TW202218785A - Laser processing device and observation method of laser beam to provide a laser processing device and an observation method of a laser beam, which can not only suppress contamination of optical components but also easily perform adjustment - Google Patents

Abstract

To provide a laser processing device and an observation method of a laser beam, which can not only suppress contamination of optical components but also easily perform adjustment. A laser processing device comprises: a laser oscillator to generate laser by oscillation; a first condenser to condense the laser beam emitted from the laser oscillator to irradiate a workpiece held by a chuck table; and an observation unit to observe the state of the condensing point of the laser beam irradiated on the workpiece in a simulated manner. The observation unit comprises: a second condenser to condense the laser beam in a direction different from the holding surface of the chuck table; a microscope for amplifying the laser beam that has been condensed by the second condenser; and a photographing element to observe the condensing point of the laser beam amplified by the microscope.

Description

Laser processing device and observation method of laser beam

The present invention relates to a laser processing device and a laser beam observation method.

In order to divide a workpiece such as a semiconductor wafer into a wafer, a laser processing apparatus including a laser beam irradiating unit that condenses the laser beam and irradiates the workpiece can be used (refer to For example, Patent Document 1). In general, the laser beam irradiation unit is configured such that the laser beam emitted from the laser oscillator is guided to the workpiece by using various optical components that control the size and shape of the beam, and the laser beam emitted from the laser oscillator is focused on the workpiece. The front or inside of the object is processed to process the object to be processed. Therefore, in order to obtain a desired processing result when processing a workpiece, adjustment of the optical component group of the laser beam irradiation unit becomes necessary. prior art literature Patent Literature

Patent Document 1: Japanese Patent Laid-Open No. 2007-275912

The problem to be solved by the invention

Incidentally, since it is necessary to carry out a processing trial whether or not a desired processing result can be obtained, the mainstream method is to adjust the optical components while processing the workpiece. However, in this method, since it is necessary to actually prepare the workpiece to be processed, there is a problem of the cost of preparing the workpiece and the labor of processing. In addition, in the laser beam irradiation unit, although the optical component group is usually arranged in a closed (shielded) space, since it is in an open state during adjustment, it may occur from the workpiece during processing. The possibility of chips (machining chips) adhering to optical parts during adjustment.

Accordingly, it is an object of the present invention to provide a laser processing apparatus and a laser beam observation method which can suppress contamination of optical components and can be easily adjusted. means of solving problems

According to one aspect of the present invention, a laser processing device can be provided, wherein the laser processing device includes: a work chuck having a holding surface for holding a workpiece; a laser oscillator for generating a laser by oscillation; and a first condenser , condensing the laser beam emitted from the laser oscillator to irradiate the workpiece held on the working table; and an observation unit, irradiating the laser on the workpiece in a similar manner The state of the condensing point of the light beam is observed, The observation unit includes: a second condenser for condensing the laser beam in a direction different from the holding surface of the work clamp; a microscope for condensing the laser beam by the second condenser magnifying; and a photographing element to observe the condensing point of the laser beam that has been magnified by the microscope.

Preferably, the observation unit is configured in a removable manner.

According to another aspect of the present invention, a method for observing a laser beam can be provided, which is to observe the state of the laser beam irradiated on the workpiece in a simulated manner in a laser processing device, and the laser processing device includes: A work clamp table has a holding surface for holding the workpiece; a laser oscillator, which oscillates to generate a laser; and a first concentrator, which condenses the laser beam emitted from the laser oscillator to focus on The object to be processed held on the working table is irradiated, and the observation method of the aforementioned laser beam includes the following steps: The preparation step is to prepare an observation unit. The observation unit has a second condenser, a microscope and a photographing element. The second condenser focuses the laser beam in a direction different from the holding surface of the work clamp. The microscope amplifying the laser beam condensed by the second condenser, and the aforementioned photographing element observes the condensing point of the laser beam that has been magnified by the microscope; an arranging step of arranging the observation unit at a position capable of receiving the laser beam emitted from the laser oscillator; and In the observation step, the state of the condensing point of the laser beam emitted from the laser oscillator and incident on the imaging element is observed.

Preferably, the laser beam observation method further includes a determination step, and the aforementioned determination step is to determine whether the state of the condensing point of the laser beam observed in the observation step is qualified or not. Invention effect

The invention of the present application can suppress contamination of optical parts and easily adjust optical parts.

Form for carrying out the invention

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the components described below include components that can be easily assumed by those skilled in the art, and components that are substantially the same. In addition, the configurations described below can be appropriately combined. In addition, various omissions, substitutions, or changes in the configuration can be made within a range that does not deviate from the gist of the present invention.

First, the structure of the laser processing apparatus 1 which concerns on embodiment of this invention is demonstrated based on drawing. FIG. 1 is a perspective view showing a configuration example of a laser processing apparatus 1 according to the embodiment. FIG. 2 is a schematic diagram schematically showing the configuration of the laser beam irradiation unit 20 and the observation unit 30 of the laser processing apparatus 1 shown in FIG. 1 . FIG. 3 is a perspective view showing a configuration example of the laser beam irradiation unit 20 and the observation unit 30 of FIG. 2 . In the following description, the X-axis direction is one direction on the horizontal plane. The Y-axis direction is the direction orthogonal to the X-axis direction on the horizontal plane. The Z-axis direction is a direction orthogonal to the X-axis direction and the Y-axis direction. In the laser processing apparatus 1 of the embodiment, the processing feed direction is the X-axis direction, and the indexing feed direction is the Y-axis direction.

As shown in FIGS. 1 and 2 , the laser processing apparatus 1 includes a work chuck 10 , a laser beam irradiation unit 20 , an observation unit 30 , an X-axis direction moving unit 40 , a Y-axis direction moving unit 50 , and a Z-axis direction moving unit unit 60 , photographing unit 70 , display unit 80 . The laser processing apparatus 1 of the embodiment is an apparatus for processing the workpiece 100 by irradiating the workpiece 100 held on the work table 10 with the laser beam 21 by the laser beam irradiating unit 20 . The processing of the workpiece 100 by the laser processing apparatus 1 may be, for example, a modified layer forming process of forming a modified layer inside the workpiece 100 by stealth dicing, or forming a groove on the front surface of the workpiece 100 groove processing, or cutting processing to cut the workpiece 100 along the planned dividing line, or the like.

The workpiece 100 may be a disc-shaped semiconductor device wafer, an optical device wafer, or the like using silicon (Si), sapphire (Al ₂ O ₃ ), gallium arsenide (GaAs), or silicon carbide (SiC) as a substrate. of wafers. In addition, the to-be-processed object 100 is not limited to embodiment, It is not necessary to have a disk shape in this invention. The workpiece 100 is supported in the opening of the ring frame 110 by, for example, attaching a tape 111 to the back of the workpiece 100 that can be attached to the ring frame 110 and has a diameter larger than the outer diameter of the workpiece 100 .

The table 10 holds the workpiece 100 with the holding surface 11 . The holding surface 11 is in the shape of a disk formed of porous ceramics or the like. The holding surface 11 is a flat surface parallel to the horizontal direction in the embodiment. The holding surface 11 is connected to a vacuum suction source, for example, through a vacuum suction path. The table 10 attracts and holds the workpiece 100 placed on the holding surface 11 . A plurality of clamp parts 12 are arranged around the work clamp table 10 , and the clamp parts 12 clamp the annular frame 110 supporting the workpiece 100 .

The work chuck 10 is rotated about an axis parallel to the Z-axis direction by the rotation unit 13 . The rotation unit 13 is supported by the X-axis direction moving plate 14 . The rotating unit 13 and the work clamp table 10 can move the plate 14 in the X-axis direction, and move in the X-axis direction by the X-axis direction moving unit 40 . The rotation unit 13 and the work clamp table 10 can be moved in the Y-axis direction by the Y-axis direction moving unit 50 through the X-axis direction moving plate 14 , the X-axis direction moving unit 40 and the Y-axis direction moving plate 15 .

The laser beam irradiation unit 20 is a unit that irradiates the pulsed laser beam 21 to the workpiece 100 held on the work jig 10 . As shown in FIGS. 2 and 3 , the laser beam irradiation unit 20 includes a laser oscillator 22 , mirrors 23 and 24 , an adjustment object lens 25 , a mounting plate 26 , a first condenser 29 and a direction conversion mirror 31 .

The laser oscillator 22 oscillates and generates a laser having a predetermined wavelength for processing the workpiece 100 . The laser beam 21 irradiated by the laser beam irradiating unit 20 has a wavelength that is penetrating or absorbing to the object to be processed 100 .

The mirror 23 reflects the laser beam 21 emitted from the laser oscillator 22 toward the mirror 24 . The mirror 24 further reflects the laser beam 21 , which has been reflected by the mirror 23 , toward the observation unit 30 . In the case where the laser beam 21 emitted from the laser oscillator 22 is UV (ultraviolet), the mirrors 23 and 24 can be formed with reflective films that reflect UV.

The adjustment target lens 25 is arranged on the optical path of the laser beam 21 between the laser oscillator 22 and the observation unit 30 . The adjustment target lens 25 propagates the laser beam 21 emitted from the laser oscillator 22 to the observation unit 30 or the processing point of the workpiece 100 . In the embodiment, the adjustment target lens 25 is constituted by a plurality of lenses. As shown in FIG. 3 , in the embodiment, the adjustment target lenses 25 are respectively attached to the mounting plate 26 in a state of being accommodated in the holder 251 . The holder 251 supports the outer edge portion of each lens of the adjustment target lens 25 and exposes the center portion of the lens.

The mounting plate 26 includes a flat plate body 261 and a plurality of fixing portions 262 . The fixing portion 262 is provided on the plate body 261, and detachably fixes the adjustment target lens 25 and the direction converting mirror 31 to be described later. In the embodiment, the fixing portion 262 is a screw hole into which a screw (not shown) is screwed, but the present invention is not limited to this. The screw passes through the through hole 252 passing through the holder 251 . In the embodiment, a plurality of fixing portions 262 are provided with intervals along the optical path of the laser beam 21 between the laser oscillator 22 and the mirror 23, and are provided with intervals along the vertical direction perpendicular to the optical path. There are multiple settings.

The first condenser 29 condenses the laser beam 21 reflected by the direction converting mirror 31 to be described later, and condenses and irradiates the workpiece 100 held on the work chuck 10 . That is, the first condenser 29 is a condenser lens for processing. The first condenser 29 is a biconvex single lens in the embodiment. In the laser beam irradiation unit 20 , at least the first condenser 29 is supported by the Z-axis direction moving unit 60 , and the Z-axis direction moving unit 60 is provided on the column 3 erected from the apparatus body 2 of the laser processing apparatus 1 . up (see Figure 1).

The direction conversion mirror 31 is detachably arranged on the optical path of the laser beam 21 between the laser oscillator 22 and the second condenser 33 of the observation unit 30 to be described later. In the embodiment, the direction converting mirror 31 is detachably arranged on the optical path of the laser beam 21 between the adjustment target lens 25 and the second condenser 33 . As shown in FIG. 3 , in the embodiment, the outer edge portion of the direction converting mirror 31 is supported by the holder 311 . The holder 311 is attached to the mounting plate 26 . Thereby, the direction converting mirror 31 is attached to the attachment plate 26 . When the laser beam 21 emitted from the laser oscillator 22 is UV, a reflective film for reflecting UV can be formed on the direction converting mirror 31 .

The observation unit 30 is a unit for observing the state of the condensing point of the laser beam 21 irradiated on the workpiece 100 in a simulated manner. In the embodiment, the observation unit 30 includes a housing 32 , a second condenser 33 , a microscope 34 , and an imaging element 35 .

When the direction conversion mirror 31 is disposed on the optical path of the laser beam 21 between the laser oscillator 22 and the second condenser 33 , it reflects the laser beam 21 propagating from the adjustment target lens 25 . , and is reflected toward the workpiece 100 held on the holding surface 11 of the work chuck 10 . In a state where the direction converting mirror 31 has been removed from the optical path of the laser beam 21 between the laser oscillator 22 and the second condenser 33 , the laser beam 21 passing through the adjustment object lens 25 passes through the first The condenser 33 and the microscope 34 are incident on the imaging element 35 .

The housing 32 has a second condenser 33 , a microscope 34 and an imaging element 35 mounted therein. As shown in FIG. 3 , the housing 32 is attached to the mounting plate 26 . That is, the observation unit 30 of the embodiment is configured to be detachable from the attachment plate 26 . In the state where the direction converting mirror 31 has been removed from the optical path of the laser beam 21 between the laser oscillator 22 and the second condenser 33 , the laser beam 21 emitted from the laser oscillator 22 will Incident into the case 32 .

The second concentrator 33 condenses the laser beam 21 in a direction different from that of the holding surface 11 of the work chuck 10 . In the observation unit 30, the laser beam 21 condensed in a direction different from that during processing is observed depending on whether the direction conversion mirror 31 is present or not. That is, the second condenser 33 is a dummy condenser lens. The second condenser 33 is a biconvex single lens in the embodiment. The focal distance of the second condenser 33 is the same as the focal distance of the first condenser 29 . That is, the condensing point of the laser beam 21 condensed by the second condenser 33 is a pseudo processing point. The focal distance of the second condenser 33 is 50 mm in the embodiment. In the embodiment, the second condenser 33 condenses the laser beam 21 that has entered the housing 32 and guides it to the microscope 34 .

The microscope 34 magnifies the laser beam 21 condensed by the second condenser 33 . The magnification of the microscope 34 is set to, for example, 10 times or more and 30 times or less, and is set to 20 times in the embodiment. In the case where the laser beam 21 oscillated from the laser oscillator 22 is UV, the microscope 34 includes a UV-corresponding microscope lens having UV resistance.

The imaging element 35 observes the condensing point of the laser beam 21 magnified by the microscope 34 . The imaging element 35 captures images within a predetermined field of view, and captures the converging point of the laser beam 21 within the field of view. The imaging element 35 includes, for example, a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor) or the like. Since the focal distance of the second condenser 33 is the same as the focal distance of the first condenser 29, the photographing element 35 can be used to align the laser beam 21 reflected by the direction conversion mirror 31 in a similar manner during processing. The condensing point is the same as the condensing point of the laser beam 21 for observation. The operator can perform adjustment of optical components such as the adjustment target lens 25 while viewing the image of the pseudo-processing point captured by the imaging element 35 .

The observation unit 30 may also be removed after the adjustment is completed, or it may not be removed after the adjustment is completed, so as to observe the light leakage of the laser beam 21 penetrating the direction converting mirror 31 .

As shown in FIG. 1 , the X-axis direction moving unit 40 is a unit that relatively moves the work chuck 10 and the laser beam irradiation unit 20 in the X-axis direction, which is the processing feed direction. In the embodiment, the X-axis direction moving unit 40 moves the table 10 in the X-axis direction. In the embodiment, the X-axis direction moving unit 40 is provided on the apparatus main body 2 of the laser processing apparatus 1 .

The X-axis direction moving unit 40 supports the X-axis direction moving plate 14 so as to be movable in the X-axis direction. The X-axis direction moving unit 40 includes a conventional ball screw 41 , a conventional pulse motor 42 and a conventional guide rail 43 . The ball screw 41 is rotatably provided around the axis. The pulse motor 42 rotates the ball screw 41 around the axis. The guide rail 43 supports the X-axis direction moving plate 14 so as to be movable in the X-axis direction. The guide rail 43 is fixed and provided to move the plate 15 in the Y-axis direction.

The Y-axis direction moving unit 50 is a unit that relatively moves the work chuck 10 and the laser beam irradiation unit 20 in the Y-axis direction, which is the indexing and feeding direction. In the embodiment, the Y-axis direction moving unit 50 moves the table 10 in the Y-axis direction. In the embodiment, the moving unit 50 in the Y-axis direction is already installed on the apparatus main body 2 of the laser processing apparatus 1 .

The Y-axis direction moving unit 50 supports the Y-axis direction moving plate 15 so as to be movable in the Y-axis direction. The moving unit 50 in the Y-axis direction includes a conventional ball screw 51 , a conventional pulse motor 52 and a conventional guide rail 53 . The ball screw 51 is rotatably provided around the axis. The pulse motor 52 rotates the ball screw 51 around the axis. The guide rail 53 supports the Y-axis direction moving plate 15 so as to be movable in the Y-axis direction. The guide rail 53 is fixed and provided on the apparatus body 2 .

The moving unit 60 in the Z-axis direction is to make the condensing point of the laser beam 21 condensed by the first condenser 29 of the laser beam irradiating unit 20 to be perpendicular to the optical axis of the holding surface 11 of the work chuck 10 A unit that moves in the direction. More specifically, the Z-axis direction moving unit 60 relatively moves the work chuck 10 and the laser beam irradiation unit 20 in the Z-axis direction, which is the direction of adjusting the position of the condensing point. In the embodiment, the Z-axis direction moving unit 60 moves the laser beam irradiation unit 20 in the Z-axis direction. In the embodiment, the Z-axis direction moving means 60 is provided on the column 3 erected from the apparatus main body 2 of the laser processing apparatus 1 .

The Z-axis direction moving unit 60 supports at least the first condenser 29 (see FIG. 2 ) in the laser beam irradiation unit 20 so as to be movable in the Z-axis direction. The Z-axis direction moving unit 60 includes a conventional ball screw 61 , a conventional pulse motor 62 and a conventional guide rail 63 . The ball screw 61 is rotatably provided around the axis. The pulse motor 62 rotates the ball screw 61 around the axis. The guide rail 63 supports the laser beam irradiation unit 20 so as to be movable in the Z-axis direction. The guide rails 63 are fixed and arranged on the column 3 .

The photographing unit 70 is configured to photograph, for example, the lower side from directly above the first condenser 29 of the laser beam irradiation unit 20 . The photographing unit 70 includes a coaxial camera, a CCD camera or an infrared camera.

The display unit 80 is a display portion constituted by a liquid crystal display device or the like. The display unit 80 can display on the display surface, for example, a setting screen of the machining conditions, the state of the workpiece 100 captured by the imaging unit 70 , the state of the machining operation, and the like. The display unit 80 can display, for example, the image of the condensing point of the laser beam 21 captured by the imaging element 35 on the display surface.

When the display surface of the display unit 80 includes a touch panel, the display unit 80 may include an input unit. The input unit can accept various operations such as registration of processing content information by the operator. The input unit may be an external input device such as a keyboard. The display unit 80 can switch information or images displayed on the display surface by an operation from an input unit or the like. The display unit 80 may also include a notification unit. The notification unit emits at least one of sound and light to notify the operator of the laser processing apparatus 1 of predetermined notification information. The notification part may also be an external notification device such as a speaker or a light-emitting device.

Next, the observation method of the laser beam 21 of embodiment is demonstrated. FIG. 4 is a flowchart showing the flow of the observation method of the laser beam 21 according to the embodiment. The observation method of the laser beam 21 includes a preparation step 201 , an arrangement step 202 , an observation step 203 and a determination step 204 .

The preparation step 201 is a step of preparing the observation unit 30 . That is, in the preparation step 201, an observation unit 30 is prepared, and the observation unit 30 has: a second condenser 33, which condenses the laser beam 21 in a direction different from that of the holding surface 11 of the work chuck 10; a microscope 34 , to magnify the laser beam 21 that has been condensed by the second condenser 33 ;

The arranging step 202 is a step of arranging the observation unit 30 prepared in the preparing step 201 at a position where the laser beam 21 emitted from the laser oscillator 22 can be received. In the arranging step 202 of the embodiment, the second condenser 33 , the microscope 34 , and the imaging element 35 are arranged on the optical path of the laser beam 21 reflected by the mirror 24 and transmitted through the adjustment target lens 25 . An observation unit 30 is provided. At this time, the direction converting mirror 31 is removed from the optical path between the mirror 24 and the second condenser 33 in advance.

The observation step 203 is a step of observing the state of the converging point of the laser beam 21 emitted from the laser oscillator 22 and incident on the imaging element 35 . In the observation step 203 , the laser beam 21 is irradiated toward the observation unit 30 already arranged in the arrangement step 202 . The laser beam 21 that has been incident into the casing 32 of the observation unit 30 is: the condensing spot that has been condensed by the second condenser 33 is enlarged by the microscope 34 and photographed by the imaging element 35 . The image of the converging point of the laser beam 21 captured by the imaging element 35 can be displayed on the display surface of the display unit 80 so as to be confirmed by the operator, for example.

The determination step 204 is a step of determining whether the state of the converging point of the laser beam 21 observed in the observation step 203 is acceptable or not. In the determination step 204 , the beam shape and the luminosity distribution in the processing point of the laser beam 21 are determined based on, for example, the shape and the brightness distribution of the light-converging point of the captured image. The determination by the determination step 204 may be performed by, for example, the control unit of the laser processing apparatus 1 . The control unit may also determine whether the state of the converging point of the laser beam 21 is acceptable or not by, for example, determining whether the shape and luminance distribution of the converging point of the captured image are within a preset range.

In the determination step 204, when it is determined that it is unacceptable, the optical components such as the object lens 25 are adjusted while checking the captured image of the converging point of the laser beam 21 captured by the imaging element 35. adjustment. In the determination step 204, when it is determined that it is a pass, the adjustment is ended.

[Variation] Next, the structure of the laser processing apparatus 1-2 of the modification is demonstrated based on drawing. FIG. 5 is a schematic diagram schematically showing the configuration of the laser beam irradiation unit 20 - 2 and the observation unit 30 - 2 of the laser processing apparatus 1 - 2 according to the modification. The laser processing apparatus 1-2 according to the modification is different from the laser processing apparatus 1 according to the embodiment in that a laser beam irradiation unit 20-2 and an observation unit 30-2 are provided instead of the laser beam irradiation unit 20-2. unit 20 and observation unit 30.

Compared with the laser beam irradiation unit 20 of the embodiment, the laser beam irradiation unit 20 - 2 of the modification is different in that the direction conversion mirror 31 is not included, but the mirror 28 is further included. In addition, the observation unit 30-2 of the modification is different from the observation unit 30 of the embodiment in that it further includes a direction converting mirror 31-2.

The direction converting mirror 31 - 2 is detachably arranged on the optical path of the laser beam 21 between the laser oscillator 22 and the mirror 28 . In the modified example, the direction converting mirror 31 - 2 is detachably arranged on the optical path of the laser beam 21 between the adjustment target lens 25 and the mirror 28 . The direction converting mirror 31 - 2 is installed inside the casing 32 in the modification.

When the direction conversion mirror 31 - 2 is disposed on the optical path of the laser beam 21 between the laser oscillator 22 and the mirror 28 , the direction conversion mirror 31 - 2 reflects the laser beam 21 that has passed through the adjustment object lens 25 to make it It is incident on the imaging element 35 through the second condenser 33 and the microscope 34 . When the direction converting mirror 31 - 2 is removed from the optical path of the laser beam 21 between the laser oscillator 22 and the mirror 28 , the laser beam 21 that has passed through the adjustment object lens 25 is incident on the mirror 28 .

The mirror 28 reflects the laser beam 21 , which has been reflected by the mirror 24 and passed through the adjustment object lens 25 , toward the workpiece 100 held on the holding surface 11 of the work chuck 10 . Furthermore, when the direction converting mirror 31 - 2 has been removed from the optical path of the laser beam 21 between the laser oscillator 22 and the mirror 28 , the laser beam 21 is incident on the mirror 28 .

As described above, the laser processing apparatuses 1 and 1-2 of the embodiment and the modification can be completed without processing by using the dummy condenser (the second condenser 33) and the optical system. In the observation of the laser beam 21 in the same state as the processing point, the aforementioned optical system can magnify and observe the laser beam 21 condensed by the dummy condenser. Therefore, labor and processing man-hours for preparing the workpiece 100 for adjustment can be reduced. In addition, it is possible to prevent debris generated from the workpiece 100 during processing from adhering to the optical component during adjustment. In addition, since the adjustment can be performed while observing the laser beam 21, and the abnormality of the laser beam 21 can be noticed in the adjustment stage, the effect of preventing rework can be exhibited.

In addition, this invention is not limited to the invention of the said embodiment. That is, various deformation|transformation can be performed in the range which does not deviate from the summary of this invention.

1,1-2: Laser processing device 2: Device body 3: Column 10: Work clamp table 11: Keep Faces 12: Fixture Department 13: Rotary unit 14: Move the board in the X-axis direction 15: Move the board in the Y-axis direction 20, 20-2: Laser beam irradiation unit 21: Laser Beam 22: Laser oscillator 23, 24, 28: Mirror 25: Adjust the object lens 26: Mounting plate 29: First Condenser 30, 30-2: Observation unit 31,31-2: Direction conversion mirror 32: Shell 33: Second Condenser 34: Microscope 35: Shooting Elements 40: Move the unit in the X-axis direction 41, 51, 61: Ball Screws 42, 52, 62: Pulse Motor 43, 53, 63: Rails 50: Move the unit in the Y-axis direction 60: Move the unit in the Z-axis direction 70: Shooting unit 80: Display unit 100: processed object 110: Ring Frame 111: Tape 201: Preparation steps 202: Configuration steps 203: Observation steps 204: Judgment step 251,311: Supporter 252: Through hole 261: Board body 262: Fixed part X,Y,Z: direction

FIG. 1 is a perspective view showing a configuration example of a laser processing apparatus according to the embodiment. FIG. 2 is a schematic diagram schematically showing the configuration of a laser beam irradiation unit and an observation unit of the laser processing apparatus shown in FIG. 1 . FIG. 3 is a perspective view showing a configuration example of a laser beam irradiation unit and an observation unit of FIG. 2 . FIG. 4 is a flowchart showing the flow of the observation method of the laser beam according to the embodiment. 5 is a schematic diagram schematically showing the configuration of a laser beam irradiation unit and an observation unit of a laser processing apparatus according to a modification.

1: Laser processing device

10: Work clamp table

11: Keep Faces

20: Laser beam irradiation unit

21: Laser Beam

22: Laser oscillator

23, 24: Mirror

25: Adjust the object lens

29: First Condenser

30: Observation unit

31: Direction conversion mirror

32: Shell

33: Second Condenser

34: Microscope

35: Shooting Elements

100: processed object

111: Tape

Claims (4)

A laser processing device, comprising: The work clamping table has a holding surface for holding the processed object; Laser oscillator, oscillating to generate laser; a first condenser for condensing the laser beam emitted from the laser oscillator to irradiate the workpiece held on the work table; and an observation unit for observing the state of the condensing point of the laser beam irradiated on the workpiece in a simulated manner, This observation unit contains: a second concentrator, which condenses the laser beam in a direction different from the holding surface of the work clamp; a microscope that amplifies the laser beam condensed by the second condenser; and The imaging element observes the condensing point of the laser beam magnified by the microscope. The laser processing apparatus according to claim 1, wherein the observation unit is configured in a removable manner. A method for observing a laser beam is to observe the state of a laser beam irradiated on a workpiece in a simulated manner in a laser processing device, wherein the laser processing device includes: A work clamping table, which has a holding surface for holding the workpiece; A laser oscillator, which oscillates to generate a laser; and The first concentrator is used for condensing the laser beam emitted from the laser oscillator to irradiate the workpiece held on the work table. The laser beam observation method includes the following steps: The preparation step is to prepare an observation unit. The observation unit has a second condenser, a microscope and a photographing element. The second condenser focuses the laser beam in a direction different from the holding surface of the work clamp. The microscope amplifying the laser beam condensed by the second condenser, and the aforementioned photographing element observes the condensing point of the laser beam that has been magnified by the microscope; an arranging step of arranging the observation unit at a position capable of receiving the laser beam emitted from the laser oscillator; and In the observation step, the state of the condensing point of the laser beam emitted from the laser oscillator and incident on the imaging element is observed. The laser beam observation method of claim 3 further comprises a determination step, wherein the determination step is to determine whether the state of the converging point of the laser beam observed in the observation step is qualified or not.

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