TW202208476A - Method for producing benzoxazine compound-containing mixture - Google Patents

Method for producing benzoxazine compound-containing mixture Download PDF

Info

Publication number
TW202208476A
TW202208476A TW110123329A TW110123329A TW202208476A TW 202208476 A TW202208476 A TW 202208476A TW 110123329 A TW110123329 A TW 110123329A TW 110123329 A TW110123329 A TW 110123329A TW 202208476 A TW202208476 A TW 202208476A
Authority
TW
Taiwan
Prior art keywords
mixture
formula
compound
group
aminophenol
Prior art date
Application number
TW110123329A
Other languages
Chinese (zh)
Inventor
南昌樹
尾野秀樹
澤田亮人
Original Assignee
日商引能仕股份有限公司
日商首選網絡股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商引能仕股份有限公司, 日商首選網絡股份有限公司 filed Critical 日商引能仕股份有限公司
Publication of TW202208476A publication Critical patent/TW202208476A/en

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D265/00Heterocyclic compounds containing six-membered rings having one nitrogen atom and one oxygen atom as the only ring hetero atoms
    • C07D265/041,3-Oxazines; Hydrogenated 1,3-oxazines
    • C07D265/121,3-Oxazines; Hydrogenated 1,3-oxazines condensed with carbocyclic rings or ring systems
    • C07D265/141,3-Oxazines; Hydrogenated 1,3-oxazines condensed with carbocyclic rings or ring systems condensed with one six-membered ring
    • C07D265/161,3-Oxazines; Hydrogenated 1,3-oxazines condensed with carbocyclic rings or ring systems condensed with one six-membered ring with only hydrogen or carbon atoms directly attached in positions 2 and 4
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/06Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Nitrogen And Oxygen As The Only Ring Hetero Atoms (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Epoxy Resins (AREA)

Abstract

To provide a method for producing a mixture containing a benzoxazine compound. The mixture has compatibility with other resins (and preferably epoxy compounds) and, when incorporated in a curable composition, can give a cured product having high heat resistance. Provided is a method for producing a mixture containing a benzoxazine compound represented by formula (1), the method including a step for subjecting p-aminophenol, an aromatic primary monoamine compound, a bisphenol compound and a formaldehyde compound to a condensation reaction. In the condensation reaction step, the ratio (OH/NH2) of phenolic hydroxyl groups derived from the p-aminophenol and the bisphenol compound and amino groups derived from the p-aminophenol and the aromatic primary monoamine compound is 1.05/1-1.15/1.

Description

含有苯并㗁𠯤化合物之混合物之製造方法Method for producing mixtures containing benzos

本發明係關於一種含有苯并㗁𠯤化合物之混合物之製造方法。The present invention relates to a method for producing a mixture containing a benzodiazepine compound.

硬化樹脂用於半導體密封材、纖維強化塑膠等各種用途,使用苯并㗁𠯤化合物作為其原料之一。 所謂苯并㗁𠯤化合物係指包含具有苯骨架及㗁𠯤骨架之苯并㗁𠯤環之化合物,其硬化物(聚合物)之耐熱性等物性優異,於多方面用途中用作高性能材料。Hardening resins are used in various applications such as semiconductor sealing materials and fiber-reinforced plastics, and benzoxyl compounds are used as one of the raw materials. The benzodiazepine compound refers to a compound containing a benzodiazepine ring having a benzene skeleton and a skeleton skeleton, and its cured product (polymer) has excellent physical properties such as heat resistance, and is used as a high-performance material in various applications.

作為苯并㗁𠯤化合物,例如於專利文獻1中,揭示一種作為用於製造具有較高熱導率之苯并㗁𠯤樹脂硬化物之原料的特定結構之苯并㗁𠯤化合物及其製造方法。As a benzodiazepine compound, for example, Patent Document 1 discloses a benzodiazepine compound having a specific structure as a raw material for producing a cured benzodiazepine resin having high thermal conductivity, and a method for producing the same.

又,於專利文獻2中,揭示一種將主鏈中具有特定結構之苯并㗁𠯤環結構之聚苯并㗁𠯤樹脂之反應性末端封端的熱硬化性樹脂。In addition, Patent Document 2 discloses a thermosetting resin in which reactive ends of a polybenzodiazepine resin having a benzodiazepine ring structure having a specific structure in the main chain are blocked.

進而,作為獲得苯并㗁𠯤化合物之方法,已知以對胺基苯酚為原料之方法。例如於非專利文獻1中,揭示一種使用對胺基苯酚而合成之苯并㗁𠯤化合物。 [先前技術文獻] [專利文獻]Furthermore, as a method for obtaining a benzodiazepine compound, a method using p-aminophenol as a raw material is known. For example, Non-Patent Document 1 discloses a benzodiazepine compound synthesized using p-aminophenol. [Prior Art Literature] [Patent Literature]

[專利文獻1]日本專利特開2013-060407號公報 [專利文獻2]日本專利特開2012-036318號公報 [非專利文獻][Patent Document 1] Japanese Patent Laid-Open No. 2013-060407 [Patent Document 2] Japanese Patent Laid-Open No. 2012-036318 [Non-patent literature]

[非專利文獻1]TAREK AGAG, TSUTOMU TAKEICHI, Journal of Polymer Science: Part A: Polymer Chemistry, 2007, vol.45, p.1878-1888[Non-Patent Document 1] TAREK AGAG, TSUTOMU TAKEICHI, Journal of Polymer Science: Part A: Polymer Chemistry, 2007, vol.45, p.1878-1888

[發明所欲解決之問題][Problems to be Solved by Invention]

根據本發明人等之研究,可知於以對胺基苯酚為原料獲得苯并㗁𠯤化合物之情形時,其分子量分佈之控制較為困難,高分子量體會降低與其他樹脂之相容性,低分子量體會降低耐熱性。進而,根據本發明人等之研究,可知雖然高分子量體之生成可藉由添加芳香族一級單胺類或單酚類作為封端劑來抑制,但亦有由於由芳香族一級單胺類及單酚類生成之苯并㗁𠯤單體,硬化後之耐熱性降低之問題。According to the research of the present inventors, it can be known that when a benzodiazepine compound is obtained by using p-aminophenol as a raw material, it is difficult to control its molecular weight distribution, the high molecular weight will reduce the compatibility with other resins, and the low molecular weight will reduce the compatibility with other resins. Reduce heat resistance. Furthermore, according to the study by the present inventors, it was found that although the formation of high molecular weight compounds can be suppressed by adding aromatic primary monoamines or monophenols as end-capping agents, there are also reasons for the presence of aromatic primary monoamines and The problem of reduced heat resistance after curing of the benzophenone monomers produced by monophenols.

因此,本發明之目的在於提供一種對其他樹脂(較佳為環氧化合物)具有相容性,並且進而於包含於硬化性組合物時其硬化物可具有高耐熱性的包含苯并㗁𠯤化合物而成之混合物之製造方法。Therefore, an object of the present invention is to provide a benzodiazepine-containing compound which is compatible with other resins (preferably epoxy compounds), and which, when contained in a curable composition, can have a hardened product with high heat resistance A method for producing the resulting mixture.

本發明人等為了解決上述課題而進行了銳意研究,結果發現以特定之比率使用特定之原料而合成之含有苯并㗁𠯤化合物之混合物可抑制高分子量體及低分子量體之生成,因此對其他樹脂(較佳為環氧化合物)之相容性優異,並且可降低與其他樹脂(較佳為環氧化合物)混合時之黏度,進而於使該混合物包含於硬化性組合物時,其硬化物之高耐熱性優異,從而完成本發明。 [解決問題之技術手段]The inventors of the present invention have made intensive studies in order to solve the above-mentioned problems, and as a result, they have found that a mixture containing a benzodiazepine compound synthesized by using a specific raw material in a specific ratio can suppress the formation of high molecular weight and low molecular weight forms. The resin (preferably an epoxy compound) has excellent compatibility and can reduce the viscosity when mixed with other resins (preferably an epoxy compound), and when the mixture is included in the curable composition, the cured product The high heat resistance is excellent, and the present invention has been completed. [Technical means to solve problems]

即,本發明包含以下發明。 [1]一種混合物之製造方法,該混合物之製造方法係包括使對胺基苯酚、芳香族一級單胺類、雙酚類與甲醛類進行縮合反應之步驟而成,該混合物係包含下述式(1)所表示之苯并㗁𠯤化合物而成,且 上述縮合反應步驟中之源自上述對胺基苯酚及上述雙酚類之酚性羥基、與源自上述對胺基苯酚及上述芳香族一級單胺類之胺基的比(OH/NH2 )為1.05/1~1.15/1。 [化1]

Figure 02_image003
式(1) [式(1)中,L為碳數1~10之伸烷基、碳數7~21之伸芳烷基、氧、硫或磺醯基,Ar分別獨立為可經取代之芳基,m、n分別獨立為0以上之整數] [2]如[1]所記載之方法,其中式(1)之芳基可由1~3個取代基R1 取代,該取代基R1 分別獨立地選自由烷基、烷氧基、酯基、醯胺基、氰基及鹵素原子所組成之群。 [3]如[1]或[2]所記載之方法,其中於上述縮合反應步驟中,上述對胺基苯酚及上述芳香族一級單胺類之胺基中之上述對胺基苯酚之胺基的含有率為25~75莫耳%。 [4]如[1]至[3]中任一項所記載之方法,其中於上述縮合反應步驟中,源自上述對胺基苯酚及上述雙酚類之酚性羥基中之上述對胺基苯酚之酚性羥基的含有率為25~75莫耳%以下。 [5]如[1]至[4]中任一項所記載之方法,其中上述混合物之數量平均分子量為600~1500, 相對於上述混合物總量,式(1)中之m及n為0之苯并㗁𠯤化合物之比率為20面積%以下。 [6]如[1]至[5]中任一項所記載之方法,其中上述混合物係包含式(1)中之m及n之合計值不同之苯并㗁𠯤化合物而成。 [7]如[1]至[6]中任一項所記載之方法,其中上述混合物係包含式(1)中之m及n之合計值為1以上之苯并㗁𠯤化合物而成。 [8]如[1]至[7]中任一項所記載之方法,其中相對於上述混合物總量,式(1)中之m及n之合計值為5以上之苯并㗁𠯤化合物之比率為20面積%以上70面積%以下。 [9]如[1]至[8]中任一項所記載之方法,其中相對於上述混合物總量,式(1)中之m及n之合計值為1~4之苯并㗁𠯤化合物之比率為25面積%以上。 [10]如[1]至[9]中任一項所記載之方法,其中上述混合物之分子量分散度為1.05~2.50。 [11]一種混合物,其係藉由如[1]至[10]中任一項所記載之方法而獲得。 [12]一種硬化性組合物,其係包含如[11]所記載之混合物而成。 [13]如[12]所記載之硬化性組合物,其係進而包含硬化劑及所需之硬化促進劑而成。 [14]如[12]或[13]所記載之硬化性組合物,其進而包含環氧化合物。 [15]一種硬化物,其係使如[12]至[14]中任一項所記載之硬化性組合物硬化而成。 [發明之效果]That is, the present invention includes the following inventions. [1] A method for producing a mixture comprising the step of subjecting p-aminophenol, aromatic primary monoamines, bisphenols and formaldehyde to a condensation reaction, the mixture comprising the following formula (1) The benzodiazepine compound represented by the above-mentioned condensation reaction step is composed of the phenolic hydroxyl group derived from the above-mentioned p-aminophenol and the above-mentioned bisphenols, and the above-mentioned p-aminophenol and the above-mentioned aromatic group. The ratio of the amine groups of the primary monoamines (OH/NH 2 ) is 1.05/1 to 1.15/1. [hua 1]
Figure 02_image003
Formula (1) [In formula (1), L is an alkylene group having 1 to 10 carbon atoms, an aralkylene group having 7 to 21 carbon atoms, oxygen, sulfur or sulfonyl group, and Ar is independently substituted. Aryl group, m and n are each independently an integer of 0 or more] [2] The method according to [1], wherein the aryl group of the formula (1) may be substituted by 1 to 3 substituents R 1 , and the substituent R 1 They are independently selected from the group consisting of alkyl group, alkoxy group, ester group, amide group, cyano group and halogen atom. [3] The method according to [1] or [2], wherein in the condensation reaction step, the amine group of the p-aminophenol among the amine groups of the p-aminophenol and the aromatic primary monoamines The content of 25 to 75 mol%. [4] The method according to any one of [1] to [3], wherein in the condensation reaction step, the p-amino group derived from the p-aminophenol and the phenolic hydroxyl group of the bisphenols The content rate of the phenolic hydroxyl group of phenol is 25 to 75 mol % or less. [5] The method according to any one of [1] to [4], wherein the number average molecular weight of the mixture is 600 to 1500, and m and n in the formula (1) are 0 with respect to the total amount of the mixture The ratio of the benzoic compound is 20 area % or less. [6] The method according to any one of [1] to [5], wherein the mixture comprises a benzodiazepine compound having different total values of m and n in formula (1). [7] The method according to any one of [1] to [6], wherein the mixture contains a benzodiazepine compound whose total value of m and n in formula (1) is 1 or more. [8] The method according to any one of [1] to [7], wherein the sum of m and n in the formula (1) is 5 or more of the benzodiazepine compound with respect to the total amount of the mixture. The ratio is 20 area % or more and 70 area % or less. [9] The method according to any one of [1] to [8], wherein the total value of m and n in the formula (1) is 1 to 4 with respect to the total amount of the mixture. The ratio is 25% by area or more. [10] The method according to any one of [1] to [9], wherein the molecular weight dispersion of the mixture is 1.05 to 2.50. [11] A mixture obtained by the method as described in any one of [1] to [10]. [12] A curable composition comprising the mixture according to [11]. [13] The curable composition according to [12], further comprising a curing agent and a desired curing accelerator. [14] The curable composition according to [12] or [13], further comprising an epoxy compound. [15] A cured product obtained by curing the curable composition according to any one of [12] to [14]. [Effect of invention]

根據本發明,可提供一種對其他樹脂(較佳為環氧化合物)具有相容性,並且可製作具有高耐熱性之硬化物之包含式(1)所表示之苯并㗁𠯤化合物而成之混合物(以下亦稱為含有式(1)之苯并㗁𠯤化合物之混合物)。本發明之含有苯并㗁𠯤化合物之混合物於能夠降低該混合物與其他樹脂(較佳為環氧化合物)之製備物(即硬化性組合物)之黏度方面而言有利。又,根據本發明,可提供一種用於獲得具有高耐熱性之硬化物之硬化性組合物。According to the present invention, it is possible to provide a product comprising the benzodiazepine compound represented by the formula (1), which is compatible with other resins (preferably epoxy compounds) and can produce a cured product with high heat resistance. A mixture (hereinafter also referred to as a mixture containing a benzodiazepine compound of formula (1)). The mixture containing the benzodiazepine compound of the present invention is advantageous in that it can reduce the viscosity of the preparation (ie, the curable composition) of the mixture and other resins (preferably epoxy compounds). Further, according to the present invention, a curable composition for obtaining a cured product having high heat resistance can be provided.

含有苯并㗁 𠯤 化合物之混合物 根據本發明之一實施形態,藉由製造本發明之含有苯并㗁𠯤化合物之混合物之方法而製造之含有苯并㗁𠯤化合物之混合物係包含下述式(1)所表示之苯并㗁𠯤化合物而成。又,上述含有苯并㗁𠯤化合物之混合物可包含於硬化性組合物中。 [化2]

Figure 02_image005
式(1) [式(1)中,L為碳數1~10之伸烷基、碳數7~21之伸芳烷基、氧、硫或磺醯基,Ar分別獨立為可經取代之芳基,m、n分別獨立為0以上之整數]。 A mixture containing a benzodiazepine compound According to one embodiment of the present invention, a mixture containing a benzodiazepine compound produced by the method for producing a mixture containing a benzodiazepine compound of the present invention comprises the following formula (1 ) represented by the benzo 㗁𠯤 compound. In addition, the above-mentioned mixture containing a benzodiazepine compound may be contained in the curable composition. [hua 2]
Figure 02_image005
Formula (1) [In formula (1), L is an alkylene group having 1 to 10 carbon atoms, an aralkylene group having 7 to 21 carbon atoms, oxygen, sulfur or sulfonyl group, and Ar is independently substituted. In the aryl group, m and n are each independently an integer of 0 or more].

於上述式(1)中,L例如為碳數1~10之伸烷基、碳數7~21之伸芳烷基、氧、硫或磺醯基,較佳為碳數1~3之伸烷基、氧、硫或磺醯基。In the above formula (1), L is, for example, an alkylene group having 1 to 10 carbon atoms, an aralkylene group having 7 to 21 carbon atoms, oxygen, sulfur or sulfonyl group, preferably an alkylene group having 1 to 3 carbon atoms. Alkyl, oxygen, sulfur or sulfonyl.

上述式(1)中之L所表示之碳數1~10之伸烷基較佳為碳數1~6之伸烷基,更佳為碳數1~3之伸烷基。作為上述伸烷基之具體例,可例舉亞甲基、伸乙基、伸丙基、伸異丙基、四亞甲基、六亞甲基等,較佳為亞甲基、伸異丙基。The alkylene group having 1 to 10 carbon atoms represented by L in the above formula (1) is preferably an alkylene group having 1 to 6 carbon atoms, more preferably an alkylene group having 1 to 3 carbon atoms. Specific examples of the above alkylene group include methylene group, ethylidene group, propylidene group, isopropylidene group, tetramethylene group, hexamethylene group and the like, and methylene group and isopropylidene group are preferred. base.

上述式(1)中之L所表示之碳數7~21之伸芳烷基較佳為碳數7~15之伸芳烷基,更佳為碳數7~10之伸芳烷基。作為上述伸芳烷基之具體例,可例舉苯基亞甲基、二苯基亞甲基、1-苯基伸乙基、萘基亞甲基等,較佳為苯基亞甲基、二苯基亞甲基。The aralkylene group having 7 to 21 carbon atoms represented by L in the above formula (1) is preferably an arylene group having 7 to 15 carbon atoms, more preferably an arylene group having 7 to 10 carbon atoms. Specific examples of the above-mentioned arylene group include phenylmethylene, diphenylmethylene, 1-phenylethylidene, naphthylmethylene, and the like, preferably phenylmethylene, diphenylmethylene, and the like. Phenylmethylene.

上述式(1)中之Ar所表示之芳基之碳數並無特別限定,可例舉6~14,較佳為6~10(但是經取代之情形除外)。作為上述芳基之具體例,可例舉苯基、1-萘基、2-萘基、菲基、聯苯基等,較佳為苯基、1-萘基、2-萘基。再者,上述式(1)中之Ar所表示之芳基可相同,亦可不同。又,於m、n為0之情形時,Ar與L所鍵結之苯并㗁𠯤環之氮原子直接鍵結。The number of carbon atoms of the aryl group represented by Ar in the above formula (1) is not particularly limited, and examples thereof include 6 to 14, preferably 6 to 10 (except when substituted). Specific examples of the aryl group include a phenyl group, a 1-naphthyl group, a 2-naphthyl group, a phenanthryl group, a biphenyl group, and the like, and a phenyl group, a 1-naphthyl group, and a 2-naphthyl group are preferred. Furthermore, the aryl groups represented by Ar in the above formula (1) may be the same or different. In addition, when m and n are 0, Ar is directly bonded to the nitrogen atom of the benzodiazepine ring to which L is bonded.

上述式(1)中之Ar所表示之芳基可被取代。具體而言,上述芳基可由1~3個取代基R1 取代。作為該取代基R1 ,可例舉獨立地選自由烷基、烷氧基、酯基、醯胺基、氰基及鹵素原子所組成之群之基,較佳為烷基、烷氧基。The aryl group represented by Ar in the above formula (1) may be substituted. Specifically, the above-mentioned aryl group may be substituted by 1 to 3 substituents R 1 . The substituent R 1 may, for example, be a group independently selected from the group consisting of an alkyl group, an alkoxy group, an ester group, an amide group, a cyano group and a halogen atom, preferably an alkyl group and an alkoxy group.

上述烷基之碳數並無特別限定,可例舉1~10,較佳為1~8,更佳為1~6。作為上述烷基之具體例,可例舉甲基、乙基、正丙基、正丁基、辛基、十二烷基、異丙基、異丁基、第二丁基、第三丁基、正戊基、正己基等,較佳為甲基、乙基、正丙基、正己基。The number of carbon atoms in the above-mentioned alkyl group is not particularly limited, but 1-10 may be mentioned, preferably 1-8, and more preferably 1-6. Specific examples of the above-mentioned alkyl group include methyl, ethyl, n-propyl, n-butyl, octyl, dodecyl, isopropyl, isobutyl, sec-butyl, and tert-butyl. , n-pentyl, n-hexyl, etc., preferably methyl, ethyl, n-propyl, n-hexyl.

上述烷氧基之烷基鏈之碳數並無特別限定,可例舉1~10,較佳為1~6,更佳為1~3。作為上述烷氧基之具體例,可例舉甲氧基、乙氧基、丙氧基等,較佳為甲氧基、乙氧基。Although the carbon number of the alkyl chain of the said alkoxy group is not specifically limited, 1-10 are mentioned, Preferably it is 1-6, More preferably, it is 1-3. As a specific example of the said alkoxy group, a methoxy group, an ethoxy group, a propoxy group, etc. are mentioned, Preferably they are a methoxy group and an ethoxy group.

作為上述酯基之具體例,可例舉:醯氧基、原酸酯基、烷氧基羰基等。此處,作為較佳之醯氧基,可例舉乙醯氧基、丙醯氧基、特戊醯氧基,作為較佳之原酸酯基,可例舉三甲氧基甲基,作為較佳之烷氧基羰基,可例舉甲氧基羰基。作為酯基,較佳為乙醯氧基、丙醯氧基。As a specific example of the said ester group, an acyloxy group, an orthoester group, an alkoxycarbonyl group, etc. are mentioned. Here, as a preferable acyloxy group, an acetoxy group, a propionyloxy group, and a pivaloyloxy group can be exemplified, a preferable orthoester group can be exemplified by a trimethoxymethyl group, and a preferable alkane group can be exemplified The oxycarbonyl group may, for example, be a methoxycarbonyl group. As an ester group, an acetoxy group and a propionyloxy group are preferable.

作為上述醯胺基之具體例,可例舉乙醯胺基、丙醯胺基、二甲基醯胺基、二乙基醯胺基等,較佳為乙醯胺基、二甲基醯胺基。As a specific example of the above-mentioned amide group, an acetamide group, a propionamide group, a dimethyl amide group, a diethyl amide group, etc. may be mentioned, and an acetamide group and a dimethyl amide group are preferred. base.

作為上述鹵素原子之具體例,可例舉氯原子、氟原子、溴原子、碘原子等,較佳為氯原子、氟原子、溴原子。As a specific example of the said halogen atom, a chlorine atom, a fluorine atom, a bromine atom, an iodine atom etc. are mentioned, Preferably it is a chlorine atom, a fluorine atom, and a bromine atom.

作為被取代之芳基之具體例,可例舉鄰甲苯基、間甲苯基、對甲苯基、乙基苯基、二甲苯基(二甲基苯基)、三甲基苯基、鄰氯苯基、間氯苯基、對氯苯基、氯甲苯基、二氯苯基、三氯苯基、鄰氟苯基、間氟苯基、對氟苯基、鄰溴苯基、間溴苯基、對溴苯基、氟氯苯基、甲氧基苯基、乙氧基苯基、氰基苯基、甲氧基甲苯基、三氟甲基苯基、乙醯胺苯基、乙醯氧基苯基、甲基萘基、乙基萘基、二甲基萘基等,較佳為鄰甲苯基、間甲苯基、對甲苯基、甲氧基苯基、二甲苯基。Specific examples of the substituted aryl group include o-tolyl, m-tolyl, p-tolyl, ethylphenyl, xylyl (dimethylphenyl), trimethylphenyl, o-chlorobenzene Base, m-chlorophenyl, p-chlorophenyl, chlorotolyl, dichlorophenyl, trichlorophenyl, o-fluorophenyl, m-fluorophenyl, p-fluorophenyl, o-bromophenyl, m-bromophenyl , p-bromophenyl, fluorochlorophenyl, methoxyphenyl, ethoxyphenyl, cyanophenyl, methoxymethylphenyl, trifluoromethylphenyl, acetamidophenyl, acetoxyphenyl phenyl, methyl naphthyl, ethyl naphthyl, dimethyl naphthyl, etc., preferably o-tolyl, m-tolyl, p-tolyl, methoxyphenyl, and xylyl.

根據本發明之較佳之實施形態,於式(1)所表示之苯并㗁𠯤化合物中,作為上述式(1)中之L,可例舉碳數1~10之伸烷基、氧,較佳為亞甲基、伸異丙基、氧,上述式(1)中之Ar為苯基。According to a preferred embodiment of the present invention, in the benzodiazepine compound represented by the formula (1), as L in the above formula (1), an alkylene group having 1 to 10 carbon atoms, oxygen, etc. can be exemplified. Preferred are methylene, isopropylidene, and oxygen, and Ar in the above formula (1) is phenyl.

根據本發明之較佳之實施形態,作為式(1)所表示之苯并㗁𠯤化合物之具體例,可例舉以下之苯并㗁𠯤化合物。 [化3]

Figure 02_image007
According to a preferred embodiment of the present invention, specific examples of the benzodiazepine compound represented by the formula (1) include the following benzodiazepine compounds. [hua 3]
Figure 02_image007

上述式(1)中之m、n只要互相獨立為0以上,則並無特別限定,較佳為整數1~10,更佳為整數1~8。In the above formula (1), m and n are not particularly limited as long as they are independently 0 or more, but the integers 1 to 10 are preferred, and the integers 1 to 8 are more preferred.

根據本發明之較佳之實施形態,含有式(1)之苯并㗁𠯤化合物之混合物係包含式(1)中之m及n之合計值不同之苯并㗁𠯤化合物而成。According to a preferred embodiment of the present invention, the mixture containing the benzodiazepine compound of the formula (1) contains the benzodiazepine compound in which the total value of m and n in the formula (1) is different.

根據本發明之較佳之實施形態,含有式(1)之苯并㗁𠯤化合物之混合物係包含式(1)中之m及n之合計值為1以上之苯并㗁𠯤化合物而成。作為上述含有苯并㗁𠯤化合物之混合物,較佳為包含式(1)中之m及n之合計值分別為0、1、2、3、4、5之各苯并㗁𠯤化合物。According to a preferred embodiment of the present invention, the mixture containing the benzodiazepine compound of the formula (1) contains the benzodiazepine compound whose total value of m and n in the formula (1) is 1 or more. As the mixture containing the above-mentioned benzodiazepine compound, it is preferable to contain each benzodiazepine compound whose total value of m and n in formula (1) is 0, 1, 2, 3, 4, and 5, respectively.

再者,基於化合物中所存在之苯并㗁𠯤環數,亦將上述苯并㗁𠯤化合物稱為x聚物(此處,x為1以上之整數)。例如,於式(1)中m+n=0之化合物亦稱為二聚物,m+n=1之化合物亦稱為三聚物。再者,單體表示具有1個苯并㗁𠯤環之化合物。In addition, based on the number of benzodiazepine rings present in the compound, the above-mentioned benzodiazepine compound is also referred to as an x-polymer (here, x is an integer of 1 or more). For example, in the formula (1), the compound of m+n=0 is also called a dimer, and the compound of m+n=1 is also called a trimer. In addition, a monomer means the compound which has one benzodiazepine ring.

根據本發明之較佳之實施形態,含有式(1)之苯并㗁𠯤化合物之混合物中,相對於上述混合物總量,式(1)中之m及n為0之苯并㗁𠯤化合物(二聚物)之比率為20面積%以下,較佳為10面積%以下,更佳為3面積%以下。藉由將式(1)中之m及n為0之苯并㗁𠯤化合物之比率設定為20面積%以下,可進一步提高硬化物之耐熱性。According to a preferred embodiment of the present invention, in the mixture containing the benzodiazepine compound of the formula (1), with respect to the total amount of the mixture, m and n in the formula (1) are 0. The ratio of polymer) is 20 area % or less, preferably 10 area % or less, more preferably 3 area % or less. By setting the ratio of the benzodiazepine compound in which m and n are 0 in the formula (1) to 20 area % or less, the heat resistance of the cured product can be further improved.

x聚物相對於混合物總量之含有率(即,單體、二聚物、三聚物等各者之含有率)(面積%)可藉由凝膠滲透層析法(GPC)測定,藉由使用實施例所記載之苯并㗁𠯤化合物作為分子量換算標準物質所獲得之GPC校準曲線算出。此種測定及換算可藉由使用市售之GPC裝置(例如東曹股份有限公司製造)及管柱(例如TSKgel SuperHZ3000、TSKgel SuperHZ2000及TSKgel SuperHZ1000(分別為東曹股份有限公司製造))而簡便地進行。作為上述測定及換算,可藉由以下條件進行。裝置:HLC-8420GPC(東曹股份有限公司);管柱:TSKgel SuperHZ3000+TSKgel SuperHZ2000+TSKgel SuperHZ1000×2(分別為東曹股份有限公司);溶析液:四氫呋喃(THF);流量:0.35 ml/分鐘;測定溫度:40℃;注入量:3 μL;檢測器:UV(Ultraviolet,紫外線)檢測器;檢測波長:254 nm;分子量換算標準物質:下述實施例所記載之結構之4種苯并㗁𠯤。The content ratio of the x-polymer to the total amount of the mixture (ie, the content ratio of each of the monomers, dimers, trimers, etc.) (area %) can be measured by gel permeation chromatography (GPC). It was calculated from the GPC calibration curve obtained using the benzodiazepine compound described in the examples as a molecular weight conversion standard material. Such measurement and conversion can be easily performed by using a commercially available GPC apparatus (eg, manufactured by Tosoh Corporation) and columns (eg, TSKgel SuperHZ3000, TSKgel SuperHZ2000, and TSKgel SuperHZ1000 (manufactured by Tosoh Corporation, respectively)). conduct. The above measurement and conversion can be performed under the following conditions. Device: HLC-8420GPC (Tosoh Corporation); Column: TSKgel SuperHZ3000+TSKgel SuperHZ2000+TSKgel SuperHZ1000×2 (Tosoh Corporation, respectively); Elution solution: Tetrahydrofuran (THF); Flow rate: 0.35 ml/min; Measurement temperature : 40° C.; Injection volume: 3 μL; Detector: UV (Ultraviolet) detector; Detection wavelength: 254 nm;

根據本發明之較佳之實施形態,含有式(1)之苯并㗁𠯤化合物之混合物中,相對於上述混合物總量,式(1)中之m及n為5以上之苯并㗁𠯤化合物(7聚物以上)之比率為15面積%以上70面積%以下,較佳為20面積%以上60面積%以下,更佳為25面積%以上50面積%以下,進而較佳為25面積%以上40面積%以下。藉由將式(1)中之m及n為5以上之苯并㗁𠯤化合物之比率設定為15面積%以上70面積%以下,可進一步提高對環氧化合物之相容性。According to a preferred embodiment of the present invention, in the mixture containing the benzoic compound of the formula (1), the benzoic compound in which m and n in the formula (1) are 5 or more relative to the total amount of the mixture ( 7 or more area %) is 15 area % or more and 70 area % or less, preferably 20 area % or more and 60 area % or less, more preferably 25 area % or more and 50 area % or less, and still more preferably 25 area % or more. 40 Area % or less. Compatibility with epoxy compounds can be further improved by setting the ratio of the benzodiazepine compound in which m and n are 5 or more in formula (1) to 15 area % or more and 70 area % or less.

根據本發明之較佳之實施形態,含有式(1)之苯并㗁𠯤化合物之混合物中,相對於上述混合物總量,式(1)中之m及n之合計值為1~4之苯并㗁𠯤化合物(3~6聚物)之比率為25面積%以上,較佳為30面積%以上,更佳為40面積%以上,進而較佳為50面積%以上。式(1)中之m及n之合計值為1~4之苯并㗁𠯤化合物之比率之上限值例如為95面積%以下,較佳為80面積%以下,更佳為70面積%以下。藉由將式(1)中之m及n為1~4之苯并㗁𠯤化合物之比率設定為25面積%以上,可進一步提高硬化物之耐熱性。According to a preferred embodiment of the present invention, in the mixture containing the benzodiazepine compound of the formula (1), the total value of m and n in the formula (1) is 1 to 4 benzos with respect to the total amount of the mixture. The ratio of the compound (tri- to hexamer) is 25 area % or more, preferably 30 area % or more, more preferably 40 area % or more, and still more preferably 50 area % or more. The upper limit of the ratio of the benzodiazepine compound in which the sum of m and n in formula (1) is 1 to 4 is, for example, 95 area % or less, preferably 80 area % or less, and more preferably 70 area % or less. . By setting the ratio of the benzodiazepine compound in which m and n in the formula (1) are 1 to 4 to 25 area % or more, the heat resistance of the cured product can be further improved.

根據本發明之較佳之實施形態,含有式(1)之苯并㗁𠯤化合物之混合物中,相對於上述混合物總量,具有1個苯并㗁𠯤環之化合物(單體)之比率為5面積%以下,較佳為3面積%以下,更佳為1面積%以下,進而較佳為0.1面積%以下。下限值並無特別限定,較佳為0面積%以上。藉由將具有1個苯并㗁𠯤環之化合物相對於混合物總量之比率設為5面積%以下,可進一步提高硬化物之耐熱性。作為上述具有1個苯并㗁𠯤環之化合物之分子量,可例舉210~250。作為該化合物,較佳為選自下述式(2)之化合物及式(3)之化合物之至少1種,更佳為Ar為苯基之式(2)之化合物或式(3)之化合物。 [化4]

Figure 02_image009
式(2) [式(2)中,Ar如式(1)中所定義]。 [化5]
Figure 02_image011
式(3)According to a preferred embodiment of the present invention, in the mixture containing the benzodiazepine compound of the formula (1), the ratio of the compound (monomer) having one benzodiazepine ring with respect to the total amount of the mixture is 5 areas % or less, preferably 3 area % or less, more preferably 1 area % or less, still more preferably 0.1 area % or less. The lower limit is not particularly limited, but is preferably 0 area % or more. By setting the ratio of the compound having one benzodiazepine ring to the total amount of the mixture to 5 area % or less, the heat resistance of the cured product can be further improved. As the molecular weight of the compound having one benzodiazepine ring, 210 to 250 may, for example, be mentioned. The compound is preferably at least one selected from the group consisting of the compound of the following formula (2) and the compound of the formula (3), more preferably the compound of the formula (2) or the compound of the formula (3) in which Ar is a phenyl group . [hua 4]
Figure 02_image009
Formula (2) [In Formula (2), Ar is as defined in Formula (1)]. [hua 5]
Figure 02_image011
Formula (3)

根據本發明之一實施形態,含有式(1)之苯并㗁𠯤化合物之混合物之數量平均分子量(Mn)並無特別限定,可例舉600~1500,較佳為650~1200,更佳為700~1000,進而較佳為700~800。含有式(1)之苯并㗁𠯤化合物之混合物之數量平均分子量可藉由上述凝膠滲透層析法(GPC)進行測定。According to an embodiment of the present invention, the number-average molecular weight (Mn) of the mixture containing the benzodiazepine compound of formula (1) is not particularly limited, and may be 600-1500, preferably 650-1200, more preferably 600-1500. 700-1000, more preferably 700-800. The number-average molecular weight of the mixture containing the benzodiazepine compound of formula (1) can be determined by gel permeation chromatography (GPC) as described above.

根據本發明之一實施形態,含有式(1)之苯并㗁𠯤化合物之混合物之分子量分散度並無特別限定,可例舉1.05~2.50,較佳為1.08~2.00,更佳為1.10~1.50,進而較佳為1.13~1.20。分子量分散度係重量平均分子量(Mw)/數量平均分子量(Mn)。此處,含有式(1)之苯并㗁𠯤化合物之混合物之重量平均分子量(Mw)可藉由上述凝膠滲透層析法(GPC)進行測定。According to an embodiment of the present invention, the molecular weight dispersion of the mixture containing the benzodiazepine compound of the formula (1) is not particularly limited, and may be 1.05-2.50, preferably 1.08-2.00, more preferably 1.10-1.50 , and more preferably 1.13 to 1.20. The molecular weight dispersion is the weight average molecular weight (Mw)/number average molecular weight (Mn). Here, the weight average molecular weight (Mw) of the mixture containing the benzodiazepine compound of the formula (1) can be measured by the above-mentioned gel permeation chromatography (GPC).

根據本發明之一實施形態,包含上述式(1)所表示之苯并㗁𠯤化合物而成之混合物係使對胺基苯酚、芳香族一級單胺類、雙酚類及甲醛類進行縮合而獲得之化合物之混合物。因此,上述混合物可為藉由縮合反應而獲得之反應產物。According to one embodiment of the present invention, the mixture containing the benzodiazepine compound represented by the above formula (1) is obtained by condensing p-aminophenol, aromatic primary monoamines, bisphenols, and formaldehydes mixture of compounds. Therefore, the above-mentioned mixture may be a reaction product obtained by a condensation reaction.

根據本發明之另一實施形態,包含上述式(1)所表示之苯并㗁𠯤化合物而成之混合物可為對使對胺基苯酚、芳香族一級單胺類、雙酚類及甲醛類進行縮合所獲得之化合物之混合物(例如反應產物)進行分液洗淨、再結晶、管柱純化等而獲得者。According to another embodiment of the present invention, the mixture containing the benzodiazepine compound represented by the above formula (1) can be prepared by using p-aminophenol, aromatic primary monoamines, bisphenols and formaldehydes. A mixture of compounds obtained by condensation (for example, reaction products) is obtained by performing separation washing, recrystallization, column purification, and the like.

(含有式(1)之苯并㗁𠯤化合物之混合物之特性) 根據本發明之一實施形態,含有式(1)之苯并㗁𠯤化合物之混合物顯示出與其他樹脂(較佳為環氧化合物)較高之相容性。相容性可藉由將含有式(1)之苯并㗁𠯤化合物之混合物及其他樹脂分別於相同質量加熱下進行混合而確認。含有式(1)之苯并㗁𠯤化合物之混合物較佳為於80℃以下可與環氧化合物相容。(Characteristics of Mixtures Containing the Benzopic Compounds of Formula (1)) According to one embodiment of the present invention, the mixture containing the benzodiazepine compound of formula (1) exhibits high compatibility with other resins (preferably epoxy compounds). Compatibility can be confirmed by mixing the mixture containing the benzodiazepine compound of formula (1) and other resins under heating of the same mass, respectively. The mixture containing the benzodiazepine compound of formula (1) is preferably compatible with epoxy compounds at temperatures below 80°C.

根據本發明之一實施形態,作為其他樹脂,並無特別限定,可例舉環氧化合物、雙馬來醯亞胺樹脂、氰酸酯樹脂、異氰酸酯樹脂等,較佳為環氧化合物、雙馬來醯亞胺樹脂。According to one embodiment of the present invention, other resins are not particularly limited, and examples thereof include epoxy compounds, bismaleimide resins, cyanate resins, isocyanate resins, and the like, and epoxy compounds, bismaleimide resins, and the like are preferred. Lysimide resin.

含有苯并㗁 𠯤 化合物之混合物之製造方法 包含式(1)所表示之苯并㗁𠯤化合物而成之混合物可藉由包括使對胺基苯酚、芳香族一級單胺類、雙酚類與甲醛類進行縮合反應之步驟而成之方法製造。The method for producing a mixture containing a benzodiazepine compound The mixture comprising the benzodiazepine compound represented by the formula (1) can be prepared by including p-aminophenol, aromatic primary monoamines, bisphenols and formaldehyde It is manufactured by a method of performing a condensation reaction step.

根據本發明之一實施形態,於縮合反應步驟中,源自上述對胺基苯酚及上述雙酚類之酚性羥基、與源自上述對胺基苯酚及上述芳香族一級單胺類之胺基的比(OH/NH2 )並無特別限定,例如為1.05/1~1.15/1,較佳為1.07/1~1.13/1,更佳為1.09/1~1.11/1。就副反應物之產生或分子量控制之困難性之觀點而言,原料之莫耳比通常需要與化學計量比吻合。具體而言,於苯并㗁𠯤化合物之合成中,由於酚類、胺類及甲醛類以1:1:2之莫耳比進行反應而形成苯并㗁𠯤環,因此酚類與胺類之調配比以羥基與胺基之莫耳比為1:1進行。因此,以下為意想不到之事實:藉由以上述方式變更原料之莫耳比,可獲得對其他樹脂之相容性優異,並且可降低與其他樹脂混合時之黏度之含有苯并㗁𠯤混合物之混合物;進而,使該混合物包含於硬化性組合物時,其硬化物之高耐熱性優異。又,於上述含有苯并㗁𠯤化合物之混合物中,低分子量體或高分子量體之生成得到抑制亦為意想不到之事實。According to an embodiment of the present invention, in the condensation reaction step, the phenolic hydroxyl group derived from the above-mentioned p-aminophenol and the above-mentioned bisphenols, and the amine group derived from the above-mentioned p-aminophenol and the above-mentioned aromatic primary monoamines The ratio (OH/NH 2 ) is not particularly limited, but is, for example, 1.05/1 to 1.15/1, preferably 1.07/1 to 1.13/1, and more preferably 1.09/1 to 1.11/1. From the viewpoint of the generation of side reactants or the difficulty of molecular weight control, the molar ratio of the starting material usually needs to match the stoichiometric ratio. Specifically, in the synthesis of benzodiazepines, since phenols, amines, and formaldehyde react in a molar ratio of 1:1:2 to form a benzodiazepine ring, the phenols and amines are The compounding ratio is carried out with the molar ratio of hydroxyl group and amine group being 1:1. Therefore, it is an unexpected fact that by changing the molar ratio of the raw materials in the above-mentioned manner, it is possible to obtain a mixture containing benzodiazepine, which is excellent in compatibility with other resins and can reduce the viscosity when mixed with other resins. A mixture; further, when the mixture is contained in a curable composition, the cured product is excellent in high heat resistance. In addition, in the above-mentioned mixture containing a benzodiazepine compound, the fact that the formation of a low molecular weight body or a high molecular weight body is suppressed is also an unexpected fact.

根據本發明之一實施形態,於縮合反應步驟中,源自上述對胺基苯酚及上述雙酚之酚性羥基中之上述對胺基苯酚之酚性羥基的含有率並無特別限定,例如為25~75莫耳%,較佳為30~65莫耳%,更佳為35~55莫耳%,進而較佳為40~50莫耳%。According to an embodiment of the present invention, in the condensation reaction step, the content of the phenolic hydroxyl group of the p-aminophenol in the phenolic hydroxyl group derived from the p-aminophenol and the bisphenol is not particularly limited, and is, for example, 25-75 mol %, preferably 30-65 mol %, more preferably 35-55 mol %, and still more preferably 40-50 mol %.

根據本發明之一實施形態,於縮合反應步驟中,源自上述對胺基苯酚及上述芳香族一級單胺類之胺基中之上述對胺基苯酚之胺基的含有率並無特別限定,例如為25~75莫耳%,較佳為30~70莫耳%,更佳為35~60莫耳%,進而較佳為40~55莫耳%。According to an embodiment of the present invention, in the condensation reaction step, the content of the amine group derived from the p-aminophenol in the amine group derived from the p-aminophenol and the above-mentioned aromatic primary monoamine is not particularly limited, For example, it is 25-75 mol %, preferably 30-70 mol %, more preferably 35-60 mol %, and still more preferably 40-55 mol %.

(芳香族一級單胺類) 作為芳香族一級單胺類,只要為1分子中具有1個一級胺基之芳香族化合物,則並無特別限定,較佳可例舉Ar-NH2 (式中,Ar為可由獨立地選自由烷基、烷氧基、酯基、醯胺基、氰基及鹵素原子所組成之群之取代基R1 所取代之芳基)。上述芳香族一級單胺類具體而言可例舉苯胺、鄰,間,對甲苯胺、鄰,間,對乙基苯胺、二甲苯胺、2,4,6-三甲苯胺、鄰,間,對氯苯胺、氯甲苯胺、二氯苯胺、三氯苯胺、鄰,間,對氟苯胺、鄰,間,對溴苯胺、氟氯苯胺、甲氧苯胺、乙氧苯胺、胺基苯甲腈、2-甲氧基-5-甲基苯胺、三氟甲基苯胺、對胺基乙醯苯胺、萘胺等,較佳為苯胺、鄰,間,對甲苯胺、甲氧苯胺。該等芳香族一級單胺類可單獨使用,亦可使用2種以上。再者,於該芳香族一級單胺類中,不包含鄰胺基苯酚、間胺基苯酚及對胺基苯酚。(Aromatic Primary Monoamines) The aromatic primary monoamines are not particularly limited as long as they are aromatic compounds having one primary amine group in one molecule, and Ar-NH 2 (wherein , Ar is an aryl group substituted by a substituent R 1 independently selected from the group consisting of alkyl, alkoxy, ester, amido, cyano and halogen atoms. Specifically, the above-mentioned aromatic primary monoamines can be exemplified by aniline, o, m, p-toluidine, o, m, p-ethylaniline, xylidine, 2,4,6-tritoluidine, o, m, p Chloroaniline, chlorotoluidine, dichloroaniline, trichloroaniline, o, m, p-fluoroaniline, o, m, p-bromoaniline, fluorochloroaniline, methoxyaniline, ethoxyaniline, aminobenzonitrile, 2 -Methoxy-5-methylaniline, trifluoromethylaniline, p-aminoacetaniline, naphthylamine, etc., preferably aniline, o-, m-, p-toluidine, and methoxyaniline. These aromatic primary monoamines may be used alone, or two or more of them may be used. In addition, o-aminophenol, m-aminophenol, and p-aminophenol are not included in the aromatic primary monoamines.

芳香族一級單胺類之使用量並無特別限定,相對於對胺基苯酚1莫耳,較佳為0.1~2莫耳,更佳為0.2~1.5莫耳。The usage-amount of aromatic primary monoamines is not particularly limited, but is preferably 0.1-2 mol, more preferably 0.2-1.5 mol, relative to 1 mol of p-aminophenol.

(雙酚類) 作為雙酚類,只要為具有2個酚性羥基之化合物,則並無特別限定,例如可例舉雙酚A、雙酚F、4,4'-雙酚F、雙酚S、4,4'-二羥基二苯醚、雙(4-羥基苯基)硫醚、雙(4-羥基苯基)碸等,較佳為雙酚F、4,4'-雙酚F、雙酚A、4,4'-二羥基二苯醚。該等雙酚類可單獨使用,亦可使用2種以上。(Bisphenols) The bisphenols are not particularly limited as long as they are compounds having two phenolic hydroxyl groups, and examples thereof include bisphenol A, bisphenol F, 4,4'-bisphenol F, bisphenol S, 4,4 '-dihydroxydiphenyl ether, bis(4-hydroxyphenyl) sulfide, bis(4-hydroxyphenyl) sulfide, etc., preferably bisphenol F, 4,4'-bisphenol F, bisphenol A, 4,4'-Dihydroxydiphenyl ether. These bisphenols may be used alone, or two or more of them may be used.

雙酚類之使用量並無特別限定,相對於對胺基苯酚1莫耳,較佳為0.05~2莫耳,更佳為0.1~0.75莫耳。The amount of bisphenol used is not particularly limited, but is preferably 0.05 to 2 mol, more preferably 0.1 to 0.75 mol, relative to 1 mol of p-aminophenol.

(甲醛類) 作為甲醛類,並無特別限定,例如可例舉甲醛、多聚甲醛、1,3,5-三㗁烷、四甲醛、福馬林等,較佳為甲醛、多聚甲醛、福馬林。於使用該等甲醛類之情形時,可單獨使用,亦可使用2種以上。(Formaldehyde) Although it does not specifically limit as formaldehyde, For example, formaldehyde, paraformaldehyde, 1,3,5- triacetane, tetraformaldehyde, formalin etc. are mentioned, Preferably they are formaldehyde, paraformaldehyde, and formalin. When these formaldehydes are used, they may be used alone, or two or more of them may be used.

甲醛類之使用量並無特別限定,相對於對胺基苯酚及芳香族一級單胺類之合計1莫耳,較佳為1~3莫耳,更佳為1.5~2.5莫耳。此處,使用多聚甲醛作為甲醛類之情形時之莫耳量設為換算為甲醛之莫耳量。The amount of formaldehyde used is not particularly limited, but is preferably 1 to 3 mol, more preferably 1.5 to 2.5 mol, relative to 1 mol of the total of p-aminophenol and aromatic primary monoamines. Here, the molar amount in the case of using paraformaldehyde as formaldehyde is the molar amount converted to formaldehyde.

(反應條件) 縮合反應通常可於溶劑之存在下實施。溶劑可於反應中回流。 作為溶劑,可例舉:甲醇、乙醇、異丙醇、正丁醇、正己醇及環己醇等醇系溶劑;四氫呋喃、二㗁烷及二甲氧基乙烷等醚系溶劑;甲苯、二甲苯及苯等脂肪族烴溶劑;N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基吡咯啶酮及二甲基亞碸等非質子性極性溶劑;乙腈及苯甲腈等腈溶劑;二氯甲烷、氯仿、1,2-二氯乙烷、四氯化碳及氯苯等鹵代烴溶劑;水;等;較佳為二㗁烷、氯仿、甲苯。溶劑可將複數種溶劑混合使用。(Reaction conditions) The condensation reaction can usually be carried out in the presence of a solvent. The solvent can be refluxed in the reaction. Examples of the solvent include alcohol-based solvents such as methanol, ethanol, isopropanol, n-butanol, n-hexanol, and cyclohexanol; ether-based solvents such as tetrahydrofuran, diethane, and dimethoxyethane; toluene, dimethoxyethane, and the like. Aliphatic hydrocarbon solvents such as toluene and benzene; aprotic polar solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone and dimethylsulfoxide ; nitrile solvents such as acetonitrile and benzonitrile; halogenated hydrocarbon solvents such as dichloromethane, chloroform, 1,2-dichloroethane, carbon tetrachloride and chlorobenzene; water; etc.; preferably diethane, chloroform , Toluene. As the solvent, a plurality of solvents can be mixed and used.

反應可於常壓條件下進行,亦可於加壓條件下進行,亦可於減壓條件下進行。又,亦可於氮氣及氬氣等惰性氣體氛圍下進行。The reaction can be carried out under normal pressure conditions, under pressure conditions, or under reduced pressure conditions. Moreover, you may carry out in inert gas atmosphere, such as nitrogen and argon.

反應溫度通常為30℃~120℃,較佳為60℃~110℃。The reaction temperature is usually 30°C to 120°C, preferably 60°C to 110°C.

反應時間並無特別限定,例如為3小時~100小時。The reaction time is not particularly limited, but is, for example, 3 hours to 100 hours.

根據本發明之一實施形態,於製造包含式(1)所表示之苯并㗁𠯤化合物而成之混合物時,於利用上述製造方法而獲得之該混合物之純度較低之情形時,較佳為藉由濃縮、分液洗淨、過濾、蒸餾、再結晶、再沈澱、管柱純化、或該等之組合進行純化。According to an embodiment of the present invention, when the mixture containing the benzodiazepine compound represented by the formula (1) is produced, when the purity of the mixture obtained by the above production method is low, it is preferably Purification is carried out by concentration, separation washing, filtration, distillation, recrystallization, reprecipitation, column purification, or a combination thereof.

式(1)所表示之苯并㗁𠯤化合物之結構可藉由1 H-NMR、紅外吸收光譜等進行鑑定。The structure of the benzodiazepine compound represented by the formula (1) can be identified by 1 H-NMR, infrared absorption spectrum, or the like.

根據本發明之較佳之實施形態,於使用苯胺作為芳香族一級單胺類、使用雙酚F或4,4'-雙酚F作為雙酚類、使用甲醛、多聚甲醛或福馬林作為醛類之情形時,可獲得式(1)中L為亞甲基、Ar為苯基之化合物作為式(1)所表示之苯并㗁𠯤化合物。According to a preferred embodiment of the present invention, aniline is used as the aromatic primary monoamine, bisphenol F or 4,4'-bisphenol F is used as the bisphenol, and formaldehyde, paraformaldehyde or formalin is used as the aldehyde In this case, a compound in which L is a methylene group and Ar is a phenyl group in the formula (1) can be obtained as the benzodiazepine compound represented by the formula (1).

硬化性組合物 根據本發明之一實施形態,其特徵之一在於其係一種硬化性組合物,該硬化性組合物係含有包含上述式(1)所表示之苯并㗁𠯤化合物而成之混合物而成者。According to one embodiment of the present invention, a curable composition is characterized in that it is a curable composition containing a mixture containing the benzodiazepine compound represented by the above formula (1). become.

於上述硬化性組合物中,就藉由硬化物有效地賦予耐熱性之觀點而言,可與包含上述式(1)所表示之苯并㗁𠯤化合物而成之混合物一起組合含有所需之其他成分(例如硬化劑、環氧化合物、硬化促進劑等)。In the above curable composition, from the viewpoint of effectively imparting heat resistance by the cured product, other necessary components may be contained in combination with a mixture containing the benzodiazepine compound represented by the above formula (1). Ingredients (eg hardeners, epoxy compounds, hardening accelerators, etc.).

以下,對可包含於硬化性組合物之各成分詳細地進行說明。Hereinafter, each component which can be contained in a curable composition is demonstrated in detail.

(包含式(1)所表示之苯并㗁𠯤化合物而成之混合物) 關於包含式(1)所表示之苯并㗁𠯤化合物而成之混合物,如上所述。(Mixture containing the benzodiazepine compound represented by the formula (1)) The mixture containing the benzodiazepine compound represented by the formula (1) is as described above.

根據本發明之一實施形態,作為硬化性組合物中之含有式(1)之苯并㗁𠯤化合物之混合物之含量,相對於硬化性組合物之總量100質量份,上述混合物較佳為5~99質量份之範圍,更佳為10~80質量份之範圍,進而較佳為30~60質量份之範圍。藉由於該範圍內包含含有式(1)之苯并㗁𠯤化合物之混合物,可獲得耐熱性更加優異之硬化物。According to an embodiment of the present invention, the content of the mixture containing the benzodiazepine compound of formula (1) in the curable composition is preferably 5 parts by mass relative to the total amount of 100 parts by mass of the curable composition. The range of to 99 parts by mass is more preferably the range of 10 to 80 parts by mass, still more preferably the range of 30 to 60 parts by mass. By including the mixture containing the benzodiazepine compound of the formula (1) within this range, a cured product with more excellent heat resistance can be obtained.

(硬化劑) 根據本發明之一實施形態,作為可包含於硬化性組合物之硬化劑,可例舉酸酐系化合物、陰離子系化合物(例如胺系化合物、酚系化合物及潛在性硬化劑)等,較佳為酚系化合物。(hardener) According to an embodiment of the present invention, as the curing agent that can be included in the curable composition, acid anhydride-based compounds, anionic compounds (for example, amine-based compounds, phenol-based compounds, and latent curing agents), etc., are exemplified, and preferably Phenolic compounds.

作為本發明之硬化性組合物中所包含之酸酐系化合物,可例舉:六氫鄰苯二甲酸酐、甲基六氫鄰苯二甲酸酐、四氫鄰苯二甲酸酐、甲基四氫鄰苯二甲酸酐、內亞甲基四氫鄰苯二甲酸酐、甲基耐地酸酐、甲基丁烯基四氫鄰苯二甲酸酐、氫化甲基耐地酸酐、三烷基四氫鄰苯二甲酸酐、環己烷三羧酸酐、甲基環己烯二羧酸酐、甲基環己烷四羧酸二酐、順丁烯二酸酐、鄰苯二甲酸酐、琥珀酸酐、十二烯基琥珀酸酐、辛烯基琥珀酸酐、均苯四甲酸二酐、偏苯三甲酸酐、烷基苯乙烯-順丁烯二酸酐共聚物、氯菌酸酐、聚壬二酸酐、二苯甲酮四羧酸二酐、乙二醇雙脫水偏苯三酸酯、三偏苯三酸甘油酯、甘油雙(脫水偏苯三酸酯)單乙酸酯、二苯甲酮四羧酸、聚己二酸酐、聚癸二酸酐、聚(乙基十八烷二酸)酐、聚(苯基十六烷二酸)酐、氯橋酸酐、降𦯉烷-2,3-二羧酸酐等。Examples of the acid anhydride-based compound contained in the curable composition of the present invention include hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, tetrahydrophthalic anhydride, and methyltetrahydrophthalic anhydride. Phthalic anhydride, endomethylene tetrahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, methylbutenyl tetrahydrophthalic anhydride, hydrogenated methyl tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride Phthalic anhydride, cyclohexanetricarboxylic anhydride, methylcyclohexene dicarboxylic anhydride, methylcyclohexanetetracarboxylic dianhydride, maleic anhydride, phthalic anhydride, succinic anhydride, dodecene succinic anhydride, octenyl succinic anhydride, pyromellitic dianhydride, trimellitic anhydride, alkyl styrene-maleic anhydride copolymer, chloroplastic anhydride, polyazelaic anhydride, benzophenone tetracarboxyl Acid dianhydride, ethylene glycol bis-anhydro trimellitate, tritrimellitic acid glyceride, glycerol bis (anhydro trimellitate) monoacetate, benzophenone tetracarboxylic acid, polyadipic anhydride , polysebacic anhydride, poly(ethyl octadecanedioic acid) anhydride, poly(phenylhexadecanedioic acid) anhydride, chloro bridge acid anhydride, nor alkane-2,3-dicarboxylic acid anhydride, etc.

作為胺系化合物,可例舉:咪唑類(2-乙基-4-甲基咪唑、1,2-二甲基咪唑、1-苄基-2-苯基咪唑、2-甲基咪唑、2-苯基咪唑、1-(2-氰乙基)-2-乙基-4-甲基咪唑、2,4-二胺基-6-[2-甲基咪唑基-(1)]乙基對稱三𠯤、2-苯基咪唑啉、2,3-二氫-1H-吡咯并[1,2-a]苯并咪唑等咪唑類)、聚氧乙烯二胺、聚氧丙烯二胺、聚氧丁烯二胺、聚氧戊烯二胺、聚氧乙烯三胺、聚氧丙烯三胺、聚氧丁烯三胺、聚氧戊烯三胺、二伸乙基三胺、三伸乙基四胺、四伸乙基五胺、間苯二甲胺、三甲基六亞甲基二胺、2-甲基戊二胺、二乙胺基丙胺、異佛爾酮二胺、1,3-雙胺基甲基環己烷、雙(4-胺基環己基)甲烷、降𦯉烷二胺、1,2-二胺基環己烷、二胺基二苯甲烷、間苯二胺、二胺基二苯基碸、N-胺基乙基哌𠯤等。As the amine compound, imidazoles (2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 1-benzyl-2-phenylimidazole, 2-methylimidazole, 2- -Phenylimidazole, 1-(2-cyanoethyl)-2-ethyl-4-methylimidazole, 2,4-diamino-6-[2-methylimidazolyl-(1)]ethyl Symmetrical tris, 2-phenylimidazoline, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole and other imidazoles), polyoxyethylene diamine, polyoxypropylene diamine, polyoxyethylene diamine Oxybutene diamine, polyoxypentene diamine, polyoxyethylene triamine, polyoxypropylene triamine, polyoxybutene triamine, polyoxypentene triamine, diethylenetriamine, triethylenetriamine Tetraamine, Tetrakenylpentamine, m-xylylenediamine, trimethylhexamethylenediamine, 2-methylpentanediamine, diethylaminopropylamine, isophoronediamine, 1,3 -Bisaminomethylcyclohexane, bis(4-aminocyclohexyl)methane, noralkanediamine, 1,2-diaminocyclohexane, diaminodiphenylmethane, m-phenylenediamine, Diaminodiphenyl, N-aminoethylpiperazine, etc.

作為酚系化合物,可例舉苯酚、鄰苯三酚、間苯二酚,作為雙酚類,只要為具有2個酚性羥基之化合物,則並無特別限定,例如可例舉雙酚A、雙酚F、雙酚C、雙酚S、雙酚Z、4,4'-二羥基二苯醚、雙(4-羥基苯基)硫醚、雙(4-羥基苯基)碸,作為酚醛清漆類,可例舉含有苯二甲基骨架之酚系酚醛清漆樹脂、含有二環戊二烯骨架之酚系酚醛清漆樹脂、含有聯苯骨架之酚系酚醛清漆樹脂、含有茀骨架之酚系酚醛清漆樹脂、含有萜烯骨架之酚系酚醛清漆樹脂、雙酚A酚醛清漆、雙酚F酚醛清漆、雙酚S酚醛清漆、雙酚AP酚醛清漆、雙酚C酚醛清漆、雙酚E酚醛清漆、雙酚Z酚醛清漆、聯苯酚酚醛清漆、四甲基雙酚A酚醛清漆、二甲基雙酚A酚醛清漆、四甲基雙酚F酚醛清漆、二甲基雙酚F酚醛清漆、四甲基雙酚S酚醛清漆、二甲基雙酚S酚醛清漆、四甲基-4,4'-聯苯酚酚醛清漆、三羥基苯基甲烷酚醛清漆、間苯二酚酚醛清漆、對苯二酚酚醛清漆、鄰苯三酚酚醛清漆、二亞異丙基酚醛清漆、1,1-二-4-羥基苯基茀酚醛清漆、酚化聚丁二烯酚醛清漆、酚系酚醛清漆、甲酚類酚醛清漆、乙基苯酚類酚醛清漆、丁基苯酚類酚醛清漆、辛基苯酚類酚醛清漆、萘酚類酚醛清漆等。The phenolic compound may, for example, be phenol, pyrogallol, or resorcinol. As the bisphenol, any compound having two phenolic hydroxyl groups is not particularly limited. For example, bisphenol A, Bisphenol F, Bisphenol C, Bisphenol S, Bisphenol Z, 4,4'-dihydroxydiphenyl ether, bis(4-hydroxyphenyl)sulfide, bis(4-hydroxyphenyl)sulfoxide, as phenolic The varnishes include xylylene skeleton-containing phenolic novolak resins, dicyclopentadiene skeleton-containing phenolic novolak resins, biphenyl skeleton-containing phenolic novolak resins, and phenolic skeleton-containing phenolic novolak resins Novolak resin, phenolic novolak resin containing terpene skeleton, bisphenol A novolak, bisphenol F novolak, bisphenol S novolak, bisphenol AP novolak, bisphenol C novolak, bisphenol E novolak , bisphenol Z novolak, biphenol novolak, tetramethyl bisphenol A novolak, dimethyl bisphenol A novolak, tetramethyl bisphenol F novolak, dimethyl bisphenol F novolak, tetramethyl bisphenol F novolak base bisphenol S novolac, dimethyl bisphenol S novolac, tetramethyl-4,4'-biphenol novolac, trihydroxyphenylmethane novolac, resorcinol novolac, hydroquinone novolac Novolac, pyrogallol novolac, diisopropylidene novolac, 1,1-di-4-hydroxyphenyl novolac, phenolic polybutadiene novolac, phenolic novolac, cresol novolac Varnish, ethylphenol novolak, butylphenol novolak, octylphenol novolak, naphthol novolak, etc.

作為潛在性硬化劑,可例舉:熱陽離子起始劑、雙氰胺、己二酸二醯肼、癸二酸二醯肼、十二烷二酸二醯肼、間苯二甲酸二醯肼、酮亞胺、咪唑化合物、二醯肼化合物、胺加成物系硬化劑等。As a latent hardener, a thermal cation initiator, dicyandiamide, dihydrazine adipic acid, dihydrazine sebacate, dihydrazine dodecanedioate, dihydrazine isophthalate, , Ketimine, imidazole compound, dihydrazide compound, amine adduct system hardener, etc.

本發明之硬化性組合物可包含1種或2種以上之如上所述之硬化劑。The curable composition of this invention may contain 1 type or 2 or more types of the above-mentioned hardeners.

就硬化物之耐熱性之觀點而言,作為硬化性組合物中之硬化劑之含量,相對於硬化性組合物之總量100質量份,硬化劑較佳為1~50質量份之範圍,更佳為3~30質量份之範圍。From the viewpoint of the heat resistance of the cured product, the content of the curing agent in the curable composition is preferably in the range of 1 to 50 parts by mass with respect to 100 parts by mass of the total amount of the curable composition, and more The range of 3-30 mass parts is preferable.

(硬化促進劑) 根據本發明之一實施形態,作為硬化性組合物中所包含之硬化促進劑,例如可例舉:三苯基膦、三苯基苄基鏻四苯基硼酸鹽、四丁基鏻二乙基二硫代磷酸鹽、四苯基溴化鏻、四丁基乙酸鏻、四正丁基溴化鏻、四正丁基鏻苯并三唑鹽、四正丁基鏻四氟硼酸鹽、四正丁基鏻四苯基硼酸鹽、甲基三苯基溴化鏻、乙基三苯基溴化鏻、乙基三苯基碘化鏻、乙基三苯基乙酸鏻、甲基三丁基鏻二乙基膦酸鹽、正丁基三苯基溴化鏻、苄基三苯基氯化鏻、四苯基鏻四苯基硼酸鹽等膦類及其四級鹽;2-乙基-4-甲基咪唑、1,2-二甲基咪唑、1-苄基-2-苯基咪唑、2-甲基咪唑、2-苯基咪唑、1-(2-氰乙基)-2-乙基-4-甲基咪唑、2,4-二胺基-6-[2-甲基咪唑基-(1)]乙基對稱三𠯤、2-苯基咪唑啉、2,3-二氫-1H-吡咯并[1,2-a]苯并咪唑等咪唑類;三(二甲胺基甲基)苯酚、二甲基苄胺、四丁基溴化銨等三級胺及其四級鹽;1,8-二氮雜雙環(5,4,0)十一碳烯-7、1,5-二氮雜雙環(4,3,0)壬烯-5等超強鹼性之有機化合物;辛酸鋅、月桂酸鋅、硬脂酸鋅、辛酸錫等有機羧酸金屬鹽;苯甲醯基丙酮鋅螯合物、二苯甲醯甲烷鋅螯合物及乙醯乙酸乙酯鋅螯合物等金屬-有機螯合物化合物;四正丁基鋶O,O-二乙基二硫代磷酸鹽等。此處,作為硬化促進劑,只要具有硬化反應之促進作用,則可為與硬化劑相同之化合物,亦可為不同之化合物。(hardening accelerator) According to one embodiment of the present invention, as the curing accelerator contained in the curable composition, for example, triphenylphosphine, triphenylbenzylphosphonium tetraphenyl borate, tetrabutylphosphonium diethyl Dithiophosphate, tetraphenylphosphonium bromide, tetrabutylphosphonium acetate, tetra-n-butylphosphonium bromide, tetra-n-butylphosphonium benzotriazole, tetra-n-butylphosphonium tetrafluoroborate, tetra-n-butylphosphonium Butylphosphonium tetraphenyl borate, methyltriphenylphosphonium bromide, ethyltriphenylphosphonium bromide, ethyltriphenylphosphonium iodide, ethyltriphenylphosphonium acetate, methyltributylphosphonium Diethylphosphonate, n-butyltriphenylphosphonium bromide, benzyltriphenylphosphonium chloride, tetraphenylphosphonium tetraphenylborate and other phosphines and their quaternary salts; 2-ethyl-4 -methylimidazole, 1,2-dimethylimidazole, 1-benzyl-2-phenylimidazole, 2-methylimidazole, 2-phenylimidazole, 1-(2-cyanoethyl)-2-ethyl yl-4-methylimidazole, 2,4-diamino-6-[2-methylimidazolyl-(1)]ethyl symmetric tris𠯤, 2-phenylimidazoline, 2,3-dihydro- Imidazoles such as 1H-pyrrolo[1,2-a]benzimidazole; tertiary amines such as tris(dimethylaminomethyl)phenol, dimethylbenzylamine, tetrabutylammonium bromide and their quaternary salts ; 1,8-diazabicyclo(5,4,0)undecene-7, 1,5-diazabicyclo(4,3,0)nonene-5 and other super basic organic compounds ;Organic carboxylic acid metal salts such as zinc octoate, zinc laurate, zinc stearate, tin octoate, etc.; Metal-organic chelate compounds such as compounds; tetra-n-butyl perionium O, O-diethyldithiophosphate, etc. Here, as a hardening accelerator, as long as it has the acceleration|stimulation effect of hardening reaction, the same compound as a hardening agent may be sufficient as it, and a different compound may be sufficient as it.

本發明之硬化性組合物可包含1種或2種以上之如上所述之硬化促進劑。The curable composition of this invention may contain 1 type or 2 or more types of the above-mentioned hardening accelerator.

就硬化物之耐熱性之觀點而言,作為本發明之硬化性組合物中之硬化促進劑之含量,相對於硬化性組合物之總量100質量份,硬化劑較佳為0.01~10質量份之範圍,更佳為0.1~6質量份之範圍。From the viewpoint of the heat resistance of the cured product, the content of the curing accelerator in the curable composition of the present invention is preferably 0.01 to 10 parts by mass relative to 100 parts by mass of the total amount of the curable composition. The range of 0.1-6 mass parts is more preferable.

(環氧化合物) 根據本發明之一實施形態,硬化性組合物可根據用途包含環氧化合物。作為該環氧化合物,例如可例舉縮水甘油醚型環氧化物、縮水甘油酯型環氧化物、縮水甘油胺型環氧化物、脂環式環氧化物等,較佳為脂環式環氧化物。(epoxy compound) According to one embodiment of the present invention, the curable composition may contain an epoxy compound according to the application. Examples of the epoxy compound include glycidyl ether type epoxides, glycidyl ester type epoxides, glycidyl amine type epoxides, alicyclic epoxides, and the like, and alicyclic epoxides are preferred. matter.

作為縮水甘油醚型環氧化物,可例舉:雙酚A二縮水甘油醚、雙酚F二縮水甘油醚、雙酚S二縮水甘油醚、四甲基聯苯酚二縮水甘油醚、氫化雙酚A二縮水甘油醚、溴化雙酚A二縮水甘油醚等二酚之縮水甘油醚;二羥基萘基甲酚三縮水甘油醚、三(羥基苯基)甲烷三縮水甘油醚、四(羥基苯基)乙烷四縮水甘油醚、聯萘三酚三縮水甘油醚、酚系酚醛清漆縮水甘油醚、甲酚酚醛清漆縮水甘油醚、含有苯二甲基骨架之酚系酚醛清漆縮水甘油醚、含有二環戊二烯骨架之酚系酚醛清漆縮水甘油醚、含有聯苯骨架之酚系酚醛清漆縮水甘油醚、含有萜烯骨架之酚系酚醛清漆縮水甘油醚、雙酚A酚醛清漆縮水甘油醚、雙酚F酚醛清漆縮水甘油醚、雙酚S酚醛清漆縮水甘油醚、雙酚AP酚醛清漆縮水甘油醚、雙酚C酚醛清漆縮水甘油醚、雙酚E酚醛清漆縮水甘油醚、雙酚Z酚醛清漆縮水甘油醚、聯苯酚酚醛清漆縮水甘油醚、四甲基雙酚A酚醛清漆縮水甘油醚、二甲基雙酚A酚醛清漆縮水甘油醚、四甲基雙酚F酚醛清漆縮水甘油醚、二甲基雙酚F酚醛清漆縮水甘油醚、四甲基雙酚S酚醛清漆縮水甘油醚、二甲基雙酚S酚醛清漆縮水甘油醚、四甲基-4,4'-聯苯酚酚醛清漆縮水甘油醚、三羥基苯基甲烷酚醛清漆縮水甘油醚、間苯二酚酚醛清漆縮水甘油醚、對苯二酚酚醛清漆縮水甘油醚、鄰苯三酚酚醛清漆縮水甘油醚、二亞異丙基酚醛清漆縮水甘油醚、1,1-二-4-羥基苯基茀酚醛清漆縮水甘油醚、酚化聚丁二烯酚醛清漆縮水甘油醚、乙基苯酚酚醛清漆縮水甘油醚、丁基苯酚酚醛清漆縮水甘油醚、辛基苯酚酚醛清漆縮水甘油醚、萘酚酚醛清漆縮水甘油醚、氫化酚系酚醛清漆縮水甘油醚等多酚之縮水甘油醚;乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、1,4-丁二醇二縮水甘油醚、1,6-己二醇二縮水甘油醚、環己烷二羥甲基二縮水甘油醚、聚乙二醇二縮水甘油醚、聚丙二醇二縮水甘油醚等二元醇之縮水甘油醚;三羥甲基丙烷三縮水甘油醚、甘油三縮水甘油醚、季戊四醇四縮水甘油醚、山梨糖醇六縮水甘油醚、聚甘油聚縮水甘油醚等多元醇之縮水甘油醚;三縮水甘油基異氰尿酸酯等。Examples of glycidyl ether-type epoxides include bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, bisphenol S diglycidyl ether, tetramethyl biphenol diglycidyl ether, and hydrogenated bisphenol. A diglycidyl ether, brominated bisphenol A diglycidyl ether and other glycidyl ethers of diphenols; dihydroxynaphthyl cresol triglycidyl ether, tris(hydroxyphenyl)methane triglycidyl ether, tetrakis(hydroxybenzene) base) ethane tetraglycidyl ether, binaphthol triglycidyl ether, phenolic novolac glycidyl ether, cresol novolac glycidyl ether, phenolic novolac glycidyl ether containing xylylene skeleton, containing Dicyclopentadiene skeleton phenolic novolak glycidyl ether, phenolic novolak glycidyl ether containing biphenyl skeleton, phenolic novolak glycidyl ether containing terpene skeleton, bisphenol A novolac glycidyl ether, Bisphenol F novolac glycidyl ether, bisphenol S novolac glycidyl ether, bisphenol AP novolac glycidyl ether, bisphenol C novolac glycidyl ether, bisphenol E novolac glycidyl ether, bisphenol Z novolac glycidyl ether Glycidyl ether, biphenol novolac glycidyl ether, tetramethyl bisphenol A novolac glycidyl ether, dimethyl bisphenol A novolac glycidyl ether, tetramethyl bisphenol F novolac glycidyl ether, dimethyl base bisphenol F novolac glycidyl ether, tetramethylbisphenol S novolac glycidyl ether, dimethylbisphenol S novolac glycidyl ether, tetramethyl-4,4'-biphenol novolac glycidyl ether , trihydroxyphenylmethane novolac glycidyl ether, resorcinol novolac glycidyl ether, hydroquinone novolac glycidyl ether, pyrogallol novolac glycidyl ether, diisopropylidene novolac glycidyl ether Glyceryl ether, 1,1-di-4-hydroxyphenyl novolac glycidyl ether, phenolated polybutadiene novolac glycidyl ether, ethylphenol novolac glycidyl ether, butylphenol novolac glycidyl ether , glycidyl ether of polyphenols such as octylphenol novolac glycidyl ether, naphthol novolac glycidyl ether, hydrogenated phenol novolak glycidyl ether, etc.; ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1, 4-Butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, cyclohexane dimethylol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, etc. Glycidyl ethers of dihydric alcohols; glycidyl ethers of polyhydric alcohols such as trimethylolpropane triglycidyl ether, glycerol triglycidyl ether, pentaerythritol tetraglycidyl ether, sorbitol hexaglycidyl ether, polyglycerol polyglycidyl ether, etc. ether; triglycidyl isocyanurate, etc.

作為縮水甘油酯型環氧化物,可例舉:甲基丙烯酸縮水甘油酯、鄰苯二甲酸二縮水甘油酯、間苯二甲酸二縮水甘油酯、對苯二甲酸二縮水甘油酯、環己烷二羧酸二縮水甘油酯、1,2,4-苯三甲酸三縮水甘油酯等羧酸之縮水甘油酯或縮水甘油酯型聚環氧化物等。As glycidyl ester type epoxide, glycidyl methacrylate, diglycidyl phthalate, diglycidyl isophthalate, diglycidyl terephthalate, cyclohexane may, for example, be mentioned. Glycidyl esters of carboxylic acids such as diglycidyl dicarboxylate and triglycidyl 1,2,4-benzenetricarboxylic acid, or glycidyl ester type polyepoxides, and the like.

作為縮水甘油胺型環氧化物,可例舉:N,N-二縮水甘油基苯胺、N,N-二縮水甘油基甲苯胺、N,N,N',N'-四縮水甘油基二胺基二苯甲烷、N,N,N',N'-四縮水甘油基二胺基二苯基碸、N,N,N',N'-四縮水甘油基二乙基二苯基甲烷等縮水甘油基芳香族胺;雙(N,N-二縮水甘油基胺基環己基)甲烷(N,N,N',N'-四縮水甘油基二胺基二苯甲烷之氫化物)、N,N,N',N'-四縮水甘油基-1,3-(雙胺基甲基)環己烷(N,N,N',N'-四縮水甘油基苯二甲胺之氫化物)、三縮水甘油基三聚氰胺、三縮水甘油基-對胺基苯酚、N-縮水甘油基-4-縮水甘油氧基吡咯啶酮等縮水甘油基雜環胺等。As the glycidylamine type epoxide, N,N-diglycidylaniline, N,N-diglycidyltoluidine, N,N,N',N'-tetraglycidyldiamine may, for example, be mentioned. Diphenylmethane, N,N,N',N'-tetraglycidyldiaminodiphenylmethane, N,N,N',N'-tetraglycidyldiethyldiphenylmethane, etc. Glyceryl aromatic amines; bis(N,N-diglycidylaminocyclohexyl)methane (N,N,N',N'-tetraglycidyldiaminodiphenylmethane hydride), N, N,N',N'-tetraglycidyl-1,3-(bisaminomethyl)cyclohexane (N,N,N',N'-tetraglycidylxylylenediamine hydride) , triglycidyl melamine, triglycidyl-p-aminophenol, N-glycidyl-4-glycidyloxypyrrolidone and other glycidyl heterocyclic amines, etc.

作為脂環式環氧化物,可例舉二氧化乙烯基環己烯、二氧化檸檬烯、二氧化二環戊二烯、二氧化三環戊二烯、雙(2,3-環氧環戊基)醚、乙二醇雙環氧二環戊基醚、3',4'-環氧-6'-甲基環己烷羧酸3,4-環氧-6-甲基環己基甲酯、3,4-環氧環己烷羧酸3,4-環氧環己基甲酯、3,4-環氧-1-甲基己烷羧酸3,4-環氧-1-甲基環己酯、3,4-環氧-3-甲基己烷羧酸3,4-環氧-3-甲基環己基甲酯、3,4-環氧-5-甲基環己烷羧酸3,4-環氧-5-甲基環己基甲酯、2-(3,4-環氧環己基-5,5-螺-3,4-環氧基)環己烷-間二㗁烷、亞甲基雙(3,4-環氧環己烷)、(3,3',4,4'-二環氧基)聯環己烷、2,2-雙(羥甲基)-1-丁醇之1,2-環氧-(2-環氧乙烷基)環己烷加成物、四氫茚二環氧化物等,較佳為3,4-環氧環己烷羧酸3',4'-環氧環己基甲酯。Examples of the alicyclic epoxide include vinylcyclohexene dioxide, limonene dioxide, dicyclopentadiene dioxide, tricyclopentadiene dioxide, bis(2,3-epoxycyclopentadiene) ) ether, ethylene glycol diepoxydicyclopentyl ether, 3',4'-epoxy-6'-methylcyclohexanecarboxylic acid 3,4-epoxy-6-methylcyclohexylmethyl ester, 3,4-Epoxycyclohexanecarboxylic acid 3,4-epoxycyclohexylmethyl ester, 3,4-epoxy-1-methylhexanecarboxylic acid 3,4-epoxy-1-methylcyclohexyl Esters, 3,4-epoxy-3-methylhexanecarboxylic acid 3,4-epoxy-3-methylcyclohexylmethyl ester, 3,4-epoxy-5-methylcyclohexanecarboxylic acid 3 , 4-epoxy-5-methylcyclohexyl methyl ester, 2-(3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy)cyclohexane-m-dioxane, Methylenebis(3,4-epoxycyclohexane), (3,3',4,4'-diepoxy)bicyclohexane, 2,2-bis(hydroxymethyl)-1- 1,2-epoxy-(2-oxiranyl)cyclohexane adduct of butanol, tetrahydroindene diepoxide, etc., preferably 3,4-epoxycyclohexanecarboxylic acid 3 ',4'-Epoxycyclohexylmethyl ester.

本發明之硬化性組合物可包含1或2種以上之如上所述之環氧化合物。The curable composition of the present invention may contain one or two or more of the above-mentioned epoxy compounds.

至於環氧化合物之含量,就硬化物之耐熱性之觀點而言,相對於硬化性組合物之總量100質量份,較佳為10~90質量份之範圍,更佳為30~70質量份之範圍。The content of the epoxy compound is preferably in the range of 10 to 90 parts by mass, more preferably 30 to 70 parts by mass with respect to 100 parts by mass of the total amount of the curable composition from the viewpoint of the heat resistance of the cured product range.

(溶劑/其他) 根據本發明之一實施形態,硬化性組合物可進而包含溶劑。作為溶劑,例如可例舉:丙酮、甲基乙基酮、乙酸乙酯、甲苯、及乙醇、氯仿、二氯甲烷等鹵素系溶劑;醯胺系溶劑等。(Solvent/Other) According to one embodiment of the present invention, the curable composition may further contain a solvent. Examples of the solvent include halogen-based solvents such as acetone, methyl ethyl ketone, ethyl acetate, toluene, ethanol, chloroform, and dichloromethane; amide-based solvents.

根據本發明之一實施形態,硬化性組合物可於不損及其特性之範圍內包含各種添加劑。作為添加劑,例如可例舉:填料(填充劑)、矽烷偶合劑、脫模劑、著色劑、阻燃劑、抗氧化劑、光穩定劑及塑化劑、消泡劑、光穩定劑、顏料或染料等著色劑、塑化劑、pH調整劑、著色防止劑、消光劑、除臭劑、耐候劑、抗靜電劑、線摩擦降低劑、滑澤劑、離子交換劑等。According to an embodiment of the present invention, the curable composition may contain various additives within a range not impairing its characteristics. Examples of additives include fillers (fillers), silane coupling agents, mold release agents, colorants, flame retardants, antioxidants, light stabilizers and plasticizers, defoaming agents, light stabilizers, pigments or Colorants such as dyes, plasticizers, pH adjusters, coloration inhibitors, matting agents, deodorants, weathering agents, antistatic agents, line friction reducers, luster agents, ion exchangers, etc.

(硬化性組合物之特性) 本發明之硬化性組合物之黏度可根據硬化前之硬化性組合物之黏度進行評價。(Characteristics of curable composition) The viscosity of the curable composition of the present invention can be evaluated based on the viscosity of the curable composition before curing.

硬化性組合物於30℃下之黏度並無特別限定,可例舉100 Pa・s以下,較佳為設為50 Pa・s以下,更佳為設為30 Pa・s以下。下限值並無特別限定,較佳為0.1 Pa・s以上。黏度可藉由流變儀進行測定。此種測定可使用市售之流變儀(例如TA Instruments製造),藉由平行板法進行測定。The viscosity of the curable composition at 30° C. is not particularly limited, but may, for example, be 100 Pa·s or less, preferably 50 Pa·s or less, and more preferably 30 Pa·s or less. The lower limit is not particularly limited, but is preferably 0.1 Pa·s or more. Viscosity can be measured by a rheometer. Such measurement can be performed by the parallel plate method using a commercially available rheometer (for example, manufactured by TA Instruments).

根據本發明之一實施形態,包含含有式(1)之苯并㗁𠯤化合物之混合物及其他樹脂(較佳為環氧化合物)而成之硬化性組合物由於如上所述般表現出非常低之黏度,因此於成型性、流動性優異之方面有利。尤其是若含有式(1)之苯并㗁𠯤化合物之混合物與其他樹脂(較佳為環氧化合物)混合時之黏度較低,則硬化性組合物中可較多地含有填料等,於所獲得之硬化性組合物及其硬化物之改質或高功能化變得容易之方面有利。According to an embodiment of the present invention, a curable composition comprising a mixture containing the benzodiazepine compound of formula (1) and other resins (preferably epoxy compounds) exhibits a very low Viscosity is therefore advantageous in terms of excellent formability and fluidity. In particular, if the viscosity of the mixture containing the benzodiazepine compound of the formula (1) is low when mixed with other resins (preferably epoxy compounds), the curable composition can contain more fillers, etc. It is advantageous in that the obtained curable composition and its cured product can be easily modified or highly functionalized.

硬化性組合物之製造方法 根據本發明之一實施形態,於硬化性組合物之製造中,按照業者廣泛周知之技術常識,可適當選擇進而包含於硬化性組合物之成分、及硬化性組合物之製備方法。 Manufacturing method of curable composition According to an embodiment of the present invention, in the manufacture of curable composition, the components and curable composition further included in the curable composition can be appropriately selected according to the technical knowledge widely known by the trade. the preparation method.

根據本發明之較佳之實施形態,作為硬化性組合物之製造方法,例如藉由將上述本發明之含有式(1)之苯并㗁𠯤化合物之混合物、進而根據所需適當追加上述成分及其他成分進行混練或混合,可製造硬化性組合物。According to a preferred embodiment of the present invention, as a method for producing a curable composition, for example, by adding the above-mentioned components and other components to the above-mentioned mixture of the present invention containing the benzodiazepine compound of the formula (1), as necessary The components are kneaded or mixed to produce a curable composition.

混練或混合方法並無特別限定,例如可使用行星式混合機、PD混合機、蝶式混合機、雙軸擠出機、熱輥、捏合機、Plastomill、分散攪拌機等混合裝置或混練機等進行混合。The kneading or mixing method is not particularly limited, and for example, it can be carried out using mixing devices such as planetary mixers, PD mixers, butterfly mixers, twin-screw extruders, hot rolls, kneaders, Plastomills, and dispersing mixers, kneaders, and the like. mix.

硬化物 根據本發明之一實施形態,使上述硬化性組合物硬化而成之硬化物具有玻璃轉移溫度較高、耐熱性優異之特徵。 Cured product According to one embodiment of the present invention, the cured product obtained by curing the above-mentioned curable composition has the characteristics of high glass transition temperature and excellent heat resistance.

(硬化物之特性) 根據本發明之一實施形態,硬化物之耐熱性可藉由測定玻璃轉移溫度進行評價。就耐熱性賦予之觀點而言,較佳為該玻璃轉移溫度較高。(Characteristics of hardened objects) According to one embodiment of the present invention, the heat resistance of the cured product can be evaluated by measuring the glass transition temperature. From the viewpoint of imparting heat resistance, the glass transition temperature is preferably high.

玻璃轉移溫度可藉由動態黏彈性測定(DMA)進行測定。利用DMA所進行之玻璃轉移溫度之測定可藉由使用市售之黏彈性測定裝置(例如Hitachi High-Tech Science股份有限公司製造,製品名:DMA-7100),簡便地進行。The glass transition temperature can be determined by dynamic viscoelasticity measurement (DMA). The measurement of the glass transition temperature by DMA can be easily performed by using a commercially available viscoelasticity measuring apparatus (for example, manufactured by Hitachi High-Tech Science Co., Ltd., product name: DMA-7100).

本發明之硬化物利用DMA所獲得之玻璃轉移溫度可例舉240℃以上,較佳為245℃以上,較佳為250℃以上。上限並無特別限定,較佳為300℃以下。The glass transition temperature of the cured product of the present invention obtained by DMA is 240°C or higher, preferably 245°C or higher, preferably 250°C or higher. The upper limit is not particularly limited, but is preferably 300°C or lower.

硬化物之製造方法 根據本發明之一實施形態,硬化物可藉由使上述本發明之硬化性組合物硬化而獲得。硬化性組合物之硬化方法並無特別限定,可藉由加熱等適當進行。 Manufacturing method of cured product According to one embodiment of the present invention, a cured product can be obtained by curing the above-mentioned curable composition of the present invention. The curing method of the curable composition is not particularly limited, and can be appropriately performed by heating or the like.

於藉由加熱使硬化性組合物硬化之情形時,較佳為多階段性地加熱硬化性組合物。藉此,可充分推進硬化反應。例如,可藉由160~200℃下60~240分鐘之一次加熱、及220~270℃下60~300分鐘之二次加熱而進行硬化反應。升溫至一次加熱溫度之升溫速度、及一次加熱溫度至二次加熱溫度之升溫速度並無特別限定,較佳為1~4℃/分鐘。然而,硬化反應之條件並不限定於上述,較佳為考慮含有式(1)之苯并㗁𠯤化合物之混合物之含量、硬化性組合物中所包含之其他化合物等之特性,適當變更而進行。When the curable composition is cured by heating, it is preferable to heat the curable composition in multiple stages. Thereby, the hardening reaction can be sufficiently advanced. For example, a hardening reaction can be performed by the primary heating at 160-200 degreeC for 60-240 minutes, and the secondary heating at 220-270 degreeC for 60-300 minutes. The temperature increase rate to the primary heating temperature and the temperature increase rate from the primary heating temperature to the secondary heating temperature are not particularly limited, but are preferably 1 to 4°C/min. However, the conditions of the curing reaction are not limited to the above, and are preferably carried out by appropriately changing the content of the mixture containing the benzodiazepine compound of the formula (1), the properties of other compounds contained in the curable composition, and the like. .

硬化物之用途 根據本發明之一實施形態,作為硬化物之用途,具體而言,可例舉:接著劑、黏著劑、塗佈於金屬、樹脂膜、玻璃、紙、木材等基材上之塗料、半導體元件或有機薄膜元件(例如有機電致發光元件或有機薄膜太陽電池元件)之表面保護膜、硬塗劑、防污膜及抗反射膜等之塗佈劑、透鏡、稜鏡、濾波器、圖像顯示材料、透鏡陣列、光半導體元件之密封材或反射材料、半導體元件之密封材、光波導、導光板、光擴散板、繞射元件及光學用接著劑等各種光學構件、澆鑄材料、層間絕緣體、印刷配向基板用保護絕緣膜及纖維強化複合材料等材料、抗蝕材料等。 [實施例] Use of hardened product According to one embodiment of the present invention, the use of hardened product may specifically include: adhesive, adhesive, coating on metal, resin film, glass, paper, wood and other substrates. Surface protection film, hard coating agent, antifouling film and antireflection film for coatings, semiconductor elements or organic thin film elements (such as organic electroluminescent elements or organic thin film solar cell elements), lenses, filters, filters Various optical components such as devices, image display materials, lens arrays, sealing materials or reflective materials for optical semiconductor elements, sealing materials for semiconductor elements, optical waveguides, light guide plates, light diffusing plates, diffractive elements, and optical adhesives, casting Materials, interlayer insulators, protective insulating films for printed and aligned substrates, fiber-reinforced composite materials, and other materials, anti-corrosion materials, etc. [Example]

以下,藉由實施例對本發明進一步詳細地進行說明,但本發明並不限定於該等實施例。Hereinafter, the present invention will be described in further detail by way of examples, but the present invention is not limited to these examples.

以下實施例、比較例中使用之物質如下所示。 ・對胺基苯酚:東京化成工業股份有限公司製造 ・苯酚:富士膠片和光純藥股份有限公司製造 ・雙酚F:東京化成工業股份有限公司製造 ・4,4'-雙酚F:東京化成工業股份有限公司製造 ・雙酚A:東京化成工業股份有限公司製造 ・多聚甲醛:富士膠片和光純藥股份有限公司製造 ・4,4'-二胺基二苯甲烷:奧德裏奇公司製造 ・苯胺:富士膠片和光純藥股份有限公司製造 ・氯仿:富士膠片和光純藥股份有限公司製造 ・1,4-二㗁烷:富士膠片和光純藥股份有限公司製造 ・環氧化合物:Celloxide 2021P(大賽璐(股)製造)The substances used in the following Examples and Comparative Examples are shown below. ・P-aminophenol: manufactured by Tokyo Chemical Industry Co., Ltd. ・Phenol: manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. ・Bisphenol F: manufactured by Tokyo Chemical Industry Co., Ltd. ・4,4'-Bisphenol F: manufactured by Tokyo Chemical Industry Co., Ltd. ・Bisphenol A: manufactured by Tokyo Chemical Industry Co., Ltd. ・Paraformaldehyde: manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. ・4,4'-Diaminodiphenylmethane: manufactured by Aldrich Corporation ・Aniline: manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. ・Chloroform: manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. ・1,4-Dioxane: manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. ・Epoxy compound: Celloxide 2021P (made by Daicel Co., Ltd.)

藉由以下方法進行以下實施例、比較例中之含有苯并㗁𠯤化合物之混合物之評價。( 含有苯并㗁 𠯤 化合物之混合物之數量平均分子量及重量平均分子量之測定、以及含有苯并㗁 𠯤 化合物之混合物中之 x 聚物之含有率之測定 ) 以下實施例、比較例中所獲得之混合物之數量平均分子量(Mn)及重量平均分子量(Mw)之測定係藉由GPC(凝膠滲透層析法)進行。又,x聚物相對於混合物總量之含有率(面積%)亦基於GPC之測定結果,根據使用下述分子量換算標準物質而獲得之GPC校準曲線算出。具體而言,x聚物之含有率(面積%)為x聚物之峰面積相對於源自混合物之峰面積之總和的比率。此處,作為峰面積,於峰分離之情形時,係將峰起點與結束點連結而獲得之面積值,於峰重疊之情形時,係自峰間之極小值垂直分割而獲得之面積值。The evaluation of the mixture containing the benzodiazepine compound in the following Examples and Comparative Examples was carried out by the following method. ( Measurement of the number-average molecular weight and weight-average molecular weight of the mixture containing the benzodiazepine compound, and the measurement of the content of the x - polymer in the mixture containing the benzodiazepine compound ) The following examples and comparative examples obtained The determination of the number average molecular weight (Mn) and the weight average molecular weight (Mw) of the mixture is carried out by GPC (gel permeation chromatography). In addition, the content rate (area %) of the x-polymer with respect to the total amount of the mixture was also calculated from the GPC calibration curve obtained by using the following molecular weight conversion standard substance based on the measurement result of GPC. Specifically, the content ratio (area %) of the x-polymer is the ratio of the peak area of the x-polymer to the sum of the peak areas derived from the mixture. Here, as the peak area, when the peaks are separated, it is the area value obtained by connecting the peak start point and the end point, and when the peaks overlap, it is the area value obtained by vertically dividing the minimum value between the peaks.

具體而言,GPC按照以下條件進行。 [GPC條件] 測定裝置:HLC-8420GPC(東曹股份有限公司) 管柱:TSKgel SuperHZ3000+TSKgel SuperHZ2000+TSKgel SuperHZ1000×2(分別為東曹股份有限公司)(管柱按照TSKgel SuperHZ3000、TSKgel SuperHZ2000、TSKgel SuperHZ1000 2根之順序串列連接) 溶析液:THF 流量:0.35 ml/分鐘 測定溫度:40℃ 注入量:3 μL(樣品為利用THF稀釋或溶解而製成約0.5 wt%溶液) 檢測器:UV檢測器 檢測波長:254 nm 分子量換算標準物質:使用下述結構之4種苯并㗁𠯤。 [化6]

Figure 02_image013
Specifically, GPC was performed under the following conditions. [GPC conditions] Measuring device: HLC-8420GPC (Tosoh Corporation) Column: TSKgel SuperHZ3000+TSKgel SuperHZ2000+TSKgel SuperHZ1000×2 (Tosoh Corporation, respectively) (Columns are based on two of TSKgel SuperHZ3000, TSKgel SuperHZ2000, and TSKgel SuperHZ1000 Serial connection) Eluent: THF Flow rate: 0.35 ml/min Measurement temperature: 40°C Injection volume: 3 μL (sample is diluted or dissolved with THF to prepare a solution of about 0.5 wt%) Detector: UV detector detection Wavelength: 254 nm Molecular weight conversion standard material: Four kinds of benzos with the following structures were used. [hua 6]
Figure 02_image013

於上述GPC測定中,如下所示求出x聚物之峰面積。將峰頂之分子量處於210~250之範圍之化合物之峰面積作為單體之峰面積。將峰頂之分子量處於320~420之範圍之化合物之峰面積作為二聚物之峰面積。將峰頂之分子量處於430~550之範圍之化合物之峰面積作為三聚物之峰面積。將峰頂之分子量處於570~650之範圍之化合物之峰面積作為4聚物之峰面積。將峰頂之分子量處於670~760之範圍之化合物之峰面積作為5聚物之峰面積。將峰頂之分子量處於780~850之範圍之化合物之峰面積作為6聚物之峰面積。將峰頂之分子量處於880~1100之範圍之化合物之峰面積作為7聚物以上之化合物之峰面積。In the above-mentioned GPC measurement, the peak area of the x-polymer was determined as follows. The peak area of the compound having the molecular weight of the peak top in the range of 210 to 250 was taken as the peak area of the monomer. The peak area of the compound having the molecular weight of the peak top in the range of 320 to 420 was taken as the peak area of the dimer. The peak area of the compound having the molecular weight of the peak top in the range of 430 to 550 was taken as the peak area of the trimer. The peak area of the compound having the molecular weight of the peak top in the range of 570 to 650 was taken as the peak area of the tetramer. The peak area of the compound having the molecular weight of the peak top in the range of 670 to 760 was taken as the peak area of the pentamer. The peak area of the compound having the molecular weight of the peak top in the range of 780 to 850 was taken as the peak area of the hexamer. The peak area of the compound having the molecular weight of the peak top in the range of 880 to 1100 was defined as the peak area of the compound having a 7-mer or more.

( 含有苯并㗁 𠯤 化合物之混合物之 1 H-NMR 光譜之測定 ) 對以下實施例、比較例中所獲得之混合物,進行1 H-NMR光譜之測定。具體而言,按照以下條件進行。 [1 H-NMR之測定條件] 測定裝置:DD2(Agilent Technologies) 溶劑:CDCl3 測定頻率:600 MHz 試樣濃度:0.3~0.8質量% 累計次數:16次 ( Measurement of 1 H-NMR spectrum of mixture containing benzodiazepine compound ) The mixture obtained in the following Examples and Comparative Examples was measured by 1 H-NMR spectrum. Specifically, it was performed under the following conditions. [Measurement conditions of 1 H-NMR] Measuring device: DD2 (Agilent Technologies) Solvent: CDCl 3 Measuring frequency: 600 MHz Sample concentration: 0.3 to 0.8 mass % Accumulation times: 16 times

( 含有苯并㗁 𠯤 化合物之混合物之紅外吸收光譜之測定 ) 藉由ATR法(attenuated total reflectance method,衰減全反射法),按照以下條件對以下實施例、比較例中所獲得之混合物之紅外吸收光譜(IR)進行測定。 [紅外吸收光譜之測定條件] 裝置:Nicolet iS10(Thermo Fisher Scientific) 測定範圍:4000~400 cm-1 累計次數:10次 ( Measurement of Infrared Absorption Spectrum of Mixtures Containing Benzoic Compounds ) By ATR method (attenuated total reflectance method, attenuated total reflection method), infrared absorption of the mixtures obtained in the following Examples and Comparative Examples under the following conditions Spectra (IR) were measured. [Measurement conditions of infrared absorption spectrum] Apparatus: Nicolet iS10 (Thermo Fisher Scientific) Measurement range: 4000 to 400 cm -1 Accumulation times: 10 times

( 含有苯并㗁 𠯤 化合物之混合物對環氧化合物之相容性之測定 ) 將以下實施例、比較例中所獲得之混合物50質量份及環氧化合物(Celloxide2021P,大賽璐(股)製造)50質量份加溫至80℃、100℃、或120℃進行混合,獲得試樣。基於以下基準對所獲得之試樣之相容性進行評價。 關於所獲得之試樣,將未殘留不溶性殘渣之狀態評價為「相容」。所謂「相容」,具體而言係混合物全部溶解於環氧化合物,為均勻溶液之狀態。 ◎:可於80℃以下相容 :可於100℃以下相容 △:可於120℃以下相容 ×:存在未溶解 ( Measurement of Compatibility of Mixtures Containing Benzoic Compounds with Epoxy Compounds ) 50 parts by mass of the mixtures obtained in the following Examples and Comparative Examples and 50 parts by mass of an epoxy compound ( Celloxide 2021P, manufactured by Daicel Co., Ltd.) Parts by mass were heated to 80°C, 100°C, or 120°C and mixed to obtain a sample. The compatibility of the obtained samples was evaluated based on the following criteria. Regarding the obtained sample, the state in which no insoluble residue remained was evaluated as "compatible". The so-called "compatibility" refers to a state in which the entire mixture is dissolved in the epoxy compound and is a homogeneous solution. ◎: Compatible below 80°C: Compatible below 100°C △: Compatible below 120°C ×: Undissolved

( 含有苯并㗁 𠯤 化合物之混合物與環氧化合物之製備物 ( 熱硬化性組合物 ) 之黏度之測定 ) 將以下實施例、比較例中所獲得之混合物50質量份、及環氧化合物(Celloxide2021P,大賽璐(股)製造)50質量份進行加溫製成均勻溶液後,冷卻至室溫,使用所得者作為試樣。 試樣之黏度係使用流變儀(DHR-2,TA Instruments製造)進行測定。具體而言,將試樣夾於間隙調整為1 mm之平行板,以2℃/min之升溫速度自溫度20℃升溫至140℃進行測定,求出30℃下之黏度。測定係以10 rad/s之轉速進行。 ( Measurement of Viscosity of Preparation ( Thermosetting Composition ) of a Mixture Containing a Benzoic Compound and an Epoxy Compound ) 50 parts by mass of the mixture obtained in the following Examples and Comparative Examples, and an epoxy compound ( Celloxide2021P , Daicel (Co., Ltd.) 50 parts by mass was heated to prepare a homogeneous solution, and then cooled to room temperature, and the obtained product was used as a sample. The viscosity of the sample was measured using a rheometer (DHR-2, manufactured by TA Instruments). Specifically, the sample was sandwiched between a parallel plate with a gap adjusted to 1 mm, the temperature was increased from 20°C to 140°C at a temperature increase rate of 2°C/min, and the measurement was performed, and the viscosity at 30°C was obtained. The measurements were carried out at a rotational speed of 10 rad/s.

( 硬化物之玻璃轉移溫度; Tg) 將以下實施例、比較例中所獲得之混合物50質量份及環氧化合物50質量份加入杯中,加溫至100℃(其中,僅比較例3為120℃)後,藉由MAZERUSTAR(KK-V350W,真空行星式攪拌消泡裝置,倉敷紡織股份有限公司製造)進行混合、除氣而製備。其後,將所獲得之製備物注入至模具中,於烘箱內以2℃/分鐘之升溫速度自100℃升溫至180℃後,於180℃下加熱2小時,其後,以2℃/分鐘之升溫速度升溫至250℃,於250℃下加熱4小時,藉此進行硬化而製作硬化物。將所獲得之硬化物切割為縱約10 mm×橫約50 mm×厚度約3 mm之大小而獲得試片。使用該試片,藉由下述黏彈性測定裝置按照下述條件由tanδ之峰頂測定Tg。將結果示於表1。 裝置:DMA-7100(Hitachi High-Tech Science股份有限公司製造) 測定條件:N2 流量;20 ml/分鐘、測定範圍;30~350℃、升溫速度;5℃/分鐘 ( Glass transition temperature of hardened product; Tg) 50 parts by mass of the mixture obtained in the following Examples and Comparative Examples and 50 parts by mass of the epoxy compound were put into a cup, and heated to 100° C. (only Comparative Example 3 was 120 °C), it was prepared by mixing and degassing by MAZERUSTAR (KK-V350W, vacuum planetary stirring defoaming device, manufactured by Kurashiki Textile Co., Ltd.). After that, the obtained preparation was injected into a mold, heated in an oven from 100°C to 180°C at a heating rate of 2°C/min, heated at 180°C for 2 hours, and thereafter heated at 2°C/min The temperature increase rate was raised to 250°C, and the cured product was produced by heating at 250°C for 4 hours. The obtained hardened material was cut into a size of about 10 mm in length, about 50 mm in width, and about 3 mm in thickness to obtain a test piece. Using this test piece, Tg was measured from the peak top of tanδ by the following viscoelasticity measuring apparatus under the following conditions. The results are shown in Table 1. Apparatus: DMA-7100 (manufactured by Hitachi High-Tech Science Co., Ltd.) Measurement conditions: N2 flow rate; 20 ml/min, measurement range; 30 to 350°C, heating rate; 5°C/min

實施例 1 :含有苯并㗁 𠯤 化合物之混合物 (p-AP/BisF/ 苯胺= 2/1.2/2) 之合成 將對胺基苯酚(109 g、1.00 mol)、雙酚F(120 g、0.60 mol)、苯胺(93 g、1.00 mol)、多聚甲醛(132 g、4.4 mol)溶解於氯仿(0.4 L)/1,4-二㗁烷(0.6 L)中,於加熱回流下(油浴之溫度:80℃)攪拌60小時。 反應結束後,過濾反應物,接著將濾液濃縮至1/3量之後,以己烷進行晶析,進行過濾分離、真空乾燥,獲得包含目標之苯并㗁𠯤化合物之混合物315 g(產率為90莫耳%)。 將以莫耳比等表示上述原料者示於表1。 Example 1 : Synthesis of a mixture containing benzodiazepines (p-AP/BisF/ aniline = 2/1.2/2) p - aminophenol (109 g, 1.00 mol), bisphenol F (120 g, 0.60 mol), aniline (93 g, 1.00 mol), and paraformaldehyde (132 g, 4.4 mol) were dissolved in chloroform (0.4 L)/1,4-dioxane (0.6 L), and heated to reflux (oil bath). temperature: 80°C) and stirred for 60 hours. After the reaction was completed, the reactant was filtered, and the filtrate was concentrated to 1/3 of the amount, followed by crystallization with hexane, filtration separation, and vacuum drying to obtain 315 g of a mixture containing the target benzodiazepine compound (the yield was 315 g). 90 mol%). Table 1 shows the above-mentioned raw materials in molar ratios and the like.

將實施例1中所獲得之混合物之平均分子量示於表1。進而,將基於GPC測定之實施例1中所獲得之混合物中之x聚物之含有率示於表1。再者,表1中,「ND」表示未達檢測極限。此處,檢測極限為0.1面積%。The average molecular weight of the mixture obtained in Example 1 is shown in Table 1. Furthermore, Table 1 shows the content ratio of the x-polymer in the mixture obtained in Example 1 by GPC measurement. In addition, in Table 1, "ND" means that the detection limit is not reached. Here, the detection limit is 0.1 area %.

又,關於實施例1中所獲得之混合物,進行1 H-NMR光譜之測定,將其測定結果示於圖1。 於1 H-NMR光譜中,確認4.2~4.7 ppm及5.0~5.4 ppm附近之峰為歸屬於㗁𠯤環之CH2 之峰,包含於㗁𠯤環之2個部位,其質子之積分值之比約為1:1。In addition, about the mixture obtained in Example 1, the measurement of 1 H-NMR spectrum was performed, and the measurement result is shown in FIG. 1. FIG. In the 1 H-NMR spectrum, the peaks around 4.2 to 4.7 ppm and 5.0 to 5.4 ppm were confirmed to be peaks belonging to CH 2 in the 㗁𠯤 ring, and the ratio of the integral values of the protons included in the two sites of the 㗁𠯤 ring. About 1:1.

(實施例1中所獲得之混合物之1 H NMR光譜)1 H NMR (600 MHz, CDCl3 ) δ (ppm) 7.4 - 6.6(芳香族H)、5.4 - 5.0 (-O-CH2 -N)、4.7 - 4.2 (N-CH2 -C)、3.9 - 3.6 (C-CH2 -C)。( 1 H NMR spectrum of the mixture obtained in Example 1) 1 H NMR (600 MHz, CDCl 3 ) δ (ppm) 7.4 - 6.6 (aromatic H), 5.4 - 5.0 (-OC H 2 -N), 4.7 - 4.2 (NC H 2 -C), 3.9 - 3.6 (CC H 2 -C).

關於實施例1中所獲得之混合物,進行紅外吸收光譜之測定,將其測定結果示於圖2。於926 cm-1 、1221 cm-1 、及1492 cm-1 觀察到苯并㗁𠯤之特徵峰。About the mixture obtained in Example 1, the infrared absorption spectrum measurement was performed, and the measurement result is shown in FIG. 2. FIG. Characteristic peaks of benzodiazepines were observed at 926 cm -1 , 1221 cm -1 , and 1492 cm -1 .

根據上述GPC、1 H NMR光譜、及紅外吸收光譜之測定結果,確認所獲得之混合物中包含下述式之化合物(m+n=2(理論值))。 [化7]

Figure 02_image015
According to the measurement results of the above-mentioned GPC, 1 H NMR spectrum, and infrared absorption spectrum, it was confirmed that the compound of the following formula (m+n=2 (theoretical value)) was contained in the obtained mixture. [hua 7]
Figure 02_image015

進而,將關於實施例1中所獲得之混合物之與環氧化合物之相容性、黏度、玻璃轉移溫度之測定結果示於表1。Furthermore, Table 1 shows the measurement results of the compatibility with the epoxy compound, the viscosity, and the glass transition temperature of the mixture obtained in Example 1.

[表1]    實施例 比較例 1 2 1 2 3 4 5 莫耳比                      對胺基苯酚 2 2 7             羥基含有率 45% 45% 88%             胺基含有率 50% 50% 88%             苯酚       1       2 2 雙酚F 1.2          1 1    4,4'-雙酚F    1.2                雙酚A          1          4,4'-二胺基二苯甲烷          1 1 2 1 苯胺 2 2 1             OH/NH2 1.10 1.10 1.00 1.00 1.00 1.00    反應時間 60 60 42 5 5 48 - 產率(莫耳%) 90 90 86 100 80 83 - 平均分子量Mn 735 718 661 1530 1000 900 - Mw/Mn 1.17 1.15 1.48 2.79 3.13 3.04 - 單體之含有率(面積%) ND ND 4.2 ND ND ND - 二聚物之含有率(面積%) 1.8 2.2 10.8 ND ND 13 - 3~6聚物之含有率(面積%) 59.9 68.8 44.2 100 100 87 - 7聚物以上之化合物之含有率(面積%) 38.3 29 38.2 - 與環氧化合物之相容性  ×  黏度(Pa・s) 20 13 155 - 4520 3880 5                (40℃)       玻璃轉移溫度(℃) 254 254 232 - 270 230 185 [Table 1] Example Comparative example 1 2 1 2 3 4 5 Morby p-aminophenol 2 2 7 Hydroxyl content 45% 45% 88% Amino group content 50% 50% 88% phenol 1 2 2 Bisphenol F 1.2 1 1 4,4'-Bisphenol F 1.2 Bisphenol A 1 4,4'-Diaminodiphenylmethane 1 1 2 1 aniline 2 2 1 OH/NH 2 1.10 1.10 1.00 1.00 1.00 1.00 Reaction time 60 60 42 5 5 48 - Yield (mol%) 90 90 86 100 80 83 - Average molecular weight Mn 735 718 661 1530 1000 900 - Mw/Mn 1.17 1.15 1.48 2.79 3.13 3.04 - Monomer content (area %) ND ND 4.2 ND ND ND - Dimer content (area %) 1.8 2.2 10.8 ND ND 13 - Content rate of 3-6 polymers (area %) 59.9 68.8 44.2 100 100 87 - Content rate of compounds with more than 7 polymers (area %) 38.3 29 38.2 - Compatibility with epoxy compounds × Viscosity (Pa・s) 20 13 155 - 4520 3880 5 (40℃) Glass transition temperature (℃) 254 254 232 - 270 230 185

實施例 2 如上述表1所示那樣變更原料之組成、調配比率、反應時間,將多聚甲醛(換算為甲醛)設為對胺基苯酚與苯胺之合計之2.2倍莫耳,除此以外,以與實施例1相同之方式合成混合物。 Example 2 Except that the composition of the raw materials, the mixing ratio, and the reaction time were changed as shown in Table 1 above, and the paraformaldehyde (converted to formaldehyde) was set to 2.2 times the mol of the total of p-aminophenol and aniline, The mixture was synthesized in the same manner as in Example 1.

將實施例2中所獲得之混合物之平均分子量示於表1。進而,將基於GPC測定之實施例2中所獲得之混合物中之x聚物之含有率示於表1。The average molecular weight of the mixture obtained in Example 2 is shown in Table 1. Furthermore, Table 1 shows the content ratio of the x-polymer in the mixture obtained in Example 2 by GPC measurement.

又,關於實施例2中所獲得之混合物,進行1 H-NMR光譜之測定,將其測定結果示於圖3。 於1 H-NMR光譜中,4.2~4.8 ppm及5.0~5.6 ppm附近之峰為歸屬於㗁𠯤環之CH2 之峰,包含於㗁𠯤環之2個部位,其質子之積分值之比約為1:1。Moreover, about the mixture obtained in Example 2, the measurement result of 1 H-NMR spectrum was performed, and the measurement result is shown in FIG. In the 1 H-NMR spectrum, the peaks around 4.2 to 4.8 ppm and 5.0 to 5.6 ppm are the peaks belonging to CH 2 of the 㗁𠯤 ring, which are included in the two parts of the 㗁𠯤 ring, and the ratio of the integral value of the protons is about 1:1.

(實施例2中所獲得之混合物之1 H NMR光譜)1 H NMR (600 MHz, CDCl3 ) δ (ppm) 7.4 - 6.4(芳香族H)、5.6 - 5.0 (-O-CH2 -N)、4.8 - 4.2 (N-CH2 -C)、3.9 - 3.6 (C-CH2 -C)。( 1 H NMR spectrum of the mixture obtained in Example 2) 1 H NMR (600 MHz, CDCl 3 ) δ (ppm) 7.4 - 6.4 (aromatic H), 5.6 - 5.0 (-O-CH 2 -N) , 4.8 - 4.2 (N-CH 2 -C), 3.9 - 3.6 (CC H 2 -C).

關於實施例2中所獲得之混合物,進行紅外吸收光譜之測定,將其測定結果示於圖4。於931 cm-1 、1222 cm-1 、及1494 cm-1 觀察到苯并㗁𠯤之特徵峰。About the mixture obtained in Example 2, the infrared absorption spectrum measurement was performed, and the measurement result is shown in FIG. 4. FIG. Characteristic peaks of benzodiazepines were observed at 931 cm -1 , 1222 cm -1 , and 1494 cm -1 .

比較例 1 將對胺基苯酚(38.1 g、0.35 mol)、苯酚(4.7 g、50 mmol)、苯胺(4.7 g、50 mmol)、多聚甲醛(26 g、0.87 mol)溶解於氯仿(150 ml)/1,4-二㗁烷(180 ml)中,於加熱回流下(油浴之溫度:80℃)攪拌42小時。 反應結束後,過濾反應物,接著將濾液濃縮至1/3量之後,以己烷進行晶析,進行過濾分離、真空乾燥,獲得包含目標之苯并㗁𠯤化合物之混合物49 g(產率為86莫耳%)。 Comparative Example 1 p-aminophenol (38.1 g, 0.35 mol), phenol (4.7 g, 50 mmol), aniline (4.7 g, 50 mmol), and paraformaldehyde (26 g, 0.87 mol) were dissolved in chloroform (150 ml) )/1,4-dioxane (180 ml), and stirred under reflux with heating (temperature of oil bath: 80° C.) for 42 hours. After the reaction was completed, the reactant was filtered, and the filtrate was concentrated to 1/3 of the amount, followed by crystallization with hexane, filtration separation, and vacuum drying to obtain 49 g of a mixture containing the target benzodiazepine compound (yield: 49 g). 86 mol%).

將關於比較例1中所獲得之混合物之產率、平均分子量、x聚物之含有率示於表1。Table 1 shows the yield, average molecular weight, and x-polymer content of the mixture obtained in Comparative Example 1.

又,關於比較例1中所獲得之混合物,進行1 H-NMR光譜之測定,將其測定結果示於圖5。Moreover, about the mixture obtained in the comparative example 1, the measurement of 1 H-NMR spectrum was performed, and the measurement result is shown in FIG. 5. FIG.

(比較例1中所獲得之混合物之1 H NMR光譜)1 H NMR (600 MHz, CDCl3 ) δ (ppm) 7.5 - 6.3(芳香族H)、5.4 - 5.0 (-O-CH2 -N)、4.7 - 4.0 (N-CH2 -C)。( 1 H NMR spectrum of the mixture obtained in Comparative Example 1) 1 H NMR (600 MHz, CDCl 3 ) δ (ppm) 7.5 - 6.3 (aromatic H), 5.4 - 5.0 (-OC H 2 -N), 4.7 - 4.0 (NCH2- C ).

關於比較例1中所獲得之混合物,進行紅外吸收光譜之測定,將其測定結果示於圖6。於933 cm-1 、1220 cm-1 、及1494 cm-1 觀察到苯并㗁𠯤之特徵峰。About the mixture obtained in the comparative example 1, the infrared absorption spectrum measurement was performed, and the measurement result is shown in FIG. 6. FIG. Characteristic peaks of benzodiazepines were observed at 933 cm -1 , 1220 cm -1 , and 1494 cm -1 .

根據上述GPC、1 H NMR光譜及紅外吸收光譜之測定結果,確認所獲得之混合物中包含下述式之化合物(n=7(理論值))。 [化8]

Figure 02_image017
According to the measurement results of the above-mentioned GPC, 1 H NMR spectrum and infrared absorption spectrum, it was confirmed that the compound of the following formula (n=7 (theoretical value)) was contained in the obtained mixture. [hua 8]
Figure 02_image017

進而,將關於比較例1中所獲得之混合物之與環氧化合物之相容性、黏度、玻璃轉移溫度之測定結果示於表1。Furthermore, Table 1 shows the measurement results of the compatibility with the epoxy compound, the viscosity, and the glass transition temperature of the mixture obtained in Comparative Example 1.

比較例 2 將雙酚A(70 g、0.31 mol)、4,4'-二胺基二苯甲烷(61 g、0.31 mol)、多聚甲醛(40 g、1.31 mol)溶解於氯仿(0.8 L)中,於加熱回流下(油浴之溫度:80℃)攪拌5小時。 反應結束後,過濾反應物,藉由1N NaHCO3 水溶液(1.6 L)將濾液分液洗淨,乾燥(NaSO4 )後,進行過濾、濃縮,其後,以甲醇進行晶析,進行過濾分離、真空乾燥,獲得包含目標之苯并㗁𠯤化合物之混合物156 g(產率為100莫耳%)。 Comparative Example 2 Bisphenol A (70 g, 0.31 mol), 4,4'-diaminodiphenylmethane (61 g, 0.31 mol), and paraformaldehyde (40 g, 1.31 mol) were dissolved in chloroform (0.8 L) ), the mixture was stirred under heating under reflux (temperature of oil bath: 80° C.) for 5 hours. After completion of the reaction, the reactant was filtered, the filtrate was washed with a 1N aqueous NaHCO 3 solution (1.6 L), and the filtrate was dried (NaSO 4 ), filtered and concentrated. After drying in vacuo, 156 g of a mixture containing the target benzodiazepine compound was obtained (yield 100 mol%).

將關於比較例2中所獲得之混合物之產率、平均分子量、x聚物之含有率示於表1。再者,於比較例2中,由於各聚物之峰未分離,因此算出三聚物以上之化合物之合計。Table 1 shows the yield, average molecular weight, and x-polymer content of the mixture obtained in Comparative Example 2. In addition, in the comparative example 2, since the peak of each polymer was not isolate|separated, the sum total of the compound more than a trimer was calculated.

又,關於比較例2中所獲得之混合物,進行1 H-NMR光譜之測定,將其測定結果示於圖7。Moreover, about the mixture obtained in the comparative example 2, the measurement of 1 H-NMR spectrum was performed, and the measurement result is shown in FIG. 7. FIG.

(比較例2中所獲得之混合物之1 H NMR光譜)1 H NMR (600 MHz, CDCl3 ) δ (ppm) 7.2 - 6.4(芳香族H)、5.4 - 5.2 (-O-CH2 -N)、4.6 - 4.4 (N-CH2 -C)、3.9 - 3.7 (C-CH2 -C)、1.7 - 1.4 (CH3 )。( 1 H NMR spectrum of the mixture obtained in Comparative Example 2) 1 H NMR (600 MHz, CDCl 3 ) δ (ppm) 7.2 - 6.4 (aromatic H), 5.4 - 5.2 (-OC H 2 -N), 4.6 - 4.4 (NC H 2 -C), 3.9 - 3.7 (CC H 2 -C), 1.7 - 1.4 (CH 3 ).

關於比較例2中所獲得之混合物,進行紅外吸收光譜之測定,將其測定結果示於圖8。於938 cm-1 、1228 cm-1 、及1497、1510 cm-1 觀察到苯并㗁𠯤之特徵峰。About the mixture obtained in the comparative example 2, the measurement of the infrared absorption spectrum was performed, and the measurement result is shown in FIG. 8. FIG. Characteristic peaks of benzodiazepines were observed at 938 cm -1 , 1228 cm -1 , and 1497 and 1510 cm -1 .

根據上述GPC測定結果、1 H NMR光譜之測定值及紅外吸收光譜之測定結果,確認所獲得之混合物中包含具有下述式之重複單元之化合物。 [化9]

Figure 02_image019
According to the above-mentioned GPC measurement results, the measurement results of the 1 H NMR spectrum, and the measurement results of the infrared absorption spectrum, it was confirmed that the compound having the repeating unit of the following formula was contained in the obtained mixture. [Chemical 9]
Figure 02_image019

進而,將關於比較例2中所獲得之混合物之與環氧化合物之相容性、黏度、玻璃轉移溫度之測定結果示於表1。再者,比較例2中所獲得之混合物由於與環氧化合物之相容性較差,無法獲得均勻之組合物,因此無法測定該混合物之黏度或玻璃轉移溫度。Furthermore, Table 1 shows the measurement results of the compatibility with the epoxy compound, the viscosity, and the glass transition temperature of the mixture obtained in Comparative Example 2. Furthermore, since the mixture obtained in Comparative Example 2 had poor compatibility with epoxy compounds, a uniform composition could not be obtained, so the viscosity or glass transition temperature of the mixture could not be measured.

比較例 3 將雙酚F(61 g、0.31 mol)、4,4'-二胺基二苯甲烷(61 g、0.31 mol)、多聚甲醛(40 g,1.32 mol)溶解於氯仿(0.8 L)中,於加熱回流下(油浴之溫度:80℃)攪拌5小時。 反應結束後,過濾反應物,藉由1N NaHCO3 水溶液(1.6 L)將濾液分液洗淨,乾燥(NaSO4 )後,進行過濾、濃縮,其後,以甲醇進行晶析,進行過濾分離、真空乾燥,獲得包含目標之苯并㗁𠯤化合物之混合物112 g(產率為80莫耳%)。 Comparative Example 3 Bisphenol F (61 g, 0.31 mol), 4,4'-diaminodiphenylmethane (61 g, 0.31 mol), and paraformaldehyde (40 g, 1.32 mol) were dissolved in chloroform (0.8 L) ), the mixture was stirred under heating under reflux (temperature of oil bath: 80° C.) for 5 hours. After completion of the reaction, the reactant was filtered, the filtrate was washed with a 1N aqueous NaHCO 3 solution (1.6 L), and the filtrate was dried (NaSO 4 ), filtered and concentrated. After drying in vacuo, 112 g of a mixture containing the target benzodiazepine compound was obtained (yield: 80 mol%).

將關於比較例3中所獲得之混合物之產率、平均分子量、x聚物之含有率示於表1。再者,於比較例3中,由於各聚物之峰未分離,因此算出三聚物以上之化合物之合計。Table 1 shows the yield, average molecular weight, and x-polymer content of the mixture obtained in Comparative Example 3. In addition, in the comparative example 3, since the peak of each polymer was not isolate|separated, the sum total of the compound of a trimer or more was calculated.

又,關於比較例3中所獲得之混合物,進行1 H-NMR光譜之測定,將其測定結果示於圖9。Moreover, about the mixture obtained in the comparative example 3, the measurement of 1 H-NMR spectrum was performed, and the measurement result is shown in FIG. 9. FIG.

(比較例3中所獲得之混合物之1 H NMR光譜)1 H NMR (600 MHz, CDCl3 ) δ (ppm) 7.2 - 6.5(芳香族H)、5.4 - 5.1 (-O-CH2 -N)、4.6 - 4.3 (N-CH2 -C)、3.9 - 3.6 (C-CH2 -C)。( 1 H NMR spectrum of the mixture obtained in Comparative Example 3) 1 H NMR (600 MHz, CDCl 3 ) δ (ppm) 7.2 - 6.5 (aromatic H), 5.4 - 5.1 (-OC H 2 -N), 4.6 - 4.3 (NC H 2 -C), 3.9 - 3.6 (CC H 2 -C).

關於比較例3中所獲得之混合物,進行紅外吸收光譜之測定,將其測定結果示於圖10。於928 cm-1 、1223 cm-1 、及1499、1511 cm-1 觀察到苯并㗁𠯤之特徵峰。About the mixture obtained in the comparative example 3, the infrared absorption spectrum measurement was performed, and the measurement result is shown in FIG. 10. FIG. Characteristic peaks of benzodiazepines were observed at 928 cm -1 , 1223 cm -1 , and 1499 and 1511 cm -1 .

根據上述GPC、1 H NMR光譜及紅外吸收光譜之測定結果,確認所獲得之混合物中包含具有下述式之重複單元之化合物。 [化10]

Figure 02_image021
According to the measurement results of the above-mentioned GPC, 1 H NMR spectrum and infrared absorption spectrum, it was confirmed that the compound having the repeating unit of the following formula was contained in the obtained mixture. [Chemical 10]
Figure 02_image021

進而,將關於比較例3中所獲得之混合物之與環氧化合物之相容性、黏度、玻璃轉移溫度之測定結果示於表1。再者,作為關於比較例3中所獲得之混合物之黏度,表示40℃下之黏度。Furthermore, Table 1 shows the measurement results of the compatibility with the epoxy compound, the viscosity, and the glass transition temperature of the mixture obtained in Comparative Example 3. In addition, as the viscosity of the mixture obtained by the comparative example 3, the viscosity at 40 degreeC is shown.

比較例 4 將雙酚F(100 g、0.50 mol)、4,4'-二胺基二苯甲烷(198 g、1.00 mol)、苯酚(94 g、1.00 mol)、多聚甲醛(132 g、4.4 mol)溶解於氯仿(1.0 L)中,於加熱回流下(油浴之溫度:80℃)攪拌48小時。 反應結束後,過濾反應物,將濾液用水(1 L、3次)洗淨,乾燥(MgSO4 )後,以己烷進行晶析,進行過濾分離、真空乾燥,獲得包含目標之苯并㗁𠯤化合物之混合物352 g(產率為83莫耳%)。 Comparative Example 4 bisphenol F (100 g, 0.50 mol), 4,4'-diaminodiphenylmethane (198 g, 1.00 mol), phenol (94 g, 1.00 mol), paraformaldehyde (132 g, 1.00 mol) 4.4 mol) was dissolved in chloroform (1.0 L), and stirred under heating under reflux (temperature of oil bath: 80° C.) for 48 hours. After completion of the reaction, the reactant was filtered, the filtrate was washed with water (1 L, 3 times), dried (MgSO 4 ), crystallized with hexane, separated by filtration, and dried in vacuo to obtain the target benzodiazepine. Compound mixture 352 g (yield 83 mol%).

將關於比較例4中所獲得之混合物之產率、平均分子量、x聚物之含有率示於表1。再者,於比較例4中,由於三聚物以上之化合物之峰未分離,因此算出三聚物以上之化合物之合計。Table 1 shows the yield, average molecular weight, and x-polymer content of the mixture obtained in Comparative Example 4. In addition, in the comparative example 4, since the peak of the compound of a trimer or more was not isolate|separated, the sum total of the compound of a trimer or more was calculated.

又,關於比較例4中所獲得之混合物,進行1 H-NMR光譜之測定,將其測定結果示於圖11。Moreover, about the mixture obtained in the comparative example 4, the measurement of 1 H-NMR spectrum was performed, and the measurement result is shown in FIG. 11. FIG.

(比較例4中所獲得之混合物之1 H NMR光譜)1 H NMR (600 MHz, CDCl3 ) δ (ppm) 7.3 - 6.5(芳香族H)、5.4 - 5.0 (-O-CH2 -N)、5.0 - 4.4 (N-CH2 -C)、3.9 - 3.6 (C-CH2 -C)。( 1 H NMR spectrum of the mixture obtained in Comparative Example 4) 1 H NMR (600 MHz, CDCl 3 ) δ (ppm) 7.3 - 6.5 (aromatic H), 5.4 - 5.0 (-OC H 2 -N), 5.0 - 4.4 (NC H 2 -C), 3.9 - 3.6 (CC H 2 -C).

關於比較例4中所獲得之混合物,進行紅外吸收光譜之測定,將其測定結果示於圖12。於926 cm-1 、1223 cm-1 、及1497、1510 cm-1 觀察到苯并㗁𠯤之特徵峰。About the mixture obtained in the comparative example 4, the measurement of the infrared absorption spectrum was performed, and the measurement result is shown in FIG. 12. FIG. Characteristic peaks of benzodiazepines were observed at 926 cm -1 , 1223 cm -1 , and 1497 and 1510 cm -1 .

根據上述GPC、1 H NMR光譜及紅外吸收光譜之測定結果,確認所獲得之混合物中包含下述式之化合物(n=1(理論值))。 [化11]

Figure 02_image023
According to the measurement results of the above-mentioned GPC, 1 H NMR spectrum and infrared absorption spectrum, it was confirmed that the compound of the following formula (n=1 (theoretical value)) was contained in the obtained mixture. [Chemical 11]
Figure 02_image023

進而,將關於比較例4中所獲得之混合物之與環氧化合物之相容性、黏度、玻璃轉移溫度之測定結果示於表1。Furthermore, Table 1 shows the measurement results of the compatibility with the epoxy compound, the viscosity, and the glass transition temperature of the mixture obtained in Comparative Example 4.

比較例 5 作為比較例5,使用下述所示之市售之苯酚-二胺基二苯甲烷(P-d)型苯并㗁𠯤(四國化成股份有限公司製造)。 [化12]

Figure 02_image025
Comparative Example 5 As Comparative Example 5, commercially available phenol-diaminodiphenylmethane (Pd) type benzodiazepines (manufactured by Shikoku Chemical Co., Ltd.) shown below were used. [Chemical 12]
Figure 02_image025

將關於比較例5之(P-d)型苯并㗁𠯤之與環氧化合物之相容性、黏度、玻璃轉移溫度之測定結果示於表1。Table 1 shows the measurement results of the compatibility with the epoxy compound, the viscosity, and the glass transition temperature of the (P-d) type benzodiazepine of Comparative Example 5.

根據上述表1所示之結果,可知含有式(1)之苯并㗁𠯤化合物之混合物對環氧化合物表現出優異之相容性,能夠降低硬化性組合物之黏度。進而可知包含含有式(1)之苯并㗁𠯤化合物之混合物的硬化性組合物之硬化物表現出優異之耐熱性。 [相關申請案之參照]From the results shown in the above Table 1, it can be seen that the mixture containing the benzodiazepine compound of the formula (1) exhibits excellent compatibility with epoxy compounds and can reduce the viscosity of the curable composition. Furthermore, it turned out that the hardened|cured material of the curable composition containing the mixture containing the benzodiazepine compound of Formula (1) shows excellent heat resistance. [Reference to related applications]

本專利申請案係附有基於2020年7月3日提出申請之日本專利申請案2020-115952號之優先權主張,該在所述專利申請案中之全部揭示內容藉由引用而成為本說明書之一部分。This patent application is accompanied by a claim of priority based on Japanese Patent Application No. 2020-115952 filed on July 3, 2020, the entire disclosure of which is incorporated herein by reference. part.

圖1表示實施例1中所獲得之含有苯并㗁𠯤化合物之混合物之1 H NMR(Nuclear Magnetic Resonance,核磁共振)峰圖。 圖2表示實施例1中所獲得之含有苯并㗁𠯤化合物之混合物之紅外吸收光譜(IR)。 圖3表示實施例2中所獲得之含有苯并㗁𠯤化合物之混合物之1 H NMR峰圖。 圖4表示實施例2中所獲得之含有苯并㗁𠯤化合物之混合物之紅外吸收光譜(IR)。 圖5表示比較例1中所獲得之含有苯并㗁𠯤化合物之混合物之1 H NMR峰圖。 圖6表示比較例1中所獲得之含有苯并㗁𠯤化合物之混合物之紅外吸收光譜(IR)。 圖7表示比較例2中所獲得之含有苯并㗁𠯤化合物之混合物之1 H NMR峰圖。 圖8表示比較例2中所獲得之含有苯并㗁𠯤化合物之混合物之紅外吸收光譜(IR)。 圖9表示比較例3中所獲得之含有苯并㗁𠯤化合物之混合物之1 H NMR峰圖。 圖10表示比較例3中所獲得之含有苯并㗁𠯤化合物之混合物之紅外吸收光譜(IR)。 圖11表示比較例4中所獲得之含有苯并㗁𠯤化合物之混合物之1 H NMR峰圖。 圖12表示比較例4中所獲得之含有苯并㗁𠯤化合物之混合物之紅外吸收光譜(IR)。FIG. 1 shows the 1 H NMR (Nuclear Magnetic Resonance, nuclear magnetic resonance) peak diagram of the mixture containing the benzodiazepine compound obtained in Example 1. FIG. FIG. 2 shows the infrared absorption spectrum (IR) of the mixture containing the benzodiazepine compound obtained in Example 1. FIG. FIG. 3 shows the 1 H NMR peak diagram of the mixture containing the benzodiazepine compound obtained in Example 2. FIG. FIG. 4 shows the infrared absorption spectrum (IR) of the mixture containing the benzodiazepine compound obtained in Example 2. FIG. FIG. 5 shows a 1 H NMR peak diagram of the mixture containing the benzodiazepine compound obtained in Comparative Example 1. FIG. FIG. 6 shows the infrared absorption spectrum (IR) of the mixture containing the benzodiazepine compound obtained in Comparative Example 1. FIG. FIG. 7 shows a 1 H NMR peak chart of the mixture containing the benzodiazepine compound obtained in Comparative Example 2. FIG. FIG. 8 shows the infrared absorption spectrum (IR) of the mixture containing the benzodiazepine compound obtained in Comparative Example 2. FIG. 9 shows a 1 H NMR peak diagram of the mixture containing the benzodiazepine compound obtained in Comparative Example 3. FIG. 10 shows the infrared absorption spectrum (IR) of the mixture containing the benzodiazepine compound obtained in Comparative Example 3. FIG. FIG. 11 shows a 1 H NMR peak diagram of the mixture containing the benzodiazepine compound obtained in Comparative Example 4. FIG. FIG. 12 shows the infrared absorption spectrum (IR) of the mixture containing the benzodiazepine compound obtained in Comparative Example 4. FIG.

Claims (10)

一種混合物之製造方法,該混合物之製造方法係包括使對胺基苯酚、芳香族一級單胺類、雙酚類與甲醛類進行縮合反應之步驟而成,該混合物係包含下述式(1)所表示之苯并㗁𠯤化合物而成,且 上述縮合反應步驟中之源自上述對胺基苯酚及上述雙酚類之酚性羥基、與源自上述對胺基苯酚及上述芳香族一級單胺類之胺基的比(OH/NH2 )為1.05/1~1.15/1, [化1]
Figure 03_image027
式(1) [式(1)中,L為碳數1~10之伸烷基、碳數7~21之伸芳烷基、氧、硫或磺醯基,Ar分別獨立為可經取代之芳基,m、n分別獨立為0以上之整數]。
A method for producing a mixture comprising the steps of condensing p-aminophenol, aromatic primary monoamines, bisphenols and formaldehyde, the mixture comprising the following formula (1) The represented benzodiazepine compound, and the phenolic hydroxyl group derived from the above-mentioned p-aminophenol and the above-mentioned bisphenols in the above-mentioned condensation reaction step, and the above-mentioned p-aminophenol and the above-mentioned aromatic primary monoamine. The ratio of such amine groups (OH/NH 2 ) is 1.05/1 to 1.15/1, [Chem. 1]
Figure 03_image027
Formula (1) [In formula (1), L is an alkylene group having 1 to 10 carbon atoms, an aralkylene group having 7 to 21 carbon atoms, oxygen, sulfur or sulfonyl group, and Ar is independently substituted. In the aryl group, m and n are each independently an integer of 0 or more].
如請求項1之方法,其中式(1)之芳基可由1~3個取代基R1 取代,該取代基R1 分別獨立地選自由烷基、烷氧基、酯基、醯胺基、氰基及鹵素原子所組成之群。The method of claim 1, wherein the aryl group of formula (1) can be substituted by 1 to 3 substituents R 1 , and the substituents R 1 are independently selected from alkyl, alkoxy, ester, amido, A group consisting of cyano and halogen atoms. 如請求項1或2之方法,其中於上述縮合反應步驟中,上述對胺基苯酚及上述芳香族一級單胺類之胺基中之上述對胺基苯酚之胺基的含有率為25~75莫耳%。The method according to claim 1 or 2, wherein in the condensation reaction step, the content of the amine group of the p-aminophenol in the amine groups of the p-aminophenol and the aromatic primary monoamines is 25-75% Mol%. 如請求項1至3中任一項之方法,其中於上述縮合反應步驟中,源自上述對胺基苯酚及上述雙酚類之酚性羥基中之上述對胺基苯酚之酚性羥基的含有率為25~75莫耳%以下。The method according to any one of claims 1 to 3, wherein in the condensation reaction step, the content of the phenolic hydroxyl group derived from the p-aminophenol and the phenolic hydroxyl group of the above-mentioned bisphenols The rate is 25 to 75 mol% or less. 如請求項1至4中任一項之方法,其中上述混合物之數量平均分子量為600~1500, 相對於上述混合物總量,式(1)中之m及n為0之苯并㗁𠯤化合物之比率為20面積%以下。The method according to any one of claims 1 to 4, wherein the number-average molecular weight of the mixture is 600-1500, The ratio of the benzodiazepine compound in which m and n in the formula (1) are 0 is 20 area % or less with respect to the total amount of the mixture. 如請求項1至5中任一項之方法,其中上述混合物係包含式(1)中之m及n之合計值不同之苯并㗁𠯤化合物而成。The method according to any one of claims 1 to 5, wherein the mixture is formed by including benzodiazepine compounds having different total values of m and n in formula (1). 如請求項1至6中任一項之方法,其中上述混合物係包含式(1)中之m及n之合計值為1以上之苯并㗁𠯤化合物而成。The method according to any one of claims 1 to 6, wherein the mixture comprises a benzodiazepine compound whose total value of m and n in formula (1) is 1 or more. 如請求項1至7中任一項之方法,其中相對於上述混合物總量,式(1)中之m及n之合計值為5以上之苯并㗁𠯤化合物之比率為15面積%以上70面積%以下。The method according to any one of claims 1 to 7, wherein the ratio of the benzodiazepine compound having a total value of m and n in the formula (1) of 5 or more is 15 area % or more and 70% relative to the total amount of the mixture. Area % or less. 如請求項1至8中任一項之方法,其中相對於上述混合物總量,式(1)中之m及n之合計值為1~4之苯并㗁𠯤化合物之比率為25面積%以上。The method according to any one of claims 1 to 8, wherein the ratio of the benzodiazepine compound having a total value of m and n in formula (1) of 1 to 4 is 25 area % or more relative to the total amount of the mixture . 如請求項1至9中任一項之方法,其中上述混合物之分子量分散度為1.05~2.50。The method according to any one of claims 1 to 9, wherein the molecular weight dispersion of the mixture is 1.05-2.50.
TW110123329A 2020-07-03 2021-06-25 Method for producing benzoxazine compound-containing mixture TW202208476A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020115952A JP2022013415A (en) 2020-07-03 2020-07-03 Method for producing benzoxazine compound-containing mixture
JP2020-115952 2020-07-03

Publications (1)

Publication Number Publication Date
TW202208476A true TW202208476A (en) 2022-03-01

Family

ID=79315982

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110123329A TW202208476A (en) 2020-07-03 2021-06-25 Method for producing benzoxazine compound-containing mixture

Country Status (3)

Country Link
JP (1) JP2022013415A (en)
TW (1) TW202208476A (en)
WO (1) WO2022004593A1 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010235714A (en) * 2009-03-30 2010-10-21 Sekisui Chem Co Ltd Benzoxazine resin
CN101700705B (en) * 2009-06-08 2013-07-10 电子科技大学 Thermosetting resin glass fiber laminating composite material and preparation method thereof
JP2013060407A (en) * 2011-09-15 2013-04-04 Sumitomo Chemical Co Ltd Benzoxazine compound and method for producing the same
JP2017186265A (en) * 2016-04-04 2017-10-12 日本化薬株式会社 Benzoxazine compound
CN106750289B (en) * 2016-12-20 2019-04-30 成都科宜高分子科技有限公司 A kind of benzoxazine oligomer of maleimide base group end-sealed type and preparation method thereof
JP2019214648A (en) * 2018-06-11 2019-12-19 学校法人近畿大学 Benzoxazine compound and benzoxazine resin

Also Published As

Publication number Publication date
WO2022004593A1 (en) 2022-01-06
JP2022013415A (en) 2022-01-18

Similar Documents

Publication Publication Date Title
TWI667281B (en) Thermosetting resin composition
TWI424006B (en) Thermal curing polyimide silicon resin composition and membrane containing the same
Dayo et al. Synthesis of benzophenone-center bisphenol-A containing phthalonitrile monomer (BBaph) and its copolymerization with Pa benzoxazine
KR101766427B1 (en) Polybenzoxazine Precursor and Preparing Method thereof
KR20180048673A (en) Epoxy resin, epoxy resin composition, cured product and electric / electronic parts
JP2019085571A (en) Method for producing epoxy compound having alkoxysilyl group, epoxy compound having alkoxysilyl group, composition comprising the same and application of the same
JP2017105891A (en) Phenol aralkyl resin, manufacturing method therefor, epoxy resin, and thermosetting molding material
JP6620981B2 (en) Thermosetting molding material, method for producing the same, and semiconductor sealing material
TWI478955B (en) Epoxy resin composition, manufacturing method for the same, and cured article thereof
TW202208476A (en) Method for producing benzoxazine compound-containing mixture
TW202204326A (en) Mixture containing benzoxazine compound, curable composition containing same, and cured product obtained by curing said curable composition
WO2022097598A1 (en) Benzoxazine compound-containing composition, curable resin composition, and cured product thereof
WO2019078298A1 (en) Benzoxazine resin, benzoxazine resin composition, cured product thereof, varnish, prepreg, and laminate or copper-clad laminate
JP5448137B2 (en) Polyhydric phenol resin, epoxy resin composition, and cured product thereof
JP6508921B2 (en) Method for producing fluorene skeleton-containing epoxy resin, epoxy resin composition, and cured product
JP2022013418A (en) Benzoxazine compound-containing mixture, curable composition containing the same, and cured product obtained by curing the curable composition
JP7034793B2 (en) Oxazine compound having a fluorene skeleton and its production method
JP5716512B2 (en) Epoxy resin and method for producing the same
JP7465926B2 (en) Epoxy resin, its manufacturing method, epoxy composition containing same, and uses thereof
KR102289998B1 (en) Method for producing fluorene skeleton-containing epoxy resin, epoxy resin composition, and cured product thereof
WO2024106523A1 (en) Benzoxazine compound, resin material composition containing same, curable resin composition, and cured product of same
WO2022102489A1 (en) Resin composition, cured article, semiconductor encapsulation material, and semiconductor device
JP2024066477A (en) Epoxy resin for semiconductor adhesive, its manufacturing method and composition containing same
TW202200595A (en) Stereoisomer of epoxy compound, curable composition containing same, and cured object obtained by curing curable composition
JP2023141768A (en) Epoxy resin, curable resin composition, cured product, and electric and electronic materials