TW202208543A - Dispersion, composite particles, and method for producing composite particles - Google Patents

Dispersion, composite particles, and method for producing composite particles Download PDF

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TW202208543A
TW202208543A TW110126248A TW110126248A TW202208543A TW 202208543 A TW202208543 A TW 202208543A TW 110126248 A TW110126248 A TW 110126248A TW 110126248 A TW110126248 A TW 110126248A TW 202208543 A TW202208543 A TW 202208543A
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polymer
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particle
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山邊敦美
徳永未央
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日商Agc股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F214/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F214/18Monomers containing fluorine
    • C08F214/26Tetrafluoroethene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/02Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/02Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
    • C08J3/09Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids
    • C08J3/11Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids from solid polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/12Powdering or granulating
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/20Compounding polymers with additives, e.g. colouring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/04Ingredients treated with organic substances
    • C08K9/06Ingredients treated with organic substances with silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08L27/18Homopolymers or copolymers or tetrafluoroethene

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

To provide: a dispersion which contains composite particles of a tetrafluoroethylene-based polymer and has excellent dispersion stability; and composite particles which contain a predetermined tetrafluoroethylene-based polymer and silica, have excellent dispersion stability in a dispersion medium, and have desirable physical properties such as high polarity. This dispersion comprises: composite particles that contain an inorganic substance and a tetrafluoroethylene-based polymer having a melting temperature of 260-320 DEG C; an aromatic polymer; and a liquid dispersion medium, wherein the composite particles are dispersed in the liquid dispersion medium, and the dispersion has a viscosity at 25 DEG C of 1,000-100,000 mPa.s.

Description

分散液、複合粒子及複合粒子之製造方法Dispersion, composite particle, and method for producing composite particle

本發明係關於一種包含四氟乙烯系聚合物之複合粒子之分散液。 又,本發明係關於一種含有特定四氟乙烯系聚合物及二氧化矽之複合粒子及其製造方法。The present invention relates to a dispersion liquid containing composite particles of a tetrafluoroethylene-based polymer. Moreover, this invention relates to the composite particle containing a specific tetrafluoroethylene type polymer and silica, and its manufacturing method.

聚四氟乙烯(PTFE)等四氟乙烯系聚合物在電特性、撥水撥油性、耐化學品性、耐熱性等物性方面優異,近年來,其粒子作為應對高頻段頻率之印刷基板材料備受關注。 就改善印刷基板材料之流動特性,提高其電特性、微細配線嵌入性、耐熱性及顯影性之觀點而言,於專利文獻1中揭示了一種含有二氧化矽被覆氟樹脂粒子及樹脂成分之組合物。 作為二氧化矽與四氟乙烯系聚合物之複合粒子,已知有專利文獻2或專利文獻3之態樣。 先前技術文獻 專利文獻Tetrafluoroethylene-based polymers such as polytetrafluoroethylene (PTFE) are excellent in physical properties such as electrical properties, water and oil repellency, chemical resistance, and heat resistance. In recent years, their particles have been used as printed circuit board materials for high-frequency frequencies. attention. From the viewpoint of improving the flow properties of printed circuit board materials, and improving the electrical properties, fine wiring embeddability, heat resistance, and developability, Patent Document 1 discloses a combination containing silica-coated fluororesin particles and a resin component. thing. As a composite particle of a silica and a tetrafluoroethylene-type polymer, the aspect of patent document 2 or patent document 3 is known. prior art literature Patent Literature

專利文獻1:國際公開第2017/135168號 專利文獻2:日本專利特開2016-124729號公報 專利文獻3:國際公開2018/212279號說明書Patent Document 1: International Publication No. 2017/135168 Patent Document 2: Japanese Patent Laid-Open No. 2016-124729 Patent Document 3: International Publication No. 2018/212279 Specification

[發明所欲解決之問題][Problems to be Solved by Invention]

然而,本發明人等之研究表明,專利文獻1中所記載之樹脂組合物在溶解或分散於液體中時,其均勻性或分散穩定性不充分,從而其使用存在問題。又,關於由分散液所獲得之成形物,成分分佈之均勻性容易降低,成形物之外觀容易產生表面粗糙等。進而,關於作為能夠使用之樹脂成分而於專利文獻1中具體地揭示之環氧樹脂、馬來醯亞胺化合物、氰酸酯化合物、苯并㗁 𠯤化合物等,其等與四氟乙烯系聚合物之組合物之加工性、及所獲得之成形物之耐熱性仍有改善之餘地。 另一方面,四氟乙烯系聚合物之極性極低,與其他成分之親和性較低,因此亦難以與二氧化矽高度地相互作用。因此,專利文獻2或專利文獻3之複合粒子難以摻入充分量之二氧化矽。 又,上述文獻之複合粒子因二氧化矽與四氟乙烯系聚合物之相互作用較低,而導致其本身之穩定性亦不充分,二氧化矽容易自複合粒子脫落。因此,須確保二氧化矽與四氟乙烯系聚合物之相互作用,二氧化矽之選擇範圍(二氧化矽之羥基之量等)容易受限制。 進而,因該限制,使得上述文獻之複合粒子之使用態樣受到限制。例如,難以提高複合粒子與液狀介質之親和性,於製備分散有複合粒子之液狀組合物時,起泡嚴重,亦難以確保其分散穩定性。However, studies by the present inventors have revealed that the resin composition described in Patent Document 1 has insufficient uniformity and dispersion stability when dissolved or dispersed in a liquid, and thus has problems in its use. In addition, with regard to the molded product obtained from the dispersion liquid, the uniformity of the component distribution tends to decrease, and the appearance of the molded product tends to be roughened. Furthermore, with regard to epoxy resins, maleimide compounds, cyanate compounds, benzodiazepine compounds, etc., which are specifically disclosed in Patent Document 1 as usable resin components, these are polymerized with tetrafluoroethylene. There is still room for improvement in the processability of the composition of the product and the heat resistance of the obtained molded product. On the other hand, tetrafluoroethylene-based polymers have extremely low polarity and low affinity with other components, so it is also difficult to highly interact with silica. Therefore, it is difficult to incorporate a sufficient amount of silica into the composite particles of Patent Document 2 or Patent Document 3. In addition, the composite particles of the above-mentioned documents have low interaction between silica and the tetrafluoroethylene-based polymer, so that the stability of the composite particles themselves is not sufficient, and the silica is easily detached from the composite particles. Therefore, it is necessary to ensure the interaction between the silica and the tetrafluoroethylene-based polymer, and the selection range of silica (the amount of hydroxyl groups of silica, etc.) is easily limited. Furthermore, due to this limitation, the use of the composite particles of the above-mentioned documents is limited. For example, it is difficult to improve the affinity of the composite particles with a liquid medium, and when preparing a liquid composition in which the composite particles are dispersed, foaming is severe, and it is also difficult to ensure the dispersion stability.

本發明人等進行了努力研究,結果得到以下見解:含有包含特定四氟乙烯系聚合物及無機物之複合粒子、芳香族聚合物、以及液狀分散介質,上述複合粒子分散於上述液狀分散介質中,且處於特定黏度範圍的分散液,其分散穩定性優異。又,得到以下見解:由該分散液所獲得之成形物較為緻密,低線膨脹係數等尤其優異。 又,本發明人等得到以下見解:含有包含特定四氟乙烯系聚合物及無機物之複合粒子、以及液狀分散介質,上述液狀分散介質包含沸點不同之兩種液狀分散介質,且上述兩種液狀分散介質處於生成共沸混合物之關係的分散液,其分散穩定性優異,並且由該分散液所獲得之成形物較為緻密,以外觀為代表之低線膨脹係數等特性優異。 進而,本發明人等得到以下見解:若使用特定四氟乙烯系聚合物來控制所獲得之複合粒子之表面之氟與矽之原子比,則可解決上述問題。 本發明之目的在於提供一種分散穩定性優異之分散液。又,本發明之目的在於提供一種分散液,其能夠獲得緻密且以外觀為代表之低線膨脹係數等特性優異之成形物。又,本發明之目的在於提供一種複合粒子及其製造方法,該複合粒子在分散介質中之分散穩定性優異,具有高極性等所需物性。 [解決問題之技術方法]The inventors of the present invention have made intensive studies and, as a result, have obtained the knowledge that the composite particles containing a specific tetrafluoroethylene-based polymer and an inorganic substance, an aromatic polymer, and a liquid dispersion medium are dispersed in the liquid dispersion medium. The dispersion liquid in a specific viscosity range has excellent dispersion stability. In addition, it was found that the molded product obtained from the dispersion liquid is relatively dense, and is particularly excellent in a low linear expansion coefficient and the like. Furthermore, the inventors of the present invention have obtained the knowledge that composite particles containing a specific tetrafluoroethylene-based polymer and an inorganic substance are contained, and a liquid dispersion medium comprising two types of liquid dispersion media having different boiling points, and the two A dispersion in which the liquid dispersion medium is in a relationship of forming an azeotrope has excellent dispersion stability, and the molded product obtained from the dispersion is relatively dense, and has excellent characteristics such as low coefficient of linear expansion represented by appearance. Furthermore, the inventors of the present invention have found that the above-mentioned problems can be solved by using a specific tetrafluoroethylene-based polymer to control the atomic ratio of fluorine and silicon on the surface of the obtained composite particles. An object of the present invention is to provide a dispersion liquid having excellent dispersion stability. Moreover, the objective of this invention is to provide the dispersion liquid which can obtain the compact which is excellent in characteristics, such as a low linear expansion coefficient represented by an external appearance. Another object of the present invention is to provide composite particles which are excellent in dispersion stability in a dispersion medium and have desired physical properties such as high polarity, and a method for producing the composite particles. [Technical solutions to problems]

本發明有下述態樣。 <1>一種分散液,其含有包含熔融溫度為260~320℃之四氟乙烯系聚合物及無機物之複合粒子、芳香族聚合物、以及液狀分散介質,且上述複合粒子分散於上述液狀分散介質中,上述分散液在25℃下之黏度為1000~100000 mPa・s。 <2>如<1>之分散液,其中上述四氟乙烯系聚合物為包含基於全氟(烷基乙烯基醚)之單元,且具有極性官能基之四氟乙烯系聚合物;或者為相對於總單元包含2.0~5.0莫耳%之基於全氟(烷基乙烯基醚)之單元,且不具有極性官能基之四氟乙烯系聚合物。 <3>如<1>或<2>之分散液,其中上述無機物為二氧化矽。 <4>如<1>至<3>中任一項之分散液,其中上述芳香族聚合物之含量少於上述複合粒子之含量。 <5>如<1>至<4>中任一項之分散液,其中上述芳香族聚合物為選自由芳香族聚醯亞胺、芳香族聚醯胺、芳香族聚醯胺醯亞胺、聚苯醚、液晶聚酯、芳香族馬來醯亞胺所組成之群中之至少一種。 <6>一種分散液,其含有包含熔融溫度為260~320℃之四氟乙烯系聚合物及無機物之複合粒子、以及液狀分散介質,且上述複合粒子分散於上述液狀分散介質中,上述液狀分散介質包含沸點不同之兩種液狀分散介質,且上述兩種液狀分散介質處於生成共沸混合物之關係。 <7>如<6>之分散液,其中上述四氟乙烯系聚合物為包含基於全氟(烷基乙烯基醚)之單元,且具有極性官能基之四氟乙烯系聚合物;或者為相對於總單元包含2.0~5.0莫耳%之基於全氟(烷基乙烯基醚)之單元,且不具有極性官能基之四氟乙烯系聚合物。 <8>如<6>或<7>之分散液,其中上述沸點不同之兩種液狀分散介質中之高沸點分散介質之混合量比多於上述兩種液狀分散介質之共沸混合物中之高沸點分散介質之組成比(質量比)。 <9>如<6>至<8>中任一項之分散液,其中構成上述液狀分散介質之沸點不同之兩種液狀分散介質之至少一種為水、醇或醯胺。 <10>一種複合粒子,其含有熔融溫度為260~320℃且相對於總單元包含1~5莫耳%之基於全氟(烷基乙烯基醚)之單元的四氟乙烯系聚合物、以及二氧化矽,上述複合粒子之藉由X射線光電子光譜法所測定之表面中之矽原子之量相對於氟原子之量為1以上。 <11>如<10>之複合粒子,其平均粒徑為2 μm以上10 μm以下。 <12>如<10>或<11>之複合粒子,其中相對於上述四氟乙烯系聚合物100質量份,上述二氧化矽為15~85質量份。 <13>如<10>至<12>中任一項之複合粒子,其以上述四氟乙烯系聚合物作為核,且於上述核之表面具有上述二氧化矽。 <14>如<10>至<13>中任一項之複合粒子,其中上述四氟乙烯系聚合物為具有極性官能基之四氟乙烯系聚合物。 <15>一種複合粒子之製造方法,該複合粒子為如<10>至<14>中任一項之複合粒子,上述複合粒子之製造方法係使上述四氟乙烯系聚合物之粒子與上述二氧化矽於上述四氟乙烯系聚合物之熔融溫度以上之溫度下且懸浮狀態下進行碰撞,獲得上述複合粒子。 [發明之效果]The present invention has the following aspects. <1> A dispersion containing composite particles comprising a tetrafluoroethylene-based polymer having a melting temperature of 260 to 320° C. and an inorganic substance, an aromatic polymer, and a liquid dispersion medium, wherein the composite particles are dispersed in the liquid In the dispersion medium, the viscosity of the above dispersion liquid at 25°C is 1,000 to 100,000 mPa·s. <2> The dispersion liquid according to <1>, wherein the tetrafluoroethylene-based polymer is a tetrafluoroethylene-based polymer containing a perfluoro(alkyl vinyl ether)-based unit and having a polar functional group; or a relative A tetrafluoroethylene-based polymer that contains 2.0-5.0 mol % of perfluoro(alkyl vinyl ether)-based units in the total unit and does not have a polar functional group. <3> The dispersion liquid according to <1> or <2>, wherein the inorganic substance is silica. <4> The dispersion liquid according to any one of <1> to <3>, wherein the content of the aromatic polymer is less than the content of the composite particles. <5> The dispersion liquid according to any one of <1> to <4>, wherein the aromatic polymer is selected from the group consisting of aromatic polyimide, aromatic polyimide, aromatic polyimide, At least one of the group consisting of polyphenylene ether, liquid crystal polyester, and aromatic maleimide. <6> A dispersion liquid comprising composite particles comprising a tetrafluoroethylene-based polymer having a melting temperature of 260 to 320° C. and an inorganic substance, and a liquid dispersion medium, wherein the composite particles are dispersed in the liquid dispersion medium, and the above The liquid dispersion medium includes two liquid dispersion media having different boiling points, and the two liquid dispersion media are in a relationship of forming an azeotrope. <7> The dispersion liquid according to <6>, wherein the tetrafluoroethylene-based polymer is a tetrafluoroethylene-based polymer containing a perfluoro(alkyl vinyl ether)-based unit and having a polar functional group; or a relative A tetrafluoroethylene-based polymer that contains 2.0-5.0 mol % of perfluoro(alkyl vinyl ether)-based units in the total unit and does not have a polar functional group. <8> The dispersion liquid according to <6> or <7>, wherein the mixing ratio of the high-boiling point dispersion medium in the above-mentioned two liquid dispersion media with different boiling points is more than that in the azeotropic mixture of the above-mentioned two liquid dispersion mediums The composition ratio (mass ratio) of the high boiling point dispersion medium. <9> The dispersion liquid according to any one of <6> to <8>, wherein at least one of the two liquid dispersion media having different boiling points constituting the liquid dispersion medium is water, alcohol or amide. <10> A composite particle containing a tetrafluoroethylene-based polymer having a melting temperature of 260 to 320° C. and containing 1 to 5 mol % of perfluoro(alkyl vinyl ether)-based units with respect to the total units, and For silica, the amount of silicon atoms in the surface of the composite particles measured by X-ray photoelectron spectroscopy is 1 or more relative to the amount of fluorine atoms. <11> The composite particles according to <10>, wherein the average particle diameter is 2 μm or more and 10 μm or less. <12> The composite particles according to <10> or <11>, wherein the amount of the silica is 15 to 85 parts by mass relative to 100 parts by mass of the tetrafluoroethylene-based polymer. <13> The composite particle according to any one of <10> to <12>, which has the above-mentioned tetrafluoroethylene-based polymer as a core, and has the above-mentioned silica on the surface of the above-mentioned core. <14> The composite particle according to any one of <10> to <13>, wherein the tetrafluoroethylene-based polymer is a tetrafluoroethylene-based polymer having a polar functional group. <15> A method for producing a composite particle, wherein the composite particle is the composite particle according to any one of <10> to <14>, wherein the method for producing the composite particle comprises the above-mentioned tetrafluoroethylene-based polymer particle and the above-mentioned two. The above-mentioned composite particles are obtained by colliding with silicon oxide in a suspended state at a temperature equal to or higher than the melting temperature of the above-mentioned tetrafluoroethylene-based polymer. [Effect of invention]

根據本發明,可獲得分散穩定性優異之四氟乙烯系聚合物之分散液。 由本發明之分散液形成之成形物較為緻密,在外觀及耐熱性、電特性、低線膨脹性等物性方面優異,例如可用作印刷基板之構成材料。 根據本發明,可提供一種複合粒子及其製造方法,該複合粒子在分散介質中之分散穩定性優異,且具有高極性等所需物性。包含上述複合粒子之分散液在塗佈於基板時塗膜之外觀優異。又,由上述分散液可獲得下述積層體及膜,該積層體及膜具備基於四氟乙烯系聚合物及無機物尤其是二氧化矽之優異特性(電特性、低線膨脹性等)。According to the present invention, a dispersion liquid of a tetrafluoroethylene-based polymer excellent in dispersion stability can be obtained. The molded product formed from the dispersion liquid of the present invention is relatively dense and excellent in physical properties such as appearance, heat resistance, electrical properties, and low linear expansion, and can be used, for example, as a constituent material of printed circuit boards. According to the present invention, it is possible to provide composite particles which are excellent in dispersion stability in a dispersion medium and have desired physical properties such as high polarity, and a method for producing the same. When the dispersion liquid containing the above-mentioned composite particles is applied to a substrate, the appearance of the coating film is excellent. Furthermore, from the above dispersion liquid, a laminate and a film having excellent properties (electrical properties, low linear expansion, etc.) based on a tetrafluoroethylene-based polymer and an inorganic substance, especially silica, can be obtained.

以下用語具有以下含義。 「平均粒徑(D50)」係藉由雷射繞射散射法所求出之對象物(粒子)之體積基準累積50%直徑。即,藉由雷射繞射散射法來測定對象物之粒度分佈,將對象物粒子之集體之總體積設為100%而求出累積曲線,上述「平均粒徑(D50)」係該累積曲線上累積體積達到50%之點之粒徑。 「D90」係以與上述相同之方式所測定之對象物之體積基準累積90%直徑。 對象物(粒子)之D50及D90係藉由以下方式而求出,即,使粒子分散於水中,藉由使用雷射繞射散射式粒度分佈測定裝置(堀場製作所公司製造,LA-920測定器)之雷射繞射散射法進行分析而求出。 「熔融溫度(熔點)」係與藉由示差掃描熱量測定(DSC)法所測得之聚合物之熔融峰之最大值對應之溫度。 「玻璃轉移點(Tg)」係藉由動態黏彈性測定(DMA)法對聚合物進行分析而測定之值。 「黏度」係使用B型黏度計,以25℃在轉速為30 rpm之條件下測定對象物(分散液或液狀組合物)而求出之值。將測定反覆進行3次,採用3次量之測定值之平均值。 「觸變比」係指藉由以下方式所算出之值(η12 ),即,將在轉速為30 rpm之條件下測定對象物(分散液或液狀組合物)而求出之黏度η1 除以在轉速為60 rpm之條件下進行測定而求出之黏度η2 ,從而算出值(η12 )。將各個黏度之測定反覆進行3次,以3次量之測定值之平均值算出。 「比表面積」係藉由氣體吸附(定容法)BET多點法來測定粒子而算出之值,且使用NOVA4200e(Quantachrome Instruments公司製造)而求出。 聚合物中之「單元」可為由單體直接形成之原子團,亦可為藉由特定之方法對所獲得之聚合物進行處理而使結構之一部分發生了轉換之原子團。關於聚合物中所包含之基於單體A之單元,亦簡單地記為「單體A單元」。The following terms have the following meanings. "Average particle diameter (D50)" is the volume-based cumulative 50% diameter of the object (particle) determined by the laser diffraction scattering method. That is, the particle size distribution of the object is measured by the laser diffraction scattering method, and the cumulative curve is obtained by taking the total volume of the particles of the object as 100%, and the above-mentioned "average particle size (D50)" is the cumulative curve The particle size at the point where the cumulative volume reaches 50%. "D90" is the volume-based cumulative 90% diameter of the object measured in the same manner as above. The D50 and D90 of the object (particles) were obtained by dispersing the particles in water and using a laser diffraction scattering particle size distribution analyzer (manufactured by Horiba, Ltd., LA-920 measuring device) ) was analyzed by the laser diffraction scattering method. "Melting temperature (melting point)" is the temperature corresponding to the maximum value of the melting peak of the polymer measured by differential scanning calorimetry (DSC). The "glass transition point (Tg)" is a value determined by analyzing the polymer by the dynamic viscoelasticity measurement (DMA) method. "Viscosity" is a value obtained by measuring the object (dispersion liquid or liquid composition) at 25°C under the condition of a rotational speed of 30 rpm using a Brookfield viscometer. The measurement was repeated three times, and the average value of the three measurements was used. The "thixotropy ratio" is a value (η 12 ) calculated by measuring the object (dispersion or liquid composition) at a rotational speed of 30 rpm. The value (η 12 ) was calculated by dividing the viscosity η 1 by the viscosity η 2 obtained by the measurement at a rotational speed of 60 rpm. The measurement of each viscosity was repeated 3 times, and the average value of the measured values of the 3 times was calculated. The "specific surface area" is a value calculated by measuring particles by the gas adsorption (constant volume method) BET multipoint method, and was calculated using NOVA4200e (manufactured by Quantachrome Instruments). The "unit" in the polymer may be an atomic group directly formed from a monomer, or an atomic group in which a part of the structure is converted by treating the obtained polymer by a specific method. The unit based on the monomer A contained in the polymer is also simply referred to as "monomer A unit".

本發明之第1種分散液(以下亦記為「本分散液A」)含有:複合粒子(以下亦記為「本粒子」),其包含熔融溫度為260~320℃之四氟乙烯系聚合物(以下亦記為「F聚合物」)及無機物;芳香族聚合物;以及液狀分散介質。 本分散液A係本粒子分散於液狀分散介質中,且其在25℃下之黏度為1000~100000 mPa・s之分散液。The first dispersion liquid of the present invention (hereinafter also referred to as "the present dispersion liquid A") contains: composite particles (hereinafter also referred to as "the present particles") containing tetrafluoroethylene-based polymerization with a melting temperature of 260 to 320°C (hereinafter also referred to as "F polymer") and inorganic substances; aromatic polymers; and liquid dispersion medium. The dispersion liquid A is a dispersion liquid in which the particles are dispersed in a liquid dispersion medium, and the viscosity at 25°C is 1000-100000 mPa·s.

本分散液A之分散穩定性優異。關於本分散液A之分散穩定性提高之原因、以及本分散液A所含有之本粒子之構成與分散穩定性之相關關係及作用機理,雖並不確定,但例如推定如下。 含有無機物之粒子之潤濕性大幅度地提高。當將上述潤濕性得到提高之粒子添加至液狀分散介質中時,容易成為粒子易沈澱之流暢之懸濁液,而非分散液。 另一方面,本粒子含有F聚合物及無機物。與非熱熔融性之四氟乙烯系聚合物相比,F聚合物不僅耐原纖性等形狀穩定性優異,而且具有在單分子等級下分子運動之限制得到緩和之自由度較高之構形。上述F聚合物在分子集合體等級下容易形成微小球晶,因此其表面容易產生微小之凹凸結構,從而表面積容易變大。因此,認為F聚合物之分子集合體能夠在無損其形狀之情況下穩定地以物理方式與無機物緊密地附著而形成本粒子。又,雖然F聚合物之表面能量較低,分散穩定性較低,但F聚合物與無機物結合而成之本粒子較F聚合物,容易與其他本粒子及液狀分散介質發生相互作用,從而認為分散穩定性優異。 進而,認為,藉由使與F聚合物同樣地為疏水性且與F聚合物之親和性較高之芳香族聚合物併存於液狀分散介質中,可獲得分散穩定性更高,黏度、觸變比、沈澱率等分散液物性亦優異,且操作性優異之本分散液A。結果,認為由本分散液A可形成下述成形物,該成形物高度具備F聚合物之物性、無機物之物性及芳香族聚合物之物性,成分均勻性較高,較為緻密(空隙比較小),且電特性等優異。This dispersion liquid A is excellent in dispersion stability. The reason why the dispersion stability of the present dispersion liquid A is improved, and the correlation between the composition of the present particles contained in the present dispersion liquid A and the dispersion stability, and the mechanism of action are not certain, but are presumed, for example, as follows. The wettability of particles containing inorganic substances is greatly improved. When the above-mentioned particles with improved wettability are added to a liquid dispersion medium, they tend to become a smooth suspension in which the particles are easily precipitated, rather than a dispersion. On the other hand, this particle contains the F polymer and an inorganic substance. Compared with non-thermofusible tetrafluoroethylene-based polymers, F polymer not only has excellent shape stability such as fibrillation resistance, but also has a configuration with a higher degree of freedom in which the restriction of molecular motion is alleviated at the single-molecule level. . The above-mentioned F polymer tends to form microscopic spherulites at the level of molecular aggregates, and therefore microscopic uneven structures tend to be formed on the surface thereof, thereby tending to increase the surface area. Therefore, it is considered that the molecular aggregate of the F polymer can form the present particle by being able to stably and physically adhere closely to the inorganic substance without losing its shape. In addition, although the surface energy of the F polymer is low and the dispersion stability is low, the present particle formed by the combination of the F polymer and the inorganic substance is more likely to interact with other present particles and the liquid dispersion medium than the F polymer, thereby It is considered to be excellent in dispersion stability. Furthermore, it is considered that, by coexisting in the liquid dispersion medium an aromatic polymer having a hydrophobicity like the F polymer and having a high affinity with the F polymer, higher dispersion stability, higher viscosity, and better tactility can be obtained. The dispersion liquid A has excellent dispersion liquid properties such as transformation ratio and sedimentation rate, and is excellent in handleability. As a result, it is considered that the following molded article can be formed from the present dispersion A. The molded article highly possesses the physical properties of the F polymer, the physical properties of the inorganic material, and the physical properties of the aromatic polymer, and the composition uniformity is high and relatively dense (with relatively small voids), and excellent electrical properties.

於本發明中,構成本粒子之F聚合物係包含基於四氟乙烯(TFE)之單元(TFE單元)之熱熔融性聚合物。F聚合物之熔融溫度為260~320℃,較佳為280~320℃,更佳為285~320℃。於上述情形時,由本分散液A形成之成形物之耐熱性變得優異。 此處,所謂熱熔融性聚合物意指於負載49 N之條件下存在熔體流動速率達到1~1000 g/10分鐘之溫度之聚合物。 F聚合物之玻璃轉移點較佳為75~125℃,更佳為80~100℃。 作為F聚合物,可列舉包含TFE單元及基於全氟(烷基乙烯基醚)(PAVE)之單元(PAVE單元)之聚合物(PFA)、包含TFE單元及基於六氟丙烯(HFP)之單元之聚合物(FEP),較佳為PFA。作為PAVE,較佳為CF2 =CFOCF3 、CF2 =CFOCF2 CF3 及CF2 =CFOCF2 CF2 CF3 (PPVE),更佳為PPVE。 F聚合物之熔融黏度在380℃下較佳為1×102 ~1×106 Pa・s,更佳為1×103 ~1×106 Pa・s。 若F聚合物之熔融溫度、玻璃轉移點或熔融黏度處於上述範圍內,則上述作用機理容易得到強化。In the present invention, the F polymer constituting the present particle is a hot-melt polymer including a unit (TFE unit) based on tetrafluoroethylene (TFE). The melting temperature of the F polymer is 260-320°C, preferably 280-320°C, more preferably 285-320°C. In the above case, the heat resistance of the molded product formed from the dispersion liquid A becomes excellent. Here, the term "hot-melt polymer" means a polymer having a melt flow rate of 1 to 1000 g/10 minutes at a temperature under a load of 49 N. The glass transition point of the F polymer is preferably 75 to 125°C, more preferably 80 to 100°C. Examples of the F polymer include a polymer (PFA) containing a TFE unit and a unit based on perfluoro(alkyl vinyl ether) (PAVE) (PAVE unit), and a unit containing a TFE unit and a unit based on hexafluoropropylene (HFP). The polymer (FEP), preferably PFA. As PAVE, CF 2 =CFOCF 3 , CF 2 =CFOCF 2 CF 3 , and CF 2 =CFOCF 2 CF 2 CF 3 (PPVE) are preferred, and PPVE is more preferred. The melt viscosity of the F polymer at 380°C is preferably 1×10 2 to 1×10 6 Pa·s, more preferably 1×10 3 to 1×10 6 Pa·s. If the melting temperature, glass transition point or melt viscosity of the F polymer is within the above-mentioned ranges, the above-mentioned action mechanism is easily strengthened.

作為F聚合物之較佳之態樣,較佳為:聚合物(1),其包含TFE單元及PAVE單元,且具有極性官能基;或者聚合物(2),其包含TFE單元及PAVE單元,相對於總單體單元包含2.0~5.0莫耳%之PAVE單元,且不具有極性官能基;更佳為聚合物(1)。 關於該等F聚合物,不僅其本粒子之分散穩定性優異,而且在由本分散液A所獲得之聚合物層等成形物中,該等F聚合物容易更緻密且均質地分佈。又,含有該等F聚合物之分散液在塗佈於基材並形成聚合物層時,容易於聚合物層中形成微小球晶,與其他成分之密接性容易提高。結果,可更容易獲得電特性等各種物性優異之成形物。As a preferred aspect of the F polymer, preferred are: polymer (1), which contains TFE unit and PAVE unit, and has polar functional groups; or polymer (2), which contains TFE unit and PAVE unit, relative to It contains 2.0-5.0 mol % of PAVE units in the total monomer units, and does not have polar functional groups; it is more preferably polymer (1). These F polymers are not only excellent in the dispersion stability of the present particles, but also tend to be more densely and homogeneously distributed in molded articles such as polymer layers obtained from the present dispersion A. Moreover, when the dispersion liquid containing these F polymers is coated on a substrate to form a polymer layer, microscopic spherulites are easily formed in the polymer layer, and the adhesion with other components is easily improved. As a result, a molded product excellent in various physical properties such as electrical properties can be more easily obtained.

聚合物(1)所具有之極性官能基可包含於聚合物所含有之單元中,亦可包含於聚合物主鏈之末端基中,較佳為包含於聚合物所含有之單元中。作為後者聚合物,可列舉:具有極性官能基作為源自聚合起始劑、鏈轉移劑、輻射處理等之末端基之聚合物;或者藉由電漿處理或電離輻射處理所製備之具有極性官能基之聚合物。The polar functional group possessed by the polymer (1) may be contained in the unit contained in the polymer or in the terminal group of the main chain of the polymer, preferably contained in the unit contained in the polymer. As the latter polymer, polymers having polar functional groups as terminal groups derived from polymerization initiators, chain transfer agents, radiation treatment, etc.; or polymers having polar functional groups prepared by plasma treatment or ionizing radiation treatment can be exemplified base polymer.

關於聚合物(1)中之極性官能基之數量,相對於主鏈之碳數每1×106 個,較佳為10~5000個,更佳為100~3000個。再者,聚合物(1)中之含氧極性基之數量可藉由聚合物之組成或國際公開第2020/145133號中所記載之方法進行定量。 作為極性官能基,較佳為含羥基之基、含羰基之基及含膦酸基之基,要想本粒子之分散性等物性容易提高,更佳為含羥基之基及含羰基之基,進而較佳為含羰基之基。The number of polar functional groups in the polymer (1) is preferably 10 to 5000, more preferably 100 to 3000 per 1×10 6 of carbon atoms in the main chain. In addition, the amount of the oxygen-containing polar group in the polymer (1) can be quantified by the composition of the polymer or the method described in International Publication No. 2020/145133. The polar functional group is preferably a hydroxyl group-containing group, a carbonyl group-containing group and a phosphonic acid group-containing group. In order to easily improve the physical properties such as the dispersibility of the particles, a hydroxyl group-containing group and a carbonyl group-containing group are more preferable. Furthermore, a carbonyl group-containing group is preferable.

作為含羥基之基,較佳為含醇性羥基之基,更佳為:-CF2 CH2 OH、-C(CF3 )2 OH及1,2-乙二醇基(-CH(OH)CH2 OH)。 作為含羰基之基,較佳為羧基、烷氧羰基、醯胺基、異氰酸基、胺基甲酸酯基(-OC(O)NH2 )、酸酐殘基(-C(O)OC(O)-)、醯亞胺殘基(-C(O)NHC(O)-等)及碳酸酯基(-OC(O)O-),更佳為酸酐殘基。The hydroxyl group-containing group is preferably an alcoholic hydroxyl group-containing group, more preferably -CF 2 CH 2 OH, -C(CF 3 ) 2 OH and 1,2-ethylene glycol (-CH(OH) CH 2 OH). The carbonyl group-containing group is preferably a carboxyl group, an alkoxycarbonyl group, an amide group, an isocyanate group, a urethane group (-OC(O)NH 2 ), an acid anhydride residue (-C(O)OC) (O)-), imide residues (-C(O)NHC(O)- etc.) and carbonate groups (-OC(O)O-), more preferably acid anhydride residues.

聚合物(1)較佳為包含TFE單元、PAVE單元及基於具有極性官能基之單體之單元的聚合物,更佳為相對於總單元,按照該等單元之順序依序包含90~99莫耳%、0.5~9.97莫耳%、0.01~3莫耳%之聚合物。若存在極性官能基,則進一步提高與無機物之親和性或密接性,自該方面考慮較佳。 關於具有極性官能基之單體,較佳為伊康酸酐、檸康酸酐或5-降𦯉烯-2,3-二羧酸酐(別名:雙環庚烯二甲酸酐;以下亦記為「NAH」)。 作為聚合物(1)之具體例,可列舉國際公開第2018/16644號中所記載之聚合物。The polymer (1) is preferably a polymer comprising a TFE unit, a PAVE unit, and a unit based on a monomer having a polar functional group, and more preferably, with respect to the total units, in the order of these units, 90 to 99 moles. Ear%, 0.5-9.97 mol%, 0.01-3 mol% polymer. When a polar functional group exists, the affinity or adhesiveness with an inorganic substance is further improved, and it is preferable from this point. As for the monomer with polar functional group, it is preferably itaconic anhydride, citraconic anhydride or 5-norene-2,3-dicarboxylic anhydride (alias: bicycloheptenedicarboxylic anhydride; hereinafter also referred to as "NAH" ). Specific examples of the polymer (1) include the polymers described in International Publication No. 2018/16644.

聚合物(2)僅由TFE單元及PAVE單元所構成,較佳為相對於總單元含有95.0~98.0莫耳%之TFE單元,且含有2.0~5.0莫耳%之PAVE單元。 聚合物(2)中之PAVE單元之含量相對於總單元,較佳為2.1莫耳%以上,更佳為2.2莫耳%以上。 上述聚合物之分子構形之自由度更高,上述作用機理容易得到強化。 再者,聚合物(2)不具有極性官能基意指相對於構成聚合物主鏈之碳原子數每1×106 個,聚合物所具有之極性官能基之數量未達500個。上述極性官能基之數量較佳為100個以下,更佳為未達50個。上述極性官能基之數量之下限通常為0個。The polymer (2) is composed of only TFE units and PAVE units, and preferably contains 95.0 to 98.0 mol % of TFE units and 2.0 to 5.0 mol % of PAVE units with respect to the total units. The content of the PAVE units in the polymer (2) is preferably 2.1 mol % or more, more preferably 2.2 mol % or more, based on the total units. The above-mentioned polymer has a higher degree of freedom in molecular configuration, and the above-mentioned action mechanism is easily strengthened. Furthermore, the fact that the polymer (2) does not have polar functional groups means that the number of polar functional groups contained in the polymer is less than 500 per 1×10 6 carbon atoms constituting the main chain of the polymer. The number of the above-mentioned polar functional groups is preferably 100 or less, more preferably less than 50. The lower limit of the number of the above-mentioned polar functional groups is usually zero.

聚合物(2)可使用不產生極性官能基作為聚合物鏈之末端基之聚合起始劑或鏈轉移劑等進行製造,亦可對具有極性官能基之聚合物(在聚合物鏈之末端基具有源自聚合起始劑之極性官能基之聚合物等)進行氟化處理而製造。 作為氟化處理之方法,可列舉使用氟氣之方法(參照日本專利特開2019-194314號公報等)。The polymer (2) can be produced by using a polymerization initiator or a chain transfer agent that does not generate polar functional groups as the terminal groups of the polymer chain, and can also be used for polymers with polar functional groups (at the terminal groups of the polymer chain). A polymer having a polar functional group derived from a polymerization initiator, etc.) is produced by fluorination treatment. As a method of the fluorination treatment, a method using fluorine gas (refer to Japanese Patent Laid-Open No. 2019-194314, etc.) can be mentioned.

於本發明中,構成本粒子之無機物之形狀較佳為粒子。作為無機物,可列舉包含氧化物、氮化物、單質金屬、合金及碳之粒子,較佳為矽酸鹽(氧化矽(二氧化矽)、矽灰石、滑石、雲母)、金屬氧化物(氧化鈹、氧化鈰、氧化鋁、鹼氧化鋁、氧化鎂、氧化鋅、氧化鈦等)、氮化硼及偏矽酸鎂(塊滑石)之粒子,更佳為含有選自鋁、鎂、矽、鈦、鋅中之元素之至少一種的無機氧化物之粒子,進而較佳為二氧化矽、氧化鈦、氧化鋅、塊滑石及氮化硼之粒子,尤佳為二氧化矽之粒子。又,無機物亦可為陶瓷。無機物可使用一種,亦可混合兩種以上而使用。於混合兩種以上無機物而使用時,可混合兩種二氧化矽粒子而使用,亦可將二氧化矽粒子、與金屬氧化物粒子加以混合而使用。In the present invention, the shape of the inorganic substances constituting the particles is preferably particles. Examples of inorganic substances include particles containing oxides, nitrides, elemental metals, alloys, and carbon, preferably silicates (silicon oxide (silicon dioxide), wollastonite, talc, mica), metal oxides (oxide particles of beryllium, cerium oxide, aluminum oxide, alkali aluminum oxide, magnesium oxide, zinc oxide, titanium oxide, etc.), boron nitride and magnesium metasilicate (mass talc), preferably containing particles selected from the group consisting of aluminum, magnesium, silicon, Particles of inorganic oxides of at least one of the elements of titanium and zinc, more preferably particles of silicon dioxide, titanium oxide, zinc oxide, talc and boron nitride, and particularly preferably particles of silicon dioxide. In addition, the inorganic substance may be ceramics. One type of inorganic substances may be used, or two or more types may be mixed and used. When two or more inorganic substances are mixed and used, two kinds of silica particles may be mixed and used, or silica particles and metal oxide particles may be mixed and used.

無機物粒子之平均粒徑(D50)較佳為20 μm以下,更佳為5 μm以下。平均粒徑較佳為0.001 μm以上,更佳為0.01 μm以上。 無機物粒子之比表面積(BET法)較佳為1~20 m2 /g,更佳為5~8 m2 /g。於該情形時,無機物與F聚合物之相互作用容易得到強化。又,於成形物(聚合物層等)中,無機物與F聚合物更均勻地分佈,而容易更高度地表現出兩者之物性。The average particle diameter (D50) of the inorganic particles is preferably 20 μm or less, more preferably 5 μm or less. The average particle diameter is preferably 0.001 μm or more, more preferably 0.01 μm or more. The specific surface area (BET method) of the inorganic particles is preferably 1 to 20 m 2 /g, more preferably 5 to 8 m 2 /g. In this case, the interaction between the inorganic substance and the F polymer is easily strengthened. In addition, in the molded product (polymer layer, etc.), the inorganic substance and the F polymer are more uniformly distributed, and the physical properties of both are easily expressed at a higher level.

上述無機物與F聚合物之相互作用容易得到強化,容易進一步提高本分散液A之分散穩定性。又,關於由本分散液A形成之成形物(例如下述聚合物層及膜),容易明顯地表現出基於無機物之物性。The interaction between the above-mentioned inorganic substance and the F polymer is easily strengthened, and the dispersion stability of the present dispersion liquid A is easily further improved. Moreover, about the molded object (for example, the following polymer layer and film) formed from this dispersion liquid A, the physical property based on an inorganic substance is easy to express remarkably.

其中,本分散液A較佳為無機物包含二氧化矽。無機物中之二氧化矽之含量較佳為80質量%以上,更佳為90質量%以上。二氧化矽之含量之上限為100質量%。Among them, the dispersion liquid A preferably contains silica as the inorganic substance. The content of silica in the inorganic substance is preferably 80% by mass or more, more preferably 90% by mass or more. The upper limit of the content of silica is 100% by mass.

上述無機物較佳為對其表面之至少一部分進行了表面處理。 作為上述表面處理中所使用之表面處理劑,可列舉:多元醇(三羥甲基乙烷、季戊四醇、丙二醇等)、飽和脂肪酸(硬脂酸、月桂酸等)、其酯、烷醇胺、胺(三甲胺、三乙胺等)、石蠟、矽烷偶合劑、矽酮、聚矽氧烷、鋁、矽、鋯、錫、鈦、銻等之氧化物、其等之氫氧化物、其等之水合氧化物、其等之磷酸鹽。 作為矽烷偶合劑,較佳為:3-胺基丙基三乙氧基矽烷、乙烯基三甲氧基矽烷、3-巰丙基三甲氧基矽烷、3-縮水甘油氧基丙基甲基二乙氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷及3-異氰酸基丙基三乙氧基矽烷。It is preferable that at least a part of the surface of the said inorganic substance is surface-treated. As the surface treatment agent used for the above surface treatment, polyhydric alcohols (trimethylolethane, pentaerythritol, propylene glycol, etc.), saturated fatty acids (stearic acid, lauric acid, etc.), esters thereof, alkanolamines, Amines (trimethylamine, triethylamine, etc.), paraffin, silane coupling agents, silicones, polysiloxanes, oxides of aluminum, silicon, zirconium, tin, titanium, antimony, etc., their hydroxides, and the like The hydrated oxides, their phosphates. As the silane coupling agent, preferred are: 3-aminopropyltriethoxysilane, vinyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-glycidoxypropylmethyldiethyl oxysilane, 3-methacryloyloxypropyltriethoxysilane and 3-isocyanatopropyltriethoxysilane.

作為無機物之具體例,可列舉:二氧化矽(Admatechs公司製造之「Admafine(註冊商標)」系列等)、利用二癸酸丙二醇酯等酯進行了表面處理之氧化鋅(堺化學工業股份有限公司製造之「FINEX(註冊商標)」系列等)、球狀熔融二氧化矽(DENKA公司製造之「SFP(註冊商標)」系列等)、利用多元醇及無機物進行了被覆處理之金紅石型二氧化鈦(石原產業公司製造之「Tipaque(註冊商標)」系列等)、利用烷基矽烷進行了表面處理之金紅石型二氧化鈦(帝國化工公司製造之「JMT(註冊商標)」系列等)、中空狀二氧化矽(太平洋水泥公司製造之「E-SPHERES」系列、日鐵礦業公司製造之「SiliNax」系列、Emerson & Cuming公司製造之「Ecco sphere」系列、日本Aerosil公司製造之疏水性AEROSIL系列「RX200」等)、滑石(NIPPON TALC公司製造之「SG」系列等)、塊滑石(NIPPON TALC公司製造之「BST」系列等)、氮化硼(昭和電工公司製造之「UHP」系列、DENKA公司製造之「Denka Boron Nitride」系列(「GP」、「HGP」等級)等)。Specific examples of inorganic substances include silicon dioxide ("Admafine (registered trademark)" series manufactured by Admatechs, etc.), zinc oxide (Sakai Chemical Industry Co., Ltd.) surface-treated with esters such as propylene glycol diddecanoate (Sakai Chemical Industry Co., Ltd.) manufactured "FINEX (registered trademark)" series, etc.), spherical fused silica ("SFP (registered trademark)" series manufactured by DENKA, etc.), and rutile titanium dioxide ( "Tipaque (registered trademark)" series manufactured by Ishihara Sangyo Co., Ltd.), rutile-type titanium dioxide surface-treated with alkylsilane ("JMT (registered trademark)" series manufactured by Imperial Chemical Co., Ltd., etc.), hollow-shaped titanium dioxide Silicon ("E-SPHERES" series manufactured by Pacific Cement Corporation, "SiliNax" series manufactured by Nippon Steel Mining Corporation, "Ecco sphere" series manufactured by Emerson & Cuming Corporation, hydrophobic AEROSIL series "RX200" manufactured by Japan Aerosil Corporation) etc.), talc (“SG” series manufactured by NIPPON TALC, etc.), block talc (“BST” series manufactured by NIPPON TALC, etc.), boron nitride (“UHP” series manufactured by Showa Denko, etc.) "Denka Boron Nitride" series ("GP", "HGP" grades), etc.).

無機物粒子之形狀可列舉粒狀、針狀(纖維狀)、板狀,具體而言,可列舉:球狀、鱗片狀、層狀、葉片狀、杏仁狀、柱狀、雞冠狀、等軸狀、葉狀、雲母狀、塊狀、平板狀、楔狀、玫瑰花狀、網狀、角柱狀。其中,較佳為球狀及鱗片狀,進而較佳為球狀。The shape of the inorganic particles includes granular, needle-like (fibrous), and plate-like shapes, and specifically, spherical, scaly, lamellar, leaf-like, almond-like, columnar, cockscomb, equiaxed Shape, leaf shape, mica shape, block shape, plate shape, wedge shape, rosette shape, net shape, angular column shape. Among them, spherical shape and scaly shape are preferable, and spherical shape is more preferable.

球狀之無機物粒子較佳為大致真球狀。大致真球狀意指利用掃描式電子顯微鏡(SEM)進行觀察時,短徑相對於長徑之比為0.5以上之球形粒子所占之比率為95%以上。於大致真球狀之無機物粒子中,短徑相對於長徑之比較佳為0.6以上,更佳為0.8以上。上述比較佳為未達1。若使用該程度之大致真球狀無機物粒子,則於成形物(聚合物層等)中,無機物與F聚合物更均勻地分佈,而容易更高度地表現出兩者之物性。The spherical inorganic particles are preferably substantially spherical. The substantially spherical shape means that the ratio of spherical particles having a ratio of a short axis to a long diameter of 0.5 or more is 95% or more when observed with a scanning electron microscope (SEM). In the substantially spherical inorganic particles, the ratio of the short axis to the long axis is preferably 0.6 or more, more preferably 0.8 or more. The above-mentioned comparison is preferably less than 1. When such substantially spherical inorganic particles are used, the inorganic material and the F polymer are more uniformly distributed in the molded product (polymer layer, etc.), and the physical properties of both are likely to be more highly expressed.

鱗片狀之無機物粒子之長徑比較佳為5以上,更佳為10以上。長徑比較佳為1000以下。The aspect ratio of the scaly inorganic particles is preferably 5 or more, more preferably 10 or more. The aspect ratio is preferably 1000 or less.

作為存在於本分散液A中之本粒子之態樣,可列舉:以F聚合物作為核,且於該核之表面附著有無機物之態樣(以下亦記為「態樣I」);以無機物作為核,且於該核之表面附著有F聚合物之態樣(以下亦記為「態樣II」)。此處,「核」意指形成複合粒子之粒子形狀所需之核(中心部),並非意指複合粒子之組成中之主成分。 附著於核之表面之附著物(無機物或F聚合物)可僅附著於核之表面之一部分,亦可附著於其大部分或整面。於前者之情形時,附著物亦可謂處於塵埃狀地黏附於核之表面之狀態,換言之,處於使核之表面之大部分露出之狀態。於後者之情形時,附著物亦可謂處於遍佈核之表面之態樣、或者被覆核之表面之狀態,該複合粒子亦可謂具有包含核及被覆核之殼之核殼結構。Examples of the aspect of the particle present in the present dispersion liquid A include: the aspect in which the F polymer is used as the core, and the inorganic substance is attached to the surface of the core (hereinafter also referred to as "Aspect I"); The inorganic substance serves as the core, and the F polymer adheres to the surface of the core (hereinafter also referred to as "Aspect II"). Here, "core" means the core (center part) required for forming the particle shape of the composite particle, and does not mean the main component in the composition of the composite particle. The attachment (inorganic matter or F polymer) attached to the surface of the core may be attached to only a part of the surface of the core, or may be attached to most or the entire surface of the core. In the former case, the attachment can also be said to be in a state in which it adheres to the surface of the nucleus in a dusty state, in other words, in a state in which most of the surface of the nucleus is exposed. In the latter case, the attachment can also be said to be in a state of spreading over the surface of the core or a state of covering the surface of the core, and the composite particle can also be said to have a core-shell structure including a core and a shell covering the core.

本粒子較佳為態樣I,且較佳為F聚合物及無機物分別為粒子狀之態樣。於該情形時,在本粒子中,與F聚合物相比硬度較高且分散穩定性較高之無機物露出於表面。結果,F聚合物不易改性,本粒子之流動性及其操作性容易提高。又,本粒子之分散穩定性容易變高。The present particle is preferably in aspect I, and preferably in the aspect in which the F polymer and the inorganic substance are in the form of particles, respectively. In this case, in the present particle, the inorganic substance having higher hardness and higher dispersion stability than the F polymer is exposed on the surface. As a result, the F polymer is not easily modified, and the fluidity and handleability of the particles are easily improved. Moreover, the dispersion stability of this particle|grains becomes high easily.

以下,亦將粒子狀之F聚合物記為「F粒子」,對態樣I之本粒子進行敍述。F聚合物之核可包含單一之F粒子,亦可包含F粒子之集合物。態樣I之本粒子較佳為將F聚合物之核之D50設定得比無機物粒子之D50大,且將本粒子中之F聚合物之量設定得比無機物之量多。Hereinafter, the particulate F polymer is also referred to as "F particle", and the present particle of Aspect I will be described. The core of the F polymer may include a single F particle, or may include a collection of F particles. In the present particle of Aspect I, it is preferable to set the D50 of the core of the F polymer to be larger than the D50 of the inorganic particle, and to set the amount of the F polymer in the present particle to be larger than the amount of the inorganic substance.

於態樣I之本粒子中,以F聚合物之核之D50作為基準,無機物粒子之D50較佳為0.001~0.5,更佳為0.01~0.3。具體而言,較佳為F聚合物之核之D50超過1 μm且無機物粒子之D50為0.1 μm以下。又,相對於F聚合物100質量份,無機物粒子之量較佳為0.1質量份以上,更佳為1質量份以上。其上限較佳為50質量份,更佳為25質量份,進而較佳為5質量份。 於如此所獲得之態樣I之本粒子中,上述關係得到維持,從而F聚合物之核之D50大於無機物粒子之D50,且F聚合物所占之質量多於無機物所占之質量。於該情形時,F聚合物之核之表面被更大量之無機物粒子被覆,從而本粒子具有核殼結構。又,於該情形時,F粒子彼此之凝聚得到抑制,容易獲得在包含單獨之F粒子之核上附著有無機物粒子之本粒子。In the present particle of aspect I, the D50 of the inorganic particle is preferably 0.001 to 0.5, more preferably 0.01 to 0.3, based on the D50 of the core of the F polymer. Specifically, it is preferable that the D50 of the core of the F polymer exceeds 1 μm and the D50 of the inorganic particle is 0.1 μm or less. Moreover, 0.1 mass part or more is preferable with respect to 100 mass parts of F polymers, and, as for the quantity of an inorganic substance particle, 1 mass part or more is more preferable. The upper limit is preferably 50 parts by mass, more preferably 25 parts by mass, and still more preferably 5 parts by mass. In the present particle of Aspect I thus obtained, the above relationship is maintained, so that the D50 of the core of the F polymer is greater than the D50 of the inorganic particle, and the F polymer occupies more mass than the inorganic substance. In this case, the surface of the core of the F polymer is covered with a larger amount of inorganic particles, so that the particle has a core-shell structure. Moreover, in this case, the aggregation of F particles is suppressed, and it is easy to obtain the present particle in which the inorganic particles are adhered to the core including the individual F particles.

無機物粒子較佳為球狀,更佳為大致真球狀粒子。於該情形時,所獲得之本粒子之分散性穩定性容易變高。於大致真球狀無機物粒子中,短徑相對於長徑之比較佳為0.5以上,更佳為0.8以上。上述比較佳為未達1。此處,「球狀」不僅包括真球,亦包括稍微變形之球。 若使用該程度之大致真球狀無機物粒子,則於成形物(聚合物層等)中,無機物與F聚合物更均勻地分佈,從而容易更高度地表現出兩者之物性。 無機物粒子亦可嵌埋至F聚合物之核。The inorganic particles are preferably spherical, and more preferably substantially spherical particles. In this case, the dispersibility stability of the present particle obtained tends to be high. In the substantially spherical inorganic particles, the ratio of the short axis to the long axis is preferably 0.5 or more, more preferably 0.8 or more. The above-mentioned comparison is preferably less than 1. Here, "spherical" includes not only a real ball but also a slightly deformed ball. When such substantially spherical inorganic particles are used, the inorganic material and the F polymer are more uniformly distributed in the molded product (polymer layer, etc.), and the physical properties of both can be easily expressed at a higher level. Inorganic particles can also be embedded in the core of the F polymer.

於態樣I之本粒子中,無機物粒子之D50較佳為0.001~0.3 μm之範圍,更佳為0.005~0.2 μm,進而較佳為0.01~0.1 μm。若D50處於該範圍內,則本粒子之操作性及流動性容易提高,且本分散液A之分散穩定性容易變高。 又,無機物粒子之粒度分佈係以D90/D10之值作為指標,較佳為3以下,更佳為2.9以下。此處,「D10」係與D50及D90同樣地進行測定所得之對象物之體積基準累積10%直徑。於該情形時,容易控制所獲得之本粒子之流動性。In the present particle of aspect I, the D50 of the inorganic particle is preferably in the range of 0.001 to 0.3 μm, more preferably 0.005 to 0.2 μm, and still more preferably 0.01 to 0.1 μm. When D50 exists in this range, the handleability and fluidity of this particle|grains are easy to improve, and the dispersion stability of this dispersion liquid A is easy to become high. In addition, the particle size distribution of the inorganic particles uses the value of D90/D10 as an index, and is preferably 3 or less, more preferably 2.9 or less. Here, "D10" is the volume-based cumulative 10% diameter of the object measured in the same manner as D50 and D90. In this case, it is easy to control the fluidity of the present particles obtained.

無機物粒子較佳為對其表面之至少一部分進行了表面處理,更佳為利用六甲基二矽氮烷等矽氮烷化合物、或矽烷偶合劑等進行了表面處理。作為矽烷偶合劑,可列舉上述化合物。 無機物粒子可使用一種,亦可混合兩種以上而使用。於混合兩種無機物粒子而使用之情形時,各無機物粒子之平均粒徑可彼此不同,各無機物粒子之含量比(質量比)可根據所要求之功能進行適當設定。It is preferable that at least a part of the surface of the inorganic particle is surface-treated, and it is more preferable that it is surface-treated with a silazane compound such as hexamethyldisilazane, a silane coupling agent, or the like. As a silane coupling agent, the above-mentioned compound is mentioned. One type of inorganic particles may be used, or two or more types may be mixed and used. When two kinds of inorganic particles are mixed and used, the average particle diameter of each inorganic particle can be different from each other, and the content ratio (mass ratio) of each inorganic particle can be appropriately set according to the required function.

於態樣I之本粒子中,F聚合物之核之D50較佳為0.1 μm以上,更佳為超過1 μm。其上限較佳為100 μm,更佳為50 μm,進而較佳為10 μm。 又,態樣I之本粒子中F聚合物所占之比率較佳為50~99質量%,更佳為75~99質量%。無機物之比率較佳為1~50質量%,更佳為1~25質量%。In the present particle of Aspect I, the D50 of the core of the F polymer is preferably 0.1 μm or more, more preferably more than 1 μm. The upper limit is preferably 100 μm, more preferably 50 μm, and still more preferably 10 μm. Moreover, 50-99 mass % is preferable, and, as for the ratio of the F polymer in the present particle of Aspect I, it is more preferable that it is 75-99 mass %. 1-50 mass % is preferable, and, as for the ratio of an inorganic substance, 1-25 mass % is more preferable.

態樣I之本粒子亦可根據附著於表面之無機物之物性進而進行表面處理。作為該表面處理之具體例,可列舉下述方法:利用聚二甲基矽氧烷等矽氧烷類或矽烷偶合劑對態樣I之本粒子進行表面處理。 上述表面處理可如下實施,即,將分散有本粒子之分散液與矽氧烷類或矽烷偶合劑加以混合,使矽氧烷類或矽烷偶合劑反應,回收本粒子。作為矽烷偶合劑,較佳為上述具有官能基之矽烷偶合劑。根據上述方法,可進而調整上述本粒子之表面物性。The present particle of Aspect I may be further surface-treated according to the physical properties of the inorganic substances attached to the surface. As a specific example of this surface treatment, the following method is mentioned which surface-treats the particle|grains of Aspect I with siloxanes, such as polydimethylsiloxane, or a silane coupling agent. The above-mentioned surface treatment can be performed by mixing the dispersion liquid in which the present particles are dispersed with a siloxane or a silane coupling agent, and reacting the siloxane or the silane coupling agent to recover the present particles. As a silane coupling agent, the silane coupling agent which has the above-mentioned functional group is preferable. According to the above method, the surface properties of the present particle can be further adjusted.

以下,對態樣II之本粒子進行敍述。 於態樣II之本粒子中,F聚合物可為粒子狀,亦可為非粒子狀。F聚合物較佳為至少一部分與無機物核融合在一起。 於態樣II之本粒子中,無機物核之D50較佳為1 μm以上,更佳為超過3 μm。其上限較佳為40 μm,更佳為30 μm。 於態樣II之本粒子中,在F聚合物為粒子狀之情形時,F粒子之D50較佳為0.1~10 μm之範圍,更佳為1~5 μm。若D50處於該範圍內,則本粒子之操作性或流動性容易提昇,又,分散穩定性容易變高。 又,態樣II之本粒子中無機物所占之比率較佳為50~99質量%,更佳為60~90質量%。F聚合物之比率較佳為1~50質量%,更佳為10~40質量%。Hereinafter, the present particle of aspect II will be described. In the present particle of aspect II, the F polymer may be in the form of particles or non-particulate. Preferably, at least a portion of the F polymer is fused to the inorganic core. In the present particle of aspect II, the D50 of the inorganic core is preferably 1 μm or more, more preferably more than 3 μm. The upper limit thereof is preferably 40 μm, more preferably 30 μm. In the present particle of Aspect II, when the F polymer is in the form of particles, the D50 of the F particle is preferably in the range of 0.1 to 10 μm, more preferably 1 to 5 μm. When D50 exists in this range, the handleability and fluidity|liquidity of this particle|grains are easy to improve, and dispersion stability is easy to become high. Moreover, 50-99 mass % is preferable, and, as for the ratio which an inorganic substance occupies in the present particle of Aspect II, it is more preferable that it is 60-90 mass %. The ratio of the F polymer is preferably from 1 to 50 mass %, more preferably from 10 to 40 mass %.

本粒子之D50較佳為30 μm以下,更佳為20 μm以下。本粒子之D50較佳為0.1 μm以上,更佳為1 μm以上,進而較佳為3 μm以上。 又,本粒子之D90較佳為30 μm以下,更佳為20 μm以下。 若本粒子之D50及D90處於上述範圍內,則本分散液A中之本粒子之分散穩定性、及由本分散液A所獲得之成形物(聚合物層等)之物性容易進一步提昇。D50 of this particle is preferably 30 μm or less, more preferably 20 μm or less. D50 of this particle is preferably 0.1 μm or more, more preferably 1 μm or more, and still more preferably 3 μm or more. Moreover, D90 of this particle is preferably 30 μm or less, more preferably 20 μm or less. When D50 and D90 of the present particle are within the above-mentioned ranges, the dispersion stability of the present particle in the present dispersion A and the physical properties of the molded product (polymer layer, etc.) obtained from the present dispersion A are likely to be further improved.

本粒子較佳為藉由以下方法進行製造:於F聚合物之熔融溫度以上之溫度下且懸浮狀態下使F粒子與無機物粒子碰撞之方法(以下亦記為「乾式法A」);於按壓或剪切狀態下使F粒子與無機物粒子碰撞之方法(以下亦記為「乾式法B」)。 或者,亦可藉由如下等方法進行製造:對含有F粒子及無機物粒子之液狀組合物進行剪切處理,使F粒子凝固之方法(以下亦記為「濕式法」)。The present particles are preferably produced by the following method: a method of colliding F particles with inorganic particles in a suspended state at a temperature higher than the melting temperature of the F polymer (hereinafter also referred to as "dry method A"); pressing Or a method of colliding F particles with inorganic particles in a sheared state (hereinafter also referred to as "dry method B"). Alternatively, it can also be produced by a method such as shearing a liquid composition containing F particles and inorganic particles to solidify the F particles (hereinafter also referred to as "wet method").

於乾式法A中,例如將F粒子及無機物粒子供給至高溫亂流氛圍下,藉由F粒子與無機物粒子之碰撞對其等之間賦予應力,從而複合化。該乾式法A有時亦稱為雜化處理。 氛圍由氣體形成。作為可使用之氣體,可列舉:空氣、氧氣、氮氣、氬氣或其等之混合氣體。 F粒子與無機物粒子可以預先混合而成之混合物之形式一次性供給至氛圍下,亦可分別單獨地供給至氛圍下。In the dry method A, for example, the F particles and the inorganic particles are supplied in a high-temperature turbulent atmosphere, and stress is applied to them by collision between the F particles and the inorganic particles to form a complex. This dry method A is sometimes referred to as hybrid treatment. The atmosphere is formed by gas. As the gas that can be used, air, oxygen, nitrogen, argon, or a mixed gas thereof can be exemplified. The F particles and the inorganic particles may be supplied to the atmosphere at one time as a pre-mixed mixture, or they may be separately supplied to the atmosphere.

於將F粒子及無機物粒子供給至高溫氛圍下時,較佳為粒子彼此不會相互凝聚之狀態。作為該方法,可使用使粒子懸浮於介質(氣體或液體)中之方法。再者,可使用氣體與液體之混合物作為介質。 又,於乾式法A中,可在準備高溫亂流氛圍後,向其中供給F粒子及無機物粒子,亦可在使F粒子及無機物粒子懸浮於介質中之後,對該介質進行加熱而形成高溫亂流氛圍。 作為前者可使用之裝置,例如可列舉如下裝置:於圓筒狀容器內一面用例如攪拌葉之類的高速旋轉之攪拌體來攪拌粒子,一面在容器之內壁與攪拌體之間夾持粒子而施加應力,上述裝置例如可列舉奈良機械製作所製造之「Hybridization System」(註冊商標)。 氛圍之溫度較佳為80℃以上,更佳為110℃以上。氛圍之溫度較佳為400℃以下,更佳為200℃以下,進而較佳為120℃以下。 於乾式法A之情形時,可使用F粒子及二氧化矽粒子之D50處於上述範圍內之粒子,在F聚合物之熔融溫度以上之溫度下且懸浮狀態下使其等碰撞。較佳為相對於F聚合物100質量份使15~85質量份之二氧化矽在F聚合物之熔融溫度以上之溫度且懸浮狀態下與其碰撞。 再者,於無機物粒子包含大量由其一次粒子彼此凝聚而成之凝聚體時,可在供給至高溫氛圍下之前壓碎凝聚體。作為凝聚體之壓碎方法,可列舉使用噴射磨機、針磨機、錘磨機之方法。When the F particles and the inorganic particles are supplied in a high-temperature atmosphere, it is preferable that the particles are in a state in which they do not agglomerate with each other. As this method, a method of suspending particles in a medium (gas or liquid) can be used. Furthermore, a mixture of gas and liquid can be used as the medium. In the dry method A, after preparing a high-temperature turbulent atmosphere, F particles and inorganic particles may be supplied therein, or after suspending the F particles and inorganic particles in a medium, the medium may be heated to form a high-temperature turbulent atmosphere. flow atmosphere. As a device that can be used for the former, for example, a device in which the particles are sandwiched between the inner wall of the container and the agitator while the particles are agitated by a high-speed rotating agitator such as a stirring blade in a cylindrical container can be mentioned. As for stress application, the above-mentioned device includes, for example, "Hybridization System" (registered trademark) manufactured by Nara Machinery Manufacturing Co., Ltd. The temperature of the atmosphere is preferably 80°C or higher, more preferably 110°C or higher. The temperature of the atmosphere is preferably 400°C or lower, more preferably 200°C or lower, and still more preferably 120°C or lower. In the case of the dry method A, the D50 of the F particles and the silica particles can be used in the above-mentioned range, and they can be collided in a suspended state at a temperature above the melting temperature of the F polymer. It is preferable to make 15-85 mass parts of silica collide with the F polymer in a suspended state at a temperature higher than the melting temperature of the F polymer with respect to 100 mass parts of the F polymer. Furthermore, when the inorganic particles contain a large amount of aggregates formed by agglomerating primary particles thereof, the aggregates can be crushed before being supplied to a high-temperature atmosphere. As the method for crushing the aggregate, a method using a jet mill, a pin mill, and a hammer mill is exemplified.

於乾式法B中,例如藉由離心力將F粒子及無機物粒子壓抵於繞中心軸旋轉之筒狀旋轉體之內周面(承受面),藉由內周面與以微小距離相隔而設之內部構件之協作,對上述粒子賦予按壓力或剪力而進行複合化。該乾式法B有時亦被稱為機械融合處理。 筒狀旋轉體內之氛圍可為惰性氣體氛圍、還原性氣體氛圍。氛圍之溫度較佳為F聚合物之熔融溫度以下,更佳為100℃以下。 筒狀旋轉體之內周面與內部構件之相隔距離係根據F粒子及無機物粒子之平均粒徑適當設定。該相隔距離通常較佳為1~10 mm。 筒狀旋轉體之轉速較佳為500~10000 rpm。於該情形時,容易提昇本粒子之製造效率。 再者,於無機物粒子包含大量由其一次粒子彼此凝聚而成之凝聚體之情形時,可在供給至筒狀旋轉體內之前,與上述乾式法A中所記載者同樣地壓碎凝聚體。In the dry method B, for example, the F particles and inorganic particles are pressed against the inner peripheral surface (receiving surface) of the cylindrical rotating body rotating around the central axis by centrifugal force, and the inner peripheral surface is separated by a small distance. The cooperation of the internal components gives the above-mentioned particles a pressing force or a shearing force to combine them. This dry process B is sometimes referred to as a mechanofusion process. The atmosphere in the cylindrical rotating body can be an inert gas atmosphere or a reducing gas atmosphere. The temperature of the atmosphere is preferably below the melting temperature of the F polymer, more preferably 100°C or below. The distance between the inner peripheral surface of the cylindrical rotating body and the internal member is appropriately set according to the average particle diameter of the F particles and the inorganic particles. The separation distance is usually preferably 1 to 10 mm. The rotational speed of the cylindrical rotating body is preferably 500-10000 rpm. In this case, it is easy to improve the production efficiency of the particles. Furthermore, when the inorganic particles contain a large amount of aggregates formed by agglomerating primary particles thereof, the aggregates may be crushed in the same manner as described in the above-mentioned dry method A before being supplied to the cylindrical rotating body.

乾式法B亦可使用下述粉碎混合裝置(例如Hosokawa Micron公司製造之「Nobilta」(註冊商標))來進行,該粉碎混合裝置具備:旋轉槽,其使旋轉軸處於水平方向而配置,且具備具有橢圓狀(異形)截面之粉碎混合室;及粉碎混合翼,其可旋轉地插入至該旋轉槽之粉碎混合室內,使旋轉軸處於與旋轉槽之旋轉軸同心之位置而配置,且具有橢圓狀(異形)截面。 於該粉碎混合裝置中,將F粒子及無機物粒子壓抵於粉碎混合室之短徑部與粉碎混合翼之長徑部之間,對上述粒子賦予按壓力或剪力而進行複合化。又,於粉碎混合裝置中,旋轉槽之旋轉方向與粉碎混合翼之旋轉方向較佳為相反,較佳為將旋轉槽之轉速設定得比粉碎混合翼之轉速慢。 根據該粉碎混合裝置,可使粉碎混合室與粉碎混合翼成為異形截面,對在粉碎混合室內因自身重量掉落而流動之F粒子及無機物粒子反覆賦予瞬間按壓力或剪力。因此,對於上述粒子,可降低由熱引起之不良影響,同時在短時間內進行粉碎混合,因此容易獲得具有目標特性之本粒子。Dry method B can also be carried out using a pulverizing and mixing apparatus (for example, "Nobilta" (registered trademark) manufactured by Hosokawa Micron Co., Ltd.), which is provided with a rotating tank arranged so that the rotating shaft is in a horizontal direction, and has A pulverizing and mixing chamber having an elliptical (special-shaped) cross-section; and a pulverizing and mixing blade rotatably inserted into the pulverizing and mixing chamber of the rotating tank so that the rotating shaft is disposed at a position concentric with the rotating axis of the rotating tank, and has an ellipse Shaped (shaped) section. In this pulverizing and mixing device, the F particles and the inorganic particles are pressed between the short-diameter portion of the pulverizing and mixing chamber and the long-diameter portion of the pulverizing and mixing blade, and the particles are compounded by applying a pressing force or a shearing force. Furthermore, in the pulverizing and mixing device, the rotation direction of the rotating tank and the rotating direction of the pulverizing and mixing blades are preferably opposite, and the rotation speed of the rotating tank is preferably set to be slower than the rotation speed of the pulverizing and mixing blades. According to this pulverizing and mixing device, the pulverizing and mixing chamber and the pulverizing and mixing blades can be formed into irregular cross-sections, and instantaneous pressing force or shearing force is repeatedly applied to the F particles and inorganic particles that flow under their own weight in the pulverizing and mixing chamber. Therefore, the particles described above can be pulverized and mixed in a short period of time while reducing adverse effects caused by heat, so that the present particles having the desired properties can be easily obtained.

濕式法係如下方法:對包含F粒子及無機物粒子之液狀組合物例如進行攪拌,進行剪切處理而使之不穩定化,引起其凝固而使F粒子與無機物粒子複合化,從而獲得本粒子。於無機物粒子為二氧化矽之情形時,適宜使用膠體狀二氧化矽。The wet method is a method of, for example, stirring a liquid composition containing F particles and inorganic particles, destabilizing it by shearing, causing it to solidify, and combining the F particles and the inorganic particles, thereby obtaining the present invention. particle. When the inorganic particles are silica, colloidal silica is suitably used.

於濕式法中,液狀組合物中之F粒子與無機物粒子之合計含量較佳為相對於液狀組合物之整體質量為30質量%以上,更佳為40~80質量%。 又,關於液狀組合物中之F粒子與無機物粒子之質量比,當將F粒子之質量設為1時,無機物粒子之質量較佳為0.001~2.0,更具體而言,於獲得態樣I之本粒子之情形時,液狀組合物較佳為包含20~50質量%之F粒子、及0.1~40質量%之無機物粒子。In the wet method, the total content of the F particles and the inorganic particles in the liquid composition is preferably 30% by mass or more, more preferably 40 to 80% by mass with respect to the entire mass of the liquid composition. In addition, regarding the mass ratio of the F particles to the inorganic particles in the liquid composition, when the mass of the F particles is set to 1, the mass of the inorganic particles is preferably 0.001 to 2.0. More specifically, in obtaining the aspect I In the case of this particle, the liquid composition preferably contains 20 to 50 mass % of F particles and 0.1 to 40 mass % of inorganic particles.

液狀組合物可將F粒子、無機物粒子及分散介質加以混合而製備。作為混合方法,可列舉如下等方法:將F粒子及無機物粒子一次性添加至分散介質中進行混合之方法;一面向分散介質中依序添加F粒子與無機物粒子一面進行混合之方法;預先混合F粒子及無機物粒子,將所獲得之混合物與分散介質加以混合之方法;分別預先混合F粒子與分散介質、無機物粒子與分散介質,將所獲得之兩種混合物進而加以混合之方法。 具體而言,使二氧化矽粒子分散於分散介質中後,將其添加至包含F粒子之分散液中而進行混合。該方法有利於二氧化矽粒子與F粒子之混合。 若使包含F粒子及二氧化矽粒子之混合液不穩定化,並引起其凝固,則可使F粒子與二氧化矽粒子複合化。 再者,作為分散介質,適宜使用與下述液狀分散介質同類之化合物等。The liquid composition can be prepared by mixing F particles, inorganic particles, and a dispersion medium. Examples of mixing methods include the following methods: a method of adding F particles and inorganic particles to a dispersion medium at one time and mixing; a method of sequentially adding F particles and inorganic particles to the dispersion medium and mixing; pre-mixing F particles Particles and inorganic particles, the method of mixing the obtained mixture with the dispersion medium; the method of mixing the F particles and the dispersion medium, the inorganic particles and the dispersion medium in advance, and then mixing the obtained two mixtures. Specifically, after dispersing silica particles in a dispersion medium, this is added to a dispersion liquid containing F particles and mixed. This method facilitates the mixing of silica particles and F particles. If the mixed solution containing the F particles and the silica particles is destabilized and solidified, the F particles and the silica particles can be combined. In addition, as the dispersion medium, a compound or the like similar to the following liquid dispersion medium is suitably used.

包含F粒子之液狀組合物可於添加無機物粒子之中途或添加結束後進行攪拌。作為用於攪拌之裝置,例如可列舉具備螺旋槳葉片、渦輪葉片、攪拌葉片、貝殼狀葉片等葉片作為攪拌葉之攪拌裝置。再者,此時之攪拌速度只要為能夠使無機物粒子有效率地分散於包含F粒子之液狀組合物中之程度即可,無須對F粒子賦予較高之剪力。The liquid composition containing the F particles can be stirred during the addition of the inorganic particles or after the addition. As an apparatus for stirring, the stirring apparatus provided with blades, such as a propeller blade, a turbine blade, a stirring blade, a shell-shaped blade, as a stirring blade, is mentioned, for example. In addition, the stirring speed at this time should just be a level which can disperse|distribute the inorganic substance particle efficiently in the liquid composition containing F particle, and it is not necessary to apply a high shear force to the F particle.

液狀組合物之攪拌例如包括:利用上述攪拌裝置、或者亨舍爾混合機、加壓捏合機、班布里混合機或行星式混合機進行之攪拌;利用球磨機、磨碎機、籃式砂磨機、砂磨機(sand mill)、砂磨機(sand grinder)、Dyno研磨機(使用玻璃珠或氧化鋯珠等粉碎介質之珠磨機)、Dispermat、SC研磨機、釘碎機或攪拌研磨機等使用介質之分散機進行之混合;使用微噴均質機、Nanomizer、Ultimaizer等高壓均質機、超音波均質機、溶解器、分散機、高速轉子分散機、自轉公轉攪拌機等不使用介質之分散機進行之混合。 剪切處理較佳為於高剪切條件下進行。「高剪切」意指於攪拌時,在至少超過300 rpm之速度下進行攪拌。 剪切處理可在向包含F粉末之液狀組合物中添加無機物粒子之中途開始,或者亦可在添加結束後進行。The stirring of the liquid composition includes, for example, stirring by the above-mentioned stirring device, or a Henschel mixer, a pressurized kneader, a Banbury mixer, or a planetary mixer; Mill, sand mill, sand grinder, Dyno mill (bead mill using grinding media such as glass beads or zirconia beads), Dispermat, SC mill, nail crusher, or stirrer Mixing by a disperser using a medium such as a grinder; using a micro-spray homogenizer, a high-pressure homogenizer such as Nanomizer, and an Ultimaizer, an ultrasonic homogenizer, a dissolver, a disperser, a high-speed rotor disperser, and a rotating revolution mixer. Mixing by disperser. The shear treatment is preferably carried out under high shear conditions. "High shear" means stirring at a speed of at least over 300 rpm while stirring. The shearing treatment may be started in the middle of adding the inorganic particles to the liquid composition containing the F powder, or may be performed after the addition is completed.

作為於剪切處理後去除分散介質而單離出本粒子之方法,可列舉加熱、減壓或過濾,亦可將其等加以適當組合。 作為單離出本粒子之方法之具體例,可列舉如下等方法:(1)於大氣壓下或減壓下將分散介質蒸餾去除而進行濃縮,根據需要進行過濾並進行乾燥;(2)一面對液狀組合物進行溫度調節一面使本粒子凝聚,或者藉由添加電解質或凝集劑、凝聚助劑等來進行凝集、晶析後,藉由過濾等方式進行分離並進行乾燥;(3)將液狀組合物噴霧至將溫度調至分散介質可揮發之溫度的乾燥氣體中,進行乾燥並進行回收;(4)對液狀組合物進行離心分離後進行乾燥。 此處,作為乾燥方法,可列舉真空乾燥、高頻乾燥、熱風乾燥。 於上述各方法(1)~(4)中,可根據需要利用分散介質對液狀組合物進行稀釋,而預先調整液狀組合物中之F聚合物及無機物之合計含量。As a method of removing the dispersion medium after the shearing treatment and isolating the particles, heating, decompression, or filtration may be mentioned, and an appropriate combination of these and the like may be used. Specific examples of the method for isolating the particles include the following methods: (1) the dispersion medium is distilled off under atmospheric pressure or reduced pressure to concentrate, filtered and dried if necessary; (2) one side The particles are agglomerated while the temperature of the liquid composition is adjusted, or after agglomeration and crystallization by adding an electrolyte, a coagulant, a coagulation aid, etc., and then separating and drying by means of filtration or the like; (3) the The liquid composition is sprayed into a drying gas whose temperature is adjusted to a temperature at which the dispersion medium can volatilize, dried and recovered; (4) the liquid composition is centrifuged and then dried. Here, as a drying method, vacuum drying, high frequency drying, and hot air drying are mentioned. In each of the above-mentioned methods (1) to (4), the liquid composition can be diluted with a dispersion medium as necessary, and the total content of the F polymer and inorganic substances in the liquid composition can be adjusted in advance.

於藉由上述乾式法A、乾式法B、濕式法來製造本粒子時,要想進一步提高F粒子與無機物粒子之密接性(接著性),較佳為在F粒子與無機物粒子之混合之前、或者與混合同時對F粒子進行表面處理。作為表面處理,可列舉電漿處理、電暈放電處理、電暈放電處理、蝕刻處理、電子束照射處理、紫外線照射處理、臭氧暴露處理,較佳為電漿處理、尤其是低溫電漿處理。 又,若藉由乾式法A及乾式法B,則於使F粒子與無機物粒子碰撞時,熱容易均勻地傳遞至該等粒子,本粒子容易進行緻密化及球形化。該情形時之本粒子之球形度較佳為0.5以上,較佳為0.93~0.99。In order to further improve the adhesion (adhesion) between the F particles and the inorganic particles when the particles are produced by the above-mentioned dry method A, dry method B, and wet method, it is preferable to mix the F particles and the inorganic particles before mixing. , or surface treatment of F particles at the same time as mixing. The surface treatment includes plasma treatment, corona discharge treatment, corona discharge treatment, etching treatment, electron beam irradiation treatment, ultraviolet irradiation treatment, and ozone exposure treatment, and plasma treatment, especially low-temperature plasma treatment, is preferred. In addition, according to the dry method A and the dry method B, when the F particles collide with the inorganic particles, heat is easily uniformly transferred to these particles, and the present particles are easily densified and spherical. In this case, the sphericity of the present particle is preferably 0.5 or more, preferably 0.93 to 0.99.

於本粒子之製造中,F粒子之D50較佳為20 μm以下,更佳為10 μm以下。F粒子之D50較佳為0.01 μm以上,更佳為0.1 μm以上。又,F粒子之D90較佳為10 μm以下。在該範圍內之D50及D90下,F粒子之流動性及分散性變得良好,又,藉由濕式法,而容易控制分散介質中所存在之本粒子之大小,以使其不易沈澱。 F粒子之鬆密度較佳為0.15 g/m2 以上,更佳為0.20 g/m2 以上。F粒子之鬆密度較佳為0.50 g/m2 以下,更佳為0.35 g/m2 以下。In the production of the present particles, the D50 of the F particles is preferably 20 μm or less, more preferably 10 μm or less. D50 of the F particles is preferably 0.01 μm or more, more preferably 0.1 μm or more. Moreover, it is preferable that D90 of F particle is 10 micrometers or less. At D50 and D90 within this range, the fluidity and dispersibility of the F particles become good, and the size of the particles present in the dispersion medium can be easily controlled by the wet method so as to prevent precipitation. The bulk density of the F particles is preferably 0.15 g/m 2 or more, more preferably 0.20 g/m 2 or more. The bulk density of the F particles is preferably 0.50 g/m 2 or less, more preferably 0.35 g/m 2 or less.

本粒子即便大量地添加至液狀分散介質中亦可穩定地分散,由上述本分散液A形成之成形物(聚合物層、膜等)中,F聚合物與無機物更均勻地分佈,而容易高度地表現出基於F聚合物之物性(電特性、接著性等)及基於無機物之物性(低線膨脹性等)。又,容易高度地表現出基於芳香族聚合物之物性(UV吸收性等)。The particles of the present invention can be stably dispersed even if they are added to a liquid dispersion medium in large amounts. The physical properties (electrical properties, adhesiveness, etc.) based on the F polymer and the physical properties (low linear expansion, etc.) based on the inorganic material are highly expressed. In addition, the physical properties (UV absorptivity, etc.) based on the aromatic polymer are likely to be highly expressed.

於本分散液A中,液狀分散介質較佳為在大氣壓、25℃下為液體之化合物。液狀分散介質可為極性亦可為非極性,較佳為極性。液狀分散介質更佳為選自水、醯胺、酮及酯中之至少一種。液狀分散介質之沸點較佳為50~240℃之範圍。液狀分散介質可單獨使用一種,亦可併用兩種以上。若使用上述液狀分散介質,則認為可更固定地保持本粒子在本分散液A中之分散狀態。 作為液狀分散介質,可列舉水、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、3-甲氧基-N,N-二甲基丙醯胺、3-丁氧基-N,N-二甲基丙醯胺、N-甲基-2-吡咯啶酮、γ-丁內酯、環己酮、環戊酮、乙酸丁酯、甲基異丙基酮、甲基乙基酮、甲苯,較佳為水、N-甲基-2-吡咯啶酮、γ-丁內酯、甲基乙基酮、環己酮及環戊酮,更佳為N-甲基-2-吡咯啶酮、甲基乙基酮。 本分散液A中之液狀分散介質之含量較佳為30~90質量%,更佳為50~80質量%。In this dispersion liquid A, the liquid dispersion medium is preferably a compound that is liquid at atmospheric pressure and 25°C. The liquid dispersion medium may be polar or non-polar, preferably polar. The liquid dispersion medium is more preferably at least one selected from the group consisting of water, amides, ketones and esters. The boiling point of the liquid dispersion medium is preferably in the range of 50 to 240°C. A liquid dispersion medium may be used individually by 1 type, and may use 2 or more types together. When the above-mentioned liquid dispersion medium is used, it is considered that the dispersed state of the present particles in the present dispersion liquid A can be more stably maintained. Examples of the liquid dispersion medium include water, N,N-dimethylformamide, N,N-dimethylacetamide, 3-methoxy-N,N-dimethylpropionamide, 3-methoxy-N,N-dimethylpropionamide, -Butoxy-N,N-dimethylpropionamide, N-methyl-2-pyrrolidone, γ-butyrolactone, cyclohexanone, cyclopentanone, butyl acetate, methyl isopropyl Ketone, methyl ethyl ketone, toluene, preferably water, N-methyl-2-pyrrolidone, γ-butyrolactone, methyl ethyl ketone, cyclohexanone and cyclopentanone, more preferably N - Methyl-2-pyrrolidone, methyl ethyl ketone. The content of the liquid dispersion medium in the dispersion liquid A is preferably 30 to 90% by mass, more preferably 50 to 80% by mass.

本分散液A進而包含芳香族聚合物。本分散液A中之芳香族聚合物之含量較佳為0.1質量%以上,更佳為1質量%以上。芳香族聚合物之含量較佳為40質量%以下,更佳為20質量%以下。 又,本分散液A中之芳香族聚合物之含量較佳為少於上述本粒子之含量。具體而言,本分散液A中之芳香族聚合物之含量相對於上述本粒子之含量之以質量計之比(質量比)較佳為0.01以上,更佳為0.1以上。另一方面,上述比較佳為0.5以下,更佳為0.3以下。即便於以上述比包含芳香族聚合物之情形時,本分散液A亦藉由上述作用機理而狀態穩定性優異。The present dispersion liquid A further contains an aromatic polymer. The content of the aromatic polymer in the dispersion liquid A is preferably 0.1% by mass or more, more preferably 1% by mass or more. 40 mass % or less is preferable, and, as for content of an aromatic polymer, 20 mass % or less is more preferable. Moreover, it is preferable that the content of the aromatic polymer in this dispersion liquid A is less than the content of the said particle|grains. Specifically, the mass ratio (mass ratio) of the content of the aromatic polymer in the present dispersion A to the content of the present particles is preferably 0.01 or more, more preferably 0.1 or more. On the other hand, the above-mentioned comparison is preferably 0.5 or less, more preferably 0.3 or less. Even when the aromatic polymer is contained in the above-mentioned ratio, the present dispersion liquid A is excellent in state stability due to the above-mentioned mechanism of action.

芳香族聚合物可為熱固性,亦可為熱塑性,較佳為熱塑性。於該情形時,本分散液A之分散穩定性變得優異。 作為芳香族聚合物,可列舉:具有含醯亞胺鍵之單元、含醯胺鍵之單元、或N-取代馬來醯亞胺結構、琥珀醯亞胺結構或者鄰苯二甲醯亞胺結構之芳香族聚合物(具體而言為芳香族聚醯亞胺、芳香族聚醯胺醯亞胺、芳香族聚醯胺醯亞胺之前驅物、芳香族馬來醯亞胺、作為芳香族聚醯亞胺前驅物之芳香族聚醯胺酸、芳香族聚醯胺)、聚苯醚、液晶聚酯、或者芳香族彈性體(苯乙烯彈性體等)。Aromatic polymers can be either thermoset or thermoplastic, preferably thermoplastic. In this case, the dispersion stability of this dispersion liquid A becomes excellent. Examples of the aromatic polymer include a unit having an amide bond, a unit having an amide bond, or an N-substituted maleimide structure, a succinimide structure, or a phthalimide structure. The aromatic polymers (specifically, aromatic polyimide, aromatic polyimide imide, aromatic polyimide imide precursor, aromatic maleimide, aromatic polyimide, etc.) Aromatic polyamides (aromatic polyamides, aromatic polyamides), polyphenylene ethers, liquid crystal polyesters, or aromatic elastomers (styrene elastomers, etc.) as precursors of imide.

作為芳香族聚醯亞胺,更佳為四羧酸二酐及二胺之一者具有芳香族環之半芳香族聚醯亞胺、或者兩者均具有芳香族環之全芳香族聚醯亞胺。作為芳香族聚醯亞胺之具體例,可列舉:「UPIA(註冊商標)-AT」系列(宇部興產公司製造)、「Neopulim」系列(三菱瓦斯化學公司製造)、「SPIXAREA」系列(SOMAR公司製造)、「Q-PILON」系列(PI技術研究所製造)、「WINGO」系列(Wingo Technology公司製造)、「TOHMIDE」系列(T&K TOKA公司製造)、「KPI-MX」系列(河村產業公司製造)。 作為芳香族聚醯胺醯亞胺或其前驅物之具體例,可列舉「HPC-1000」、「HPC-2100D」(均為昭和電工材料公司製造)。The aromatic polyimide is more preferably a semi-aromatic polyimide having an aromatic ring in either tetracarboxylic dianhydride or diamine, or a wholly aromatic polyimide having both aromatic rings amine. Specific examples of the aromatic polyimide include "UPIA (registered trademark)-AT" series (manufactured by Ube Industries, Ltd.), "Neopulim" series (manufactured by Mitsubishi Gas Chemical Corporation), "SPIXAREA" series (SOMAR) company), "Q-PILON" series (manufactured by PI Technology Research Institute), "WINGO" series (manufactured by Wingo Technology Co., Ltd.), "TOHMIDE" series (manufactured by T&K TOKA Co., Ltd.), "KPI-MX" series (Kawamura Sangyo Co., Ltd. manufacture). As a specific example of an aromatic polyimide imide or its precursor, "HPC-1000" and "HPC-2100D" (both are manufactured by Showa Denko Materials Co., Ltd.) are mentioned.

作為芳香族馬來醯亞胺,較佳為具有N-取代馬來醯亞胺結構之馬來醯亞胺樹脂,可列舉雙馬來醯亞胺樹脂,其係使為二聚二胺、具有脂環結構之二胺等二胺與具有芳香環之四羧酸二酐之反應物且末端基為胺基的聚醯亞胺與馬來酸酐進行反應而獲得。雙馬來醯亞胺樹脂可僅在末端基具有N-取代馬來醯亞胺結構,亦可在末端基及側鏈兩處具有N-取代馬來醯亞胺結構。 該等馬來醯亞胺化合物可選用DESIGNER MOLECULES Inc製造之BMI系列來獲取市售品。As the aromatic maleimide, maleimide resins having an N-substituted maleimide structure are preferred, and examples include bismaleimide resins, which are dimerized diamines having It is obtained by reacting a diamine such as a diamine having an alicyclic structure with a reactant of a tetracarboxylic dianhydride having an aromatic ring, and a polyimide having an amine group as a terminal group and maleic anhydride. The bismaleimide resin may have an N-substituted maleimide structure only at the terminal group, or may have an N-substituted maleimide structure at both the terminal group and the side chain. These maleimide compounds can be commercially available from the BMI series manufactured by DESIGNER MOLECULES Inc.

作為液晶聚酯,可列舉芳香族聚酯、或向該芳香族聚酯中導入有醯胺鍵之芳香族聚酯醯胺。對於芳香族聚酯或芳香族聚酯醯胺,可進而導入醯亞胺鍵、碳酸酯鍵、碳二醯亞胺鍵或異氰尿酸酯鍵等源自異氰酸酯之鍵等。 液晶聚酯較佳為熱塑性,更佳為熔融溫度為260~360℃之範圍之液晶聚酯,進而較佳為270~350℃之範圍。 液晶聚酯中,較佳為至少包含基於對羥基苯甲酸(HBA)之單元、或基於6-羥基-2-萘甲酸(HNA)之單元之聚酯,較佳為:包含HBA單元及HNA單元之聚酯;包含HBA或HNA之至少一種的芳香族羥基羧酸單元、4,4'-二羥基聯苯或對苯二酚之至少一種的芳香族二醇單元、及對苯二甲酸、間苯二甲酸或2,6-萘二甲酸之至少一種的芳香族二羧酸單元的聚酯;包含HBA單元及2,6-二羥基萘甲酸單元之聚酯;包含2,6-二羥基萘甲酸單元、對苯二甲酸單元及乙醯胺酚單元之聚酯;包含HBA單元、對苯二甲酸單元及4,4'-聯苯酚單元之聚酯。該等液晶聚酯可經由工業製造而獲取,可列舉:Celanese Japan公司製造之「威達(Vectra)」系列、JX Energy公司之「XYDAR」系列、日本寶理塑料公司之「LAPEROS」系列、上野製藥公司之「UENO LCP」系列等。As the liquid crystal polyester, aromatic polyester or aromatic polyester amide to which an amide bond is introduced into the aromatic polyester can be mentioned. An isocyanate-derived bond, such as an imide bond, a carbonate bond, a carbodiimide bond, or an isocyanurate bond, can be introduced into the aromatic polyester or the aromatic polyester imide. The liquid crystal polyester is preferably a thermoplastic, more preferably a liquid crystal polyester having a melting temperature in the range of 260 to 360°C, and more preferably in the range of 270 to 350°C. Among the liquid crystalline polyesters, it is preferable to include at least a unit based on p-hydroxybenzoic acid (HBA) or a polyester based on a unit based on 6-hydroxy-2-naphthoic acid (HNA), preferably: a unit containing HBA and HNA unit The polyester; the aromatic hydroxycarboxylic acid unit comprising at least one of HBA or HNA, the aromatic diol unit of at least one of 4,4'-dihydroxybiphenyl or hydroquinone, and terephthalic acid, m- Polyester of aromatic dicarboxylic acid unit of at least one of phthalic acid or 2,6-naphthalene dicarboxylic acid; polyester comprising HBA unit and 2,6-dihydroxynaphthoic acid unit; comprising 2,6-dihydroxynaphthalene Polyester of formic acid unit, terephthalic acid unit and acetaminophen unit; polyester comprising HBA unit, terephthalic acid unit and 4,4'-biphenol unit. These liquid crystal polyesters can be obtained through industrial manufacturing, and examples include: “Vectra” series manufactured by Celanese Japan, “XYDAR” series by JX Energy, “LAPEROS” series by Polyplastics, Ueno "UENO LCP" series of pharmaceutical companies, etc.

作為苯乙烯彈性體,較佳為具備橡膠與塑膠兩者之性質,且藉由加熱而塑化從而表現出柔軟性之苯乙烯彈性體,可列舉苯乙烯與共軛二烯或(甲基)丙烯酸酯之共聚物(苯乙烯-丁二烯橡膠;苯乙烯系核殼型共聚物;苯乙烯-丁二烯-苯乙烯嵌段共聚物、苯乙烯-異戊二烯-苯乙烯嵌段共聚物、苯乙烯-丁二烯-苯乙烯嵌段共聚物之氫化物、及苯乙烯-異戊二烯-苯乙烯嵌段共聚物之氫化物等苯乙烯系嵌段共聚物等),較佳為具備橡膠與塑膠兩者之性質,且藉由加熱而塑化從而表現出柔軟性之苯乙烯彈性體。The styrene elastomer is preferably a styrene elastomer having properties of both rubber and plastic, and being plasticized by heating to exhibit flexibility, such as styrene and conjugated diene or (methyl) Acrylate copolymer (styrene-butadiene rubber; styrene core-shell copolymer; styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer styrene-butadiene-styrene block copolymer, hydrogenated products of styrene-butadiene-styrene block copolymers, and styrene-based block copolymers such as hydrogenated products of styrene-isoprene-styrene block copolymers, etc.), preferably It is a styrene elastomer that has properties of both rubber and plastic, and is plasticized by heating to show flexibility.

本發明較佳為,芳香族聚合物為選自由芳香族聚醯亞胺、芳香族聚醯胺、芳香族聚醯胺醯亞胺、聚苯醚、液晶聚酯、芳香族馬來醯亞胺所組成之群中之至少一種。 又,要想本分散液A之分散穩定效果較高,上述芳香族聚合物較佳為熱塑性,其中,更佳為熱塑性之芳香族聚醯亞胺或芳香族聚醯胺醯亞胺,進而較佳為熱塑性之芳香族聚醯亞胺。於該情形時,認為熱塑性之芳香族聚醯亞胺或芳香族聚醯胺醯亞胺在本分散液A中作為界面活性劑或黏度調整劑發揮作用,或者作為其兩者發揮作用。因此,會平衡本分散液A之液體物性(黏度、觸變比等),其操作性易於提高。並且,由本分散液A形成之成形物之接著性與低線膨脹性進一步提高。Preferably in the present invention, the aromatic polymer is selected from the group consisting of aromatic polyimide, aromatic polyimide, aromatic polyamide imide, polyphenylene ether, liquid crystal polyester, and aromatic maleimide At least one of the groups formed. In addition, in order to obtain a higher dispersion stabilization effect of the dispersion liquid A, the above-mentioned aromatic polymer is preferably a thermoplastic, among which, a thermoplastic aromatic polyimide or an aromatic polyimide imide is more preferred, and further more preferred. A thermoplastic aromatic polyimide is preferred. In this case, it is considered that thermoplastic aromatic polyimide or aromatic polyimide imide acts as a surfactant or a viscosity modifier in the present dispersion A, or acts as both of them. Therefore, the liquid physical properties (viscosity, thixotropic ratio, etc.) of the dispersion liquid A are balanced, and the handleability thereof is easily improved. Moreover, the adhesiveness and low linear expansion property of the molded object formed from this dispersion liquid A were further improved.

進而,上述芳香族聚合物之至少一部分可於本分散液A中呈粒子狀分散。於該情形時,適宜使用粒子狀之液晶聚酯。 於使用粒子狀之液晶聚酯之情形時,其平均粒徑(D50)較佳為1~40 μm之範圍,更佳為5~20 μm。若平均粒徑(D50)處於該範圍內,則其在本分散液A中之散穩定性容易進一步提高。Furthermore, in this dispersion liquid A, at least a part of the said aromatic polymer can be dispersed in particle form. In this case, a particulate liquid crystal polyester is suitably used. In the case of using a particulate liquid crystal polyester, the average particle diameter (D50) is preferably in the range of 1 to 40 μm, more preferably 5 to 20 μm. When the average particle diameter (D50) is within this range, the dispersion stability in the present dispersion liquid A is likely to be further improved.

本分散液A可進而包含界面活性劑,亦可不包含。於本分散液A包含界面活性劑之情形時,其含量較佳為1~15質量%,且界面活性劑較佳為非離子性。 作為界面活性劑,較佳為:二醇系界面活性劑、乙炔系界面活性劑、矽酮系界面活性劑及氟系界面活性劑。再者,所謂氟系界面活性劑係指具有親水性部位及含有含氟有機基之疏水性部位之化合物。界面活性劑可使用一種,亦可使用兩種。於使用兩種界面活性劑之情形時,界面活性劑較佳為矽酮系界面活性劑與二醇系界面活性劑。 作為界面活性劑之具體例,可列舉:「FTERGENT」系列(NEOS公司製造)、「Surflon」系列(AGC SEIMI CHEMICAL公司製造)、「MEGAFAC」系列(DIC公司製造)、「Unidyne」系列(大金工業公司製造)、「BYK-347」、「BYK-349」、「BYK-378」、「BYK-3450」、「BYK-3451」、「BYK-3455」、「BYK-3456」(BYK-Chemie Japan公司製造)、「KF-6011」、「KF-6043」(信越化學工業公司製造)、「Tergitol」系列(陶氏化學公司製造,「Tergitol TMN-100X」等)。This dispersion liquid A may further contain a surfactant, or may not contain it. When the present dispersion liquid A contains a surfactant, the content thereof is preferably 1 to 15% by mass, and the surfactant is preferably nonionic. As the surfactant, a glycol-based surfactant, an acetylene-based surfactant, a silicone-based surfactant, and a fluorine-based surfactant are preferable. In addition, the so-called fluorine-based surfactant refers to a compound having a hydrophilic part and a hydrophobic part containing a fluorine-containing organic group. One type of surfactant may be used, or two types may be used. When two kinds of surfactants are used, the surfactants are preferably a silicone-based surfactant and a glycol-based surfactant. Specific examples of surfactants include "FTERGENT" series (manufactured by NEOS Corporation), "Surflon" series (manufactured by AGC Seimi Chemical Co., Ltd.), "MEGAFAC" series (manufactured by DIC Corporation), "Unidyne" series (manufactured by Daikin Corporation) manufactured by Industrial Corporation), "BYK-347", "BYK-349", "BYK-378", "BYK-3450", "BYK-3451", "BYK-3455", "BYK-3456" (BYK-Chemie Japan Corporation), "KF-6011", "KF-6043" (Shin-Etsu Chemical Co., Ltd.), "Tergitol" series (Dow Chemical Corporation, "Tergitol TMN-100X", etc.).

本分散液A藉由上述作用機理,即便未必含有界面活性劑、尤其是氟系界面活性劑,亦分散穩定性及操作性優異。本分散液A較佳為不含氟系界面活性劑。由不含氟系界面活性劑之本分散液A形成之成形物之低介電損耗因數性等容易進一步提高。This dispersion liquid A is excellent in dispersion stability and handleability even if it does not necessarily contain a surfactant, especially a fluorine-based surfactant, by the above-mentioned mechanism of action. This dispersion liquid A preferably does not contain a fluorine-based surfactant. The low dielectric dissipation factor and the like of the molded article formed from the present dispersion liquid A containing no fluorine-based surfactant are likely to be further improved.

要想提高由本分散液A形成之成形物之接著性及低線膨脹性,本分散液A可進而包含除F聚合物、上述芳香族聚合物以外之樹脂材料。該樹脂材料可為熱固性亦可為熱塑性,亦可經改性,可溶解於本分散液A中,亦可不溶解而分散於其中。 作為上述樹脂材料,可列舉:除F聚合物以外之四氟乙烯系聚合物、丙烯酸系樹脂、酚系樹脂、聚烯烴樹脂、改性聚苯醚、乙烯酯樹脂、尿素樹脂、鄰苯二甲酸二烯丙酯樹脂、三聚氰胺樹脂、三聚氰二胺樹脂、三聚氰胺-尿素共縮合樹脂、聚碳酸酯、環氧樹脂等。 要想提高由本分散液A形成之成形物之電特性,上述樹脂材料較佳為除F聚合物以外之四氟乙烯系聚合物。作為除F聚合物以外之四氟乙烯系聚合物,可列舉聚四氟乙烯(PTFE),可列舉具有原纖性之高分子量PTFE、低分子量PTFE、改性PTFE。再者,低分子量PTFE或改性PTFE亦包含TFE與極微量之共聚單體(HFP、PAVE、FAE等)之共聚物。 於本分散液A包含樹脂材料之情形時,其含量相對於本分散液A整體較佳為40質量%以下。In order to improve the adhesiveness and low linear expansion of the molded article formed from the dispersion liquid A, the dispersion liquid A may further contain resin materials other than the F polymer and the above-mentioned aromatic polymer. The resin material may be thermosetting or thermoplastic, or modified, and may be dissolved in the dispersion liquid A or dispersed therein without being dissolved. Examples of the above-mentioned resin material include tetrafluoroethylene-based polymers other than F polymers, acrylic resins, phenol-based resins, polyolefin resins, modified polyphenylene ethers, vinyl ester resins, urea resins, and phthalic acid. Diallyl ester resin, melamine resin, melamine resin, melamine-urea co-condensation resin, polycarbonate, epoxy resin, etc. In order to improve the electrical properties of the molded article formed from the present dispersion A, the resin material is preferably a tetrafluoroethylene-based polymer other than the F polymer. Examples of tetrafluoroethylene-based polymers other than the F polymer include polytetrafluoroethylene (PTFE), and examples thereof include high molecular weight PTFE, low molecular weight PTFE, and modified PTFE having fibrillar properties. Furthermore, low molecular weight PTFE or modified PTFE also includes copolymers of TFE and a very small amount of comonomers (HFP, PAVE, FAE, etc.). When this dispersion liquid A contains a resin material, its content is preferably 40 mass % or less with respect to this whole dispersion liquid A.

本分散液A可除本粒子中所含之F聚合物以外另外進而含有四氟乙烯系聚合物。於該情形時,本分散液A亦分散穩定性優異。 上述四氟乙烯系聚合物可為與上述構成本粒子之F聚合物同類之聚合物,亦可為不同類之聚合物。其中,較佳為PTFE或F聚合物,更佳為PFA或FEP,進而較佳為上述聚合物(1)或聚合物(2)。 上述四氟乙烯系聚合物較佳為粒子狀,較佳為分散於本分散液A中。又,上述四氟乙烯系聚合物之粒子可僅包含四氟乙烯系聚合物,亦可包含四氟乙烯系聚合物及其他成分(上述樹脂材料等)。The present dispersion liquid A may further contain a tetrafluoroethylene-based polymer in addition to the F polymer contained in the present particles. In this case, this dispersion liquid A is also excellent in dispersion stability. The above-mentioned tetrafluoroethylene-based polymer may be the same type of polymer as the above-mentioned F polymer constituting the present particle, or may be a different type of polymer. Among them, PTFE or F polymer is preferable, PFA or FEP is more preferable, and the above-mentioned polymer (1) or polymer (2) is still more preferable. The above-mentioned tetrafluoroethylene-based polymer is preferably in the form of particles, and is preferably dispersed in the present dispersion A. Moreover, the particle|grains of the said tetrafluoroethylene type polymer may contain only a tetrafluoroethylene type polymer, and may contain a tetrafluoroethylene type polymer and other components (the said resin material etc.).

本分散液A可除本粒子中所含之無機粒子以外另外進而包含無機粒子。作為無機粒子,可列舉與上述可構成本粒子之無機物粒子同類者。無機粒子可使用一種,亦可混合兩種以上而使用。於本分散液A進而含有無機粒子之情形時,其含量相對於本分散液A整體較佳為1~50質量%之範圍,更佳為5~30質量%。又,本分散液A中之無機粒子之含量相對於本粒子之含量之以質量計之比(質量比)較佳為0.01~2,更佳為0.1~1。The present dispersion liquid A may further contain inorganic particles in addition to the inorganic particles contained in the present particles. Examples of the inorganic particles include those similar to the above-mentioned inorganic particles that can constitute the present particle. One type of inorganic particles may be used, or two or more types may be mixed and used. When the present dispersion liquid A further contains inorganic particles, the content thereof is preferably in the range of 1 to 50 mass % with respect to the present dispersion liquid A as a whole, and more preferably 5 to 30 mass %. Moreover, the ratio by mass (mass ratio) of the content of the inorganic particles in the present dispersion A with respect to the content of the present particles is preferably 0.01-2, more preferably 0.1-1.

本分散液A除包含上述成分以外,還可在無損本發明之效果之範圍內進而包含觸變性賦予劑、黏度調節劑、消泡劑、矽烷偶合劑、脫水劑、塑化劑、耐候劑、抗氧化劑、熱穩定劑、潤滑劑、抗靜電劑、增白劑、著色劑、導電劑、脫模劑、表面處理劑、阻燃劑、各種填料等其他成分。In addition to the above components, the dispersion liquid A may further contain a thixotropy imparting agent, a viscosity modifier, an antifoaming agent, a silane coupling agent, a dehydrating agent, a plasticizer, a weathering agent, a Antioxidants, heat stabilizers, lubricants, antistatic agents, brighteners, colorants, conductive agents, mold release agents, surface treatment agents, flame retardants, various fillers and other ingredients.

可將本粒子、芳香族聚合物、液狀分散介質、及視需要而定之上述界面活性劑等其他成分加以混合並進行攪拌而製備本分散液A。攪拌時,可應用上述濕式法中所列舉之攪拌裝置、及與剪切處理所使用之方法相同之方法。 本分散液A中之本粒子之含量較佳為相對於本分散液A之整體質量為20質量%以上,更佳為40~80質量%。並且,相對於本分散液A之整體質量,F聚合物之含量較佳為10質量%以上。 又,本粒子中之F粒子與無機物之質量比較佳為,當將F粒子之質量設為1時,無機物之質量為0.01~2.0。要想能夠由本分散液A適當地形成層狀等成形物,本分散液A較佳為包含20~40質量%之F粒子、5~40質量%之無機物、0.1~30質量%之芳香族聚合物。The present dispersion liquid A can be prepared by mixing and stirring other components such as the present particles, an aromatic polymer, a liquid dispersion medium, and optionally the above-mentioned surfactant. When stirring, the stirring apparatus mentioned in the said wet method, and the method similar to the method used for shearing treatment can be applied. The content of the particles in the dispersion A is preferably 20% by mass or more, more preferably 40 to 80% by mass, with respect to the entire mass of the dispersion A. In addition, the content of the F polymer is preferably 10% by mass or more with respect to the entire mass of the present dispersion A. In addition, it is preferable that the mass of the F particles in the present particle is compared with the inorganic substance, and when the mass of the F particle is set to 1, the mass of the inorganic substance is 0.01 to 2.0. In order to be able to appropriately form a molded product such as a layer from the dispersion liquid A, the dispersion liquid A preferably contains 20 to 40 mass % of F particles, 5 to 40 mass % of an inorganic substance, and 0.1 to 30 mass % of an aromatic polymer. thing.

本分散液A在25℃下之黏度為1000~100000 mPa・s。本分散液A在25℃下之黏度較佳為5000 mPa・s以上,更佳為10000 mPa・s以上。本分散液A在25℃下之黏度較佳為100000 mPa・s以下,更佳為50000 mPa・s以下,進而較佳為20000 mPa・s以下。於該情形時,本分散液A之塗佈性優異,容易形成具有任意厚度之成形物(聚合物層等)。 又,關於具有該範圍之黏度、尤其是高黏度之本分散液A,在由其形成之成形物中,無機物不易凝聚而容易均勻地分佈,因此容易更高度地表現出F聚合物與無機物各自之物性。The viscosity of this dispersion A at 25℃ is 1000~100000 mPa·s. The viscosity of the dispersion liquid A at 25°C is preferably 5000 mPa·s or more, more preferably 10000 mPa·s or more. The viscosity of the dispersion liquid A at 25°C is preferably 100,000 mPa·s or less, more preferably 50,000 mPa·s or less, and still more preferably 20,000 mPa·s or less. In this case, this dispersion liquid A is excellent in coatability, and it becomes easy to form the molded object (polymer layer etc.) which has an arbitrary thickness. In addition, with regard to the present dispersion liquid A having a viscosity in this range, especially a high viscosity, in the formed product formed from the dispersion liquid A, the inorganic substances are not easily aggregated and are easily uniformly distributed, so that the F polymer and the inorganic substances are more likely to be expressed at a higher level. materiality.

本分散液A之觸變比較佳為1.0以上。本分散液A之觸變比較佳為3.0以下,更佳為2.0以下。於該情形時,本分散液A之塗佈性及均質性優異,容易形成更緻密之成形物(聚合物層等)。 本分散液A容易調整為上述範圍黏度或觸變性,操作性優異。The thixotropy ratio of the dispersion liquid A is preferably 1.0 or more. The thixotropy ratio of the dispersion liquid A is preferably 3.0 or less, more preferably 2.0 or less. In this case, the present dispersion liquid A is excellent in coatability and homogeneity, and it is easy to form a denser molded product (polymer layer, etc.). This dispersion liquid A is easy to adjust to the viscosity and thixotropy in the above-mentioned range, and is excellent in workability.

本分散液A較佳為成分沈澱率為60%以上,較佳為70%以上,更佳為80%以上。此處,所謂成分沈澱率係指藉由以下方式而算出之值,即,將本分散液A(18 mL)放入至螺旋管(內容積:30 mL)內,並於25℃下靜置14天時,自靜置後之螺旋管中之分散液整體之高度與沈澱層(分散層)之高度根據以下式進行計算。再者,於靜置後未確認到沈澱層,狀態無變化之情形時,視為分散液整體之高度無變化,將成分沈澱率設為100%。 成分沈澱率(%)=(沈澱層之高度)/(分散液整體之高度)×100In the present dispersion liquid A, the precipitation ratio of the components is preferably 60% or more, preferably 70% or more, and more preferably 80% or more. Here, the component precipitation rate refers to a value calculated by putting this dispersion liquid A (18 mL) in a spiral tube (internal volume: 30 mL), and leaving it to stand at 25°C At the time of 14 days, the height of the whole dispersion liquid in the spiral tube after standing and the height of the precipitation layer (dispersion layer) were calculated according to the following formula. In addition, when a precipitation layer was not confirmed after standing still, and the state did not change, it was considered that the height of the whole dispersion liquid did not change, and the component precipitation rate was set to 100%. Component precipitation rate (%) = (height of the precipitation layer) / (height of the entire dispersion) × 100

使本分散液A與基材層之表面接觸,進行加熱而形成聚合物層,從而獲得具有基材層及聚合物層之積層體。更具體而言,若使本分散液A與基材層之表面接觸,形成液狀覆膜,對該液狀覆膜進行加熱以去除分散介質而形成乾燥覆膜,進而對乾燥覆膜進行加熱來焙燒F聚合物,則可獲得下述積層體,該積層體於基材層之表面具有包含F聚合物及無機物之聚合物層(以下亦記為「F層」)、較佳為包含F聚合物及二氧化矽之聚合物層。 液狀覆膜之加熱時之溫度較佳為120℃至200℃。另一方面,乾燥覆膜之加熱時之溫度較佳為250℃至400℃,更佳為300至380℃。 作為各個加熱之方法,可列舉:使用烘箱之方法、使用通風乾燥爐之方法、照射紅外線等熱線之方法。This dispersion liquid A is brought into contact with the surface of the base material layer, and heated to form a polymer layer, thereby obtaining a laminate having a base material layer and a polymer layer. More specifically, when the dispersion liquid A is brought into contact with the surface of the base material layer to form a liquid coating, the liquid coating is heated to remove the dispersion medium to form a dry coating, and the dry coating is further heated. By calcining the F polymer, the following layered product can be obtained. The layered product has a polymer layer (hereinafter also referred to as "F layer") containing the F polymer and an inorganic substance on the surface of the base material layer, preferably containing F Polymer layer of polymer and silica. The temperature at the time of heating the liquid coating film is preferably 120°C to 200°C. On the other hand, the temperature at the time of heating to dry the film is preferably 250 to 400°C, more preferably 300 to 380°C. As each heating method, a method of using an oven, a method of using a ventilation drying furnace, and a method of irradiating heat rays such as infrared rays can be mentioned.

作為基材層,可列舉:銅、鎳、鋁、鈦、其等之合金等金屬箔等金屬基板;聚醯亞胺、聚芳酯、聚碸、聚芳碸、聚醯胺、聚醚醯胺、聚苯硫醚、聚芳醚酮、聚醯胺醯亞胺、液晶聚酯、液晶聚酯醯胺等耐熱性樹脂之膜;預浸體(纖維強化樹脂基板之前驅物)、碳化矽、氮化鋁、氮化矽等陶瓷基板、玻璃基板。 基材層之表面之十點平均粗糙度較佳為0.01~0.05 μm。 本分散液A之接觸較佳為藉由塗佈、液滴噴出、浸漬來進行,較佳為藉由塗佈來進行。 作為塗佈方法,可列舉:噴霧法、輥式塗佈法、旋轉塗佈法、凹版塗佈法、微凹版塗佈法、凹版膠版法、刮塗法、接觸塗佈法、棒式塗佈法、模嘴塗佈法、噴注麥勒棒法、狹縫式模嘴塗佈法。Examples of the base material layer include metal substrates such as metal foils such as copper, nickel, aluminum, titanium, and alloys thereof; polyimide, polyarylate, polyamide, polyarylene, polyamide, and polyether amide. Films of heat-resistant resins such as amine, polyphenylene sulfide, polyaryletherketone, polyamide imide, liquid crystal polyester, and liquid crystal polyester imide; prepreg (precursor of fiber-reinforced resin substrate), silicon carbide , aluminum nitride, silicon nitride and other ceramic substrates, glass substrates. The ten-point average roughness of the surface of the base material layer is preferably 0.01 to 0.05 μm. The contact of the dispersion liquid A is preferably performed by coating, droplet discharge, and immersion, and is preferably performed by coating. Examples of coating methods include spray coating, roll coating, spin coating, gravure coating, microgravure coating, gravure offset coating, blade coating, contact coating, and bar coating. method, die nozzle coating method, injection Meeller rod method, slot die nozzle coating method.

於使液狀覆膜乾燥時,以使分散介質揮發之溫度對液狀覆膜進行加熱,而於片狀基材之表面形成乾燥覆膜。該加熱之溫度較佳為分散介質之沸點+50℃以下,更佳為分散介質之沸點以下,進而較佳為分散介質之沸點-50℃以下之溫度。乾燥時之溫度較佳為120℃~200℃。再者,可於去除分散介質之步驟中吹送空氣。 乾燥時,分散介質無需完全揮發,只要揮發至保持後之層形狀穩定,可維持自支撐膜之程度即可。 於F聚合物之焙燒時,較佳為以F聚合物之熔融溫度以上之溫度對乾燥覆膜進行加熱。該加熱之溫度較佳為380℃以下,更佳為350℃以下。 作為各個加熱之方法,可列舉:使用烘箱之方法、使用通風乾燥爐之方法、照射紅外線等熱線之方法。加熱可於常壓下及減壓下之任一狀態下進行。又,加熱氛圍可為氧化性氣體氛圍(氧氣等)、還原性氣體氛圍(氫氣等)、惰性氣體氛圍(氦氣、氖氣、氬氣、氮氣等)之任一者。 加熱時間較佳為0.1~30分鐘,更佳為0.5~20分鐘。 若在如上所述之條件下進行加熱,則可在維持較高之生產性之同時適當地形成F層。When drying the liquid coating, the liquid coating is heated at a temperature at which the dispersion medium is volatilized to form a dry coating on the surface of the sheet-like substrate. The heating temperature is preferably the boiling point of the dispersion medium +50°C or lower, more preferably the boiling point of the dispersion medium or lower, and still more preferably the boiling point of the dispersion medium -50°C or lower. The temperature during drying is preferably 120°C to 200°C. Furthermore, air may be blown in the step of removing the dispersion medium. When drying, the dispersion medium does not need to be completely volatilized, as long as it is volatilized to the extent that the shape of the layer is stable and the self-supporting film can be maintained. When the F polymer is calcined, the dry film is preferably heated at a temperature higher than the melting temperature of the F polymer. The heating temperature is preferably 380°C or lower, more preferably 350°C or lower. As each heating method, a method of using an oven, a method of using a ventilation drying furnace, and a method of irradiating heat rays such as infrared rays can be mentioned. Heating can be carried out under either normal pressure or reduced pressure. Moreover, the heating atmosphere may be any of an oxidizing gas atmosphere (oxygen, etc.), a reducing gas atmosphere (hydrogen, etc.), and an inert gas atmosphere (helium, neon, argon, nitrogen, etc.). The heating time is preferably 0.1 to 30 minutes, more preferably 0.5 to 20 minutes. If the heating is performed under the above conditions, the F layer can be appropriately formed while maintaining high productivity.

F層之厚度較佳為0.1~150 μm。具體而言,於基材層為金屬箔之情形時,F層之厚度較佳為1~30 μm。於基材層為耐熱性樹脂膜之情形時,F層之厚度較佳為1~150 μm,更佳為10~50 μm。 F層與基材層之剝離強度較佳為10 N/cm以上,更佳為15 N/cm以上。上述剝離強度較佳為100 N/cm以下。若使用本分散液A,則可無損F層中之F聚合物之物性而容易地形成上述本積層體。The thickness of the F layer is preferably 0.1-150 μm. Specifically, when the base material layer is a metal foil, the thickness of the F layer is preferably 1 to 30 μm. When the base material layer is a heat-resistant resin film, the thickness of the F layer is preferably 1 to 150 μm, more preferably 10 to 50 μm. The peel strength between the F layer and the base material layer is preferably 10 N/cm or more, more preferably 15 N/cm or more. The above-mentioned peel strength is preferably 100 N/cm or less. When the present dispersion liquid A is used, the above-mentioned present layered body can be easily formed without sacrificing the physical properties of the F polymer in the F layer.

本分散液A可僅與基材層之一表面接觸,亦可與基材層之兩面接觸。於前者之情形時,可獲得具有基材層且在基材層之一表面具有F層之積層體,於後者之情形時,可獲得具有基材層且在基材層之兩表面具有F層之積層體。後者之積層體更不易發生翹曲,因此其加工時之操作性優異。 作為上述積層體之具體例,可列舉:具有金屬箔且在該金屬箔之至少一表面具有F層之金屬箔積層體、具有聚醯亞胺膜且在該聚醯亞胺膜之兩表面具有F層之多層膜。The dispersion liquid A may be in contact with only one surface of the substrate layer, or may be in contact with both surfaces of the substrate layer. In the former case, a laminate having a base material layer and an F layer on one surface of the base material layer can be obtained, and in the latter case, a base material layer and an F layer on both surfaces of the base material layer can be obtained. layered body. The latter laminate is less likely to be warped, and thus is excellent in workability during processing. Specific examples of the above-mentioned laminate include a metal foil laminate having a metal foil and having an F layer on at least one surface of the metal foil, and a polyimide film having a polyimide film on both surfaces of the polyimide film. Multilayer film of layer F.

再者,關於金屬箔,可使用包含2層以上金屬箔之附帶載體之金屬箔。作為附帶載體之金屬箔,可列舉下述附帶載體之銅箔,其包含厚度10~35 μm之載體銅箔、及經由剝離層而積層於載體銅箔上之厚度2~5 μm之極薄銅箔。若使用該附帶載體之銅箔,則可藉由MSAP(改良型半加成法)工藝來形成精細圖案。作為上述剝離層,較佳為包含鎳或鉻之金屬層、或者積層有該金屬層之多層金屬層。 作為附帶載體之金屬箔之具體例,可列舉福田金屬箔粉工業股份有限公司製造之商品名「FUTF-5DAF-2」。In addition, as a metal foil, the metal foil with a carrier which consists of two or more layers of metal foils can be used. Examples of the metal foil with a carrier include the following copper foil with a carrier, which includes a carrier copper foil with a thickness of 10 to 35 μm and an ultra-thin copper with a thickness of 2 to 5 μm laminated on the carrier copper foil through a peeling layer. foil. If the copper foil with the carrier is used, a fine pattern can be formed by the MSAP (modified semi-additive method) process. The peeling layer is preferably a metal layer containing nickel or chromium, or a multi-layer metal layer in which the metal layer is laminated. As a specific example of the metal foil with a carrier, the trade name "FUTF-5DAF-2" by Futian Metal Foil Powder Industry Co., Ltd. can be mentioned.

對於上述積層體之最表面,為了進一步提高其低線膨脹性或接著性,可進而進行表面處理。其中,積層體之最表面係指與基材相反之側之F層之表面。 作為表面處理之方法,可列舉:電暈處理、電漿處理、臭氧處理、準分子處理、矽烷偶合處理。 作為電漿處理中所使用之氣體,可列舉:氧氣、氮氣、氬氣等稀有氣體、氫氣、氨氣、乙酸乙烯酯。該等氣體可使用一種,亦可併用兩種以上。 對於上述積層體,為了進一步提高其低線膨脹係數,可進而進行退火處理。退火處理中之條件較佳為,將溫度設為120~180℃,將壓力設為0.005~0.015 MPa,將時間設為30~120分鐘。The outermost surface of the above-mentioned layered product may be further subjected to surface treatment in order to further improve the low linear expansion property or the adhesiveness. Here, the outermost surface of the laminate refers to the surface of the F layer on the side opposite to the base material. As a method of surface treatment, corona treatment, plasma treatment, ozone treatment, excimer treatment, and silane coupling treatment can be mentioned. As a gas used for plasma processing, rare gases, such as oxygen, nitrogen, and argon, hydrogen, ammonia, and vinyl acetate are mentioned. These gases may be used alone or in combination of two or more. In order to further improve the low linear expansion coefficient of the above-mentioned laminated body, annealing treatment may be further performed. The conditions in the annealing treatment are preferably 120 to 180° C. for temperature, 0.005 to 0.015 MPa for pressure, and 30 to 120 minutes for time.

於積層體之最表面可進而積層其他基板。 作為其他基板,可列舉:耐熱性樹脂膜、作為纖維強化樹脂板之前驅物之預浸體、具有耐熱性樹脂膜層之積層體、具有預浸體層之積層體。 再者,預浸體係使熱固性樹脂或熱塑性樹脂含浸於玻璃纖維或碳纖維等強化纖維之絲束或織布等基材中而獲得之片狀基板。 耐熱性樹脂膜係包含一種以上耐熱性樹脂之膜,作為耐熱性樹脂,可列舉上述樹脂,尤佳為芳香族聚醯亞胺。Other substrates can be further laminated on the outermost surface of the laminated body. Examples of other substrates include a heat-resistant resin film, a prepreg as a precursor of a fiber-reinforced resin sheet, a laminate having a heat-resistant resin film layer, and a laminate having a prepreg layer. Furthermore, the prepreg system is a sheet-like substrate obtained by impregnating a thermosetting resin or a thermoplastic resin into a base material such as tow of reinforcing fibers such as glass fiber or carbon fiber, or a woven cloth. The heat-resistant resin film is a film containing one or more types of heat-resistant resins. Examples of the heat-resistant resin include the above-mentioned resins, and aromatic polyimide is particularly preferred.

作為積層方法,可列舉對積層體與其他基板進行熱壓之方法。 其他基板為預浸體時之熱壓之條件較佳為,將溫度設為120~400℃,將氛圍之壓力設為20 kPa以下之真空,將加壓壓力設為0.2~10 MPa。上述積層體具有電特性優異之F層,因此適宜作為印刷基板材料。具體而言,上述積層體可用於作為撓性金屬箔積層板或剛性金屬箔積層板來製造印刷基板,尤其適宜用於作為撓性金屬箔積層板來製造撓性印刷基板。As a lamination method, the method of heat-pressing a laminated body and another board|substrate is mentioned. When the other substrates are prepregs, the conditions of the hot pressing are preferably set to the temperature of 120 to 400°C, the pressure of the atmosphere to a vacuum of 20 kPa or less, and the pressing pressure to be 0.2 to 10 MPa. The above-mentioned laminate has an F layer excellent in electrical properties, and thus is suitable as a printed circuit board material. Specifically, the above-mentioned laminate can be used as a flexible metal foil laminate or a rigid metal foil laminate to produce a printed circuit board, and is particularly suitable for use as a flexible metal foil laminate to produce a flexible printed circuit board.

對基材層為金屬箔之附帶F層之金屬箔那樣的積層體之金屬箔進行蝕刻加工,形成傳輸電路而獲得印刷基板。具體而言,可藉由以下方法來製造印刷基板:對金屬箔進行蝕刻處理而加工成特定之傳輸電路之方法;或者藉由半加成法(SAP法)、MSAP法等電鍍法將金屬箔加工成特定之傳輸電路之方法。 由附帶F層之金屬箔製造而成之印刷基板依序具有由金屬箔形成之傳輸電路與F層。作為印刷基板之構成之具體例,可列舉:傳輸電路/F層/預浸體層、傳輸電路/F層/預浸體層/F層/傳輸電路。 於製造該印刷基板時,可於傳輸電路上形成層間絕緣膜,亦可於傳輸電路上積層阻焊劑,亦可於傳輸電路上積層覆蓋膜。可利用本分散液A來形成該等層間絕緣膜、阻焊劑及覆蓋膜。The metal foil of the laminated body such as the metal foil with the F layer in which the base material layer is a metal foil is etched, a transmission circuit is formed, and a printed circuit board is obtained. Specifically, the printed circuit board can be produced by the following methods: a method of etching a metal foil to process it into a specific transmission circuit; or by a semi-additive method (SAP method), an electroplating method such as MSAP method, etc. A method of processing into a specific transmission circuit. The printed circuit board made of the metal foil with the F layer has the transmission circuit formed of the metal foil and the F layer in this order. As a specific example of the structure of a printed circuit board, a transfer circuit/F layer/prepreg layer, a transfer circuit/F layer/prepreg layer/F layer/transfer circuit are mentioned. When manufacturing the printed circuit board, an interlayer insulating film may be formed on the transmission circuit, a solder resist may be laminated on the transmission circuit, and a cover film may be laminated on the transmission circuit. These interlayer insulating films, solder resists, and cover films can be formed using this dispersion liquid A.

F層與其他基材之積層體可用作天線零件、印刷基板、航空器用零件、汽車用零件、運動用具、食品工業用品、塗料、化妝品等,具體而言,可用作:電線被覆材(航空器用電線等)、電絕緣性膠帶、石油鑽探用絕緣膠帶、印刷基板用材料、分離膜(微濾膜、超濾膜、逆滲透膜、離子交換膜、透析膜、氣體分離膜等)、電極黏合劑(鋰二次電池用、燃料電池用等)、複製輥、傢俱、汽車儀錶板、家電製品等之外罩、滑動構件(負載軸承、滑動軸、閥、軸承、齒輪、凸輪、帶式輸送機、食品搬送用帶等)、工具(鏟、銼、錐子、鋸等)、鍋爐、漏斗、管道管、烘箱、烤模、滑槽、眼模、馬桶、容器被覆材。The laminate of the F layer and other substrates can be used as antenna parts, printed circuit boards, aircraft parts, automotive parts, sports equipment, food industry supplies, coatings, cosmetics, etc. Specifically, it can be used as a wire covering material ( Aircraft wires, etc.), electrical insulating tapes, insulating tapes for oil drilling, materials for printed circuit boards, separation membranes (microfiltration membranes, ultrafiltration membranes, reverse osmosis membranes, ion exchange membranes, dialysis membranes, gas separation membranes, etc.), Electrode binders (for lithium secondary batteries, fuel cells, etc.), replica rolls, furniture, car dashboards, home appliances, etc. covers, sliding members (load bearings, sliding shafts, valves, bearings, gears, cams, belts) Conveyors, food conveying belts, etc.), tools (shovels, files, awls, saws, etc.), boilers, funnels, pipes, ovens, baking molds, chutes, eye molds, toilets, container coverings.

本發明之第2種分散液係以下分散液(以下亦記為「本分散液B」),其包含本粒子及液狀分散介質,且本粒子分散於上述液狀分散介質中,上述液狀分散介質包含沸點不同之兩種液狀分散介質,且上述兩種液狀分散介質處於生成共沸混合物之關係。The second dispersion liquid of the present invention is the following dispersion liquid (hereinafter also referred to as "the present dispersion liquid B"), which comprises the present particles and a liquid dispersion medium, and the present particles are dispersed in the above-mentioned liquid dispersion medium, and the above-mentioned liquid dispersion medium The dispersion medium includes two liquid dispersion media having different boiling points, and the two liquid dispersion media are in a relationship of forming an azeotrope.

本分散液B之分散穩定性優異。又,由本分散液B所獲得之成形物較為緻密,外觀(表面之平坦性及質感)等表面特性優異。關於本分散液B之分散穩定性及所獲得之成形物之外觀提高之原因、以及與本分散液B之構成之相關關係及作用機理,雖不一定明確,但考慮如下。 含有四氟乙烯系聚合物及無機物之複合粒子一般容易吸附或擔載分散介質。因此,將含有複合粒子之分散液賦予至基材表面而形成液狀覆膜後,藉由加熱等方法來去除分散介質時揮發或蒸發需要時間,容易導致成形物之生產效率及精度降低。另一方面,於由分散液製造成形物時,即便構成分散液之分散介質為很容易揮發或蒸發之性狀,複合粒子亦不會充分地堆積,而容易導致所獲得之成形物之表面平滑性降低。 本分散液B包含沸點不同且處於生成共沸混合物之關係之兩種液狀分散介質作為分散介質,故認為能夠以適當之蒸發速度使分散介質揮發。又,高沸點之液狀分散介質會慢慢地揮發或蒸發,因此本粒子會緊密地堆積,又,可抑制因氣泡之急遽產生等導致之表面粗糙,從而認為可改善所獲得之成形物之外觀。The dispersion stability of this dispersion liquid B was excellent. In addition, the molded article obtained from the present dispersion B is relatively dense, and has excellent surface properties such as appearance (surface flatness and texture). The reasons for the improvement of the dispersion stability of the dispersion liquid B and the appearance of the obtained molded product, and the correlation and action mechanism with the constitution of the dispersion liquid B are not necessarily clear, but are considered as follows. Composite particles containing tetrafluoroethylene-based polymers and inorganic substances are generally easy to adsorb or support a dispersion medium. Therefore, after the dispersion liquid containing the composite particles is applied to the surface of the substrate to form a liquid coating, it takes time for volatilization or evaporation when the dispersion medium is removed by heating or the like, which tends to reduce the production efficiency and accuracy of the molded product. On the other hand, when a molded article is produced from a dispersion liquid, even if the dispersion medium constituting the dispersion liquid is easily volatilized or evaporated, the composite particles are not sufficiently accumulated, and the surface smoothness of the obtained molded article is easily caused. reduce. This dispersion liquid B contains two kinds of liquid dispersion media which have different boiling points and are in a relationship of forming an azeotrope as a dispersion medium, so it is considered that the dispersion medium can be volatilized at an appropriate evaporation rate. In addition, since the high-boiling liquid dispersion medium gradually volatilizes or evaporates, the particles are densely packed, and the surface roughness due to the rapid generation of air bubbles can be suppressed, thereby improving the quality of the obtained molded product. Exterior.

又,本粒子包含F聚合物及無機粒子。F聚合物雖表面能量較低且分散穩定性較低,但F聚合物與無機物結合而成之本粒子相較於F聚合物,容易與其他本粒子及液狀分散介質發生相互作用,從而認為分散穩定性優異。 結果,認為由本分散液B可形成下述成形物,該成形物高度具備F聚合物之物性及無機物之物性,成分均勻性較高,較為緻密,且電特性及外觀等優異。Moreover, this particle contains F polymer and an inorganic particle. Although the surface energy of the F polymer is lower and the dispersion stability is lower, the original particles formed by the combination of the F polymer and the inorganic matter are more likely to interact with other original particles and the liquid dispersion medium than the F polymer, so it is considered that Excellent dispersion stability. As a result, it is considered that the present dispersion B can form a molded article having high physical properties of the F polymer and inorganic properties, high component uniformity, relatively dense, and excellent electrical properties and appearance.

關於本分散液B中之F聚合物、本粒子之詳細內容,與上文本分散液A之說明中所述之內容相同。The details of the polymer F and the particles in the dispersion B are the same as those described in the description of the dispersion A above.

又,本分散液B中,構成本粒子之F粒子亦可包含芳香族聚酯、聚醯胺醯亞胺、熱塑性聚醯亞胺、聚苯醚(polyphenylene ether)、聚氧二甲苯(polyphenylene oxide)等除F聚合物以外之樹脂,但較佳為以F聚合物作為主成分。F粒子中之F聚合物之含量較佳為80質量%以上,更佳為100質量%。In addition, in the present dispersion B, the F particles constituting the present particles may also contain aromatic polyester, polyimide imide, thermoplastic polyimide, polyphenylene ether, polyphenylene oxide ) and the like other than the F polymer, but preferably the F polymer as the main component. The content of the F polymer in the F particles is preferably 80% by mass or more, more preferably 100% by mass.

本粒子即便大量地添加至液狀分散介質中亦可穩定地分散,由該本分散液B形成之成形物(聚合物層、膜等)中,F聚合物與無機物更均勻地分佈,而容易高度地表現出F聚合物之物性(電特性、接著性等)及無機物之物性(低線膨脹性等)。The present particles can be stably dispersed even when a large amount is added to the liquid dispersion medium, and in the molded article (polymer layer, film, etc.) formed from the present dispersion liquid B, the F polymer and the inorganic matter are more uniformly distributed, and it is easy to The physical properties of F polymers (electrical properties, adhesion, etc.) and the properties of inorganic substances (low linear expansion, etc.) are highly expressed.

本分散液B包含沸點不同之兩種液狀分散介質。並且,上述兩種液狀分散介質處於生成共沸混合物之關係。此處,「共沸混合物」係氣相與液相之組成相同之混合物。 共沸混合物根據兩種液狀分散介質之選擇,可能會獲得均勻或不均勻之任一態樣。就由本分散液B獲得成形物之過程中生產性及步驟通過性變得良好之觀點而言,較佳為均勻之共沸混合物。The present dispersion B contains two liquid dispersion media having different boiling points. In addition, the above-mentioned two liquid dispersion media are in a relationship to form an azeotrope. Here, an "azeotrope" is a mixture in which the composition of the gas phase and the liquid phase are the same. The azeotrope may be either homogeneous or heterogeneous depending on the choice of the two liquid dispersion media. A uniform azeotropic mixture is preferable from the viewpoint of improving productivity and step-throughability in the process of obtaining a molded product from the present dispersion B.

於本分散液B中,較佳為上述沸點不同之兩種液狀分散介質中之高沸點分散介質之混合量比多於上述兩種液狀分散介質之共沸混合物中之高沸點分散介質之組成比(質量比)。 共沸混合物之組成比根據兩種液狀分散介質之選擇,可能會廣泛地變化。具體而言,將低沸點之液狀分散介質設為分散介質S1,將高沸點之液狀分散介質設為分散介質S2時,較佳為本分散液B中之S1相對於S2之組成比(質量比)多於S1與S2之共沸混合物中之S1相對於S2之組成比(質量比)。 又,共沸混合物之共沸點較佳為低於上述兩種液狀分散介質中高沸點分散介質之沸點,更佳為共沸點低於上述兩種液狀分散介質之任一者之沸點。 若為此種混合量比及共沸點,則於由本分散液B製造成形物時之乾燥過程中,即便是沸點較高之分散介質,亦能夠以更低之低溫以共沸混合物形式容易地去除,因此容易實現生產性之提高與成形物之外觀改善之兼顧。且,認為所殘留之高沸點液狀分散介質於去除液狀分散介質之過程中亦如潤滑劑般發揮作用,促進本粒子之堆積,而輔助形成表面粗糙較少之均勻之成形物。In this dispersion liquid B, it is preferable that the mixing ratio of the high-boiling point dispersion medium in the above-mentioned two liquid dispersion media with different boiling points is greater than that of the high-boiling point dispersion medium in the azeotrope of the above-mentioned two liquid dispersion mediums. Composition ratio (mass ratio). The compositional ratio of the azeotrope may vary widely depending on the choice of the two liquid dispersion media. Specifically, when the liquid dispersion medium with a low boiling point is used as the dispersion medium S1, and the liquid dispersion medium with a high boiling point is used as the dispersion medium S2, the composition ratio of S1 to S2 in the dispersion liquid B is preferably ( mass ratio) than the composition ratio (mass ratio) of S1 to S2 in the azeotrope of S1 and S2. Further, the azeotrope of the azeotropic mixture is preferably lower than the boiling point of the high-boiling point dispersion medium among the above-mentioned two liquid dispersion media, more preferably, the azeotrope point is lower than the boiling point of either of the above-mentioned two liquid dispersion media. With such a mixing ratio and azeotrope, even a dispersion medium having a relatively high boiling point can be easily removed as an azeotrope at a lower low temperature during the drying process when a molded product is produced from the present dispersion B. Therefore, it is easy to achieve both the improvement of productivity and the improvement of the appearance of the molded product. In addition, it is considered that the remaining high-boiling liquid dispersion medium also acts as a lubricant in the process of removing the liquid dispersion medium, promoting the accumulation of the particles, and assisting in the formation of a uniform molded product with less surface roughness.

上述兩種液狀分散介質均較佳為在大氣壓、25℃下為液體之化合物,可為極性亦可為非極性。 上述兩種液狀分散介質之沸點均較佳為50~240℃之範圍。又,兩種液狀分散介質之至少一種更佳為水、醇或醯胺。 若使用上述液狀分散介質,則認為可更固定地保持本粒子在本分散液B中之分散狀態。Both of the above two liquid dispersion media are preferably compounds that are liquid at atmospheric pressure and 25°C, and may be polar or non-polar. Both of the above-mentioned two liquid dispersion media preferably have a boiling point in the range of 50 to 240°C. Furthermore, at least one of the two liquid dispersion media is more preferably water, alcohol or amide. When the above-mentioned liquid dispersion medium is used, it is considered that the dispersed state of the present particles in the present dispersion liquid B can be maintained more stably.

作為液狀分散介質,可列舉:水[沸點:100℃(大氣壓下之沸點,以下無特別記載時同樣如此)]、乙二醇(沸點:197℃)、N,N-二甲基甲醯胺(沸點:153℃)、N,N-二甲基乙醯胺(沸點:165℃)、3-甲氧基-N,N-二甲基丙醯胺(沸點:215℃)、3-丁氧基-N,N-二甲基丙醯胺(沸點:252℃)、N-甲基-2-吡咯啶酮(沸點:204℃)、γ-丁內酯(沸點:204℃)、環己酮(沸點:156℃)、環戊酮(沸點:131℃)、乙酸丁酯(沸點:126℃)、甲基異丁基酮(沸點:118℃)、甲基乙基酮(沸點:79.6℃)、甲苯(沸點:111℃)。 其中,作為對於本分散液B而言適宜,處於生成共沸混合物之關係且沸點不同之兩種液狀分散介質之組合,可列舉水與甲基乙基酮、水與環己酮、乙二醇與甲苯、甲苯與N,N-二甲基甲醯胺。再者,於本說明書中,將甲苯與N,N-二甲基甲醯胺之組合視為共沸點為59.9~109.9℃之共沸混合物。Examples of the liquid dispersion medium include water [boiling point: 100°C (boiling point at atmospheric pressure, the same applies when there is no particular description below)], ethylene glycol (boiling point: 197°C), N,N-dimethylformamide Amine (boiling point: 153°C), N,N-dimethylacetamide (boiling point: 165°C), 3-methoxy-N,N-dimethylpropionamide (boiling point: 215°C), 3- Butoxy-N,N-dimethylpropionamide (boiling point: 252°C), N-methyl-2-pyrrolidone (boiling point: 204°C), γ-butyrolactone (boiling point: 204°C), Cyclohexanone (boiling point: 156°C), cyclopentanone (boiling point: 131°C), butyl acetate (boiling point: 126°C), methyl isobutyl ketone (boiling point: 118°C), methyl ethyl ketone (boiling point: 118°C) : 79.6°C), toluene (boiling point: 111°C). Among them, as a combination of two liquid dispersion media suitable for the present dispersion B, which are in the relationship of forming an azeotrope and have different boiling points, water and methyl ethyl ketone, water and cyclohexanone, ethylene di Alcohol and toluene, toluene and N,N-dimethylformamide. In addition, in this specification, the combination of toluene and N,N- dimethylformamide is regarded as an azeotropic mixture whose azeotropic point is 59.9-109.9 degreeC.

本分散液B可於無損本發明之效果之範圍內進而含有與上述兩種液狀分散介質不同之其他液狀分散介質。 此處,其他液狀分散介質可為與上述兩種液狀分散介質之至少一者生成共沸混合物之關係,或者亦可為與上述兩種液狀分散介質共同生成3成分系之共沸混合物之關係,但較佳為不生成任一共沸混合物之關係。 於本分散液B中,液狀分散介質之總含量較佳為30~90質量%,更佳為50~80質量%。The present dispersion liquid B may further contain another liquid dispersion medium different from the above-mentioned two liquid dispersion mediums within the range which does not impair the effect of the present invention. Here, the other liquid dispersion medium may form an azeotrope with at least one of the above-mentioned two liquid dispersion media, or may form a three-component azeotrope together with the above-mentioned two liquid dispersion mediums relationship, but preferably a relationship that does not generate any azeotrope. In the present dispersion liquid B, the total content of the liquid dispersion medium is preferably 30 to 90% by mass, more preferably 50 to 80% by mass.

本分散液B可進而含有界面活性劑,亦可不含有。作為界面活性劑,可列舉與上述本分散液A之說明中所述之界面活性劑相同者。本分散液B較佳為不含氟系界面活性劑。This dispersion liquid B may further contain a surfactant, and may not contain it. As a surfactant, the thing similar to the surfactant mentioned in the description of this dispersion liquid A mentioned above can be mentioned. This dispersion liquid B preferably does not contain a fluorine-based surfactant.

要想提高由本分散液B形成之成形物之接著性及低線膨脹性,本分散液B可除本粒子以外另外進而包含其他樹脂材料。於該情形時,本分散液B亦分散穩定性變得優異。於本分散液B包含其他樹脂材料之情形時,其含量相對於本分散液B整體較佳為40質量%以下。 作為其他樹脂材料,可列舉F聚合物以外之四氟乙烯系聚合物、F聚合物、芳香族聚合物。其他樹脂材料可與本粒子中之F聚合物相同。 作為F聚合物以外之四氟乙烯系聚合物,可列舉:聚四氟乙烯(PTFE)、包含TFE單元及基於乙烯之單元之聚合物、包含TFE單元及基於丙烯之單元之聚合物、包含TFE單元及基於氟烷基乙烯之單元之聚合物、包含TFE單元及基於三氟氯乙烯之單元之聚合物。 F聚合物可為與上述構成本粒子之F聚合物同類之聚合物,亦可為不同類之聚合物。其中,較佳為PTFE或F聚合物,更佳為PFA或FEP,進而較佳為上述聚合物(1)或聚合物(2)。 上述F聚合物較佳為粒子狀,較佳為分散於本分散液B中。又,上述F聚合物之粒子可僅包含F聚合物,亦可包含F聚合物及其他成分(上述樹脂材料等)。In order to improve the adhesiveness and low linear expansion of the molded article formed from the dispersion liquid B, the dispersion liquid B may further contain other resin materials in addition to the particles. In this case, this dispersion liquid B also becomes excellent in dispersion stability. When this dispersion liquid B contains another resin material, its content is preferably 40 mass % or less with respect to the whole of this dispersion liquid B. As other resin materials, tetrafluoroethylene-based polymers other than F polymers, F polymers, and aromatic polymers can be mentioned. Other resin materials can be the same as the F polymer in this particle. Examples of tetrafluoroethylene-based polymers other than the F polymer include polytetrafluoroethylene (PTFE), polymers containing TFE units and ethylene-based units, polymers containing TFE units and propylene-based units, and TFE-containing units Units and polymers based on fluoroalkylethylene units, polymers comprising TFE units and units based on chlorotrifluoroethylene. The F polymer may be the same type of polymer as the above-mentioned F polymer constituting the present particle, or may be a different type of polymer. Among them, PTFE or F polymer is preferable, PFA or FEP is more preferable, and the above-mentioned polymer (1) or polymer (2) is still more preferable. The above-mentioned F polymer is preferably in the form of particles, and is preferably dispersed in the present dispersion liquid B. Moreover, the particle|grains of the said F polymer may contain only the F polymer, and may contain the F polymer and other components (the said resin material etc.).

作為芳香族聚合物,可列舉與可包含在分散液A中之芳香族聚合物相同者,其較佳範圍亦相同。As an aromatic polymer, the thing similar to the aromatic polymer which can be contained in dispersion liquid A is mentioned, and its preferable range is also the same.

本分散液B可除本粒子中所含之無機粒子以外另外進而包含無機粒子。作為無機粒子,可列舉與本分散液A可進而包含之無機粒子相同者,其較佳態樣亦相同。 本分散液B除包含上述成分以外,還可在無損本發明之效果之範圍內進而包含與上述本分散液A之說明中所述之其他成分相同之其他成分。The present dispersion liquid B may further contain inorganic particles in addition to the inorganic particles contained in the present particles. As the inorganic particles, the same inorganic particles as the inorganic particles which can be further contained in the dispersion liquid A can be mentioned, and the preferred aspects thereof are also the same. In addition to the above-mentioned components, the present dispersion liquid B may further contain other components similar to the other components described in the description of the present dispersion liquid A above within a range that does not impair the effects of the present invention.

本分散液B可與本分散液A同樣地進行製備。 關於本分散液B中之本粒子之含量、F聚合物之含量、本粒子中之F粒子與無機物之質量比之較佳之範圍,與本分散液A中之其等之較佳之範圍相同。 本分散液B中之F聚合物之含量較佳為40質量%以上,更佳為50質量%以上。 於本分散液B除本粒子中所含之F聚合物以外另外包含F聚合物作為其他樹脂之情形時,本分散液B中之F聚合物之含量意指本粒子中所含之F聚合物之含量、與作為其他樹脂而包含之F聚合物之含量的和。The present dispersion liquid B can be prepared in the same manner as the present dispersion liquid A. The preferable ranges of the content of the present particles in the present dispersion B, the content of the F polymer, and the mass ratio of the F particles in the present particles to the inorganic matter are the same as those in the present dispersion A. The content of the F polymer in the dispersion liquid B is preferably 40% by mass or more, more preferably 50% by mass or more. When this dispersion liquid B contains F polymer as other resin in addition to the F polymer contained in this particle, the content of F polymer in this dispersion B means the F polymer contained in this particle The sum of the content of F and the content of the F polymer contained as other resins.

本分散液B之黏度、觸變比、成分沈澱率之較佳範圍與本分散液A之黏度、觸變比之較佳範圍相同。The preferred ranges of viscosity, thixotropy ratio and component precipitation ratio of this dispersion B are the same as the preferred ranges of viscosity and thixotropy ratio of this dispersion A.

只要使本分散液B與基材層之表面接觸,進行加熱而形成包含F聚合物及無機物之聚合物層,便可獲得具有基材層及聚合物層之積層體。 關於積層體之製造方法之詳細情況、基材層、使用積層體之印刷基板及多層印刷電路基板之態樣,包括較佳之態樣在內均與上述分散液A之說明中所述之其等相同。When this dispersion liquid B is brought into contact with the surface of the base material layer and heated to form a polymer layer containing the F polymer and an inorganic substance, a laminate having a base material layer and a polymer layer can be obtained. The details of the method for producing the laminate, the substrate layer, the aspect of the printed circuit board using the laminate, and the multilayer printed circuit board, including the preferred aspect, are the same as those described in the description of the above-mentioned dispersion A. same.

再者,於使液狀覆膜乾燥時,以使分散介質揮發之溫度對液狀覆膜進行加熱,於片狀基材之表面形成乾燥覆膜。上述加熱之溫度較佳為本分散液B所含有之兩種分散介質之共沸混合物之共沸點+50℃以下,更佳為該共沸點以下。乾燥時之溫度較佳為120℃~200℃。Furthermore, when drying the liquid coating film, the liquid coating film is heated at a temperature at which the dispersion medium is volatilized to form a dry coating film on the surface of the sheet-like base material. The temperature of the above heating is preferably below the azeotropic point +50°C of the azeotropic mixture of the two dispersion media contained in the dispersion B, more preferably below the azeotropic point. The temperature during drying is preferably 120°C to 200°C.

本發明之複合粒子係下述複合粒子(以下亦記為「本粒子α」),其含有熔融溫度為260~320℃且相對於總單元含有1~5莫耳%之PAVE單元之F聚合物、以及二氧化矽,上述複合粒子之藉由X射線光電子光譜法所測定之表面中之矽原子之量相對於氟原子之量為1以上。The composite particles of the present invention are composite particles (hereinafter also referred to as "the present particles α") containing F polymers having a melting temperature of 260 to 320° C. and 1 to 5 mol% of PAVE units relative to the total units , and silica, wherein the amount of silicon atoms in the surface of the composite particles measured by X-ray photoelectron spectroscopy is 1 or more relative to the amount of fluorine atoms.

本粒子α係可調整極性等物性,且穩定性較高之F聚合物與二氧化矽之複合材料。其作用機理雖並不明確,但考慮如下。 F聚合物不僅耐原纖性等形狀穩定性優異,而且具有在單分子等級下分子運動之制限得到緩和之自由度較高之構形。上述F聚合物在分子集合體等級下容易形成微小球晶,其表面容易產生微小之凹凸結構。因此,認為F聚合物之分子集合體會在無損其形狀之情況下穩定地以物理方式與二氧化矽緊密地附著。又,亦認為緊密地附著之二氧化矽間之相互作用進而促進二氧化矽之附著,從而使複合粒子變得穩定。 結果,認為本粒子α即便含有相對大量之二氧化矽,穩定性亦較高,具備F聚合物之物性及二氧化矽之物性。The particle α is a composite material of F polymer and silicon dioxide, which can adjust the physical properties such as polarity, and has high stability. Although the mechanism of action is not clear, it is considered as follows. The F polymer not only has excellent shape stability such as fibrillation resistance, but also has a configuration with a high degree of freedom in which the restriction of molecular motion at the single-molecule level is relaxed. The above-mentioned F polymer is likely to form microscopic spherulites at the molecular aggregate level, and microscopic concavo-convex structures are likely to be formed on the surface thereof. Therefore, it is considered that the molecular assembly of the F polymer will stably and physically closely adhere to the silica without loss of its shape. In addition, it is also considered that the interaction between the closely adhered silicas promotes the adhesion of the silicas, thereby stabilizing the composite particles. As a result, it is considered that this particle α has high stability even if it contains a relatively large amount of silica, and has the physical properties of the F polymer and the physical properties of silica.

本粒子α中之F聚合物係熔融溫度為260~320℃且相對於總單元包含1~5莫耳%之PAVE單元之TFE系聚合物。作為F聚合物,更佳為上文所述之包含TFE單元及PAVE單元,且具有極性官能基之聚合物(1)。若F聚合物為聚合物(1),則本粒子α中,聚合物(1)與二氧化矽不僅容易以物理方式附著,而且亦容易以化學方式附著,上述作用機理容易得到強化。The F polymer in the present particle α is a TFE-based polymer having a melting temperature of 260 to 320° C. and containing 1 to 5 mol % of PAVE units with respect to the total unit. As the F polymer, the above-mentioned polymer (1) containing a TFE unit and a PAVE unit and having a polar functional group is more preferable. If the F polymer is the polymer (1), in the particle α, the polymer (1) and the silica are easily attached not only physically but also chemically, and the above-mentioned action mechanism is easily strengthened.

本粒子α亦可包含F聚合物以外之其他聚合物。但是,本粒子α中所含之聚合物中F聚合物所占之比率較佳為80質量%以上,更佳為100質量%。 作為F聚合物以外之其他聚合物,可列舉芳香族聚酯、聚醯胺醯亞胺、熱塑性聚醯亞胺、聚苯醚、聚氧二甲苯等耐熱性樹脂。The present particle α may also contain other polymers than the F polymer. However, the ratio of the F polymer in the polymer contained in the particle α is preferably 80% by mass or more, more preferably 100% by mass. Examples of polymers other than the F polymer include heat-resistant resins such as aromatic polyesters, polyimide imide, thermoplastic polyimide, polyphenylene ether, and polyoxyxylene.

本粒子α含有二氧化矽。二氧化矽可使用一種,亦可混合兩種以上使用。又,亦可含有二氧化矽以外之無機物。 於含有二氧化矽以外之其他無機物之情形時,將二氧化矽與其他無機物之合計量設為100質量%,二氧化矽之含量較佳為50質量%以上,更佳為75質量%。二氧化矽之含量較佳為100質量%以下,更佳為90質量%以下。This particle α contains silica. One type of silica may be used, or two or more types may be used in combination. Moreover, inorganic substances other than silica may be contained. In the case of containing other inorganic substances other than silica, the total amount of silica and other inorganic substances is set to 100% by mass, and the content of silica is preferably 50% by mass or more, more preferably 75% by mass. The content of silicon dioxide is preferably 100 mass % or less, more preferably 90 mass % or less.

二氧化矽較佳為其表面之至少一部分進行了表面處理。作為該表面處理所使用之表面處理劑,可列舉與上述無機物之表面處理所使用之表面處理劑相同之化合物,例如可列舉矽烷偶合劑。Silica is preferably surface-treated at least a portion of its surface. As a surface treatment agent used for this surface treatment, the same compound as the surface treatment agent used for the surface treatment of the said inorganic substance is mentioned, for example, a silane coupling agent is mentioned.

二氧化矽之比表面積(BET法)較佳為1~20 m2 /g,更佳為5~8 m2 /g。於該情形時,二氧化矽與F聚合物之相互作用容易得到強化。又,於將含有本粒子α之分散液塗佈於基材而形成聚合物層時,二氧化矽與F聚合物更均勻地分佈,容易平衡兩者之物性。The specific surface area (BET method) of silica is preferably 1-20 m 2 /g, more preferably 5-8 m 2 /g. In this case, the interaction between the silica and the F polymer is easily strengthened. In addition, when the dispersion liquid containing the particles α is applied to the substrate to form the polymer layer, the silica and the F polymer are more uniformly distributed, and it is easy to balance the physical properties of the two.

作為二氧化矽,可列舉:二氧化矽填料(Admatechs公司製造之「Admafine(註冊商標)」系列等)、球狀熔融二氧化矽(DENKA公司製造之「SFP(註冊商標)」系列等)、中空狀二氧化矽填料(太平洋水泥公司製造之「E-SPHERES」系列、日鐵礦業公司製造之「SiliNax」系列、Emerson & Cuming公司製造之「Ecco sphere」系列、日本Aerosil公司製造之疏水性AEROSIL系列「RX200」等)。 又,作為二氧化矽以外之其他無機物,可列舉上文所述之可構成本粒子之無機物。Examples of silica include silica fillers (“Admafine (registered trademark)” series manufactured by Admatechs, etc.), spherical fused silica (“SFP (registered trademark)” series manufactured by DENKA Corporation, etc.), Hollow silica fillers ("E-SPHERES" series manufactured by Pacific Cement Corporation, "SiliNax" series manufactured by Nippon Steel Mining Corporation, "Ecco sphere" series manufactured by Emerson & Cuming Corporation, hydrophobicity manufactured by Japan Aerosil Corporation AEROSIL series "RX200" etc.). Moreover, as another inorganic substance other than silica, the inorganic substance which can comprise this particle mentioned above is mentioned.

二氧化矽之形狀較佳為粒狀,更佳為球狀、針狀(纖維狀)或板(柱)狀。作為二氧化矽之具體形狀,可列舉:球狀、鱗片狀、層狀、葉片狀、杏仁狀、柱狀、雞冠狀、等軸狀、葉狀、雲母狀、塊狀、平板狀、楔狀、玫瑰花狀、網狀、角柱狀,較佳為球狀。若使用球狀二氧化矽,則於將含有本粒子α之分散液塗佈於基材而形成聚合物層時,二氧化矽與F聚合物更均勻地分佈,而容易提高其功能。 球狀之二氧化矽較佳為大致真球狀。大致真球狀如上所述。The shape of silica is preferably granular, more preferably spherical, needle-like (fibrous) or plate (column). Specific shapes of silica include spherical, scale-like, lamellar, leaf-like, almond-like, columnar, cockscomb, equiaxed, leaf-like, mica-like, massive, flat, wedge-like shape, rosette shape, net shape, angular column shape, preferably spherical shape. If spherical silica is used, when the dispersion liquid containing the particle α is applied to the substrate to form the polymer layer, the silica and the F polymer are more uniformly distributed, and the function thereof is easily improved. The spherical silica is preferably substantially spherical. Roughly true spherical shape as described above.

於藉由X射線光電子光譜法(以下亦稱為ESCA)來測定本粒子α時,表面之矽原子之量相對於氟原子之量為1以上。ESCA係對存在於粒子表面等之元素量進行定量之方法,可對碳(C)、氧(O)、氟(F)、矽(Si)等各元素進行定量。本發明中,表面為距離粒子之表面2至8 nm之深度。測定時,用碳帶固定粒子,在碳帶不露出且儘可能確保表面平坦性之情況下對粒子進行取樣。裝置之資訊及分析條件如下所述。 分析裝置:ULVAC-PHI公司製造之ESCA 5500 X射線源:Al Kα 14 kV 光束直徑:800 μm

Figure 02_image001
測定模式:寬光譜測定 結合能之測定範圍:0~1100 eV 通過能量:93.8 eV 能階:0.8 eV 累計數:16個循環 中和槍:使用 檢測器與試樣表面之角度:45度 本發明中,藉由ESCA來測定本粒子α中存在於該深度之元素,對矽原子之量及氟原子之量進行定量。本粒子α中,將如此定量之矽之量除以氟之量所獲得之值為1以上。When the particle α is measured by X-ray photoelectron spectroscopy (hereinafter also referred to as ESCA), the amount of silicon atoms on the surface is 1 or more relative to the amount of fluorine atoms. ESCA is a method for quantifying the amount of elements present on the surface of particles, etc. It is possible to quantify each element such as carbon (C), oxygen (O), fluorine (F), and silicon (Si). In the present invention, the surface is a depth of 2 to 8 nm from the surface of the particle. During the measurement, the particles were fixed with a carbon tape, and the particles were sampled while the carbon tape was not exposed and the surface flatness was ensured as much as possible. Device information and analysis conditions are described below. Analysis device: ESCA 5500 manufactured by ULVAC-PHI X-ray source: Al Kα 14 kV Beam diameter: 800 μm
Figure 02_image001
Measurement mode: Broad spectrum measurement Binding energy measurement range: 0~1100 eV Pass energy: 93.8 eV Energy level: 0.8 eV Cumulative number: 16 cycles Neutralization gun: Use the angle between the detector and the surface of the sample: 45 degrees Among them, the elements present at the depth in the particle α were measured by ESCA, and the amount of silicon atoms and the amount of fluorine atoms were quantified. In this particle α, the value obtained by dividing the amount of silicon thus quantified by the amount of fluorine is 1 or more.

具有上述值之本粒子α換言之為表面被二氧化矽高度被覆之粒子,不僅起因於二氧化矽之液中分散性等粒子特性優異,而且由含有本粒子α之液狀組合物形成之成形物易於高度具備二氧化矽之物性及F聚合物之物性。 藉由ESCA測定所獲得之本粒子α之表面中之矽原子之量相對於氟原子之量較佳為1.0以上,更佳為1.1以上,進而較佳為1.2以上。矽原子之量相對於氟原子之量較佳為100以下。The present particle α having the above-mentioned value, in other words, the surface of which is highly coated with silica, is not only due to excellent particle properties such as dispersibility in a liquid of silica, but also a molded product formed from a liquid composition containing the present particle α. It is easy to have high physical properties of silica and physical properties of F polymer. The amount of silicon atoms in the surface of the present particle α obtained by ESCA measurement is preferably 1.0 or more, more preferably 1.1 or more, and still more preferably 1.2 or more with respect to the amount of fluorine atoms. The amount of silicon atoms is preferably 100 or less with respect to the amount of fluorine atoms.

再者,ESCA測定中之對象元素設為碳元素、氧元素、氟元素及矽元素此4元素,將其總計中氟元素及矽元素分別所占之比率(單元:Atomic%)設為各個原子之量。 為了使本粒子α之表面之氟原子及矽原子之量處於上述範圍內,較佳為藉由上述乾式法A、乾式法B、濕式法等來製作本粒子α,更佳為乾式法A。即,較佳為使F粒子與二氧化矽在F聚合物之熔融溫度以上之溫度下且懸浮狀態下碰撞,製作本粒子α。Furthermore, the target elements in the ESCA measurement are set to four elements, namely carbon element, oxygen element, fluorine element, and silicon element, and the ratio (unit: Atomic%) of fluorine element and silicon element in the total is set to each atom. amount. In order to keep the amounts of fluorine atoms and silicon atoms on the surface of the particle α within the above-mentioned range, the particle α is preferably produced by the above-mentioned dry method A, dry method B, wet method, etc., more preferably dry method A . That is, it is preferable to make this particle|grain (alpha) by making F particle and silica collide at the temperature higher than the melting temperature of F polymer and in a suspended state.

本粒子α之D50較佳為40 μm以下,更佳為10 μm以下,進而較佳為4 μm以下。本粒子α之D50較佳為0.1 μm以上,更佳為1 μm以上,進而較佳為2 μm以上。 又,本粒子α之D90較佳為40 μm以下,更佳為4 μm以下。 若本粒子α之D50及D90處於上述範圍內,則本粒子α之分散穩定性、以及將包含本粒子α之液狀組合物塗佈於基材而形成聚合物層(F層)時其於所獲得之積層體之聚合物層(F層)等中之分散均勻性亦進一步變高,容易獲得高度具備F聚合物之物性與二氧化矽之物性之積層體。D50 of the particle α is preferably 40 μm or less, more preferably 10 μm or less, and still more preferably 4 μm or less. D50 of the particle α is preferably 0.1 μm or more, more preferably 1 μm or more, and still more preferably 2 μm or more. In addition, D90 of the particle α is preferably 40 μm or less, more preferably 4 μm or less. When D50 and D90 of the present particle α are within the above-mentioned ranges, the dispersion stability of the present particle α, and when the polymer layer (layer F) is formed by applying the liquid composition containing the present particle α to the substrate, are in The dispersion uniformity in the polymer layer (F layer) etc. of the obtained layered product is further improved, and it becomes easy to obtain a layered product having high physical properties of the F polymer and physical properties of silica.

本粒子α中之二氧化矽之量越多,則本粒子α之鬆密度變得越小,故較佳。另一方面,本粒子α中之二氧化矽之量越少,則包含本粒子α之液狀組合物之黏度變得越小,故較佳。自上述觀點考慮,本粒子α中之二氧化矽之量相對於F聚合物100質量份,較佳為15~85質量份。若設為該範圍,則容易使本粒子α之表面之氟元素與矽元素之量處於上述範圍內。本粒子α中之二氧化矽之量相對於F聚合物100質量份,更佳為20質量份以上,進而較佳為30質量份以上。又,本粒子α中之二氧化矽之量相對於F聚合物100質量份,更佳為70質量份以下,進而較佳為50質量份以下。 藉由進而設為上述範圍,而容易使本粒子α之表面之氟原子與矽原子之量處於上述範圍內。The larger the amount of silica in the particle α, the smaller the bulk density of the particle α, which is preferable. On the other hand, as the amount of silica in the particle α is smaller, the viscosity of the liquid composition containing the particle α becomes smaller, which is preferable. From the above viewpoints, the amount of silica in the particles α is preferably 15 to 85 parts by mass relative to 100 parts by mass of the F polymer. Within this range, the amounts of the fluorine element and the silicon element on the surface of the particle α can be easily adjusted within the above-mentioned range. The amount of silica in the particle α is more preferably 20 parts by mass or more, and still more preferably 30 parts by mass or more, relative to 100 parts by mass of the F polymer. Moreover, as for the quantity of the silica in this particle|grain (alpha), 70 mass parts or less is more preferable with respect to 100 mass parts of F polymers, and 50 mass parts or less is still more preferable. By further setting it as the said range, it becomes easy to make the quantity of the fluorine atom and the silicon atom on the surface of this particle|grain (alpha) into the said range.

作為本粒子α之較佳態樣,較佳為以F聚合物作為核,且於該核之表面附著有二氧化矽之態樣、即上述態樣I。As a preferable aspect of the particle α, it is preferable that the F polymer is used as the core, and silica is attached to the surface of the core, that is, the aspect I described above.

於態樣I之情形時,F聚合物核及二氧化矽較佳為分別為粒子狀。於該情形時,較F聚合物而言硬度更高之二氧化矽露出於表面,因此本粒子α之流動性變高,其操作性易於提高。 再者,於態樣I之情形時,F聚合物核可包含單個F粒子,亦可包含F粒子之集合物。 態樣I之本粒子α較佳為藉由上述乾式法A或乾式法B來製造F粒子與二氧化矽粒子,更佳為乾式法A。於該情形時,較佳為將F粒子之D50設定得比二氧化矽粒子之D50大,且將F粒子之量設定得比二氧化矽粒子之量多。若設定為此種關係,藉由乾式法A或乾式法B來製造本粒子α,則容易獲得態樣I之本粒子α。In the case of Aspect I, the F polymer core and the silica are preferably in the form of particles, respectively. In this case, since silica with higher hardness than the F polymer is exposed on the surface, the fluidity of the particle α becomes high, and the handleability thereof is easily improved. Furthermore, in the case of Aspect I, the F polymer core may comprise a single F particle or an aggregate of F particles. In the present particle α of the aspect I, it is preferable to produce the F particles and the silica particles by the above-mentioned dry method A or dry method B, and the dry method A is more preferable. In this case, it is preferable to set the D50 of the F particles to be larger than the D50 of the silica particles, and to set the amount of the F particles to be larger than the amount of the silica particles. If this relationship is set, the present particle α of the aspect I can be easily obtained by producing the present particle α by the dry method A or the dry method B.

以F粒子之D50作為基準,二氧化矽粒子之D50較佳為0.001~0.5,更佳為0.01~0.05。具體而言,較佳為F粒子之D50超過1 μm且二氧化矽粒子之D50為0.8 μm以下。 關於如此獲得之態樣I之本粒子α,上述關係得到維持,F聚合物核之D50大於二氧化矽粒子之D50,且其中F聚合物所占之質量多於二氧化矽所占之質量。於該情形時,F聚合物核之表面被更大量之二氧化矽粒子被覆,從而態樣I之本粒子α具有核殼結構。又,於該情形時,F粒子彼此之凝聚得到抑制,容易獲得在包含單個F粒子之核上附著有二氧化矽粒子之本粒子α。Based on the D50 of the F particles, the D50 of the silica particles is preferably 0.001-0.5, more preferably 0.01-0.05. Specifically, it is preferable that the D50 of the F particles exceeds 1 μm and the D50 of the silica particles is 0.8 μm or less. Regarding the present particle α of Aspect I thus obtained, the above relationship is maintained, the D50 of the F polymer core is greater than the D50 of the silica particle, and the mass occupied by the F polymer is greater than the mass occupied by the silica. In this case, the surface of the F polymer core is coated with a larger amount of silica particles, so that the present particle α of aspect I has a core-shell structure. Moreover, in this case, the aggregation of F particles is suppressed, and it is easy to obtain the original particle α in which silica particles are attached to the core including a single F particle.

於態樣I中,二氧化矽粒子較佳為球狀,更佳為大致真球狀。大致真球狀如下所述。 若使用該程度之大致真球狀二氧化矽粒子,則將含有本粒子α之液狀組合物塗佈於基材並形成聚合物層時,二氧化矽與F聚合物更均勻地分佈,容易平衡兩者之物性。In Aspect I, the silica particles are preferably spherical, more preferably substantially true spherical. The approximately true spherical shape is as follows. If the substantially spherical silica particles of this level are used, when the liquid composition containing the particle α is applied to the substrate to form a polymer layer, the silica and the F polymer are more uniformly distributed, and it is easy to Balance the physical properties of the two.

於態樣I中,二氧化矽粒子之D50較佳為0.001~0.8 μm之範圍,更佳為0.01~0.3 μm,進而較佳為0.03~0.1 μm。D50為該範圍之二氧化矽亦有時稱為奈米二氧化矽,本粒子α之操作性及流動性易於提高,且分散穩定性易於變高。若使用該範圍之二氧化矽,則容易對含有本粒子α之液狀組合物之黏度、觸變比等液體物性進行調整,其操作性及消泡性變得優異。 又,二氧化矽粒子之粒度分佈係以D90/D10之值作為指標,較佳為3以下,更佳為2.9以下。若粒度分佈狹窄,則容易控制所獲得之本粒子α之流動性,就此觀點而言較佳。In aspect I, the D50 of the silica particles is preferably in the range of 0.001-0.8 μm, more preferably 0.01-0.3 μm, and still more preferably 0.03-0.1 μm. Silica having D50 in this range is also sometimes referred to as nano-silica. The handleability and fluidity of the particle α are easily improved, and the dispersion stability is easily improved. When the silica in this range is used, the liquid physical properties such as the viscosity and the thixotropic ratio of the liquid composition containing the particles α can be easily adjusted, and the handleability and defoaming properties thereof are excellent. In addition, the particle size distribution of the silica particles takes the value of D90/D10 as an index, and is preferably 3 or less, more preferably 2.9 or less. When the particle size distribution is narrow, it is easy to control the fluidity of the obtained particle α, which is preferable from the viewpoint.

於態樣I中,二氧化矽粒子較佳為對其表面之至少一部分進行了表面處理,更佳為利用六甲基二矽氮烷等矽氮烷化合物、或矽烷偶合劑等進行了表面處理。作為矽烷偶合劑,可列舉上述化合物。In Aspect I, at least a part of the surface of the silica particles is preferably surface-treated, and more preferably, the surface is treated with a silazane compound such as hexamethyldisilazane, a silane coupling agent, or the like. . As a silane coupling agent, the above-mentioned compound is mentioned.

於態樣I中,二氧化矽粒子可使用一種,亦可混合兩種以上而使用。於混合兩種二氧化矽粒子而使用之情形時,各二氧化矽粒子之平均粒徑可彼此不同,各二氧化矽粒子之含量之質量比可根據所需功能進行適當設定。In Aspect I, one type of silica particles may be used, or two or more types may be mixed and used. When two kinds of silica particles are mixed and used, the average particle size of each silica particle may be different from each other, and the mass ratio of the content of each silica particle may be appropriately set according to the required function.

又,於態樣I之情形時,較佳為二氧化矽粒子之一部分嵌埋至F聚合物核。藉此,二氧化矽粒子對F聚合物核之密接性進一步提高,更不易發生二氧化矽粒子自本粒子α脫落。即,本粒子α之穩定性進一步提高。 關於態樣I之本粒子α,F聚合物核之D50較佳為0.1 μm以上,更佳為1 μm以上,進而較佳為2 μm以上。D50較佳為30 μm以下,更佳為10 μm以下,進而較佳為5 μm以下。Also, in the case of Aspect I, it is preferred that a portion of the silica particles is embedded in the F polymer core. Thereby, the adhesiveness of the silica particles to the F polymer core is further improved, and it is more difficult for the silica particles to fall off from the particles α. That is, the stability of the present particle α is further improved. Regarding the particle α of the aspect I, the D50 of the F polymer core is preferably 0.1 μm or more, more preferably 1 μm or more, and still more preferably 2 μm or more. D50 is preferably 30 μm or less, more preferably 10 μm or less, and still more preferably 5 μm or less.

又,態樣I之本粒子α中F聚合物所占之比率較佳為50質量%以上,更佳為60質量%以上。F聚合物之比率較佳為99質量%以下,更佳為90質量%以下,進而較佳為80質量%以下。二氧化矽之比率較佳為1質量%以上,更佳為10質量%以上,進而較佳為20質量%以上。二氧化矽之比率較佳為50質量%以下,更佳為40質量%以下。又,若使用該範圍之二氧化矽,則不僅容易獲得操作性及分散穩定性優異之本粒子α,而且容易對含有本粒子α之液狀組合物之黏度、觸變比等液體物性進行調整,從而其操作性及消泡性變得優異。In addition, the ratio of the F polymer in the present particle α of Aspect I is preferably 50% by mass or more, more preferably 60% by mass or more. The ratio of the F polymer is preferably 99 mass % or less, more preferably 90 mass % or less, and still more preferably 80 mass % or less. The ratio of silica is preferably 1 mass % or more, more preferably 10 mass % or more, and still more preferably 20 mass % or more. 50 mass % or less is preferable, and 40 mass % or less is more preferable. In addition, when silica within this range is used, not only the present particles α excellent in handleability and dispersion stability can be easily obtained, but also the liquid physical properties such as the viscosity and thixotropic ratio of the liquid composition containing the present particles α can be easily adjusted. , so that its handleability and defoaming properties become excellent.

態樣I之本粒子α可進而進行表面處理。該表面處理之具體例如上所述,不僅可調整上述本粒子α之表面二氧化矽量,而且可進而調整其表面物性。The present particle α of Aspect I may be further surface-treated. The specific example of this surface treatment is as described above, and it is possible to adjust not only the amount of silica on the surface of the particle α described above, but also the physical properties of the surface.

於本發明中,若將上述本粒子α及分散介質加以混合,則可獲得含有上述本粒子α及分散介質,且本粒子α分散於分散介質中之液狀組合物(以下亦稱為本組合物)。 本粒子α可表現出足夠高之極性,即便大量添加至分散介質中,亦可穩定地分散。又,於由本組合物形成之聚合物層、積層體、膜中,F聚合物與二氧化矽更均勻地分佈,而容易高度地表現出電特性、接著性等基於F聚合物之物性、以及低線膨脹性等基於二氧化矽之物性。 本組合物中之液狀分散介質係作為本粒子α之分散介質發揮功能之在25℃下為惰性之液體化合物。分散介質可為水,亦可為非水系分散介質。分散介質可為一種,亦可為兩種以上。於該情形時,不同類之液體化合物較佳為相容。 作為分散介質,可列舉與本組合物A或本組合物B中之液狀分散介質相同者。In the present invention, if the present particle α and the dispersion medium are mixed, a liquid composition (hereinafter also referred to as the present composition) can be obtained containing the present particle α and the dispersion medium, and the present particle α is dispersed in the dispersion medium. thing). This particle α can exhibit a sufficiently high polarity, and even if it is added in a large amount to a dispersion medium, it can be stably dispersed. In addition, in the polymer layer, laminate, and film formed from the present composition, the F polymer and the silica are more uniformly distributed, and the physical properties based on the F polymer, such as electrical properties, adhesiveness, etc., are easily exhibited at a high level, and Physical properties based on silica such as low linear expansion. The liquid dispersion medium in the present composition is a liquid compound that is inert at 25°C and functions as a dispersion medium for the particles α. The dispersion medium may be water or a non-aqueous dispersion medium. One type of dispersion medium may be used, or two or more types may be used. In this case, the different classes of liquid compounds are preferably compatible. As a dispersion medium, the same thing as the liquid dispersion medium in this composition A or this composition B is mentioned.

於分散介質包含N-甲基-2-吡咯啶酮等非質子性極性溶劑之情形時,較佳為利用下述矽烷偶合劑對本粒子α中所含之二氧化矽之表面之至少一部分進行了表面處理,該矽烷偶合劑具有選自由胺基、乙烯基及(甲基)丙烯醯氧基所組成之群中之至少一種基,更佳為利用苯基胺基矽烷進行了表面處理。 於分散介質包含甲苯等非極性溶劑之情形時,較佳為對本粒子α中所含之二氧化矽之表面之至少一部分進行了疏水化處理,較佳為利用具有選自由烷基及苯基所組成之群中之至少一種基之矽烷偶合劑進行了表面處理。 再者,於分散介質包含水等質子性極性溶劑之情形時,本粒子α中所含之二氧化矽較佳為未經表面處理。 於將上述分散介質與二氧化矽之表面處理加以組合之情形時,本組合物之分散穩定性變得優異。When the dispersion medium contains an aprotic polar solvent such as N-methyl-2-pyrrolidone, it is preferable that at least a part of the surface of the silica contained in the particle α is subjected to the following silane coupling agent. For the surface treatment, the silane coupling agent has at least one group selected from the group consisting of an amino group, a vinyl group, and a (meth)acryloyloxy group, and more preferably, the surface treatment is performed with a phenylaminosilane. When the dispersion medium contains a non-polar solvent such as toluene, it is preferable to hydrophobize at least a part of the surface of the silica contained in the particle α, preferably using a compound having a compound selected from an alkyl group and a phenyl group. The silane coupling agent of at least one group in the group is surface-treated. Furthermore, when the dispersion medium contains a protic polar solvent such as water, the silica contained in the particle α is preferably not surface-treated. When the above-mentioned dispersion medium is combined with the surface treatment of silica, the dispersion stability of the present composition becomes excellent.

於將本組合物設為100質量%時,本組合物中之本粒子α之含量較佳為1~50質量%,更佳為10~40質量%。 於將本組合物設為100質量%時,本組合物中之分散介質之含量較佳為50~99質量%,更佳為60~90質量%。When the composition is 100% by mass, the content of the particles α in the composition is preferably 1 to 50% by mass, more preferably 10 to 40% by mass. The content of the dispersion medium in the composition is preferably 50 to 99% by mass, more preferably 60 to 90% by mass, when the composition is 100% by mass.

要想進一步提高本粒子α之分散穩定性,提高粒子沈澱性及操作性,本組合物可進而含有界面活性劑,但本粒子α之分散穩定性優異,因此可實質上不含界面活性劑。作為界面活性劑,可列舉上述界面活性劑。 所謂實質上不含界面活性劑,係指本組合物中之界面活性劑之濃度不超過1質量%,本組合物中之界面活性劑之量為1質量%以下,界面活性劑之量較佳為0.5質量%以下,更佳為0質量%。In order to further improve the dispersion stability of the particles α and improve the particle precipitation and handleability, the composition may further contain a surfactant, but the particles α are excellent in dispersion stability, and therefore can be substantially free of surfactants. As a surfactant, the above-mentioned surfactant is mentioned. The so-called "substantially free of surfactant" means that the concentration of the surfactant in the composition does not exceed 1% by mass, the amount of the surfactant in the composition is less than 1% by mass, and the amount of the surfactant is preferably It is 0.5 mass % or less, More preferably, it is 0 mass %.

本組合物之黏度較佳為50 mPa・s以上,更佳為100 mPa・s以上。本組合物之黏度較佳為50000 mPa・s以下,較佳為1000 mPa・s以下,更佳為800 mPa・s以下。於該情形時,本組合物之塗佈性優異,因此容易形成具有任意厚度之聚合物層等成形物。 本組合物之觸變比較佳為1.0以上。本組合物之觸變比較佳為3.0以下,更佳為2.0以下。於該情形時,本組合物不僅塗佈性優異,其均質性亦優異,因此容易形成更緻密之聚合物層等成形物。The viscosity of the composition is preferably 50 mPa·s or more, more preferably 100 mPa·s or more. The viscosity of the composition is preferably 50,000 mPa·s or less, preferably 1,000 mPa·s or less, and more preferably 800 mPa·s or less. In this case, since the present composition is excellent in coatability, it is easy to form a molded product such as a polymer layer having an arbitrary thickness. The thixotropy ratio of the present composition is preferably 1.0 or more. The thixotropy ratio of the present composition is preferably 3.0 or less, more preferably 2.0 or less. In this case, since the present composition is excellent not only in coatability, but also in homogeneity, it is easy to form molded articles such as a denser polymer layer.

本組合物可進而包含F聚合物、除F聚合物以外之聚合物或其前驅物。作為該聚合物或其前驅物,可列舉:聚四氟乙烯(PTFE)、包含TFE單元及PAVE單元之聚合物(PFA)、包含TFE單元及基於六氟丙烯之單元之聚合物(FEP)、包含TFE單元及基於乙烯之單元之聚合物(ETFE)、聚偏二氟乙烯(PVDF)、聚醯亞胺、聚芳酯、聚碸、聚芳碸、聚醯胺、聚醚醯胺、聚苯醚、聚苯硫醚、聚芳醚酮、聚醯胺醯亞胺、液晶性聚酯、液晶性聚酯醯胺、環氧樹脂、馬來醯亞胺樹脂等。再者,PFA可為F聚合物,亦可為F聚合物以外之PFA。 該等聚合物或其前驅物可分散於本組合物中,亦可溶解於其中。又,該等聚合物或其前驅物可為熱塑性,亦可為熱固性。本組合物較佳為包含上述芳香族聚合物。 本組合物除包含上述成分以外,還可在無損本發明之效果之範圍內進而包含與本分散液A之說明中所述之其他成分相同之其他成分。The present composition may further comprise F polymers, polymers other than F polymers, or precursors thereof. Examples of the polymer or its precursor include polytetrafluoroethylene (PTFE), a polymer (PFA) containing a TFE unit and a PAVE unit, a polymer (FEP) containing a TFE unit and a hexafluoropropylene-based unit, Polymers containing TFE units and ethylene-based units (ETFE), polyvinylidene fluoride (PVDF), polyimide, polyarylate, polyarylene, polyarylene, polyamide, polyetheramide, polyamide Phenyl ether, polyphenylene sulfide, polyaryl ether ketone, polyamide imide, liquid crystal polyester, liquid crystal polyester imide, epoxy resin, maleimide resin, etc. Furthermore, the PFA may be an F polymer, or may be a PFA other than the F polymer. These polymers or their precursors can be dispersed or dissolved in the composition. Furthermore, these polymers or their precursors may be thermoplastic or thermosetting. The present composition preferably contains the above-mentioned aromatic polymer. In addition to the above-mentioned components, the present composition may further contain other components similar to the other components described in the description of the present dispersion liquid A within a range that does not impair the effects of the present invention.

只要使本組合物與基材層之表面接觸,進行加熱而形成包含F聚合物及二氧化矽之聚合物層,便可獲得具有基材層及聚合物層之積層體。關於積層體之製造方法之詳細情況、基材層、使用積層體之印刷基板及多層印刷電路基板之態樣,包括較佳之態樣在內均與上述分散液A之說明中所述之其等相同。As long as this composition is brought into contact with the surface of the base material layer and heated to form a polymer layer containing the F polymer and silica, a laminate having a base material layer and a polymer layer can be obtained. The details of the method for producing the laminate, the substrate layer, the aspect of the printed circuit board using the laminate, and the multilayer printed circuit board, including the preferred aspect, are the same as those described in the description of the above-mentioned dispersion A. same.

又,只要將本粒子α與氟烯烴系聚合物加以熔融混練後進行擠出成形,便可製造膜。 本粒子α包含與氟烯烴系聚合物之相互作用(相容性)較高之F聚合物及二氧化矽。又,本粒子α在表面以特定之比率具有矽原子,因此具有特定之硬度,將本粒子α與氟烯烴系聚合物加以熔融混練時,複合粒子與氟烯烴系聚合物碰撞,分別被粉碎,從而容易微粒化。 結果,兩者被均勻地熔融混練,於所獲得之膜中,F聚合物、氟烯烴系聚合物及二氧化矽均勻地分佈,而容易高度地表現出基於F聚合物及氟烯烴系聚合物之物性、尤其是電特性、以及基於二氧化矽之低線膨脹性等物性。 供與本粒子α進行熔融混練之氟烯烴系聚合物可為F聚合物,亦可為F聚合物以外之包含基於氟烯烴之單元之聚合物。In addition, a film can be produced by melt-kneading the particles α and the fluoroolefin-based polymer and then extrusion-molding. The particle α contains the F polymer and silica having high interaction (compatibility) with the fluoroolefin-based polymer. In addition, the present particle α has silicon atoms in a specific ratio on the surface, so it has a specific hardness. When the present particle α and the fluoroolefin-based polymer are melt-kneaded, the composite particles collide with the fluoroolefin-based polymer and are pulverized respectively. Thus, it is easy to micronize. As a result, both are melt-kneaded uniformly, and in the obtained film, the F polymer, the fluoroolefin-based polymer, and the silica are uniformly distributed, and the F polymer and the fluoroolefin-based polymer are likely to be highly expressed. physical properties, especially electrical properties, and low linear expansion properties based on silica. The fluoroolefin-based polymer to be melt-kneaded with the particles α may be either the F polymer or a polymer containing a fluoroolefin-based unit other than the F polymer.

作為氟烯烴系聚合物,可列舉PTFE、PFA、FEP、ETFE、PVDF。PFA可為F聚合物,亦可為F聚合物以外之PFA。氟烯烴系聚合物亦可為與複合粒子中所含之F聚合物相同之F聚合物。 氟烯烴系聚合物之熔融溫度(熔點)較佳為160~330℃。 氟烯烴系聚合物之玻璃轉移點較佳為45~150℃。 氟烯烴系聚合物亦較佳為具有極性官能基。再者,關於極性官能基之種類及導入方法,包括較佳之種類及導入方法在內均與上述F聚合物中之其等相同。As a fluoroolefin type polymer, PTFE, PFA, FEP, ETFE, PVDF are mentioned. The PFA may be an F polymer or a PFA other than the F polymer. The fluoroolefin-based polymer may be the same F polymer as the F polymer contained in the composite particles. The melting temperature (melting point) of the fluoroolefin-based polymer is preferably 160 to 330°C. The glass transition point of the fluoroolefin-based polymer is preferably 45 to 150°C. The fluoroolefin-based polymer also preferably has a polar functional group. In addition, regarding the kind and introduction method of polar functional group, it is the same as that in the above-mentioned F polymer, including preferable type and introduction method.

關於本粒子α與氟烯烴系聚合物之熔融混練,例如可使用單軸混練機而進行。單軸混練機具有料缸、及可旋轉地設置於料缸內之1根螺桿。若使用單軸混練機,則於熔融混練時容易防止F聚合物及氟烯烴系聚合物之劣化。 於該情形時,將螺桿之全長設為L(mm),將直徑設為D(mm)時,以全長L相對於直徑D之比進行表示之有效長度(L/D)較佳為30~45。若有效長度為上述範圍,則可防止F聚合物及TFE系聚合物之劣化,並且可對其等賦予充分之剪切應力,容易降低熔融混練物之溫度不均。 螺桿之轉速較佳為10~50 ppm。The melt-kneading of the particles α and the fluoroolefin-based polymer can be performed, for example, using a uniaxial kneader. The single-shaft kneader has a material cylinder and a screw rotatably arranged in the material cylinder. When a uniaxial kneader is used, the deterioration of the F polymer and the fluoroolefin-based polymer can be easily prevented during melt-kneading. In this case, when the overall length of the screw is L (mm) and the diameter is D (mm), the effective length (L/D) expressed as the ratio of the overall length L to the diameter D is preferably 30 to 45. When the effective length is in the above range, the deterioration of the F polymer and the TFE-based polymer can be prevented, sufficient shear stress can be imparted to them, and the temperature unevenness of the melt-kneaded product can be easily reduced. The rotational speed of the screw is preferably 10-50 ppm.

熔融混練物係自配置於料缸前端之T型模頭中噴出。然後,自T型模頭中噴出之熔融混練物與複數根冷卻輥接觸被固化而被膜化。將所獲得之長條膜捲取至捲取輥。 膜之厚度較佳為5~150 μm,更佳為10~100 μm。 膜之形狀可為長條狀,也可為單片狀。長條狀之膜之長邊方向之長度較佳為100 m以上。長邊方向之長度之上限通常為2000 m。又,長條狀之短邊方向之長度較佳為1000 mm以上。短邊方向之長度之上限通常為3000 mm。The melt-kneaded material is ejected from the T-die head arranged at the front end of the material cylinder. Then, the melt-kneaded product ejected from the T-die is brought into contact with a plurality of cooling rolls to be solidified and formed into a film. The obtained long film is wound up to a take-up roll. The thickness of the film is preferably 5 to 150 μm, more preferably 10 to 100 μm. The shape of the film can be a long strip or a single sheet. The length in the longitudinal direction of the elongated film is preferably 100 m or more. The upper limit of the length in the longitudinal direction is usually 2000 m. In addition, the length in the short-side direction of the elongated shape is preferably 1000 mm or more. The upper limit of the length in the short side direction is usually 3000 mm.

將所獲得之膜重疊於基材層後,進行熱壓,藉此可獲得具有由膜形成之聚合物層及基材層之積層體。 熱壓之條件較佳為,將溫度設為120至300℃,將氛圍之壓力設為20 kPa以下之真空,將加壓壓力設為0.2至10 MPa。 再者,關於基材層、使用積層體之印刷基板及多層印刷電路基板之態樣,包括較佳之態樣在內均與上述本法1中之其等相同。 又,亦可使用圓形模頭代替T型模頭來製造吹脹膜。After superimposing the obtained film on the base material layer, hot pressing is performed, whereby a laminate having a polymer layer formed of the film and a base material layer can be obtained. The conditions of the hot pressing are preferably set to the temperature of 120 to 300° C., the pressure of the atmosphere to be a vacuum of 20 kPa or less, and the pressurized pressure to be set to 0.2 to 10 MPa. In addition, about the aspect of a base material layer, the printed circuit board using a laminated body, and a multilayer printed circuit board, including preferable aspect, it is the same as the above-mentioned method 1 and the like. Also, a circular die may be used instead of a T-die to manufacture an blown film.

以上,已對本發明之分散液、複合粒子及複合粒子之製造方法進行了說明,但本發明並不限於上述實施方式之構成。 例如,本發明之分散液及複合粒子可分別於上述實施方式之構成中追加其他之任意構成,亦可與發揮相同功能之任意構成進行置換。 又,本發明之複合粒子之製造方法可分別於上述實施方式之構成中以追加方式具有其他任意步驟,亦可與產生相同作用之任意步驟進行置換。 實施例As mentioned above, although the dispersion liquid of this invention, composite particle, and the manufacturing method of a composite particle were demonstrated, this invention is not limited to the structure of the said embodiment. For example, the dispersion liquid and the composite particle of the present invention may be respectively added with other arbitrary structures to the structures of the above-described embodiments, or may be replaced with arbitrary structures that exhibit the same function. In addition, the method for producing composite particles of the present invention may have other optional steps in addition to the configuration of the above-described embodiments, or may be substituted for any steps that produce the same effect. Example

以下,藉由實施例來詳細地說明本發明,但本發明並不限於該等。 將各成分之詳細內容示於以下。 [F粒子] F粒子1:含有包含97.9莫耳%之TFE單元、0.1莫耳%之NAH單元及2.0莫耳%之PPVE單元且具有酸酐基之F聚合物1(熔融溫度300℃)的粒子(D50:2 μm;鬆密度:0.18 g/m2 ) F粒子2:含有包含97.5莫耳%之TFE單元及2.5莫耳%之PPVE單元且不具有官能基之F聚合物2(熔融溫度305℃)的粒子(D50:2 μm;鬆密度:0.19 g/m2 ) F粒子3:包含僅由TFE單元及PPVE單元所構成之F聚合物3(熔融溫度305℃)的粒子(D50:2 μm;鬆密度:0.19 g/m2 ) F粒子4:含有包含97.5莫耳%之TFE單元及2.5莫耳%之PPVE單元且不具有極性官能基之F聚合物4(熔融溫度:300℃)的粒子(D50:2.6 μm) [PTFE粒子] PTFE1:包含非熱熔融性之PTFE之粒子(D50:0.3 μm;鬆密度:0.2 g/m2 ) PTFE2:包含原纖性之PTFE之粒子(D50:2.4 μm) [無機物] 無機物1:二氧化矽填料(大致真球狀,平均粒徑0.03 μm),利用矽烷偶合劑進行了表面處理 [二氧化矽粒子] 二氧化矽粒子1:包含二氧化矽之大致真球狀粒子(D50:0.05 μm) 二氧化矽粒子2:包含二氧化矽之大致真球狀粒子(D50:0.25 μm) [分散介質] NMP:N-甲基-2-吡咯啶酮 分散介質S1:甲苯(沸點:111℃) 分散介質S2:N,N-二甲基甲醯胺(DMF)(沸點:153℃) [芳香族聚合物] 聚合物1:熱塑性之芳香族聚醯亞胺(PI1)溶解於NMP中而成之清漆 聚合物2:使2-羥基-6-萘甲酸、4,4'-二羥基聯苯、對苯二甲酸、及2,6-萘二甲酸依序以60莫耳%、20莫耳%、15.5莫耳%、4.5莫耳%之比率進行反應而獲得熱塑性聚合物,將該熱塑性聚合物進行粉碎而獲得之粉末(D50:16 μm)。 聚合物3:熱固性之芳香族性雙馬來醯亞胺之粉末(D50:2 μm)Hereinafter, the present invention will be described in detail by way of examples, but the present invention is not limited to these. The details of each component are shown below. [F particle] F particle 1: particle containing F polymer 1 (melting temperature 300°C) containing 97.9 mol % of TFE unit, 0.1 mol % of NAH unit, and 2.0 mol % of PPVE unit and having an acid anhydride group (D50: 2 μm; bulk density: 0.18 g/m 2 ) F particle 2: F polymer 2 containing 97.5 mol % of TFE units and 2.5 mol % of PPVE units and having no functional group (melting temperature 305 °C) particles (D50: 2 μm; bulk density: 0.19 g/m 2 ) F particles 3: particles containing F polymer 3 (melting temperature 305 °C) composed of only TFE units and PPVE units (D50: 2 μm; bulk density: 0.19 g/m 2 ) F particles 4: F polymer 4 containing 97.5 mol % of TFE units and 2.5 mol % of PPVE units and having no polar functional group (melting temperature: 300° C.) PTFE particles (D50: 2.6 μm) [PTFE particles] PTFE1: particles containing non-thermofusible PTFE (D50: 0.3 μm; bulk density: 0.2 g/m 2 ) PTFE2: particles containing fibrillar PTFE (D50 : 2.4 μm) [Inorganic substance] Inorganic substance 1: Silica filler (approximately true spherical shape, average particle size 0.03 μm), surface-treated with a silane coupling agent [Silicon dioxide particle] Silica particle 1: Contains dioxide Roughly spherical particles of silicon (D50: 0.05 μm) Silica particles 2: Roughly spherical particles containing silica (D50: 0.25 μm) [Dispersion medium] NMP: N-methyl-2-pyrrolidine Ketone Dispersion Medium S1: Toluene (Boiling Point: 111°C) Dispersion Medium S2: N,N-Dimethylformamide (DMF) (Boiling Point: 153°C) [Aromatic Polymer] Polymer 1: Thermoplastic Aromatic Polymer Varnish polymer 2 prepared by dissolving imide (PI1) in NMP: 2-hydroxy-6-naphthoic acid, 4,4'-dihydroxybiphenyl, terephthalic acid, and 2,6-naphthalene diphenyl A thermoplastic polymer was obtained by reacting formic acid at a ratio of 60 mol %, 20 mol %, 15.5 mol %, and 4.5 mol % in this order, and the thermoplastic polymer was pulverized to obtain a powder (D50: 16 μm) . Polymer 3: Powder of thermosetting aromatic bismaleimide (D50: 2 μm)

[例1-1] 1.複合粒子之製造 製備99質量份之F粒子1與1質量份之無機物1之混合物。 繼而,向下述粉體處理裝置(Hybridization System)中投入混合物,該粉體處理裝置係於圓筒狀容器內一面用高速旋轉之攪拌葉攪拌粒子,一面於容器之內壁與攪拌體之間夾持粒子而施加應力。然後,使F粒子1與無機物1在高溫亂流氛圍下懸浮並碰撞,對其等之間賦予應力而進行複合化處理。再者,將處理中之裝置內設為氮氣氛圍下,將溫度保持於100℃以下,將處理時間設為15分鐘。 所獲得之處理物為微粉狀。又,用光學顯微鏡對該微粉進行分析,結果為以F粒子1作為核且於該核之表面附著無機物1而形成了殼的核殼結構之複合粒子1。 再者,複合粒子1之形狀為球狀,其D50為4 μm。[Example 1-1] 1. Manufacture of composite particles A mixture of 99 parts by mass of the F particles 1 and 1 part by mass of the inorganic substance 1 was prepared. Then, put the mixture into the following powder processing device (Hybridization System), the powder processing device is in a cylindrical container while stirring the particles with a high-speed rotating stirring blade, and on the other hand between the inner wall of the container and the stirring body. Stress is applied by clamping the particles. Then, the F particles 1 and the inorganic substances 1 are suspended and collided in a high-temperature turbulent atmosphere, and a stress is applied between them to perform a composite treatment. In addition, the inside of the apparatus during processing was made into nitrogen atmosphere, the temperature was kept below 100 degreeC, and the processing time was made into 15 minutes. The obtained treated product was in the form of fine powder. Further, the fine powder was analyzed with an optical microscope, and as a result, it was a composite particle 1 of a core-shell structure in which the F particle 1 was used as a core and the inorganic substance 1 was adhered to the surface of the core to form a shell. In addition, the shape of the composite particle 1 was spherical, and its D50 was 4 μm.

2.分散液之製造及評價 向具備攪拌葉之槽中加入NMP及聚合物1,於槽內充分地攪拌。繼而,將所獲得之複合粒子1加入槽內,以800 rpm攪拌15分鐘,於形成了上升流之狀態下進行剪切處理而獲得包含複合粒子1(100質量份)、聚合物1(30質量份)及NMP(120質量份)之分散液1。所獲得之分散液1在25℃下之黏度為18000 mPa・s。依據下述基準對分散液1之分散穩定性及成分沈澱率進行評價。 <分散穩定性之評價基準> 〇:於剛製備後及保管後,均起泡較少,未發現凝聚物,均勻地分散。 △:於剛製備後及保管後,均觀察到一部分凝聚物。 ×:發現了大量凝聚物,未均勻地分散。 <成分沈澱率之評價基準> 〇:成分沈澱率為60%以上。 △:成分沈澱率超過40%且為60%以下。 ×:成分沈澱率為40%以下。2. Manufacture and evaluation of dispersion liquid The NMP and the polymer 1 were added to the tank equipped with a stirring blade, and the tank was fully stirred. Then, the obtained composite particles 1 were put into the tank, stirred at 800 rpm for 15 minutes, and sheared in a state where an upflow was formed to obtain composite particles 1 (100 parts by mass) and polymer 1 (30 parts by mass). parts) and dispersion 1 of NMP (120 parts by mass). The viscosity of the obtained dispersion liquid 1 at 25°C was 18000 mPa·s. The dispersion stability and component precipitation rate of Dispersion Liquid 1 were evaluated according to the following criteria. <Evaluation Criteria for Dispersion Stability> ○: There was little foaming immediately after preparation and storage, and no aggregates were found, and the mixture was uniformly dispersed. Δ: A part of the aggregate was observed immediately after preparation and after storage. ×: A large amount of aggregates were found and were not uniformly dispersed. <Evaluation Criteria for Component Precipitation Rate> ○: The component precipitation rate is 60% or more. Δ: The component precipitation ratio exceeds 40% and is 60% or less. ×: The component precipitation ratio is 40% or less.

3.積層體之製作及評價 於長條銅箔(厚度18 μm)之表面,使用棒式塗佈機塗佈分散液1而形成濕膜。繼而,將形成有該濕膜之銅箔在110℃下通入乾燥爐5分鐘,藉由加熱使其乾燥而形成乾膜。然後,於氮氣烘箱中將乾膜在380℃下加熱3分鐘。藉此,製作具有銅箔、及位於其表面之包含F粒子1之熔融焙燒物、無機物1及聚合物1之作為成形物之聚合物層(厚度20 μm)的積層體1。 自積層體1切出180 mm見方之方形試片,依據JIS C 6471:1995所規定之測定方法,對試片測定25℃以上260℃以下之範圍內之試片之線膨脹係數,並依據下述基準進行評價。 <線膨脹係數之評價基準> 〇:線膨脹係數為50 ppm/℃以下。 △:線膨脹係數超過50 ppm/℃且為75 ppm/℃以下。 ×:線膨脹係數超過75 ppm/℃。3. Fabrication and evaluation of laminates On the surface of a long copper foil (thickness 18 micrometers), the dispersion liquid 1 was apply|coated using a bar coater, and a wet film was formed. Next, the copper foil on which the wet film was formed was passed into a drying furnace at 110° C. for 5 minutes, and dried by heating to form a dry film. The dry film was then heated at 380°C for 3 minutes in a nitrogen oven. Thereby, the laminated body 1 which has the polymer layer (thickness 20 micrometers) which is a molded object of copper foil and the melt-fired product containing the F particle 1, the inorganic substance 1, and the polymer 1 located on the surface was produced. Cut out a square test piece of 180 mm square from the laminated body 1, and measure the linear expansion coefficient of the test piece in the range of 25°C to 260°C according to the measurement method specified in JIS C 6471:1995, and according to the following evaluated against the above-mentioned benchmarks. <Evaluation Criteria for Coefficient of Linear Expansion> ○: The linear expansion coefficient is 50 ppm/°C or less. Δ: The linear expansion coefficient exceeds 50 ppm/°C and is 75 ppm/°C or less. ×: The linear expansion coefficient exceeds 75 ppm/°C.

[例1-2] 製備99質量份之F粒子1與1質量份之無機物1之混合物。 繼而,向下述粉體處理裝置(機械融合裝置)中投入混合物,該粉體處理裝置具備:內周面具有承受面之筒狀旋轉體、及以微小距離與承受面相隔而設之內部構件。然後,使筒狀旋轉體繞中心軸高速旋轉。藉由此時所產生之離心力將粒子壓抵於承受面,向承受面與內部構件之間之狹窄空間(按壓空間)導入混合物,於剪切狀態下使粒子碰撞而進行處理。再者,將處理中之筒狀旋轉體之氛圍之溫度保持於100℃以下,將處理時間設為15分鐘。 所獲得之處理物為微粉狀。又,用光學顯微鏡對該微粉進行分析,結果為以F粒子1作為核且於該核之表面附著無機物1而形成了殼的核殼結構之複合粒子2。 再者,複合粒子2之形狀為球狀,其D50為18 μm。 使用所獲得之複合粒子2,以與例1-1相同之方式製造分散液2,製作積層體2,並進行評價。將評價結果示於表1。[Example 1-2] A mixture of 99 parts by mass of the F particles 1 and 1 part by mass of the inorganic substance 1 was prepared. Then, the mixture is put into the following powder processing apparatus (mechanical fusion apparatus), which is provided with a cylindrical rotating body having a receiving surface on its inner peripheral surface, and an internal member provided with a slight distance from the receiving surface. . Then, the cylindrical rotating body is rotated at a high speed around the central axis. The particles are pressed against the receiving surface by the centrifugal force generated at this time, and the mixture is introduced into the narrow space (pressing space) between the receiving surface and the internal member, and the particles are collided in a sheared state and processed. In addition, the temperature of the atmosphere of the cylindrical rotating body being processed was kept below 100 degreeC, and the processing time was made into 15 minutes. The obtained treated product was in the form of fine powder. The fine powder was analyzed with an optical microscope. As a result, it was a composite particle 2 of a core-shell structure in which the F particle 1 was used as a core and the inorganic substance 1 was adhered to the surface of the core to form a shell. In addition, the shape of the composite particle 2 was spherical, and its D50 was 18 μm. Using the obtained composite particles 2, a dispersion liquid 2 was produced in the same manner as in Example 1-1, and a layered body 2 was produced and evaluated. The evaluation results are shown in Table 1.

[例1-3~例1-8] 除按下表1所示變更各成分之種類及量以外,以與例1-1相同之方式獲得複合粒子3、4及分散液3~8,製造積層體3~8。將所獲得之分散液及積層體之評價結果示於表1。[Example 1-3 to Example 1-8] The composite particles 3 and 4 and the dispersion liquids 3 to 8 were obtained in the same manner as in Example 1-1, except that the types and amounts of the components were changed as shown in Table 1 below, and the laminated bodies 3 to 8 were produced. Table 1 shows the evaluation results of the obtained dispersion liquid and layered product.

[表1] 表1 1-1 1-2 1-3 1-4 1-5 1-6 1-7 1-8 分散液編號 1 2 3 4 5 6 7 8 分散液之組成                         複合粒子(F粒子)                            F粒子1(質量份) 99 99    99 99 99       F粒子2(質量份)       99                PTFE1(質量份)                   99    複合粒子(無機物)                            無機物1(質量份) 1 1 1 1 1 1 1    (複合粒子編號) 1 2 3 1 1 1 4    芳香族聚合物                            聚合物1(質量份) 30 30 30       90 30 30 聚合物2(質量份)          30             聚合物3(質量份)             30          F粒子                            F粒子1(質量份)                200    99 無機物                            無機物1(質量份)                      1 分散介質                            NMP(質量份) 120 120 120 120 120 360 120 120 分散液評價 分散穩定性 × × 成分沈澱率 × 黏度(25℃)(mPa・s) 18000 19000 21000 19000 22000 20000 80000 60000 積層體評價 線膨脹係數 × × [Table 1] Table 1 example 1-1 1-2 1-3 1-4 1-5 1-6 1-7 1-8 Dispersion No. 1 2 3 4 5 6 7 8 Composition of the dispersion Composite particles (F particles) F particle 1 (mass part) 99 99 99 99 99 F particle 2 (mass part) 99 PTFE1 (parts by mass) 99 Composite particles (inorganic) Inorganic substance 1 (mass part) 1 1 1 1 1 1 1 (composite particle number) 1 2 3 1 1 1 4 Aromatic polymers Polymer 1 (parts by mass) 30 30 30 90 30 30 Polymer 2 (parts by mass) 30 Polymer 3 (parts by mass) 30 F particles F particle 1 (mass part) 200 99 Inorganic Inorganic substance 1 (mass part) 1 dispersion medium NMP (parts by mass) 120 120 120 120 120 360 120 120 Dispersion evaluation Dispersion stability × × Component Precipitation Rate × Viscosity(25℃)(mPa・s) 18000 19000 21000 19000 22000 20000 80000 60000 Laminated body evaluation Linear expansion coefficient × ×

[例2-1] 1.複合粒子之製造 製備99質量份之F粒子1與1質量份之無機物1之混合物,以與例1-1之1.相同之方式而獲得複合粒子1。再者,複合粒子1之形狀為球狀,其D50為4 μm。[Example 2-1] 1. Manufacture of composite particles A mixture of 99 parts by mass of F particles 1 and 1 part by mass of inorganic substance 1 was prepared, and composite particles 1 were obtained in the same manner as in 1. of Example 1-1. In addition, the shape of the composite particle 1 was spherical, and its D50 was 4 μm.

2.分散液之製造及評價 向具備攪拌葉之槽中加入分散介質S1(甲苯)、分散介質S2(DMF)、上述所獲得之複合粒子1,以800 rpm攪拌15分鐘而獲得包含複合粒子1(100質量份)、甲苯(30質量份)及DMF(70質量份)之分散液9。所獲得之分散液9在25℃下之黏度為13000 mPa・s。 以與例1-1之2.相同之方式來評價分散液9之分散穩定性。2. Manufacture and evaluation of dispersion liquid The dispersion medium S1 (toluene), the dispersion medium S2 (DMF), and the composite particle 1 obtained above were added to a tank equipped with a stirring blade, and the mixture was stirred at 800 rpm for 15 minutes to obtain a composite particle 1 (100 parts by mass), toluene ( 30 parts by mass) and dispersion 9 of DMF (70 parts by mass). The viscosity of the obtained dispersion liquid 9 at 25°C was 13000 mPa·s. The dispersion stability of the dispersion liquid 9 was evaluated in the same manner as in 2. of Example 1-1.

3.乾膜、以及積層體之製作及評價 於長條銅箔(厚度18 μm)之表面,使用棒式塗佈機塗佈分散液9而形成濕膜。繼而,將形成有該濕膜之金屬箔在100℃下通入乾燥爐5分鐘,藉由加熱使其乾燥而獲得乾膜1。 藉由目視並依據下述基準來評價乾膜1之平滑性。 <乾膜之平滑性> 〇:表面整體平滑。 △:於表面之緣部觀察到凝聚物或因粉末脫落而形成之凹凸。 ×:於整個表面觀察到凝聚物或因粉末脫落而形成之凹凸。3. Production and evaluation of dry films and laminates On the surface of the long copper foil (thickness 18 μm), the dispersion liquid 9 was applied using a bar coater to form a wet film. Next, the metal foil on which the wet film was formed was passed into a drying furnace at 100° C. for 5 minutes, and dried by heating to obtain a dry film 1 . The smoothness of the dry film 1 was evaluated by visual observation and according to the following criteria. <Smoothness of dry film> 〇: The entire surface is smooth. Δ: Aggregates or irregularities due to powder falling off were observed at the edge of the surface. ×: Aggregates or irregularities due to powder falling off were observed on the entire surface.

再者,進而於氮氣烘箱中在380℃下將具有乾膜1之金屬箔加熱3分鐘,而製成具有金屬箔、及位於其表面之包含F粒子1之熔融焙燒物、無機物1及聚合物1之聚合物層(厚度20 μm)的積層體1。該聚合物層未發現凝聚物或伴隨發泡而形成之凹凸,從而表面平滑性優異。Furthermore, the metal foil with the dry film 1 was heated in a nitrogen oven at 380° C. for 3 minutes to produce a metal foil and a molten calcined product including the F particles 1 on the surface, the inorganic substance 1 and the polymer. Laminate 1 of polymer layer 1 (thickness 20 μm). In the polymer layer, no aggregates or irregularities due to foaming were found, and the polymer layer was excellent in surface smoothness.

[例2-2~例2-5] 除按下表2所示變更各成分之種類及量以外,以與例2-1相同之方式獲得複合粒子5及分散液10~13,並製造乾膜2~5。將所獲得之分散液及乾膜之評價結果示於表2。[Example 2-2 to Example 2-5] The composite particles 5 and the dispersions 10 to 13 were obtained in the same manner as in Example 2-1, except that the types and amounts of the components were changed as shown in Table 2 below, and the dry films 2 to 5 were produced. Table 2 shows the evaluation results of the obtained dispersion liquid and dry film.

[表2] 表2 2-1 2-2 2-3 2-4 2-5 分散液編號 9 10 11 12 13 分散液之組成                複合粒子(F粒子)                   F粒子1(質量份) 99    99       F粒子3(質量份)    99    99 99 複合粒子(無機物)                   無機物1(質量份) 1 1 1 1 1 (複合粒子編號) 1 5 1 5 5 F粒子                   F粒子1(質量份)       100       分散介質S1                   甲苯(質量份) 30 30 60    100 分散介質S2                   DMF(質量份) 70 70 140 100    分散液評價 分散穩定性 × 黏度(25℃)(mPa・s) 13000 15000 13000 18000 25000 乾膜評價 乾膜之平滑性 × × [Table 2] Table 2 example 2-1 2-2 2-3 2-4 2-5 Dispersion No. 9 10 11 12 13 Composition of the dispersion Composite particles (F particles) F particle 1 (mass part) 99 99 F particle 3 (mass part) 99 99 99 Composite particles (inorganic) Inorganic substance 1 (mass part) 1 1 1 1 1 (composite particle number) 1 5 1 5 5 F particles F particle 1 (mass part) 100 Dispersion medium S1 Toluene (parts by mass) 30 30 60 100 Dispersion medium S2 DMF (parts by mass) 70 70 140 100 Dispersion evaluation Dispersion stability × Viscosity(25℃)(mPa・s) 13000 15000 13000 18000 25000 Dry film evaluation Smoothness of dry film × ×

[例3-1] 1.複合粒子之製作 製備70質量份之F粒子1與30質量份之二氧化矽粒子1之混合物。 繼而,向下述粉體處理裝置(Hybridization System(註冊商標))中投入混合物,該粉體處理裝置係於圓筒狀容器內一面用高速旋轉之攪拌葉攪拌粒子,一面於容器之內壁與攪拌葉之間夾持粒子而施加應力。然後,使F粒子1與二氧化矽粒子1在高溫亂流氛圍下懸浮並碰撞,對其等之間賦予應力而進行複合化處理。再者,將處理中之裝置內設為氮氣氛圍下,將溫度保持於120℃以下,將複合化處理時間設為15分鐘。 利用光學顯微鏡對所獲得之微粉進行分析,結果為以粒子狀之F聚合物1作為核,且於該核之表面附著二氧化矽粒子1而形成了殼之核殼結構之球狀複合粒子6(D50:3 μm)。[Example 3-1] 1. Production of composite particles A mixture of 70 parts by mass of F particles 1 and 30 parts by mass of silica particles 1 was prepared. Then, the mixture was put into the following powder processing device (Hybridization System (registered trademark)), which was in a cylindrical container while stirring the particles with a stirring blade rotating at a high speed, and on the inner wall of the container while stirring the particles. Stress is applied by sandwiching the particles between the stirring blades. Then, the F particles 1 and the silicon dioxide particles 1 are suspended and collided in a high-temperature turbulent atmosphere, and stress is applied between them to perform a composite treatment. In addition, the inside of the apparatus in process was set to nitrogen atmosphere, the temperature was maintained at 120 degrees C or less, and the composite treatment time was set to 15 minutes. The obtained micropowder was analyzed with an optical microscope, and the result was spherical composite particles 6 having a core-shell structure of a shell with a particle-like F polymer 1 as a core, and silica particles 1 attached to the surface of the core to form a shell. (D50: 3 μm).

2.藉由ESCA進行之複合粒子之表面測定 於藉由ESCA來測定表面時,使用ULVAC-PHI公司製造之ESCA5500。關於X射線源,以14 kV使用單色化AlKα射線,利用離子槍及使用氧化鋇發射器之中和槍,防止樣品表面之帶電,並且將光電子檢測面積設為800 μm

Figure 02_image003
,將光電子檢測角設為45度,將通過能量設為93.8 eV,將能階設為0.8 eV/step,將累計數設為16個循環。又,氟原子之含有比率係根據藉由測定所檢測出之各種峰強度(C1s、O1s、F1s及Si2s軌道)而算出。又,距離表面之深度係基於使用C60離子作為濺射離子之SiO2 濺射膜之濺射速率而決定。將各複合粒子之表面中之矽原子之量相對於氟原子之量(以下亦記為「Si/F量」)示於表3。2. Surface measurement of composite particles by ESCA When the surface was measured by ESCA, ESCA5500 manufactured by ULVAC-PHI was used. As for the X-ray source, monochromatic AlKα rays were used at 14 kV, an ion gun and a barium oxide emitter neutralization gun were used to prevent the electrification of the sample surface, and the photoelectron detection area was set to 800 μm
Figure 02_image003
, the photoelectron detection angle was set to 45 degrees, the passing energy was set to 93.8 eV, the energy level was set to 0.8 eV/step, and the cumulative number was set to 16 cycles. In addition, the content ratio of a fluorine atom was calculated from the various peak intensities (C1s, O1s, F1s, and Si2s orbitals) detected by the measurement. In addition, the depth from the surface was determined based on the sputtering rate of the SiO 2 sputtering film using C60 ions as sputtering ions. Table 3 shows the amount of silicon atoms in the surface of each composite particle relative to the amount of fluorine atoms (hereinafter also referred to as "Si/F amount").

3.評價 3-1.分散穩定性之評價 向容器內加入複合粒子6及NMP,在不加入界面活性劑之情況下於容器內進行攪拌,而製備分散有複合粒子6之液狀組合物1。將液狀組合物1放置特定時間,依據以下基準評價其分散穩定性。 [評價基準] 〇:於製備時起泡得到抑制,於製備後,即便在25℃下靜置3天,亦未產生沈澱物。 △:雖於製備時有起泡,但製備後,即便在25℃下靜置3天,亦未產生沈澱物。 ×:在25℃下靜置3天時,產生沈澱物。3. Evaluation 3-1. Evaluation of dispersion stability The composite particles 6 and NMP were added to the container, and the container was stirred without adding a surfactant to prepare a liquid composition 1 in which the composite particles 6 were dispersed. The liquid composition 1 was left to stand for a predetermined time, and the dispersion stability thereof was evaluated according to the following criteria. [Evaluation Criteria] ○: Foaming was suppressed during preparation, and after preparation, even if it was left to stand at 25°C for 3 days, no precipitate was generated. Δ: Although foaming occurred during the preparation, even if it was left to stand at 25° C. for 3 days after preparation, no precipitate was generated. ×: Precipitates were generated when left to stand at 25°C for 3 days.

3-2.落粉及翹曲之評價 於長條銅箔(厚度18 μm)之表面,使用棒式塗佈機塗佈液狀組合物1而形成液狀覆膜。繼而,將形成有該液狀覆膜之銅箔在120℃下通入乾燥爐5分鐘,藉由加熱使其乾燥而獲得乾燥覆膜。然後,於氮氣烘箱中在380℃下將乾燥覆膜加熱3分鐘。藉此,獲得具有銅箔、及位於其表面之包含聚合物之熔融焙燒物及二氧化矽之聚合物層的積層體。3-2. Evaluation of powder falling and warpage The liquid composition 1 was applied to the surface of a long copper foil (thickness: 18 μm) using a bar coater to form a liquid coating. Next, the copper foil on which the liquid coating was formed was passed into a drying furnace at 120° C. for 5 minutes, and dried by heating to obtain a dry coating. Then, the dried film was heated in a nitrogen oven at 380°C for 3 minutes. Thereby, the laminated body which has a copper foil, and the polymer layer which consists of the molten calcination of a polymer and a silicon dioxide located on the surface is obtained.

對乾燥覆膜之落粉、及積層體之翹曲進行評價。 乾燥覆膜之落粉係目視確認乾燥覆膜之緣部,依據以下基準進行評價。 [落粉之評價基準] 〇:於乾燥覆膜之緣部未確認到脫落。 △:於乾燥覆膜之緣部之一部分確認到脫落。 ×:於乾燥覆膜之緣部之較寬之範圍確認到脫落。The powder fall of the dry coating and the warpage of the laminate were evaluated. The powder fall of the dry coating was visually confirmed at the edge of the dry coating, and evaluated according to the following criteria. [Evaluation criteria for falling powder] ○: No peeling was observed at the edge of the dry coating. △: Peeling was observed in a part of the edge of the dry coating. ×: Peeling was confirmed in a wide range of the edge portion of the dry coating.

利用氯化鐵水溶液藉由蝕刻來去除積層體之銅箔,而製作單一之聚合物層。自聚合物層切出180 mm見方之方形試片,藉由JIS C 6471:1995所規定之測定方法對試片進行測定,並依據以下基準進行評價。 [翹曲之評價基準] 〇:線膨脹係數未達±20 ppm/℃。 △:線膨脹係數為±20 ppm/℃以上且未達±30 ppm/℃。 ×:線膨脹係數為±30 ppm/℃以上。 將以上評價結果示於表4。The copper foil of the laminated body was removed by etching using an aqueous ferric chloride solution to produce a single polymer layer. A square test piece of 180 mm square was cut out from the polymer layer, and the test piece was measured by the measurement method specified in JIS C 6471:1995, and the evaluation was performed according to the following criteria. [Evaluation criteria for warpage] ○: The coefficient of linear expansion is less than ±20 ppm/°C. △: The linear expansion coefficient is ±20 ppm/°C or more and less than ±30 ppm/°C. ×: The linear expansion coefficient is ±30 ppm/°C or more. The above evaluation results are shown in Table 4.

[例3-2~例3-5] 除按表1所示變更粒子之種類與量以外,以與例3-1相同之方式獲得複合粒子7~10,使用複合粒子7~10製備液狀組合物2~5。又,分別使用液狀組合物2~5獲得積層體。將複合粒子之表面測定結果、各液狀組合物之分散穩定性、乾燥覆膜之落粉及積層體之翹曲之評價結果示於表3及表4。[Example 3-2 to Example 3-5] The composite particles 7 to 10 were obtained in the same manner as in Example 3-1 except that the types and amounts of the particles were changed as shown in Table 1, and the composite particles 7 to 10 were used to prepare the liquid compositions 2 to 5. Moreover, the laminated body was obtained using the liquid compositions 2-5, respectively. Table 3 and Table 4 show the surface measurement results of the composite particles, the dispersion stability of each liquid composition, the powder falling of the dry coating, and the evaluation results of the warpage of the laminate.

[表3] 表3 3-1 3-2 3-3 3-4 3-5 複合粒子編號 6 7 8 9 10 F粒子或PTFE粒子 F粒子1(70) F粒子1(70) F粒子4(70) F粒子1(90) PTFE2 (70) 二氧化矽粒子編號 1(30) 2(30) 1(30) 1(10) 1(30) Si/F量 1.3 1.1 1.1 0.6 0.2 ※括弧內之數值係各個複合粒子中之含量(單元:質量份)。 [table 3] table 3 example 3-1 3-2 3-3 3-4 3-5 Composite particle number 6 7 8 9 10 F particles or PTFE particles F particle 1 (70) F particle 1 (70) F particle 4 (70) F particle 1 (90) PTFE2 (70) Silicon dioxide particle number 1(30) 2(30) 1(30) 1(10) 1(30) Si/F content 1.3 1.1 1.1 0.6 0.2 ※The value in parentheses is the content in each composite particle (unit: part by mass).

[表4] 表4 3-1 3-2 3-3 3-4 3-5 複合粒子編號 6 7 8 9 10 液狀組合物分散穩定性 × 乾燥覆膜落粉 × × 積層體翹曲 × × [產業上之可利用性][Table 4] Table 4 example 3-1 3-2 3-3 3-4 3-5 Composite particle number 6 7 8 9 10 Liquid composition dispersion stability × dry lamination powder × × Laminate warpage × × [Industrial Availability]

本發明之分散液之分散穩定性優異,可容易地加工成膜、纖維強化膜、預浸體、金屬積層板(附帶樹脂之金屬箔)。所獲得之加工物品可用作天線零件、印刷基板、航空器用零件、汽車用零件、運動用具、食品工業用品、滑動軸承等材料。 又,本發明之複合粒子之操作性及在分散介質中之分散穩定性優異。包含本發明之複合粒子之液狀組合物可用於製造具備基於F聚合物之物性及基於二氧化矽之特性之成形物(積層體、膜等)。由本發明之複合粒子形成之成形物可用作天線零件、印刷基板、航空器用零件、汽車用零件、運動用具、食品工業用品、塗料、化妝品等,具體而言,可用作:電線被覆材(航空器用電線等)、電絕緣性膠帶、石油鑽探用絕緣膠帶、印刷基板用材料、分離膜(微濾膜、超濾膜、逆滲透膜、離子交換膜、透析膜、氣體分離膜等)、電極黏合劑(鋰二次電池用、燃料電池用等)、複製輥、傢俱、汽車儀錶板、家電製品等之外罩、滑動構件(負載軸承、滑動軸、閥、軸承、齒輪、凸輪、帶式輸送機、食品搬送用帶等)、工具(鏟、銼、錐子、鋸等)、鍋爐、漏斗、管道管、烘箱、烤模、滑槽、眼模、馬桶、容器被覆材。The dispersion liquid of the present invention has excellent dispersion stability, and can be easily processed into films, fiber-reinforced films, prepregs, and metal laminates (metal foils with resin). The obtained processed articles can be used as antenna parts, printed circuit boards, parts for aircraft, parts for automobiles, sports equipment, food industry supplies, sliding bearings and other materials. In addition, the composite particles of the present invention are excellent in handleability and dispersion stability in a dispersion medium. The liquid composition containing the composite particles of the present invention can be used for the production of molded articles (laminates, films, etc.) having properties based on F polymer and properties based on silica. The molded article formed from the composite particles of the present invention can be used as antenna parts, printed circuit boards, parts for aircrafts, parts for automobiles, sports equipment, food industry products, paints, cosmetics, etc. Specifically, it can be used as a wire coating material ( Aircraft wires, etc.), electrical insulating tapes, insulating tapes for oil drilling, materials for printed circuit boards, separation membranes (microfiltration membranes, ultrafiltration membranes, reverse osmosis membranes, ion exchange membranes, dialysis membranes, gas separation membranes, etc.), Electrode binders (for lithium secondary batteries, fuel cells, etc.), replica rolls, furniture, car dashboards, home appliances, etc. covers, sliding members (load bearings, sliding shafts, valves, bearings, gears, cams, belts) Conveyors, food conveying belts, etc.), tools (shovels, files, awls, saws, etc.), boilers, funnels, pipes, ovens, baking molds, chutes, eye molds, toilets, container coverings.

Claims (15)

一種分散液,其含有包含熔融溫度為260~320℃之四氟乙烯系聚合物及無機物之複合粒子、芳香族聚合物、以及液狀分散介質,上述複合粒子分散於上述液狀分散介質中,且上述分散液在25℃下之黏度為1000~100000 mPa・s。A dispersion liquid comprising composite particles comprising a tetrafluoroethylene-based polymer having a melting temperature of 260 to 320° C. and an inorganic substance, an aromatic polymer, and a liquid dispersion medium, wherein the composite particles are dispersed in the liquid dispersion medium, And the viscosity of the dispersion liquid at 25°C is 1000-100000 mPa·s. 如請求項1之分散液,其中上述四氟乙烯系聚合物為包含基於全氟(烷基乙烯基醚)之單元且具有極性官能基之四氟乙烯系聚合物,或者為相對於總單元包含2.0~5.0莫耳%之基於全氟(烷基乙烯基醚)之單元且不具有極性官能基之四氟乙烯系聚合物。The dispersion liquid according to claim 1, wherein the tetrafluoroethylene-based polymer is a tetrafluoroethylene-based polymer containing a perfluoro(alkyl vinyl ether)-based unit and having a polar functional group, or is a tetrafluoroethylene-based polymer containing a unit based on a perfluoro(alkyl vinyl ether) and having a polar functional group, or a 2.0-5.0 mol % of tetrafluoroethylene-based polymers based on perfluoro(alkyl vinyl ether) units and not having polar functional groups. 如請求項1或2之分散液,其中上述無機物為二氧化矽。The dispersion liquid of claim 1 or 2, wherein the inorganic substance is silicon dioxide. 如請求項1至3中任一項之分散液,其中上述芳香族聚合物之含量少於上述複合粒子之含量。The dispersion liquid according to any one of claims 1 to 3, wherein the content of the above-mentioned aromatic polymer is less than the content of the above-mentioned composite particles. 如請求項1至4中任一項之分散液,其中上述芳香族聚合物為選自由芳香族聚醯亞胺、芳香族聚醯胺、芳香族聚醯胺醯亞胺、聚苯醚、液晶聚酯、芳香族馬來醯亞胺所組成之群中之至少一種。The dispersion liquid according to any one of claims 1 to 4, wherein the aromatic polymer is selected from the group consisting of aromatic polyimide, aromatic polyamide, aromatic polyamide imide, polyphenylene ether, liquid crystal At least one of the group consisting of polyester and aromatic maleimide. 一種分散液,其含有包含熔融溫度為260~320℃之四氟乙烯系聚合物及無機物之複合粒子、以及液狀分散介質,上述複合粒子分散於上述液狀分散介質中,並且上述液狀分散介質包含沸點不同之兩種液狀分散介質,且上述兩種液狀分散介質處於生成共沸混合物之關係。A dispersion liquid containing composite particles comprising a tetrafluoroethylene-based polymer having a melting temperature of 260 to 320° C. and an inorganic substance, and a liquid dispersion medium, wherein the composite particles are dispersed in the liquid dispersion medium, and the liquid dispersion The medium includes two liquid dispersion media having different boiling points, and the two liquid dispersion media are in a relationship of forming an azeotrope. 如請求項6之分散液,其中上述四氟乙烯系聚合物為包含基於全氟(烷基乙烯基醚)之單元且具有極性官能基之四氟乙烯系聚合物,或者為相對於總單元包含2.0~5.0莫耳%之基於全氟(烷基乙烯基醚)之單元且不具有極性官能基之四氟乙烯系聚合物。The dispersion liquid according to claim 6, wherein the tetrafluoroethylene-based polymer is a tetrafluoroethylene-based polymer containing a perfluoro(alkyl vinyl ether)-based unit and having a polar functional group, or is a tetrafluoroethylene-based polymer containing a polar functional group relative to the total unit 2.0-5.0 mol % of tetrafluoroethylene-based polymers based on perfluoro(alkyl vinyl ether) units and not having polar functional groups. 如請求項6或7之分散液,其中上述沸點不同之兩種液狀分散介質中之高沸點分散介質之混合量比多於上述兩種液狀分散介質之共沸混合物中之高沸點分散介質之組成比(質量比)。The dispersion liquid of claim 6 or 7, wherein the mixing ratio of the high-boiling-point dispersion medium in the above-mentioned two liquid dispersion media with different boiling points is more than that of the high-boiling-point dispersion medium in the azeotropic mixture of the above-mentioned two liquid dispersion media The composition ratio (mass ratio). 如請求項6至8中任一項之分散液,其中構成上述液狀分散介質之沸點不同之兩種液狀分散介質之至少一種為水、醇或醯胺。The dispersion liquid according to any one of claims 6 to 8, wherein at least one of the two liquid dispersion media having different boiling points constituting the above-mentioned liquid dispersion medium is water, alcohol or amide. 一種複合粒子,其含有熔融溫度為260~320℃且相對於總單元包含1~5莫耳%之基於全氟(烷基乙烯基醚)之單元的四氟乙烯系聚合物、以及二氧化矽,藉由X射線光電子光譜法所測得之表面之矽原子之量相對於氟原子之量為1以上。A composite particle containing a tetrafluoroethylene-based polymer having a melting temperature of 260 to 320° C. and containing 1 to 5 mol % of perfluoro(alkyl vinyl ether)-based units with respect to the total units, and silica , the amount of silicon atoms on the surface measured by X-ray photoelectron spectroscopy is 1 or more relative to the amount of fluorine atoms. 如請求項10之複合粒子,其平均粒徑為2 μm以上10 μm以下。The composite particles according to claim 10 have an average particle diameter of 2 μm or more and 10 μm or less. 如請求項10或11之複合粒子,其中相對於上述四氟乙烯系聚合物100質量份,上述二氧化矽為15~85質量份。The composite particle according to claim 10 or 11, wherein the amount of the silica is 15 to 85 parts by mass relative to 100 parts by mass of the tetrafluoroethylene-based polymer. 如請求項10至12中任一項之複合粒子,其以上述四氟乙烯系聚合物作為核,且於上述核之表面具有上述二氧化矽。The composite particle according to any one of claims 10 to 12, wherein the above-mentioned tetrafluoroethylene-based polymer is used as a core, and the above-mentioned silica is provided on the surface of the above-mentioned core. 如請求項10至13中任一項之複合粒子,其中上述四氟乙烯系聚合物為具有極性官能基之四氟乙烯系聚合物。The composite particle according to any one of claims 10 to 13, wherein the tetrafluoroethylene-based polymer is a tetrafluoroethylene-based polymer having a polar functional group. 一種複合粒子之製造方法,該複合粒子為如請求項10至14中任一項之複合粒子,上述複合粒子之製造方法係使上述四氟乙烯系聚合物之粒子與上述二氧化矽於上述四氟乙烯系聚合物之熔融溫度以上之溫度下且懸浮狀態下進行碰撞,而獲得上述複合粒子。A method for producing composite particles, the composite particles being the composite particles according to any one of Claims 10 to 14, wherein the method for producing the composite particles comprises mixing the particles of the tetrafluoroethylene-based polymer with the silica in the four The above-mentioned composite particles are obtained by colliding in a suspended state at a temperature higher than the melting temperature of the vinyl fluoride-based polymer.
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