TW202210579A - Halogen-free thermosetting resin composition and use thereof - Google Patents

Abstract

The invention provides a halogen-free thermosetting resin composition, which includes a halogen-free epoxy resin, a styrene maleic anhydride copolymer, a cyanate ester resin, a maleimide resin and a flame retardant.

Description

Halogen-free thermosetting resin composition and its use

The present invention relates to a thermosetting resin composition and use thereof, and particularly to a halogen-free thermosetting resin composition and use thereof.

In recent years, with the rapid development of communication technology, the demand for light weight and high density of electronic products is increasing day by day. The power consumption of an electronic product during use will generate a large amount of heat energy, which will cause the temperature of the electronic product to rise, thereby making the substrate easily damaged. At the same time, with the gradual improvement of environmental protection awareness, various environmental protection regulations have become more stringent, and halogen-free materials have become an imperative trend. Therefore, in terms of the development of resin compositions, it has no halogenation and has excellent electrical properties, and also has good heat resistance, which is an urgent development goal for those skilled in the art.

The invention provides a halogen-free thermosetting resin composition, the resin does not contain halogen, has the characteristics of low dielectric constant and low dielectric loss, and still has high Tg (glass transition temperature) and high heat resistance, and can be used in Copper foil substrates and printed circuit boards.

The halogen-free thermosetting resin composition of the present invention includes a halogen-free epoxy resin, a styrene maleic anhydride copolymer, a cyanate ester resin, a maleimide resin, and a flame retardant.

In an embodiment of the present invention, based on the content of the epoxy resin as 100 parts by weight, the content of the styrene maleic anhydride copolymer is 40 to 90 parts by weight, and the content of the cyanate ester resin is 30 to 90 parts by weight 120 parts by weight, the content of the maleimide resin is 20 to 70 parts by weight, and the content of the flame retardant is 20 to 70 parts by weight.

In an embodiment of the present invention, the epoxy resin includes novolac epoxy resin, trifunctional epoxy resin, tetrafunctional epoxy resin, dicyclopentadiene epoxy resin (DCPD), bisphenol epoxy resin, phosphorus-containing epoxy resin Epoxy resin, o-cresol novolac epoxy resin, bisphenol A novolac epoxy resin, phenol novolac epoxy resin, naphthalene ring epoxy resin, isocyanate modified epoxy resin, biphenyl epoxy resin, triazine-containing structure Epoxy resin (triazine), fulorene-containing epoxy resin (fulorene), or a combination thereof.

In an embodiment of the present invention, the molecular weight of the styrene maleic anhydride copolymer is 3000 to 10000, and the molar ratio of styrene:maleic anhydride is 1 to 8:1.

In an embodiment of the present invention, the cyanate ester resin includes bisphenol A type cyanate ester resin, dicyclopentadiene type (DCPD) cyanate ester resin, bisphenol F type cyanate ester resin, and novolac type cyanate ester resin or a combination thereof.

In one embodiment of the present invention, the maleimide resin includes 4,4'-diphenylmethane bismaleimide, phenylmethane maleimide oligomer, m-phenylene bismaleimide Imide, bisphenol A diphenyl ether bismaleimide, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide amine, 4-methyl-1,3-phenylenebismaleimide, 1,6-bismaleimide-(2,2,4-trimethyl)hexane, or a combination thereof.

In an embodiment of the present invention, the flame retardant is a halogen-free flame retardant.

In one embodiment of the present invention, the flame retardant includes a phosphorus-containing flame retardant.

In one embodiment of the present invention, the phosphorus-containing flame retardant includes a phosphazene compound, a phosphoric acid ester compound, a phosphorus-containing epoxy resin, a phosphorus-containing phenolic resin, a phosphorus-containing cyanate resin, or a combination thereof.

The present invention provides a prepreg made of the above-mentioned halogen-free thermosetting resin composition, which is produced by impregnating or coating a base material with the halogen-free thermosetting resin composition, and drying the impregnated or coated base material.

Based on the above, the present invention provides a halogen-free thermosetting resin composition, including a halogen-free epoxy resin, which has the characteristics of low dielectric constant and low dielectric loss, and also has high Tg (glass transition temperature) and high heat resistance. properties, and can be used in copper foil substrates and printed circuit boards.

Hereinafter, embodiments of the present invention will be described in detail. However, these embodiments are exemplary, and the present disclosure is not limited thereto.

As used herein, a range represented by "one value to another value" is a general representation that avoids listing all the values in the range in the specification. Accordingly, the recitation of a particular numerical range includes any numerical value within that numerical range as well as a smaller numerical range bounded by any numerical value within that numerical range, as if the arbitrary numerical value and the smaller numerical range were written in the description in the specification The range of values is the same.

The invention provides a halogen-free thermosetting resin composition, which comprises a halogen-free epoxy resin, a styrene maleic anhydride copolymer, a cyanate ester resin, a maleimide resin and a flame retardant. More specifically, based on 100 parts by weight of the epoxy resin, the content of the styrene maleic anhydride copolymer is, for example, 40 to 90 parts by weight, and the content of the cyanate resin is, for example, 30 to 120 parts by weight. The content of the maleimide resin is, for example, 20 to 70 parts by weight, and the content of the flame retardant is, for example, 20 to 70 parts by weight. Hereinafter, the above-mentioned various components will be described in detail. ＜ Epoxy resin ＞

The epoxy resin of the present invention does not contain halogen, and can mainly include novolac epoxy resin, trifunctional epoxy resin, tetrafunctional epoxy resin, dicyclopentadiene epoxy resin (DCPD), bisphenol epoxy resin, phosphorus-containing epoxy resin Epoxy resin, o-cresol novolac epoxy resin, bisphenol A novolac epoxy resin, phenol novolac epoxy resin, naphthalene ring epoxy resin, isocyanate modified epoxy resin, biphenyl epoxy resin, triazine-containing structure Epoxy resin (triazine), fulorene-containing epoxy resin (fulorene), or a combination thereof. < Styrene maleic anhydride copolymer >

The molecular weight of the styrene maleic anhydride copolymer of the present invention is, for example, 3,000 to 10,000, and the molar ratio of styrene:maleic anhydride is, for example, 1 to 8:1. ＜ Cyanate ester resin ＞.

The cyanate resin of the present invention may include bisphenol A type cyanate resin, dicyclopentadiene type (DCPD) cyanate resin, bisphenol F type cyanate resin, novolac type cyanate resin or a combination thereof. ＜ Maleimide resin ＞

The maleimide resin of the present invention may include 4,4'-diphenylmethanebismaleimide, phenylmethanemaleimide oligomer, m-phenylenebismaleimide, bismaleimide Phenol A diphenyl ether bismaleimide, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide, 4-methyl yl-1,3-phenylenebismaleimide, 1,6-bismaleimide-(2,2,4-trimethyl)hexane, or a combination thereof. ＜ Flame retardant ＞

The flame retardant of the present invention is a halogen-free flame retardant, and the halogen-free flame retardant may include, but is not limited to, nitrogen-containing compounds, phosphorus-containing compounds or metal hypophosphorous acid salts, preferably phosphorus-containing compounds. The phosphorus-containing flame retardant may include a phosphazene compound, a phosphoric acid ester compound, a phosphorus-containing epoxy resin, a phosphorus-containing phenolic resin, a phosphorus-containing cyanate resin, or a combination thereof. ＜ Other additives ＞

The halogen-free thermosetting resin composition of the present invention may further include at least one of the following additives: a crosslinking agent, a filler, a catalyst and a solvent.

The cross-linking agent of the present invention may include 2,2'-diallyl bisphenol A, triallyl isocyanurate, bis(3-allyl-4-hydroxyphenyl) sulfone, active ester ( For example: DIC's HPC-8000-65T), hydroquinone or a combination thereof.

Fillers of the present invention may include silica, alumina, magnesia, magnesium hydroxide, calcium carbonate, talc, clay, aluminum nitride, boron nitride, aluminum hydroxide, aluminum silicon carbide, silicon carbide, sodium carbonate, titanium dioxide , zinc oxide, zirconia, quartz, diamond, diamond-like, graphite, calcined kaolin, kaolin, mica, hydrotalcite, hollow silica, polytetrafluoroethylene (PTFE) powder, glass beads, nanocarbon Tubes, nanoscale inorganic powders, or a combination thereof.

The type of the catalyst of the present invention is not particularly limited as long as it can promote ring-opening of epoxy functional groups and lower the curing reaction temperature of the resin composition. Specifically, the catalyst can be selected from the following: 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, dimethylbenzylamine, 2-(dimethylaminomethyl)phenol, 2 ,4,6-Tris(dimethylaminomethyl)phenol, 2,3-diaminopyridine, 2,5-diaminopyridine, 2,6-diaminopyridine, 4-dimethylaminopyridine, 2-amino-3-methylpyridine, 2-amino-4-methylpyridine, 2-amino-3-nitropyridine, zinc oxide and combinations thereof.

The type of the solvent in the present invention is not particularly limited, as long as it can make the viscosity of the resin composition moderate, and is convenient for operation and curing, which is not limited in the present invention.

The present invention also provides a prepreg made of the above-mentioned halogen-free thermosetting resin composition, which is produced by impregnating or coating a base material with the halogen-free thermosetting resin composition, and drying the impregnated or coated base material . In more detail, the base material may include glass fiber reinforced materials (glass fiber woven or non-woven, cellophane, glass mat, etc.), kraft paper, cotton paper, natural fiber cloth, organic fiber cloth, liquid crystal polymer fiber felt and the like. In this embodiment, for example, 2116 glass fiber cloth can be used as a reinforcing material (substrate), and the semi-cured pre-impregnated sheet can be prepared by heating and drying at a temperature of 130°C to 200°C for 2 minutes to 10 minutes. Take several semi-cured pre-impregnated sheets and stack them in a hot press for high temperature curing, for example, curing at a temperature of 160°C to 280°C for 1 hour to 4 hours.

Hereinafter, the halogen-free thermosetting resin composition proposed by the present invention will be described in detail by means of experimental examples. However, the following experimental examples are not intended to limit the present invention. Experimental example

In order to prove that the halogen-free thermosetting resin composition proposed by the present invention has low dielectric constant, low dielectric loss, and still has high glass transition temperature (Tg) and high heat resistance, the following experimental example is specially made.

Resin compositions of Examples 1 to 4 and Comparative Examples 1 to 4 were prepared according to the composition ratios listed in Table 1 below. Using 2116 glass fiber cloth as a reinforcing material (substrate), the substrate is impregnated or coated with a resin composition, and heated and dried at a temperature of 130°C to 200°C for 2 minutes to 10 minutes to prepare a semi-cured pre-impregnated sheet . Take several semi-cured pre-impregnated sheets and stack them in a hot press for high temperature curing, for example, curing at a temperature of 160°C to 280°C for 1 hour to 4 hours. After that, the electrothermal properties of the test pieces were tested, and the test results are listed in Table 1 below.

In Table 1 below, the epoxy resins are trifunctional epoxy resins, dicyclopentadiene epoxy resins, and bisphenol-type epoxy resins. The styrene maleic anhydride copolymer is in a molar ratio of styrene:maleic anhydride from 3:1 to 6:1. The cyanate resin is a bisphenol A type cyanate resin. The maleimide resin is 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide. The crosslinking agent is an active ester. The flame retardant is a phosphazene compound. The filler is silica. The catalyst is 2-methylimidazole.

Table 1 raw material Example 1 Example 2 Example 3 Example 4 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 epoxy resin 100 100 100 100 100 100 100 100 Styrene Maleic Anhydride Copolymer 75 82 75 63 82 82 63 82 Cyanate resin 46 46 42 46 0 46 twenty three 46 Maleimide resin 27 30 27 30 38 75 15 15 cross-linking agent 0 8 7 8 20 8 14 16 flame retardant 48 43 39 41 41 49 36 43 filler 77 72 66 144 61 79 118 72 catalyst 1 1 1 1 1 1 1 1 T _g (DMA) 218.60 215.81 210.47 221.42 148.29 225.19 217.26 204.42 T _d (5wt% loss) 367.06 370.65 370.10 371.84 368.60 375.35 379.20 371.06 Dk (10GHz) 3.88 3.80 3.87 3.81 4.54 4.34 3.79 4.01 Df (10GHz) 0.0090 0.0091 0.0091 0.0089 0.0100 0.0088 0.0102 0.0093 (unit: parts by weight)

As shown in Table 1, it can be known from Examples 1 to 4 that when the composition and content of the resin composition meet the ranges proposed by the present invention, the cured resin composition has excellent thermal properties and electrical properties. As can be seen from Comparative Example 1, the lack of addition of the cyanate ester resin significantly reduces the overall properties of the resin composition. It can be known from Comparative Example 2 that when the amount of maleimide resin added is too high (beyond the range proposed by the present invention), Dk will increase. It can be known from Comparative Example 3 that when the content of cyanate resin and maleimide resin exceeds the range proposed by the present invention, Df will increase. It can be known from Comparative Example 4 that when the amount of maleimide resin added is too low (beyond the range proposed by the present invention), Dk will increase. In this way, it can be known that when the composition ratio of the resin composition conforms to the range proposed by the present invention, the Tg of the cured resin composition can reach a high temperature above 200 ° C, and has a better Dk/Df value (Dk < 4.0 , Df < 0.010).

In summary, the present invention provides a halogen-free thermosetting resin composition, comprising a halogen-free epoxy resin, a styrene maleic anhydride copolymer, a cyanate ester resin, a maleimide resin and a flame retardant, and The above composition is added in a specific ratio range, so it has low dielectric constant, low dielectric loss, and still has high glass transition temperature (Tg) and high heat resistance. The glass transition temperature (Tg) can reach more than 200 ℃, And can be applied to copper foil substrates and printed circuit boards.

without

without

Claims (10)

A halogen-free thermosetting resin composition, comprising: Epoxy resins, which do not contain halogens; Styrene maleic anhydride copolymer; Cyanate resin; maleimide resin; and flame retardant. The halogen-free thermosetting resin composition according to claim 1, wherein based on the content of the epoxy resin as 100 parts by weight, the content of the styrene maleic anhydride copolymer is 40 parts by weight to 90 parts by weight, so The content of the cyanate resin is 30 to 120 parts by weight, the content of the maleimide resin is 20 to 70 parts by weight, and the content of the flame retardant is 20 to 70 parts by weight . The halogen-free thermosetting resin composition according to claim 1, wherein the epoxy resin comprises novolac epoxy resin, trifunctional epoxy resin, tetrafunctional epoxy resin, dicyclopentadiene epoxy resin (DCPD), dicyclopentadiene epoxy resin Phenolic epoxy resin, phosphorus-containing epoxy resin, o-cresol epoxy resin, bisphenol A novolac epoxy resin, phenol novolac epoxy resin, naphthalene ring epoxy resin, isocyanate modified epoxy resin, biphenyl type Epoxy resin, triazine-containing epoxy resin (triazine), fulorene-containing epoxy resin (fulorene), or a combination thereof. The halogen-free thermosetting resin composition according to claim 1, wherein the molecular weight of the styrene maleic anhydride copolymer is 3000 to 10000, and the molar ratio of styrene:maleic anhydride is 1 to 8:1. The halogen-free thermosetting resin composition according to claim 1, wherein the cyanate resin comprises bisphenol A type cyanate resin, dicyclopentadiene type (DCPD) cyanate resin, bisphenol F type cyanate resin ester resin, novolac cyanate resin, or a combination thereof. The halogen-free thermosetting resin composition according to claim 1, wherein the maleimide resin comprises 4,4'-diphenylmethane bismaleimide, phenylmethane maleimide oligomer, m-phenylene bismaleimide, bisphenol A diphenyl ether bismaleimide, 3,3'-dimethyl-5,5'-diethyl-4,4'-di Phenylmethanebismaleimide, 4-methyl-1,3-phenylenebismaleimide, 1,6-bismaleimide-(2,2,4-trimethyl) ) hexane or a combination thereof. The halogen-free thermosetting resin composition according to claim 1, wherein the flame retardant is a halogen-free flame retardant. The halogen-free thermosetting resin composition according to claim 1, wherein the flame retardant includes a phosphorus-containing flame retardant. The halogen-free thermosetting resin composition according to claim 8, wherein the phosphorus-containing flame retardant comprises a phosphazene compound, a phosphoric acid ester compound, a phosphorus-containing epoxy resin, a phosphorus-containing phenolic resin, a phosphorus-containing cyanate resin or the like combination. A prepreg made of the halogen-free thermosetting resin composition described in any one of the first to ninth claims, wherein the halogen-free thermosetting resin composition is impregnated or coated on a substrate and drying the impregnated or coated substrate.