TW202208473A - Resin composition comprising (A) a polyether ether ketone compound having a maleimide group, (B) an epoxy resin, and (C) an active ester-based curing agent - Google Patents

Abstract

To provide a resin composition or the like which is capable of obtaining a cured product having low dielectric properties, excellent peel strength even if the surface roughness becomes small, and a high glass transition temperature. A resin composition comprises (A) a polyether ether ketone compound having a maleimide group, (B) an epoxy resin, and (C) an active ester-based curing agent.

Description

resin composition

The present invention relates to resin compositions. Furthermore, the present invention relates to a resin sheet, a printed wiring board, and a semiconductor device obtained by using the resin composition.

As a manufacturing technique of a printed wiring board, the manufacturing method by the stacking system which mutually stacks an insulating layer and a conductor layer is known. In the manufacturing method by the deposition method, generally, the insulating layer is formed by curing the resin composition. As such a resin composition, the resin composition disclosed by patent document 1 is known, for example. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2019-066792

[The problem to be solved by the invention]

The cured product formed by curing the resin composition can be used as an insulating layer of a printed wiring board of a semiconductor device. Therefore, it is sought to reduce the dielectric properties (dielectric constant and dielectric loss tangent) of the cured product. In addition, the insulating layer formed by the cured product has excellent peel strength between the insulating layer and the conductor layer even if the surface roughness of the insulating layer is reduced, and the glass transition temperature is preferably high in order to be excellent in heat resistance.

The present invention has been created in view of the aforementioned problems, and its object is to provide a resin composition capable of obtaining a cured product having low dielectric properties, excellent peel strength even if the surface roughness is reduced, and high glass transition temperature; and a resin sheet, It includes a resin composition layer including the resin composition; a printed wiring board including an insulating layer formed of a cured product of the resin composition; and a semiconductor device including the printed wiring board. [Means of Solving Problems]

As a result of intensive research to solve the above-mentioned problems, the present inventors found that by using (A) a polyether ether ketone compound having a maleimide group, (B) an epoxy resin, and (C) an active ester system The above-mentioned problems can be solved by a curing agent, and the present invention has been completed.

That is, the present invention includes the following. [1] A resin composition comprising (A) a polyether ether ketone compound having a maleimide group, (B) epoxy resin, and (C) Active ester type hardener. [2] The resin composition according to [1], wherein the number-average molecular weight of the component (A) is 10,000 or less. [3] The resin composition according to [1] or [2], wherein the component (A) has a maleimide group at the terminal. [4] The resin composition according to any one of [1] to [3], wherein the content of the (A) component is 5 mass % or more and 60 mass % when the resin component in the resin composition is set at 100 mass % %the following. [5] The resin composition according to any one of [1] to [4], wherein the component (B) contains a naphthol-type epoxy resin. [6] The resin composition according to any one of [1] to [5], wherein the component (C) is selected from the group consisting of dicyclopentadiene-type active ester-based hardeners and naphthalene-type active ester-based hardeners 1 or more. [7] The resin composition according to any one of [1] to [6], further comprising (D) a resin having a polymerizable unsaturated group. [8] The resin composition according to [7], wherein the component (D) is a resin containing a maleimide group and an aromatic ring. [9] The resin composition according to any one of [1] to [8], further comprising (E) an inorganic filler. [10] The resin composition according to [9], wherein the content of the (E) component is 40 mass % or more and 65 mass % or less when the non-volatile content in the resin composition is 100 mass %. [11] The resin composition according to any one of [1] to [10], which is for forming an insulating layer. [12] The resin composition according to any one of [1] to [11], which is for forming an insulating layer, and the insulating layer is an insulating layer for forming a conductor layer. [13] A resin sheet comprising a support, and a resin composition layer disposed on the support, the resin composition layer comprising the resin composition according to any one of [1] to [12]. [14] A printed wiring board comprising an insulating layer formed of a cured product of the resin composition according to any one of [1] to [12]. [15] A semiconductor device comprising the printed wiring board as described in [14]. [Inventive effect]

According to the present invention, it is possible to provide a resin composition capable of obtaining a cured product having low dielectric properties, excellent peel strength even if the surface roughness is reduced, and high glass transition temperature; and a resin sheet comprising the resin composition described above. A resin composition layer of the object; a printed wiring board including an insulating layer formed of a cured product of the resin composition; and a semiconductor device including the printed wiring board.

Hereinafter, the present invention will be described by showing embodiments and examples. However, the present invention is not limited to the embodiments and examples shown below, and can be implemented with arbitrary modifications within the scope of the claims of the present invention and their equivalents.

[resin composition] The resin composition of the present invention includes (A) a polyether ether ketone compound having a maleimide group, (B) an epoxy resin, and (C) an active ester-based hardener. According to such a resin composition, it is possible to obtain a cured product having low dielectric properties, excellent peel strength even if the surface roughness is small, and high glass transition temperature.

The resin composition may further include (D) a resin containing a radically polymerizable unsaturated group, (E) an inorganic filler, (F) a hardener, (G) a hardening accelerator, and (H) others as needed. Arbitrary components such as additives.

<(A) The polyether ether ketone compound which has a maleimide group> The resin composition contains the polyether ether ketone compound which has a maleimide group as (A) component. The maleimide group is represented by the following formula (A-1). By making a resin composition contain (A) component, the hardened|cured material with a high glass transition temperature can be obtained.

As the component (A), a compound having a maleimide group and having a polyetheretherketone (PEEK) structure was used. The number of maleimide groups per molecule of component (A) is preferably 1 or more, more preferably 2 or more, more preferably 10 or less, more preferably 5 or less, still more preferably 3 or less . From the viewpoint of obtaining a cured product having excellent dielectric properties, the maleimide group preferably has a maleimide group at the end of the component (A), and it is more preferable to have a maleimide group at both ends. good.

式(A-2)中，Ar¹ 、Ar² 、Ar³ 、Ar⁴ 及Ar⁵ ，各自獨立表示2價芳香族烴基。n表示2~50之整數。＊表示鍵結處。(A) Component has a polyetheretherketone structure. As a polyetheretherketone structure, it is preferable to have a structure represented by the following formula (A-2).

In formula (A-2), Ar ¹ , Ar ² , Ar ³ , Ar ⁴ and Ar ⁵ each independently represent a divalent aromatic hydrocarbon group. n represents an integer from 2 to 50. * Indicates the bond.

The aromatic hydrocarbon group refers to a hydrocarbon group containing an aromatic ring. However, the aromatic hydrocarbon group does not have to be composed of only an aromatic ring, and a part of the aromatic hydrocarbon group may include a chain structure or an alicyclic hydrocarbon group, and the aromatic ring may be any of a monocyclic ring, a polycyclic ring, and a heterocyclic ring.

As a divalent aromatic hydrocarbon group, an aryl-extended group, an ar-extended alkyl group, a group having an aryl-extended-alkyl-extended-arylene-extended group structure, and the like can be exemplified.

As the aryl extended group, an extended aryl group with a carbon number of 6 to 30 is preferable, an extended aryl group with a carbon number of 6 to 20 is more preferable, and an extended aryl group with a carbon number of 6 to 10 is even more preferable. As such an aryl-extended group, a phenyl-extended group, a naphthyl-extended group, an anthracenyl-extended group, a biphenyl-extended group, and the like may, for example, be mentioned.

As the aralkylene group, an aralkylene group having 7 to 30 carbon atoms is preferred, an aralkylene group having 7 to 20 carbon atoms is more preferred, and an aralkylene group having 7 to 15 carbon atoms is even more preferred. As such an aralkylene group, a phenylene group, a group having a biphenylene-methylene structure, and the like can be exemplified.

式中，「＊」表示鍵結處。The aryl-extended group in the group having the aryl-extended-alkyl-extended-aryl-extended group structure is the same as the above-mentioned aryl-extended group. As the alkylene group, an alkylene group having 1 to 10 carbon atoms is preferable, an alkylene group having 1 to 6 carbon atoms is more preferable, and an alkylene group having 1 to 3 carbon atoms is even more preferable. As such an alkylene group, a methylene group, an ethylidene group, a propylidene group, etc. are mentioned, for example. In addition, the alkylene group may have a substituent. Examples of substituents include alkyl groups with 1 to 3 carbon atoms; halogen atoms such as fluorine atoms, chlorine atoms, and bromine atoms; halogenated alkyl groups, etc., and alkyl groups with 1 to 3 carbon atoms and halogenated alkyl groups are preferred. A methyl group and a trifluoromethyl group are more preferable, and a methyl group is even more preferable. As a specific example of the group which has such an aryl-extended-alkyl-extended-aryl-extended group structure, the structures represented by the following formulae (1)-(2) are mentioned, for example. Among them, the base represented by the formula (1) is preferable.

In the formula, "*" represents the bond.

Among them, as Ar ¹ , Ar ² , Ar ⁴ and Ar ⁵ , an aryl group or a group having an aryl group-alkyl group-arylene group structure is preferable, an aryl group is more preferable, and a benzene group is preferable. The base is better. As Ar ³ , an aryl-extended group, or a group having an aryl-extended-alkyl-extended-aryl-extended group structure is preferable, a group having an aryl-extended-alkylene-arylene-extended group structure is more preferable, and a phenyl-extended group is preferable. The group of -dimethylmethylene-phenylene structure (group represented by formula (1)) is more preferable.

n represents an integer of 2 to 50, preferably an integer of 3 to 40, more preferably an integer of 4 to 30, and still more preferably an integer of 5 to 20.

As a specific example of the structure represented by the formula (A-2), the structures represented by the following formulae (A1) to (A2) can be exemplified, but are not limited to these (in the formula, * represents a bond) .

n1 and n2 are the same as n in formula (A-2).

式中，D¹ 及D² ，各自獨立表示單鍵或2價連結基。Ar¹¹ 、Ar¹² 、Ar¹⁴ ，及Ar¹⁵ ，各自獨立與式(A-2)中之Ar¹ 、Ar² 、Ar⁴ ，及Ar⁵ 相同。Ar¹³ ，各自獨立與式(A-2)中之Ar³ 相同。m與式(A-2)中之n相同。As the component (A), a compound represented by the following formula (A-3) is preferred.

In the formula, D ¹ and D ² each independently represent a single bond or a divalent linking group. Ar ¹¹ , Ar ¹² , Ar ¹⁴ , and Ar ¹⁵ are each independently the same as Ar ¹ , Ar ² , Ar ⁴ , and Ar ⁵ in the formula (A-2). Ar ¹³ , each independently is the same as Ar ³ in formula (A-2). m is the same as n in formula (A-2).

D ¹ and D ² each independently represent a single bond or a divalent linking group. As a divalent linking group, for example, a divalent hydrocarbon group, a divalent heterocyclic group, a carbonyl group, an ether bond, an ester bond, a carbonate bond, an amide bond, an imide bond, and a group in which a plurality of these are connected can be exemplified. Wait. The bivalent hydrocarbon group includes a bivalent aliphatic hydrocarbon group and a bivalent aromatic hydrocarbon group.

Examples of the divalent aliphatic hydrocarbon group include linear or branched alkylene groups having 1 to 18 carbon atoms, and linear or branched alkenylene groups having 2 to 18 carbon atoms. Examples of linear or branched alkylene groups having 1 to 18 carbon atoms include methylene, methylmethylene, dimethylmethylene, ethylidene, propylidene, and trimethylene. Wait. Examples of linear or branched alkenylene groups having 2 to 18 carbon atoms include vinylidene groups, 1-methylvinylene groups, propenylene groups, 1-butenylene groups, and 2-butene groups. Base et al.

Examples of the divalent alicyclic hydrocarbon group include a divalent alicyclic hydrocarbon group having 3 to 18 carbon atoms, and examples include 1,2-cyclopentylene, 1,3-cyclopentylene, cyclopentylene, Cycloalkylene (including cycloalkylene) of 1,2-cyclohexylene, 1,3-cyclohexylene, 1,4-cyclohexylene, cyclohexylene and the like.

Examples of the divalent aromatic hydrocarbon group include arylidene groups having 6 to 14 carbon atoms, for example, 1,2-phenylene groups, 1,4-phenylene groups, 1,3-phenylene groups, 4,2-phenylene groups, and the like. 4'-biphenylene, 3,3'-biphenylene, 2,6-naphthylene, 2,7-naphthylene, 1,8-naphthylene, anthracenyl, etc.

唑環、異

唑環、γ-丁內酯環、噻吩環、噻唑環、異噻唑環、噻二吖唑環、吡咯環、吡咯啶環、吡唑環、咪唑環、三唑環等之5員環；4-側氧基-4H-哌喃環、四氫哌喃環、嗎啉環、4-側氧基-4H-噻喃環、異三聚氰酸環、吡啶環、嗒

環、嘧啶環、吡

環、哌啶環、哌

環等之6員環；3-氧雜三環[4.3.1.1^4,8 ]十一烷-2-酮環、3-氧雜三環[4.2.1.0^4,8 ]壬烷-2-酮環等之橋聯環；苯并呋喃環、異苯并呋喃環、4-側氧基-4H-苯并哌喃環、二氫苯并哌喃環、異二氫苯并哌喃環、苯并噻吩環、吲哚環、吲哚啉環、喹啉環、吖啶環、萘啶環、喹唑啉環、嘌呤環等之縮合環等。2價雜環基為自上述雜環之結構式去除2個氫原子而成之基。The heterocyclic ring constituting the divalent heterocyclic group includes an aromatic heterocyclic ring and a non-aromatic heterocyclic ring. Examples of the heterocyclic ring include 3- to 10-membered rings in which atoms constituting the ring have a carbon atom and at least one type of heteroatom, and condensed rings thereof. As a hetero atom, an oxygen atom, a sulfur atom, a nitrogen atom, etc. are mentioned, for example. The heterocyclic ring is preferably a 3-10 membered ring, more preferably a 4-6 membered ring. As the heterocyclic ring constituting the divalent heterocyclic group, for example, a three-membered ring such as an oxirane ring; a four-membered ring such as an oxetane ring; a furan ring, a tetrahydrofuran ring,

azole ring, iso

5-membered rings such as azole ring, γ-butyrolactone ring, thiophene ring, thiazole ring, isothiazole ring, thiadiazazole ring, pyrrole ring, pyrrolidine ring, pyrazole ring, imidazole ring, triazole ring, etc.; 4 -Pendant oxy-4H-pyran ring, tetrahydropyran ring, morpholine ring, 4-side oxy-4H-thiopyran ring, isocyanuric acid ring, pyridine ring, pyridine ring

ring, pyrimidine ring, pyridine

ring, piperidine ring, piperidine

6- ^membered ring, etc ^.; Bridged rings of rings, etc.; benzofuran ring, isobenzofuran ring, 4-oxy-4H-benzopyran ring, dihydrobenzopyran ring, isodihydrobenzopyran ring, benzene Condensed rings of thiophene ring, indole ring, indoline ring, quinoline ring, acridine ring, naphthyridine ring, quinazoline ring, purine ring, etc. The divalent heterocyclic group is a group obtained by removing two hydrogen atoms from the structural formula of the above-mentioned heterocyclic ring.

Among them, D ¹ and D ² are preferred to represent a divalent aromatic hydrocarbon group from the viewpoint of significantly obtaining the effects of the present invention, more preferred to represent an aryl extended group having 6 to 16 carbon atoms, and to represent a 1,2-phenylene extended group base, 1,4-phenylene, 1,3-phenylene, 4,4'-biphenylene, 3,3'-biphenylene, 2,6-naphthylene, 2,7- Naphthylene, 1,8-naphthylene, or anthracylene are more preferred, and 1,2-phenylene, 1,4-phenylene, or 1,3-phenylene are particularly preferred.

Although the following can be mentioned as a specific example of (A) component, this invention is not limited to this. In the following formula, na and nb each independently represent an integer of 2 to 50.

As the component (A), a commercially available one may be used, or one synthesized by a known method may be used. As a synthesis method of (A) component, for example, it can synthesize|combine by the synthesis method described in Polymer 1989, p.978. (A) component may be used individually by 1 type, and may be used in combination of 2 or more types.

The weight average molecular weight of the component (A) is preferably 1,000 or more, more preferably 1,200 or more, and still more preferably 1,400 or more, from the viewpoint of obtaining a cured product having low dielectric properties and excellent adhesion to copper foil. , preferably 10,000 or less, more preferably 7,500 or less, and still more preferably 5,000 or less. The weight average molecular weight of the resin can be measured in terms of polystyrene by gel permeation chromatography (GPC).

The number average molecular weight of the component (A) is preferably 1,000 or more, more preferably 1,200 or more, and still more preferably 1,400 or more, from the viewpoint of obtaining a cured product having low dielectric properties and excellent adhesion to copper foil. , preferably 10,000 or less, more preferably 7,500 or less, and still more preferably 5,000 or less. The number-average molecular weight of the resin can be measured in terms of polystyrene by gel permeation chromatography (GPC).

As content of the (A) component, from the viewpoint of obtaining a cured product having low dielectric properties and excellent adhesion to copper foil, when the nonvolatile content in the resin composition is 100% by mass, it is preferably 1 mass % or more, more preferably 3 mass % or more, still more preferably 5 mass % or more, preferably 25 mass % or less, more preferably 20 mass % or less, still more preferably 15 mass % or less. In addition, in this invention, the content of each component in a resin composition is the value when the non-volatile component in a resin composition is set to 100 mass %, unless otherwise specified.

The content of the component (A) is preferably 5 when the resin component in the resin composition is 100% by mass, from the viewpoint of obtaining a cured product having low dielectric properties and excellent adhesion to copper foil. mass % or more, more preferably 10 mass % or more, still more preferably 15 mass % or more, preferably 60 mass % or less, preferably 40 mass % or less, more preferably 35 mass % or less, further preferably 30 mass % the following. The term "resin component" refers to a component from which the (E) inorganic filler is removed from the nonvolatile components in the resin composition.

<(B) Epoxy resin> The resin composition contains an epoxy resin as the (B) component. By containing the (B) epoxy resin in the resin composition, a cured product having low dielectric properties and excellent peel strength can be obtained.

As the component (B), for example, a bixylenol type epoxy resin, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, and a bisphenol AF type epoxy resin may be mentioned. Resin, dicyclopentadiene epoxy resin, trisphenol epoxy resin, naphthol novolac epoxy resin, phenol novolak epoxy resin, tertiary butyl-catechol epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin Resins, linear aliphatic epoxy resins, epoxy resins having a butadiene structure, alicyclic epoxy resins, heterocyclic epoxy resins, spiro-containing epoxy resins, cyclohexane-type epoxy resins, cyclic epoxy resins Hexanedimethanol type epoxy resin, naphthylene ether type epoxy resin, trimethylol type epoxy resin, tetraphenylethane type epoxy resin, etc. Among them, as the component (B), a naphthol-type epoxy resin is preferable from the viewpoint of remarkably obtaining the effects of the present invention.

The resin composition preferably contains an epoxy resin having two or more epoxy groups in one molecule as the component (B). From the viewpoint of remarkably obtaining the desired effect of the present invention, the ratio of the epoxy resin having two or more epoxy groups in one molecule is preferably based on 100% by mass of the nonvolatile content of the component (B). 20 mass % or more, more preferably 30 mass % or more, and particularly preferably 40 mass % or more.

Among the epoxy resins, there are epoxy resins that are liquid at a temperature of 20°C (hereinafter sometimes referred to as "liquid epoxy resins"), and epoxy resins that are solid at a temperature of 20°C (hereinafter sometimes referred to as "liquid epoxy resins"). "Solid Epoxy Resin"). The resin composition may contain only a liquid epoxy resin, only a solid epoxy resin, or a combination of a liquid epoxy resin and a solid epoxy resin as the component (B), but it is remarkably obtained by From the viewpoint of the desired effect of the present invention, it is preferable to contain only the solid epoxy resin.

As a solid epoxy resin, the solid epoxy resin which has 3 or more epoxy groups in 1 molecule is preferable, and the aromatic type solid epoxy resin which has 3 or more epoxy groups in 1 molecule is more preferable.

As solid epoxy resins, there are phenol-type epoxy resins, naphthalene-type epoxy resins, naphthalene-type tetrafunctional epoxy resins, cresol novolac-type epoxy resins, dicyclopentadiene-type epoxy resins, Phenol type epoxy resin, naphthol type epoxy resin, biphenyl type epoxy resin, naphthyl ether type epoxy resin, anthracene type epoxy resin, bisphenol A type epoxy resin, bisphenol AF type epoxy resin , tetraphenylethane type epoxy resin is better, naphthol type epoxy resin is better.

Specific examples of solid epoxy resins include "HP4032H" (naphthalene type epoxy resin) manufactured by DIC Corporation; "HP-4700" and "HP-4710" (naphthalene type tetrafunctional epoxy resin manufactured by DIC Corporation) ); "N-690" (cresol novolac type epoxy resin) manufactured by DIC Corporation; "N-695" (cresol novolac type epoxy resin) manufactured by DIC Corporation; "HP-7200" manufactured by DIC Corporation ", "HP-7200HH", "HP-7200H" (dicyclopentadiene epoxy resin); "EXA-7311", "EXA-7311-G3", "EXA-7311-G4" manufactured by DIC Corporation , "EXA-7311-G4S", "HP6000" (naphthyl ether type epoxy resin); "EPPN-502H" (triphenol type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC7000L" (naphthol novolak type epoxy resin); "NC3000H", "NC3000", "NC3000L", "NC3100" (biphenyl type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; manufactured by Nippon Steel Chemical & Materials Co., Ltd. "ESN475V" (naphthol type epoxy resin); "ESN485" (naphthol novolac type epoxy resin) manufactured by Nippon Steel Chemical &Materials; "YX4000H", "YX4000", "YL6121" manufactured by Mitsubishi Chemical Corporation "(biphenyl type epoxy resin); "YX4000HK" (co-phenol type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YX8800" (anthracene type epoxy resin) manufactured by Mitsubishi Chemical Corporation; Osaka Gas Chemical Corporation "PG-100", "CG-500"; "YL7760" (bisphenol AF type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YL7800" (Fine type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1010" (solid bisphenol A type epoxy resin); "jER1031S" (tetraphenylethane type epoxy resin) manufactured by Mitsubishi Chemical Corporation. These may be used individually by 1 type, and may be used in combination of 2 or more types.

As a liquid epoxy resin, the liquid epoxy resin which has two or more epoxy groups in 1 molecule is preferable.

As the liquid epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, epoxy resin Propylamine type epoxy resin, phenol novolac type epoxy resin, alicyclic epoxy resin with ester skeleton, cyclohexane type epoxy resin, cyclohexane dimethanol type epoxy resin, glycidylamine type epoxy resin , and epoxy resins with a butadiene structure are preferred, and naphthalene-type epoxy resins are more preferred.

Specific examples of liquid epoxy resins include "HP4032", "HP4032D", and "HP4032SS" (naphthalene-type epoxy resins) manufactured by DIC Corporation; "828US", "jER828EL", "825" manufactured by Mitsubishi Chemical Corporation ", "EPIKOTE 828EL" (bisphenol A type epoxy resin); "jER807", "1750" (bisphenol F type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER152" (phenol novolak) manufactured by Mitsubishi Chemical Corporation Type epoxy resin); "630", "630LSD" (glycidamine type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "ZX1059" manufactured by Nippon Steel Chemical & Materials Corporation (bisphenol A type epoxy resin and bisphenol Mixture of F type epoxy resin); "EX-721" (glycidyl ester epoxy resin) manufactured by Nagase ChemteX; "CELLOXIDE 2021P" (alicyclic epoxy resin with ester skeleton) manufactured by DAICEL resin); "PB-3600" (epoxy resin with a butadiene structure) manufactured by DAICEL; "ZX1658", "ZX1658GS" (liquid 1,4-epoxypropyl) manufactured by Nippon Steel Chemical & Materials Co., Ltd. cyclohexane type epoxy resin) etc. These may be used individually by 1 type, and may be used in combination of 2 or more types.

When combining a liquid epoxy resin and a solid epoxy resin as the component (B), the ratio of these (liquid epoxy resin: solid epoxy resin) is preferably 1:1 in terms of mass ratio ~1:20, more preferably 1:1.5~1:15, particularly preferably 1:2~1:10. When the amount ratio of the liquid epoxy resin to the solid epoxy resin is within this range, the desired effect of the present invention can be remarkably obtained. Furthermore, when it is generally used in the form of a resin sheet, moderate adhesiveness can be produced. In addition, when it is generally used in the form of a resin sheet, sufficient flexibility can be obtained and workability is improved. Furthermore, in general, a hardened product having sufficient breaking strength can be obtained.

The epoxy equivalent of the component (B) is preferably 50g/eq.～5000g/eq., more preferably 50g/eq.～3000g/eq., more preferably 80g/eq.～2000g/eq., furthermore Preferably, it is 110g/eq.~1000g/eq.. By making it into this range, the crosslinking density of the hardened|cured material of a resin composition layer becomes sufficient, and an insulating layer with a small surface roughness can be produced. The epoxy equivalent is the mass of the epoxy resin containing 1 equivalent of epoxy groups. This epoxy equivalent can be measured according to JIS K7236.

The weight average molecular weight (Mw) of the component (B) is preferably 100 to 5000, more preferably 200 to 3000, and still more preferably 250 to 1500, from the viewpoint of remarkably obtaining the desired effect of the present invention.

The content of the component (B) is preferably 5% by mass when the nonvolatile content in the resin composition is 100% by mass, from the viewpoint of obtaining an insulating layer exhibiting good mechanical strength and good insulation reliability. Above, more preferably 10 mass % or more, still more preferably 15 mass % or more. The upper limit of the content of the epoxy resin is preferably 30 mass % or less, more preferably 25 mass % or less, and particularly preferably 20 mass % or less, from the viewpoint of remarkably obtaining the desired effect of the present invention.

The content of the component (B) is preferably 20% by mass when the resin component in the resin composition is 100% by mass, from the viewpoint of obtaining an insulating layer exhibiting good mechanical strength and good insulation reliability. Above, more preferably 25 mass % or more, still more preferably 30 mass % or more, preferably 50 mass % or less, more preferably 45 mass % or less, still more preferably 40 mass % or less.

<(C) Active ester curing agent> The resin composition contains (C) an active ester-based curing agent. By using an active ester-based hardener, the dielectric properties can be improved, and the peel strength can be excellent. (C)component may be used individually by 1 type, and may be used in combination of 2 or more types.

As the (C) active ester-based hardener, in general, those having two or more high reactivity in one molecule, such as phenolic esters, thiophenolic esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds, are preferably used. Ester-based compounds. The active ester-based hardener is preferably obtained by condensation reaction of a carboxylic acid compound and/or a thiocarboxylic acid compound with a hydroxyl compound and/or a thiol compound. In particular, from the viewpoint of improving heat resistance, an active ester-based hardener obtained from a carboxylic acid compound and a hydroxy compound is preferred, and an active ester-based hardener obtained from a carboxylic acid compound and a phenol compound and/or a naphthol compound is preferred better. As a carboxylic acid compound, benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, pyromellitic acid, etc. are mentioned, for example. Examples of the phenol compound or naphthol compound include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthalein, methylated bisphenol A, methylated bisphenol F, methylated Bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene , 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucinol, benzenetriol, dicyclopentadiene-type diphenol compound, phenol Novolak, etc. Here, the "dicyclopentadiene-type diphenol compound" refers to a diphenol compound obtained by condensing two molecules of phenol with one molecule of dicyclopentadiene.

Specifically, as (C)component, a dicyclopentadiene type active ester type hardening agent, a naphthalene type active ester type hardening Active ester-based hardener for benzyl compounds of novolacs, etc. Naphthalene-type active ester-based hardener, including a naphthalene structure. Among them, as the component (C), at least one selected from the group consisting of dicyclopentadiene-type active ester-based curing agents and naphthalene-type active-ester-based curing agents is more preferred, and naphthalene-type active ester-based curing agents are even more preferred. As the dicyclopentadiene-type active ester-based hardener, an active-ester-based hardener containing a dicyclopentadiene-type diphenol structure is preferred. The "dicyclopentadiene-type diphenol structure" means a bivalent structural unit composed of phenylene-dicyclopentylene-phenylene.

(C) Commercial products of the active ester-based hardener include "EXB9451", "EXB9460", "EXB9460S", and "HPC-8000" which are active ester-based hardeners containing a dicyclopentadiene-type diphenol structure. -65T", "HPC-8000H-65TM", "EXB-8000L-65TM" (manufactured by DIC Corporation); "EXB9416-70BK", "EXB-8100L-65T", "EXB" as naphthalene-type active ester type hardener -8150L-65T", "EXB-8150-65T", "HPC-8150-60T", "HPC-8150-62T" (manufactured by DIC Corporation), "PC1300-02-65T" (manufactured by Air & Water Corporation); "DC808" (manufactured by Mitsubishi Chemical Co., Ltd.) as an active ester-based hardener containing a novolac acetylated compound; "YLH1026" (Mitsubishi Chemical Corporation) as an active ester-based hardener containing a novolak novolak-based benzyl compound Chemical Co., Ltd.); "DC808" (manufactured by Mitsubishi Chemical Corporation) as an active ester-based hardener for acetylated compounds of novolak; "YLH1026" as an active ester-based hardener for phenolic novolaks of benzyl compounds "(Mitsubishi Chemical Corporation), "YLH1030" (Mitsubishi Chemical Corporation), "YLH1048" (Mitsubishi Chemical Corporation); "EXB-8500-65T" (DIC Corporation); etc.

(C) The active ester group equivalent of the active ester-based curing agent is preferably 50 g/eq. to 500 g/eq. from the viewpoint of obtaining a cured product that can reduce the dielectric loss tangent and at the same time is excellent in adhesiveness, More preferably, it is 50g/eq.~400g/eq., and still more preferably, it is 100g/eq.~300g/eq.. The active ester group equivalent is the mass of the active ester-based hardener containing 1 equivalent of the active ester group.

The amount ratio of (B) epoxy resin to (C) active ester-based hardener is calculated as the ratio of [total number of active groups of active ester-based hardener]/[total number of epoxy groups of epoxy resin], It is preferably 0.01 or more, more preferably 0.3 or more, still more preferably 0.5 or more, more preferably 5 or less, more preferably 3 or less, and still more preferably 2 or less. Here, the "number of epoxy groups of the epoxy resin" refers to a value obtained by dividing the mass of the nonvolatile content of the epoxy resin present in the resin composition by the epoxy equivalent weight and adding up all the values. In addition, "the number of active bases of the active ester-based hardener" is a value obtained by dividing the mass of the non-volatile content of the active-ester-based hardener in the resin composition by the value of the active ester group equivalent. The effect of the present invention can be remarkably obtained by setting the amount ratio of the epoxy resin to the active ester-based hardener within this range.

The content of the active ester-based hardener (C) is preferably 100% by mass of the non-volatile content in the resin composition from the viewpoint of obtaining a hardened product with reduced dielectric properties and excellent peel strength. 1 mass % or more, more preferably 5 mass % or more, still more preferably 10 mass % or more. Moreover, 30 mass % or less is preferable, as for an upper limit, 25 mass % or less is more preferable, and 20 mass % or less is still more preferable.

The content of the (C) active ester-based hardener is preferably 100% by mass of the resin component in the resin composition, from the viewpoint of obtaining a hardened product having excellent peel strength while reducing dielectric properties. 10 mass % or more, more preferably 20 mass % or more, still more preferably 25 mass % or more, preferably 50 mass % or less, more preferably 45 mass % or less, still more preferably 40 mass % or less.

<(D) Resin containing radically polymerizable unsaturated group> In addition to the above-mentioned components, the resin composition may contain (D) a radically polymerizable unsaturated group-containing resin as an optional component. By making the resin composition contain (D) the radically polymerizable unsaturated group-containing resin, a cured product having low dielectric properties and excellent peel strength can be obtained. (D) Component, those who meet the components (A) ~ (C) are excluded.

The radically polymerizable unsaturated group contained in the component (D) means a group containing an unsaturated bond exhibiting radically polymerizable properties. As this radical polymerizable unsaturated group, the group containing an ethylenic double bond is mentioned, for example. The component (D) containing such a radically polymerizable unsaturated group can undergo radical polymerization by heat or active energy rays, thereby curing the resin composition.

Examples of the radically polymerizable unsaturated group include a maleimide group, a vinyl group, a vinylphenyl group, an acryl group, a methacryloyl group, a fumaric group, a maleinyl group, and a benzocyclobutane group. Alkenyl, allyl, etc. Among them, as the component (D), a maleimide group is preferred from the viewpoint of remarkably obtaining the effects of the present invention. The number of radically polymerizable unsaturated groups contained in the component (D) is usually 1 or more, preferably 2 or more. When the component (D) contains two or more radically polymerizable unsaturated groups, these two or more radically polymerizable unsaturated groups may be the same or different.

As (D)component, it is preferable to use the resin which contains an aromatic ring in a molecule|numerator. Therefore, the (D) component is preferably a resin containing an aromatic ring and a radically polymerizable unsaturated group. The aromatic ring contained in the component (D) may be an aromatic carbocyclic ring or an aromatic heterocyclic ring. In addition, the aromatic ring may be a monocyclic aromatic ring, a condensed aromatic ring formed by condensing two or more monocyclic aromatic rings, or one or more monocyclic aromatic rings condensed. Condensed aromatic ring formed from the above monocyclic non-aromatic ring. Examples of these aromatic rings include monocyclic aromatic rings such as a benzene ring and a pyridine ring; and condensed aromatic rings such as a dihydroindene ring, a perylene ring, and a naphthalene ring. Among them, the aromatic ring is preferably an aromatic carbocyclic ring. The number of carbon atoms in the aromatic carbocyclic ring is preferably 6 or more and 10 or less.

A substituent may be bonded to the aromatic ring contained in the (D) component. The number of substituents bonded to one aromatic ring may be one or two or more. When the number of substituents is 2 or more, these 2 or more substituents may be the same or different.

As the substituent, for example, an alkyl group, an alkyloxy group, an alkylthio group, an aryl group, an aryloxy group, an arylthio group, a cycloalkyl group, a halogen atom, a hydroxyl group, and a mercapto group can be exemplified.

The number of carbon atoms of the alkyl group is preferably 1-10. Examples of the alkyl group include methyl, ethyl, propyl, n-butyl, t-butyl and the like.

The number of carbon atoms of the alkyloxy group is preferably 1-10. As an alkyloxy group, a methoxy group, an ethoxy group, a propoxy group, a butoxy group, etc. are mentioned, for example.

The number of carbon atoms of the alkylthio group is preferably 1-10. As an alkylthio group, a methylthio group, an ethylthio group, a propylthio group, a butylthio group, etc. are mentioned, for example.

The number of carbon atoms in the aryl group is preferably 6-10. As an aryl group, a phenyl group, a naphthyl group, etc. are mentioned, for example.

The number of carbon atoms of the aryloxy group is preferably 6-10. As an aryloxy group, a phenyloxy group, a naphthyloxy group, etc. are mentioned, for example.

The number of carbon atoms of the arylthio group is preferably 6-10. Examples of the arylthio group include a phenylthio group, a naphthylthio group, and the like.

The number of carbon atoms in the cycloalkyl group is preferably 3-10. As a cycloalkyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, etc. are mentioned, for example.

As a halogen atom, a fluorine atom, a chlorine atom, an iodine atom, etc. are mentioned, for example.

Among them, the aromatic ring contained in the component (D) is preferably an unbonded substituent or an alkyl group.

The number of aromatic rings contained in the component (D) is usually 1 or more, preferably 2 or more. When the component (D) contains two or more aromatic rings, the two or more aromatic rings may be the same or different.

(D) component may be used individually by 1 type, and may be used in combination of 2 or more types.

A suitable embodiment of the component (D) is a maleimide group-containing resin. It is preferable that the resin containing a maleimide group further contains an aromatic ring. Since the resin containing a maleimide group is a resin belonging to the component (D), those meeting the component (A) are excluded. The maleimide group-containing resin may be used alone or in combination of two or more.

As a resin containing a maleimide group, selected from (D-1) a maleimide compound containing an aliphatic group having 5 or more carbon atoms directly bonded to the nitrogen atom of the maleimide group, (D-2) a maleimide compound having an aromatic ring directly bonded to a nitrogen atom of a maleimide group, and (D-3) Maleimide compound containing trimethyldihydroindene skeleton One or more of them is preferred.

Here, the term "direct" means that in the component (D-1), there is no other group between the nitrogen atom of the maleimide group and the aliphatic group having 5 or more carbon atoms, and in the component (D-2) Component means that there is no other group between the nitrogen atom of maleimide and the aromatic ring.

The component (D-1) is a maleimide compound containing an aliphatic group having 5 or more carbon atoms directly bonded to the nitrogen atom of the maleimide group. (D-1) Component, for example, can be imidated by a component containing an aliphatic amine compound (diamine compound having a dimer acid skeleton, etc.), maleic anhydride, and optionally tetracarboxylic dianhydride chemical reaction.

As a C5 or more aliphatic group, an alkyl group, an alkylene group, an alkenylene group, etc. are mentioned, for example.

The number of carbon atoms of the alkyl group having 5 or more carbon atoms is preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, and still more preferably 40 or less. The alkyl group may be linear, branched, or cyclic, and among them, linear is preferred. As such an alkyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, a decyl group, etc. are mentioned, for example. The alkyl group having 5 or more carbon atoms may be contained as a substituent of the alkylene group having 5 or more carbon atoms. The alkyl group having 5 or more carbon atoms may be a part of an alkenyl group or a part of a polyalkenyl group (the number of double bonds is preferably 2).

The number of carbon atoms in the alkylene group having 5 or more carbon atoms is preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, and still more preferably 40 or less. The alkylidene group may be any of linear, branched and cyclic, among which linear is preferred. Here, the cyclic alkylene group is a concept that includes both the case where the cyclic alkylene group is composed only and the case where both the linear alkylene group and the cyclic alkylene group are included. As such an alkylene group, for example, a pentylene group, a hexyl group, a heptyl group, an octyl group, a non-nonyl group, a hexadecyl group, an hexadecyl group, an hexadecyl group, an hexadecyl group, an hexadecyl group, and a hexadecyl group can be exemplified. Heptyl, trihexadecyl, base with octylene-cyclohexylene structure, base with octylidene-cyclohexylene-cyclohexylene structure, propylidene-cyclohexylene-cyclohexylene structure base etc. The alkylene group having 5 or more carbon atoms may be a part of an alkenylene group or a part of an alkapolyenylene (the number of double bonds is preferably 2).

The number of carbon atoms in the alkenylene group having 5 or more carbon atoms is preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, and still more preferably 40 or less. The alkenylene group may be any of linear, branched and cyclic, among which linear is preferred. Here, the cyclic alkenylene group is a concept that includes both the case where the cyclic alkenylene group is composed only and the case where both the linear alkenylene group and the cyclic alkenylene group are included. Examples of such alkenylene groups include pentynyl, hexynyl, heptynyl, octynyl, non-nonynyl, decynyl, undecynyl, and dodecynyl. Alkyl, tridecynyl, heptadecynyl, trihexadecynyl, groups with octynyl-cyclohexylene structure, octynyl-cyclohexynyl-cyclohexylidene alkynyl-structured groups, groups with propynylidene-cyclohexynylidene-octynylidene structures, and the like.

一般式(D-1-1)中，M表示可具有取代基之碳原子數為5以上之2價脂肪族基，L表示單鍵或2價連結基。As the component (D-1), a compound represented by the following formula (D-1-1) is preferred.

In general formula (D-1-1), M represents a divalent aliphatic group having 5 or more carbon atoms which may have a substituent, and L represents a single bond or a divalent linking group.

M represents a divalent aliphatic group having 5 or more carbon atoms which may have a substituent. The number of carbon atoms of the divalent aliphatic group having 5 or more carbon atoms is preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, and still more preferably 40 or less. The aliphatic group may be linear, branched, or cyclic, and among them, linear is preferred. Here, the term "cyclic aliphatic group" is a concept that includes the case where only the cyclic aliphatic group is formed and the case where both the linear aliphatic group and the cyclic aliphatic group are included. As a divalent aliphatic group, an alkylene group, an alkenylene group, an alkapolyenylene group (more preferably, the number of double bonds is 2), etc. are mentioned. The alkylene group and the alkenylene group are as described above.

Examples of the substituent for M include halogen atoms, -OH, -OC _1-10 alkyl, -N(C _1-10 alkyl) ₂ , C _1-10 alkyl, C _2-30 alkenyl, C _2-30 alkynyl, C _6-10 aryl, -NH ₂ , -CN, -C(O)OC _1-10 alkyl, -COOH, -C(O)H, -NO ₂ and the like. Here, the term "C _xy " (x and y are positive integers and satisfy x<y) means that the number of carbon atoms of the organic group immediately after the term is x to y. For example, the expression "C _1-10 alkyl" means an alkyl group having 1 to 10 carbon atoms. such substituents. They can be bonded to each other to form a ring, and the ring structure also includes a spiro ring or a condensed ring. The substituent is preferably an alkyl group having 5 or more carbon atoms.

L represents a single bond or a divalent linking group. Examples of the divalent linking group include alkylene, alkenylene, alkynylene, aryl, -C(=O)-, -C(=O)-O-, -NR ⁰ - (R ⁰ is A hydrogen atom, an alkyl group having 1 to 3 carbon atoms), an oxygen atom, a sulfur atom, C(=O)NR ⁰ -, a divalent group derived from phthalimide, a diimide derived from pyromellitic acid The divalent base, and the base formed by the combination of two or more of these divalent bases, etc. Alkylene group, alkenylene group, alkynylene group, arylidene group, divalent group derived from phthalimide, divalent group derived from pyromellitic acid diimide, and two or more divalent groups The group formed by the combination of groups may contain an alkyl group having 5 or more carbon atoms as a substituent. The divalent group derived from phthalimide means a divalent group derived from phthalimide, and specifically, it is a group represented by general formula (D-1-2). The divalent group derived from pyromellitic acid diimide refers to a divalent group derived from pyromellitic acid diimide, and is specifically a group represented by general formula (D-1-3). In the formula, "*" represents the bond.

As the alkylene group of the divalent linking group in L, an alkylene group having 1 to 50 carbon atoms is preferable, an alkylene group having 1 to 45 carbon atoms is more preferable, and an alkylene group having 1 to 40 carbon atoms is preferable. Excellent. The alkylene group may be any of linear, branched and cyclic. Examples of such alkylene groups include methyl ethylidene, cyclohexylene, pentylene, hexylene, heptyl, octyl, nonyl, decyl, undecyl, and tendenyl groups. Diyl, tridecyl, heptadecyl, trihexadecyl, base with octylene-cyclohexylene structure, base with octyl-cyclohexylene-octylene structure, propylene Radical-cyclohexylene-extended octyl structure, etc.

As the alkenylene group of the divalent linking group in L, an alkenylene group having 2 to 50 carbon atoms is preferable, an alkenylene group having 2 to 45 carbon atoms is more preferable, and an alkenylene group having 2 to 40 carbon atoms is preferable. Excellent. This alkenylene group may be linear, branched, or cyclic. As such an alkenylene group, a methyl vinylene group, a cyclohexenylene group, a pentenylene group, a hexenylene group, a heptenene group, an octenylene group, etc. are mentioned, for example.

The alkynylene group of the divalent linking group in L is preferably an alkynylene group having 2 to 50 carbon atoms, more preferably an alkynylene group having 2 to 45 carbon atoms, and an alkynylene group having 2 to 40 carbon atoms. Excellent. The alkynylene group may be linear, branched, or cyclic. As such an alkynylene group, a methylethynylene group, a cyclohexylene group, a pentynyl group, a hexylene group, a heptynylene group, a cyclohexylene group, and the like can be exemplified, for example.

As the aryl extended group of the divalent linking group in L, the extended aryl group with the carbon number of 6~24 is preferable, the extended aryl group with the carbon number of 6~18 is more preferable, and the extended aryl group with the carbon number of 6~14 is more preferable. More preferably, an aryl group having 6 to 10 carbon atoms is even more preferable. As the arylidene group, for example, a phenylene group, a naphthylene group, an anthracenide group and the like may be mentioned.

The alkylene group, alkenylene group, alkynylene group, and arylidene group of the divalent linking group in L may have a substituent. The substituent is the same as that of M in the general formula (B2-1-1), preferably an alkyl group having 5 or more carbon atoms.

As a group formed by a combination of two or more divalent groups in L, for example, a divalent group formed by a combination of an alkylene group, a divalent group derived from phthalimide, and an oxygen atom; A divalent group derived from a combination of a divalent group of phthalimide, an oxygen atom, an arylidene group, and an alkylene group; a combination of an alkylene group and a divalent group derived from pyromellitic acid diimide into the 2-price basis; etc. A group consisting of a combination of two or more divalent groups may form a ring such as a condensed ring by a combination of the respective groups. In addition, the group consisting of a combination of two or more divalent groups may be a repeating unit whose number of repeating units is 1 to 10.

Wherein, as L in the general formula (D-1-1), an oxygen atom, an aryl group with a carbon number of 6 to 24 which may have a substituent, an extension with a carbon number of 1 to 50 which may have a substituent An alkyl group, an alkyl group having 5 or more carbon atoms, a divalent group derived from phthalimide, a divalent group derived from pyromellitic acid diimide, or two or more of these groups The combined bivalent base is better. Among them, as L, it has an alkylene group; an alkylene group-a divalent group derived from phthalimide-oxygen atom-a divalent group derived from a divalent group derived from phthalimide; has an alkylene group -Divalent group derived from phthalimide-oxygen atom-arylidene-alkylene-arylidene-oxygen atom-divalent group derived from phthalimide divalent structure; with alkylene - Divalent group of structure derived from diimide of pyromellitic acid; has alkynylene group - Divalent group derived from phthalimide - Oxygen atom - Divalent group derived from phthalimide The divalent group of the structure of the radical; has an alkynylene group-derived from a 2-valent group of phthalimide-oxygen atom-arylidene-alkynylene-arylidene-oxygen atom-derived from phthalimide-2 The divalent group of the structure of the valence group; the divalent group of the structure having an alkynylene group-diimide-pyromellitic acid-derived divalent group is more preferable.

一般式(D-1-4)中，M¹ 各自獨立表示可具有取代基之碳原子數為5以上之2價脂肪族基，Z各自獨立表示可具有取代基之碳原子數為5以上之2價脂肪族基或可具有取代基之具有芳香環之2價基。t表示1~10之整數。The maleimide resin represented by the general formula (D-1-1) is preferably the maleimide resin represented by the general formula (D-1-4).

In the general formula (D-1-4), each M ¹ independently represents a divalent aliphatic group having 5 or more carbon atoms which may have a substituent, and each Z independently represents a group which may have a substituent having 5 or more carbon atoms. A divalent aliphatic group or a divalent group having an aromatic ring which may have a substituent. t represents an integer from 1 to 10.

M ¹ each independently represents a divalent aliphatic group having 5 or more carbon atoms which may have a substituent. M ¹ is the same as M in the general formula (D-1-1).

Z independently represents a divalent aliphatic group having 5 or more carbon atoms which may have a substituent or a divalent group which has an aromatic ring which may have a substituent. As a divalent aliphatic group in Z, an alkylene group, an alkenylene group, an alkapolyenylene group (more preferably, the number of double bonds is 2) etc. are mentioned, for example. The divalent aliphatic group may be any of chain, branched, and cyclic, and among them, cyclic, that is, a cyclic divalent aliphatic group having 5 or more carbon atoms as a substituent, is preferred.

The number of carbon atoms of the alkylene group is preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, and still more preferably 40 or less. As such an alkylene group, for example, a group having an octylene-cyclohexylene structure, a group having an octylene-cyclohexylene-octylene structure, a propylidene-cyclohexylene-octylene group, The basis of the structure, etc.

The number of carbon atoms in the alkenylene group having 5 or more carbon atoms is preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, and still more preferably 40 or less. The alkenylene group may be any of linear, branched and cyclic, among which linear is preferred. Here, the cyclic alkenylene group is a concept that includes both the case where the cyclic alkenylene group is composed only and the case where both the linear alkenylene group and the cyclic alkenylene group are included. Examples of such alkenylene groups include pentynyl, hexynyl, heptynyl, octynyl, non-nonynyl, decynyl, undecynyl, and dodecynyl. Alkyl, tridecynyl, heptadecynyl, trihexadecynyl, groups with octynyl-cyclohexylene structure, octynyl-cyclohexynyl-cyclohexylidene alkynyl-structured groups, groups with propynylidene-cyclohexynylidene-octynylidene structures, and the like.

Examples of the aromatic ring in the divalent group having an aromatic ring represented by Z include a benzene ring, a naphthalene ring, an anthracene ring, a phthalimide ring, a pyromellitic acid diimide ring, an aromatic heterocyclic ring, and the like. , preferably a benzene ring, a phthalimide ring, and a pyromellitic acid diimide ring. That is, as a divalent group having an aromatic ring, a divalent group having a benzene ring which may have a substituent, a divalent group having a phthalimide ring which may have a substituent, and a pyromellitic tetramine which may have a substituent The divalent group of the formic acid diimide ring is preferred. As a divalent group having an aromatic ring, for example, a group consisting of a combination of a divalent group derived from phthalimide and an oxygen atom; a divalent group derived from phthalimide, an oxygen atom, an aromatic A group consisting of a combination of an alkylene group and an alkylene group; a group consisting of a combination of an alkylene group and a divalent group derived from pyromellitic acid diimide; a divalent group derived from pyromellitic acid diimide group; a group formed by a combination of a divalent group derived from phthalimide and an alkylene group; and the like. The above-mentioned aryl group is the same as the aryl group in the divalent linking group represented by L in the general formula (D-1-1).

The alkylene group represented by Z and the divalent group having an aromatic ring may have a substituent. The substituents are the same as those of M in the general formula (D-1-1).

Specific examples of the group represented by Z include the following groups. In the formula, "*" represents the bond.

一般式(D-1-5)中，M² 及M³ 各自獨立表示可具有取代基之碳原子數為5以上之2價脂肪族基，R⁴⁰ 各自獨立表示氧原子、伸芳基、伸烷基，或由此等之基之2個以上的組合而成之2價基。t1表示1~10之整數。 一般式(D-1-6)中，M⁴ 、M⁶ 及M⁷ 各自獨立表示可具有取代基之碳原子數為5以上之脂肪族基，M⁵ 各自獨立表示可具有取代基之具有芳香環之2價基，R⁴¹ 及R⁴² 各自獨立表示碳原子數為5以上之烷基。t2表示0~10之整數，u1及u2各自獨立表示0~4之整數。The compound represented by the general formula (D-1-1) is preferably either the compound represented by the general formula (D-1-5) or the compound represented by the general formula (D-1-6).

In the general formula (D-1-5), M ² and M ³ each independently represent a divalent aliphatic group with 5 or more carbon atoms that may have a substituent, and R ⁴⁰ each independently represents an oxygen atom, an aryl group, an extended group An alkyl group, or a divalent group formed by combining two or more of these groups. t1 represents an integer from 1 to 10. In the general formula (D-1-6), M ⁴ , M ⁶ and M ⁷ each independently represent an optionally substituted aliphatic group having 5 or more carbon atoms, and M ⁵ each independently represent an optionally substituted aromatic group In the ring divalent group, R ⁴¹ and R ⁴² each independently represent an alkyl group having 5 or more carbon atoms. t2 represents an integer from 0 to 10, and u1 and u2 each independently represent an integer from 0 to 4.

M ² and M ³ each independently represent a divalent aliphatic group having 5 or more carbon atoms which may have a substituent. M ² and M ³ are the same as the divalent aliphatic groups with 5 or more carbon atoms represented by M in the general formula (D-1-1), preferably trihexadecyl and trihexadecyl .

R ⁴⁰ each independently represents an oxygen atom, an aryl group, an alkyl group, or a group formed by combining two or more divalent groups thereof. The arylidene group and the alkylene group are the same as the arylidene group and the alkylene group in the divalent linking group represented by L in the general formula (D-1-1). As R ⁴⁰ , a group or an oxygen atom composed of a combination of two or more divalent groups is preferred.

As a group consisting of a combination of two or more divalent groups in R ⁴⁰ , an oxygen atom, an aryl group, and a combination of an alkyl group can be exemplified. As a specific example of the group which consists of a combination of 2 or more types of divalent groups, the following groups are mentioned. In the formula, "*" represents the bond.

M ⁴ , M ⁶ and M ⁷ each independently represent an aliphatic group having 5 or more carbon atoms which may have a substituent. M ⁴ , M ⁶ and M ⁷ are the same as the aliphatic groups with 5 or more carbon atoms which may have a substituent represented by M in the general formula (D-1-1), and are represented by hexyl, heptyl, Preferred are octyl, nonyl, and decyl, and more preferred are octyl.

M ⁵ each independently represents a divalent group having an aromatic ring which may have a substituent. M ⁵ is the same as the divalent group having an aromatic ring that may have a substituent represented by Z in the general formula (D-1-4), and is composed of an alkylene group and a divalent group derived from pyromellitic acid diimide. A group formed by a combination of groups; a group formed by a combination of a divalent group derived from phthalimide and an alkylene group is preferred, and a group formed from an alkylene group and a divalent group derived from pyromellitic acid diimide The combination of the foundation is better. The arylidene group and the alkylene group mentioned above are the same as the arylidene group and the alkylene group in the divalent linking group represented by L in the general formula (D-1-1).

Specific examples of the group represented by M ⁵ include the following groups. In the formula, "*" represents the bond.

R ⁴¹ and R ⁴² each independently represent an alkyl group having 5 or more carbon atoms. R ⁴¹ and R ⁴² are the same as the above-mentioned alkyl groups having 5 or more carbon atoms, preferably hexyl, heptyl, octyl, nonyl, and decyl, and more preferably hexyl and octyl.

u1 and u2 each independently represent an integer of 1 to 15, preferably an integer of 1 to 10.

As a specific example of the component (D-1), the following compounds (Di) to (D-iii) can be exemplified, but are not limited to these specific examples. In the formula, v represents an integer from 1 to 10.

Specific examples of the component (D-1) include "BMI1500" (the compound of the formula (D-i)), "BMI1700" (the compound of the formula (D-ii)), "BMI689" (the compound of the formula ( Compounds of D-iii)) and the like.

The weight average molecular weight (Mw) of the component (D-1) is preferably 150 to 5000, more preferably 300 to 2500.

The maleimide group equivalent of the component (D-1) is preferably 50g/eq.～2000g/eq., more preferably 100g/eq.～1000g, from the viewpoint of significantly obtaining the desired effect of the present invention /eq., more preferably 150g/eq.~500g/eq.. The maleimide group equivalent is the mass of the component (D-1) containing 1 equivalent of the maleimide group.

The component (D-2) is a maleimide compound having an aromatic ring directly bonded to a nitrogen atom of a maleimide group. (D-2) Component can be obtained, for example, by subjecting a component containing an aromatic amine compound (aromatic diamine compound, etc.) and maleic anhydride to an imidization reaction.

唑環、異

唑環、噻唑環、咪唑環、吡啶環、嗒

環、嘧啶環、吡

環等之單環式之芳香族環；萘環、蒽環、苯并呋喃環、異苯并呋喃環、吲哚環、異吲哚環、苯并噻吩環、苯并咪唑環、吲唑環、苯并

唑環、苯并異

唑環、苯并噻唑環、喹啉環、異喹啉環、喹喔啉環、吖啶環、喹唑啉環、噌啉環、呔

環等之2個以上之單環式之芳香族環縮合而成之縮合環；二氫茚環、茀環、四氫萘環等之於1個以上之單環式之芳香族環縮合1個以上之單環式之非芳香族環而成之縮合環等。其中，作為芳香族環，以單環式之芳香族環較佳，苯環更佳。Aromatic ring, which can be carbocyclic or heterocyclic. As the aromatic ring, for example, a benzene ring, a furan ring, a thiophene ring, a pyrrole ring, a pyrazole ring,

azole ring, iso

azole ring, thiazole ring, imidazole ring, pyridine ring, pyridine

ring, pyrimidine ring, pyridine

Monocyclic aromatic rings such as rings; naphthalene ring, anthracene ring, benzofuran ring, isobenzofuran ring, indole ring, isoindole ring, benzothiophene ring, benzimidazole ring, indazole ring , benzo

azole ring, benziso

azole ring, benzothiazole ring, quinoline ring, isoquinoline ring, quinoxaline ring, acridine ring, quinazoline ring, cinnoline ring,

A condensed ring formed by condensing two or more monocyclic aromatic rings such as rings; one or more monocyclic aromatic rings such as dihydroindene ring, perylene ring, tetrahydronaphthalene ring condensed The above-mentioned monocyclic non-aromatic rings are condensed rings and the like. Among them, as the aromatic ring, a monocyclic aromatic ring is preferable, and a benzene ring is more preferable.

As the component (D-2), a compound represented by the following formula (D-2-1) is preferred.

In the formula, R ^c each independently represents a substituent; X ^c each independently represents a single bond, an alkylene group, an alkenylene group, -O-, -CO-, -S-, -SO-, -SO ₂ -, -CONH-, -NHCO-, -COO-, or -OCO- (preferably a single bond or an alkylene group); Z ^c are each independently, representing a non-aromatic ring that may have a substituent, or an aromatic ring that may have a substituent Ring (preferably an aromatic ring that may have a substituent, particularly preferably a benzene ring that may have a substituent); s represents an integer of 1 or more (preferably an integer of 1 to 100, more preferably an integer of 1 to 50, and preferably an integer of 1 to 20); t1 is independently an integer of 0 or more; u is independently an integer of 0 to 2 (preferably 0)] The maleimide compound represented by, particularly The best formula is (D-2-2)~(D-2-5):

式中，R^c1 、R^c2 及R^c3 各自獨立，表示烷基；X^c1 及X^c2 各自獨立，表示單鍵或伸烷基；s表示1以上之整數(較佳為1~100之整數，更佳為1~50之整數，進而佳為1~20之整數)；t’表示1~5之整數；v1、v2及v3各自獨立，表示0~2之整數(較佳為0)。此外，s單位、t單位、t’單位、v單位、v1單位、v2單位及v3單位，分別可每單位皆相同，亦可不同。

In the formula, R ^c1 , R ^c2 and R ^c3 are each independently and represent an alkyl group; X ^c1 and X ^c2 are each independently and represent a single bond or an alkylene group; s represents an integer of 1 or more (preferably an integer from 1 to 100, More preferably, it is an integer of 1 to 50, more preferably an integer of 1 to 20); t' represents an integer of 1 to 5; v1, v2 and v3 are each independently and represent an integer of 0 to 2 (preferably 0). In addition, the s unit, the t unit, the t' unit, the v unit, the v1 unit, the v2 unit, and the v3 unit may be the same or different for each unit, respectively.

式中，R³¹ 及R³⁶ 表示馬來醯亞胺基，R³² 、R³³ 、R³⁴ 及R³⁵ ，各自獨立表示氫原子、烷基或芳基，D各自獨立表示2價芳香族基。m1及m2各自獨立表示1~10之整數，a表示1~100之整數。Moreover, as another embodiment, it is preferable that (D-2) component has the structure represented by following formula (D-2-6), for example.

In the formula, R ³¹ and R ³⁶ represent a maleimide group, R ³² , R ³³ , R ³⁴ and R ³⁵ each independently represent a hydrogen atom, an alkyl group or an aryl group, and D each independently represents a divalent aromatic group. m1 and m2 each independently represent an integer from 1 to 10, and a represents an integer from 1 to 100.

R ³² , R ³³ , R ³⁴ and R ³⁵ in formula (D-2-6) each independently represent a hydrogen atom, an alkyl group, or an aryl group, preferably a hydrogen atom.

As the alkyl group, an alkyl group having 1 to 10 carbon atoms is preferable, an alkyl group having 1 to 6 carbon atoms is more preferable, and an alkyl group having 1 to 3 carbon atoms is even more preferable. The alkyl group can be linear, branched or cyclic. As such an alkyl group, a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, an isopropyl group, etc. are mentioned, for example.

The aryl group is preferably an aryl group having 6 to 20 carbon atoms, more preferably an aryl group having 6 to 15 carbon atoms, and even more preferably an aryl group having 6 to 10 carbon atoms. The aryl group may be a single ring or a condensed ring. As such an aryl group, a phenyl group, a naphthyl group, an anthracenyl group, etc. are mentioned, for example.

The alkyl group and the aryl group may have a substituent. The substituent is not particularly limited, and examples include halogen atom, -OH, -OC _1-6 alkyl, -N(C _1-10 alkyl) ₂ , C _1-10 alkyl, C _6-10 aryl, -NH ₂ , -CN, -C(O)OC _1-10 alkyl, -COOH, -C(O)H, -NO ₂ and the like. Here, the term "C _pq " (p and q are positive integers and satisfy p<q) means that the number of carbon atoms of the organic group described immediately after the term is p to q. For example, the expression "C _1-10 alkyl" means an alkyl group having 1 to 10 carbon atoms. such substituents. They can be bonded to each other to form a ring, and the ring structure also includes a spiro ring or a condensed ring.

The above-mentioned substituent may further have a substituent (hereinafter, it may be referred to as a "secondary substituent"). As the secondary substituent, unless otherwise specified, the same ones as those described above can be used.

D in formula (D-2-6) represents a divalent aromatic group. Examples of the divalent aromatic group include phenylene, naphthylene, anthracenyl, aralkyl, biphenylene, biphenylaralkyl, etc. The base is preferred, and the biphenylene is more preferred. The divalent aromatic group may have a substituent. The substituents are the same as those that the alkyl group represented by R ³² in the formula (D-2-6) may have.

m1 and m2 each independently represent an integer of 1 to 10, preferably 1 to 6, more preferably 1 to 3, still more preferably 1 to 2, and even more preferably 1.

a represents an integer of 1 to 100, preferably 1 to 50, more preferably 1 to 20, and still more preferably 1 to 5.

式中，R³⁷ 及R³⁸ 表示馬來醯亞胺基。a1表示1~100之整數。As the component (D-2), the resin represented by the formula (D-2-7) is preferable.

In the formula, R ³⁷ and R ³⁸ represent a maleimide group. a1 represents an integer from 1 to 100.

a1 is the same as a in formula (D-2-6), and the preferred range is also the same.

As a commercial product of the component (D-2), for example, "MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd.; "BMI-50P" manufactured by K･I Chemical Co., Ltd.; "BMI-50P" manufactured by Yamato Chemical Co., Ltd. 1000", "BMI-1000H", "BMI-1100", "BMI-1100H", "BMI-4000", "BMI-5100"; K･I Chemical Co., Ltd. "BMI-4,4'-BPE", "BMI-70", "BMI-80" manufactured by K・I Chemical Co., Ltd., etc.

The weight average molecular weight (Mw) of the component (D-2) is preferably 150-5000, more preferably 300-2500.

The functional group equivalent of the maleimide group of the component (D-2) is preferably 50g/eq.~2000g/eq., more preferably 100g/eq.~1000g/eq. and more preferably 150g/eq. ~500g/eq., preferably 200g/eq.~300g/eq.

The component (D-3) is a maleimide compound containing a trimethyldihydroindene skeleton. The trimethyldihydroindene skeleton means a skeleton represented by the following formula (D-3-1).

Substituents may also be bonded to the benzene ring contained in the trimethyldihydroindene skeleton. As the substituent, for example, an alkyl group, an alkyloxy group, an alkylthio group, an aryl group, an aryloxy group, an arylthio group, a cycloalkyl group, a halogen atom, a hydroxyl group, and a mercapto group can be exemplified. The number of carbon atoms of the alkyl group is preferably 1-10. Examples of the alkyl group include methyl, ethyl, propyl, n-butyl, t-butyl and the like. The number of carbon atoms of the alkyloxy group is preferably 1-10. As an alkyloxy group, a methoxy group, an ethoxy group, a propoxy group, a butoxy group, etc. are mentioned, for example. The number of carbon atoms in the alkylthio group is preferably 1 to 10. As an alkylthio group, a methylthio group, an ethylthio group, a propylthio group, a butylthio group, etc. are mentioned, for example. The number of carbon atoms in the aryl group is preferably 6-10. As an aryl group, a phenyl group, a naphthyl group, etc. are mentioned, for example. The number of carbon atoms of the aryloxy group is preferably 6-10. As an aryloxy group, a phenyloxy group, a naphthyloxy group, etc. are mentioned, for example. The number of carbon atoms of the arylthio group is preferably 6-10. As an arylthio group, a phenylthio group, a naphthylthio group, etc. are mentioned, for example. The number of carbon atoms in the cycloalkyl group is preferably 3-10. As a cycloalkyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, etc. are mentioned, for example. As a halogen atom, a fluorine atom, a chlorine atom, an iodine atom, etc. are mentioned, for example.

Among the aforementioned substituents, the hydrogen atom of the alkyl group, the alkyloxy group, the alkylthio group, the aryl group, the aryloxy group, the arylthio group, and the cycloalkyl group may be substituted by a halogen atom.

The number of substituents bonded to one benzene ring contained in the trimethyldihydroindene skeleton may be 1 or may be 2 or more. The number of substituents bonded to the benzene ring contained in the trimethyldihydroindene skeleton is usually 0 or more and 3 or less. When the number of substituents is 2 or more, these 2 or more substituents may be the same or different. Among them, the benzene ring contained in the trimethyldihydroindene skeleton is preferably an unbonded substituent.

The number of trimethyldihydroindene skeletons contained in 1 molecule of the component (D-3) may be 1 or may be 2 or more. The upper limit may be, for example, 10 or less, 8 or less, 7 or less, or 6 or less.

The component (D-3) preferably contains an aromatic ring skeleton in addition to the above-mentioned trimethyldihydroindene skeleton. The number of carbon atoms constituting the ring of the aromatic ring skeleton is preferably 6-10. As an aromatic ring skeleton, a benzene ring skeleton, a naphthalene ring skeleton, etc. are mentioned, for example. The number of the above-mentioned aromatic ring skeleton contained in one molecule of the component (D-3) is preferably 1 or more, more preferably 2 or more, preferably 6 or less, more preferably 4 or less, particularly preferably 3 or less . When the component (D-3) contains two or more aromatic ring skeletons in addition to the trimethyldihydroindene skeleton, these aromatic ring skeletons may be the same or different.

A substituent may be bonded to the aromatic ring contained in the aforementioned aromatic ring skeleton. Examples of the substituent include the above-mentioned substituents which can be bonded to the benzene ring contained in the trimethylindene skeleton, and a nitro group. The number of substituents bonded to one aromatic ring may be one or two or more. The number of substituents bonded to the aromatic ring is usually 0 or more and 4 or less. When the number of substituents is 2 or more, these 2 or more substituents may be the same or different.

The component (D-3) preferably contains a divalent aliphatic hydrocarbon group in addition to the above-mentioned trimethyldihydroindene skeleton. In particular, when the component (D-3) contains an aromatic ring skeleton other than the benzene ring contained in the trimethyldihydroindene skeleton, it is preferable that the component (D-3) contains a divalent aliphatic hydrocarbon group. In this case, the divalent aliphatic hydrocarbon group is preferably connected between the benzene ring and the aromatic ring skeleton contained in the trimethyldihydroindene skeleton. In addition, it is preferable that the divalent aliphatic hydrocarbon group connects the aromatic ring skeletons.

The number of carbon atoms of the divalent aliphatic hydrocarbon group is preferably 1 or more, preferably 12 or less, more preferably 8 or less, and particularly preferably 5 or less. As the divalent aliphatic hydrocarbon group, an alkylene group which is a saturated aliphatic hydrocarbon group is more preferable. Examples of the divalent aliphatic hydrocarbon group include straight-chain alkylene groups such as methylene, ethylidene, trimethylene, tetramethylene, pentamethylene, and hexamethylene; ethylene (-CH( CH ₃ )-), propylene (-CH(CH ₂ CH ₃ )-), isopropylidene (-C(CH ₃ ) ₂ -), ethylmethylmethylene (-C(CH ₃ ) (CH ₂ CH ₃ )-), diethylmethylene (-C(CH ₂ CH ₃ ) ₂ -), etc.; branched alkylene; etc. (B2-3) When the maleimide compound containing a trimethyldihydroindene skeleton contains two or more divalent aliphatic hydrocarbon groups in addition to the trimethyldihydroindene skeleton, the divalent aliphatic hydrocarbon groups may be the same , can be different.

The component (D-3) preferably contains a structure represented by the following formula (D-3-2). The whole of the component (D-3) may have the structure represented by the formula (D-3-2), or the part of the component (D-3) may have the structure represented by the formula (D-3-2).

(In the formula, Ar ^a1 represents a divalent aromatic hydrocarbon group which may have a substituent; R ^a1 is each independently and represents an alkyl group with 1 to 10 carbon atoms, an alkyloxy group with 1 to 10 carbon atoms, and a carbon number of 1 ~10 alkylthio group, aryl group with carbon number 6~10, aryloxy group with carbon number 6~10, arylthio group with carbon number 6~10, cycloalkyl group with carbon number 3~10, Halogen atom, nitro group, hydroxyl group, or mercapto group; R ^a2 is independent of each other, representing an alkyl group with 1 to 10 carbon atoms, an alkyloxy group with 1 to 10 carbon atoms, an alkylthio group with 1 to 10 carbon atoms, Aryl group with 6-10 carbon atoms, aryloxy group with 6-10 carbon atoms, arylthio group with 6-10 carbon atoms, cycloalkyl group with 3-10 carbon atoms, halogen atom, hydroxyl group, or mercapto group ; R ^a3 is each independent, representing a ^divalent aliphatic hydrocarbon group; n _a1 represents a positive integer; _{n a2} is each independent, representing an integer of 0 to 4; Hydrogen atoms of oxy, alkylthio, aryl, aryloxy, arylthio, and cycloalkyl groups can also be substituted by halogen atoms. R ^a2 is alkyl, alkyloxy, alkylthio, aryl The hydrogen atom of alkoxy group, aryloxy group, arylthio group, and cycloalkyl group can also be substituted by halogen atom. When n _a2 is 2~4, R ^a1 can be the same or different in the same ring. n _a3 is 2~ When 3, R ^a2 may be the same or different in the same ring).

In formula (D-3-2), Ar ^a1 represents a divalent aromatic hydrocarbon group which may have a substituent. The number of carbon atoms in the divalent aromatic hydrocarbon group is preferably 6 or more, preferably 20 or less, and more preferably 16 or less. As a divalent aromatic hydrocarbon group, a phenylene group and a naphthylene group are mentioned, for example. As a substituent which the divalent aromatic hydrocarbon group may have, for example, an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, a carbon atom Aryl with 6 to 10 carbon atoms, aryloxy group with 6 to 10 carbon atoms, arylthio group with 6 to 10 carbon atoms, cycloalkyl group with 3 to 10 carbon atoms, halogen atom, hydroxyl group, and mercapto group. The hydrogen atom of each substituent may be further substituted by a halogen atom. Moreover, as a specific example of these substituents, the thing similar to the substituent which can be bonded to the benzene ring contained in a trimethyldihydroindene skeleton is mentioned, for example. When the divalent aromatic hydrocarbon group has substituents, the number of the substituents is preferably 1 to 4. When the number of the substituents of the divalent aromatic hydrocarbon group is 2 or more, the 2 or more substituents may be the same, can be different. Among them, Ar ^a1 is preferably an unsubstituted divalent aromatic hydrocarbon group.

In formula (D-3-2), R ^a1 is each independently and represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, a carbon Aryl with 6-10 atoms, aryloxy with 6-10 carbon atoms, arylthio group with 6-10 carbon atoms, cycloalkyl group with 3-10 carbon atoms, halogen atom, nitro group, hydroxyl group, or thiol. Hydrogen atoms of alkyl groups, alkyloxy groups, alkylthio groups, aryl groups, aryloxy groups, arylthio groups, and cycloalkyl groups may also be substituted by halogen atoms. As a specific example of these groups, the same example as the substituent which can be bonded to the benzene ring contained in the trimethyldihydroindene skeleton can be mentioned, for example. Wherein, R ^a1 is more than one group selected from the group consisting of an alkyl group with 1 to 4 carbon atoms, a cycloalkyl group with 3 to 6 carbon atoms, and an aryl group with 6 to 10 carbon atoms. Preferably, an alkyl group having 1 to 4 carbon atoms is particularly preferred.

In formula (D-3-2), R ^a2 is each independently and represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, a carbon An aryl group having 6 to 10 atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group. Hydrogen atoms of alkyl groups, alkyloxy groups, alkylthio groups, aryl groups, aryloxy groups, arylthio groups, and cycloalkyl groups may also be substituted by halogen atoms. As a specific example of these groups, the thing similar to the substituent which can be bonded to the benzene ring contained in a trimethyldihydroindene skeleton is mentioned, for example. Wherein, R ^a2 is more than one group selected from the group consisting of alkyl groups with 1 to 4 carbon atoms, cycloalkyl groups with 3 to 6 carbon atoms, and aryl groups with 6 to 10 carbon atoms. good.

In formula (D-3-2), R ^a3 is each independently, and represents a divalent aliphatic hydrocarbon group. The preferable range of the divalent aliphatic hydrocarbon group is as described above.

In formula (D-3-2), n _a1 represents a positive integer. n _a1 is preferably 1 or more, preferably 10 or less, more preferably 8 or less.

In formula (D-3-2), n _a2 are each independently and represent an integer of 0 to 4. n _a2 is preferably 2 or 3, more preferably 2. Although the plural n _a2 may be different, they are preferably the same. n _a2 is 2 or more, and plural R ^a1 may be the same or different in the same ring.

In formula (D-3-2), n _a3 is each independent and represents an integer of 0 to 3. Although the plural n _a3 may be different, they are preferably the same. n _a3 , preferably 0.

(式中，R^b1 各自獨立，表示碳原子數1~10之烷基、碳原子數1~10之烷基氧基、碳原子數1~10之烷硫基、碳原子數6~10之芳基、碳原子數6~10之芳氧基、碳原子數6~10之芳硫基、碳原子數3~10之環烷基、鹵素原子、硝基、羥基，或巰基；R^b2 各自獨立，表示碳原子數1~10之烷基、碳原子數1~10之烷基氧基、碳原子數1~10之烷硫基、碳原子數6~10之芳基、碳原子數6~10之芳氧基、碳原子數6~10之芳硫基、碳原子數3~10之環烷基、鹵素原子、羥基，或巰基；n_b1 表示正整數；n_b2 各自獨立，表示0~4之整數；n_b3 各自獨立，表示0~3之整數。R^b1 之烷基、烷基氧基、烷硫基、芳基、芳氧基、芳硫基，及環烷基之氫原子，亦可被鹵素原子取代。R^b2 之烷基、烷基氧基、烷硫基、芳基、芳氧基、芳硫基，及環烷基之氫原子，亦可被鹵素原子取代。n_b2 為2~4時，R^b1 在同一環內可相同亦可不同。n_b3 為2~3時，R^b2 在同一環內可相同亦可不同)。The component (D-3) preferably contains a structure represented by the following formula (D-3-3). The whole of the component (D-3) may have the structure represented by the formula (D-3-3), or the part of the component (D-3) may have the structure represented by the formula (D-3-3).

(in the formula, R ^b1 are each independently, and represent an alkyl group with 1 to 10 carbon atoms, an alkyloxy group with 1 to 10 carbon atoms, an alkylthio group with 1 to 10 carbon atoms, and a group with 6 to 10 carbon atoms. Aryl group, aryloxy group with 6-10 carbon atoms, arylthio group with 6-10 carbon atoms, cycloalkyl group with 3-10 carbon atoms, halogen atom, nitro group, hydroxyl group, or mercapto group; R ^b2 each Independently, represents an alkyl group with 1-10 carbon atoms, an alkyloxy group with 1-10 carbon atoms, an alkylthio group with 1-10 carbon atoms, an aryl group with 6-10 carbon atoms, and an aryl group with 6-10 carbon atoms Aryloxy group of ~10, arylthio group of carbon number of 6~10, cycloalkyl group of carbon number of 3~10, halogen atom, hydroxyl group, or mercapto group; n _b1 represents a positive integer; n _b2 is independent of each other and represents 0 An integer of ~4; each of n _b3 is independent and represents an integer of 0 to 3. R ^b1 is an alkyl group, an alkyloxy group, an alkylthio group, an aryl group, an aryloxy group, an arylthio group, and a hydrogen atom of a cycloalkyl group , can also be substituted by halogen atoms. The alkyl, alkyloxy, alkylthio, aryl, aryloxy, arylthio, and hydrogen atoms of cycloalkyl groups of R ^b2 can also be substituted by halogen atoms. n When _b2 is 2~4, R ^b1 may be the same or different within the same ring. When n _b3 is 2~3, R ^b2 may be the same or different within the same ring).

In formula (D-3-3), R ^b1 , R ^b2 , n _b1 , n _b2 and n _b3 are respectively the same as R ^a1 , R ^a2 , n _a1 , n _a2 and n in formula (D-3-2) same for _a3 .

式(D-3-4)中，R^c1 、R^c2 、n_c2 及n_c3 ，分別與式(A4)中之R^a1 、R^a2 、n_a2 及n_a3 相同。又，式(D-3-4)中，n_c1 為重複單位數，表示1~20之整數。進而，式(E2-3-4)中，＊表示鍵結處。例如，(D-3)成分，在式(D-3-2)中，n_a2 為3以下，且相對於馬來醯亞胺基鍵結之苯環的馬來醯亞胺基之鄰位及對位中，2個以上未鍵結R^a1 時，可與式(D-3-2)所示之結構組合包含前述式(D-3-4)所示之結構。又，例如，(D-3)成分，在式(D-3-3)中，n_b2 為3以下，且相對於馬來醯亞胺基鍵結之苯環的馬來醯亞胺基之鄰位及對位中，2個以上未鍵結R^b1 時，可與式(D-3-3)所示之結構組合包含前述式(D-3-4)所示之結構。The component (B2-3) may further contain the structure represented by the following formula (D-3-4).

In formula (D-3-4), R ^c1 , R ^c2 , n _c2 and n _c3 are the same as R ^a1 , R ^a2 , n _a2 and n _a3 in formula (A4), respectively. In addition, in formula (D-3-4), n _c1 is the number of repeating units, and represents an integer of 1 to 20. Furthermore, in formula (E2-3-4), * represents a bond. For example, in the component (D-3), in formula (D-3-2), n _a2 is 3 or less, and the ortho position relative to the maleimide group of the benzene ring to which the maleimide group is bonded And in the para position, when two or more of R ^a1 are not bonded, the structure represented by the aforementioned formula (D-3-4) can be included in combination with the structure represented by the formula (D-3-2). Also, for example, in the component (D-3), in the formula (D-3-3), n _b2 is 3 or less, and the ratio of the maleimide group to the maleimide group of the benzene ring to which the maleimide group is bonded is determined. In the ortho and para positions, when two or more of R ^b1 are not bonded, the structure represented by the aforementioned formula (D-3-4) can be included in combination with the structure represented by the formula (D-3-3).

(D-3) A component may be used individually by 1 type, and may be used in combination of 2 or more types in arbitrary ratios.

The maleimide group equivalent of the component (D-3) is preferably 50 g/eq. or more, more preferably 100 g/eq. or more, particularly preferably 200 g/eq. or more, preferably 2000 g/eq. or less , more preferably 1000 g/eq. or less, particularly preferably 800 g/eq. or less. The maleimide group equivalent represents the mass of the maleimide compound per equivalent of the maleimide group. When the maleimide group equivalent of the component (E2-3) is within the aforementioned range, the effect of the present invention can be remarkably obtained.

(D-3) The manufacturing method of a component is not specifically limited. The component (D-3) can be produced, for example, in accordance with the method described in the Japanese Association for Inventions Publication No. 2020-500211. According to the production method described in the Japanese Inventor's Association Publication No. 2020-500211, a maleimide compound in which the repeating units of the trimethyldihydroindene skeleton are dispersed can be obtained. The maleimide compound obtained by this method has a structure represented by the following formula (D-3-5). Therefore, (D-3) component may contain the maleimide compound containing the structure represented by formula (D-3-5).

(in the formula, R ¹ are each independently and represent an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, and an alkyl group having 1 to 10 carbon atoms. Aryl group, aryloxy group with 6-10 carbon atoms, arylthio group with 6-10 carbon atoms, cycloalkyl group with 3-10 carbon atoms, halogen atom, nitro group, hydroxyl group, or mercapto group; R ² each Independently, represents an alkyl group with 1-10 carbon atoms, an alkyloxy group with 1-10 carbon atoms, an alkylthio group with 1-10 carbon atoms, an aryl group with 6-10 carbon atoms, and an aryl group with 6-10 carbon atoms Aryloxy groups of ~10, arylthio groups of carbon atoms of 6 to 10, cycloalkyl groups of carbon atoms of 3 to 10, halogen atoms, hydroxyl groups, or mercapto groups; n ₁ represents the average number of repeating units of 0.95 to 10.0; n ₂ are each independently and represent an integer from 0 to 4; n ₃ are each independently and represent an integer from 0 to 3. R ¹ is an alkyl group, an alkyloxy group, an alkylthio group, an aryl group, an aryloxy group, an arylthio group, and The hydrogen atom of the cycloalkyl group can also be replaced by a halogen atom. The alkyl group, alkyloxy group, alkylthio group, aryl group, aryloxy group, arylthio group of R ² , and the hydrogen atom of the cycloalkyl group can also be replaced by halogen atoms. Substituted by a halogen atom. When n ₂ is 2 to 4, R ¹ may be the same or different in the same ring. When n ₃ is 2 to 3, R ² may be the same or different in the same ring).

In formula (D-3-5), R ¹ , R ² , n ₂ and n ₃ are the same as R ^a1 , R ^a2 , n _a2 and n _a3 in formula (D-3-2), respectively.

In formula (D-3-5), n ₁ represents the average number of repeating units, and the range is 0.95 to 10.0. According to the production method described in JIS Publication No. 2020-500211, a maleimide compound including one group of structures represented by formula (D-3-5) can be obtained. From the fact that the average number of repeating units n ₁ in the formula (D-3-5) can be less than 1.00, it can be known that the maleimide compound containing the structure represented by the formula (D-3-5) obtained in this way can contain A maleimide compound in which the repeating unit number of the trimethyldihydroindene skeleton is 0. Therefore, from the maleimide compound having the structure represented by the formula (D-3-5), the maleimide compound having 0 repeating units of the trimethyldihydroindene skeleton is removed by purification. The (D-3) component may be included in the resin composition only as the (D-3) component thus obtained. However, even when the maleimide compound in which the number of repeating units of the trimethyldihydroindene skeleton is contained in the resin composition is contained, the effect of the present invention can be obtained. In addition, when purification is omitted, cost can also be suppressed. Therefore, without removing the maleimide compound having a repeating unit number of 0 of the trimethyldihydroindene skeleton, the resin composition contains the maleimide compound having the structure represented by the formula (D-3-5). better.

In formula (D-3-5), the average number of repeating units n ₁ is preferably 0.95 or more, more preferably 0.98 or more, further preferably 1.0 or more, particularly preferably 1.1 or more, preferably 10.0 or less, more preferably 8.0 or less, more preferably 7.0 or less, particularly preferably 6.0 or less. When the average repeating unit number n ₁ is within the aforementioned range, the effect of the present invention can be remarkably obtained. In particular, the glass transition temperature of the resin composition can be effectively increased.

As an example of the structure represented by formula (D-3-5), the following can be mentioned.

The maleimide compound containing the structure represented by the formula (D-3-5) may further contain the structure represented by the aforementioned formula (D-3-4). For example, in the maleimide compound containing the structure represented by the formula (D-3-5), in the formula (D-3-5), n ₂ is 3 or less, and relative to the maleimide group bond In the ortho and para positions of the maleimide group of the benzene ring of the junction, when two or more R ¹ are not bonded, it can be combined with the structure represented by the formula (D-3-5) to include the formula (E2-3 -4) The structure shown.

The maleimide compound containing the structure represented by the formula (D-3-5) preferably has a molecular weight distribution Mw/Mn calculated by gel permeation chromatography (GPC) within a specific range. The molecular weight distribution is a value obtained by dividing the weight average molecular weight Mw by the number average molecular weight Mn, and is represented by "Mw/Mn". Specifically, the molecular weight distribution Mw/Mn of the maleimide compound having the structure represented by the formula (D-3-5) is preferably 1.0 to 4.0, more preferably 1.1 to 3.8, and still more preferably 1.2 to 1.2 3.6, the best is 1.3~3.4. When the molecular weight distribution Mw/Mn of the maleimide compound having the structure represented by the formula (D-3-5) is within the aforementioned range, the effect of the present invention can be remarkably obtained.

Among the maleimide compounds having the structure represented by the formula (D-3-5), the amount of the maleimide compounds in which the average number of repeating units n ₁ is 0 is preferably within a specific range. When performing the aforementioned GPC measurement of the maleimide compound containing the structure represented by the formula (D-3-5), the amount of the maleimide compound whose average repeating unit number n ₁ is 0 can be determined based on its GPC The results are expressed in area %. Specifically, in the chromatogram obtained by the aforementioned GPC measurement, the area of the peak of the maleimide compound having an average repeating unit number n ₁ of 0 is relative to the area of the peak of the maleimide compound represented by the formula (D-3-5). The ratio (area %) of the total area of the peaks of the maleimide compounds of the structure represents the amount of the maleimide compounds in which the average repeating unit number n ₁ is 0. Specifically, with respect to 100 area % of the total amount of the maleimide compounds containing the structure represented by the formula (D-3-5), the maleimide compound in which the average repeating unit number n ₁ is 0 The amount is preferably 32 area % or less, more preferably 30 area % or less, and still more preferably 28 area % or less. When the amount of the maleimide compound in which the average number of repeating units n ₁ is 0 is within the aforementioned range, the effect of the present invention can be remarkably obtained.

The maleimide group equivalent of the maleimide compound having the structure represented by the formula (D-3-5) is compared with the maleimide group equivalent of the above-mentioned component (D-3) within the same range. good. When the maleimide group equivalent of the maleimide compound having the structure represented by the formula (D-3-5) is within the aforementioned range, the effect of the present invention can be remarkably obtained.

From the viewpoint of obtaining a cured product with low dielectric properties and excellent peel strength, the content of the component (D) is preferably 0.1% by mass or more when the nonvolatile content in the resin composition is 100% by mass, and more 0.5 mass % or more is preferable, 1 mass % or less is more preferable, 10 mass % or less is preferable, 8 mass % or less is more preferable, and 5 mass % or less is more preferable.

The content of the component (D) is preferably 1% by mass or more, when the resin component in the resin composition is 100% by mass, from the viewpoint of obtaining a cured product with low dielectric properties and excellent peel strength. 3 mass % or more is preferable, 5 mass % or less is more preferable, 20 mass % or less is preferable, 15 mass % or less is more preferable, and 10 mass % or less is further more preferable.

<(E) Inorganic fillers> The resin composition may contain (E) an inorganic filler as an optional component in addition to the above-mentioned components. By containing the (E) inorganic filler in the resin composition, a cured product excellent in dielectric properties can be obtained.

As the material of the inorganic filler, an inorganic compound is used. Examples of the material of the inorganic filler include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, diaspore, Aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate , titanium oxide, zirconium oxide, barium titanate, barium titanate zirconate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Of these, silica is particularly suitable. As silica, for example, amorphous silica, fused silica, crystalline silica, synthetic silica, hollow silica, etc. can be mentioned. Moreover, as silica, spherical silica is preferable. (E) An inorganic filler may be used individually by 1 type, and may be used in combination of 2 or more types.

(E) Commercial products of inorganic fillers include, for example, "UFP-30" manufactured by Denka Chemical Industry Co., Ltd.; "SP60-05" and "SP507-05" manufactured by Nippon Steel & Sumitomo Metal Materials Co., Ltd.; "YC100C", "YA050C", "YA050C-MJE", "YA010C"; "UFP-30" manufactured by Denka Corporation; "SILFIL NSS-3N", "SILFIL NSS-4N", "SILFIL manufactured by Tokuyama Corporation" NSS-5N"; "SC2500SQ", "SO-C4", "SO-C2", "SO-C1", "SC2050-SXF" manufactured by Admatechs; etc.

(E) The average particle size of the inorganic filler is preferably 0.01 μm or more, more preferably 0.05 μm or more, particularly preferably 0.1 μm or more, and preferably 5 μm or less, from the viewpoint of remarkably obtaining the desired effect of the present invention. , more preferably 2 μm or less, still more preferably 1 μm or less.

(E) The average particle size of the inorganic filler can be measured by a laser diffraction/scattering method based on the Mie scattering theory. Specifically, the particle size distribution of the inorganic filler can be prepared on a volume basis by a laser diffraction scattering particle size distribution measuring apparatus, and the median diameter can be determined as an average particle size for measurement. The measurement sample can be obtained by weighing 100 mg of the inorganic filler and 10 g of methyl ethyl ketone into a vial, and dispersing it with ultrasonic waves for 10 minutes. The measured sample is measured by a laser diffraction particle size distribution measuring device, and the wavelengths of the light sources used are set as blue and red, and the particle size distribution of the inorganic filler based on the volume of the inorganic filler is measured by a flow cell (Flow Cell) method. From the particle size distribution, the average particle size was calculated as the median diameter. As a laser diffraction particle size distribution measuring apparatus, "LA-960" manufactured by Horiba Corporation, "SALD-2200" manufactured by Shimadzu Corporation, etc. can be mentioned, for example.

(E) The specific surface area of the inorganic filler is preferably 1 m ^{2 /g or more, more preferably 2 m 2 /g or more, and particularly preferably 3 m 2 / g} or more, from the viewpoint of remarkably obtaining the desired effect of the present invention. The upper limit is not particularly limited, but is preferably not more than 60 m ² /g, not more than 50 m ² /g, or not more than 40 m ² /g. The specific surface area can be obtained by the following method. Using a BET automatic specific surface area measuring device (Macsorb HM-1210 manufactured by MOUNTECH), nitrogen gas is adsorbed on the surface of the sample, and the specific surface area is calculated by the BET multi-point method, thereby measuring the inorganic filler. specific surface area of the material.

(E) The inorganic filler is preferably treated with a surface treatment agent from the viewpoint of improving moisture resistance and dispersibility. As the surface treatment agent, for example, fluorine-containing silane coupling agents such as 3,3,3-trifluoropropyltrimethoxysilane; 3-aminopropyltriethoxysilane, N-phenyl-8- Amino silane coupling agents such as aminooctyl-trimethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, etc.; ring of 3-glycidoxypropyltrimethoxysilane, etc. Oxysilane-based coupling agents; mercaptosilane-based coupling agents such as 3-mercaptopropyltrimethoxysilane; silane-based coupling agents; alkoxysilanes such as phenyltrimethoxysilane; hexamethyldisilazane, etc. Organosilazane compounds, titanate-based coupling agents, etc. Moreover, a surface treatment agent may be used individually by 1 type, and may be used in arbitrary combination of 2 or more types.

As a commercial product of the surface treatment agent, for example, "KBM403" (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM803" (3-mercaptopropyl silane) manufactured by Shin-Etsu Chemical Co., Ltd. Trimethoxysilane), "KBE903" (3-aminopropyltriethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd. silane), "SZ-31" (hexamethyldisilazane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM103" (phenyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM-4803 manufactured by Shin-Etsu Chemical Co., Ltd. "(long-chain epoxy silane coupling agent), "KBM-7103" (3,3,3-trifluoropropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., etc.

From the viewpoint of improving the dispersibility of the inorganic filler, the degree of surface treatment by the surface treatment agent is preferably limited within a predetermined range. Specifically, 100 parts by mass of the inorganic filler is preferably surface-treated by 0.2-5 parts by mass of a surface treatment agent, preferably 0.2-3 parts by mass, and preferably 0.3-2 parts by mass Better surface treatment.

The degree of surface treatment by the surface treatment agent can be evaluated by the amount of carbon per unit surface area of the inorganic filler. From the viewpoint of improving the dispersibility of the inorganic filler, the carbon content per unit surface area of the inorganic filler is preferably 0.02 mg/m ² or more, more preferably 0.1 mg/m ² or more, and 0.2 mg/m ² or more. good. On the other hand, from the viewpoint of suppressing the increase of the melt viscosity of the resin coating and the melt viscosity in the form of flakes, it is preferably 1 mg/m ² or less, more preferably 0.8 mg/m ² or less, and furthermore 0.5 mg/m ² or less. good.

(E) The carbon content per unit surface area of the inorganic filler can be measured after the surface-treated inorganic filler is washed with a solvent (eg, methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent was added to the inorganic filler surface-treated with a surface-treating agent, and ultrasonically cleaned at 25° C. for 5 minutes. After removing the supernatant and drying the solid content, the amount of carbon per unit surface area of the inorganic filler can be measured using a carbon analyzer. As a carbon analyzer, "EMIA-320V" manufactured by Horiba, Ltd., etc. can be used.

The content of the inorganic filler (E) is preferably 40 mass % or more, more preferably 45 mass %, when the non-volatile content in the resin composition is 100 mass % from the viewpoint of remarkably obtaining the effects of the present invention. % or more, more preferably 50 mass % or more, more preferably 75 mass % or less, preferably 70 mass % or less, preferably 65 mass % or less, more preferably 60 mass % or less, further preferably 55 mass % or less .

系硬化劑、氰酸酯系硬化劑，及碳二亞胺系硬化劑等。其中，由提升絕緣信賴性之觀點來看，(F)硬化劑，以酚系硬化劑、萘酚系硬化劑、氰酸酯系硬化劑，及碳二亞胺系硬化劑之任一者之1種以上較佳，酚系硬化劑及萘酚系硬化劑之任一者更佳，包含酚系硬化劑進而佳。(F)硬化劑可單獨使用1種，或可併用2種以上。<(F) Hardening Agent> The resin composition may further contain the (F) hardening agent as an optional component in addition to the above-mentioned components. However, the (C) active ester-based hardener is not included in the (F) hardener. As (F) hardener, a phenol-type hardener, a naphthol-type hardener, a benzoin

type hardener, cyanate ester type hardener, and carbodiimide type hardener, etc. Among them, from the viewpoint of improving insulation reliability, the (F) curing agent is any one of a phenol-based curing agent, a naphthol-based curing agent, a cyanate-based curing agent, and a carbodiimide-based curing agent One or more kinds are preferred, any one of a phenol-based curing agent and a naphthol-based curing agent is more preferred, and it is even more preferred to include a phenol-based curing agent. The (F) hardener may be used alone or in combination of two or more.

骨架之酚系硬化劑更佳。As the phenol-based hardener and the naphthol-based hardener, from the viewpoint of heat resistance and water resistance, a phenol-based hardener having a novolak structure or a naphthol-based hardener having a novolak structure is preferred. In addition, from the viewpoint of adhesion to the conductor layer, a nitrogen-containing phenol-based curing agent is preferred, containing three

The phenolic hardener of the skeleton is more preferable.

Specific examples of phenol-based hardeners and naphthol-based hardeners include "MEH-7700", "MEH-7810", and "MEH-7851" manufactured by Meiwa Chemical Co., Ltd., and "NHN" manufactured by Nippon Kayaku Co., Ltd. , "CBN", "GPH", "SN170", "SN180", "SN190", "SN475", "SN485", "SN495", "SN-495V", "SN375" manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd. , "SN395", "TD-2090", "LA-7052", "LA-7054", "LA-1356", "LA3018-50P", "EXB-9500" manufactured by DIC Corporation, etc.

系硬化劑之具體例，可舉例昭和高分子公司製之「HFB2006M」、四國化成工業公司製之「P-d」、「F-a」。as benzo

Specific examples of the curing agent include "HFB2006M" manufactured by Showa Polymer Co., Ltd., and "Pd" and "Fa" manufactured by Shikoku Chemical Industry Co., Ltd.

化而成之預聚物。作為氰酸酯系硬化劑之具體例，可舉例Lonza Japan公司製之「PT30」及「PT60」(酚酚醛清漆型多官能氰酸酯樹脂)、「ULL-950S」(多官能氰酸酯樹脂)、「BA230」、「BA230S75」(雙酚A二氰酸鹽的一部分或全部成為經三

化而成之三量體的預聚物)等。Examples of cyanate-based hardeners include bisphenol A dicyanate, polyphenol cyanate, oligo(3-methylene-1,5-phenylene cyanate), 4,4'- Methylene bis(2,6-dimethylphenylcyanate), 4,4'-ethylene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis (4-cyanate)phenylpropane, 1,1-bis(4-cyanatephenylmethane), bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3 -Bis(4-cyanate phenyl-1-(methylethylene))benzene, bis(4-cyanate phenyl) sulfide, and bis(4-cyanate phenyl) ether, etc. Difunctional cyanate resins, polyfunctional cyanate resins derived from phenol novolacs and cresol novolacs, etc., some of these cyanate resins

formed prepolymer. Specific examples of cyanate-based hardeners include "PT30" and "PT60" (novolak-type polyfunctional cyanate resins) and "ULL-950S" (polyfunctional cyanate resins manufactured by Lonza Japan). ), "BA230", "BA230S75" (a part or all of bisphenol A dicyanate becomes

The prepolymer formed by the three-dimensional form) and so on.

As a specific example of a carbodiimide type hardening|curing agent, "V-03", "V-07" by Nisshinbo Chemical Co., Ltd., etc. are mentioned.

When a hardener is contained as the component (F), the amount ratio of the epoxy resin to the (B) active ester-based hardener and the (F) hardener is [total number of epoxy groups of epoxy resin]: [(B) The ratio of the active ester-based hardener and (F) the total number of active groups of the hardener] is preferably in the range of 1:0.01~1:5, more preferably 1:0.3~1:3, 1:0.5~1 : 2 is better. Here, the "number of epoxy groups of the epoxy resin" refers to a value obtained by dividing the mass of the nonvolatile content of the epoxy resin present in the resin composition by the epoxy equivalent weight and adding up all the values. In addition, the so-called "(B) active ester-based hardener and (F) the active base of the hardener" is the active ester-based hardener and the mass of the non-volatile content of the hardener present in the resin composition divided by the active ester group The value obtained by adding up all the equivalent values. As (B) component and (F) component, the effect of this invention can be acquired remarkably by making the quantity ratio with an epoxy resin into this range.

When a hardener is contained as the component (F), the amount ratio of the epoxy resin to all (F) hardeners is calculated as [total number of epoxy groups of epoxy resin]: [total number of active groups of (F) hardener ], the range is preferably 1:0.01~1:1, more preferably 1:0.03~1:0.5, and even more preferably 1:0.05~1:0.3. Here, "(F) the number of active bases of the hardener" is a value obtained by dividing the mass of the nonvolatile content of the (F) hardener present in the resin composition by the value of the active group equivalent. As the component (F), the effect of the present invention can be remarkably obtained by setting the amount ratio of the epoxy resin to the curing agent within this range.

The content of the hardener (F) is preferably 1% by mass or more, more preferably 1.5% by mass, when the nonvolatile content in the resin composition is set at 100% by mass, from the viewpoint of remarkably obtaining the desired effect of the present invention. mass % or more, more preferably 2 mass % or more. The upper limit is preferably 5 mass % or less, more preferably 4 mass % or less, and still more preferably 3 mass % or less.

The content of the hardener (F) is preferably 1 mass % or more, more preferably 2 mass %, when the resin component in the resin composition is 100 mass % from the viewpoint of remarkably obtaining the desired effect of the present invention. % or more, more preferably 3 mass % or more, preferably 10 mass % or less, more preferably 8 mass % or less, and still more preferably 5 mass % or less.

<(G) Hardening accelerator> In addition to the above-mentioned components, the resin composition may further contain a curing accelerator as the component (G) as an optional component.

As (G) component, a phosphorus type hardening accelerator, an amine type hardening accelerator, an imidazole type hardening accelerator, a guanidine type hardening accelerator, a metal type hardening accelerator, etc. are mentioned, for example. (G) component may be used individually by 1 type, and may be used in combination of 2 or more types.

Examples of phosphorus-based curing accelerators include triphenylphosphine, phosphonium borate compounds, tetraphenylphosphonium tetraphenylborate, n-butylphosphonium tetraphenylborate, tetrabutylphosphonium decanoate, ( 4-methylphenyl) triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate, etc., with triphenylphosphine, tetrabutylphosphonium decanoate better.

Examples of the amine-based curing accelerator include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6,-sam(dimethylamino) Methyl) phenol, 1,8-diazbicyclo(5,4,0)-undecene, etc., with 4-dimethylaminopyridine, 1,8-diazbicyclo(5,4,0)-decene, etc. An ene is preferred.

、2,4-二胺基-6-[2’-十一烷基咪唑基-(1’)]-乙基-s-三

、2,4-二胺基-6-[2’-乙基-4’-甲基咪唑基-(1’)]-乙基-s-三

、2,4-二胺基-6-[2’-甲基咪唑基-(1’)]-乙基-s-三

異三聚氰酸加成物、2-苯基咪唑異三聚氰酸加成物、2-苯基-4,5-二羥基甲基咪唑、2-苯基-4-甲基-5-羥基甲基咪唑、2,3-二氫-1H-吡咯并[1,2-a]苯并咪唑、1-十二烷基-2-甲基-3-苄基咪唑鎓氯化物、2-甲基咪唑啉、2-苯基咪唑啉等之咪唑化合物及咪唑化合物與環氧樹脂之加成物，以2-乙基-4-甲基咪唑、1-苄基-2-苯基咪唑較佳。Examples of imidazole-based curing accelerators include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, and 2-ethyl-4-methyl. Imidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-Benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl -4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2- Phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-tris

, 2,4-Diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-tri

, 2,4-Diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-tri

, 2,4-Diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-tri

Isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5- Hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2- Imidazole compounds such as methylimidazoline, 2-phenylimidazoline, and adducts of imidazole compounds and epoxy resins are compared with 2-ethyl-4-methylimidazole and 1-benzyl-2-phenylimidazole. good.

As an imidazole type hardening accelerator, a commercial item can also be used, for example, "P200-H50" by Mitsubishi Chemical Corporation, etc. are mentioned.

Examples of the guanidine-based curing accelerator include dicyandiamine, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, Methylguanidine, Diphenylguanidine, Trimethylguanidine, Tetramethylguanidine, Pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-methyl- 1,5,7-Triazabicyclo[4.4.0]dec-5-ene, 1-methyl biguanide, 1-ethyl biguanide, 1-n-butyl biguanide, 1-n-octadecyl biguanide , 1,1-dimethyl biguanide, 1,1-diethyl biguanide, 1-cyclohexyl biguanide, 1-allyl biguanide, 1-phenyl biguanide, 1-(o-tolyl) biguanide, etc. Dicyandiamide and 1,5,7-triazabicyclo[4.4.0]dec-5-ene are preferred.

Examples of the metal-based hardening accelerator include organometallic complexes and organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of the organometallic complex include organocobalt complexes such as cobalt acetylacetonate (II), cobalt acetylacetonate (III), etc., organocopper complexes such as copper acetylacetonate (II), Organic zinc complexes such as zinc (II) acetylacetonate, organic iron complexes such as iron (III) acetylacetonate, organic nickel complexes such as nickel (II) acetylacetonate, manganese acetylacetonate ( II) Organic manganese complexes and the like. As an organometallic salt, zinc octoate, tin octoate, zinc naphthenate, cobalt naphthenate, tin stearate, zinc stearate, etc. are mentioned, for example.

The content of the component (G) is preferably 0.01 mass % or more, more preferably 0.05 mass %, when the non-volatile content in the resin composition is 100 mass % from the viewpoint of remarkably obtaining the desired effect of the present invention. % or more, more preferably 0.1 mass % or more, preferably 3 mass % or less, more preferably 1.5 mass % or less, still more preferably 1 mass % or less.

The content of the component (G) is preferably 0.1% by mass or more, more preferably 0.3% by mass, when the resin component in the resin composition is 100% by mass, from the viewpoint of remarkably obtaining the desired effect of the present invention. Above, more preferably 0.5 mass % or more, more preferably 5 mass % or less, more preferably 3 mass % or less, and still more preferably 1 mass % or less.

<(H) Other additives> In addition to the above-mentioned components, the resin composition may further contain other additives as optional components. As such an additive, a thermoplastic resin, an elastomer, an organic filler, a tackifier, a defoaming agent, a leveling agent, an adhesiveness imparting agent, a flame retardant etc. are mentioned, for example. These may be used individually by 1 type, and may be used in combination of 2 or more types in arbitrary ratios.

The resin composition can be produced, for example, by mixing the above-mentioned components in an arbitrary order. Moreover, in the process of mixing each component, heating and/or cooling can also be performed by adjusting temperature suitably. In addition, during or after the mixing of each component, a stirring device such as a mixer may be used to agitate the component to uniformly disperse the component. Furthermore, a defoaming process may be performed on a resin composition as needed.

<Physical properties and applications of resin composition> Since the resin composition contains (A) component (B) component and (C) component in combination, a cured product with low dielectric properties, excellent peel strength even if the surface roughness is reduced, and high glass transition temperature can be obtained.

The cured product obtained by thermally curing the resin composition at 200° C. for 90 minutes has a low dielectric constant Dk. Therefore, when an insulating layer is formed from this cured product, an insulating layer having a low dielectric constant can be obtained. For example, the dielectric constant Dk of the cured product obtained by curing the resin composition under the conditions described in the following Examples is preferably 3.0 or less, more preferably 2.9 or less, and still more preferably 2.8 or less. The lower limit value of the dielectric constant Dk of the above-mentioned cured product is not particularly limited, but may be 0.1 or more. The dielectric constant of the cured product can be measured by the method described in the examples.

A cured product obtained by thermally curing the resin composition at 200° C. for 90 minutes has a low dielectric loss tangent. Therefore, when an insulating layer is formed from this cured product, an insulating layer having a low dielectric loss tangent can be obtained. For example, the dielectric loss tangent Df of the cured product obtained by curing the resin composition under the conditions described in the following Examples is preferably 0.010 or less, more preferably 0.005 or less, and still more preferably 0.004 or less. The lower limit value of the dielectric loss tangent Df of the above-mentioned cured product is not particularly limited, but may be 0.001 or more. The dielectric loss tangent of the cured product can be measured by the method described in the examples.

The hardened product obtained by thermally hardening the resin composition at 200° C. for 90 minutes can improve the plating peeling strength, which represents the adhesion strength to the plating conductor layer. Therefore, when an insulating layer is formed from this cured product, an insulating layer having a high peel strength from the conductor layer can be obtained. For example, when the insulating layer and the plated conductor layer are formed by the method described in the following examples, the peel strength between the insulating layer and the conductor layer is preferably 0.2 kgf/cm or more, more preferably 0.3 kgf/cm or more , 0.4kgf/cm or more. The upper limit of the adhesion is not particularly limited, but may be, for example, 10.0 kgf/cm or less. Peel strength can be measured by the method demonstrated in an Example.

The cured product obtained by thermally curing the resin composition at 200° C. for 90 minutes shows the characteristic that the arithmetic mean roughness (Ra) of the surface of the cured product after the roughening treatment can be reduced. Therefore, an insulating layer having a small arithmetic mean roughness (Ra) of the surface after the roughening treatment can be obtained. The arithmetic mean roughness (Ra) is preferably 100 nm or less, more preferably 80 nm or less, and still more preferably 50 nm or less. The lower limit is not particularly limited, but can be set to 1 nm or more. The arithmetic mean roughness (Ra) can be measured in accordance with the method described in the examples described later.

The cured product obtained by thermally curing the resin composition at 200° C. for 90 minutes exhibits a high glass transition temperature. Therefore, when an insulating layer is formed from this insulating layer, an insulating layer having a high glass transition temperature and excellent heat resistance can be obtained. The glass transition temperature is preferably 140°C or higher, more preferably 145°C or higher, and further preferably 150°C or higher. The upper limit is not particularly limited, but can be set to 300° C. or lower. The glass transition temperature can be measured according to the method described in the examples described later.

The resin composition according to one embodiment of the present invention is suitable as a resin composition for insulating purposes, and is particularly suitable as a resin composition for forming an insulating layer. Therefore, for example, the resin composition is suitable as a resin composition for forming an insulating layer of a printed wiring board (a resin composition for forming an insulating layer of a printed wiring board). In addition, the resin composition is suitable as a resin composition for forming a conductor layer (including a wiring layer) formed on an insulating layer, a resin composition for forming the insulating layer (a resin composition for forming an insulating layer for forming a conductor layer) ). The resin composition can also be used in sheet-like laminates such as resin sheets and prepregs, solder resists, underfill materials, die bonding materials, semiconductor packaging materials, filling resin grease, parts embedding resin, multi-chip packaging, Resin compositions are widely used in applications such as stack packaging, wafer level packaging, panel level packaging, and system level packaging.

Further, for example, when a semiconductor chip package is manufactured through the following steps (1) to (6), the resin composition of the present embodiment is also suitable for use as an insulating layer for forming a rewiring layer for forming a rewiring forming layer The resin composition (resin composition for rewiring formation layer formation), and the resin composition for encapsulating semiconductor chips (resin composition for semiconductor chip encapsulation). When manufacturing a semiconductor chip package, a rewiring layer may be further formed on the package layer. (1) the step of laminating the temporary fixing film on the base material, (2) the step of temporarily fixing the semiconductor wafer on the temporary fixing film, (3) the step of forming the encapsulation layer on the semiconductor wafer, (4) the step of peeling off the base material and the temporary fixing film from the semiconductor wafer, (5) a step of forming a rewiring formation layer serving as an insulating layer on the surface of the peeled-off base material of the semiconductor wafer and the temporary fixing film, and (6) A step of forming a rewiring layer as a conductor layer on the rewiring formation layer.

The above-mentioned resin composition can also be used in the case where the printed wiring board is a component built-in circuit board.

[resin sheet] The resin sheet of the present invention includes a support and a resin composition layer formed of the resin composition of the present invention provided on the support.

The thickness of the resin composition layer is preferably 50 μm or less, more preferably 50 μm or less, from the viewpoints of thinning the printed wiring board and the fact that the cured product of the resin composition can be provided as a cured product excellent in insulating properties even if it is a thin film. 40 μm or less, more preferably 30 μm or less. Although the lower limit of the thickness of a resin composition layer is not specifically limited, Usually, it can be set to 5 micrometers or more.

As the support, for example, films made of plastic materials, metal foils, and release paper can be used, and films and metal foils made of plastic materials are preferred.

When a film made of a plastic material is used as the support, the plastic material may, for example, include polyethylene terephthalate (hereinafter abbreviated as "PET"), polyethylene naphthalate (hereinafter sometimes abbreviated as "PET"). Polyester such as "PEN"), polycarbonate (hereinafter sometimes referred to as "PC"), acrylic group such as polymethyl methacrylate (PMMA), cyclic polyolefin, triacetyl cellulose (TAC) ), polyether sulfide (PES), polyether ketone, polyimide, etc. Among them, polyethylene terephthalate and polyethylene naphthalate are preferable, and low-cost polyethylene terephthalate is particularly preferable.

When a metal foil is used as a support, as a metal foil, a copper foil, an aluminum foil, etc. are mentioned, for example, A copper foil is preferable. As the copper foil, a foil made of a single metal of copper, or an alloy of copper and other metals (for example, tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) can be used foil.

The support body can also be subjected to matte treatment, corona treatment and antistatic treatment on the surface that is joined to the resin composition layer.

Moreover, as a support body, it can also be used for the support body with a release layer which has a release layer on the surface to be joined to the resin composition layer. As the release agent used for the release layer of the support with the release layer, for example, a release agent selected from the group consisting of an alkyd resin, a polyolefin resin, a urethane resin, and a polysiloxane resin can be exemplified. 1 or more release agents. Commercially available products may also be used as the support with a release layer, and examples include "SK-1" manufactured by Lintec Co., Ltd., a PET film having a release layer containing an alkyd resin-based release agent as a main component, "AL-5", "AL-7", "Lumirror T60" manufactured by Toray Corporation, "Purex" manufactured by Teijin Corporation, "Unipeel" manufactured by Unitika Corporation, etc.

The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, and more preferably in the range of 10 μm to 60 μm. Moreover, when the support body with a mold release layer is used, it is preferable that the thickness of the whole support body with a mold release layer is in the said range.

In one embodiment, the resin sheet may further include other layers if necessary. As this other layer, for example, the protective film etc. according to the support provided on the surface (that is, the surface opposite to the support) of the resin composition layer which is not bonded to the support can be mentioned. Although the thickness of a protective film is not specifically limited, For example, it is 1 micrometer - 40 micrometers. By laminating the protective film, it is possible to suppress the adhesion of dirt or the like on the surface of the resin composition layer or to prevent scratches.

The resin sheet is prepared, for example, by preparing a resin coating obtained by dissolving a resin composition in an organic solvent, applying the resin coating on a support using a die coater or the like, and then drying it to form a resin composition layer. manufacture.

Examples of the organic solvent include ketones such as acetone, methyl ethyl ketone (MEK), and cyclohexanone; ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, and Acetates such as carbitol acetate; carbitols such as cellosolve and butyl carbitol; aromatic hydrocarbons such as toluene and xylene; dimethylformamide, dimethylethyl acetate Amide-based solvents such as amide (DMAc) and N-methylpyrrolidone, etc. An organic solvent may be used individually by 1 type, and may be used in combination of 2 or more types.

Drying can be carried out by known methods such as heating and blowing hot air. The drying conditions are not particularly limited, but are dried so that the content of the organic solvent in the resin composition layer is 10 mass % or less, preferably 5 mass % or less. Although it varies depending on the boiling point of the organic solvent in the resin coating, for example, when using a resin coating containing an organic solvent of 30% by mass to 60% by mass, it can be adjusted at 50°C to 150°C for 3 minutes to 10 minutes. It is dried to form a resin composition layer.

Resin sheets can be rolled into rolls for storage. When the resin sheet has a protective film, it can be used by peeling off the protective film.

[Printed Wiring Board] A printed wiring board according to an embodiment of the present invention includes an insulating layer formed of a cured product obtained by curing the resin composition.

A printed wiring board, for example, can be manufactured by a method including the steps of the following (I) and (II) using the above-mentioned resin sheet. (1) Step of laminating the resin sheet on the inner-layer substrate by bonding the resin composition layer of the resin sheet to the inner-layer substrate (II) Step of hardening the resin composition layer to form an insulating layer

The so-called "inner layer substrate" used in the step (I) is a member that becomes the substrate of the printed wiring board, such as glass epoxy substrate, metal substrate, polyester substrate, polyimide substrate, BT resin substrate, thermosetting type polyphenylene ether substrate, etc. In addition, the substrate may have a conductor layer on one side or both sides, and the conductor layer may also be patterned. An inner layer substrate in which a conductor layer is formed on one or both sides of the substrate is sometimes referred to as an "inner layer circuit substrate". In addition, when manufacturing a printed wiring board, the intermediate product in which an insulating layer and/or a conductor layer is further intended to be formed is also included in the "inner layer substrate". When the printed wiring board is a circuit board with built-in components, an inner-layer substrate with built-in components can also be used.

The lamination of the inner layer substrate and the resin sheet can be performed, for example, by thermocompression bonding of the resin sheet to the inner layer substrate from the side of the support. As a member for thermocompression bonding of the resin sheet to the inner layer substrate (hereinafter, also referred to as "thermocompression bonding member"), for example, a heated metal plate (SUS mirror plate, etc.) or a metal roll (SUS roll etc.) can be mentioned. In addition, instead of pressing the thermocompression member directly on the resin sheet, it is preferable to pressurize the resin sheet through an elastic material such as heat-resistant rubber so that the resin sheet can sufficiently adhere to the surface unevenness of the inner layer substrate.

The lamination of the inner layer substrate and the resin sheet can also be carried out by a vacuum lamination method. In the vacuum lamination method, the heating and crimping temperature is preferably in the range of 60°C to 160°C, more preferably in the range of 80°C to 140°C, and the heating and crimping pressure is preferably 0.098MPa to 1.77MPa, more preferably 0.29MPa~ In the range of 1.47MPa, the heating and crimping time is preferably in the range of 20 seconds to 400 seconds, and more preferably in the range of 30 seconds to 300 seconds. The lamination is preferably carried out under a reduced pressure condition of a pressure of 26.7 hPa or less.

Lamination can be performed by a commercially available vacuum laminating machine. As a commercially available vacuum laminating machine, a vacuum pressure laminating machine manufactured by Meiki Seisakusho Co., Ltd., a vacuum laminating machine manufactured by Nikko Materials Co., Ltd., a batch type vacuum pressure laminating machine, etc. are mentioned, for example.

After lamination, for example, the thermocompression-bonding member may be pressurized from the support body side under atmospheric pressure to perform smoothing treatment of the laminated resin sheet. The pressing conditions of the smoothing treatment can be set to the same conditions as the thermocompression bonding conditions of the above-mentioned lamination. The smoothing process can be performed by a commercially available laminating machine. In addition, the lamination and smoothing process can also be performed continuously using the above-mentioned commercially available vacuum laminating machine.

The support may be removed between the step (I) and the step (II), or may be removed after the step (II).

In step (II), the resin composition layer is hardened to form an insulating layer made of a hardened product of the resin composition. The curing conditions of the resin composition layer are not particularly limited, and can be used for the conditions employed when forming the insulating layer of the printed wiring board. Although the resin composition layer may be cured by irradiating active energy rays such as ultraviolet rays, it is usually thermally cured by heating.

For example, although the thermal curing conditions of the resin composition layer vary depending on the type of resin composition, in one embodiment, the curing temperature is preferably 120°C to 240°C, more preferably 150°C to 220°C, and more preferably It is 170℃~210℃. The hardening time is preferably 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, and more preferably 15 minutes to 100 minutes.

Before thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, before thermosetting the resin composition layer, the resin composition layer may be preheated at a temperature of 50°C to 120°C, preferably 60°C to 115°C, more preferably 70°C to 110°C for more than 5 minutes. , preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, and further preferably 15 minutes to 100 minutes.

The method of manufacturing a printed wiring board may further include (III) a step of drilling a hole in an insulating layer, (IV) a step of roughening the insulating layer, and (V) a step of forming a conductor layer. When the support is removed after step (II), the removal of the support may be between step (II) and step (III), between step (III) and step (IV), or between step (IV) and step (IV) (V) between implementations. In addition, the formation of the insulating layer and the conductor layer in steps (I) to (V) may be repeated as necessary to form a multilayer wiring board.

Step (III) is a step of drilling holes in the insulating layer, whereby holes such as through holes, through holes, etc. can be formed in the insulating layer. Step (III), depending on the composition of the resin composition used in the formation of the insulating layer, can be performed using, for example, a drill, a laser, and a plasma. The size or shape of the hole can be appropriately determined depending on the design of the printed wiring board.

Step (IV) is a step of roughening the insulating layer. Usually, in this step (IV), smear removal can also be performed. The procedure and conditions of the roughening treatment are not particularly limited. For example, a swelling treatment with a swelling liquid, a roughening treatment with an oxidizing agent, and a neutralization treatment with a neutralizing liquid can be sequentially performed to roughen the insulating layer.

Examples of the swelling liquid used for the roughening treatment include an alkaline solution, a surfactant solution, and the like, and an alkaline solution is preferred. As an alkali solution, a sodium hydroxide solution and a potassium hydroxide solution are mentioned more preferably. As a commercially available swelling liquid, "Swelling Dip Securiganth P (Swelling Dip Securiganth P)" and "Swelling Dip Securiganth SBU (Swelling Dip Securiganth SBU)" manufactured by Atotech Japan can be exemplified, for example. Although the swelling treatment by the swelling liquid is not particularly limited, for example, it can be performed by immersing the insulating layer in the swelling liquid at 30° C. to 90° C. for 1 minute to 20 minutes. From the viewpoint of controlling the swelling of the resin of the insulating layer to an appropriate level, it is preferable to immerse the insulating layer in a swelling liquid of 40° C. to 80° C. for 5 minutes to 15 minutes.

As an oxidizing agent for roughening treatment, for example, an alkaline permanganic acid solution obtained by dissolving potassium permanganate or sodium permanganate in an aqueous sodium hydroxide solution can be mentioned. The roughening treatment of an oxidizing agent such as an alkaline permanganic acid solution is preferably performed by immersing the insulating layer in an oxidizing agent solution heated to 60° C. to 100° C. for 10 minutes to 30 minutes. In addition, the concentration of the permanganate in the alkaline permanganic acid solution is preferably 5% by mass to 10% by mass. Examples of commercially available oxidizing agents include alkaline permanganic acid solutions such as "Concentrates Compact CP" and "Dosing Solution Securiganth P" manufactured by Atotech Japan.

As the neutralizing solution for the roughening treatment, an acidic aqueous solution is preferred, and as a commercial product, for example, "Reduction solution Securiganth P" manufactured by Atotech Japan can be exemplified. The treatment with the neutralizing liquid can be performed by immersing the treated surface subjected to the roughening treatment with the oxidizing agent in the neutralizing liquid at 30° C. to 80° C. for 5 minutes to 30 minutes. From the viewpoint of workability and the like, the method of immersing the object subjected to the roughening treatment by the oxidizing agent in the neutralizing liquid at 40° C. to 70° C. for 5 minutes to 20 minutes is preferable.

In one embodiment, the arithmetic mean roughness Ra of the surface of the insulating layer after the roughening treatment is preferably 500 nm or less, more preferably 400 nm or less, and still more preferably 300 nm or less. The lower limit is not particularly limited, but may be, for example, 1 nm or more, 2 nm or more, or the like. In addition, the root mean square average roughness (Rq) of the surface of the insulating layer after the roughening treatment is preferably 500 nm or less, more preferably 400 nm or less, and still more preferably 300 nm or less. The lower limit is not particularly limited, but can be, for example, 1 nm or more, 2 nm or more, or the like. The arithmetic mean roughness (Ra) and the root mean square mean roughness (Rq) of the surface of the insulating layer can be measured using a non-contact surface roughness meter.

Step (V) is a step of forming a conductor layer, and a conductor layer is formed on the insulating layer. The conductor material used for the conductor layer is not particularly limited. In a more suitable embodiment, the conductor layer comprises at least one selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin and indium Metal. The conductor layer may be a single metal layer or an alloy layer. As the alloy layer, for example, an alloy of two or more metals selected from the above-mentioned group (for example, nickel-chromium alloy, copper-nickel alloy, and copper- titanium alloy) layers. Among them, from the viewpoints of versatility, cost, ease of patterning, etc. of the formation of the conductor layer, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or a single metal layer of nickel, Alloy layer of chromium alloy, copper-nickel alloy, copper-titanium alloy is preferred, single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or alloy layer of nickel-chromium alloy is more preferred , and a single metal layer of copper is even better.

The conductor layer may be a single-layer structure, or may be a multi-layer structure obtained by laminating two or more single metal layers or alloy layers of different kinds of metals or alloys. When the conductor layer has a multi-layer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc or titanium, or an alloy layer of nickel-chromium alloy.

Although the thickness of the conductor layer varies depending on the desired design of the printed wiring board, it is generally 3 μm to 35 μm, preferably 5 μm to 30 μm.

The conductor layer is preferably formed by plating. For example, a conductor layer having a desired wiring pattern can be formed by plating on the surface of the insulating layer by a semi-additive method, a full-additive method, or the like. From the viewpoint of easiness of manufacture, it is preferable to form by a semi-additive method. Hereinafter, an example in which the conductor layer is formed by the semi-additive method is shown.

On the surface of the insulating layer, a plating seed layer is formed by electroless plating. Next, on the formed plating seed layer, a mask pattern for exposing a part of the plating seed layer is formed in accordance with a desired wiring pattern. After the metal layer is formed by electrolytic plating on the exposed plating seed layer, the mask pattern is removed. After that, the unnecessary plating seed layer can be removed by etching or the like to form a conductor layer having a desired wiring pattern.

[semiconductor device] A semiconductor device according to an embodiment of the present invention includes the above-mentioned printed wiring board. This semiconductor device can be manufactured using the above-mentioned printed wiring board.

Examples of semiconductor devices include various semiconductor devices provided to electrical products (eg, computers, mobile phones, digital cameras, televisions, etc.) and vehicles (eg, locomotives, automobiles, trains, ships, aircraft, etc.). [Example]

Hereinafter, although an Example is shown, this invention is demonstrated concretely. However, the present invention is not limited to the following examples. In addition, in the following description, unless otherwise indicated, "part" and "%" which show a quantity mean "mass part" and "mass %", respectively. In addition, the operation described below is carried out under the environment of normal temperature and normal pressure unless otherwise indicated.

<Preparation of Maleimide Resin A> A MEK solution (nonvolatile content: 70% by mass) of maleimide resin A synthesized by the method described in Synthesis Example 1 of the Japan Institute of Invention Association Publication No. 2020-500211 was prepared. This maleimide resin A has a structure represented by the following formula.

The FD-MS spectrum of maleimide resin A was measured, and peaks of M+=560, 718 and 876 were confirmed. These peaks correspond to the cases where n ₁ is 0, 1 and 2, respectively. In addition, the maleimide resin A was analyzed by GPC, and the value of the number of repeating units n ₁ of the indene skeleton moiety was determined based on the number average molecular weight, and found that n ₁ =1.47 and molecular weight distribution (Mw/Mn)=1.81 . Furthermore, in 100 area % of the total amount of the maleimide compound A ₁ , the content ratio of the maleimide resin having an average repeating unit number n ₁ of 0 was 26.5 area %.

The FD-MS spectrum of the aforementioned maleimide resin A is measured by the following measuring apparatus and measuring conditions. (Measuring device and measuring conditions of FD-MS spectrum) Measuring device: JMS-T100GC AccuTOF Measurement conditions Measuring range: m/z=4.00~2000.00 Rate of change: 51.2mA/min Final current value: 45mA Cathode voltage: -10kV Recording interval: 0.07sec

The GPC of the maleimide resin A is measured by the following measuring apparatus and measuring conditions. Measuring device: "HLC-8320 GPC" manufactured by Tosoh Corporation Columns: Tosoh Co., Ltd. guard column "HXL-L", Tosoh Co., Ltd. "TSK-GEL G2000HXL", Tosoh Co., Ltd. "TSK-GEL G2000HXL", Tosoh Co., Ltd. TSK-GEL G4000HXL” Detector: RI (differential refractometer) Data processing: "GPC Workstation EcoSEC-WorkStation" manufactured by Tosoh Corporation Measurement conditions: column temperature 40°C Developing solvent: Tetrahydrofuran Flow rate 1.0ml/min Standard: According to the measurement manual of the aforementioned "GPC Workstation EcoSEC-WorkStation", monodisperse polystyrene with known molecular weight is used. Sample: A tetrahydrofuran solution of 1.0% by mass in terms of the nonvolatile content of the maleimide compound was filtered with a microfilter (50 μl).

The molecular weight distribution (weight average molecular weight (Mw)/number average molecular weight (Mn)) of the maleimide resin A, and the average number of repeating units "n ₁ " in relation to the dihydroindene skeleton in the maleimide resin, It shows what was calculated from the GPC chart obtained by the said GPC measurement. In addition, the average number of repeating units "n ₁ " is calculated based on the number average molecular weight (Mn). Specifically, for compounds with n ₁ of 0 to 4, the theoretical molecular weight and the measured molecular weight in GPC are marked on the scatter diagram, and an approximate straight line is drawn. Then, the number-average molecular weight (Mn) was obtained from the point showing the measured value Mn (1) on the straight line, and the average repeating unit "n ₁ " was also calculated. Furthermore, based on the result of GPC measurement, the content ratio (area %) of the maleimide resin in which the average repeating unit number n ₁ is 0 in 100 area % of the total amount of the maleimide resin A was calculated. For details, reference can be made to Japanese Invention Association Publication Technical Publication No. 2020-500211.

<Synthesis of PEEK (polyetheretherketone) compound A> Into a 500 mL flask (three-neck) equipped with a stirring device, an argon introduction tube, and a Dean-Stark device, 31.443 g of 4,4'-difluorobenzophenone, 13.223 g of resorcinol, and 29.894 g of anhydrous potassium carbonate were added. g. 180 mL of N-methylpyrrolidone and 90 mL of toluene were heated with stirring under an argon atmosphere, and the toluene was refluxed at 130 to 140° C. for 4 hours. After that, further heating was performed to distill off toluene at 170 to 180°C. Furthermore, after continuing stirring at 170-180 degreeC for 10 hours, it returned to room temperature, and the product 1 was obtained.

In the flask containing the product 1, 5.233 g of 4-aminophenol, 6.628 g of anhydrous potassium carbonate, 18 mL of N-methylpyrrolidone, and 90 mL of toluene were added, and the flask was heated again while stirring under an argon atmosphere, and heated at 130 Toluene was refluxed for 3 hours at ~140°C. Then, toluene was distilled off by heating at 170-180 degreeC, and stirring was continued for 4 hours while maintaining the said temperature. Then, it cooled to room temperature, the reaction liquid was added to 5000 mL of methanol, and a powdery solid was obtained by filtration. This powdery solid was washed repeatedly with methanol and water, and then dried at 100° C. for 8 hours to obtain 37.461 g of powdery solid (diamine-A).

In a 500 mL flask (three ports) equipped with a stirring device and an argon introduction tube, 0.878 g of diamine-A, 4.943 g of maleic anhydride, and 240 mL of N-methylpyrrolidone were added, and stirred at room temperature for 18 hours under an argon atmosphere. . Then, 8.576 g of acetic anhydride and 0.689 g of sodium acetate were added, and the mixture was stirred at 60°C for 6 hours. After returning the reaction solution to room temperature, a powdery solid was obtained by adding the reaction solution to 5000 mL of methanol. This powdery solid was repeatedly washed with methanol and water, and then dried at 100° C. for 8 hours to obtain 28.434 g of PEEK compound A represented by the following formula. The number average molecular weight calculated by GPC measurement of PEEK compound A was 2230.

[Example 1] 14 parts of PEEK compound A, naphthalene-type epoxy resin ("ESN475V" manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., epoxy equivalent about 332 g/eq.), 20 parts of active ester-based hardener (manufactured by DIC Corporation) were mixed "HPC-8000-65T", active group equivalent of 223, toluene solution with solid content of 65% by mass) 30 parts, surface-treated with an inorganic filler (amine-based alkoxysilane compound ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.) Spherical silica ("SO-C2" manufactured by Admatechs Co., Ltd., average particle size 0.5 μm, specific surface area 5.8 m ² /g) 60 parts, and hardening accelerator ("1B2PZ" manufactured by Shikoku Chemical Co., Ltd., 2-phenyl- 1-benzyl-1H-imidazole) 0.5 part was uniformly dispersed using a high-speed rotary mixer to obtain a resin coating.

As a support, a polyethylene terephthalate film (“AL5” manufactured by Lintec Co., Ltd., thickness 38 μm) provided with a mold release layer was prepared. On the mold release layer of this support, the resin coating material described above was uniformly applied so that the thickness of the resin composition layer after drying was 40 μm. After that, the resin coating was dried at 80° C. to 100° C. (90° C. on average) for 4 minutes to obtain a resin sheet including a support and a resin composition layer.

[Example 2] In Example 1, 30 parts of an active ester-based hardener ("HPC-8000-65T" manufactured by DIC Corporation, toluene solution with an active group equivalent of 223 and a solid content of 65% by mass) was changed to an active-ester-based hardener (DIC). "HPC-8150-62T" manufactured by the company, 30 parts of a toluene solution with an active group equivalent of 229 and a solid content of 62% by mass. Except for the above, it carried out similarly to Example 1, and obtained the resin coating material and resin sheet.

[Example 3] In Example 2, Change the amount of PEEK compound A from 14 parts to 10.5 parts, Furthermore, a radical polymerizable compound (biphenyl aralkyl type maleimide compound (“MIR-3000-70MT” manufactured by Nippon Kayaku Co., Ltd., maleimide group equivalent weight: 275 g/eq., non-volatile content) was used. 70% MEK/toluene mixed solution)) 5 parts. Except for the above, it carried out similarly to Example 2, and obtained the resin coating material and resin sheet.

[Example 4] In Example 2, Change the amount of PEEK compound A from 14 parts to 12.6 parts, Further, 2 parts of a radically polymerizable compound (“BMI-1500” manufactured by Designer Molecules, maleimide group equivalent 750 g/eq.) was used. Except for the above, it carried out similarly to Example 2, and obtained the resin coating material and resin sheet.

骨架之甲酚酚醛清漆系硬化劑(DIC公司製「LA3018-50P」，羥基當量151、不揮發成分50%之1-甲氧基-2-丙醇溶液) 5份。 除以上事項以外與實施例2同樣地進行，得到樹脂塗料及樹脂薄片。[Example 5] In Example 2, the amount of the active ester-based hardener ("HPC-8150-62T" manufactured by DIC Corporation, active group equivalent 229, toluene solution with solid content of 62% by mass) was changed from 30 parts to 25 parts, the amount of the hardening accelerator ("1B2PZ" manufactured by Shikoku Chemical Co., Ltd., 2-phenyl-1-benzyl-1H-imidazole) was changed from 0.5 part to 0.1 part, and further, a compound containing three

5 parts of a cresol novolak-based hardener of the skeleton ("LA3018-50P" manufactured by DIC Corporation, 1-methoxy-2-propanol solution of 151 hydroxyl equivalents and 50% nonvolatile content). Except for the above, it carried out similarly to Example 2, and obtained the resin coating material and resin sheet.

[Example 6] In Example 2, Change the amount of PEEK compound A from 14 parts to 10.5 parts, Furthermore, 5 parts of maleimide resin A were used. Except for the above, it carried out similarly to Example 2, and obtained the resin coating material and resin sheet.

[Example 7] In Example 1, 30 parts of an active ester-based hardener ("HPC-8000-65T" manufactured by DIC Corporation, toluene solution with an active group equivalent of 223 and a solid content of 65% by mass) was changed to an active ester-based hardener containing a naphthalene structure. 30 parts of curing agent ("PC1300-02-65MA" manufactured by Air & Water Corporation, methyl amyl ketone solution with an active group equivalent of 200 and a solid content of 65% by mass). Except for the above, it carried out similarly to Example 1, and obtained the resin coating material and resin sheet.

[Comparative Example 1] In Example 2, without using 14 parts of PEEK compound A, spherical silica ( "SO-C2" manufactured by Admatechs Co., Ltd., with an average particle size of 0.5 μm and a specific surface area of 5.8 m ² /g) was changed from 60 parts to 45 parts. Except for the above matters, it was carried out in the same manner as in Example 2 to obtain a resin coating and resin flakes.

[Comparative Example 2] In Example 3, Without PEEK Compound A 10.5 parts, A radically polymerizable compound (biphenyl aralkyl type maleimide compound (“MIR-3000-70MT” manufactured by Nippon Kayaku Co., Ltd., maleimide group equivalent: 275 g/eq., nonvolatile content 70 The amount of % MEK/toluene mixed solution)) was changed from 5 parts to 20 parts. Except for the above, it carried out similarly to Example 3, and obtained the resin coating material and resin sheet.

[Comparative Example 3] In Example 4, Without PEEK Compound A 12.6 parts, The amount of the radically polymerizable compound (“BMI-1500” manufactured by Designer Molecules, maleimide group equivalent: 750 g/eq.) was changed from 2 parts to 14 parts. Except for the above, it carried out similarly to Example 4, and obtained the resin coating material and resin sheet.

[Measurement of dielectric properties (dielectric constant and dielectric loss tangent)] The resin sheets produced in Examples and Comparative Examples were heated at 200° C. for 90 minutes to thermoset the resin composition layer. Then, the support body was peeled off, and the "hardened|cured material A of resin composition" was obtained. The cured product A of the resin composition was cut into test pieces having a width of 2 mm and a length of 80 mm. For this test piece, the dielectric constant Dk and the dielectric loss tangent Df were measured by the cavity resonance perturbation method using "HP8362B" manufactured by Agilent Technology at a measurement frequency of 5.8 GHz and a measurement temperature of 23°C. Three test pieces were measured, and the average value thereof is shown in the following table.

[Measurement of Plating Peeling Strength] (1) Base treatment of inner circuit substrate: As an inner-layer circuit board, a glass cloth-based epoxy resin double-sided copper-clad laminate with inner-layer circuits (copper foils) on both sides was prepared (copper foil thickness 18 μm, substrate thickness 0.4 mm, “R1515A” manufactured by Panasonic Corporation). Both surfaces of this inner-layer circuit board were etched by 1 μm with “CZ8101” manufactured by MEC, and the copper surface was roughened.

(2) Lamination of resin sheets: The resin sheet was laminated on both surfaces of the inner-layer circuit board using a batch-type vacuum pressure laminating machine (manufactured by Nikko Materials, Inc., a two-stage stacking laminating machine, CVP700). This lamination is carried out so that the resin composition layer of the resin sheet is in contact with the inner-layer circuit board. In addition, this lamination was performed by reducing the pressure for 30 seconds to make the air pressure 13 hPa or less, and performing pressure bonding for 45 seconds at 130° C. and a pressure of 0.74 MPa. Next, hot pressing was performed at 120° C. and a pressure of 0.5 MPa for 75 seconds.

(3) Hardening of resin composition: The laminated resin sheet and the inner layer circuit board were heated at 130° C. for 30 minutes, and then heated at 170° C. for 30 minutes to harden the resin composition to form an insulating layer. Then, the support body is peeled off, and the laminated board which has an insulating layer, an inner-layer circuit board, and an insulating layer in this order is obtained.

(4) Roughening treatment: The above-mentioned laminated substrate was immersed in a swelling solution (Swelling Dip Securiganth P (glycol ethers, sodium hydroxide containing diethylene glycol monobutyl ether made by Atotech Japan) at 60° C. aqueous solution)) for 10 minutes. Next, the laminate substrate was immersed in a roughening solution (Concentrates Compact P (KMnO ₄ : 60 g/L, NaOH: 40 g/L aqueous solution) manufactured by Atotech Japan) at 80° C. for 20 minutes. After that, the laminate substrate was immersed in a The 40°C neutralization solution was immersed in (Reduction solution Seuriganth P (aqueous solution of sulfuric acid) manufactured by Atotech Japan) for 5 minutes. After that, the laminated substrate was dried at 80°C for 30 minutes to obtain an "evaluation substrate A".

(5) Plating by semi-additive method: The evaluation substrate A was immersed in a solution for electroless plating containing PdCl ₂ at 40° C. for 5 minutes, and then immersed in an electroless copper plating solution at 25° C. for 20 minutes. minute. After that, annealing treatment was performed by heating at 150° C. for 30 minutes. After that, an etching resist is formed, and patterning by etching is performed. After that, copper sulfate electrolytic plating was performed to form a conductor layer with a thickness of 20 μm. Next, an annealing treatment was performed at 200° C. for 60 minutes to obtain an “evaluation substrate B”.

(6) Determination of plating peel strength: In the conductor layer of the evaluation board|substrate B, the incision which surrounded the rectangular part of width 10mm and length 100mm was formed. One end of the rectangular part was peeled off, and was held by a gripper (TSE Corporation, AUTO COM type testing machine "AC-50C-SL"). The rectangular part was peeled off in the vertical direction at a speed of 50 mm/min at room temperature by a gripper, and the load (kgf/cm) at the time of peeling 35 mm was measured as the plating peeling strength.

[Measurement of surface roughness Ra] The arithmetic mean roughness Ra of the surface of the insulating layer of the evaluation substrate A was measured. For the measurement, a non-contact surface roughness meter (WYKO NT3300 manufactured by Veeco Instruments) was used, and the measurement range was set to 121 μm×92 μm in a VSI mode and a 50-fold lens. This measurement was performed at 10 measurement points, and the average value thereof is shown in the following table.

[Measurement of glass transition temperature] The cured product A of the resin composition was cut into test pieces having a width of about 5 mm and a length of about 15 mm, and thermomechanical analysis was performed by the tensile weight method using a dynamic viscoelasticity measuring apparatus (EXSTAR6000, manufactured by SII NanoTechnology). After the test piece was installed in the aforementioned apparatus, the measurement was performed under the measurement conditions of a load of 200 mN and a temperature increase rate of 2°C/min. The peak top of the obtained tan δ was calculated as the glass transition temperature (°C).

＊表中，(A)成分之含量，表示將樹脂組成物中之樹脂成分定為100質量%時之(A)成分之含量。(E)成分之含量，表示將樹脂組成物中之不揮發成分定為100質量%時之(E)成分之含量。(C)成分/(B)成分表示(C)成分與(B)成分之量比。

*In the table, the content of the component (A) represents the content of the component (A) when the resin component in the resin composition is 100% by mass. The content of the component (E) means the content of the component (E) when the nonvolatile content in the resin composition is set to 100% by mass. (C)component/(B)component shows the quantitative ratio of (C)component and (B)component.

Claims (15)

A resin composition comprising (A) a polyether ether ketone compound having a maleimide group, (B) epoxy resin, and (C) Active ester type hardener. The resin composition according to claim 1, wherein the number-average molecular weight of component (A) is 10,000 or less. The resin composition according to claim 1, wherein the component (A) has a maleimide group at the terminal. The resin composition of claim 1, wherein the content of the (A) component is 5 mass % or more and 60 mass % or less when the resin component in the resin composition is 100 mass %. The resin composition of claim 1, wherein the component (B) comprises a naphthol-type epoxy resin. The resin composition according to claim 1, wherein the component (C) is at least one selected from the group consisting of dicyclopentadiene-type active ester-based hardeners and naphthalene-type active ester-based hardeners. The resin composition according to claim 1, further comprising (D) a resin having a polymerizable unsaturated group. The resin composition according to claim 7, wherein the component (D) is a resin containing a maleimide group and an aromatic ring. The resin composition according to claim 1, further comprising (E) an inorganic filler. The resin composition of claim 9, wherein the content of the (E) component is 40 mass % or more and 65 mass % or less when the non-volatile content in the resin composition is 100 mass %. The resin composition according to claim 1 is for forming an insulating layer. The resin composition of claim 1, which is for forming an insulating layer, and the insulating layer is an insulating layer for forming a conductor layer. A resin sheet comprising a support body and a resin composition layer disposed on the support body, the resin composition layer comprising the resin composition according to any one of claims 1 to 12. A printed wiring board comprising an insulating layer formed of a cured product of the resin composition according to any one of claims 1 to 12. A semiconductor device comprising the printed wiring board of claim 14.