TW202221422A - Control device for controlling manipulators for a projection lens - Google Patents

Abstract

A control device (14) for controlling manipulators (M1-M4, 36) for changing an optical behaviour of a microlithographic projection lens (16) by generating respective stipulations (38) for a plurality of travel variables which define manipulations, to be undertaken by means of the manipulators, of at least one optical element (E1-E4) of the projection lens for the purposes of changing state parameters (34) of the projection lens is provided. The control device is configured to generate a respective approximation (38-1) of the stipulations for the travel variables by optimizing a uniform scaling factor (86) using a first optimization algorithm (74), said scaling factor, in constraints (82) of the first optimization algorithm, defining a uniform scaling of limits (84) specified for the individual state parameters, and to ascertain a respective final result (38) of the stipulations for the travel variables by means of at least one further optimization algorithm (76, 78) in the case where an optimization result (87) for the uniform scaling factor, as ascertained by means of the first optimization algorithm, does not exceed a specified threshold (85).

Description

Control device for manipulator of projection lens

This application claims priority from German Patent Application No. 10 2020 210 567.7 filed on August 20, 2020. The entire contents of this patent application are incorporated herein by reference.

The present invention relates to a control device and a method for controlling a plurality of manipulators to change the optical behavior of a lithographic projection lens. In addition, the present invention relates to an adjustment device for adjusting a lithography projection lens, a projection lens for a lithography projection exposure device with the control device, and a lithography projection exposure device with the projection lens.

In the production of semiconductor components, a lithographic projection exposure apparatus is used to produce structures on a substrate in the form of a semiconductor wafer. To this end, the projection exposure apparatus includes a projection lens with a plurality of optical elements for imaging the reticle structure on the wafer during the exposure procedure.

A projection lens with as little wavefront aberration as possible is required to ensure that the reticle structure imaged on the wafer is as accurate as possible. Therefore, a projection lens equipped with a manipulator can correct for wavefront errors by changing the state of the individual optical elements of the projection lens. Examples of such a state change include a change in relative position of one or more of the six rigid body degrees of freedom of the associated optical element, application of heat and/or cooling to the optical element. Additionally, one or more post-processing units may be provided for ablating material from an optical element by surface treatment to change the shape of an optical element. Such a post-processing unit may be part of the projection lens, or separate therefrom, and is also referred to as a manipulator within the scope of this document.

Manipulator corrections performed to correct for aberration characteristics of a projection lens are calculated by a stroke-generating optimization algorithm, also known as a "manipulator correction model". For example, this optimization algorithm is disclosed in patent case number WO 2010/034674 A1.

其中

Therefore, optimization algorithms known in the prior art can be constructed to solve the following optimization problems:

in

描述，考慮到由

所描述的限度。此處， M表示一靈敏度矩陣， x表示具有個別操縱器的行程變數 x _k 的一行程向量， b _mess 表示投影透鏡的一狀態向量，其描述投影透鏡的一測量像差特徵的個別狀態參數，

表示歐基里德範數，以及

表示個別行程變數 x _k 的一相對固定限制。 This optimization problem is structured to minimize the objective function (also known as the merit function or merit function), given by

description, taking into account the

the described limits. Here, M denotes a sensitivity matrix, x denotes a travel vector with travel variables x _k of the individual manipulators, b _mess denotes a state vector of the projection lens, which describes an individual state parameter of a measured aberration characteristic of the projection lens,

represents the Euclidean norm, and

represents a relatively fixed limit for the individual travel variable _xk .

To ensure that even the state parameters of the projection lens, in particular the aberrations of the projection lens, respect the envisaged constraints, it is customary to incorporate a suitable influence factor term into the objective function. Depending on the weight or stringency of the relevant impact factor term, such impact factor term essentially represents a "soft" limit or target that is respected or selectively exceeded to a certain extent.

Such an influence factor term H _b (the state function is included in the objective function) for limiting the state parameters of the projection lens in patent DE10 2015 206 448 A1 is expressed as follows:

表示投影透鏡的對應狀態參數的相對目標值或規範，以冊尼克（Zernike）係數 b _j 的形式表示。此外，

及

表示使用者可根據相關影響因子項的權重及嚴格度，自由選擇的參數。 in,

Represents the relative target value or specification of the corresponding state parameter of the projection lens, expressed in the form of the Zernike coefficient b _j . also,

and

Indicates parameters that users can freely choose according to the weight and strictness of the relevant impact factor items.

In order to determine the so-called recipe of a manipulator for a projection lens, that is, the travel conditions for the travel variables of the manipulator, it is customary to require a plurality of iterations of the optimization algorithm, within which the weights of the influence factor terms or strict The degree is varied until the constraints of the state parameter are well respected. This is a very time-consuming process, especially since if a reliable recipe cannot be found, it will not be known whether a reliable recipe actually exists. In this context, a reliable recipe is understood as a stroke condition for the manipulator's stroke variable. In the case of a reliable recipe, the stroke conditions for the stroke variable are chosen to adhere to relative specification limits.

basic purpose

An object of the present invention is to provide a control device and a method for solving the aforementioned problems and in particular for finding a recipe for the stroke variable in a relatively short time. Solution according to the invention

For example, according to the present invention, the aforementioned objects are achieved by a control device for controlling a manipulator, which control device changes the optical behavior of a lithographic projection lens by generating relative travel conditions of a plurality of travel variables, The travel variables define the manipulation of at least one optical element of the projection lens by the manipulators for changing state parameters of the projection lens. The control device according to the present invention is configured to generate a relative approximation to the travel variable travel conditions by using a first optimization algorithm to optimize a scaling factor at the first maximum In the Limits of the Optimization Algorithm, the first scaling limits are defined, and these limits are specified for these individual state parameters. Furthermore, the control device according to the present invention is configured to optimize by at least one further optimization, provided that an optimization result of the scaling factor does not exceed a certain critical value determined by the first optimization algorithm. An algorithm is developed to determine a relative end result of the trip variable trip condition.

In other words, if the optimization result of the first optimization result of the scaling factor does not exceed a certain run, the relative final result of the run-variable run condition is determined by at least one further optimization algorithm. In this context, a "stroke" is understood to mean a change in a state parameter of one or more optical elements along the stroke, accomplished by actuation of a manipulator, for the purpose of changing the optical power of one or more optical elements. For example, the manipulation may consist of a displacement of the optical element in a particular direction, but also may consist of an impact of the optical element, in particular local or Two-dimensional shock. Additionally, manipulation can define material ablation at an optical element, performed by a post-processing unit.

In particular, the state parameter may be the aberration of the projection lens. The scaling factor can also be referred to as the target arrival variable. This target arrival variable describes a normalized distance between the limit and the corresponding state parameter. For example, a value of 1 can be designated as a threshold, ie certain limits are respected. In addition, a higher value can be set as the threshold value. What is known, at least in this case, is the extent to which the limit is exceeded.

The first optimization algorithm helps to reliably determine whether there is an acceptable recipe for a set of state parameters of the projection exposure apparatus, ie, whether the control device can determine the travel conditions of the travel variable, thereby adhering to certain constraints. In particular, the first optimization algorithm and/or the second optimization algorithm are configured to solve a nonlinear optimization problem.

By creatively generating a proportional scaling factor by the first optimization algorithm, it is possible to reliably assume that there is a reliable recipe, and thus to find the final result of the stroke-variable stroke condition, without the need to perform more optimization calculations with weight changes multiple iterations of the method, in which case the question of whether the optimization result for the equal scaling factor does not exceed a certain critical value should be affirmative. Thus, the recipe for the stroke variable can be found in a very time-saving manner. In particular, limits can be formulated as hard limits that are reliably observed, eg as explicit limits. Explicit limits are understood to be limits that are not part of the relevant objective function, as is the case in the prior art using impact factor terms.

According to another embodiment, the control device is further configured to, when executing at least one further optimization algorithm, execute a state parameter optimization algorithm in which individual proportions are optimized A weighted sum of scaling factors, taking into account the state parameter limits associated with the state parameters, wherein the individual scaling factors in the state parameter limits define a relative scaling limit imposed by the individual state parameters specified.

In particular, the limit corresponds to the aforementioned explicit limit, taking into account the weighted summation of optimized individual scaling factors. In particular, when executing at least one further optimization algorithm, the travel conditions for the travel variables generated by the limits are taken into account by optimizing the weighted sum of the individual scaling factors. In other words, the weighted summation of the individual scaling factors forms the objective function of the state parameter optimization algorithm. Scaling a particular limit by a relative individual scaling factor should be understood to mean that one of a plurality of individual scaling factors is assigned to each of the plurality of constraints, and the relative constraints are then scaled by the relative scaling factor. In particular, state parameter limits also include limits for individual state parameters. In particular, the state parameter optimization algorithm is structured to solve a nonlinear optimization problem.

According to another embodiment, the control device is further configured to execute, when executing at least one further optimization algorithm, a travel optimization algorithm, wherein an objective function including travel variables is optimized. In particular, the state parameter optimization algorithm is structured to solve a nonlinear optimization problem.

According to another embodiment, the control device is configured to, when executing at least one further optimization algorithm, firstly execute the state parameter optimization algorithm, and then execute the travel optimization algorithm, wherein the travel optimization algorithm The method is constructed to optimize the objective function taking into account the condition that each of the further individual scaling factors may exceed the optimization result of these corresponding first individual scaling factors by no more than 5% (in particular, no more than 1 %), these corresponding first individual scaling factors are determined by the state parameter optimization algorithm. In particular, specific conditions are part of the travel optimization limits, and in particular also include the limits of individual state parameters. Relaxing further individual scaling factors enables the run optimization algorithm to fully exploit to find an optimal solution to the objective function with run variables.

According to another embodiment, the control device is further configured to base the travel optimization algorithm on more approximations of travel conditions based on the travel variables determined when executing the state parameter optimization algorithm.

According to another embodiment, the state parameter limit also includes the condition that each of these first individual scaling factors can exceed the optimal result of the equal scaling factor by no more than 5% (in particular no more than 1% ), the scaling factors are determined by the first optimization algorithm. Relaxing the individual scaling factors enables the state parameter optimization algorithm to work to find an optimal solution for the weighted sum of the individual scaling factors.

According to another specific embodiment, the objective function of the travel optimization algorithm contains travel variables in at least quadratic form, ie in exponents of at least a power of 2.

According to another embodiment, the control means are further configured to base at least one further optimization algorithm on approximations of the travel conditions of the travel variables as starting values.

According to another embodiment, the limits of the first optimization algorithm are defined as explicit limits, which are not part of an objective function that is optimized when executing the first optimization algorithm. Thus, an explicit limit is understood to be a limit that is not part of the objective function; in contrast, an implicit limit is part of the objective function. According to another embodiment, the state parameter limits and/or the limits on the basis of the itinerary optimization algorithm are also defined as explicit limits.

According to another embodiment, the determined stroke variable stroke conditions define changes in the state parameters of the projection lens, the changes being carried out by means of the manipulator. In particular, it defines the changes that will occur in the state parameters of the projection lens and the state parameters of the projection exposure device independent of the projection lens, such as those related to the illumination system of the projection exposure device.

Furthermore, according to the present invention, an adjustment device for adjusting a lithography projection lens is provided. The adjustment device comprises a measuring device and a control device as in any of the preceding embodiments or variants of the specific embodiment, the measuring device being used to determine the current value of the state parameter of the projection lens, the control device from the current value of the state parameter Generates a stroke variable stroke condition.

Furthermore, according to the present invention there is provided a projection lens for a lithographic projection exposure apparatus, the projection lens comprising a manipulator configured to change a state parameter of the projection lens. In addition, the projection lens includes a control device as described in any preceding embodiment or embodiment variant for controlling the manipulator.

In addition, according to the present invention, there is provided a lithography projection exposure device comprising the aforementioned projection lens.

Furthermore, the aforementioned objects can be achieved, for example, by a method for controlling a manipulator to change the optical behavior of a lithographic projection lens by generating relative travel conditions of a plurality of travel variables. The travel variable defines the manipulation of at least one optical element of the projection lens by the manipulator for changing the state parameter. The method according to the present invention includes generating a relative approximation to the travel variable travel conditions by optimizing a scaling factor using a first optimization algorithm, wherein the scaling factor is used in the first optimization algorithm Among the limits of the method, define the first scaling limits, which are specified for individual state parameters, and where an optimization result of the scaling factor, as determined by the first optimization algorithm, does not exceed a A relative end result of the travel variable travel condition is determined by at least one further optimization algorithm for certain thresholds.

According to an embodiment of the method of the present invention, at least one further optimization algorithm is used to determine the relative finality of the travel variable travel conditions. Therefore, the further optimization algorithm takes into account the explicit modification of the projection lens state parameters, It is not part of an objective function that is optimized when performing at least one further optimization algorithm.

The specific features enumerated above with respect to specific embodiments, exemplary embodiments and specific embodiment variants etc. of the control device according to the invention can thus be transferred to the control method according to the invention. These specific embodiments and other features according to the invention are explained in the description and claims of the drawings. As specific embodiments of the invention, individual features may be implemented individually or in combination. Furthermore, it may describe preferred embodiments that are independently protectable and claimed only during or after application, as appropriate.

In the exemplary embodiments, embodiments or variations of the embodiments described below, elements that are functionally or structurally similar to each other are provided with the same or similar reference numerals wherever possible. Therefore, to understand the characteristics of individual elements of a particular exemplary embodiment, reference should be made to the descriptions of other exemplary embodiments or to the general description of the invention.

For the convenience of description, a Cartesian xyz coordinate system is indicated in the drawings, and the positional relationship of each component in the drawing can be clearly seen from the coordinate system. In Figure 1, the y-direction extends perpendicular to the plane of the drawing, the x-direction extends to the right, and the z-direction extends upward.

FIG. 1 shows an adjustment device 10 for adjusting a projection lens 16 of a lithographic projection exposure device. The adjustment device 10 includes a measuring device 12 for determining a state parameter 34 of the projection lens 16, which state parameter characterizes the aberration of the projection lens 16, and a control device 14 in the form of a so-called stroke determination device , for generating a travel command 38 with travel conditions 38n and 38p from the state parameter 34 for the travel variable _xk of the manipulator. Herein, travel conditions 38n and 38p are also referred to as travel vector x and define the manipulation of at least one optical element E1 to E4 of projection lens 16 by a manipulator, described in more detail below.

Projection lens 16 is used to image the reticle structure from an object plane 24 into an image plane 28 and can be designed for exposure radiation of different wavelengths, such as 248 nm or 193 nm. In this particular embodiment, the projection lens 16 is designed for a wavelength in the EUV wavelength range of less than 100 nm, eg, about 13.5 nm or about 6.8 nm.

The measurement device 12 is configured to measure the wavefront error of the projection lens 16 and includes an illumination unit 18 and a measurement mask 22 on the entrance side of the projection lens 16 and a sensor element 26 on the exit side of the projection lens 16 , a detector 30 and an evaluation unit 32 . The illumination unit 18 is configured to generate measurement radiation 20, in this case in the form of EUV radiation, at the operating wavelength of the projection lens 16 to be tested, and to irradiate said radiation to the measurement reticle arranged in the object plane 24 22 on. The measurement mask 22, also commonly referred to as a "coherent mask", has a first periodic structure. A sensor element 26 in the form of an image grating with a second periodic structure is arranged in the image plane 28 . The checkerboard structure in the measurement reticle 22 may also be combined with the checkerboard structure in the sensor element 26 . Other combinations of periodic structures known to those of ordinary skill in the art from the field of shear interferometry or point diffraction interferometry can also be used.

A detector 30 in the form of a camera resolved in two dimensions is arranged below the sensor element 26 , to be precise in a plane that is conjugate to the pupil plane of the projection lens 16 . The sensor element 26 and the detector 30 together form a sensor module. The measurement mask 22 and sensor module form a shear interferometer or point diffraction interferometer, as known to those of ordinary skill in the art, and are used to measure the wavefront error of the projection lens 16 . For this purpose, phase shifting methods known to those of ordinary skill in the art are used in particular.

The evaluation unit 32 determines the state parameter 34 of the projection lens 16 from the intensity pattern recorded by the detector 30 . According to this particular embodiment, the state parameters 34 comprise a set of Schönnick coefficients b _j characterized as the wavefront error of the projection lens 16 .

是從Daniel Malacara撰寫、約翰威立（John Wiley & Sons, Inc.）出版的教科書「Optical Shop Testing」第2版（1992）的第13.2.3章中所得知的。根據所謂的條紋排序以Z _j表示，如在美國專利案US 2013/0188246A1中的第[0125]至[0129]段中所述，然後 b _j是指定到相對的冊尼克多項式的冊尼克係數（亦稱為「冊尼克函數」）。條紋排序如由Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim在2005年出版的「光學系統手冊」第2卷、第215頁的表20-2中進行說明。投影透鏡物件平面中某一點處的波前偏差 W(ρ,Φ)然後以隨著光瞳平面的極座標(ρ, Φ) 的方式，如下方式串聯擴展：

(1) In the present application, the Schonick function

It is known from Chapter 13.2.3 of the textbook "Optical Shop Testing" 2nd Edition (1992) written by Daniel Malacara and published by John Wiley & Sons, Inc.. Denoted by Z _j according to the so-called fringe ordering, as described in paragraphs [0125] to [0129] in US Patent Application US 2013/0188246 A1, then b _j are the Honick coefficients assigned to the relative Sonick polynomial ( Also known as the "Schonick function"). The fringe ordering is as described in Table 20-2, "Handbook of Optical Systems", Vol. 2, p. 215, published by Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, 2005. The wavefront deviation W(ρ,Φ) at a point in the object plane of the projection lens is then expanded in series with the polar coordinates (ρ, Φ) of the pupil plane as follows:

(1)

Within the scope of the present application, the Schonick polynomials are denoted by Z _j , ie by the subscript j, and the Schonick coefficients are denoted by b _j . It should be noted here that the Schonick coefficient b _j is also usually denoted by Z _j in the professional field, ie by a normally written index such as, for example, Z5 and Z6 representing astigmatism.

，其中L是一用於可藉操縱器M1至M4控制的行程變數 x _k的計數器。行程條件38n包含用於控制一後處理單元36、以對投影透鏡16的光學元件E1至E4進行機械後處理的行程條件

，其中L是一用於可藉後處理單元36控制的行程變數 x _k的計數器。 The status feature 34 established by the evaluation unit 32 of the measuring device 12 is transmitted to the control device 14 , which generates the travel command 38 therefrom. As previously mentioned, the travel command 38 in the exemplary embodiment of the present invention includes travel conditions 38n and 38p. The stroke condition 38p includes the stroke conditions of the manipulators M1 to M4 of the projection lens 16

, where L is a counter for the travel variable _xk controllable by the manipulators M1 to M4. The travel conditions 38n include travel conditions for controlling a post-processing unit 36 to mechanically post-process the optical elements E1 to E4 of the projection lens 16

, where L is a counter for the run variable x _k controllable by the post-processing unit 36 .

Within the scope of the present application, the manipulators M1 to M4 of the projection lens 16 and the post-processing unit 36 are both understood as manipulators for changing the optical behavior of the projection lens 16 , more precisely for changing the projection lens 16 The purpose of the state parameter 34 is to manipulate at least one of the optical elements E1 to E4 of the projection lens 16 .

In the specific embodiment according to FIG. 1 , the projection lens 16 has four optical elements E1 to E4 . All optics are removably mounted. To this end, an opposing manipulator MS, in particular an opposing one of the manipulators M1 to M4, is assigned to each of the optical elements E1 to E4. The manipulators M1 , M2 and M3 are each capable of displacing the assigned optical elements E1 , E2 and E3 in the x and y directions and thus in a plane substantially parallel to the opposing reflecting surfaces of the optical elements.

The manipulator M4 is configured to tilt the optical element E4 by rotation about a tilt axis 40 which is arranged parallel to the y-axis. Therefore, the reflective surface angle of E4 is modified relative to the incident radiation. It is conceivable that the manipulator has more degrees of freedom. Thus, for example, a displacement of an associated optical element on its optical surface, or a rotation about a reference axis perpendicular to the reflective surface, can be provided.

In general, each of the manipulators Ml-M4 shown herein are provided to cause displacement of the associated optical elements El-E4 while performing rigid body motion along a stroke defined by stroke condition 38p. For example, such a stroke may combine translations, tilts and/or rotations in different directions in any manner. Alternatively or additionally, manipulators may also be provided that are configured to change a state variable of the associated optical element in different ways by an appropriate actuation of the manipulator. In this regard, an actuation can be performed, for example, by applying a specific temperature distribution or a specific force distribution to the optical element. In this case, the stroke may be due to a change in the temperature distribution on the optical element or a local tension is applied to an optical element - thus, the optical element may be implemented as a deformable lens or a deformable mirror.

、

、

及

，其預先確定由操縱器M1至M4所執行的改變，因此其用以控制投影透鏡16的操縱器M1至M4。所確定的行程

、

、

及

，藉行程訊號傳達至個別操縱器M1至M4，並為其預定義要實現的相對校正行程。這些定義了指定到的光學元件M1至M4的對應位移，用於校正投影透鏡16發生的波前誤差。在一操縱器具有複數個自由度的情況下，也可以向其傳達多個行程

。 In the case shown, the stroke command 38 includes the stroke 38p, containing the stroke

,

,

and

, which predetermines the changes performed by the manipulators M1 to M4 , which are therefore used to control the manipulators M1 to M4 of the projection lens 16 . determined itinerary

,

,

and

, which is communicated to the individual manipulators M1 to M4 by means of the travel signal, and for which the relative correction travel to be achieved is predefined. These define the corresponding displacements assigned to the optical elements M1 to M4 for correcting the wavefront errors that occur with the projection lens 16 . Multiple strokes can also be communicated to a manipulator with multiple degrees of freedom

.

) ，在所示的情況下含有行程

、

、

及

，且行程用於控制後處理單元36，以對投影透鏡16的光學元件E1、E2、E3及E4進行相對的機械後處理。因此，類似於行程

至

，行程

至

用於校正所發生投影透鏡16的波前誤差。 The travel command 38 also includes the travel condition 38n of the post-processing unit 36 (

), with stroke in the case shown

,

,

and

, and the stroke is used to control the post-processing unit 36 to perform relative mechanical post-processing on the optical elements E1 , E2 , E3 and E4 of the projection lens 16 . So, similar to itinerary

to

,journey

to

Used to correct for wavefront errors of the projection lens 16 that occur.

Post-processing unit 36 should be understood as a unit for mechanically ablating material at the optical surface of an optical element in the form of a lens or a mirror. This ablation follows the creation of optical elements. Therefore, a corresponding post-processing optical element is also called an intrinsically corrected aspheric surface (Intrinsically Corrected Asphere, ICA). In particular, an ablation unit, typically used for ICA mechanical processing, can be used as a post-processing unit 36 . Therefore, ablation is also referred to below as "ICA ablation". For example, an ion beam can be used for mechanical processing. Using this mechanical process, any corrected profile can be processed into a post-processed optic.

FIG. 2 shows a specific embodiment of a lithography projection exposure apparatus 50 according to the present invention. This particular embodiment is designed for operation in the EUV wavelength range. Due to this operating wavelength, all optical elements are implemented as mirrors. However, the present invention is not limited to projection exposure devices in the EUV wavelength range. According to further specific embodiments of the present invention, it is designed for operating wavelengths in the UV range, eg 365 nm, 248 nm or 193 nm. In this case, at least some of the optical elements are configured as conventional transmissive lens elements.

The projection exposure device 50 according to FIG. 2 includes an exposure radiation source 52 for generating exposure radiation 54 . In this case, the exposure radiation source 52 is implemented as an EUV source, and it may comprise, for example, a plasmonic radiation source. Exposure radiation 54 initially passes through an illumination optical unit 56 and is thereby deflected onto a reticle 58 . Illumination optics 56 are configured to produce different angular distributions of exposure radiation 54 incident on reticle 58 . Illumination optics 56 are configured to expose the angular distribution of radiation 54 incident on reticle 58 depending on an illumination setting desired by the user. Examples of selectable lighting settings include so-called dipole lighting, ring lighting and quadrupole lighting, but also freeform lighting, ie an intensity distribution of the lighting profile that can be freely selected to a point.

The reticle 58 has a reticle structure to be imaged on a substrate 64 in the form of a wafer, and is movably mounted on the reticle stage 60 . As shown in FIG. 2, the reticle 58 can be implemented as a reflective reticle, or it can also be configured as a transmissive reticle, especially for UV lithography. In the specific embodiment according to FIG. 2 , the exposure radiation 54 is reflected at the reticle 58 and then passes through the projection lens 16 , which has been described with reference to the adjustment device 10 according to FIG. 1 . Projection lens 16 is used to image the reticle structure of reticle 58 on substrate 64 . Exposure radiation 54 is guided within projection lens 16 by a plurality of optical elements E1 to E4 (presented as mirrors). The substrate 64 is movably mounted on a substrate translation stage 66 . The projection exposure device 50 can be designed as a so-called scanner or as a so-called stepper.

In the case of the embodiment implemented as a scanner (which is also referred to as a step-scan projection exposure apparatus), each time reticle 58 is imaged onto substrate 64 (ie, each time an exposure is made on substrate 64 ) During one field), the mask stage 60 and the substrate stage 66 move in opposite directions or the same direction. As shown in FIG. 2, in this case, for example, the reticle stage 60 moves in a scan direction 62 pointing to the left, and the substrate stage moves in a scan direction 68 pointing to the right. The so-called recession aberration can be traced back to the scanning motion of this scanner during field exposure and is explained in more detail below.

的行程條件38p。狀態參數可藉一外部波前測量器件收集，如參考圖1所述的測量器件12。然而，或者，狀態參數34亦可藉整合在基材位移台66中的一波前測量單元70來測量。根據另一具體實施例，含在投影曝光裝置50中的控制器件14可對應於圖1的控制器件14，並可產生一行程命令38，除了行程條件38p之外，還包括用於後處理單元36的行程條件38n。在此情況下，受後處理影響的光學元件E1至E4首先從投影透鏡16中移除，並基於行程條件38n進行後處理。然後，將光學元件E1至E4重新插入投影透鏡16中，並藉操縱器M1至M4根據行程條件38p進行調整。 The projection exposure apparatus 50 further includes a control device 14 . In the embodiment visualized, the control device differs from the control device 14 of FIG. 1 only in that the travel command 38 generated from the state parameters 34 includes only travel variables for the manipulators M1 to M4

The trip condition is 38p. The state parameters may be collected by means of an external wavefront measurement device, such as measurement device 12 described with reference to FIG. 1 . Alternatively, however, the state parameter 34 may also be measured by a wavefront measurement unit 70 integrated in the substrate stage 66 . According to another specific embodiment, the control device 14 contained in the projection exposure apparatus 50 may correspond to the control device 14 of FIG. 1 and may generate a stroke command 38 which, in addition to the stroke condition 38p, also includes a post-processing unit for 36 stroke condition 38n. In this case, the optical elements E1 to E4 affected by the post-processing are first removed from the projection lens 16 and post-processed based on the travel condition 38n. Then, the optical elements E1 to E4 are reinserted into the projection lens 16 and adjusted according to the travel conditions 38p by means of the manipulators M1 to M4.

3, the function of the control device 14 is explained below in an exemplary manner. It is configured to perform an overall optimization algorithm 72 that generates a trip, the overall optimization algorithm 72 including a plurality of individual optimization algorithms 74 , 76 and 78 .

The limits of the optimization problem include the specification or maximum travel condition for the state parameter 34 of the projection lens 16, and the specification or maximum for the travel variable _xk . The individual state parameters 34 are also referred to below as ZP _i , where i is a counter.

(2) The limits for the state parameter 34 of the projection lens 16 are generally expressed as follows:

(2)

是投影透鏡16的狀態參數 ZP _i的規範值或限制，由索引i編號，且 B _i(x) 為包括投影透鏡16的相對狀態參數的函數，其可為行程因子x的函數。根據一具體實施例，按照式子（2）的限度包括以下限度群：

(3)

(4)

，及                                    (5)

(6) in,

is the normative value or limit of the state parameter ZP _i of the projection lens 16, numbered by index i, and B _i (x) is a function including the relative state parameter of the projection lens 16, which may be a function of the travel factor x. According to a specific embodiment, the limits according to equation (2) include the following limit groups:

(3)

(4)

, and (5)

(6)

是個別冊尼克係數 b _j 的規範，其中索引 j從1至

，亦即在此情況下，狀態參數 ZP _i對應於冊尼克係數 b _j 。規範

對應於從項（2）i = 1至

的一般規範值

。 M是上面已提及的一靈敏度矩陣，描述標準行程 x _k ⁰ 與調整一操縱器自由度 k 之間的關係。 Among them, the limit group system according to the formula (3) is related to the conditions of the individual Schonick coefficients b _j . in,

is the specification of the individual Shonick coefficients b _j , where index j ranges from 1 to

, that is, in this case, the state parameter ZP _i corresponds to the Schonick coefficient b _j . specification

corresponds to the terms (2) i = 1 to

general specification value of

. M is a sensitivity matrix already mentioned above, describing the relationship between the standard travel x _k ⁰ and adjusting a manipulator degree of freedom k.

是：

(7) Representation in Equation (4)

Yes:

(7)

的條件有關。這些可從測得的冊尼克像差 b _j 計算而來。此外，

是衰退像差

的目標值或特定規範，其中索引j從1運行至

。也就是說，在此情況下狀態參數 ZP _i對應於衰退像差

。從式子（2），規範

對應於一般規範值

，其中 i =

+1 至

+

。索引m的總和為沿著投影曝光裝置的掃描方向在所有場點上運行。參數 w _m表示所謂的掃描權重，亦即追溯到掃描運動的影像像差的權重。

表示衰退像差

的一靈敏度矩陣，因此定義當藉一標準行程 x ₀調整操縱器時，由於衰退像差而導致的投影透鏡狀態向量b的改變。 The limit group system according to equation (4) and the so-called recession aberration

conditions related. These can be calculated from the measured Hornic aberrations b _j . also,

is the fading aberration

The target value or specific specification of , where index j runs from 1 to

. That is, in this case the state parameter ZP _i corresponds to the decaying aberration

. From equation (2), the norm

corresponds to the general norm value

, where i =

+1 to

+

. The sum of the indices m runs over all field points along the scanning direction of the projection exposure device. The parameter w _m represents the so-called scan weight, ie the weight of the image aberrations traced back to the scan motion.

Represents fading aberration

A sensitivity matrix of , thus defining the change in the projection lens state vector b due to fading aberration when the manipulator is adjusted by a standard travel x ₀ .

表示。其中，SZ ^p是一矩陣，其包括個別冊尼克係數 b _j 的場點相依權重。因此，一覆蓋誤差

由個別冊尼克係數 b _j 的線性組合形成。 The limit group system according to equation (5) is related to the condition of the coverage error. The coverage error is judged for different structure types, such as isolated lines, lines arranged in a grid, circular structures, etc. The different structure types are denoted by the index p. - The coverage error as a function of structure type p and field point m is given by the product

express. where SZ ^p is a matrix that includes the field point-dependent weights of the individual Shonick coefficients b _j . Therefore, a coverage error

It is formed by a linear combination of the individual Shonick coefficients b _j .

(8) The notation OVL _P in equation (5) is:

(8)

是結構類型p的覆蓋誤差的目標值或特定規範，其中索引p從1運行至p _max。也就是說，在此情況下狀態參數 ZP _i對應於覆蓋誤差

。從式子（2），規範

對應於一般規範值

，其中 i =

+

+1 至

+

+ p _max。矩陣 M是前述的靈敏度矩陣係與像差的限度群有關。max函數判斷所有場點m的最大值。 also,

is the target value or specific specification of the coverage error for structure type p, where index p runs from 1 to p _max . That is, in this case the state parameter ZP _i corresponds to the overlay error

. From equation (2), the norm

corresponds to the general norm value

, where i =

+

+1 to

+

+ p _max . The matrix M is the aforementioned sensitivity matrix related to the limit group of aberrations. The max function determines the maximum value of all field points m.

(9) The limit group according to equation (6) is related to the condition of the grouped RMS value. where RMS ^r is defined as follows:

(9)

是個別冊尼克貢獻 b _j 對具有指數r的RMS值的權重，且最大值是建立在投影透鏡16的影像場的所有場點m上。分組的RMS值RMS ^r之每一者包括一群冊尼克係數 Zj，根據各種具體實施例具有相等方位角波紋，典型上所有冊尼克係數 Zj具有相關的方位角波紋（例如，2倍或4倍方位角波紋）直至某一徑向波紋（亦即，徑向波紋≤最大徑向波紋）。舉例來說，分組RMS值「RMS_AST_0」包括冊尼克係數Zj，其中j = 12、21、32……，而分組RMS值「RMS_Coma_x」包括冊尼克係數 Zj，其中j=7、14、23及34。在式子（6）中特定的RMS值RMS ^r的條件下，

是針對具有索引r的RMS值的特定規範。也就是說，在此情況下，狀態參數 ZP _i對應於RMS值 RMS ^r。 where r is an index of the grouped RMS value RMS ^r . For example, grouping is performed by classifying the corresponding Hornic coefficients b _j into categories such as "spherical aberration", "coma aberration", "astigmatism", and the like. The sum on j is a sum on the Sonic class,

is the weight of the individual Schonick contributions b _j to the RMS value with the index r, and the maximum value is established at all field points m of the image field of the projection lens 16 . Each of the grouped RMS values RMS ^r includes a set of Honnick coefficients Zj with equal azimuthal ripples according to various embodiments, typically all Honnick coefficients Zj have associated azimuthal ripples (eg, 2-fold or 4-fold azimuthal ripples). angular corrugation) up to a certain radial corrugation (ie, radial corrugation ≤ maximum radial corrugation). For example, the grouped RMS values "RMS_AST_0" include the Honnick coefficients Zj, where j = 12, 21, 32, . . Under the condition of the specified RMS value RMS ^r in equation (6),

is a specific specification for the RMS value with index r. That is, in this case, the state parameter ZP _i corresponds to the RMS value RMS ^r .

As previously mentioned, the overall optimization algorithm 72 executed by the control device 14 includes a plurality of individual optimization algorithms. Denoted by reference numeral 74 in FIG. 3, the first of these optimization algorithms optimizes the following objective function F, also commonly referred to as a merit function or function of merit, denoted by reference numeral 80 in FIG. 3: F( x , t _s ) = t _s ; that is, F → min (10)

，                                                                             (11)

，及                                    (12)

(13) Has the following explicit limits:

, (11)

, and (12)

(13)

，每個前面都有一等比例縮放因子 t _s。在圖3中以參考標號86表示的縮放因子t _s，對於所有規範值

都是相同的，並且用於等比例縮放規範值或限制84，該規範值或限制84是為投影透鏡14的個別狀態參數 ZP _i所指定。在（13）中引用的限度，最後為個別行程變數 x _k 特定規範或限制

，並且取決於具體實施例變體也可以省略。 The limit-specific _ts quoted in equation (11) must not be negative. The limits quoted in the limit equation (12) (represented by reference 82 in FIG. 3 ) are related to the state parameter ZP _i of the projection lens 12 and correspond to the limits quoted in equation (2), except that in FIG. 3 is the limit or specification value denoted by reference numeral 84

, each preceded by a proportional scaling factor _ts . The scaling factor _ts denoted by reference numeral 86 in Figure 3, for all normative values

are all the same, and are used to scale the normative value or limit 84 specified for the individual state parameter ZP _i of the projection lens 14 . Limits quoted in (13), and finally individual trip variables x _k specific specifications or limits

, and may also be omitted depending on the specific embodiment variant.

The optimization algorithm 74 is now structured to optimize the scaling factor _ts by minimization. Due to this optimization, an approximate travel command 38-1 is generated based on the measured state parameters 34. This approximate travel command 38-1 includes an approximation of the travel condition 38p or 38n for the travel variable _xk .

不超過一特定臨界值85的情況下，該臨界值較佳為1，亦即若

≤ 1，則過渡到第二最佳化演算法76。在此情況下，已經可確定，對於投影透鏡16的操縱器的行程變數 x _k，存在行程條件形式的一可接受配方，其中遵守為投影透鏡的狀態參數特定的所有限制84。因此，若存在限度遵守行程變數 x _k的行程條件，則存在一可接受配方。若

＞ 1，由於不存在可接受配方，故最佳化通常終止。然而，若 t _s剛好超過臨界值，則藉由第二及第三最佳化演算法76及78產生一配方可能是有利的，藉此配方至少在最大程度上遵守限制84。 In Figure 3 is indicated by reference numeral 87 the result of the optimization at the equal scaling factor _ts

Without exceeding a certain threshold value 85, the threshold value is preferably 1, that is, if

≤ 1, transition to the second optimization algorithm 76 . In this case, it has been determined that, for the travel variable _xk of the manipulator of the projection lens 16, there is an acceptable formula in the form of travel conditions, in which all constraints 84 specific to the state parameters of the projection lens are respected. Therefore, if there are travel conditions that limit compliance with the travel variable _xk , there is an acceptable recipe. like

> 1, optimization is usually terminated because no acceptable formulation exists. However, if _ts just exceeds a critical value, it may be advantageous to generate a recipe by the second and third optimization algorithms 76 and 78 whereby the recipe adheres to the constraints 84 at least to the greatest extent.

The second optimization algorithm 76 is used for the individual optimization of the state parameters 34 of the projection lens 16 and is therefore also referred to herein as a state parameter optimization algorithm. To this end, each state parameter ZP _i is assigned a corresponding individual scaling factor t _i , denoted by reference numeral 90 in FIG. 3 .

；                                        (14) The objective function F (indicated by reference numeral 88 in FIG. 3 ) of the second optimization algorithm 76 is formed by a weighted sum 92 of the individual scaling factors ti, where the relative weighting factors are denoted by _{wi :}

; (14)

，                                        (15)

，及                                    (16)

(17) The optimization of the objective function F shown in equation (14) (that is, F → min) is achieved under the following explicit limits:

, (15)

, and (16)

(17)

不大於1%，該最佳化結果是由第一最佳化演算法74所確定。根據另外的具體實施例，限度式子（15）亦可訂定，使得 t _i可使最佳化結果

超過一較大百分比

，諸如，例如5%。寬鬆個別比例縮放因子90使第二最佳化演算法76能充分發揮，以找到個別比例縮放因子90的加權加總92的一最佳化解決方案。 The limits referenced in limit equations (15) and (16) are also referred to herein as state parameter limits 94 . The limits quoted in equation (15) specify that in each case the individual scaling factor ti cannot be negative, and in each case the optimal result of the equal scaling factor _{t s}

Not more than 1%, the optimization result is determined by the first optimization algorithm 74 . According to another specific embodiment, the limit formula (15) can also be defined, so that t _i can optimize the result

more than a larger percentage

, such as, for example, 5%. Relaxing the individual scaling factors 90 allows the second optimization algorithm 76 to fully exploit to find an optimal solution for the weighted sum 92 of the individual scaling factors 90 .

之每一者前面加註相關個別比例縮放因子 t _i ，而非等比例縮放因子 t _s 。因此，個別比例縮放因子90定義一相對比例縮放的限制84，其係針對個別狀態參數ZP _i指定。限度式子（17）中引用的限度係與第一最佳化演算法74的限度（13）相同，並且指定個別行程變數 x _k 的規範或限制

。取決於具體實施例變體，這些亦可以類似限度（13）的方式省略。 The condition of the state parameter limit 94 quoted in the limit expression (16) corresponds to the limit expression (12) of the first optimization algorithm 74, except that the canonical value of the individual state parameter ZP _i

Each of these is preceded by an associated individual scaling factor _ti , rather than an equal scaling factor _ts . Thus, the individual scaling factor 90 defines a relative scaling limit 84 that is specified for the individual state parameter ZP _i . The limits quoted in the limit expression (17) are the same as the limit (13) of the first optimization algorithm 74 and specify the specification or limit of the individual travel variable x _k

. Depending on the specific embodiment variant, these can also be omitted in a manner similar to limit (13).

。更近似行程命令38-2包括用於行程變數 x _k的行程條件38p或者38n的更近似值。 The trip conditions contained in the approximate trip command 38 - 1 determined by the first optimization algorithm 74 are the starting values as the basis for the second optimization algorithm 76 . The optimization of the second optimization algorithm 76 results in a more approximate travel command _38-2 and an optimization result for the individual scaling factor ti indicated by reference numeral 91 in FIG. 3

. The more approximate stroke command 38-2 includes a more approximate value of the stroke condition 38p or 38n for the stroke variable _xk .

A third optimization algorithm 78 is used to optimize the strokes 38p and 38n performed by the manipulators of the projection lens 16 and optionally performed by the post-processing unit 36 and specified by the stroke command 38 . In general, the goal of this paper is to minimize these trips. Therefore, the third optimization algorithm 78 is also referred to herein as a trip optimization algorithm.

(18) 其中

且

(19) The objective function F of the third optimization algorithm 78, represented by reference 96 in FIG. 3, is as follows:

(18) of which

and

(19)

，                                        (20)

，及                                    (21)

(22) where x ^t represents the transposed run vector x , M ^t represents the transposed sensitivity matrix M , and b ^t represents the vector of the transposed Schonick coefficients b _j . Since the objective function F contains the run variable x _k through the run vector x according to equation (18), the third optimization algorithm 78 is also referred to herein as the run optimization algorithm. Since the objective function F contains x and x ^t as factors according to equation (18), the objective function F contains a quadratic form of the stroke variable x _k . The optimization of the objective function F shown in equation (18) (ie, F → min) is achieved under the following explicit limits:

, (20)

, and (21)

(twenty two)

不能為負，並且在每一情況下，對應個別比例縮放因子 t _i的最佳化結果

不大於1%，該結果是由第二最佳化演算法76所確定。根據另外的具體實施例，限度式子（20）亦可訂定，使得

可以一更大百分比超過對應最佳化結果

，如5%。寬鬆進一步個別比例縮放因子100使第三最佳化演算法能充分發揮，以找到行程38p或者38n的一最佳化解決方案。 The bounds cited in bound equations (20) and (21) are also referred to herein as travel optimization bounds 98. The limits cited in (20) are specific, in each case further individual scaling factors denoted by reference numeral 100

cannot be negative, and in each case corresponds to the optimization of the individual scaling factor t _i

No more than 1%, the result is determined by the second optimization algorithm 76 . According to another specific embodiment, the limit formula (20) can also be defined such that

can exceed the corresponding optimization result by a larger percentage

, such as 5%. Relaxing the individual scaling factor further by 100 allows the third optimization algorithm to fully exploit to find an optimal solution for either run 38p or 38n.

。在（22）中引用的限度係相同於第一最佳化演算法74的限度（13）及第二最佳化演算法76的限度式子（17），其為個別行程變數 x _k指定規範或限制

。取決於具體實施例變體，這些亦可以類似限度（13）的方式省略。 The condition of limit 98 cited in limit expression (21) corresponds to limit (16) of the second optimization algorithm 76, except that the individual scaling factors _ti are replaced by further individual scaling factors

. The limits cited in (22) are the same as the limits (13) of the first optimization algorithm 74 and the limit expression (17) of the second optimization algorithm 76, which specify specifications for the individual run variables x _k or limit

. Depending on the specific embodiment variant, these can also be omitted in a manner similar to limit (13).

The trip condition determined by the second optimization algorithm 76 and contained in the further approximated trip command 38 - 2 is the starting value as the basis for the third optimization algorithm 78 . The optimization result of the third optimization algorithm 78 is the travel command 38 . The latter includes the final result of the stroke condition 38p or 38n of the stroke variable _xk , which is then transmitted as a control signal to the manipulators M1 to M4 of the projection lens 16, or to the post-processing unit 36, as described with reference to FIGS. 1 and 2 .

The foregoing descriptions of exemplary embodiments, specific embodiments, or variations of specific embodiments are to be understood as illustrative. The disclosure thus achieved first enables those skilled in the art to understand the invention and its related advantages, and secondly, changes and modifications to the described structures and methods are also apparent to those skilled in the art. Therefore, all changes and modifications, as long as they fall within the scope of the present invention and equivalent claims, should be protected by the claims according to the definition of the scope of the patent application hereinafter.

bj:像差 E1-E4:光學元件 M1-M4:操縱器 x:行程向量 xi:行程變數 xk:行程變數 10: Adjustment device 12: Measuring device 14: Control device 16: Projection lens 18: Lighting unit 20: Measuring radiation 22: Measuring mask 26: Sensor element 30: Detector 32: Evaluation unit 34: Status parameter 36: Post-processing unit 38: stroke command 38-1: approximate stroke command 38-2: more approximate stroke command 38p: projection lens manipulator stroke condition 38n: post-processing unit stroke condition 40: tilt axis 50: projection exposure device 52: exposure radiation source: 54: exposure radiation 56: illumination optics 58: reticle 60: reticle stage 62: scan direction of reticle stage 64: substrate 66: substrate stage 68: scan direction of substrate stage 70 : wavefront measurement unit t 72: overall optimization algorithm 74: first optimization algorithm 76: second optimization algorithm 78: third optimization algorithm 80: first optimization algorithm 82: Limits of the first optimization algorithm 84: Limits 85: Critical values 86: Equal scaling factor ts 87: Optimal results of the equal scaling factor ts 88: The second optimization algorithm Objective function 90: Individual scaling factors ti 91: Optimization results for individual scaling factors ti 92: Weighted summation 94: State parameter limits 96: Objective function of the third optimization algorithm 98: Travel optimization limits 100: more individual scaling factor

bj: Aberrations E1-E4: Optical elements M1-M4: Manipulator x: Stroke vector xi: Stroke variable xk: Stroke variable

The foregoing and other preferred features of the present invention are illustrated schematically in the following description of exemplary embodiments of the invention, which are set forth with reference to the accompanying drawings. In the attached image:

FIG. 1 shows an adjustment device for adjusting a projection lens of a lithography projection exposure device, which includes a control device for generating travel commands of a manipulator;

Figure 2 shows a lithographic projection exposure apparatus including a control device for generating travel commands for the manipulator; and

Figure 3 shows a visualization of the functionality of one of the aforementioned control means.

34: Status parameter

38: Stroke Command

38-1: Approximate stroke command

38-2: More approximate stroke command

72: Overall Optimization Algorithm

74: First Optimization Algorithm

76: Second Optimization Algorithm

78: Third Optimization Algorithm

80: Objective function of the first optimization algorithm

82: Limits of First Optimization Algorithms

84: Restrictions

85: critical value

86: Equal scaling factor ts

87: Optimized results for equal scaling factor ts

88: Objective function of the second optimization algorithm

90: Individual scaling factor ti

91: Optimization results for individual scaling factors ti

92: Weighted Summation

94: State parameter limit

96: Objective function of the third optimization algorithm

98: Itinerary optimization limit

100: more individual scaling factor

Claims (15)

A control device for controlling a manipulator that changes the optical behavior of a lithography projection lens by generating relative travel conditions of a plurality of travel variables, the travel variables defining at least one optical effect of the manipulator on the projection lens manipulation of elements for changing state parameters of the projection lens, wherein the control device is configured to: - Generate a relative approximation to the travel variable travel conditions by optimizing a scaling factor using a first optimization algorithm, the scaling factor being within the limits of the first optimization algorithm , define the first scaling limits specified for the individual state parameters, and - determining the itinerary by at least one further optimization algorithm, provided that an optimization result of the scaling factors does not exceed a certain threshold, determined by the first optimization algorithm A relative end result for variable travel conditions. A control device as described in claim 1, It is also configured to, when executing the at least one further optimization algorithm, execute a state parameter optimization algorithm in which a weighted sum of individual scaling factors is optimized , while considering state parameter limits associated with the state parameter, wherein the individual scaling factors in the state parameter limits define a relative scaling limit specified for the individual state parameters. A control device as claimed in claim 1 or 2, It is also configured to execute a run optimization algorithm in which an objective function including the run variable is optimized when the at least one further optimization algorithm is executed. The control device as described in claim 2 and claim 3, It is configured such that when executing the at least one further optimization algorithm, first the state parameter optimization algorithm is executed, and then the travel optimization algorithm is executed, wherein the travel optimization algorithm is configured to optimize Consider the objective function of the condition that each of the further individual scaling factors may exceed the optimization result of the corresponding first individual scaling factors by no more than 5%, the corresponding first individual scaling factors is determined by the state parameter optimization algorithm. A control device as described in claim 4, It is also configured to base the trip optimization algorithm on more approximations of trip conditions based on the trip variables determined when executing the state parameter optimization algorithm. A control device as claimed in claim 2, 4 or 5, wherein the state parameter limit further includes the condition that each of the first individual scaling factors may exceed the optimization result of the scaling factor by no more than 5%, the scaling factor being determined by the determined by the first optimization algorithm. A control device as claimed in any one of claims 3 to 6, Wherein the objective function of the travel optimization algorithm contains the travel variables in at least quadratic form. A control device as claimed in any one of the preceding claims, It is also configured to base the at least one further optimization algorithm on the approximations of the travel variable travel conditions as starting values. A control device as claimed in any one of the preceding claims, Wherein the constraints of the first optimization algorithm are defined as explicit constraints, which are not part of an objective function optimized when the first optimization algorithm is executed. A control device as claimed in any one of the preceding claims, wherein the determined travel variable travel conditions define changes in the state parameters of the projection lens, the changes being performed by the manipulators. An adjustment device for adjusting a lithography projection lens, comprising a measuring device for determining the current value of a state parameter of the projection lens; The current values of the state parameters generate the travel variable travel conditions. A projection lens for a lithography projection exposure apparatus comprising a plurality of manipulators configured to change a state parameter of the projection lens; and a control device as described in any one of claims 1 to 10 for controlling the Wait for the manipulator. A lithography projection exposure device comprising a projection lens as described in claim 12. A method for controlling a manipulator that alters the optical behavior of a lithographic projection lens by generating relative travel conditions of a plurality of travel variables that define control of at least one optical element of the projection lens by the manipulators Manipulation performed to change state parameters, the method consists of the following steps: - generating a relative approximation to the trip-variable trip conditions by optimizing a scaling factor using a first optimization algorithm, wherein the scaling factor in the first optimization algorithm Limits define first-scaling limits specified for those individual state parameters; and - determining the travel variable by at least one further optimization algorithm, provided that an optimization result of the scaling factors determined by the first optimization algorithm does not exceed a certain threshold A relative end result of travel conditions. A method as described in claim 14, wherein at least one further optimization algorithm is used to determine the relative finality of the travel variable travel conditions. Therefore, the further optimization algorithm takes into account the apparent limits of the state parameters of the projection lens, which are not performing A portion of an objective function that is optimized in the at least one further optimization algorithm.

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