TW202214544A - Ceramic spheres - Google Patents

Ceramic spheres Download PDF

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TW202214544A
TW202214544A TW110131385A TW110131385A TW202214544A TW 202214544 A TW202214544 A TW 202214544A TW 110131385 A TW110131385 A TW 110131385A TW 110131385 A TW110131385 A TW 110131385A TW 202214544 A TW202214544 A TW 202214544A
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ceramic
spherical body
particle size
ceramic spherical
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神井康宏
新貝真之
吉野正樹
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日商東麗股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B02CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02CCRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
    • B02C17/00Disintegrating by tumbling mills, i.e. mills having a container charged with the material to be disintegrated with or without special disintegrating members such as pebbles or balls
    • B02C17/18Details
    • B02C17/20Disintegrating members
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01GCOMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G25/00Compounds of zirconium
    • C01G25/02Oxides
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/48Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
    • C04B35/486Fine ceramics
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74Physical characteristics
    • C04B2235/78Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures
    • C04B2235/786Micrometer sized grains, i.e. from 1 to 100 micron

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Food Science & Technology (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Crushing And Grinding (AREA)
  • Compositions Of Oxide Ceramics (AREA)

Abstract

Ceramic spheres that include zirconia as a primary component and are 80-95 volume% tetragonal crystals and no more than 5 volume% monoclinic crystals, the ceramic spheres being characterized in that, when average particle diameter is X ([mu]m), the maximum height of waviness Wz ([mu]m) of the line of intersection between a cross-section and the surface of spheres that have a diameter of X/2 ([mu]m) is 0.5%-1.2% of the average particle diameter X ([mu]m). The present invention provides ceramic spheres that can be used as a medium, such as balls or beads, that is for use in a grinder and do not readily break, even when grinding and dispersion are performed at normal temperature and a high water temperature.

Description

陶瓷球形體ceramic sphere

本發明係關於陶瓷球形體。The present invention relates to ceramic spheroids.

電子材料用途所使用之粉末的微粉碎、或油墨用途的顏料之分散時,廣泛採取使用粉碎用介質施行粉碎的球磨機、振動研磨機、砂磨機、珠磨機等粉碎機。此種粉碎機用的磨球、磨珠等粉碎用介質(以下亦簡稱「介質」),係使用以耐磨損性、耐碰撞性等優異的二氧化鋯作為主成分之陶瓷燒結體。For fine pulverization of powders used for electronic materials or dispersion of pigments for inks, pulverizers such as ball mills, vibration mills, sand mills, and bead mills are widely used for pulverization using a pulverizing medium. The grinding medium (hereinafter also referred to as "medium") such as balls and beads for such a grinder is a ceramic sintered body mainly composed of zirconium dioxide, which is excellent in abrasion resistance, impact resistance, and the like.

以二氧化鋯作為主成分的陶瓷燒結體係有揭示:藉由限定ZrO 2與Y 2O 3的組成比率,並控制Al 2O 3量及SiO 2量,而提升耐久性及耐磨損性的介質(例如專利文獻1)。 [先前技術文獻] [專利文獻] The ceramic sintering system with zirconium dioxide as the main component has been disclosed: by limiting the composition ratio of ZrO 2 and Y 2 O 3 , and controlling the amount of Al 2 O 3 and SiO 2 , the durability and wear resistance can be improved. medium (eg, Patent Document 1). [Prior Art Literature] [Patent Literature]

專利文獻1:日本專利特開2001-316178號公報Patent Document 1: Japanese Patent Laid-Open No. 2001-316178

(發明所欲解決之問題)(The problem that the invention intends to solve)

近年特別在提升被粉碎物之性能的目的下,更進一步要求粒子微細化,隨此情形擴大利用300μm以下的粉碎用微小徑介質。微小徑介質一般係利用例如:滾動造粒成形法、液中造粒成形法、電漿熔融成形法等進行製造,不管何種造粒方法均係在成形過程中,會受粒子的成長履歷、熱履歷、表面張力等影響,而在介質表面上存在波浪形狀。In recent years, especially for the purpose of improving the performance of the object to be pulverized, the particle size has been further demanded, and the use of micro-diameter media for pulverization of 300 μm or less has been expanded in response to this situation. Micro-diameter media are generally manufactured by, for example, rolling granulation, in-liquid granulation, and plasma fusion molding. Regardless of the granulation method, it is in the process of forming and will be affected by the growth history of particles, Due to the influence of thermal history, surface tension, etc., there is a wave shape on the surface of the medium.

此種介質表面的波浪係局部性曲率半徑較小的地方。由本發明者等檢討的結果,得知當介質彼此之間、介質與被粉碎物、以及介質與裝置壁面進行碰撞時,介質表面波浪地方的接觸面積較小,若施加較高壓力,結果會成為容易生成介質破損的要因。特別在水中將被粉碎物與介質混合於粉碎機等之中,施行長時間粉碎/分散的情況,會有水溫提高、陶瓷燒結體進行劣化、容易發生破損之情形。The wave system on the surface of this medium is where the local curvature radius is small. From the results of the review by the inventors of the present invention, it is known that when the media collide with each other, the medium and the object to be pulverized, and the medium and the wall surface of the device, the contact area of the wave area on the surface of the medium is small, and if a higher pressure is applied, the result will be It is easy to generate the cause of damage to the medium. In particular, when the material to be pulverized and the medium are mixed in a pulverizer or the like in water and pulverized/dispersed for a long time, the water temperature may increase, the ceramic sintered body may deteriorate, and breakage may occur easily.

本發明目的在於提供:可用為粉碎機所用之磨球、磨珠等介質,且即使在常溫狀態與水溫較高之狀態下施行粉碎/分散,仍不易發生破損的陶瓷球形體。 (解決問題之技術手段) The object of the present invention is to provide a ceramic spherical body that can be used as a medium for grinding balls, grinding beads, etc. in a pulverizer, and is not easily broken even when pulverized/dispersed in a normal temperature state and a state with a high water temperature. (Technical means to solve problems)

即,為解決上述課題,本發明的陶瓷球形體,係以二氧化鋯為主成分,正方晶比例係80容量%以上且95容量%以下、單斜晶比例係5容量%以下的陶瓷球形體;其中,將平均粒徑設為X(μm)時,直徑成為X/2(μm)的該球形體截面、與該球形體表面的正交線部中,最大高度波浪Wz(μm)係平均粒徑X(μm)的0.5%以上且1.2%以下。 (對照先前技術之功效) That is, in order to solve the above-mentioned problems, the ceramic spherical body of the present invention is mainly composed of zirconium dioxide, the proportion of tetragonal crystal is 80 volume % or more and 95 volume % or less, and the monoclinic crystal proportion system is 5 volume % or less. Wherein, when the average particle size is X (μm), the diameter of the spherical body cross-section with a diameter of X/2 (μm), and the perpendicular line portion to the spherical body surface, the maximum height wave Wz (μm) is the average 0.5% or more and 1.2% or less of the particle size X (μm). (Compared to the efficacy of the prior art)

本發明之陶瓷球形體係即使在常溫狀態及水溫較高狀態下被用以施行被粉碎物的粉碎/分散,仍可發揮抑制陶瓷球形體破損的效果。Even if the ceramic spherical system of the present invention is used for pulverization/dispersion of objects to be pulverized in a normal temperature state or a state with a relatively high water temperature, the effect of suppressing the breakage of the ceramic spherical body can still be exerted.

本發明的陶瓷球形體係由以二氧化鋯為主成分的陶瓷燒結體構成。另外,於以下之本說明書中,最終製品的陶瓷燒結體(即,粉碎用介質以外,在製造步驟中經一次以上燒結而獲得的中間體陶瓷燒結體),稱為「中間燒結體」。又,將最終製品陶瓷燒結體及中間燒結體二者簡稱為「燒結體」。The ceramic spherical system of the present invention is composed of a ceramic sintered body mainly composed of zirconium dioxide. In addition, in the following specification, the ceramic sintered body of the final product (ie, the intermediate ceramic sintered body obtained by sintering more than one time in the production process other than the grinding medium) is referred to as "intermediate sintered body". In addition, both the final product ceramic sintered body and the intermediate sintered body are simply referred to as "sintered body".

本發明的陶瓷球形體係藉由將以二氧化鋯為主成分的陶瓷原料粉末(以下簡稱為「原料粉末」)成形為球狀而獲得。此處,本說明書中「以二氧化鋯為主成分」係指二氧化鋯比率達90重量%以上,若二氧化鋯比率佔總成分的93重量%以上,便可獲得特別高的強度,故較佳。The ceramic spherical system of the present invention is obtained by molding a ceramic raw material powder containing zirconium dioxide as a main component (hereinafter simply referred to as "raw material powder") into a spherical shape. Here, in this specification, "containing zirconium dioxide as the main component" means that the ratio of zirconium dioxide is 90% by weight or more. better.

陶瓷的各成分含量係依如下便可求得。首先,將陶瓷試料使用萬能試驗機施行壓碎,再將壓碎片約0.3g裝入白金坩堝中,利用硫酸氫鉀熔解。將其利用稀硝酸溶解並定溶,使用ICP發光分光分析法定量各金屬元素,更將其換算為氧化物並求取含量。以下,若本發明之陶瓷球形體的成分有依金屬元素表記,則亦有依氧化物表記的情況。The content of each component of the ceramic can be obtained as follows. First, a ceramic sample was crushed using a universal testing machine, and about 0.3 g of crushed pieces were placed in a platinum crucible and melted with potassium hydrogen sulfate. This was dissolved in dilute nitric acid and the solution was determined, and each metal element was quantified by ICP emission spectrometry, and the content was determined by converting it into an oxide. Hereinafter, if the components of the ceramic spherical body of the present invention are expressed in terms of metal elements, they may also be expressed in terms of oxides.

再者,本發明的陶瓷球形體係除上述主成分之外,較佳係依氧化物換算而含有氧化釔(Y 2O 3)、氧化鈰(CeO 2)、氧化鋁(Al 2O 3)、氧化鎂(MgO)、氧化鈣(CaO)等。該等具安定化劑機能,可提升陶瓷球形體的強度、韌性。其中,較佳係含有氧化釔。氧化釔含量係陶瓷球形體中的氧化釔/二氧化鋯之莫耳比,較佳為4.6/95.4以上且5.6/94.4以下、更佳為4.8/95.2以上且5.5/94.5以下。 Furthermore, the ceramic spherical system of the present invention preferably contains yttrium oxide (Y 2 O 3 ), cerium oxide (CeO 2 ), aluminum oxide (Al 2 O 3 ), Magnesium oxide (MgO), calcium oxide (CaO), etc. These stabilizer functions can improve the strength and toughness of the ceramic spherical body. Among them, yttrium oxide is preferably contained. The yttria content is the molar ratio of yttria/zirconia in the ceramic spherical body, preferably 4.6/95.4 or more and 5.6/94.4 or less, more preferably 4.8/95.2 or more and 5.5/94.5 or less.

本發明之陶瓷球形體係正方晶比例為80容量%以上且95容量%以下、單斜晶比例為5容量%以下。若正方晶含量達80容量%以上,施加應力時,正方晶會變異為單斜晶並體積膨脹,便可抑制介質龜裂,但若未滿80容量%則此項效果會有變小的情況。另一方面,若正方晶含量大於95容量%,則在高溫水中容易發生劣化,因而若長時間施行粉碎/分散等,會有導致水溫上升的情況,進而有造成陶瓷球形體容易破損的情況。又,就從防止破損的觀點,單斜晶的比例越少越好,較佳係在5容量%以下。更佳係3容量%以下、特佳係1容量%以下。然而,在陶瓷球形體的製造步驟中,為使表面形狀呈平滑,一般會施行後述濕式研磨或後洗淨,在濕式研磨時的水溫上升、或研磨後的洗淨、乾燥過程中,因為單斜晶至少會形成0.1%以上,因而一般無法完全歸零。陶瓷球形體的各結晶相比例係可利用粉末X射線繞射法進行測定。The proportion of tetragonal crystals in the ceramic spherical system of the present invention is 80% by volume or more and 95% by volume or less, and the proportion of monoclinic crystals is 5% by volume or less. If the content of tetragonal crystals exceeds 80% by volume, when stress is applied, the tetragonal crystals will mutate into monoclinic crystals and expand in volume, which can suppress the cracking of the medium. However, if it is less than 80% by volume, this effect will be reduced. . On the other hand, if the content of tetragonal crystals exceeds 95% by volume, degradation is likely to occur in high-temperature water, so if pulverization/dispersion is performed for a long time, the water temperature may rise, and the ceramic spherical body may be easily damaged. . In addition, from the viewpoint of preventing breakage, the smaller the proportion of monoclinic crystals, the better, and it is preferably 5% by volume or less. More preferably, it is less than 3% of capacity, and particularly preferred is less than 1% of capacity. However, in the production process of the ceramic spherical body, in order to make the surface shape smooth, wet grinding or post-cleaning, which will be described later, is generally performed. , because the monoclinic crystal will form at least 0.1% or more, so it is generally impossible to completely return to zero. The ratio of each crystal phase of the ceramic spherical body can be measured by powder X-ray diffraction.

本發明的陶瓷球形體係將平均粒徑設為X(μm)時,使直徑成為X/2(μm)的該球形體截面、與該球形體表面的正交線部中,最大高度波浪Wz(μm)係平均粒徑X(μm)的0.5%以上且1.2%以下、即,(Wz/X)×100係0.5以上且1.2以下。一般最大高度波浪會隨粒子粒徑變大,故本發明利用最大高度波浪除以平均粒徑的商值進行評價。若(Wz/X)×100大於1.2,則粉碎中的陶瓷球形體間、或陶瓷球形體與被粉碎物等碰撞時,陶瓷球形體會生成局部性壓力集中,結果導致容易發生破損。(Wz/X)×100較佳係1.0以下。又,若(Wz/X)×100小於0.5,便欠缺工業製品生產性。In the ceramic spherical system of the present invention, when the average particle size is X (μm), the maximum height wave Wz ( μm) is 0.5% or more and 1.2% or less of the average particle diameter X (μm), that is, (Wz/X)×100 is 0.5 or more and 1.2 or less. Generally, the maximum height wave will increase with the particle size, so the present invention uses the quotient of dividing the maximum height wave by the average particle size for evaluation. If (Wz/X)×100 is greater than 1.2, when the ceramic spheres are being crushed, or when the ceramic spheres collide with the object to be crushed, local pressure concentration is generated on the ceramic spheres, resulting in easy breakage. (Wz/X)×100 is preferably 1.0 or less. Furthermore, when (Wz/X)×100 is less than 0.5, the productivity of industrial products is insufficient.

此處,平均粒徑X係拍攝陶瓷球形體後,使用影像分析・計測軟體便可測定。具體係指依如下測定的值。針對陶瓷球形體的集合體使用數位式顯微鏡依倍率10~200倍拍攝。使用影像分析・計測軟體,並以測定用影像的亮度為基準,將拍攝影像施行二值化。二值化影像利用最小均方施行圓形圖形分離,計算出經分離的各圓直徑,並設為各陶瓷球形體的直徑。將1000個陶瓷球形體直徑的數量平均值設為平均粒徑X。Here, the average particle diameter X can be measured using image analysis and measurement software after photographing the ceramic spherical body. Specifically, it means the value measured as follows. The aggregates of ceramic spheres were photographed with a digital microscope at a magnification of 10 to 200 times. Using image analysis and measurement software, the captured image is binarized based on the brightness of the measurement image. The binarized image is separated from the circular pattern by the least mean square, and the diameter of each separated circle is calculated and set as the diameter of each ceramic sphere. The average particle diameter X was defined as the number average of the diameters of 1000 ceramic spheres.

再者,「最大高度波浪Wz」係根據JIS B 0601:2013,如圖1所示,針對小於陶瓷球形體直徑1、成為X/2直徑2的該球形體截面、與該球形體表面的正交線部3,從上方4利用雷射顯微鏡觀察陶瓷球形體便可求得。縮小最大高度波浪Wz的方法係可例如:一邊在後述滾動造粒機內僅添加水,一邊進行長時間滾動。Furthermore, the "maximum height wave Wz" is based on JIS B 0601:2013, as shown in Fig. 1, for the cross section of the spherical body smaller than the diameter 1 of the ceramic spherical body, which becomes the X/2 diameter of 2, and the positive surface of the spherical body. The intersection 3 can be obtained by observing the ceramic spherical body with a laser microscope from above 4 . As a method of reducing the maximum height wave Wz, for example, rolling for a long time can be performed while adding only water in a rolling granulator described later.

本發明之陶瓷球形體的內部缺陷率較佳係0.5%以下。此處所謂「內部缺陷」係指陶瓷球形體內部的龜裂或空孔。內部缺陷係藉由研削陶瓷球形體,將內部缺陷率形成0.5%以下,便可更加抑制陶瓷球形體之破損。將內部缺陷率設為0.5%以下的方法,係可例如:對所獲得之陶瓷球形體施行後述的熱間均壓處理,或施行後述降低成形體之表面波浪之步驟等。The internal defect rate of the ceramic spherical body of the present invention is preferably 0.5% or less. The term "internal defects" as used herein refers to cracks or voids inside the ceramic spherical body. Internal defect: By grinding the ceramic spherical body, the internal defect rate is 0.5% or less, and the damage of the ceramic spherical body can be further suppressed. The method of setting the internal defect rate to 0.5% or less can be, for example, subjecting the obtained ceramic spherical body to a hot equalization treatment described later, or a step of reducing the surface wave of the molded body described later.

本發明之陶瓷球形體的平均粒徑X較佳係30μm以上且300μm以下。藉由平均粒徑X達30μm以上,便可輕易地進行被粉碎物與陶瓷球形體的分離,能防止陶瓷球形體混入。藉由平均粒徑X在300μm以下,便可將被粉碎物均勻且微小地施行粉碎、分散。平均粒徑X係利用後述篩式分級等便可設為上述範圍。The average particle diameter X of the ceramic spherical body of the present invention is preferably 30 μm or more and 300 μm or less. When the average particle diameter X is 30 μm or more, the separation of the pulverized material and the ceramic spherical body can be easily performed, and the mixing of the ceramic spherical body can be prevented. When the average particle diameter X is 300 μm or less, the object to be pulverized can be pulverized and dispersed uniformly and finely. The average particle diameter X can be set to the above-mentioned range by sieve classification or the like described later.

本發明之陶瓷球形體的最小粒徑係0.7X(μm)以上,最大粒徑較佳係1.3X(μm)以下。藉由最小粒徑達0.7X以上,被粉碎物與陶瓷球形體便可輕易分離,俾能防止陶瓷球形體混入。又,藉由最大粒徑在1.3X(μm)以下,便可將粉碎後的被粉碎物設為均勻粒度分佈。最小粒徑與最大粒徑係依照與前述平均粒徑X的測定同樣,使用影像分析・計測軟體,將經圓形圖分離的各圓直徑之最小值設為最小粒徑,將最大值設為最大粒徑便可測定。最小粒徑與最大粒徑係利用後述篩式分級等便可設為上述範圍。The minimum particle size of the ceramic spherical body of the present invention is 0.7X (μm) or more, and the maximum particle size is preferably 1.3X (μm) or less. With the minimum particle size of 0.7X or more, the pulverized material and the ceramic spheres can be easily separated, so as to prevent the ceramic spheres from mixing. In addition, when the maximum particle diameter is 1.3X (μm) or less, the pulverized object after pulverization can be made into a uniform particle size distribution. The minimum particle diameter and the maximum particle diameter are the same as the above-mentioned measurement of the average particle diameter X, using image analysis and measurement software, and the minimum value of the diameters of the circles separated by the circular chart is the minimum particle diameter, and the maximum value is set as the The maximum particle size can be determined. The minimum particle diameter and the maximum particle diameter can be set to the above-mentioned ranges by using sieve classification or the like to be described later.

另外,因陶瓷球形體製造過程中的不均勻性,會導致較難使所有粒子均形成球形狀,一般情況係正球性較差的粒子存在有1~數%程度。特別係橢圓形狀物會有依橢圓短軸通過開口寬度較等值圓直徑小之分級網的可能性,或者相反會有依橢圓長軸被開口寬度較等值圓直徑大之分級網捕捉的可能性,亦有偏移陶瓷球形體粒度分佈外之值存在的可能性。所以,較佳為利用抽樣的粒徑評價,依能排除如上述特殊形狀之粒子之影響的方式,不使用最小粒徑與最大粒徑,而利用1%粒徑(D1)、99%粒徑(D99)定義,更能正確掌握陶瓷球形體的粒徑範圍,故較佳。所以,本發明之陶瓷球形體較佳係D1達0.7X(μm)以上、D99在1.3X(μm)以下。D1、D99係可依照與最小粒徑、最大粒徑的同樣手法進行評價。In addition, due to the non-uniformity in the manufacturing process of the ceramic spherical body, it will be difficult to make all the particles into a spherical shape. Generally, the particles with poor sphericity exist at the level of 1 to several%. In particular, the ellipse-shaped object may pass through the grading net whose opening width is smaller than the diameter of the equivalent circle according to the minor axis of the ellipse, or may be caught by the grading net whose opening width is larger than the diameter of the equivalent circle according to the long axis of the ellipse There is also the possibility of shifting the value outside the particle size distribution of ceramic spheres. Therefore, it is better to use the particle size evaluation of sampling, according to the method that can eliminate the influence of the particles with special shapes as above, instead of using the minimum particle size and the maximum particle size, use 1% particle size (D1), 99% particle size and 99% particle size. The definition of (D99) can more accurately grasp the particle size range of the ceramic spherical body, so it is better. Therefore, in the ceramic spherical body of the present invention, D1 is preferably 0.7X (μm) or more, and D99 is 1.3X (μm) or less. D1 and D99 systems can be evaluated in the same manner as the minimum particle size and the maximum particle size.

本發明之陶瓷球形體係可依照各種方法製造。以下,一例係針對利用滾動造粒成形法施行的製造例之詳細內容進行說明。The ceramic spherical system of the present invention can be manufactured according to various methods. Hereinafter, an example is demonstrated about the detail of the manufacturing example performed by the rolling granulation method.

原料粉末首先使用滾動造粒成形法成形為球狀。滾動造粒成形法係藉由在旋轉的轉鼓內,交錯添加陶瓷原料粉末、及含有黏結劑與水分的液體黏結劑,而形成球狀微粒,然後藉由對微粒及粉末賦予旋轉連動使粒子成長,而製作球狀成形體的方法。The raw material powder is first formed into a spherical shape using a rolling granulation method. The rolling granulation method is to form spherical particles by staggeringly adding ceramic raw material powder and a liquid binder containing a binder and moisture in a rotating drum. A method for producing a spherical molded body by growing it.

其次,所獲得之成形體降低表面波浪的步驟係將至少重量100kg以上之成形體在滾動造粒機內,一邊僅添加水,一邊更進行至少10小時以上、較佳約20小時、更佳為30小時以上的滾動。藉此,對成形體表面施行平坦化,而縮小表面波浪。此步驟中,滾動造粒機中的水分率較佳係設為較造粒成長時高出2~5%。藉此,藉由陶瓷球形體表層形成含較多水分之狀態,承受滾動壓力時可使粒子移動(可塑性變形)較為容易,結果可使凸部分平坦化,便可獲得最大高度波浪Wz較小的平滑陶瓷球形體。又,為使過剩水分不會造成粒子間凝聚,必需每隔一定經過時間為掌握滾動造粒中的粒子之加濕狀態而目視觀察外觀,或抽樣少量樣品施行粒子狀態之顯微鏡觀察,或者一邊掌握水分率、容積密度等表示加濕狀態的物理量等施行品質管理,一邊進行滾動。Next, the step of reducing the surface wave of the obtained formed body is to place the formed body weighing at least 100 kg or more in a rolling granulator, while adding only water, for at least 10 hours or more, preferably about 20 hours, more preferably 30+ hours of rolling. Thereby, the surface of the molded body is flattened, and the surface wave is reduced. In this step, the moisture content in the rolling granulator is preferably set to be 2-5% higher than that when the granulation is grown. In this way, the surface layer of the ceramic spherical body is in a state containing a lot of water, so that the particles can be easily moved (plastically deformed) when subjected to rolling pressure, and as a result, the convex portion can be flattened, and the maximum height wave Wz can be obtained. Smooth ceramic spherical body. In addition, in order to prevent excessive moisture from causing aggregation between particles, it is necessary to visually observe the appearance of the particles in the rolling granulation for grasping the humidified state of the particles at a certain elapsed time, or to sample a small amount of samples to perform microscopic observation of the particle state, or to grasp the state of the particles. The physical quantities, such as moisture content and bulk density, which indicate the humidified state, are rolled while subject to quality control.

再者,上述降低表面波浪的步驟亦具有促進成形體緻密化的效果,亦能有效降低內部缺陷率。Furthermore, the above-mentioned step of reducing the surface wave also has the effect of promoting the densification of the formed body, and can also effectively reduce the internal defect rate.

因為依此獲得的成形體含有水分,因而若直接提供而進行後述燒結步驟,因成形體內部的水分急遽蒸發,會有導致成形體發生龜裂的可能性。所以,成形體在提供進行燒結步驟之前,便使用乾燥機等進行使成形體內部水分逐漸減少的乾燥步驟。Since the thus obtained molded body contains moisture, if it is directly supplied and subjected to the sintering step described later, the moisture inside the molded body rapidly evaporates, which may cause cracks in the molded body. Therefore, before the compact is provided for the sintering process, a drying process for gradually reducing the moisture content in the compact is performed using a dryer or the like.

依此,藉由施行將所成形且經乾燥步驟的成形體放入匣缽等之中,利用煅燒爐進行煅燒的燒結步驟,除去黏結劑與消除粉末粒子結合,便可獲得陶瓷燒結體。燒結步驟時,較佳為依1350~1450℃施行1~3小時之煅燒。In this way, a ceramic sintered body can be obtained by performing a sintering step of placing the formed body after the drying step in a sagger or the like, and calcining it in a calcining furnace to remove the binder and eliminate the bonding of the powder particles. In the sintering step, it is preferable to perform calcination at 1350-1450° C. for 1-3 hours.

經過燒結步驟的燒結體可直接(或更進一步經後述研磨後)使用為粉碎用介質。但是,為能更進一步減少粉碎用介質的缺陷,較佳為施行後述的熱間均壓步驟。以下,針對在燒結步驟後更進一步施行熱間均壓步驟的情況進行說明。另外,於沒有施行熱間均壓步驟的情況,前述燒結步驟後的燒結體並非最終製品的「中間燒結體」;於有施行熱間均壓步驟的情況,在以下說明中記為「中間燒結體」。The sintered body that has undergone the sintering step can be used as it is (or after further grinding as described later) as a pulverizing medium. However, in order to further reduce the defects of the pulverizing medium, it is preferable to perform a thermal equalization step described later. Hereinafter, the case where the thermal pressure equalization step is further performed after the sintering step will be described. In addition, in the case where the hot equalization step is not performed, the sintered body after the aforementioned sintering step is not the "intermediate sintered body" of the final product; in the case where the hot equalization step is performed, it is described as "intermediate sintering" in the following description. body".

如前述,由燒結步驟所獲得的中間燒結體,較佳為提供進行熱間均壓(Hot Isostatic Pressing)處理(以下稱「HIP處理」)的熱間均壓步驟。HIP處理係對被處理物同時施加高溫與等向性壓力的處理,藉由對中間燒結體施行HIP處理,便可在不致使形狀變化之情況下,除去中間燒結體內部殘存的空隙與龜裂等缺陷。As described above, the intermediate sintered body obtained by the sintering step is preferably subjected to a hot isostatic pressing step for performing a hot isostatic pressing treatment (hereinafter referred to as "HIP treatment"). HIP treatment is a treatment in which high temperature and isotropic pressure are simultaneously applied to the object to be treated. By applying HIP treatment to the intermediate sintered body, the remaining voids and cracks in the intermediate sintered body can be removed without changing the shape. and other defects.

HIP處理較佳為依較燒結步驟中的燒結溫度低0℃~50℃之溫度實施。若為更低的溫度,HIP處理中的二氧化鋯等陶瓷粉末擴散不足,會有殘留缺陷的情況。另一方面,若HIP處理的溫度高於燒結溫度,則因中間燒結體進行粒成長而會導致強度降低,且會有強度變動趨大的情況。HIP處理的溫度更佳係較燒結步驟的燒結溫度低0℃~40℃之溫度、特佳係低0℃~30℃的溫度。The HIP treatment is preferably performed at a temperature 0°C to 50°C lower than the sintering temperature in the sintering step. If the temperature is lower, the diffusion of ceramic powders such as zirconium dioxide in the HIP treatment is insufficient, and residual defects may occur. On the other hand, if the temperature of the HIP treatment is higher than the sintering temperature, the grain growth of the intermediate sintered body causes the strength to decrease, and the strength fluctuation may become large. The temperature of the HIP treatment is preferably 0°C to 40°C lower than the sintering temperature in the sintering step, and particularly preferably the temperature is 0°C to 30°C lower.

HIP處理的壓力係為能除去缺陷,較佳為足夠壓力,若依100MPa以上之壓力施行處理,便可毫無問題地施行處理。為能形成高壓狀態,較佳為在Ar氣體環境中施行處理。The pressure of the HIP treatment is sufficient to remove defects, and is preferably a sufficient pressure. If the treatment is carried out at a pressure of 100 MPa or more, the treatment can be carried out without problems. In order to be able to form a high-pressure state, it is preferable to perform the treatment in an Ar gas atmosphere.

依如上述獲得的燒結體係可直接使用為粉碎用介質,更進一步使用例如:滾筒研磨裝置、球磨機、珠磨機等裝置研磨表面,便可獲得更高品質的粉碎用介質。The sintering system obtained as described above can be directly used as a pulverizing medium, and a higher-quality pulverizing medium can be obtained by further grinding the surface with devices such as a barrel mill, a ball mill, and a bead mill.

再者,燒結體較佳為利用分級步驟進行分級。利用分級步驟便可設為所需的平均粒徑、最小粒徑及最大粒徑。分級方法係可例如:使用篩網狀篩進行分級的篩式分級等。篩分級亦可使兩層篩重疊,利用1次操作分離粒徑相對大的粗粉、與粒徑相對小的微粉。Furthermore, the sintered body is preferably classified by a classification step. The desired average particle size, minimum particle size, and maximum particle size can be set by the classification step. The classification method can be, for example, sieve classification in which a mesh-shaped sieve is used for classification. The sieve classification can also make two layers of sieves overlap, and use one operation to separate the coarse powder with a relatively large particle size and the fine powder with a relatively small particle size.

另外,關於上述表面研磨步驟,經本發明者等檢討的結果,發現特別係使用具較高攪拌能量的珠磨機裝置施行濕式研磨,便可獲得更良好的表面平滑性。表面平滑性係在濕式分散製程中會大幅影響陶瓷球形體磨損量的因子,當表面平滑性較差的情況、即表面凹凸較大或較多的情況,若陶瓷球形體間、或者陶瓷球形體與被分散物間發生碰撞時,凸形狀部分容易被研削,而增加陶瓷球形體之主要成分二氧化鋯的磨損量,結果對被分散物的品質造成大幅影響。特別已知在本發明之陶瓷球形體介質之主要用途,將積層陶瓷電容器製造用高介電原料,所使用的鈦酸鋇粉末施行濕式分散的步驟時,因會導致陶瓷球形體磨損的二氧化鋯成分混入於鈦酸鋇中,便會影響抑制鈦酸鋇的燒結反應,而損及燒結後的鈦酸鋇之初級粒徑的均勻性。此種初級粒徑的不均勻程度會使電容器之電氣特性(電容、介電損失等)惡化、或在形成每1層厚度未滿1μm的較薄之誘電體層時助長表面凹凸,導致在形成平坦積層構造的製程中成為阻礙要因。所以,在鈦酸鋇的濕式分散步驟中,依高精度管理混入被粉碎物中的二氧化鋯之磨損量,較佳係磨損量少且安定的陶瓷球形體介質。為實現此點,必需確保陶瓷球形體表面的平滑性。In addition, with regard to the above-mentioned surface grinding step, the inventors of the present invention have found that, as a result of examination, particularly by using a bead mill apparatus with a higher stirring energy to perform wet grinding, more favorable surface smoothness can be obtained. Surface smoothness is a factor that will greatly affect the amount of wear of ceramic spheres in the wet dispersion process. When colliding with the object to be dispersed, the convex portion is easily ground, and the wear amount of zirconium dioxide, which is the main component of the ceramic spherical body, is increased, and as a result, the quality of the object to be dispersed is greatly affected. In particular, it is known that in the main application of the ceramic spherical body dielectric of the present invention, when the high dielectric raw material for the manufacture of multilayer ceramic capacitors is subjected to the wet dispersion step of the barium titanate powder used, it is known that the wear of the ceramic spherical body will be caused by two factors. When the zirconia component is mixed into the barium titanate, the sintering reaction of the barium titanate will be inhibited, and the uniformity of the primary particle size of the sintered barium titanate will be impaired. The unevenness of the primary particle size can deteriorate the electrical characteristics (capacitance, dielectric loss, etc.) of the capacitor, or promote surface irregularities when forming a thin dielectric layer with a thickness of less than 1 μm per layer, resulting in a flat It becomes a hindrance factor in the process of the build-up structure. Therefore, in the wet dispersion step of barium titanate, the abrasion amount of zirconium dioxide mixed into the object to be pulverized is controlled with high precision, and it is preferable to use a ceramic spherical medium with less abrasion amount and stability. To achieve this, it is necessary to ensure the smoothness of the surface of the ceramic spherical body.

使用上述珠磨機裝置的研磨步驟中,為能獲得良好表面平滑性的重要製程因子,係研磨材的種類(素材、粒徑)、及其漿濃度、攪拌速度(圓周速度)、處理時間。為使自重能如微小尺寸陶瓷球形體般的輕,在研磨表面時必需使用較高的研磨能量。研磨材較佳為使用切削力較高的碳化矽(SiC)或氧化鋁(Al 2O 3),粒徑越大則切削力越高,相反的,粒徑越小則越能降低切削傷,故較能更輕易地獲得平滑表面。所以,從生產效率之觀點,最初先利用較大粒徑的研磨材施行粗研磨後,再使用較小粒徑的研磨材施行拋光研磨便屬有效,粗研磨用較佳為使用粒徑3~10μm程度的粒徑,拋光研磨用較佳為使用0.5~2μm程度的粒徑。又,研磨材的漿濃度,從研磨處理中防止研磨材自身之凝聚的觀點,較佳係設為1~5重量%程度。同樣地從防止凝聚之觀點,較佳為配合研磨材種類添加分散劑0.3~3重量%程度。裝置運轉條件的攪拌速度(圓周速度),從生產能力之觀點係越快越好,但若過快會導致陶瓷球形體表面上容易附著研磨材之殘渣,故就從兼顧的觀點較佳係設為8~14m/s範圍。處理時間係依照裝置規格、陶瓷球形體尺寸、研磨材種類等而有所不同,較佳係至少2小時以上、更佳係4小時以上。又,待研磨處理結束後,藉由利用未含研磨材而僅有水者、或僅含有水與分散劑者施行處理,便可除去陶瓷球形體表面上附著的殘渣,較佳係施行0.5~2小時左右。 In the grinding step using the above-mentioned bead mill, the important process factors for obtaining good surface smoothness are the type of grinding material (material, particle size), its slurry concentration, stirring speed (peripheral speed), and processing time. In order to make the dead weight as light as the micro-sized ceramic spheres, it is necessary to use higher grinding energy when grinding the surface. The abrasive material is preferably silicon carbide (SiC) or alumina (Al 2 O 3 ) with high cutting force. Therefore, it is easier to obtain a smooth surface. Therefore, from the point of view of production efficiency, it is effective to use the abrasive material with larger particle size to perform rough grinding at first, and then use the abrasive material with smaller particle size to perform polishing and grinding. A particle size of about 10 μm is preferably used for polishing and polishing with a particle size of about 0.5 to 2 μm. In addition, the slurry concentration of the abrasives is preferably about 1 to 5% by weight from the viewpoint of preventing aggregation of the abrasives themselves during the polishing process. Similarly, from the viewpoint of preventing aggregation, it is preferable to add about 0.3 to 3% by weight of the dispersant in accordance with the type of abrasive. The stirring speed (circumferential speed) of the operating conditions of the device is as fast as possible from the viewpoint of productivity. However, if it is too fast, residues of abrasives will easily adhere to the surface of the ceramic spherical body. It is in the range of 8~14m/s. The treatment time varies depending on the specifications of the device, the size of the ceramic sphere, the type of abrasives, etc., but is preferably at least 2 hours or more, and more preferably 4 hours or more. In addition, after the grinding process is completed, the residues adhering to the surface of the ceramic spherical body can be removed by using only water without abrasives, or with only water and dispersant, and preferably 0.5~ 2 hours or so.

使用如上述珠磨機依適當條件施行濕式研磨的結果,例如若以滾筒研磨方式,相對於表面粗糙度Ra=20~40nm程度的平滑性可獲得Ra=2~10nm的平滑性。為形成2nm以下必需使用更微小之粒徑研磨材,依長時間或高圓周速度施行研磨,但卻容易發生研磨材之凝聚,結果會有混入製品的顧慮,所以利用本發明施行的製法較佳為設為上述表面粗糙度範圍。表面粗糙度Ra係使用原子力顯微鏡(AFM)便可評價。另外,本發明係抽樣10個陶瓷球形體進行評價,將平均值設為表面粗糙度值Ra。As a result of performing wet grinding under appropriate conditions using the bead mill as described above, for example, by barrel grinding, the smoothness of Ra=2 to 10 nm can be obtained with respect to the smoothness of the surface roughness Ra=20 to 40 nm. In order to form an abrasive material with a finer particle size below 2nm, grinding is performed for a long time or at a high peripheral speed, but the agglomeration of the abrasive material is likely to occur, and as a result, there will be concerns about mixing into the product, so it is better to use the production method implemented in the present invention. In order to make it into the said surface roughness range. The surface roughness Ra can be evaluated using an atomic force microscope (AFM). In addition, in this invention, 10 ceramic spherical bodies were sampled and evaluated, and the average value was made into the surface roughness value Ra.

上述表面粗糙度Ra=2~10nm陶瓷球形體進行鈦酸鋇濕式分散時,磨損量的評價結果,得知若Ra=10nm至5nm時雖平滑但磨損量亦會降低,可是若5nm以下則幾乎持平。此現象可認為因為二氧化鋯球形體受來自鈦酸鋇的切削作用,例如即使初期平滑性為2nm左右,但使用後會因切削傷導致其惡化成5nm前後的平滑性。由以上結果,關於本發明的鈦酸鋇之濕式分散用途,為能降低因陶瓷球形體造成的氧化鋯磨損量且使安定化,陶瓷球形體較佳為設為表面粗糙度Ra=2~5nm範圍。 [實施例] When the above-mentioned surface roughness Ra=2~10nm ceramic spherical body is subjected to wet dispersion of barium titanate, the evaluation result of the wear amount shows that if Ra=10nm to 5nm, although it is smooth, the wear amount will also decrease, but if it is less than 5nm, the wear amount will be reduced. almost flat. This phenomenon is considered to be because the zirconia spherical body is subjected to cutting action from barium titanate. For example, even if the initial smoothness is about 2 nm, after use, the smoothness deteriorates to about 5 nm due to cutting damage. From the above results, regarding the wet dispersion application of barium titanate of the present invention, in order to reduce the wear amount of zirconia caused by the ceramic spherical body and stabilize the ceramic spherical body, the surface roughness of the ceramic spherical body is preferably set to Ra=2~ 5nm range. [Example]

以下,根據實施例針對本發明進行具體說明,惟,本發明並不僅侷限於該等實施例。Hereinafter, the present invention will be specifically described based on the embodiments, but the present invention is not limited to these embodiments.

(測定方法) (平均粒徑、最小粒徑、最大粒徑、1%粒徑(D1)、99%粒徑(D99) 粒徑係依下述方法測定。利用數位式顯微鏡VHX-2000(Keyence製),依倍率10~200倍拍攝陶瓷球形體的集合體。使用影像分析・計測軟體WinROOF(註冊商標:三谷商事公司製),以測定用影像的亮度為基準施行二值化。二值化影像利用最小均方施行圓形圖分離,計算出經分離的各圓之直徑,並設為各陶瓷球形體的直徑。又,將1000個陶瓷球形體的直徑數量平均值設為平均粒徑X。又,將經圓形圖分離的各圓直徑之最小值設為最小粒徑、最大值設為最大粒徑。此外,依個數比例從最小端起計數,將累積個數1%的等值直徑設為1%粒徑(D1),將累積個數99%的等值直徑設為99%粒徑(D99)。 (test methods) (average particle size, minimum particle size, maximum particle size, 1% particle size (D1), 99% particle size (D99) The particle size is measured according to the following method. Using a digital microscope VHX-2000 (manufactured by Keyence), an aggregate of ceramic spheres was photographed at a magnification of 10 to 200 times. Image analysis and measurement software WinROOF (registered trademark: manufactured by Mitani Corporation) was used to perform binarization based on the brightness of the measurement image. The binarized image is separated by a circle diagram using the least mean square, and the diameter of each separated circle is calculated and set as the diameter of each ceramic sphere. In addition, let the average particle diameter X be the average number of diameters of 1000 ceramic spherical bodies. In addition, let the minimum value of the diameters of each circle separated by the circular chart be the minimum particle diameter, and the maximum value to be the maximum particle diameter. In addition, count from the smallest end according to the number ratio, set the equivalent diameter of 1% of the cumulative number as 1% particle size (D1), and set the equivalent diameter of 99% of the cumulative number as 99% particle size (D99 ).

(結晶相比例) 將樹脂包埋試料,施行切剖及鏡面研磨設為測定試料。將其貼附於試料支撐架上,利用廣角X射線繞射法(微小部X射線繞射)進行測定。測定條件係如下: X射線源:CuK線(使用多層膜反射鏡) 輸出:50kV、22mA 狹縫系:100μm

Figure 02_image001
針孔 測定範圍:2θ=23°~33°、70°~77° 累計時間:3600秒/幀。 (Crystalline Phase Example) A resin-embedded sample was subjected to cutting and mirror polishing to obtain a measurement sample. This was attached to a sample holder, and the measurement was performed by a wide-angle X-ray diffraction method (micro-part X-ray diffraction). The measurement conditions are as follows: X-ray source: CuK line (using a multilayer mirror) Output: 50 kV, 22 mA Slit system: 100 μm
Figure 02_image001
Pinhole measurement range: 2θ=23°~33°, 70°~77° Cumulative time: 3600 seconds/frame.

從測定結果,使用下式計算出二氧化鋯各結晶層的含有率。 單斜晶含有率(%)=[{I m(111)+I m(1-1-1)}/{I m(111)+I m(1-1-1)+I t+c(111)}]×100 立方晶含有率(%)=[I t+c(111)/{I m(111)+I m(1-1-1)+I t+c(111)}]×[{I c(400)/{I c(400) +I t(400)+I t(004)}×100 正方晶含有率(%)=100-單斜晶含有率-立方晶含有率 其中,I係表示繞射強度。下標字係m、t、c分別表示單斜晶、立方晶、正方晶。繞射強度之( )內係表示各結晶的指數。 From the measurement results, the content of each crystal layer of zirconium dioxide was calculated using the following formula. Monoclinic crystal content (%)=[{I m (111)+I m (1-1-1)}/{I m (111)+I m (1-1-1)+I t+c ( 111)}]×100 Cubic crystal content (%)=[I t+c (111)/{I m (111)+I m (1-1-1)+I t+c (111)}]× [{I c (400)/{I c (400) +I t (400)+I t (004)}×100 tetragonal content (%)=100-monoclinic content-cubic content where , where I represents the diffraction intensity. The subscripts m, t, and c represent monoclinic, cubic, and tetragonal crystals, respectively. The inner part of the diffraction intensity ( ) represents the index of each crystal.

(最大高度波浪Wz) 最大高度波浪Wz(μm)係根據JIS B 0601:2013。針對陶瓷球形體使用雷射顯微鏡VK-X-150(Keyence製),從圖1的4所示之測定方向(圖1中的z軸方向),就直徑成為圖1中的2所示之X/2(μm)的該球形體之截面(圖1中與z軸正交的xy平面上)、與該球形體表面的交線部(即,圖1中的3所示之處),以未接觸的10個球形體對象,在測定長度=平均粒徑X/2×3.141(μm)、高頻成分除去用截頻值λs=2.5(μm)、低頻成分除去用λc=無的條件下,測定z軸方向的最大高度波浪Wz,計算出最大高度波浪Wz的平均值。此處,圖1中的5係本發明之最大高度波浪Wz的測定分佈例。 (Max height wave Wz) The maximum height wave Wz (μm) is based on JIS B 0601:2013. Using a laser microscope VK-X-150 (manufactured by Keyence) for the ceramic spherical body, the diameter from the measurement direction shown in 4 in FIG. 1 (z-axis direction in FIG. 1 ) becomes X shown in 2 in FIG. 1 . /2 (μm) of the cross-section of the spherical body (on the xy plane orthogonal to the z-axis in FIG. 1 ), and the intersection with the surface of the spherical body (that is, the place indicated by 3 in FIG. 1 ), with 10 uncontacted spherical objects, under the conditions of measurement length = average particle diameter X/2 × 3.141 (μm), cutoff value for high frequency component removal λs = 2.5 (μm), and low frequency component removal λc = none , measure the maximum height wave Wz in the z-axis direction, and calculate the average value of the maximum height wave Wz. Here, 5 in FIG. 1 is an example of the measurement distribution of the maximum height wave Wz of the present invention.

(表面粗糙度Ra) 表面粗糙度Ra(nm)係根據JIS B 0601:2013。從陶瓷球形體的集合體任意抽樣10個粒子,使用原子力顯微鏡(Bruker公司、NanoScopeV),在陶瓷球形體之平均粒徑X的1/10四邊形大小之測定區域中,依掃描速度=0.3Hz、解析度256×256掃描球形體中心附近,再針對所獲得之影像施行平面化(Flatten)1次、平面相稱(Plane Fit)-x3次處理,獲得將曲面擬合校正為平面的影像。針對經平面校正的影像,評價表面粗糙度Ra。針對各粒子各施行3次評價,將10粒子×3次=合計30處的Ra平均值設為該陶瓷球形體的表面粗糙度值Ra。 (Surface Roughness Ra) The surface roughness Ra (nm) is based on JIS B 0601:2013. 10 particles were randomly sampled from the aggregate of ceramic spheres, and an atomic force microscope (Bruker, NanoScope V) was used to measure the size of a quadrilateral 1/10 of the average particle diameter X of the ceramic spheres according to the scanning speed = 0.3 Hz, A resolution of 256×256 was used to scan the vicinity of the center of the spherical body, and then the obtained image was subjected to one-time Flattening and three-times Plane Fit-x3 processing to obtain an image whose curved surface was fitted and corrected to a flat surface. For the plane-corrected image, the surface roughness Ra is evaluated. The evaluation was performed three times for each particle, and the average value of Ra at 10 particles×3 times=a total of 30 points was defined as the surface roughness value Ra of the ceramic spherical body.

(內部缺陷率) 內部缺陷率係依下述方法測定。陶瓷球形體利用研削機施行研削至球形體直徑的40~60%大小後,更利用粒徑6μm之鑽石液施行10分鐘以上的拋光研磨,獲得略截面。所獲得之樣品使用數位式顯微鏡VHX-2000(Keyence製)依倍率10~200倍觀察,計數可觀察到的龜裂數。觀察200個陶瓷球形體,從該等之中,計算出有龜裂或點缺陷的陶瓷球形體比例,設為內部缺陷率。 (internal defect rate) The internal defect rate was measured by the following method. The ceramic spherical body is ground to 40~60% of the diameter of the spherical body with a grinding machine, and then polished and ground for more than 10 minutes with a diamond liquid with a particle size of 6 μm to obtain a rough cross-section. The obtained sample was observed at a magnification of 10 to 200 times using a digital microscope VHX-2000 (manufactured by Keyence), and the number of observed cracks was counted. 200 ceramic spheres were observed, and from these, the proportion of ceramic spheres with cracks or point defects was calculated and set as the internal defect rate.

(壓碎荷重值) 壓碎荷重值係依下述方法測定。利用直徑20mm之二氧化鋯製圓柱狀夾具夾持陶瓷球形體,使用電子式萬能試驗機CATY-2000YD(米倉製作所製)依0.5mm/min速度施加壓縮荷重,測定破壞時的荷重值。測定係針對30個陶瓷球形體實施,數值係採用平均值。又,當陶瓷球形體暴露於高溫之水中時,強度試驗係將所獲得之陶瓷球形體在水溫90℃中靜置50小時,然後測定陶瓷球形體的壓碎荷重值,設為「水熱試驗後的壓碎荷重值」。測定係依30個球形體實施,數值係採用平均值。又,從{(水熱試驗前的壓碎荷重值)-(水熱試驗後的壓碎荷重值)}/(水熱試驗前的壓碎荷重值)×100,計算出水熱試驗後的壓碎荷重降低率。 (crushing load value) The crushing load value was measured according to the following method. The ceramic spherical body was clamped by a zirconium dioxide cylindrical fixture with a diameter of 20 mm, and a compressive load was applied at a speed of 0.5 mm/min using an electronic universal testing machine CATY-2000YD (manufactured by Yicang Manufacturing Co., Ltd.), and the load value at the time of failure was measured. The measurement is carried out on 30 ceramic spheres, and the numerical value is an average value. In addition, when the ceramic spherical body is exposed to high temperature water, the strength test system will allow the obtained ceramic spherical body to stand for 50 hours in a water temperature of 90 ° C, and then measure the crushing load value of the ceramic spherical body, and set it as "hydrothermal". Crush load value after test". The measurement is carried out on 30 spheroids, and the numerical system adopts the average value. Also, from {(crushing load value before hydrothermal test)-(crushing load value after hydrothermal test)}/(crushing load value before hydrothermal test)×100, the pressure after hydrothermal test was calculated. Crushed load reduction rate.

(龜裂試驗) 依下述方法施行龜裂試驗。所獲得之陶瓷球形體的集合體在珠磨機裝置(HIROSHIMA METAL & MACHINERY公司製、型號UAM-015)中填充220g,使20℃純水300g進行循環,依圓周速度12m/s進行24小時攪拌。經攪拌後,取出陶瓷球形體,使用數位式顯微鏡VHX-2000(Keyence)依倍率10~200倍觀察,確認有無龜裂。確認1000個陶瓷球形體,將有出現龜裂的陶瓷球形體個數設為龜裂個數。 (Crack test) The crack test was carried out according to the following method. The aggregate of the obtained ceramic spherical bodies was filled with 220 g of a bead mill device (manufactured by HIROSHIMA METAL & MACHINERY, model UAM-015), 300 g of pure water at 20°C was circulated, and stirring was performed at a peripheral speed of 12 m/s for 24 hours. . After stirring, the ceramic spherical body was taken out, and observed with a digital microscope VHX-2000 (Keyence) at a magnification of 10 to 200 times to confirm the presence or absence of cracks. 1000 ceramic spheres were confirmed, and the number of ceramic spheres with cracks was defined as the number of cracks.

(鈦酸鋇濕式分散時的磨損量評價、龜裂評價) 利用下述方法施行鈦酸鋇之濕式分散時的陶瓷球形體之磨損量評價。所獲得之陶瓷球形體的集合體在珠磨機裝置(HIROSHIMA METAL & MACHINERY公司製、型號UAM-015)中填充220g,使在20℃之純水300g中摻合鈦酸鋇30g(SIGMA-ALDRICH公司、鈦(IV)酸鋇)、分散劑3g(東京化成工業(股)、十二烷基苯磺酸鈉)而製作的漿進行循環,依圓周速度12m/s實施4小時濕式分散。所獲得之漿利用熱風乾燥機施行90℃×24小時乾燥,再將已乾固的鈦酸鋇粉末使用研缽施行微粉碎後,使用螢光X射線分析裝置(理學電氣工業製 ZSX PrimusII),藉由求取鋯強度尖峰面積相對於鈦、鋇之強度尖峰面積的比率,而計算出鈦酸鋇粉末中的二氧化鋯量(陶瓷球形體磨損量)。又,實施該試驗後,依照與前述龜裂試驗同樣的手法,使用數位式顯微鏡確認陶瓷球形體的龜裂個數。 (Evaluation of wear amount and crack evaluation during wet dispersion of barium titanate) The wear amount evaluation of the ceramic spherical body during wet dispersion of barium titanate was carried out by the following method. The aggregate of the obtained ceramic spherical bodies was filled with 220 g of a bead mill device (manufactured by HIROSHIMA METAL & MACHINERY, model UAM-015), and 300 g of barium titanate (SIGMA-ALDRICH) was mixed with 300 g of pure water at 20°C. Company, titanium (IV) barium), and 3 g of dispersant (Tokyo Chemical Industry Co., Ltd., sodium dodecylbenzenesulfonate) were circulated, and wet dispersion was performed for 4 hours at a peripheral speed of 12 m/s. The obtained slurry was dried at 90°C for 24 hours with a hot air dryer, and then the dried barium titanate powder was finely pulverized with a mortar, and then a fluorescent X-ray analyzer (ZSX Primus II, manufactured by Rigaku Electric Co., Ltd.) was used. The amount of zirconium dioxide in the barium titanate powder (ceramic spherical body wear amount) was calculated by obtaining the ratio of the area of the zirconium intensity peak to the area of the intensity peak of titanium and barium. In addition, after this test was carried out, the number of cracks in the ceramic spherical body was confirmed using a digital microscope in the same manner as in the above-mentioned crack test.

[實施例1] 在氧氯化鋯中,依所獲得之陶瓷球形體中之氧化物換算成為表1的氧化釔/二氧化鋯莫耳比所示比例之方式,添加氯化釔,依照共沉法製作原料粉末。 [Example 1] In zirconium oxychloride, yttrium chloride was added in such a manner that the oxides in the obtained ceramic spheres were converted into the molar ratio of yttria/zirconia in Table 1, and the raw material powder was prepared according to the co-precipitation method. .

接著,使用上述原料粉末,依滾動造粒成形法,施行造粒成形直到燒結後的平均粒徑X成為50μm前後之尺寸為止,獲得成形體。Next, using the above-mentioned raw material powder, according to the rolling granulation molding method, granulation molding was performed until the average particle diameter X after sintering became a size around 50 μm to obtain a molded body.

其次,所獲得之成形體降低表面波浪的步驟,係一邊依滾動造粒機內保持一定水分率之方式僅添加水,一邊施行約40小時的滾動,而降低表面波浪。Next, in the step of reducing the surface wave of the obtained formed body, the surface wave was reduced by rolling for about 40 hours while only adding water so as to maintain a certain moisture content in the rolling granulator.

將依如上所獲得之成形體施行乾燥後,依1400℃施行2小時煅燒,獲得中間燒結體(燒結步驟)。然後,對中間燒結體依1380℃、120MPa施行1.5小時的HIP處理(熱間均壓步驟)。針對所獲得之燒結體,使用滾筒研磨裝置施行表面研磨後,藉由施行篩式分級,而製作表1所示之粉碎用球形介質。After drying the formed body obtained as described above, calcination was performed at 1400° C. for 2 hours to obtain an intermediate sintered body (sintering step). Then, the intermediate sintered body was subjected to HIP treatment at 1380° C. and 120 MPa for 1.5 hours (thermal equalization step). The obtained sintered body was subjected to surface grinding using a barrel grinding apparatus, and then subjected to sieve classification to prepare spherical media for grinding shown in Table 1.

[實施例2] 使用實施例1的原料粉末,與實施例1同樣地,依照滾動造粒成形法造粒至燒結後之平均粒徑X成為100μm前後之尺寸之成形體,實施降低表面波浪的步驟。所獲得之成形體經乾燥除去水分後,再施行煅燒、HIP處理。針對所獲得之燒結體,使用滾筒研磨裝置施行表面研磨後,藉由施行篩式分級,而製作表1所示之粉碎用球形介質。 [Example 2] Using the raw material powder of Example 1, similarly to Example 1, the rolling granulation method was used to granulate a compact with an average particle diameter X after sintering of about 100 μm, and the step of reducing the surface wave was carried out. The obtained shaped body is dried to remove moisture, and then subjected to calcination and HIP treatment. The obtained sintered body was subjected to surface grinding using a barrel grinding apparatus, and then subjected to sieve classification to prepare spherical media for grinding shown in Table 1.

[實施例3] 使用實施例1的原料粉末,與實施例1同樣地,依照滾動造粒成形法造粒至燒結後之平均粒徑X成為200μm前後之尺寸之成形體,實施降低表面波浪的步驟。所獲得之成形體經乾燥除去水分後,再施行煅燒、HIP處理。針對所獲得之燒結體,使用滾筒研磨裝置施行表面研磨後,藉由施行篩式分級,而製作表1所示之粉碎用球形介質。 [Example 3] Using the raw material powder of Example 1, as in Example 1, a compact was granulated by the rolling granulation method until the average particle diameter X after sintering became a size of about 200 μm, and the step of reducing the surface wave was carried out. The obtained shaped body is dried to remove moisture, and then subjected to calcination and HIP treatment. The obtained sintered body was subjected to surface grinding using a barrel grinding apparatus, and then subjected to sieve classification to prepare spherical media for grinding shown in Table 1.

[實施例4] 與實施例1同樣地,依照滾動造粒成形法造粒至燒結後之平均粒徑X成為50μm前後之尺寸之成形體。除將降低表面波浪的步驟的時間縮短為10小時之外,其餘均與實施例1同樣地實施,而製作表1所示之粉碎用球形介質。 [Example 4] In the same manner as in Example 1, a compact was granulated according to the rolling granulation method until the average particle diameter X after sintering became a size of about 50 μm. Except that the time of the step of reducing the surface wave was shortened to 10 hours, it carried out similarly to Example 1, and produced the spherical medium for pulverization shown in Table 1.

[實施例5] 與實施例2同樣地,依照滾動造粒成形法造粒至燒結後之平均粒徑X成為100μm前後之尺寸之成形體。除將降低表面波浪的步驟的時間縮短為10小時之外,其餘均與實施例2同樣地實施,而製作表1所示之粉碎用球形介質。 [Example 5] In the same manner as in Example 2, a compact was granulated according to the rolling granulation method until the average particle diameter X after sintering became a size of around 100 μm. Except that the time of the step of reducing the surface wave was shortened to 10 hours, it carried out similarly to Example 2, and produced the spherical media for grinding shown in Table 1.

[實施例6] 與實施例3同樣地,依照滾動造粒成形法造粒至燒結後之平均粒徑X成為200μm前後之尺寸之成形體。除將降低表面波浪的步驟的時間縮短為10小時之外,其餘均與實施例3同樣地實施,而製作表1所示之粉碎用球形介質。 [Example 6] In the same manner as in Example 3, a compact was granulated according to the rolling granulation method until the average particle diameter X after sintering became a size of around 200 μm. Except that the time of the step of reducing the surface wave was shortened to 10 hours, it carried out similarly to Example 3, and produced the spherical media for grinding shown in Table 1.

[實施例7] 與實施例2同樣地,依照滾動造粒成形法造粒至燒結後之平均粒徑X成為100μm前後之尺寸之成形體。除將HIP步驟的處理溫度從1380℃變更為1300℃之外,其餘均與實施例2同樣地實施,而製作表1所示之粉碎用球形介質。 [Example 7] In the same manner as in Example 2, a compact was granulated according to the rolling granulation method until the average particle diameter X after sintering became a size of around 100 μm. Except that the treatment temperature of the HIP step was changed from 1380°C to 1300°C, it was carried out in the same manner as in Example 2, and the spherical media for pulverization shown in Table 1 were produced.

[實施例8] 進行與實施例1同樣的製造製程直到HIP處理,但研磨步驟係使用珠磨機依如下條件進行。研磨材係使用由粒徑3μm之氧化鋁(Tipton公司(股)、Light 1A)3.0重量%、分散劑之多元羧酸鈉塩(中京油脂(股)、Serna D-305)0.5重量%調製的研磨漿,依珠磨機攪拌圓周速度=12m/s合計研磨6小時後,再利用由粒徑1μm之氧化鋁(Tipton公司(股)、Light 1A)1.0重量%、分散劑同為D-305:0.5重量%調製的研磨漿,實施4小時研磨。最後,利用僅由D-305:0.5重量%調製的漿施行2小時拋光,除去陶瓷球形體的表面殘渣,獲得表面粗糙度Ra=2nm的陶瓷球形體。之後的篩式分級係依照與實施例1同樣之手法實施。 [Example 8] The same manufacturing process as in Example 1 was carried out until the HIP treatment, but the grinding step was carried out using a bead mill under the following conditions. The abrasive used was prepared from 3.0% by weight of alumina with a particle size of 3 μm (Tipton Co., Ltd., Light 1A), and 0.5% by weight of sodium polycarboxylate as a dispersant (Zhongjing Oil Co., Ltd., Serna D-305). The slurry was ground for a total of 6 hours with a bead mill at a peripheral speed of 12 m/s, and then used alumina with a particle size of 1 μm (Tipton Co., Ltd., Light 1A) 1.0% by weight, and the dispersant was the same as D-305. : 0.5 wt % of the prepared slurry was polished for 4 hours. Finally, polishing was performed for 2 hours with a slurry prepared only by D-305: 0.5 wt % to remove the surface residues of the ceramic spheres, thereby obtaining ceramic spheres with a surface roughness Ra=2 nm. The subsequent sieve classification was carried out in the same manner as in Example 1.

[實施例9] 進行與實施例1同樣的製造製程直到HIP處理,但研磨步驟係使用珠磨機依如下條件進行。研磨材係使用由粒徑3μm之氧化鋁(Tipton公司(股)、Light 1A)3.0重量%、分散劑之多元羧酸鈉塩(中京油脂(股)、Serna D-305)0.5重量%調製的研磨漿,依珠磨機攪拌圓周速度=12m/s合計研磨6小時後,再利用僅由D-305:0.5重量%調製的漿施行2小時拋光,除去陶瓷球形體的表面殘渣,獲得表面粗糙度Ra=5nm的陶瓷球形體。之後的篩式分級係依照與實施例1同樣之手法實施。 [Example 9] The same manufacturing process as in Example 1 was carried out until the HIP treatment, but the grinding step was carried out using a bead mill under the following conditions. The abrasive used was prepared from 3.0% by weight of alumina with a particle size of 3 μm (Tipton Co., Ltd., Light 1A), and 0.5% by weight of sodium polycarboxylate as a dispersant (Zhongjing Oil Co., Ltd., Serna D-305). After grinding the slurry for a total of 6 hours according to the bead mill stirring peripheral speed = 12m/s, the slurry prepared by D-305: 0.5% by weight was used for polishing for 2 hours to remove the surface residue of the ceramic spherical body and obtain a rough surface. Ceramic spheres with a degree of Ra=5nm. The subsequent sieve classification was carried out in the same manner as in Example 1.

[實施例10] 進行與實施例1同樣的製造製程直到HIP處理,但研磨步驟係使用珠磨機依如下條件進行。研磨材係使用由粒徑3μm之氧化鋁(Tipton公司(股)、Light 1A)3.0重量%、分散劑之多元羧酸鈉塩(中京油脂(股)、Serna D-305)0.5重量%調製的研磨漿,依珠磨機攪拌圓周速度=12m/s合計研磨3小時後,再利用僅由D-305:0.5重量%調製的漿施行2小時拋光,除去陶瓷球形體的表面殘渣,獲得表面粗糙度Ra=10nm的陶瓷球形體。之後的篩式分級係依照與實施例1同樣的手法實施。 [Example 10] The same manufacturing process as in Example 1 was carried out until the HIP treatment, but the grinding step was carried out using a bead mill under the following conditions. The abrasive used was prepared from 3.0% by weight of alumina with a particle size of 3 μm (Tipton Co., Ltd., Light 1A), and 0.5% by weight of sodium polycarboxylate as a dispersant (Zhongjing Oil Co., Ltd., Serna D-305). After grinding the slurry for a total of 3 hours according to the bead mill stirring peripheral speed = 12m/s, the slurry prepared by D-305: 0.5% by weight was used for polishing for 2 hours to remove the surface residue of the ceramic spherical body and obtain a rough surface. Ceramic spheres with a degree of Ra=10nm. The subsequent sieve classification was carried out in the same manner as in Example 1.

[比較例1] 與實施例1同樣地,依照滾動造粒成形法造粒至燒結後之平均粒徑X成為50μm前後之尺寸之成形體。除省略降低表面波浪的步驟之外,其餘均與實施例1同樣地實施,而製作表1所示之粉碎用球形介質。 [Comparative Example 1] In the same manner as in Example 1, a compact was granulated according to the rolling granulation method until the average particle diameter X after sintering became a size of about 50 μm. Except for omitting the step of reducing the surface wave, it was carried out in the same manner as in Example 1, and the spherical media for pulverization shown in Table 1 were produced.

[比較例2] 與實施例2同樣地,依照滾動造粒成形法造粒至燒結後之平均粒徑X成為100μm前後之尺寸之成形體。除省略降低表面波浪的步驟之外,其餘均與實施例2同樣地實施,而製作表1所示之粉碎用球形介質。 [Comparative Example 2] In the same manner as in Example 2, a compact was granulated according to the rolling granulation method until the average particle diameter X after sintering became a size of around 100 μm. Except that the step of reducing the surface wave was omitted, it was carried out in the same manner as in Example 2, and the spherical media for pulverization shown in Table 1 were produced.

[比較例3] 與實施例3同樣地,依照滾動造粒成形法造粒至燒結後之平均粒徑X成為200μm之前後尺寸之成形體。除省略降低表面波浪的步驟之外,其餘均與實施例3同樣地實施,而製作表1所示之粉碎用球形介質。 [Comparative Example 3] In the same manner as in Example 3, a compact was granulated according to the rolling granulation method until the average particle diameter X after sintering became 200 μm before and after. Except for omitting the step of reducing the surface wave, it was carried out in the same manner as in Example 3, and the spherical medium for pulverization shown in Table 1 was produced.

[比較例4~6] 在氧氯化鋯中,依所獲得之陶瓷球形體中氧化物換算成為表1的氧化釔/二氧化鋯莫耳比所示比例之方式添加氯化釔,利用共沉法製作原料粉末。 [Comparative Examples 4 to 6] In the zirconium oxychloride, yttrium chloride was added so that the oxides in the obtained ceramic spherical body were converted into the ratio shown in the yttria/zirconia molar ratio in Table 1, and the raw material powder was prepared by the coprecipitation method.

其次,使用上述原料粉末,與實施例2同樣地,利用滾動造粒成形法造粒至燒結後之平均粒徑成為100μm尺寸之成形體,再實施降低表面波浪的步驟。所獲得之成形體經乾燥而除去水分後,施行煅燒、HIP處理。針對所獲得之燒結體,使用滾筒研磨裝置施行表面研磨後,藉由施行篩式分級,而製作表1所示之粉碎用球形介質。Next, using the above-mentioned raw material powder, as in Example 2, the rolling granulation method was used to granulate a compact having an average particle diameter of 100 μm after sintering, and the step of reducing the surface wave was carried out. The obtained molded body is dried to remove moisture, and then subjected to calcination and HIP treatment. The obtained sintered body was subjected to surface grinding using a barrel grinding apparatus, and then subjected to sieve classification to prepare spherical media for grinding shown in Table 1.

[比較例7] 進行與比較例1同樣的製法直到HIP步驟,但研磨步驟係與實施例8同樣依使用珠磨機之研磨條件實施,獲得表面粗糙度Ra=3nm的表面平滑性。篩式分級亦與實施例8同樣地實施。 [Comparative Example 7] The same production method as in Comparative Example 1 was carried out until the HIP step, but the polishing step was carried out in the same manner as in Example 8 under the polishing conditions using a bead mill to obtain surface smoothness with a surface roughness Ra=3 nm. The sieve classification was also carried out in the same manner as in Example 8.

評價結果如表1~2所示。The evaluation results are shown in Tables 1-2.

如實施例1~6所示,藉由降低表面波浪,便可獲得不易破損的陶瓷球形體。實施例7係藉由降低HIP溫度,而提高內部缺陷率、且龜裂個數略有増加,但仍在容許範圍內。As shown in Examples 1 to 6, by reducing the surface wave, a ceramic spherical body that is not easily broken can be obtained. In Example 7, the internal defect rate was increased by lowering the HIP temperature, and the number of cracks was slightly increased, but still within the allowable range.

比較例1~3因為表面波浪較大,因而屬於較容易破損的陶瓷球形體。比較例4因為單斜晶比例較大,因而屬於較容易破損的陶瓷球形體。比較例5因為正方晶比例較大,因而水熱試驗後的壓碎荷重值降低率較大,屬於水溫上升時發生破損的可能性高的陶瓷球形體。比較例6,因為正方晶比例較小,因而屬於較容易破損的陶瓷球形體。Comparative Examples 1 to 3 belong to the ceramic spherical bodies which are easily broken due to the large surface waves. Comparative Example 4 belongs to a ceramic spherical body which is easily broken due to the large proportion of monoclinic crystals. In Comparative Example 5, since the ratio of tetragonal crystals is large, the reduction rate of the crushing load value after the hydrothermal test is large, and it belongs to a ceramic spherical body with a high possibility of breakage when the water temperature rises. Comparative Example 6 belongs to a ceramic spherical body which is easily broken because of the small proportion of tetragonal crystals.

再者,如實施例1及實施例8~10所示,若表面粗糙度Ra=5~20nm範圍,隨Ra降低,鈦酸鋇濕式分散時的二氧化鋯磨損量會降低,但5nm與2nm係呈現相同程度。又,此時的陶瓷球形體龜裂個數,實施例1、8~10均屬於零發生。又,龜裂試驗時的龜裂耐性係與實施例1同樣地,於實施例8~10中亦均為零發生。Furthermore, as shown in Example 1 and Examples 8 to 10, if the surface roughness Ra = 5 to 20 nm, the wear amount of zirconia during wet dispersion of barium titanate will decrease as Ra decreases, but 5 nm and The 2nm series exhibited the same degree. In addition, the number of cracks in the ceramic spherical body at this time was zero in Examples 1, 8 to 10. In addition, the crack resistance at the time of the crack test was the same as that of Example 1, and also in Examples 8 to 10, the occurrence of cracks was zero.

比較例7,鈦酸鋇濕式分散時的二氧化鋯磨損量雖較實施例10少,但呈現較實施例8~9高的數值。發現陶瓷球形體有龜裂產生,判斷可能係微小龜裂碎片混入鈦酸鋇分散物的影響。關於龜裂試驗時的龜裂個數亦是與比較例1無大差異,有龜裂產生。In Comparative Example 7, although the zirconium dioxide abrasion amount during the wet dispersion of barium titanate was smaller than that of Example 10, it showed a higher value than that of Examples 8 to 9. It was found that the ceramic spherical body had cracks, and it was judged that it might be caused by the mixing of tiny crack fragments into the barium titanate dispersion. The number of cracks in the crack test was not significantly different from that of Comparative Example 1, and cracks occurred.

[表1] [表1] 平均粒徑X [μm] 最小粒徑 [μm] 最大粒徑 [μm] D1粒徑 [μm] D99粒徑 [μm] 氧化釔/二氧化鋯莫耳比 結晶相比例(容量%) 滾動時間 [hour] 最大高度波浪Wz [μm] (Wz/X)×100 表面粗糙度Ra [nm] HIP溫度 [℃] 內部缺陷率 [%] 正方晶 單斜晶 立方晶 實施例1 50 45 55 46 53 4.8/95.2 89 1 10 40 0.28 0.56 23 1380 0.0 實施例2 106 101 114 103 111 4.9/95.1 91 0 9 40 0.85 0.80 1380 0.0 實施例3 202 194 211 196 209 5.1/94.9 92 0 8 40 1.45 0.72 1380 0.0 實施例4 51 45 59 47 57 4.7/95.3 90 0 10 10 0.59 1.16 1380 0.2 實施例5 106 98 113 99 111 4.5/95.5 91 1 8 10 1.20 1.13 1380 0.2 實施例6 204 192 214 194 211 5.0/95.0 87 2 11 10 2.13 1.04 1380 0.1 實施例7 104 98 109 99 108 4.7/95.3 91 0 9 40 0.83 0.80 1300 0.7 實施例8 51 43 56 45 54 4.9/94.7 90 1 9 40 0.31 0.61 2 1380 0.0 實施例9 50 42 56 43 54 4.8/95.0 91 1 8 40 0.34 0.68 5 1380 0.0 實施例10 51 44 57 46 55 4.8/95.1 90 1 9 40 0.29 0.57 10 1380 0.0 比較例1 50 44 56 46 54 4.7/95.3 90 1 9 0 0.74 1.48 1380 0.3 比較例2 104 98 111 100 109 4.8/95.2 89 2 9 0 1.47 1.41 1380 0.3 比較例3 203 194 213 195 210 4.7/95.3 90 0 10 0 2.80 1.38 1380 0.2 比較例4 105 96 116 97 114 2.7/97.3 92 8 0 40 0.88 0.84 1380 0.0 比較例5 106 94 111 95 109 2.5/97.5 98 2 0 40 0.79 0.75 1380 0.0 比較例6 106 97 112 99 110 5.7/94.3 78 2 20 40 0.85 0.80 1380 0.0 比較例7 50 43 57 45 55 4.7/94.8 90 1 9 0 0.79 1.58 3 1380 0.0 [Table 1] [Table 1] Average particle size X [μm] Minimum particle size [μm] Maximum particle size [μm] D1 particle size [μm] D99 particle size [μm] Yttria/Zirconium Dioxide Molar Ratio Crystal phase ratio (volume %) scroll time [hour] Maximum height wave Wz [μm] (Wz/X)×100 Surface roughness Ra [nm] HIP temperature [℃] Internal defect rate [%] Square crystal Monoclinic cubic crystal Example 1 50 45 55 46 53 4.8/95.2 89 1 10 40 0.28 0.56 twenty three 1380 0.0 Example 2 106 101 114 103 111 4.9/95.1 91 0 9 40 0.85 0.80 1380 0.0 Example 3 202 194 211 196 209 5.1/94.9 92 0 8 40 1.45 0.72 1380 0.0 Example 4 51 45 59 47 57 4.7/95.3 90 0 10 10 0.59 1.16 1380 0.2 Example 5 106 98 113 99 111 4.5/95.5 91 1 8 10 1.20 1.13 1380 0.2 Example 6 204 192 214 194 211 5.0/95.0 87 2 11 10 2.13 1.04 1380 0.1 Example 7 104 98 109 99 108 4.7/95.3 91 0 9 40 0.83 0.80 1300 0.7 Example 8 51 43 56 45 54 4.9/94.7 90 1 9 40 0.31 0.61 2 1380 0.0 Example 9 50 42 56 43 54 4.8/95.0 91 1 8 40 0.34 0.68 5 1380 0.0 Example 10 51 44 57 46 55 4.8/95.1 90 1 9 40 0.29 0.57 10 1380 0.0 Comparative Example 1 50 44 56 46 54 4.7/95.3 90 1 9 0 0.74 1.48 1380 0.3 Comparative Example 2 104 98 111 100 109 4.8/95.2 89 2 9 0 1.47 1.41 1380 0.3 Comparative Example 3 203 194 213 195 210 4.7/95.3 90 0 10 0 2.80 1.38 1380 0.2 Comparative Example 4 105 96 116 97 114 2.7/97.3 92 8 0 40 0.88 0.84 1380 0.0 Comparative Example 5 106 94 111 95 109 2.5/97.5 98 2 0 40 0.79 0.75 1380 0.0 Comparative Example 6 106 97 112 99 110 5.7/94.3 78 2 20 40 0.85 0.80 1380 0.0 Comparative Example 7 50 43 57 45 55 4.7/94.8 90 1 9 0 0.79 1.58 3 1380 0.0

[表2] [表2]    壓碎荷重值 [kgf] 水熱試驗後壓 碎荷重值 [kgf] 水熱試驗後壓 碎荷重降低率 [%] 龜裂個數 [個] 鈦酸鋇濕式分散 Zr磨損濃度 [ppm] 鈦酸鋇濕式分散 龜裂個數 [ppm] 實施例1 0.37 0.36 3 0 1400 0 實施例2 1.66 1.65 1 0 實施例3 5.68 5.64 1 0 實施例4 0.34 0.33 3 0 實施例5 1.54 1.50 3 0 實施例6 5.31 5.25 1 0 實施例7 1.56 1.51 3 2 實施例8 0.39 0.38 3 0 210 0 實施例9 0.38 0.37 3 0 220 0 實施例10 0.38 0.36 5 0 480 0 比較例1 0.30 0.29 3 7 比較例2 1.48 1.45 2 10 比較例3 5.08 5.04 1 11 比較例4 1.52 1.50 1 6 比較例5 1.68 1.51 10 0 比較例6 1.53 1.49 3 8 比較例7 0.32 0.30 6 8 390 10 [Table 2] [Table 2] Crushing load value [kgf] Crushing load value after hydrothermal test [kgf] Crushing load reduction rate after hydrothermal test [%] Number of cracks [pieces] Barium titanate wet dispersion Zr wear concentration [ppm] Barium titanate wet dispersion crack number [ppm] Example 1 0.37 0.36 3 0 1400 0 Example 2 1.66 1.65 1 0 Example 3 5.68 5.64 1 0 Example 4 0.34 0.33 3 0 Example 5 1.54 1.50 3 0 Example 6 5.31 5.25 1 0 Example 7 1.56 1.51 3 2 Example 8 0.39 0.38 3 0 210 0 Example 9 0.38 0.37 3 0 220 0 Example 10 0.38 0.36 5 0 480 0 Comparative Example 1 0.30 0.29 3 7 Comparative Example 2 1.48 1.45 2 10 Comparative Example 3 5.08 5.04 1 11 Comparative Example 4 1.52 1.50 1 6 Comparative Example 5 1.68 1.51 10 0 Comparative Example 6 1.53 1.49 3 8 Comparative Example 7 0.32 0.30 6 8 390 10

1:陶瓷球形體直徑 2:成為X/2(μm)的直徑 3:直徑成為X/2(μm)的陶瓷球形體截面與該球形體表面的交線部 4:最大高度波浪Wz的測定方向 5:最大高度波浪Wz的測定分佈之例 1: diameter of ceramic sphere 2: becomes the diameter of X/2 (μm) 3: The intersection of the cross section of the ceramic spherical body with a diameter of X/2 (μm) and the surface of the spherical body 4: Determination direction of maximum height wave Wz 5: Example of measurement distribution of maximum height wave Wz

圖1係本發明之陶瓷球形體的最大高度波浪Wz之測定位置、測定方向、及實際測定的波浪分佈例圖。測定圖中的z軸方向之最大高度波浪,x軸、y軸係其正交的平面。FIG. 1 is a diagram showing an example of the measurement position, measurement direction, and actually measured wave distribution of the maximum height wave Wz of the ceramic spherical body of the present invention. The maximum height of the wave in the z-axis direction in the figure is measured, and the x-axis and y-axis are the planes perpendicular to it.

Claims (7)

一種陶瓷球形體,係以二氧化鋯為主成分,正方晶比例係80容量%以上且95容量%以下、單斜晶比例係5容量%以下的陶瓷球形體;其中, 將平均粒徑設為X(μm)時,直徑成為X/2(μm)的該球形體之截面、與該球形體之表面的交線部中,最大高度波浪Wz(μm)係平均粒徑X(μm)的0.5%以上且1.2%以下。 A ceramic spherical body, which is mainly composed of zirconium dioxide, the proportion of tetragonal crystal is more than 80% by volume and less than 95% by volume, and the proportion of monoclinic crystal is less than 5% by volume; wherein, When the average particle size is X (μm), the maximum height wave Wz (μm) is the average particle size in the cross-section of the spherical body with a diameter of X/2 (μm) and the intersection with the surface of the spherical body 0.5% or more and 1.2% or less of X (μm). 如請求項1之陶瓷球形體,其中,單斜晶比例係0.1容量%以上。The ceramic spherical body according to claim 1, wherein the proportion of monoclinic crystals is 0.1% by volume or more. 如請求項1或2之陶瓷球形體,其中,粒度分佈中的1%粒徑(D1)係0.7X(μm)以上,99%粒徑(D99)係1.3X(μm)以下。The ceramic spherical body according to claim 1 or 2, wherein the 1% particle size (D1) in the particle size distribution is 0.7X (μm) or more, and the 99% particle size (D99) is 1.3X (μm) or less. 如請求項1至3中任一項之陶瓷球形體,其中,最小粒徑係0.7X(μm)以上,最大粒徑係1.3X(μm)以下。The ceramic spherical body according to any one of claims 1 to 3, wherein the minimum particle size is 0.7X (μm) or more, and the maximum particle size is 1.3X (μm) or less. 如請求項1至4中任一項之陶瓷球形體,其中,上述陶瓷球形體的內部缺陷率係0.5%以下。The ceramic spherical body according to any one of claims 1 to 4, wherein the internal defect rate of the ceramic spherical body is 0.5% or less. 如請求項1至5中任一項之陶瓷球形體,其中,上述陶瓷球形體的平均粒徑係30μm以上且300μm以下。The ceramic spherical body according to any one of claims 1 to 5, wherein the average particle diameter of the ceramic spherical body is 30 μm or more and 300 μm or less. 如請求項1至6中任一項之陶瓷球形體,其中,表面粗糙度Ra係2.0nm以上且5.0nm以下,使用於鈦酸鋇粉末的濕式粉碎。The ceramic spherical body according to any one of claims 1 to 6, wherein the surface roughness Ra is 2.0 nm or more and 5.0 nm or less, and is used for wet grinding of barium titanate powder.
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