copper foil electrolytic desorption] The method for measuring the average volume VAV of the recessed portion and the root mean square height Sq described above is a method set with reference to the contents described in the international standard ISO25178. Using a white light interference type microscope Wyko ContourGT-K manufactured by Bruker, the surface shape of the electrolytically resolved surface of the electrolytic copper foil was measured, and shape analysis was performed to obtain the average volume VAV and root mean square height Sq of the concave portion. The measurement of the surface shape was carried out at any five places on the end surface of the electrolysis, and the shape analysis of each of the five places was carried out, and the average volume VAV of the concave portion and the root mean square height Sq of each of the five places were obtained. Then, the average value of the obtained results at five places was used as the average volume VAV of the concave portion and the root-mean-square height Sq of the electrolytic-deposited end surface of the electrolytic copper foil.

形狀分析是使用高解析度CCD照相機(解析度1280×960像素)並以VSI測定方法(垂直掃描型干涉法)來實行。條件設為光源是白光、測定倍率是10倍、測定範圍是477μm×357.8μm、閾值是3%,在進行條件去除(圓柱和傾斜)、資料修復(方法:傳統、重複 5)的濾波處理後,實行傅立葉濾波處理。The shape analysis was performed by the VSI measurement method (vertical scanning type interferometry) using a high-resolution CCD camera (resolution 1280×960 pixels). The conditions are set as the light source is white light, the measurement magnification is 10 times, the measurement range is 477 μm × 357.8 μm, and the threshold value is 3%. , the implementation of Fourier filter processing.

傅立葉濾波處理,使用高頻帶通濾波(High Freq Pass)作為傅立葉濾波,傅立葉濾波窗口使用高斯窗,截止頻率將高頻截止頻率設為12.5mm -1。 進一步,實行統計濾波器(濾波器尺寸:3、濾波器型式:中位)處理。 In the Fourier filtering process, a high frequency band-pass filter (High Freq Pass) is used as the Fourier filter, the Fourier filter window is a Gaussian window, and the cut-off frequency is set to 12.5mm -1 . Furthermore, statistical filter (filter size: 3, filter type: median) processing is performed.

凹部平均體積VAV是藉由多區域分析而求得。詳細而言,將「Region Finding Routine(區域查找程序)」設為「By」、「閾值」設為「0.5μm」、「最小區域尺寸」設為「100像素」、「區域位準(Region Level) 」設為「凹谷(Valleys)」、「零位準」設為「自動(Automatic)」、「條件去除(Term Removal)」設為「None」,並將所算出的「體積(Volume)值」的顯示在「Avg:」中的值,採用作為凹部平均體積VAV。再者,區域位準是凹谷,是以負值的形式被計算出來,所以關於所算出的凹部平均體積VAV,要實施修正為絕對值。 均方根高度Sq是利用「S parpmeters-height解析」並將「去除傾斜(Remove Tilt)」設為「True」來算出。 將凹部平均體積VAV和均方根高度Sq的測定結果表示於表2中。 The concave portion average volume VAV is obtained by multi-region analysis. Specifically, "Region Finding Routine" is set to "By", "Threshold" is set to "0.5 μm", "Minimum Region Size" is set to "100 pixels", and "Region Level )" is set to "Valleys", "Zero Level" is set to "Automatic", "Term Removal" is set to "None", and the calculated "Volume" The value displayed in "Avg:" of "value" is adopted as the average volume VAV of the concave part. In addition, since the area level is a valley and is calculated as a negative value, the calculated average volume VAV of the concave portion is corrected to an absolute value. The root mean square height Sq is calculated using "S parpmeters-height analysis" with "Remove Tilt" set to "True". Table 2 shows the measurement results of the concave portion average volume VAV and the root mean square height Sq.

[電解銅箔的拉伸率E和拉伸強度] 將電解銅箔裁切成寬度13.0mm、長度152mm的長方形狀,將其作為測定用試樣。然後,使用Instron公司製造的拉伸試驗機1122型,實行測定用試樣的拉伸試驗並測定常態中的拉伸率與拉伸強度。在此拉伸試驗中,將夾頭間距離設為70mm並將拉伸速度設為50mm/min,其他條件則基於在IPC-TM-650中所規定的方法來設定。將結果表示於表2中。再者,本發明中所謂的「常態」是意味著電解銅箔被放置在常溫常濕(例如溫度為23±2℃、濕度為50±5%RH)環境中的狀態。 [Elongation E and Tensile Strength of Electrolytic Copper Foil] The electrolytic copper foil was cut into a rectangular shape with a width of 13.0 mm and a length of 152 mm, and this was used as a sample for measurement. Then, the tensile test of the sample for measurement was performed using a tensile tester model 1122 manufactured by Instron Corporation, and the elongation ratio and tensile strength in the normal state were measured. In this tensile test, the distance between the chucks was set to 70 mm, the tensile speed was set to 50 mm/min, and other conditions were set based on the method specified in IPC-TM-650. The results are shown in Table 2. In addition, the term "normal state" in the present invention means a state in which the electrolytic copper foil is placed in an environment of normal temperature and normal humidity (for example, a temperature of 23±2° C. and a humidity of 50±5% RH).

[鋰離子二次電池的充放電循環特性的評價] 對於鋰離子二次電池,將以充電電流100Ma充電至電壓成為4.2V為止後並以放電電流100mA放電至電壓成為2.4V為止的循環作為一個循環,來實行充放電循環試驗。反覆進行此循環後,將鋰離子二次電池分解,調查電解銅箔有無破斷。將結果表示於表2中。 在表2中,將即便500次循環以上也沒有觀察到破斷的情況表示為「A」、將300次循環以上且500次循環以下便觀察到破斷的情況表示為「B」、將300次循環以下便觀察到破斷的情況表示為「C」。 [Evaluation of charge-discharge cycle characteristics of lithium ion secondary batteries] For the lithium ion secondary battery, a charge-discharge cycle test was performed using a cycle of charging at a charging current of 100 mA until the voltage reached 4.2 V and discharging at a discharge current of 100 mA until the voltage reached 2.4 V as one cycle. After repeating this cycle, the lithium ion secondary battery was disassembled, and the presence or absence of breakage of the electrolytic copper foil was investigated. The results are shown in Table 2. In Table 2, the case where no breakage was observed even after 500 cycles or more was shown as "A", the case where breakage was observed after 300 cycles or more and 500 cycles or less was shown as "B", and 300 The case where breakage was observed after the second cycle was denoted as "C".

300次循環以下便發生破斷的電解銅箔,可說是不適合負極集電體的用途。300次循環以上且500次循環以下發生破斷的電解銅箔,可說是適合於負極集電體的用途。即便500次循環以上也不破斷的電解銅箔,非常適合於負極集電體的用途,能夠使鋰離子二次電池的充放電循環特性良好。It can be said that the electrolytic copper foil, which breaks after 300 cycles, is not suitable for use as a negative electrode current collector. It can be said that the electrolytic copper foil which breaks at 300 cycles or more and 500 cycles or less is suitable for use as a negative electrode current collector. The electrolytic copper foil that does not break even after 500 cycles or more is very suitable for use as a negative electrode current collector, and can make the charge-discharge cycle characteristics of the lithium ion secondary battery good.

由表2可知,將實施例1〜19的電解銅箔作為負極集電體使用之鋰離子二次電池,由於其電解銅箔的箔厚t為10μm以上且20μm以下,VAV×t超過0μm 4且1000μm 4以下,E/t為0.9%/μm以上且1.8%/μm以下,所以即便反覆進行充放電,電解銅箔也難以發生破斷,鋰離子二次電池的充放電循環特性優異。 As can be seen from Table 2, in the lithium ion secondary batteries using the electrolytic copper foils of Examples 1 to 19 as negative electrode current collectors, since the foil thickness t of the electrolytic copper foils is 10 μm or more and 20 μm or less, VAV×t exceeds 0 μm . And 1000 μm 4 or less, E/t is 0.9%/μm or more and 1.8%/μm or less, so even if charge and discharge are repeated, the electrolytic copper foil is hardly broken, and the charge-discharge cycle characteristics of the lithium ion secondary battery are excellent.

11:旋轉電極 12:不溶性電極 13:電解液 14:電解銅箔 11: Rotary electrode 12: Insoluble electrode 13: Electrolyte 14: Electrolytic copper foil

第1圖是說明使用電解析出裝置來製造電解銅箔的方法的圖。 第2圖是說明關於本實施形態的電解銅箔的圖,表示被形成在電解析出結束面上的凹凸的白光干涉顯微照片。 第3圖是說明關於本實施形態的電解銅箔的圖,表示第2圖的白光干涉顯微照片內的一條線上的電解析出結束面的輪廓的圖。 FIG. 1 is a diagram illustrating a method for producing an electrolytic copper foil using an electrolytic deposition apparatus. FIG. 2 is a diagram illustrating the electrolytic copper foil according to the present embodiment, and shows a white light interference micrograph of unevenness formed on the electrolytic desorption end surface. FIG. 3 is a diagram for explaining the electrolytic copper foil of the present embodiment, and is a diagram showing the outline of an electrolytically resolved surface on a line in the white light interference micrograph of FIG. 2 .

國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic storage information (please note in the order of storage institution, date and number) none Foreign deposit information (please note in the order of deposit country, institution, date and number) none

Claims (10)

一種電解銅箔,當將箔厚設為t(μm)、將被形成在電解析出結束面上的凹部的體積的平均值也就是凹部平均體積設為VAV(μm 3)、將沿著長度方向拉伸而測得的拉伸率設為E(%),並使用白光干涉顯微鏡來測定凹部平均體積VAV時,箔厚t為10μm以上且20μm以下,凹部平均體積VAV與箔厚t的乘積也就是VAV×t為超過0μm 4且1000μm 4以下,將拉伸率E除以箔厚t而得的E/t為0.9%/μm以上且1.8%/μm以下。 An electrolytic copper foil, when the foil thickness is t (μm), the average value of the volume of the concave portions formed on the electrolytic desorption end surface, that is, the average volume of the concave portions is VAV (μm 3 ), and the length along the length When the elongation ratio measured by stretching in the direction is set as E (%), and the average volume VAV of the concave portion is measured using a white light interference microscope, the foil thickness t is 10 μm or more and 20 μm or less, and the product of the average volume of the concave portion VAV and the foil thickness t That is, VAV×t is more than 0 μm 4 and 1000 μm 4 or less, and E/t obtained by dividing the elongation E by the foil thickness t is 0.9%/μm or more and 1.8%/μm or less. 如請求項1所述之電解銅箔,其中,凹部平均體積VAV與箔厚t的乘積也就是VAV×t為超過0μm 4且400μm 4以下,將拉伸率E除以箔厚t而得的E/t為1.2%/μm以上且1.7%/μm以下。 The electrolytic copper foil according to claim 1, wherein the product of the average volume VAV of the concave portion and the foil thickness t, that is, VAV×t is more than 0 μm 4 and 400 μm 4 or less, and is obtained by dividing the elongation E by the foil thickness t E/t is 1.2%/μm or more and 1.7%/μm or less. 如請求項1或2所述之電解銅箔,其中,將拉伸率E除以箔厚t而得的E/t為1.3%/μm以上且1.6%/μm以下。The electrolytic copper foil according to claim 1 or 2, wherein E/t obtained by dividing the elongation E by the foil thickness t is 1.3%/μm or more and 1.6%/μm or less. 如請求項1至3中任一項所述之電解銅箔,其中,使用白光干涉顯微鏡而測得的前述電解析出結束面的均方根高度Sq為0.1μm以上且0.4μm以下。The electrolytic copper foil according to any one of claims 1 to 3, wherein the root-mean-square height Sq of the end surface of the electro-desorption measured using a white light interference microscope is 0.1 μm or more and 0.4 μm or less. 如請求項1至3中任一項所述之電解銅箔,其中,使用白光干涉顯微鏡而測得的前述電解析出結束面的均方根高度Sq為0.1μm以上且0.25μm以下。The electrolytic copper foil according to any one of claims 1 to 3, wherein the root-mean-square height Sq of the end surface of the electro-desorption measured using a white light interference microscope is 0.1 μm or more and 0.25 μm or less. 如請求項1至5中任一項所述之電解銅箔,其中,沿著長度方向拉伸而測得的拉伸強度為300MPa以上且380MPa以下。The electrolytic copper foil according to any one of claims 1 to 5, wherein the tensile strength measured by stretching in the longitudinal direction is 300 MPa or more and 380 MPa or less. 如請求項1至6中任一項所述之電解銅箔,其為鋰離子二次電池的負極集電體用。The electrolytic copper foil according to any one of claims 1 to 6, which is for a negative electrode current collector of a lithium ion secondary battery. 如請求項1至6中任一項所述之電解銅箔,其為印刷線路板用。The electrolytic copper foil according to any one of claims 1 to 6, which is for a printed wiring board. 一種鋰離子二次電池用負極,其具備請求項1至7中任一項所述之電解銅箔。A negative electrode for a lithium ion secondary battery comprising the electrolytic copper foil according to any one of claims 1 to 7. 一種鋰離子二次電池,其具備請求項9所述之鋰離子二次電池用負極。A lithium ion secondary battery comprising the negative electrode for a lithium ion secondary battery according to claim 9.
TW110138342A 2020-10-22 2021-10-15 Electrolytic copper foil, negative electrode for lithium ion secondary cell, and lithium ion secondary cell TW202223163A (en)

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